WO2017018592A1 - Alignement hybride - Google Patents

Alignement hybride Download PDF

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Publication number
WO2017018592A1
WO2017018592A1 PCT/KR2015/009813 KR2015009813W WO2017018592A1 WO 2017018592 A1 WO2017018592 A1 WO 2017018592A1 KR 2015009813 W KR2015009813 W KR 2015009813W WO 2017018592 A1 WO2017018592 A1 WO 2017018592A1
Authority
WO
WIPO (PCT)
Prior art keywords
moving plate
moving
plate
axis
guide rails
Prior art date
Application number
PCT/KR2015/009813
Other languages
English (en)
Korean (ko)
Inventor
신정욱
Original Assignee
주식회사 재원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 재원 filed Critical 주식회사 재원
Priority to JP2016566925A priority Critical patent/JP6401299B2/ja
Priority to CN201580026288.2A priority patent/CN106663654B/zh
Publication of WO2017018592A1 publication Critical patent/WO2017018592A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Definitions

  • the present invention relates to a positioning device, and more particularly to a positioning device used for display panel processing equipment, semiconductor processing equipment and the like.
  • a positioning device used in display panel processing equipment, semiconductor processing equipment, and the like has a structure in which a short distance is linearly moved in order to precisely determine the location of semiconductor devices for manufacturing or inspecting semiconductor devices.
  • the overall height and size of the positioning device and the position of the positioning device are reduced due to the structural stability and mechanical stiffness deterioration problem due to the compactness and thickness.
  • the present invention has been made on the basis of the technical background as described above, to provide a lighter and thinner positioning device.
  • the base plate A first moving plate disposed on the base plate to be movable in a first axis; A second moving plate disposed on the first moving plate so as to be movable in a second axial direction perpendicular to the first axis and parallel to the first moving plate; A rotating plate disposed on the second moving plate to be rotatable about a rotation axis that is orthogonal to the first axis and the second axis at the same time;
  • a first driving unit including a first driving unit body fixed to the base plate, and a first moving bracket movable to the first axis with respect to the first driving unit body and connected to the first moving plate; A second driving unit body fixed to the first moving plate and a second moving bracket movable in the second axial direction with respect to the second driving unit body and connected to the second moving plate; unit; And a third driving unit body fixed to the second moving plate, a third moving bracket movable in the first axis or the second axis direction,
  • the base plate may further include a base plate body formed in a plate shape, and a pair of first guide rails disposed on an upper surface of the base plate body and extending in the first axis and spaced apart from each other.
  • the first moving plate may include a first moving plate body formed in a plate shape, and a lower surface of the first moving plate body and extending in the first axis and disposed between the first guide rails to form the first guide rail. And a pair of second guide rails that engage with the field.
  • the first moving plate may further include a pair of third guide rails disposed on an upper surface of the first moving plate body and extending in the second axial direction and spaced apart from each other.
  • the second moving plate body formed in the plate shape, and disposed on the lower surface of the second moving plate and is formed extending in the second axial direction and spaced apart from the third guide rails and the third guide rails and It may include a pair of fourth guide rails each engaged.
  • first guide rails each include a first guide rail body extending in the first axis, the first guide rail body is formed along the longitudinal direction of the first guide rail, the second guide rail And a second guide rail body each extending from the first axis and having a second recessed groove facing the first recessed groove along a longitudinal direction of the second guide rail, wherein the third guide rail And a third guide rail body extending in the second axial direction and having a third recessed groove formed along a length direction of the third guide rail, wherein the fourth guide rails are formed in the second shaft.
  • the first moving plate may extend from one side of the first moving plate body to the first axis, and may include an extension part at which a part of the second driving unit body is seated and fixed.
  • the base plate may further include a pair of base plate fixing parts formed at one side and the other side of the base plate body and having a plurality of through holes formed therein.
  • the base plate, the first moving plate, the second moving plate, and the rotating plate may have circular first alignment holes, second alignment holes, third alignment holes, and fourth alignment holes, respectively.
  • the rotation axis may pass through the first alignment hole, the second alignment hole, the third alignment hole, and the fourth alignment hole.
  • first alignment hole and the second alignment hole are formed in a first size
  • the third alignment hole and the fourth alignment hole is formed in a second size
  • the first size is larger than the second size Large crabs can be formed.
  • the first moving plate and the second moving plate may not interfere with the rotating shaft while the first moving plate or the second moving plate is moved with respect to the base plate or the first moving plate, respectively. have.
  • the second driving unit and the third driving unit may be disposed in parallel with each other with the rotation plate interposed therebetween, and the first driving unit may be disposed at one side of the second driving unit and the third driving unit. Can be.
