WO2016171480A1 - Film polymère, film de protection de panneau solaire, et appareil de production d'énergie solaire le comprenant - Google Patents
Film polymère, film de protection de panneau solaire, et appareil de production d'énergie solaire le comprenant Download PDFInfo
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- WO2016171480A1 WO2016171480A1 PCT/KR2016/004139 KR2016004139W WO2016171480A1 WO 2016171480 A1 WO2016171480 A1 WO 2016171480A1 KR 2016004139 W KR2016004139 W KR 2016004139W WO 2016171480 A1 WO2016171480 A1 WO 2016171480A1
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- Prior art keywords
- layer
- resin
- bonding force
- polymer film
- polyester resin
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- 229920006254 polymer film Polymers 0.000 title claims abstract description 29
- 230000001681 protective effect Effects 0.000 title claims abstract description 23
- 238000010248 power generation Methods 0.000 title abstract 2
- 229920005989 resin Polymers 0.000 claims abstract description 93
- 239000011347 resin Substances 0.000 claims abstract description 93
- 229920001225 polyester resin Polymers 0.000 claims abstract description 47
- 239000004645 polyester resin Substances 0.000 claims abstract description 45
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 32
- 229910052731 fluorine Inorganic materials 0.000 claims description 32
- 239000011737 fluorine Substances 0.000 claims description 32
- 239000002033 PVDF binder Substances 0.000 claims description 24
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 24
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 20
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 14
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 10
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 9
- 150000002009 diols Chemical class 0.000 claims description 7
- 150000002148 esters Chemical class 0.000 claims description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 claims description 5
- 239000000049 pigment Substances 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical group O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 claims description 3
- 230000002708 enhancing effect Effects 0.000 claims description 3
- 229920005672 polyolefin resin Polymers 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 238000007334 copolymerization reaction Methods 0.000 claims description 2
- 125000001153 fluoro group Chemical group F* 0.000 abstract 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- -1 Spiroglycol Chemical compound 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 6
- 229910010413 TiO 2 Inorganic materials 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 239000011342 resin composition Substances 0.000 description 5
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical group FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 4
- 229920006026 co-polymeric resin Polymers 0.000 description 4
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 4
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 4
- 150000008064 anhydrides Chemical group 0.000 description 3
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- DCTMXCOHGKSXIZ-UHFFFAOYSA-N (R)-1,3-Octanediol Chemical compound CCCCCC(O)CCO DCTMXCOHGKSXIZ-UHFFFAOYSA-N 0.000 description 2
- BLTXWCKMNMYXEA-UHFFFAOYSA-N 1,1,2-trifluoro-2-(trifluoromethoxy)ethene Chemical compound FC(F)=C(F)OC(F)(F)F BLTXWCKMNMYXEA-UHFFFAOYSA-N 0.000 description 2
- MIZLGWKEZAPEFJ-UHFFFAOYSA-N 1,1,2-trifluoroethene Chemical group FC=C(F)F MIZLGWKEZAPEFJ-UHFFFAOYSA-N 0.000 description 2
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical group COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- WFLOTYSKFUPZQB-OWOJBTEDSA-N (e)-1,2-difluoroethene Chemical group F\C=C\F WFLOTYSKFUPZQB-OWOJBTEDSA-N 0.000 description 1
- 229940031723 1,2-octanediol Drugs 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- YUQDBHFUUCAXOX-UHFFFAOYSA-N 2,2-diethylpentane-1,5-diol Chemical compound CCC(CC)(CO)CCCO YUQDBHFUUCAXOX-UHFFFAOYSA-N 0.000 description 1
