WO2023103840A1 - 一种设备节点及液冷机柜 - Google Patents

一种设备节点及液冷机柜 Download PDF

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Publication number
WO2023103840A1
WO2023103840A1 PCT/CN2022/135017 CN2022135017W WO2023103840A1 WO 2023103840 A1 WO2023103840 A1 WO 2023103840A1 CN 2022135017 W CN2022135017 W CN 2022135017W WO 2023103840 A1 WO2023103840 A1 WO 2023103840A1
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WO
WIPO (PCT)
Prior art keywords
liquid
cooling
cooled
outlet
inlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/135017
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English (en)
French (fr)
Inventor
贾晖
夏高亮
李定方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to EP22903262.8A priority Critical patent/EP4432794A4/en
Publication of WO2023103840A1 publication Critical patent/WO2023103840A1/zh
Priority to US18/735,565 priority patent/US20240324146A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the present application relates to the technical field of video surveillance, in particular to a device node and a liquid-cooled cabinet.
  • liquid cooling can be used for heat dissipation.
  • liquid-cooled cabinets usually use immersion heat dissipation or spray heat dissipation to dissipate heat from equipment nodes.
  • Immersion heat dissipation has high requirements on the withstand voltage capacity of equipment, which will increase the difficulty of structural design; The flow of the chip position is limited, and the heat dissipation capacity is insufficient.
  • the present application provides a device node and a liquid-cooled cabinet, which are used to improve the liquid-cooled heat dissipation capability of the device node and meet the heat dissipation requirements of servers.
  • the present application provides a device node, which includes a housing, a circuit board, and a heat dissipation component; the housing has a cavity, and a cooling liquid inlet and a liquid return outlet are arranged on the housing; the circuit board and the heat dissipation In the casing, at least one main chip is arranged on the circuit board.
  • the main chip generates more heat when it is working, while other devices on the circuit board generate less heat than the main chip, so the heat dissipation components use different heat dissipation structures to dissipate heat from the main chip and the circuit board; specifically,
  • the heat dissipation assembly includes a spray plate and at least one liquid-cooled cold plate, the at least one liquid-cooled cold plate is in one-to-one correspondence with the at least one main chip, and each liquid-cooled cold plate is in contact with the corresponding main chip to liquid-cool the corresponding main chip. Cooling and heat dissipation; each liquid-cooled cold plate is used to form a liquid-cooled channel, and the liquid-cooled channel of the at least one liquid-cooled cold plate is connected to form a liquid-cooled network.
  • the spray plate has a spray channel connected with the outlet of the liquid cooling network and connected with the spray channel A plurality of connected liquid spray holes, the liquid outlet end of each liquid spray hole faces the circuit board, the coolant enters the spray channel from the liquid cooling channel and sprays onto the circuit through the liquid spray hole, which can spray other components on the circuit board shower to cool off.
  • the heat dissipation component corresponding to the device node can perform single-point heat dissipation on at least one main chip, and can also spray heat dissipation on other devices on the circuit board except the main chip, thereby improving the single-point heat dissipation capability of liquid cooling. Meet the heat dissipation requirements of current electronic equipment.
  • the liquid return outlet is arranged at the lowest position in the inner space of the housing, and the cooling liquid in the inner cavity of the housing can accumulate to the side of the liquid return outlet under the action of gravity and flow out from the liquid return outlet.
  • the surface of the spray plate facing the circuit board includes a first area and a second area, the first area and the second area do not overlap, the first area corresponds to the above-mentioned at least one main chip, and the liquid spray hole is specifically located in the second area , so that the orthographic projection of the at least one main chip on the spray plate does not overlap with the position of the spray hole, the coolant in the spray plate does not need to be sprayed onto the main chip, saving flow.
  • the coolant When the coolant is injected into the equipment node, the coolant will fall into the shell after passing through the liquid-cooled cold plate and the spray plate. Most components on the circuit board can be submerged for liquid cooling and heat dissipation, and at the same time, it can save coolant.
  • the liquid-cooling channels of the at least one liquid-cooled cold plate may be connected to form a liquid-cooling network, and the connection manner may adopt a series and/or parallel structure.
  • the structure of the liquid-cooled cold plate may have multiple implementations.
  • the liquid-cooled cold plate includes a plate shell fixed to the main chip, and the plate shell has a hollow cavity to form the above-mentioned liquid cooling channel.
  • the liquid-cooled cold plate includes a plate body fixed to the circuit board, and the above-mentioned liquid cooling channel is formed between the plate body and the circuit board; wherein, the liquid cooling channel includes a first liquid cooling chamber communicated with the cold liquid inlet and a spray channel A connected second liquid cooling chamber, the main chip is located in the second liquid cooling chamber; a jet plate is arranged between the first liquid cooling chamber and the second liquid cooling chamber, and the jet plate has a function of connecting the first liquid cooling chamber and the second liquid cooling chamber The jet hole of the cold cavity is used for spraying the cooling liquid in the first liquid cooling cavity to the main chip.
  • the present application provides a liquid-cooled cabinet
  • the liquid-cooled cabinet may include a cabinet body, a circulating liquid cooling system, and at least one of the aforementioned device nodes.
  • the at least one device node can be inserted into the cabinet along the vertical direction of the cabinet body, the circulating liquid cooling system can communicate with the cold liquid inlet of each device node through the liquid supply pipeline, and the circulating liquid cooling system can communicate with the cooling liquid inlet of each device node through the liquid return pipeline.
  • the liquid return outlet of each equipment node is airtight and connected, and the top of the liquid return pipeline is also provided with an air inlet connected to the atmosphere, so that the return liquid pipeline maintains a normal pressure state, so that the coolant in each equipment node can flow in Return line.
  • the circulating liquid cooling system specifically includes a liquid storage tank and a heat exchange unit.
  • the liquid storage tank is arranged in the cabinet and located at the bottom of the cabinet, and the heat exchange unit is integrated at the back of the cabinet, so that the liquid storage tank, heat exchange unit and the cabinet Integrated integration ensures that the volume of the liquid-cooled cabinet meets the design requirements.
  • the liquid storage tank has a liquid return inlet and a cold liquid outlet, the liquid return inlet is connected to the liquid return pipeline, the cold liquid outlet is connected to the liquid supply pipeline, and the heat exchange unit is connected between the cold liquid outlet and the liquid supply pipeline to Cool down the coolant in the liquid supply line.
  • the heat exchange unit includes a control board, a heat exchanger, and a circulating pump group, and the control board is connected to the circulating pump group for signals; the liquid inlet of the heat exchanger is connected to the liquid return outlet, and the liquid outlet of the heat exchanger is connected to the supply
  • the liquid pipeline is connected, and the heat exchanger is connected with the external cooling water source.
  • the external cooling water source enters the heat exchanger, exchanges heat with the cooling liquid in the heat exchanger, and removes the heat of the cooling liquid to achieve cooling of the cooling liquid.
  • the circulating pump group is arranged between the liquid return outlet and the liquid inlet, and is used to pump the cooling liquid in the liquid storage tank into the liquid supply pipeline.
  • the control board can control the work of the circulating pump group.
  • the liquid storage tank has a separated liquid storage chamber and a working chamber. Both the return liquid inlet and the cooling liquid outlet are connected to the working chamber.
  • the working chamber is equivalent to participating in the working process of the circulating liquid cooling system; Liquid channel, when the cooling liquid in the working chamber is too much, it can enter the liquid storage chamber through the liquid passage for storage. When the cooling liquid in the working chamber is too small and not enough for the liquid cooling cycle, the cooling liquid in the liquid storage chamber can be replenished into the working chamber.
  • a partition is arranged in the liquid storage tank, and the partition divides the liquid storage tank into a liquid storage chamber and a working chamber, and there is a gap between the top of the partition and the inner wall of the liquid storage tank to form a liquid channel, when there is too much coolant in the working chamber, the coolant will overflow from the top of the partition to the liquid storage chamber; the liquid storage chamber and the working chamber are connected through a replenishment pipe, when the cooling liquid in the working chamber is insufficient, the liquid storage chamber The coolant can flow into the working chamber through the replenishment pipe.
  • a liquid replenishment pump for driving the cooling liquid from the liquid storage chamber to the working chamber is arranged on the liquid replenishment pipeline, and the liquid replenishment pump is connected to the control board in the heat exchange unit by signal.
  • a first liquid level sensor is arranged in the liquid storage chamber, and the first liquid level sensor has an alarm; when the liquid level of the cooling liquid in the liquid storage chamber is lower than the set liquid level, The first liquid level sensor triggers an alarm to notify the staff to replenish cooling liquid in the liquid storage tank in time.
  • a second liquid level sensor is arranged in the working chamber, and the second liquid level sensor is connected to the control board of the heat exchange unit for signal connection, and the control board receives the liquid level monitored by the second liquid level sensor.
  • the replenishment pump is controlled to pump the coolant in the liquid storage chamber to the working chamber, so that the liquid level of the coolant in the working chamber returns to the normal working liquid level.
  • At least one liquid supply port is formed on the liquid supply pipeline, and each liquid supply port is used to connect to the cooling liquid inlet of a device node, and the gap between the liquid supply port and the cooling liquid inlet It is connected by a quick connector to facilitate the plugging and unplugging of the device nodes.
  • At least one liquid return port is formed on the liquid return pipeline, and each liquid return port is used for correspondingly connecting the liquid return outlet of a device node; in a group of corresponding liquid return ports and liquid return outlets, the liquid return port
  • the inner diameter of the liquid return outlet is larger than the outer diameter of the liquid return outlet so that the liquid return outlet can be inserted into the liquid return port; the liquid return port is provided with an elastic anti-reflux member.
  • the anti-reflux member When the liquid return outlet is separated from the liquid return port, the anti-reflux member will radially block the liquid return port; it can provide a certain period of time for the cooling liquid in the equipment node to return to the liquid return line, and wait for the equipment node to separate from the liquid supply port and place it After a period of time, the coolant in the equipment node completely flows into the liquid return pipeline, and then the equipment node is completely pulled out for maintenance.
  • the anti-backflow component can be made of elastic material (such as rubber) to meet the requirements of radial sealing and multiple insertion and extraction.
  • the shell has opposite first and second ends, and the liquid return outlet is arranged at the second end, and the level of the first end is adjusted to be higher than the level of the second end, which is beneficial to the cooling in the device node
  • the liquid flows out.
  • the cabinet body can be adjusted so that the equipment nodes can produce the above-mentioned inclination effect with the change of the cabinet body structure; the first leg corresponding to the first end and the second leg corresponding to the second end can be set at the bottom of the cabinet body , set the height of the first leg to be greater than the height of the second leg.
  • FIG. 1 is a schematic structural diagram of a device node provided in an embodiment of the present application.
  • Figure 2a to Figure 2d are schematic diagrams of the internal structure of a device node provided by the embodiment of the present application.
