WO2016155340A1 - 用于检测扬声器振动位移的结构和声电互转的双效装置 - Google Patents

用于检测扬声器振动位移的结构和声电互转的双效装置 Download PDF

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Publication number
WO2016155340A1
WO2016155340A1 PCT/CN2015/095680 CN2015095680W WO2016155340A1 WO 2016155340 A1 WO2016155340 A1 WO 2016155340A1 CN 2015095680 W CN2015095680 W CN 2015095680W WO 2016155340 A1 WO2016155340 A1 WO 2016155340A1
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WIPO (PCT)
Prior art keywords
diaphragm
layer
metal layer
vibration system
structure according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/095680
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English (en)
French (fr)
Inventor
邵明辉
杨健斌
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Goertek Inc
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Goertek Inc
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Filing date
Publication date
Priority claimed from CN201510149780.0A external-priority patent/CN104780489B/zh
Priority claimed from CN201520763528.4U external-priority patent/CN204948356U/zh
Application filed by Goertek Inc filed Critical Goertek Inc
Priority to US15/551,262 priority Critical patent/US10264360B2/en
Publication of WO2016155340A1 publication Critical patent/WO2016155340A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/06—Plane diaphragms comprising a plurality of sections or layers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R29/00—Monitoring arrangements; Testing arrangements
    • H04R29/001—Monitoring arrangements; Testing arrangements for loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/013—Electrostatic transducers characterised by the use of electrets for loudspeakers

Definitions

  • the present invention relates to a structure for detecting vibration displacement of a speaker and a double effect device for mutual resonance of sound and electricity.
  • the current solution is to use the intelligent power amplifier control unit to control the power of the speaker product, and to "calculate" the speaker vibration system based on the input information (such as voltage) and monitored information (such as current) and the physical parameters of the speaker.
  • the actual displacement reduces the power of the speaker product when the actual displacement exceeds a predetermined level.
  • a structure for detecting a vibration displacement of a speaker comprising: a vibration system having a movable plate; a magnetic circuit system; disposed under the vibration system and movable a fixed plate opposite to the plate, the movable plate and the fixed plate group Into a capacitor.
  • the vibration system comprises a diaphragm and a voice coil located below the diaphragm, the diaphragm comprising an electret layer and a metal layer attached to the electret layer, the electret layer and the metal layer
  • the movable plate is composed.
  • the diaphragm further comprises a plastic film layer compounded with the movable plate, the plastic film layer being a single layer film or a multilayer composite film.
  • the vibration system includes a diaphragm and a voice coil located below the diaphragm, the diaphragm includes a diaphragm body portion and a reinforcing portion, and the diaphragm body portion includes a flat portion at the center and is located at an edge of the plane portion a folding portion and a fixing portion located at the outermost periphery, the reinforcing portion being disposed above the planar portion; the diaphragm body portion including an electret layer and a metal layer attached to the electret layer The electret layer and the metal layer constitute the movable plate.
  • the diaphragm body portion further comprises a plastic film layer compounded with the movable plate, the plastic film layer being a single layer film or a multilayer composite film.
  • the electret layer covers the entire area of the diaphragm body portion or covers only the area of the plane portion.
  • the metal layer covers the entire area of the diaphragm body portion; or the metal layer includes a first area that completely covers the plane portion, a second area that covers the fixed portion, and a partial coverage. a third region of the folded portion, wherein the third region communicates with the first region and the second region.
  • the metal layer is located at an uppermost layer of the diaphragm body portion, wherein an electrical connection is disposed on the metal layer above the fixing portion.
  • the electrical connector is a metal connector or a conductive paste coated on the metal layer.
  • the layer of heat-insulating material covering the entire area of the diaphragm near a side of the voice coil or covering only the The area where the diaphragm is connected to the voice coil.
  • the magnetic circuit system is located below the vibration system, the magnetic circuit system includes a washer, and the washer is the fixed plate.
  • the magnetic circuit system further includes a magnet and a basin frame located below the washer, The washer, the magnet, and the basin are provided with openings at a central location.
  • the material of the electret layer comprises any one or combination of the following: polytetrafluoroethylene, polyvinylidene fluoride, polyvinylidene fluoride, polyethylene, polypropylene, polyetherimide, polyethylene terephthalate Methyl ester.
  • the vibration system includes a diaphragm and a voice coil located below the diaphragm, the magnetic circuit system is located below the vibration system, the magnetic circuit system includes a washer and a magnet; and the movable plate is attached On the diaphragm, an upper surface of the washer is provided with an electret film, and the electret film is a fixed plate.
  • the movable plate is a metal layer or a flexible circuit board layer with a metal layer in between; the metal layer or a flexible circuit board layer with a metal layer in between is attached above or below the diaphragm.
  • a double-effect device for acoustic-electrical interconversion comprising the structure as described above, and an impedance transformer coupled to the capacitor, the impedance converter including a field effect transistor and diode.
  • the inventors of the present invention have found that there is no technical solution in the prior art for detecting the actual displacement of the vibration system by detecting a change in capacitance. Therefore, such a solution to the problem is never thought of or expected by those skilled in the art. As a result, the present invention is a new technical solution.
  • the invention designs a capacitor structure for detecting the actual displacement of the vibration system, and the movable plate of the capacitor is arranged on the vibration system, the fixed plate is arranged under the vibration system and the position is fixed, and the change of the capacitance is detected when the vibration system vibrates.