- RYRZSXJVEILFRR-UHFFFAOYSA-N 2,3-dimethylterephthalic acid Chemical compound CC1=C(C)C(C(O)=O)=CC=C1C(O)=O RYRZSXJVEILFRR-UHFFFAOYSA-N 0.000 description 1
- OJRJDENLRJHEJO-UHFFFAOYSA-N 2,4-diethylpentane-1,5-diol Chemical compound CCC(CO)CC(CC)CO OJRJDENLRJHEJO-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- BPZIYBJCZRUDEG-UHFFFAOYSA-N 2-[3-(1-hydroxy-2-methylpropan-2-yl)-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]-2-methylpropan-1-ol Chemical compound C1OC(C(C)(CO)C)OCC21COC(C(C)(C)CO)OC2 BPZIYBJCZRUDEG-UHFFFAOYSA-N 0.000 description 1
- VNPMDUDIDCXVCH-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-3-(3-piperazin-1-ylpropyl)pyrazol-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound O=C(CN1C=C(C(CCCN2CCNCC2)=N1)C1=CN=C(NC2CC3=C(C2)C=CC=C3)N=C1)N1CCC2=C(C1)N=NN2 VNPMDUDIDCXVCH-UHFFFAOYSA-N 0.000 description 1
- DSKYSDCYIODJPC-UHFFFAOYSA-N 2-butyl-2-ethylpropane-1,3-diol Chemical compound CCCCC(CC)(CO)CO DSKYSDCYIODJPC-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- LNFDWQCEHXSMLT-UHFFFAOYSA-N 5-methylhexane-1,5-diol Chemical compound CC(C)(O)CCCCO LNFDWQCEHXSMLT-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- FGEGZNORXGGFML-UHFFFAOYSA-N C(C)C=COF Chemical compound C(C)C=COF FGEGZNORXGGFML-UHFFFAOYSA-N 0.000 description 1
- 229920001634 Copolyester Polymers 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 229920006368 Hylar Polymers 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
- OWBTYPJTUOEWEK-UHFFFAOYSA-N butane-2,3-diol Chemical compound CC(O)C(C)O OWBTYPJTUOEWEK-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- AEIJTFQOBWATKX-UHFFFAOYSA-N octane-1,2-diol Chemical compound CCCCCCC(O)CO AEIJTFQOBWATKX-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 125000005825 oxyethoxy group Chemical group [H]C([H])(O[*:1])C([H])([H])O[*:2] 0.000 description 1
- FOKCKXCUQFKNLD-UHFFFAOYSA-N pent-1-enyl hypofluorite Chemical compound C(CC)C=COF FOKCKXCUQFKNLD-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- Embodiments relate to a polymer film, a solar panel protective film, and a photovoltaic device including the same.
- PVDF Polyvinylidene fluoride
- PVDF film many kinds of objects are coated with a PVDF film, and in addition to the above-described physical properties, various physical properties are additionally required for the PVDF film. That is, there is a need for good adhesion to the object to be coated (substrate) and good heat resistance to withstand exposure to mild climatic conditions or high temperature processes. For example, there is a need for high strength and flexibility to withstand the mechanical pressure generated when drawing.
- Korean Laid-Open Patent Publication No. 10-2011-0118736 discloses a PVDF substrate film exhibiting good flexibility and high strength, and discloses a multilayered film in which a PET or PEN sheet and the PVDF substrate film are combined.
- the fluorine-based polymer resins constituting the existing fluorine-based polymer film including the PVDF base film disclosed in Korean Patent Application Laid-Open No. 10-2011-0118736, do not mix with each other when coextruded with PET resin (immiscible) There was a problem causing it.
- Embodiments provide a polymer film, a solar panel protective film, and a photovoltaic device including the same, which can be easily manufactured with improved peel strength.
- a first layer comprising a polyester resin
- the second layer comprises more than 50 wt% to 90 wt% or less of fluorinated resin and 5 to 25 wt% of bonding strength improving resin, and the bonding force between the bonding force improving resin and the polyester resin is the fluorine resin and the poly It provides a polymer film that is greater than the bonding force between ester resins.
- a first layer comprising a polyester resin
- the second layer comprises more than 50 wt% to 90 wt% or less of fluorinated resin and 5 to 25 wt% of bonding strength improving resin, and the bonding force between the bonding force improving resin and the polyester resin is the fluorine resin and the poly It provides a solar panel protective film, which is greater than the bonding force between ester resins.
