WO2016204835A1 - Precessional spin current structure for mram - Google Patents
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- WO2016204835A1 WO2016204835A1 PCT/US2016/021691 US2016021691W WO2016204835A1 WO 2016204835 A1 WO2016204835 A1 WO 2016204835A1 US 2016021691 W US2016021691 W US 2016021691W WO 2016204835 A1 WO2016204835 A1 WO 2016204835A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1675—Writing or programming circuits or methods
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
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- H—ELECTRICITY
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- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
- H10N50/85—Magnetic active materials
Definitions
- the present patent document relates generally to spin-transfer torque magnetic random access memory and, more particularly, to a magnetic tunnel junction stack having improved performance of the free layer in the magnetic tunnel junction structure.
- Magnetoresistive random-access memory is a non-volatile memory technology mat stores data through magnetic storage elements. These elements are two ferromagnetic plates or electrodes that can hold a magnetic field and are separated by a non-magnetic material, such as a non-magnetic metal or insulator. In general, one of the plates has its magnetization pinned (i.e., a "reference layer”), meaning that this layer has a higher coercivity than the other layer and requires a larger magnetic field or spin- polarized current to change the orientation of its magnetization. The second plate is typically referred to as the free layer and its magnetization direction can be changed by a smaller magnetic field or spin-polarized current relative to the reference layer.
- a reference layer magnetization pinned
- MRAM devices store information by changing the orientation of the
- MRAM devices are non-volatile memory devices, since they maintain the information even when the power is off.
- the two plates can be sub- micron in lateral size and the magnetization direction can still be stable with respect to thermal fluctuations.
- Spin transfer torque or spin transfer switching uses spin-aligned ("polarized") electrons to change the magnetization orientation of the free layer in the magnetic tunnel junction.
- electrons possess a spin, a quantized number of angular momentum intrinsic to the electron.
- An electrical current is generally unpolarized, i.e., it consists of 50% spin up and 50% spin down electrons. Passing a current though a magnetic layer polarizes electrons with the spin orientation corresponding to the magnetization direction of the magnetic layer (i.e., polarizer), thus produces a spin-polarized current.
- Fig. 1 illustrates a magnetic tunnel junction (" ⁇ stack 100 for a conventional MRAM device.
- stack 100 includes one or more seed layers 110 provided at the bottom of stack 100 to initiate a desired crystalline growth in the above-deposited layers.
- MTJ 130 is deposited on top of SAF layer 120.
- MTJ 130 includes reference layer 132, which is a magnetic layer, a non-magnetic tunneling barrier layer (i.e., the insulator) 134, and the free layer 136, which is also a magnetic layer.
- reference layer 132 is actually part of SAF layer 120, but forms one of the ferromagnetic plates of MTJ 130 when the non-magnetic tunneling barrier layer 134 and free layer 136 are formed on reference layer 132.
- magnetic reference layer 132 has a magnetization direction perpendicular to its plane.
- free layer 136 also has a magnetization direction perpendicular to its plane, but its direction can vary by 180 degrees.
- the first magnetic layer 114 in the SAF layer 120 is disposed over seed layer 110.
- SAF layer 120 also has a antiferromagnetic coupling layer 116 disposed over the first magnetic layer 114.
- a nonmagnetic spacer 140 is disposed on top of MTJ 130 and a polarizer ISO is disposed on top of the nonmagnetic spacer 140.
- Polarizer ISO is a magnetic layer that has a magnetic direction in its plane, but is perpendicular to the magnetic direction of the reference layer 132 and free layer 136.
- Polarizer 150 is provided to polarize a current of electrons ("spin-aligned electrons”) applied to MTJ structure 100.
- capping layers 160 can be provided on top of polarizer ISO to protect the layers below on MTJ stack 100.
- a hard mask 170 is deposited over capping layers 160 and is provided to pattern the underlying layers of the MTJ structure 100, using a reactive ion etch (RIE) process.
- RIE reactive ion etch
- in-plane OST structures This defines the operation window for the in-plane OST structures.
- the magnetization direction of the reference layer and free layer are in the plane of the layer.
- the thermal stability requirements may limit the size of the MTJ devices to approximately sixty nanometers or higher.