  • Figure 3a and Figure 3b are schematic cross-sectional structural diagrams of a liquid-cooled cold plate in a device node provided by an embodiment of the present application;
  • Fig. 3c is a schematic structural diagram of a sprinkler plate in a device node provided by an embodiment of the present application.
  • FIG. 4a is a schematic structural diagram of a liquid-cooled cabinet provided in an embodiment of the present application.
  • FIG. 4b is a schematic diagram of the internal structure of a cabinet in a liquid-cooled cabinet provided in an embodiment of the present application;
  • FIG. 5 is a schematic structural diagram of a liquid storage tank in a liquid-cooled cabinet provided in an embodiment of the present application
  • FIG. 6 is a schematic structural diagram of the cooperation between a liquid storage tank and a heat exchange unit in a liquid-cooled cabinet provided in an embodiment of the present application;
  • FIG. 7 is a schematic diagram of the internal structure of a liquid-cooled cabinet provided in an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a device node in a liquid-cooled cabinet provided by an embodiment of the present application, which is arranged obliquely relative to the cabinet;
  • Fig. 9 is a schematic structural diagram of a liquid-cooled cabinet provided by an embodiment of the present application, where the cabinet body is inclined relative to the horizontal plane;
  • Fig. 10a and Fig. 10b are structural schematic diagrams of the connection between the equipment nodes and the liquid supply pipeline and the liquid return pipeline in a liquid-cooled cabinet provided by the embodiment of the present application;
  • Fig. 11 is a schematic structural diagram of a quick connector used between the cold liquid inlet of the equipment node in the liquid-cooled cabinet and the liquid supply port of the liquid supply pipeline provided by the embodiment of the present application;
  • Figure 12a and Figure 12b are schematic diagrams of the connection structure between the liquid return outlet of the equipment node and the liquid return port of the liquid return line in a liquid-cooled cabinet provided by the embodiment of the present application;
  • Fig. 13a and Fig. 13b are structural schematic diagrams of anti-reflux components on a liquid return port in a liquid-cooled cabinet provided by an embodiment of the present application;
  • FIG. 14 is a schematic structural diagram of the connection between a device node and a cabinet in a liquid-cooled cabinet provided in an embodiment of the present application;
  • Fig. 15a is a schematic structural diagram of a device node in a liquid-cooled cabinet before it is installed in the cabinet according to an embodiment of the present application;
  • Fig. 15b is a schematic structural diagram of installing a device node in a liquid-cooled cabinet provided in an embodiment of the present application to the cabinet.
  • the liquid-cooled cabinet can dissipate heat from electronic equipment in a liquid-cooled manner, and current liquid-cooled cabinets may dissipate heat from device nodes of electronic equipment in a manner of immersion or spraying.
  • Immersion heat dissipation has higher requirements on the withstand voltage capability of the device, which will increase the difficulty of structural design; while in the spray heat dissipation method, the flow rate at the main chip position on the device node is limited, and the heat dissipation capacity is insufficient.
  • an embodiment of the present application provides a device node and a liquid-cooled cabinet to solve the above problems.
  • the application will be further described in detail below in conjunction with the accompanying drawings.
  • references to "one embodiment” or “some embodiments” or the like in this specification means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application.
  • appearances of the phrases “in one embodiment,” “in some embodiments,” “in other embodiments,” “in other embodiments,” etc. in various places in this specification are not necessarily All refer to the same embodiment, but mean “one or more but not all embodiments” unless specifically stated otherwise.
  • the terms “including”, “comprising”, “having” and variations thereof mean “including but not limited to”, unless specifically stated otherwise.
  • a device node 1 provided by the embodiment itself, the device node 1 includes a casing 11, the casing 11 has a cavity, and the casing 11 is provided with a cooling liquid inlet a for the cooling liquid to flow in and a cooling liquid for the cooling liquid Out of the liquid return outlet b, the external insulating cooling liquid can enter the equipment casing 11 from the cooling liquid inlet a, and the cooling liquid in the casing 11 can flow out through the liquid return outlet b.
  • the housing 11 has opposite first ends and second ends along a first direction, and the first direction is set as X.
  • the thickness direction of the housing 11 is set as the third direction Y, and the direction perpendicular to the first direction X and the third direction Z is set as the second direction Y. Both the cold liquid inlet a and the liquid return outlet b of the housing 11 are located at the second end.
  • the device node 1 also includes a circuit board 12 and a heat dissipation assembly 13.
  • the heat dissipation assembly 13 provides installation space and bearing support.
  • the circuit board 12 is relatively located at the bottom of the casing 11, and the bottom here is a relative position, referring to the bottom in the state shown in FIG. 2a.
  • the circuit board 12 is provided with at least one main chip 121, the main chip 121 has higher power consumption, and can generate higher heat, the main chip 121 can be defined as the first type of device; the circuit board 12 is also set theoretically There are other devices that consume less power and generate less heat, which can be defined as Class 2 devices.
  • the heat dissipation assembly 13 provided in the embodiment of the present application adopts different heat dissipation methods.
  • the heat dissipation assembly 13 includes a shower plate 132 and at least one liquid-cooled cold plate 131, the at least one liquid-cooled cold plate 131 corresponds to the above-mentioned at least one main chip 121, and each liquid-cooled cold plate 131 is used for corresponding contact
  • a main chip 121 is used for liquid cooling and heat dissipation of the main chip 121 .
  • Each liquid-cooled cold plate 131 can be used to form a liquid-cooled channel T1 for cooling liquid to pass through.
  • each main chip 121 corresponds to a liquid-cooled cold plate 131.
  • 131 flows through the liquid cooling channel T1 corresponding to each main chip 121 for targeted liquid cooling and heat dissipation.
  • liquid-cooled cold plate 131 there is at least one liquid-cooled cold plate 131, and the liquid-cooled channel T1 corresponding to all the liquid-cooled cold plates 131 can form a liquid-cooled network, the liquid-cooled network has an inlet and an outlet, and the cooling liquid enters from the inlet of the liquid-cooled network
  • the cooling liquid will flow into the liquid cooling channel T1 of each liquid cooling cold plate 131 , and the cooling liquid flowing out from the corresponding liquid cooling channel T1 of each liquid cooling cold plate 131 will flow out from the outlet of the liquid cooling network.
  • the inlet of the liquid cooling network can be directly connected with the above-mentioned cooling liquid inlet a, so that the cooling liquid can directly enter each liquid cooling channel T1 in the liquid cooling network from the cooling liquid inlet a to perform liquid cooling and heat dissipation on each main chip 121 .
  • the spray plate 132 has a spray channel T2 and a plurality of spray holes c communicating with the spray channel T2, and the liquid outlet end of each spray hole c faces the above-mentioned circuit board 12; wherein, the entrance of the spray channel T2 is connected to the above-mentioned
  • the outlet of the liquid cooling network is directly connected, and the cooling liquid enters the spray channel T2 to spray and dissipate heat to other structures on the circuit board 12 after completing the liquid cooling and heat dissipation of the main chip 121 .
  • the spray plate 132 is specifically located on the top of the housing 1 , so that the cooling liquid in the spray channel T2 can be sprayed onto the circuit board 12 through the liquid spray hole c under the action of gravity.
  • the liquid-cooled cold plates 131 can be arranged in series (as shown in FIG. 2 a ), that is, the corresponding liquid-cooled cold plates 131
  • the cold channel T1 is connected from end to end in turn, wherein the entrance of the liquid cooling channel T1 at the head end is equivalent to the entrance of the liquid cooling network, the entrance of the liquid cooling channel T1 is directly connected with the cold liquid inlet a, and the outlet of the liquid cooling channel T1 at the rear end Equivalent to the outlet of the liquid cooling network, the outlet of the liquid cooling channel T1 is directly connected to the inlet of the spray channel T2, and the cooling liquid entering from the inlet of the liquid cooling network is equivalent to entering each liquid cooling channel T1 successively to successively control each main chip 121 for liquid cooling.
  • the liquid-cooled cold plates 131 can also be arranged in parallel (as shown in FIG. 2b ), that is, the inlets of the liquid-cooled channel T1 corresponding to each liquid-cooled cold plate 131 are collected into one inlet, which is equivalent to a liquid-cooled
  • the inlet of the network is directly connected with the cold liquid inlet a, and the collection of the liquid cooling channel T1 corresponding to each liquid cooling cold plate 131 is an outlet, which is equivalent to the outlet of the liquid cooling network and is directly connected to the inlet of the spray channel T2.
  • each liquid cooling channel T1 is equivalent to being arranged in parallel, and the cooling liquid entering from the entrance of the liquid cooling network is equivalent to entering each liquid cooling channel T1 in multiple channels to perform liquid cooling and heat dissipation on each main chip 121 at the same time.
  • the number of liquid-cooled cold plates 131 is more than one (shown here as three)
  • the liquid-cooled cold plates 131 can be arranged in a series-parallel mixed form, that is, two liquid-cooled cold plates 131 are connected in parallel, and the two liquid-cooled cold plates 131 are connected in parallel.
  • the liquid-cooled cold plate 131 connected in series is connected in series with another liquid-cooled cold plate 131 (as shown in FIG.
  • the cold plates 131 are connected in parallel (as shown in Figure 2d); of course, when the number of liquid-cooled cold plates 131 is more than three, the liquid-cooled network formed by the liquid-cooled channel T1 of each liquid-cooled cold plate 131 may also have more The connection mode is deformed, and no more examples are given here.
  • liquid cooling channels T1 of adjacent liquid cooling cold plates 131 and the liquid cooling channel T1 and the spraying channel T2 can be connected through the hose 14 .
  • the cooling liquid entering the housing 11 through the cooling liquid inlet a first enters the liquid cooling channel T1 of each liquid cooling cold plate 131 (it may be the series method as shown in Fig. 2a, or it may be as shown in Fig. 2b Parallel connection mode), the first type of device (such as the main chip 121) is liquid-cooled and radiated; then it enters the spray channel of the spray plate 132, and is sprayed onto the circuit board 12 through the liquid spray hole c, which can heat the circuit board The second type of device on the 12 is sprayed to dissipate heat. After the cooling liquid sprays the second type of devices on the circuit board 12, it will fall into the housing 11 and be discharged through the liquid return outlet b.
  • the liquid return outlet b can be set at a relatively low position of the casing 11, specifically, the liquid return outlet b can be set at the lowest position of the casing 11, where the lowest position Refers to the horizontal plane where the lowest position of the space occupied by the inner cavity formed by the shell 11 is located.
  • the liquid return outlet b is set at the second end, and the fixed state of the casing 11 is adjusted so that the horizontal plane where the first end is located is higher than the horizontal plane where the second end is located, then the casing 11
  • the cooling liquid inside can accumulate from the first end to the second end under the action of gravity, so that the cooling liquid can be discharged from the liquid return outlet b.
