WO2017031960A1 - 一种光模块 - Google Patents

一种光模块 Download PDF

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Publication number
WO2017031960A1
WO2017031960A1 PCT/CN2016/074033 CN2016074033W WO2017031960A1 WO 2017031960 A1 WO2017031960 A1 WO 2017031960A1 CN 2016074033 W CN2016074033 W CN 2016074033W WO 2017031960 A1 WO2017031960 A1 WO 2017031960A1
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WO
WIPO (PCT)
Prior art keywords
chip
hole
light
circuit board
lead
Prior art date
Application number
PCT/CN2016/074033
Other languages
English (en)
French (fr)
Inventor
徐海强
夏京盛
杨思更
何鹏
贲仕建
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Publication of WO2017031960A1 publication Critical patent/WO2017031960A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources

Definitions

  • the present invention relates to the field of semiconductor technology, and more particularly to an optical module.
  • the industry has proposed various methods for reducing crosstalk.
  • the driving chip 11 and the light-emitting chip 12 are disposed on a PCB (Printed Circuit Board) 13, and are driven.
  • the lead point of the chip 11 is located on the lower surface of the driving chip 11, and the lead point of the receiving chip 12 is located on the upper surface of the receiving chip 12.
  • the driving chip 11 is connected to the PCB 13 by an under-bonding process, and the lead 14 between the driving chip 11 and the light-emitting chip 12 is connected by a reverse bonding process on the side of the driving chip, and the lead is used on the side of the receiving chip 12 Process connection.
  • the lead length between the chips is too long, which easily causes crosstalk problems.
  • An embodiment of the present invention provides an optical module for solving the problem that the lead length between the driving chip and the receiving and emitting chip is too long in the prior art, resulting in significant crosstalk between the channels.
  • An embodiment of the invention provides an optical module, including:
  • a driving chip a light emitting chip, and a circuit board
  • the bow line of the light emitting chip is located on the same side as the light emitting hole
  • the lead point of the light emitting chip and the lead point of the driving chip are respectively in contact with the circuit board, and the lead point of the emitting optical chip is located on the same horizontal plane as the lead point of the driving chip, a bow line point of the light emitting chip and a bow line point of the driving chip are connected by a trace on the circuit board;
  • the circuit board is provided with a through hole, and a light beam emitted from the light emitting hole of the light emitting chip passes through the through hole.
  • an embodiment of the present invention further provides an optical module, including:
  • the bow line point of the receiving optical chip is located on the same side as the light receiving hole
  • the lead point of the receiving optical chip and the lead point of the driving chip are respectively in contact with the circuit board, and the lead point of the receiving optical chip is located on the same horizontal plane as the lead point of the driving chip, The bow line point of the receiving optical chip and the bow line point of the driving chip are connected by a trace on the circuit board;
  • the circuit board is provided with a through hole, and the light receiving hole of the receiving optical chip receives the light beam passing through the through hole.
  • the optical module in the embodiment of the present invention includes: a driving chip, a light emitting chip, and a circuit board, wherein the lead point of the emitting optical chip is located on the same side as the light emitting hole, and the lead point of the emitting optical chip is Leading points of the driving chip are respectively in contact with the circuit board, and lead points of the emitting optical chip are located on the same horizontal plane as lead points of the driving chip, and lead points of the emitting optical chip and lead points of the driving chip
  • a through hole is disposed on the circuit board through a trace connection on the circuit board, and a light beam emitted from the light emitting hole of the light emitting chip passes through the through hole.
  • FIG. 1 is a schematic view showing a connection structure of a driving chip and a light receiving chip in the prior art
  • FIG. 2 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure
  • FIG. 3 is a cross-sectional view of an optical module according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of an optical module according to an embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of another optical module according to an embodiment of the present invention.
  • 6 is a top view of an optical module according to an embodiment of the present invention.
  • FIG. 7 is a bottom view of an optical module according to an embodiment of the present invention.
  • FIG. 8 is a top view of another optical module according to an embodiment of the present invention.
  • FIG. 9 is a bottom view of another optical module according to an embodiment of the present invention.
  • the PCB is a carrier for the electronic original device by attaching a dry film to the copper clad plate, and forming a conductive circuit pattern by exposure, development and etching to perform current conduction and signal transmission in the electronic product.
  • VCSEL Very Cavity Surface Emitting Laser
  • VCSEL Vertical Cavity Surface Emitting Laser
  • the optical module includes: a gold finger 21, a circuit board 22, an optical module lens assembly 23, and an optical fiber ribbon 24. If the laser below the optical module lens assembly 23 is a VCSEL, the light emitted by the VCSEL is transmitted through the optical fiber ribbon 24.
  • FIG. 3 shows a cross-sectional structure of the optical module.
  • the optical module specifically includes: a driving chip 31, a laser 32, a circuit board 33, an optical fiber ribbon 34, a protective housing 35, The laser light receiving region or light emitting region 36, the parallel light lens 37, the light refracting bright surface 38, and the outer casing inner cavity 39.
  • the laser 32 is a light-emitting chip VCSEL
  • the driving chip 31 drives the laser 32 to emit an optical signal.
  • the optical signal passes through the parallel light lens 37, passes through the refraction of the light-refracting bright surface 38, and then enters the parallel light.
  • the lens 37 is then incident into the ribbon 34 and transported in the ribbon 34.
  • the laser 32 and the driving chip 31 are pasted on the circuit board 33 by a conductive paste, the laser 32 and The driving chips 31 are connected by gold wire bonding. Since the heights of the laser 32 and the driving chip 31 are inconsistent, the length of the gold wire is too long, causing crosstalk between the channels.
