WO2017050702A1 - Method for electrically insulating an electrical conductor, in particular a component module, conductor module, and component module - Google Patents

Method for electrically insulating an electrical conductor, in particular a component module, conductor module, and component module Download PDF

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Publication number
WO2017050702A1
WO2017050702A1 PCT/EP2016/072190 EP2016072190W WO2017050702A1 WO 2017050702 A1 WO2017050702 A1 WO 2017050702A1 EP 2016072190 W EP2016072190 W EP 2016072190W WO 2017050702 A1 WO2017050702 A1 WO 2017050702A1
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WO
WIPO (PCT)
Prior art keywords
conductor
component
open
insulating material
module
Prior art date
Application number
PCT/EP2016/072190
Other languages
German (de)
French (fr)
Inventor
Stefan Stegmeier
Hubert Baueregger
Volkmar Sommer
Original Assignee
Siemens Aktiengesellschaft
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Publication date
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Publication of WO2017050702A1 publication Critical patent/WO2017050702A1/en

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Definitions

  • the invention relates to a method for electrical insulation of an electrical conductor in particular a Bauteilmo ⁇ duls with the electrical conductor and a component and a semiconductor module and a module component with a component comprising at least one insulated electrical conductor ⁇ .
  • passive components such as resistors and capacitors
  • semiconductor devices such as ⁇ example IGBTs, diodes, MOSFETs, LEDs, and substrates, such as FR4, DCB ((engl.) "Direct Copper Bonding "), AMB (" Active Metal Braze ”) and leadframes, electrically connected by means of electrical conductors, such as by means of a construction and connection technology.
  • the electrical conductors are regularly isolated. Most of the electrical conductor such as a bonding wire is covered with an insulation material or ⁇ shed.
  • the inventive method is a method for electrical insulation of a conductor see in particular a Bauteilmo ⁇ duls.
  • the component module is formed with at least one component and at least one electrically contacted to the at least ei ⁇ ne component conductor and / or the conductor is the head of a component.
  • a conductor formed with an open-pore material is used as the electrical conductor, and internal regions of the open-pored material are formed by means of pores of the porous material open-porous material at least partially provided with electrically insulating material.
  • inner regions of open-pore material are provided by means of an insertion electrically insulating material in the open-pored material with the insulating Ma ⁇ TERIAL; ie the insulating material is introduced into the open-pored material.
  • the open-pore material of the conductor is used to a certain extent like a sponge for the iso ⁇ -regulating material. Due to the open-pored Materi ⁇ than the electrical conductor, the insulating material can at least partially pass through or enforce the open-pore material. Consequently, then the insulating material is also positively connected to the electrical conductor.
  • a conductor module or component module can be manufactured which is not subject to delamination. Because even if a temporary adhesion of the insulating material on that material of the conductor should not be sufficiently given, the form-fit caused due to the Offenpo- rIER of the material of the conductor in addition an upright ⁇ attitude of the conductor-insulation material-composite. Further advantageous effect can be an effective electrical insulation ⁇ efficiently with significantly less insulating material. Because unlike a casting of the conductor with isolieren- the material requires a transfer of the insulating Ma ⁇ terials a significantly smaller amount of material. Another ago ⁇ partly lies in the simplicity of the process.
  • the open-pore material has an open-cell structure, so that the insulating material can pass through this structure particularly efficiently. It is understood that the insulating material must already exert its electrical insulating properties fully when applied to the open-pored Materi al ⁇ ⁇ not notwen sarily. Thus, the insulating material may be about to ⁇ next introduced together with a later evaporierenden electrically conductive liquid.
  • the conductor is a contact piece, which is contacted at an electrical contact of the component.
  • the insulating material is different from air.
  • a isolie ⁇ - generating material in the context of this application is useful to understand such a material, which is specifically used for the isolation of a conductor, but not air, which already exists in numerous applications or manufacturing environments in the immediate working environment and is limited in the dielectric strength but preference ⁇ , a liquid and / or solid.
  • a mate rial ⁇ is used as insulating material, which penetrates by capillary action efficiently in the open-pore material.
  • the insulating material is formed from or with a so-called underfill, which advantageously distributed along surfaces and displaces air.
  • the insulating material is epoxy-based, ie gebil ⁇ det with an epoxy material.
  • a multicomponent material which has an insulating effect on larger dimensions than those of the particles or particle cores for example a multicomponent material as described above, is to be understood as an insulation material. That is, the admixtures of other components are part of Isolationsmate ⁇ rials.
  • an elastic material is used as the insulating material.
  • the open-pore material of the conductor is elastic, so that the composite material formed with the open-pore material and the insulating material is elas ⁇ table deformable.
  • a silicone or an epoxide is used as the elastic insulating material.
  • a liquid or gaseous material is used as the insulating material.
  • the introduction of the insulating material by means of Dispensens and / or drop and / or dipping and / or Jettens is carried out in the inventive method.
  • the insulating material is preferably converted by means of a Einwir ⁇ effect of infrared radiation and / or heat and / or one or more catalysts and / or curing agent additives in a solid state and / or cured.
  • the solvent released can efficiently outgas from the open-pored material.
  • the electrical conductor is first connected to at least one contact of a component with the open-pore material of the conductor in the manner of a contact piece galvanically (electrochemically or without external current).
  • the open porosity of the material of the head not only provides for the insulating material, but also for numerous electrolyte fluid passages so that the latter can thus move from the outside to the interface of con ⁇ tact piece and electrical contact of the component.
  • the open-pore material of the con tact ⁇ piece on an open cell structure through which can be reciprocated by electrolyte fluid happen particularly efficient.
  • the open-pore material of the Lei ⁇ ters serves both for the electrical contacting and at the same time for the electrical insulation.
  • the component with the open-pored contact piece is expediently produced by means of a method as described in the Applicant's patent application with the official file reference 102015210061.8, in particular in the description and / or the claims contained therein.
  • Process is the open-pored material formed with porous material.
  • the at least one open-pored material with a fabric-like and / or foam-like and / or net-like structure is expediently designed or formed as such a structure in the method according to the invention.
  • the method according to the invention is preferably carried out for a conductor of a component module comprising the component and a conductor contacted to the component.
  • a power component is used as the component.
  • a suitable manner Is in the inventive method as a component, a component having at least one transistor, preferably as a ⁇ insulated-gate bipolar transistor.
  • the invention also provides a method for producing an insulated electrical conductor, for producing a conductor module with an electrically insulated conductor or for producing a component module having a component and at least one electrically contacted to the construction ⁇ partially electrically insulated conductors in which the steps of the method according to the invention for the electrical insulation of a conductor, as explained above in this description, are carried out.
  • the conductor module according to the invention comprises at least one elekt ⁇ step ladder.
  • the component module according to the invention has a component with at least one electrically contacted to the component conductor.
  • the conductor is formed with open-pore material and the open-pored material is at least partially internally with ⁇ isolate the material provided.
  • the conductor module or component module according to the invention is particularly advantageously formed by means of a method according to the invention as described above.
  • this stack is realized in the manner of a stack, wherein the levels of this stack are formed by means of printed circuit boards and / or substrates, to which components are connected to conductors ⁇ .
  • the conductors of components of all levels by means of the method according to the invention are isolated.
  • components, in particular on a semiconductor basis such as IGBTs and / or passive components such as capacitors and / or inductors, stack-like without each own circuit board are stacked and insulated by the inventive method against each other.
  • the conductor is contacted to a contact surface of the component of the component ⁇ module.
  • the conductor is away from the contact surface and / or on a surface of the contact ask ⁇ facing side of the conductor, isolated.
