WO2016171253A1 - Adhesive composition and connected structure - Google Patents
Adhesive composition and connected structure Download PDFInfo
- Publication number
- WO2016171253A1 WO2016171253A1 PCT/JP2016/062766 JP2016062766W WO2016171253A1 WO 2016171253 A1 WO2016171253 A1 WO 2016171253A1 JP 2016062766 W JP2016062766 W JP 2016062766W WO 2016171253 A1 WO2016171253 A1 WO 2016171253A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- adhesive composition
- substrate
- connection
- mass
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 239
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 239
- 239000000203 mixture Substances 0.000 title claims abstract description 150
- 150000001875 compounds Chemical class 0.000 claims abstract description 66
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 32
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 32
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 31
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 29
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052796 boron Inorganic materials 0.000 claims abstract description 20
- 239000007870 radical polymerization initiator Substances 0.000 claims abstract description 20
- 125000000962 organic group Chemical group 0.000 claims abstract description 18
- 125000003118 aryl group Chemical group 0.000 claims abstract description 6
- -1 vinyl compound Chemical class 0.000 claims description 94
- 239000002245 particle Substances 0.000 claims description 73
- 239000000758 substrate Substances 0.000 claims description 69
- 239000000463 material Substances 0.000 claims description 32
- 229920002554 vinyl polymer Polymers 0.000 claims description 27
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 21
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 21
- 229920000515 polycarbonate Polymers 0.000 claims description 15
- 239000004417 polycarbonate Substances 0.000 claims description 15
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 14
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 claims description 13
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 13
- 230000009477 glass transition Effects 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 10
- 229920000728 polyester Polymers 0.000 claims description 8
- 239000009719 polyimide resin Substances 0.000 claims description 8
- 229920000178 Acrylic resin Polymers 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- 125000003545 alkoxy group Chemical group 0.000 claims description 5
- 125000003277 amino group Chemical group 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 5
- 229920006287 phenoxy resin Polymers 0.000 claims description 5
- 239000013034 phenoxy resin Substances 0.000 claims description 5
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 4
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 3
- 229920006122 polyamide resin Polymers 0.000 claims description 3
- 229920005749 polyurethane resin Polymers 0.000 claims description 3
- 239000010419 fine particle Substances 0.000 description 40
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 37
- 229920001296 polysiloxane Polymers 0.000 description 34
- 238000003860 storage Methods 0.000 description 34
- 150000003254 radicals Chemical class 0.000 description 33
- 238000002156 mixing Methods 0.000 description 26
- 238000001723 curing Methods 0.000 description 22
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 18
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 17
- 238000012360 testing method Methods 0.000 description 17
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 16
- 229920001971 elastomer Polymers 0.000 description 16
- 238000010438 heat treatment Methods 0.000 description 16
- 238000000034 method Methods 0.000 description 15
- 239000005060 rubber Substances 0.000 description 15
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 14
- 239000010410 layer Substances 0.000 description 12
- 239000002904 solvent Substances 0.000 description 11
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 10
- 150000001412 amines Chemical class 0.000 description 10
- 150000001639 boron compounds Chemical class 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 10
- 238000013329 compounding Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 150000002009 diols Chemical class 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 9
- 229920000459 Nitrile rubber Polymers 0.000 description 8
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 239000011162 core material Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 239000005062 Polybutadiene Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 239000002923 metal particle Substances 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 229920002857 polybutadiene Polymers 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 238000013112 stability test Methods 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 5
- 125000002723 alicyclic group Chemical group 0.000 description 5
- 235000019400 benzoyl peroxide Nutrition 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 5
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 230000007774 longterm Effects 0.000 description 5
- 238000013035 low temperature curing Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 125000004573 morpholin-4-yl group Chemical group N1(CCOCC1)* 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 5
- IJUCBZFJEAVADL-UHFFFAOYSA-N propane-1,3-diamine;triethylborane Chemical compound NCCCN.CCB(CC)CC IJUCBZFJEAVADL-UHFFFAOYSA-N 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000003381 stabilizer Substances 0.000 description 5
- CMHHITPYCHHOGT-UHFFFAOYSA-N tributylborane Chemical compound CCCCB(CCCC)CCCC CMHHITPYCHHOGT-UHFFFAOYSA-N 0.000 description 5
- 239000004342 Benzoyl peroxide Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 239000011258 core-shell material Substances 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 4
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 150000001451 organic peroxides Chemical class 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 235000013772 propylene glycol Nutrition 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- LALRXNPLTWZJIJ-UHFFFAOYSA-N triethylborane Chemical compound CCB(CC)CC LALRXNPLTWZJIJ-UHFFFAOYSA-N 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000012792 core layer Substances 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 150000002334 glycols Chemical class 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- LRIOGIBXOOAGMT-UHFFFAOYSA-N n'-(2-aminoethyl)ethane-1,2-diamine;triethylborane Chemical compound CCB(CC)CC.NCCNCCN LRIOGIBXOOAGMT-UHFFFAOYSA-N 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 150000007530 organic bases Chemical class 0.000 description 3
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229910052697 platinum Chemical group 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229920003048 styrene butadiene rubber Polymers 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- RPNDKNJEUSJAMT-UHFFFAOYSA-N (2,2,3,3-tetramethylpiperidin-1-yl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)ON1CCCC(C)(C)C1(C)C RPNDKNJEUSJAMT-UHFFFAOYSA-N 0.000 description 2
- UNVGBIALRHLALK-UHFFFAOYSA-N 1,5-Hexanediol Chemical compound CC(O)CCCCO UNVGBIALRHLALK-UHFFFAOYSA-N 0.000 description 2
- 125000006219 1-ethylpentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])[H] 0.000 description 2
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- UDXXYUDJOHIIDZ-UHFFFAOYSA-N 2-phosphonooxyethyl prop-2-enoate Chemical compound OP(O)(=O)OCCOC(=O)C=C UDXXYUDJOHIIDZ-UHFFFAOYSA-N 0.000 description 2
- XJMMNTGIMDZPMU-UHFFFAOYSA-N 3-methylglutaric acid Chemical compound OC(=O)CC(C)CC(O)=O XJMMNTGIMDZPMU-UHFFFAOYSA-N 0.000 description 2
- UZFMOKQJFYMBGY-UHFFFAOYSA-N 4-hydroxy-TEMPO Chemical compound CC1(C)CC(O)CC(C)(C)N1[O] UZFMOKQJFYMBGY-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 229920002121 Hydroxyl-terminated polybutadiene Polymers 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 2
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 2
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 229920000800 acrylic rubber Polymers 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000005370 alkoxysilyl group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 125000004093 cyano group Chemical group *C#N 0.000 description 2
- 125000006165 cyclic alkyl group Chemical group 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- GHLKSLMMWAKNBM-UHFFFAOYSA-N dodecane-1,12-diol Chemical compound OCCCCCCCCCCCCO GHLKSLMMWAKNBM-UHFFFAOYSA-N 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 2
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- IVDFJHOHABJVEH-UHFFFAOYSA-N pinacol Chemical compound CC(C)(O)C(C)(C)O IVDFJHOHABJVEH-UHFFFAOYSA-N 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920001195 polyisoprene Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 230000003685 thermal hair damage Effects 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- JXCAHDJDIAQCJO-UHFFFAOYSA-N (1-tert-butylperoxy-2-ethylhexyl) hydrogen carbonate Chemical compound CCCCC(CC)C(OC(O)=O)OOC(C)(C)C JXCAHDJDIAQCJO-UHFFFAOYSA-N 0.000 description 1
- UPPUJFRSINZXTE-UHFFFAOYSA-N (2,2,3,3,4-pentamethylpiperidin-1-yl) 2-methylprop-2-enoate Chemical compound CC1CCN(OC(=O)C(C)=C)C(C)(C)C1(C)C UPPUJFRSINZXTE-UHFFFAOYSA-N 0.000 description 1
- HKTVJXTZAPGBRT-UHFFFAOYSA-N (2,2,3,3,4-pentamethylpiperidin-1-yl) prop-2-enoate Chemical compound CC1CCN(OC(=O)C=C)C(C)(C)C1(C)C HKTVJXTZAPGBRT-UHFFFAOYSA-N 0.000 description 1
- KIFAKLJJKSLDBP-UHFFFAOYSA-N (2,2,3,3-tetramethylpiperidin-1-yl) prop-2-enoate Chemical compound CC1(C)CCCN(OC(=O)C=C)C1(C)C KIFAKLJJKSLDBP-UHFFFAOYSA-N 0.000 description 1
- YUXBDADAZLPMKT-UHFFFAOYSA-N (2,5-dioxopyrrol-1-yl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)ON1C(=O)C=CC1=O YUXBDADAZLPMKT-UHFFFAOYSA-N 0.000 description 1
- FJFNGDQUNWPFLA-UHFFFAOYSA-N (2,5-dioxopyrrol-1-yl) prop-2-enoate Chemical compound C=CC(=O)ON1C(=O)C=CC1=O FJFNGDQUNWPFLA-UHFFFAOYSA-N 0.000 description 1
- ACGJEMXWUYWELU-UHFFFAOYSA-N (2,5-dioxopyrrolidin-1-yl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)ON1C(=O)CCC1=O ACGJEMXWUYWELU-UHFFFAOYSA-N 0.000 description 1
- YXMISKNUHHOXFT-UHFFFAOYSA-N (2,5-dioxopyrrolidin-1-yl) prop-2-enoate Chemical compound C=CC(=O)ON1C(=O)CCC1=O YXMISKNUHHOXFT-UHFFFAOYSA-N 0.000 description 1
- HCXVPNKIBYLBIT-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 3,5,5-trimethylhexaneperoxoate Chemical compound CC(C)(C)CC(C)CC(=O)OOOC(C)(C)C HCXVPNKIBYLBIT-UHFFFAOYSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- NLBJAOHLJABDAU-UHFFFAOYSA-N (3-methylbenzoyl) 3-methylbenzenecarboperoxoate Chemical compound CC1=CC=CC(C(=O)OOC(=O)C=2C=C(C)C=CC=2)=C1 NLBJAOHLJABDAU-UHFFFAOYSA-N 0.000 description 1
- MVELOSYXCOVILT-UHFFFAOYSA-N (4-hydroxy-2-methylpentan-2-yl) 7,7-dimethyloctaneperoxoate Chemical compound CC(O)CC(C)(C)OOC(=O)CCCCCC(C)(C)C MVELOSYXCOVILT-UHFFFAOYSA-N 0.000 description 1
- AGKBXKFWMQLFGZ-UHFFFAOYSA-N (4-methylbenzoyl) 4-methylbenzenecarboperoxoate Chemical compound C1=CC(C)=CC=C1C(=O)OOC(=O)C1=CC=C(C)C=C1 AGKBXKFWMQLFGZ-UHFFFAOYSA-N 0.000 description 1
- NOBYOEQUFMGXBP-UHFFFAOYSA-N (4-tert-butylcyclohexyl) (4-tert-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(C(C)(C)C)CCC1OC(=O)OOC(=O)OC1CCC(C(C)(C)C)CC1 NOBYOEQUFMGXBP-UHFFFAOYSA-N 0.000 description 1
- RIPYNJLMMFGZSX-UHFFFAOYSA-N (5-benzoylperoxy-2,5-dimethylhexan-2-yl) benzenecarboperoxoate Chemical compound C=1C=CC=CC=1C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C1=CC=CC=C1 RIPYNJLMMFGZSX-UHFFFAOYSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- BLKRGXCGFRXRNQ-SNAWJCMRSA-N (z)-3-carbonoperoxoyl-4,4-dimethylpent-2-enoic acid Chemical compound OC(=O)/C=C(C(C)(C)C)\C(=O)OO BLKRGXCGFRXRNQ-SNAWJCMRSA-N 0.000 description 1
- 0 *C(C(Oc1c(cccc2)c2cc2c1cccc2)=O)=C Chemical compound *C(C(Oc1c(cccc2)c2cc2c1cccc2)=O)=C 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- AQSVMUCTNYYCRW-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)-3,4,5-trimethylbenzene Chemical class CC1=CC(CN=C=O)=C(CN=C=O)C(C)=C1C AQSVMUCTNYYCRW-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- 229940015975 1,2-hexanediol Drugs 0.000 description 1
- 229940031723 1,2-octanediol Drugs 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical group O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- AHBNSOZREBSAMG-UHFFFAOYSA-N 1,5-diisocyanato-2-methylpentane Chemical compound O=C=NCC(C)CCCN=C=O AHBNSOZREBSAMG-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- LJDGDRYFCIHDPX-UHFFFAOYSA-N 1-(2-methoxyphenyl)pyrrole-2,5-dione Chemical compound COC1=CC=CC=C1N1C(=O)C=CC1=O LJDGDRYFCIHDPX-UHFFFAOYSA-N 0.000 description 1
- QYOJZFBQEAZNEW-UHFFFAOYSA-N 1-(2-methylphenyl)pyrrole-2,5-dione Chemical compound CC1=CC=CC=C1N1C(=O)C=CC1=O QYOJZFBQEAZNEW-UHFFFAOYSA-N 0.000 description 1
- UNCUTNPWBZKJHD-UHFFFAOYSA-N 1-(3-methoxyphenyl)pyrrole-2,5-dione Chemical compound COC1=CC=CC(N2C(C=CC2=O)=O)=C1 UNCUTNPWBZKJHD-UHFFFAOYSA-N 0.000 description 1
- PRZFFHNZHXGTRC-UHFFFAOYSA-N 1-(3-methylphenyl)pyrrole-2,5-dione Chemical compound CC1=CC=CC(N2C(C=CC2=O)=O)=C1 PRZFFHNZHXGTRC-UHFFFAOYSA-N 0.000 description 1
- XAHCEMQKWSQGLQ-UHFFFAOYSA-N 1-(4-methoxyphenyl)pyrrole-2,5-dione Chemical compound C1=CC(OC)=CC=C1N1C(=O)C=CC1=O XAHCEMQKWSQGLQ-UHFFFAOYSA-N 0.000 description 1
- KCFXNGDHQPMIAQ-UHFFFAOYSA-N 1-(4-methylphenyl)pyrrole-2,5-dione Chemical compound C1=CC(C)=CC=C1N1C(=O)C=CC1=O KCFXNGDHQPMIAQ-UHFFFAOYSA-N 0.000 description 1
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- WVUYYXUATWMVIT-UHFFFAOYSA-N 1-bromo-4-ethoxybenzene Chemical compound CCOC1=CC=C(Br)C=C1 WVUYYXUATWMVIT-UHFFFAOYSA-N 0.000 description 1
- OZFIGURLAJSLIR-UHFFFAOYSA-N 1-ethenyl-2h-pyridine Chemical compound C=CN1CC=CC=C1 OZFIGURLAJSLIR-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
