WO2016204522A1 - Laveur de type à catalyseur au plasma - Google Patents

Laveur de type à catalyseur au plasma Download PDF

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Publication number
WO2016204522A1
WO2016204522A1 PCT/KR2016/006378 KR2016006378W WO2016204522A1 WO 2016204522 A1 WO2016204522 A1 WO 2016204522A1 KR 2016006378 W KR2016006378 W KR 2016006378W WO 2016204522 A1 WO2016204522 A1 WO 2016204522A1
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WO
WIPO (PCT)
Prior art keywords
plasma
reaction unit
housing
catalyst
unit
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PCT/KR2016/006378
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English (en)
Korean (ko)
Inventor
이대훈
송영훈
김관태
조성권
변성현
Original Assignee
한국기계연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from KR1020150084437A external-priority patent/KR101688611B1/ko
Priority claimed from KR1020150153141A external-priority patent/KR101809660B1/ko
Priority claimed from KR1020150155260A external-priority patent/KR101814770B1/ko
Application filed by 한국기계연구원 filed Critical 한국기계연구원
Publication of WO2016204522A1 publication Critical patent/WO2016204522A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D47/00—Separating dispersed particles from gases, air or vapours by liquid as separating agent
    • B01D47/06—Spray cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/32—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by electrical effects other than those provided for in group B01D61/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34—Chemical or biological purification of waste gases
    • B01D53/46—Removing components of defined structure
    • B01D53/68—Halogens or halogen compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34—Chemical or biological purification of waste gases
    • B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • B01D53/77—Liquid phase processes
    • B01D53/78—Liquid phase processes with gas-liquid contact
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34—Chemical or biological purification of waste gases
    • B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • B01D53/86—Catalytic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
    • Y02C20/00—Capture or disposal of greenhouse gases
    • Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a gas aftertreatment apparatus for removing contaminants contained in a treated gas, and more particularly, a hardly degradable process including perfluorinated compounds (PFCs) generated in a semiconductor manufacturing process or various chemical industries.
  • the present invention relates to a plasma-catalyst scrubber for decomposing gas (process gas).
  • PFCs Perfluorinated compounds
  • Perfluorinated compounds (PFCs) from semiconductor processes typically include CF 4 , CHF 3 , C 3 F 6 , CH 2 F 2 , C 2 F 4 , C 2 F 6 , C 3 F 8 , C 4 F 10 , C 5 F 8 , SF 6 , NF 3 , and the like.
  • Perfluorinated compounds (PFCs) are nontoxic but are subject to emission regulations because the global warming index is thousands to tens of times higher than carbon dioxide.
  • PFCs perfluorinated compounds
  • Direct combustion methods have a high reaction temperature above 1400 ° C. and require fuel for combustion.
  • pure oxygen combustion may be performed to obtain a higher temperature condition.
  • the pure oxygen combustion method generates a large amount of NOx due to the process characteristics of combustion at a high temperature condition. NOx is also a major contaminant constrained by the emission totals, which limits the application of the direct combustion method.
  • a method of treating a hardly decomposable gas containing perfluorinated compounds (PFCs) using an electric heater and a catalyst using an electric heater and a catalyst.
  • the catalytic reactor maintains a temperature of 700 to 800 ° C. to treat hardly decomposable gas.
  • the volume of the electric heater and the volume of the catalytic reactor may be excessively large due to low heat transfer efficiency.
  • corrosion of a portion of the electric heater in the normal operation of the catalytic reactor makes the entire system unusable.
  • An object of the present invention is to provide a plasma-catalyst scrubber that decomposes and removes a hardly decomposable process gas (ie, a processing gas) containing perfluorinated compounds (PFCs) using a plasma and a catalyst.
  • a plasma-catalyst scrubber that decomposes and removes a hardly decomposable process gas (ie, a processing gas) containing perfluorinated compounds (PFCs) using a plasma and a catalyst.
  • Another object of the present invention is to provide a plasma-catalyst type scrubber that overcomes temperature variations in the length or volume of the catalyst.
  • PFCs perfluorinated compounds
  • the plasma reaction unit for converting the discharge gas into the thermal energy of the plasma arc into electrical energy and heating while decomposing the treatment gas flowing into one side to the thermal energy, and It includes a catalytic reaction unit for introducing a processing gas heated in the plasma reaction unit to decompose contaminants contained in the processing gas by a catalytic reaction.
  • the plasma reaction unit may include a housing having a first inlet port and a second inlet port at one side thereof to introduce the discharge gas and the processing gas, and to form a narrow neck, and an electrode insulated from the housing and to which a driving voltage is applied.
  • the housing may include an extension part connected to the neck to form an extended space and electrically grounded to induce a rotation arc connected to the electrode.
  • the housing may have a larger diameter extending from the extension than a diameter narrowing from the electrode side with respect to the neck.
  • the plasma reaction unit is formed of a closed cylinder on one side, an electrode to which a driving voltage is applied, and connected to the electrode and electrically grounded to form a discharge gap, and having a first inlet on the discharge gap side to discharge the discharge.
  • the housing may include a gas inlet, and the housing may include an extension that forms an expanded space on the opposite side of the electrode.
  • the housing may further include a second inlet on the discharge gap side to introduce the processing gas.
  • the housing may further include a second inlet at the extension side to introduce the processing gas.
  • the plasma reaction unit may include a housing formed with a closed cylinder on one side and having a first inlet port and a second inlet port, respectively, for introducing the discharge gas and the processing gas, and an RF induction coil disposed at an outer circumference of the housing.
  • the housing may include an extension that forms an expanded space on the opposite side of the RF induction coil.
  • the plasma reaction unit includes a housing formed with a closed cylinder on one side thereof and having a first inlet to introduce the discharge gas, and an RF induction coil disposed on an outer circumference of the housing, wherein the housing includes the RF induction coil.
  • An expansion space may be formed on the opposite side of the expansion space, and the expansion portion may be provided to have a second inlet to introduce the processing gas.
  • the plasma reaction unit is disposed in the longitudinal direction by forming a discharge gap on the outer periphery of the first electrode, the first electrode disposed in the longitudinal direction at the center, and having a first inlet between the first electrode and the discharge It may include a second electrode for introducing gas, and a housing formed in a cylinder to accommodate the second electrode, and a second inlet behind the second electrode to introduce the processing gas.
  • Each of the first electrode and the second electrode may include a cooling water passage for circulating cooling water therein.
  • the plasma reaction unit includes a housing to which the discharge gas is supplied and electrically grounded on one side thereof, an electrode embedded in the housing to form a discharge gap between the inner surface of the housing, and to which a driving voltage is applied, and an outlet of the discharge port of the housing. And a chamber configured to supply the processing gas into the housing through the supply hole of the housing and to flow the plasma arc discharged to the discharge port.
  • the supply hole of the housing may be formed in a tangential direction in contact with the inner peripheral surface of the housing.
  • the catalytic reaction unit may include a catalyst of any one of manganese oxide, precious metals, ruthenium (Ru), and rhodium (Rh).
  • the catalytic reaction part may include a catalyst formed in one of pellet type, spherical shape, honeycomb type and powder type.
  • the catalytic reaction unit may further include a temperature deviation removing unit for solving the temperature deviation in the longitudinal direction in which the heated processing gas flows.
  • the catalytic reaction unit may include a catalyst embedded in a catalyst housing, and the temperature deviation removing unit may include a tube disposed in the length direction in the catalyst and having a plurality of gas passages.
  • the tube may be formed by closing the end of the longitudinal direction.
  • the catalytic reaction part may include a catalyst embedded in a housing, and the temperature deviation removing part may include an RF induction coil disposed on an outer circumference of the housing.
  • Plasma-catalyst scrubber according to another embodiment of the present invention, which is provided at the rear end of the catalytic reaction unit for spraying water on the contaminants decomposed from the treatment gas in the catalytic reaction unit to fix the decomposed contaminants with water It may further include a water treatment.
  • the water treatment unit may supply a neutralizing agent to neutralize a water treatment product containing hydrogen fluoride.
  • Plasma-catalyst scrubber according to another embodiment of the present invention is disposed between the plasma reaction unit and the catalytic reaction unit, the uniformly distributed distribution of the processing gas heated in the plasma reaction unit to the catalytic reaction unit It may further include a flow control unit for controlling.
  • the flow control unit includes a control unit housing connecting the plasma reaction unit and the catalytic reaction unit, and a flow plate disposed in the control unit housing to control the flow, wherein the flow plate is formed in a plane on the plasma reaction unit side. And a minimum diameter portion at the center, and may be diffused in steps from the minimum diameter portion to form a maximum diameter portion on the catalytic reaction part side to make the flow of the processing gas uniform.
  • the flow control unit may include a control unit housing connecting the plasma reaction unit and the catalytic reaction unit, a flow plate disposed in the control unit housing to form a passage, and a fine passage narrower than the passage at one side of the flow plate to process gas. It may include a straightener to uniformize the flow of.
  • the plasma-catalyst scrubber according to another embodiment of the present invention may further include a heater provided outside the catalytic reaction part to heat the catalytic reaction part.
  • the plasma-catalyst scrubber according to another embodiment of the present invention may further include a heat exchanger provided at a rear end of the catalytic reaction unit to recover heat via the processing gas flowing into the plasma reaction unit.
  • Plasma-catalyst scrubber according to another embodiment of the present invention, is provided between the plasma reaction portion and the catalytic reaction portion, the heat in contact with the plasma arc generated in the plasma reaction portion and passing the plasma arc It may further include a heat transfer unit for receiving the energy to heat the processing gas.