  • the specific structure of the liquid-cooled cold plate 131 shown in Fig. 2a to Fig. 2d can refer to that shown in Fig. 3a, it comprises a plate shell 1311, and plate shell 1311 is shell structure, has a cavity, and this cavity can form above-mentioned liquid
  • the cold channel T1 ; the plate shell 1311 can be directly fixed on the main chip 121 by bonding or other means, and the heat exchange between the cooling liquid and the main chip 121 is realized through the plate shell 1311 .
  • the liquid inlet nozzle d1 and the liquid outlet nozzle d2 can be installed on the plate shell 1311.
  • the positions and shapes of the liquid inlet nozzle d1 and the liquid outlet nozzle d2 are not limited, and the liquid inlet nozzle d1 is used for cooling
  • the liquid enters the cavity of the plate shell 1311, and the liquid outlet d2 is used for the cooling liquid in the cavity of the plate shell 1311 to flow out.
  • the cavity of the plate shell 1311 should be filled with cooling liquid, so as to fully exchange heat and cold with the main chip 121 and realize liquid cooling and heat dissipation for the main chip 121 .
  • the structure of the liquid-cooled cold plate 131 can be shown in FIG. Liquid cooling channel T1; the plate body 1312 is provided with a liquid inlet nozzle e1 and a liquid outlet nozzle e2; specifically, the liquid cooling channel T1 includes a first liquid cooling chamber T11 communicated with the liquid inlet nozzle e1 and a first liquid cooling chamber T11 communicated with the liquid outlet nozzle e2
  • the second liquid cooling chamber T12, the above-mentioned main chip 121 is located in the second liquid cooling chamber T12, when the second liquid cooling chamber T12 is filled with cooling liquid, it is equivalent to the main chip 121 being immersed in the cooling liquid;
  • the first liquid cooling chamber T11 A jet plate 1313 is provided between the second liquid cooling chamber T12, and the jet plate 1313 has a jet hole w connecting the first liquid cooling chamber T11 and the second liquid cooling chamber T12, and the jet hole w is used to connect the first liquid cooling chamber
  • the cooling liquid in the T11 is sprayed toward the main chip
  • the liquid-cooled cold plate 131 directly contacts the main chip 121 through the cooling liquid to liquid-cool and dissipate the main chip 121, and the liquid-cooled channel T1 is formed through the cooperation of the board body 1312 and the circuit board 12.
  • the “fitting” in refers to being fixed together by structural design to form the above-mentioned liquid cooling channel T1.
  • Figure 3c shows the surface of the shower plate 132 facing the circuit board 12, the surface of the shower plate 132 facing the circuit board 12 is at least divided into a first area V1 and a second area V2, the first area V1 and the second area V2 have no Overlapping, the first area V1 corresponds to all the above-mentioned main chips 121, the above-mentioned shower holes c are arranged in the second area V2, and the orthographic projection of each main chip 121 on the shower plate 132 (to be perpendicular to the shower plate 132 projected onto the spray plate 132) does not overlap with the position of the spray hole c, the coolant in the spray plate 132 is mainly used to spray other devices on the circuit board 12 except the main chip 121 This setting method is beneficial to save the flow of coolant.
  • the shape and distribution direction of the plurality of spray holes c are not limited, and FIG. 3 c is only an example.
  • the cooling liquid when the cooling liquid is passed into the equipment node 1, the cooling liquid falls into the casing 11 after passing through the liquid-cooled cold plate 131 and the spray plate 132, and the liquid level of the cooling liquid in the casing 11 needs to be higher than that of the circuit board 12
  • the highest part of the surface is 1-3mm, so that the coolant can immerse most of the devices on the circuit board 12 for liquid cooling and heat dissipation, and at the same time, the coolant can also be saved.
  • the device node 1 provided in the embodiment of the present application is correspondingly equipped with a heat dissipation component 13, and the liquid-cooled cold plate 131 in the heat dissipation component 13 can provide high power consumption and high heat for the main chip 121 in the device node 1.
  • the device performs targeted liquid cooling and heat dissipation, and the spray plate 132 can spray and dissipate other devices on the circuit board 12 with low power consumption and low heat dissipation, so as to realize liquid cooling and heat dissipation while improving the single-point heat dissipation capability, which can Meet the heat dissipation requirements of current electronic equipment.
  • the embodiment of the present application also provides a liquid-cooled cabinet.
  • the structure of the liquid-cooled cabinet can be shown in FIG.
  • Device node 1 is equivalent to any smallest unit that can be plugged and unplugged in a liquid-cooled cabinet, and cabinet body 2 is used to carry device nodes.
  • the liquid-cooled cabinet also includes a circulating liquid cooling system that circulates cooling liquid for the equipment node 1 , and the circulating liquid cooling system specifically includes a liquid storage tank 31 and a heat exchange unit 32 .
  • the liquid storage tank 31 is used to store cooling liquid. On the one hand, it provides cooling liquid to each equipment node 1, and on the other hand, it recovers the cooling liquid flowing out of the equipment node 1; the liquid storage tank 31 is arranged in the cabinet 2 and is located at the bottom of the cabinet 2 It is convenient for the cooling liquid flowing out of the equipment node 1 to flow into the liquid storage tank 31 under the action of gravity.
  • the heat exchange unit 32 is integrated at the back of the cabinet body 2, and the heat exchange unit 32 is used to cool the cooling liquid delivered to the equipment node 2, and reduce the temperature of the cooling liquid, so as to perform good cooling and heat dissipation on the equipment node 1; wherein, The rear is based on the liquid-cooled cabinet facing the operating surface of the staff. If the operating surface of the liquid-cooled cabinet is set as the front, the other side corresponding to the front is the rear. Please refer to Fig. 4a, define the front end and rear end of the cabinet body 2, the heat exchange unit 32 can be arranged at the rear door of the cabinet body 2, without increasing the size of the liquid-cooled cabinet, and meeting the size requirements of the standard cabinet.
  • the liquid storage tank 31, the heat exchange unit 32 and the cabinet body 2 can be integrated together, and a base 4 is provided at the bottom of the overall structure of the cabinet body 2 and the heat exchange unit 32 to facilitate the overall structure placement of the liquid cooling cabinet and move.
  • the structure of the cabinet 2 can be shown in Figure 4b.
  • Multiple installation stations s can be set in the cabinet 2, and each installation station s has a chute, which can be inserted into one of the above-mentioned device nodes 1.
  • Each device node 1 It can be inserted into the installation station s and connected with the cabinet body 2 through various connectors in the cabinet body 2.
  • the connections here include electricity, signals and cooling liquid.
  • the arrangement of the equipment nodes 1 in the cabinet body 2 there is no limitation.
  • FIG. 4 a and FIG. 4 b multiple equipment nodes 1 are arranged in sequence along the height direction of the cabinet body 2 . Wherein, each device node 2 has a certain height, but the distance between adjacent device nodes 2 may not be limited.
  • the circulating liquid cooling system communicates with the cooling liquid inlet a of each equipment node 1 through the liquid supply pipeline 51, so as to provide cooling liquid to the cooling assembly 13 in the equipment node 1; at the same time, the circulating liquid cooling system communicates with the cooling liquid inlet a through the liquid return pipeline 52.
  • the liquid return outlet b of each equipment node 1 is airtightly connected to recover the cooling liquid in the equipment node 1 .
  • Both the liquid supply pipeline 51 and the liquid return pipeline 52 are arranged in the cabinet body 2 .
  • the structure of the liquid storage tank 31 can refer to Figure 5.
  • the liquid storage tank 31 is a shell structure, which has an inner cavity that can hold the cooling liquid, and has a liquid return inlet g and a cold liquid outlet h.
  • the liquid return inlet g is specifically located in the storage liquid
  • the top position of the tank 31 is convenient for the coolant flowing out of the equipment node 2 to enter the liquid storage tank 31 from the liquid return inlet g. Combining the positional structure of the liquid storage tank 31 and the heat exchange unit 32 shown in FIG.
  • the cooling liquid enters the heat exchange unit 32 from the cooling liquid outlet h.
  • FIG. 7 a simplified schematic diagram of the internal structure of the liquid-cooled cabinet, two device nodes 1 are installed in the cabinet body 2 as an example, and the two device nodes 1 are vertically stacked in the cabinet body 2 .
  • the circulating liquid cooling system communicates with the cooling liquid inlet a of each equipment node 1 through the liquid supply pipeline 51, so as to provide cooling liquid to the cooling assembly 13 in the equipment node 1; at the same time, the circulating liquid cooling system communicates with the cooling liquid inlet a through the liquid return pipeline 52.
  • the liquid return outlet b of each equipment node 1 is airtightly connected to recover the cooling liquid in the equipment node 1 .
  • the liquid return inlet g of the liquid tank 31 enters the liquid storage tank 31 without an additional power source, saving costs.
  • a liquid injection port i is provided on the top of the liquid storage tank 31 , and when the cooling liquid inside the liquid storage tank 31 is insufficient, cooling liquid is added to the liquid storage tank 31 through the liquid injection port i.
  • the heat exchange unit 32 specifically includes a heat exchanger 321 and a circulating pump group 322, the liquid inlet of the heat exchanger 321 communicates with the cold liquid outlet h of the liquid storage tank 31, and the circulating pump group 322 is arranged at the cold liquid outlet of the liquid storage tank 31 Between h and the liquid inlet of the heat exchanger, specifically, it can be arranged at the outlet h of the cooling liquid to provide power for the flow of the cooling liquid.
  • the liquid outlet of the heat exchanger 321 communicates with the above-mentioned liquid supply pipeline 51, and the circulating pump group 322 pumps the coolant in the liquid storage tank 31 into the heat exchanger 321, and the heat exchanger 321 communicates with an external cooling water source, and the external cooling
  • the water source flows through the heat exchanger 321, exchanges heat with the cooling liquid in the heat exchanger 321, and takes away the heat of the cooling liquid to reduce the temperature of the cooling liquid.
  • the pipe 33 may be used to communicate between the heat exchanger 321 and the liquid supply pipeline 51 , and between the heat exchanger 321 and the liquid storage tank 31 .
  • the heat exchange unit 32 also includes a control board 323 , which can be arranged on the inner wall of the heat exchange unit 32 .
  • the control board 323 is connected to the above-mentioned circulating pump group 322 by signal, and can control the circulating pump group 322 .
  • the control board 323 can specifically be a single-chip microcomputer, and an operation panel connected to the control board 323 can be provided outside the heat exchange unit 32, so as to facilitate the staff to perform control operations.
  • the circulation pump group 322 is set in the form of N+1, that is, there are N main circulation pumps and one backup pump.
  • the backup pump can be started to ensure normal liquid cooling circulation operation.
  • the circulating pump unit 322 is connected to the cold liquid outlet h of the liquid storage tank 31 through a ball valve 6, and the ball valve 6 can be directly shut off when the circulating pump unit 322 fails, and the circulating pump unit 322 can be disassembled for maintenance and overhaul.
  • the liquid storage tank 31 is a box structure, specifically, a liquid storage chamber M and a working chamber N distributed in the horizontal direction are formed in the box structure, the liquid storage chamber M and the working chamber N are separated and liquid conduction can be realized at the same time.
