WO2016194165A1

WO2016194165A1 - Heat sink and heat sink attaching structure

Info

Publication number: WO2016194165A1
Application number: PCT/JP2015/066028
Authority: WO
Inventors: 暁後藤; 福井　一夫; 重匡佐藤
Original assignee: 株式会社日立製作所
Priority date: 2015-06-03
Filing date: 2015-06-03
Publication date: 2016-12-08

Abstract

A heat sink H1 of the present invention is disposed between a substrate k, and a top plate 510 fixed at a position facing the substrate k, said top plate being on the substrate k side on which a component m to be cooled is mounted. The heat sink is characterized by being provided with: a heat sink main body 110, which has a base section 111 in contact with the component m, and a heat dissipation fin 112, which is integrally connected to the base section 111, and which protrudes to the side opposite to the base section 111 side which the component m is in contact with; and a fixing means 210, which is provided such that one end thereof is in contact with the top plate 510, and the other end thereof is engaged with the heat sink main body 110, and which fixes the heat sink main body 110 to the component m by pressing the heat sink main body 110 toward the component m by having a portion in contact with the top plate 510 as a fixing end.

Description

Heat sink and its mounting structure

The present invention relates to a heat sink and its mounting structure.

The evolution of electronic components used in electronic devices, especially semiconductor elements represented by CPUs in information processing devices, is rapid, and heat generation per unit area of the board from electronic components is accompanied by higher performance and higher mounting density. The volume is steadily increasing.

As a representative means for cooling such electronic components, a heat sink is widely used. This heat sink promotes heat radiation from the electronic component to be cooled and suppresses the temperature rise. As a conventional heat sink, for example, a fin structure having a flat plate shape or a pin shape such as a cylinder or a polygonal column to improve heat dissipation, or a combination of air blowing means such as a fan and fins to increase heat dissipation Is known, and is excellent in that the electronic component can be efficiently cooled (see, for example, Patent Document 1).

JP 2005-26571 A

Due to the recent increase in the mounting density of electronic components on the board accompanying the downsizing of electronic devices, it is becoming difficult to secure a region for arranging the heat sink mounting screws and fixing pins on the board. .

On the other hand, a method of directly attaching the electronic component to the substrate by directly connecting the electronic component such as a semiconductor and the heat sink with a heat conductive adhesive or double-sided tape is considered. However, in the above-mentioned method, it is necessary to individually verify the reliability of electronic component mounting, and there are some that require a long processing time to obtain sufficient mounting performance, which is not always satisfactory in terms of productivity and cost. It can not be said.

The present invention has been made based on the circumstances as described above, and an object of the present invention is to provide a heat sink that can be directly and surely attached to a component to be cooled without securing an area for attachment to a substrate, and its attachment structure. It is to provide.

The present invention
(1) A heat sink disposed between a substrate and a top plate fixed to a position facing the substrate on the mounting side of the component to be cooled of the substrate,
A heat sink body having a base portion that abuts on the component to be cooled, and a radiation fin that is integrally connected to the base portion and protrudes on a side opposite to the side on which the component to be cooled abuts.
One end is in contact with the top plate and the other end is engaged with the heat sink main body, and the heat sink main body is pressed toward the component to be cooled with a portion contacting the top plate as a fixed end. A heat sink comprising a fixing means for fixing the heat sink body to the component to be cooled;
(2) The heat sink according to (1), wherein the fixing unit is a unit that presses the heat sink body against the component to be cooled using the repulsive force of the compressed spring.
(3) The heat sink according to (1) or (2), wherein a portion where the heat sink main body and the fixing unit are engaged is located on the side opposite to the side on which the cooling target component abuts.
(4) From (1) further provided with a misalignment prevention guide provided on the base portion so as to face the side surface of the component to be cooled and for preventing misalignment of the heat sink body with respect to the component to be cooled. The heat sink according to any one of (3),
(5) The above (1), further comprising a thermally conductive member that is provided in a portion that contacts the part to be cooled on the base part and is interposed between the base part and the part to be cooled to promote heat transfer. To (4), and (6) a heat sink in which a plurality of heat sinks according to any one of (1) to (5) are attached to a single top plate. It relates to the mounting structure.

Note that the “parts to be cooled” means electronic parts that need to be cooled in order to suppress temperature rise due to heat generation during operation. Examples of the cooling target component include a semiconductor element represented by a CPU. Further, the “top plate” means a member that is fixed to a position facing the substrate on the mounting side of the component to be cooled on the substrate. The top plate may be, for example, a member that constitutes a casing of an electronic device, or may be a member that is different from the members that constitute the casing.