- Solar panels And it provides a photovoltaic device comprising the protective film disposed on at least one surface of the solar cell panel.
- the polymer film according to the embodiment is formed by coextrusion of a fluorine-based resin (second layer) and a polyester resin (first layer), and by using the fluorine-based resin together with a bonding strength improving resin, The bonding force between the second layers is improved.
- the first layer and the second layer may be strongly bonded to each other to form one laminated film.
- the embodiment easily forms the fluorine-based resin layer and the polyester resin layer having the improved peel strength with each other by one co-extrusion to a desired thickness. can do.
- FIG. 1 is a view illustrating one cross section of a solar panel protective film according to an embodiment.
- FIG. 2 is a view illustrating a cross section of the solar cell apparatus according to an embodiment.
- Embodiments include a first layer comprising a polyester resin; And a second layer formed on one surface or both surfaces of the first layer, wherein the first layer and the second layer have a coextruded structure, and the second layer is more than 50 wt% to 90 wt% or less
- a resin film comprising a resin and a bonding strength improving resin of 5 to 25% by weight, wherein the bonding force between the bonding force improving resin and the polyester resin is larger than the bonding force between the fluorine-based resin and the polyester resin.
- FIG. 1 is a view illustrating one cross section of a solar panel protective film according to an embodiment.
- a solar panel protective film includes a first layer 100, a second layer 200, and a third layer 300.
- the first layer comprises a polyester resin.
- the first layer comprises at least one polyester resin.
- the polyester resin may be a homopolymerized polyester or a copolyester.
- the first layer may comprise about 80% by weight or more of the polyester resin.
- the first layer may include the polyester resin in an amount of about 90% by weight or more.
- the first layer may include the polyester resin in an amount of about 95% by weight or more.
- the first layer may include the polyester resin in an amount of about 99% by weight or more.
- the polyester resin includes a diol component and a dicarboxylic acid component.
- the polyester resin may be composed entirely of the diol component and the dicarboxylic acid component.
- the polyester resin may include about 95 mol% or more of the diol component and the dicarboxylic acid component.
- the polyester resin may be formed by transesterification of the diol component and the dicarboxylic acid component and then polymerization.
- diol component examples include ethylene glycol, 1,4-cyclohexanedimethanol, 1,3-propanediol, 1,2-octanediol, 1,3-octanediol, 2,3-butanediol, 1,3- Butanediol, 1,4-butanediol, 1,5-pentanediol, 2,2-dimethyl-1,3-propanediol (neopentyl glycol), 2-butyl-2-ethyl-1,3-propanediol, 2, 2-diethyl-1,5-pentanediol, 2,4-diethyl-1,5-pentanediol, 3-methyl-1,5-pentanediol, 1,1-dimethyl-1,5-pentanediol, Spiroglycol, 3,9-bis (1,1-dimethyl-2-hydroxyethyl) -2
- the diol component comprises about 20 mol% to about 97 mol% ethylene glycol, and at least one of neopentyl glycol, 1,4-cyclohexanedimethanol, diethylene glycol and spiroglycol to about 3 mol% to about 80 It may be included in the content of mol%.
- the dicarboxylic acid component include aromatic dicarboxylic acids such as terephthalic acid, dimethyl terephthalic acid, isophthalic acid, naphthalenedicarboxylic acid and orthophthalic acid; Aliphatic dicarboxylic acids such as adipic acid, azelaic acid, sebacic acid, and decanedicarboxylic acid; Alicyclic dicarboxylic acid; Ester esters thereof; And mixtures thereof.
- the dicarboxylic acid component may comprise at least about 80 mole percent aromatic dicarboxylic acid.
- the dicarboxylic acid component may comprise from about 20 mol% to about 97 mol% terephthalic acid and from about 3 mol% to about 80 mol% isophthalic acid.
- the second layer is in direct contact with the first layer.