  • the optical module is improved, as shown in FIG.
  • the embodiment of the invention provides an optical module, where the optical module includes:
  • the bow line point of the light emitting chip 42 is located on the same side as the light emitting hole;
  • the lead point of the light-emitting chip 42 and the lead point of the driving chip 41 are respectively in contact with the circuit board 43, and the lead point of the light-emitting chip 42 is located on the same level as the lead point of the driving chip 41, and the lead point of the light-emitting chip 42 is emitted.
  • the wire I line point of the driving chip 41 is connected through the trace 44 on the circuit board, and is fixed on the circuit board 43;
  • the circuit board 43 is provided with a through hole through which the light beam emitted from the light emitting hole of the light emitting chip 42 passes.
  • the driving chip 41 drives the emitting optical chip 42 to emit a light beam which passes through the through hole on the circuit board 43.
  • An end of the circuit board 43 away from the light-emitting aperture of the light-emitting chip 42 is further provided with a lens 45, which is coupled to the light-emitting aperture of the light-emitting chip 42, and the light beam emitted from the light-emitting chip 42 is projected onto the lens 45.
  • the lens 45 is incident on the optical fiber ribbon and transmitted through the optical fiber ribbon.
  • the lens 45 is fixed to a lens holder on a circuit board 43 which is a combination of lenses for transmitting a light beam emitted from the light-emitting aperture into the optical fiber ribbon by a combination of lenses.
  • the fixing manner of the lens 45 can be specifically seen in the lens fixing mode in the lens module of the optical module in FIG. 2 and FIG. 3.
  • the lens holder can be a protective casing of the optical module, and the lens 45 can be fixed on the protective casing.
  • the driving chip 41 and the light emitting chip 42 are flipped on the circuit board 43 and the chip is flipped on the circuit board 43.
  • the flip-chip bonding process is performed by facing the active area of the chip facing the circuit board 43 and connecting the chip to the circuit board 43 through solder joints arranged in an array on the chip. This method can reduce the interconnect length between chips, reduce signal delay, and improve the electrical performance of the chip.
  • the active area of the chip faces up, and the backside of the circuit board 43 is fixed by a conductive adhesive, and the chips are interconnected by a gold wire bonding process.
  • the light emitting hole of the light emitting chip 42 is located on the same side as the active area of the light emitting chip 42, that is, the bow line point of the light emitting chip 42 is on the same side as the light emitting hole, in order to enable the light emitting chip 42 to be inverted.
  • a through hole is provided at a position corresponding to the light emitting hole on the circuit board 43, that is, a light beam emitted from the light emitting hole can be emitted through the through hole.
  • the vertical line of the through hole and the vertical line of the light emitting hole may coincide, and the light beam emitted by the light emitting hole may completely pass through the through hole without being blocked by the circuit board 43 around the through hole.
  • the light-emitting chip 42 is a single laser, the diameter of the through-hole is larger than the diameter of the light-emitting hole.
  • the light emitting chip 42 is a laser array, that is, a VCSEL array, the width of the through hole is larger than the diameter of the light emitting hole, and the specific size can be adjusted according to practical applications, and the present invention is not specifically limited.
  • the lead point of the light-emitting chip 42 and the lead point of the driving chip 41 are respectively soldered on the circuit board 43, and the lead point of the light-emitting chip 42 is located on the same level as the lead point of the driving chip 41, and the light-emitting chip 42 and the driving are driven.
  • the chip 41 can connect the lead points of the light-emitting chip 42 to the lead points of the driving chip 41 through the traces 44 on the circuit board 43.
  • the trace 44 between the light-emitting chip 42 and the driver chip 41 may be a straight line, and may be the shortest straight line among all the traces 44 between the lead point of the light-emitting chip 42 and the lead point of the drive chip 41, because this The connection method is shorter than the connection method in the prior art, and the line 44 is a straight line, which further shortens the distance, as shown in FIG. 4 .
  • the bow line point of the driving chip 41 and the bow line point of the light emitting chip 42 are opposite to the circuit board 43, the conductive paste is pasted on the circuit board 43, and then the gold wire is used for the wire bonding process.
  • the bow line point of the driving chip 41 and the bow line point of the light emitting chip 42 are connected.
  • This process is fixed by the conductive glue during the manufacturing process, and a large space is required for fixing, so that the driving chip 41 and the light emitting chip are enabled.
  • the distance between the 42 is relatively long, and accordingly, the distance between the lead point of the driving chip 41 and the lead point of the light-emitting chip 42 is relatively long, so that the length of the lead between the driving chip 41 and the light-emitting chip 42 is too long, thereby This leads to crosstalk between channels, especially in high-speed parallel optical modules.
  • the lead point of the driving chip 41 and the lead point of the emitting optical chip 42 are connected by the trace 44 on the circuit board 43, so that the length of the lead connecting the driving chip 41 and the emitting optical chip 42 can be the shortest, thereby reducing the channel spacing. Crosstalk problem.
  • the circuit board 43 may be a PCB board, and the embodiment of the present invention is only an exemplary function, which is not limited thereto.
  • the driving chip 41 is disposed on the PCB, and the transmitting optical chip 42 may be a VCSEL.
  • the driving chip 41 and the light-emitting chip 42 are both made of gold wires. Wire technology connects the lead points of two chips, which can cause signal crosstalk between channels.
  • the VCSEL can include multiple vertical cavity emitting lasers, such as 1x1 arrays, 1x4 arrays, 1x8 arrays, 1x12 arrays.
  • the VCSEL is realized by a metal organic chemical vapor deposition process.
  • the diameter of the illuminating hole of a single vertical cavity emitting laser can be 20 ⁇ m, and the half divergence angle can be 18°.
