WO2018045718A1 - 扬声器模组及发声装置 - Google Patents

扬声器模组及发声装置 Download PDF

Info

Publication number
WO2018045718A1
WO2018045718A1 PCT/CN2017/073195 CN2017073195W WO2018045718A1 WO 2018045718 A1 WO2018045718 A1 WO 2018045718A1 CN 2017073195 W CN2017073195 W CN 2017073195W WO 2018045718 A1 WO2018045718 A1 WO 2018045718A1
Authority
WO
WIPO (PCT)
Prior art keywords
fixed plates
fixed
speaker module
speaker
module according
Prior art date
Application number
PCT/CN2017/073195
Other languages
English (en)
French (fr)
Inventor
曹惠娴
杨鑫峰
王国福
姜舒
张怀省
汲鹏程
Original Assignee
歌尔股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Priority to KR1020197007921A priority Critical patent/KR102168754B1/ko
Priority to US16/331,524 priority patent/US10638233B2/en
Publication of WO2018045718A1 publication Critical patent/WO2018045718A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R29/00—Monitoring arrangements; Testing arrangements
    • H04R29/001—Monitoring arrangements; Testing arrangements for loudspeakers
    • H04R29/003—Monitoring arrangements; Testing arrangements for loudspeakers of the moving-coil type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/021—Casings; Cabinets ; Supports therefor; Mountings therein incorporating only one transducer
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/02—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R29/00—Monitoring arrangements; Testing arrangements
    • H04R29/001—Monitoring arrangements; Testing arrangements for loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
    • H04R2307/027—Diaphragms comprising metallic materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H04R3/007—Protection circuits for transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/06—Plane diaphragms comprising a plurality of sections or layers
    • H04R7/10—Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact

