WO2016202021A1

WO2016202021A1 - Flexible neural microelectrode array

Info

Publication number: WO2016202021A1
Application number: PCT/CN2016/076183
Authority: WO
Inventors: 张贯京; 陈兴明; 葛新科
Original assignee: 深圳市华科安测信息技术有限公司
Priority date: 2015-06-13
Filing date: 2016-03-12
Publication date: 2016-12-22
Also published as: CN204767032U

Abstract

A flexible neural microelectrode array comprises a flexible substrate (1), an insulation layer (2), a microelectrode unit (3), conducting wires (4) and lead soldering joints (5). The microelectrode units (3), the conducting wires (4) and the lead soldering joints (5) are provided on the flexible substrate (1). The microelectrode units (3) and the lead soldering joints (5) are connected by the conducting wires (4). The insulation layer (2) covers the flexible substrate (1). The microelectrode unit (3) penetrates and is exposed from the insulation layer (2). The flexible substrate (1) is provided with a plurality of hollow protrusions (7) that penetrates and is exposed from the insulation layer (2). The microelectrode units (3) are provided on the hollow protrusions (7) of the flexible substrate (1). An adhesion layer (6) is provided on the hollow protrusions (7) on the insulation layer (2). The microelectrode units (3) are provided on the adhesion layer (6), so as to effectively reduce contact resistance and mechanical strength of microelectrodes.

Description

Flexible nerve microelectrode array

Technical field

The utility model relates to the field of biomedical equipment, in particular to a flexible neural microelectrode array.

Background technique

In the medical diagnosis or the corresponding research, it is necessary to measure and record the internal potential of the human body or the animal to be studied. In addition, transcutaneous electrical stimulation is a commonly used method for assisting disease treatment in clinical practice. All kinds of medical measuring instruments need to communicate with the body through appropriate electrodes when performing bioelectrical detection and applying electrical stimulation to the patient. The electrical signal is transmitted when the bioelectrical detection is performed on the human nervous system. Neuromicroelectrode arrays have been widely studied and applied to nerve repair implantable devices in recent years due to their excellent biocompatibility and small damage to tissue. However, based on such a flexible substrate, it is generally a planar electrode array. Currently, the micro-scale flexible microelectrode exists in the absence of surface modification. There are two problems: 1. The presence of the insulating layer causes the metal electrode portion to be depressed. In the state, the electrode is difficult to form a good contact with the position to be measured as the size is reduced; 2. As the electrode size decreases, the surface impedance of the electrode increases, and the neuroelectrophysiological signal is generally weak, and the electrode surface An increase in impedance affects the measurement of the signal.

Utility model content

The main purpose of the utility model is to provide a flexible neural microelectrode array capable of reducing contact impedance, which can effectively improve the contact area between the flexible neural microelectrode and the part to be tested, and reduce the contact impedance between the flexible neural microelectrode and the part to be tested.

Further, the utility model can also reduce the mechanical strength of the microelectrode site, and ensure that no damage is caused to the site to be tested while being in good contact with the site to be tested.

To achieve the above object, the present invention provides a flexible neural microelectrode array comprising a flexible substrate, an insulating layer, a microelectrode unit, a wire and a lead solder joint, wherein the microelectrode unit, the wire and the lead solder joint are disposed in the On the flexible substrate, the microelectrode unit and the lead solder joint are connected by the wire, the insulating layer covers the flexible substrate, and the microelectrode unit is exposed In the insulating layer, the flexible substrate is provided with a plurality of hollow protrusions exposed on the insulating layer, and an adhesive layer is disposed on the hollow protrusions of the insulating layer. An electrode unit is disposed on the adhesive layer.

Preferably, the insulating layer is provided with an opening at a position of the wire bonding point, and the wire bonding point is exposed through an opening of the insulating layer.

Preferably, an adhesive layer is disposed on the hollow protrusion of the insulating layer, and the microelectrode unit is disposed on the adhesive layer.

Preferably, the material of the adhesion layer comprises titanium, chromium, or an alloy containing one or two of the two elements, and the microelectrode unit is made of gold.

Preferably, the material of the flexible substrate comprises polydimethylsiloxane, and the material of the insulating layer comprises a photolithographic polydimethylsiloxane.

Preferably, the insulating layer is composed of a plurality of sheet-shaped insulating materials.

