WO2016161909A1 - 有机发光二极管基板 - Google Patents

有机发光二极管基板 Download PDF

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Publication number
WO2016161909A1
WO2016161909A1 PCT/CN2016/077632 CN2016077632W WO2016161909A1 WO 2016161909 A1 WO2016161909 A1 WO 2016161909A1 CN 2016077632 W CN2016077632 W CN 2016077632W WO 2016161909 A1 WO2016161909 A1 WO 2016161909A1
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Prior art keywords
inner ring
substrate
layer
ring region
device layer
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PCT/CN2016/077632
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English (en)
French (fr)
Inventor
王涛
孙韬
张嵩
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京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/321,518 priority Critical patent/US10199604B2/en
Publication of WO2016161909A1 publication Critical patent/WO2016161909A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

Definitions

  • the present disclosure relates to the field of organic light emitting diode display, and in particular to an organic light emitting diode substrate.
  • Flexible display devices are widely used in fields requiring curved display because of their ability to bend.
  • the existing flexible display device uses an organic light emitting diode as a light source.
  • the organic light emitting diode is sensitive to water oxygen in the air, so the packaging of the organic light emitting diode substrate of the flexible display device is required to be high, and the packaging effect directly affects the life of the organic light emitting diode substrate.
  • the OLED substrate packaged by the face-to-face bonding method comprises a substrate substrate, a device layer including the organic light-emitting diode formed thereon, and a surface-coated glue on the device layer and the substrate substrate.
  • Commonly used toppings are pressure sensitive adhesives and thermosetting adhesives.
  • the surface adhesive is pressure sensitive adhesive, although the pressure sensitive adhesive is relatively strong, the pressure sensitive adhesive itself has poor ability to block water oxygen, so it cannot provide sufficient protection for the organic light emitting diode; if the surface adhesive is made of heat curing adhesive Although the heat-curing adhesive has a good ability to block water oxygen, it does not provide sufficient protection for the organic light-emitting diode because of its general bonding strength, especially at the edges. Therefore, in the conventional organic light emitting diode substrate packaged by the surface adhesive surface, there is a technical problem that the organic light emitting diode and the water in the air cannot be effectively isolated.
  • the present disclosure provides an organic light emitting diode substrate that at least partially alleviates or eliminates the above disadvantages of the prior art.
  • an organic light emitting diode substrate comprising: a substrate substrate and a device layer formed on an intermediate portion thereof, the region above the device substrate except the device layer is divided into An inner ring region surrounding the device layer and an outer ring region outside the inner ring region; a first adhesive layer bonded over the device layer and the inner ring region and covering the device layer and the inner ring a region, the first adhesive layer is used to block water and oxygen for the device layer; a second rubber frame above the outer ring region and the first rubber layer and covering an upper portion of the inner ring region of the first rubber layer, the second plastic frame has a higher bonding strength than the first rubber layer Bond strength.
  • the overlapping portions of the first and second frames above the inner ring region are pressed together.
  • the second frame covers the outer ring region.
  • At least one reinforcement having an outwardly extending pressure for releasing the corner is provided at each corner of the second frame, the reinforcement being adhered to the substrate Pick up.
  • the reinforcement is a rounded or straight strip or curved strip.
  • the inner ring region is provided with at least one fixing protrusion, and the fixing protrusion is laminated with the first glue.
  • the fixing projections are provided at the corners of each of the inner ring regions.
  • the fixing protrusion is a truncated cone shape or a straight wall shape or a curved wall shape or a shape conforming to a corner shape of the inner ring region.
  • the frame formed by the inner edge of the second frame overlaps the device layer.
  • the device layer comprises an organic light emitting diode
  • the first adhesive layer is a first adhesive layer formed by a thermosetting adhesive
  • the second plastic frame is a second plastic frame formed by a pressure sensitive adhesive
  • the device layer is located at an intermediate portion above the substrate substrate, and the first adhesive layer is adhered over the inner layer region of the device layer and the surrounding device layer and covers the device layer and the inner layer
  • the second frame is bonded to the outer ring region and the portion above the inner ring region of the first adhesive layer and covers the portion above the inner ring region of the first adhesive layer.
  • the first adhesive layer and the second plastic frame are covered on the inner ring region to avoid the existence of seams between the first adhesive layer and the second plastic frame, thereby absorbing oxygen in the device layer and the air.
  • the effective isolation is performed; on the other hand, the bonding strength of the second plastic frame is higher, the second plastic frame is firmly bonded to the substrate, and the first adhesive layer is bonded to the substrate.