  • Dispensing device before carrying out the method according to the invention for the isolation of the electrical conductor in a schematic diagram in cross section, the arrangement acc. Fig. 1 in the implementation of the method according to the invention for the isolation of the electrical conductor in a schematic diagram in cross section, and the arrangement of the power component according to. Fig. 3 after performing the method according to the invention in a schematic diagram in cross section.
  • the power component 10 shown in FIG. 1 is a
  • Insulated gate bipolar transistor and has a first 20 and a second flat side 30 facing away from each other along the first 20 and second flat side 30 extend thin-film surface contacts 40, 50 of the power component 10, which -area chip ⁇ metallizations are formed.
  • the upper side is arranged in Fig. 1 surface contact 40 and the underside surfaces arranged ⁇ contact 50 of the power device 10 are made of copper.
  • the surface contacts can also be made or with silver and / or from or with AlSiCu and / or be formed from or with gold and / or Kup ⁇ fer and / or other metals or other electrically conducting materials.
  • a contact piece 60 of open-pored material is bonded to the surface contact 40. connected, which extends substantially flat along the surface contact 40.
  • the contact piece 60 is conductive latestbil ⁇ det and realized as a copper sponge. It is understood that in other, not specifically illustratedtientsbeispie ⁇ len, which otherwise correspond to the explained with reference to the figures embodiment, the open-pore contact piece 60 may consist of other open-pore conductive materials, such as nets or fabric or other porous structures formed aluminum -, Ti- or formed from or with other metals contacts.
  • Polymer sponges are used as contact pieces.
  • One of the surface contacts 50 of the power device 10 facing ei ⁇ nem further surface contact 80 of a ceramic substrate 90 having a ceramic core 100 of aluminum nitride (A1N).
  • the ceramic core 100 can consist of another ceramic material in further exemplary embodiments not shown, or of printed circuit board materials such as FR 4 or other supports of silicone and / or epoxy.
  • the further surface contact 80 of the ceramic substrate 90 is formed as superficial substrate metallization, in the illustrated exemplary embodiment as a copper substrate metallization.
  • the ceramic substrate 90 facing surface ⁇ contact 50 of the power component 10 and the other surface ⁇ contact 80 of the ceramic substrate 90 extend parallel to each other and thus form a planar gap.
  • the contact piece 70 is thus arranged for contacting the power component 10 and the ceramic substrate 90.
  • a contacting of the open-pore contact piece 60 with the surface contact 40 of the power component 10 is realized by means of - known per se - electrochemical galvanization.
  • metal in the illustrated embodiment copper, is deposited in the region between the open-pored contact piece 60 and the surface contact 40 as an electrically conductive connection.
  • the deposited copper forms a copper ⁇ layer (not separately shown) from which area along the chip metallization, and the contact piece 60 extends ER.
  • the open-pore contact piece 60 is conductively connected to the power device 10.
  • insulated power module 10 formed with insulating material 210.
  • Fig. 2 shows a ge ⁇ Dispenser 180 present, which is arranged above the contact piece 60 on the ceramic substrate 90 from the side facing ist ⁇ .
  • the dispenser 200 is formed, a liquid
  • Insulation material 210 in the illustrated embodiment, an epoxy-based underfill, i. one with one
  • the insulating material 210 passes through the contact-piece 60 by its superficial pores and penetrates a certain distance into the interior of the contact piece 60 a (see Fig. 3 and 4).
  • the insulating material 210 is baked out.
  • the heating of the insulation material 210 can be omitted. Drying takes place here, for example, by a longer waiting time or else when a corresponding insulation material is applied. is selected by means of infrared radiation or by means of an addition of a curing agent or by means of an addition egg ⁇ nes catalyst.
  • privacysbei ⁇ play the insulation material 210 is not with a
  • Dispenser 200 applied, but by means of a
  • Inkjet printer imprinted or the contact piece 60 with ⁇ means immersion in a bath of liquid insulation material infiltrated into the contact piece 60.
  • a filler for example, Si02-particles and / or poly ⁇ amide particles can be contained in the insulating material, having which typical properties of insulation ⁇ materials, such as a high dielectric strength, a high resistance to partial discharges, a corresponding ther ⁇ mixer expansion coefficient and /or similar.
  • the insulation material 210 is closely interlocked with the contact piece 60, so that delamination is effectively prevented.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The invention relates to a method for electrically insulating an electrical conductor, in particular a component module, and to a component module. In the method for electrically insulating a conductor, in particular a component (10), at least one conductor formed with an open-pored material (60) is used as an electrical conductor, and at least portions of interior regions of the open-pored material are provided with electrically insulating material (210), via the pores of the open-pored material. The component module is formed with a component with at least one electrically conductive contact, to which at least one open-pored contact piece is galvanically connected. The component module is formed, in particular, by means of an aforementioned method.

Description

Beschreibung description
Verfahren zur elektrischen Isolierung eines elektrischen Leiters insbesondere eines Bauteilmoduls, Leitermodul und Bau- teilmodul Method for electrical insulation of an electrical conductor, in particular of a component module, conductor module and component module
Die Erfindung betrifft ein Verfahren zur elektrischen Isolierung eines elektrischen Leiters insbesondere eines Bauteilmo¬ duls mit dem elektrischen Leiter und einem Bauteil sowie ein Leitermodul und ein Bauteilmodul mit einem Bauteil mit zumin¬ dest einem isolierten elektrischen Leiter. The invention relates to a method for electrical insulation of an electrical conductor in particular a Bauteilmo ¬ duls with the electrical conductor and a component and a semiconductor module and a module component with a component comprising at least one insulated electrical conductor ¬.
Insbesondere in der Mikrosystemtechnik und der Leistungselektronik werden passive Bauteile, wie beispielsweise Wider- stände und Kondensatoren, sowie Halbleiterbauteile, wie bei¬ spielsweise IGBTs, Dioden, MOSFETS, LEDs, und Substrate, wie beispielsweise FR4, DCB ((engl.) „Direct Copper Bonding") , AMB ((engl.) „Active Metal Braze") und Leadframes, elektrisch mittels elektrischen Leitern, etwa mittels einer Aufbau- und Verbindungstechnik, miteinander verbunden. In particular, in microsystem technology and power electronics are passive components, such as resistors and capacitors, and semiconductor devices, such as ¬ example IGBTs, diodes, MOSFETs, LEDs, and substrates, such as FR4, DCB ((engl.) "Direct Copper Bonding "), AMB (" Active Metal Braze ") and leadframes, electrically connected by means of electrical conductors, such as by means of a construction and connection technology.
Um einen Überschlag von einem solchen elektrischen Leiter hin zu einem anderen Bauteil, welches sich auf einem anderen elektrischen Potential befindet, zu vermeiden, werden die elektrischen Leiter regelmäßig isoliert. Meist wird der elektrische Leiter, etwa ein Bonddraht, mit einem Isolations¬ material ummantelt oder vergossen. In order to avoid a flashover from such an electrical conductor to another component, which is located at a different electrical potential, the electrical conductors are regularly isolated. Most of the electrical conductor such as a bonding wire is covered with an insulation material or ¬ shed.
