WO2016158613A1 - ガスバリア性積層体、電子デバイス用部材、および電子デバイス - Google Patents
ガスバリア性積層体、電子デバイス用部材、および電子デバイス Download PDFInfo
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- WO2016158613A1 WO2016158613A1 PCT/JP2016/059209 JP2016059209W WO2016158613A1 WO 2016158613 A1 WO2016158613 A1 WO 2016158613A1 JP 2016059209 W JP2016059209 W JP 2016059209W WO 2016158613 A1 WO2016158613 A1 WO 2016158613A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/048—Forming gas barrier coatings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/023—Optical properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D43/00—Lids or covers for rigid or semi-rigid containers
- B65D43/02—Removable lids or covers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
- C08J7/0423—Coating with two or more layers, where at least one layer of a composition contains a polymer binder with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder
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- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
- C08J7/123—Treatment by wave energy or particle radiation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/48—Ion implantation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
- B05D3/141—Plasma treatment
- B05D3/145—After-treatment
- B05D3/148—After-treatment affecting the surface properties of the coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
- B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/418—Refractive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/72—Density
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
- B32B2307/7244—Oxygen barrier
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
- C08J2483/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
- C08J2483/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/16—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
Definitions
- the present invention relates to a gas barrier laminate excellent in gas barrier properties and excellent in colorless transparency, an electronic device member comprising the gas barrier laminate, and an electronic device including the electronic device member.
- a liquid crystal display and an electroluminescence (EL) display have a gas barrier on a transparent plastic film instead of a glass plate as a substrate having electrodes in order to realize a reduction in thickness, weight, and flexibility.
- a so-called gas barrier film in which layers are laminated is used.
- a method for forming a gas barrier layer a method for modifying the surface of a layer containing a polysilazane compound is known.
- Patent Document 1 describes a molded article characterized by having a layer in which ions are implanted into a layer containing a polysilazane compound. This document also describes that the layer into which the ions are implanted can function as a gas barrier layer.
- a gas barrier film excellent in gas barrier properties and transparency can be obtained by injecting ions into a layer containing a polysilazane compound formed on a substrate. Further, according to the study by the present inventors, it has been found that a gas barrier layer having better gas barrier properties can be formed by increasing the applied voltage when ions are implanted. However, gas barrier films having such a gas barrier layer tended to be yellowish.
- the present invention has been made in view of the above circumstances, and has a gas barrier laminate excellent in gas barrier properties and excellent in colorless transparency, a member for an electronic device comprising the gas barrier laminate, and the member for an electronic device It is an object to provide an electronic device comprising:
- the present inventors have intensively studied a gas barrier laminate having a base material and a gas barrier layer.
- the base material, the base-side gas barrier layer (1) provided on the base material directly or via another layer, and the gas barrier layer (2) provided on the gas barrier layer (1) A gas barrier laminate comprising a gas barrier unit having a thickness of 170 nm to 10 ⁇ m, and having excellent gas barrier properties and colorless transparency.
- the headline and the present invention were completed.
- gas barrier laminates [1] to [5], an electronic device member [6] and an electronic device [7] are provided.
- a gas barrier laminate comprising a gas barrier layer (2) disposed on the side surface, and the thickness of the gas barrier unit being 170 nm to 10 ⁇ m.
- the gas barrier layer (1) has a refractive index of 1.40 to 1.50
- the gas barrier layer (2) has a refractive index of 1.50 to 1.75
- [the gas barrier layer (1) The optical barrier layered product according to [1], wherein [optical film thickness] / [optical film thickness of gas barrier layer (2)] is 3.0 or more.
- the gas barrier laminate according to [1], wherein the gas barrier layer (1) and the gas barrier layer (2) are formed using a material containing a polysilazane compound.
- [5] A portion in which the gas barrier layer (2) is modified by subjecting the surface of a layer containing a polysilazane compound, which is provided directly or via another layer, to the substrate.
- An electronic device member comprising the gas barrier laminate according to any one of [1] to [5].
- An electronic device comprising the electronic device member according to [6].
- a gas barrier laminate excellent in gas barrier properties and excellent in colorless transparency an electronic device member comprising the gas barrier laminate, and an electronic device including the electronic device member.
- Gas barrier laminate of the present invention includes a base material and a gas barrier unit, and the gas barrier layer (1) is formed by arranging the gas barrier unit on the base material side.
- the base material constituting the gas barrier laminate of the present invention is not particularly limited as long as it is excellent in transparency and has sufficient strength as a base material for the gas barrier laminate.
- Resin components of the resin film include polyimide, polyamide, polyamideimide, polyphenylene ether, polyether ketone, polyether ether ketone, polyolefin, polyester, polycarbonate, polysulfone, polyethersulfone, polyphenylene sulfide, acrylic resin, cycloolefin Examples thereof include polymers and aromatic polymers.
- polyesters, polyamides or cycloolefin polymers are preferred, and polyesters or cycloolefin polymers are more preferred because of their superior transparency and versatility.
- polyester examples include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyarylate, and the like, and polyethylene terephthalate is preferable.
- polyamide examples include wholly aromatic polyamide, nylon 6, nylon 66, nylon copolymer, and the like.
- cycloolefin polymers include norbornene polymers, monocyclic olefin polymers, cyclic conjugated diene polymers, vinyl alicyclic hydrocarbon polymers, and hydrides thereof. Specific examples thereof include Apel (an ethylene-cycloolefin copolymer manufactured by Mitsui Chemicals), Arton (a norbornene polymer manufactured by JSR), Zeonoa (a norbornene polymer manufactured by Nippon Zeon), and the like. .
- Apel an ethylene-cycloolefin copolymer manufactured by Mitsui Chemicals
- Arton a norbornene polymer manufactured by JSR
- Zeonoa a norbornene polymer manufactured by Nippon Zeon
- the resin film may contain various additives as long as the effects of the present invention are not hindered.
- the additive include an ultraviolet absorber, an antistatic agent, a stabilizer, an antioxidant, a plasticizer, a lubricant, and a coloring pigment. What is necessary is just to determine suitably content of these additives according to the objective.