  • the heat transfer part is disposed in parallel toward the plasma reaction part and heated by the plasma arc, and includes a plate part having a through hole through which the plasma arc and the processing gas pass, and connected to the plate part in a flow direction of the processing gas. It may include a heat radiation fin that extends.
  • the heat dissipation fins may be disposed in a radial direction of the plate portion on a lower surface of the plate portion.
  • the through holes provided in the plate portion may be disposed between the heat dissipation fins.
  • the heat transfer part and the catalytic reaction part may be embedded in a tube, and the plasma reaction part may be connected to one side of the tube.
  • a multi-plasma reaction including multiple unit plasma reaction units for generating thermal energy of a plasma arc with electrical energy and heating the decomposition gas using the thermal energy is decomposed.
  • a catalytic reaction part connected to the multi-plasma reaction part multiplely introduced into the processing gas heated by the thermal energy into a plurality to decompose contaminants contained in the processing gas by a catalytic reaction of a built-in catalyst.
  • the multi-plasma reaction unit may include a first unit plasma reaction unit and a second unit plasma reaction unit disposed on different sides with the catalyst reaction unit therebetween.
  • the unit plasma reaction unit has a gas inlet on one side to enter the processing gas, form a narrow neck, and is electrically grounded, and an electrode which is insulated from the housing and forms a discharge gap to apply a driving voltage. It may include.
  • the housing may further include a flow controller connected to the neck to form an extended space and electrically extended to induce a rotation arc connected to the electrode to control the flow field.
  • the housing may further include a flow controller connected to the neck to form a space extending in a straight line and electrically contracted to concentrate a rotating arc connected to the electrode to control the flow field.
  • the unit plasma reaction unit may include a housing having a gas inlet on one side and introducing the processing gas into a cylinder, and an electrode insulated from the housing and forming a discharge gap to apply a driving voltage. It may include a flow controller to form a space extending in a straight line and formed of a cylinder to flow a rotating arc connected to the electrode electrically grounded to control the flow field.
  • Plasma-catalyst scrubber is a process chamber for generating a hardly decomposable gas containing a perfluorinated compound by performing a semiconductor manufacturing process, the discharge gas to the electrical energy of the plasma arc thermal energy Converting the process gas introduced into one side into a heat energy while decomposing the process gas into the thermal energy, and decomposing contaminants contained in the process gas by introducing a processing gas heated by the plasma reaction part into a catalytic reaction. It may include a catalytic reaction unit, and a vacuum pump disposed between the process chamber and the plasma reaction unit is connected to each other to supply the processing gas of the process chamber to the plasma reaction unit.
  • the plasma-catalyst scrubber according to another embodiment of the present invention may further include a prefilter disposed between the vacuum pump and the plasma reaction unit to filter particulate matter contained in the processing gas.
  • the process chamber may be provided in plural, and the vacuum pump may be provided in plural and connected to the plurality of process chambers, respectively, to the plasma reaction unit.
  • the plasma reaction unit may be provided in plural to correspond to each of the plurality of vacuum pumps, and the catalytic reaction unit may be connected to the plurality of plasma reaction units.
  • the plasma-catalyst scrubber includes a plasma reaction part and a catalytic reaction part to heat the processing gas with the thermal energy of the plasma arc to supply the catalytic reaction part to the perfluorinated compounds (PFCs). It is possible to decompose and remove the hardly decomposable gas.
  • PFCs perfluorinated compounds
  • the temperature deviation removing unit provided in the catalytic reaction unit may eliminate the temperature deviation of the catalytic reaction unit in the longitudinal direction in which the heated processing gas flows.
  • the driving power supplied to the plasma reaction unit is controlled according to the inflow amount of the perfluorinated compound included in the processing gas, that is, the temperature of the plasma is controlled, thereby reducing the operating cost of the plasma reaction unit.
  • the plasma-catalyst scrubber according to another embodiment of the present invention includes a multi-plasma reaction part and a catalytic reaction part, and heats the processing gas with the thermal energy of the multi-plasma arc generated in the multi-plasma reaction part, thereby providing As a result, it is possible to efficiently decompose and remove hardly decomposable gas containing perfluorinated compounds (PFCs).
  • PFCs perfluorinated compounds
  • the multi-plasma reaction unit heats up to a temperature at which the catalytic reaction unit can operate while firstly decomposing the processing gas by the thermal energy of the multi-plasma arc, thereby inducing secondary decomposition by the catalytic reaction unit, thereby increasing the decomposition efficiency of the processing gas and consuming power. Can be reduced.
  • the multi-plasma reaction unit distributes power consumption, the durability of each plasma reaction unit (for example, the electrode and the housing) can be improved, compared to the concentration of the power consumption in the existing single plasma reaction unit. It can improve the lifespan.
  • the multi-plasma reaction unit supplies thermal energy of the multi-plasma arc to the catalytic reaction unit in various directions, even in a large volume of the catalytic reaction unit, the temperature distribution is uniform within the catalytic reaction unit, and heat loss is lower than that of the single plasma reaction unit. Can be minimized.
  • the plasma-catalyst scrubber includes a plasma generating unit, a heat transfer unit, and a catalytic reaction unit, and heats the processing gas by thermal energy of the plasma arc, and heats the processing gas by the catalytic reaction.
  • Degradation of contaminants allows removal of contaminants (eg, perfluorinated compounds (PFCs) and N 2 O) without generating nitrogen oxides (NOx).
  • a processing gas is driven in a process chamber by driving a vacuum pump provided between a plasma chamber and a process chamber that generates a processing gas by performing a semiconductor manufacturing process. Since it is supplied to the plasma reaction unit, the treatment gas containing perfluorinated compounds (PFCs) generated in the semiconductor manufacturing process may be decomposed and removed by plasma and catalyst.
  • PFCs perfluorinated compounds
  • FIG. 1 is a block diagram of a plasma-catalyst type scrubber according to a first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view showing an example of a plasma reaction unit applied to the scrubber shown in FIG. 1.
  • FIG. 3 is a block diagram of a plasma-catalyst type scrubber according to a second embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a catalytic reaction unit applied to the scrubber shown in FIG. 3.
  • FIG. 5 is a cross-sectional view of a plasma reaction unit applied to the scrubber shown in FIG. 3.
  • FIG. 6 is a cross-sectional view of a catalytic reaction part applied to a scrubber of a plasma-catalyst method according to a third embodiment of the present invention.
  • FIG. 7 is a configuration diagram of a plasma-catalyst scrubber according to a fourth embodiment of the present invention.
  • FIG. 8 is a cross-sectional view of the flow control unit applied to the scrubber shown in FIG.
  • FIG. 9 is a cross-sectional view of a flow control unit applied to a plasma-catalyst scrubber according to a fifth embodiment of the present invention.
  • FIG. 10 is a block diagram of a plasma-catalyst type scrubber according to a sixth embodiment of the present invention.
  • FIG. 11 is a graph illustrating control of driving power supplied to a plasma reaction unit according to the inflow amount of perfluorinated compound included in the processing gas in the scrubber shown in FIG.
  • FIG. 12 is a cross-sectional view of a plasma reaction unit applied to a plasma-catalyst scrubber according to a seventh embodiment of the present invention.
  • FIG. 13 is a cross-sectional view of a plasma reaction unit applied to a plasma-catalyst scrubber according to an eighth embodiment of the present invention.
  • FIG. 14 is a cross-sectional view of a plasma reaction unit applied to a plasma-catalyst scrubber according to a ninth embodiment of the present invention.
  • FIG. 15 is a cross-sectional view of a plasma reaction unit applied to a scrubber of a plasma-catalyst method according to a tenth embodiment of the present invention.
  • 16 is a cross-sectional view of a plasma reaction unit applied to a plasma-catalyst scrubber according to an eleventh embodiment of the present invention.
  • 17 is a block diagram of a plasma-catalyst type scrubber according to a twelfth embodiment of the present invention.
  • FIG. 18 is a cross-sectional view of a plasma reaction unit applied to the scrubber shown in FIG. 17.
  • FIG. 19 is a cross-sectional view taken along the line XIX-XIX of FIG. 18.
  • FIG. 20 is a perspective view of a heat transfer part applied to the scrubber shown in FIG. 17.
  • FIG. 21 is a cross-sectional view taken along the line XXI-XXI of FIG. 20.
  • 22 is a block diagram of a multi-plasma-catalyzed scrubber according to a thirteenth embodiment of the present invention.
  • FIG. 23 is a cross-sectional view of a catalytic reaction unit applied to the scrubber shown in FIG. 22.
  • 24 is a block diagram of a unit plasma reaction unit applied to a scrubber of a multi-plasma catalyst according to a fourteenth embodiment of the present invention.
  • FIG. 25 is a block diagram illustrating a unit plasma reaction unit applied to a scrubber of a multi-plasma catalyst according to a fifteenth embodiment of the present invention.
  • FIG. 26 is a configuration diagram of a scrubber of a multi-plasma catalyst according to a sixteenth embodiment of the present invention.
  • FIG. 27 is a configuration diagram of a multi-plasma-catalyzed scrubber according to a seventeenth embodiment of the present invention.
  • FIG. 28 is a configuration diagram of a plasma-catalyst scrubber according to an eighteenth embodiment of the present invention.
  • 29 is a configuration diagram of a plasma-catalyst scrubber according to a nineteenth embodiment of the present invention.
  • FIG. 30 is a configuration diagram of a plasma-catalyst type scrubber according to a twentieth embodiment of the present invention.
  • FIG. 31 is a configuration diagram of a plasma-catalyst type scrubber according to a twenty-first embodiment of the present invention.
  • FIG. 32 is a configuration diagram of a plasma-catalyst type scrubber according to a twenty-second embodiment of the present invention.
