WO2016201722A1 - Oled器件的封装结构及其封装方法 - Google Patents

Oled器件的封装结构及其封装方法 Download PDF

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Publication number
WO2016201722A1
WO2016201722A1 PCT/CN2015/082660 CN2015082660W WO2016201722A1 WO 2016201722 A1 WO2016201722 A1 WO 2016201722A1 CN 2015082660 W CN2015082660 W CN 2015082660W WO 2016201722 A1 WO2016201722 A1 WO 2016201722A1
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layer
oled device
barrier layer
desiccant
substrate
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PCT/CN2015/082660
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English (en)
French (fr)
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钱佳佳
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深圳市华星光电技术有限公司
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Priority to US14/764,581 priority Critical patent/US20160365538A1/en
Publication of WO2016201722A1 publication Critical patent/WO2016201722A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

Definitions

  • the present invention relates to the field of packaging technologies, and in particular, to a package structure of an OLED device and a packaging method thereof.
  • OLED is an Organic Light-Emitting Diode, which has the characteristics of self-illumination, high brightness, wide viewing angle, high contrast, flexibility, low energy consumption, etc., and has received extensive attention as a new generation display mode. It has gradually replaced traditional LCD monitors and is widely used in mobile phone screens, computer monitors, and full-color TVs. OLED display technology is different from traditional liquid crystal display technology. It does not require a backlight. It uses a very thin coating of organic materials and a glass substrate. When there is current, these organic materials will emit light. However, since organic materials are easily reacted with water vapor or oxygen, as an organic material-based display device, the OLED display has a very high requirement for packaging.
  • OLED luminescent layer Most organic materials in the OLED luminescent layer are very sensitive to atmospheric pollutants, oxygen and water vapor. Electrochemical corrosion is prone to occur in environments containing moisture, which seriously affects the service life of OLED devices. Therefore, it is essential for the stable illumination of OLED devices to improve the internal sealing of the device by the packaging of the OLED device and to isolate it from the external environment as much as possible.
  • the package of the OLED device is mainly packaged on a rigid package substrate (such as glass or metal), but the method is not suitable for the flexible device. Therefore, there is also a technical solution for packaging the OLED device by using a laminated film.
  • the layer film is generally packaged by forming two layers of a barrier layer having a good water resistance as an inorganic material on the OLED device on the substrate, and forming a layer of organic material with good flexibility between the two barrier layers. Buffer layer.
  • the package structure of the OLED device includes a substrate 10 , an OLED device 20 disposed on the substrate 10 , a first barrier layer 30 formed on the OLED device 20 , and a buffer formed on the first barrier layer 30 .
  • the layer 40 is a second barrier layer 50 formed on the buffer layer 40.
  • the package structure of the OLED device is heavily dependent on the quality of each film layer, especially the quality of the inorganic film layer. As shown in FIG. 2, the inevitable defects of the inorganic film formed at a low temperature are formed. The channel of water vapor erosion, thereby causing the performance of the package structure to deteriorate.
  • the object of the present invention is to provide a package structure of an OLED device, which blocks water vapor Strong, good packaging effect, suitable for OLED flexible displays.
  • Another object of the present invention is to provide an OLED packaging method which is simple in process, easy to operate, has a good packaging effect, and has a strong effect of blocking water vapor, and is suitable for an OLED flexible display.
  • the present invention provides a package structure of an OLED device, comprising: a substrate, an OLED device disposed on the substrate, and a first barrier layer formed on the OLED device, formed in the a desiccant layer on the first barrier layer, a buffer layer formed on the desiccant layer, and a second barrier layer formed on the buffer layer.
  • the first barrier layer and the second barrier layer are SiNx or Al 2 O 3 inorganic thin films; and the buffer layer is an organic thin film.
  • the first barrier layer completely covers the OLED device; the desiccant layer completely covers the OLED device in a vertical direction.
  • the buffer layer completely covers the OLED device in a vertical direction; the second barrier layer completely covers the first barrier layer, the desiccant layer, and the buffer layer.
  • the substrate is a flexible substrate.