- the resin film can be obtained by preparing a resin composition containing a resin component and optionally various additives, and molding the resin composition into a film.
- the molding method is not particularly limited, and a known method such as a casting method or a melt extrusion method can be used.
- the thickness of the substrate is not particularly limited and may be determined according to the purpose of the gas barrier laminate.
- the thickness of the substrate is usually 0.5 to 500 ⁇ m, preferably 1 to 100 ⁇ m.
- the light transmittance at 380 to 780 nm of the substrate is preferably 80% or more, and more preferably 85% or more.
- the gas barrier unit which comprises the gas barrier laminated body of this invention is provided on the base material directly or through another layer.
- the gas barrier unit includes a gas barrier layer (1) disposed on the substrate side, and a gas barrier layer (2) disposed on the surface of the gas barrier layer (1) opposite to the substrate side.
- the gas barrier layer (1) and the gas barrier layer (2) may be disposed adjacent to each other, or the gas barrier layer (1) and the gas barrier layer (2) may be other layers. It may be arranged with a (primer layer or the like) in between.
- the thickness of the gas barrier unit is 170 nm to 10 ⁇ m, preferably 170 to 500 nm, more preferably 170 to 400 nm.
- the thickness of the gas barrier unit is less than 170 nm, the colorless transparency of the gas barrier laminate tends to be poor.
- the thickness of the gas barrier unit is thicker than 10 ⁇ m, it is difficult to obtain an effect commensurate with it.
- the value calculated by [optical film thickness of gas barrier layer (1)] / [optical film thickness of gas barrier layer (2)] is preferably 3.0 or more, more preferably 3.0. To 20.0, more preferably from 3.0 to 10.0. When this value is 3.0 or more, a gas barrier laminate excellent in colorless transparency can be easily obtained.
- the optical film thickness of the gas barrier layer is calculated by “refractive index of gas barrier layer ⁇ thickness of gas barrier layer”.
- gas barrier layers (1) and (2) are all made of a gas such as oxygen or water vapor. It is a layer having the property of suppressing permeation (gas barrier property).
- gas barrier property since the gas barrier property of the gas barrier layer alone is not focused, the gas barrier layer cannot be defined from the viewpoint of gas barrier performance. However, it is possible to estimate the gas barrier performance based on the refractive index. In general, it can be said that a layer containing constituents described later and having a refractive index of 1.40 or more has a sufficient gas barrier property.
- the gas barrier layers (1) and (2) in the present invention can be distinguished from their constituent components and physical properties such as refractive index.
- the gas barrier layer (1) is a layer formed on the substrate side in the gas barrier unit.
- the refractive index of the gas barrier layer (1) is preferably 1.40 to 1.50, more preferably 1.42 to 1.48. When the refractive index is within the above range, a gas barrier laminate excellent in colorless transparency can be easily obtained.
- the refractive index means the refractive index of light having a wavelength of 590 nm measured at 23 ° C.
- the thickness of the gas barrier layer (1) is not particularly limited, but is preferably 169 nm to 5 ⁇ m, more preferably 169 to 300 nm.
- the film density of the gas barrier layer (1) is preferably 1.0 to 2.5 g / cm 3 , more preferably 1.5 to 2.0 g / cm 3 . When the film density of the gas barrier layer (1) is within the above range, a gas barrier laminate excellent in colorless transparency and flexibility can be easily obtained.
- the gas barrier layer (2) is a layer formed on the surface of the gas barrier layer (1) opposite to the substrate side.
- the refractive index of the gas barrier layer (2) is preferably 1.50 to 1.75, more preferably 1.55 to 1.72. When the refractive index is in the above range, a gas barrier laminate excellent in colorless transparency and flexibility can be easily obtained.
- the thickness of the gas barrier layer (2) is not particularly limited, but is preferably 1 nm to 5 ⁇ m, more preferably 1 to 200 nm, and particularly preferably 1 to 100 nm.
- the film density of the gas barrier layer (2) is preferably 2.5 to 4.5 g / cm 3 , more preferably 2.7 to 4.0 g / cm 3 .
- a gas barrier laminate excellent in gas barrier properties and excellent in colorless transparency can be easily obtained.
- constituent components of the gas barrier layer include inorganic compounds, metals, and polymer compounds.
- inorganic compounds include inorganic oxides such as silicon oxide, aluminum oxide, magnesium oxide, zinc oxide, indium oxide, and tin oxide; inorganic nitrides such as silicon nitride; inorganic carbides such as silicon carbide; and composites thereof.
- the metal include aluminum, magnesium, zinc, tin and the like.
- the polymer compound include a polymer silicon compound.
- the gas barrier layer (1) is a layer containing a polymeric silicon compound (hereinafter referred to as “polymeric silicon compound layer”). It is preferable that the gas barrier layer (2) is either a layer containing an inorganic compound or a layer containing a metal.
- the polymer silicon compound constituting the polymer silicon compound layer of the gas barrier layer (1) examples include polysilazane compounds, polycarbosilane compounds, polysilane compounds, and polyorganosiloxane compounds.
- the gas barrier layer (1) is preferably a layer containing a polysilazane compound (hereinafter sometimes referred to as “polysilazane layer”) because it has more excellent gas barrier properties.
- polysilazane layer a layer containing a polysilazane compound because it has more excellent gas barrier properties.
- the layer containing the inorganic compound or metal of the gas barrier layer (2) is obtained by modifying the inorganic vapor-deposited film or the polymer silicon compound layer [in this case, the gas barrier layer (2) is modified. It means only the quality part. ] Etc. are mentioned.
- Examples of the inorganic vapor deposition film include vapor deposition films of inorganic compounds and metals.
- Examples of the raw material for the vapor deposition film of the inorganic compound and the metal vapor deposition film include those described above as the constituent components of the gas barrier layer. These can be used singly or in combination of two or more.
- an inorganic vapor-deposited film using an inorganic oxide, inorganic nitride or metal as a raw material is preferable from the viewpoint of gas barrier properties, and further, an inorganic material using an inorganic oxide or inorganic nitride as a raw material from the viewpoint of transparency.