  • FIG 33 is a configuration diagram of a plasma-catalyst type scrubber according to a twenty-third embodiment of the present invention.
  • thermal plasma is generated by arc discharge, the temperature inside the plasma arc may rise to several thousand to tens of thousands of degrees Celsius, and the gas temperature around the plasma arc may be maintained at 500 degrees Celsius or more. have. Therefore, the plasma reaction part of the present invention has a different characteristic from that of generating a non-thermal plasma, and there is no dielectric layer between the electrodes.
  • FIG. 1 is a block diagram of a plasma-catalyst type scrubber according to a first embodiment of the present invention.
  • the plasma-catalyst scrubber of the first embodiment includes a plasma reaction unit 10 and a catalytic reaction unit 20 to decompose and remove a treatment gas containing perfluorinated compounds (PFCs).
  • a plasma reaction unit 10 and a catalytic reaction unit 20 to decompose and remove a treatment gas containing perfluorinated compounds (PFCs).
  • PFCs perfluorinated compounds
  • the plasma reaction unit 10 is configured to generate a high temperature plasma arc in the discharge gas by the electric energy of the driving voltage HV supplied. Therefore, the plasma reaction unit 10 converts electrical energy into thermal energy.
  • the hardly decomposable process gas ie, processing gas
  • contaminants eg, perfluorinated compounds (PFCs)
  • PFCs perfluorinated compounds
  • the catalytic reaction unit 20 is configured to introduce a high temperature plasma and a processing gas heated by high temperature thermal energy generated in the plasma reaction unit 10 to decompose the processing gas by a catalytic reaction.
  • the catalytic reaction unit 20 contains a catalyst (see FIG. 2).
  • FIG. 2 is a cross-sectional view showing an example of a plasma reaction unit applied to the scrubber shown in FIG. 1.
  • the plasma reaction unit 10 includes a housing 11, an electrode 12, and an extension 114 to generate a high temperature plasma arc to decompose and heat the processing gas.
  • the housing 11 has a first inlet 111 on one side and a second inlet 112 on the other side, respectively, to discharge the discharge gas and the processing gas into the first and second inlets 111 and 112, respectively.
  • the housing 11 forms a neck 113, which is a passage of the smallest diameter, after being narrowed to the first inclination ⁇ 1 on the inner circumferential surface. Therefore, the processing gas and the plasma arc are compressed while going from the first inlet 111 side of the housing 11 to the neck 113 side.
  • the first inlet 111 may be formed in a tangential direction with respect to the circumferential direction of the inner circumferential surface of the housing 11. Therefore, the discharge gas may flow in the tangential direction of the first inlet 111 and rotate in the housing 11. That is, the discharge gas can be distributed quickly and uniformly with the hot plasma arc.
  • the electrode 12 is mounted in an insulating state in the housing 11, a driving voltage HV is applied thereto, and a discharge gap G is formed between the electrode 12 and the inner circumferential surface of the housing 11.
  • An electrical insulation member 14 is provided between the electrode 12 and the housing 11 at one side.
  • the electrode 12 is tapered at a first inclination ⁇ 1 so as to form a distance D parallel to the inner peripheral surface narrowing in the housing 11. That is, the outer circumferential surface of the electrode 12 and the inner circumferential surface of the housing 11 may form the same distance D between each other, or may be formed (not shown) by increasing the distance toward the neck 113. Therefore, the plasma generated in the discharge gap G may be more stably compressed toward the neck 113 between the electrode 12 and the housing 11.
  • extension 114 is connected to an end of the neck 113 and is extended to a second slope ⁇ 2 greater than the first slope ⁇ 1 and electrically grounded. Substantially, extension 114 may be viewed as extending housing 11.
  • the housing 11 is formed in two pieces, and the extension part 114 is formed separately. Therefore, the length of the neck 113 and the second slope ⁇ 2 of the extension 114 may be set in various combinations.
  • the second inclination ⁇ 2 of the extension 114 prevents the rotating arc A, which is connected to the electrode 12, from being induced adjacent to the neck 113 and positioned far from the neck 113. Allow long induction.
  • the extension part 114 is connected to the neck part 113 to form an expanded space and is electrically grounded at the wide part. Therefore, the rotating arc A connecting the wide portion of the electrode 12 and the extension 114 can be induced long.
  • the length of the neck 113 and the second slope ⁇ 2 of the extension 114 may induce a length of the rotating arc A to make the temperature distribution of the rotating arc A uniform.
  • the rotating arc A is generated by the rotation of the hot plasma arc. As the length of the rotating arc A increases, the concentration of the plasma arc is relaxed in the ground portion of the central electrode 12 and the extension 114. Therefore, corrosion of the extension 114 by the plasma arc can be alleviated. That is, the rotating arc A may increase the resistance of the extension 114 to corrosion.
  • the expanded diameter of the expansion part 114 is formed to be larger than the diameter of the housing 11 narrowing on the electrode 12 side about the neck 113. That is, the expansion part 114 forms a space that is expanded than the inner space of the housing 11.
  • the high temperature plasma arc and the processing gas are concentrated in the neck 113 and then rapidly expand and expand into the wide space of the extension 114 at the rear of the neck 113 to rotate along the circumferential surface of the extension 114.
  • the temperature uniformity in the radial direction with respect to the plasma arc and the processing gas may be further improved in the housing 11 and the extension 114.
  • the plasma reaction unit 10 may be operated only with a discharge gas such as N 2 or Ar for generating an arc plasma, or may be used as a discharge gas by using a part or all of the processing gas.
  • the plasma reaction unit 10 of FIG. 2 uses a discharge gas supplied separately from the processing gas.
  • the high temperature rotating arc A and the processing gas supplied from the plasma reaction unit 10 to the catalytic reaction unit 20 have a uniform temperature distribution in the expansion section 114 in the radial direction, and thus the catalytic reaction unit 20
  • the rotating arc A and the processing gas form a uniform temperature distribution in the cavity.
  • the rotating arc A and the processing gas having a uniform temperature distribution in the radial direction in the plasma reaction unit 10 have a temperature distribution in which the temperature deviation is removed in the longitudinal direction in the catalytic reaction unit 20.
  • the perfluorinated compound (PFC) which is a contaminant contained in the treatment gas, forms a substantially uniform temperature distribution in the radial direction and the longitudinal direction via the plasma reaction unit 10 and the catalytic reaction unit 20, thereby catalyzing the catalytic reaction unit. It can be effectively decomposed and removed by the catalytic reaction at (20).
  • FIG. 3 is a configuration diagram of a plasma-catalyst type scrubber according to a second embodiment of the present invention
  • FIG. 4 is a cross-sectional view of a catalytic reaction unit applied to the scrubber shown in FIG. 3.
  • the plasma-catalyst scrubber of the second embodiment includes a plasma reaction unit 10, a catalyst reaction unit 20, and a water treatment unit 30.
  • the plasma reaction unit 10 is configured to generate a plasma arc in the discharge gas by the electrical energy of the driving power supplied, thereby converting the electrical energy into thermal energy.
  • the process gas ie, processing gas
  • contaminants eg, perfluorinated compounds (PFCs)
  • PFCs perfluorinated compounds
  • the catalytic reaction unit 20 is configured to introduce a high temperature plasma heated by the thermal energy generated by the plasma reaction unit 10 and the processing gas to decompose contaminants contained in the processing gas by the catalytic reaction.
  • the catalytic reaction unit 20 may embed various types of catalysts according to contaminants to be treated.
  • the catalytic reaction unit 20 may include a manganese oxide-based, precious metal-based, ruthenium (Ru) or rhodium (Rh) catalyst.
  • Manganese oxide, precious metals, ruthenium (Ru) or rhodium (Rh) catalyst can decompose nitrogen oxide (N 2 O) contained in the treatment gas.
  • the catalyst reaction part 20 includes a temperature deviation removing part 25.
  • the temperature deviation removing unit 25 is embedded in the catalyst reaction unit 20 to remove and minimize the temperature deviation in the longitudinal direction in which the heated processing gas flows due to the thermal energy of the plasma generated by the plasma reaction unit 10.
  • the catalytic reaction unit 20 is built into the catalyst housing 21 for distributing the hot plasma and the heated processing gas, and the catalyst housing 21 for distributing the plasma and the processing gas to catalyze the reaction gas. It comprises a catalyst 22 to.
  • the temperature deviation removing unit 25 includes a tube 23 disposed in the catalyst 22 in the longitudinal direction of the catalyst reaction unit 20 and the flow direction of the processing gas, and a plurality of gas passages provided in the tube 23. (24).
  • the tube 23 is formed by closing the end of the longitudinal direction so that the hot plasma and the processing gas flowing into one side are distributed through the gas passages 24 while passing through the inside of the tube 23.
  • the tube 23 is disposed in the longitudinal direction of the catalytic reaction unit 20 and includes the gas passages 24, it is possible to uniformly supply high temperature plasma and the processing gas in the entire longitudinal direction of the catalytic reaction unit 20. Can be.
  • the catalytic reaction part 20 containing the tube 23 may maintain a generally uniform temperature range in the longitudinal direction.
  • the tube 23 is heated to a high temperature through its own conductive heat transfer to heat the surrounding catalyst 22, so that the heat transfer can be induced more efficiently.
  • the catalyst 22 maintains a high temperature condition of 700 to 800 ° C. or higher that causes decomposition reaction of the perfluorinated compound (CF 4 ) on the inlet side and the outlet side into which the high temperature plasma and the processing gas flow into.
  • the tube 23 is the temperature variation as a whole within the catalytic reaction section 20 Can be minimized.
  • the perfluorinated compound CF 4 which is a contaminant contained in the processing gas, may be effectively decomposed and reacted in the catalyst 22. Can be.