- the second layer may directly contact the top and / or bottom surface of the first layer.
- the second layer may be in direct contact with the entire top and / or bottom of the first layer.
- the second layer includes a fluorine resin and a bonding force improving resin.
- the fluorine-based resin and the bonding force improving resin are mixed with each other. That is, the second layer includes a mixture of the fluorine resin and the bonding force improving resin.
- the fluorine-based resin may be a polymer containing fluorine.
- the fluorine-based resin examples include ethylene-tetrafluoroethylene copolymer (ETFE), polyvinylidene fluoride (PVDF), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), tetrafluoroethylene-hexafluoro Ropropylene-vinylidene fluoride copolymer (THV), copolymers thereof, and mixtures thereof.
- ETFE ethylene-tetrafluoroethylene copolymer
- PVDF polyvinylidene fluoride
- FEP tetrafluoroethylene-hexafluoropropylene copolymer
- FEP tetrafluoroethylene-hexafluoropropylene copolymer
- the fluorine-based resin may be homopolymerized polyvinylidene fluoride or copolymerized polyvinylidene fluoride.
- PVDF is a copolymer resin
- vinylidene fluoride (VF2) and a comonomer are resin copolymerized in the weight ratio of 50: 50-99: 1.
- Comonomers that can be copolymerized are preferably fluorinated monomers, for example vinyl fluoride; Trifluoroethylene (VF 3); Chlorotrifluoroethylene (CTFE); 1,2-difluoroethylene; Tetrafluoroethylene (TFE); Hexafluoropropylene (HFP); Perfluoro (alkylvinyl) ethers such as perfluoro (methylvinyl) ether (PMVE), perfluoro (ethylvinyl) ether (PEVE) and perfluoro (propylvinyl) ether (PPVE); Perfluoro (1,3-diosol); And perfluoro (2,2-dimethyl-1,3-diosol) (PDD).
- chlorotrifluoroethylene (CTFE) hexafluoropropylene
- HFP hexafluoropropylene
- TFE tetrafluoroethylene
- the viscosity measured by a capillary flow meter under conditions of shear rate of 100 s ⁇ 1 and 230 ° C. is preferably 100 to 2,500 Pa ⁇ s, preferably 500 to 2,000 Pa ⁇ s. More preferred.
- the content of the fluorine-based resin, in particular PVDF is preferably greater than 50% by weight and 90% by weight, particularly 60 to 80% by weight, based on the total weight of the second layer. If the content of PVDF is 50% by weight or less, there may be a limit in sufficient weather resistance expression, when the content of more than 90% by weight more than necessary properties may be expressed or manufacturing costs may increase.
- the bonding force improving resin has improved bonding force with the first layer.
- the bonding force improving resin has improved bonding strength with the polyester resin. More specifically, the bonding force between the bonding force improving resin and the polyester resin included in the first layer is greater than the bonding force between the fluorine-based resin and the polyester resin. More specifically, with respect to the polyester resin, the bonding force of the bonding force improving resin may be about 1.3 times or more greater than the bonding force of the fluorine-based resin. More specifically, with respect to the polyester resin, the bonding force of the bonding force improving resin may be about 1.5 times or more greater than the bonding force of the fluorine-based resin. More specifically, with respect to the polyester resin, the bonding force of the bonding force improving resin may be about three times or more greater than the bonding force of the fluorine-based resin.
- the bonding force improving resin may be an acrylic resin.
- the bonding force improving resin may be a substituted or unsubstituted polymethyl methacrylate (PMMA) resin.
- the adhesion enhancing resin may be a single resin of methyl methacrylate monomer or a copolymer resin with other comonomers.
- MMA methyl methacrylate
- a comonomer resins copolymerized in the weight ratio of 50: 50-99: 1.
- Examples of comonomers that can be copolymerized include alkyl (meth) acrylates, acrylonitrile, butadiene, styrene, isoprene and mixtures thereof.