- a vapor deposition film is preferred.
- a PVD (physical vapor deposition) method such as a vacuum vapor deposition method, a sputtering method, or an ion plating method, a thermal CVD (chemical vapor deposition) method, a plasma CVD method, a photo CVD method, etc.
- the CVD method is mentioned.
- a layer obtained by subjecting the polymer silicon compound layer to the modification treatment As the layer obtained by subjecting the polymer silicon compound layer to the modification treatment, a layer obtained by subjecting the polysilazane layer to the modification treatment is preferable.
- the details of the method for modifying the polysilazane layer and the like will be described later, but the same method can be used when modifying other polymer silicon compound layers.
- the gas barrier layer (1) and the gas barrier layer (2) can be efficiently formed by using a material containing a polysilazane compound.
- the target gas barrier unit is efficiently formed by forming a polysilazane layer on the substrate directly or via another layer and applying a modification treatment to the surface of the formed polysilazane layer. be able to.
- the gas barrier layer (1) is an unmodified portion
- the gas barrier layer (2) is a modified portion.
- the polysilazane compound is a polymer compound having a repeating unit containing —Si—N— bond (silazane bond) in the molecule. Specifically, the formula (1)
- the compound which has a repeating unit represented by these is preferable.
- the number average molecular weight of the polysilazane compound to be used is not particularly limited, but is preferably 100 to 50,000.
- n represents an arbitrary natural number.
- Rx, Ry, and Rz each independently represent a hydrogen atom, an unsubstituted or substituted alkyl group, an unsubstituted or substituted cycloalkyl group, an unsubstituted or substituted alkenyl group, unsubstituted or substituted Represents a non-hydrolyzable group such as an aryl group having a group or an alkylsilyl group;
- alkyl group of the unsubstituted or substituted alkyl group examples include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, a t-butyl group, Examples thereof include alkyl groups having 1 to 10 carbon atoms such as n-pentyl group, isopentyl group, neopentyl group, n-hexyl group, n-heptyl group and n-octyl group.
- Examples of the unsubstituted or substituted cycloalkyl group include cycloalkyl groups having 3 to 10 carbon atoms such as a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, and a cycloheptyl group.
- alkenyl group of an unsubstituted or substituted alkenyl group examples include, for example, a vinyl group, 1-propenyl group, 2-propenyl group, 1-butenyl group, 2-butenyl group, 3-butenyl group and the like having 2 to 2 carbon atoms. 10 alkenyl groups are mentioned.
- substituents for the alkyl group, cycloalkyl group and alkenyl group include halogen atoms such as fluorine atom, chlorine atom, bromine atom and iodine atom; hydroxyl group; thiol group; epoxy group; glycidoxy group; (meth) acryloyloxy group
- halogen atoms such as fluorine atom, chlorine atom, bromine atom and iodine atom
- hydroxyl group such as hydroxyl group; thiol group; epoxy group; glycidoxy group; (meth) acryloyloxy group
- An unsubstituted or substituted aryl group such as a phenyl group, a 4-methylphenyl group, and a 4-chlorophenyl group;
- aryl group of an unsubstituted or substituted aryl group examples include aryl groups having 6 to 10 carbon atoms such as a phenyl group, a 1-naphthyl group, and a 2-naphthyl group.
- substituent of the aryl group examples include halogen atoms such as fluorine atom, chlorine atom, bromine atom and iodine atom; alkyl groups having 1 to 6 carbon atoms such as methyl group and ethyl group; carbon numbers such as methoxy group and ethoxy group 1-6 alkoxy groups; nitro groups; cyano groups; hydroxyl groups; thiol groups; epoxy groups; glycidoxy groups; (meth) acryloyloxy groups; unsubstituted phenyl groups, 4-methylphenyl groups, 4-chlorophenyl groups, etc.
- alkylsilyl group examples include trimethylsilyl group, triethylsilyl group, triisopropylsilyl group, tri-t-butylsilyl group, methyldiethylsilyl group, dimethylsilyl group, diethylsilyl group, methylsilyl group, and ethylsilyl group.
- Rx, Ry, and Rz a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group is preferable, and a hydrogen atom is particularly preferable.
- Examples of the polysilazane compound having a repeating unit represented by the formula (1) include inorganic polysilazanes in which Rx, Ry, and Rz are all hydrogen atoms, and organic polysilazanes in which at least one of Rx, Ry, and Rz is not a hydrogen atom. It may be.
- a modified polysilazane compound can also be used as the polysilazane compound.
- the modified polysilazane include, for example, JP-A-62-195024, JP-A-2-84437, JP-A-63-81122, JP-A-1-138108, and JP-A-2-175726.
- JP-A-5-238827, JP-A-5-238827, JP-A-6-122852, JP-A-6-306329, JP-A-6-299118, JP-A-9-31333 Examples thereof include those described in Kaihei 5-345826 and JP-A-4-63833.
- the polysilazane compound perhydropolysilazane in which Rx, Ry, and Rz are all hydrogen atoms is preferable from the viewpoint of easy availability and the ability to form an ion-implanted layer having excellent gas barrier properties.
- a polysilazane compound a commercially available product as a glass coating material or the like can be used as it is.
- the polysilazane compounds can be used alone or in combination of two or more.
- the polysilazane layer may contain other components in addition to the above-described polysilazane compound as long as the object of the present invention is not impaired.
- examples of other components include a curing agent, an anti-aging agent, a light stabilizer, and a flame retardant.
- the content of the polysilazane compound in the polysilazane layer is preferably 50% by mass or more and more preferably 70% by mass or more because a gas barrier layer having more excellent gas barrier properties can be obtained.
- the thickness of the polysilazane layer is not particularly limited, but is usually 170 nm to 10 ⁇ m, preferably 170 to 500 nm, more preferably 170 to 400 nm. In the present invention, even if the polysilazane layer is nano-order, a gas barrier laminate having a sufficient gas barrier property can be obtained.