Jedoch verursachen in der Elektronik und insbesondere in der Leistungselektronik das Schalten und Leiten von Strömen in den Halbleiterbauelementen und den elektrischen Zuleitungen und Ableitungen Verlustleistungen, Vibrationen und thermome- chanischen Stress. In der Folge kann eine Delamination von Isolationsmaterial vom elektrischen Leiter erfolgen. Dadurch sinkt die Lebensdauer von Elektronikbauteilen, insbesondere von Leistungsmodulen, erheblich. Es ist bekannt, der Delamination von Isolationsmaterial mit¬ tels zusätzlicher Haftlayer zu begegnen, welche gewissermaßen als Bindeglied zwischen elektrischem Leiter und Isolationsma¬ terial dienen. Ferner lassen sich im Rahmen einer planaren Aufbau- und Verbindungstechnologie verhältnismäßig große Grenzflächen zwischen Leiter und Isolationsmaterial errei¬ chen, sodass eine Haftung zwischen Leiter und Isolationsmate¬ rial zumindest verbessert ist. Mit den genannten Verfahren lässt sich jedoch eine Delamination nicht hinreichend sicher ausschließen und die Umsetzung ist aufwendig und teuer. However, in electronics, and in particular in power electronics, the switching and conduction of currents in the semiconductor devices and the electrical leads and leads cause power losses, vibration and thermo-mechanical stress. As a result, a delamination of insulation material from the electrical conductor can take place. This significantly reduces the service life of electronic components, in particular of power modules. It is known to address the delamination of insulation material with ¬ means of additional adhesive layer, which in a sense serve as a link between the electrical conductor and Isolationsma ¬ TERIAL. Furthermore, can be part of a planar packaging technology relatively large interface between the conductor and insulating material Errei ¬ surfaces, so that an adhesion between conductor and insulation mate rial ¬ is at least improved. With the above methods, however, a delamination can not be excluded with sufficient certainty and the implementation is complicated and expensive.
Vor diesem Hintergrund des Standes der Technik ist es daher Aufgabe der Erfindung, ein verbessertes Verfahren zur Isolierung von elektrischen Leitern insbesondere eines Bauteils und ein verbessertes Leitermodul und ein verbessertes Bauteilmo¬ dul anzugeben. Insbesondere soll die Lebensdauer mittels des erfindungsgemäßen Verfahrens resultierender Elektronikbauteile sowie der erfindungsgemäßen Leitermodule und Bauteilmodule verbessert sein und Verfahren und Leitermodul und Bauteilmo- dul sollen insbesondere kostengünstig realisierbar sein. Against this background of the prior art, it is therefore an object of the invention to provide an improved method for the insulation of electrical conductors, in particular of a component and an improved conductor module and an improved Bauteilmo ¬ module. In particular, the service life should be improved by means of the method according to the invention resulting electronic components and the conductor modules and component modules according to the invention and method and conductor module and Bauteilmo- module should be particularly cost feasible.
Diese Aufgabe der Erfindung wird mit einem Verfahren mit den in Anspruch 1 angegebenen Merkmalen sowie mit einem Leitermodul oder Bauteilmodul mit den in Anspruch 15 angegebenen Merkmalen gelöst. Bevorzugte Weiterbildungen der Erfindung ergeben sich aus den zugehörigen Unteransprüchen, der nachfolgenden Beschreibung und der Zeichnung. This object of the invention is achieved by a method having the features specified in claim 1 and with a conductor module or component module having the features specified in claim 15. Preferred embodiments of the invention will become apparent from the accompanying dependent claims, the following description and the drawings.
Das erfindungsgemäße Verfahren ist ein Verfahren zur elektri- sehen Isolierung eines Leiters insbesondere eines Bauteilmo¬ duls. Zweckmäßig ist das Bauteilmodul mit zumindest einem Bauteil sowie zumindest einem elektrisch an das zumindest ei¬ ne Bauteil kontaktierten Leiter gebildet und/oder der Leiter ist der Leiter eines Bauteils. Bei dem erfindungsgemäßen Ver- fahren wird als elektrischer Leiter ein mit einem offenporigen Material gebildeter Leiter herangezogen und innenliegende Bereiche des offenporigen Materials werden mittels Poren des offenporigen Materials zumindest bereichsweise mit elektrisch isolierendem Material versehen. The inventive method is a method for electrical insulation of a conductor see in particular a Bauteilmo ¬ duls. Suitably, the component module is formed with at least one component and at least one electrically contacted to the at least ei ¬ ne component conductor and / or the conductor is the head of a component. In the method according to the invention, a conductor formed with an open-pore material is used as the electrical conductor, and internal regions of the open-pored material are formed by means of pores of the porous material open-porous material at least partially provided with electrically insulating material.
Zweckmäßig werden innenliegende Bereiche des offenporigen Ma- terials mittels einer Einbringung elektrisch isolierenden Materials in das offenporige Material mit dem isolierenden Ma¬ terial versehen; d.h. das isolierende Material wird in das offenporige Material eingebracht. Bei dem erfindungsgemäßen Verfahren wird das offenporige Material des Leiters gewissermaßen wie ein Schwamm für das iso¬ lierende Material genutzt. Aufgrund des offenporigen Materi¬ als des elektrischen Leiters kann das isolierende Material das offenporige Material zumindest zum Teil durchziehen oder durchsetzen. Folglich ist dann das isolierende Material auch formschlüssig mit dem elektrischen Leiter verbunden. Mittels des erfindungsgemäßen Verfahrens lässt sich folglich ein vor Delamination wirksam geschützter Leiter-Isolationsmaterial- Verbund schaffen. Insbesondere kann mittels des erfindungsge- mäßen Verfahrens ein Leitermodul oder Bauteilmodul gefertigt werden, welches keiner Delamination unterliegt. Denn selbst wenn zeitweise eine Haftung des isolierenden Materials an demjenigen Material des Leiters nicht hinreichend gegeben sein sollte, so bewirkt der Formschluss aufgrund der Offenpo- rigkeit des Materials des Leiters zusätzlich eine Aufrechter¬ haltung des Leiter-Isolationsmaterial-Verbundes . Weiterhin vorteilhaft lässt sich eine effektive elektrische Isolations¬ wirkung mit deutlich weniger isolierendem Material bewirken. Denn im Gegensatz zu einem Verguss des Leiters mit isolieren- dem Material erfordert eine Einbringung des isolierenden Ma¬ terials eine deutlich geringere Stoffmenge. Ein weiterer Vor¬ teil liegt in der Einfachheit des Verfahrens. Denn aufgrund von Kapillarkräften und Oberflächenspannungen kann eine Einbringung des isolierenden Materials sehr einfach erfolgen. In vielen Fällen ist ein bloßes Betropfen des offenporigen Materials mit einem, jedenfalls zunächst, flüssigen isolierenden Material bereits ausreichend. Idealerweise weist das offenporige Material eine offenzellige Struktur auf, sodass das isolierende Material diese Struktur besonders effizient passieren kann. Es versteht sich, dass das isolierende Material nicht notwen¬ digerweise bereits beim Einbringen in das offenporige Materi¬ al seine elektrisch isolierenden Eigenschaften vollumfänglich entfalten muss. So kann das isolierende Material etwa zu¬ nächst gemeinsam mit einer später evaporierenden elektrisch leitenden Flüssigkeit eingebracht sein. Vorteilhaft ist bei dem erfindungsgemäßen Verfahren der Leiter ein Kontaktstück, welches an einem elektrischen Kontakt des Bauteils kontaktiert ist. Zweckmäßig ist bei dem erfindungsgemäßen Verfahren das isolierende Material von Luft verschieden. Unter einem isolie¬ renden Material im Rahmen dieser Anmeldung ist zweckmäßig ein solches Material zu verstehen, welches eigens zur Isolierung eines Leiters aufgewandt wird, nicht aber Luft, welches in zahlreichen Anwendungsfällen oder Fertigungsumgebungen ohnehin bereits in der unmittelbaren Arbeitsumgebung vorliegt und in der Durchschlagsfestigkeit begrenzt ist, sondern vorzugs¬ weise eine Flüssigkeit und/oder ein Feststoff. Vorzugsweise wird als isolierendes Material ein solches Mate¬ rial herangezogen, welches mittels Kapillarkräften effizient in das offenporige Material eindringt. Vorzugsweise ist das isolierende Material aus oder mit einem sogenannten