WO2017012336A1 - 一种单板模块级水冷系统 - Google Patents

一种单板模块级水冷系统 Download PDF

Info

Publication number
WO2017012336A1
WO2017012336A1 PCT/CN2016/073883 CN2016073883W WO2017012336A1 WO 2017012336 A1 WO2017012336 A1 WO 2017012336A1 CN 2016073883 W CN2016073883 W CN 2016073883W WO 2017012336 A1 WO2017012336 A1 WO 2017012336A1
Authority
WO
WIPO (PCT)
Prior art keywords
water
module
board
cooling
water pump
Prior art date
Application number
PCT/CN2016/073883
Other languages
English (en)
French (fr)
Inventor
江文兵
厉建峰
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Priority to EP16827028.8A priority Critical patent/EP3328172B1/en
Priority to US15/746,569 priority patent/US10212856B2/en
Publication of WO2017012336A1 publication Critical patent/WO2017012336A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H05K7/1489—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures characterized by the mounting of blades therein, e.g. brackets, rails, trays

Definitions

  • the present application relates to the field of electronic communication devices, for example, to a single board module level water cooling system for equipment insertion boxes.
  • the more common water cooling mode is to install a water-cooled heat-dissipating box that is independent of the equipment box in the cabinet.
  • This mode has the following disadvantages: First, the water-cooled heat-dissipation box is installed in the cabinet separately, which will occupy a large cabinet space. Second, the plugging and unloading process of the water-cooled heat-dissipating box requires manual control, resulting in low thermal conductivity and efficiency of the system. Third, the water-cooled heat-dissipating box will drip when manually controlled, and there is water in the water-cooled line in the extracted board.
  • Embodiments of the present invention can overcome the above problems.
  • the embodiment of the invention provides a single-board module-level water-cooling system, in which a single-plate water-cooling module capable of hot-swapping is installed on each single-board module, and the system can realize the function of automatically pumping liquid to the single-plate water-cooling module, and the structure Simple, space-saving, water-free in the pulled out board, and high equipment maintenance efficiency.
  • a single-board module-level water-cooling system includes: a device insertion box having a backboard; a plurality of single-board modules located on one side of the backboard; and one or more series connected to each of the single-board modules Connected single-board water-cooling modules, each of which has a liquid that cools the heating elements of the single-board module; a plurality of pairs of sealed plug-in units mounted on the backing plate, each pair of sealed plug-in units connected One or more single-plate water-cooling modules connected in series; multiple water pump modules on the other side of the backing plate, one The water pump module is connected to one or more single-board water-cooling modules connected in series via a pair of said sealing plug-in units; wherein each of the sealed plug-in units of each pair of sealed plug-in units comprises two parts of the plug-in connection The first part is mounted on the single board module and is connected with one or more single board water cooling modules connected in series, wherein the second part is mounted on the back board and is connected with a water pump module.
  • a control panel configured to control the water pump module to supply cooling liquid to the single plate water cooling module and to draw cooling liquid from the single plate water cooling module may also be included.
  • a water storage tank configured to provide cooling liquid for the single-plate water-cooling module may also be included; wherein, between the water storage tank and each of the water pump modules, between each of the water pump modules and the sealed plug-in unit, and each of the sealed plug-in units and the single The plate water cooling modules are connected by a circulation line.
  • the first part of the sealing plug-in unit may be a fixed male end, the fixed male end is fixedly mounted on the single-board module, and one end thereof is connected to the single-plate water-cooling module through a circulation pipeline;
  • the second part may be a floating female end, a floating mother The end is floatingly mounted on the back plate and has one end connected to the water pump module through a circulation line, and the other end of which is sealed and inserted with the other end of the fixed male end; wherein the other end of the fixed male end is installed to be configured to realize the fixed male end a primary sealing unit and a secondary oblique sealing unit that are sealed with the floating female end.
  • the single board module may have a pull-out switch connected to the control board and configured to send a pull-out signal to the control board, and an indicator light configured to instruct the water pump module to draw out a state of the cooling liquid.