  • the water treatment unit 30 is provided at the rear end of the catalytic reaction unit 20, and the catalytic reaction unit 20 fixes the decomposed material with water by spraying water on the material decomposed from the contaminants of the treatment gas.
  • the pollutant is decomposed in the catalytic reaction unit 20 and the treated gas that is treated in the water treatment unit 30 is discharged from the water treatment unit 30.
  • the treated gas is free from contaminants.
  • the water treatment unit 30 sprays water (H 2 0) on a substance decomposed from a perfluorinated compound (PFC), and fixes the decomposed substance with hydrogen fluoride (HF) to treat hydrogen fluoride (HF). Fix with water.
  • the water treatment unit 30 may include a nozzle (not shown) for spraying water.
  • the water treatment unit 30 may supply a neutralizing agent to neutralize a water treatment product including hydrogen fluoride (HF), and discharge a treatment gas from which a perfluorinated perfluorinated compound (PFC) is removed. That is, the water treatment unit 30 may be connected to a neutralizer supply line (not shown), and a discharge line (not shown) for discharging the treated gas from which the pollutant is removed.
  • a neutralizing agent to neutralize a water treatment product including hydrogen fluoride (HF), and discharge a treatment gas from which a perfluorinated perfluorinated compound (PFC) is removed.
  • FIG. 5 is a cross-sectional view of a plasma reaction unit applied to the scrubber shown in FIG. 3.
  • the plasma reaction unit 10 includes a housing 11 that forms a discharge portion and a processing gas in which the neck 113 flows in and narrows, and the driving voltage HV is insulated from the housing 11. Electrode 12 is applied.
  • the housing 11 includes a first inlet 111 and a second inlet 112 at one side, and introduces a processing gas, which is a discharge gas for plasma discharge and a process gas including contaminants, into the interior thereof.
  • a processing gas which is a discharge gas for plasma discharge and a process gas including contaminants
  • the first inlet 111 may be provided at one side and may be formed in a tangential direction with respect to the circumferential direction of the inner surface of the housing 11. Therefore, the discharge gas may flow in the tangential direction of the first inlet 111 to induce rotation in the housing 11.
  • the housing 11 further includes an extension 114 connected to the neck 113 to form an extended space S and electrically grounded, and extending from the neck 113. Since a wide portion of the extension 114 is electrically grounded, a rotating arc RA connecting the electrode 12 and the wide portion of the extension 114 may be long.
  • the rotating arc RA is generated by the rotation of the plasma arc.
  • the rotating arc RA mitigates the concentration of the plasma arc at the grounded portion of the center electrode 12 and the housing 11 and thus mitigates corrosion of the housing 11 by the plasma arc. That is, the rotating arc RA may increase the resistance of the housing 11 to corrosion.
  • the housing 11 may have a larger diameter extending from the extension part 114 side than a diameter narrowing from the electrode 12 side around the neck 113 in the flow direction of the processing gas.
  • the housing 11 and the extension part ( 114) As such, after the plasma arc and the processing gas are concentrated in the neck 113 and rapidly expand and expand into the wide space S of the extension 114 at the rear of the neck 113, the housing 11 and the extension part ( 114, the temperature uniformity in the radial direction with respect to the plasma arc and the processing gas can be improved.
  • the plasma reaction unit 10 may be operated only with a discharge gas such as N 2 or Ar for generating plasma, or may be used as a discharge gas by using part or all of the processing gas.
  • the plasma reaction unit 10 of FIG. 5 uses all of the processing gas and the discharge gas as the discharge gas.
  • the design of the electrode 12 and the housing 11 is required so that corrosion problems do not occur in the plasma reaction unit 10.
  • the inside of the electrode 12 and the housing 11 is formed in a streamlined shape.
  • the neck 113 is streamlined to avoid concentration of the plasma arc.
  • the high temperature plasma arc and the processing gas supplied from the plasma reaction unit 10 to the catalytic reaction unit 20 have a uniform temperature distribution in the expansion section 114 in the radial direction, so that the catalyst housing of the catalytic reaction unit 20 Within 21, the plasma arc and the processing gas form a uniform temperature distribution.
  • the plasma arc and the processing gas having a uniform temperature distribution in the radial direction in the plasma reaction unit 10 have a temperature distribution in which the temperature deviation is removed in the longitudinal direction in the catalytic reaction unit 20.
  • the perfluorinated compound (PFC) which is a contaminant contained in the processing gas, forms a uniform temperature distribution in the radial direction and the longitudinal direction through the plasma reaction unit 10 and the catalytic reaction unit 20, and thus the catalyst 22 It can be effectively decomposed and removed by a catalytic reaction at.
  • FIG. 6 is a cross-sectional view of a catalytic reaction part applied to a scrubber of a plasma-catalyst method according to a third embodiment of the present invention.
  • the catalytic reaction unit 220 includes a catalyst 22 embedded in the catalyst housing 21 and a temperature deviation removing unit 225.
  • the temperature deviation removing unit 225 may be formed of a radio frequency (RF) induction coil disposed on an outer circumference of the catalyst housing 21. RF power of a few to several hundred MHz band is applied to the temperature deviation removing unit 225 to generate a plasma inside the catalyst housing 21 by RF discharge. RF discharge can generate high temperature and high density plasma.
  • RF radio frequency
  • the temperature deviation removing unit 225 formed of the RF induction coil generates plasma by RF discharge in the interior of the catalytic reaction unit 220 to remove the temperature deviation in the longitudinal direction of the catalytic reaction unit 220.
  • the perfluorinated compound (PFC) which is a contaminant contained in the treatment gas, forms a uniform temperature distribution in the radial direction and the longitudinal direction via the plasma reaction unit 10 and the catalytic reaction unit 220, thereby providing a catalyst 22. It can be effectively decomposed and removed by a catalytic reaction at.
  • FIG. 7 is a configuration diagram of a plasma-catalyst scrubber according to a fourth embodiment of the present invention.
  • the plasma-catalyst scrubber of the fourth embodiment includes a flow control unit 40 disposed between the plasma reaction unit 10 and the catalytic reaction unit 20.
  • the flow control unit 40 is configured to control the high temperature plasma arc and the heated processing gas generated in the plasma reaction unit 10 to have a uniform temperature distribution in the radial direction and to supply the catalyst reaction unit 20.
  • FIG. 8 is a cross-sectional view of the flow control unit applied to the scrubber shown in FIG.
  • the flow control unit 40 is disposed in the control unit housing 41 connecting the plasma reaction unit 10 and the catalyst reaction unit 20, and the control unit housing 41 to flow the plasma arc and the processing gas. It includes a flow plate 42 for controlling.
  • the flow plate 42 has a minimum diameter portion 422 formed in the plane 421 on the side of the plasma reaction portion 10 to form a passage 424 in the center, and diffuses stepwise at the minimum diameter portion 422. And a maximum diameter portion 423 for uniformizing the flow of the plasma arc and the processing gas in the radial direction.
  • the maximum diameter part 423 is formed on the catalyst reaction part 20 side.
  • the flow control unit 40 may improve the temperature uniformity in the radial direction with respect to the plasma arc and the processing gas in the control unit housing 41. That is, the plasma arc and the processing gas form a high density in the plane 421 and the minimum diameter portion 422, and then spread uniformly in the radial direction from the maximum diameter portion 423 while passing through the passage 424. Have.
  • FIG. 9 is a cross-sectional view of a flow control unit applied to a plasma-catalyst scrubber according to a fifth embodiment of the present invention.
  • the flow control unit 240 is disposed in the control unit housing 41 and the control unit housing 41, and a flow plate 243 forming a passage 242, and a straightener. (244).
  • the straightener 244 is disposed in the diffusion space at one side of the flow plate 243 and is formed as a fine passage 245 that is narrower than the passage 242 to uniformly flow the plasma arc and the processing gas.
  • the straightener 244 having the fine passages 245 may be formed in a mesh or honeycomb structure.
  • the plasma arc and the processing gas form a high density in the passage 242 of the fluid plate 243, and then diffuse in the diffusion space, and then, through the fine passage 245 of the straightener 244, the catalytic reaction part ( 20) to have a uniform temperature distribution in the radial direction.
  • FIG. 10 is a block diagram of a plasma-catalyst type scrubber according to a sixth embodiment of the present invention.
  • the plasma-catalyst scrubber of the sixth embodiment further includes a heater 50 provided outside the catalytic reaction unit 20.
  • the heater 50 may intermittently heat the catalytic reaction unit 20 separately from the plasma reaction unit 10. In other words, when decomposing CF 4, which is the most difficult decomposition of pollutants perfluorinated compounds (PFC), a temperature of 750 ⁇ 800 °C is required. In addition, CF 4 may not be continuously discharged to the treatment gas. In this case, the plasma reaction unit 10 is stopped running, and the heater 50 is driven auxiliary. Therefore, the operating cost of the plasma reaction unit 10 can be reduced.
  • PFC pollutants perfluorinated compounds
  • a sensor 52 is provided in the passage 51 for supplying the processing gas to the plasma reaction unit 10.
  • the sensor 52 detects a specific component, for example, CF 4 , in the supplied processing gas, thereby selectively controlling the plasma reaction unit 10 and the heater 50.
  • the plasma reaction unit 10 is stopped and the temperature of the catalytic reaction unit 20 is controlled using a heater 50.
  • the plasma reaction unit 10 may be driven in a section in which CF 4 is discharged.
  • the heater 50 and the plasma reaction unit 10 are driven to increase the temperature of the processing gas up to the decomposition temperature of CF 4 , so that a temperature suitable for the catalytic reaction can be effectively formed.