The present invention can provide a heat sink that can be directly and surely attached to a component to be cooled without securing an area for attachment to the substrate, and an attachment structure thereof.

1 is a schematic perspective view showing a first embodiment of the present invention. It is a schematic perspective view which permeate | transmits and shows a part of electronic device with which the heat sink of FIG. 1 was attached. It is a schematic front view of the heat sink of FIG. It is a schematic side view of the heat sink of FIG. It is a schematic plan view of the heat sink of FIG. It is a schematic bottom view of the heat sink of FIG. It is the schematic which shows the fixing means of the heat sink of FIG. 1, Comprising: (a) is a perspective view, (b) shows a top view, respectively. It is a schematic perspective view which shows the heat sink main body of FIG. It is a schematic perspective view of the electronic device which shows the attachment process of the heat sink of FIG. It is a schematic perspective view of the electronic device which shows the attachment process of the heat sink of FIG. It is a schematic perspective view of the electronic device which shows the attachment process of the heat sink of FIG. It is a schematic perspective view of the electronic device which shows the attachment process of the heat sink of FIG. It is a schematic perspective view of the electronic device which shows the attachment process of the heat sink of FIG. It is a schematic perspective view which expands and shows a part of electronic device which attached the heat sink of FIG. It is a schematic perspective view which shows the top plate of the electronic device of FIG. 1, Comprising: (a) shows the surface side, (b) shows the back surface side, respectively. It is a schematic perspective view which shows the 2nd Embodiment of this invention. It is a schematic perspective view which shows the electronic device of the state to which the heat sink of FIG. 16 was attached. FIG. 17 is a schematic front view of a part of the heat sink of FIG. 16. FIG. 17 is a schematic side view of a part of the heat sink of FIG. 16. FIG. 17 is a schematic plan view of a part of the heat sink of FIG. 16. FIG. 17 is a schematic bottom view of a part of the heat sink of FIG. 16. It is the schematic which shows the fixing means in the heat sink of FIG. 16, Comprising: (a) is the perspective view which decomposed | disassembled one part, (b) shows the top view, respectively. It is a schematic perspective view which shows the heat sink main body of FIG. It is a schematic perspective view of the electronic device which shows the attachment process of the heat sink of FIG. It is a schematic perspective view of the electronic device which shows the attachment process of the heat sink of FIG. It is a schematic perspective view of the electronic device which shows the attachment process of the heat sink of FIG. It is a schematic perspective view of the electronic device which shows the attachment process of the heat sink of FIG. It is a schematic perspective view of the electronic device which shows the attachment process of the heat sink of FIG. It is a schematic perspective view which expands and shows a part of electronic device which attached the heat sink of FIG. It is a schematic perspective view which shows the 3rd Embodiment of this invention. It is a schematic perspective view which shows the top plate of the electronic device of FIG. 30, Comprising: (a) shows an outer surface side, (b) shows an inner surface side, respectively. It is a schematic perspective view which shows the electronic device which attached the heat sink of FIG. It is the schematic which shows the 4th Embodiment of this invention, Comprising: It is sectional drawing which cut | disconnects and shows a part of electronic device. It is a schematic perspective view which shows the modification of FIG.

<Heatsink>
The heat sink of the present invention is a heat sink disposed between a board and a top plate fixed to a position facing the board on the mounting side of the board to be cooled. A heat sink main body having a base portion that is in contact with the base portion, a heat radiation fin that is integrally connected to the base portion and protrudes on a side opposite to the side on which the component to be cooled comes into contact, and one end of the heat sink main body. The heat sink main body is provided so that the other end engages with the heat sink main body, and the heat sink main body is pressed toward the component to be cooled by pressing the heat sink main body toward the component to be cooled with the portion contacting the top plate as a fixed end. And a fixing means for fixing to the target part.

Thus, since the heat sink includes the heat sink body and the fixing means, the heat sink can be directly and reliably fixed to the component to be cooled without securing an area for attaching the heat sink on the substrate. it can. Therefore, the heat sink contributes to high density mounting of electronic components on a substrate accompanying downsizing of electronic equipment.

It should be noted that the top plate of the electronic device in which the heat sink is used is fixed at a position facing the substrate on the mounting side of the component to be cooled on the substrate (the distance between the substrate and the top plate is also fixed). Hereinafter, embodiments of the heat sink of the present invention will be described with reference to the drawings. However, the heat sink is not limited to the embodiments described in the drawings.

[First Embodiment]
1 to 15 are schematic views showing a heat sink H1 according to the first embodiment of the present invention. The first embodiment shows an embodiment of a plate heat sink. The heat sink H1 is roughly constituted by the heat sink body 110 and the fixing means 210 shown in FIG. 1, and the misalignment prevention guide 310 and the heat conductive member 410 shown in FIG.