- KIKBJYQCJJXCBZ-UHFFFAOYSA-N 1-octylpyrrole-2,5-dione Chemical compound CCCCCCCCN1C(=O)C=CC1=O KIKBJYQCJJXCBZ-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- JCTXKRPTIMZBJT-UHFFFAOYSA-N 2,2,4-trimethylpentane-1,3-diol Chemical compound CC(C)C(O)C(C)(C)CO JCTXKRPTIMZBJT-UHFFFAOYSA-N 0.000 description 1
- ZNMDSQBHOLGTPA-UHFFFAOYSA-N 2,2,5,5-tetramethylhexanedioic acid Chemical compound OC(=O)C(C)(C)CCC(C)(C)C(O)=O ZNMDSQBHOLGTPA-UHFFFAOYSA-N 0.000 description 1
- BTUDGPVTCYNYLK-UHFFFAOYSA-N 2,2-dimethylglutaric acid Chemical compound OC(=O)C(C)(C)CCC(O)=O BTUDGPVTCYNYLK-UHFFFAOYSA-N 0.000 description 1
- GOHPTLYPQCTZSE-UHFFFAOYSA-N 2,2-dimethylsuccinic acid Chemical compound OC(=O)C(C)(C)CC(O)=O GOHPTLYPQCTZSE-UHFFFAOYSA-N 0.000 description 1
- KLZYRCVPDWTZLH-UHFFFAOYSA-N 2,3-dimethylsuccinic acid Chemical compound OC(=O)C(C)C(C)C(O)=O KLZYRCVPDWTZLH-UHFFFAOYSA-N 0.000 description 1
- CRJIYMRJTJWVLU-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-yl 3-(5,5-dimethylhexyl)dioxirane-3-carboxylate Chemical compound CC(C)(C)CCCCC1(C(=O)OC(C)(C)CC(C)(C)C)OO1 CRJIYMRJTJWVLU-UHFFFAOYSA-N 0.000 description 1
- DPGYCJUCJYUHTM-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-yloxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)CC(C)(C)C DPGYCJUCJYUHTM-UHFFFAOYSA-N 0.000 description 1
- DBTGFWMBFZBBEF-UHFFFAOYSA-N 2,4-dimethylpentane-2,4-diol Chemical compound CC(C)(O)CC(C)(C)O DBTGFWMBFZBBEF-UHFFFAOYSA-N 0.000 description 1
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 1
- JVNHNXXTIIQWBZ-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2,3-dimethylbutanenitrile Chemical compound CC(C)C(C)(C#N)N=NC(C)(C)C#N JVNHNXXTIIQWBZ-UHFFFAOYSA-N 0.000 description 1
- PJABOTZVAHGVAF-UHFFFAOYSA-N 2-(2-cyclohexylpropan-2-yl)-7,7-dimethyloctaneperoxoic acid Chemical compound CC(C)(C)CCCCC(C(=O)OO)C(C)(C)C1CCCCC1 PJABOTZVAHGVAF-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- IEMBFTKNPXENSE-UHFFFAOYSA-N 2-(2-methylpentan-2-ylperoxy)propan-2-yl hydrogen carbonate Chemical compound CCCC(C)(C)OOC(C)(C)OC(O)=O IEMBFTKNPXENSE-UHFFFAOYSA-N 0.000 description 1
- RWLALWYNXFYRGW-UHFFFAOYSA-N 2-Ethyl-1,3-hexanediol Chemical compound CCCC(O)C(CC)CO RWLALWYNXFYRGW-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 description 1
- MUBQKSBEWRYKES-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO MUBQKSBEWRYKES-UHFFFAOYSA-N 0.000 description 1
- HEQOJEGTZCTHCF-UHFFFAOYSA-N 2-amino-1-phenylethanone Chemical class NCC(=O)C1=CC=CC=C1 HEQOJEGTZCTHCF-UHFFFAOYSA-N 0.000 description 1
- MCRZWYDXIGCFKO-UHFFFAOYSA-N 2-butylpropanedioic acid Chemical compound CCCCC(C(O)=O)C(O)=O MCRZWYDXIGCFKO-UHFFFAOYSA-N 0.000 description 1
- FDYJJKHDNNVUDR-UHFFFAOYSA-N 2-ethyl-2-methylbutanedioic acid Chemical compound CCC(C)(C(O)=O)CC(O)=O FDYJJKHDNNVUDR-UHFFFAOYSA-N 0.000 description 1
- ZACVGCNKGYYQHA-UHFFFAOYSA-N 2-ethylhexoxycarbonyloxy 2-ethylhexyl carbonate Chemical compound CCCCC(CC)COC(=O)OOC(=O)OCC(CC)CCCC ZACVGCNKGYYQHA-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- IJSVVICYGLOZHA-UHFFFAOYSA-N 2-methyl-n-phenylprop-2-enamide Chemical compound CC(=C)C(=O)NC1=CC=CC=C1 IJSVVICYGLOZHA-UHFFFAOYSA-N 0.000 description 1
- IFXDUNDBQDXPQZ-UHFFFAOYSA-N 2-methylbutan-2-yl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)CC IFXDUNDBQDXPQZ-UHFFFAOYSA-N 0.000 description 1
- ZIDNXYVJSYJXPE-UHFFFAOYSA-N 2-methylbutan-2-yl 7,7-dimethyloctaneperoxoate Chemical compound CCC(C)(C)OOC(=O)CCCCCC(C)(C)C ZIDNXYVJSYJXPE-UHFFFAOYSA-N 0.000 description 1
- RFSCGDQQLKVJEJ-UHFFFAOYSA-N 2-methylbutan-2-yl benzenecarboperoxoate Chemical compound CCC(C)(C)OOC(=O)C1=CC=CC=C1 RFSCGDQQLKVJEJ-UHFFFAOYSA-N 0.000 description 1
- YMMLZUQDXYPNOG-UHFFFAOYSA-N 2-methylpentan-2-yl 7,7-dimethyloctaneperoxoate Chemical compound CCCC(C)(C)OOC(=O)CCCCCC(C)(C)C YMMLZUQDXYPNOG-UHFFFAOYSA-N 0.000 description 1
- WXDJDZIIPSOZAH-UHFFFAOYSA-N 2-methylpentan-2-yl benzenecarboperoxoate Chemical compound CCCC(C)(C)OOC(=O)C1=CC=CC=C1 WXDJDZIIPSOZAH-UHFFFAOYSA-N 0.000 description 1
- AUZRCMMVHXRSGT-UHFFFAOYSA-N 2-methylpropane-1-sulfonic acid;prop-2-enamide Chemical compound NC(=O)C=C.CC(C)CS(O)(=O)=O AUZRCMMVHXRSGT-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- DUHQIGLHYXLKAE-UHFFFAOYSA-N 3,3-dimethylglutaric acid Chemical compound OC(=O)CC(C)(C)CC(O)=O DUHQIGLHYXLKAE-UHFFFAOYSA-N 0.000 description 1
- VKERWIBXKLNXCY-UHFFFAOYSA-N 3,5,5-trimethyl-2-(2-methylbutan-2-ylperoxy)hexanoic acid Chemical compound CCC(C)(C)OOC(C(O)=O)C(C)CC(C)(C)C VKERWIBXKLNXCY-UHFFFAOYSA-N 0.000 description 1
- MOSSLXZUUKTULI-UHFFFAOYSA-N 3-[3-(2,5-dioxopyrrol-3-yl)-4-methylphenyl]pyrrole-2,5-dione Chemical compound CC1=CC=C(C=2C(NC(=O)C=2)=O)C=C1C1=CC(=O)NC1=O MOSSLXZUUKTULI-UHFFFAOYSA-N 0.000 description 1
- SOYBEXQHNURCGE-UHFFFAOYSA-N 3-ethoxypropan-1-amine Chemical compound CCOCCCN SOYBEXQHNURCGE-UHFFFAOYSA-N 0.000 description 1
- SJKKMGRHBRUPIG-UHFFFAOYSA-N 3-methoxypropan-1-amine;tributylborane Chemical compound COCCCN.CCCCB(CCCC)CCCC SJKKMGRHBRUPIG-UHFFFAOYSA-N 0.000 description 1
- KQQUVPYTQZDZAE-UHFFFAOYSA-N 3-methoxypropan-1-amine;triethylborane Chemical compound COCCCN.CCB(CC)CC KQQUVPYTQZDZAE-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- HBWITNNIJDLPLS-UHFFFAOYSA-N 4-[1-[4-(dimethylamino)phenyl]ethenyl]-n,n-dimethylaniline Chemical compound C1=CC(N(C)C)=CC=C1C(=C)C1=CC=C(N(C)C)C=C1 HBWITNNIJDLPLS-UHFFFAOYSA-N 0.000 description 1
- NFWPZNNZUCPLAX-UHFFFAOYSA-N 4-methoxy-3-methylaniline Chemical compound COC1=CC=C(N)C=C1C NFWPZNNZUCPLAX-UHFFFAOYSA-N 0.000 description 1
- XESZUVZBAMCAEJ-UHFFFAOYSA-N 4-tert-butylcatechol Chemical compound CC(C)(C)C1=CC=C(O)C(O)=C1 XESZUVZBAMCAEJ-UHFFFAOYSA-N 0.000 description 1
- GAYWCADKXYCKCG-UHFFFAOYSA-N 5-pyridin-3-yl-1,2-dihydro-1,2,4-triazole-3-thione Chemical compound N1NC(=S)N=C1C1=CC=CN=C1 GAYWCADKXYCKCG-UHFFFAOYSA-N 0.000 description 1
- BSKLKCJVOHJWHU-UHFFFAOYSA-N 6-hydroxyhexyl hydrogen carbonate Chemical compound OCCCCCCOC(O)=O BSKLKCJVOHJWHU-UHFFFAOYSA-N 0.000 description 1
- GBJVVSCPOBPEIT-UHFFFAOYSA-N AZT-1152 Chemical compound N=1C=NC2=CC(OCCCN(CC)CCOP(O)(O)=O)=CC=C2C=1NC(=NN1)C=C1CC(=O)NC1=CC=CC(F)=C1 GBJVVSCPOBPEIT-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 241000286819 Malo Species 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- ALBJGICXDBJZGK-UHFFFAOYSA-N [1-[(1-acetyloxy-1-phenylethyl)diazenyl]-1-phenylethyl] acetate Chemical compound C=1C=CC=CC=1C(C)(OC(=O)C)N=NC(C)(OC(C)=O)C1=CC=CC=C1 ALBJGICXDBJZGK-UHFFFAOYSA-N 0.000 description 1
- JYSSGQITKNFRQE-UHFFFAOYSA-N [3-(4-anilinoanilino)-2-hydroxypropyl] 2-methylprop-2-enoate Chemical compound C1=CC(NCC(O)COC(=O)C(=C)C)=CC=C1NC1=CC=CC=C1 JYSSGQITKNFRQE-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- KYIKRXIYLAGAKQ-UHFFFAOYSA-N abcn Chemical compound C1CCCCC1(C#N)N=NC1(C#N)CCCCC1 KYIKRXIYLAGAKQ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- YLFIGGHWWPSIEG-UHFFFAOYSA-N aminoxyl Chemical class [O]N YLFIGGHWWPSIEG-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 125000002490 anilino group Chemical group [H]N(*)C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 125000000440 benzylamino group Chemical group [H]N(*)C([H])([H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- SYEOWUNSTUDKGM-UHFFFAOYSA-N beta-methyladipic acid Natural products OC(=O)CC(C)CCC(O)=O SYEOWUNSTUDKGM-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- DLDJFQGPPSQZKI-UHFFFAOYSA-N but-2-yne-1,4-diol Chemical compound OCC#CCO DLDJFQGPPSQZKI-UHFFFAOYSA-N 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- RKLSGKOUKYOIRM-UHFFFAOYSA-N butylboron Chemical compound [B]CCCC RKLSGKOUKYOIRM-UHFFFAOYSA-N 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 125000001951 carbamoylamino group Chemical group C(N)(=O)N* 0.000 description 1
- 125000005587 carbonate group Chemical group 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- YSRSBDQINUMTIF-UHFFFAOYSA-N decane-1,2-diol Chemical compound CCCCCCCCC(O)CO YSRSBDQINUMTIF-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 125000005265 dialkylamine group Chemical group 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- OREAFAJWWJHCOT-UHFFFAOYSA-N dimethylmalonic acid Chemical compound OC(=O)C(C)(C)C(O)=O OREAFAJWWJHCOT-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- CIKJANOSDPPCAU-UHFFFAOYSA-N ditert-butyl cyclohexane-1,4-dicarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1CCC(C(=O)OOC(C)(C)C)CC1 CIKJANOSDPPCAU-UHFFFAOYSA-N 0.000 description 1
- GTZOYNFRVVHLDZ-UHFFFAOYSA-N dodecane-1,1-diol Chemical compound CCCCCCCCCCCC(O)O GTZOYNFRVVHLDZ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- BNKAXGCRDYRABM-UHFFFAOYSA-N ethenyl dihydrogen phosphate Chemical compound OP(O)(=O)OC=C BNKAXGCRDYRABM-UHFFFAOYSA-N 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- UKFXDFUAPNAMPJ-UHFFFAOYSA-N ethylmalonic acid Chemical compound CCC(C(O)=O)C(O)=O UKFXDFUAPNAMPJ-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- SXCBDZAEHILGLM-UHFFFAOYSA-N heptane-1,7-diol Chemical compound OCCCCCCCO SXCBDZAEHILGLM-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- FHKSXSQHXQEMOK-UHFFFAOYSA-N hexane-1,2-diol Chemical compound CCCCC(O)CO FHKSXSQHXQEMOK-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- OHMBHFSEKCCCBW-UHFFFAOYSA-N hexane-2,5-diol Chemical compound CC(O)CCC(C)O OHMBHFSEKCCCBW-UHFFFAOYSA-N 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000009396 hybridization Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 150000004658 ketimines Chemical group 0.000 description 1
- 125000000040 m-tolyl group Chemical group [H]C1=C([H])C(*)=C([H])C(=C1[H])C([H])([H])[H] 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- GPKUICFDWYEPTK-UHFFFAOYSA-N methoxycyclohexatriene Chemical group COC1=CC=C=C[CH]1 GPKUICFDWYEPTK-UHFFFAOYSA-N 0.000 description 1
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- 125000000250 methylamino group Chemical group [H]N(*)C([H])([H])[H] 0.000 description 1
- ZJBHFQKJEBGFNL-UHFFFAOYSA-N methylsilanetriol Chemical compound C[Si](O)(O)O ZJBHFQKJEBGFNL-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 1
- OVHHHVAVHBHXAK-UHFFFAOYSA-N n,n-diethylprop-2-enamide Chemical compound CCN(CC)C(=O)C=C OVHHHVAVHBHXAK-UHFFFAOYSA-N 0.000 description 1
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 description 1
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 1
- RQAKESSLMFZVMC-UHFFFAOYSA-N n-ethenylacetamide Chemical compound CC(=O)NC=C RQAKESSLMFZVMC-UHFFFAOYSA-N 0.000 description 1
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical compound C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- CXOYJPWMGYDJNW-UHFFFAOYSA-N naphthalen-2-yl 2-methylprop-2-enoate Chemical compound C1=CC=CC2=CC(OC(=O)C(=C)C)=CC=C21 CXOYJPWMGYDJNW-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- FSAJWMJJORKPKS-UHFFFAOYSA-N octadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C=C FSAJWMJJORKPKS-UHFFFAOYSA-N 0.000 description 1
- AEIJTFQOBWATKX-UHFFFAOYSA-N octane-1,2-diol Chemical compound CCCCCCC(O)CO AEIJTFQOBWATKX-UHFFFAOYSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 125000005474 octanoate group Chemical group 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- WCVRQHFDJLLWFE-UHFFFAOYSA-N pentane-1,2-diol Chemical compound CCCC(O)CO WCVRQHFDJLLWFE-UHFFFAOYSA-N 0.000 description 1
- GLOBUAZSRIOKLN-UHFFFAOYSA-N pentane-1,4-diol Chemical compound CC(O)CCCO GLOBUAZSRIOKLN-UHFFFAOYSA-N 0.000 description 1
- GTCCGKPBSJZVRZ-UHFFFAOYSA-N pentane-2,4-diol Chemical compound CC(O)CC(C)O GTCCGKPBSJZVRZ-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229940104181 polyflex Drugs 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- AQHHHDLHHXJYJD-UHFFFAOYSA-N propranolol Chemical compound C1=CC=C2C(OCC(O)CNC(C)C)=CC=CC2=C1 AQHHHDLHHXJYJD-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 150000004059 quinone derivatives Chemical class 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- VNJISVYSDHJQFR-UHFFFAOYSA-N tert-butyl 4,4-dimethylpentaneperoxoate Chemical compound CC(C)(C)CCC(=O)OOC(C)(C)C VNJISVYSDHJQFR-UHFFFAOYSA-N 0.000 description 1
- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000005270 trialkylamine group Chemical group 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to an adhesive composition and a connection structure.
- the adhesive is a connection between a liquid crystal display element and TCP (or COF), a connection between FPC and TCP (or COF), a connection between TCP (or COF) and a printed wiring board, and a connection between FPC and a printed wiring board. Etc. are used.
- the adhesive is also used when a semiconductor element is mounted on a substrate.
- adherends used for bonding include printed wiring boards, organic substrates such as polyimide resin, polyethylene terephthalate (PET), polycarbonate (PC), and polyethylene naphthalate (PEN), as well as copper and aluminum.
- SiN silicon nitride
- SiO 2 dioxide dioxide
- the pitch between elements and the pitch between wirings are becoming narrower.
- a semiconductor element, a liquid crystal display element, or a touch panel using an organic base material having low heat resistance such as PET, PC, or PEN is used.
- the heating temperature at the time of curing is high, and when the curing speed is slow, not only the desired connection portion but also the peripheral member is excessively heated and the peripheral member is damaged. Tend to be a factor. Therefore, adhesion by low temperature curing is required for the adhesive composition.
- thermosetting resin using an epoxy resin having high adhesiveness and high reliability has been used (for example, see Patent Document 1 below).
- an epoxy resin, a curing agent that is reactive with the epoxy resin (such as a phenol resin), a thermal latent catalyst that promotes a reaction between the epoxy resin and the curing agent, and the like are generally used.