Underfill gebildet, welches sich vorteilhaft entlang von Oberflächen verteilt und Luft verdrängt. Bevorzugt ist das isolierende Material epoxybasiert , d.h. mit einem Expoxymaterial gebil¬ det . Conveniently, inner regions of open-pore material are provided by means of an insertion electrically insulating material in the open-pored material with the insulating Ma ¬ TERIAL; ie the insulating material is introduced into the open-pored material. In the inventive method, the open-pore material of the conductor is used to a certain extent like a sponge for the iso ¬-regulating material. Due to the open-pored Materi ¬ than the electrical conductor, the insulating material can at least partially pass through or enforce the open-pore material. Consequently, then the insulating material is also positively connected to the electrical conductor. By means of the method according to the invention, it is consequently possible to create a conductor-insulation-material composite which is effectively protected from delamination. In particular, by means of the method according to the invention a conductor module or component module can be manufactured which is not subject to delamination. Because even if a temporary adhesion of the insulating material on that material of the conductor should not be sufficiently given, the form-fit caused due to the Offenpo- rigkeit of the material of the conductor in addition an upright ¬ attitude of the conductor-insulation material-composite. Further advantageous effect can be an effective electrical insulation ¬ efficiently with significantly less insulating material. Because unlike a casting of the conductor with isolieren- the material requires a transfer of the insulating Ma ¬ terials a significantly smaller amount of material. Another ago ¬ partly lies in the simplicity of the process. Because due to capillary forces and surface tensions, an introduction of the insulating material can be done very easily. In many cases, merely dripping the open-pored material with a, at least initially, liquid insulating material is already sufficient. Ideally, the open-pore material has an open-cell structure, so that the insulating material can pass through this structure particularly efficiently. It is understood that the insulating material must already exert its electrical insulating properties fully when applied to the open-pored Materi al ¬ ¬ not notwen sarily. Thus, the insulating material may be about to ¬ next introduced together with a later evaporierenden electrically conductive liquid. Advantageously, in the method according to the invention, the conductor is a contact piece, which is contacted at an electrical contact of the component. Suitably, in the method according to the invention, the insulating material is different from air. Under a isolie ¬- generating material in the context of this application is useful to understand such a material, which is specifically used for the isolation of a conductor, but not air, which already exists in numerous applications or manufacturing environments in the immediate working environment and is limited in the dielectric strength but preference ¬, a liquid and / or solid. Preferably, such a mate rial ¬ is used as insulating material, which penetrates by capillary action efficiently in the open-pore material. Preferably, the insulating material is formed from or with a so-called underfill, which advantageously distributed along surfaces and displaces air. Preferably, the insulating material is epoxy-based, ie gebil ¬ det with an epoxy material.
Zweckmäßig wird ein solches isolierendes Material herangezo- gen, welches einen Wärmeausdehnungskoeffizienten aufweist, der von demjenigen des zu isolierenden Leiters, insbesondere von demjenigen des offenporigen Materials, möglichst wenig abweicht. Vorteilhaft treten dann im Betrieb keine erhöhten Materialspannungen auf, sodass ein Bruch des Leiters wirksam ausgeschlossen werden kann. Bevorzugt wird bei dem erfindungsgemäßen Verfahren ein solches isolierendes Material herangezogen, bei welchem der Wärmeausdehnungskoeffizient des isolierenden Materials angepasst ist. Dies kann entweder durch das, insbesondere einkomponentige, Isolationsmaterial selbst erfolgen oder durch Beimengungen weiterer Komponenten zum Isolationsmaterial, etwa mittels Füllstoffen wie isolie¬ rende Partikel, insbesondere Keramikpartikel und/oder It is expedient to use such an insulating material which has a thermal expansion coefficient which deviates as little as possible from that of the conductor to be insulated, in particular that of the open-pore material. Advantageously then occur in operation no increased Material stresses on, so that a breakage of the conductor can be effectively excluded. In the method according to the invention, preference is given to using such an insulating material in which the thermal expansion coefficient of the insulating material is adapted. This can be done either by the, in particular one-component, insulating material itself or by admixtures of other components to the insulating material, such as by means of fillers such as isolie ¬ rende particles, in particular ceramic particles and / or
Siliziumpartikel und/oder Kunststoffpartikel und/oder Kohlen¬ stoffpartikel und/oder Nanotubes und/oder Nanowires und/oder Flakes. Es versteht sich, dass ein isolierendes Partikel nicht vollständig aus elektrisch isolierendem Material beste¬ hen muss. Vielmehr kann ein isolierendes Partikel im Rahmen der vorliegenden Anmeldung ein Partikel mit einem elektrisch leitfähigen Kern sein, welches von einem elektrischen Isolator umhüllt ist, d.h. das ganze Partikel als solches leitet nicht. Im Rahmen dieser Anmeldung soll auch unter einem mehrkomponentigen Material, welches auf größeren Abmessungen als jenen der Partikel oder Partikelkerne isolierend wirkt, etwa ein mehrkomponentiges Material wie zuvor beschrieben, ein Isolationsmaterial verstanden werden. D.h. die Beimengungen weiterer Komponenten sind Bestandteil des Isolationsmate¬ rials. Silicon particles and / or plastic particles and / or coal ¬ material particles and / or nanotubes and / or nanowires and / or flakes. It is understood that an insulating particles do not completely of electrically insulating material best ¬ hen needs. Rather, an insulating particle in the context of the present application may be a particle with an electrically conductive core which is enveloped by an electrical insulator, ie the entire particle as such does not conduct. Within the scope of this application, a multicomponent material which has an insulating effect on larger dimensions than those of the particles or particle cores, for example a multicomponent material as described above, is to be understood as an insulation material. That is, the admixtures of other components are part of Isolationsmate ¬ rials.
Alternativ oder zusätzlich und ebenfalls bevorzugt wird als isolierendes Material ein elastisches Material herangezogen. Idealerweise ist auch das offenporige Material des Leiters elastisch, sodass auch der mit dem offenporigen Material und mit dem isolierenden Material gebildete Materialverbund elas¬ tisch verformbar ist. In vorteilhafter Weiterbildung des erfindungsgemäßen Verfahrens wird als elastisches isolierendes Material ein Silikon oder ein Epoxid herangezogen. In einer bevorzugten Weiterbildung des erfindungsgemäßen Verfahrens wird als isolierendes Material ein flüssiges oder gasförmiges Material herangezogen. Vorzugsweise erfolgt bei dem erfindungsgemäßen Verfahren die Einbringung des isolierenden Materials mittels Dispensens und/oder Tropfens und/oder Tauchens und/oder Jettens (insbe¬ sondere Ink-Jettens) . Alternatively or additionally and also preferably, an elastic material is used as the insulating material. Ideally, the open-pore material of the conductor is elastic, so that the composite material formed with the open-pore material and the insulating material is elas ¬ table deformable. In an advantageous development of the method according to the invention, a silicone or an epoxide is used as the elastic insulating material. In a preferred development of the method according to the invention, a liquid or gaseous material is used as the insulating material. Preferably, the introduction of the insulating material by means of Dispensens and / or drop and / or dipping and / or Jettens (in particular ¬ sondere ink Jettens) is carried out in the inventive method.