- Figs.2A-2B shows switching of a free layer 136 of an MTJ. As is seen, free layer 136 has a magnetization direction 200 perpendicular to that of the polarizer 150. The magnetization direction 200 of the free layer 136 can rotate by 180 degrees. Figs.
- FIGS. 2A-2B show precession about the axis of the magnetization vector of free layer 136.
- magnetic vector 200 begins to rotate about its axis in a cone-like manner such that its magnetization vector 200' deflects from the perpendicular axis 202 of free layer 136.
- no component of magnetic vector 200 is in the plane of free layer 136
- a component of magnetic vector 200' can be found both in-plane and orthogonal to free layer 136.
- the rotation of vector 200' extends further from the center of free layer 136, as is seen in Fig. 2B.
- the magnetization direction of polarizer 150 is fixed, which is shown in Figs. 1 and 3. See also U.S. Patent No. 6,532,164, which states that the direction of the magnetization of the polarizing layer cannot vary in the presence of current.
- the free layer 136 Prior to current passing through the MTJ, the free layer 136 has a magnetization direction 200 perpendicular to that of the polarizer 150. While the magnetization direction 200 of the free layer 136 can rotate by 180 degrees, such rotation is normally precluded by the free layer's inherent damping ability 205, which is represented by a vector 205 pointing to axis 202 (shown as a dashed line in Fig. 2A as well as Fig. 3). Axis 202 is perpendicular to the plane of free layer 136. This damping 20S has value, defined by the damping constant, which maintains the magnetization direction of the free layer 136.
- spin transfer torque 210 helps the magnetization direction of the free layer 136 to precess in a cone-like manner around an axis 202 perpendicular to the plane of the layers.
- a spin polarized current traverses the stack 100, the magnetization of the free layer 136 processes in a continuous manner (i.e. it turns on itself in a continuous manner as shown in Fig. 3) with maintained oscillations until the magnetic direction office layer 136 is opposite the magnetic direction prior to the spin torque causing precession, i.e., the magnetic direction of free layer 136 switches by 180 degrees.
- Fig. 3 illustrates precession of a free layer 136 of an MTJ assisted by spin polarized current provided by polarizing magnetic layer ISO.
- the spin polarized electrons from polarizer 150 provide torque 210 that helps overcome the damping 205 in the first half of the precession 215 because the torque 210 provided by the spin polarized current is opposite that of the inherent damping 205 of the free layer 136. This is shown on the right-hand side of the middle portion of Fig. 3.
- the spin polarized electrons from polarizer ISO actually harm the switching process during the second half of the precession 220. The reason for mis is that the spin of the electrons in the spin polarized current only apply a torque 210 in the direction of their polarization.
- the spin transfer torque 210 actually works with the inherent damping 20S of free layer 136 to make rotation more difficult. This is shown in the left-hand side of the middle portion of Fig. 3. Indeed, it is the magnetization vector of the reference layer 132 (not shown in Fig. 3) that overcomes the damping of free layer 136 as well as the spin transfer torque 210 during the half of a precession cycle where the spin of the electrons harms precession, and thus it is the reference layer 132 that allows for completion of precession.
- a magnetic device has a magnetic tunnel junction stack having a significantly improved performance of the free layer in the magnetic tunnel junction structure that requires significantly lower switching currents and which significantly reduces switching times for MRAM applications.
- a magnetic device includes a synthetic antiferromagnetic structure in a first plane.
- the synthetic antiferromagnetic structure includes a magnetic reference layer having a magnetization vector that is perpendicular to the first plane and having a fixed magnetization direction.
- the device also includes a non-magnetic tunnel barrier layer in a second plane that is disposed over the magnetic reference layer.
- a free magnetic layer is in a third plane and is disposed over die non-magnetic tunnel barrier layer.
- the free magnetic layer has a magnetization vector mat is perpendicular to die third plane and also has a magnetization direction that can process from a first magnetization direction to a second magnetization direction.
- the magnetic reference layer, the non- magnetic tunnel barrier layer and the free magnetic layer form a magnetic tunnel junction.
- the device also includes a non-magnetic spacer in a fourth plane that is disposed over the free magnetic layer.
- the device includes a precessional spin current magnetic layer in a fifth plane that is physically separated from the free magnetic layer and coupled to the free magnetic layer by the non-magnetic spacer.