  • the single-board module can be mounted with a wrench and a micro switch that is in contact with the wrench.
  • the micro-switch is connected to the control board and configured to send a single-board module in-position signal to the control board.
  • the circulation line may have a water inlet pipe and a water return pipe
  • the water pump module includes: a one-way valve connected to the water inlet pipe, the one-way valve is connected to the control board, and configured to receive the single sent by the control board A start and stop signal to the valve; a water pump connected to the return pipe, the water pump being coupled to the control panel and configured to receive a start and stop signal of the water pump sent by the control panel.
  • the circulation line (eg, the lower part or the lowest part, etc.) may be equipped with a flooding sensor, and the water flooding sensor is connected to the control board, and is configured to send a signal to the control board whether the circulation line leaks.
  • the floating female end can be mounted on the back plate by bolts and nuts.
  • the mounting hole of the floating female end for mounting the bolt may have a larger hole diameter than the outer diameter of the bolt, so as to generate a radial gap for achieving radial fine adjustment, thereby achieving automatic axial centering of the floating female end and the fixed male end.
  • the single-plate water-cooling module is installed on each single-board module of the equipment insertion box, and
  • the sealing plug-in unit is connected with the water pump module, and can be inserted and removed at any time under the control of the control board, which is convenient to use and saves space;
  • the water pump module connected to the single-plate water-cooling module through the sealed plug-in unit is connected with the control board in the embodiment of the invention, and the function of automatically supplying the cooling liquid to the single-plate water-cooling module and automatically extracting the cooling liquid from the single-plate water-cooling module can be realized;
  • the embodiment of the invention can realize the water cooling function of a single board module or the water cooling function of a plurality of water cooling modules under the action of the controller.
  • FIG. 1a and 1b are schematic structural views of a single-plate water-cooling module installed on a single-board module of a device insertion box according to an embodiment of the present invention
  • FIG. 2a is a schematic diagram of a circulation path of a single-board module-level water cooling system according to an embodiment of the present invention
  • Figure 2b is an enlarged schematic view of the portion A shown in Figure 2a;
  • FIG. 3 is a schematic structural view of a sealing plug-in unit according to an embodiment of the invention.
  • FIG. 4 is a schematic structural view of a single-board module-level water cooling system according to an embodiment of the present invention.
  • a single-board module-level water-cooling system includes: a device insertion box 1 having a backplane 2; a plurality of single-board modules 3 on one side of the backplane; A single-plate water-cooling module 4 on module 3, each single-plate water-cooling module 4 Each has a liquid for cooling the heating element of one of the corresponding single-board modules 3; a plurality of pairs of sealed plug-in units 5 mounted on the backing plate 2, and a pair of single-plate water-cooling modules 4 connected to each pair of sealed plug-in units 5 a plurality of water pump modules 11 on the other side of the backboard, one water pump module 11 connected to a single-plate water-cooling module 4 via a pair of sealed plug-in units 5; configured to control one or more water pump modules 11 to be connected thereto
  • each of the sealed plug-in units 5 of each pair of sealing plug-in units 5 comprises two portions of a plug-in connection.
  • the first part is a fixed male end 51, and the fixed male end 51 is fixedly mounted on the single board module 3, and one end thereof is connected to the single board water cooling module 4 through the circulation line 6; the second part is the floating female end 52, and the floating female end 52 is installed.
  • the back plate 2 is connected to the water pump module 11 through a circulation line 6 at one end, and the other end of the fixed male end 51 is sealed and inserted at the other end.
  • the end of the fixed male end 51 for inserting the other end of the floating female end 52 is chamfered for quick blind insertion.
  • the end body portion of the fixed male end 51 for inserting the other end of the floating female end 52 is mounted with a primary sealing unit 13 and a secondary oblique sealing unit 14 for sealingly connecting the fixed male end 51 and the floating female end 52.
  • the double-layer sealing unit achieves both sealing and positioning functions.