- a thermal latent catalyst is a substance that does not react at a storage temperature such as room temperature and exhibits high reactivity upon heating, and is an important factor that determines the curing temperature and the curing rate.
- Various compounds have been used from the viewpoints of storage stability at room temperature and curing rate during heating.
- the desired adhesion was obtained under curing conditions of curing at a temperature of 170 to 250 ° C. for 1 to 3 hours.
- a thermal latent catalyst having a low activation energy, but it is very difficult to combine storage stability.
- a radical curable adhesive using a radical polymerizable compound such as an acrylate derivative or a methacrylate derivative in combination with a peroxide as a radical polymerization initiator has attracted attention. Radical curing can be cured in a short time because radicals that are reactive species are rich in reactivity (see, for example, Patent Document 2 below).
- a method in which benzoyl peroxide (BPO), an amine compound, an organic boron compound, or the like is used in combination as a radical polymerization initiator has been proposed (for example, see Patent Document 3 below).
- radical curable adhesive In order to cure the above-mentioned radical curable adhesive at a low temperature, it is necessary to use a radical polymerization initiator. However, in the conventional radical curable adhesive, it is very important to combine low temperature curable property and storage stability. It is difficult. For example, when the above-described benzoyl peroxide (BPO), amine compound, organoboron compound or the like is used as a radical polymerization initiator of a radical polymerizable compound such as an acrylate derivative or a methacrylate derivative, room temperature (25 ° C., below (Similarly), since the curing reaction proceeds, the storage stability may decrease.
- BPO benzoyl peroxide
- amine compound, organoboron compound or the like is used as a radical polymerization initiator of a radical polymerizable compound such as an acrylate derivative or a methacrylate derivative
- an object of the present invention is to provide an adhesive composition having excellent low-temperature curability and storage stability. Moreover, an object of this invention is to provide the connection structure using such an adhesive composition.
- the present inventors can obtain excellent low-temperature curability and storage stability by using a specific complex containing boron as a constituent component of the adhesive composition. As a result, the present invention has been completed.
- the adhesive composition according to the present invention contains (a) a thermoplastic resin, (b) a radical polymerizable compound, (c) a radical polymerization initiator, and (d) a complex containing boron.
- the boron-containing complex is a compound represented by the following general formula (A).
- R 1 , R 2 and R 3 each independently represent a hydrogen atom, an alkyl group having 1 to 18 carbon atoms or an aryl group
- R 4 , R 5 and R 6 each independently represent A hydrogen atom, an alkyl group having 1 to 18 carbon atoms, an organic group represented by the following general formula (a1), or an organic group represented by the following general formula (a2) is shown.
- R 7a represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms
- R 7b represents a hydrogen atom, an amino group, an alkoxy group or an alkyl group having 1 to 10 carbon atoms.
- S and t each independently represent an integer of 1 to 10.
- R 8 represents an alkyl group having 1 to 10 carbon atoms.
- U represents an integer of 1 to 10.
- the adhesive composition contains (d) a complex containing boron, (c) decomposition of the radical polymerization initiator at a low temperature (for example, 80 to 120 ° C.) can be promoted.
- the low temperature curability of the adhesive composition is excellent.
- the (d) boron-containing complex is a compound represented by the general formula (A), so that the storage stability of the adhesive composition (for example, around room temperature (for example, ⁇ 20 to The storage stability at 25 ° C.) is excellent, and even when the adhesive composition is stored for a long period of time, excellent adhesive strength and connection resistance (for example, adhesive strength in a connection structure of a circuit member or a solar cell module) Connection resistance).
- the adhesive composition according to the present invention is excellent in low-temperature curability and storage stability.
- adhesive strength and connection resistance can be obtained regardless of whether the adhesive composition is stored for a long period of time.
- stable performance adheresive strength and connection resistance
- high temperature and high humidity test high temperature and high humidity test
- the (b) radical polymerizable compound may contain a vinyl compound having a phosphate group and a radical polymerizable compound other than the vinyl compound. In this case, adhesion by low-temperature curing is facilitated, and the adhesion strength with the substrate having the connection terminals can be further improved.
- the thermoplastic resin (a) is composed of a phenoxy resin, polyurethane resin, polyester urethane resin, butyral resin, (meth) acrylic resin, polyimide resin and polyamide resin, and a copolymer having a structural unit derived from vinyl acetate. It may contain at least one selected from the group. In this case, heat resistance and adhesiveness are further improved, and these excellent characteristics can be easily maintained even after a long-term reliability test (high temperature and high humidity test).
- the adhesive composition according to the present invention may further contain (e) conductive particles.
- conductive particles since favorable electroconductivity or anisotropic conductivity can be provided to the adhesive composition, it can be more suitably used for bonding between circuit members having connection terminals or for a solar cell module. Become. Moreover, the connection resistance of the connection structure obtained by electrical connection through the adhesive composition can be further sufficiently reduced.
- the adhesive composition is useful for connecting a member having a connection terminal.
- the adhesive composition according to the present invention electrically connects the first connection terminal disposed on the main surface of the first substrate and the second connection terminal disposed on the main surface of the second substrate. It may be used to connect to the solar cell, and may be used to electrically connect the connection terminal of the solar battery cell having the connection terminal disposed on the main surface of the substrate and the wiring member.
- a connection structure includes a first circuit member having a first connection terminal disposed on a main surface of the first substrate and the first substrate, a second substrate, and the second substrate.
- a second circuit member having a second connection terminal disposed on the main surface of the second substrate, and a connection member disposed between the first circuit member and the second circuit member,
- a connection member contains the hardened
- connection resistance and adhesive strength in the connection structure can be improved.
- connection structure in the connection structure according to one aspect of the present invention, at least one of the first substrate and the second substrate may be composed of a base material including a thermoplastic resin having a glass transition temperature of 200 ° C. or lower.
- the adhesive strength in the connection structure using the adhesive composition can be further improved.
- connection structure in the connection structure according to one aspect of the present invention, at least one of the first substrate and the second substrate is composed of a base material including at least one selected from the group consisting of polyethylene terephthalate, polycarbonate, and polyethylene naphthalate. It may be.
- the adhesive composition according to the present invention is used. Since low temperature curing is possible by using, thermal damage to the first circuit member or the second circuit member can be reduced. Further, the wettability between the substrate composed of the specific material and the adhesive composition can be improved, and the adhesive strength can be further improved. As a result, excellent connection reliability can be obtained in the case where a substrate made of the specific material is used.
- the first substrate is composed of a base material including at least one selected from the group consisting of polyethylene terephthalate, polycarbonate, and polyethylene naphthalate
- the second substrate is Further, it may be configured by a base material including at least one selected from the group consisting of polyimide resin and polyethylene terephthalate.
- a connection structure according to another aspect of the present invention is disposed between a substrate, a solar battery cell having a connection terminal disposed on a main surface of the substrate, a wiring member, and the solar battery cell and the wiring member.
- the connection member contains a cured product of the adhesive composition, and the connection terminal and the wiring member are electrically connected.
- connection resistance and adhesive strength in the connection structure can be improved.
- an adhesive composition excellent in low-temperature curability and storage stability can be provided.
- Such an adhesive composition can improve storage stability compared with the case where the alkyl boron compound of the said patent document 3 is used.
- the adhesive composition according to the present invention is excellent in the balance between low-temperature curability and storage stability. Since the adhesive composition according to the present invention is excellent in storage stability, excellent adhesive strength and connection resistance can be obtained even when the adhesive composition is stored for a long period of time. Furthermore, in the adhesive composition according to the present invention, excellent adhesive strength and connection resistance can be obtained regardless of whether the adhesive composition is stored for a long period of time.
- the adhesive composition according to the present invention stable performance (adhesive strength and connection) after a long-term reliability test (high temperature and high humidity test) regardless of whether or not the adhesive composition is stored for a long period of time. Resistance) can be maintained.
- the present invention can provide a connection structure using such an adhesive composition.
- connection structure which concerns on 1st Embodiment of this invention. It is a schematic cross section which shows the manufacturing method of the connection structure shown in FIG. It is a schematic cross section which shows the connection structure which concerns on 2nd Embodiment of this invention. It is a schematic cross section which shows the manufacturing method of the connection structure shown in FIG. It is a schematic cross section which shows the connection structure which concerns on 3rd Embodiment of this invention.
- (meth) acrylic acid means acrylic acid and methacrylic acid corresponding thereto
- (meth) acrylate means acrylate and methacrylate corresponding thereto
- (( “Meth) acrylic resin” means an acrylic resin and a corresponding methacrylic resin
- ((meth) acryloyl group” means an acryloyl group and a corresponding methacryloyl group
- (meth) acryloyloxy group Means an acryloyloxy group and a corresponding methacryloyloxy group.
- weight average molecular weight means the value measured by the gel permeation chromatograph (GPC) using the calibration curve by a standard polystyrene according to the conditions shown below.
- GPC gel permeation chromatograph
- Equipment GPC-8020 manufactured by Tosoh Corporation Detector: RI-8020 manufactured by Tosoh Corporation Column: Gelpack GL-A-160-S + GL-A150 manufactured by Hitachi Chemical Co., Ltd. Sample concentration: 120mg / 3ml
- Solvent Tetrahydrofuran Injection volume: 60 ⁇ l Pressure: 30 kgf / cm 2 Flow rate: 1.00 ml / min
- the adhesive composition according to the present embodiment contains (a) a thermoplastic resin, (b) a radical polymerizable compound, (c) a radical polymerization initiator, and (d) a complex containing boron. ing.
- thermoplastic resin is a resin that has a property of being able to repeat this process in a liquid state with a high viscosity by heating, being deformed freely by external force, and being hardened while maintaining its shape when cooled and removed.
- the thermoplastic resin may be a resin (polymer) having a reactive functional group having the above properties.
- the glass transition temperature (Tg) of the thermoplastic resin is preferably ⁇ 30 ° C. or higher, more preferably ⁇ 25 ° C. or higher, and further preferably ⁇ 20 ° C. or higher.
- the glass transition temperature of the thermoplastic resin is preferably 190 ° C or lower, more preferably 170 ° C or lower, still more preferably 150 ° C or lower, particularly preferably 130 ° C or lower, and extremely preferably 110 ° C or lower.
- the thermoplastic resin includes, for example, phenoxy resin, polyurethane resin, polyester urethane resin, butyral resin (for example, polyvinyl butyral resin), (meth) acrylic resin, polyimide resin and polyamide resin, and structural units derived from vinyl acetate. It can contain at least one selected from the group consisting of a copolymer (vinyl acetate copolymer such as ethylene-vinyl acetate copolymer). These can be used individually by 1 type or in mixture of 2 or more types. Furthermore, these (a) thermoplastic resins may contain a siloxane bond or a fluorine substituent. These are preferably in a state in which the resins to be mixed are completely compatible with each other, or in a state in which microphase separation occurs and becomes cloudy.
- the weight average molecular weight of the thermoplastic resin is preferably 5000 or more, more preferably 7000 or more, further preferably 10,000 or more, particularly preferably 20000 or more, and extremely preferably 25000 or more.
- the weight average molecular weight of the thermoplastic resin is 5000 or more, good film formability tends to be obtained.
- the weight average molecular weight of the thermoplastic resin is preferably 150,000 or less, more preferably 100,000 or less, still more preferably 80000 or less, particularly preferably 70000 or less, and extremely preferably 65000 or less.
- the weight average molecular weight of the thermoplastic resin is 150,000 or less, good compatibility with other components tends to be easily obtained.
- the blending amount of the thermoplastic resin (a) in the adhesive composition is preferably 5% by mass or more, preferably 15% by mass or more based on the total mass of the adhesive component (component excluding conductive particles in the adhesive composition). Is more preferably 25% by mass or more, and particularly preferably 35% by mass or more.
- the blending amount of the thermoplastic resin is preferably 80% by mass or less, more preferably 70% by mass or less, based on the total mass of the adhesive component (component excluding conductive particles in the adhesive composition). The mass% is more preferable, and 50 mass% or less is particularly preferable.
- the blending amount of the thermoplastic resin is 80% by mass or less, good fluidity of the adhesive composition tends to be obtained.
- a radically polymerizable compound refers to a compound that generates radical polymerization by the action of a radical polymerization initiator.
- the radically polymerizable compound may be a compound that itself generates radicals by applying activation energy such as light or heat.
- a compound having a functional group (vinyl group, (meth) acryloyl group, allyl group, maleimide group, etc.) that is polymerized by an active radical can be suitably used.
- radical polymerizable compound examples include oligomers such as epoxy (meth) acrylate oligomers, urethane (meth) acrylate oligomers, polyether (meth) acrylate oligomers, and polyester (meth) acrylate oligomers; trimethylolpropane Poly (ethylene glycol di (meth) acrylate); Polyalkylene glycol di (meth) acrylate; Dicyclopentenyl (meth) acrylate; Dicyclopentenyloxyethyl (meth) acrylate; Neopentyl glycol di (meth) acrylate Dipentaerythritol hexa (meth) acrylate; isocyanuric acid modified bifunctional (meth) acrylate; isocyanuric acid modified trifunctional (meth) acrylate; bisphenoxy Tanol fluorene (meth) acrylate; epoxy (meth) acrylate with bisphenol fluorenediglycidyl
- R 9 and R 10 each independently represent a hydrogen atom or a methyl group, and a and b each independently represent an integer of 1 to 8. ]
- R 11 and R 12 each independently represent a hydrogen atom or a methyl group, and c and d each independently represents an integer of 0 to 8. ]
- the radical polymerizable compound may be a compound that exhibits a solid state without fluidity, such as waxy, crystalline, glassy, powdery, when left alone at 30 ° C. It can be used without any particular limitation.
- radical polymerizable compounds include N, N′-methylenebisacrylamide, diacetone acrylamide (also known as diacetone acrylamide), N-methylol acrylamide, N-phenyl methacrylamide, Acrylamide-2-methylpropanesulfonic acid, tris (2-acryloyloxyethyl) isocyanurate, N-phenylmaleimide, N- (o-methylphenyl) maleimide, N- (m-methylphenyl) maleimide, N- (p -Methylphenyl) maleimide, N- (o-methoxyphenyl) maleimide, N- (m-methoxyphenyl) maleimide, N- (p-methoxyphenyl) maleimide, N- (p-me
- R 13 and R 14 each independently represent a hydrogen atom or a methyl group, and f represents an integer of 15 to 30. ]
- R 15 and R 16 each independently represents a hydrogen atom or a methyl group, and g represents an integer of 15 to 30. ]
- R 17 represents a hydrogen atom or a methyl group.
- R 18 represents a hydrogen atom or a methyl group, and h represents an integer of 1 to 10.
- R 19 represents a hydrogen atom or an organic group represented by the following formula (i) or (ii), and i represents an integer of 1 to 10. ]
- R 20 represents a hydrogen atom or an organic group represented by the following formula (iii) or (iv), and j represents an integer of 1 to 10. ]
- R 21 represents a hydrogen atom or a methyl group.
- R 22 represents a hydrogen atom or a methyl group.
- urethane (meth) acrylate can be used as the (b) radical polymerizable compound.
- Urethane (meth) acrylate may be used independently and may be used together with (b) radically polymerizable compounds other than urethane (meth) acrylate.
- urethane (meth) acrylate alone or in combination with (b) a radical polymerizable compound other than urethane (meth) acrylate, flexibility is improved and adhesive strength can be further improved.
- Urethane (meth) acrylate is not particularly limited, but urethane (meth) acrylate represented by the following general formula (N) is preferable.
- urethane (meth) acrylate represented by the following general formula (N) includes aliphatic diisocyanate or alicyclic diisocyanate, aliphatic ester diol, alicyclic ester diol, and aliphatic carbonate diol. And a condensation reaction with at least one selected from the group consisting of alicyclic carbonate-based diols.
- R 23 and R 24 each independently represent a hydrogen atom or a methyl group
- R 25 represents an ethylene group or a propylene group
- R 26 represents a saturated aliphatic group or a saturated alicyclic group.
- R 27 represents a saturated aliphatic group or saturated alicyclic group having an ester group, or a saturated aliphatic group or saturated alicyclic group having a carbonate group
- k represents an integer of 1 to 40.
- R 25 and R 26 may be the same or different.