  • FIG. 11 is a graph illustrating control of driving power supplied to a plasma reaction unit according to the inflow amount of perfluorinated compound included in the processing gas in the scrubber shown in FIG.
  • the driving voltage HV is supplied to the plasma reaction unit 10 (b) to drive the plasma reaction unit 10. Increase the temperature of the treatment gas (c).
  • a large amount of driving power is supplied to rapidly increase the temperature of the processing gas (e.g., above 750 ° C, which is a decomposition temperature of CF 4 ), and then gradually reduce the driving power supply to the processing gas. Respond quickly to changes in the influent flow of CF 4 contained.
  • the plasma-catalyst scrubber of the sixth embodiment further includes a heat exchanger 45 provided at a rear end of the catalytic reaction unit 20.
  • the heat exchanger 45 may recover the waste heat discharged to the rear end of the catalytic reaction unit 20 via the processing gas introduced into the plasma reaction unit 10, and heat the processing gas to supply the plasma reaction unit 10. have. Therefore, an operating cost for driving the plasma reactor 10 and the heater 50 may be further lowered.
  • FIG. 12 is a cross-sectional view of a plasma reaction unit applied to a plasma-catalyst scrubber according to a seventh embodiment of the present invention.
  • the plasma reactor 610 is formed of a closed cylinder on one side and connected to an electrode 612 to which a driving voltage HV is applied, and an electrode 612 and electrically grounded. To form a discharge gap (G).
  • An insulating member 613 is provided between the housing 611 and the electrode 612 to electrically insulate the two.
  • the insulating member 613 includes a first inlet 631 to introduce discharge gas into the electrode 612 and the housing 611.
  • the insulating member 613 further includes a second inlet 632 to introduce the processing gas into the electrode 612 and the housing 611. That is, the insulating member 613 is installed at the discharge gap G side.
  • the housing 611 further includes an extension 614 forming an expanded space on the opposite side of the electrode 612.
  • the extension 614 is connected to the catalytic reaction section 20.
  • the housing 611 has a third inlet 633 just before the extension 614.
  • the third inlet 633 sprays water (H 2 O) on the material decomposed from the perfluorinated compound (PFC) to fix the decomposed material with hydrogen fluoride (HF).
  • the plasma reactor 610 may minimize the erosion of the electrode 612 mainly generated at the contact of the plasma arc because the contact of the plasma arc PA is not fixed to the ground of the high voltage electrode 612 and the housing 611. have.
  • the plasma reaction unit 610 is a processing gas because the flow path set inside the electrode 612 and the housing 611 is simple, and a process gas is decomposed and treated by directly supplying the processing gas to the plasma arc PA.
  • the flow rate of can be greatly increased.
  • FIG. 13 is a cross-sectional view of a plasma reaction unit applied to a plasma-catalyst scrubber according to an eighth embodiment of the present invention.
  • the plasma reactor 710 includes a housing 711 that is electrically grounded and an electrode 712 to which a driving voltage HV is applied.
  • An insulating member 713 is provided between the housing 711 and the electrode 712, and the insulating member 713 has a first inlet 731 to discharge the discharge gas into the electrode 712 and the housing 711. Inflow.
  • the housing 711 further includes a second inlet 732 adjacent to the extension 714 side.
  • the second inlet 732 supplies the processing gas to the rear end of the housing 711, that is, behind the plasma arc PA2 formed in the discharge gap G. That is, the second inlet 732 may supply the processing gas in a stable state of the plasma arc PA2 and increase the flow rate of the processing gas.
  • the housing 711 has a third inlet 733 opposite the second inlet 732 immediately before the extension 714.
  • the third inlet 733 sprays water (H 2 O) on the material decomposed from the perfluorinated compound (PFC) to fix the decomposed material with hydrogen fluoride (HF).
  • FIG. 14 is a cross-sectional view of a plasma reaction unit applied to a plasma-catalyst scrubber according to a ninth embodiment of the present invention.
  • the plasma reaction unit 810 includes a housing 811 formed on a closed cylinder of one side and an RF induction coil 812 disposed on an outer circumference of the housing 811.
  • the housing 811 is provided with a first inlet 831 and a second inlet 832 on one side to inject the discharge gas and the processing gas, respectively.
  • RF power of several to several hundred MHz bands is applied to the RF induction coil 812 to generate a plasma arc PA3 in the housing 811.
  • RF discharge can generate high temperature and density plasma arc (PA3).
  • housing 811 further includes an extension 814 forming an expanded space on the opposite side of the RF induction coil 812.
  • the extension 814 is connected to the catalytic reaction section 20.
  • Housing 811 has a third inlet 833 at extension 814.
  • the third inlet 833 is sprayed with water (H 2 0) to the material decomposed from the perfluorinated compound (PFC) to fix the decomposition material with hydrogen fluoride (HF).
  • FIG. 15 is a cross-sectional view of a plasma reaction unit applied to a scrubber of a plasma-catalyst method according to a tenth embodiment of the present invention.
  • the plasma reactor 910 includes a housing 911 having one side closed by a cylindrical cylinder and an RF induction coil 912 disposed on an outer circumference of the housing 911.
  • the housing 911 has a first inlet 931 at one side to inject a discharge gas.
  • the housing 911 has an extension 914 which forms an expanded space on the opposite side of the RF induction coil 912.
  • the housing 911 includes a second inlet 932 in the expansion part 914 to introduce a processing gas, and has a third inlet 933.
  • the third inlet 933 sprays water (H 2 O) on the material decomposed from the perfluorinated compound (PFC) to fix the decomposed material with hydrogen fluoride (HF).
  • 16 is a cross-sectional view of a plasma reaction unit applied to a plasma-catalyst scrubber according to an eleventh embodiment of the present invention.
  • the plasma reactor 510 includes a first electrode 511, a second electrode 512, and a housing 513.
  • the first electrode 511 is disposed in the longitudinal direction at the center thereof and serves as a cathode.
  • the second electrode 512 forms a discharge gap G5 on the outer circumference of the first electrode 511 and is disposed in the longitudinal direction to act as an anode, and a first inlet port between the first electrode 511 and the first electrode 511. 531 is provided to introduce a discharge gas.
  • the housing 513 is formed in a cylinder to accommodate the second electrode 512.
  • the second electrode 512 has a discharge port 515 narrowed at the end of the first electrode 511. Therefore, the plasma arc PA generated between the first electrode 511 and the second electrode 512 connected to the DC power is rapidly expanded in the housing 513 while being discharged to the narrow discharge port 515. That is, the plasma arc PA5 may form a uniform temperature distribution in the radial direction of the housing 513.
  • the housing 513 includes a second inlet 532 at the rear of the second electrode 512, and introduces the processing gas and water into the second inlet 532. Therefore, the high temperature plasma arc and the processing gas are uniformly formed in the temperature distribution and are supplied to the catalytic reaction unit 20.
  • the plasma reaction unit 510 of the eleventh embodiment is advantageous in delivering high energy to the DC torch type.
  • first electrode 511 and the second electrode 512 have cooling water passages 541 and 542 for circulating the cooling water therein.
  • the cooling water passages 541 and 542 may circulate the cooling water to cool the first electrode 511 and the second electrode 512, which are overheated by the plasma discharge, to an appropriate temperature.
  • 17 is a block diagram of a plasma-catalyst type scrubber according to a twelfth embodiment of the present invention.
  • the plasma-catalyst scrubber of the twelfth embodiment includes a plasma reaction unit 10, a heat transfer unit 60, a catalyst reaction unit 20, and a water treatment unit 30.
  • the plasma reaction unit 10 is configured to generate a plasma arc in the discharge gas by the supplied electrical energy, thereby converting the electrical energy into thermal energy.
  • the processing gas containing contaminants is supplied to the plasma arc discharge side of the plasma reaction unit 10.
  • the treatment gas may be directly heated by a hot plasma arc.
  • the heat transfer part 60 is in contact with the plasma arc generated in the plasma reaction part 10 to be directly heated by the plasma arc heat, and in the process, a part of the processing gas is decomposed and transfers heat energy of the plasma arc while passing through the plasma arc. And heat or partially decompose the process gas passing therethrough.
  • the heat transfer part 60 is heated by passing heat of the processing gas heated in contact with the hot plasma arc and the plasma arc.
  • the plasma reaction unit 10 and the heat transfer unit 60 can significantly reduce the amount of power consumed, as compared with the prior art of pyrolyzing the processing gas only by the plasma method.
  • the catalytic reaction unit 20 is configured to introduce a processing gas heated in the heat transfer unit 60 to decompose contaminants contained in the processing gas by a catalytic reaction.
  • the catalytic reaction unit 20 may embed various types of catalysts according to contaminants to be treated.
  • the water treatment unit 30 sprays the water decomposed from the contaminants in the catalytic reaction unit 20 to fix the decomposed substance with water, and contaminants are decomposed in the catalytic reaction unit 20 and the water treatment unit 30 is disposed. It is configured to discharge treated gas which does not contain contaminants remaining after water treatment.
  • the plasma-catalyzed scrubber of one embodiment further includes a tube (70).
  • the tubular body 70 includes the heat transfer part 60 and the catalyst reaction part 20 at set intervals, and serves as a catalyst housing of the heat transfer part 60 and the catalyst reaction part 20.
  • the plasma reaction unit 10 is connected to the upper side of the tube 70
  • the water treatment unit 30 is connected to the lower side of the tube 70. That is, the tubular body 70 connects the plasma reaction unit 10 and the water treatment unit 30, so that the high temperature plasma arc and the processing gas are the plasma reaction unit 10, the heat transfer unit 60, the catalytic reaction unit 20, and the water. It flows to the processing part 30.
  • the catalytic reaction unit 20 decomposes the perfluorinated compound (PFC) contained in the treatment gas by the catalytic reaction.