The utility model provides a flexible neural microelectrode array, which comprises a flexible substrate, an insulating layer, a microelectrode unit, a wire and a lead solder joint, the microelectrode unit, the wire and the lead solder joint are all disposed on the flexible substrate, and the micro electrode unit And the wire solder joint is connected by a wire, the insulating layer covers the flexible substrate, and the micro electrode unit is exposed to the insulating layer. The flexible substrate of the present invention is provided with a plurality of hollow protrusions exposed on the insulating layer, and the microelectrode The unit is disposed on the adhesive layer on the hollow protrusion of the flexible substrate. Compared with the conventional flexible nerve microelectrode array, the micro-electrode unit is disposed on the hollow protrusion on the flexible substrate in the present invention, compared to the plane. Flexible substrate microelectrode, the microelectrode on the protrusion increases the surface area of the electrical stimulation site, can effectively reduce the contact resistance, and since the protrusion on the flexible substrate in the present invention is hollow, it can reduce micro The overall strength of the electrode site makes it difficult to damage the measured position during use;

The utility model is formed by using a plate-shaped microelectrode with a plurality of protrusions to form a template, and a flexible base layer is spin-coated on the microelectrode fabrication template, and then the wire and the lead solder joint are laid on the flexible base layer, and the flexibility is The microelectrode unit is deposited on the convex portion of the base layer, and the insulating layer is laid on the flexible base layer, and the micro electrode unit on the convex portion and the convex portion of the flexible base layer is exposed to the insulating layer, and the manufacturing process is simple and quick. And the cost is low.

DRAWINGS

1 is a schematic perspective view of a flexible neural microelectrode array in the present invention;

2 is a side cross-sectional view showing a flexible neural microelectrode array of the present invention;

FIG. 3 is a schematic side view showing the structure of a template prepared by using a microelectrode used in a method for preparing a flexible neural microelectrode array according to the present invention.

The implementation, functional features and advantages of the present invention will be further described with reference to the accompanying drawings.

detailed description

It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The utility model provides a flexible neural microelectrode array (hereinafter may be referred to as a microelectrode array). Referring to FIG. 1 and FIG. 2 , FIG. 1 is a schematic perspective view of a flexible neural microelectrode array according to the present invention, FIG. 2 is a schematic diagram of FIG. A side structural view of a flexible neural microelectrode array in the present invention, a flexible neural microelectrode array comprising a flexible substrate 1, an insulating layer 2, a microelectrode unit 3, a wire 4 and a wire bonding point 5, said micro The electrode unit 3, the wire 4 and the wire bonding point 5 are disposed on the flexible substrate 1, and the microelectrode unit 3 and the wire bonding point 5 are connected by the wire 4, the insulation The layer 2 is covered on the flexible substrate 1 , and the microelectrode unit 3 is exposed on the insulating layer 2 , and the flexible substrate 1 is provided with a plurality of hollow protrusions exposed on the insulating layer 2 . 7 , an adhesive layer 6 is disposed on the hollow protrusion 7 , and the micro electrode unit 3 is disposed on the adhesion layer 6 of the hollow protrusion 7 of the flexible substrate, and the micro electrode unit 3 and the adhesion layer 6 Easier to combine, improve the stability of the microelectrode unit 3, so that the microelectrode Unit 3 is more secure.

In the utility model, a flexible neural microelectrode array adopts a flexible substrate 1 having a hollow convex structure, and the microelectrode unit 3 is deposited on the adhesive layer 6 on the hollow protrusion 7 on the flexible substrate 1, the wire 4 and the wire bonding point 5 is arranged in a similar manner to the conventional microelectrode array, and the microelectrode unit 3 and the wire bonding pad 5 can be connected by the wire 4 according to the corresponding arrangement of different kinds of microelectrode arrays, and the insulating layer 2 is covered. On the flexible substrate 1 and exposing the microelectrode unit 3 to the insulating layer 2, in use, when the microelectrode array is attached to the portion to be tested, compared with the conventional microelectrode unit 3, the micro in the present invention The electrode unit 3 is capable of forming a larger contact area with the portion to be tested, that is, the microelectrode unit 3 on the convex structure of the flexible substrate 1 can increase the surface area of the electrode stimulation site, lower the contact resistance, and on the flexible substrate 1 The hollow convex structure can also reduce the strength of the electrode position of the microelectrode unit 3 without causing any damage to the measured position.

In a preferred embodiment, the insulating layer 2 is provided with openings at the positions of the microelectrode unit 3 and the wire bonding pads 5, and the wire bonding pads 5 are exposed through the opening of the insulating layer 2. The insulating layer 2 can also use a plurality of insulating layers of a single sheet structure. At this time, after the flexible substrate 1 is fabricated and the microelectrode unit 3, the wires, and the wire bonding pads 5 are laid on the flexible substrate 1, only A plurality of individual sheet-like insulating layers 2 are covered on the flexible substrate 1 to cover the wires 4, and the microelectrode unit 3 and the lead pads 5 are exposed.

In a preferred embodiment, the material of the adhesive layer 6 comprises titanium, chromium, or an alloy containing one or two of the two elements, and the microelectrode unit 3 is made of gold. .

In a preferred embodiment, the material of the flexible substrate 1 comprises polydimethylsiloxane, and the material of the insulating layer comprises a photolithographic polydimethylsiloxane.