As shown in FIG. 8, the heat sink main body 110 includes a base portion 111, heat radiation fins 112, a pin fixing portion 113, and a connection portion 114.

The base part 111 is a part that comes into contact with the cooling target component m. The base portion 111 is formed in a rectangular shape in plan view. The heat generated in the cooling target component m or the like is conducted to the radiation fin 112 via the base portion 111 and is radiated into the air around the radiation fin 112. The radiating fins 112 are integrally connected to the base part 111 and project from the side of the base part 111 opposite to the side on which the component m to be cooled abuts. The heat radiating fins 112 are constituted by a plurality of plate-like fins erected in parallel with each other on the base portion 111. In addition, a predetermined gap is provided between adjacent fins so that heat exchange between the fins and the air surrounding them can be performed efficiently.

The pin fixing portion 113 is a portion with which a fixing means 210 described later is engaged. As shown in FIG. 5, the pin fixing portion 113 is a portion on the further outer side of the fin 112a located on the outermost side of the plurality of fins in the heat dissipating fin 112, and is diagonally opposite to the base portion 111 in plan view. It is provided at the four corners. Further, as shown in FIG. 8, the pin fixing portion 113 is provided with a hole 113a for engaging the fixing means 210. The connection part 114 is a part that connects the base part 111 and the pin fixing part 113 described above. The connecting portion 114 is formed of a plate-like member arranged in parallel to the fins so as not to hinder the air flow between the fins.

The material constituting each part of the heat sink main body 110 such as the above-described heat radiating fin 112 is not particularly limited as long as it has excellent thermal conductivity and heat resistance, and examples thereof include metals such as aluminum, iron, and copper. Can be adopted.

As shown in FIG. 2, the fixing means 210 is provided so that one end abuts the top plate 510 and the other end engages the heat sink body 110, and a portion that abuts the top plate 510 is a fixed end. Is a means for fixing the heat sink body 110 to the component m to be cooled by pressing it toward the component m to be cooled. The fixing means 210 is preferably means for pressing the heat sink body 110 against the component m to be cooled using the repulsive force of the compressed spring. In the present embodiment, as shown in FIG. 7, the fixing means 210 is roughly configured by a push pin 211, a coil spring 212 as the spring, and a heat sink fixing member 213, and the push pin 211 and the heat sink fixing member. 213 is connected and fixed. Thus, by using the repulsive force of the spring (coil spring 212) compressed by the fixing means 210, the heat sink H1 can be fixed to the component m to be cooled in close contact.

As shown in FIG. 7, the push pin 211 has a pin main part 211a and a tip part 211b.

The pin main portion 211a serves as a winding core around which a coil spring 212, which will be described later, is wound, and is formed in a longitudinal shape so that the coil spring 212 fits in a natural state. The tip end portion 211b is provided integrally with the end portion of the pin main portion 211a, and is inserted into the hole 113a by pressing against the pin fixing portion 113 shown in FIG. 8 with a constant load. Moreover, the front-end | tip part 211b has the latching piece 211b1 of the front-crack shape which has elasticity so that it may not remove easily after inserting in the hole 113a.

The spring is used to press the heat sink body 110 against the component m to be cooled using a repulsive force during compression. Although it does not specifically limit as said spring, From a viewpoint of the ease of mounting | wearing to the pin main part 211a, and a rebound improvement, it is preferable that it is a coil spring 212 as shown in FIG. In the present embodiment, the coil spring 212 is wound around the pin main portion 211a, and is attached so that one end thereof contacts the heat sink fixing member 213 and the other end contacts the pin fixing portion 113 (see FIG. 8). .

The heat sink fixing member 213 constitutes one end of the fixing means 210 and is a part that contacts the top plate 510. The heat sink fixing member 213 includes a fixing tip contact portion 213a that directly contacts the top plate 510, and a cross hole 213b for operating the heat sink fixing member 213 by attaching a plus driver (jig). Note that the fixed contact portion 213a may be formed of a material having a large friction coefficient, or may be subjected to a surface treatment or the like so as to increase the friction coefficient so that slipping or displacement with respect to the top plate 510 is difficult to occur. .

Here, the portion where the heat sink main body 110 and the fixing means 210 are engaged (the position of the pin fixing portion 113) is not particularly limited, but as shown in FIGS. 3 and 4, the component m to be cooled of the base portion 111 is used. It is preferable that it is located on the opposite side to the side which contacts. As a result, since the engagement portion is located closer to the top plate 510 than the base portion 111, the heat sink H1 is stably fixed to the component m to be cooled by suppressing the shaking of the fixing means 210 when the heat sink H1 is fixed. And the heat sink H1 can be easily fixed, and the engagement portion and the mounting component on the substrate interfere with each other because the engagement portion is more distant from the substrate than the base portion 111. Can be prevented.

