Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
  • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
  • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
  • B42D25/30—Identification or security features, e.g. for preventing forgery
  • B42D25/328—Diffraction gratings; Holograms
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
  • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
  • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
  • B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
  • B42D25/29—Securities; Bank notes
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
  • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
  • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
  • B42D25/30—Identification or security features, e.g. for preventing forgery
  • B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
  • B42D25/373—Metallic materials
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
  • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
  • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
  • B42D25/40—Manufacture
  • B42D25/405—Marking
  • B42D25/425—Marking by deformation, e.g. embossing
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
  • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
  • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
  • B42D25/40—Manufacture
  • B42D25/405—Marking
  • B42D25/43—Marking by removal of material
  • B42D25/435—Marking by removal of material using electromagnetic radiation, e.g. laser
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
  • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
  • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
  • B42D25/40—Manufacture
  • B42D25/45—Associating two or more layers

Definitions

• the invention relates to a method for producing a security element having a metallized optical diffraction structure in an embossed lacquer layer in which a lacquer layer is applied, embossed and cured on a support, structural embossings, structure elevations and an optical diffraction structure being produced by embossing the lacquer layer, hereinafter a reflection layer is provided on the structure depressions and structure elevations of the embossed lacquer layer by metallization, and subsequently this reflection layer is selectively demetallised.
• step to prepare the sections with mutually different laser interactions In addition, provision of such subregions is often not possible at all by embossing structures predetermined on the security element, so that such processes are not only comparatively complicated by this step, but also only of limited applicability.
• the invention is therefore based on the object to provide a method for producing a security element with a metallized optical diffraction structure of the type described input, which is simple and flexible applicable and reproducibly generates an accurate security element.
• the invention achieves the stated object in that the optical diffraction structure is impressed on at least one structure elevation and that the selective demetallization comprises connecting at least the structure elevation comprising the metallized and the optical diffraction structure to a transfer support and subsequently separating this structure elevation connected to a transfer support from the carrier as well as at least one adjacent to this structure survey metallized structure recess by removing the transfer carrier from the carrier.
• the lacquer layer can be divided into comparatively sharply delimited partial areas in a procedurally simple manner due to the transition between the structure elevation and the subsequent structural recess.
• a subsequent selective demetallization of the metallized embossed lacquer layer or demetallization of a partial region on the metallized embossed lacquer layer can be facilitated if this selective demetallization involves joining at least the metallized and the metallized layers comprising optical diffraction structure structure survey with a transfer carrier and subsequent separation of these associated with a transfer support structure survey of both the carrier and at least one adjacent to this structure survey metallized structure recess by removing the transfer carrier from the carrier.
• the metallization in the region of the diffraction structure can be demetallized in a highly reproducible manner in a precise and accurate position, and unwanted demetallization of the reflection layer on the structure elevations can be avoided.
• it can be created on the security element to the diffraction structure exactly subsequent viewing areas, cutouts, interruptions, exemptions, etc., which can significantly increase its security against counterfeiting.
• it is thus possible to create a reflection layer congruent with the structure elevations - in particular a reflection layer that is congruent with the optical diffraction structure at the structure elevation.
• An extremely reproducible but nevertheless cost-effective method for producing a tamper-proof security element can accordingly be created.
• the structure supports which are connected to the transfer support and remain thereon can subsequently constitute the security element or a part thereof.
• the structure elevations connected to the transfer carrier can be subjected to further process steps, such as additional coatings, etc. for this purpose.
• the lacquer layer can be any layer based on thermoplastic polymers such as PMMA, acrylates, PVC, PU or similar materials.
• the lacquer layer may further consist of free-radically or cationically curable UV lacquers which i.a. based on polyester, PU or acrylate binders.
• the lacquer layer is applied to the carrier as a liquid or pasty lacquer and then embossed and cured, the process can be further accelerated and simplified. Due to the liquid or pasty consistency of the Lacks can also result in a homogeneous cohesive connection to the carrier and carried out a more uniform filling of the embossing tool, whereby the reproducibility of the process can be further increased.
• the simplicity of the process can be further enhanced if the lacquer layer is cured during the embossing, in particular polymerized. In this way, very tight and simple narrow manufacturing tolerances can be followed with respect to the embossed structure.
• the production parameters - such as hardening time, contact time with the embossing tool, etc. - can be set flexibly, whereby the reproducibility can be further improved.
• the curing or polymerization of the lacquer layer can be effected by UV radiation. Irradiation by the carrier during embossing is possible, for example, with UV-transparent carrier films. However, the irradiation can also take place from the side of the embossing tool.
• the lacquer layer is embossed with a rotating stamping tool, this can further improve the continuity of the method.
• a nearly bump-free embossing of the lacquer layer can be achieved by the rotating embossing tool. A simpler and more reproducible method may result.
• a security element with particularly good security effect can be generated in a simple manner in terms of process engineering.
• the hologram can already be impressed by the embossing tool with high precision in the structure surveys, whereby additional process steps can be avoided. A method with high reproducibility can thus be created.
• the reproducibility of the method can be significantly increased if the thickness of the reflection layer is less than the embossing depth of the structure depressions.
• the reflection layers of the structural Recesses and structure surveys to each other form an overlap.
• such an overlap on separation could lead to an uncontrollable breakage of the reflection layer, which can lead to blurred contours in the reflection layer on the structure elevations.
• the optical diffraction patterns embossed in the structure elevations have a lower embossing depth than the structural depressions, reliable demetallization can be ensured by separating the structure elevations from the structure depressions during the stripping of the support.
• parts of the diffraction structures in particular parts of the lacquer layer forming the structure elevations, are also removed during demetallization and thus the diffraction structure is destroyed.
• a particularly reliable and reproducible method can be achieved.
• low manufacturing tolerances can be made possible.
• the selective demetallization by separating the structure elevations from the structure depressions can be considerably improved if the embossing depth of the structure depressions in the lacquer layer essentially corresponds to the lacquer layer thickness.
• This means that the bond between the structure elevations and structural depressions to be separated therefrom together with their metallization can be particularly weakened - which not only facilitates the removal of the transfer carrier, but can also ensure an exact, sharp-edged demetallization. This in particular when the structural depressions are stamped to the carrier. A particularly simple and reproducible method can result.
