WO2017045232A1 - 一种天然石墨/铝复合散热片 - Google Patents

一种天然石墨/铝复合散热片 Download PDF

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WO2017045232A1
WO2017045232A1 PCT/CN2015/091641 CN2015091641W WO2017045232A1 WO 2017045232 A1 WO2017045232 A1 WO 2017045232A1 CN 2015091641 W CN2015091641 W CN 2015091641W WO 2017045232 A1 WO2017045232 A1 WO 2017045232A1
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aluminum
layer
graphite
heat sink
composite heat
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PCT/CN2015/091641
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English (en)
French (fr)
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刘宝兵
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奇华光电（昆山）股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the utility model relates to the field of heat dissipation and electromagnetic shielding of a heat-generating component of an electronic product, in particular to a natural graphite/aluminum composite heat sink.
  • the current CPU is hot due to high-speed operation, and the high-speed operation of the CPU is developed to improve the processing speed of its equipment.
  • the demand for mobile phones, tablet computers, notebook computers and televisions and the use of display screens have increased.
  • the demand for high brightness of display screens has increased the use of LEDs, but the more LEDs are used, the more power is consumed, which also increases the equipment.
  • the functions of display devices are increasing, the number of parts used is diversified, the number is large, and the volume is smaller.
  • the devices such as mobile phones and tablet computers are becoming smaller and smaller, and the available space is insufficient.
  • the distance between parts and components is closer, which is easy to occur. Electromagnetic interference between each other.
  • the thickness of artificial graphite as a heat dissipating material on the market is dominated by 25 ⁇ m, and 40 ⁇ m artificial graphite can be mass-produced, but the thermal conductivity is not good.
  • the mass productivity of 70 ⁇ m artificial graphite is not high, and the thickness limits the heat dissipation performance of artificial graphite. More heat needs to be solved.
  • a heat conducting carrier having a higher thermal conductivity and a larger heat dissipation capability is required.
  • the utility model provides a natural graphite/aluminum composite heat sink, which is a heat conductive carrier with excellent heat conduction effect, and can also provide electromagnetic shielding function.
  • a natural graphite/aluminum composite heat sink comprising an aluminum foil layer and a graphite layer on the upper and lower sides of the aluminum foil layer; the aluminum foil layer comprising an aluminum substrate and a roughened layer on the upper and lower sides of the aluminum substrate; The surface is uniformly distributed with holes; the roughened layer is engaged with the graphite layer through the holes.
  • the aluminum substrate, the roughened layer and the holes are an integrated structure.
  • the natural graphite/aluminum composite heat sink has a thickness of 28 ⁇ m to 2100 ⁇ m; the aluminum foil layer has a thickness of 8 ⁇ m to 100 ⁇ m; the roughened layer has a surface area of 3 to 8 times that of the aluminum substrate; and the graphite layer has a thickness of 10 ⁇ m to 1000 ⁇ m.
  • the natural graphite/aluminum composite heat sink has a graphite layer/aluminum foil layer/graphite layer as a unit layer, and can form a composite structure of up to 10 unit layers.
  • the utility model has the advantages that: the natural graphite/aluminum composite heat sink of the utility model adopts the manner that the graphite layer and the aluminum foil layer are engaged with each other through the holes, so that the adhesion of the aluminum foil and the graphite is greatly increased, and the interface between the aluminum foil and the graphite is made.
  • the thermal resistance is smaller, the thermal conductivity in the Z-axis direction is greatly improved, and the heat conduction performance of the heat sink is excellent, the thermal conductivity is 400 W/m ⁇ K - 1200 W/m ⁇ K, and the thermal diffusion coefficient is as high as 200 mm 2 /s to 700 mm 2 /s.
  • the natural graphite/aluminum composite heat sink of the utility model is resistant to stretching, It is bent 180 degrees and has high mechanical properties.