  • the first sealing unit 13 is a coarse positioning and matching unit, which realizes the first stage positioning insertion of the fixed male end 51;
  • the secondary oblique sealing unit 14 is a fine positioning and matching unit, and realizes the pair of the fixed male end 51 and the floating female end 52.
  • the primary sealing unit 13 and the secondary oblique sealing unit 14 are gaskets.
  • the floating female end 52 is mounted on the backing plate 2 by bolts and nuts 12.
  • a single-plate water-cooling module 4 is connected to a water pump module 11 via a sealed plug-in unit 5.
  • a single-board water-cooling module 4 corresponds to a single-board module 3.
  • a plurality of single-plate water-cooling modules 4 connected in series may be installed on each single-board module 3 of the embodiment of the present invention.
  • a single-board module 3 has a plurality of heating elements, a plurality of serially connected single-board water-cooled A heat generating component is cooled on each of the single-plate water-cooling modules 4 in the module 4 to improve heat dissipation efficiency.
  • the board module 3 has a tablet switch 9 and an indicator light 10.
  • the pull switch 9 is connected to the control board 15 and is configured to send a pull signal to the control board 15; the indicator light 10 is connected to the control board 15 and is configured to instruct the water pump module to draw out a cooling liquid state.
  • the single-board module 3 is mounted with a wrench 8 and a micro switch 7 in contact with the wrench 8.
  • the micro switch 7 is connected to the control board 15 and configured to send a single-board module in-position signal to the control board 15. .
  • the circulation line has an inlet line and a return line.
  • the water pump module 11 includes: a check valve 112 connected to the water inlet pipe, and the check valve 112 is connected to the control board 15 and configured to receive the start and stop signals of the check valve sent by the control board 15;
  • the water pump 111, the water pump 111 is connected to the control board 15, and is configured to receive start and stop signals of the water pump sent by the control board.
  • a circulation line (e.g., lower or lowest) is mounted with a flooding sensor 17, which is coupled to the control panel 15 and configured to send a signal to the control panel whether or not the circulation line is leaking.
  • the single-plate water-cooling module 4 of the embodiment of the present invention is sealedly connected to a water pump module 11 via the sealing plug-in unit 5, and the water supply module 11 automatically supplies liquid to the single-plate water-cooling module 4 after the sealing connection is as follows: the wrench 8 is triggered to trigger The position triggers the micro switch 7 to send a single board module in-position signal to the control board 15, and the control board 15 that receives the signal sends a start signal to the check valve 112 and the water pump 111, the check valve 112 is opened, the water pump is running, and the water pump is stored. The cooling liquid is withdrawn from the water tank and supplied to the single-plate water-cooling module 4 to realize automatic circulation supply.
  • the process of starting the drawing of the board is as follows: the boarding switch 9 is activated, and the boarding switch 9 sends a request for pulling the board to the control board 15, and the control board 15 receiving the signal is unidirectional.
  • the valve 112 sends a shutdown signal, the one-way valve 112 is closed, and the water pump draws cooling liquid from the single-plate water-cooling module 4.
  • the indicator light 10 flashes red during the process of drawing out the cooling liquid. After the cooling liquid is exhausted, the indicator light 10 is solid green, and the single board module can be removed.
  • the present application discloses a single-board module-level water-cooling system, including: a device insertion box having a backboard; a plurality of single-board modules located on one side of the backplane; and correspondingly installed on each of the single-board modules a single-plate water-cooling module having a liquid for cooling a heating element of the single-plate module; mounted on the back a plurality of sealing plug-in units connected to each of the single-plate water-cooling modules on the board; and a plurality of water pump modules of the plurality of single-board water-cooling modules are connected via the plurality of sealed plug-in units, the water pump module being located on the backboard One side; wherein each sealing plug unit comprises two parts of the plug connection, wherein the first part is mounted on the single board module and is connected with a single board water cooling module, wherein the second part is installed in the A water pump module is connected to the back plate.
  • the single-board module-level water-cooling system disclosed in the present application has a simple structure,