- the aliphatic diisocyanate or alicyclic diisocyanate constituting the urethane (meth) acrylate is tetramethylene diisocyanate, hexamethylene diisocyanate, lysine diisocyanate, 2-methylpentane-1,5-diisocyanate, 3-methylpentane-1, 5-diisocyanate, 2,2,4-trimethylhexamethylene-1,6-diisocyanate, 2,4,4-trimethylhexamethylene-1,6-diisocyanate, isophorone diisocyanate, cyclohexyl diisocyanate, hydrogenated xylylene diisocyanate, hydrogenated It may be selected from diphenylmethane diisocyanate, hydrogenated trimethylxylylene diisocyanate, and the like.
- the aliphatic ester diol or alicyclic ester diol constituting the urethane (meth) acrylate is ethylene glycol, propylene glycol (also known as 1,2-propanediol), 1,3-propanediol, 1, 3-butanediol, 1,4-butanediol, neopentyl glycol, 1,2-pentanediol, 1,4-pentanediol, 1,5-pentanediol, 2,4-pentanediol, 2-methyl-2, 4-pentanediol, 2,4-dimethyl-2,4-pentanediol, 2,2,4-trimethyl-1,3-pentanediol, 1,2-hexanediol, 1,5-hexanediol, 1,6 -Hexanediol, 2,5-hexanediol, 2-ethyl-1,3
- adipic acid 3-methyladipic acid, 2,2,5,5-tetramethyladipic acid, maleic acid, fumaric acid, succinic acid, 2,2-dimethylsuccinic acid, 2-ethyl-2- Methyl succinic acid, 2,3-dimethyl succinic acid, oxalic acid, malonic acid, methyl malo Acid, ethylmalonic acid, butylmalonic acid, dimethylmalonic acid, glutaric acid, 2-methylglutaric acid, 3-methylglutaric acid, 2,2-dimethylglutaric acid, 3,3-dimethylglutaric acid, 2,4-dimethyl Polyester diols obtained by dehydration condensation of dibasic acids such as glutaric acid, pimelic acid, suberic acid, azelaic acid and sebacic acid or their corresponding acid anhydrides; ring-opening polymerization of cyclic ester compounds such as ⁇ -caprolactone It may be selected from
- the aliphatic carbonate-based diol or alicyclic carbonate-based diol constituting the urethane (meth) acrylate may be selected from polycarbonate diols obtained by reaction of at least one kind of the above-described glycols with phosgene.
- the polycarbonate-type diol obtained by reaction of the said glycols and phosgene can be used individually by 1 type or in mixture of 2 or more types.
- the urethane (meth) acrylate can be preferably used by adjusting the weight average molecular weight freely within the range of 5000 or more and less than 30000 from the viewpoint of further improving the adhesive strength. If the weight average molecular weight of the urethane (meth) acrylate is within the above range, both flexibility and cohesion can be obtained sufficiently, and the adhesive strength with organic substrates such as PET, PC, PEN and the like is further improved. In addition, further excellent connection reliability can be obtained.
- the weight average molecular weight of the urethane (meth) acrylate is more preferably 8000 or more and less than 25,000, further preferably 10,000 or more and less than 25,000, and particularly preferably 10,000 or more and less than 20,000.
- the weight average molecular weight is 5000 or more, sufficient flexibility tends to be obtained, and when the weight average molecular weight is less than 30000, the fluidity of the adhesive composition is suppressed from decreasing. There is a tendency to.
- the blending amount of the urethane (meth) acrylate is preferably 5% by mass or more, more preferably 10% by mass or more based on the total mass of the adhesive component (component excluding conductive particles in the adhesive composition). 15% by mass or more is more preferable, 25% by mass or more is particularly preferable, and 35% by mass or more is very preferable. When the blending amount is 5% by mass or more, sufficient heat resistance tends to be easily obtained after curing.
- the blending amount of the urethane (meth) acrylate is preferably 95% by mass or less, more preferably 80% by mass or less, based on the total mass of the adhesive component (component excluding conductive particles in the adhesive composition).
- 70% by mass or less is more preferable, 60% by mass or less is particularly preferable, and 50% by mass or less is very preferable.
- the blending amount is 95% by mass or less, when the adhesive composition is used as a film adhesive, good film formability tends to be obtained.
- the radical polymerizable compound may contain at least one kind of a phosphate group-containing vinyl compound (a vinyl compound having a phosphate group) and a radical polymerizable compound other than the phosphate group-containing vinyl compound.
- the radical polymerizable compound includes an N-vinyl compound selected from the group consisting of an N-vinyl compound and an N, N-dialkylvinyl compound, and a radical polymerizable compound other than the N-vinyl compound, respectively. One or more kinds may be included.
- the phosphoric acid group-containing vinyl compound in combination, the adhesiveness of the adhesive composition to the substrate having connection terminals can be further improved.
- the combined use of the N-vinyl compound can improve the crosslinking rate (crosslinking rate) of the adhesive composition.
- the phosphate group-containing vinyl compound is not particularly limited as long as it is a compound having a phosphate group and a vinyl group, but compounds represented by the following general formulas (O) to (Q) are preferable.
- R 28 represents a (meth) acryloyloxy group
- R 29 represents a hydrogen atom or a methyl group
- l and m each independently represents an integer of 1 to 8.
- R 28 s , R 29 s , l s, and m s may be the same or different.
- R 30 represents a (meth) acryloyloxy group, and n, o and p each independently represents an integer of 1 to 8.
- R 30 s , n s, o s, and p s may be the same or different.
- R 31 represents a (meth) acryloyloxy group
- R 32 represents a hydrogen atom or a methyl group
- q and r each independently represents an integer of 1 to 8.
- the phosphoric acid group-containing vinyl compound examples include acid phosphooxyethyl (meth) acrylate, acid phosphooxypropyl (meth) acrylate, acid phosphooxypolyoxyethylene glycol mono (meth) acrylate, and acid phosphooxypolyoxy.
- N-vinyl compound examples include N-vinylimidazole, N-vinylpyridine, N-vinylpyrrolidone, N-vinylformamide, N-vinylcaprolactam, 4,4′-vinylidenebis (N, N— Dimethylaniline), N-vinylacetamide, N, N-dimethylacrylamide, N, N-diethylacrylamide and the like.
- Each of the compounding amounts of the above-mentioned phosphate group-containing vinyl compound and N-vinyl compound is independent of the compounding amount of the radical polymerizable compound other than the phosphate group-containing vinyl compound and N-vinyl compound.
- the total mass of the component excluding the conductive particles in the adhesive composition
- 0.2% by mass or more is preferable, 0.3% by mass or more is more preferable, 0.5% by mass or more is more preferable, and 1% 0.0 mass% or more is particularly preferable, and 1.5 mass% or more is extremely preferable.
- the said compounding quantity is 0.2 mass% or more.
- Each of the compounding amounts of the above-mentioned phosphate group-containing vinyl compound and N-vinyl compound is preferably 15% by mass or less based on the total mass of the adhesive component (component excluding conductive particles in the adhesive composition). 10 mass% or less is more preferable, 5 mass% or less is still more preferable, and 3 mass% or less is especially preferable. When the blending amount is 15% by mass or less, the physical properties after curing of the adhesive composition are unlikely to decrease, and reliability tends to be ensured.
- the blending amount of the radical polymerizable compound (b) excluding the above-mentioned phosphate group-containing vinyl compound and N-vinyl compound is the total mass of the adhesive component (component excluding conductive particles in the adhesive composition). Is preferably 5% by mass or more, more preferably 10% by mass or more, still more preferably 15% by mass or more, particularly preferably 25% by mass or more, and extremely preferably 35% by mass or more. When the blending amount is 5% by mass or more, sufficient heat resistance tends to be easily obtained after curing.
- the blending amount of the radical polymerizable compound (b) excluding the above-mentioned phosphate group-containing vinyl compound and N-vinyl compound is based on the total mass of the adhesive component (component excluding conductive particles in the adhesive composition). 95 mass% or less is preferable, 80 mass% or less is more preferable, 70 mass% or less is further more preferable, 60 mass% or less is especially preferable, and 50 mass% or less is very preferable. When the blending amount is 95% by mass or less, when the adhesive composition is used as a film adhesive, good film formability tends to be obtained.
- (C) radical polymerization initiator compounds that generate radicals by external energy application, such as conventionally known organic peroxides and azo compounds, can be used.
- the radical polymerization initiator is preferably an organic peroxide having a 1 minute half-life temperature of 90 to 175 ° C. and a weight average molecular weight of 180 to 1000 from the viewpoint of excellent stability, reactivity and compatibility. .
- the 1-minute half-life temperature is in this range, the storage stability is further improved, the radical polymerizability is sufficiently high, and the composition can be cured in a short time.
- radical polymerization initiator examples include 1,1,3,3-tetramethylbutylperoxyneodecanoate, di (4-t-butylcyclohexyl) peroxydicarbonate, di (2 -Ethylhexyl) peroxydicarbonate, cumylperoxyneodecanoate, dilauroyl peroxide, 1-cyclohexyl-1-methylethylperoxyneodecanoate, t-hexylperoxyneodecanoate, t-butylper Oxyneodecanoate, t-butylperoxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-di (2-ethyl) Hexanoylperoxy) hexane, t-hexylperoxy-2-ethylhexanoate, t-
- the (c) radical polymerization initiator a compound that generates radicals upon irradiation with light of 150 to 750 nm can be used.
- Such compounds have high sensitivity to light irradiation, and are described in, for example, Photoinitiation, Photopolymerization, and Photocuring, J. MoI. -P. And ⁇ -aminoacetophenone derivatives and phosphine oxide derivatives described in Fouassier, Hanser Publishers (1995, p17-p35). These compounds may be used alone or in combination of two or more, or may be used in combination with the above organic peroxides or azo compounds.
- the amount of the radical polymerization initiator (c) is preferably 0.5% by mass or more, preferably 1% by mass or more based on the total mass of the adhesive component (component excluding conductive particles in the adhesive composition). More preferably, 2% by mass or more is further preferable, 3% by mass or more is particularly preferable, and 5% by mass or more is extremely preferable. When the blending amount is 0.5% by mass or more, the adhesive composition tends to be sufficiently cured.
- the amount of the radical polymerization initiator (c) is preferably 40% by mass or less, more preferably 30% by mass or less, based on the total mass of the adhesive component (component excluding conductive particles in the adhesive composition). 20 mass% or less is more preferable, and 10 mass% or less is especially preferable. There exists a tendency for storage stability to fall that the said compounding quantity is 40 mass% or less.
- component (d) is a compound represented by the following general formula (A).
- the component (d) contains a boron compound and ammonia or an amine compound as a basic substance for the boron compound.
- R 1 , R 2 and R 3 each independently represent a hydrogen atom, an alkyl group having 1 to 18 carbon atoms or an aryl group
- R 4 , R 5 and R 6 each independently represent A hydrogen atom, an alkyl group having 1 to 18 carbon atoms, an organic group represented by the following general formula (a1), or an organic group represented by the following general formula (a2) is shown.
- R 7a represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms
- R 7b represents a hydrogen atom, an amino group, an alkoxy group or an alkyl group having 1 to 10 carbon atoms.
- S and t each independently represent an integer of 1 to 10.
- R 8 represents an alkyl group having 1 to 10 carbon atoms.
- U represents an integer of 1 to 10.
- Examples of the boron compound contained in the component (d) include alkyldiarylborane, dialkylarylborane, trialkylborane, triarylborane, borohydride and the like.
- the boron compound is preferably trialkylborane from the viewpoint of further excellent low-temperature curability.
- the boron compound may be a compound having a plurality of structures of these compounds in the molecule, or a compound having the structure of the above compound in the main chain and / or side chain of the polymer.
- alkyl group bonded to the boron atom in the boron compound a linear, branched or cyclic alkyl group can be used.
- alkyl group having 1 to 18 carbon atoms include methyl group, trifluoromethyl group, ethyl group, n-butyl group, hexyl group, octyl group, 2-ethylhexyl group, decyl group, dodecyl group, octadecyl group, Propyl, isopropyl, isobutyl, sec-butyl, tert-butyl, pentyl, 1-ethylpentyl, cyclopentyl, cyclohexyl, isopentyl, heptyl, nonyl, undecyl, tert-octyl Etc.
- an ethyl group, an isopropyl group, and an n-butyl group are preferable from the viewpoint of further excellent low-temperature curability.
- the number of carbon atoms of the alkyl group is preferably from 1 to 12, and more preferably from 1 to 5, from the viewpoint of further excellent low temperature curability.
- Each of the alkyl groups bonded to the boron atom in the boron compound may be the same as or different from each other.
- aryl group bonded to the boron atom in the boron compound include a phenyl group, p-tolyl group, m-tolyl group, mesityl group, xylyl group, p-tert-butylphenyl group (4-tert-butylphenyl group). ), P-methoxyphenyl group, biphenyl group, naphthyl group, 4-methylnaphthyl group and the like.
- a phenyl group, a p-tert-butylphenyl group, and a 4-methylnaphthyl group are preferable, and a phenyl group is more preferable from the viewpoint of further excellent low-temperature curability and storage stability.
- Each of the aryl groups bonded to the boron atom in the boron compound may be the same as or different from each other.
- amine compound used as the basic substance of component (d) alkylamine, dialkylamine, trialkylamine, an amine having an organic group represented by general formula (a1), and represented by general formula (a2)
- examples include amines having an organic group.
- an amine having an organic group represented by the general formula (a1) and an amine having an organic group represented by the general formula (a2) are preferable from the viewpoint of further excellent low-temperature curability and storage stability.
- the amine compound may be a compound having a plurality of structures of these compounds in the molecule, or a compound having the structure of the above compound in the main chain and / or side chain of the polymer.
- an amine having an organic group represented by the general formula (a1) is preferable from the viewpoint of further excellent low-temperature curability and storage stability, and the organic group represented by the general formula (a1) is preferable.
- an amine having two or more amino groups more preferably an amine having two or more organic groups represented by formula (a1) in which R 7a and R 7b are hydrogen atoms.
- the solubility with respect to a thermoplastic resin, a radically polymerizable compound, and a solvent improves, and low temperature curability can further be improved.
- alkyl group bonded to the nitrogen atom in the amine compound a linear, branched or cyclic alkyl group can be used.
- alkyl group having 1 to 18 carbon atoms include methyl group, trifluoromethyl group, ethyl group, n-butyl group, hexyl group, octyl group, 2-ethylhexyl group, decyl group, dodecyl group, octadecyl group, Propyl, isopropyl, isobutyl, sec-butyl, tert-butyl, pentyl, 1-ethylpentyl, cyclopentyl, cyclohexyl, isopentyl, heptyl, nonyl, undecyl, tert-octyl Etc.
- n-butyl group is preferable from the viewpoint of further excellent low-temperature curability and storage stability.
- the number of carbon atoms of the alkyl group is preferably 1 to 12 and more preferably 1 to 6 from the viewpoint of further excellent low temperature curability and storage stability.
- R 7a is preferably a hydrogen atom and an alkyl group having 1 to 5 carbon atoms.
- R 7b is preferably a hydrogen atom and an alkyl group having 1 to 5 carbon atoms.
- the number of carbon atoms of the alkoxy group for R 7b is preferably 1 to 3.
- s is preferably an integer of 1 to 5.
- s may be an integer of 1 to 3, or an integer of 1 to 2.
- t is preferably an integer of 1 to 3, more preferably an integer of 1 to 2.
- R 8 is preferably an alkyl group having 1 to 5 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and still more preferably an alkyl group having 1 to 2 carbon atoms.
- u is preferably an integer of 1 to 5, more preferably an integer of 1 to 3.
- Specific examples of the compound represented by the general formula (A) include triethylborane 1,3-diaminopropane, triethylborane N- (2-aminoethyl) ethane-, from the viewpoint of further excellent low temperature curability and storage stability.
- 1,2-diamine also known as triethylborane N- (2-aminoethyl) -1,2-ethanediamine
- triethylborane 3-methoxy-1-aminepropane also known as triethylborane 3-methoxypropylamine
- tri N-butylborane 3-methoxy-1-aminepropane also known as tri-n-butylborane 3-methoxypropylamine
- tri-n-butylborane 3-ethoxy-1-aminepropane also known as tri-n-butylborane
- At least one selected from the group consisting of (3-ethoxypropylamine) is preferred.
- component (d) a combination of a trialkylborane and an amine having an organic group represented by the general formula (a1) or an organic group represented by the general formula (a2) is preferable.
- the component (d) is a complex having such a configuration, the low-temperature curability improvement and the storage stability improvement of the adhesive composition can be obtained in a better balance.
- a complex obtained by a conventional synthesis method described in JP-B-7-72264 can be used.
- a trialkylborane-amine complex can be obtained by adding a tetrahydrofuran (THF) solution containing a trialkylborane to an amine solution.