  • the positioning device can be installed in a difficult installation conditions.
  • the driving units of the plate are arranged so that they do not overlap each other, so that installation is possible without limiting the shape or size of the driving motors, and a through hole is formed to use an optical device together.
  • FIG. 2 is a plan view showing the positioning device of FIG.
  • FIG. 5 is an exploded perspective view of FIG. 4 viewed in the V direction;
  • FIG. 6 is an exploded perspective view showing the configuration of the third drive unit and the rotating plate of the positioning device of FIG.
  • the positioning device described in the present description may mean a hybrid alignment capable of position movement along a plurality of axes.
  • the positioning device 1 has a linear configuration part in the direction of the second axis D2 orthogonal to the first axis D1 and the first axis D1.
  • a worktable or positioning device which is moved and whose other part is rotatably formed along the rotational axis R which is simultaneously orthogonal to the first axis D1 and the second axis D2, and is coupled with the positioning device 1 It is possible to precisely adjust the working position of the work object seated in (1), for example, a semiconductor wafer.
  • the base plate 100 may be seated or fixed at a predetermined position, and may provide a basis for positioning the positioning device 1.
  • the first moving plate 200 is disposed on the base plate 100 so as to be movable in the direction of the first axis D1, and the second moving plate 300 is disposed on the first moving plate 200. It is arrange
  • the rotating plate 400 is rotatably disposed about the rotation axis R on the second moving plate 300.
  • the second driving unit 600 is fixed to the first moving plate 200, and some components of the second driving unit 600 which are movable in the direction of the second axis D2 are connected to the second moving plate 300. . Therefore, the second driving unit 600 allows the second moving plate 300 to move in the direction of the second axis D2 with respect to the first moving plate 200.
  • the base plate 100, the first moving plate 200, the second moving plate 300, the rotating plate 400, the first driving unit 500, and the second driving unit 600 will be described. And the detailed configuration of the third drive unit 700 will be described in detail.
  • FIG. 3 is an exploded perspective view of the positioning device of FIG. 1
  • FIG. 4 is a perspective view of the exploded perspective view of FIG. 3 viewed from IV direction
  • the base plate 100 includes a base plate body 101, first guide rails 104, first support frames 103, and plate fixing portions 105. .
  • the base plate body 101 is formed in a plate shape, a circular first alignment hole 102 is formed in the center of the base plate body 101.
  • the first driving unit 500 is fixed to the base plate body 101.
  • the first guide rails 104 are disposed on the upper surface of the base plate body 101 and extend in the direction of the first axis D1.
  • the first guide rails 104 are spaced apart from each other.
  • the first support frames 103 protrude upward from the upper surface of the base plate body 101 and are spaced apart from each other with the first guide rails 104 at the center.
  • the first support frame 103 is in contact with the rear surfaces of the first guide rails 104 to support the first guide rails 104 from the rear side.
  • the base plate fixing part 105 is formed at one side edge and the other side edge of the base plate body 101, and a plurality of through holes are formed.
  • the base plate fixing part 105 may be disposed on one side and the other side of the base plate body 101 with the first support frames 103 interposed therebetween.
  • the base plate fixing part 105 may be fixed to the work holder (not shown) by a fastening member (not shown) penetrating the through hole to provide a fixed position of the positioning device 1.
  • the first moving plate 200 includes a first moving plate body 201, second guide rails 204, third guide rails 205, a second support frame 203, and a third And a support frame 206 and an extension 207.
  • the first moving plate body 201 is formed in a plate shape, the center of the first moving plate body 201 is a circular second alignment hole (aligned with the first alignment hole 102 of the base plate body 101) 208 is formed. At this time, the first alignment hole 102 and the second alignment hole 208 of the positioning device 1 according to the present embodiment may be formed to the same size.
  • the second guide rails 204 are disposed on the lower surface of the first moving plate body 201 and extend in the direction of the first axis D1.
  • the second guide rails 204 are disposed between the first guide rails 104 and mesh with the first guide rails 104, respectively, to the base plate 100 formed in the direction of the first axis D1. The movement of the first moving plate 200 may be guided.
  • the second support frame 203 protrudes downward from the lower surface of the first moving plate body 201 and is disposed between the pair of second guide rails 204.
  • the second support frame 203 is in contact with the rear surface of the second guide rail 204 to support the second guide rails 204 from the rear.
  • the third guide rails 205 are disposed on an upper surface of the first moving plate body 201 and extend in a second axis D2 direction, which is a direction orthogonal to the second guide rails 204.
  • the third supporting frame 206 is formed to protrude upward from the upper surface of the first moving plate body 201 and is disposed between the pair of third guide rails 205.
  • the third support frame 206 is in contact with the rear surface of the third guide rail 205 to support the third guide rails 205 from the rear.
  • the second moving plate 300 includes a second moving plate body 301, fourth guide rails 303, fourth supporting frames 302, and a rotating member 304.