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种单板模块级水冷系统，包括：具有背板（2）的设备插箱（1）；位于所述背板（2）一侧的多个单板模块（3）；对应安装在每个所述单板模块（3）上的多个单板水冷模块（4），其具有对所述单板模块（3）的发热元件进行冷却的液体；安装在所述背板（2）上且连接每个单板水冷模块（4）的多个密封插接单元（5）；经由多个所述密封插接单元（5）连接多个单板水冷模块（4）的多个水泵模块（11），所述水泵模块（11）位于所述背板（2）另一侧。所述的单板模块级水冷系统结构简单，节约空间，设备维护效率高。

Description

一种单板模块级水冷系统 技术领域
本申请涉及电子通讯设备领域，例如涉及一种用于设备插箱的单板模块级水冷系统。
背景技术
近些年来，随着互联网技术不断发展，很多通信设备、网络设备以及数据设备都被集成在一个插箱中，形成设备插箱。随着通信设备、网络设备以及数据设备等电子设备的集成度越来越高，规模越来越大，设备插箱内的热密度越来越高，使得用于安装设备插箱的整个机柜的热负荷越来越大。水冷散热方式由于其导热效率高而逐渐被应用到电子通讯领域的散热中。
目前较为常见的水冷散热模式是：在机柜内安装与设备插箱独立的水冷散热插箱。该模式存在以下缺点：一，水冷散热插箱独立安装在机柜内会占用较大机柜空间；二，水冷散热插箱的插拔以及供液过程均需要手动控制，导致系统导热能力和效率不高；三，水冷散热插箱在手动控制时会滴水，且拔出的单板内的水冷管路中有水。
发明内容
本发明实施例可以克服上述问题。本发明实施例提供一种单板模块级水冷系统，在每个单板模块上安装一个可实现热插拔的单板水冷模块，且该系统可实现向单板水冷模块自动抽送液功能，结构简单，节约空间，拔出的单板中无水，设备维护效率高。
本发明实施例提供以下技术方案：
一种单板模块级水冷系统，包括：具有背板的设备插箱；位于所述背板一侧的多个单板模块；对应安装在每个所述单板模块上的一个或多个串联连接的单板水冷模块，每个单板水冷模块具有对所述单板模块的发热元件进行冷却的液体；安装在所述背板上的多对密封插接单元，每对密封插接单元连接有一个或多个串联连接的单板水冷模块；位于所述背板另一侧的多个水泵模块，一个 水泵模块经由一对所述密封插接单元连接有一个或多个串联连接的单板水冷模块；其中，每对密封插接单元中的每个密封插接单元均包括插接连接的两个部分，其中的第一部分安装在所述单板模块上且连接有一个或多个串联连接的单板水冷模块，其中的第二部分安装在所述背板上且连接有一个水泵模块。
还可以包括被配置为控制所述水泵模块向单板水冷模块供应冷却液体以及从所述单板水冷模块抽出冷却液体的控制板。
还可以包括被配置为为单板水冷模块提供冷却液体的储水箱；其中，储水箱与每个水泵模块之间、每个水泵模块与密封插接单元之间以及每个密封插接单元与单板水冷模块之间通过循环管路连接。
所述密封插接单元的第一部分可以为固定公端，固定公端固定安装在单板模块上且其一端通过循环管路与单板水冷模块连接；第二部分可以为浮动母端，浮动母端浮动安装在背板上且其一端通过循环管路与水泵模块连接，其另一端与固定公端的另一端密封插接；其中，所述固定公端的另一端安装有被配置为实现固定公端与浮动母端密封插接的一级密封单元和二级斜出密封单元。
所述单板模块上可以具有与控制板连接的被配置为向控制板发送拔板信号的拔板开关以及被配置为指示水泵模块抽出冷却液体状态的指示灯。
所述单板模块上可以安装有扳手以及与扳手接触的微动开关，所述微动开关与控制板连接，被配置为向控制板发送单板模块安装到位信号。
所述循环管路可以具有进水管路和回水管路，所述水泵模块包括：连接在进水管路上的单向阀，所述单向阀与控制板连接，被配置为接收控制板发送的单向阀的启动与停止信号；连接在回水管路上的水泵，所述水泵与控制板连接，被配置为接收控制板发送的水泵的启动与停止信号。
所述循环管路(如：下部或最低处等)可以安装有水淹传感器，水淹传感器与控制板连接，被配置为向控制板发送循环管路是否漏水的信号。
所述浮动母端可以通过螺栓螺母安装在背板上。
所述浮动母端上用于安装螺栓的安装孔的孔径可以大于螺栓外径，以便产生实现径向微调的径向间隙，从而实现浮动母端与固定公端轴向自动对中。
本发明实施例的有益效果体现在以下方面：
本发明实施例将单板水冷模块安装在设备插箱的每个单板模块上，且通过 密封插接单元与水泵模块连接，在控制板的控制下可实现随时插拔，使用方便，节约空间；
本发明实施例的与单板水冷模块通过密封插接单元连接的水泵模块与控制板连接，可实现自动向单板水冷模块供应冷却液体以及自动从单板水冷模块抽出冷却液体的功能；
本发明实施例在控制器的作用下，能实现一个单板模块的水冷功能或者多个水冷模块的水冷功能。
附图概述
图1a、1b是本发明实施例的单板水冷模块安装在设备插箱的单板模块上的结构示意图；
图2a是本发明实施例的单板模块级水冷系统的循环路径示意图；
图2b是图2a所示A部分的放大结构示意图；
图3是发明实施例的密封插接单元的结构示意图；
图4是本发明实施例的单板模块级水冷系统的结构示意图。