  • the working chamber N communicates with the above-mentioned liquid supply pipeline 51, the cooling liquid in the working chamber N can be delivered to the liquid supply pipeline 51, the return liquid inlet g, the cold liquid outlet h and the liquid injection port i on the liquid storage tank 31 They are all connected to the working chamber N; the liquid return inlet g is located on the top of the working chamber N, so that the cooling liquid in the liquid return pipeline 52 can fall into the working chamber N directly.
  • the working chamber N directly participates in the liquid supply and liquid return operation of the liquid cooling circulation system, and the liquid storage chamber M is used to provide storage and replenishment functions for the working chamber N.
  • the function of liquid storage is that when the amount of cooling liquid in the working chamber N is large enough to exceed the set maximum threshold, the cooling liquid in the working chamber N can flow into the liquid storage chamber M for storage; the function of replenishing liquid is that when the working The amount of cooling liquid in the chamber N is too small to be lower than the set minimum threshold, and the cooling liquid stored in the liquid storage chamber M can supplement the amount of liquid for the working chamber N.
  • the maximum threshold and the minimum threshold are defined as, the cooling liquid in the working chamber N can ensure that the liquid cooling cycle system realizes the normal liquid cooling cycle is not greater than the maximum threshold and not less than the minimum threshold.
  • the normal working liquid level of the coolant in the working chamber N is set to the operating liquid level L0
  • the maximum threshold of the coolant corresponds to the liquid storage level L1
  • the minimum threshold of the coolant corresponds to the replenishment liquid level L2; in the liquid cooling cycle system
  • the operating liquid level L0 needs to be greater than the replenishment liquid level L2 and smaller than the storage liquid level L1; of course, the operating liquid level L0 can be dynamically changed during the operation of the liquid cooling cycle system.
  • the sum of the capacities of the liquid storage chamber M and the working chamber N is set to at least accommodate the cooling liquid returned by all equipment nodes 1 .
  • the cooling liquid of the liquid cooling circulation system will evaporate and lose to a certain extent during the working process, and a certain amount of cooling liquid may also be lost during the maintenance of the equipment node 1.
  • the liquid storage chamber M needs to store coolant not lower than the set threshold liquid volume to prepare for the possible replenishment needs of the working chamber N, so as to prevent the shortage of coolant liquid volume in the liquid cooling circulation system.
  • the set threshold liquid volume corresponds to the safe liquid level L3.
  • a first liquid level sensor 314 is arranged in the liquid storage chamber M, and the first liquid level sensor 314 is provided with an alarm. If the liquid level is lower than the above-mentioned safe liquid level L3, the first liquid level sensor 314 triggers an alarm to remind the staff to add liquid to the liquid storage tank 31 through the liquid injection port i.
  • a partition 311 is provided in the liquid storage tank 31 , the partition 311 is arranged along the vertical direction, and the partition 311 can divide the interior of the liquid storage tank 31 into a liquid storage chamber M and a working chamber N distributed in the horizontal direction.
  • the gap q is equivalent to the above-mentioned liquid passage, and the cooling liquid in the liquid storage chamber M and the cooling liquid in the working chamber N can realize liquid through the gap q. circulation and exchange.
  • the lowest point of the gap q can correspond to the cooling when the liquid in the working chamber N reaches the maximum threshold.
  • the storage liquid level L1 of the liquid when the cooling liquid level in the working chamber N is higher than the liquid storage level L1, the cooling liquid in the working chamber N can overflow from the working chamber N, and the top of the partition 311 and the inner wall of the liquid storage tank 31 The gap q between them can be used for the circulation of the overflowing coolant without using additional power support.
  • the cooling liquid in the liquid storage chamber M is replenished to the working chamber N, and power support is required.
  • a liquid replenishment pipeline 312 can be arranged between the liquid storage chamber M and the working chamber N, and the liquid replenishment pipeline 312 can be provided to drive the cooling liquid.
  • the replenishment pump 313 that transfers from low potential energy to high potential energy, of course, the replenishment pump 313 can also be controlled by the control board 323 of the heat exchange unit 32 .
  • a second liquid level sensor 315 is arranged in the working chamber N, and the second liquid level sensor 315 is connected to the above-mentioned control board 323 for signal, and the control board 323 receives the second liquid level sensor 315 monitors the liquid level information and controls the replenishment pump 313 according to the liquid level information to pump the coolant in the liquid storage chamber M to the working chamber N through the replenishment pipeline 312, so that the liquid level of the coolant in the working chamber N returns to normal operation liquid level.
  • the main circulation pump of the circulation pump group 322 is a centrifugal pump.
  • the circulating pump group 322 communicates with the working chamber N through a ball valve, and the working liquid level L0 of the coolant in the working chamber N needs to be higher than that of the pump body of the main circulating pump to ensure that the rotor chamber of the main circulating pump is always in the coolant liquid of the working chamber N. below the surface to prevent air from entering the rotor cavity of the main circulation pump.
  • At least one device node 1 is provided along the vertical direction of the cabinet body 2 (two device nodes 1 are used as an example in the figure), and each device node 1 is arranged along the vertical direction of the cabinet body 2.
  • the stacking arrangement in the vertical direction in order to facilitate the export of the coolant in each equipment node 1 to the return pipeline 52, the equipment node 1 can be arranged obliquely, so that the coolant in the equipment node 1 can flow from the first end to the second end under the action of gravity The two ends then flow into the return pipeline 52 through the liquid return outlet b.
  • the casing 11 of the device node 1 is a regular shell structure, and the bottom of the casing 11 is a bottom surface with uniform thickness, and the device node 1 or the cabinet body 2 can be adjusted so that The horizontal height of the first end of the device node 1 is higher than the horizontal height of the second end (as shown in Figure 8), which means that there is an angle ⁇ between the connection line between the first end and the second end of the device node 1 and the horizontal plane , and the opening of the included angle ⁇ is facing the first end, the lowest point of the inner cavity space of the shell 11 of the final device node 1 is equivalent to the side of the second end, the liquid return outlet b is located at the lowest point, and the cooling in the shell 11 of the device node 1 The liquid can accumulate to the second end under the action of gravity and flow out to the return line 52 through the liquid return outlet b.
  • a guide rail with a slope can be set inside the cabinet body 2 (not shown in the figure) In this way, after the device node 1 is inserted along the guide rail, an angle ⁇ will be formed between the device node 1 and the cabinet backplane 23 .
  • Fig. 15a shows a schematic structural diagram of a device node 1 before being installed in a cabinet
  • Fig. 15b shows a schematic structural diagram of a device node 1 installed in a cabinet.
  • the device node 1 is provided with a male connector 14 .
  • the male connector 14 located in the device node 1 may be designed as a floating structure, and the floating direction may include a moving direction relative to the backplane 23 .
  • the floatability can be ensured by the device spring screw 15 .
  • a female connector 24 is provided on the backplane 23, and the female connector 24 has an introduction structure (a slope structure 241 as shown in the figure).
  • the male end connector 14 can be straightened by the female end connector 24 located on the backplane 23 through the lead-in structure, so as to ensure reliable connection between the male and female end connectors.
  • the male end connector 14 and the device node 1 The rear window forms an included angle ⁇ (as shown in FIG. 15b, the ⁇ in the upper right corner in the diagram after insertion).
  • the installation position of the equipment node 1 in the cabinet body 2 can be adjusted, that is, the cabinet body 2 is placed horizontally relative to the horizontal plane, and the equipment node 1 is inclined relative to the cabinet body 2 as shown in Figure 8; it can also be shown in Figure 9
  • the equipment node 1 is installed horizontally in the cabinet body 2, adjust the cabinet body 2, and set a first leg 21 and a second leg 22 at the bottom of the cabinet body 2, the first leg 21 corresponds to the first end of the device node 1, and the second leg 21 corresponds to the first end of the device node 1
  • the second leg 22 corresponds to the second end of the device node 1, and the height r1 of the first leg 21 is greater than the height r2 of the second leg 22, so that the level of the first end of the device node 1 is higher than the level of the second end, that is, liquid return Outlet b is located at the lowest point of the casing 11 .
  • the heat exchange unit 32 is integrated at the rear door of the cabinet body 2, and the liquid storage tank 31 is arranged at the inner bottom of the cabinet body 2. Therefore, in the simplified schematic diagram shown in FIG. At the bottom of the box 31 , the second leg 22 is equivalent to being located at the bottom of the heat exchange unit 32 . Finally, there is an angle ⁇ between the bottom of the cabinet body 2 and the horizontal plane, and the opening of the angle ⁇ faces the side of the first leg 21. Since the equipment node 1 is horizontally arranged relative to the cabinet body 2, the equipment node 1 is also in an angle relative to the horizontal plane. Angle ⁇ . Wherein, according to the standard size of the liquid cooler, the height difference between the height r1 of the first leg 21 and the height r2 of the second leg 22 is greater than about 5mm.
  • At least one liquid supply port j is formed on the liquid supply pipeline 51, and each liquid supply port j Corresponding to one device node 1 ; at least one liquid return port k is formed on the liquid return line 52 , and each liquid return port k corresponds to one device node 1 .
  • Each liquid supply port j is used to connect a corresponding cold liquid inlet a of the equipment node 1, and the liquid supply pipeline
  • the cooling liquid in 51 can enter the corresponding device node 1 through each liquid supply port j and the cooling liquid inlet a corresponding to the liquid supply port j, so as to ensure that the cooling liquid flow rate in each device node 1 is sufficient for liquid cooling , to avoid uneven distribution of coolant.
  • connection between the liquid supply port j and the cold liquid inlet a can be realized quickly through the female head m and male head n of the quick connector as shown in Figure 11.
  • each liquid return port k is used to connect to the liquid return outlet b of a device node 1, and the cooling liquid in a device node 1 can be connected to the liquid return outlet b of the device node 1 and the liquid return outlet b
  • the corresponding liquid return port k enters the liquid return line 52 to ensure that the cooling liquid in each equipment node 1 can be discharged as soon as possible.
  • the structure of the liquid return port k and the liquid return outlet b can refer to Figure 12a.
  • the inner diameter of the liquid return port k is larger than the outer diameter of the liquid return outlet b so that the return
  • the liquid outlet b can be inserted into the liquid return port k; an elastic anti-reflux member p is set at the liquid return port k.
  • the anti-reflux member p When the liquid return outlet b is inserted into the liquid return port k as shown in Figure 12b, the anti-reflux member p is in contact with the outer wall of the liquid return outlet b, and the liquid return outlet b is connected to the liquid return port k; when the liquid return outlet b is separated from the return port liquid port k, and the anti-reflux member p blocks the liquid return port k.
  • the structure of the anti-reflux part p can be shown in Figure 13a and Figure 13b.
  • the anti-reflux part p is made of elastic material (such as rubber), and it is arranged around the inner wall of the liquid return port k.
  • the specific setting method can be set on the liquid return port k, may also be fixed on the inner wall of the liquid return port k by gluing or other means.