  • the invention also provides a package structure of an OLED device, comprising a substrate, an OLED device disposed on the substrate, a first barrier layer formed on the OLED device, and a desiccant formed on the first barrier layer a layer, a buffer layer formed on the desiccant layer, and a second barrier layer formed on the buffer layer;
  • first barrier layer and the second barrier layer are SiNx or Al 2 O 3 inorganic thin films;
  • the buffer layer is an organic thin film;
  • the first barrier layer completely covers the OLED device;
  • the desiccant layer completely covers the OLED device in a vertical direction;
  • the buffer layer completely covers the OLED device in a vertical direction; the second barrier layer completely covers the first barrier layer, the desiccant layer, and the buffer layer.
  • the invention also provides a packaging method for an OLED device, comprising the following steps:
  • Step 1 providing a substrate, forming an OLED device by evaporation on the substrate;
  • Step 2 forming a first barrier layer on the OLED device
  • Step 3 forming a layer of desiccant on the first barrier layer
  • Step 4 forming a buffer layer on the desiccant layer
  • Step 5 Form a second barrier layer on the buffer layer.
  • the first barrier layer prepared in the step 2 and the second barrier layer fabricated in the step 5 are SiNx or Al 2 O 3 inorganic thin films; the first barrier layer prepared in the step 2 and the step 5
  • the second barrier layer is prepared by a low temperature plasma enhanced chemical vapor deposition method or an atomic layer deposition technique; the buffer layer prepared in the step 4 is an organic thin film.
  • the step 3 is specifically: applying a desiccant to the first barrier layer by printing, and curing to obtain a desiccant layer.
  • the first barrier layer completely covers the OLED device; the desiccant layer and the buffer layer completely cover the OLED device in a vertical direction; the second barrier layer completely covers the first barrier layer, a desiccant layer and a buffer layer.
  • the substrate provided in the step 1 is a flexible substrate.
  • the package structure of the OLED device of the present invention is provided with a layer of desiccant layer completely covering the OLED device in the vertical direction between the first barrier layer and the buffer layer, and is absorbed into the interior of the package structure by the desiccant absorption
  • the water vapor interrupts the intrusion path of the water vapor, enhances the ability of the package structure to block moisture, thereby effectively extending the life of the OLED device
  • the packaging method of the OLED device of the present invention has a layer between the first barrier layer and the buffer layer
  • the desiccant layer of the OLED device is completely covered in the vertical direction, and the water vapor invading the inside of the package structure is absorbed by the desiccant, thereby interrupting the intrusion path of water vapor, effectively preventing moisture intrusion, improving the packaging effect, and effectively extending the life of the OLED device, and
  • the method is simple and operability is strong.
  • FIG. 1 is a schematic cross-sectional view showing a package structure of a conventional OLED device
  • FIG. 2 is a schematic view showing a barrier layer having a defect of water vapor erosion in a package structure of the OLED device of FIG. 1;
  • FIG. 3 is a cross-sectional view showing a package structure of an OLED device of the present invention.
  • FIG. 4 is a schematic view showing a barrier layer having a defect of water vapor erosion in a package structure of the OLED device of FIG. 3;
  • FIG. 5 is a flow chart of a method of packaging an OLED device of the present invention.
  • step 1 of a method of packaging an OLED device of the present invention is a schematic diagram of step 1 of a method of packaging an OLED device of the present invention.
  • step 2 of a packaging method of an OLED device according to the present invention is a schematic diagram of step 2 of a packaging method of an OLED device according to the present invention.
  • step 3 of a packaging method of an OLED device according to the present invention is a schematic diagram of step 3 of a packaging method of an OLED device according to the present invention.
  • step 4 of a method of packaging an OLED device of the present invention is a schematic diagram of step 4 of a method of packaging an OLED device of the present invention.
  • the present invention provides a package structure of an OLED device, comprising a substrate 1, an OLED device 2 disposed on the substrate 1, and a first barrier layer 3 formed on the OLED device 2, formed in the The desiccant layer 4 on the first barrier layer 3, the buffer layer 5 formed on the desiccant layer 4, and the second barrier layer 6 formed on the buffer layer 5 are described.
  • the first barrier layer 3 and the second barrier layer 6 are SiNx or Al 2 O 3 inorganic thin films; and the buffer layer 5 is an organic thin film.
  • the first barrier layer 3 completely covers the OLED device 2; the desiccant layer 4 and the buffer layer 5 completely cover the OLED device 2 in a vertical direction; the second barrier layer 6
  • the first barrier layer 3, the desiccant layer 4, and the buffer layer 5 are completely covered.
  • the substrate 1 is a flexible substrate.
  • the desiccant layer 4 can be absorbed through the buffer layer 5 into the package structure.