  • the rotating member 304 is rotatably connected with respect to the second moving plate body 301, and is formed in a circular shape in which a third alignment hole 305 is formed at the center thereof, and a plurality of agents are formed on an upper surface of the rotating member 304. 1 coupling hole 306 is formed.
  • the third alignment hole 305 is aligned with the first alignment hole 102 and the second alignment hole 208, and may be formed to have a diameter smaller than that of the first alignment hole 102 and the second alignment hole 208. have.
  • the fourth guide rails 303 are disposed on the lower surface of the second moving plate body 301 and extend in the direction of the second axis D2.
  • the fourth guide rails 303 are spaced apart from each other with the third guide rails 205 interposed therebetween, and engaged with the third guide rails 205, respectively, to form the first moving plate 200 in the second axis D2 direction. It may guide the movement of the second moving plate 300 relative to).
  • the fourth supporting frames 302 are bent downward from one side and the other edge of the second moving plate body 301, and support the fourth guide rails 303 from the rear side.
  • the rotating plate 400 is rotatably connected about the rotation axis R with respect to the second moving plate 300 and includes a rotating plate body 401 formed in a circular shape.
  • a circular fourth alignment hole 402 which is aligned with the first alignment hole 102, the second alignment hole 208 and the third alignment hole 305, the fourth The alignment hole 402 may be formed to have the same diameter as the third alignment hole 305.
  • Second coupling holes 403 are formed around the fourth alignment hole 402 to be aligned with the first coupling holes 306.
  • the rotation plate 400 is centered on the rotation axis R with respect to the second moving plate 300. It can be rotatably connected.
  • the first alignment hole 102, the second alignment hole 208, the third alignment hole 305, and the fourth alignment hole 402 of the positioning device 1 according to the present embodiment are aligned with each other.
  • the rotation axis R is the first alignment hole 102 and the second alignment hole. 208, the third alignment hole 305, and the fourth alignment hole 402 may pass through at the same time.
  • the first moving plate 200 or the second moving plate 300 In addition, in the process of moving the first moving plate 200 or the second moving plate 300 with respect to the base plate 100 or the first moving plate 200, respectively, the first moving plate 200 or the second moving plate Since the movement of the plates 300 is fine, the first moving plate 200 and the second moving plate 300 do not interfere with the rotation axis R.
  • an optical device can be installed under the base plate 100 and used if necessary.
  • the first driving unit 500 is movable in the direction of the first axis D1 with respect to the first driving unit body 510 and the first driving unit body 510 fixed to the base plate 100. 1 from the first moving bracket 520 connected to the moving plate 200, the first driving motor 530 providing a driving force for moving the first moving bracket 520, and the first driving motor 530.
  • the first driving shaft 550 is provided on the outer circumferential surface to receive the rotational force so that the first moving bracket 520 is movable in the direction of the first axis D1.
  • the first moving bracket 520 connected to the first moving plate 200 by the external signal in the direction of the first axis D1.
  • movement of the first moving plate 200, the second moving plate 300, and the rotation plate 400 in the X-axis direction may be controlled.
  • a thread (not shown) may be formed on an outer circumferential surface of the first driving shaft 550.
  • the other side of the first moving bracket 520 is engaged with the screw thread of the first driving shaft 550 while one side of the first moving bracket 520 is fixed to the first moving plate 200, thereby driving the first drive.
  • the first moving bracket 520 may move in the direction of the first moving plate 200 and the first axis D1 by the rotational force of the motor 530.
  • the second drive unit 600 has a second shaft (2) relative to the second drive unit body 610 and the second drive unit body 610 that are seated and fixed to the extension 207 of the first moving plate 200.
  • a second moving bracket 620 movable in the direction D2) and connected to the second moving plate 300, a second driving motor 630 providing a driving force for moving the second moving bracket 620;
  • the second driving shaft 650 receives the rotational force from the second drive motor 630 and is disposed on the outer circumferential surface so as to be movable along the direction of the second axis D2, and the thread is formed on the outer circumferential surface. It includes.
  • the second driving unit 600 moves the second moving bracket 620 connected to the second moving plate 300 by an external signal in the direction of the second axis D2.
  • the configuration of the first drive unit 500 Since it is the same as, detailed description thereof will be omitted.
  • FIG. 6 is an exploded perspective view showing the configuration of the third drive unit and the rotating plate of the positioning device of FIG. 1, and FIG. 7 is a view showing the operation of the third drive unit and the rotating plate of the positioning device of FIG. 6.
  • the third drive unit 700 includes a third drive unit body 710, a third moving bracket 720, a third drive motor 730, and a pivot bracket 740. ), A third drive shaft 750, a bracket fixing member 760, and a third elastic member 770.
  • the third driving unit body 710 may include a frame part 711 fixed to the second moving plate 300, and a cover part covering the frame part 711 and forming an internal space therebetween. 712).
  • the frame part 711 is fixed to one fourth support frame 302 of the fourth support frames 302 of the second moving plate 300.