The misalignment prevention guide 310 is provided on the base 111 so as to face the side surface of the cooling target component m, and is a guide for preventing the misalignment of the heat sink body 110 with respect to the cooling target component m. Specifically, as shown in FIGS. 3, 4, and 6, the misalignment prevention guide 310 includes four partition-shaped guides that are erected on the base portion 111 so as to surround the component m to be cooled from four sides. The horizontal movement of the heat sink body 110 with respect to the cooling target component m is restricted.

As described above, by including the misalignment prevention guide 310, the heat sink H1 can prevent the heat sink main body 110 and the cooling target component m from being misaligned, and the cooling target component m can be surely secured. Can be cooled to.

The heat conductive member 410 is a member that is provided in a portion that contacts the cooling target component m on the base portion 111 and is interposed between the base portion 111 and the cooling target component m to promote heat transfer. Examples of the thermally conductive member include a thermally conductive sheet formed by dispersing thermally conductive particles such as silver, copper, aluminum, aluminum oxide, aluminum nitride, and boron nitride in a resin to form a sheet; Examples include thermally conductive grease in which particles are dispersed in a viscous resin such as modified silicone. The heat conductive member 410 of the present embodiment is a heat conductive sheet, is formed in the same shape as the shape of the upper end surface of the component to be cooled in plan view, and is bonded onto the base portion 111 using an adhesive. .

Thus, by providing the heat conductive member 410, the heat sink H1 can promote heat transfer from the component m to be cooled to the heat sink body 110, and efficiently cool the component m to be cooled. be able to.

Next, a method of using the heat sink H1 for an electronic device will be described with reference to FIGS. FIG. 9 is a schematic perspective view of the electronic apparatus A1 with the top plate 510 removed before the heat sink H1 is attached. As shown in FIG. 9, the electronic device A1 includes a board k and a chassis sheet metal 610 attached with the board k, and a component m to be cooled is mounted on the board k.

Using such an electronic device A1, first, a heat sink (heat sink body 110) in a state where the fixing means 210 is not attached is attached to the cooling target component m so that the base portion 111 is in close contact with the heat conductive member 410. Place on top (see FIG. 10). At that time, the misalignment prevention guide 310 is guided in accordance with the cooling target component m so that the heat sink body 110 and the cooling target component m are not misaligned.

Next, the top plate 510 is attached to the chassis sheet metal 610 to fix them (see FIG. 11). In the top plate 510 shown in the present embodiment, an opening 511 for inserting the fixing means 210 is formed. The opening shape of the opening 511 is substantially similar to the shape of the heat sink fixing member 213 in plan view, and can be inserted only from a specific rotation direction. The opening 511 is arranged so that the holes 113a of all the pin fixing portions 113 can be visually recognized through the opening 511. Although not illustrated, it is preferable that the opening shape of the opening 511 and the shape of the heat sink fixing member 213 in plan view are asymmetric in the vertical and horizontal directions. Thereby, the direction of the heat sink fixing member 213 that can pass through the opening 511 can be further restricted, and the heat sink fixing member 213 can be prevented from rotating and passing through the opening 511 again.

Next, the four fixing means 210 are inserted in the direction indicated by the arrow through the opening 511 (see FIG. 12), and the tip 211b of the push pin 211 is inserted into the hole 113a. Engage. In this state, the heat sink fixing member 213 has not yet passed through the opening 511 of the top plate 510 and is positioned above the opening 511 (outside the casing).

Next, after adjusting the direction of the heat sink fixing member 213 so that it can pass through the opening 511, a Phillips screwdriver (jig) is engaged with the cross hole 213b and pressed to attach the heat sink fixing member 213 to the housing of the electronic device A1. The heat sink fixing member 213 is pushed into the body and rotated until the heat sink fixing member 213 pushed into the housing cannot pass through the opening 511 again (see FIG. 13). In this state, the coil spring 212 is compressed.

Next, the Phillips screwdriver is removed from the cross hole 213b to release the pressure on the heat sink fixing member 213. At this time, the heat sink fixing member 213 comes into contact with the top plate 510 by the repulsive force of the compressed coil spring 212 and the fixing means 210 pushes the heat sink body 110 back to the component m to be cooled with the contact portion with the top plate 510 as a fixed end. When the heat sink body 110 is pressed against the component m to be cooled, both are fixed in close contact (see FIG. 14).