  • FIG. 1 is a schematic structural view of a natural graphite/aluminum composite heat sink according to an embodiment
  • FIG. 2 is an enlarged schematic view showing an aluminum foil layer of a natural graphite/aluminum composite heat sink according to an embodiment
  • 1-aluminum foil layer 11-aluminum substrate, 12-roughened layer, 13-hole, 2-graphite layer.
  • the natural graphite/aluminum composite heat sink prepared by the method for preparing a natural graphite/aluminum composite heat sink of the present embodiment comprises an aluminum foil layer 1 and graphite on the upper and lower sides of the aluminum foil layer 1.
  • the aluminum foil layer 1 comprises an aluminum substrate 11 and a roughening layer 12 on the upper and lower sides of the aluminum substrate; the surface of the roughening layer 12 is uniformly distributed with holes 13; the rough layer 12 passes through the holes 13 and The graphite layer 2 is engaged with each other; the aluminum substrate, the rough layer and the hole are an integrated structure; the natural graphite/aluminum composite heat sink has a thickness of 28 ⁇ m to 2100 ⁇ m; and the aluminum foil layer 1 has a thickness of 8 ⁇ m to 100 ⁇ m; The surface area of the roughened layer 12 is 3 to 8 times that of the aluminum substrate 11; and the thickness of the graphite layer 2 is 10 ⁇ m to 1000 ⁇ m.
  • the holes in the aluminum foil layer of the embodiment can not only increase the surface area, but also make the adhesion of aluminum and graphite more tight, the surface of the roughened aluminum is uneven, the surface area is extremely large, and the pores are scattered and the shapes of the holes are different.
  • the graphite can not fall off and resist bending due to the grip of the hole.
  • the bite force of the graphite layer and the aluminum described in this embodiment is greater than the bite force between the graphite layer and the graphite layer, thereby increasing the adhesion between the graphite layer and the aluminum substrate.
  • the natural graphite/aluminum composite heat sink described in this embodiment can be arbitrarily adjusted in thickness under different requirements, and can be arbitrarily adjusted within the scope of the process to meet different application requirements; the graphite layer/aluminum foil layer/graphite layer is used as a unit.
  • the number of layers can be arbitrarily adjusted in different requirements, and can be adjusted to a maximum of 10 layers within the scope of the process to meet different application requirements.
  • the graphite layer enters the pores distributed on the aluminum foil layer in the Z-axis direction, and the characteristics of the same thermal conductivity of aluminum are utilized, and after the graphite layer enters the pores, the adhesion between the graphite and the aluminum is not easily detached, and Due to the addition of aluminum, the Z-guided thermal characteristics of aluminum compensate for the disadvantages of poor thermal conductivity of the graphite layer Z, and the Z-guide heat of the entire composite heat sink is increased by the addition of aluminum.
  • the natural graphite/aluminum composite heat sink of the embodiment has a thermal conductivity of 400 W/m ⁇ K to 1200 W/m ⁇ K and a thermal diffusivity of 200 mm 2 /s to 700 mm 2 /s; the addition of aluminum in the composite heat sink It can be fixed by metal bolts in the equipment assembly and connected to the ground end, and the grounding loop is formed by the conductive characteristics of aluminum, and the heat sink covers the chip of the equipment to directly cover the most susceptible chip, which constitutes the best.
  • the electromagnetic screen has an anti-high frequency interference capability of 60 to 80 db (10 MHz to 1 GHz); the tensile fracture value in the XY direction (horizontal direction) is 50 Kgf/mm 2 to 100 Kgf/mm 2 due to the addition of the aluminum substrate. It is 50 times of the same thickness of graphite sheet, which is 5 times of the same thickness of artificial graphite sheet; regardless of the thickness of the composite sheet, the bending angle is 180 degrees, and the number of bending times is 50 times, without natural stone.
  • the ink/aluminum composite heat sink breaks and the heat dissipation performance is reduced. This is unmatched by a single graphite heat sink that cannot withstand more than 90 degrees of bending and cannot withstand multiple bends.