• Adhesion reducers whose use leads to a lower adhesive strength between the support and the lacquer layer than between the reflection layer and the support, may in particular prove themselves in this case if the lacquer layer remains up to this point Carrier has been punched through. A particularly simple demetallization can be achieved and thus the reliability of the method can be further increased.
• the transfer carrier is coated with an adhesion promoter before it is joined to the structure elevations, it can be ensured that the structure elevations form a stable connection with the transfer carrier via their reflection layer.
• unintentional release of the structure elevations from the transfer carrier during the removal of the carrier from the security element to the transfer carrier can be steadily prevented. The reproducibility of the process can thus continue to increase.
• the security element is provided with a protective lacquer layer after separation from the support, this can facilitate the further treatment of the security element in the process.
• the protective lacquer layer can compensate for the unevenness created by the structural depressions and thus create a homogeneous planar surface for further processing steps.
• the protective lacquer layer can reliably protect the security element against external influences, such as oxidation of the metallic reflection layer.
• the protective lacquer layer may be a transparent lacquer layer.
• the protective lacquer layer may also be an adhesive layer in order to be able to provide the security element in a handling-friendly manner on a document of value.
• Such an adhesive layer may be, for example, a heat-sealable, cold-seal or self-adhesive coating.
• the adhesive layer may also be applied additionally with a protective lacquer layer.
• the security against forgery of the security element can additionally be increased if the security element is provided with further security features. This can be done, for example, by gluing (or laminating) the security element according to the invention with a further security element having other security features.
• the security element can be connected to a value document in a manner that are easy to handle, for example, by sticking it to the value document. Even a lamination of the same is conceivable.
• a value document may be, for example, a passport, an identity card, a driver's license, a bill, a credit card, or the like.
• FIG. 2 shows a detailed detail of the separation process of the method from FIG. 1
• FIG. 3 shows a detailed detail of the embossing process of the method from FIG. 1.
• a method 100 for producing a security element 1 is shown.
• a lacquer layer 3 is applied to a support 2, which lacquer layer 3 is embossed in a further step with an embossing tool 4 and subsequently hardened - hereinafter shown.
• the hardening is schematically represented by a radiation source 5, for example.
• embossing 3 structural depressions 6 and structure elevations 7 are generated in the lacquer layer.
• the lacquer layer 3 has optical diffraction structures 8 after embossing.
• the lacquer layer 3 is metallized to produce a reflection layer 9, 9 '- by the metallization, a reflection layer 9, 9' is created both on the structure depressions 6 and on the structure elevations 7.
• the metallization is carried out, as shown in Fig. 1, with a common metal coating method 10.
• the reflective layer 9, 9 ' As a result of the method, it is selectively removed, or demetallized, in particular by the structure depressions 6 of the lacquer layer 3.
• the structure elevations 7 of the lacquer layer 3, in particular having a reflection layer 9, are materially bonded to a transfer carrier 11, as can be seen in detail in FIG.
• the transfer support 11, as a new substrate of the security element 1 is brought into contact with the structure elevations 7 of the lacquer layer 3 on the support 2.
• a connection between the structure recesses 6 of the lacquer layer 3 and the transfer carrier 1 1 does not take place.
• the original carrier 2 is now removed from the security element 1, thereby separating the structural elevations 7 connected to the transfer carrier 11 from the metallized structural depressions 6 adjoining the latter.
• the structure recesses 6 continue to adhere to the original carrier 2 and are deducted with this from the transfer carrier 1 1 to produce the security element 1.
• those regions of the reflection layer 9 'which are located in the structure depressions 6 are removed together with the carrier 2.
• the reflection layer 9 of the security element 1 on the transfer carrier 11 is selectively demetallised in the regions of the structure depressions 6, by removing the reflection layer 9 '.
• a reflection layer 9 can be produced which is exactly congruent with the structure elevations 7 of the lacquer layer 3.
• a diffraction structure 8 is embossed in at least one of these structure elevations 7 -for example by means of the embossing tool 4-an exactly congruent metallization of the diffraction structure 8 is thus achieved. Accordingly, regions between the structure elevations 7 act as see-through regions 12 through the reflection layer 9, which represent an exact security feature on the security element 1 and lead to a high security against counterfeiting.
• the lacquer layer 3 is applied to the carrier 2 in the form of a liquid or pasty lacquer 13.
• the cavities 14 of the embossing tool 4 filled better and a more homogeneous and exact embossing can be achieved.
• sharply demarcated structure elevations 7 can be created.
• the lacquer layer 3 or the liquid or pasty lacquer 13 forming the lacquer layer 3 are hardened during the contact with the embossing tool 4.
• a radiation source 5 is shown schematically below the embossing tool 4, which hardens the lacquer layer 3 during contact with the embossing tool 4 by suitable radiation 15.
• the embossing tool 4 is a rotating embossing tool 4, whereby the periodicity of the embossed structure is improved and a recurring impact in the embossed structure is avoided.
• the thickness of the reflection layer 9, 9 'on the structure elevations 7 and on the structure depressions 6 is less than the embossing depth 17 of the structure depressions 6.
• the reflection layer 9, 9 ' is significantly smaller than the embossing depth 17 of the structure depressions 6, a simple detachment of the reflection layers 9' from the lacquer layer 3 during the separation can be guaranteed.
• optical diffraction structures 8 are embossed in a plurality of structure elevations 7.
• these diffraction structures 8 form holograms 16, which represent a security feature of the security element 1.
• the embossing depth 17 of the diffraction structures 8 and holograms 1 6 is advantageously, preferably significantly, less than the embossing depth 17 of the structure recesses 6 in the embossed lacquer layer 3. This allows the subsequent separation of the structure depressions 6 are greatly facilitated by the structure elevations 7, since the remaining lacquer layer residues 18 are kept as small as possible in the structure depressions 6. Remaining lacquer layer residues 18 could adhere to the structure elevations 7 during separation and prevent an exact sharp-edged separation.
• the embossing depth 17 of the structure depressions 6 in the lacquer layer 3 essentially corresponds to the lacquer layer thickness 19.
• no appreciable coating layer residues 18 are formed in the structure depressions 6, and the subsequently applied reflection layer 9 can thus adhere directly to the underlying layer, for example the support 2.
• an adhesion reducer 20 is applied to the carrier 2 before the lacquer layer 3.
• the adhesion reducer 20 is advantageously designed such that the adhesive strength between the carrier 2 and the lacquer layer 3 is reduced, but the adhesive strength between the carrier 2 and the reflection layer 9 'is enhanced. As a result, it can be ensured during the separation, as shown in FIG. 2, that the reflection layer 9 'reliably adheres to the support 2 and is pulled off, while the lacquer layer 3 of the structure elevations 7 remains undamaged.
• the transfer carrier 1 1 is also coated with a bonding agent 21, whereby the adhesion between the transfer carrier 1 1 and the reflective layer 9 of the structure elevations 7 is increased. A cohesive connection between the reflective layer 9, the structure elevations 7 and the transfer carrier 1 1 is ensured. The separation can be carried out more reliably and reproducibly.
• the security element 1 is provided after separation with a protective lacquer layer 22.
• the protective lacquer layer 22 can be both for protection serve the security element 1 from external influences, as well as a connection of the security element 1 with other security features or documents of value allow.
• the protective varnish 23 forming the protective varnish layer 22 can offer both a protective effect and an adhesive effect for the security element 1.
• the security element 1 can also be applied to value documents, such as banknotes, credit or bank cards, passports, identity cards, driving licenses, etc.