- THF tetrahydrofuran
- the component (d) may be used alone or in combination of two or more.
- the amount of component (d) is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, based on the total mass of the adhesive component (component excluding conductive particles in the adhesive composition). 1.0 mass% or more is more preferable, and 1.5 mass% or more is particularly preferable.
- the blending amount of component (d) is preferably 20% by mass or less, more preferably 15% by mass or less, and more preferably 10% by mass based on the total mass of the adhesive component (component excluding conductive particles in the adhesive composition). The following is more preferable, and 5% by mass or less is particularly preferable.
- D When the compounding quantity of a component is 20 mass% or less, there exists a tendency for the storage stability of an adhesive composition to become difficult to fall.
- the conductive particles may be particles having conductivity on the whole or on the surface, but when used for connecting members having connection terminals, the average particle diameter is smaller than the distance between the connection terminals. Is preferred.
- the conductive particles include metal particles composed of a metal such as Au, Ag, Ni, Cu, Pd or solder, and particles composed of carbon or the like. Further, (e) the conductive particles may be particles in which non-conductive glass, ceramic, plastic, or the like is used as a core, and the core is coated with the metal, metal particles, or carbon. Particles obtained by coating the above metal, metal particles or carbon on the core of plastic, and hot-melt metal particles are deformable by heating and pressurization, so that the contact area with the electrode increases at the time of connection and the reliability is improved. Therefore, it is preferable as (e) conductive particles. (E) The electroconductive particle may be a particle obtained by coating silver on a metal particle made of copper, for example. In addition, as the conductive particles (e), a metal powder having a shape in which a large number of fine metal particles are connected in a chain shape as described in JP-A-2005-116291 can be used.
- a method such as hybridization By using the particles, short-circuiting due to contact between the particles when the blending amount of the conductive particles is increased is suppressed, and insulation between the electrode circuits is improved. Therefore, these particles may be used alone or mixed with (e) conductive particles as appropriate.
- the average particle diameter of the conductive particles is preferably 1 to 18 ⁇ m, for example, from the viewpoint of excellent dispersibility and conductivity.
- the adhesive composition can be suitably used as an anisotropic conductive adhesive.
- the average particle diameter of the conductive particles can be measured using a laser diffraction particle size distribution measuring apparatus (for example, a laser diffraction SALD-2100 manufactured by Shimadzu Corporation).
- the blending amount of the conductive particles is not particularly limited, but is preferably 0.1% by volume or more based on the total volume of the adhesive component (a component excluding the conductive particles in the adhesive composition). 0.2 volume% or more is more preferable, 0.5 volume% or more is further more preferable, and 1 volume% or more is especially preferable. There exists a tendency for electroconductivity to become low that the said compounding quantity is 0.1 volume% or more is suppressed.
- the blending amount of the conductive particles is preferably 30% by volume or less, more preferably 10% by volume or less, based on the total volume of the adhesive component (component excluding the conductive particles in the adhesive composition). A volume% or less is more preferable.
- volume% is determined based on the volume of each component before curing at 23 ° C., but the volume of each component can be converted from weight to volume using specific gravity. Also, do not dissolve or swell the component in a graduated cylinder, etc., put the component into a container containing a suitable solvent (water, alcohol, etc.) that wets the component well, and increase the volume of the component. It can also be determined as a volume.
- the adhesive composition according to the present embodiment can contain a stabilizer for controlling the curing rate and for further improving the storage stability.
- a stabilizer known compounds can be used without particular limitation, but quinone derivatives such as benzoquinone and hydroquinone; phenol derivatives such as 4-methoxyphenol and 4-t-butylcatechol; Preferred are aminoxyl derivatives such as 1,6,6-tetramethylpiperidine-1-oxyl and 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxyl; and hindered amine derivatives such as tetramethylpiperidyl methacrylate.
- a stabilizer can be used individually by 1 type or in mixture of 2 or more types.
- the blending amount of the stabilizer is preferably 0.005% by mass or more, more preferably 0.01% by mass or more, based on the total mass of the adhesive component (component excluding conductive particles in the adhesive composition). 0.02 mass% or more is still more preferable. When the blending amount is 0.005% by mass or more, the curing rate tends to be controlled and the storage stability tends to be improved.
- the blending amount of the stabilizer is preferably 10% by mass or less, more preferably 8% by mass or less, and more preferably 5% by mass or less based on the total mass of the adhesive component (component excluding conductive particles in the adhesive composition). Is more preferable. There exists a tendency for compatibility with another component to fall that the said compounding quantity is 10 mass% or less.
- the adhesive composition according to the present embodiment may appropriately contain an adhesion aid such as a coupling agent represented by an alkoxysilane derivative and a silazane derivative, an adhesion improver, and a leveling agent.
- an adhesion aid such as a coupling agent represented by an alkoxysilane derivative and a silazane derivative, an adhesion improver, and a leveling agent.
- a coupling agent specifically, a compound represented by the following general formula (R) is preferable.
- R general formula
- a coupling agent can be used individually by 1 type or in mixture of 2 or more types.
- R 33 , R 34 and R 35 are each independently a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or an alkoxycarbonyl group having 1 to 5 carbon atoms.
- R 36 is a (meth) acryloyl group, vinyl group, isocyanate group, imidazole group, mercapto group, amino group, methylamino group, dimethylamino group, benzylamino group, phenylamino group, cyclohexylamino group , Morpholino group, piperazino group, ureido group or glycidyl group, v represents an integer of 1 to 10. ]
- the adhesive composition according to the present embodiment may contain a rubber component for the purpose of stress relaxation and adhesion improvement.
- the rubber component refers to a component that exhibits rubber elasticity (JIS K6200) as it is or a component that exhibits rubber elasticity by reaction.
- the rubber component may be solid or liquid at room temperature (25 ° C.), but is preferably liquid from the viewpoint of improving fluidity.
- a compound having a polybutadiene skeleton is preferable.
- the rubber component may have a cyano group, a carboxyl group, a hydroxyl group, a (meth) acryloyl group, or a morpholino group.
- a rubber component containing a cyano group or a carboxyl group, which is a highly polar group, in the side chain or terminal is preferable.
- a rubber component containing a cyano group or a carboxyl group, which is a highly polar group, in the side chain or terminal is preferable.
- thermoplasticity even if it has a polybutadiene skeleton, if it exhibits thermoplasticity, it is classified as (a) a thermoplastic resin, and if it exhibits radical polymerizability, it is classified as (b) a radically polymerizable compound.
- the rubber component include polyisoprene, polybutadiene, carboxyl-terminated polybutadiene, hydroxyl-terminated polybutadiene, 1,2-polybutadiene, carboxyl-terminated 1,2-polybutadiene, hydroxyl-terminated 1,2-polybutadiene, acrylic rubber, Styrene-butadiene rubber, hydroxyl-terminated styrene-butadiene rubber, acrylonitrile-butadiene rubber, carboxyl group, hydroxyl group, (meth) acryloyl group or morpholino group-terminated acrylonitrile-butadiene rubber, carboxylated nitrile rubber, hydroxyl-terminated poly (oxy) Propylene), alkoxysilyl group-terminated poly (oxypropylene), poly (oxytetramethylene) glycol, polyolefin glycol and the like.
- the rubber component having a high polar group and being liquid at room temperature specifically includes a liquid acrylonitrile-butadiene rubber, a liquid having a carboxyl group, a hydroxyl group, a (meth) acryloyl group or a morpholino group at a polymer terminal.
- a liquid acrylonitrile-butadiene rubber a liquid having a carboxyl group, a hydroxyl group, a (meth) acryloyl group or a morpholino group at a polymer terminal.
- examples include acrylonitrile-butadiene rubber and liquid carboxylated nitrile rubber.
- the blending amount of acrylonitrile having a polar group is preferably 10 to 60% by mass.
- Rubber components can be used singly or in combination of two or more.
- the adhesive composition according to the present embodiment may contain organic fine particles for the purpose of stress relaxation and adhesion improvement.
- the average particle size of the organic fine particles is preferably 0.05 to 1.0 ⁇ m, for example.
- organic fine particles consist of the above-mentioned rubber component it classify
- organic fine particles include polyisoprene, polybutadiene, carboxyl-terminated polybutadiene, hydroxyl-terminated polybutadiene, 1,2-polybutadiene, carboxyl-terminated 1,2-polybutadiene, acrylic rubber, styrene-butadiene rubber, and acrylonitrile-butadiene.
- the adhesive composition used for the connection structure described below in which the substrate is composed of a base material containing at least one selected from the group consisting of polyethylene terephthalate, polycarbonate and polyethylene naphthalate, contains silicone fine particles. It may be.
- the adhesive composition used for the connection structure in which the substrate is composed of a base material containing at least one selected from the group consisting of polyethylene terephthalate, polycarbonate, and polyethylene naphthalate contains silicone fine particles, thereby causing internal stress. Therefore, the adhesive strength to polyethylene terephthalate, polycarbonate and polyethylene naphthalate can be further improved, and the adhesive strength to a member having a connection terminal can be further improved. In addition, more stable performance can be maintained even after a long-term reliability test.
- silicone fine particles fine particles of polyorganosilsesquioxane resin having rubber elasticity are known, and spherical or amorphous silicone fine particles are used. Moreover, it is preferable that a silicone fine particle has a weight average molecular weight of 1 million or more from a viewpoint of a dispersibility and relaxation of an internal stress.
- the silicone fine particles preferably have a three-dimensional crosslinked structure. Such silicone fine particles have high dispersibility with respect to the resin, and are further excellent in stress relaxation after curing.
- the silicone fine particles having a weight average molecular weight of 1 million or more and / or the silicone fine particles having a three-dimensional cross-linked structure are low in solubility in polymers (thermoplastic resins, etc.), monomers or solvents, the above-mentioned effects Can be obtained more remarkably.
- “having a three-dimensional crosslinked structure” indicates that the polymer chain has a three-dimensional network structure.
- the glass transition temperature of the silicone fine particles is preferably from ⁇ 130 ° C. to ⁇ 20 ° C., more preferably from ⁇ 120 ° C. to ⁇ 40 ° C. Such silicone fine particles can sufficiently relieve the internal stress of the adhesive composition as a circuit connecting material.
- the silicone fine particles having such a structure include an organopolysiloxane having at least two vinyl groups, an organohydropolyene polysiloxane having at least two hydrogen atoms bonded to silicon atoms, and a platinum catalyst. Fine particles obtained by reaction with (for example, JP-A-62-2579939); organopolysiloxanes having alkenyl groups, organopolysiloxanes having hydrosilyl groups, and platinum-based catalysts (for example, Japanese Patent Laid-Open No.
- silicone fine particles obtained using diorganosiloxane, monoorganosilsesquioxane, triorganosiloxane and a platinum-based catalyst for example, Japanese Patent Laid-Open No. 62-270660; methylsilane Triol Beauty / or dropped silicone fine particles obtained by performing the polycondensation reaction (e.g., Patent No. 3,970,453 discloses) in an alkaline aqueous solution of a water / alcohol solution of the partial condensate and the like can be used.
- silicone fine particles to which an epoxy compound is added or copolymerized for example, JP-A-3-167228, silicone to which an acrylate compound is added or copolymerized are added. Fine particles can also be used.
- silicone fine particles having a core-shell structure In order to further improve the dispersibility, it is preferable to use silicone fine particles having a core-shell structure.
- the core-shell type structure has a surface layer (shell layer) having a glass transition temperature higher than the glass transition temperature of the core material (core layer) on the surface of the core material, and is grafted outside the core material (core layer).
- core layer There is a structure having a layer (shell layer), and silicone fine particles having different compositions in the core layer and the shell layer can be used.
- core-shell type silicone fine particles for example, Japanese Patent No.
- WO2009 Core-shell type silicone fine particles as described in JP / A / 051067 can also be used.
- silicone fine particles having a functional group such as a hydroxyl group, an epoxy group, a ketimine group, a carboxyl group, or a mercapto group at the molecular terminal or the inner molecular chain can be used.
- Such silicone fine particles are preferable because dispersibility in a film-forming component and a radical polymerizable substance is improved.
- the average particle size of the silicone fine particles is preferably 0.05 to 25 ⁇ m, more preferably 0.1 to 20 ⁇ m.
- the average particle size is 0.05 ⁇ m or more, the fluidity of the adhesive composition tends to be suppressed from decreasing due to an increase in surface area. Further, when the average particle size is 25 ⁇ m or less, the internal stress tends to be sufficiently relaxed.
- the compounding amount of the silicone fine particles is preferably 3% by mass or more, more preferably 5% by mass or more based on the total mass of the adhesive component (component excluding conductive particles in the adhesive composition).
- the blending amount of the silicone fine particles is preferably 40% by mass or less, more preferably 30% by mass or less, based on the total mass of the adhesive component (component excluding conductive particles in the adhesive composition).
- the blending amount of the silicone fine particles is 40% by mass or less, the flexibility (elastic modulus, elongation) of the adhesive composition is suppressed from decreasing, and the adhesive strength tends to be difficult to decrease.
- These silicone fine particles can be used singly or in combination of two or more.
- the adhesive composition according to this embodiment can be used in the form of a paste when the adhesive composition is liquid at room temperature.
- the adhesive composition When the adhesive composition is solid at room temperature, it may be heated and used, or may be made into a paste using a solvent.
- a solvent that can be used a solvent that is not reactive with the adhesive composition and the additive and has sufficient solubility is preferable, and a solvent having a boiling point of 50 to 150 ° C. at normal pressure is preferable.
- the boiling point is 50 ° C. or higher, volatilization is less likely when left at room temperature, and use in an open system tends to be facilitated.
- the boiling point when the boiling point is 150 ° C. or lower, it becomes easy to volatilize the solvent, and the reliability after bonding tends to be difficult to decrease.
- the adhesive composition according to this embodiment can be formed into a film and used as a film adhesive.
- the film adhesive which concerns on this embodiment contains the said adhesive composition. If necessary, after applying a solution obtained by adding a solvent or the like to the adhesive composition on a peelable substrate such as a fluororesin film, a polyethylene terephthalate film or a release paper, or on a substrate such as a nonwoven fabric. After impregnating the above solution and placing it on a peelable substrate, the solvent and the like can be removed and used as a film. If it is used in the form of a film, it is more convenient in terms of handleability.
- an adhesive sheet provided with a base material and a film adhesive is provided. In the adhesive sheet, the film adhesive is disposed on the substrate, and forms, for example, an adhesive layer.
- the adhesive composition according to the present embodiment can be bonded by using heating and pressurization together.
- the heating temperature is preferably 100 to 200 ° C.
- the pressure is preferably in a range that does not damage the adherend, and generally 0.1 to 10 MPa. These heating and pressurization are preferably performed in the range of 0.5 to 120 seconds, and can be bonded by heating at 120 to 190 ° C., 3 MPa, and 10 seconds.
- the adhesive composition according to the present embodiment electrically connects the first connection terminal disposed on the main surface of the first substrate and the second connection terminal disposed on the main surface of the second substrate. Can be used to connect to each other. Moreover, the adhesive composition according to the present embodiment can be used to electrically connect the connection terminal of the solar battery cell having the connection terminal disposed on the main surface of the substrate and the wiring member. .
- the adhesive composition according to the present embodiment can be used as an adhesive for the same type of adherend, and can also be used as an adhesive for different types of adherends having different thermal expansion coefficients.
- the adhesive composition according to the present embodiment includes an anisotropic conductive adhesive, a silver paste, a circuit connection material represented by a silver film, an elastomer for CSP, an underfill material for CSP, a LOC tape, and the like. It can be used as a semiconductor element adhesive material represented by
- a first circuit member having a first circuit board and a first circuit member having a first connection terminal disposed on a main surface of the first circuit board, a second circuit board, and a main circuit board of the second circuit board.
- the second circuit member having the second connection terminal disposed on the surface is arranged such that the first connection terminal and the second connection terminal face each other, and the first connection terminal and the second connection terminal are electrically connected to each other.
- a circuit member connection structure can be configured by arranging the adhesive composition according to the present embodiment or the cured product thereof. In such a case, the adhesive composition according to this embodiment is useful as an adhesive for circuit connection.
- connection structure using the above-described adhesive composition and a manufacturing method thereof will be described.
- the first circuit member having the first substrate and the first connection terminal disposed on the main surface of the first substrate, the second substrate, and the second substrate.