As shown in FIG. 15, the heat sink fixing member 213 is locked to the inner surface side of the top plate 510 so that the heat sink fixing member 213 rotates until it reaches a predetermined direction and can be fixed in the direction when the rotation is completed. Possible stops 512 may be provided. Thus, by providing the stopper 512 on the top plate 510, the heat sink body 110 can be prevented from being displaced, and the cooling target component m can be reliably cooled.

[Second Embodiment]
16 to 29 are schematic views showing a heat sink H2 according to the second embodiment of the present invention. The heat sink H2 is roughly constituted by a heat sink body 110 and a fixing means 220 shown in FIG. 16, and a misalignment prevention guide 310 and a heat conductive member 410 shown in FIG. In the second embodiment, the push pin 221 and the heat sink fixing member 223 in the fixing means 220 to be described later are provided as separate bodies, and the two

members

221 and 223 are configured to be connectable. This is different from the first embodiment. Since the configuration other than the fixing means 220 is the same as that of the first embodiment, the same portions are denoted by the same reference numerals and detailed description thereof is omitted.

As shown in FIG. 22, the fixing means 220 is roughly constituted by a push pin 221, a coil spring 222, and a heat sink fixing member 223.

The push pin 221 has a pin main part 221a, a tip part 221b, a head part 221c, and a protruding part 221d. The pin main portion 221a and the tip end portion 221b are the same as the pin main portion 211a and the tip end portion 211b described above in the first embodiment, respectively, and the description of the first embodiment is incorporated and omitted. The head 221c constitutes an end opposite to the tip 221b of the push pin 221 and is a part to which a heat sink fixing member 223 described later is attached. The protrusion 221d is a part that is provided so as to protrude from the side surface of the head 221c and engages with a notch 223d (described later) of the heat sink fixing member 223.

The coil spring 222 presses the heat sink body 110 against the component m to be cooled using a repulsive force during compression. The coil spring 222 is wound around the pin main portion 221 a and is attached so that one end thereof is in contact with the head portion 221 c and the other end is in contact with the pin fixing portion 113.

The heat sink fixing member 223 is a member that constitutes one end of the fixing means 220 and contacts the top plate 510, and is configured to be connectable to the push pin 221 described above. This heat sink fixing member 223 fits a fixing tip contact portion 223a that directly contacts the top plate 510, a knob portion 223b for applying a toolless force (for example, a finger) to rotate, and a head portion 221c. It has a fitting recess 223c to be made and a notch 223d for receiving the protrusion 221d. The heat sink fixing member 223 is coupled to the push pin 221 by fitting the fitting recess 223c to the head 221c and locking the notch 223d to the protrusion 221d. In addition, since the structure of the fixing point contact part 223a is the same as that of the fixing point contact part 213a mentioned above in 1st Embodiment, it abbreviate | omits and uses description of 1st Embodiment. FIG. 17 is a schematic perspective view showing the electronic apparatus with the heat sink (heat sink H2) of FIG. 16 attached thereto.

Next, a method of using the heat sink H2 for an electronic device will be described with reference to FIGS. FIG. 24 is a schematic perspective view of the electronic apparatus A2 with the top plate 510 removed before the heat sink H2 is attached. As shown in FIG. 24, the electronic apparatus A2 includes a board k and a chassis metal plate 610 to which the board k is attached, and the component m to be cooled is mounted on the board k.

Using such an electronic device A2, first, the heat sink H2 in a state where the heat sink fixing member 223 is not attached is mounted on the component m to be cooled so that the base portion 111 is in close contact with the heat conductive member 410. (See FIG. 25). At that time, the misalignment prevention guide 310 is guided in accordance with the cooling target component m so that the heat sink body 110 and the cooling target component m are not misaligned.

Next, the top plate 510 is attached to the chassis sheet metal 610 and both are fixed (see FIG. 26). In the top plate 510 shown in the present embodiment, an opening 511 for inserting the heat sink fixing member 223 is formed. The opening shape of the opening 511 is substantially similar to the shape of the heat sink fixing member 223 in plan view, and is formed so that it can be inserted only from a specific rotation direction. Further, the opening 511 is disposed so that the upper ends of the heads 221c of all the push pins 221 can be visually recognized through the opening 511.

Next, the four heat sink fixing members 223 are inserted in the direction of the arrow through the opening 511 (see FIG. 27), the fitting recess 223c is fitted into the head 221c, and the notch 223d is inserted into the protrusion 221d. The push pin 221 and the heat sink fixing member 223 are connected to each other (see FIG. 22). In this state, the heat sink fixing member 223 has not yet passed through the opening 511 of the top plate 510 and is positioned above the opening 511.