- alkyl (meth) acrylates are described in Kirk- Othmer Encyclopedia of Chemical Technology, 4th Edition , Vol. 1, p. 292-293 & Vol. 16, p. 475-478.
- the copolymer resin may be a copolymer of methyl acrylate and / or ethyl acrylate comonomer in an amount of 1 to 20% by weight, in particular 5 to 15% by weight.
- PMMA may be functionalized, for example, may contain acid, acid chloride, alcohol or anhydride functional groups, and these functional groups may be introduced by way of graft or copolymerization. Among these, it is preferable that it is an acid functional group provided with acrylic acid copolymer resin.
- the content ratio of the functional group may be 0 to 15% by weight based on the weight of the PMMA containing the functional group.
- Two adjacent acrylic acid functional groups may also lose water to form an anhydride such as Chemical Formula 1 or 2 below.
- anhydride such as Chemical Formula 1 or 2 below.
- These anhydrides can serve to express softer soft structures by enhancing the weak impact strength of PMMA or by mitigating the crystal behavior of PVDF after blending with PVDF:
- the PMMA used in the examples may be modified polymethylmethacrylate having impact resistance.
- the modified polymethylmethacrylate may have a specific heat of 0.5 to 2.0 J / (g ⁇ K), or 1.0 to 2.0 J / (g ⁇ K), as measured in accordance with JIS K 7123, in detail about 1.5 It may have a specific heat of J / (g ⁇ K).
- the modified poly (methyl methacrylate) is as measured in accordance with JIS K7197, 5X10 -5 / °C to 20X10 -5 / °C, 5X10 -5 / °C to 15X10 -5 / °C, 10X10 -5 / °C to 15X10 - 5 / °C, 10X10, or it may have a linear thermal expansion coefficient of -5 / °C to 12X10 -5 / °C.
- the modified polymethyl methacrylate is 0.1 to 1.0W / (mK), 0.1 to 0.5W / (mK), 0.1 to 0.3W / (mK) as measured according to JIS A1412 , 0.1 to 0.2 W / (m ⁇ K), or about 0.2 W / (m ⁇ K).
- the modified polymethylmethacrylate may have a load bending temperature of 80 to 90 ° C., 80 to 85 ° C., or 82 to 85 ° C. as measured according to JIS K7191 or ISO 75.
- the modified polymethylmethacrylate may have a softening point of 70 to 90 ° C, 70 to 85 ° C, 75 to 85 ° C, or 78 to 85 ° C, as measured according to JIS K7206 or ISO306.
- the modified polymethylmethacrylate is 0.5 to 3.0 g / 10 minutes, 1.0 to 3.0 g / 10 minutes, 1.0 to 2.5 g / 10 minutes, or 2 to 2.5 g, as measured according to JIS K7210 or ISO 1133. It may have a melting index (MI) of 10 minutes.
- the MVI (melt volume index) of PMMA can be 4 to 6 cm 3/10 minutes when measured at a temperature of 230 ° C. under a load of 3.8 kg.
- the content of the bonding force-improving resin is preferably 5 to 25% by weight, particularly 10 to 20% by weight, based on the second layer.
- At least one of the first and second layers may further comprise pigments or dyes in an amount of 1 to 40% by weight, preferably 5 to 20% by weight, based on the total weight of one layer.
- the pigment may be titanium oxide (TiO 2 ) particles, the TiO 2 particles to control the optical properties such as light transmittance, reflectance, color, as well as the coefficient of friction, surface roughness and fine touch.
- TiO 2 titanium oxide
- TiO 2 is preferably added in a compounding manner, and the particle diameter is preferably 0.1 to 0.7 ⁇ , particularly preferably 0.2 to 0.35 ⁇ .
- the third layer may directly contact the other surface of the first layer when the second layer is formed on one surface of the first layer, and the second layer may be formed on the surface of the second layer when the second layer is formed on both surfaces of the first layer. You can contact it directly.
- the third layer may include a polyolefin resin.
- a polyolefin resin those commonly used in the art may be used.