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• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Physics & Mathematics (AREA)
• Health & Medical Sciences (AREA)
• Electromagnetism (AREA)
• General Health & Medical Sciences (AREA)
• Optics & Photonics (AREA)
• Toxicology (AREA)
• Business, Economics & Management (AREA)
• Accounting & Taxation (AREA)
• Finance (AREA)
• Credit Cards Or The Like (AREA)
• Diffracting Gratings Or Hologram Optical Elements (AREA)
• Holo Graphy (AREA)
• Application Of Or Painting With Fluid Materials (AREA)

Priority Applications (3)

Applications Claiming Priority (2)

Publications (1)

Family

ID=54291066

Family Applications (1)

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Citations (3)

Family Cites Families (15)

• 2015
  • 2015-10-02 EP EP15188216.4A patent/EP3150400A1/de not_active Withdrawn
• 2016
  • 2016-10-03 JP JP2018517259A patent/JP7025323B2/ja not_active Expired - Fee Related
  • 2016-10-03 EP EP16787740.6A patent/EP3356158B1/de active Active
  • 2016-10-03 US US15/765,366 patent/US10618339B2/en not_active Expired - Fee Related
  • 2016-10-03 WO PCT/EP2016/073582 patent/WO2017055634A1/de not_active Ceased

Patent Citations (3)

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