附图标记说明：1-设备插箱；2-背板；3-单板模块；4-单板水冷模块；5-密封插接单元；51-固定公端；52-浮动母端；6-循环管路；7-微动开关；8-扳手；9-拔板开关；10-指示灯；11-水泵模块；111-水泵；112-单向阀；12-螺栓螺母；13-一级密封单元；14-二级斜出密封单元；15-控制板；16-储水箱；17-水淹传感器。
本发明的实施方式
本发明实施例提供一种单板模块级水冷系统，既能实现一个单板模块的水冷控制，又能实现多个单板模块的水冷控制。如图1a、1b和4所示，一种单板模块级水冷系统包括：具有背板2的设备插箱1；位于背板一侧的多个单板模块3；对应安装在每个单板模块3上的一个单板水冷模块4，每个单板水冷模块4 上均具有对与其对应的一个单板模块3的发热元件进行冷却的液体；安装在背板2上的多对密封插接单元5，每对密封插接单元5连接有一个单板水冷模块4；位于背板另一侧的多个水泵模块11，一个水泵模块11经由一对密封插接单元5连接有一个单板水冷模块4；被配置为控制一个或多个水泵模块11向与其连接的单板水冷模块4供应冷却液体以及从单板水冷模块4抽出冷却液体的控制板15；被配置为为单板水冷模块4提供冷却液体的储水箱16；其中，储水箱16与每个水泵模块11之间、每个水泵模块11与密封插接单元5之间以及每个单板水冷模块4与密封插接单元5之间通过循环管路6连接。
下面结合附图对本发明实施例的系统结构及其工作原理进行详细说明。
如图2a和3所示，每对密封插接单元5中的每个密封插接单元5包括插接连接的两个部分。第一部分为固定公端51，固定公端51固定安装在单板模块3上且其一端通过循环管路6与单板水冷模块4连接；第二部分为浮动母端52，浮动母端52安装在背板2上且其一端通过循环管路6与水泵模块11连接，其另一端与固定公端51的另一端密封插接。如图3所示，固定公端51上用于插入浮动母端52的另一端的端头部设计有倒角，便于实现快速盲插。且固定公端51上用于插入浮动母端52的另一端的端体部安装有实现固定公端51与浮动母端52密封插接的一级密封单元13和二级斜出密封单元14。双层密封单元实现密封和定位双重功能。
一级密封单元13为粗定位配合单元，实现的是固定公端51的第一级定位插入；二级斜出密封单元14为精定位配合单元，实现固定公端51与浮动母端52的对中与紧密配合。一级密封单元13和二级斜出密封单元14为密封垫。浮动母端52通过螺栓螺母12安装在背板2上。
如图2a所示，一个单板水冷模块4经由一个密封插接单元5与一个水泵模块11连接。一个单板水冷模块4对应一个单板模块3。此外，本发明实施例的每个单板模块3上也可以安装多个串联连接的单板水冷模块4，当一个单板模块3上具有多个发热元件时，多个串联连接的单板水冷模块4中的每个单板水冷模块4上对一个发热元件进行冷却，以提高散热效率。单板模块3上具有拔板开关9和指示灯10。拔板开关9与控制板15连接，被配置为向控制板15发送拔板信号；指示灯10与控制板15连接，被配置为指示水泵模块抽出冷却液体状态。
如图2b所示，单板模块3上安装有扳手8以及与扳手8接触的微动开关7，微动开关7与控制板15连接，被配置为向控制板15发送单板模块安装到位信号。
如图2a所示，循环管路具有进水管路和回水管路。水泵模块11包括：连接在进水管路上的单向阀112，单向阀112与控制板15连接，被配置为接收控制板15发送的单向阀的启动与停止信号；连接在回水管路上的水泵111，水泵111与控制板15连接，被配置为接收控制板发送的水泵的启动与停止信号。
如图2a所示，循环管路(如：下部或最低处等)安装有水淹传感器17，水淹传感器17与控制板15连接，被配置为向控制板发送循环管路是否漏水的信号。
本发明实施例的单板水冷模块4经由密封插接单元5与一个水泵模块11密封连接，以及密封连接后水泵模块11向单板水冷模块4自动供液的过程如下：扳动扳手8到触发位置并触发微动开关7向控制板15发送单板模块安装到位信号，接收到信号的控制板15向单向阀112和水泵111发送启动信号，单向阀112开启，水泵运行，水泵从储水箱中抽出冷却液体向单板水冷模块4中供应，实现自动循环供液。
本发明实施例中，启动拔板(拔下单板模块)的过程如下：启动拔板开关9，拔板开关9向控制板15发送请求拔板信号，接收到信号的控制板15向单向阀112发送关闭信号，单向阀112关闭，水泵从单板水冷模块4中抽出冷却液体。在抽出冷却液体的过程中指示灯10红色闪烁，抽完冷却液体后指示灯10绿色常亮，此时可以拔下单板模块。
尽管上述对本发明实施例做了详细说明，但本发明不限于此，本技术领域的技术人员可以根据本发明实施例的原理进行修改，因此，凡按照本发明实施例的原理进行的各种修改都应当理解为落入本发明的保护范围。
工业实用性
本申请公开了一种单板模块级水冷系统，包括：具有背板的设备插箱；位于所述背板一侧的多个单板模块；对应安装在每个所述单板模块上的多个单板水冷模块，其具有对所述单板模块的发热元件进行冷却的液体；安装在所述背 板上且连接每个单板水冷模块的多个密封插接单元；经由多个所述密封插接单元连接多个单板水冷模块的多个水泵模块，所述水泵模块位于所述背板另一侧；其中，每个密封插接单元包括插接连接的两个部分，其中的第一部分安装在所述单板模块上且连接有一个单板水冷模块，其中的第二部分安装在所述背板上且连接有一个水泵模块。本申请所公开的单板模块级水冷系统结构简单，节约空间，设备维护效率高。