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  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Carbon And Carbon Compounds (AREA)

Abstract

一种天然石墨/铝复合散热片，包括铝箔层和位于铝箔层上下两面的石墨层。铝箔层包括铝基材和位于铝基材上下两面的粗化层；粗化层表面均匀分布有孔洞；粗化层通过孔洞与石墨层互相咬合。该复合散热片使得铝箔和石墨的界面热阻更小，Z轴方向导热性提高。

Description

一种天然石墨/铝复合散热片 技术领域
本实用新型涉及电子产品的发热组件的散热及电磁屏蔽领域，特别是涉及一种天然石墨/铝复合散热片。
背景技术
目前的CPU因高速运行发热，CPU高速运行乃为提高其设备的处理速度而研发。手机，平板计算机，笔记本计算机及电视的需求量及显示屏使用量增加，显示屏高亮度的需求使发光二极管使用量增加，但因发光二极管使用越多，其耗电增加，这也加大设备的发热量，同时电池电量消耗增加，电池容量也需跟着提高，使得显示器设备因耗能大而发热多，如不能有效控制发热，不仅高温会使CPU运转因高热而当机出问题或丧失功能，也会使发热设备使用寿命缩短。同时现今显示器设备功能增多，使用零件也多样化，数量多而体积更小，手机，平板计算机等设备因越来越小型化，其可用空间不足，各零件及组件的距离更近，很容易发生相互间的电磁干扰。
目前市场上作为散热材的人工石墨厚度以25μm为主导，40μm的人工石墨能达到量产，但导热系数不佳，70μm的人工石墨的可量产性不高，厚度限制了人工石墨的散热性能，更多的热量需要解决，为了把热量从发热组件“A”点传至其它点散发进而降低发热组件的温度，使发热组件“A”的本体温度大幅度降低。因此需要更高导热系数和更大散热能力的导热载体。
实用新型内容
本实用新型为了解决上述技术问题而提供了一种天然石墨/铝复合散热片，是具有优良的导热效果的导热载体，也能提供电磁屏蔽的功能。
一种天然石墨/铝复合散热片，它包括铝箔层和位于铝箔层上下两面的石墨层；所述铝箔层包括铝基材和位于铝基材上下两面的粗化层；所述粗化层的表面均匀分布有孔洞；所述粗化层通过孔洞与石墨层互相咬合。
所述铝基材、粗化层和孔洞为一体化结构。
所述天然石墨/铝复合散热片的厚度为28μm～2100μm；所述铝箔层的厚度为8μm～100μm；所述粗化层的表面积为铝基材的3～8倍；所述石墨层厚度为10μm～1000μm。
所述天然石墨/铝复合散热片以石墨层/铝箔层/石墨层为一个单位层，可形成最多10个单位层复合的结构。
本实用新型的优点：一、本实用新型的一种天然石墨/铝复合散热片采用石墨层和铝箔层通过孔洞相互咬合的方式，使铝箔和石墨的附着力大大增加，使铝箔和石墨的界面热阻更小，Z轴方向的导热性大大提高，使得散热片的导热性能优良，导热系数为400W/m·K～1200W/m·K，热扩散系数高达200mm2/s～700mm2/s；由于铝基材的加入，也具有优良的电磁屏蔽效果，使得小型设备中各组件可以有效的防止电磁干扰；二、本实用新型的一种天然石墨/铝复合散热片，抗拉伸，可弯折180度，有很高的力学性能。
附图说明
图1为实施例的一种天然石墨/铝复合散热片的结构示意图；
图2为实施例的一种天然石墨/铝复合散热片的铝箔层的放大示意图；
其中，1-铝箔层，11-铝基材，12-粗化层，13-孔洞，2-石墨层。
具体实施方式
为了加深对本实用新型的理解，下面将结合附图和实施例对本实用新型做进一步详细描述，该实施例仅用于解释本实用新型，并不对本实用新型的保护 范围构成限定。
实施例
如图1和图2所示，本实施例的一种天然石墨/铝复合散热片的制备方法制备得到的天然石墨/铝复合散热片，它包括铝箔层1和位于铝箔层1上下两面的石墨层2；所述铝箔层1包括铝基材11和位于铝基材上下两面的粗化层12；所述粗化层12的表面均匀分布有孔洞13；所述粗化层12通过孔洞13与石墨层2互相咬合；所述铝基材、粗化层和孔洞为一体化结构；所述天然石墨/铝复合散热片的厚度为28μm～2100μm；所述铝箔层1的厚度为8μm～100μm；所述粗化层12的表面积为铝基材11的3～8倍；所述石墨层2厚度为10μm～1000μm。
本实施例的铝箔层上的孔洞，不仅能增加表面积，还能使铝与石墨的附着更加紧密，粗化后的铝表面凹凸不平，表面积极大，而且孔洞分布散乱，孔洞形状各不相同，可因孔洞抓力使石墨不脱落且抗弯折，
本实施例所述的石墨层与铝的咬合力大于石墨层与石墨层之间的咬合力，从而增加了石墨层与铝基材之间的附着力。
本实施例所述的天然石墨/铝复合散热片在不同需求可任意调整厚度，在工艺许可范围内任意调整，以达不同的应用方面的要求；以石墨层/铝箔层/石墨层为一个单位层数在不同需求可任意调整厚度，在工艺许可范围内调整为最多10层，以达不同的应用方面的要求。
本实施例中石墨层在Z轴方向进入铝箔层上分布的孔洞内，利用铝的各向导热系数相同的特性，在石墨层进入了孔洞后，不仅加强石墨与铝的附着力不易脱落，更因铝的加入，靠铝的Z向导热特性弥补了石墨层Z向导热特性不佳的缺点，使整个复合散热片的Z向导热因铝的加入而提高。
本实施例的天然石墨/铝复合散热片，导热系数为400W/m·K～1200W/m·K， 热扩散系数为200mm2/s～700mm2/s；因复合散热片中铝材的加入，可在设备组装中以金属螺栓固定且与地线端相连，并因铝的导电特性构成接地回路，且散热片覆盖住设备的芯片上，直接盖住最易被干扰的芯片，构成最佳的电磁屏敝效果防高频干扰能力为60～80db(10MHz～1GHz)；因铝基材的加入，其X-Y方向(水平方向)的拉伸断裂值为50Kgf/mm2～100Kgf/mm2，是目前同等厚度石墨片的50倍，是目前同等厚度人工石墨片的5倍；不论复合片厚度为多少，其可弯折角度为180度，可弯折次数为50次，而不会使天然石墨/铝复合散热片断裂而导致散热效能降低，这是单一石墨散热片无法承受大于90度弯曲及无法承受多次弯曲所无法比拟的。
上述实施例不应以任何方式限制本实用新型，凡采用等同替换或等效转换的方式获得的技术方案均落在本实用新型的保护范围内。

