WO2016208816A1 - Résine polymère de formule chimique 1, film adhésif la comprenant et écran connecté par film adhésif - Google Patents

Résine polymère de formule chimique 1, film adhésif la comprenant et écran connecté par film adhésif Download PDF

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Publication number
WO2016208816A1
WO2016208816A1 PCT/KR2015/010307 KR2015010307W WO2016208816A1 WO 2016208816 A1 WO2016208816 A1 WO 2016208816A1 KR 2015010307 W KR2015010307 W KR 2015010307W WO 2016208816 A1 WO2016208816 A1 WO 2016208816A1
Authority
WO
WIPO (PCT)
Prior art keywords
group
polymer resin
formula
adhesive film
aromatic hydrocarbon
Prior art date
Application number
PCT/KR2015/010307
Other languages
English (en)
Korean (ko)
Inventor
강경희
고연조
권순영
김정섭
김하나
박경수
서현주
송기태
황자영
Original Assignee
삼성에스디아이 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성에스디아이 주식회사 filed Critical 삼성에스디아이 주식회사
Priority to CN201580080522.XA priority Critical patent/CN107614572B/zh
Publication of WO2016208816A1 publication Critical patent/WO2016208816A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/08—Saturated oxiranes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides

Definitions

  • substituted means that the hydrogen atom in the compound is a halogen atom (F, Br, Cl, I), alkyl halide, hydroxy group, alkoxy group, nitro group, cyano group, amino group, azido group , Amidino group, hydrazino group, hydrazono group, carbonyl group, carbamyl group, thiol group, ester group, carboxyl group or salt thereof, sulfonic acid group or salt thereof, phosphoric acid group or salt thereof, C 1 to C 20 alkyl group, C 2 To C 20 alkenyl group, C 2 to C 20 alkynyl group, C 6 to C 30 aryl group, C 7 to C 30 arylalkyl group, C 1 to C 20 alkoxy group, C 1 to C 20 heteroalkyl group, C 3 to C 20 heteroarylalkyl group, C 3 to C 20 cycloalkyl group, (meth) acrylate group,
  • halogen atom F, Br,
  • the C 6-30 aromatic containing group may be selected from the group consisting of Formulas A1 to A7:
  • the hydrogenated epoxy resin is specifically an alicyclic hydrogenated epoxy resin such as hydrogenated bisphenol A epoxy resin or cycloaliphatic.
  • a resin having a structure such as alicyclic diepoxy acetal, alicyclic diepoxy adipate, alicyclic diepoxy carboxylate, vinyl cyclohexene dioxide, or the like may be used.
  • the hydrogenated bisphenol A epoxy resin is generally obtained by using a hydrogenated bisphenol A derivative and epichlorohydrin, and may be a structure in which a double bond in the bisphenol A molecular structure is substituted with a hydrogen molecule.
  • connection film as described in this application located between the said 1st to-be-connected member and the said 2nd to-be-connected member, and connecting the said 1st electrode and the said 2nd electrode.
  • Initial resistance was measured after pressing at 90 ° C. for 1 second and 1 MPa and main pressing at 130 ° C. for 5 seconds and 3 MPa.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

La présente invention concerne une résine polymère comprenant : (1) un groupe contenant un hydrocarbure aromatique polycyclique ; et (2) un groupe contenant aromatique ou cycloaliphatique en C6-30, un procédé de préparation de celle-ci, un film adhésif la comprenant, et un écran connecté par le film adhésif.
PCT/KR2015/010307 2015-06-24 2015-09-30 Résine polymère de formule chimique 1, film adhésif la comprenant et écran connecté par film adhésif WO2016208816A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201580080522.XA CN107614572B (zh) 2015-06-24 2015-09-30 式1的聚合物树脂、其制备方法、接着膜及显示装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020150089398A KR101788382B1 (ko) 2015-06-24 2015-06-24 화학식 1의 고분자 수지, 이를 포함하는 접착 필름 및 상기 접착 필름에 의해 접속된 반도체 장치
KR10-2015-0089398 2015-06-24