- the adhesive composition By curing the adhesive composition in a state in which the adhesive composition is interposed between the second circuit member having the second connection terminal disposed on the main surface, the first connection terminal And the manufacturing method of the connection structure which adhere
- the adhesive in a state where the adhesive composition is interposed between the wiring member and the solar cell having the connection terminal disposed on the main surface of the substrate and the substrate.
- a method for manufacturing a connection structure is provided in which the solar cell and the wiring member are bonded in a state where the connection terminal and the wiring member are electrically connected.
- FIG. 1 is a schematic cross-sectional view showing the connection structure according to the first embodiment.
- FIG. 2 is a schematic cross-sectional view showing a manufacturing method of the connection structure shown in FIG.
- the circuit member connection structure 100 shown in FIG. 1 is obtained using (e) an adhesive composition that does not contain conductive particles.
- the circuit member 1 includes a circuit member (first circuit member) 10, a circuit member (second circuit member) 20, and a connection member 30.
- the circuit member 10 includes a circuit board (first board) 12 and connection terminals (first connection terminals) 14 disposed on the main surface 12 a of the circuit board 12.
- the circuit member 20 includes a circuit board (second board) 22 and connection terminals (second connection terminals) 24 disposed on the main surface 22 a of the circuit board 22.
- the connecting member 30 is disposed between the circuit member 10 and the circuit member 20.
- the connecting member 30 connects the circuit member 10 and the circuit member 20 so that the main surface 12a and the main surface 22a face each other substantially in parallel.
- the connection terminal 14 and the connection terminal 24 are arranged to face each other and are electrically connected by being in contact with each other.
- the connection member 30 consists of the hardened
- the connection structure 100 can be manufactured as follows, for example. First, as shown in FIG. 2, a circuit member 10, a circuit member 20, and an adhesive composition 30a made of the above adhesive composition are prepared.
- the adhesive composition 30a is formed, for example, by forming the adhesive composition into a film.
- the adhesive composition 30a is placed on the main surface 22a of the circuit member 20 on which the connection terminals 24 are formed.
- the circuit member 10 is placed on the adhesive composition 30 a so that the connection terminal 14 faces the connection terminal 24. Subsequently, the adhesive composition 30a is cured while heating the adhesive composition 30a through the circuit member 10 and the circuit member 20, and is pressurized in a direction perpendicular to the main surfaces 12a and 22a. A connecting member 30 is formed therebetween. Thereby, the connection structure 100 is obtained.
- FIG. 3 is a schematic cross-sectional view showing the connection structure according to the second embodiment.
- FIG. 4 is a schematic cross-sectional view showing a manufacturing method of the connection structure shown in FIG.
- a circuit member connection structure 200 shown in FIG. 3 is obtained by using an adhesive composition containing (e) conductive particles.
- connection terminal 14 and the connection terminal 24 are arranged to face each other in a state of being separated from each other.
- the connecting member 40 is disposed between the circuit member 10 and the circuit member 20.
- the connection member 40 is made of a cured product of an adhesive composition 40a described later, and has an adhesive component 42 and conductive particles 44 dispersed in the adhesive component 42.
- the adhesive component 42 is made of a cured product of an adhesive component 42a described later.
- the conductive particles 44 are in contact with the connection terminals 14 and 24 between the connection terminals 14 and 24 that face each other, so that the connection terminals 14 and 24 are electrically connected to each other via the conductive particles 44. It is connected to the.
- connection structure 200 can be manufactured as follows, for example. First, as shown in FIG. 4, the circuit member 10, the circuit member 20, and the adhesive composition 40a which consists of the said adhesive composition are prepared.
- the adhesive composition 40a is formed, for example, by forming the adhesive composition into a film.
- the adhesive composition 40a has an adhesive component 42a and conductive particles 44 dispersed in the adhesive component 42a. Then, the circuit member 10 and the circuit member 20 are connected through the adhesive composition 40a by a method similar to the method of obtaining the circuit member connection structure 100 described above. Thereby, the connection structure 200 is obtained.
- At least one of the circuit board 12 and the circuit board 22 in the circuit member connection structures 100 and 200 may be formed of a base material containing a thermoplastic resin having a glass transition temperature of 200 ° C. or lower.
- at least one of the circuit board 12 and the circuit board 22 may be composed of an organic base material including at least one selected from the group consisting of polyethylene terephthalate, polycarbonate, and polyethylene naphthalate.
- the circuit board 12 and the circuit board 22 are composed of a base material containing at least one selected from the group consisting of polyethylene terephthalate, polycarbonate, and polyethylene naphthalate
- the circuit board 12 And the other circuit board of the circuit boards 22 may be comprised from the base material containing at least 1 sort (s) chosen from the group which consists of a polyimide resin and a polyethylene terephthalate.
- the circuit boards 12 and 22 are made of a base material containing an inorganic substance such as a semiconductor, glass or ceramic; an organic substance such as polyethylene terephthalate, polyethylene naphthalate, polyimide resin or polycarbonate; a composite material such as glass / epoxy resin. It may be.
- the circuit boards 12 and 22 may be flexible boards.
- FIG. 5 is a schematic cross-sectional view showing the connection structure according to the third embodiment.
- a solar cell module 300 shown in FIG. 5 includes solar cells 310a and 310b, a wiring member 320, and a connection member 330.
- the solar cells 310a and 310b include a substrate 312, a surface electrode (connection terminal) 314 disposed on the surface (main surface) 312a of the substrate 312, and a back surface disposed on the back surface (main surface) 312b of the substrate 312. And an electrode (connection terminal) 316.
- the substrate 312 is made of, for example, a semiconductor, an inorganic material such as glass or ceramic, or a composite material such as glass / epoxy resin.
- the substrate 312 may be a flexible substrate.
- the surface 312a is a light receiving surface.
- the wiring member 320 is a member for electrically connecting the solar battery cell 310a and another member, for example, electrically connecting one solar battery cell and another solar battery cell.
- the surface electrode 314 of the solar battery cell 310 a and the back electrode 316 of the solar battery cell 310 b are electrically connected by the wiring member 320.
- the connection member 330 is disposed between the solar battery cell 310a and the wiring member 320, and between the solar battery cell 310b and the wiring member 320, and connects the solar battery cells 310a and 310b and the wiring member 320. Yes.
- the connection member 330 contains a cured product of the adhesive composition, and contains an insulating material.
- the connection member 330 may further contain conductive particles or may not contain conductive particles.
- the connection member 330 contains electroconductive particle
- the surface electrode 314 and the wiring member 320 of the photovoltaic cell 310a can be electrically connected through electroconductive particle.
- the back electrode 316 of the solar battery cell 310b and the wiring member 320 can also be electrically connected through the conductive particles.
- the connection member 330 does not contain conductive particles, for example, the surface electrode 314 of the solar cell 310 a and / or the back electrode 316 of the solar cell 310 b may be in contact with the wiring member 320.
- the connection member 330 is formed of a cured product of the adhesive composition.
- the adhesive strength of the connection member 330 between the photovoltaic cells 310a and the wiring member 320, and between the photovoltaic cells 310b and the wiring member 320 is sufficiently high, and the connection between the photovoltaic cells 310a and 310b and the wiring member 320 is achieved.
- the resistance is small enough.
- the connection member 330 is a member that can be formed by a heat treatment at a low temperature for a short time. Therefore, the solar cell module shown in FIG. 5 can be manufactured without deteriorating the solar cells 310a and 310b at the time of connection, and can have higher reliability than conventional ones.
- the solar cell module 300 uses the solar cells 310a and 310b and the wiring member 320 in place of the circuit member 10 and the circuit member 20 in the method for manufacturing the connection structures 100 and 200 described above, and the method for manufacturing the connection structure described above. It can be manufactured by the same method.
- the adhesive composition used as a connection member does not need to be completely cured (the highest degree of curing that can be achieved under predetermined curing conditions), and has the above characteristics. As long as this occurs, it may be in a partially cured state.
- polyester urethane resin (trade name: UR-4800, manufactured by Toyobo Co., Ltd., weight average molecular weight: 32000, glass transition temperature: 106 ° C.) is dissolved in a 1: 1 mixed solvent of methyl ethyl ketone and toluene to have a resin content of 30% by mass. A mixed solvent-dissolved product was prepared.
- phenoxy resin 40 parts by mass of phenoxy resin (trade name: YP-50, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., weight average molecular weight: 60000, glass transition temperature: 80 ° C.) is dissolved in 60 parts by mass of methyl ethyl ketone, and a solution having a solid content of 40% by mass Prepared.
- phenoxy resin trade name: YP-50, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., weight average molecular weight: 60000, glass transition temperature: 80 ° C.
- reaction was conducted by heating to 70 to 75 ° C. After adding 0.53 parts by mass of hydroquinone monomethyl ether (manufactured by Sigma Aldrich) and 5.53 parts by mass of dibutyltin dilaurate (manufactured by Sigma Aldrich) to the reaction vessel, 2-hydroxyethyl acrylate (manufactured by Sigma Aldrich) 238 parts by mass (2.05 mol) was added and reacted at 70 ° C. for 6 hours in an air atmosphere to obtain urethane acrylate (UA1). The weight average molecular weight of urethane acrylate was 15000.
- N N-dimethylaniline (abbreviation: DMA, manufactured by Sigma-Aldrich) was prepared as an amine compound.
- ⁇ Radical polymerization initiator> Dilauroyl peroxide (trade name: Parroyl L, manufactured by NOF Corporation) was prepared.
- ⁇ Conductive particles> (Preparation of conductive particles) A nickel layer having a thickness of 0.2 ⁇ m is provided on the surface of particles having polystyrene as a core, and then a gold layer having a thickness of 0.02 ⁇ m is provided on the outside of the nickel layer. Particles were made.
- Examples 1 to 6 and Comparative Examples 1 to 4> (Production of adhesive for circuit connection) As shown in Table 1 in terms of solid mass ratio, a thermoplastic resin, a radical polymerizable compound and a radical polymerization initiator, and a boron-containing complex or amine compound are blended, and further, an adhesive component (in an adhesive for circuit connection) The conductive particles were mixed and dispersed in an amount of 1.5% by volume on the basis of the total volume of the component excluding the conductive particles) to obtain an adhesive for circuit connection. The obtained adhesive for circuit connection is applied on a fluororesin film having a thickness of 80 ⁇ m using a coating apparatus, and dried with hot air at 70 ° C. for 10 minutes for connecting a film-like circuit having an adhesive layer thickness of 20 ⁇ m. An adhesive was obtained.
- connection structure A (FPC / ITO) was made.
- connection structure A FPC / ITO
- the resistance value was shown as an average of 37 resistances between adjacent circuits.
- connection structure A was measured by a 90-degree peeling method according to JIS-Z0237.
- Tensilon UTM-4 peeleling speed 50 mm / min, 25 ° C.
- Toyo Baldwin Co., Ltd. was used as an adhesive strength measuring device.
- a thermocompression bonding apparatus heating method: constant heat type, manufactured by Toray Engineering Co., Ltd.
- connection structure B Using a multimeter, the resistance value between adjacent circuits of this connection structure B immediately after connection and after being held in a constant temperature and humidity chamber at 85 ° C. and 85% RH for 240 hours (after a high temperature and high humidity test) Measured. The resistance value was shown as an average of 37 resistances between adjacent circuits.
- connection structure B was measured and evaluated under the same conditions as the connection structure A.
- Table 2 below shows the measurement results of the connection resistance and adhesive strength (adhesive strength) of the connection structures A and B measured as described above.
- Table 3 below shows the measurement results of connection resistance and adhesive strength of the connection structure measured as described above.
- connection structures using the film-like circuit connecting adhesives obtained in Examples 3 to 6 were tested in the same manner as in Examples 1 and 2, and as a result, they were cured at a low temperature as in Examples 1 and 2. And storage stability were good.
- the FPC / ITO connection structure A using the circuit connection adhesives obtained in Examples 1 to 6 was immediately after connection at a heating temperature of 120 ° C. and 85 ° C., regardless of whether or not the storage stability test was performed.
- the FPC / Ag connection structure B 240 hours in a constant temperature and humidity chamber immediately after connection at a heating temperature of 120 ° C. and in a constant temperature and humidity chamber at 85 ° C. and 85% RH, regardless of whether or not a storage stability test is performed.
- connection structure using the circuit connection adhesive obtained in Comparative Examples 1 and 2 a good connection resistance can be obtained when the circuit connection adhesive before the storage stability test is used.
- D Since the adhesive for circuit connection does not contain a complex containing boron, when the adhesive for circuit connection after the storage stability test is used, after being kept in a constant temperature and humidity chamber for 240 hours ( It was confirmed that the connection resistance after the high-temperature and high-humidity test increased from that of the examples.
Abstract
Description
(測定条件)
装置:東ソー株式会社製 GPC-8020
検出器:東ソー株式会社製 RI-8020
カラム:日立化成株式会社製 Gelpack GL-A-160-S+GL-A150
試料濃度:120mg/3ml
溶媒:テトラヒドロフラン
注入量:60μl
圧力:30kgf/cm2
流量:1.00ml/min Moreover, in this specification, "weight average molecular weight" means the value measured by the gel permeation chromatograph (GPC) using the calibration curve by a standard polystyrene according to the conditions shown below.
(Measurement condition)
Equipment: GPC-8020 manufactured by Tosoh Corporation
Detector: RI-8020 manufactured by Tosoh Corporation
Column: Gelpack GL-A-160-S + GL-A150 manufactured by Hitachi Chemical Co., Ltd.
Sample concentration: 120mg / 3ml
Solvent: Tetrahydrofuran Injection volume: 60 μl
Pressure: 30 kgf / cm 2
Flow rate: 1.00 ml / min
本実施形態に係る接着剤組成物は、(a)熱可塑性樹脂と、(b)ラジカル重合性化合物と、(c)ラジカル重合開始剤と、(d)ホウ素を含有する錯体と、を含有している。 <Adhesive composition>
The adhesive composition according to the present embodiment contains (a) a thermoplastic resin, (b) a radical polymerizable compound, (c) a radical polymerization initiator, and (d) a complex containing boron. ing.
(a)熱可塑性樹脂とは、加熱により粘度の高い液状状態になって外力により自由に変形し、冷却し外力を取り除くとその形状を保ったままで硬くなり、この過程を繰り返し行える性質を持つ樹脂(高分子)をいう。また、(a)熱可塑性樹脂は、上記の性質を有する反応性官能基を有する樹脂(高分子)であってもよい。(a)熱可塑性樹脂のガラス転移温度(Tg)は、-30℃以上が好ましく、-25℃以上がより好ましく、-20℃以上が更に好ましい。(a)熱可塑性樹脂のガラス転移温度は、190℃以下が好ましく、170℃以下がより好ましく、150℃以下が更に好ましく、130℃以下が特に好ましく、110℃以下が極めて好ましい。 ((A) thermoplastic resin)
(A) A thermoplastic resin is a resin that has a property of being able to repeat this process in a liquid state with a high viscosity by heating, being deformed freely by external force, and being hardened while maintaining its shape when cooled and removed. (Polymer). Further, (a) the thermoplastic resin may be a resin (polymer) having a reactive functional group having the above properties. (A) The glass transition temperature (Tg) of the thermoplastic resin is preferably −30 ° C. or higher, more preferably −25 ° C. or higher, and further preferably −20 ° C. or higher. (A) The glass transition temperature of the thermoplastic resin is preferably 190 ° C or lower, more preferably 170 ° C or lower, still more preferably 150 ° C or lower, particularly preferably 130 ° C or lower, and extremely preferably 110 ° C or lower.
(b)ラジカル重合性化合物とは、ラジカル重合開始剤の作用でラジカル重合を生じる化合物をいう。(b)ラジカル重合性化合物は、光又は熱等の活性化エネルギーを付与することでそれ自体ラジカルを生じる化合物であってもよい。(b)ラジカル重合性化合物としては、例えば、活性ラジカルによって重合する官能基(ビニル基、(メタ)アクリロイル基、アリル基、マレイミド基等)を有する化合物を好適に使用可能である。 ((B) Radical polymerizable compound)
(B) A radically polymerizable compound refers to a compound that generates radical polymerization by the action of a radical polymerization initiator. (B) The radically polymerizable compound may be a compound that itself generates radicals by applying activation energy such as light or heat. (B) As the radically polymerizable compound, for example, a compound having a functional group (vinyl group, (meth) acryloyl group, allyl group, maleimide group, etc.) that is polymerized by an active radical can be suitably used.