  • the bonding between the second plastic frame and the first adhesive layer and the base substrate is made stronger, thereby effectively isolating the device layer from the water oxygen in the air.
  • FIG. 1 is a schematic diagram of a substrate and a device layer of an organic light emitting diode substrate according to an embodiment of the present disclosure
  • FIG. 2 is a schematic view of a first adhesive layer and a second plastic frame of the LED substrate shown in FIG. 1;
  • FIG. 3 is a schematic view showing another angle of the first rubber layer and the second plastic frame shown in FIG. 1;
  • FIG. 4 is a schematic view showing another angle of the first rubber layer and the second plastic frame shown in FIG. 1 after pressing;
  • FIG. 5 is a schematic view of a first adhesive layer and a second plastic frame of a light emitting diode substrate according to still another embodiment of the present disclosure
  • FIG. 6 is a schematic diagram of a first adhesive layer and a second plastic frame of an LED substrate according to another embodiment of the present disclosure.
  • An organic light emitting diode substrate includes:
  • a first adhesive layer 310 bonded over the device layer and the inner ring region and covering the device layer 200 and the inner ring region 110, the first adhesive layer 310 being used to block water and oxygen for the device layer ;
  • the second plastic frame has a higher bonding strength than the Bond strength of the first adhesive layer
  • the device layer comprises an organic light emitting diode
  • the first adhesive layer is a first adhesive layer formed by a thermosetting adhesive
  • the second plastic frame is a second plastic frame formed by a pressure sensitive adhesive
  • the device layer is located at an intermediate portion above the substrate, and the first adhesive layer formed by the thermosetting adhesive is adhered to the inner layer region of the device layer and the surrounding device layer and Covering the device layer and the inner ring region, the second plastic frame formed by the pressure sensitive adhesive is bonded to the outer ring region and the portion above the inner ring region of the first adhesive layer and covers the portion above the inner ring region of the first adhesive layer.
  • the first adhesive layer and the second plastic frame are covered on the inner ring region to avoid the existence of seams between the first adhesive layer and the second plastic frame, thereby absorbing oxygen in the device layer and the air.
  • the effective isolation is performed; on the other hand, the bonding strength of the second plastic frame is higher, the second plastic frame is firmly bonded to the substrate, and the first adhesive layer is bonded to the substrate.
  • the bonding between the second plastic frame and the first adhesive layer and the base substrate is made stronger, thereby effectively isolating the device layer from the water oxygen in the air.
  • the first glue layer 310 and the second plastic frame 320 are pressed together at overlapping portions above the inner ring region.
  • the overlap between the two adhesive layers can be made closer, thereby effectively making the water layer in the device layer and the air effective. Isolation.
  • the second plastic frame 320 further covers the outer ring region.
  • the second plastic frame covers the portion of the outer ring region and the inner ring region of the first rubber layer, and the second plastic frame is bonded to the outer ring region, so that the bonding of the second plastic frame is more firm and avoids Peeling occurs at the edges.
  • At least one reinforcing body 321 having an outwardly protruding pressure for releasing the corner is provided at each corner of the second plastic frame, the reinforcing body Bonding to the substrate.
  • the stress at the corner of the second plastic frame is relatively concentrated.
  • an outwardly protruding reinforcing body is provided at each corner, and the reinforcing body increases the bonding area with the substrate, which is effective. The stress is released, thus reducing the risk of peeling off the corners of the second frame.
  • the reinforcement may be a rounded shape as shown in FIG. 5, or a straight strip as shown in FIG. 6, or a curved strip. It should be noted that there are various specific implementation forms of the reinforcement body, such as rounded or straight strips or curved strips, which are only used for illustration. Any shape of the reinforcement can increase the bonding area with the substrate, which is effective. Release stress.
  • the inner ring region 110 is further provided with at least one fixing protrusion 111, and the fixing protrusion is laminated with the first glue.
  • the fixing boss The first adhesive layer is laminated, and the fixing protrusions enhance the adhesion of the first adhesive layer to the base substrate.
  • the fixing protrusions 111 are provided at the corners of each of the inner ring regions.
  • a fixing protrusion at a corner of each inner ring region bonds and secures the first adhesive layer to the base substrate.
  • the fixing protrusion is a truncated cone shape or a straight wall shape or a curved wall shape or a shape conforming to a corner shape of the inner ring region. It should be noted that there are various implementation forms of the fixing protrusions, such as a truncated cone shape or a straight wall shape or a curved wall shape or a shape conforming to the corner shape of the inner ring region, which is used for illustration only, and has any shape.
  • the fixing protrusions can better bond and fix the first adhesive layer and the base substrate.
  • a frame formed by an inner edge of the second plastic frame overlaps the device layer.
  • the second frame does not cover the device layer and does not affect the device layer.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