Bevorzugt wird das isolierende Material mittels einer Einwir¬ kung von Infrarotstrahlung und/oder Wärme und/oder einem oder mehreren Katalysatoren und/oder von Härterzusätzen in einen Festkörper gewandelt und/oder gehärtet. Vorteilhaft kann bei einer Wandlung in einen Festkörper oder bei einer Härtung des isolierenden Materials freiwerdendes Lösungsmittel effizient aus dem offenporigen Materials ausgasen. The insulating material is preferably converted by means of a Einwir ¬ effect of infrared radiation and / or heat and / or one or more catalysts and / or curing agent additives in a solid state and / or cured. Advantageously, in the case of a conversion into a solid or in the case of a hardening of the insulating material, the solvent released can efficiently outgas from the open-pored material.
Zweckmäßig wird bei dem erfindungsgemäßen Verfahren der elektrische Leiter zunächst an zumindest einen Kontakt eines Bauteils mit dem offenporigen Material des Leiters in der Art eines Kontaktstücks galvanisch (elektrochemisch oder außen- stromfrei) angebunden. Die Offenporigkeit des Materials des Leiters liefert nicht nur für das isolierende Material, son- dern auch für Elektrolytflüssigkeit zahlreiche Durchlässe, sodass letztere somit von außen an die Grenzfläche von Kon¬ taktstück und elektrischem Kontakt des Bauteils gelangen kann. Idealerweise weist das offenporige Material des Kon¬ taktstücks eine offenzellige Struktur auf, durch welche hin- durch Elektrolytflüssigkeit besonders effizient passieren kann. Auf diese Weise dient das offenporige Material des Lei¬ ters sowohl zur elektrischen Kontaktierung als auch zugleich zur elektrischen Isolierung. Zweckmäßig ist dabei das Bauteil mit dem offenporigen Kontaktstück mittels eines Verfahrens hergestellt wie es in der Patentanmeldung der Anmelderin mit dem amtlichen Aktenzeichen 102015210061.8, insbesondere in der dort enthaltenen Beschreibung und/oder den Ansprüchen, erläutert ist. In einer vorteilhaften Weiterbildung des erfindungsgemäßenAppropriately, in the method according to the invention, the electrical conductor is first connected to at least one contact of a component with the open-pore material of the conductor in the manner of a contact piece galvanically (electrochemically or without external current). The open porosity of the material of the head not only provides for the insulating material, but also for numerous electrolyte fluid passages so that the latter can thus move from the outside to the interface of con ¬ tact piece and electrical contact of the component. Ideally, the open-pore material of the con tact ¬ piece on an open cell structure through which can be reciprocated by electrolyte fluid happen particularly efficient. In this way, the open-pore material of the Lei ¬ ters serves both for the electrical contacting and at the same time for the electrical insulation. The component with the open-pored contact piece is expediently produced by means of a method as described in the Applicant's patent application with the official file reference 102015210061.8, in particular in the description and / or the claims contained therein. In an advantageous embodiment of the invention
Verfahrens ist das offenporige Material mit porösem Material gebildet . Zweckmäßig ist bei dem erfindungsgemäßen Verfahren das zumindest eine offenporige Material aus oder mit Metall, insbeson¬ dere mit oder aus Kupfer und/oder Aluminium und/oder Zinn und/oder Titan und/oder Nickel und/oder Silber und/oder Gold und/oder Legierungen aus zwei oder mehreren den vorgenannten Metallen miteinander, insbesondere Messing, oder mit weiteren Materialien, gebildet. Process is the open-pored material formed with porous material. Is useful in the inventive method the at least one open-pored material or metal, insbeson ¬ particular with or of copper and / or aluminum and / or tin and / or titanium and / or nickel and / or silver and / or gold and / or Alloys of two or more of the aforementioned metals together, in particular brass, or formed with other materials.
Zweckmäßig ist bei dem erfindungsgemäßen Verfahren das zumin- dest ein offenporiges Material mit einer gewebeartigen und/oder schaumartigen und/oder netzartigen Struktur ausgebildet oder als eine solche Struktur ausgebildet. The at least one open-pored material with a fabric-like and / or foam-like and / or net-like structure is expediently designed or formed as such a structure in the method according to the invention.
Vorzugsweise wird das erfindungsgemäße Verfahren für einen Leiter eines Bauteilmoduls umfassend das Bauteil und einen an das Bauteil kontaktierten Leiter durchgeführt. In einer vorteilhaften Weiterbildung des erfindungsgemäßen Verfahrens wird als Bauteil ein Leistungsbauteil herangezogen. Geeigneterweise wird bei dem erfindungsgemäßen Verfahren als Bauteil ein Bauteil mit mindestens einem Transistor, vorzugs¬ weise einem Bipolartransistor mit isolierter Gate-Elektrode (engl. „ insulated-gate bipolar transistor": IGBT) herangezogen . The method according to the invention is preferably carried out for a conductor of a component module comprising the component and a conductor contacted to the component. In an advantageous development of the method according to the invention, a power component is used as the component. Used: a suitable manner (IGBT eng "insulated-gate bipolar transistor.") Is in the inventive method as a component, a component having at least one transistor, preferably as a ¬ insulated-gate bipolar transistor.
Es versteht sich, dass sich als Erfindung zusätzlich auch ein Verfahren zur Herstellung eines isolierten elektrischen Leiters, zur Herstellung eines Leitermoduls mit einem elektrisch isolierten Leiter oder zur Herstellung eines Bauteilmoduls mit einem Bauteil und zumindest einem elektrisch an das Bau¬ teil kontaktierten elektrisch isolierten Leiter verstehen lässt, bei welchem die Schritte des erfindungsgemäßen Verfahrens zur elektrischen Isolierung eines Leiters, wie sie in dieser Beschreibung oben erläutert sind, durchgeführt werden. It will be understood that in addition be understood as the invention also provides a method for producing an insulated electrical conductor, for producing a conductor module with an electrically insulated conductor or for producing a component module having a component and at least one electrically contacted to the construction ¬ partially electrically insulated conductors in which the steps of the method according to the invention for the electrical insulation of a conductor, as explained above in this description, are carried out.
Das erfindungsgemäße Leitermodul weist zumindest einen elekt¬ rischen Leiter auf. Das erfindungsgemäße Bauteilmodul weist ein Bauteil mit zumindest einem elektrisch an das Bauteil kontaktierten Leiter auf. Bei dem erfindungsgemäßen Leitermodul und beim erfindungsgemäßen Bauteilmodul ist der Leiter mit offenporigem Material gebildet und das offenporige Mate- rial ist zumindest bereichsweise innenliegend mit isolieren¬ dem Material versehen. The conductor module according to the invention comprises at least one elekt ¬ step ladder. The component module according to the invention has a component with at least one electrically contacted to the component conductor. In the inventive conductor module according to the invention and component module, the conductor is formed with open-pore material and the open-pored material is at least partially internally with ¬ isolate the material provided.
Besonders vorteilhaft ist das erfindungsgemäße Leitermodul oder Bauteilmodul mittels eines erfindungsgemäßen Verfahrens wie oben beschrieben gebildet. The conductor module or component module according to the invention is particularly advantageously formed by means of a method according to the invention as described above.