Next, after adjusting the direction of the heat sink fixing member 223 so that it can pass through the opening 511, a force is applied to the knob portion 223b with a finger to push the heat sink fixing member 223 into the casing of the electronic device A2. The heat sink fixing member 223 is rotated until the heat sink fixing member 223 pushed into the inside again becomes an orientation that cannot pass through the opening 511 (see FIG. 28). In this state, the coil spring 222 is compressed.

Next, the finger is released from the knob portion 223b to release the pressure on the heat sink fixing member 223. At this time, the heat sink fixing member 223 comes into contact with the top plate 510 by the repulsive force of the compressed coil spring 222, and the fixing means 220 pushes the heat sink body 110 back to the component m to be cooled with the contact portion with the top plate 510 as a fixed end. When the heat sink body 110 is pressed against the component m to be cooled, both are fixed in close contact (see FIG. 29).

As described above, in the present embodiment, the push pin 221 and the heat sink fixing member 223 are provided independently, and the two members can be connected to each other, so that the heat sink H2 to the electronic device A2 can be connected. Fixing work can be easily performed.

[Third Embodiment]
30 to 32 are schematic views showing a heat sink H3 according to a third embodiment of the present invention. The heat sink H3 is roughly constituted by a heat sink body 110 and a fixing means 230 shown in FIG. 30, a misalignment prevention guide 310 and a heat conductive member 410 not shown. The third embodiment is different from the first embodiment in that four push pins 231 in a fixing unit 230 described later are integrally connected and fixed via a heat sink fixing member 233. Since the configuration other than the fixing means 230 is the same as that of the first embodiment, the same portions are denoted by the same reference numerals and detailed description thereof is omitted.

As shown in FIG. 30, the fixing means 230 is roughly configured by four push pins 231, four coil springs 232, and a heat sink fixing member 233.

The push pin 231 has a pin main part 231a, a tip part 231b, and a head part 231c. The pin main portion 231a and the tip portion 231b are the same as the pin main portion 211a and the tip portion 211b described above in the first embodiment, respectively, and the description of the first embodiment is incorporated and omitted. The head 231c constitutes an end opposite to the tip 231b of the push pin 231 and is a part that is connected and fixed to a heat sink fixing member 233 described later.

The coil spring 232 presses the heat sink body 110 against the component m to be cooled using a repulsive force during compression. The coil spring 232 is wound around the pin main portion 231a, and is attached so that one end thereof is in contact with the head portion 231c and the other end is in contact with the pin fixing portion 113.

The heat sink fixing member 233 is a member that constitutes one end of the fixing means 230 and contacts the top plate 510, and has a flat plate portion 233a and an extending portion 233b as shown in FIG. The flat plate portion 233a integrally connects and fixes the four push pins 231 and has the same function as the fixed

contact portions

213a and 223a shown in the first and second embodiments. Specifically, the flat plate portion 233a is formed by a single flat plate in a plan view, and the heads 231c of the push pins 231 are fitted into the holes 233c formed in the four corners of the flat plate portion 233a. It is worn. Further, a portion (surface) opposite to the side from which the push pin 231 protrudes of the flat plate portion 233a is a fixed tip contact portion 233d that directly contacts the top plate 510. The extending portion 233b extends from each of a pair of opposing edges of the flat plate portion 233a, and is a locked portion for fixing to a locking portion 513 (see FIG. 31) provided on the top plate 510. 233b1 is formed. In the present embodiment, the locking portion 513 is formed in a protruding shape having a claw, and the locked portion 233b1 is formed with an opening for receiving the claw of the locking portion 513.

Next, a method of using the heat sink H3 for the electronic device A3 will be described. Using the electronic device A3 in the same state as the electronic device A1 shown in FIG. 9 described above, first, the heat sink H3 is mounted on the component m to be cooled so that the base portion 111 is in close contact with the heat conductive member 410. Put. At that time, the misalignment prevention guide 310 is guided in accordance with the cooling target component m so that the heat sink body 110 and the cooling target component m are not misaligned. In addition, when using the heat sink H3 of this embodiment, before mounting the heat sink H3 on the component m to be cooled, the tip portion 231b of the push pin 231 is inserted in the hole 113a in advance, and the heat sink body 110, the fixing means 230, Are used in an engaged state.