(c)ラジカル重合開始剤としては、従来から知られている有機過酸化物及びアゾ化合物等のように、外部からのエネルギーの付与によりラジカルを発生する化合物を用いることができる。(c)ラジカル重合開始剤としては、安定性、反応性及び相溶性に優れる観点から、1分間半減期温度が90~175℃であり且つ重量平均分子量が180~1000の有機過酸化物が好ましい。1分間半減期温度がこの範囲にあることで、貯蔵安定性に更に優れ、ラジカル重合性も充分に高く、短時間で硬化できる。 ((C) radical polymerization initiator)
(C) As the radical polymerization initiator, compounds that generate radicals by external energy application, such as conventionally known organic peroxides and azo compounds, can be used. (C) The radical polymerization initiator is preferably an organic peroxide having a 1 minute half-life temperature of 90 to 175 ° C. and a weight average molecular weight of 180 to 1000 from the viewpoint of excellent stability, reactivity and compatibility. . When the 1-minute half-life temperature is in this range, the storage stability is further improved, the radical polymerizability is sufficiently high, and the composition can be cured in a short time.
(d)ホウ素を含有する錯体(以下「(d)成分」という)は、下記一般式(A)で表される化合物である。(d)成分は、ホウ素化合物と、ホウ素化合物に対する塩基性物質としてアンモニア又はアミン化合物とを含んでいる。
(D) A complex containing boron (hereinafter referred to as “component (d)”) is a compound represented by the following general formula (A). The component (d) contains a boron compound and ammonia or an amine compound as a basic substance for the boron compound.
(e)導電性粒子は、その全体又は表面に導電性を有する粒子であればよいが、接続端子を有する部材の接続に使用する場合は、接続端子間の距離よりも平均粒径が小さい粒子が好ましい。 ((E) conductive particles)
(E) The conductive particles may be particles having conductivity on the whole or on the surface, but when used for connecting members having connection terminals, the average particle diameter is smaller than the distance between the connection terminals. Is preferred.
本実施形態に係る接着剤組成物は、硬化速度の制御のため、及び、貯蔵安定性を更に向上させるために、安定化剤を含有することができる。このような安定化剤としては、特に制限なく公知の化合物を使用することができるが、ベンゾキノン及びハイドロキノン等のキノン誘導体;4-メトキシフェノール及び4-t-ブチルカテコール等のフェノール誘導体;2,2,6,6-テトラメチルピペリジン-1-オキシル及び4-ヒドロキシ-2,2,6,6-テトラメチルピペリジン-1-オキシル等のアミノキシル誘導体;テトラメチルピペリジルメタクリレート等のヒンダードアミン誘導体などが好ましい。安定化剤は、1種を単独で又は2種以上を混合して用いることができる。 (Other ingredients)
The adhesive composition according to the present embodiment can contain a stabilizer for controlling the curing rate and for further improving the storage stability. As such a stabilizer, known compounds can be used without particular limitation, but quinone derivatives such as benzoquinone and hydroquinone; phenol derivatives such as 4-methoxyphenol and 4-t-butylcatechol; Preferred are aminoxyl derivatives such as 1,6,6-tetramethylpiperidine-1-oxyl and 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxyl; and hindered amine derivatives such as tetramethylpiperidyl methacrylate. A stabilizer can be used individually by 1 type or in mixture of 2 or more types.
次に、上述した接着剤組成物を用いた接続構造体及びその製造方法について説明する。本実施形態によれば、第1の基板及び当該第1の基板の主面上に配置された第1の接続端子を有する第1の回路部材と、第2の基板及び当該第2の基板の主面上に配置された第2の接続端子を有する第2の回路部材との間に、接着剤組成物を介在させた状態で当該接着剤組成物を硬化させることにより、第1の接続端子及び第2の接続端子が電気的に接続した状態で第1の回路部材及び第2の回路部材を接着する、接続構造体の製造方法が提供される。また、本実施形態によれば、基板及び当該基板の主面上に配置された接続端子を有する太陽電池セルと、配線部材との間に、接着剤組成物を介在させた状態で当該接着剤組成物を硬化させることにより、接続端子及び配線部材が電気的に接続した状態で太陽電池セル及び配線部材を接着する、接続構造体の製造方法が提供される。 <Connection structure>
Next, a connection structure using the above-described adhesive composition and a manufacturing method thereof will be described. According to this embodiment, the first circuit member having the first substrate and the first connection terminal disposed on the main surface of the first substrate, the second substrate, and the second substrate. By curing the adhesive composition in a state in which the adhesive composition is interposed between the second circuit member having the second connection terminal disposed on the main surface, the first connection terminal And the manufacturing method of the connection structure which adhere | attaches a 1st circuit member and a 2nd circuit member in the state which the 2nd connection terminal electrically connected is provided. Moreover, according to the present embodiment, the adhesive in a state where the adhesive composition is interposed between the wiring member and the solar cell having the connection terminal disposed on the main surface of the substrate and the substrate. By curing the composition, a method for manufacturing a connection structure is provided in which the solar cell and the wiring member are bonded in a state where the connection terminal and the wiring member are electrically connected.
(ポリエステルウレタン樹脂の準備)
ポリエステルウレタン樹脂(商品名:UR-4800、東洋紡株式会社製、重量平均分子量:32000、ガラス転移温度:106℃)をメチルエチルケトンとトルエンとの1:1混合溶媒に溶解して樹脂分30質量%の混合溶媒溶解品を準備した。 <Thermoplastic resin>
(Preparation of polyester urethane resin)
Polyester urethane resin (trade name: UR-4800, manufactured by Toyobo Co., Ltd., weight average molecular weight: 32000, glass transition temperature: 106 ° C.) is dissolved in a 1: 1 mixed solvent of methyl ethyl ketone and toluene to have a resin content of 30% by mass. A mixed solvent-dissolved product was prepared.
フェノキシ樹脂(商品名:YP-50、新日鉄住金化学株式会社製、重量平均分子量:60000、ガラス転移温度:80℃)40質量部をメチルエチルケトン60質量部に溶解して、固形分40質量%の溶液を準備した。 (Preparation of phenoxy resin)
40 parts by mass of phenoxy resin (trade name: YP-50, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., weight average molecular weight: 60000, glass transition temperature: 80 ° C.) is dissolved in 60 parts by mass of methyl ethyl ketone, and a solution having a solid content of 40% by mass Prepared.
(ウレタンアクリレート(UA1)の合成)
攪拌機、温度計、塩化カルシウム乾燥管を有する還流冷却管、及び、窒素ガス導入管を備えた反応容器に、数平均分子量1000のポリ(1,6-ヘキサンジオールカーボネート)(商品名:デュラノール T5652、旭化成ケミカルズ株式会社製)2500質量部(2.50mol)と、イソホロンジイソシアネート(シグマアルドリッチ社製)666質量部(3.00mol)とを3時間で均一に滴下し、反応容器に充分に窒素ガスを導入した後、70~75℃に加熱して反応させた。反応容器に、ハイドロキノンモノメチルエーテル(シグマアルドリッチ社製)0.53質量部と、ジブチルスズジラウレート(シグマアルドリッチ社製)5.53質量部とを添加した後、2-ヒドロキシエチルアクリレート(シグマアルドリッチ社製)238質量部(2.05mol)を加え、空気雰囲気下70℃で6時間反応させ、ウレタンアクリレート(UA1)を得た。ウレタンアクリレートの重量平均分子量は15000であった。 <Radically polymerizable compound>
(Synthesis of urethane acrylate (UA1))
In a reaction vessel equipped with a stirrer, a thermometer, a reflux condenser having a calcium chloride drying tube, and a nitrogen gas introduction tube, poly (1,6-hexanediol carbonate) having a number average molecular weight of 1000 (trade name: DURANOL T5652; Asahi Kasei Chemicals Co., Ltd.) 2500 parts by mass (2.50 mol) and isophorone diisocyanate (Sigma Aldrich) 666 parts by mass (3.00 mol) are uniformly added dropwise over 3 hours, and nitrogen gas is sufficiently added to the reaction vessel. After the introduction, the reaction was conducted by heating to 70 to 75 ° C. After adding 0.53 parts by mass of hydroquinone monomethyl ether (manufactured by Sigma Aldrich) and 5.53 parts by mass of dibutyltin dilaurate (manufactured by Sigma Aldrich) to the reaction vessel, 2-hydroxyethyl acrylate (manufactured by Sigma Aldrich) 238 parts by mass (2.05 mol) was added and reacted at 70 ° C. for 6 hours in an air atmosphere to obtain urethane acrylate (UA1). The weight average molecular weight of urethane acrylate was 15000.
リン酸基を有するビニル化合物として、2-(メタ)アクリロイルオキシエチルホスフェート(商品名:ライトエステルP-2M、共栄社化学株式会社製)を準備した。 (Preparation of a vinyl compound having a phosphate group (P-2M))
As a vinyl compound having a phosphoric acid group, 2- (meth) acryloyloxyethyl phosphate (trade name: Light Ester P-2M, manufactured by Kyoeisha Chemical Co., Ltd.) was prepared.
(トリエチルボラン1,3-ジアミノプロパン(TEB-DAP)の合成)
攪拌器、冷却器、温度計及び窒素ガス導入管を含む3口フラスコに14.8g(0.20mol)の1,3-プロピレンジアミンを加え、13.1g(0.13mol)のトリエチルホウ素を100mlのテトラヒドロフラン(THF)に溶解させた溶液を約40℃以下に保ちながら滴下した。滴下終了後、この混合物を約0.5時間攪拌することで、トリエチルボラン1,3-ジアミノプロパン(TEB-DAP)を得た。 <Complex containing boron>
(Synthesis of triethylborane 1,3-diaminopropane (TEB-DAP))
14.8 g (0.20 mol) of 1,3-propylenediamine was added to a three-necked flask containing a stirrer, a cooler, a thermometer, and a nitrogen gas introduction tube, and 100 ml of 13.1 g (0.13 mol) of triethylboron was added. A solution dissolved in tetrahydrofuran (THF) was added dropwise while maintaining the temperature at about 40 ° C. or lower. After completion of the dropwise addition, the mixture was stirred for about 0.5 hours to obtain triethylborane 1,3-diaminopropane (TEB-DAP).
攪拌器、冷却器、温度計及び窒素ガス導入管を含む3口フラスコに20.6g(0.20mol)のN-(2-アミノエチル)エタン-1,2-ジアミンを加え、13.1g(0.13mol)のトリエチルホウ素を100mlのテトラヒドロフラン(THF)に溶解させた溶液を約40℃以下に保ちながら滴下した。滴下終了後、この混合物を約0.5時間攪拌することで、トリエチルボランN-(2-アミノエチル)エタン-1,2-ジアミン(TEB-DETA)を得た。 (Synthesis of triethylborane N- (2-aminoethyl) ethane-1,2-diamine (TEB-DETA))
20.6 g (0.20 mol) of N- (2-aminoethyl) ethane-1,2-diamine was added to a three-necked flask containing a stirrer, a cooler, a thermometer, and a nitrogen gas inlet tube, and 13.1 g ( A solution prepared by dissolving 0.13 mol) of triethylboron in 100 ml of tetrahydrofuran (THF) was added dropwise while maintaining the temperature at about 40 ° C. or lower. After completion of the dropwise addition, the mixture was stirred for about 0.5 hours to obtain triethylborane N- (2-aminoethyl) ethane-1,2-diamine (TEB-DETA).
攪拌器、冷却器、温度計及び窒素ガス導入管を含む3口フラスコに17.8g(0.20mol)の3-メトキシ-1-アミンプロパンを加え、23.7g(0.13mol)のトリ-n-ブチルホウ素を100mlのテトラヒドロフラン(THF)に溶解させた溶液を約40℃以下に保ちながら滴下した。滴下終了後、この混合物を約0.5時間攪拌することで、トリ-n-ブチルボラン3-メトキシ-1-アミンプロパン(TnBB-MOPA)を得た。 (Synthesis of tri-n-butylborane 3-methoxy-1-aminepropane (TnBB-MOPA))
17.8 g (0.20 mol) of 3-methoxy-1-aminepropane was added to a three-necked flask containing a stirrer, a cooler, a thermometer, and a nitrogen gas inlet tube, and 23.7 g (0.13 mol) of tri- A solution prepared by dissolving n-butylboron in 100 ml of tetrahydrofuran (THF) was added dropwise while maintaining the temperature at about 40 ° C. or lower. After completion of the dropwise addition, the mixture was stirred for about 0.5 hours to obtain tri-n-butylborane 3-methoxy-1-aminepropane (TnBB-MOPA).
アミン化合物として、N,N-ジメチルアニリン(略称:DMA、シグマアルドリッチ社製)を準備した。 <Amine compound>
N, N-dimethylaniline (abbreviation: DMA, manufactured by Sigma-Aldrich) was prepared as an amine compound.
ジラウロイルパーオキサイド(商品名:パーロイルL、日油株式会社製)を準備した。 <Radical polymerization initiator>
Dilauroyl peroxide (trade name: Parroyl L, manufactured by NOF Corporation) was prepared.
(導電性粒子の作製)
ポリスチレンを核とする粒子の表面に厚み0.2μmのニッケル層を設けた後、このニッケル層の外側に厚み0.02μmの金層を設けて、平均粒径10μm、比重2.5の導電性粒子を作製した。 <Conductive particles>
(Preparation of conductive particles)
A nickel layer having a thickness of 0.2 μm is provided on the surface of particles having polystyrene as a core, and then a gold layer having a thickness of 0.02 μm is provided on the outside of the nickel layer. Particles were made.
(回路接続用接着剤の作製)
固形質量比で表1に示すように熱可塑性樹脂、ラジカル重合性化合物及びラジカル重合開始剤、並びに、ホウ素を含有する錯体又はアミン化合物を配合し、さらに、接着剤成分(回路接続用接着剤における導電性粒子を除いた成分)の全体積を基準として導電性粒子を1.5体積%配合分散させて、回路接続用接着剤を得た。得られた回路接続用接着剤を、塗工装置を用いて厚み80μmのフッ素樹脂フィルム上に塗布し、70℃、10分の熱風乾燥によって、接着剤層の厚みが20μmのフィルム状回路接続用接着剤を得た。 <Examples 1 to 6 and Comparative Examples 1 to 4>
(Production of adhesive for circuit connection)
As shown in Table 1 in terms of solid mass ratio, a thermoplastic resin, a radical polymerizable compound and a radical polymerization initiator, and a boron-containing complex or amine compound are blended, and further, an adhesive component (in an adhesive for circuit connection) The conductive particles were mixed and dispersed in an amount of 1.5% by volume on the basis of the total volume of the component excluding the conductive particles) to obtain an adhesive for circuit connection. The obtained adhesive for circuit connection is applied on a fluororesin film having a thickness of 80 μm using a coating apparatus, and dried with hot air at 70 ° C. for 10 minutes for connecting a film-like circuit having an adhesive layer thickness of 20 μm. An adhesive was obtained.
実施例1~6及び比較例1~4のフィルム状回路接続用接着剤を、ポリイミドフィルム上にライン幅25μm、ピッチ50μm、厚み8μmの銅回路を500本有するフレキシブル回路板(FPC)と、厚み0.2μmのITOの薄層を形成した厚み1.1mmのガラス(ITO、表面抵抗20Ω/□)との間に介在させた。これを、熱圧着装置(加熱方式:コンスタントヒート型、東レエンジニアリング株式会社製)を用いて、120℃、2MPaで10秒間加熱加圧して幅2mmにわたり接続し、接続構造体A(FPC/ITO)を作製した。この接続構造体Aの隣接回路間の抵抗値を、接続直後と、85℃、85%RHの恒温恒湿槽中に240時間保持した後(高温高湿試験後)とにおいて、マルチメータを用いて測定した。抵抗値は隣接回路間の抵抗37点の平均で示した。 (Measurement of connection resistance and adhesive strength)
A flexible circuit board (FPC) having 500 copper circuits having a line width of 25 μm, a pitch of 50 μm, and a thickness of 8 μm on a polyimide film, and the thickness of the adhesive for film-like circuit connection of Examples 1 to 6 and Comparative Examples 1 to 4; It was interposed between 1.1 mm thick glass (ITO, surface resistance 20Ω / □) formed with a 0.2 μm thin ITO layer. Using a thermocompression bonding apparatus (heating method: constant heat type, manufactured by Toray Engineering Co., Ltd.), it was heated and pressurized at 120 ° C. and 2 MPa for 10 seconds to be connected over a width of 2 mm, and connection structure A (FPC / ITO) Was made. Using a multimeter, the resistance value between adjacent circuits of this connection structure A immediately after connection and after being kept in a constant temperature and humidity chamber at 85 ° C. and 85% RH for 240 hours (after a high temperature and high humidity test) Measured. The resistance value was shown as an average of 37 resistances between adjacent circuits.