  • the third driving motor 730 provides a rotational force and is provided at one side of the third driving unit body 710.
  • the third drive shaft 750 extends in the direction of the second axis D2 and receives rotational force from the third drive motor 730.
  • the third drive shaft 750 is rotatably connected to the frame portion 711, and a thread is formed on an outer circumferential surface of the third drive shaft 750.
  • the third moving bracket 720 is engaged with the screw thread with one side penetrated by the third drive shaft 750 to be movable in the direction of the second axis D2 by the rotation of the third drive shaft 750. Is formed.
  • the third moving bracket 720 may be formed in a hexahedral shape, and a first fastening hole 721 is formed on an upper surface of the third moving bracket 720.
  • the bracket fixing member 760 has a head portion 761 formed in a circular shape, a neck portion 762 protruding from a lower surface of the head portion 761, and having a diameter smaller than that of the head portion 761, and the head portion 761.
  • a second fastening hole 763 is formed through the upper surface of the second fastening hole 721 is aligned with the first fastening hole 721 of the third moving bracket (720).
  • the bracket fixing member 760 may be fixed to the third moving bracket 720 by a fastening member such as a screw that is fixed to the first fastening hole 721 by passing through the second fastening hole 763. .
  • the pivot bracket 740 may be formed in a plate shape, for example.
  • pivot bracket 740 is formed with a round portion 742 formed with a curvature corresponding to the outer circumference of the neck portion 762 of the bracket fixing member 760.
  • one side of the pivot bracket 740 is rotatably connected with respect to the third moving bracket 720, and the other side of the pivot bracket 740 is fixed to the rotating plate 400.
  • An elastic member 760 surrounding the third driving shaft 750 may be provided between the third moving bracket 720 and the frame part 711 to provide a restoring force to the third moving bracket 720.
  • the pivot bracket 740 may be defined as a reference position in which the pivot bracket 740 is perpendicular to the linear movement path of the third moving bracket 720, that is, the second axis D2.
  • the rotational displacement of the rotating plate 400 may be adjusted.
  • the third moving bracket 720 connected to the third drive shaft 750 is the second shaft It moves along (D2).
  • the pivot bracket 740 connected to one side of the third moving bracket 720 to be rotatable linearly moves the third moving bracket 720. Pushed in the direction. Accordingly, the pivot bracket 740 may be rotated about the rotation shaft R together with the rotation plate 400.
  • the linear movement direction of the third moving bracket 720 may be the same as the tangential direction of the circumference around the rotation axis (R).
  • the moving center P1 of the third moving bracket 720 and the moving center P2 of the pivot bracket 740 may coincide with each other.
  • the third moving bracket 720 can be moved relative to the open end of the round portion 742 of the pivot bracket 740, the center of movement P2 and the center of movement of the round portion 742 of the pivot bracket 740 are made. 3 Even if the linear movement paths of the moving centers P1 of the moving bracket 720 are different, the pivot bracket 740 and the third moving bracket 720 can be smoothly rotated and linearly moved without interfering with each other.
  • the second drive unit 600 and the third drive unit 700 of the positioning device 1 according to the present embodiment are parallel to each other in the direction of the second axis D2 with the rotating plate 400 interposed therebetween.
  • the second driving unit 600 is disposed at one side of the first driving unit 500 and the third driving unit 700 in the second axis D2.
  • first drive unit 500 and the third drive unit 700 of the positioning device 1 face each other with the rotation plate 400 interposed therebetween in the direction of the first axis D1.
  • the first driving unit 500 may be disposed in the direction of the first axis D1 on one side of the second driving unit 600 and the third driving unit 700.
  • the third moving bracket 720 of the third driving unit 700 is provided to be movable on the first axis D1.
  • FIG. 8 is a cross-sectional view illustrating a first guide rail and a second guide rail of the positioning device of FIG. 1.
  • the second guide rail 204 of the first moving plate 200 includes a second guide rail body 211 extending along the first axis D1, and the second guide rail body 211 is provided with a second guide rail body 211.
  • the second recessed groove 212 is formed in the longitudinal direction of the second guide rail body 211.
  • the first guide rail 104 and the second guide rail 204 are disposed so that the first recessed groove 112 and the second recessed groove 212 face each other, and the first recessed groove 112 and the second recessed groove ( A roller member 800 that is simultaneously fitted to the first recessed groove 112 and the second recessed groove 212 is provided between the 212.
  • recessed grooves facing each other are formed in the third guide rail 205 of the first moving plate 200 and the fourth guide rail 303 of the second moving plate 300, respectively.
  • a roller member to be fitted may be provided to smoothly move the second moving plate 300 with respect to the first moving plate 200.
  • the driving units of the plate are arranged so that they do not overlap each other, so that installation is possible without limiting the shape or size of the driving motors, and a through hole is formed to use an optical device together.
  • the present invention relates to a positioning device, which can be applied to various industrial equipments, has repeatability, and is industrially applicable.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Machine Tool Units (AREA)
  • Transmission Devices (AREA)
  • Details Of Measuring And Other Instruments (AREA)