  • the actual displacement of the vibration system can be calculated so that the power of the loudspeaker unit can be reduced when the actual displacement of the vibration system exceeds a safety threshold.
  • real-time detection of the displacement of each speaker product can be realized at the electronic device system side.
  • Figure 1 is a schematic illustration of an embodiment of a first implementation of the structure of the present invention for detecting vibration displacement of a loudspeaker.
  • FIG. 2 is a schematic structural view of a first embodiment of a diaphragm body portion of a first implementation of the structure for detecting a vibration displacement of a speaker of the present invention.
  • Fig. 3 is a view showing the configuration of a second embodiment of the diaphragm body portion of the first embodiment of the structure for detecting the vibration displacement of the speaker of the present invention.
  • Fig. 4 is a view showing the configuration of a third embodiment of the diaphragm body portion of the first embodiment of the structure for detecting the vibration displacement of the speaker of the present invention.
  • Fig. 5 is a view showing the configuration of a fourth embodiment of the diaphragm body portion of the first embodiment of the structure for detecting the vibration displacement of the speaker of the present invention.
  • Figure 6 is a schematic view showing the structure of a first embodiment of the addition of a heat-insulating material layer of the first embodiment of the structure for detecting the vibration displacement of the speaker of the present invention.
  • Figure 7 is a schematic view showing the structure of a second embodiment of the addition of the heat-insulating material layer of the first embodiment of the structure for detecting the vibration displacement of the speaker of the present invention.
  • Figure 8 is a schematic illustration of a first embodiment of a second implementation of the structure of the present invention for detecting vibration displacement of a loudspeaker.
  • Figure 9 is a schematic illustration of a second embodiment of a second implementation of the structure of the present invention for detecting vibration displacement of a loudspeaker.
  • Figure 10 is a schematic view showing the structure of a flexible wiring board layer with a metal layer in the middle of the embodiment of Figure 9.
  • the invention designs a capacitor structure for detecting the actual vibration displacement of the vibration system of the speaker.
  • the capacitor is composed of a movable plate and a fixed plate opposite to the movable plate, wherein the movable plate is a part of the vibration system with the vibration system Vibrating together, the fixed plate is placed under the vibration system and fixed relative to the outer casing of the speaker.
  • the vibration system vibrates, the movable plate vibrates, and the distance between the two plates changes to cause the capacitance to change.
  • Directly monitoring the value change of the capacitor or indirectly monitoring the current change of the circuit connected to the capacitor can calculate the vibration. The actual displacement of the system.
  • the invention can be connected to the capacitor by using an intelligent power amplifier control unit to monitor the actual displacement of the vibration system and reduce the input power of the speaker when needed, to protect the speaker from being too distorted or physically damaged.
  • the vibration system of the speaker includes a diaphragm and a voice coil located below the diaphragm, and the present invention can utilize
  • the diaphragm forms a movable plate.
  • the diaphragm should include at least an electret layer and a metal layer attached to the electret layer, and the electret layer and the metal layer constitute the movable plate.
  • the voice coil drives the diaphragm to vibrate, and the vibration of the diaphragm causes the capacitance of the movable plate and the fixed plate to change, due to the stability of the electret layer.
  • the charge can be calculated by monitoring the change value of the capacitor, and the actual displacement of the vibration system can be calculated by indirectly monitoring the current change of the circuit connected to the capacitor.
  • the vibration system of the speaker includes a diaphragm 1 and a voice coil 2 located below the diaphragm 1, and the diaphragm 1 includes a diaphragm body portion and a reinforcing portion (not shown), and the diaphragm body portion includes The flat portion 11 located in the middle, the folded portion 12 at the edge of the flat portion 11, and the fixed portion 13 at the outermost periphery for fixing the diaphragm in the speaker device.
  • the reinforcing portion is provided above the flat portion 11.
  • the magnetic circuit system of the speaker is located below the vibration system, including the washer 3, the magnet 4 and the basin frame 5 from top to bottom.
  • the diaphragm body portion should at least include an electret layer and a metal layer attached to the electret layer, and the electret plate is formed by the electret layer and the metal layer.
  • the diaphragm body portion can also It includes a conventional plastic film layer (single layer film or multilayer composite film).
  • the material of the electret layer may include any one or combination of the following: polytetrafluoroethylene, polyvinylidene fluoride, polyvinylidene fluoride, polyethylene, polypropylene, polyetherimide, polyethylene terephthalate. .
  • the washer 3 is fixed as a fixed plate, and in order to maintain the pressure between the diaphragm 1 and the washer 3, an internal magnetic gap 9 exists between the diaphragm 1 and the washer 3, Further, the opening process can be performed at the center of the inner magnetic circuit, specifically, the opening 7 provided at the center position of the washer 3, the magnet 4, and the basin frame 5. Since the magnet 4 and the basin frame 5 are both electrically conductive, the fixed plate and the external circuit can be connected from the bottom of the basin frame 5. It is of course also possible to design the fixed plate to be fixed independently.
  • the diaphragm body portion includes an electret layer 101 and a metal layer 102 attached to the electret layer 101, and a metal layer. 102 is located above the electret layer 101.