Definitions

  • the present invention relates to the field of acoustic devices, and more particularly to a speaker module and a sounding device provided with the speaker module.
  • the speaker module includes a module housing and a speaker unit mounted in the module housing.
  • the most important structure of the moving coil structure as the speaker unit includes a diaphragm, a voice coil fixedly connected to the diaphragm, and a magnetic circuit system, wherein the voice coil is located in a magnetic gap formed by the magnetic circuit system, and the structure is
  • the speaker unit drives the diaphragm to vibrate under the action of the magnetic circuit system through the voice coil, and drives the surrounding air to sound, thereby realizing the conversion of electric energy to sound energy.
  • This kind of speaker unit can limit the application of the maximum power of the product when working in low frequency conditions.
  • the main problem is that under high power, the voice coil working under low frequency conditions will generate excessive displacement, and excessive displacement will result in excessive displacement. The distortion is sharply increased, and even a significant voice coil is rubbed against the magnetic circuit system, which causes irreversible damage to the speaker.
  • the current solution is to use the intelligent power amplifier control unit to control the power fed to the speaker unit, and to reduce the power when the vibration displacement of the vibration system exceeds a predetermined level, which requires knowledge of the vibration displacement of the vibration system.
  • a scheme for detecting vibration displacement is: using a voice coil and an external circuit as a sensor, real-time measurement of the speaker model and real-time monitoring of the input signal to realize monitoring of the vibration displacement of the vibration system.
  • the premise of this solution is to assume that the speaker has a theoretical model, such as diaphragm stiffness coefficient Kms, vibration system mass Mms, force drive factor Bl, damping factor Rms, DC impedance Re, inductance Le, and so on.
  • Kms diaphragm stiffness coefficient
  • Mms force drive factor
  • Bl damping factor
  • Rms DC impedance Re
  • inductance Le inductance Le
  • Another solution for detecting the vibration displacement is to provide a fixed plate and a movable plate on the speaker unit, and the movable plate is located on the diaphragm, so that the fixed plate can be detected by
  • the capacitance value of the variable capacitor formed by the moving plate is used to monitor the vibration displacement.
  • a speaker module includes a module housing and a speaker unit mounted in the module housing, the module housing including a housing body and a fixed connection Two fixed plates on the main body of the housing, wherein the two fixed plates are insulated from each other, and the two fixed plates each have a connecting portion exposed outside the main body of the housing;
  • the vibration system is formed with a movable plate, and the two fixed plates each form a variable capacitor with the movable plate; the speaker module is disposed through a connection portion of the two fixed plates
  • An electrical signal indicative of the vibrational displacement of the vibration system is output.
  • each of the fixed plates includes a plate body and a metal body for welding on the plate body; at least a portion of the metal body is exposed as a connection portion corresponding to the fixed plate On the outside of the housing body.
  • the two fixed plates are integrally formed from one material, and the surface of each of the fixed plates is directly exposed as a corresponding connecting portion on the outside of the housing body.
  • each of the fixed plates comprises a plate body and a terminal electrically connected to the plate body, and the terminal is exposed as a connection portion corresponding to the fixed plate to the outside of the housing body.
  • the two fixed plates are fixedly coupled to the housing body by being injection molded as at least a portion of the housing body.
  • a forming structure for preventing the disengagement is formed between each of the fixed plates and the housing body.
  • the housing body has an opening corresponding to the two fixed plates, and an inner wall of each of the openings is formed with a step portion; each of the fixed plates is embedded in the corresponding opening And supported on the step portion.
  • the movable plate is a reinforcing portion fixedly connected to a central plane portion of the diaphragm of the vibration system, or a fixing portion fixedly connected to a central plane portion of the diaphragm of the vibration system.
  • a film layer of the strong part is a film layer of the strong part.
  • a portion of the diaphragm corresponding to the reinforcing portion is stripped to form a stripping opening, and an edge of the reinforcing portion is overlapped and fixed in a periphery of the diaphragm at a periphery of the stripping opening On the edge.
  • a sounding device comprising a capacitance measuring circuit and a speaker module according to the first aspect of the present invention, two signal input terminals of the capacitance measuring circuit and the speaker module The two connecting portions of the group are electrically connected one by one.
  • the present invention forms a series structure by disposing two fixed plates on the module housing and a movable plate formed by the vibration system, so that the two fixed plates can be directly exposed.
  • the connecting portion leads to an electrical signal characterizing the vibration displacement without setting any connection structure inside the speaker module, which will greatly reduce the structure of the speaker module to form a variable capacitor structure and lead to an electrical signal generated by the capacitor structure. Complexity, which in turn effectively reduces the difficulty of the process.
  • FIG. 1 is a cross-sectional view of an embodiment of a speaker module in accordance with the present invention.
  • FIG. 2 is a bottom view of the speaker module of FIG. 1;
  • FIG. 3 is a schematic structural view of an embodiment of the fixed plate of FIG. 1;
  • FIG. 4 is a schematic structural view of another embodiment of the fixed electrode plate of FIG. 1;