Abstract

La présente invention porte sur un appareil de positionnement comprenant : une plaque de base ; une première plaque mobile qui est disposée sur la plaque de base de manière à être mobile sur un premier axe ; une deuxième plaque mobile qui est disposée sur la première plaque mobile de manière à être mobile dans la direction d'un deuxième axe qui est orthogonal au premier axe et est parallèle à la première plaque mobile ; une plaque rotative qui est disposée sur la deuxième plaque mobile de manière à pouvoir tourner autour d'un axe de rotation qui est simultanément orthogonal au premier axe et au deuxième axe ; un premier corps d'unité d'entraînement qui est fixé à la plaque de base ; une première unité d'entraînement comprenant un premier support mobile qui est mobile sur le premier axe par rapport au premier corps d'unité d'entraînement et est relié à la première plaque mobile ; un deuxième corps d'unité d'entraînement qui est fixé à la première plaque mobile ; une deuxième unité d'entraînement comprenant un deuxième support mobile qui est mobile dans la direction du deuxième axe par rapport au deuxième corps d'unité d'entraînement et est relié à la deuxième plaque mobile ; un troisième corps d'unité d'entraînement qui est fixé à la deuxième plaque mobile ; un troisième support mobile qui est mobile sur le premier axe ou dans la direction du deuxième axe ; et une troisième unité d'entraînement comprenant un support de pivot dont un côté est relié de manière rotative au troisième support mobile et dont l'autre côté est fixé à la plaque rotative.
PCT/KR2015/009813 2015-07-30 2015-09-18 Alignement hybride WO2017018592A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016566925A JP6401299B2 (ja) 2015-07-30 2015-09-18 ハイブリッドアライメント
CN201580026288.2A CN106663654B (zh) 2015-07-30 2015-09-18 混合对准装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020150107841A KR101608625B1 (ko) 2015-07-30 2015-07-30 위치 결정 장치
KR10-2015-0107841 2015-07-30

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WO2017018592A1 true WO2017018592A1 (fr) 2017-02-02

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JP (1) JP6401299B2 (fr)
KR (1) KR101608625B1 (fr)
CN (1) CN106663654B (fr)
WO (1) WO2017018592A1 (fr)

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JP2021526980A (ja) * 2018-06-12 2021-10-11 コベントリー アソシエイツ， インク．Ｃｏｖｅｎｔｒｙ Ａｓｓｏｃｉａｔｅｓ， Ｉｎｃ． 物体に対する複数の製造作業を実施するための方法および装置
CN108746784A (zh) * 2018-06-28 2018-11-06 宁德思客琦智能装备有限公司 一种锂电池电芯极柱面铣削设备
KR102259802B1 (ko) * 2019-07-04 2021-06-02 퀸시스(주) 회전 스테이지
JP7266875B2 (ja) * 2019-09-27 2023-05-01 株式会社ナガセインテグレックス 工作機械
KR102447890B1 (ko) * 2020-09-04 2022-09-27 삼승테크(주) 검사 스테이지의 회전 각도 정밀 조절장치

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CN106663654B (zh) 2019-07-30

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