Next, the top plate 510 is attached to the chassis sheet metal 610 to fix both. Specifically, the locking portion 513 of the top plate 510 is inserted into the opening of the locked portion 233b1 of the heat sink H3, and the fixed contact portion 233d and the top plate 510 are brought into contact with the coil spring 232 in a compressed state. The top plate 510 is slid while keeping this contact state, and the claw of the locking portion 513 is locked to the locked portion 233b1, and then the top plate 510 and the chassis metal plate 610 are fixed. At this time, due to the repulsive force of the compressed coil spring 232, the fixing means 230 pushes the heat sink body 110 back to the component m to be cooled with the contact portion with the top plate 510 as a fixed end, and the heat sink body 110 presses against the component m to be cooled. As a result, both are fixed in close contact (see FIG. 32).

Thus, in the present embodiment, the four push pins 231 are integrally connected and fixed, so that it is not necessary to attach each push pin 231 individually, and the heat sink H3 is fixed to the component m to be cooled. The work can be easily performed, and the heat sink H3 can be stably fixed to the component m to be cooled by suppressing the shaking of the fixing means 230 when fixing the heat sink H3.

<Heat sink mounting structure>
The heat sink mounting structure of the present invention is such that a plurality of heat sinks are mounted on a single top plate.

Thus, since the mounting structure of the heat sink is the above structure, the heat sink can be directly and reliably fixed to the component to be cooled without securing a region for mounting each heat sink on the substrate. Even when used in an electronic device having one or more substrates mounted with a plurality of components to be cooled whose distances from the top plate are different from each other, each heat sink can be securely attached to each component to be cooled. it can.

Note that the top plate of the electronic device to which the heat sink mounting structure is applied is fixed to a position facing one side of the cooling target component of one or more boards (the distance between the board and the top board). Is also fixed). Hereinafter, embodiments of the heat sink mounting structure of the present invention will be described with reference to the drawings. However, the heat sink mounting structure is not limited to the embodiments described in the drawings.

[Fourth Embodiment]
FIG. 33 is a schematic front view showing a fourth embodiment of the present invention. Here, the two heat sinks H1 according to the first embodiment described above are used, and the electronic apparatus A4 according to the present embodiment is schematically illustrated as components to be cooled m1 and m2, as shown in FIG. , Substrates k 1 and k 2, heat sinks H 1 and H 1, a top plate 510, and a chassis metal plate 610.

As described above, the cooling target components m1 and m2 are electronic components that require cooling in order to suppress a temperature rise due to heat generation during operation. In the present embodiment, semiconductor elements are used as the cooling target components m1 and m2.

In the present embodiment, two boards k1 and k2 having different mounting heights are arranged in two stages. The cooling target component m1 is placed on the lower board k1 and the cooling target part m2 is placed on the upper board k2. Each one is implemented. The substrates k1 and k2 are fixed to the chassis sheet metal 610.

The heat sinks H1 and H1 promote heat dissipation from the cooling target components m1 and m2, respectively, and suppress the temperature rise. Each heat sink H <b> 1 includes a heat sink body 110 and a fixing unit 210, and the fixing unit 210 includes a push pin 211 and a coil spring 212. In each heat sink main body 110, a portion where the heat sink main body 110 and the fixing means 210 are engaged (see the pin fixing portion 113 in FIG. 8) is located on the opposite side of the base portion 111 from the side on which the components to be cooled m1 and m2 abut. is doing. Thereby, each heat sink H1 can be stably fixed to the components m1 and m2 to be cooled, the fixing work of the heat sink H1 is facilitated, and other parts mounted on the engagement portion and the boards k1 and k2 are facilitated. Interference with electronic components can be prevented.

The top plate 510 is mounted on the cooling target components m1 and m2 of the substrates k1 and k2, and is fixed at a position facing the substrates k1 and k2 (the interval between the substrates k1 and k2 and the top plate 510 is also fixed). Yes. The top plate 510 is a member that constitutes the casing of the electronic apparatus A4, and is fixed to a chassis sheet metal 610 described later.

The chassis sheet metal 610 is a member constituting the casing of the electronic device A4, and fixes the above-described substrates k1 and k2 and the top plate 510.

In the present embodiment, the heat sink body 110 is in contact with the cooling target components m1 and m2, and the fixing means 210 is in contact with the heat sink body 110 and the top plate 510 in a state where the coil spring 212 is compressed. As a result, each heat sink H1 is pressed against the cooling target components m1 and m2 with the portion contacting the top plate 510 as a fixed end, and each heat sink body 110 is fixed to the cooling target components m1 and m2, respectively.

Next, a configuration method of the heat sink mounting structure will be described. As shown in FIG. 33, using an electronic device A4 that includes two boards k1 and k2 arranged in a different manner, the cooling target component m1 is mounted on the board k1, and the cooling target component m2 is mounted on the board k2, respectively. The heat sinks H1 are placed on the cooling target components m1 and m2 so that the base portions 111 thereof are in close contact with each other via the heat conductive member 410. At that time, the position shift prevention guides 310 are guided in accordance with the cooling target components m1 and m2 so that the heat sink main bodies 110 and the cooling target components m1 and m2 do not shift in position.