  • the electret layer 101 and the metal layer 102 constitute a movable plate of the capacitor, and the electret layer 101 can be formed by polarization of the electret material, and the electret layer 101 and the metal layer 102 both cover the diaphragm body. The entire area of the department.
  • the diaphragm body portion may further comprise a conventional plastic film layer (Single-layer film or multilayer composite film), that is, an electret layer and a metal layer attached to the electret layer are formed on the upper or lower surface of a conventional plastic film layer.
  • a conventional plastic film layer Single-layer film or multilayer composite film
  • the diaphragm body portion includes a metal layer 102, an electret layer 101 and a plastic film layer 103 in order from top to bottom. Both the electret layer 101 and the metal layer 102 cover the entire area of the diaphragm body portion.
  • the metal layer 102 is located at the uppermost layer of the diaphragm body portion, wherein the metal layer 102 above the fixing portion 13 is provided with an electrical connection member, and the electrical connector may be a metal connector 6 (for example, a metal ring) or coated on a metal.
  • the conductive paste on layer 102, metal layer 102 can be grounded through an electrical connection or connected to an external circuit.
  • FIG. 4 a third embodiment of the diaphragm body portion of the first implementation of the present invention is shown, which differs from the second embodiment of FIG. 3 in that the electret layer 101 is oscillated as much as possible.
  • the influence of the compliantness of the folded portion 12 of the film 1 covers only the region of the flat portion 11 of the diaphragm 1 .
  • a fourth embodiment of the diaphragm body portion of the first implementation of the present invention is shown, which is different from the second embodiment of FIG. 3 in that the metal layer 102 is used to minimize the diaphragm 1
  • the metal layer 102 includes a first region 1021 covering all of the planar portion 11, a second region 1022 covering all of the fixed portion 13, and a third region 1023 partially covering the folded portion 12, The third area 1023 is connected to the first area 1021 and the second area 1022.
  • the present invention may further include a heat resistant material layer 104 disposed between the diaphragm 1 and the voice coil 2 to prevent direct transfer of heat of the voice coil 2 to the electret layer 101 under high power, resulting in degradation of the performance of the electret layer 101.
  • a heat resistant material layer 104 disposed between the diaphragm 1 and the voice coil 2 to prevent direct transfer of heat of the voice coil 2 to the electret layer 101 under high power, resulting in degradation of the performance of the electret layer 101.
  • Fig. 6 there is shown a first embodiment of the first embodiment of the present invention in which a layer of heat-insulating material 104 is added.
  • the layer of heat-insulating material 104 covers the entire area of the diaphragm 1 near the side of the voice coil 2.
  • FIG. 7 there is shown a second embodiment of the first embodiment of the present invention in which the heat-insulating material layer 104 is added, which is different from the first embodiment of FIG.
  • the heat-resistant material layer 104 is oscillated as much as possible.
  • the refractory effect of the folded portion 12 of the film 1 covers only the region where the diaphragm 1 is connected to the voice coil 2.
  • the thermal conductivity of the heat-insulating material layer 104 is not more than 10 W/(m*K), and the nano-composite material can be selected, and the thickness can be controlled at 1 to 100 nm.
  • the voice coil 2 when the energized voice coil 2 vibrates under the action of the magnetic circuit system, the voice coil 2 The vibration of the diaphragm 1 is caused, and the vibration of the diaphragm 1 causes the capacitance of the movable plate and the fixed plate to change. Since the electret layer 101 has a stable charge, by monitoring the change value of the capacitance, The actual displacement of the diaphragm 1 can be calculated.
  • the fixed electrode plate can be connected to the impedance converter through the bottom of the basin frame 5, and the impedance variator includes a field effect transistor 8 and a diode (in the figure) Not shown), the impedance changer is connected to the amplifier at the system side. Further, the amplifier can be connected to the intelligent power amplifier control unit for detecting a change in the capacitance of the capacitor and calculating the actual displacement of the vibration system to control the input power of the speaker device.
  • the speaker with the impedance converter has all the core components of the condenser microphone, it can also be used as a condenser microphone, so the present invention also provides a double-effect device for acoustic-electrical mutual conversion, including: having a movable plate a vibration system; a magnetic circuit system; a fixed plate disposed below the vibration system and opposite to the movable plate, the movable plate and the fixed plate forming a capacitance; and an impedance transformer connected to the capacitor, the impedance converter includes Field effect transistor 8 and diode.
  • the dual effect device can be used as a speaker or microphone.
  • the vibration system of the loudspeaker comprises a diaphragm and a voice coil 2 located below the diaphragm, the diaphragm comprising a plane in the middle
  • the portion 11, the folding portion 12 located at the edge of the flat portion 11, and the fixing portion 13 located at the outermost periphery, the fixing portion 13 is for fixing the diaphragm in the speaker device.
  • the magnetic circuit system of the speaker is located below the vibration system, including the washer 3, the magnet 4 and the basin frame 5 from top to bottom.
  • the upper surface of the washer 3 is provided with an electret film 300, and the electret film 300 is a fixed plate. In order to maintain the pressure equalization between the diaphragm and the washer 3, there is an internal magnetic gap 9 between the diaphragm and the washer 3.
  • the electret film 300 may be formed by polarization of an electret material that may cover the entire area of the upper surface of the washer 3 .