- the method for forming the polysilazane layer is not particularly limited.
- a solution for forming a polysilazane layer containing at least one polysilazane compound, optionally other components, a solvent, etc. is prepared, and then this polysilazane layer forming solution is applied by a known method.
- a dried polysilazane layer can be formed by drying the coated film.
- Solvents used for the polysilazane layer forming solution include aromatic hydrocarbon solvents such as benzene and toluene; ester solvents such as ethyl acetate and butyl acetate; ketone solvents such as acetone, methyl ethyl ketone, and methyl isobutyl ketone; n-pentane And aliphatic hydrocarbon solvents such as n-hexane and n-heptane; and alicyclic hydrocarbon solvents such as cyclopentane and cyclohexane. These solvents can be used alone or in combination of two or more.
- the coating method of the polysilazane layer forming solution includes a bar coating method, a spin coating method, a dipping method, a roll coating method, a gravure coating method, a knife coating method, an air knife coating method, a roll knife coating method, a die coating method, and a screen printing method. , Spray coating method, gravure offset method and the like.
- drying the formed coating film As a method for drying the formed coating film, conventionally known drying methods such as hot air drying, hot roll drying, and infrared irradiation can be employed.
- the heating temperature is usually in the range of 60 to 130 ° C.
- the heating time is usually several seconds to several tens of minutes.
- the modification treatment for the polysilazane layer examples include ion implantation treatment, plasma treatment, ultraviolet irradiation treatment, and heat treatment.
- the ion implantation process is a method of modifying the polysilazane layer by implanting ions into the polysilazane layer, as will be described later.
- the plasma treatment is a method for modifying the polysilazane layer by exposing the polysilazane layer to plasma.
- plasma treatment can be performed according to the method described in Japanese Patent Application Laid-Open No. 2012-106421.
- the ultraviolet irradiation treatment is a method for modifying the polysilazane layer by irradiating the polysilazane layer with ultraviolet rays.
- the ultraviolet modification treatment can be performed according to the method described in JP2013-226757A.
- the ion implantation treatment is preferable because the gas barrier layer (2) can be efficiently reformed to the inside without roughening the surface of the polysilazane layer and more excellent in gas barrier properties.
- ions to be injected into the polysilazane layer ions of rare gases such as argon, helium, neon, krypton, and xenon; ions such as fluorocarbon, hydrogen, nitrogen, oxygen, carbon dioxide, chlorine, fluorine, and sulfur; methane, ethane, and the like Ions of alkane gases; ions of alkenes such as ethylene and propylene; ions of alkadiene gases such as pentadiene and butadiene; ions of alkyne gases such as acetylene; aromatic hydrocarbons such as benzene and toluene Ions of a system gas; ions of a cycloalkane gas such as cyclopropane; ions of a cycloalkene gas such as cyclopentene; a metal ion; an ion of an organosilicon compound; These ions can be used alone or in combination of two or more. Among these, ions of rare gases such
- the ion implantation amount can be appropriately determined according to the purpose of use of the gas barrier laminate (necessary gas barrier properties, transparency, etc.).
- Examples of the method of implanting ions include a method of irradiating ions accelerated by an electric field (ion beam), a method of implanting ions in plasma, and the like. Among them, the latter method of implanting plasma ions is preferable because the target gas barrier layer (2) can be easily formed.
- plasma is generated in an atmosphere containing a plasma generating gas such as a rare gas, and a negative high voltage pulse is applied to the polysilazane layer, whereby ions (positive ions) in the plasma are converted into polysilazane. It can be performed by injecting into the surface of the layer.
- a plasma generating gas such as a rare gas
- Plasma ion implantation can be performed using a known plasma ion implantation apparatus.
- the pressure at the time of ion implantation pressure at the time of plasma ion implantation
- the pressure at the time of ion implantation is usually 0.01 to 5 Pa, preferably 0.01 to 1 Pa.
- a uniform ion implantation layer can be formed easily and efficiently, and the gas barrier layer (2) having both transparency and gas barrier properties can be efficiently formed. can do.
- the pulse width is preferably 1 to 15 ⁇ sec. When the pulse width is in such a range, the transparent and uniform gas barrier layer (2) can be more easily and efficiently formed.
- the negative pulsed high voltage applied to the polysilazane layer is ⁇ 100 kV to ⁇ 100 V, preferably ⁇ 50 kV to ⁇ 1 kV.
- the applied voltage when generating plasma is preferably ⁇ It is 1 kV to -50 kV, more preferably -1 kV to -30 kV, and particularly preferably -5 kV to -20 kV. If ion implantation is performed at an applied voltage greater than ⁇ 1 kV, the ion implantation amount (dose amount) becomes insufficient, and the desired performance may not be obtained. On the other hand, if ion implantation is performed at a value smaller than ⁇ 50 kV, the laminate is charged at the time of ion implantation, and problems such as coloring of the laminate occur.
- the thickness of the region into which ions are implanted can be controlled by implantation conditions such as the type of ion, applied voltage, and processing time, and is determined according to the thickness of the polysilazane layer and the purpose of use of the laminate. Usually, it is 10 to 1000 nm, preferably 10 to 400 nm.
- the gas barrier laminate of the present invention comprises the base material and the gas barrier unit provided on the base material directly or via another layer.
- the gas barrier laminate of the present invention may have a layer other than the base material and the gas barrier unit.
- Examples of the layer other than the base material and the gas barrier unit include a primer layer, a conductor layer, a shock absorbing layer, an adhesive layer, a hard coat layer, and a process sheet.
- the process sheet has a role of protecting the gas barrier laminate when storing or transporting the gas barrier laminate, and is peeled off when the gas barrier laminate is used.
- the layer structure of the gas barrier laminate of the present invention examples include, but are not limited to, the following.
- the gas barrier unit is represented as “gas barrier layer (1) / gas barrier layer (2)”.
- the thickness of the gas barrier laminate of the present invention is not particularly limited, but is preferably 1 to 1000 ⁇ m, more preferably 10 to 500 ⁇ m, and still more preferably 40 to 100 ⁇ m.