- the precessional spin current magnetic layer has a magnetization vector with a magnetization component in the fifth plane that can freely rotate in any magnetic direction.
- the device also includes a current source that directs electrical current through the precessional spin current magnetic layer, the nonmagnetic spacer, the free magnetic layer, the non-magnetic tunnel barrier layer, and the magnetic reference layer.
- the electrons of the electrical current are aligned in the magnetic direction of the precessional spin current magnetic layer.
- the magnetization direction of the precessional spin current magnetic layer follows precession of the magnetization direction of the free magnetic layer, thereby causing spin transfer torque to assist switching of the magnetization vector of the free magnetic layer.
- the processional spin current magnetic layer of the magnetic device has a circular shape.
- the magnetization direction of the magnetization vector of the processional spin current magnetic layer is in the fifth plane.
- the magnetization direction of the processional spin current magnetic layer has a magnetization component in the fifth plane which can freely rotate in the fifth plane.
- the processional spin current magnetic layer comprises
- the processional spin current magnetic layer is magnetically coupled to the free magnetic layer.
- the processional spin current magnetic layer is electronically coupled to the free magnetic layer.
- precession of the processional spin current magnetic layer is synchronized to precession of the free magnetic layer.
- the processional spin current magnetic layer has a rotation frequency greater than zero.
- a magnetic device in another embodiment, includes a processional spin current magnetic layer in a first plane.
- the processional spin current magnetic layer has a magnetization vector with a magnetization component in the first plane which can freely rotate in any magnetic direction.
- the device includes a non-magnetic spacer layer in a second plane and disposed over the processional spin current magnetic layer.
- a free magnetic layer is in a third plane and disposed over the non-magnetic spacer layer.
- the free magnetic layer has a magnetization vector that is perpendicular to the third plane and also has a magnetization direction that can precess from a first magnetization direction to a second magnetization direction.
- the device has a non-magnetic tunnel barrier layer in a fourth plane and disposed over the free magnetic layer.
- a synthetic anti ferromagnetic structure is in a fifth plane.
- the synthetic antiferromagnetic structure includes a magnetic reference layer having a magnetization vector that is perpendicular to the fifth plane.
- the magnetic reference layer has a fixed magnetization direction.
- the magnetic reference layer, the non-magnetic tunnel barrier and the free magnetic layer form a magnetic tunnel junction.
- the device has a current source that directs electrical current through the precessional spin current magnetic layer, the non-magnetic spacer, the free magnetic layer, the non-magnetic tunnel barrier, and the magnetic reference layer. Electrons of the electrical current are aligned in the magnetic direction of the precessional spin current magnetic layer.
- the magnetization direction of the precessional spin current magnetic layer follows precession of the magnetization direction of the free magnetic layer, thereby causing spin transfer torque to assist switching of the magnetization vector of the free magnetic layer.
- a magnetic device in another embodiment, includes a magnetic tunnel junction in a first plane.
- the magnetic tunnel junction includes a free magnetic layer and a reference magnetic layer.
- the free magnetic layer and the reference magnetic layer are separated by a non-magnetic tunneling barrier layer.
- the free magnetic layer has a magnetization vector that is perpendicular to the first plane, and can precess from a first magnetization direction to a second magnetization direction.
- the device also has a non-magnetic spacer in a second plane coupled to the free magnetic layer.
- a precessional spin current magnetic layer is in a third plane and is coupled through the non-magnetic spacer to the free magnetic layer. The precessional spin current magnetic layer is separated from the free magnetic layer by the non-magnetic spacer.
- the processional spin current magnetic layer has a magnetization vector with a magnetization component in the third plane which can freely rotate in any magnetic direction.
- the magnetization direction of the precessional spin current magnetic layer follows precession of the magnetization direction of the free magnetic layer upon application of current to the device. This causes spin transfer torque to assist switching of the magnetization vector of the free magnetic layer.
- Fig. 1 illustrates a conventional MTJ stack for an MRAM device.
- Figs. 2A and 2B illustrate the precession of the free layer in an MTJ.
- Fig. 3 illustrates the precession of the freeB RIEFr in an MTJ used with a polarizing magnetic layer having a fixed magnetization direction.
