WO2017036511A1 - Composant multicouche électrique pour technologie de montage en surface, et procédé de fabrication d'un composant multicouche électrique - Google Patents

Composant multicouche électrique pour technologie de montage en surface, et procédé de fabrication d'un composant multicouche électrique Download PDF

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Publication number
WO2017036511A1
WO2017036511A1 PCT/EP2015/069844 EP2015069844W WO2017036511A1 WO 2017036511 A1 WO2017036511 A1 WO 2017036511A1 EP 2015069844 W EP2015069844 W EP 2015069844W WO 2017036511 A1 WO2017036511 A1 WO 2017036511A1
Authority
WO
WIPO (PCT)
Prior art keywords
main surface
electrode layer
multilayer component
base body
electric multilayer
Prior art date
Application number
PCT/EP2015/069844
Other languages
English (en)
Inventor
Shaoyu Sun
Xiaojia TIAN
Tingting FAN
Original Assignee
Epcos Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos Ag filed Critical Epcos Ag
Priority to PCT/EP2015/069844 priority Critical patent/WO2017036511A1/fr
Publication of WO2017036511A1 publication Critical patent/WO2017036511A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/1006—Thick film varistors

Definitions

  • Electric multilayer components comprise a stack of layers formed from ceramic material with inner electrode layers arranged between the ceramic layers. Outer electrodes are provided for external electric connections.
  • a varistor is an electronic component with an electrical resistivity that varies with the applied voltage.
  • a typical application of multilayer varistor devices is electrostatic discharge protection for electronic circuits.
  • Surface-mount technology is a method of producing electronic circuits in which electronic components are mounted on the surface of a printed circuit board. An electronic device produced in this technology is called a surface-mount device.
  • EP 2 201 585 Bl discloses an electric multilayer component comprising a stack of dielectric layers and electrode layers arranged between the dielectric layers. Each electrode layer is connected to one of two outer contacts, which are located on the same outer surface of the stack and are provided for connection in flipchip technology.
  • US 2014/0252403 Al discloses an ESD protection component with a base body comprising a ceramic material. Contact areas that are suitable for flip-chip technology are arranged on one of the outer surfaces of the base body. A floating inner
  • An object of the invention is to disclose an electric multilayer component for surface-mount technology that can easily be produced.
  • a further object is to disclose a method of producing such an electric multilayer component.
  • the electric multilayer component comprises a base body including a multilayered ceramic material, a first electrode layer and a second electrode layer arranged on a first main surface of the base body, the first and second electrode layers being spaced apart from one another by an intermediate area of the first main surface, and a third electrode layer arranged outside the base body on a second main surface of the base body, opposite the first main surface, as a
  • the first and second electrode layers are provided as contact areas for external electric connection.
  • the third electrode layer covers areas of the second main surface that are opposite the first and second electrode layers .
  • the electrode layers may comprise a metal paste.
  • electrode layers comprise copper or silver.
  • An insulation material like glass or a silicon-based adhesive may cover surface areas of the base body outside the
  • At least one slot is formed in the intermediate area of the first main surface. The slot may extend across the space between the electrode layers and may thus separate the first electrode layer and the second electrode layer.
  • the method of producing an electric multilayer component comprises forming a base body including a multilayered ceramic material, and applying a metal paste to form
  • a first electrode layer and a second electrode layer are formed on the first main surface, spaced apart from one another by an intermediate area of the first main surface, and a third electrode layer is formed on the second main surface as a continuous layer covering areas of the second main surface that are opposite the first electrode layer and the second electrode layer.
  • an insulation layer is formed on the second main surface as a continuous layer covering areas of the second main surface that are opposite the first electrode layer and the second electrode layer.
  • Figure 1 shows a top view onto the first main surface of an embodiment of the electric multilayer component.
  • Figure 3 shows a top view onto the first main surface of a further embodiment.
  • a first electrode layer 1 and a second electrode layer 2 are provided as contact areas for external electric connections of the electric multilayer component and are arranged at a distance from one another on the first main surface 31.
  • the first and second electrode layers 1, 2 are sufficiently large to facilitate the electric connection, in particular the connection to contact areas of a printed circuit board, for instance .
  • Electrode layers 1, 2 There is no restriction on the shape of the electrode layers 1, 2.
  • a symmetrical arrangement of congruent electrode layers 1, 2, as shown in Figure 1, may be especially suitable.
  • An intermediate area 5 of the first main surface 31 is left free from the electrode layers 1, 2, which are thus spaced apart from one another to inhibit leakage currents and flashover.
  • Figure 2 shows a top view onto a second main surface 32 opposite the first main surface 31 of a base body 3.
  • a third electrode layer 4 is applied on the second main surface 32 as a continuous layer.
  • the third electode layer 4 comprises a portion that is located opposite the first electrode layer 1 and a further portion that is located opposite the second electrode layer 2.
  • An insulation material 7 may be applied to the electric multilayer component to cover surface areas of the base body 3 that are not covered by the electrode layers 1, 2, 4, as indicated in Figure 4 by way of example.
  • the insulation material 7, which may be a glass or a silicon-based adhesive, helps to prevent leakage currents or flashover between the electrode layers 1, 2, 4.
  • the insulation material 7 may be employed on any embodiment of the electric multilayer
  • the metal paste that is used for the electrode layers 1, 2, 4 can be applied on the first and second main surfaces 31, 32 by printing, for instance.
  • the metal paste may comprise copper or silver, for instance. If a slot 6 or a plurality of slots are to be provided, they may be formed before or after the application of the electrode layers 1, 2, 4.
  • a further insulation material may be applied to cover and protect the entire electric multilayer component after mounting.
  • the described electric multilayer component can be easily manufactured by the described method, and it allows easy mounting on a printed circuit board in surface-mount
  • a further advantage is the reduced height, which is enabled by the large-area third electrode layer connecting parts of the electric multilayer component.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