提供一种有机发光二极管基板，包括：衬底基板和形成于之上中间部分的器件层，衬底基板之上除器件层之外的区域划分为环绕器件层的内环区和内环区之外的外环区；粘接于器件层和内环区之上的第一胶层（310）且其覆盖器件层和内环区；第一胶层（310）用于器件层的阻隔水氧；粘接于外环区和第一胶层（310）之上的第二胶框（320）且其覆盖第一胶层（310）的内环区之上部分，第二胶框（320）的粘接强度高于第一胶层（310）的粘接强度。如此解决了器件层与空气中的水氧无法进行有效隔离的技术问题。

Description

有机发光二极管基板 技术领域
本公开涉及有机发光二极管显示领域，特别涉及一种有机发光二极管基板。
背景技术
柔性显示装置因其能够弯曲的特性而广泛适用于需要曲面显示的领域。现有的柔性显示装置采用有机发光二极管作为光源。然而，有机发光二极管对空气中的水氧很敏感，因此对柔性显示装置的有机发光二极管基板的封装要求很高，封装效果直接影响到有机发光二极管基板的寿命。
在现有的有机发光二极管基板的封装中，大多采用面胶整面进行贴合的方式。采用面胶整面贴合的方式封装的有机发光二极管基板包括衬底基板，形成于之上的包括有机发光二极管的器件层，整面贴合在器件层和衬底基板之上的面胶。常用的面胶有压敏胶和热固化胶两种。如果面胶采用压敏胶，虽然压敏胶粘接的比较牢固，但是由于压敏胶本身阻隔水氧的能力较差，因此不能为有机发光二极管提供足够的保护；如果面胶采用热固化胶，虽然热固化胶阻隔水氧的能力不错，但是由于其粘接强度一般，尤其在边缘处容易发生剥落，因此也不能为有机发光二极管提供足够的保护。因而，在现有采用面胶整面贴合的方式封装的有机发光二极管基板中，存在有机发光二极管与空气中的水氧无法进行有效隔离的技术问题。
发明内容
本公开提供了一种有机发光二极管基板，其至少部分地缓解或消除了现有技术中的上述缺点。
在本公开的第一方面，提供了一种有机发光二极管基板，包括：衬底基板和形成于之上的中间部分的器件层，所述衬底基板之上除器件层之外的区域划分为环绕所述器件层的内环区和所述内环区之外的外环区；粘接于所述器件层和内环区之上的第一胶层且其覆盖所述器件层和内环区，所述第一胶层用于为所述器件层阻隔水氧；粘接于所 述外环区和第一胶层之上的第二胶框且其覆盖第一胶层的内环区之上部分，所述第二胶框的粘接强度高于所述第一胶层的粘接强度。
在一个实施例中，所述第一胶层和第二胶框在所述内环区之上的重叠的部分压合在一起。
在另一实施例中，所述第二胶框覆盖所述外环区。
在又一实施例中，在所述第二胶框的每个拐角处设置有至少一个具有向外伸出的用于释放拐角处应力的增强体，所述增强体与所述衬底基板粘接。
在再一实施例中，所述增强体是圆角形或直条形或弯曲条。
在另外的实施例中，所述内环区设置有至少一个固定凸起，所述固定凸起与所述第一胶层压合为一体。
在一个实施例中，在每个所述内环区的拐角处设置有所述固定凸起。
在另一实施例中，所述固定凸起是圆台形或直墙形或弯曲的墙形或与所述内环区的拐角形状一致的形状。
在又一实施例中，所述第二胶框的内边缘形成的框与所述器件层重叠。
在再一实施例中，所述器件层包括有机发光二极管，所述第一胶层是热固化胶形成的第一胶层，所述第二胶框是压敏胶形成的第二胶框。
在本公开提供的有机发光二极管基板中，器件层位于衬底基板之上的中间部分，第一胶层粘接在所述器件层和环绕器件层的内环区之上且覆盖器件层和内环区，第二胶框粘接在外环区和第一胶层的内环区之上部分且覆盖第一胶层的内环区之上的部分。一方面，在内环区之上覆盖有第一胶层和第二胶框，避免在第一胶层和第二胶框之间存在接缝的情况，从而将器件层和空气中的水氧进行了有效的隔离；另一方面，第二胶框的粘接强度更高，使第二胶框与衬底基板牢固的粘接在一起，同时将第一胶层粘接在衬底基板之上，使得第二胶框和第一胶层与衬底基板的粘接更为牢固，从而将器件层和空气中的水氧进行了有效的隔离。
附图说明
图1为本公开的一个实施例的有机发光二极管基板的衬底基板和器件层的示意图；
图2为图1所示的发光二极管基板的第一胶层和第二胶框的示意图；
图3为图1所示的第一胶层和第二胶框的另一角度的示意图；
图4为图1所示的第一胶层和第二胶框在压合后的另一角度的示意图；