  • the parameters of the vertical cavity emitting laser in the embodiment of the present invention are only exemplary functions, and the specific application is to select parameters according to actual conditions.
  • the light emitted from the illuminating aperture is a high quality circular beam that passes through the lens 45 into the optical fiber through active alignment technology and is transmitted in the optical fiber.
  • a driving chip 41 can be connected to a VCSEL, and the driving chip 41 and the VCSEL are connected by a PCB trace. By PCB routing, crosstalk is avoided when parallel high-speed transmission occurs.
  • the optical module includes: a driving chip 41, a light emitting chip 42 and a circuit board 43.
  • the lead point of the emitting optical chip 42 is located on the same side as the light emitting hole, and the lead point of the light emitting chip 42
  • the lead points of the driving chip 41 are respectively in contact with the circuit board 43.
  • the lead points of the emitting optical chip 42 are located on the same horizontal plane as the lead points of the driving chip 41, and the lead points of the emitting optical chip 42 are
  • the lead point of the driving chip 41 is connected to the circuit board 43 via a trace 44 on the circuit board 43.
  • the circuit board 43 is provided with a through hole, and the light emitting chip 42 emits light. A light beam emitted from the hole passes through the through hole.
  • the embodiment of the present invention further provides an optical module.
  • the optical module specifically includes
  • driving chip 51 receiving optical chip 52 and circuit board 53;
  • the lead point of the receiving optical chip 52 is located on the same side as the light receiving hole
  • the lead point of the receiving optical chip 52 and the lead point of the driving chip 51 are respectively in contact with the circuit board 53, and the lead point of the receiving optical chip 52 is in the same position as the lead point of the driving chip 51.
  • a horizontal plane, the point I of the receiving optical chip 52 and the point I of the driving chip 51 are connected by a trace 54 on the circuit board 53 and fixed on the circuit board 53;
  • the circuit board 53 is provided with a through hole, and the light receiving hole of the receiving optical chip 52 receives the light beam passing through the through hole.
  • the driving chip 51 drives the receiving optical chip 52 to receive a light beam, and the light beam is incident on the light receiving hole of the receiving optical chip 52 through the through hole on the circuit board 53, and the received optical chip is received. 52 received.
  • a lens 55 is disposed at an end of the circuit board 53 at a position away from the light receiving hole of the receiving optical chip 52.
  • the lens 55 is coupled to the light receiving hole of the receiving optical chip 52, and the light beam transmitted by the optical fiber ribbon passes through the lens. 55, incident on the light receiving hole of the receiving optical chip 52.
  • the lens 55 is fixed to a lens holder on a circuit board 53, which is a lens combination, and the direction of light transmission can be changed by the lens 55.
  • the fixing manner of the lens 55 can be specifically seen in the lens fixing manner in the optical module lens assembly of FIGS. 2 and 3.
  • the lens holder can be a protective housing of the optical module, and the lens 55 can be fixed on the protective housing.
  • the embodiment of the present invention flips the driving chip 51 and the receiving optical chip 52 onto the circuit board 53, and the chip is flipped on the circuit board 53.
  • the flip-chip bonding process is performed by facing the active area of the chip facing the circuit board 53 and connecting the chip to the circuit board 53 through solder joints arranged in an array on the chip.
  • This method can reduce the interconnect length between chips, reduce signal delay, and improve the electrical performance of the chip.
  • the active area of the chip faces up, and the backside of the circuit board 53 is fixed by a conductive adhesive, and the chips are interconnected by a gold wire bonding process.
  • the light receiving hole of the receiving optical chip 52 is located on the same side as the active area of the receiving optical chip 52, that is, the bow line point of the receiving optical chip 52 and the light receiving hole are located on the same side, in order to realize the receiving optical chip.
  • the flip-chip is mounted on the circuit board 53.
  • a through hole is disposed at a position corresponding to the light receiving hole of the circuit board 53, that is, the light receiving hole receives the light beam through the through hole.
  • the vertical line of the through hole and the vertical line of the light receiving hole may coincide, and the light beam transmitted by the optical fiber ribbon may completely pass through the through hole, and is received by the light receiving hole, and is not affected by the circuit board 53 around the through hole.
  • the receiving optical chip 52 is a single laser, the diameter of the through hole is larger than the diameter of the receiving hole. If the receiving optical chip 52 is a laser array, that is, a PD (Photo-Diode) array, the width of the through-hole is larger than the diameter of the light-receiving hole, and the specific size can be adjusted according to practical applications, and the present invention is not specifically limited.
  • a laser array that is, a PD (Photo-Diode) array
  • the width of the through-hole is larger than the diameter of the light-receiving hole, and the specific size can be adjusted according to practical applications, and the present invention is not specifically limited.
  • the lead point of the receiving optical chip 52 and the lead point of the driving chip 51 are respectively soldered on the circuit board 53, and the bow line point of the receiving optical chip 52 is located on the same horizontal plane as the bow line point of the driving chip 51, and the receiving light is received.
  • the chip 52 and the driving chip 51 can connect the lead points of the receiving optical chip 52 to the lead points of the driving chip 51 by the traces 54 on the circuit board 53.
  • the trace 54 between the receiving optical chip 52 and the driving chip 51 may be a straight line, and may be the shortest straight line among all the traces 54 between the lead points of the receiving optical chip 52 and the lead points of the driving chip 51, because this The connection method is shorter than the connection method in the prior art, and the trace 54 is The straight line further shortens the distance, as shown in Figure 5.