  • the material of the electret film 300 is any one or combination of the following: polytetrafluoroethylene material, polyvinylidene fluoride, polyvinylidene fluoride, polyethylene, polypropylene, polyetherimide, polyethylene terephthalate.
  • the material of the electret film 300 is preferably poly four Fluoroethylene material with charge after polarization.
  • the movable plate can be formed by using a diaphragm.
  • the movable plate in FIG. 8 is a metal layer 100.
  • the metal layer 100 is only attached to the plane portion 11 of the diaphragm, in order to minimize The effect of the small metal layer 100 on the compliance of the folded portion 12 of the diaphragm.
  • the metal layer 100 may also be attached to the upper portion of the diaphragm 13 at the same time.
  • the metal layer 100 may also be attached to the underside of the diaphragm.
  • the material of the diaphragm is preferably made of silicone or silicone rubber. Both materials can withstand a high temperature of 140 ° C to avoid degradation of product performance at higher temperatures.
  • the diaphragm may also include a conventional plastic film layer (single layer film or multilayer composite film).
  • the voice coil 2 drives the diaphragm to vibrate, and the vibration of the diaphragm causes the capacitance of the movable plate and the fixed plate to change, due to the electret
  • the bulk film 300 has a stable charge.
  • FIG. 9 A second embodiment of the second implementation of the structure for detecting the vibration displacement of the speaker of the present invention will be described with reference to FIG. 9.
  • the difference from the first embodiment of FIG. 8 is that the movable plate is arranged differently, and FIG. 9
  • the moving plate is a flexible circuit board layer 200 with a metal layer in the middle, and a flexible circuit board layer 200 with a metal layer in the middle is attached to the lower side of the diaphragm.
  • the flexible wiring board layer 200 with the metal layer in the middle includes a central portion 201, an annular portion 202 surrounding the central portion 201, and a connecting portion 203 connecting the central portion 201 and the annular portion 202, and a ring
  • the portion 202 covers the fixing portion 11 of the diaphragm
  • the center portion 201 covers the flat portion 11 of the diaphragm and extends below the folding portion 12.
  • the shape and arrangement of the metal layer 100 of the first embodiment may be the same as that of the flexible circuit board layer 200 with the metal layer in the middle of the second embodiment.