In einer Weiterbildung des erfindungsgemäßen Bauteilmoduls ist dieses stapelartig in der Art eines Stacks realisiert, wobei die Ebenen dieses Stacks mittels Leiterplatten und/oder Substraten gebildet sind, an welchen Bauteile an Leiter ange¬ bunden sind. Zweckmäßig sind dazu die Leiter von Bauteilen sämtlicher Ebenen mittels des erfindungsgemäßen Verfahrens isoliert. Insbesondere können auch Bauteile, insbesondere auf Halbleiterbasis wie etwa IGBTs und/oder passive Bauteile wie Kondensatoren und/oder Induktivitäten, stackartig ohne jeweils eigene Leiterplatte übereinander gestapelt werden und mittels des erfindungsgemäßen Verfahrens gegeneinander isoliert werden. Geeigneterweise ist bei dem erfindungsgemäßen Bauteilmodul der Leiter an einen Flächenkontakt des Bauteils des Bauteil¬ moduls kontaktiert. Vorzugsweise ist der Leiter abseits des Flächenkontakts und/oder an einer dem Flächenkontakt abge¬ wandten Seite des Leiters, isoliert. In a development of the component module according to the invention, this stack is realized in the manner of a stack, wherein the levels of this stack are formed by means of printed circuit boards and / or substrates, to which components are connected to conductors ¬ . Suitably, the conductors of components of all levels by means of the method according to the invention are isolated. In particular, components, in particular on a semiconductor basis such as IGBTs and / or passive components such as capacitors and / or inductors, stack-like without each own circuit board are stacked and insulated by the inventive method against each other. Suitably, in the inventive component module, the conductor is contacted to a contact surface of the component of the component ¬ module. Preferably, the conductor is away from the contact surface and / or on a surface of the contact abge ¬ facing side of the conductor, isolated.
Nachfolgend wird die Erfindung anhand eines in der Zeichnung dargestellten Ausführungsbeispiels näher erläutert. Es zei¬ gen : Fig. 1 eine Anordnung mit einem Keramiksubstrat mit einem The invention will be explained in more detail with reference to an embodiment shown in the drawing. It zei ¬ gen 1 shows an arrangement with a ceramic substrate with a.
Leistungsbauteil und einem an dieses Leistungsbau¬ teil ankontaktierten elektrischen Leiter vor der Durchführung des erfindungsgemäßen Verfahrens zur Isolierung des elektrischen Leiters zur Herstellung eines erfindungsgemäßen Bauteilmoduls in einer Prinzipskizze im Querschnitt, die Anordnung gem. Fig. 1 gemeinsam mit einer Power component and an ankontaktierten to this Leistungsbau ¬ part electrical conductor before performing the method according to the invention Insulation of the electrical conductor for producing a component module according to the invention in a schematic diagram in cross section, the arrangement acc. Fig. 1 together with a
Dispensereinrichtung vor einer Durchführung des erfindungsgemäßen Verfahrens zur Isolierung des elektrischen Leiters in einer Prinzipskizze im Querschnitt, die Anordnung gem. Fig. 1 bei der Durchführung des erfindungsgemäßen Verfahrens zur Isolierung des elektrischen Leiters in einer Prinzipskizze im Querschnitt, sowie die Anordnung des Leistungsbauteils gem. Fig. 3 nach Durchführung des erfindungsgemäßen Verfahrens in einer Prinzipskizze im Querschnitt.  Dispensing device before carrying out the method according to the invention for the isolation of the electrical conductor in a schematic diagram in cross section, the arrangement acc. Fig. 1 in the implementation of the method according to the invention for the isolation of the electrical conductor in a schematic diagram in cross section, and the arrangement of the power component according to. Fig. 3 after performing the method according to the invention in a schematic diagram in cross section.
Das in Fig. 1 dargestellte Leistungsbauteil 10 ist ein The power component 10 shown in FIG. 1 is a
Bipolartransistor mit isolierter Gate-Elektrode (engl. Insulated Gate Bipolar Transistor (Engl.
„insulated-gate bipolar transistor": IGBT) und weist eine erste 20 und eine zweite Flachseite 30 auf, welche voneinan- der abgewandt sind. Entlang der ersten 20 und zweiten Flachseite 30 erstrecken sich dünnschichtartige Flächenkontakte 40, 50 des Leistungsbauteils 10, welche als flächige Chip¬ metallisierungen ausgebildet sind. Im dargestellten Ausführungsbeispiel bestehen der in Fig. 1 oberseitig angeordnete Flächenkontakt 40 sowie der unterseitig angeordnete Flächen¬ kontakt 50 des Leistungsbauteils 10 aus Kupfer. Grundsätzlich können die Flächenkontakte auch aus oder mit Silber und/oder aus oder mit AlSiCu und/oder aus oder mit Gold und/oder Kup¬ fer und/oder sonstigen Metallen oder anderen elektrisch lei- tenden Materialien gebildet sein. Insulated gate bipolar transistor (IGBT) and has a first 20 and a second flat side 30 facing away from each other along the first 20 and second flat side 30 extend thin-film surface contacts 40, 50 of the power component 10, which -area chip ¬ metallizations are formed. in the illustrated embodiment, the upper side is arranged in Fig. 1 surface contact 40 and the underside surfaces arranged ¬ contact 50 of the power device 10 are made of copper. in principle, the surface contacts can also be made or with silver and / or from or with AlSiCu and / or be formed from or with gold and / or Kup ¬ fer and / or other metals or other electrically conducting materials.
Zur Kontaktierung des oberseitigen Flächenkontakts 40 ist an den Flächenkontakt 40 ein Kontaktstück 60 offenporigen Mate- rials angebunden, welches sich im Wesentlichen flächig entlang des Flächenkontakts 40 erstreckt. Im dargestellten Aus¬ führungsbeispiel ist das Kontaktstück 60 leitfähig ausgebil¬ det und als Kupferschwamm realisiert. Es versteht sich, dass in weiteren, nicht eigens dargestellten Ausführungsbeispie¬ len, welche im Übrigen dem anhand der Figuren erläuterten Ausführungsbeispiel entsprechen, das offenporige Kontaktstück 60 auch aus sonstigen offenporigen leitfähigen Materialien bestehen können, etwa als Netze oder Gewebe oder sonstigen porösen Strukturen ausgebildete Aluminium-, Ti- oder aus oder mit sonstigen Metallen gebildete Kontaktstücke. Beispielswei¬ se können auch mit leitfähigen Materialien bereichsweise beschichtete oder mit leitfähigen Partikeln versetzte For contacting the upper-side surface contact 40, a contact piece 60 of open-pored material is bonded to the surface contact 40. connected, which extends substantially flat along the surface contact 40. In the exemplary embodiment shown, the contact piece 60 is conductive ausgebil ¬ det and realized as a copper sponge. It is understood that in other, not specifically illustrated Ausführungsbeispie ¬ len, which otherwise correspond to the explained with reference to the figures embodiment, the open-pore contact piece 60 may consist of other open-pore conductive materials, such as nets or fabric or other porous structures formed aluminum -, Ti- or formed from or with other metals contacts. Beispielswei ¬ se can also partially coated with conductive materials or with conductive particles offset
Polymerschwämme als Kontaktstücke herangezogen werden. Polymer sponges are used as contact pieces.