  • the bow line point of the driving chip 51 and the bow line point of the receiving optical chip 52 are opposite to the circuit board 53, which are pasted on the circuit board 53 by conductive adhesive, and then the process of wire bonding through the gold wire will be The lead point of the driving chip 51 is connected with the lead point of the receiving optical chip 52.
  • This process is fixed by the conductive adhesive during the manufacturing process, and a large space is required for fixing, so that between the driving chip 51 and the receiving optical chip 52
  • the distance is relatively long, and accordingly, the distance between the lead point of the driving chip 51 and the lead point of the receiving optical chip 52 is also relatively long, so the length of the lead between the driving chip 51 and the receiving optical chip 52 is too long, thereby causing an appearance between the channels.
  • Crosstalk especially in high-speed parallel optical modules, is even more pronounced.
  • the lead point of the driving chip 51 and the lead point of the receiving optical chip 52 are connected by the trace 54 on the circuit board 53, so that the length of the lead connecting the driving chip 51 and the receiving optical chip 52 can be minimized, thereby reducing the channel spacing.
  • Crosstalk problem is pronounced.
  • the driving chip 51 may be a TIA (Transimpedance Amplifer).
  • the TIA chip is a high-bandwidth advantage and is generally used in high-speed circuits, that is, in optical transmission.
  • the TIA chip can drive the PD chip, which is a photoelectrically converted receiving optical chip that converts the optical signal into an electrical signal.
  • An embodiment of the present invention further provides an optical module, where the optical module specifically includes:
  • driving chip receiving light emitting chip and circuit board
  • the lead point of the receiving light is located on the same side as the receiving light hole
  • the lead point of the light-emitting chip and the lead point of the driving chip are respectively in contact with the circuit board, and the lead point of the light-receiving chip and the lead point of the driving chip are located on the same horizontal surface, and the lead point of the light-emitting chip and the lead point of the driving chip are received. It is fixed to the circuit board by a trace connection on the circuit board; a through hole is provided on the circuit board.
  • the light-receiving chip in the embodiment of the present invention is a chip that can receive both a light beam and a light beam, and the specific connection relationship between the light-emitting chip and the driving chip can be seen in the above embodiment.