  • the internal water vapor interrupts the intrusion of water vapor, which can effectively extend the life of the OLED device.
  • the present invention further provides a packaging method for an OLED device, comprising the following steps:
  • Step 1 as shown in Figure 6, providing a flexible substrate 1, on the flexible substrate 1 by evaporation forming OLED device 2;
  • Step 2 as shown in Figure 7, the first barrier layer 3 is fabricated on the OLED device 2;
  • the first barrier layer 3 completely covers the OLED device 2; the first barrier layer 3 is a SiNx or Al 2 O 3 inorganic film, and the first barrier layer 3 is subjected to low temperature plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical) Vapor Deposition, PECVD) or Atomic Layer Deposition (ALD) technique.
  • PECVD plasma enhanced chemical vapor deposition
  • ALD Atomic Layer Deposition
  • the first barrier layer 3 fabricated in the step 2 is larger than the area of the OLED device 2, the first barrier layer 3 completely covers the OLED device 2;
  • Step 3 as shown in Figure 8, a layer of desiccant 4 is formed on the first barrier layer 3;
  • the desiccant is applied to the first barrier layer 3 by printing, and cured to obtain a desiccant layer 4;
  • the desiccant layer 4 produced in the step 3 is larger than the area of the OLED device 2, the desiccant layer 4 completely covers the OLED device 2 in the vertical direction;
  • Step 4 as shown in Figure 9, on the desiccant layer 4 is made of a buffer layer 5;
  • the buffer layer 5 is an organic film
  • the area of the buffer layer 5 fabricated in the step 4 is larger than the area of the OLED device 2, the buffer layer 5 completely covers the OLED device 2 in the vertical direction;
  • Step 5 forming a second barrier layer 6 on the buffer layer 5 to obtain a package structure of the OLED device as shown in FIG. 3, thereby completing packaging of the OLED device.
  • the second barrier layer 6 of Al 2 O 3 or SiNx inorganic thin film is enhanced by low-temperature chemical vapor deposition or atomic layer deposition, plasma techniques.