Claims (10)

  1. 一种单板模块级水冷系统，包括：
    具有背板的设备插箱；
    位于所述背板一侧的多个单板模块；
    安装在每个所述单板模块上的一个或多个串联连接的单板水冷模块，每个单板水冷模块具有对所述单板模块的发热元件进行冷却的液体；
    安装在所述背板上的多对密封插接单元，每对密封插接单元连接有一个或多个串联连接的单板水冷模块；
    位于所述背板另一侧的多个水泵模块，一个水泵模块经由一对所述密封插接单元连接有一个或多个串联连接的单板水冷模块；
    其中，每对密封插接单元中的每个密封插接单元均包括插接连接的两个部分，其中的第一部分安装在所述单板模块上且连接有一个或多个串联连接的单板水冷模块，其中的第二部分安装在所述背板上且连接有一个水泵模块。
  2. 如权利要求1所述的单板模块级水冷系统，其中，还包括被配置为控制所述水泵模块向单板水冷模块供应冷却液体以及从所述单板水冷模块抽出冷却液体的控制板。
  3. 如权利要求2所述的单板模块级水冷系统，其中，还包括被配置为为单板水冷模块提供冷却液体的储水箱；其中，
    储水箱与每个水泵模块之间、每个水泵模块与密封插接单元之间以及每个密封插接单元与单板水冷模块之间通过循环管路连接。
  4. 如权利要求3所述的单板模块级水冷系统，其中，所述每个密封插接单元的第一部分为固定公端，固定公端固定安装在单板模块上且其一端通过循环管路与单板水冷模块连接；第二部分为浮动母端，浮动母端浮动安装在背板上且其一端通过循环管路与水泵模块连接，其另一端与固定公端的另一端密封插 接；
    其中，所述固定公端的另一端安装有实现固定公端与浮动母端密封插接的一级密封单元和二级斜出密封单元。
  5. 如权利要求4所述的单板模块级水冷系统，其中，所述单板模块上具有与控制板连接的被配置为向控制板发送拔板信号的拔板开关以及被配置为指示水泵模块抽出冷却液体状态的指示灯。
  6. 如权利要求5所述的单板模块级水冷系统，其中，所述单板模块上安装有扳手以及与扳手接触的微动开关，所述微动开关与控制板连接，被配置为向控制板发送单板模块安装到位信号。
  7. 如权利要求6所述的单板模块级水冷系统，其中，所述循环管路具有进水管路和回水管路，所述水泵模块包括：
    连接在进水管路上的单向阀，所述单向阀与控制板连接，被配置为接收控制板发送的单向阀的启动与停止信号；
    连接在回水管路上的水泵，所述水泵与控制板连接，被配置为接收控制板发送的水泵的启动与停止信号。
  8. 如权利要求7所述的单板模块级水冷系统，其中，所述循环管路安装有水淹传感器，水淹传感器与控制板连接，被配置为向控制板发送循环管路是否漏水的信号。
  9. 如权利要求4或8所述的单板模块级水冷系统，其中，所述浮动母端通过螺栓螺母安装在背板上。
  10. 如权利要求9所述的单板模块级水冷系统，其中，所述浮动母端上用于安装螺栓的安装孔的孔径大于螺栓外径，以产生实现径向微调的径向间隙。
PCT/CN2016/073883 2015-07-23 2016-02-16 一种单板模块级水冷系统 WO2017012336A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP16827028.8A EP3328172B1 (en) 2015-07-23 2016-02-16 Water cooling system on board module level
US15/746,569 US10212856B2 (en) 2015-07-23 2016-02-16 Water cooling system of single board module level