- the gas barrier layered product of the present invention the temperature 40 ° C., water vapor permeability at 90% relative humidity, preferably 0.100g / (m 2 ⁇ day) or less, more preferably 0.050g / (m 2 ⁇ day) Hereinafter, it is more preferably 0.030 g / (m 2 ⁇ day) or less. There is no particular lower limit, and the lower the better, the better, but it is usually 0.001 g / (m 2 ⁇ day) or more.
- the water vapor transmission rate can be measured by the method described in the examples.
- the b * value in the CIE L * a * b * color system defined by JIS Z 8729-1994 of the gas barrier laminate of the present invention is preferably ⁇ 1.0 to 1.0, more preferably -0.8 to 0.8.
- the b * value represents the degree of yellow and blue when the color is digitized. If the b * value is positive, it is yellowish, and if it is negative, it is bluish. When the b * value is in the above range, the gas barrier laminate exhibits a hue that is more intermediate between yellow and blue.
- the b * value can be efficiently within the range of -1.0 to 1.0 by changing the thickness of the gas barrier unit or the optical thickness of the gas barrier layer.
- the gas barrier laminate of the present invention is excellent in gas barrier properties and excellent in colorless transparency, it is suitably used as a member for electronic devices.
- the electronic device member of the present invention comprises the gas barrier laminate of the present invention. Therefore, since the electronic device member of the present invention has excellent gas barrier properties, it is possible to prevent deterioration of the element due to gas such as water vapor. Moreover, since it is excellent in colorless transparency, it is suitable as a display member such as a liquid crystal display or an EL display.
- the electronic device of the present invention includes the electronic device member of the present invention. Specific examples include a liquid crystal display, an organic EL display, an inorganic EL display, electronic paper, and a solar battery. Since the electronic device of the present invention includes the electronic device member comprising the gas barrier laminate of the present invention, it has excellent gas barrier properties.
- the refractive index and film thickness of the gas barrier layer (1) and gas barrier layer (2) were determined by “Spectroscopic Ellipso” manufactured by JA Woollam Japan. It was measured using a “Meter 2000U”. The measurement was performed at 23 ° C. using light having a wavelength of 590 nm.
- X-ray source Cu-K ⁇ 1 (wavelength: 1.54059 mm)
- Optical system Parallel beam optical system
- Incident side slit system Ge (220) 2 crystal, height limiting slit 5 mm, incident slit 0.05 mm
- Light receiving side slit system light receiving slit 0.10 mm, solar slit 5 °
- Detector Scintillation counter
- Tube voltage / tube current 45kV-200mA
- Scanning axis 2 ⁇ / ⁇
- Scan mode Continuous scan Scan range: 0.1-3.0 deg. Scanning speed: 1 deg. / Min.
- Example 1 Perhydropolysilazane (manufactured by AZ Electronic Materials, “NL-110”) is applied to the non-contact surface of a polyethylene terephthalate (PET) film (Toyobo, “Cosmo Shine A-4100”) having a thickness of 50 ⁇ m. And a polysilazane layer was formed by heating and curing at 120 ° C. for 2 minutes. The film thickness of the polysilazane layer was 200 nm.
- PET polyethylene terephthalate
- Plasma generation gas Argon gas flow rate: 100 sccm RF output: 1000W RF frequency: 1000Hz RF pulse width: 50 ⁇ sec RF delay: 25nsec DC voltage: -6kV DC frequency: 1000Hz DC pulse width: 5 ⁇ sec DC delay: 50 ⁇ sec Duty ratio: 0.5% Processing time: 200 sec
- Example 2 In Example 1, a gas barrier film was obtained in the same manner as in Example 1 except that the thickness of the polysilazane layer was changed to 250 nm, and various measurements were performed. The measurement results are shown in Table 1.
- Example 3 In Example 1, a gas barrier film was obtained in the same manner as in Example 1 except that the thickness of the polysilazane layer was changed to 200 nm and the DC voltage was changed to -10 kV, and various measurements were performed. The measurement results are shown in Table 1.
- Example 4 In Example 1, a gas barrier film was obtained in the same manner as in Example 1 except that the thickness of the polysilazane layer was changed to 250 nm and the DC voltage was changed to ⁇ 10 kV, and various measurements were performed. The measurement results are shown in Table 1.
- Example 5 A gas barrier film was obtained in the same manner as in Example 1 except that the thickness of the polysilazane layer was changed to 200 nm and the DC voltage was changed to ⁇ 15 kV in Example 1, and various measurements were performed. The measurement results are shown in Table 1.
- Example 6 In Example 1, a gas barrier film was obtained in the same manner as in Example 1 except that the thickness of the polysilazane layer was changed to 250 nm and the DC voltage was changed to ⁇ 15 kV, and various measurements were performed. The measurement results are shown in Table 1.
- Example 1 a gas barrier film was obtained in the same manner as in Example 1 except that the thickness of the polysilazane layer was changed to 130 nm and the DC voltage was changed to -10 kV, and various measurements were performed. The measurement results are shown in Table 1.
- Comparative Example 2 A gas barrier film was obtained in the same manner as in Comparative Example 1 except that the DC voltage was changed to ⁇ 15 kV in Comparative Example 1, and various measurements were performed. The measurement results are shown in Table 1.
- the gas barrier films obtained in Examples 1 to 6 have a gas barrier unit thickness of 170 nm or more and are not yellowish. Further, when these gas barrier films are compared, it can be seen that the gas barrier property is improved as the value of the applied voltage increases. On the other hand, in the gas barrier films obtained in Comparative Examples 1 and 2, the thickness of the gas barrier unit is less than 170 nm and the b * value exceeds 1.0.