Publications (1)

Publication Number Publication Date
WO2016208816A1 true WO2016208816A1 (fr) 2016-12-29

Family

ID=57585779

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2015/010307 WO2016208816A1 (fr) 2015-06-24 2015-09-30 Résine polymère de formule chimique 1, film adhésif la comprenant et écran connecté par film adhésif

Country Status (4)

Country Link
KR (1) KR101788382B1 (fr)
CN (1) CN107614572B (fr)
TW (1) TWI623563B (fr)
WO (1) WO2016208816A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7016226B2 (ja) * 2017-05-17 2022-02-04 川崎化成工業株式会社 高分子光重合増感剤

Citations (5)

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KR100727742B1 (ko) * 2005-12-17 2007-06-13 제일모직주식회사 블럭화된 이소시아네이트를 이용한 접착제용 이방 도전성수지 조성물 및 이를 이용한 접속 구조체
KR20090021292A (ko) * 2006-06-27 2009-03-02 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리하이드록시에테르 및 유기 입자를 포함하는 접착제 조성물, 및 이를 사용한 회로 기판의 접속 방법
KR20100050423A (ko) * 2008-11-04 2010-05-13 주식회사 엘지화학 고분자 전해질막
KR20130076237A (ko) * 2011-12-28 2013-07-08 제일모직주식회사 이방 도전성 필름용 조성물, 이방 도전성 필름, 및 이를 이용한 반도체 장치
KR20140139902A (ko) * 2013-05-28 2014-12-08 삼성디스플레이 주식회사 이방성 도전 필름 적층체, 이를 포함하는 표시 장치 및 표시 장치 제조 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1160899A (ja) * 1997-08-19 1999-03-05 Minnesota Mining & Mfg Co <3M> 導電性エポキシ樹脂組成物、異方性導電接着フィルムおよび電気的接続方法
US6320020B1 (en) * 1998-09-08 2001-11-20 Mitsui Chemicals, Inc. Sulfur-containing (thio)ether (co)polymer and a use thereof
JP4888482B2 (ja) 2008-12-22 2012-02-29 日立化成工業株式会社 異方導電性接着剤組成物、それを用いた回路端子の接続方法及び接続構造体
JP2011227460A (ja) * 2010-03-30 2011-11-10 Fujifilm Corp 感光性組成物
KR101788379B1 (ko) * 2015-06-09 2017-10-19 삼성에스디아이 주식회사 화학식 1 또는 2의 고분자 수지, 이를 포함하는 접착 필름 및 상기 접착 필름에 의해 접속된 반도체 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100727742B1 (ko) * 2005-12-17 2007-06-13 제일모직주식회사 블럭화된 이소시아네이트를 이용한 접착제용 이방 도전성수지 조성물 및 이를 이용한 접속 구조체
KR20090021292A (ko) * 2006-06-27 2009-03-02 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리하이드록시에테르 및 유기 입자를 포함하는 접착제 조성물, 및 이를 사용한 회로 기판의 접속 방법
KR20100050423A (ko) * 2008-11-04 2010-05-13 주식회사 엘지화학 고분자 전해질막
KR20130076237A (ko) * 2011-12-28 2013-07-08 제일모직주식회사 이방 도전성 필름용 조성물, 이방 도전성 필름, 및 이를 이용한 반도체 장치
KR20140139902A (ko) * 2013-05-28 2014-12-08 삼성디스플레이 주식회사 이방성 도전 필름 적층체, 이를 포함하는 표시 장치 및 표시 장치 제조 방법

Also Published As

Publication number Publication date
KR20170000486A (ko) 2017-01-03
CN107614572B (zh) 2020-12-15
TW201700526A (zh) 2017-01-01
CN107614572A (zh) 2018-01-19
KR101788382B1 (ko) 2017-10-19
TWI623563B (zh) 2018-05-11

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