  • an electrical connection member 61 is disposed above the fixing portion 13 of the diaphragm, and the electrical connection member 61 may be a metal connecting member (for example, a metal ring) or other electrical connection structure, and a movable plate of the capacitor. It can be grounded or connected to an external circuit through the electrical connector 61. Since the magnet 4 and the basin frame 5 are both electrically conductive, the fixed plate can be connected to an external circuit through the bottom of the basin frame 5.
  • the impedance converter includes a field effect transistor 8 and a diode (not shown), and the impedance converter is connected to the amplifier at the system side. Further, the amplifier can be connected to the intelligent power amplifier control unit for detecting a change in the capacitance of the capacitor and calculating the actual displacement of the vibration system to control the input power of the speaker device.
  • the speaker with the impedance converter has all the core components of the condenser microphone, it can also be used as a condenser microphone, so the present invention also provides a double-effect device for acoustic-electrical mutual conversion, including: having a movable plate a vibration system; a magnetic circuit system; a fixed plate disposed below the vibration system and opposite to the movable plate, the movable plate and the fixed plate forming a capacitance; and an impedance transformer connected to the capacitor, the impedance converter includes Field effect transistor 8 and diode.
  • the dual effect device can be used as a speaker or microphone.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)

Abstract

本发明公开了用于检测扬声器振动位移的结构，包括：具有可动极板的振动系统；磁路系统；设置于振动系统之下并且与可动极板相对的固定极板，可动极板和固定极板组成电容。本发明还公开了声电互转的双效装置，还包括与所述电容连接的阻抗变换器，阻抗变换器包括场效应管和二极管。本发明将电容的可动极板设置在振动系统上，固定极板设置在振动系统之下并且位置固定，当振动系统振动时检测电容的变化即可计算出振动系统的实际位移，这样就可以在振动系统的实际位移超出安全阈值时降低扬声器装置的功率。对于采用这种扬声器结构的电子设备，可以在电子设备系统端实现对扬声器产品的振动系统的位移进行实时检测。

Description

用于检测扬声器振动位移的结构和声电互转的双效装置 技术领域
本发明涉及一种用于检测扬声器振动位移的结构和一种声电互转的双效装置。
背景技术
现有技术中，无论是对于微型扬声器还是大型喇叭，在工作于低频条件下时，限制产品最大功率应用的问题主要在于：
大功率下，工作于低频条件下的音圈产生过大的位移，而过大的位移会导致失真急剧升高，甚至出现明显的音圈与磁路系统的擦碰问题，这些都会造成产品系统的机械损伤。
对于这一问题，目前的解决方案是采用智能功放控制单元控制扬声器产品的功率，根据输入的信息(如电压)和监控的信息(如电流)以及扬声器的物理参数“推算”出扬声器振动系统的实际位移，在实际位移超出预定程度时降低扬声器产品的功率。
但是，智能功放控制单元对于实际位移的推算仍然是建在在假设的理论模型上进行的，这种理论模型与实际的产品仍然具有一定的差异。另外，对于批量生产的微型扬声器，扬声器的物理参数总是存在着一些偏差，不能做到100％的一致。上述原因就决定了智能功放控制单元对实际位移的推算很难做到精确实时反应每一个扬声器产品的真实位移。
发明内容
本发明的目的是提供一种检测扬声器装置振动位移的新技术方案。
根据本发明的第一方面，提供了一种用于检测扬声器振动位移的结构，包括：具有可动极板的振动系统；磁路系统；设置于所述振动系统之下并且与所述可动极板相对的固定极板，所述可动极板和所述固定极板组 成电容。
优选地，所述振动系统包括振膜和位于振膜下方的音圈，所述振膜包括驻极体层和依附于所述驻极体层的金属层，所述驻极体层和金属层组成所述可动极板。
优选地，所述振膜还包括与所述可动极板复合在一起的塑料薄膜层，所述塑料薄膜层为单层薄膜或多层复合薄膜。