  • FIGS. 6 and 7 respectively show a top view structure and a bottom view structure of an optical module, as shown in FIGS. 6 and 7, on the circuit board 63,
  • the light-emitting chip 62 having the driver chip 61 and the 1x8 array is connected between the drive chip 61 and the light-receiving chip 62 via the circuit board trace 64.
  • the lower side of the light-receiving chip 62 of the through hole 65 on the circuit board corresponds to the light-receiving hole 66 of the light-receiving chip 62.
  • the light-emitting chip 62 can be replaced with an emission core. Chip or receive optical chip.
  • FIG. 8 and FIG. 9 respectively show a top view structure and a bottom view structure of another optical module.
  • a driving chip 81 and a light-receiving chip are provided on the circuit board 83.
  • the driving chip 81 and the light-emitting chip 82 are connected by a circuit board trace 84.
  • the lower side of the light-receiving chip 82 of the through hole 85 of the circuit board corresponds to the light-receiving hole 86 of the light-receiving chip 82.
  • a light-receiving hole 86 can be seen in the through-hole 85, and the width of the through-hole 85 is larger than the diameter of the light-receiving light 86.
  • the light-emitting chip 82 can be replaced by a light-emitting chip or a light-receiving chip.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)

Abstract

一种光模块，包括：驱动芯片（41）、发射光芯片（42）和电路板（43），所述发射光芯片（42）的引线点与发光孔位于同一侧，所述发射光芯片（42）的引线点、所述驱动芯片（41）的引线点分别与所述电路板（43）接触，所述发射光芯片（42）的引线点与所述驱动芯片（41）的引线点位于同一水平面上，所述发射光芯片（42）的引线点与所述驱动芯片（41）的引线点通过所述电路板（43）上的走线（44）连接，所述电路板（43）上设有通孔，所述发射光芯片（42）的发光孔发出的光束穿过所述通孔。通过将发射光芯片（42）和驱动芯片（41）的引线点设置在同一水平面上，可以减少发射光芯片（42）与驱动芯片（41）之间的引线的长度，从而减小通道间的引线串扰。

Description

说明书 发明名称：一种光模块
技术领域
[0001] 本发明涉及半导体技术领域， 更具体的涉及一种光模块。
背景技术
[0002] 在高速并行光模块领域， 随着传输速率的不断提高， 对驱动芯片、 收发光芯片 的封装要求越来越高， 芯片之间距离要求越来越近， 处理不当就会导致存在明 显的串扰问题。
[0003] 为了减少串扰问题， 业界提出了多种减少串扰的方法， 如图 1所示， 驱动芯片 1 1和收发光芯片 12设置在 PCB (Printed Circuit Board, 印制线路板） 13上， 驱动 芯片 11的引线点位于驱动芯片 11的下表面， 收发光芯片 12的引线点位于收发光 芯片 12的上表面。 其中， 驱动芯片 11采用倒扣焊工艺连接到 PCB13上， 且驱动芯 片 11和收发光芯片 12之间的引线 14在驱动芯片一侧采用倒扣焊工艺连接， 在收 发光芯片 12—侧采用引线工艺连接。 通过该方案制作的光模块， 芯片之间的引 线长度过长， 容易引起串扰问题。
技术问题
[0004] 本发明实施例提供一种光模块， 用以解决现有技术中存在驱动芯片和收发光芯 片之间引线长度过长， 导致通道间存在明显串扰的问题。
问题的解决方案
技术解决方案
[0005] 本发明实施例提供一种光模块， 包括：
[0006] 驱动芯片、 发射光芯片和电路板；
[0007] 所述发射光芯片的弓 I线点与发光孔位于同一侧；
[0008] 所述发射光芯片的引线点、 所述驱动芯片的引线点分别与所述电路板接触， 所 述发射光芯片的引线点与所述驱动芯片的引线点位于同一水平面上， 所述发射 光芯片的弓 I线点与所述驱动芯片的弓 I线点通过所述电路板上的走线连接；
[0009] 所述电路板上设有通孔， 所述发射光芯片的发光孔发出的光束穿过所述通孔。 [0010] 相应地， 本发明实施例还提供了一种光模块， 包括：
[0011] 驱动芯片、 接收光芯片和电路板；
[0012] 所述接收光芯片的弓 I线点与收光孔位于同一侧；
[0013] 所述接收光芯片的引线点、 所述驱动芯片的引线点分别与所述电路板接触， 所 述接收光芯片的引线点与所述驱动芯片的引线点位于同一水平面上， 所述接收 光芯片的弓 I线点与所述驱动芯片的弓 I线点通过所述电路板上的走线连接；
[0014] 所述电路板上设有通孔， 所述接收光芯片的收光孔接收穿过所述通孔的光束。
发明的有益效果
有益效果