图5为本公开的又一个实施例的发光二极管基板的第一胶层和第二胶框的示意图；
图6为本公开的另一个实施例的发光二极管基板的第一胶层和第二胶框的示意图。
主要元件附图标记说明：
100衬底基板，110内环区，111固定凸起，120外环区，200器件层，
310第一胶层，320第二胶框，321增强体。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
根据本公开的一个实施例的有机发光二极管基板，如图1，图2和图3所示，包括：
衬底基板100和形成于之上的中间部分的器件层200，所述衬底基板之上除器件层之外的区域划分为环绕所述器件层的内环区110和所述内环区之外的外环区120；
粘接于所述器件层和内环区之上的第一胶层310且其覆盖所述器件层200和内环区110，所述第一胶层310用于为所述器件层阻隔水氧；
粘接于所述外环区和第一胶层之上的第二胶框320且其覆盖第一胶层的内环区之上部分，所述第二胶框的粘接强度高于所述第一胶层的粘接强度；
其中，所述器件层包括有机发光二极管，所述第一胶层是热固化胶形成的第一胶层，所述第二胶框是压敏胶形成的第二胶框。
在本实施例的有机发光二极管基板中，器件层位于衬底基板之上的中间部分，热固化胶形成的第一胶层粘接在所述器件层和环绕器件层的内环区之上且覆盖器件层和内环区，压敏胶形成的第二胶框粘接在外环区和第一胶层的内环区之上部分且覆盖第一胶层的内环区之上的部分。一方面，在内环区之上覆盖有第一胶层和第二胶框，避免在第一胶层和第二胶框之间存在接缝的情况，从而将器件层和空气中的水氧进行了有效的隔离；另一方面，第二胶框的粘接强度更高，使第二胶框与衬底基板牢固的粘接在一起，同时将第一胶层粘接在衬底基板之上，使得第二胶框和第一胶层与衬底基板的粘接更为牢固，从而将器件层和空气中的水氧进行了有效的隔离。
在一个示例实施例中，如图4所示，所述第一胶层310和第二胶框320在所述内环区之上的重叠的部分压合在一起。通过将第一胶层和第二胶框在内环区之上的重叠部分压合在一起，可以使两者重叠之处的固定更加紧密，从而将器件层和空气中的水氧进行了有效的隔离。
可选地，如图2所示，所述第二胶框320还覆盖所述外环区。这样，第二胶框覆盖在外环区和第一胶层的内环区之上的部分，第二胶框与外环区的粘接，使得第二胶框的粘接更加牢固，避免在边缘处发生剥落。
可选地，如图5和图6所示，在所述第二胶框的每个拐角处设置有至少一个具有向外伸出的用于释放拐角处应力的增强体321，所述增强体与所述衬底基板粘接。第二胶框的拐角处的应力比较集中，为了释放拐角处的应力，在每个拐角处设置具有向外伸出的增强体，增强体增大了与衬底基板的粘接面积，有效的释放了应力，因此，降低了从第二胶框的拐角处剥落的风险。
具体的，所述增强体可以是如图5所示的圆角形，或如图6所示的直条形，或弯曲条。需要说明的是，增强体的具体实现形式有多种，圆角形或直条形或弯曲条，仅用于举例说明，任何形状的增强体都可以增大与衬底基板的粘接面积，有效的释放应力。
进一步的，如图1所示，所述内环区110还设置有至少一个固定凸起111，所述固定凸起与所述第一胶层压合为一体。这样，固定凸起 和第一胶层压合为一体，固定凸起增强了第一胶层与衬底基板的粘接。
可选地，如图1所示，在每个所述内环区的拐角处设置有所述固定凸起111。每个内环区的拐角处的固定凸起将第一胶层与所述衬底基板更好的粘接固定。
进一步的，所述固定凸起是圆台形或直墙形或弯曲的墙形或与所述内环区的拐角形状一致的形状。需要说明的是，固定凸起的具体实现形式有多种，圆台形或直墙形或弯曲的墙形或与所述内环区的拐角形状一致的形状，仅用于举例说明，任何形状的固定凸起都可以将第一胶层与所述衬底基板更好的粘接固定。
可选地，所述第二胶框的内边缘形成的框与所述器件层重叠。这样，第二胶框不会遮盖器件层，对器件层不会有影响。
显然，本领域的技术人员可以对本公开实施例进行各种改动和变型而不脱离本公开的精神和范围。这样，倘若本公开的这些修改和变型属于本公开权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。