优选地，所述振动系统包括振膜和位于振膜下方的音圈，所述振膜包括振膜本体部和补强部，所述振膜本体部包括位于中间的平面部、位于平面部边缘的折环部、以及位于最外围的固定部，所述补强部设置在所述平面部的上方；所述振膜本体部包括驻极体层和依附于所述驻极体层的金属层，所述驻极体层和金属层组成所述可动极板。
优选地，所述振膜本体部还包括与所述可动极板复合在一起的塑料薄膜层，所述塑料薄膜层为单层薄膜或多层复合薄膜。
优选地，所述驻极体层覆盖所述振膜本体部的全部区域，或者仅覆盖所述平面部的区域。
优选地，所述金属层覆盖所述振膜本体部的全部区域；或者，所述金属层包括全部覆盖所述平面部的第一区域、全部覆盖所述固定部的第二区域、以及部分覆盖所述折环部的第三区域，其中所述第三区域连通第一区域和第二区域。
优选地，所述金属层位于所述振膜本体部的最上层，其中所述固定部上方的金属层上设置有电连接件。
优选地，所述电连接件为金属连接件或者为涂布于所述金属层上的导电胶。
优选地，还包括设置于所述振膜和所述音圈之间的阻热材料层，所述阻热材料层覆盖所述振膜靠近所述音圈一侧的全部区域或者仅覆盖所述振膜与所述音圈连接的区域。
优选地，所述磁路系统位于所述振动系统的下方，所述磁路系统包括华司，所述华司为所述固定极板。
优选地，所述磁路系统还包括位于所述华司下方的磁铁和盆架，所述 华司、所述磁铁、以及所述盆架在中心位置处设置开孔。
优选地，所述驻极体层的材质包括下列任一或组合：聚四氟乙烯、聚二氟乙烯、聚偏氟乙烯、聚乙烯、聚丙烯、聚醚酰亚胺、聚乙烯对苯二甲酯。
优选地，所述振动系统包括振膜和位于振膜下方的音圈，所述磁路系统位于所述振动系统的下方，所述磁路系统包括华司和磁铁；所述可动极板附着于所述振膜上，所述华司的上表面设有驻极体薄膜，所述驻极体薄膜为固定极板。
优选地，所述可动极板为金属层或者中间带有金属层的柔性线路板层；所述金属层或者中间带有金属层的柔性线路板层附着于振膜的上方或者下方。
根据本发明的第二方面，提供了一种声电互转的双效装置，包括如前所述的结构，以及与所述电容连接的阻抗变换器，所述阻抗变换器包括场效应管和二极管。
本发明的发明人发现，在现有技术中还没有通过检测电容的变化来检测振动系统的实际位移的技术方案，因此，这种解决问题的方案是本领域技术人员从未想到的或者没有预期到的，故本发明是一种新的技术方案。
本发明设计了用于检测振动系统实际位移的电容结构，将电容的可动极板设置在振动系统上，固定极板设置在振动系统之下并且位置固定，当振动系统振动时检测电容的变化即可计算出振动系统的实际位移，这样就可以在振动系统的实际位移超出安全阈值时降低扬声器装置的功率。对于采用这种扬声器结构的电子设备，可以在电子设备系统端实现对每一只扬声器产品的位移进行实时检测。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例，并且连同其说明一起用于解释本发明的原理。
图1是本发明用于检测扬声器振动位移的结构的第一种实现方式的实施例的示意图。
图2是本发明用于检测扬声器振动位移的结构的第一种实现方式的振膜本体部的第一实施例的结构示意图。
图3是本发明用于检测扬声器振动位移的结构的第一种实现方式的振膜本体部的第二实施例的结构示意图。
图4是本发明用于检测扬声器振动位移的结构的第一种实现方式的振膜本体部的第三实施例的结构示意图。
图5是本发明用于检测扬声器振动位移的结构的第一种实现方式的振膜本体部的第四实施例的结构示意图。
图6是本发明用于检测扬声器振动位移的结构的第一种实现方式的添加阻热材料层的第一实施例的结构示意图。
图7是本发明用于检测扬声器振动位移的结构的第一种实现方式的添加阻热材料层的第二实施例的结构示意图。
图8是本发明用于检测扬声器振动位移的结构的第二种实现方式的第一实施例的示意图。
图9是本发明用于检测扬声器振动位移的结构的第二种实现方式的第二实施例的示意图。
图10是图9实施例的中间带有金属层的柔性线路板层的结构示意图。
附图标记说明
1振膜、2音圈、3华司、4磁铁、5盆架、61电连接件、6金属连接件、7开孔、8场效应管、9内磁间隙；11平面部、12折环部、13固定部；101驻极体层、102金属层、103塑料薄膜层、104阻热材料层；1021第一区域、1022第二区域、1023第三区域；100金属层、200中间带有金属层的柔性线路板层、300驻极体薄膜、201中心部、202环状部、203连接部。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、 数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
本发明设计了用于检测扬声器振动系统实际振动位移的电容结构，电容由可动极板和与可动极板相对的固定极板组成，其中，可动极板为振动系统的一部分随振动系统一起振动，固定极板设置于振动系统之下并且相对于扬声器的外壳位置固定。当振动系统振动时可动极板随之振动，两个极板的距离产生变化导致电容发生变化，直接监控该电容的数值变化或者间接监控与该电容相连的电路的电流变化即可计算出振动系统的实际位移。
在本发明的应用中，可以监控振动系统的实际位移是否超出预设的安全阈值，如果超出就降低扬声器的输入功率。也可以监控该电容的变化数值是否超出预设的安全阈值，如果超出就降低扬声器的输入功率。也可以监控与该电容相连的电路的电流变化是否超出预设的安全阈值，如果超出就降低扬声器的输入功率。
本发明可以利用智能功放控制单元与该电容相连，以监控振动系统的实际位移并在需要时减小扬声器的输入功率，保护扬声器不会过于失真或者受到物理损伤。
(一)参考图1-7介绍本发明的用于检测扬声器振动位移的结构的第一种实现方式：
扬声器的振动系统包括振膜和位于振膜下方的音圈，本发明可以利用 振膜形成可动极板，具体来说，振膜至少应当包括驻极体层和依附于驻极体层的金属层，由驻极体层和金属层构成可动极板。当通电的音圈在磁路系统的作用下振动时，音圈带动振膜振动，振膜的振动会导致可动极板和固定极板组成的电容发生变化，由于驻极体层带有稳定的电荷，通过监控该电容的变化数值就可以计算出振动系统的实际位移，也可以间接监控与该电容相连的电路的电流变化计算出振动系统的实际位移。