[0015] 本发明实施例中的光模块， 包括： 驱动芯片、 发射光芯片和电路板， 所述发射 光芯片的引线点与发光孔位于同一侧， 所述发射光芯片的引线点、 所述驱动芯 片的引线点分别与所述电路板接触， 所述发射光芯片的引线点与所述驱动芯片 的引线点位于同一水平面上， 所述发射光芯片的引线点与所述驱动芯片的引线 点通过所述电路板上的走线连接， 所述电路板上设有通孔， 所述发射光芯片的 发光孔发出的光束穿过所述通孔。 通过将发射光芯片和驱动芯片的弓 I线点设置 在同一水平面上， 可以减少发射光芯片与驱动芯片之间的引线的长度， 从而减 小通道间的引线串扰。
对附图的简要说明
附图说明
[0016] 为了更清楚地说明本发明实施例中的技术方案， 下面将对实施例描述中所需要 使用的附图作简单地介绍， 显而易见地， 下面描述中的附图仅仅是本发明的实 施例， 对于本领域普通技术人员来讲， 在不付出创造性劳动的前提下， 还可以 根据提供的附图获得其他的附图。
[0017] 图 1为现有技术中一种驱动芯片和收发光芯片的连接结构示意图；
[0018] 图 2为本发明实施例提供的一种光模块的结构示意图；
[0019] 图 3为本发明实施例提供的一种光模块的剖视图；
[0020] 图 4为本发明实施例提供的一种光模块的结构示意图；
[0021] 图 5为本发明实施例提供的另一种光模块的结构示意图； [0022] 图 6为本发明实施例提供的一种光模块的俯视图；
[0023] 图 7为本发明实施例提供的一种光模块的仰视图；
[0024] 图 8为本发明实施例提供的另一种光模块的俯视图；
[0025] 图 9为本发明实施例提供的另一种光模块的仰视图。
本发明的实施方式
[0026] 下面将结合本发明实施例中的附图， 对本发明实施例中的技术方案进行清楚， 完整地描述， 显然， 所描述的实施例仅仅是本发明一部分实施例， 而不是全部 的实施例。 基于本发明中的实施例， 本领域普通技术人员在没有做出创造性劳 动前提下所获得的所有其他实施例， 都属于本发明保护的范围。
[0027] 本发明实施例中， 涉及的技术术语如下：
[0028] 1、 PCB , 是在覆铜板上贴上干膜， 经曝光显影、 蚀刻形成导电线路图形在电 子产品起到电流导通与信号传送的作用,是电子原器件的载体。
[0029] 2、 倒扣焊工艺 （英文： Flip-Chip Technology) ， 通过芯片上的凸点直接将器 件朝下互连到基板、 载体或者电路板上。
[0030] 3、 VCSEL (Vertical Cavity Surface Emitting Laser, 垂直腔面发射激光器） 具 有体积小、 圆形输出光斑、 单纵模输出、 阈值电流小、 价格低廉、 易集成为大 面积阵列等优点， 广泛应用与光通信、 光互连、 光存储等领域。
[0031] 图 2示出了一种光模块的外部结构， 从图 2中可以看出， 该光模块包括： 金手指 21、 电路板 22、 光模块透镜组件 23和光纤带 24。 如果光模块透镜组件 23的下方 的激光器为 VCSEL, 则 VCSEL发出的光通过光纤带 24进行传输。
[0032] 具体的， 图 3示出了该光模块的剖视结构， 如图 3所示， 该光模块具体包括： 驱 动芯片 31、 激光器 32、 电路板 33、 光纤带 34、 保护外壳 35、 激光器收光区或发 光区 36、 平行光透镜 37、 光折射明面 38和外壳内腔体 39。 在该光模块中， 激光 器 32的为发射光芯片 VCSEL吋， 驱动芯片 31驱动激光器 32进行发射光信号， 光 信号穿过平行光透镜 37， 经过光折射明面 38的折射之后再进入到平行光透镜 37 ， 然后入射到光纤带 34中， 在光纤带 34中进行传输。
[0033] 其中， 激光器 32和驱动芯片 31是通过导电胶粘贴在电路板 33上的， 激光器 32和 驱动芯片 31之间通过金线打线进行连接。 由于激光器 32和驱动芯片 31的高度不 一致， 导致金线打线长度过长， 从而引起通道间的串扰。
[0034] 为了解决上述问题， 在本发明实施例中， 光需要穿过电路板， 相应地图 3中的 结构需要发生变化， 本发明实施例对上述光模块进行了改进， 如图 4所示， 本发 明实施例提供了一种光模块， 该光模块包括：
[0035] 驱动芯片 41、 发射光芯片 42和电路板 43 ;
[0036] 发射光芯片 42的弓 I线点与发光孔位于同一侧；
[0037] 发射光芯片 42的引线点、 驱动芯片 41的引线点分别与电路板 43接触， 发射光芯 片 42的引线点与驱动芯片 41的引线点位于同一水平面上， 发射光芯片 42的引线 点与驱动芯片 41的弓 I线点通过电路板上的走线 44连接， 固定于电路板 43上；
[0038] 电路板 43上设有通孔， 发射光芯片 42的发光孔发出的光束穿过所述通孔。
[0039] 在本发明实施例中， 驱动芯片 41驱动发射光芯片 42进行发射光束， 该光束会穿 过电路板 43上的通孔。 在电路板 43上通孔位置处的远离发射光芯片 42发光孔的 一端还设置有透镜 45， 该透镜 45与发射光芯片 42的发光孔耦合， 发射光芯片 42 发射的光束投射到透镜 45上， 穿过该透镜 45， 入射到光纤带中， 通过光纤带进 行传输。 该透镜 45是固定在电路板 43上的透镜支架上的， 该透镜 45为透镜组合 ， 通过透镜组合将发光孔发射的光束进行传输至光纤带中。 该透镜 45的固定方 式具体可见图 2和图 3中光模块透镜组件中的透镜固定方式， 透镜支架可以是光 模块的保护外壳， 透镜 45可以固定在该保护外壳上。
[0040] 为了能够减小驱动芯片 41和发射光芯片 42之间的引线长度， 本发明实施例将驱 动芯片 41和发射光芯片 42倒装在电路板 43上， 芯片倒装在电路板 43上是通过倒 扣焊工艺实现的， 倒扣焊工艺是将芯片的有源区面对这电路板 43， 通过芯片上 呈阵列排列的焊点实现芯片与电路板 43的连接。 这种方式可以减小芯片之间的 互联长度， 减小信号延迟， 提高了芯片的电气性能。 而现有技术是将芯片的有 源区面朝上， 背对电路板 43通过导电胶进行固定， 芯片之间是通过金线打线的 工艺进行互联。
[0041] 由于， 发射光芯片 42的发光孔与发射光芯片 42的有源区位于同一侧， 即发射光 芯片 42的弓 I线点与发光孔位于同一侧， 为了能够实现发射光芯片 42倒装在电路 板 43上， 本发明实施例在电路板 43上发光孔所对应的位置处， 设置了通孔， 即 发光孔发出的光束可以穿过通孔发出。 具体地， 该通孔的中垂线与发光孔的中 垂线可以重合， 且该发光孔发出的光束可以完全穿过该通孔， 不受通孔周边的 电路板 43遮挡。 如果发射光芯片 42为单个激光器， 则通孔的直径大于该发光孔 的直径。 如果发射光芯片 42为激光器阵列即 VCSEL阵列， 则通孔的宽度大于该 发光孔的直径， 具体尺寸可以根据实际应用进行调整， 本发明不做具体限制。