Eines der Flächenkontakte 50 des Leistungsbauteils 10 ist ei¬ nem weiteren Flächenkontakt 80 eines Keramiksubstrats 90 mit einem Keramikkern 100 aus Aluminiumnitrid (A1N) zugewandt. Grundsätzlich kann der Keramikkern 100 in weiteren, nicht ei- gens gezeigten Ausführungsbeispielen aus einem anderen keramischen Material, oder aber aus Leiterplattenmaterialien wie FR 4 oder anderen Trägern aus Silikon und/oder Epoxy bestehen. Der weitere Flächenkontakt 80 des Keramiksubstrats 90 ist als oberflächliche Substratmetallisierung, im dargestell- ten Ausführungsbeispiel als kupferne Substratmetallisierung, ausgebildet. Der dem Keramiksubstrat 90 zugewandte Flächen¬ kontakt 50 des Leistungsbauteils 10 und der weitere Flächen¬ kontakt 80 des Keramiksubstrats 90 erstrecken sich zueinander parallel und bilden folglich einen ebenen Spalt aus. Das an jenem dem Keramiksubstrat 90 zugewandten Flächenkontakt 50 angeordnete Kontaktstück 70 füllt diesen ebenen Spalt voll¬ ständig aus und liegt vollflächig an diesem Flächenkontakt 50 des Leistungsbauteils 10 sowie an dem weiteren Flächenkontakt 80 des Keramiksubstrats 90 an. Das Kontaktstück 70 ist somit zur Kontaktierung von Leistungsbauteil 10 und Keramiksubstrat 90 angeordnet. Eine Kontaktierung des offenporigen Kontaktstücks 60 mit dem Flächenkontakt 40 des Leistungsbauteils 10 ist mittels - an sich bekannter - elektrochemischer Galvanisierung realisiert. Dabei ist Metall, im dargestellten Ausführungsbeispiel Kup- fer, im Bereich zwischen dem offenporigen Kontaktstück 60 und dem Flächenkontakt 40 als eine elektrisch leitende Anbindung abgeschieden. Das abgeschiedene Kupfer bildet eine Kupfer¬ schicht (nicht eigens dargestellt) aus, welche sich flächig entlang der Chipmetallisierung sowie dem Kontaktstück 60 er- streckt. Infolge dieser Abscheidung ist das offenporigen Kontaktstück 60 leitfähig mit dem Leistungsbauteil 10 verbunden. One of the surface contacts 50 of the power device 10 facing ei ¬ nem further surface contact 80 of a ceramic substrate 90 having a ceramic core 100 of aluminum nitride (A1N). In principle, the ceramic core 100 can consist of another ceramic material in further exemplary embodiments not shown, or of printed circuit board materials such as FR 4 or other supports of silicone and / or epoxy. The further surface contact 80 of the ceramic substrate 90 is formed as superficial substrate metallization, in the illustrated exemplary embodiment as a copper substrate metallization. The ceramic substrate 90 facing surface ¬ contact 50 of the power component 10 and the other surface ¬ contact 80 of the ceramic substrate 90 extend parallel to each other and thus form a planar gap. The facing on that the ceramic substrate 90 surface contact 50 arranged contact piece 70 fills this planar gap fully ¬ constantly and is fully supported on this surface contact 50 of the power device 10 and on the further surface contact 80 of the ceramic substrate 90th The contact piece 70 is thus arranged for contacting the power component 10 and the ceramic substrate 90. A contacting of the open-pore contact piece 60 with the surface contact 40 of the power component 10 is realized by means of - known per se - electrochemical galvanization. In this case, metal, in the illustrated embodiment copper, is deposited in the region between the open-pored contact piece 60 and the surface contact 40 as an electrically conductive connection. The deposited copper forms a copper ¬ layer (not separately shown) from which area along the chip metallization, and the contact piece 60 extends ER. As a result of this deposition, the open-pore contact piece 60 is conductively connected to the power device 10.
Nachfolgend wird das aus Keramiksubstrat 90 und Subsequently, the ceramic substrate 90 and
ankontaktiertem Leistungsbauteil 10 gebildete Leistungsmodul mit Isoliermaterial 210 isoliert. Dazu ist wie in Fig. 2 ge¬ zeigt eine Dispensereinrichtung 200 vorhanden, die oberhalb des Kontaktstücks 60 an dessen vom Keramiksubstrat 90 abge¬ wandten Seite angeordnet ist. Die Dispenereinrichtung 200 ist ausgebildet, ein flüssigesinsulated power module 10 formed with insulating material 210. For this purpose, as shown in Fig. 2 shows a ge ¬ Dispensereinrichtung 200 present, which is arranged above the contact piece 60 on the ceramic substrate 90 from the side facing abge ¬. The dispenser 200 is formed, a liquid
Isolationsmaterial 210, im dargestellten Ausführungsbeispiel einen epoxybasierten Underfill, d.h. einen mit einem Insulation material 210, in the illustrated embodiment, an epoxy-based underfill, i. one with one
Expoxymaterial gebildeten Underfill, abseits von der eigent¬ lichen Kontaktfläche zwischen Kontaktstück 60 und Flächenkon- takt 40, im dargestellten Ausführungsbeispiel also von oben, auf das Kontaktstück 60 zu tropfen. Expoxymaterial formed underfill, away from OWNER ¬ union area of contact between the contact piece 60 and Flächenkon- clock 40, in the illustrated embodiment, from the top to drip onto the contact piece 60th
Infolge der Kapillarkräfte aufgrund der jeweiligen Oberflä¬ chenspannungen durchsetzt das Isolationsmaterial 210 das Kon- taktstück 60 durch dessen oberflächliche Poren und dringt ein Stück weit in das Innere des Kontaktstücks 60 ein (s.a. Fig. 3 und 4 ) . As a result of the capillary forces due to the respective Oberflä ¬ chenspannungen the insulating material 210 passes through the contact-piece 60 by its superficial pores and penetrates a certain distance into the interior of the contact piece 60 a (see Fig. 3 and 4).
Nachfolgend wird das Isolationsmaterial 210 ausgeheizt. In weiteren, nicht eigens dargestellten Ausführungsbeispielen kann das Ausheizen des Isolationsmaterials 210 entfallen. Hier erfolgt eine Trocknung beispielsweise durch eine längere Wartezeit oder aber, wenn ein entsprechendes Isolationsmate- rial gewählt wird, mittels Infrarotbestrahlung oder mittels eines Zusatzes eines Härters oder mittels eines Zusatzes ei¬ nes Katalysators. In weiteren, nicht gesondert dargestellten Ausführungsbei¬ spielen wird das Isolationsmaterial 210 nicht mit einem Subsequently, the insulating material 210 is baked out. In further, not specifically illustrated embodiments, the heating of the insulation material 210 can be omitted. Drying takes place here, for example, by a longer waiting time or else when a corresponding insulation material is applied. is selected by means of infrared radiation or by means of an addition of a curing agent or by means of an addition egg ¬ nes catalyst. In further, not separately illustrated Ausführungsbei ¬ play the insulation material 210 is not with a
Dispenser 200 aufgetragen, sondern mittels eines Dispenser 200 applied, but by means of a
Inkjetdruckers eingedruckt oder aber das Kontaktstück 60 mit¬ tels Eintauchens in ein Bad flüssigen Isolationsmaterials in das Kontaktstück 60 infiltriert. Zusätzlich kann in weiteren Ausführungsbeispielen ein Füllstoff im Isolationsmaterial enthalten sein, beispielsweise Si02-Partikel und/oder Poly¬ amid-Partikel, welcher typische Eigenschaften von Isolations¬ materialien aufweist, etwa eine hohe Durchschlagsfestigkeit, eine hohe Teilentladungsfestigkeit, ein entsprechender ther¬ mischer Ausdehnungskoeffizient und/oder ähnliches. Inkjet printer imprinted or the contact piece 60 with ¬ means immersion in a bath of liquid insulation material infiltrated into the contact piece 60. In addition, in other embodiments, a filler, for example, Si02-particles and / or poly ¬ amide particles can be contained in the insulating material, having which typical properties of insulation ¬ materials, such as a high dielectric strength, a high resistance to partial discharges, a corresponding ther ¬ mixer expansion coefficient and /or similar.