- Fig.4 illustrates the precession of the free layer in an MTJ used with a
- precessional spin current magnetic layer having a magnetization direction that rotates freely.
- Fig. S illustrates an MTJ stack for an MRAM device having a precessional spin current magnetic layer.
- Fig. 6 illustrates the magnetic direction of the precessional spin current magnetic layer of an embodiment.
- Figs. 7A-7E are graphs of simulations illustrating the improvement in performance of MTJ devices having precessional spin current magnetic layer.
- Fig. 8 illustrates an alternative embodiment of an MTJ stack for an MRAM device having a precessional spin current magnetic layer.
- This present patent document discloses a MRAM device that does not use a polarization layer having a fixed magnetization direction, and is described with reference to Figs. 3-7. Instead of a polarization layer having a fixed magnetization direction, the MRAM device described in this patent document utilizes a precessional spin current (PSC) magnetic layer 350 in conjunction with a perpendicular MTJ where the in-plane magnetization component direction of the PSC layer is free to rotate.
- PSC precessional spin current
- the PSC magnetic layer 350 will rotate with resonant behavior with the free-layer magnetization precessional dynamics. This will significantly improve the impact of the spin current in overcoming the inherent damping of the free layer 336 since the PSC layer will help the spin torque overcome this damping through the entire orbital motion of the precession cycle rather on only half of the precession. This precessional spin current effect throughout the entire one-hundred eighty degree rotation significantly enhances the free-layer magnetization switching.
- Fig.4 shows the concept behind the MRAM device using a PSC magnetic layer 350 having magnetization vector 270 that rotates instead of a polarization layer 150 having a magnetic vector with a fixed magnetization direction.
- the free layer 336 in this embodiment is similar to the free layer 136 previously discussed, in that it has an inherent damping characteristic 205 that can be overcome with the assistance of spin transfer torque.
- the embodiment shown in Fig.4 replaces polarizing layer 150 with PSC magnetic layer 350.
- (he direction of the spin transfer torque 310 created by spin current passing through free layer 336 changes with the rotation of PSC magnetic layer 350.
- spin transfer torque 310 causes the magnetization direction 200'of the free layer 336 to precess in a cone-like manner around an axis 202 perpendicular to the plane of the layers.
- Fig.4 shows a progression of rotation of the magnetic direction 200' about axis 202.
- the magnetization of the free layer 336 processes in a continuous manner (i.e. it turns on itself in a continuous manner as shown in Fig.4) with maintained oscillations until the magnetic direction of free layer 336 is opposite the magnetic direction prior to the spin torque causing precession, i.e., the magnetic direction of free layer 136 switches by 180 degrees.
- the processional spin current layer 350 and the free-layer 336 are magnetically and/or electronically coupled such that the magnetization direction of the magnetization vector 270 of the PSC magnetic layer 350 follows the processional rotation of the magnetic vector of the free layer 336. This can be seen in Fig. 4.
- the spin polarized electrons provide torque 310 helps to overcome the damping 205 in the first half of the procession 215 because the torque 310 provided by the spin polarized current is opposite that of the inherent damping 205 of the free layer 336.
- the magnetization direction of magnetization vector 270 of PSC magnetic layer 350 rotates.
- the polarization of electrons of the spin current created by PSC magnetic layer 350 changes as well. This means that the direction of torque 310 exerted on magnetic vector of free layer 336 changes well, which is seen on the bottom of Fig. 4.
- the spin of the electrons in the spin polarized current applies a torque 310 in both halves of the precession cycle, including the half of the precession cycle 220 where devices with fixed polarization magnetic layers 150 actually harmed precession. This is seen in the left-hand side of Fig. 4. As is seen, the torque 310 continues to help overcome the inherent damping 205 of free layer 136 throughout the entire precession cycle.
- the processional vector 270 of the PSC magnetic layer 350 follows the processional rotation of the magnetic vector of the free layer 336 by being in alignment therewith.
- precessional vector 270 of the PSC magnetic layer 350 follows the precessional rotation of the magnetic vector of the free layer 336 by trailing the free layer's magnetic vector, as will be discussed below.
- the magnetization direction of the free layer is switched by me spin torque 310 from the reference layer 132 where the direction of the current defines the final state.