  • the central hole o of the anti-reflux member p In the unstressed state, the central hole o of the anti-reflux member p is in a closed state as shown in FIG. 13 a , so that the liquid return port k can be blocked to achieve radial sealing.
  • the central hole o of the elastic anti-reflux member p is knocked open by the liquid return outlet b as shown in Figure 13b, so that the liquid return port k is in a through state.
  • the anti-reflux member p may also have other structures, as long as it can ensure that the liquid return port k is closed when the liquid return outlet b is not inserted, and is connected when it is inserted.
  • the liquid supply port j is disconnected from the cooling liquid inlet a, and the liquid between the liquid supply port j and the cooling liquid inlet a is circulated is directly cut off, that is to say, the cooling liquid in the liquid supply pipeline 51 will not be transported to the equipment node 1; but the cooling fluid of the equipment node 1 still needs to flow into the liquid return pipeline 52, and the above-mentioned backflow prevention part p is
  • the radial sealing structure of the liquid return port k can provide a certain period of time for the coolant in the equipment node 1 to flow back to the liquid return pipeline 52. After the equipment node 1 is placed for a period of time, the coolant in the equipment node 1 will completely flow into the liquid return pipe 52, and then completely unplug device node 1 for maintenance.

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Abstract

本申请提供一种设备节点及液冷机柜，用于提升设备节点的液冷散热能力，满足服务器散热需求。该设备节点包括外壳、电路板以及散热组件；外壳具有冷液进口和回液出口；电路板和散热组件均设置于外壳内，且电路板上设置有至少一个主芯片；散热组件包括喷淋板和至少一个液冷冷板，每个液冷冷板用于形成液冷通道，所有液冷冷板的液冷通道连通形成液冷网络，液冷网络的入口与冷液进口连通；喷淋板具有与液冷网络的出口连通的喷淋通道以及与喷淋通道连通的喷液孔，喷液孔出液一端朝向电路板。该设备节点对应设置的散热组件，可以对主芯片进行单点散热，同时还可以对电路板上的其他器件进行喷淋散热，具有较强单点散热能力，满足目前电子设备的散热需求。

Description

一种设备节点及液冷机柜
相关申请的交叉引用
本申请要求在2021年12月06日提交中国专利局、申请号为202111479105.6、申请名称为“一种设备节点及液冷机柜”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及视频监控技术领域，尤其涉及到一种设备节点及液冷机柜。
背景技术
随着科技的发展，诸如服务器之类的电子设备的功率越来越高，对电子设备的散热也提出的更高的要求。由于常规的风冷散热增大了用于服务器冷却的能耗，可以采用液冷散热。具体地，液冷机柜常用浸没散热或喷淋散热对设备节点进行散热，浸没散热对设备的耐压能力有较高要求，会增加结构设计难度；而喷淋散热方式中，设备节点上的主芯片位置的流量有限，散热能力不足。
可见，现有的液冷散热结构设计存在缺陷，其散热能力不足以满足散热需求。
发明内容
本申请提供一种设备节点和液冷机柜，用于提升设备节点的液冷散热能力，满足服务器散热需求。
第一方面，本申请提供一种设备节点，该设备节点包括外壳、电路板以及散热组件；外壳具有空腔，且在外壳上设置有冷液进口和回液出口；电路板和散热组件均设置于外壳内，且电路板上设置有至少一个主芯片。主芯片在工作时会产生较多的热量，而电路板上的其他器件产生的热量相较于主芯片较少，因此散热组件采用不同的散热结构对主芯片和电路板进行散热；具体地，散热组件包括喷淋板和至少一个液冷冷板，该至少一个液冷冷板与上述至少一个主芯片一一对应，每个液冷冷板与对应的主芯片接触以对对应主芯片进行液冷散热；每个液冷冷板用于形成液冷通道，该至少一个液冷冷板的液冷通道连通形成液冷网络，液冷网络的入口与外壳的冷液进口连通，外部的冷却液自冷液进口进入外壳内直接导入液冷网络内的各个液冷通道，可以对主芯片进行单点液冷散热；喷淋板具有与液冷网络的出口连通的喷淋通道以及与喷淋通道连通的多个喷液孔，每个喷液孔出液一端朝向电路板，冷却液自液冷通道进入喷淋通道后经喷液孔喷洒到电路上，可以对电路板上的其他器件进行喷淋散热。
该设备节点对应设置的散热组件，可以对至少一个主芯片进行单点散热，同时还可以对电路板上除主芯片外的其他器件进行喷淋散热，从而提升液冷散热的单点散热能力，满足目前电子设备的散热需求。
为了便于外壳内的冷却液流出，将回液出口设置于外壳内部空间的最低位，外壳内腔内的冷却液在重力作用下可以积聚到回液出口一侧并从回液出口流出。
其中，将喷淋板朝向电路板的表面包括第一区域和第二区域，第一区域和第二区域未交叠，第一区域与上述至少一个主芯片对应，喷液孔具体位于第二区域，使得上述至少一个主芯片在喷淋板上的正投影与喷淋孔所在位置不会产生交叠，喷淋板内的冷却液不需要喷淋到主芯片上，节省流量。
当向设备节点内通入冷却液，冷却液经过液冷冷板和喷淋板后落到外壳内，外壳内冷却液的液位需要高于电路板表面最高处1-3mm，以使冷却液可以浸没电路板上大多数器件以进行液冷散热，同时，还能够节约冷却液。
上述至少一个液冷冷板的液冷通道可以连通形成液冷网络，其连通方式可以采用串联和/或并联的结构。
其中，液冷冷板的结构可能有多种实现方式。例如，液冷冷板包括固定于主芯片的板壳，板壳具有中空腔体以形成上述液冷通道。或者，液冷冷板包括固定于电路板的板体，板体与电路板之间形成上述液冷通道；其中，液冷通道包括与冷液进口连通的第一液冷腔以及与喷淋通道连通的第二液冷腔，主芯片位于第二液冷腔内；第一液冷腔和第二液冷腔之间设置有射流板，且射流板具有连通第一液冷腔和第二液冷腔的射流孔，射流孔用于将第一液冷腔内的冷却液喷向主芯片。
第二方面，本申请提供一种液冷机柜，该液冷机柜可以包括柜体、循环液冷系统以及至少一个上述设备节点。该至少一个设备节点可以沿柜体的竖直方向插装于柜体内，循环液冷系统可以通过供液管路与每个设备节点的冷液进口连通，循环液冷系统通过回液管路与每个设备节点的回液出口密闭连通，回液管路的顶部还设置有与大气连通的进气口，使得回液管路内保持常压状态，方便每个设备节点内的冷却液可以流入回液管路。
循环液冷系统具体包括储液箱和换热单元，储液箱设置于柜体内并位于柜体的底部，换热单元则集成于柜体的后面，使得储液箱、换热单元与柜体集成一体化，保证液冷机柜的体积满足设计要求。储液箱具有回液进口和冷液出口，回液进口与回液管路连通，冷液出口与供液管路连通，换热单元连接于冷液出口与供液管路之间以对供向供液管路内的冷却液进行降温。
其中换热单元包括有控制板、换热器以及循环泵组，控制板与循环泵组信号连通；其中，换热器的进液口与回液出口连通，换热器的出液口与供液管路连通，换热器与外部冷却水源连通，外部冷却水源进入换热器，与换热器内的冷却液换热带走冷却液的热量，实现对冷却液的降温。循环泵组设置于回液出口与进液口之间，用于将储液箱内的冷却液泵压到供液管路内。控制板可以对循环泵组的工作进行控制。
储液箱具有分隔的储液腔和工作腔，回液进口和冷液出口均与工作腔连通，工作腔相当于参与循环液冷系统的工作过程；储液腔和工作腔之间形成有过液通道，当工作腔内的冷却液过多可以通过过液通道进入储液腔内存储，当工作腔内的冷却液过少不足以位置液冷循环，可以将储液腔内的冷却液补充到工作腔内。
一种可能实现的方式中，储液箱内设置有隔板，隔板将储液箱分隔为储液腔和工作腔，隔板的顶部与储液箱的内壁之间存在间隙以形成过液通道，当工作腔内的冷却液过多，冷却液会自隔板顶部溢出到储液腔；储液腔和工作腔之间通过补液管道连通，当工作腔内冷却液不足，储液腔内的冷却液可以经补液管道流通到工作腔内。具体地，在补液管道上设置有用于驱动冷却液自储液腔流向工作腔的补液泵，补液泵与换热单元中的控制板信号连接。
为了监控储液腔内冷却液的液位，储液腔内设置有第一液位传感器，第一液位传感器具有报警器；当储液腔内冷却液的液位低于设定液位，第一液位传感器触发报警器报警，通知工作人员及时向储液箱内补充冷却液。
为了监控工作腔内冷却液的液位，工作腔内设置有第二液位传感器，第二液位传感器与上述换热单元的控制板信号连接，由控制板接收第二液位传感器监测的液位信息并根据液位信息控制补液泵将储液腔内的冷却液泵压至工作腔，使工作腔内的冷却液的液位回复到正常工作液位。
为了实现对每个设备节点的针对性散热，供液管路上形成有至少一个供液端口，每个供液端口用于对应连接一个设备节点的冷液进口，供液端口与冷液进口之间通过快接头连接，方便设备节点的插拔作业。