参考图1所示，扬声器的振动系统包括振膜1和位于振膜1下方的音圈2，振膜1包括振膜本体部和补强部(图中没有示出)，振膜本体部包括位于中间的平面部11、位于平面部11边缘的折环部12、以及位于最外围的固定部13，固定部13用于将振膜固定在扬声器装置中。补强部设置在平面部11的上方。扬声器的磁路系统位于振动系统的下方，从上至下依次包括华司3、磁铁4和盆架5。
振膜本体部至少应当包括驻极体层和依附于驻极体层的金属层，由驻极体层和金属层构成可动极板，为了改善振膜的弹性特性，振膜本体部还可以包括常规的塑料薄膜层(单层薄膜或多层复合薄膜)。其中，驻极体层的材质可以包括下列任一或组合：聚四氟乙烯、聚二氟乙烯、聚偏氟乙烯、聚乙烯、聚丙烯、聚醚酰亚胺、聚乙烯对苯二甲酯。
参考图1所示，采用华司3作为被固定住的固定极板，为了能够让振膜1与华司3之间保持均压，振膜1和华司3之间存在内磁间隙9，进一步的，可以在内磁路的中心做开孔处理，具体为华司3、磁铁4和盆架5的中心位置处设置的开孔7。由于磁铁4和盆架5均为导电体，可以从盆架5底部连接固定极板和外部电路。当然也可以独立的设计被固定住的固定极板。
其中参考图2所示是本发明第一种实现方式的振膜本体部的第一实施例，振膜本体部包括驻极体层101和依附于驻极体层101的金属层102，金属层102位于驻极体层101的上方。该驻极体层101和金属层102构成电容的可动极板，该驻极体层101可以由驻极体材料经过极化形成，该驻极体层101和金属层102均覆盖振膜本体部的全部区域。
为了改善振膜的弹性特性，振膜本体部还可以包括常规的塑料薄膜层 (单层薄膜或多层复合薄膜)，即在常规的塑料薄膜层的上表面或下表面涂布驻极体层和依附于驻极体层的金属层形成。
其中参考图3所示是本发明第一种实现方式的振膜本体部的第二实施例，振膜本体部从上至下依次包括金属层102、驻极体层101和塑料薄膜层103，驻极体层101和金属层102均覆盖振膜本体部的全部区域。其中，金属层102位于振膜本体部的最上层，其中固定部13上方的金属层102上设置有电连接件，电连接件可以为金属连接件6(例如金属环)或者为涂布于金属层102上的导电胶，金属层102可以通过电连接件接地或者连接至外部电路。
其中参考图4所示是本发明第一种实现方式的振膜本体部的第三实施例，和图3的第二实施例的不同之处在于，为了尽量减小驻极体层101对振膜1的折环部12的顺性的影响，驻极体层101仅覆盖振膜1的平面部11的区域。
其中参考图5所示是本发明第一种实现方式的振膜本体部的第四实施例，和图3的第二实施例的不同之处在于，为了尽量减小金属层102对振膜1的折环部12的顺性的影响，金属层102包括全部覆盖平面部11的第一区域1021、全部覆盖固定部13的第二区域1022、以及部分覆盖折环部12的第三区域1023，其中第三区域1023连通第一区域1021和第二区域1022。
本发明还可以包括设置于振膜1和音圈2之间的阻热材料层104，以避免大功率下音圈2的热量直接传递到驻极体层101，造成驻极体层101的性能下降。参考图6所示是本发明第一种实现方式添加阻热材料层104的第一实施例，阻热材料层104覆盖振膜1靠近音圈2一侧的全部区域。参考图7所示是本发明第一种实现方式添加阻热材料层104的第二实施例，和图6的第一实施例的不同之处在于，为了尽量减小阻热材料层104对振膜1的折环部12的顺性的影响，阻热材料层104仅覆盖振膜1与音圈2连接的区域。其中，阻热材料层104的导热系数不大于10W/(m*K)，可以选择纳米复合材料，厚度可以控制在1～100nm。
参考图1所示，当通电的音圈2在磁路系统的作用下振动时，音圈2 带动振膜1振动，振膜1的振动会导致可动极板和固定极板组成的电容的容值发生变化，由于驻极体层101带有稳定的电荷，通过监控该电容的变化数值就可以计算出振膜1的实际位移。
参考图1所示，由于磁铁4和盆架5均为导电体，固定极板可以通过盆架5的底部与阻抗变换器相连接，阻抗变化器包括一个场效应管8和一个二极管(图中没有示出)，阻抗变化器再与系统端的放大器相连接。进一步的，放大器可以与智能功放控制单元连接，智能功放控制单元用于检测该电容的容值的变化并计算出振动系统的实际位移以控制扬声器装置的输入功率。
由于具有了阻抗变换器的扬声器具备了电容麦克风的所有核心零部件，所以还可以作为电容麦克风使用，所以本发明还提供了一种声电互转的双效装置，包括：具有可动极板的振动系统；磁路系统；设置于振动系统之下并且与可动极板相对的固定极板，可动极板和固定极板组成电容；以及与电容连接的阻抗变换器，阻抗变换器包括场效应管8和二极管。该双效装置可以作为扬声器或麦克风使用。
(二)参考图8-10介绍本发明的用于检测扬声器振动位移的结构的第二种实现方式：
参考图8介绍本发明用于检测扬声器振动位移的结构的第二种实现方式的第一实施例，扬声器的振动系统包括振膜和位于振膜下方的音圈2，振膜包括位于中间的平面部11、位于平面部11边缘的折环部12、以及位于最外围的固定部13，固定部13用于将振膜固定在扬声器装置中。扬声器的磁路系统位于振动系统的下方，从上至下依次包括华司3、磁铁4和盆架5。
华司3的上表面设有驻极体薄膜300，驻极体薄膜300为固定极板。为了能让振膜与华司3之间保持均压，振膜和华司3之间存在内磁间隙9。
该驻极体薄膜300可以由驻极体材料经过极化形成，该驻极体薄膜300可以覆盖华司3的上表面的全部区域。驻极体薄膜300的材质为下列任一或组合：聚四氟乙烯材质、聚二氟乙烯、聚偏氟乙烯、聚乙烯、聚丙烯、聚醚酰亚胺、聚乙烯对苯二甲酯。驻极体薄膜300的材质优选为聚四 氟乙烯材质，通过极化后带有电荷。
可以利用振膜形成可动极板，图8中可动极板为金属层100，从图8中可以看出，金属层100仅附着于振膜的平面部11的上方，这是为了尽量减小金属层100对振膜的折环部12的顺性的影响。在其它实施例中，金属层100还可以同时附着于振膜的固定部13的上方。在其它的实施例中，金属层100还可以附着于振膜的下方。
振膜的材料优选为硅胶或者硅橡胶材质，这两种材料都能够耐受140℃的高温，以免温度较高时造成产品性能下降。为了改善振膜的弹性特性，振膜还可以包括常规的塑料薄膜层(单层薄膜或多层复合薄膜)。
当通电的音圈2在磁路系统的作用下振动时，音圈2带动振膜振动，振膜的振动会导致可动极板和固定极板组成的电容的容值发生变化，由于驻极体薄膜300带有稳定的电荷，通过监控该电容的变化数值就可以计算出振动系统的实际位移，也可以间接监控与该电容相连的电路的电流变化计算出振动系统的实际位移。