  • the water treatment unit 30 sprays water (H 2 O) on the substance decomposed from the perfluorinated compound (PFC) to fix the decomposed substance with hydrogen fluoride (HF).
  • the water treatment unit 30 includes nozzles 31 and 32 for spraying water.
  • the water treatment unit 30 supplies a neutralizing agent to neutralize the water treatment product including hydrogen fluoride (HF), and discharges the treatment gas from which the perfluorinated compound (PFC) is removed. That is, the neutralizer supply line 34 via the valve 33 to be opened and closed is connected to the water treatment unit 30, and a discharge line 35 to discharge the treatment gas from which the pollutant is removed is connected.
  • a neutralizing agent to neutralize the water treatment product including hydrogen fluoride (HF)
  • PFC perfluorinated compound
  • FIG. 18 is a cross-sectional view of the plasma reaction unit applied to the scrubber shown in FIG. 17, and FIG. 19 is a cross-sectional view taken along the line XIX-XIX of FIG. 18.
  • the plasma reactor 10 includes a housing 11, an electrode 12, and a chamber 15 to generate a plasma arc in a discharge gas with electrical energy.
  • electrical energy is converted into thermal energy.
  • the housing 11 is connected to the heat transfer part 60 by supplying a discharge gas to one side and being electrically grounded.
  • the housing 11 may be formed in various structures, but may be formed in a cylindrical embodiment. Substantially, the housing 11 is coupled to the tubular body 70 containing the heat transfer part 60.
  • the electrode 12 is embedded in the housing 11 to form a discharge gap G between the inner surface of the housing 11.
  • the gap between both gradually narrows, then forms a minimum gap, and then gradually widens.
  • the discharge gap G is set at the minimum distance between the electrode 12 and the housing 11.
  • the driving voltage HV is applied to the electrode 12.
  • the insulating member 14 is interposed between the electrode 12 and the housing 11.
  • the insulating member 14 electrically insulates the electrode 12 and the housing 11 from each other.
  • the insulating member 14 also includes a discharge gas hole 145. Therefore, the discharge gas is supplied to the discharge gap G in the housing 11 through the discharge gas hole 145 of the insulating member 14.
  • the chamber 15 is disposed outside the discharge port 115 of the housing 11, and is processed into the housing 11 through a plurality of supply holes 116 formed around the discharge hole 115 of the housing 11. Gas can be supplied.
  • the supply hole 116 flows the plasma arc discharged to the discharge port 115 of the housing 11 as the processing gas is supplied.
  • the processing gas supplied to the supply hole 116 acts on the plasma arc to change the discharge direction of the plasma arc, thereby continuously changing the position where the plasma arc reaches the heat transfer part 60.
  • the hot plasma arc is not supplied toward only a part of the heat transfer part 60, but is supplied over a large area of the heat transfer part 60. That is, the heat transfer part 60 may be exposed to the plasma arc and the processing gas uniformly supplied in the tube body 70 to receive uniform heat. That is, the treatment gas via the heat transfer part 60 is heated uniformly.
  • the supply hole 116 is formed in a tangential direction in contact with the inner circumferential surface of the housing 11. Therefore, the processing gas supplied into the housing 11 through the supply hole 116 in the chamber 15 causes swirling in the discharge port 115 of the housing 11.
  • the plasma arc and the processing gas heated by the plasma arc are discharged to the heat transfer part 60 while causing a swirl in the discharge port 115. Therefore, the heat transfer efficiency of the heat transfer part 60 may be increased.
  • FIG. 20 is a perspective view of a heat transfer part applied to the scrubber shown in FIG. 17, and FIG. 21 is a cross-sectional view taken along the line XXI-XXI of FIG. 20.
  • the heat transfer part 60 includes a plate portion 61 and a heat dissipation fin 62.
  • the plate portion 61 is disposed in parallel toward the plasma reaction portion 10 and directly heated by the plasma arc, and includes a plurality of through holes 601 passing through the plasma arc and the processing gas.
  • the heat dissipation fins 62 are connected to the plate portion 61 to extend in the flow direction of the plasma arc and the processing gas.
  • the heat dissipation fins 62 may be disposed on the lower surface of the plate portion 61 to cross in the radial direction of the plate portion 61.
  • the through holes 601 provided in the plate portion 61 are disposed between the heat dissipation fins 62 to facilitate the flow of the processing gas.
  • the plate portion 61 is thus heated in direct contact with the plasma arc and the heated process gas.
  • the heat dissipation fins 62 may be connected to the plate portion 61 and heated with heat conduction, thereby further heating the processing gas passing through the through holes 601 of the plate portion 61.
  • the catalytic reaction unit 20 is configured to decompose contaminants contained in the treatment gas supplied by being heated in the heat transfer unit 60 by a catalytic reaction.
  • the water treatment unit 30 sprays the water decomposed from the contaminants in the catalytic reaction unit 20 to fix the decomposed material with water.
  • the treatment gas may include nitrogen oxide (N 2 O) as a contaminant.
  • the catalytic reaction unit 20 decomposes nitrogen oxide (N 2 O) included in the treatment gas by a catalytic reaction.
  • the catalytic reaction unit 20 may include a manganese oxide-based, precious metal-based, ruthenium (Ru) or rhodium (Rh) catalyst.
  • Manganese oxide, precious metals, ruthenium (Ru) or rhodium (Rh) catalysts decompose nitrogen oxide (N 2 O) contained in the treatment gas.
  • 22 is a block diagram of a multi-plasma-catalyzed scrubber according to a thirteenth embodiment of the present invention.
  • the multi-plasma catalytic scrubber of the thirteenth embodiment includes a multi-plasma reaction part 100 (101, 102), a catalyst reaction part 20, and a water treatment part 30.
  • the multi-plasma reaction unit 100 (101, 102) is configured to generate a plasma arc in the discharge gas by the electrical energy of the supplied driving voltage (HV), that is, convert the electrical energy into thermal energy of the plasma arc.
  • HV supplied driving voltage
  • Process gas ie, processing gas
  • hardly degradable contaminants eg, perfluorinated compounds (PFCs)
  • PFCs perfluorinated compounds
  • the catalytic reaction unit 20 is configured to decompose contaminants contained in the processing gas by introducing a high temperature plasma and a processing gas heated by the heat energy generated by the multi-plasma reaction unit 100 (101; 102). do.
  • the catalytic reaction unit 20 may embed various types of catalysts according to contaminants to be treated.
  • the catalytic reaction unit 20 may include a manganese oxide-based, precious metal-based, ruthenium (Ru) or rhodium (Rh) catalyst.
  • Manganese oxide, precious metals, ruthenium (Ru) or rhodium (Rh) catalyst can decompose nitrogen oxide (N 2 O) contained in the treatment gas.
  • the multi-plasma reaction unit (100; 101, 102) is connected to the catalyst reaction unit (20) in a multiple manner to process the multi-plasma and heated processing gas through the catalytic reaction unit (20). ) To multiple feeds.
  • the multi-plasma arc and the heated treatment gas supplied in a plurality make the temperature distribution uniform throughout the catalyst volume inside the catalytic reaction section 20.
  • the multi-plasma reaction unit 100 may include a first unit plasma reaction unit 101 and a second unit plasma reaction unit 102 disposed on different sides with the catalyst reaction unit 20 therebetween. .
  • the first unit plasma reaction unit 101 and the second unit plasma reaction unit 102 are disposed on opposite sides of the catalyst reaction unit 20 to supply the plasma arc and the heated processing gas to the catalyst reaction unit 20, respectively. do. Therefore, the temperature distribution inside the catalyst reaction unit 20 may be more uniform than supplying the plasma arc and the heated processing gas in the single plasma reaction unit.
  • FIG. 23 is a cross-sectional view of a catalytic reaction unit applied to the scrubber shown in FIG. 22.
  • the catalytic reaction unit 20 includes a catalyst housing 21 for distributing high-temperature multi-plasma and heated processing gas, and a catalyst housing 21 for distributing multi-plasma and heated processing gas. And a catalyst 22 that catalyzes the treatment gas.
  • the high temperature multi-plasma and the heated processing gas supplied from the first unit plasma reaction unit 101 and the second unit plasma reaction unit 102 heat the catalyst 22 in the catalyst housing 21 to a temperature capable of catalyzing reaction.
  • the catalyst 22 may form a uniform temperature distribution in the entire volume inside the catalyst housing 21.
  • Catalyst 22 may be formed as spherical as shown, or as pelletized, honeycomb, or powdered, not shown.
  • the catalyst 22 may be formed of various materials depending on the type of processing gas. The hardly decomposable contaminants included in the treatment gas may be primarily decomposed by the multi-plasma in the first and second unit plasma reactors 101 and 102, and further decomposed secondly by the catalytic reaction unit 20.
  • the water treatment unit 30 is provided at the rear end of the catalytic reaction unit 20, and the catalytic reaction unit 20 fixes the decomposed material with water by spraying water on the material decomposed from the contaminants of the treatment gas.
  • contaminants are decomposed in the first and second unit plasma reaction units 101 and 102 and the catalytic reaction unit 20, and the treated gas treated by the water treatment unit 30 is discharged from the water treatment unit 30.
  • the treated gas is free from contaminants.
  • the water treatment unit 30 sprays water (H20) on the material decomposed from the perfluorinated compounds (PFCs) to fix the decomposed material with hydrogen fluoride (HF), and fix the hydrogen fluoride (HF) with water.
  • the water treatment unit 30 may further include a nozzle (not shown) for spraying water.