  • the area of the second barrier layer 6 is larger than the area of the desiccant layer 4 and the buffer layer 5, and the second barrier layer 6 completely covers the first barrier layer 3, the desiccant layer 4, and Buffer layer 5.
  • the package structure of the OLED device of the present invention is provided with a layer of desiccant layer completely covering the OLED device in the vertical direction between the first barrier layer and the buffer layer, and is absorbed by the desiccant into the interior of the package structure.
  • the packaging method of the OLED device of the present invention is provided by placing a layer between the first barrier layer and the buffer layer
  • the desiccant layer of the OLED device is completely covered in the vertical direction, and the moisture invading the inside of the package structure is absorbed by the desiccant, interrupting the intrusion path of the water vapor, effectively preventing the intrusion of water vapor, improving the packaging effect, and effectively extending the life of the OLED device, and
  • the method is simple and operability is strong.

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Abstract

一种OLED器件的封装结构及其封装方法，所述OLED器件的封装结构包括基板(1)、设于所述基板(1)上的OLED器件(2)、形成于所述OLED器件(2)上的第一阻挡层(3)、形成于所述第一阻挡层(3)上的干燥剂层(4)、形成于所述干燥剂层(4)上的缓冲层(5)，及形成于所述缓冲层(5)上的第二阻挡层(6)。通过在OLED器件的封装结构中加入干燥剂层(4)，增强了封装结构阻止水汽的能力，从而可以有效延长OLED器件寿命；且该 OLED器件的封装方法，可以有效阻止水汽侵入，提高封装效果，有效延长了OLED器件寿命，且该方法较简单，可操作性强。

Description

OLED器件的封装结构及其封装方法 技术领域
本发明涉及封装技术领域，尤其涉及一种OLED器件的封装结构及其封装方法。
背景技术
OLED即有机发光二极管(Organic Light-Emitting Diode)，具备自发光、高亮度、宽视角、高对比度、可挠曲、低能耗等特性，因此受到广泛的关注，并作为新一代的显示方式，已开始逐渐取代传统液晶显示器，被广泛应用在手机屏幕、电脑显示器、全彩电视等。OLED显示技术与传统的液晶显示技术不同，无需背光灯，采用非常薄的有机材料涂层和玻璃基板，当有电流通过时，这些有机材料就会发光。但是由于有机材料易与水汽或氧气反应，作为基于有机材料的显示设备，OLED显示屏对封装的要求非常高。
OLED发光层的多数有机物质对于大气中的污染物、氧气以及水汽都十分敏感。在含有水汽的环境中容易发生电化学腐蚀，严重影响OLED器件的使用寿命。因此，通过OLED器件的封装提高器件内部的密封性，尽可能的与外部环境隔离，对于OLED器件的稳定发光至关重要。
目前OLED器件的封装主要在硬质封装基板(如玻璃或金属)上通过封装胶封装，但是该方法并不适用于柔性器件，因此，也有技术方案通过叠层薄膜对OLED器件进行封装，该叠层薄膜的封装方式一般是在基板上的OLED器件上方形成两层为无机材料的阻水性好的阻挡层(barrier layer)，在两层阻挡层之间形成一层为有机材料的柔韧性好的缓冲层(buffer layer)。具体请参阅图1，该种OLED器件的封装结构包括基板10、设于基板10上的OLED器件20、形成于OLED器件20上的第一阻挡层30、形成于第一阻挡层30上的缓冲层40、形成于缓冲层40上的第二阻挡层50。但是该种OLED器件的封装结构严重依赖于各膜层质量，尤其是无机膜层的质量，如图2所示，低温下形成的无机膜不可避免的会存在的缺陷(defect)，便会形成水汽侵蚀的通道，由此则造成封装结构的性能劣化。
发明内容