参考图9介绍本发明用于检测扬声器振动位移的结构的第二种实现方式的第二实施例，和图8的第一实施例的区别在于可动极板的设置方式不同，图9中可动极板为中间带有金属层的柔性线路板层200，中间带有金属层的柔性线路板层200附着于振膜的下方。
从图10中可以看出，中间带有金属层的柔性线路板层200包括中心部201、包围中心部201的环状部202、以及连接中心部201和环状部202的连接部203，环状部202覆盖振膜的固定部11，中心部201覆盖振膜的平面部11并且延伸至折环部12的下方。需要说明的是，第一实施例的金属层100的形状和设置方式可以和第二实施例的中间带有金属层的柔性线路板层200的形状和设置方式相同。
参考图8和图9所示，振膜的固定部13的上方设置有电连接件61，电连接件61可以为金属连接件(例如金属环)或者其它电连接结构，电容的可动极板可以通过该电连接件61接地或者连接至外部电路。由于磁铁4和盆架5均为导电体，固定极板可以通过盆架5的底部连接外部电路。
由于磁铁4和盆架5均为导电体，固定极板可以通过盆架5的底部与 阻抗变换器相连接，阻抗变换器包括一个场效应管8和一个二极管(图中没有示出)，阻抗变换器再与系统端的放大器相连接。进一步的，放大器可以与智能功放控制单元连接，智能功放控制单元用于检测该电容的容值的变化并计算出振动系统的实际位移以控制扬声器装置的输入功率。
由于具有了阻抗变换器的扬声器具备了电容麦克风的所有核心零部件，所以还可以作为电容麦克风使用，所以本发明还提供了一种声电互转的双效装置，包括：具有可动极板的振动系统；磁路系统；设置于振动系统之下并且与可动极板相对的固定极板，可动极板和固定极板组成电容；以及与电容连接的阻抗变换器，阻抗变换器包括场效应管8和二极管。该双效装置可以作为扬声器或麦克风使用。
虽然已经通过例子对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (16)

  1. 一种用于检测扬声器振动位移的结构，其特征在于，包括：
    具有可动极板的振动系统；
    磁路系统；
    设置于所述振动系统之下并且与所述可动极板相对的固定极板，所述可动极板和所述固定极板组成电容。
  2. 根据权利要求1所述的结构，其特征在于，所述振动系统包括振膜(1)和位于振膜(1)下方的音圈(2)，所述振膜(1)包括驻极体层(101)和依附于所述驻极体层(101)的金属层(102)，所述驻极体层(101)和金属层(102)组成所述可动极板。
  3. 根据权利要求2所述的结构，其特征在于，所述振膜(1)还包括与所述可动极板复合在一起的塑料薄膜层(103)，所述塑料薄膜层(103)为单层薄膜或多层复合薄膜。
  4. 根据权利要求1所述的结构，其特征在于，所述振动系统包括振膜(1)和位于振膜(1)下方的音圈(2)，所述振膜(1)包括振膜本体部和补强部，所述振膜本体部包括位于中间的平面部(11)、位于平面部(11)边缘的折环部(12)、以及位于最外围的固定部(13)，所述补强部设置在所述平面部(11)的上方；所述振膜本体部包括驻极体层(101)和依附于所述驻极体层(101)的金属层(102)，所述驻极体层(101)和金属层(102)组成所述可动极板。
  5. 根据权利要求4所述的结构，其特征在于，所述振膜本体部还包括与所述可动极板复合在一起的塑料薄膜层(103)，所述塑料薄膜层(103)为单层薄膜或多层复合薄膜。
  6. 根据权利要求4所述的结构，其特征在于，所述驻极体层(101)覆盖所述振膜本体部的全部区域，或者仅覆盖所述平面部(11)的区域。
  7. 根据权利要求4所述的结构，其特征在于，所述金属层(102)覆盖所述振膜本体部的全部区域；或者，所述金属层(102)包括全部覆盖所述平面部(11)的第一区域(1021)、全部覆盖所述固定部(13)的第二 区域(1022)、以及部分覆盖所述折环部(12)的第三区域(1023)，其中所述第三区域(1023)连通第一区域(1021)和第二区域(1022)。
  8. 根据权利要求4所述的结构，其特征在于，所述金属层(102)位于所述振膜本体部的最上层，其中所述固定部(13)上方的金属层(102)上设置有电连接件。
  9. 根据权利要求8所述的结构，其特征在于，所述电连接件为金属连接件(6)或者为涂布于所述金属层(102)上的导电胶。
  10. 根据权利要求2所述的结构，其特征在于，还包括设置于所述振膜(1)和所述音圈(2)之间的阻热材料层(104)，所述阻热材料层(104)覆盖所述振膜(1)靠近所述音圈(2)一侧的全部区域或者仅覆盖所述振膜(1)与所述音圈(2)连接的区域。
  11. 根据权利要求1所述的结构，其特征在于，所述磁路系统位于所述振动系统的下方，所述磁路系统包括华司(3)，所述华司(3)为所述固定极板。
  12. 根据权利要求11所述的结构，其特征在于，所述磁路系统还包括位于所述华司(3)下方的磁铁(4)和盆架(5)，所述华司(3)、所述磁铁(4)、以及所述盆架(5)在中心位置处设置开孔(7)。
  13. 根据权利要求2所述的结构，其特征在于，所述驻极体层(101)的材质包括下列任一或组合：聚四氟乙烯、聚二氟乙烯、聚偏氟乙烯、聚乙烯、聚丙烯、聚醚酰亚胺、聚乙烯对苯二甲酯。
  14. 根据权利要求1所述的结构，其特征在于，所述振动系统包括振膜和位于振膜下方的音圈(2)，所述磁路系统位于所述振动系统的下方，所述磁路系统包括华司(3)和磁铁(4)；
    所述可动极板附着于所述振膜上，所述华司(3)的上表面设有驻极体薄膜(300)，所述驻极体薄膜(300)为固定极板。
  15. 根据权利要求14所述的结构，其特征在于，所述可动极板为金属层(100)或者中间带有金属层的柔性线路板层(200)；所述金属层(100)或者中间带有金属层的柔性线路板层(200)附着于振膜的上方或者下方。
  16. 一种声电互转的双效装置，其特征在于，包括如权利要求1-15 任一项所述的结构，以及与所述电容连接的阻抗变换器，所述阻抗变换器包括场效应管(8)和二极管。
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