実施例1~2及び比較例1~2のフィルム状回路接続用接着剤を、ガスバリア性容器(旭化成パックス株式会社製、商品名:ポリフレックスバッグ飛竜、型番:N-9、材質:ナイロン(厚み15μm)/PE(厚み60μm)、サイズ:200mm×300mm)内に入れた後、ガスバリア性容器内の空気を除いた。次に、ヒートシーラーにて密封後、40℃雰囲気下に48時間放置した。上記雰囲気下に放置することによって、-10℃雰囲気下で5ヶ月間放置したことと同等とした。その後、実施例1~2及び比較例1~2のフィルム状回路接続用接着剤を、上記と同様のFPCとITOの薄層を形成したガラスとの間、及び、FPCとAgペーストの薄層を形成したPET基板との間にそれぞれ介在させた。これを、上記接続抵抗及び接着強度の測定の際と同じ方法及び条件で加熱圧着して接続構造体を作製した。この接続構造体の接続抵抗及び接着強度を上記と同様の方法で測定した。 (Storage stability test)
The adhesives for film-like circuit connection of Examples 1 and 2 and Comparative Examples 1 and 2 were used as gas barrier containers (manufactured by Asahi Kasei Packs Co., Ltd., trade name: Polyflex bag Hiryu, model number: N-9, material: nylon ( After being put in (thickness 15 μm) / PE (thickness 60 μm, size: 200 mm × 300 mm), the air in the gas barrier container was removed. Next, after sealing with a heat sealer, it was left in a 40 ° C. atmosphere for 48 hours. By leaving it in the above atmosphere, it was equivalent to leaving it in a −10 ° C. atmosphere for 5 months. Thereafter, the adhesives for film-like circuit connection of Examples 1 and 2 and Comparative Examples 1 and 2 were used between the same FPC and glass on which a thin layer of ITO was formed, and a thin layer of FPC and Ag paste. And a PET substrate on which each was formed. This was thermocompression-bonded under the same method and conditions as in the measurement of the connection resistance and adhesive strength to produce a connection structure. The connection resistance and adhesive strength of this connection structure were measured by the same method as described above.
Claims (11)
- (a)熱可塑性樹脂と、(b)ラジカル重合性化合物と、(c)ラジカル重合開始剤と、(d)ホウ素を含有する錯体と、を含有し、
前記(d)ホウ素を含有する錯体が、下記一般式(A)で表される化合物である、接着剤組成物。
(D) The adhesive composition whose complex containing a boron is a compound represented by the following general formula (A).
- 前記(b)ラジカル重合性化合物が、リン酸基を有するビニル化合物と、当該ビニル化合物以外のラジカル重合性化合物と、を含む、請求項1に記載の接着剤組成物。 The adhesive composition according to claim 1, wherein the (b) radical polymerizable compound includes a vinyl compound having a phosphate group and a radical polymerizable compound other than the vinyl compound.
- 前記(a)熱可塑性樹脂が、フェノキシ樹脂、ポリウレタン樹脂、ポリエステルウレタン樹脂、ブチラール樹脂、(メタ)アクリル樹脂、ポリイミド樹脂及びポリアミド樹脂、並びに、酢酸ビニル由来の構造単位を有する共重合体からなる群より選ばれる少なくとも1種を含む、請求項1又は2に記載の接着剤組成物。 The group (a) wherein the thermoplastic resin is composed of a phenoxy resin, a polyurethane resin, a polyester urethane resin, a butyral resin, a (meth) acrylic resin, a polyimide resin and a polyamide resin, and a copolymer having a structural unit derived from vinyl acetate. The adhesive composition of Claim 1 or 2 containing at least 1 sort (s) chosen from more.
- (e)導電性粒子を更に含有する、請求項1~3のいずれか一項に記載の接着剤組成物。 (E) The adhesive composition according to any one of claims 1 to 3, further comprising conductive particles.
- 第1の基板の主面上に配置された第1の接続端子と、第2の基板の主面上に配置された第2の接続端子とを電気的に接続するために用いられる、請求項1~4のいずれか一項に記載の接着剤組成物。 The first connection terminal disposed on the main surface of the first substrate is used to electrically connect the second connection terminal disposed on the main surface of the second substrate. The adhesive composition according to any one of 1 to 4.
- 基板の主面上に配置された接続端子を有する太陽電池セルの当該接続端子と、配線部材とを電気的に接続するために用いられる、請求項1~4のいずれか一項に記載の接着剤組成物。 The adhesion according to any one of claims 1 to 4, which is used for electrically connecting the connection terminal of the solar battery cell having the connection terminal disposed on the main surface of the substrate and the wiring member. Agent composition.
- 第1の基板及び当該第1の基板の主面上に配置された第1の接続端子を有する第1の回路部材と、
第2の基板及び当該第2の基板の主面上に配置された第2の接続端子を有する第2の回路部材と、
前記第1の回路部材及び前記第2の回路部材の間に配置された接続部材と、を備え、
前記接続部材が、請求項1~4のいずれか一項に記載の接着剤組成物の硬化物を含有し、
前記第1の接続端子及び前記第2の接続端子が電気的に接続されている、接続構造体。 A first circuit member having a first substrate and a first connection terminal disposed on a main surface of the first substrate;
A second circuit member having a second connection terminal disposed on the main surface of the second substrate and the second substrate;
A connection member disposed between the first circuit member and the second circuit member;
The connection member contains a cured product of the adhesive composition according to any one of claims 1 to 4,
A connection structure in which the first connection terminal and the second connection terminal are electrically connected. - 前記第1の基板及び前記第2の基板の少なくとも一方が、ガラス転移温度が200℃以下の熱可塑性樹脂を含む基材から構成されている、請求項7に記載の接続構造体。 The connection structure according to claim 7, wherein at least one of the first substrate and the second substrate is formed of a base material including a thermoplastic resin having a glass transition temperature of 200 ° C or lower.
- 前記第1の基板及び前記第2の基板の少なくとも一方が、ポリエチレンテレフタレート、ポリカーボネート及びポリエチレンナフタレートからなる群より選ばれる少なくとも1種を含む基材から構成されている、請求項7に記載の接続構造体。 The connection according to claim 7, wherein at least one of the first substrate and the second substrate is composed of a base material including at least one selected from the group consisting of polyethylene terephthalate, polycarbonate, and polyethylene naphthalate. Structure.
- 前記第1の基板が、ポリエチレンテレフタレート、ポリカーボネート及びポリエチレンナフタレートからなる群より選ばれる少なくとも1種を含む基材から構成されており、
前記第2の基板が、ポリイミド樹脂及びポリエチレンテレフタレートからなる群より選ばれる少なくとも1種を含む基材から構成されている、請求項7に記載の接続構造体。 The first substrate is composed of a base material including at least one selected from the group consisting of polyethylene terephthalate, polycarbonate and polyethylene naphthalate,
The connection structure according to claim 7, wherein the second substrate is composed of a base material including at least one selected from the group consisting of a polyimide resin and polyethylene terephthalate. - 基板及び当該基板の主面上に配置された接続端子を有する太陽電池セルと、
配線部材と、
前記太陽電池セル及び前記配線部材の間に配置された接続部材と、を備え、
前記接続部材が、請求項1~4のいずれか一項に記載の接着剤組成物の硬化物を含有し、
前記接続端子及び前記配線部材が電気的に接続されている、接続構造体。 A solar cell having a substrate and connection terminals disposed on the main surface of the substrate;
A wiring member;
A connecting member disposed between the solar cell and the wiring member,
The connection member contains a cured product of the adhesive composition according to any one of claims 1 to 4,
A connection structure in which the connection terminal and the wiring member are electrically connected.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201680015269.4A CN107429143B (en) | 2015-04-23 | 2016-04-22 | Adhesive composite and connection structural bodies |
JP2017514209A JP6834946B2 (en) | 2015-04-23 | 2016-04-22 | Adhesive composition and connection structure |
KR1020177025039A KR102490406B1 (en) | 2015-04-23 | 2016-04-22 | Adhesive composition and bonded structure |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-088515 | 2015-04-23 | ||
JP2015088515 | 2015-04-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016171253A1 true WO2016171253A1 (en) | 2016-10-27 |
Family
ID=57143953
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2016/062766 WO2016171253A1 (en) | 2015-04-23 | 2016-04-22 | Adhesive composition and connected structure |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6834946B2 (en) |
KR (1) | KR102490406B1 (en) |
CN (1) | CN107429143B (en) |
TW (1) | TWI705117B (en) |
WO (1) | WO2016171253A1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019240277A1 (en) * | 2018-06-15 | 2019-12-19 | デンカ株式会社 | Composition |
JP2020019885A (en) * | 2018-07-31 | 2020-02-06 | 井和工業株式会社 | Application method of adhesive composition |
JP2020019927A (en) * | 2019-04-16 | 2020-02-06 | 井和工業株式会社 | Adhesive composition |
WO2022014625A1 (en) * | 2020-07-17 | 2022-01-20 | 京都エレックス株式会社 | Conductive adhesive composition |
WO2022107729A1 (en) * | 2020-11-17 | 2022-05-27 | 昭和電工マテリアルズ株式会社 | Adhesive set, adhesive body, and method for producing same |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0693235A (en) * | 1992-03-17 | 1994-04-05 | Natl Starch & Chem Investment Holding Corp | Acrylic adhesive composition and organoboron initiator system |
JPH11504625A (en) * | 1995-04-14 | 1999-04-27 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | Organoboran polyoxyalkylene polyamine complex and adhesive composition produced using the complex |
JP2000504353A (en) * | 1994-02-22 | 2000-04-11 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | Polymerizable composition produced using polymerization initiator system based on organoboron amine complex |
JP2008518082A (en) * | 2004-10-28 | 2008-05-29 | ダウ・コーニング・コーポレイション | Curable conductive composition |
JP2009519368A (en) * | 2005-12-15 | 2009-05-14 | ハンツマン アドバンスト マテリアルズ (スイッツァランド) ゲーエムベーハー | Multi-phase acrylic adhesive |
JP2013144792A (en) * | 2011-12-16 | 2013-07-25 | Hitachi Chemical Co Ltd | Adhesive composition, filmy adhesive, adhesive sheet, connecting structure, and method for manufacturing connecting structure |
JP2013144793A (en) * | 2011-12-16 | 2013-07-25 | Hitachi Chemical Co Ltd | Adhesive composition, filmy adhesive, adhesive sheet, connecting structure, and method for manufacturing connecting structure |
JP2014170794A (en) * | 2013-03-01 | 2014-09-18 | Dexerials Corp | Conductive adhesive, solar cell module, and method for manufacturing solar cell module |
JP2015007182A (en) * | 2013-06-25 | 2015-01-15 | 日立化成株式会社 | Connection material, connection material for solar battery, solar cell module prepared using the same and method of producing the same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2610900B2 (en) | 1987-10-27 | 1997-05-14 | ソニーケミカル 株式会社 | Thermosetting anisotropic conductive adhesive sheet and method for producing the same |
JP3587859B2 (en) | 1997-03-31 | 2004-11-10 | 日立化成工業株式会社 | Circuit connection material, circuit terminal connection structure and connection method |
JP4514848B2 (en) | 1999-04-09 | 2010-07-28 | サンメディカル株式会社 | Polymerization initiator and dental material using the same |
-
2016
- 2016-04-22 KR KR1020177025039A patent/KR102490406B1/en active IP Right Grant
- 2016-04-22 JP JP2017514209A patent/JP6834946B2/en active Active
- 2016-04-22 TW TW105112600A patent/TWI705117B/en active
- 2016-04-22 WO PCT/JP2016/062766 patent/WO2016171253A1/en active Application Filing
- 2016-04-22 CN CN201680015269.4A patent/CN107429143B/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0693235A (en) * | 1992-03-17 | 1994-04-05 | Natl Starch & Chem Investment Holding Corp | Acrylic adhesive composition and organoboron initiator system |
JP2000504353A (en) * | 1994-02-22 | 2000-04-11 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | Polymerizable composition produced using polymerization initiator system based on organoboron amine complex |
JPH11504625A (en) * | 1995-04-14 | 1999-04-27 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | Organoboran polyoxyalkylene polyamine complex and adhesive composition produced using the complex |
JP2008518082A (en) * | 2004-10-28 | 2008-05-29 | ダウ・コーニング・コーポレイション | Curable conductive composition |
JP2009519368A (en) * | 2005-12-15 | 2009-05-14 | ハンツマン アドバンスト マテリアルズ (スイッツァランド) ゲーエムベーハー | Multi-phase acrylic adhesive |
JP2013144792A (en) * | 2011-12-16 | 2013-07-25 | Hitachi Chemical Co Ltd | Adhesive composition, filmy adhesive, adhesive sheet, connecting structure, and method for manufacturing connecting structure |
JP2013144793A (en) * | 2011-12-16 | 2013-07-25 | Hitachi Chemical Co Ltd | Adhesive composition, filmy adhesive, adhesive sheet, connecting structure, and method for manufacturing connecting structure |
JP2014170794A (en) * | 2013-03-01 | 2014-09-18 | Dexerials Corp | Conductive adhesive, solar cell module, and method for manufacturing solar cell module |
JP2015007182A (en) * | 2013-06-25 | 2015-01-15 | 日立化成株式会社 | Connection material, connection material for solar battery, solar cell module prepared using the same and method of producing the same |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019240277A1 (en) * | 2018-06-15 | 2019-12-19 | デンカ株式会社 | Composition |
CN112262159A (en) * | 2018-06-15 | 2021-01-22 | 电化株式会社 | Composition comprising a metal oxide and a metal oxide |
JP2020019885A (en) * | 2018-07-31 | 2020-02-06 | 井和工業株式会社 | Application method of adhesive composition |
JP2020019927A (en) * | 2019-04-16 | 2020-02-06 | 井和工業株式会社 | Adhesive composition |
JP7115752B2 (en) | 2019-04-16 | 2022-08-09 | 井和工業株式会社 | adhesive composition |
WO2022014625A1 (en) * | 2020-07-17 | 2022-01-20 | 京都エレックス株式会社 | Conductive adhesive composition |
JP2022019451A (en) * | 2020-07-17 | 2022-01-27 | 京都エレックス株式会社 | Conductive adhesive composition |
WO2022107729A1 (en) * | 2020-11-17 | 2022-05-27 | 昭和電工マテリアルズ株式会社 | Adhesive set, adhesive body, and method for producing same |
WO2022107211A1 (en) * | 2020-11-17 | 2022-05-27 | 昭和電工マテリアルズ株式会社 | Adhesive agent set, and adhesion body and method for producing same |
Also Published As
Publication number | Publication date |
---|---|
CN107429143A (en) | 2017-12-01 |
KR102490406B1 (en) | 2023-01-18 |
CN107429143B (en) | 2019-08-16 |
JPWO2016171253A1 (en) | 2018-02-15 |
JP6834946B2 (en) | 2021-02-24 |
KR20170139505A (en) | 2017-12-19 |
TWI705117B (en) | 2020-09-21 |
TW201704433A (en) | 2017-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5527395B2 (en) | Adhesive composition, adhesive sheet, and connection structure | |
JP5527394B2 (en) | Adhesive composition, adhesive sheet, and connection structure | |
KR101296486B1 (en) | Adhesive composition, connection structure, method for producing connection structure, and use of adhesive composition | |
JP6834946B2 (en) | Adhesive composition and connection structure | |
JP6024261B2 (en) | Adhesive for circuit connection, connection structure for circuit member and solar cell module | |
JP5454578B2 (en) | Adhesive composition, connection structure, method for producing connection structure, and application of adhesive composition | |
JP2018188646A (en) | Adhesive composition, film-like adhesive, adhesive sheet, circuit connection body, method for connecting circuit member, use of adhesive composition, use of film-like adhesive and use of adhesive sheet | |
JP6051662B2 (en) | Adhesive composition for circuit connection, adhesive sheet, adhesive reel and circuit member connection structure | |
JP6107345B2 (en) | Adhesive composition, adhesive for circuit connection, and connection structure for circuit member | |
JP2015151536A (en) | Adhesive composition and connection structure | |
KR102373783B1 (en) | Adhesive composition and connection structure | |
JP2020111760A (en) | Adhesive composition and connection structure | |
JP2019026851A (en) | Adhesive composition and connection structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 16783274 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2017514209 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20177025039 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 16783274 Country of ref document: EP Kind code of ref document: A1 |