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201520535827.2U CN204887839U (zh) 2015-07-23 2015-07-23 一种单板模块级水冷系统
CN201520535827.2 2015-07-23

Publications (1)

Publication Number Publication Date
WO2017012336A1 true WO2017012336A1 (zh) 2017-01-26

Family

ID=54832155

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/073883 WO2017012336A1 (zh) 2015-07-23 2016-02-16 一种单板模块级水冷系统

Country Status (4)

Country Link
US (1) US10212856B2 (zh)
EP (1) EP3328172B1 (zh)
CN (1) CN204887839U (zh)
WO (1) WO2017012336A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204887839U (zh) * 2015-07-23 2015-12-16 中兴通讯股份有限公司 一种单板模块级水冷系统
WO2018184216A1 (en) * 2017-04-07 2018-10-11 Valeo Siemens Eautomotive Shenzhen Co., Ltd A battery charger for use in an electrical or hybrid vehicle
US20190068466A1 (en) * 2017-08-30 2019-02-28 Intel Corporation Technologies for auto-discovery of fault domains
CN110022659B (zh) * 2018-01-09 2021-12-31 中兴通讯股份有限公司 一种通讯设备的液冷漏液的防护方法及装置
CN108055816A (zh) * 2018-01-23 2018-05-18 扬州万方电子技术有限责任公司 一种单元模块化可快速安装的水冷服务器
US10856055B2 (en) * 2019-03-20 2020-12-01 Mellanox Technologies, Ltd. Apparatuses for improved thermal performance of dynamic network connections
JP7148203B2 (ja) * 2019-11-13 2022-10-05 Ｎｅｃプラットフォームズ株式会社 電子機器
CN113645780A (zh) * 2021-06-28 2021-11-12 翟秋菊 一种高功率图像处理装置
CN115016623B (zh) * 2022-08-10 2022-11-25 兰洋(宁波)科技有限公司 一种液冷箱体

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2904296Y (zh) * 2006-03-14 2007-05-23 南宁八菱科技股份有限公司 集成电路水冷装置
DE202007003726U1 (de) * 2007-03-13 2007-06-28 Man Zai Industrial Co., Ltd. Flüssigkeitsgekühlte Wärmesenke
CN201064063Y (zh) * 2007-04-05 2008-05-21 万在工业股份有限公司 视频控制卡的散热装置
CN201197243Y (zh) * 2008-05-27 2009-02-18 华为技术有限公司 单板的插装设备以及电子设备
CN201222836Y (zh) * 2008-03-07 2009-04-15 曜嘉科技股份有限公司 电子装置及其散热模块
CN100568493C (zh) * 2007-04-26 2009-12-09 美商旭扬热传股份有限公司 显示卡的水冷散热模块装置
CN202268795U (zh) * 2011-09-30 2012-06-06 广东明阳龙源电力电子有限公司 一种水冷变频器的水循环散热管
CN203504428U (zh) * 2013-10-17 2014-03-26 广东志成冠军集团有限公司 带有水冷散热装置的逆变模块
CN203708084U (zh) * 2014-01-16 2014-07-09 北京能高自动化技术股份有限公司 一种水冷变流器内循环系统
CN103957681A (zh) * 2014-04-28 2014-07-30 中国船舶重工集团公司第七二三研究所 一种等流体分配的电子设备冷却装置
CN204887839U (zh) * 2015-07-23 2015-12-16 中兴通讯股份有限公司 一种单板模块级水冷系统