Next, after attaching the top plate 510 to the chassis metal plate 610 and fixing both, the heat sinks H1 are fixed to the cooling target components m1 and m2. The configuration of the top plate 510 and the method for fixing the heat sink H1 to the cooling target components m1 and m2 are the same as those described in the first embodiment, and thus the description of the first embodiment is incorporated. Omitted. The heat sink mounting structure is configured as described above.

In addition, this invention is not limited to the structure of embodiment mentioned above, is shown by the claim, and intends that all the changes within the meaning and range equivalent to a claim are included. Is done.

For example, in each of the above-described embodiments, the heat sinks H1 to H3 including both the misalignment prevention guide 310 and the heat conductive member 410 and the mounting structure thereof have been described, but only one of them is provided. It may be a thing which is not provided.

Further, in each of the above-described embodiments, the description has been given of the use of the coil spring as the fixing means for pressing the heat sink body 110 toward the cooling target parts m, m1, and m2. However, the fixing means uses the heat sink body as the cooling target part. It is not particularly limited as long as it can be pressed toward.

Further, in each of the above-described embodiments, the plate-shaped radiation fins 112 as shown in FIG. 8 have been described. For example, the pin-shaped radiation fins 122 as illustrated in FIG. 34 are employed. There may be. In such a case, it is preferable to make the connecting portion narrow. Thereby, the flow of the wind in the heat sink body can be performed in all directions in a plan view, and the margin for designing the electronic device can be increased. Even when a pin-like fin is employed as the heat radiating fin, the connecting portion may be wide as long as the fin is provided in parallel with the air flow direction in the heat sink body. Thereby, it becomes possible to maintain cooling efficiency.

In the first embodiment described above, the push pin 211 and the heat sink fixing member 213 are separately provided, and the heat sink H1 in which these are connected and fixed has been described. However, the push pin 211 and the heat sink fixing member 213 are May be provided integrally.

In the third embodiment described above, the heat sink H3 in which the locked portion 233b1 is provided in the extended portion 233b of the heat sink fixing member 233 has been described. The thing provided with the to-be-latched part of a form different from the to-be-latched part 233b1 is also employable.

In the above-described fourth embodiment, the mounting structure for the electronic device in which the heat sinks H1 and H1 are disposed on the plurality of substrates k1 and k2, respectively, has been described. However, a plurality of heat sinks are provided on one substrate. It may be arranged.

Further, in the above-described fourth embodiment, the form using two heat sinks H1 according to the first embodiment has been described. However, as long as the heat sink employed in the heat sink mounting structure is the heat sink of the present invention. It does not specifically limit, The heat sink currently attached two or more can be used combining the thing of the mutually same or different structure.

A1 to A4 Electronic device H1 to H4 Heat sink k, k1, k2 Substrate m, m1, m2 Cooling target part 110 Heat sink body 111 Base part 112

Radiation fins

210, 220, 230 Fixing means 211, 221, 231 Push pins 212, 222, 232

Coil spring

213, 223, 233 Heat sink fixing member 310 Position shift prevention guide 410 Thermal conductive member 510 Top plate 610 Chassis sheet metal

Claims

A heat sink disposed between a board and a top plate fixed to a position opposite to the board on the mounting side of the component to be cooled of the board,
A heat sink body having a base portion that abuts on the component to be cooled, and a radiation fin that is integrally connected to the base portion and protrudes on a side opposite to the side on which the component to be cooled abuts.
One end is in contact with the top plate and the other end is engaged with the heat sink main body, and the heat sink main body is pressed toward the component to be cooled with a portion contacting the top plate as a fixed end. A heat sink, comprising: a fixing means for fixing the heat sink body to the component to be cooled.
2. The heat sink according to claim 1, wherein the fixing means is means for pressing the heat sink body against the component to be cooled using the repulsive force of the compressed spring.
The heat sink according to claim 1 or 2, wherein a portion where the heat sink main body and the fixing means are engaged is located on a side opposite to a side on which a cooling target component abuts.
The position shift prevention guide which is provided on a base part so that it may face the side surface of cooling object components, and prevents the position shift of the said heat sink main body with respect to the said cooling object components is further provided. The heat sink according to any one of claims.
5. A heat conductive member that is provided at a portion that contacts the part to be cooled on the base part and is interposed between the base part and the part to be cooled to promote heat transfer. The heat sink according to any one of the above.
A heat sink mounting structure in which a plurality of heat sinks according to any one of claims 1 to 5 are mounted on a single top plate.