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Abstract
Description
ガスバリア層の形成方法としては、ポリシラザン系化合物を含有する層の表面を改質する方法が知られている。
また、本発明者らの検討によれば、イオンを注入するときの印加電圧を高くすることで、よりガスバリア性に優れるガスバリア層を形成することができることが分かった。
しかしながら、そのようなガスバリア層を有するガスバリアフィルムは黄みを帯びる傾向があった。
〔1〕基材と、ガスバリア性ユニットとを有し、前記ガスバリア性ユニットが、前記基材側に配置されてなるガスバリア層(1)と、前記ガスバリア層(1)の基材側とは反対側の面側に配置されてなるガスバリア層(2)とからなるものであり、かつ、前記ガスバリア性ユニットの厚みが、170nmから10μmであることを特徴とするガスバリア性積層体。
〔2〕前記ガスバリア層(1)の屈折率が1.40~1.50であり、前記ガスバリア層(2)の屈折率が1.50~1.75であり、[ガスバリア層(1)の光学膜厚]/[ガスバリア層(2)の光学膜厚]が3.0以上であることを特徴とする〔1〕に記載のガスバリア性積層体。
〔3〕前記ガスバリア層(2)の膜密度が2.5~4.5g/cm3である〔2〕に記載のガスバリア性積層体。
〔4〕前記ガスバリア層(1)及び前記ガスバリア層(2)が、ポリシラザン系化合物を含有する材料を用いて形成されたものである、〔1〕に記載のガスバリア性積層体。
〔5〕前記ガスバリア層(2)が、基材上に、直接又はその他の層を介して設けられた、ポリシラザン系化合物を含有する層の表面に改質処理を施すことにより改質された部分である、〔4〕に記載のガスバリア性積層体。
〔6〕前記〔1〕~〔5〕のいずれかに記載のガスバリア性積層体からなる電子デバイス用部材。
〔7〕前記〔6〕に記載の電子デバイス用部材を備える電子デバイス。
本発明のガスバリア性積層体は、基材と、ガスバリア性ユニットとを有し、前記ガスバリア性ユニットが、前記基材側に配置されてなるガスバリア層(1)と、前記ガスバリア層(1)の基材側とは反対側の面側に配置されてなるガスバリア層(2)とからなるものであり、かつ、前記ガスバリア性ユニットの厚みが、170nmから10μmであることを特徴とする。
本発明のガスバリア性積層体を構成する基材は、透明性に優れ、かつ、ガスバリア性積層体の基材として十分な強度を有するものであれば特に制限されない。
樹脂フィルムの樹脂成分としては、ポリイミド、ポリアミド、ポリアミドイミド、ポリフェニレンエーテル、ポリエーテルケトン、ポリエーテルエーテルケトン、ポリオレフィン、ポリエステル、ポリカーボネート、ポリスルフォン、ポリエーテルスルフォン、ポリフェニレンスルフィド、アクリル系樹脂、シクロオレフィン系ポリマー、芳香族系重合体等が挙げられる。
ポリアミドとしては、全芳香族ポリアミド、ナイロン6、ナイロン66、ナイロン共重合体等が挙げられる。
基材の380~780nmにおける光線透過率は、80%以上が好ましく、85%以上がより好ましい。
本発明のガスバリア性積層体を構成するガスバリア性ユニットは、基材上に、直接又はその他の層を介して設けられたものである。
前記ガスバリア性ユニットは、基材側に配置されてなるガスバリア層(1)と、前記ガスバリア層(1)の基材側とは反対側の面側に配置されてなるガスバリア層(2)とからなる。
前記ガスバリア性ユニットは、ガスバリア層(1)とガスバリア層(2)とが隣接して配置してなるものであってもよいし、ガスバリア層(1)とガスバリア層(2)とが他の層(プライマー層等)を挟んで配置されてなるものであってもよい。
なお、ガスバリア層の光学膜厚は、「ガスバリア層の屈折率×ガスバリア層の厚み」で算出される。
本発明においては、ガスバリア層単独のガスバリア性には注目していないため、ガスバリア性能の観点からガスバリア層を定義することはできない。しかしながら、その屈折率を基に、ガスバリア性能を推測することは可能である。通常、後述する構成成分を含み、屈折率が1.40以上の層は十分なガスバリア性を有するものであるといえる。
なお、本発明におけるガスバリア層(1)と(2)は、その構成成分や、屈折率等の物性値から区別され得るものである。
本発明において、屈折率とは、23℃で測定した、波長が590nmの光の屈折率をいう。
ガスバリア層(1)の厚みは特に限定されないが、好ましくは169nmから5μmであり、より好ましくは169~300nmである。
ガスバリア層(1)の膜密度は、好ましくは1.0~2.5g/cm3であり、より好ましくは1.5~2.0g/cm3である。
ガスバリア層(1)の膜密度が上記範囲内であることで、無色透明性や屈曲性により優れるガスバリア性積層体が得られ易くなる。
ガスバリア層(2)の厚みは特に限定されないが、好ましくは1nmから5μmであり、より好ましくは1~200nmであり、特に好ましくは1~100nmである。
無機化合物としては、酸化珪素、酸化アルミニウム、酸化マグネシウム、酸化亜鉛、酸化インジウム、酸化スズ等の無機酸化物;窒化珪素等の無機窒化物;炭化珪素等の無機炭化物;これらの複合体である、無機酸化窒化物、無機酸化炭化物、無機窒化炭化物、無機酸化窒化炭化物;等が挙げられる。
金属としては、アルミニウム、マグネシウム、亜鉛、スズ等が挙げられる。
高分子化合物としては高分子ケイ素化合物等が挙げられる。
ポリシラザン層の形成方法等の詳細については後述するが、その他の高分子ケイ素化合物層についても、同様の方法を利用して形成することができる。
無機化合物の蒸着膜や、金属の蒸着膜の原料としては、ガスバリア層の構成成分として先に示したものが挙げられる。これらは、1種単独で、あるいは2種以上を組み合わせて用いることができる。
これらの中では、ガスバリア性の観点から、無機酸化物、無機窒化物又は金属を原料とする無機蒸着膜が好ましく、さらに、透明性の観点から、無機酸化物又は無機窒化物を原料とする無機蒸着膜が好ましい。
これらの中でも、ポリシラザン系化合物としては、入手容易性、及び優れたガスバリア性を有するイオン注入層を形成できる観点から、Rx、Ry、Rzが全て水素原子であるペルヒドロポリシラザンが好ましい。
また、ポリシラザン系化合物としては、ガラスコーティング材等として市販されている市販品をそのまま使用することもできる。