However, it should be noted that the material of all the components in the present invention is not limited to the materials given above, and any common alternative materials that can be conceived by those skilled in the art belong to the equivalent replacement of the above listed materials. .

In the present invention, the shape of the protrusion on the flexible substrate 1 is not limited to the hollow hemisphere given in the drawing, and may also be a hollow conical shape, a hollow pyramid, a quadrangular pyramid, a polygonal pyramid or the like. The effect is similar to the hollow hemispherical protrusions in the present invention, and belongs to the same replacement of the present invention, and will not be enumerated here.

In the preparation of the present invention, the template is first fabricated using the microelectrode shown in FIG. 3, and the flexible substrate is spin-coated on the microelectrode fabrication template. Since the microelectrode is formed with a plurality of protrusions on the template, the plurality of protrusions and the The hollow convex shape of the prepared flexible neural microelectrode array is matched, so after the spin-coated flexible substrate, the flexible substrate forms a plurality of hollow convex structures, and then the microelectrode unit is deposited on the hollow convex structure, and a wire and a lead solder joint are laid on the flexible substrate, and the microelectrode unit and the lead solder joint are connected by the wire, and then an insulating layer is laid on the flexible substrate, and the insulating layer is on the microelectrode unit and the lead solder joint Positioning, the microelectrode unit and the lead solder joint are exposed through the insulating layer, and after the flexible substrate and the insulating layer are solidified, the microelectrode is formed into a template and separated from the flexible substrate layer, A flexible neural microelectrode array, the preparation method of a flexible neural microelectrode array in the utility model is simple, quick, easy to manufacture, and has low production cost and production efficiency The rate is high.

In the production of the utility model, a layer of polydimethylsiloxane can be spin-coated on the microelectrode fabrication template as a flexible substrate, and a metal template having the same shape as the microelectrode can be used, and the metal template is applied to the micro template. Forming an opening at a position corresponding to a preset position of the microelectrode unit, the lead wire and the lead solder joint on the electrode forming template, covering the metal template on the flexible base layer, and then passing through the opening in the metal template on the flexible base layer A layer of titanium or chromium is deposited as an adhesion layer on the raised portion, after which a layer of gold is deposited on the adhesion layer as a microelectrode unit, wires and lead pads are laid on the flexible substrate layer, and the microelectrode unit and wire bonding are connected by wires. Pointing, then separating the metal template from the flexible substrate layer on the microelectrode fabrication template, using a metal template, according to a preset position of the microelectrode unit, the wire and the lead pad on the flexible substrate, in the metal Opening a plurality of openings on the template, then laying the metal template on the flexible substrate, and then setting the flexible substrate on the opening through the metal template Micro-electrode unit, the wire and the bond pad, is connected by a wire after the unit between microelectrodes and a lead solder metal template is removed, it can be more easily produced microelectrode array.

As a preferred embodiment of the present invention, the optional material of the adhesive layer in the present invention includes titanium, chromium, or an alloy containing one or two of the two elements, which can be controlled by magnetron sputtering. Titanium or chromium or an alloy comprising one or both of these two elements is deposited on the raised portion of the flexible substrate, the microelectrode unit is made of gold, and the flexible substrate may be made of materials including but not Limited to polydimethylsiloxane, the insulating layer may be selected from materials including, but not limited to, photolithographic polydimethylsiloxane.

The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the patents of the present invention. Any equivalent structure or equivalent flow transformation made by the specification and the drawings of the present invention may be directly or indirectly applied to other related The technical fields are all included in the scope of patent protection of the present invention.

Claims

A flexible neural microelectrode array comprising a flexible substrate, an insulating layer, a microelectrode unit, a wire and a wire bonding spot, wherein the microelectrode unit, the wire and the wire bonding point are disposed on the flexible substrate, the micro The electrode unit is connected to the wire bonding point by the wire, the insulating layer covers the flexible substrate, and the micro electrode unit is exposed to the insulating layer, wherein The flexible substrate is provided with a plurality of hollow protrusions exposed on the insulating layer, and an adhesive layer is disposed on the hollow protrusion of the insulating layer, and the microelectrode unit is disposed on the On the adhesive layer.
The flexible neural microelectrode array according to claim 1, wherein said insulating layer is provided with an opening at a position of said wire bonding pad, said wire bonding spot being exposed through an opening of said insulating layer.
The flexible neural microelectrode array of claim 1 wherein said insulating layer is comprised of a plurality of sheet-like insulating materials.
The flexible neural microelectrode array according to claim 1, wherein the material of the adhesive layer comprises titanium, chromium, or an alloy comprising one or two of the two elements, the micro The material of the electrode unit is gold.
The flexible neural microelectrode array according to claim 1, wherein the material of the flexible substrate comprises polydimethylsiloxane, and the material of the insulating layer comprises lithable polydimethylsiloxane. Oxytomane.