Claims (4)

  1. 一种天然石墨/铝复合散热片，其特征在于：它包括铝箔层和位于铝箔层上下两面的石墨层；所述铝箔层包括铝基材和位于铝基材上下两面的粗化层；所述粗化层的表面均匀分布有孔洞；所述粗化层通过孔洞与石墨层互相咬合。
  2. 根据权利要求1所述的一种天然石墨/铝复合散热片，其特征在于：所述铝基材、粗化层和孔洞为一体化结构。
  3. 根据权利要求1所述的一种天然石墨/铝复合散热片，其特征在于：所述天然石墨/铝复合散热片的厚度为28μm～2100μm；所述铝箔层的厚度为8μm～100μm；所述粗化层的表面积为铝基材的3～8倍；所述石墨层厚度为10μm～1000μm。
  4. 根据权利要求1所述的一种天然石墨/铝复合散热片，其特征在于：所述天然石墨/铝复合散热片以石墨层/铝箔层/石墨层为一个单位层，可形成最多10个单位层复合的结构。
PCT/CN2015/091641 2015-09-14 2015-10-10 一种天然石墨/铝复合散热片 WO2017045232A1 (zh)

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CN107872943A (zh) * 2016-09-23 2018-04-03 天津莱尔德电子材料有限公司 用于从电子设备内的一个或更多个热源散热的热系统
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CN203032018U (zh) * 2012-08-29 2013-07-03 恒朗科技（天津）有限公司 无胶膜的金属箔石墨导热复合材料
CN203251562U (zh) * 2013-04-22 2013-10-23 孙利庆 散热片
CN204362488U (zh) * 2014-12-31 2015-05-27 昆山立茂国际贸易有限公司 复合型散热片

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