L'invention concerne un composant multicouche électrique qui comprend un corps de base (3) comprenant un matériau céramique multicouche, une première couche d'électrode (1) et une deuxième couche d'électrode (2) agencées sur une première surface principale (31) du corps de base, les première et deuxième couches d'électrode étant espacées l'une de l'autre par une zone intermédiaire (5) de la première surface principale, et une troisième couche d'électrode agencée à l'extérieur du corps de base sur une seconde surface principale du corps de base, à l'opposé de la première surface principale, sous la forme d'une couche continue. Les première et deuxième couches d'électrode font office de zones de contact pour une connexion électrique externe. La troisième couche d'électrode couvre des zones de la seconde surface principale qui sont à l'opposé des première et deuxième couches d'électrode.
PCT/EP2015/069844 2015-08-31 2015-08-31 Composant multicouche électrique pour technologie de montage en surface, et procédé de fabrication d'un composant multicouche électrique WO2017036511A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/EP2015/069844 WO2017036511A1 (fr) 2015-08-31 2015-08-31 Composant multicouche électrique pour technologie de montage en surface, et procédé de fabrication d'un composant multicouche électrique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2015/069844 WO2017036511A1 (fr) 2015-08-31 2015-08-31 Composant multicouche électrique pour technologie de montage en surface, et procédé de fabrication d'un composant multicouche électrique

Publications (1)

Publication Number Publication Date
WO2017036511A1 true WO2017036511A1 (fr) 2017-03-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/069844 WO2017036511A1 (fr) 2015-08-31 2015-08-31 Composant multicouche électrique pour technologie de montage en surface, et procédé de fabrication d'un composant multicouche électrique

Country Status (1)

Country Link
WO (1) WO2017036511A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110400665A (zh) * 2018-04-24 2019-11-01 成都铁达电子股份有限公司 一种芯片式低固有电容压敏电阻器

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3694710A (en) * 1970-04-13 1972-09-26 Mallory & Co Inc P R Variable capacitance multilayered ceramic capacitor
US20070217110A1 (en) * 2005-11-22 2007-09-20 Yung-Hao Lu Tri-phase surge protector and its manufacturing method
DE102011109007A1 (de) * 2011-07-29 2013-01-31 Epcos Ag Verfahren zum Herstellen eines elektrischen Bauelements und elektrisches Bauelement
US20140252403A1 (en) 2011-10-28 2014-09-11 Epcos Ag ESD Protection Component and Component Comprising an ESD Protection Component and an LED
EP2201585B1 (fr) 2007-09-19 2015-04-22 Epcos AG Composant électrique multicouche

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3694710A (en) * 1970-04-13 1972-09-26 Mallory & Co Inc P R Variable capacitance multilayered ceramic capacitor
US20070217110A1 (en) * 2005-11-22 2007-09-20 Yung-Hao Lu Tri-phase surge protector and its manufacturing method
EP2201585B1 (fr) 2007-09-19 2015-04-22 Epcos AG Composant électrique multicouche
DE102011109007A1 (de) * 2011-07-29 2013-01-31 Epcos Ag Verfahren zum Herstellen eines elektrischen Bauelements und elektrisches Bauelement
US20140252403A1 (en) 2011-10-28 2014-09-11 Epcos Ag ESD Protection Component and Component Comprising an ESD Protection Component and an LED

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110400665A (zh) * 2018-04-24 2019-11-01 成都铁达电子股份有限公司 一种芯片式低固有电容压敏电阻器
CN110400665B (zh) * 2018-04-24 2021-09-28 成都铁达电子股份有限公司 一种芯片式低固有电容压敏电阻器

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