- a memory cell with a precessional spin current MTJ structure 300 is shown in Fig. 5.
- MTJ structure 300 includes one or more seed layers 310 provided at the bottom of stack 300 to initiate a desired crystalline growth in the above-deposited layers.
- Synthetic antiferromagnetic (SAF) layer 320 is disposed over seed layer 310.
- SAF layer 320 is comprised of a first SAF layer 332, anti-ferromagnetic coupling layer 316 and second SAF layer 314.
- Second SAF layer 314 is deposited over seed layer 310, while anti- ferromagnetic coupling layer 316 is placed over second SAF layer 314.
- MTJ 330 is deposited over anti-ferromagnetic coupling layer 316.
- first SAF layer 332 which acts as the reference layer of the MTJ, and is also part of SAF layer 320.
- a tunneling barrier layer (i.e., the insulator) 334 is over first SAF layer 332 while the free layer 336 is disposed over tunneling barrier layer 334.
- the magnetization vector of first SAF layer 332 has a magnetization direction that is preferably perpendicular to its plane, although variations of a several degrees are within the scope of what is considered perpendicular.
- free layer 336 also has a magnetization vector that is preferably perpendicular to its plane, but its direction can vary by 180 degrees.
- a nonmagnetic spacer 340 is disposed over of MTJ 330.
- PSC magnetic layer 350 is disposed over nonmagnetic spacer 340.
- PSC magnetic layer 350 has a magnetization vector having a magnetic direction parallel to its plane, and is perpendicular to the magnetic vector of the reference layer 132 and free layer 136.
- One or more capping layers 370 can be provided on top of PSC layer 150 to protect the layers below on MTJ stack 100.
- Nonmagnetic spacer 340 has a number of properties. For example, nonmagnetic spacer 340 physically separates the free layer 336 and the PSC layer 350. Nonmagnetic spacer 340 promotes strong magnetic and/or electronic coupling such mat the magnetic direction of the PSC magnetic layer 350 follows the precession cycle of the free layer 336, In other words, nonmagnetic spacer 340 couples the magnetic direction of the PSC magnetic layer 350 to the magnetic direction of the free layer 336. Nonmagnetic spacer 340 transmits spin current efficiently from the PSC magnetic layer 350 into the free layer 336 because it preferably has a long spin diffusion length. Nonmagnetic spacer 340 also promotes good microstructure and high tunneling magnetoresistance (TMR) and helps keep the damping constant of the free layer 336 low.
- TMR tunneling magnetoresistance
- the magnetization direction of PSC magnetic layer 350 has at least the following properties.
- the magnetization direction of PSC magnetic layer 350 is in the plane of the layer but is perpendicular to magnetization direction of free layer 336.
- the magnetization direction of PSC magnetic layer 350 can have a horizontal component X and perpendicular component Z such mat the angle ⁇ between the plane of free layer 336 and the magnetic direction 270 of PSC magnetic layer 350 can be anywhere between 0 and less than 90 degrees.
- PSC magnetic layer 350 preferably has very low coercivhy and is therefore manufactured with a very soft magnetic material, e.g., less man fifty (50) Oersteds. PSC magnetic layer 350 should have a strong magnetic coupling to free layer 336 so that its magnetization direction follows magnetic direction of free layer 336 as it processes about its axis. In one embodiment, PSC magnetic layer 350 is free to rotate near the same frequency as the precessional motion of the free layer 336. By having nearly the same frequency of the magnetization rotations (PSC magnetic layer 350 magnetization direction and free layer 336 magnetization precession), the free layer switching time is significantly reduced and also tightens the thermal distribution of switching times. In an embodiment, PSC magnetic layer 350 has a rotation frequency greater than zero. Likewise, in an embodiment, PSC magnetic layer 350 has a circular (or near circular) shape so that its magnetization direction has no shape induced anisotropy in the x-y plane (i.e., in the plane of the magnetic film).
- PSC magnetic layer 350 has a circular
- Seed layer 310 in the MTJ structure shown in Fig. 5 preferably comprises Ta, TaN, Cr, Cu, CuN, Ni, Fe or alloys thereof.
- Second SAF layer 314 preferably comprises either a Co/Ni or Co/Pt multilayer structure.