本发明的目的在于提供一种OLED器件的封装结构，其阻挡水汽的作 用强，封装效果好，适用于OLED柔性显示器。
本发明的另一目的在于提供一种OLED封装方法，制程简单，易操作，封装效果好，阻挡水汽的作用强，适用于OLED柔性显示器。
为实现上述目的，本发明提供一种OLED器件的封装结构，其特征在于，包括基板、设于所述基板上的OLED器件、形成于所述OLED器件上的第一阻挡层、形成于所述第一阻挡层上的干燥剂层、形成于所述干燥剂层上的缓冲层，及形成于所述缓冲层上的第二阻挡层。
所述第一阻挡层和第二阻挡层为SiNx或者Al2O3无机薄膜；所述缓冲层为有机薄膜。
所述第一阻挡层完全覆盖所述OLED器件；所述干燥剂层在竖直方向上完全遮盖所述OLED器件。
所述缓冲层在竖直方向上完全遮盖所述OLED器件；所述第二阻挡层完全覆盖所述第一阻挡层、干燥剂层、及缓冲层。
所述基板为柔性基板。
本发明还提供一种OLED器件的封装结构，包括基板、设于所述基板上的OLED器件、形成于所述OLED器件上的第一阻挡层、形成于所述第一阻挡层上的干燥剂层、形成于所述干燥剂层上的缓冲层，及形成于所述缓冲层上的第二阻挡层；
其中，所述第一阻挡层和第二阻挡层为SiNx或者Al2O3无机薄膜；所述缓冲层为有机薄膜；
其中，所述第一阻挡层完全覆盖所述OLED器件；所述干燥剂层在竖直方向上完全遮盖所述OLED器件；
其中，所述缓冲层在竖直方向上完全遮盖所述OLED器件；所述第二阻挡层完全覆盖所述第一阻挡层、干燥剂层、及缓冲层。
本发明还一种OLED器件的封装方法，包括如下步骤：
步骤1、提供基板，在所述基板上通过蒸镀形成OLED器件；
步骤2、在所述OLED器件上制作第一阻挡层；
步骤3、在所述第一阻挡层上制作一层干燥剂层；
步骤4、在所述干燥剂层上制作一层缓冲层；
步骤5、在所述缓冲层上制作第二阻挡层。
所述步骤2中制作的第一阻挡层和所述步骤5中制作的第二阻挡层为SiNx或者Al2O3无机薄膜；所述步骤2中制作的第一阻挡层和步骤5中制作的第二阻挡层通过低温等离子增强化学气相沉积法或者原子层沉积技术制得；所述步骤4中制作的缓冲层为有机薄膜。
所述步骤3具体为，将干燥剂通过印刷方式涂布于所述第一阻挡层上，并固化，得到干燥剂层。
所述第一阻挡层完全覆盖所述OLED器件；所述干燥剂层和所述缓冲层在竖直方向上完全遮盖所述OLED器件；所述第二阻挡层完全覆盖所述第一阻挡层、干燥剂层、及缓冲层。
所述步骤1中所提供的基板为柔性基板。
本发明的有益效果：本发明的OLED器件的封装结构，在第一阻挡层和缓冲层之间设有一层在竖直方向上完全遮盖OLED器件的干燥剂层，通过干燥剂吸收侵入封装结构内部的水汽，中断了水汽的侵入通道，增强了封装结构阻止水汽的能力，从而可以有效延长OLED器件寿命；本发明的OLED器件的封装方法，通过在第一阻挡层和缓冲层之间设置一层在竖直方向上完全遮盖OLED器件的干燥剂层，通过干燥剂吸收侵入封装结构内部的水汽，中断了水汽的侵入通道，可以有效阻止水汽侵入，提高封装效果，有效延长了OLED器件寿命，且该方法较简单，可操作性强。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其他有益效果显而易见。
附图中，
图1为一种现有OLED器件的封装结构的剖面示意图；
图2为图1的OLED器件的封装结构中阻挡层具有缺陷被水汽侵蚀的示意图；
图3为本发明OLED器件的封装结构的剖面示意图；
图4为图3的OLED器件的封装结构中阻挡层具有缺陷被水汽侵蚀的示意图；
图5为本发明OLED器件的封装方法的流程图；
图6为本发明OLED器件的封装方法的步骤1的示意图；
图7为本发明OLED器件的封装方法的步骤2的示意图；
图8为本发明OLED器件的封装方法的步骤3的示意图；
图9为本发明OLED器件的封装方法的步骤4的示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图3，本发明提供一种OLED器件的封装结构，包括基板1、设于所述基板1上的OLED器件2、形成于所述OLED器件2上的第一阻挡层3、形成于所述第一阻挡层3上的干燥剂层4，形成于所述干燥剂层4上的缓冲层5、形成于所述缓冲层5上的第二阻挡层6。
具体地，所述第一阻挡层3和第二阻挡层6为SiNx或者Al2O3无机薄膜；所述缓冲层5为有机薄膜。
具体地，所述第一阻挡层3完全覆盖所述OLED器件2；所述干燥剂层4和所述缓冲层5在竖直方向上完全遮盖所述OLED器件2；所述第二阻挡层6完全覆盖所述第一阻挡层3、干燥剂层4、及缓冲层5。
具体地，所述基板1为柔性基板。
请参阅图4，在本发明的OLED器件的封装结构中，当所述第一阻挡层3或第二阻挡层5具有缺陷时，所述干燥剂层4可吸收穿过缓冲层5进入封装结构内部的水汽，中断水汽的侵入通道，从而可以有效延长OLED器件的寿命。
如图5所示，本发明还提供一种OLED器件的封装方法，包括如下步骤：
步骤1、如图6所示，提供一柔性基板1，在所述柔性基板1上通过蒸镀形成OLED器件2；
步骤2、如图7所示，在所述OLED器件2上制作第一阻挡层3；