- the third layer is for easy adhesion with ethylene vinyl acetate (EVA) used as the sealing material.
- EVA ethylene vinyl acetate
- the first layer and the second layer are formed by coextrusion, and the third layer is in-line coated on one surface of the first layer / second layer laminate or the second layer / first layer / second layer laminate formed by coextrusion. It can be formed to an appropriate thickness through.
- the polymer film according to the embodiment is used as a solar panel protective film, it may have a thickness of 25 to 400 ⁇ m, preferably 125 to 300 ⁇ m.
- the first layer and the second layer may have a thickness ratio of 1 to 100: 1.
- the first layer and the second layer may have a thickness ratio of 1 to 50: 1.
- the first layer and the second layer may have a thickness ratio of 1 to 20: 1.
- the resin constituting the first layer may have an intrinsic viscosity (IV) of 0.4 to 0.9 cPs (centipoise), preferably 0.5 to 0.7 cPs, and may be 230 to 280 ° C, preferably 250 to 270 ° C. May be coextruded at a temperature.
- IV intrinsic viscosity
- the resin constituting the second layer may have a MI of 2 to 20 g / 10 minutes at 230 ° C., preferably 5 to 15 g / 10 minutes, and a temperature of 190 to 260 ° C., preferably 220 to 240 ° C.
- the polymer film according to the embodiment may be uniaxially or biaxially stretched, and may be 1.5 to 6 times stretched in at least one direction.
- the polymer film may be about 2 to about 5 times stretched in the longitudinal direction and / or about 2 to about 5 times stretched in the width direction. More specifically, the polymer film may be stretched from about 2.5 times to about 4 times in the longitudinal direction and / or stretched from about 2.5 times to about 4 times in the width direction.
- the polymer film according to the embodiment is formed by coextrusion of a fluorine-based resin (second layer) and a polyester resin (first layer), and by using the fluorine-based resin together with a bonding strength improving resin, The bonding force between the first layer and the second layer is improved.
- the first layer and the second layer may be strongly bonded to each other to form one laminated film.
- the embodiment easily forms the fluorine-based resin layer and the polyester resin layer having the improved peel strength with each other by one co-extrusion to a desired thickness. can do.
- the polymer film according to the embodiment may exhibit a reflectance of 50 to 99% at a wavelength of 550 nm.
- Embodiments include a first layer comprising a polyester resin; And a second layer formed on one surface or both surfaces of the first layer, wherein the first layer and the second layer have a coextruded structure, and the second layer is more than 50 wt% to 90 wt% or less It provides a solar panel protective film comprising a resin and a bonding force improving resin of 5 to 25% by weight, wherein the bonding force between the bonding force improving resin and the polyester resin is greater than the bonding force between the fluorine-based resin and the polyester resin. .
- an embodiment includes a solar panel; And a protective film disposed on at least one surface of the solar cell panel, wherein the protective film comprises: a first layer comprising a polyester resin; And a second layer formed on one surface or both surfaces of the first layer, wherein the first layer and the second layer have a coextruded structure, and the second layer is more than 50 wt% to 90 wt% or less
- a photovoltaic device comprising a resin and a bonding force improving resin of 5 to 25% by weight, wherein the bonding force between the bonding force improving resin and the polyester resin is larger than the bonding force between the fluorine-based resin and the polyester resin.
- FIG. 2 is a view illustrating a cross section of the solar cell apparatus according to an embodiment.
- the solar cell apparatus includes a solar panel 10; And the protective films 20 and 30 disposed on both surfaces of the solar cell panel 10.
- Co-PET chips obtained from 18 mol% of neopentyl glycol, 82 mol% of ethylene glycol and 100 mol% of terephthalic acid were prepared as a first layer resin composition (IV of 0.6 cPs).
- PVDF polyvinylidene fluoride
- PMMA polymethyl methacrylate
- TiO 2 particles Ti-pure, 15% by weight of Dupont Co., Ltd. was mixed to prepare a second layer resin composition (MI at 10 g / 10 min at 230 ° C.).