[0042] 发射光芯片 42的引线点、 驱动芯片 41的引线点分别焊接在电路板 43上， 发射光 芯片 42的引线点与驱动芯片 41的引线点位于同一水平面上， 发射光芯片 42与驱 动芯片 41可以通过电路板 43上的走线 44， 将发射光芯片 42的引线点与驱动芯片 4 1的引线点进行连接。 发射光芯片 42与驱动芯片 41之间的走线 44可以为直线， 且 可以是发射光芯片 42的引线点到驱动芯片 41的引线点之间的所有走线 44中最短 的一条直线， 因为这种连接方式比现有技术中的连接方式距离短， 而走线 44是 直线这种方式进一步缩短了距离， 具体如图 4所示。 而现有技术是将驱动芯片 41 的弓 I线点和发射光芯片 42的弓 I线点背对电路板 43， 通过导电胶粘贴在电路板 43 上， 然后通过金线打线的工艺将驱动芯片 41的弓 I线点和发射光芯片 42的弓 I线点 连接， 这种工艺在制作过程中， 通过导电胶进行固定， 实现固定需要较大的空 间， 使得驱动芯片 41与发射光芯片 42之间的距离比较远， 相应地， 驱动芯片 41 的引线点与发射光芯片 42的引线点的距离也比较远， 因此驱动芯片 41与发射光 芯片 42之间的引线的长度过长， 从而导致通道间出现串扰， 尤其在高速并行光 模块中， 现象更加明显。 本发明实施例通过电路板 43上的走线 44连接驱动芯片 4 1的引线点和发射光芯片 42的引线点， 可以使得驱动芯片 41和发射光芯片 42互联 的引线长度最短， 从而降低通道间的串扰问题。
[0043] 本发明实施例中， 电路板 43可以是 PCB板， 本发明实施例仅是示例作用， 对此 不做限制。
[0044] 举例来说， 在高速并行光模块中， 驱动芯片 41设置在 PCB上， 发射光芯片 42可 以是 VCSEL, 在现有技术中， 驱动芯片 41和收发光芯片 42都是使用金线打线技 术连接两个芯片的引线点的， 这种方式能够引起通道间的信号串扰。 VCSEL可 以包括多个垂直腔发射激光器， 如 1x1阵列， 1x4阵列、 1x8阵列， 1x12阵列。 该 VCSEL采用金属有机化学汽相沉积工艺实现的， 单个垂直腔发射激光器的发光 孔的直径可以为 20μηι， 半发散角度可以为 18°。 本发明实施例中的垂直腔发射激 光器的参数仅是示例作用， 具体应用吋， 根据实际情况选择参数。
[0045] 该 VCSEL在工作吋， 从发光孔发射出的光为高质量的圆形光束， 通过有源对准 技术经过透镜 45进入到光纤中， 在光纤中进行传输。
[0046] 一个驱动芯片 41可以连接一个 VCSEL, 驱动芯片 41与 VCSEL之间通过 PCB走线 进行连接。 通过 PCB走线， 避免了在并行高速传输吋会产生串扰。
[0047] 上述实施例表明， 光模块包括： 驱动芯片 41、 发射光芯片 42和电路板 43， 所述 发射光芯片 42的引线点与发光孔位于同一侧， 所述发射光芯片 42的引线点、 所 述驱动芯片 41的引线点分别与所述电路板 43接触， 所述发射光芯片 42的引线点 与所述驱动芯片 41的引线点位于同一水平面上， 所述发射光芯片 42的引线点与 所述驱动芯片 41的引线点通过所述电路板 43上的走线 44连接， 固定于所述电路 板 43上， 所述电路板 43上设有通孔， 所述发射光芯片 42的发光孔发出的光束穿 过所述通孔。 通过将发射光芯片 42和驱动芯片 41的引线点设置在同一水平面上 ， 可以减少发射光芯片 42与驱动芯片 41之间的引线的长度， 从而减小通道间的 引线串扰。
[0048] 相应地， 本发明实施例还提供了一种光模块， 如图 5所示， 该光模块具体包括
[0049] 驱动芯片 51、 接收光芯片 52和电路板 53;
[0050] 所述接收光芯片 52的引线点与收光孔位于同一侧；
[0051] 所述接收光芯片 52的引线点、 所述驱动芯片 51的引线点分别与所述电路板 53接 触， 所述接收光芯片 52的引线点与所述驱动芯片 51的引线点位于同一水平面上 ， 所述接收光芯片 52的弓 I线点与所述驱动芯片 51的弓 I线点通过所述电路板 53上 的走线 54连接， 固定于所述电路板 53上；
[0052] 所述电路板 53上设有通孔， 所述接收光芯片 52的收光孔接收穿过所述通孔的光 束。
[0053] 在本发明实施例中， 驱动芯片 51驱动接收光芯片 52进行接收光束， 该光束穿过 电路板 53上的通孔入射到接收光芯片 52上的收光孔上， 被接收光芯片 52接收。 在电路板 53上通孔位置处的远离接收光芯片 52收光孔的一端还设置有透镜 55， 该透镜 55与接收光芯片 52的收光孔耦合， 光纤带传输的光束， 穿过该透镜 55， 入射到接收光芯片 52的收光孔上。 该透镜 55是固定在电路板 53上的透镜支架上 的， 该透镜 55为透镜组合， 可以通过透镜 55改变光的传输方向。 该透镜 55的固 定方式具体可见图 2和图 3中光模块透镜组件中的透镜固定方式， 透镜支架可以 是光模块的保护外壳， 透镜 55可以固定在该保护外壳上。
[0054] 为了能够减小驱动芯片 51和接收光芯片 52之间的引线长度， 本发明实施例将驱 动芯片 51和接收光芯片 52倒装在电路板 53上， 芯片倒装在电路板 53上是通过倒 扣焊工艺实现的， 倒扣焊工艺是将芯片的有源区面对这电路板 53， 通过芯片上 呈阵列排列的焊点实现芯片与电路板 53的连接。 这种方式可以减小芯片之间的 互联长度， 减小信号延迟， 提高了芯片的电气性能。 而现有技术是将芯片的有 源区面朝上， 背对电路板 53通过导电胶进行固定， 芯片之间是通过金线打线的 工艺进行互联。
[0055] 由于， 接收光芯片 52的收光孔与接收光芯片 52的有源区位于同一侧， 即接收光 芯片 52的弓 I线点与收光孔位于同一侧， 为了能够实现接收光芯片 52倒装在电路 板 53上， 本发明实施例在电路板 53上收光孔所对应的位置处， 设置了通孔， 即 收光孔通过该通孔接收光束。 具体地， 该通孔的中垂线与收光孔的中垂线可以 重合， 且光纤带传输的光束可以完全穿过该通孔， 被收光孔接收， 不受通孔周 边的电路板 53遮挡。 如果接收光芯片 52为单个激光器， 则通孔的直径大于该收 光孔的直径。 如果接收光芯片 52为激光器阵列即 PD (Photo-Diode, 光电探测器 ) 阵列， 则通孔的宽度大于该收光孔的直径， 具体尺寸可以根据实际应用进行 调整， 本发明不做具体限制。