  • the water treatment unit 30 may supply a neutralizing agent to neutralize a water treatment product including hydrogen fluoride (HF), and discharge a treatment gas from which perfluorinated compounds (PFCs) are removed. That is, the water treatment unit 30 may be connected to a neutralizer supply line (not shown), and a discharge line (not shown) for discharging the treated gas from which the pollutant is removed.
  • a neutralizing agent to neutralize a water treatment product including hydrogen fluoride (HF), and discharge a treatment gas from which perfluorinated compounds (PFCs) are removed.
  • HF hydrogen fluoride
  • PFCs perfluorinated compounds
  • the plasma reaction unit shown in FIG. 5 may be applied to the first and second unit plasma reaction units 101 and 102 applied to the multi-plasma catalyst scrubber according to the present embodiment, and as described above with reference to FIG. 5. Can be driven.
  • PFCs perfluorinated compounds
  • the multi-plasma reaction unit 100 is provided with the first and second unit plasma reaction units 101 and 102 to enable miniaturization. As the concentration of the first and second unit plasma reactors 101 and 102 by the first plasma decomposed by the multi-plasma decreases, the volume of the catalytic reaction unit 20 and the catalyst 22 may be reduced. Therefore, it is possible to reduce the volume of the catalyst reaction portion 20 and the volume of the catalyst 22 required for the thermal insulation. That is, the volume of the entire multi-catalyst catalytic scrubber may be reduced.
  • first and second unit plasma reactors 101 and 102 distribute power consumption, the power consumption is concentrated in the existing single plasma reactor, thereby reducing power consumption through multiplexing, Durability of the electrode 12 and the housing 11 can be improved.
  • 24 is a block diagram of a unit plasma reaction unit applied to a scrubber of a multi-plasma catalyst according to a fourteenth embodiment of the present invention.
  • the housing 211 is connected to a neck 213 that forms a discharge gap G between the electrode 12 and a straight space extending in a straight line S2. It includes a flow control unit 214 to form a.
  • the flow control unit 214 may be contracted more than the space of the housing 211 to control the flow field so as to concentrate the rotating arc RA2 electrically grounded and connected to the electrode 12. Since the flow control unit 214 contracted more than the diameter of the housing 211 concentrates the rotating arc RA2, the temperature of the processing gas is higher than that of the first and second unit plasma reaction units 101 and 102 of the twelfth embodiment. Can be effectively raised.
  • FIG. 25 is a block diagram illustrating a unit plasma reaction unit applied to a scrubber of a multi-plasma catalyst according to a fifteenth embodiment of the present invention.
  • the unit plasma reaction unit 310 may include a housing 311 formed in a cylinder, and an electrode 12 insulated from the housing 311 and forming a discharge gap G3 to which a driving voltage is applied. Include.
  • the housing 311 has a gas inlet (for example, a first inlet 111 and a second inlet 112) at one side, and introduces a discharge gas and a treatment gas.
  • the housing 311 includes a flow controller 314 forming a space S3 extending in a straight line.
  • the flow controller 314 may be formed in a cylinder to flow the rotating arc RA3 electrically connected to the electrode 12 to be electrically grounded to control the flow field.
  • the flow controller 314 is formed in the same cylinder as the housing 311 to form the rotating arc RA3, it is easy to process, and the first and second unit plasma reaction units 101 and 102 and the thirteenth embodiment of the twelfth embodiment
  • the temperature of the processing gas may be increased to about the middle of the unit plasma reaction unit 210 of the embodiment.
  • 26 is a configuration diagram of a multi-plasma-catalyzed scrubber according to a sixteenth embodiment of the present invention.
  • the multi-plasma reaction unit 410 is a first unit plasma reaction unit disposed on different sides with the catalyst reaction unit 20 therebetween. 411, a second unit plasma reaction unit 412, and a third unit plasma reaction unit 413.
  • the first unit plasma reaction unit 411, the second unit plasma reaction unit 412, and the third unit plasma reaction unit 413 are disposed at right angles to each other in the catalytic reaction unit 20 and heated with the plasma arc in each of them.
  • the treatment gas is supplied to the catalytic reaction unit 20. Therefore, the temperature distribution inside the catalyst reaction unit 20 may be more uniform than supplying the heated treatment gas in the first and second unit plasma reaction units 101 and 102 of the twelfth embodiment.
  • the multi-plasma catalytic scrubber of this embodiment further includes a heater 50.
  • the heater 50 is provided at the outer peripheries of the first, second, and third unit plasma reaction units 411, 412, and 413 connected to the catalytic reaction unit 20, respectively, and flows into the catalytic reaction unit 20. And the treatment gas is further heated.
  • the heater 50 may be driven separately from the first, second, and third unit plasma reaction units 411, 412, and 413 to heat the processing gas supplied to the catalytic reaction unit 20.
  • CF 4 which is the most difficult decomposition of perfluorinated perfluorinated compounds (PFCs)
  • a temperature of 750 to 800 ° C is required.
  • CF 4 may not be continuously discharged to the treatment gas.
  • the first, second, and third unit plasma reaction units 411, 412, and 413 may be stopped and the heater 50 may be auxiliary. Therefore, operating costs of the first, second, and third unit plasma reactors 411, 412, 413 can be reduced.
  • a sensor (not shown) is provided in a passage (not shown) for supplying the processing gas to the first, second, and third unit plasma reaction units 411, 412, and 413, and the processing gas to which the sensor is supplied.
  • a specific component for example, CF 4
  • the first, second, and third unit plasma reaction units 411, 412, 413 and the heater 50 may be selectively controlled.
  • the first, second, and third unit plasma reaction units 411, 412, and 413 are stopped and the catalyst is heated using the heater 50.
  • the temperature of the processing gas supplied to the reaction unit 20 may be maintained at a predetermined level, and the first, second, and third unit plasma reaction units 411, 412, and 413 may be driven in a section in which CF 4 is discharged. .
  • the heater 50 and the first, second, and third unit plasma reaction units 411, 412, and 413 are driven to raise the temperature of the processing gas to the decomposition temperature of CF 4 , so that the temperature is suitable for the catalytic reaction. Can be effectively formulated.
  • the water treatment unit 30 is provided at the rear end of the catalyst reaction unit 20 to connect the heater 50, the first, second, and third unit plasma reaction units 411, 412, 413, and the catalytic reaction unit 20. Water is injected into the decomposed material from the contaminants of the processing gas while passing through, and the decomposed material is fixed with water.
  • the plasma reactors shown in FIGS. 13 and 16 may be applied and may be driven in the manner described with reference to FIGS. 13 and 16. .
  • FIG. 27 is a configuration diagram of a multi-plasma-catalyzed scrubber according to a seventeenth embodiment of the present invention.
  • the multi-plasma-catalyzed scrubber may supply the processing gas to the front of the unit plasma reaction part 500 or to the front of the catalytic reaction part 20, or to supply the processing gas from both sides. It can be configured to supply.
  • the processing gas may be supplied to the front of the unit plasma reaction unit 500, the flow control unit 514, or the front of the catalyst reaction unit 20, or at least two. It may be formed to supply the processing gas in place.
  • FIG. 28 is a configuration diagram of a plasma-catalyst type scrubber according to an eighteenth embodiment of the present invention.
  • the plasma-catalyst scrubber of the eighteenth embodiment further includes a process chamber 130 and a vacuum pump 140 in front of the plasma reaction unit 10 as compared with the first embodiment.
  • the process chamber 130 is a vacuum chamber that performs a semiconductor manufacturing process and generates a hardly decomposable gas containing a perfluorinated compound during the process.
  • the vacuum pump 140 is disposed between the process chamber 130 and the plasma reaction unit 10, and supplies the process gas (ie, processing gas) generated in the process chamber 130 to the plasma reaction unit 10.
  • the plasma-catalyst scrubber of the eighteenth embodiment shows an example in which the processing gas generated in the process chamber 130 performing the semiconductor manufacturing process is decomposed and removed in the plasma reaction unit 10 and the catalytic reaction unit 20. have.
  • the process gas generated in the process chamber 130 is heated to a high temperature while being partially decomposed by a high-temperature rotating arc in the plasma reaction unit 10 by the operation of the vacuum pump 140, and a catalytic reaction unit 20 requiring high temperature. Can be decomposed into a catalytic reaction without a separate heating means.
  • 29 is a configuration diagram of a plasma-catalyst scrubber according to a nineteenth embodiment of the present invention.
  • the plasma-catalyst scrubber according to the nineteenth embodiment further includes a prefilter 150 disposed between the vacuum pump 140 and the plasma reaction unit 10 as compared with the eighteenth embodiment. Include.
  • the prefilter 150 filters the particulate matter contained in the process gas (ie, the processing gas) supplied from the vacuum pump 140 to prevent the particulate matter from entering the plasma reaction unit 10.
  • the prefilter 150 prevents the particulate matter from being supplied to the catalytic reaction unit 20 to cause clogging in the catalyst 22.
  • the prefilter 150 may prevent this problem.
  • FIG. 30 is a configuration diagram of a plasma-catalyst type scrubber according to a twentieth embodiment of the present invention.
  • the plasma-catalyst scrubber according to the twentieth embodiment includes a plurality of process chambers 131, 132, and 133 and a vacuum pump 141, 142, and 143 as compared with the eighteenth embodiment. And a plurality of) are connected to the process chambers 131, 132, and 133, respectively.
  • the plurality of vacuum pumps 141, 142, and 143 are commonly connected to one plasma reactor 10 through a common line 123. That is, the plasma-catalyst scrubber of the twentieth embodiment connects the plurality of vacuum pumps 141, 142, and 143 to the plasma reaction unit 10 to decompose process gases in the process chambers 131, 132, and 133 in common. do. Therefore, the processing capacity of the plasma reaction unit 10 and the catalyst reaction unit 20 may be increased.