- First SAF layer 332 preferably comprises either a Co/Ni or Co/Pt multilayer structure plus a thin non-magnetic layer comprised of tantalum having a thickness of two to five Angstroms and a thin CoFeB layer (.5 to three nanometers).
- Anti-ferromagnetic coupling layer 316 is preferably made from Ru having thickness in the range of three to ten Angstroms.
- Tunneling barrier layer 334 is preferably made of an insulating material such as MgO, with a thickness of approximately ten Angstroms.
- Free layer 336 is preferably made with CoFeB deposited on top of tunneling barrier layer 334. Free layer 336 can also have layers of Fe, Co, Ni or alloys thereof.
- Spacer layer 340 over MTJ 330 can be any non-magnetic material such as 2 to 20 Angstroms of ruthenium, 2-20 Angstroms of Ta, 2-20 Angstroms of TaN, 2-20
- PSC magnetic layer 350 is preferably made from CoFeB. It can also be made with Co, Fe, Ni magnetic layers or can be made out of their alloys. The magnetic alloys can also have boron, tantalum, copper or other materials.
- capping layer 370 can be any material that provides good interface to PSC layer such as Ta, TaN, Ru, MgO, Cu, etc.
- an electrical current is supplied, for example, by a current source 37S, which passes electrical current through the precessional spin current magnetic layer 350, the non-magnetic spacer 340, the free magnetic layer 336, the non-magnetic tunneling barrier layer 334, and the reference layer 332.
- the electrons of the electrical current passing through the precessional spin current magnetic layer 350 become spin polarized in the magnetic direction thereof, thus creating a spin polarized current that passes through non-magnetic spacer layer 340, free magnetic layer 336, tunneling barrier layer 334, and reference magnetic layer 332.
- the spin polarized current exerts a spin transfer torque on free magnetic layer 336, which helps overcome the inherent damping of the magnetic material making up the free layer 336. This causes the free magnetic layer 336 to process about its axis, which is shown in Fig. 4.
- the magnetic direction of the PSC magnetic layer 350 begins to rotate, as is also seen in Fig. 4. This rotation is caused by the magnetic and/or electronic coupling between the free magnetic layer 336 and the PSC magnetic layer 350 through the non-magnetic spacer 340.
- the rotation of the magnetic direction of the PSC magnetic layer 350 causes the spin polarization of the electrons of the electrical current to change in a manner corresponding to the magnetic direction of the PSC magnetic layer 350.
- the spin of the electrons of the spin polarized current corresponds to the magnetic direction of PSC magnetic layer 350, and the magnetic direction of PSC magnetic layer 350 follows the precession of free magnetic layer 336, the spin of the electrons applies spin transfer torque to the free layer 336 in a direction that varies through an entire switching cycle.
- devices using PSC magnetic layer 350 can provide spin transfer torque 205 for an entire switching cycle.
- the structure described herein utilizing PSC magnetic layer 350 and spacer layer 340 creates precessional magnetization that provides spin current to the free layer 336 of an MTJ throughout the whole precession cycle and therefore significantly enhance the free layer switching process, which will result in faster write times.
- Figs. 7A-7E The results of simulating a device having the structure described herein are seen in Figs. 7A-7E.
- the Y axis is the magnetization in the Z axis of a device 300 from -1.0 to +1.0.
- the X axis shows the amount of time it takes with switch the magnetization direction of free layer 336 180 degrees.
- the precession frequency of the magnetization direction of the PSC magnetic layer 350 is designated as (co) while the precessional frequency of free layer 336 is designated as ( ⁇ ⁇ ).
- the results are shown for ⁇ / ⁇ ⁇ ratios of 0 (Fig. 7A), 0.5 (Fig. 7B), 0.7 (Fig. 7C), 0.9 (Fig. 7D), and 1.0 (Fig. 7E). In all cases the tilt angle is 30 degrees, which indicates the efficiency of the spin current effect.
- Fig. 7A actually show the switching time for a device as in Figs. 1 and 3, i.e., a device with a polarizing layer 150 in which the magnetization direction does not rotate.
- Figs. 7B-7E show the switching times for ⁇ / ⁇ ratios for a device as in Figs.4-6, i.e., a device with a PSC magnetic layer 3S0 in which the magnetization direction rotates and thus follows the precession of free layer 336.