[0056] 接收光芯片 52的引线点、 驱动芯片 51的引线点分别焊接在电路板 53上， 接收光 芯片 52的弓 I线点与驱动芯片 51的弓 I线点位于同一水平面上， 接收光芯片 52与驱 动芯片 51可以通过电路板 53上的走线 54， 将接收光芯片 52的引线点与驱动芯片 5 1的引线点进行连接。 接收光芯片 52与驱动芯片 51之间的走线 54可以为直线， 且 可以是接收光芯片 52的引线点到驱动芯片 51的引线点之间的所有走线 54中最短 的一条直线， 因为这种连接方式比现有技术中的连接方式距离短， 而走线 54是 直线这种方式进一步缩短了距离， 具体如图 5所示。 而现有技术是将驱动芯片 51 的弓 I线点和接收光芯片 52的弓 I线点背对电路板 53， 通过导电胶粘贴在电路板 53 上， 然后通过金线打线的工艺将驱动芯片 51的引线点和接收光芯片 52的引线点 连接， 这种工艺在制作过程中， 通过导电胶进行固定， 实现固定需要较大的空 间， 使得驱动芯片 51与接收光芯片 52之间的距离比较远， 相应地， 驱动芯片 51 的引线点与接收光芯片 52的引线点的距离也比较远， 因此驱动芯片 51与接收光 芯片 52之间的引线的长度过长， 从而导致通道间出现串扰， 尤其在高速并行光 模块中， 现象更加明显。 本发明实施例通过电路板 53上的走线 54连接驱动芯片 5 1的引线点和接收光芯片 52的引线点， 可以使得驱动芯片 51和接收光芯片 52互联 的引线长度最短， 从而降低通道间的串扰问题。
[0057] 本发明实施例中， 驱动芯片 51可以是 TIA (Transimpedance Amplifer, 跨阻放大 器） ， TIA芯片是一种高宽带的优点， 一般用于高速电路中， 即在光电传输中普 遍使用。 TIA芯片可以驱动 PD芯片， PD芯片为一种光电转换的接收光芯片， 可 以将光信号转换为电信号。
[0058] 本发明实施例还提供了一种光模块， 该光模块具体包括：
[0059] 驱动芯片、 收发光芯片和电路板；
[0060] 收发光的引线点与收发光孔位于同一侧；
[0061] 收发光芯片的引线点、 驱动芯片的引线点分别与电路板接触， 收发光芯片的引 线点与驱动芯片的引线点位于同一水平面上， 收发光芯片的引线点与驱动芯片 的引线点通过电路板上的走线连接， 固定于电路板上； 电路板上设有通孔。
[0062] 本发明实施例中的收发光芯片为既可以接收光束又可以发射光束的芯片， 该收 发光芯片与驱动芯片的具体连接关系， 可以见上述实施例。
[0063] 相应地， 为了更好的解释本发明， 图 6和图 7分别示出了一种光模块的俯视结构 和仰视结构， 如图 6和图 7所示， 在电路板 63上， 设有驱动芯片 61和 1x8阵列的收 发光芯片 62， 驱动芯片 61和收发光芯片 62之间通过电路板走线 64连接。 电路板 上的通孔 65的设置的收发光芯片 62的下方， 与收发光芯片 62的收发光孔 66相对 应。 通过图 7可以看到， 在通孔 65中可以看到 8个收发光孔 66， 通孔 65的宽度大 于收发光孔 66的直径。 本发明实施例中， 该收发光芯片 62可以替换为发射光芯 片或者接收光芯片。
[0064] 图 8和图 9分别示出了另一种光模块的俯视结构和仰视结构， 如图 8和图 9所示， 在电路板 83上， 设有驱动芯片 81和一个的收发光芯片 82， 驱动芯片 81和收发光 芯片 82之间通过电路板走线 84连接。 电路板上的通孔 85的设置的收发光芯片 82 的下方， 与收发光芯片 82的收发光孔 86相对应。 通过图 9可以看到， 在通孔 85中 可以看到 1个收发光孔 86， 该通孔 85的宽度大于该收发光 86的直径。 本发明实施 例中， 该收发光芯片 82可以替换为发射光芯片或者接收光芯片。
[0065] 显然， 本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的 精神和范围。 这样， 倘若本发明的这些修改和变型属于本发明权利要求及其等 同技术的范围之内， 则本发明也意图包含这些改动和变型在内。

Claims

权利要求书
[权利要求 1] 一种光模块， 其特征在于， 包括：
驱动芯片、 发射光芯片和电路板；
所述发射光芯片的引线点与发光孔位于同一侧； 所述发射光芯片的引线点、 所述驱动芯片的引线点分别与所述电路板 接触， 所述发射光芯片的引线点与所述驱动芯片的引线点位于同一水 平面上， 所述发射光芯片的弓 I线点与所述驱动芯片的弓 I线点通过所述 电路板上的走线连接；
所述电路板上设有通孔， 所述发射光芯片的发光孔发出的光束穿过所 述通孑 L。
[权利要求 2] 如权利要求 1所述的光模块， 其特征在于， 还包括： 透镜；
所述透镜位于所述通孔远离所述发光孔的一端。
[权利要求 3] 如权利要求 2所述的光模块， 其特征在于， 所述透镜粘贴于所述电路 板的固定支架上。
[权利要求 4] 如权利要求 1所述的光模块， 其特征在于， 所述通孔的宽度大于所述 发光孔的直径。
[权利要求 5] —种光模块， 其特征在于， 包括：
驱动芯片、 接收光芯片和电路板；
所述接收光芯片的引线点与收光孔位于同一侧； 所述接收光芯片的引线点、 所述驱动芯片的引线点分别与所述电路板 接触， 所述接收光芯片的引线点与所述驱动芯片的引线点位于同一水 平面上， 所述接收光芯片的弓 I线点与所述驱动芯片的弓 I线点通过所述 电路板上的走线连接；
所述电路板上设有通孔， 所述接收光芯片的收光孔接收穿过所述通孔 的光束。
[权利要求 6] 如权利要求 5所述的光模块， 其特征在于， 还包括： 透镜；
所述透镜位于所述通孔远离所述收光孔的一端。
[权利要求 7] 如权利要求 6所述的光模块， 其特征在于， 所述透镜粘贴于所述电路 板的固定支架上。
[权利要求 8] 如权利要求 5所述的光模块， 其特征在于， 所述通孔的宽度大于所述 收光孔的直径。
PCT/CN2016/074033 2015-08-25 2016-02-18 一种光模块 WO2017031960A1 (zh)

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