对应地，回液管路上形成有至少一个回液端口，每个回液端口用于对应连接一个设备节点的回液出口；在一组相互对应的回液端口与回液出口中，回液端口的内径大于回液出口的外径以使回液出口插入回液端口内；回液端口设置有弹性的防回流件，当回液出口插入回液端口，防回流件与回液出口的外壁抵接；当回液出口脱离回液端口，防回流件将回液端口径向封堵；可以为设备节点内的冷却液回流到回液管路提供一定时间，待设备节点脱离供液端口并放置一段时间后，设备节点内的冷却液完全流入回液管路，再完全拔出设备节点进行维护。防回流件可以由弹性材料(例如橡胶)制备，满足径向封堵和多次插拔的要求。
对于每个设备节点，外壳具有相对的第一端和第二端，回液出口设置于第二端，将第一端所在水平面调整为高于第二端所在水平面，有利于设备节点内的冷却液流出。可能地，可以对柜体进行调节，以使设备节点随柜体结构变化产生上述倾斜效果；可以在柜体的底部设置与第一端对应的第一支脚以及与第二端对应的第二支脚，将第一支脚的高度设置为大于第二支脚的高度。
附图说明
图1为本申请实施例提供的一种设备节点的结构示意图；
图2a至图2d为本申请实施例提供的一种设备节点的内部结构示意图；
图3a和图3b为本申请实施例提供的一种设备节点中液冷冷板的剖面结构示意图；
图3c为本申请实施例提供的一种设备节点中喷淋板的结构示意图；
图4a为本申请实施例提供的一种液冷机柜的结构示意图；
图4b为本申请实施例提供的一种液冷机柜中柜体的内部结构示意图；
图5为本申请实施例提供的一种液冷机柜中储液箱的结构示意图；
图6为本申请实施例提供的一种液冷机柜中储液箱与换热单元配合的结构示意图；
图7为本申请实施例提供的一种液冷机柜内部结构示意图；
图8为本申请实施例提供的一种液冷机柜中设备节点相对柜体倾斜设置的结构示意图；
图9为本申请实施例提供的一种液冷机柜中柜体相对水平面倾斜设置的结构示意图；
图10a和图10b为本申请实施例提供的一种液冷机柜中设备节点与供液管路、回液管路连接的结构示意图；
图11为本申请实施例提供的一种液冷机柜中设备节点的冷液进口与供液管路的供液端口之间采用的快接头的结构示意图；
图12a和图12b为本申请实施例提供的一种液冷机柜中设备节点的回液出口与回液管路的回液端口之间的连接结构示意图；
图13a和图13b为本申请实施例提供的一种液冷机柜中回液端口上防回流件的结构示意图；
图14为本申请实施例提供的一种液冷机柜中设备节点与机柜连接的结构示意图；
图15a为本申请实施例提供的一种液冷机柜中设备节点安装到机柜之前的结构示意图；
图15b为本申请实施例提供的一种液冷机柜中设备节点安装到机柜的结构示意图。
具体实施方式
液冷机柜可以采用液冷方式对电子设备进行散热，目前的液冷机柜可能采用浸没或喷淋的方式对电子设备的设备节点进行散热。浸没散热对设备的耐压能力有较高要求，会增加结构设计难度；而喷淋散热方式中，设备节点上的主芯片位置的流量有限，散热能力不足。
基于此，本申请实施例提供一种设备节点及液冷机柜，以解决上述问题。为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。
以下实施例中所使用的术语只是为了描述特定实施例的目的，而并非旨在作为对本申请的限制。如在本申请的说明书和所附权利要求书中所使用的那样，单数表达形式“一个”、“一种”、“所述”、“上述”、“该”和“这一”旨在也包括例如“一个或多个”这种表达形式，除非其上下文中明确地有相反指示。
在本说明书中描述的参考“一个实施例”或“一些实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。由此，在本说明书中的不同之处出现的语句“在一个实施例中”、“在一些实施例中”、“在其他一些实施例中”、“在另外一些实施例中”等不是必然都参考相同的实施例，而是意味着“一个或多个但不是所有的实施例”，除非是以其他方式另外特别强调。术语“包括”、“包含”、“具有”及它们的变形都意味着“包括但不限于”，除非是以其他方式另外特别强调。
请参照图1，本身实施例提供的一种设备节点1，该设备节点1包括有外壳11，外壳11具有空腔，在外壳11上设置有供冷却液流入的冷液进口a以及供冷却液流出的回液出口b，外部的绝缘的冷却液可以自冷液进口a进入设备外壳11内，外壳11内的冷却液则可以通过回液出口b流出。以图1所示的设备节点1的结构为例，设定外壳11沿第一方向具有相对的第一端和第二端，将该第一方向设定为X。将外壳11的厚度方向设定为第三方向Y，将垂直于第一方向X和第三方向Z的方向设定为第二方向Y。外壳11的冷液进口a和回液出口b均位于第二端。
如图2a所示的设备节点1的内部结构示意图，设备节点1还包括电路板12以及散热组件13，电路板12和散热组件13均设置于外壳11的空腔内，外壳11对电路板12和散热组件13提供安装空间以及承载支撑。电路板12相对位于外壳11的底部，此处的底部是个相对位置，指的是在图2a所示状态下的底部。电路板12上设置有至少一个主芯片121，主芯片121具有较高的功耗，且能产生较高的热量，可以将主芯片121定义为第一类器件；电路板12上理论上还设置有其他功耗较低、产生热量较少的器件，可以将这类器件定义为第二类器件。针对第一类器件和第二类器件，本申请实施例所提供的散热组件13采用不同的散热方式。
具体地，散热组件13包括喷淋板132和至少一个液冷冷板131，该至少一个液冷冷板131与上述至少一个主芯片121一一对应，每个液冷冷板131用于对应接触一个主芯片121以对该主芯片121进行液冷散热。每个液冷冷板131可以用于形成供冷却液穿过的液冷通道T1，在图2a中，每个主芯片121对应一个液冷冷板131，当冷却液在每个液冷冷板131对应的液冷通道T1内流过，可以对每个主芯片121进行针对性的液冷散热。此处，液冷冷板131为至少一个，所有的液冷冷板131对应的液冷通道T1可以形成一液冷网络，液冷网络具有入口和出口，冷却液自液冷网络的入口进入后会流入每个液冷冷板131的液冷通道T1内，自每个液冷冷板131对应的液冷通道T1流出的冷却液则会自液冷网络的出口流出。此处，液冷网络的入口可以与上述冷液进口a直接连通，方便冷却液自冷液进口a直接进入液冷网络中的各个液冷通道T1内对各个主芯片121进行液冷散热。
喷淋板132具有喷淋通道T2以及与喷淋通道T2连通的多个喷液孔c，每个喷液孔c的出液一端朝向上述电路板12；其中，喷淋通道T2的入口与上述液冷网络的出口直接连通，冷却液完成对主芯片121的液冷散热后进入喷淋通道T2以对电路板12上的其他结构进行喷淋散热。喷淋板132具体位于外壳1内的顶部，方便喷淋通道T2内的冷却液可以在重力作用下经喷液孔c喷到电路板12上。
当液冷冷板131的数量多于一个(此处示出为两个)，液冷冷板131之间可以以串联形式设置(如图2a所示)，即液冷冷板131对应的液冷通道T1依次首尾连通，其中，位于首端的液冷通道T1的入口相当于液冷网络的入口，该液冷通道T1的入口与冷液进口a直接连通，位于尾端的液冷通道T1的出口相当于液冷网络的出口，该液冷通道T1的出口与喷淋通道T2的入口直接连通，自液冷网络的入口进入的冷却液相当于先后进入各个液冷通道T1以先后对各个主芯片121进行液冷散热。或者，液冷冷板131之间还可以以并联形式设置(如图2b所示)，即每个液冷冷板131对应的液冷通道T1的入口汇集为一个入口，该入口相当于液冷网络的入口以与冷液进口a直接连通，且每个液冷冷板131对应的液冷通道T1的汇集为一个出口，该出口相当于液冷网络的出口以与喷淋通道T2的入口直接连通，各个液冷通道T1相当于并列设置，自液冷网络的入口进入的冷却液相当于分多路分别进入各个液冷通道T1以同时对各个主芯片121进行液冷散热。当液冷冷板131的数量多于一个(此处示出为三个)，液冷冷板131之间可以以串并联混用形式设置，即其中两个液冷冷板131并联，该两个串联的液冷冷板131与另一个液冷冷板131串联(如图2c所示)，或者，其中两个液冷冷板131串联，该两个串联的液冷冷板131与另一个液冷冷板131并联(如图2d所示)；当然，当液冷冷板131的数量多于三个，各个液冷冷板131的液冷通道T1所形成的液冷网络还可能有更多的连通方式变形，此处不再举例说明。
其中，相邻的液冷冷板131的液冷通道T1之间、液冷通道T1与喷淋通道T2之间均可以通过软管14相连通。
在图2a至图2d中，冷液进口a进入外壳11内的冷却液首先进入各个液冷冷板131的液冷通道T1(可能是图2a所示的串联方式，也可能是图2b所示的并联方式)，对第一类器件(例如主芯片121)进行液冷散热；然后进入喷淋板132的喷淋通道，并经喷液孔c喷出到电路板12上，可以对电路板12上的第二类器件进行喷淋散热。冷却液对电路板12上的第二类器件喷淋后会落在外壳11内，并经回液出口b排出。
为了方便外壳11内的冷却液自回液出口b流出，回液出口b可以设置于外壳11相对较低的位置，具体可以将回液出口b设置于外壳11的最低位，此处的最低位指的是外壳 11形成的内腔所占据空间的最低位置所在水平面。以图1所示的设备节点1的结构为例，回液出口b设置于第二端，对外壳11的固定状态进行调整，使得第一端所在水平面高于第二端所在水平面，则外壳11内的冷却液可以在重力作用下自第一端向第二端积聚，方便冷却液自回液出口b排出。
在图2a至图2d所示的液冷冷板131的具体结构可以参照图3a所示，其包括一板壳1311，板壳1311为壳体结构，具有一空腔，该空腔可以形成上述液冷通道T1；板壳1311可以通过粘接等方式直接固定到主芯片121上，冷却液与主芯片121之间的热量交换是通过板壳1311实现的。为了方便液冷通道T1进出液，可以在板壳1311上设置进液嘴d1和出液嘴d2，进液嘴d1和出液嘴d2的位置、形状不做限定，进液嘴d1用于冷却液进入板壳1311的空腔，出液嘴d2用于板壳1311的空腔内的冷却液流出。理想状态下，板壳1311的空腔内应当是充满冷却液的状态，以与主芯片121进行充分的冷热交换，实现对主芯片121的液冷散热。
在另一种实施例中，液冷冷板131的结构可以参照图3b所示，其包括板体1312，板体1312固定于电路板12上，且板体1312与电路板12之间形成上述液冷通道T1；板体1312上设置有进液嘴e1和出液嘴e2；具体地，液冷通道T1包括与进液嘴e1连通的第一液冷腔T11以及与出液嘴e2连通的第二液冷腔T12，上述主芯片121位于第二液冷腔T12内，当第二液冷腔T12内填充冷却液，相当于主芯片121被浸没在冷却液中；第一液冷腔T11和第二液冷腔T12之间设置有射流板1313，且射流板1313具有连通第一液冷腔T11和第二液冷腔T12的射流孔w，射流孔w用于将第一液冷腔T11内的冷却液喷向主芯片121，冷却液直接冲击到主芯片121的表面，不需要导热界面材料，能够提高液冷散热效果。这种实施例中，液冷冷板131是通过冷却液直接接触主芯片121以对主芯片121进行液冷散热的，且液冷通道T1是通过板体1312与电路板12配合形成的，此处的“配合”指的是通过结构设计固定在一起以形成上述液冷通道T1。