- PSC magnetic layer 350 has a rotation frequency greater than zero. Note that the ⁇ / ⁇ ratio indicates how closely the precessional vector 270 of the PSC magnetic layer 350 follows precession of the free layer 336.
- the frequency of rotation of the precessional vector 270 of the processing PSC magnetic layer 350 is synchronized to be close to the frequency of rotation of free layer 336.
- Fig. 7A shows the switching time for a device such as shown in Figs.
- magnetic device 400 has had its MTJ stack inverted with respect to the embodiment shown in Fig. 5.
- magnetic device 400 includes a seed layer 470.
- PSC magnetic layer 450 is placed over seed layer 450.
- Nonmagnetic spacer 440 is placed over PSC layer 450.
- Nonmagnetic spacer 440 has the same properties, construction and characteristics as nonmagnetic spacer 340, discussed above.
- PSC magnetic layer 450 has the same properties, construction and characteristics as PSC magnetic layer 350, discussed above.
- MTJ 430 is placed over nonmagnetic spacer 440.
- MTJ 430 is generally constructed of free layer 436 (which is placed over nonmagnetic spacer 450) and reference layer 432.
- Free layer 436 and reference layer 432 are spatially separated from each other by tunneling barrier layer 434, which is made of an insulating material.
- Tunneling barrier layer 434 also forms part of synthetic antiferromagnetic (SAF) layer 420.
- SAF layer 420 is comprised of a first SAF layer 432, which is also the reference layer of device 400, anti- ferromagnetic coupling layer 416 and second SAF layer 414.
- Anti-ferromagnetic coupling layer 416 is placed over first SAF layer 432.
- capping layer 410 is placed over SAF layer 420.
- Current can be provided by a current source 474.
- magnetic device operates in the same manner as described with respect to the embodiment shown in Fig. 5.
- PSC magnetic layer 450 rotates in such a way that spin transfer torque 310 is applied in a beneficial manner throughout the entire precession cycle of free layer 436.
- the thin film sputter deposition system can include the necessary physical vapor deposition (PVD) chambers, each having one or more targets, an oxidation chamber and a sputter etching chamber.
- PVD physical vapor deposition
- the sputter deposition process involves a sputter gas (e.g., oxygen, argon, or the like) with an ultra-high vacuum and the targets can be made of the metal or metal alloys to be deposited on the substrate.
- a sputter gas e.g., oxygen, argon, or the like
- the targets can be made of the metal or metal alloys to be deposited on the substrate.
- each MTJ stack 300 can be implemented as a bit cell for a memory array having a plurality of bit cells.
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Abstract
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JP2017564822A JP6770002B2 (en) | 2015-06-16 | 2016-03-10 | Precession spin current structure for MRAM |
KR1020187001466A KR102479222B1 (en) | 2015-06-16 | 2016-03-10 | Precession Spin Current Structure for MRAM |
CN201680035519.0A CN107750382B (en) | 2015-06-16 | 2016-03-10 | Precessional spin current architecture for MRAM |
EP16812075.6A EP3298636B1 (en) | 2015-06-16 | 2016-03-10 | Precessional spin current structure for mram |
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US14/814,036 US9853206B2 (en) | 2015-06-16 | 2015-07-30 | Precessional spin current structure for MRAM |
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Publication number | Publication date |
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KR20180018779A (en) | 2018-02-21 |
EP3298636B1 (en) | 2023-07-05 |
EP3298636A1 (en) | 2018-03-28 |
US20180047894A1 (en) | 2018-02-15 |
US10553787B2 (en) | 2020-02-04 |
US20160372656A1 (en) | 2016-12-22 |
EP3298636A4 (en) | 2019-02-27 |
JP2018522409A (en) | 2018-08-09 |
CN107750382B (en) | 2021-05-25 |
CN107750382A (en) | 2018-03-02 |
KR102479222B1 (en) | 2022-12-19 |
JP6770002B2 (en) | 2020-10-14 |
US10026892B2 (en) | 2018-07-17 |
US9853206B2 (en) | 2017-12-26 |
US20180315920A1 (en) | 2018-11-01 |
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