ポリシラザン系化合物は、1種単独で、あるいは2種以上を組み合わせて用いることができる。
ポリシラザン層中のポリシラザン系化合物の含有量は、より優れたガスバリア性を有するガスバリア層が得られることから、50質量%以上が好ましく、70質量%以上がより好ましい。
本発明においては、ポリシラザン層がナノオーダーであっても、充分なガスバリア性を有するガスバリア性積層体を得ることができる。
これらの溶媒は、1種単独で、あるいは2種以上を組み合わせて用いることができる。
イオン注入処理は、後述するように、ポリシラザン層にイオンを注入して、ポリシラザン層を改質する方法である。
プラズマ処理は、ポリシラザン層をプラズマ中に晒して、ポリシラザン層を改質する方法である。例えば、特開2012-106421号公報に記載の方法に従って、プラズマ処理を行うことができる。
紫外線照射処理は、ポリシラザン層に紫外線を照射してポリシラザン層を改質する方法である。例えば、特開2013-226757号公報に記載の方法に従って、紫外線改質処理を行うことができる。
これらの中でも、ポリシラザン層の表面を荒らすことなく、その内部まで効率よく改質し、よりガスバリア性に優れるガスバリア層(2)を形成できることから、イオン注入処理が好ましい。
これらのイオンは、1種単独で、あるいは2種以上を組み合わせて用いることができる。
これらの中でも、より簡便にイオンを注入することができ、より優れたガスバリア性を有するガスバリア層(2)を形成できることから、アルゴン、ヘリウム、ネオン、クリプトン、キセノン等の希ガスのイオンが好ましい。
イオン注入する際の圧力(プラズマイオン注入時の圧力)は、通常0.01~5Pa、好ましくは0.01~1Paである。プラズマイオン注入時の圧力がこのような範囲にあるときに、簡便にかつ効率よく均一なイオン注入層を形成することができ、透明性、ガスバリア性を兼ね備えたガスバリア層(2)を効率よく形成することができる。
負の高電圧パルスを印加するとき、すなわちイオン注入するときのパルス幅は、1~15μsecであるのが好ましい。パルス幅がこのような範囲にあるときに、透明で均一なガスバリア層(2)をより簡便にかつ効率よく形成することができる。ポリシラザン層に負の高電圧印加する負のパルス状高電圧は、-100kV~-100V、好ましくは-50kV~-1kVである。パルス状高電圧がこのような範囲にあるときに、透明で均一なガスバリア層(2)をより簡便にかつ効率よく形成することができる
また、プラズマを発生させるときの印加電圧は、好ましくは-1kV~-50kV、より好ましくは-1kV~-30kV、特に好ましくは-5kV~-20kVである。印加電圧が-1kVより大きい値でイオン注入を行うと、イオン注入量(ドーズ量)が不十分となり、所望の性能が得られないおそれがある。一方、-50kVより小さい値でイオン注入を行うと、イオン注入時に積層体が帯電し、また積層体への着色等の不具合が生じ、好ましくない。
本発明のガスバリア性積層体は、前記基材と、この基材上に直接又はその他の層を介して設けられた、前記ガスバリア性ユニットとを有するものである。
本発明のガスバリア性積層体は、基材、ガスバリア性ユニット以外の層を有するものであってもよい。
基材、ガスバリア性ユニット以外の層としては、プライマー層、導電体層、衝撃吸収層、粘着剤層、ハードコート層、工程シート等が挙げられる。なお、工程シートは、ガスバリア性積層体を保存、運搬等する際に、ガスバリア性積層体を保護する役割を有し、ガスバリア性積層体が使用される際には剥離されるものである。
(i)基材/ガスバリア層(1)/ガスバリア層(2)
(ii)ハードコート層/基材/ガスバリア層(1)/ガスバリア層(2)
(iii)基材/プライマー層/ガスバリア層(1)/ガスバリア層(2)
(iv)ハードコート層/基材/プライマー層/ガスバリア層(1)/ガスバリア層(2)
水蒸気透過率は、実施例に記載の方法により測定することができる。
b*値は、色を数値化したときの、黄みと青みの程度を表すものである。b*値が正の値であれば、黄みを帯びていることを、負の値であれば、青みを帯びていることを表す。
b*値が上記範囲にあることで、そのガスバリア性積層体は、より黄と青の中間の色相を呈することになる。
b*値は、ガスバリア性ユニットの厚みやガスバリア層の光学膜厚を変えること等により、-1.0から1.0の範囲内に効率よく収めることができる。
本発明の電子デバイス用部材は、本発明のガスバリア性積層体からなることを特徴とする。従って、本発明の電子デバイス用部材は、優れたガスバリア性を有しているので、水蒸気等のガスによる素子の劣化を防ぐことができる。また、無色透明性に優れるので、液晶ディスプレイ、ELディスプレイ等のディスプレイ部材;等として好適である。
本発明の電子デバイスは、本発明のガスバリア性積層体からなる電子デバイス用部材を備えているので、優れたガスバリア性を有する。
各例中の部及び%は、特に断りのない限り、質量基準である。
実施例1~6及び比較例1、2で得られたガスバリアフィルムのL*a*b*表色系におけるb*値を、島津製作所社製、「UV-3600」を用いて測定した。b*値はJISZ8729にて規定される、色座標における指標である。
実施例1~6及び比較例1、2で得られたガスバリアフィルムの水蒸気透過率を、mocon社製、「AQUATRAN-1」を用いて測定した。測定は40℃、相対湿度90%雰囲気下で行った。
実施例1~6及び比較例1、2で得られたガスバリアフィルムについて、ガスバリア層(1)、ガスバリア層(2)の屈折率および膜厚をジェー・エー・ウーラム・ジャパン社製、「分光エリプソメトリー2000U」を用いて測定した。測定は、波長が590nmの光を用いて、23℃で行った。
薄膜評価用試料水平型X線回折装置(リガク社製、「SmartLab」)を用いて下記に示す測定条件にてX線の反射率を測定して全反射臨界角度θcを求め、その値からガスバリア層(2)の膜密度を算出した。
(測定条件)
X線源:Cu-Kα1(波長:1.54059Å)
光学系:並行ビーム光学系
入射側スリット系:Ge(220)2結晶、高さ制限スリット5mm、入射スリット0.05mm
受光側スリット系:受光スリット0.10mm、ソーラースリット5°
検出器:シンチレーションカウンター
管電圧・管電流:45kV-200mA
走査軸:2θ/θ
走査モード:連続スキャン
走査範囲:0.1-3.0deg.