图3c示出了喷淋板132朝向电路板12的表面，将喷淋板132朝向电路板12的表面至少划分为第一区域V1和第二区域V2，第一区域V1和第二区域V2没有交叠，该第一区域V1与上述所有的主芯片121对应，上述喷淋孔c设置于第二区域V2内，各个主芯片121在喷淋板132上的正投影(以垂直于喷淋板132的方向投影到喷淋板132上)与喷淋孔c所在位置未产生交叠，喷淋板132内的冷却液主要用于为电路板12上除主芯片121之外的其他器件进行喷淋散热，这样的设置方式有利于节省冷却液的流量。此处，多个喷淋孔c的形状以及分布方向并不限定，图3c中仅做示例。
需要注意的是，当向设备节点1内通入冷却液，冷却液经过液冷冷板131和喷淋板132后落到外壳11内，外壳11内冷却液的液位需要高于电路板12表面最高处1-3mm，以使冷却液可以浸没电路板12上大多数器件以进行液冷散热，同时，还能够节约冷却液。可以看出，本申请实施例所提供的设备节点1对应设置有散热组件13，散热组件13中的液冷冷板131可以对设备节点1中的主芯片121这类功耗大、热量高的器件进行针对性的液冷散热，喷淋板132则可以对电路板12上的其他功耗较小、热量交底的器件进行喷淋散热，实现液冷散热的同时可以提升单点散热能力，可以满足目前电子设备的散热需求。
基于上述设备节点1，本申请实施例还提供一种液冷机柜，该液冷机柜的结构可以参照图4a所示，具体包括柜体2，柜体2内可以安装至少一个设备节点1。设备节点1相当于液冷机柜中任意一个插拔的最小单元，柜体2即用于承载设备节点。
液冷机柜还包括为设备节点1循环提供冷却液的循环液冷系统，该循环液冷系统具体包括储液箱31和换热单元32。储液箱31用于储存冷却液，一方面向各个设备节点1提供冷却液，一方面回收设备节点1流出的冷却液；储液箱31设置于柜体2内且位于柜体2的底部，方便设备节点1流出的冷却液在重力作用下流入储液箱31内。换热单元32集成于柜体2的后面，且换热单元32用于对输送到设备节点2的冷却液进行冷却，降低冷却液的温度，以对设备节点1进行良好的冷却散热；其中，后面是以该液冷机柜朝向工作人员操作面为参照的，设定液冷机柜的操作面为前，则与前对应的另一面为后。请参照图4a所示，对柜体2的前端和后端进行定义，可以将换热单元32设置于柜体2后门位置，不增大液冷机柜的尺寸，满足标准机柜的尺寸要求。该实施例中，可以将储液箱31、换热单元32与柜体2集成在一起，并在柜体2以及换热单元32整体结构的底部设置一底座4，方便液冷机柜整体结构安置与挪移。
柜体2的结构可以参照图4b所示，柜体2内可以设置多个安装工位s，每个安装工位s具有滑槽，可以对应插装一个上述设备节点1，每个设备节点1可以插入安装工位s并通过柜体2内的各种连接器与柜体2实现连接，此处的连接包括电、信号以及冷却液。至于设备节点1在柜体2内排布方式，可以不作限定，图4a和图4b中，多个设备节点1沿柜体2的高度方向依次排布。其中，每个设备节点2具有确定的高度，但是相邻的设备节点2之间的距离可以不做限定。循环液冷系统通过供液管路51与每个设备节点1的冷液进口a连通，以向设备节点1内的散热组件13提供冷却液；同时，循环液冷系统通过回液管路52与每个设备节点1的回液出口b密闭连通，以回收设备节点1内的冷却液。供液管路51和回液管路52均设置于柜体2内。
储液箱31的结构可以参照图5，储液箱31为壳体结构，其具有可以盛装冷却液的内腔，其具有回液进口g和冷液出口h，回液进口g具体位于储液箱31的顶部位置，方便设备节点2流出的冷却液自回液进口g进入储液箱31。结合图6示出的储液箱31与换热单元32的位置结构，储液箱31的冷液出口h设置于储液箱31用于对接换热单元32的侧面，储液箱31内的冷却液自该冷液出口h进入换热单元32。
如图7所示的液冷机柜的内部结构简化结构示意图，在柜体2内示例性安装有两个设备节点1，两个设备节点1在柜体2内沿竖直方向层叠设置。循环液冷系统通过供液管路51与每个设备节点1的冷液进口a连通，以向设备节点1内的散热组件13提供冷却液；同时，循环液冷系统通过回液管路52与每个设备节点1的回液出口b密闭连通，以回收设备节点1内的冷却液。在回液管路52的顶部具有与大气连通的进气口f，进气口f可以保证回液管路32内保持常压，回液管路52内的冷却液可以在重力作用下自储液箱31的回液进口g进入储液箱31，无需额外的动力源，节省成本。此处，储液箱31顶部还设置有注液口i，在储液箱31内部冷却液不足时，通过该注液口i向储液箱31添加冷却液。
换热单元32具体包括换热器321和循环泵组322，换热器321的进液口与储液箱31的冷液出口h连通，且循环泵组322设置于储液箱31冷液出口h与换热器的进液口之间，具体可以设置于冷液出口h处，为冷却液的流动提供动力。换热器321的出液口与上述供液管路51连通，循环泵组322将储液箱31内的冷却液泵压进入换热器321，换热器321与外部冷却水源连通，外部冷却水源流过换热器321，与换热器321内的冷却液热量交换，带走冷却液的热量实现对冷却液的降温。其中，换热器321与供液管路51之间、换热器321与储液箱31之间可以采用管道33连通。换热单元32还包括控制板323，控制板323 具体可以设置于换热单元32结构内壁，控制板323与上述循环泵组322信号连接，可以对循环泵组322进行控制。控制板323具体可以为单片机，在换热单元32外可以设置与控制板323信号连接的操作面板，方便工作人员进行控制作业。
其中，循环泵组322设置为N+1的形式，即有N个主循环泵和1个备用泵，在主循环泵N出现故障时，备用泵可以启动保证正常的液冷循环作业。其中，循环泵组322与储液箱31的冷液出口h之间通过球阀6连接，在循环泵组322故障时可直接关断球阀6，拆卸循环泵组322进行维护检修。
储液箱31为箱体结构，具体在箱体结构内形成有水平方向分布的储液腔M和工作腔N，储液腔M与工作腔N之间分离同时能够实现液体导通。其中，工作腔N与上述供液管路51连通，工作腔N内的冷却液可以输送到供液管路51，储液箱31上的回液进口g、冷液出口h以及注液口i均与该工作腔N连通；回液进口g位于工作腔N的顶部，方便回液管路52内的冷却液直接落入工作腔N。工作腔N直接参与液冷循环系统的供液以及回液作业，储液腔M则用于为工作腔N提供储存以及补液功能。储液的作用在于，当工作腔N内的冷却液液量足够多超过设定的极大阈值，工作腔N内的冷却液可以流入储液腔M内进行存储；补液的作用在于，当工作腔N内的冷却液液量太少低于设定的极小阈值，储液腔M内存储的冷却液可以为工作腔N补充液量。此处极大阈值和极小阈值被定义为，工作腔N内的冷却液可以保证液冷循环系统实现正常液冷循环的液量不大于该极大阈值且不小于该极小阈值。其中，工作腔N内冷却液正常工作的液位设定运行液位L0，冷却液极大阈值对应于储液液位L1，冷却液极小阈值对应于补液液位L2；在液冷循环系统正常工作时，运行液位L0需要大于补液液位L2且小于储液液位L1；当然，运行液位L0在液冷循环系统工作中，是可以动态变化的。
本申请实施例中储液腔M和工作腔N的容量之和被设置为至少可以容纳所有设备节点1回流的冷却液。一般地，液冷循环系统的冷却液在工作过程中会存在一定的蒸发、流失，且在设备节点1维护时也可能损失一定的冷却液，为了保证液冷循环系统的正常工作，储液腔M内需要存储不低于设定阈值液量的冷却液，以备工作腔N可能的补液需要，防止出现液冷循环系统冷却液液量出现不足的情况。该设定阈值液量对应于安全液位L3，当储液腔M内的冷却液的液位低于该安全液位L3，说明储液腔M的冷却液液量不足以在工作腔N需要补液时提供足够的冷却液，此时需要及时为储液箱31内补充冷却液。为了监控储液腔M内冷却液的液量，在储液腔M内设置有第一液位传感器314，第一液位传感器314设置有报警器，当储液腔M内的冷却液的液位低于上述安全液位L3，第一液位传感器314触发报警器报警，提醒工作人员可以通过注液口i为储液箱31加液。
为了冷却液可以在储液腔M和工作腔N之间流通，需要在储液腔M和工作腔N之间形成一过液通道，示例性地，在储液箱31内设置一隔板311，隔板311沿竖直方向设置，隔板311可以将储液箱31内部分为水平方向分布的储液腔M和工作腔N。隔板311的顶部与储液箱31的内壁之间存在间隙q，间隙q相当于上述过液通道，储液腔M内的冷却液和工作腔N内的冷却液可以通过该间隙q实现液体流通与交换。由于工作腔N内的冷却液流向储液腔M的条件在于工作腔N内的冷却液液量足够多，因此，间隙q最低点可以对应于工作腔N内的液量达到极大阈值时冷却液的储液液位L1，当工作腔N内冷却液液位高于储液液位L1，工作腔N内的冷却液可以自工作腔N溢出，隔板311顶部与储液箱31的内壁之间的间隙q可以供溢出的冷却液流通，不需要采用额外的动力支持。而储液腔 M内的冷却液向工作腔N补充，需要采用动力支持，具体地，可以在储液腔M和工作腔N之间设置一补液管道312，补液管道312上设置可以驱动冷却液自低势能向高势能转移的补液泵313，当然，补液泵313也可以由上述换热单元32的控制板323控制。
当液冷循环系统扩容或其它原因导致工作腔N内冷却液的运行液位L0降低到补液液位L2时，需要及时对工作腔N进行补液。为了监控工作腔N内冷却液的液位，在工作腔N内设置有第二液位传感器315，第二液位传感器315与上述控制板323信号连接，由控制板323接收第二液位传感器315监测的液位信息并根据液位信息控制补液泵313将储液腔M内的冷却液经补液管道312泵压至工作腔N，使工作腔N内的冷却液的液位回复到正常工作液位。
需要说明的是，本申请实施例中循环泵组322的主循环泵为离心泵。上述循环泵组322通过球阀与工作腔N连通，工作腔N内的冷却液工作液位L0需要高于主循环泵泵体，以保证主循环泵的转子腔始终处于工作腔N的冷却液液面以下，避免空气进入主循环泵的转子腔。
请继续参照图7，在该实施例中，设备节点1沿柜体2的竖直方向设置有至少一个(图中以两个设备节点1进行示例)，各设备节点1沿柜体2的竖直方向层叠设置，为了方便每个设备节点1内的冷却液导出到回流管路52，可以将设备节点1倾斜设置，使得设备节点1内的冷却液可以在重力作用下自第一端流向第二端，然后经回液出口b流入回流管路52。具体地，以图7所示的设备节点1结构为例，设备节点1的外壳11为规则的壳体结构，其外壳11的底部是厚度均匀的底面，可以调节设备节点1或柜体2使得设备节点1的第一端所在水平高度高于第二端所在水平高度(如图8所示)，相当于设备节点1的第一端与第二端的连线与水平面之间存在一夹角α，且该夹角α的开口朝向第一端，最终设备节点1外壳11内腔空间的最低点相当于第二端一侧，回液出口b位于该最低点，设备节点1外壳11内的冷却液可以在重力作用下积聚到第二端并由回液出口b流出到回流管路52。