- the first layer resin composition was melt co-extruded at 260 ° C., the second layer resin composition at 230 ° C., and then cooled on a casting roll at about 20 ° C. to prepare an unstretched sheet.
- the two-layered polymer film of Examples 1 to 15 and the three-layered polymer film of Examples 16 to 18 were strongly bonded to each other between the first and second layers despite being coextruded. Since it does not cause peeling, it can be usefully used as a solar panel protective film (backside protective film).
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Abstract
La présente invention concerne un film polymère, un film de protection de panneau solaire et un appareil de production d'énergie solaire le comprenant. Le film polymère de la présente invention comprend : une première couche comprenant une résine de polyester ; et une seconde couche formée d'un côté ou des deux côtés de la première couche, la première couche et la seconde couche présentant une structure coextrudée, et la seconde couche comprenant de 50 à 90 % en poids de résine fluorée et de 5 à 25 % en poids de résine d'amélioration d'adhérence. Étant donné que l'adhérence entre la résine d'amélioration d'adhérence et la résine de polyester est supérieure à l'adhérence entre la résine fluorée et la résine de polyester, le film polymère présente une résistance au pelage améliorée et peut être facilement préparé par coextrusion, et peut donc être avantageusement utilisé comme film de protection de panneau solaire.
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KR1020150057376A KR101658184B1 (ko) | 2015-04-23 | 2015-04-23 | 폴리머 필름, 태양 전지 패널 보호 필름 및 이를 포함하는 태양광 발전 장치 |
KR10-2015-0057376 | 2015-04-23 |
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PCT/KR2016/004139 WO2016171480A1 (fr) | 2015-04-23 | 2016-04-21 | Film polymère, film de protection de panneau solaire, et appareil de production d'énergie solaire le comprenant |
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KR20100084918A (ko) * | 2009-01-19 | 2010-07-28 | 에스케이씨 주식회사 | 광학용 이접착 폴리에스테르 필름 |
KR20100089038A (ko) * | 2009-02-02 | 2010-08-11 | 주식회사 엘지화학 | 태양전지 백시트 및 이의 제조방법 |
KR20130034944A (ko) * | 2011-09-29 | 2013-04-08 | 주식회사 엘지화학 | 불소계 고분자 코팅층을 포함하는 고신뢰성 다층 필름 및 이의 제조방법 |
KR20130047696A (ko) * | 2010-06-03 | 2013-05-08 | 가부시키가이샤 가네카 | 태양 전지용 백시트 및 태양 전지 모듈 |
JP2015073048A (ja) * | 2013-10-04 | 2015-04-16 | 積水化学工業株式会社 | 太陽電池保護シート、及び、太陽電池モジュール |
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FR2896445B1 (fr) | 2006-01-25 | 2010-08-20 | Arkema | Film flexible a base de polymere fluore |
JP6068236B2 (ja) * | 2013-04-02 | 2017-01-25 | 富士フイルム株式会社 | 積層フィルム、太陽電池モジュール用バックシート及び太陽電池モジュール |
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KR20100084918A (ko) * | 2009-01-19 | 2010-07-28 | 에스케이씨 주식회사 | 광학용 이접착 폴리에스테르 필름 |
KR20100089038A (ko) * | 2009-02-02 | 2010-08-11 | 주식회사 엘지화학 | 태양전지 백시트 및 이의 제조방법 |
KR20130047696A (ko) * | 2010-06-03 | 2013-05-08 | 가부시키가이샤 가네카 | 태양 전지용 백시트 및 태양 전지 모듈 |
KR20130034944A (ko) * | 2011-09-29 | 2013-04-08 | 주식회사 엘지화학 | 불소계 고분자 코팅층을 포함하는 고신뢰성 다층 필름 및 이의 제조방법 |
JP2015073048A (ja) * | 2013-10-04 | 2015-04-16 | 積水化学工業株式会社 | 太陽電池保護シート、及び、太陽電池モジュール |
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