  • FIG. 31 is a configuration diagram of a plasma-catalyst type scrubber according to a twenty-first embodiment of the present invention.
  • the plasma-catalyst scrubber according to the twenty-first embodiment includes a process chamber 130 and a vacuum pump 140 in front of the plasma reaction unit 10 as compared with the first embodiment.
  • the apparatus further includes a water treatment unit 55 provided at the rear of the catalytic reaction unit 20.
  • the water treatment unit 55 is connected to the rear of the catalytic reaction unit 20, the water in the catalytic reaction unit 20 by spraying the water decomposed from the contaminants of the treatment gas to fix the decomposition material with water.
  • the pollutant is decomposed in the catalytic reaction unit 20 and the treatment gas treated in the water treatment unit 55 is discharged from the water treatment unit 55.
  • the treated gas is free from contaminants.
  • the water treatment unit 55 sprays water (H 2 0) on a substance decomposed from a perfluorinated compound (PFC), and fixes the decomposed substance with hydrogen fluoride (HF) to treat hydrogen fluoride (HF). Fix with water.
  • the water treatment unit 55 may include a nozzle (not shown) for spraying water.
  • the water treatment unit 55 may supply a neutralizing agent to neutralize a water treatment product including hydrogen fluoride (HF), and discharge a treatment gas from which a perfluorinated perfluorinated compound (PFC) is removed. That is, the neutralizer supply line (not shown) may be connected to the water treatment unit 55, and a discharge line (not shown) for discharging the treatment gas from which the pollutant is removed may be connected.
  • a neutralizing agent to neutralize a water treatment product including hydrogen fluoride (HF), and discharge a treatment gas from which a perfluorinated perfluorinated compound (PFC) is removed.
  • FIG. 32 is a configuration diagram of a plasma-catalyst type scrubber according to a twenty-second embodiment of the present invention.
  • the plasma-catalyst scrubber of the twenty-second embodiment includes a plurality of process chambers 134 and 135 and a plurality of vacuum pumps 144 and 145 as compared with the eighteenth embodiment. It is connected to each of the process chambers 134 and 135, and a plurality of plasma reaction units 101 and 102 are provided to connect to the vacuum pumps 144 and 145, respectively.
  • the plurality of vacuum pumps 144 and 145 are connected to the plasma reactors 101 and 102 by lines 441 and 451, respectively.
  • the catalytic reaction unit 20 is connected to each side of the plurality of plasma reaction units 101 and 102, and is connected to the water treatment unit 55 on the other side. That is, the plasma reaction units 101 and 102 are connected to both sides of the catalytic reaction unit 20, so that the high-temperature rotating arc A and the processing gas are supplied to both sides of the catalytic reaction unit 20.
  • the catalytic reaction unit 20 is heated by the rotating arc A and the processing gas supplied to both sides to decompose the processing gas and supply it to the water treatment unit 55. That is, the plasma-catalyst scrubber of the twenty-second embodiment decomposes the processing gas by connecting the plurality of plasma reaction units 101 and 102 to the catalytic reaction unit 20, thereby increasing the processing capacity and improving the temperature uniformity in the catalyst 22. Can be kept higher.
  • FIG 33 is a configuration diagram of a plasma-catalyst type scrubber according to a twenty-third embodiment of the present invention.
  • the plasma-catalyst scrubber of the twenty-third embodiment further includes a heat transfer unit 60 provided between the plasma reaction unit 10 and the catalytic reaction unit 20 as compared with the twenty-first embodiment. do.
  • the heat transfer part 60 is in contact with the rotating arc (A) of the high temperature plasma generated in the plasma reaction unit 10, is directly heated by the heat of the rotating arc (A) of the high temperature plasma, and decomposes a part of the processing gas in the process.
  • the heat energy of the rotating arc A is transmitted while passing through the rotating arc A of the high temperature plasma, thereby heating or partially decomposing the processing gas therethrough.
  • the process gas passing through the heat transfer part 60 is indirectly 800 degrees Celsius (the catalyst reaction part is a catalyst). Temperature to react). Therefore, the plasma reaction unit 10 and the heat transfer unit 60 can significantly reduce the amount of power consumed, as compared with the prior art of pyrolyzing the processing gas only by the plasma method.
  • the heat transfer part 60 includes a plate portion 61 and a heat dissipation fin 62.
  • the plate portion 61 is disposed in parallel toward the plasma reaction unit 10 and directly heated by the rotating arc A of the high temperature plasma, and the plurality of through holes passing through the rotating arc A and the processing gas of the high temperature plasma. 601 is provided.
  • the heat dissipation fins 62 are connected to the plate portion 61 so as to extend in the flow direction of the rotating arc A of the high temperature plasma and the processing gas.
  • the heat dissipation fins 62 may be disposed on the lower surface of the plate portion 61 to cross in the radial direction of the plate portion 61.
  • the through holes 611 provided in the plate portion 61 are disposed between the heat dissipation fins 62 to facilitate the flow of the processing gas.
  • the plate portion 61 is thus heated in direct contact with the rotating arc A of the high temperature plasma and the heated process gas.
  • the heat dissipation fins 62 may be connected to the plate portion 61 and heated with heat conduction, thereby further heating the processing gas passing through the through holes 611 of the plate portion 61.
  • the catalytic reaction unit 20 decomposes the contaminants contained in the processing gas that is heated and supplied by the heat transfer unit 60 into a catalytic reaction.
  • the water treatment unit 55 sprays water on the material decomposed from the contaminant in the catalytic reaction unit 20 to fix the decomposed material with water.

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Abstract

La présente invention concerne un appareil de post-traitement de gaz permettant d'éliminer les polluants contenus dans un gaz à traiter et, plus particulièrement, un laveur de type à catalyseur au plasma permettant de décomposer un gaz de traitement non décomposable (gaz à traiter) contenant des composés perfluorés (PFC) devant être générés dans un procédé de fabrication de semi-conducteurs ou diverses industries chimiques. Le laveur de type à catalyseur au plasma de la présente invention comprend : une partie de réaction au plasma permettant de convertir un gaz de décharge en énergie thermique d'un plasma au moyen d'énergie électrique, et de chauffer le gaz à traiter qui s'écoule vers un côté tout en décomposant le gaz à traiter avec l'énergie thermique ; et une partie de réaction catalytique permettant de recevoir le gaz à traiter, ayant été chauffé au niveau de la partie de réaction au plasma, et de décomposer, par une réaction catalytique, les polluants contenus dans le gaz à traiter.
PCT/KR2016/006378 2015-06-15 2016-06-15 Laveur de type à catalyseur au plasma WO2016204522A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR1020150084437A KR101688611B1 (ko) 2015-06-15 2015-06-15 플라즈마-촉매 방식의 스크러버
KR10-2015-0084437 2015-06-15
KR10-2015-0153141 2015-11-02
KR1020150153141A KR101809660B1 (ko) 2015-11-02 2015-11-02 멀티 플라즈마 촉매 방식 스크러버
KR10-2015-0155260 2015-11-05
KR1020150155260A KR101814770B1 (ko) 2015-11-05 2015-11-05 플라즈마촉매 방식의 스크러버

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WO2016204522A1 true WO2016204522A1 (fr) 2016-12-22

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CN108159882A (zh) * 2018-03-06 2018-06-15 车继鲁 一种工业废气处理系统及处理方法
CN110508109A (zh) * 2019-08-14 2019-11-29 南京苏曼等离子科技有限公司 旋转弧热等离子体催化裂解高浓度voc尾气处理系统与方法
WO2020141642A1 (fr) * 2019-01-03 2020-07-09 주식회사 글로벌스탠다드테크놀로지 Système de traitement de gaz dangereux basé sur un plasma et un catalyseur de chauffage diélectrique
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KR20220036828A (ko) * 2020-09-16 2022-03-23 한국기계연구원 스크러버, 이를 포함하는 스크러버 시스템, 및 스크러버의 구동 방법
CN115155285A (zh) * 2022-05-20 2022-10-11 江苏贯森新材料科技有限公司 一种超薄软态不锈钢带生产用酸雾废气处理装置

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CN107875829A (zh) * 2017-11-15 2018-04-06 山东艾派仕环保科技有限公司 一种废气处理用高压电离分解净化塔及其处理方法
CN108159882A (zh) * 2018-03-06 2018-06-15 车继鲁 一种工业废气处理系统及处理方法
WO2020141642A1 (fr) * 2019-01-03 2020-07-09 주식회사 글로벌스탠다드테크놀로지 Système de traitement de gaz dangereux basé sur un plasma et un catalyseur de chauffage diélectrique
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KR102292828B1 (ko) 2019-07-24 2021-08-25 주식회사 소로나 진공펌프 전단 설치형 저온 플라즈마-촉매 스크러버
CN110508109A (zh) * 2019-08-14 2019-11-29 南京苏曼等离子科技有限公司 旋转弧热等离子体催化裂解高浓度voc尾气处理系统与方法
KR20220036828A (ko) * 2020-09-16 2022-03-23 한국기계연구원 스크러버, 이를 포함하는 스크러버 시스템, 및 스크러버의 구동 방법
KR102521378B1 (ko) * 2020-09-16 2023-04-13 한국기계연구원 스크러버, 이를 포함하는 스크러버 시스템, 및 스크러버의 구동 방법
CN115155285A (zh) * 2022-05-20 2022-10-11 江苏贯森新材料科技有限公司 一种超薄软态不锈钢带生产用酸雾废气处理装置
CN115155285B (zh) * 2022-05-20 2023-11-03 四川罡宸不锈钢有限责任公司 一种超薄软态不锈钢带生产用酸雾废气处理装置

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