在一个实施例中，如图14所示，为了实现设备节点1使得第一端所在水平高度高于第二端所在水平高度，可以在柜体2内部设置一个具有坡度的导轨(图中未示出)，这样，沿导轨插入的设备节点1后，设备节点1会与机柜背板23之间形成夹角α。图15a示出了设备节点1在安装到机柜之前的结构示意图，图15b示出了设备节点1安装到机柜的结构示意图。设备节点1设置有公端连接器14。可以将位于设备节点1中的公端连接器14设计为可浮动结构，浮动方向可以包括相对于背板23的运动方向。具体实现时，可以通过设备弹簧螺钉15来保证可浮动性。相应的，在背板23上设置一个母端连接器24，母端连接器24上具有导入结构(如图中所示的斜面结构241)。在插入过程中，公端连接器14可通过导入结构被位于背板23的母端连接器24摆正，从保证公母两端连接器可靠连接，此时公端连接器14与设备节点1的后窗形成一个夹角α(如图15b所示插入后的示图中的右上角的α)。
为了达到以上目的，可以调节设备节点1在柜体2内的安装位置，即柜体2是相对水平面水平放置，而设备节点1相对柜体2如图8所示倾斜；还可以如图9所示，设备节点1在柜体2中水平安装，调节柜体2，在柜体2的底部设置第一支脚21和第二支脚22，第一支脚21与设备节点1的第一端对应，第二支脚22与设备节点1的第二端对应，第一支脚21的高度r1大于第二支脚22的高度r2，使得设备节点1的第一端所在水平面高于第二端所在水平面，即回液出口b位于外壳11的最低点。应当理解，换热单元32集成于柜体 2的后门处，储液箱31设置于柜体2内底部，因此，在图9所示的简化结构示意图中，第一支脚21相当于位于储液箱31的底部，第二支脚22相当于位于换热单元32的底部。最终，柜体2的底部与水平面之间存在一夹角α，且夹角α的开口朝向第一支脚21一侧，由于设备节点1相对柜体2水平设置，设备节点1也相对于水平面呈夹角α。其中，依照液冷柜标准尺寸，第一支脚21的高度r1与第二支脚22的高度r2之间的高度差大于在5mm左右。
对供液管路51、回液管路52与设备节点1连接的结构进行单独说明，如图10a所示，供液管路51上形成有至少一个供液端口j，每个供液端口j对应一个设备节点1；回液管路52上形成有至少一个回液端口k，每个回液端口k对应一个设备节点1。
将供液管路51、回液管路52与设备节点1连接的结构简化如图10b所示，每个供液端口j用于对应连接一个设备节点1的冷液进口a，供液管路51内的冷却液可以通过每个供液端口j、与该供液端口j对应的冷液进口a进入对应的设备节点1，从而可以保证每个设备节点1内的冷却液流量足够液冷使用，避免出现冷却液分布不均的情况。
具体地，在一组相互对应的供液端口j与冷液进口a中，供液端口j与冷液进口a之间可以通过如图11所示快接头的母头m和公头n实现快速连接与拆卸；其中，母头m可以设置于供液端口j，对应地，公头n设置于冷液进口a；或者，母头m可以设置于冷液进口a，对应地，公头n设置于供液端口j。
继续参照图10b，每个回液端口k用于对应连接一个设备节点1的回液出口b，一个设备节点1内的冷却液可以自该设备节点1回液出口b、与该回液出口b对应的回液端口k进入回液管路52，保证每个设备节点1内的冷却液可以尽快排出。
在一组相互对应的回液端口k与回液出口b中，回液端口k与回液出口b的结构可以参照图12a，回液端口k的内径大于回液出口b的外径以使回液出口b可以插入回液端口k内；在回液端口k设置有弹性的防回流件p。当回液出口b如图12b所示插入回液端口k，防回流件p与回液出口b的外壁抵接，回液出口b与回液端口k之间连通；当回液出口b脱离回液端口k，防回流件p将回液端口k封堵。
防回流件p的结构可以参照图13a和图13b所示，防回流件p由弹性材料(例如橡胶)制备，其环绕回液端口k内壁设置一圈，具体设置方式可以是套在回液端口k上，也可以是通过胶粘等方式固定在回液端口k的内壁上。在未受力状态下，防回流件p中心孔洞o如图13a所示处于封闭状态，从而可以对回液端口k封堵实现径向密封。当回液出口b插入回液端口k，弹性的防回流件p中心孔洞o如图13b所示被回液出口b撞开，从而，回液端口k处于贯通状态。应当理解，防回流件p还可以是其他的结构，只需要能够保证回液端口k在回液出口b未插入时封闭、插入时导通的效果即可。
当设备节点1需要拆卸维护时，将设备节点1自回液端口k拔出15mm距离后，供液端口j与冷液进口a断开，供液端口j与冷液进口a之间的液体流通被直接断停，也就是说供液管路51内的冷却液不会再被输送到设备节点1内；但是设备节点1的冷却液还需要流入回液管路52，上述防回流件p对回液端口k的径向密封结构可以为设备节点1内的冷却液回流到回液管路52提供一定时间，待设备节点1放置一段时间后，设备节点1内的冷却液完全流入回液管路52，再完全拔出设备节点1进行维护。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本 申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (17)

  1. 一种设备节点，其特征在于，包括：外壳、电路板以及散热组件；
    所述外壳具有冷液进口和回液出口；所述电路板和所述散热组件均设置于所述外壳内，且所述电路板上设置有至少一个主芯片；
    所述散热组件包括喷淋板和至少一个液冷冷板，所述至少一个液冷冷板与所述至少一个主芯片一一对应，每个所述液冷冷板与对应的主芯片接触以对所述对应的主芯片进行液冷散热；每个所述液冷冷板用于形成液冷通道，所述至少一个液冷冷板的液冷通道连通形成液冷网络，所述液冷网络的入口与所述冷液进口连通；
    所述喷淋板具有与所述液冷网络的出口连通的喷淋通道以及与所述喷淋通道连通的多个喷液孔，每个所述喷液孔出液一端朝向所述电路板。
  2. 根据权利要求1所述的设备节点，其特征在于，所述喷淋板朝向所述电路板的表面包括第一区域和第二区域，所述第一区域与所述至少一个主芯片对应，所述多个喷液孔位于所述第二区域。
  3. 根据权利要求1或2所述的设备节点，其特征在于，当所述设备节点通入冷却液，所述外壳内冷却液的液位高于所述电路板表面最高处1-3mm。
  4. 根据权利要求1-3中任一项所述的设备节点，其特征在于，所述液冷冷板包括固定于所述电路板的板体，所述板体与所述电路板之间形成所述液冷通道；
    所述液冷通道包括与所述冷液进口连通的第一液冷腔以及与所述喷淋通道连通的第二液冷腔，所述主芯片位于所述第二液冷腔内；所述第一液冷腔和所述第二液冷腔之间设置有射流板，且所述射流板具有连通所述第一液冷腔和所述第二液冷腔的射流孔，所述射流孔用于将所述第一液冷腔内的冷却液喷向所述主芯片。
  5. 根据权利要求1-3中任一项所述的设备节点，其特征在于，至少一个所述液冷冷板串联和/或并联。
  6. 根据权利要求1-5中任一项所述的设备节点，其特征在于，所述回液出口位于所述外壳的最低位。
  7. 一种液冷机柜，其特征在于，包括：柜体、循环液冷系统以及至少一个如权利要求1-6中任一项所述的设备节点；
    所述至少一个设备节点设置于所述柜体内，所述循环液冷系统通过供液管路与每个设备节点的冷液进口密闭连通，所述循环液冷系统通过回液管路与每个所述设备节点的回液出口密闭连通，所述回液管路的顶部具有与大气连通的进气口。
  8. 根据权利要求7所述的液冷机柜，其特征在于，所述循环液冷系统包括储液箱和换热单元；
    所述储液箱设置于所述柜体内并位于所述柜体的底部，所述储液箱具有回液进口和冷液出口，所述回液进口与所述回液管路连通，所述冷液出口与所述供液管路连通；
    所述换热单元集成于所述柜体的后面，且所述换热单元连接于所述冷液出口与所述供液管路之间。
  9. 根据权利要求8所述的液冷机柜，其特征在于，所述储液箱具有分隔的储液腔和工作腔，所述回液进口和所述冷液出口均与所述工作腔连通；
    所述储液腔和所述工作腔之间形成有过液通道。
  10. 根据权利要求9所述的液冷机柜，其特征在于，所述储液箱内设置有隔板，所述隔板将所述储液箱分隔为所述储液腔和所述工作腔，所述隔板的顶部与所述储液箱的内壁之间存在间隙以形成所述过液通道，且所述储液腔和所述工作腔之间通过补液管道连通。
  11. 根据权利要求10所述的液冷机柜，其特征在于，所述补液管道上设置有补液泵，所述换热单元与所述补液泵信号连接。
  12. 根据权利要求9-11中任一项所述的液冷机柜，其特征在于，所述储液腔内设置有第一液位传感器，所述第一液位传感器具有报警器；
    所述工作腔内设置有第二液位传感器，所述第二液位传感器与所述换热单元信号连接。
  13. 根据权利要求8-12中任一项所述的液冷机柜，其特征在于，所述换热单元包括控制板、换热器以及循环泵组，所述控制板与所述循环泵组信号连通；
    所述换热器的进液口与所述回液出口连通，所述换热器的出液口与所述供液管路连通，所述循环泵组设置于所述回液出口与所述进液口之间。
  14. 根据权利要求7-13中任一项所述的液冷机柜，其特征在于，所述供液管路上形成有至少一个供液端口，每个供液端口用于对应连接一个所述设备节点的冷液进口；
    在一组相互对应的所述供液端口与所述冷液进口中，所述供液端口与所述冷液进口之间通过快接头连接。
  15. 根据权利要求7-14中任一项所述的液冷机柜，其特征在于，所述回液管路上形成有至少一个回液端口，每个所述回液端口用于对应连接一个所述设备节点的回液出口；
    在一组相互对应的所述回液端口与所述回液出口中，所述回液端口的内径大于所述回液出口的外径以使所述回液出口插入所述回液端口内；
    所述回液端口设置有弹性的防回流件，当所述回液出口插入所述回液端口，所述防回流件与所述回液出口的外壁抵接；当所述回液出口脱离所述回液端口，所述防回流件将所述回液端口径向封堵。
  16. 根据权利要求7-15中任一项所述的液冷机柜，其特征在于，对于每个所述设备节点，所述外壳具有相对的第一端和第二端，所述回液出口位于所述第二端；
    所述柜体的底部具有与所述第一端对应的第一支脚以及与所述第二端对应的第二支脚，所述第一支脚的高度大于所述第二支脚的高度。
  17. 根据权利要求7-16中任一项所述的液冷机柜，其特征在于，至少一个所述设备节点沿竖直方向层叠设置。
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