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7218523B2 (en) * 2003-09-10 2007-05-15 Qnx Cooling Systems Inc Liquid cooling system
US7012807B2 (en) * 2003-09-30 2006-03-14 International Business Machines Corporation Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack
US20070125523A1 (en) * 2005-12-01 2007-06-07 Bhatti Mohinder S Low profile liquid cooled server heat sink
US8289710B2 (en) * 2006-02-16 2012-10-16 Liebert Corporation Liquid cooling systems for server applications
EP1987309B1 (en) * 2006-02-16 2014-04-16 Cooligy, Inc. Liquid cooling loops for server applications
US20080266798A1 (en) * 2007-04-25 2008-10-30 International Business Machines Corporation System and method for liquid cooling of an electronic system
US8783052B2 (en) * 2010-11-04 2014-07-22 International Business Machines Corporation Coolant-buffered, vapor-compression refrigeration with thermal storage and compressor cycling
CN102711414B (zh) * 2012-04-20 2015-07-08 华为技术有限公司 一种液冷装置
US20140251583A1 (en) * 2013-03-07 2014-09-11 Asetek A/S Leak detection system for a liquid cooling system

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2904296Y (zh) * 2006-03-14 2007-05-23 南宁八菱科技股份有限公司 集成电路水冷装置
DE202007003726U1 (de) * 2007-03-13 2007-06-28 Man Zai Industrial Co., Ltd. Flüssigkeitsgekühlte Wärmesenke
CN201064063Y (zh) * 2007-04-05 2008-05-21 万在工业股份有限公司 视频控制卡的散热装置
CN100568493C (zh) * 2007-04-26 2009-12-09 美商旭扬热传股份有限公司 显示卡的水冷散热模块装置
CN201222836Y (zh) * 2008-03-07 2009-04-15 曜嘉科技股份有限公司 电子装置及其散热模块
CN201197243Y (zh) * 2008-05-27 2009-02-18 华为技术有限公司 单板的插装设备以及电子设备
CN202268795U (zh) * 2011-09-30 2012-06-06 广东明阳龙源电力电子有限公司 一种水冷变频器的水循环散热管
CN203504428U (zh) * 2013-10-17 2014-03-26 广东志成冠军集团有限公司 带有水冷散热装置的逆变模块
CN203708084U (zh) * 2014-01-16 2014-07-09 北京能高自动化技术股份有限公司 一种水冷变流器内循环系统
CN103957681A (zh) * 2014-04-28 2014-07-30 中国船舶重工集团公司第七二三研究所 一种等流体分配的电子设备冷却装置
CN204887839U (zh) * 2015-07-23 2015-12-16 中兴通讯股份有限公司 一种单板模块级水冷系统

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3328172A4 *

Also Published As

Publication number Publication date
CN204887839U (zh) 2015-12-16
US20180228058A1 (en) 2018-08-09
EP3328172A1 (en) 2018-05-30
EP3328172A4 (en) 2018-07-11
EP3328172B1 (en) 2020-04-01
US10212856B2 (en) 2019-02-19

Similar Documents

Publication Publication Date Title
WO2017012336A1 (zh) 一种单板模块级水冷系统
US10225958B1 (en) Liquid cooling system for a data center
US9743561B2 (en) Liquid-cooled heat sink configured to facilitate drainage
RU2500013C1 (ru) Система жидкостного охлаждения для электронных устройств
EP3125657A1 (en) Liquid-cooling heat dissipation server
US9161480B2 (en) Vacuum pumped liquid cooling system for computers
US9483091B2 (en) System, information processing device and rack
US10753236B2 (en) Fuel vaporization using data center waste heat
US9049803B2 (en) Thermal management infrastructure for IT equipment in a cabinet
WO2016127706A1 (zh) 一种散热插箱
CN103930847A (zh) 用于冷却数据中心中的电子元件的装置
CN111197580A (zh) 用于服务器的微型轴流泵
CN114080716A (zh) 一种散热系统、电池模组及供配电系统
US11589482B2 (en) Cooling module with serial fluid management
TWI761710B (zh) 用於伺服器機櫃內之液體冷卻分配裝置
WO2020186859A1 (zh) 抽屉式cdu
KR100872188B1 (ko) 액체 냉각 장치, 블레이드 컴퓨터 및 액체 냉각 방법
US20230320040A1 (en) Cooling apparatus for server
US11690201B2 (en) Server architecture for hybrid system integration and interface management
CN111488044B (zh) 一种基于vpx架构的散热服务器
WO2023103840A1 (zh) 一种设备节点及液冷机柜

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16827028

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 15746569

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2016827028

Country of ref document: EP