走査速度:1deg./min.
サンプリング間隔:0.002°/step
なお、原子数比は、X線光電子分光測定により得られたガスバリア層の表層部における酸素原子、窒素原子及びケイ素原子の存在割合を用いた。
厚みが50μmのポリエチレンテレフタレート(PET)フィルム(東洋紡社製、「コスモシャインA-4100」)の非易接面に、ペルヒドロポリシラザン(AZエレクトロニックマテリアルズ社製、「NL-110」)を、塗工し、これを120℃で2分間加熱硬化させることでポリシラザン層を形成した。ポリシラザン層の膜厚は200nmとした。
次いで、プラズマイオン注入装置を用いて、上記のポリシラザン層に下記条件にてプラズマイオン注入を行い、ポリシラザン層の表面を改質し、ガスバリアフィルム(基材と、基材上に直接設けられたガスバリア性ユニットとを有するガスバリア性積層体)を得た。このガスバリアフィルムについて各種測定を行った。測定結果を第1表に示す。
チャンバー内圧:0.2Pa
プラズマ生成ガス:アルゴン
ガス流量:100sccm
RF出力:1000W
RF周波数:1000Hz
RFパルス幅:50μsec
RF delay:25nsec
DC電圧:-6kV
DC周波数:1000Hz
DCパルス幅:5μsec
DC delay:50μsec
Duty比:0.5%
処理時間:200sec
実施例1において、ポリシラザン層の膜厚を250nmに変更したことを除き、実施例1と同様にしてガスバリアフィルムを得、各種測定を行った。測定結果を第1表に示す。
実施例1において、ポリシラザン層の膜厚を200nmに、DC電圧を-10kVに変更したことを除き、実施例1と同様にしてガスバリアフィルムを得、各種測定を行った。測定結果を第1表に示す。
実施例1において、ポリシラザン層の膜厚を250nmに、DC電圧を-10kVに変更したことを除き、実施例1と同様にしてガスバリアフィルムを得、各種測定を行った。測定結果を第1表に示す。
実施例1において、ポリシラザン層の膜厚を200nmに、DC電圧を-15kVに変更したことを除き、実施例1と同様にしてガスバリアフィルムを得、各種測定を行った。測定結果を第1表に示す。
実施例1において、ポリシラザン層の膜厚を250nmに、DC電圧を-15kVに変更したことを除き、実施例1と同様にしてガスバリアフィルムを得、各種測定を行った。測定結果を第1表に示す。
実施例1において、ポリシラザン層の膜厚を130nmに、DC電圧を-10kVに変更したことを除き、実施例1と同様にしてガスバリアフィルムを得、各種測定を行った。測定結果を第1表に示す。
比較例1において、DC電圧を-15kVに変更したことを除き、比較例1と同様にしてガスバリアフィルムを得、各種測定を行った。測定結果を第1表に示す。
実施例1~6で得られたガスバリアフィルムは、ガスバリア性ユニットの厚みが170nm以上であり、黄みを帯びていない。また、これらのガスバリアフィルムを比べると、印加電圧の値が増大するに従い、ガスバリア性が向上していることが分かる。
一方、比較例1、2で得られたガスバリアフィルムは、ガスバリア性ユニットの厚みが170nm未満であり、b*値が1.0を超えている。
Claims (7)
- 基材と、ガスバリア性ユニットとを有し、
前記ガスバリア性ユニットが、前記基材側に配置されてなるガスバリア層(1)と、前記ガスバリア層(1)の基材側とは反対側の面側に配置されてなるガスバリア層(2)とからなるものであり、かつ、
前記ガスバリア性ユニットの厚みが、170nmから10μmであること
を特徴とするガスバリア性積層体。 - 前記ガスバリア層(1)の屈折率が1.40~1.50であり、前記ガスバリア層(2)の屈折率が1.50~1.75であり、[ガスバリア層(1)の光学膜厚]/[ガスバリア層(2)の光学膜厚]が3.0以上であることを特徴とする請求項1に記載のガスバリア性積層体。
- 前記ガスバリア層(2)の膜密度が2.5~4.5g/cm3である請求項2に記載のガスバリア性積層体。
- 前記ガスバリア層(1)及び前記ガスバリア層(2)が、ポリシラザン系化合物を含有する材料を用いて形成されたものである、請求項1に記載のガスバリア性積層体。
- 前記ガスバリア層(2)が、基材上に、直接又はその他の層を介して設けられた、ポリシラザン系化合物を含有する層の表面に改質処理を施すことにより改質された部分である、請求項4に記載のガスバリア性積層体。
- 請求項1~5のいずれかに記載のガスバリア性積層体からなる電子デバイス用部材。
- 請求項6に記載の電子デバイス用部材を備える電子デバイス。
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CN201680019724.8A CN107405867A (zh) | 2015-03-30 | 2016-03-23 | 阻气性层合体、电子器件用部件及电子器件 |
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WO2013035432A1 (ja) * | 2011-09-08 | 2013-03-14 | リンテック株式会社 | 変性ポリシラザンフィルム、および、ガスバリアフィルムの製造方法 |
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WO2013035432A1 (ja) * | 2011-09-08 | 2013-03-14 | リンテック株式会社 | 変性ポリシラザンフィルム、および、ガスバリアフィルムの製造方法 |
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