具体地，所述第一阻挡层3完全覆盖所述OLED器件2；第一阻挡层3为SiNx或者Al2O3无机薄膜，该第一阻挡层3通过低温等离子增强化学气相沉积(Plasma Enhanced Chemical Vapor Deposition，PECVD)法或者原子层沉积(Atomic Layer Deposition，ALD)技术制得。
具体地，该步骤2中制作的第一阻挡层3大于所述OLED器件2的面积，该第一阻挡层3完全覆盖所述OLED器件2；
步骤3、如图8所示，在所述第一阻挡层3上制作一层干燥剂层4；
具体地，将干燥剂通过印刷方式涂布于所述第一阻挡层3上，并固化，得到干燥剂层4；
具体地，该步骤3中制作的干燥剂层4大于所述OLED器件2的面积，该干燥剂层4在竖直方向上完全遮盖所述OLED器件2；
步骤4、如图9所示，在所述干燥剂层4上制作缓冲层5；
具体地，所述缓冲层5为有机薄膜，该步骤4中制作的缓冲层5的面积大于所述OLED器件2的面积，该缓冲层5在竖直方向上完全遮盖所述OLED器件2；
步骤5、在所述缓冲层5上制作第二阻挡层6，制得如图3所示的OLED器件的封装结构，从而完成OLED器件的封装。
具体地，第二阻挡层6为SiNx或者Al2O3无机薄膜，该第二阻挡层6通过低温等离子增强化学气相沉积法或者原子层沉积技术制得。
具体地，所述第二阻挡层6的面积大于所述干燥剂层4和所述缓冲层5的面积，该第二阻挡层6完全覆盖所述第一阻挡层3、干燥剂层4、及缓冲层5。
综上所述，本发明的OLED器件的封装结构，在第一阻挡层和缓冲层之间设有一层在竖直方向上完全遮盖OLED器件的干燥剂层，通过干燥剂吸收侵入封装结构内部的水汽，中断了水汽的侵入通道，增强了封装结构阻止水汽的能力，从而可以有效延长OLED器件寿命；本发明的OLED器件的封装方法，通过在第一阻挡层和缓冲层之间设置一层在竖直方向上完全遮盖OLED器件的干燥剂层，通过干燥剂吸收侵入封装结构内部的水汽，中断了水汽的侵入通道，可以有效阻止水汽侵入，提高封装效果，有效延长了OLED器件寿命，且该方法较简单，可操作性强。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。

Claims (12)

  1. 一种OLED器件的封装结构，包括基板、设于所述基板上的OLED器件、形成于所述OLED器件上的第一阻挡层、形成于所述第一阻挡层上的干燥剂层、形成于所述干燥剂层上的缓冲层，及形成于所述缓冲层上的第二阻挡层。
  2. 如权利要求1所述的OLED器件的封装结构，其中，所述第一阻挡层和第二阻挡层为SiNx或者Al2O3无机薄膜；所述缓冲层为有机薄膜。
  3. 如权利要求1所述的OLED器件的封装结构，其中，所述第一阻挡层完全覆盖所述OLED器件；所述干燥剂层在竖直方向上完全遮盖所述OLED器件。
  4. 如权利要求1所述的OLED器件的封装结构，其中，所述缓冲层在竖直方向上完全遮盖所述OLED器件；所述第二阻挡层完全覆盖所述第一阻挡层、干燥剂层、及缓冲层。
  5. 如权利要求1所述的OLED器件的封装结构，其中，所述基板为柔性基板。
  6. 一种OLED器件的封装结构，包括基板、设于所述基板上的OLED器件、形成于所述OLED器件上的第一阻挡层、形成于所述第一阻挡层上的干燥剂层、形成于所述干燥剂层上的缓冲层，及形成于所述缓冲层上的第二阻挡层；
    其中，所述第一阻挡层和第二阻挡层为SiNx或者Al2O3无机薄膜；所述缓冲层为有机薄膜；
    其中，所述第一阻挡层完全覆盖所述OLED器件；所述干燥剂层在竖直方向上完全遮盖所述OLED器件；
    其中，所述缓冲层在竖直方向上完全遮盖所述OLED器件；所述第二阻挡层完全覆盖所述第一阻挡层、干燥剂层、及缓冲层。
  7. 如权利要求6所述的OLED器件的封装结构，其中，所述基板为柔性基板。
  8. 一种OLED器件的封装方法，包括如下步骤：
    步骤1、提供基板，在所述基板上通过蒸镀形成OLED器件；
    步骤2、在所述OLED器件上制作第一阻挡层；
    步骤3、在所述第一阻挡层上制作一层干燥剂层；
    步骤4、在所述干燥剂层上制作一层缓冲层；
    步骤5、在所述缓冲层上制作第二阻挡层。
  9. 如权利要求8所述的OLED器件的封装方法，其中，所述步骤2中制作的第一阻挡层和所述步骤5中制作的第二阻挡层为SiNx或者Al2O3无机薄膜；所述步骤2中制作的第一阻挡层和步骤5中制作的第二阻挡层通过低温等离子增强化学气相沉积法或者原子层沉积技术制得；所述步骤4中制作的缓冲层为有机薄膜。
  10. 如权利要求8所述的OLED器件的封装方法，其中，所述步骤3具体为，将干燥剂通过印刷方式涂布于所述第一阻挡层上，并固化，得到干燥剂层。
  11. 如权利要求8所述的OLED器件的封装方法，其中，所述第一阻挡层完全覆盖所述OLED器件；所述干燥剂层和所述缓冲层在竖直方向上完全遮盖所述OLED器件；所述第二阻挡层完全覆盖所述第一阻挡层、干燥剂层、及缓冲层。
  12. 如权利要求8所述的OLED器件的封装方法，其中，所述步骤1中所提供的基板为柔性基板。
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