WO2016191403A1 - Composition d'adhésif époxyde à deux composants (2k) pour coller des métaux huileux - Google Patents

Composition d'adhésif époxyde à deux composants (2k) pour coller des métaux huileux Download PDF

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Publication number
WO2016191403A1
WO2016191403A1 PCT/US2016/033866 US2016033866W WO2016191403A1 WO 2016191403 A1 WO2016191403 A1 WO 2016191403A1 US 2016033866 W US2016033866 W US 2016033866W WO 2016191403 A1 WO2016191403 A1 WO 2016191403A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive composition
epoxy
composition
core
oil
Prior art date
Application number
PCT/US2016/033866
Other languages
English (en)
Inventor
Bharati BALIJEPALLI
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of WO2016191403A1 publication Critical patent/WO2016191403A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne une nouvelle composition adhésive 2K dont le composant de résine époxyde comprend un solide polymère organique contenant une fraction phénolique vinylique. Ladite composition adhésive permet d'obtenir une forte liaison à des substrats métalliques contaminés par de l'huile, lorsqu'elle durcit à température ambiante, tout en présentant simultanément une bonne résistance aux chocs.
PCT/US2016/033866 2015-05-28 2016-05-24 Composition d'adhésif époxyde à deux composants (2k) pour coller des métaux huileux WO2016191403A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562167489P 2015-05-28 2015-05-28
US62/167,489 2015-05-28

Publications (1)

Publication Number Publication Date
WO2016191403A1 true WO2016191403A1 (fr) 2016-12-01

Family

ID=56119764

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2016/033866 WO2016191403A1 (fr) 2015-05-28 2016-05-24 Composition d'adhésif époxyde à deux composants (2k) pour coller des métaux huileux

Country Status (1)

Country Link
WO (1) WO2016191403A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020082006A1 (fr) * 2018-10-18 2020-04-23 Illinois Tool Works Inc. Adhésif époxy durci à deux composants et à faible teneur en halogène
WO2020115041A1 (fr) 2018-12-04 2020-06-11 Hexcel Composites Limited Composition adhésive
CN111315839A (zh) * 2017-08-15 2020-06-19 Ddp特种电子材料美国公司 室温可固化的双组分增韧的环氧粘合剂

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4021403A (en) * 1974-02-07 1977-05-03 Maruzen Oil Co. Ltd. Flame resistant thermosetting resin composition and metal clad laminate composed of the thermosetting resin composition
US4659779A (en) * 1985-04-02 1987-04-21 Ciba-Geigy Corporation Solid solution of amine and polymerized phenol as epoxy resin cure accelerator
EP0351365A2 (fr) * 1988-07-09 1990-01-17 Ciba-Geigy Ag Compositions durcissables de résine époxyde
EP0365479A2 (fr) * 1988-10-18 1990-04-25 Ciba-Geigy Ag Compositions durcissables de résines époxydes
JPH02243334A (ja) * 1989-03-17 1990-09-27 Toshiba Chem Corp 多層銅張積層板
EP0706548A1 (fr) * 1993-06-24 1996-04-17 Minnesota Mining And Manufacturing Company Composition adhesive epoxy pour coller des metaux contamines par de l'huile
WO2005007766A1 (fr) 2003-07-07 2005-01-27 Dow Global Technologies Inc. Composition de colle epoxyde et son procede d'application
EP1632533A1 (fr) 2003-06-09 2006-03-08 Kaneka Corporation Procede de production d'une resine epoxy modifiee
EP1695990A1 (fr) * 2005-02-28 2006-08-30 Dow Global Technologies Inc. Composition adhesive epoxy a deux composants
WO2007025007A1 (fr) * 2005-08-24 2007-03-01 Henkel Kommanditgesellschaft Auf Aktien Compositions d'epoxyde presentant une resistance superieure aux chocs
US7625977B2 (en) 2007-06-20 2009-12-01 Dow Global Technologies Inc. Adhesive of epoxy resin, toughener and blocked isocyanate polytetrahydrofuran toughener
US7642316B2 (en) 2004-10-14 2010-01-05 Dow Global Technologies, Inc. Rubber modified monovinylidene aromatic polymers and fabricated articles prepared therefrom
WO2012158336A1 (fr) * 2011-05-19 2012-11-22 Dow Global Technologies Llc Nouvel adhésif structural et son utilisation
US8404787B2 (en) 2005-06-02 2013-03-26 Dow Global Technologies Llc Toughened epoxy adhesive composition

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4021403A (en) * 1974-02-07 1977-05-03 Maruzen Oil Co. Ltd. Flame resistant thermosetting resin composition and metal clad laminate composed of the thermosetting resin composition
US4659779A (en) * 1985-04-02 1987-04-21 Ciba-Geigy Corporation Solid solution of amine and polymerized phenol as epoxy resin cure accelerator
EP0351365A2 (fr) * 1988-07-09 1990-01-17 Ciba-Geigy Ag Compositions durcissables de résine époxyde
EP0365479A2 (fr) * 1988-10-18 1990-04-25 Ciba-Geigy Ag Compositions durcissables de résines époxydes
JPH02243334A (ja) * 1989-03-17 1990-09-27 Toshiba Chem Corp 多層銅張積層板
EP0706548A1 (fr) * 1993-06-24 1996-04-17 Minnesota Mining And Manufacturing Company Composition adhesive epoxy pour coller des metaux contamines par de l'huile
US20070027233A1 (en) 2003-06-09 2007-02-01 Katsumi Yamaguchi Process for producing modified epoxy resin
EP1632533A1 (fr) 2003-06-09 2006-03-08 Kaneka Corporation Procede de production d'une resine epoxy modifiee
WO2005007766A1 (fr) 2003-07-07 2005-01-27 Dow Global Technologies Inc. Composition de colle epoxyde et son procede d'application
US7642316B2 (en) 2004-10-14 2010-01-05 Dow Global Technologies, Inc. Rubber modified monovinylidene aromatic polymers and fabricated articles prepared therefrom
EP1695990A1 (fr) * 2005-02-28 2006-08-30 Dow Global Technologies Inc. Composition adhesive epoxy a deux composants
US8404787B2 (en) 2005-06-02 2013-03-26 Dow Global Technologies Llc Toughened epoxy adhesive composition
WO2007025007A1 (fr) * 2005-08-24 2007-03-01 Henkel Kommanditgesellschaft Auf Aktien Compositions d'epoxyde presentant une resistance superieure aux chocs
US7625977B2 (en) 2007-06-20 2009-12-01 Dow Global Technologies Inc. Adhesive of epoxy resin, toughener and blocked isocyanate polytetrahydrofuran toughener
WO2012158336A1 (fr) * 2011-05-19 2012-11-22 Dow Global Technologies Llc Nouvel adhésif structural et son utilisation

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
LEE, H.; NEVILLE, K.: "Handbook of Epoxy Resins", 1967, MCGRAW-HILL BOOK COMPANY, pages: 2 - 1,2-27

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111315839A (zh) * 2017-08-15 2020-06-19 Ddp特种电子材料美国公司 室温可固化的双组分增韧的环氧粘合剂
WO2020082006A1 (fr) * 2018-10-18 2020-04-23 Illinois Tool Works Inc. Adhésif époxy durci à deux composants et à faible teneur en halogène
WO2020115041A1 (fr) 2018-12-04 2020-06-11 Hexcel Composites Limited Composition adhésive

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