Claims (10)

  1. 一种有机发光二极管基板，包括：
    衬底基板和形成于之上的中间部分的器件层，所述衬底基板之上除器件层之外的区域划分为环绕所述器件层的内环区和所述内环区之外的外环区；
    粘接于所述器件层和内环区之上的第一胶层且其覆盖所述器件层和内环区，所述第一胶层用于为所述器件层阻隔水氧；
    粘接于所述外环区和第一胶层之上的第二胶框且其覆盖第一胶层的内环区之上部分，所述第二胶框的粘接强度高于所述第一胶层的粘接强度。
  2. 根据权利要求1所述的有机发光二极管基板，其中，所述第一胶层和第二胶框在所述内环区之上的重叠的部分压合在一起。
  3. 根据权利要求1或2所述的有机发光二极管基板，其中，所述第二胶框覆盖所述外环区。
  4. 根据权利要求1至3任一所述的有机发光二极管基板，其中，在所述第二胶框的每个拐角处设置有至少一个具有向外伸出的用于释放拐角处应力的增强体，所述增强体与所述衬底基板粘接。
  5. 根据权利要求4所述的有机发光二极管基板，其中，所述增强体是圆角形或直条形或弯曲条。
  6. 根据权利要求1至5任一所述的有机发光二极管基板，其中，所述内环区设置有至少一个固定凸起，所述固定凸起与所述第一胶层压合为一体。
  7. 根据权利要求6所述的有机发光二极管基板，其中，在每个所述内环区的拐角处设置有所述固定凸起。
  8. 根据权利要求7所述的有机发光二极管基板，其中，所述固定凸起是圆台形或直墙形或弯曲的墙形或与所述内环区的拐角形状一致的形状。
  9. 根据权利要求1至8任一所述的有机发光二极管基板，其中，所述第二胶框的内边缘形成的框与所述器件层重叠。
  10. 根据权利要求1至9任一所述的有机发光二极管基板，其中，所述器件层包括有机发光二极管，所述第一胶层是热固化胶形成的第 一胶层，所述第二胶框是压敏胶形成的第二胶框。
PCT/CN2016/077632 2015-04-10 2016-03-29 有机发光二极管基板 WO2016161909A1 (zh)

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