Aufgrund der sich ausbildenden zahlreichen Formschlüsse ist das Isolationsmaterial 210 mit dem Kontaktstück 60 eng ver- zahnt, sodass einer Delamination wirksam vorgebeugt ist. Because of the numerous form-fit connections that form, the insulation material 210 is closely interlocked with the contact piece 60, so that delamination is effectively prevented.

Claims

Patentansprüche claims
1. Verfahren zur elektrischen Isolierung eines elektrischen Leiters, bei welchem als elektrischer Leiter zumindest ein mit einem offenporigen Material (60) gebildeter Leiter herangezogen wird und innenliegende Bereiche des offenporigen Ma¬ terials mittels Poren des offenporigen Materials zumindest bereichsweise mit elektrisch isolierendem Material (210) ver¬ sehen werden. 1. A method for electrical insulation of an electrical conductor, wherein an electrical conductor, at least one with an open-pored material (60) formed conductor is used and internal regions of the open-pored Ma ¬ terials means pores of the open-pored material at least regionally with an electrically insulating material (210) will see ¬ ver.
2. Verfahren nach Anspruch 1, bei welchem das offenporige Material zumindest bereichsweise außenliegend mit isolierendem Material (210) versehen wird. 2. The method of claim 1, wherein the open-pored material is at least partially provided externally with insulating material (210).
3. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem der Leiter ein Leiter eines Bauteils ist und/oder der Leiter ein Kontaktstück ist, welches an einem elektrischen Kontakt eines Bauteils kontaktiert ist. 3. The method according to any one of the preceding claims, wherein the conductor is a conductor of a component and / or the conductor is a contact piece, which is contacted to an electrical contact of a component.
4. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem als isolierendes Material (210) ein, zumindest zu¬ nächst, flüssiges oder gasförmiges Material herangezogen wird . 4. The method according to any one of the preceding claims, wherein as an insulating material (210), at least one of ¬ next, liquid or gaseous material is used.
5. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem eine Einbringung isolierenden Materials (210) mittels Dispensers und/oder Tropfens und/oder Tauchens und/oder Jet¬ tens, insbesondere Ink-Jettens, erfolgt. 5. The method according to any one of the preceding claims, wherein an introduction of insulating material (210) by means of dispenser and / or drop and / or diving and / or Jet ¬ least, in particular ink jetting takes place.
6. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem das isolierende Material (210) mittels einer Einwir¬ kung von Infrarotstrahlung und/oder Wärme und/oder einem oder mehreren Katalysatoren und/oder von Härterzusätzen in einen Festkörper gewandelt und/oder gehärtet wird. 6. The method according to any one of the preceding claims, wherein the insulating material (210) is converted and / or cured by means of Einwir ¬ kung of infrared radiation and / or heat and / or one or more catalysts and / or hardener additives in a solid.
7. Verfahren nach einem der vohergehenden Ansprüche, bei welchem das isolierende Material mit einem Underfiller gebildet ist . A method according to any one of the preceding claims, wherein the insulating material is formed with an underfiller.
8. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem das isolierende Material mittels Füllstoffen, insbe¬ sondere mittels elektrisch isolierender Partikel, gebildet ist . 8. The method according to any one of the preceding claims, wherein the insulating material is formed by means of fillers, in particular ¬ special means of electrically insulating particles.
9. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem das isolierende Material mit einem elastischen Mate- rial, insbesondere mit einem Silikon und/oder einem Epoxid, gebildet ist. 9. The method according to any one of the preceding claims, wherein the insulating material with an elastic mate- material, in particular with a silicone and / or an epoxy, is formed.
10. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem das zumindest eine offenporige Material (60) mit ei¬ nem porösen Material gebildet ist. 10. The method according to any one of the preceding claims, wherein the at least one open-pored material (60) is formed with egg ¬ nem porous material.
11. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem das zumindest eine offenporige Material (60) aus oder mit Metall, insbesondere Kupfer und/oder Aluminium und/oder Zinn und/oder Titan und/oder Nickel und/oder Silber und/oder Gold und/oder Legierungen aus den vorgenannten Metallen miteinander, insbesondere Messing, oder mit weiteren Materialien gebildet ist. 11. The method according to any one of the preceding claims, wherein the at least one open-pore material (60) made of or with metal, in particular copper and / or aluminum and / or tin and / or titanium and / or nickel and / or silver and / or gold and / or alloys of the aforementioned metals with each other, in particular brass, or is formed with other materials.
12. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem das zumindest eine offenporige Material (60) mit ei¬ ner gewebeartigen und/oder schaumartigen und/oder netzartigen Struktur gebildet ist. 12. The method according to any one of the preceding claims, wherein the at least one open-pored material (60) is formed with ei ¬ ner fabric-like and / or foam-like and / or net-like structure.
13. Verfahren nach einem der vorherigen Ansprüche, zumindest nach Anspruch 3, , wobei als Bauteil (10) ein Leistungsbau¬ teil herangezogen wird. 13. The method according to any one of the preceding claims, at least according to claim 3, wherein as component (10) a Leistungsbau ¬ part is used.
14. Verfahren nach einem der vorhergehenden Ansprüche, zumindest nach Anspruch3, bei welchem als Bauteil (10) ein Bauteil mit mindestens einem Transistor, vorzugsweise einem IGBT, herangezogen wird. 14. The method according to any one of the preceding claims, at least according to claim 3, wherein as component (10) a component with at least one transistor, preferably an IGBT, is used.
15. Leitermodul mit einem elektrischen Leiter oder Bauteilmo¬ dul mit einem Bauteil mit zumindest einem elektrisch an das Bauteil kontaktierten Leiter, bei welchem der elektrische Leiter mit einem offenporigen Material gebildet ist, wobei das offenporige Material zumindest bereichsweise innenliegend mit isolierendem Material versehen ist. 15. Conductor module with an electrical conductor or Bauteilmo ¬ module with a component having at least one electrically contacted to the component conductor, wherein the electrical conductor is formed with an open-pore material, wherein the open-pored material is at least partially internally provided with insulating material.
16. Leitermodul oder Bauteilmodul nach dem vorhergehenden Anspruch, welches mittels eines Verfahrens nach einem der vor¬ hergehenden Ansprüche gebildet ist. 16. Head module or component module according to the preceding claim, which is formed by a method according to one of claims ¬ forth before.
PCT/EP2016/072190 2015-09-23 2016-09-19 Method for electrically insulating an electrical conductor, in particular a component module, conductor module, and component module WO2017050702A1 (en)

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WO2003096389A2 (en) * 2002-05-14 2003-11-20 Infineon Technologies Ag Metal object to be at least partially coated with a substance
WO2011063933A1 (en) * 2009-11-30 2011-06-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Metal-contacted substrate and method for the production thereof
US20110192630A1 (en) * 2010-02-09 2011-08-11 Denso Corporation Electronic device and method of manufacturing the same

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DE102011018544A1 (en) * 2011-04-20 2012-10-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for connecting mating face of substrate, electronic portion and mating face of electronic portion for electronic component, involves forming film between mating face(s) and adhering mating face(s) with intermediate film

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JPS5624956A (en) * 1979-08-08 1981-03-10 Nec Corp Resin-sealed semiconductor device
WO2003096389A2 (en) * 2002-05-14 2003-11-20 Infineon Technologies Ag Metal object to be at least partially coated with a substance
WO2011063933A1 (en) * 2009-11-30 2011-06-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Metal-contacted substrate and method for the production thereof
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