  • FIG. 5 is a simplified schematic diagram of a variable capacitor structure formed by the speaker module of FIG. 1.
  • FIG. 5 is a simplified schematic diagram of a variable capacitor structure formed by the speaker module of FIG. 1.
  • FIG. 1 and 2 are schematic structural views of an embodiment of a speaker module according to the present invention.
  • the speaker module comprises a module housing 1 and a speaker unit 2 mounted in the module housing 1.
  • the vibration system 21 further includes a diaphragm and a voice coil, and may further include a reinforcing portion (DOME) fixedly connected to the central plane portion of the diaphragm, wherein the voice coil may be fixedly connected to the diaphragm or fixedly connected to the reinforcing portion. It is located in the magnetic gap formed by the magnetic circuit system 22.
  • a reinforcing portion (DOME) fixedly connected to the central plane portion of the diaphragm, wherein the voice coil may be fixedly connected to the diaphragm or fixedly connected to the reinforcing portion. It is located in the magnetic gap formed by the magnetic circuit system 22.
  • the portion of the corresponding reinforcing portion of the diaphragm can be stripped to form a discharge opening, and the edge of the reinforcing portion is overlapped and fixed to the diaphragm.
  • the inner edge of the periphery of the spout is used to reduce the load on the vibration system 21.
  • the magnetic circuit system 22 is a dual magnetic circuit structure, that is, the magnetic circuit system includes a magnetic yoke, a central magnet fixedly coupled to the magnetic yoke, and a central magnet disposed on the magnetic yoke.
  • the side magnet may be a ring magnet or may be composed of a plurality of separate magnets.
  • the magnetic circuit system 22 can also employ a single magnetic circuit structure, such as an inner magnetic circuit structure and an outer magnetic circuit structure, wherein the inner magnetic circuit structure, that is, the magnetic circuit system 22, includes a bowl-shaped magnetic yoke. a central magnet fixedly coupled to the yoke and a central magnetically permeable plate fixedly coupled to the central magnet, wherein the magnetic gap is formed between the central magnetic permeable plate and the sidewall of the yoke.
  • the module housing 1 includes a housing body 11 and two fixed plates 31, 32 fixedly coupled to the housing body 11, wherein the two fixed plates 31, 32 are insulated from each other, and the two fixed plates 31 are fixed.
  • Each of the 32 has a connection portion exposed outside the casing body 11 to facilitate connection between the two fixed plates 31, 32 and an external circuit.
  • the housing body 11 may include at least two portions assembled together.
  • the housing body 11 includes a module upper housing and a module.
  • the shell and the two fixed plates 31, 32 are specifically fixedly connected to the upper casing of the module.
  • the upper case of the module is defined as a case facing the side of the diaphragm, and the lower case of the module is defined as a case facing the side of the magnetic circuit system.
  • the two fixed plates 31, 32 can be fixedly coupled to the housing body 11 by injection molding as at least a portion of the housing body 11.
  • the two fixed plates 31, 32 are fixedly connected to the casing body 11 by injection molding as an insert into the upper casing of the module, that is, in the injection molding module.
  • the two fixed plates 31, 32 are placed as inserts in corresponding positions of the cavity of the injection mold, and are positioned, so that the injection material can be injected into the injection mold, and the fixed plate 31 can be On the 32, the injection molding of the upper shell of the module is carried out, so that the two are reliably combined.
  • the combination structure has the advantages of strong bonding force, no need to fix between the two by additional means, easy formation of an effective anti-detachment limit structure between the two, convenient processing, low cost and the like.
  • the limiting structure has at least one between the fixed plates 31 and 32 and the housing body 11 , for example.
  • a corresponding limiting structure is formed on the action surface for preventing the disengagement, and the action surface is, for example, a stepped surface, a sloped surface or the like.
  • the two fixed plates 31, 32 may also be adhesively fixed to the housing body 11.
  • the two fixed plates 31, 32 may be adhesively fixed to the corresponding openings of the casing body 11, or may be bonded and fixed to the portion of the casing body at the periphery of the corresponding opening on the inner side of the casing body 11. It may be bonded and fixed to the outer portion of the casing main body 11 at a portion of the casing main body at the periphery of the corresponding opening.
  • each of the fixed plates 31, 32 may include an intermediate portion. And a basin edge extending through the intermediate portion.
  • the intermediate portion of each of the fixed plates 31, 32 is embedded in the corresponding opening or extends into the interior of the housing body 11 via the corresponding opening, and the basin of each of the fixed plates 31, 32 is lapped and fixed to the housing body 11 In order to reduce the initial gap between the fixed plates 31, 32 and the movable plate 211 as much as possible, the electrical signal is increased.
  • the housing body 11 may have an opening corresponding to the two fixed plates 31, 32. And an inner wall of each opening is formed with a step portion; each of the fixed plates 31, 32 is embedded in the corresponding opening and supported on the step portion.
  • the two fixed plates 31, 32 can be directly bonded and fixed on the corresponding step portions.
  • the two main fixed plates 31 and 32 are spaced apart from each other on the casing main body 11, so that insulation between the two can be achieved by the casing main body 11.
  • the insulation between the two can also be achieved by the insulating glue and/or the casing body.
  • the vibrating system 21 is formed with a movable plate 211.
  • the forming structure of the movable plate 211 can be, but is not limited to,:
  • the diaphragm is made of a metal material, and the diaphragm is used as the movable plate 211.
  • the diaphragm is an insulating material, and a metal film layer is bonded to the diaphragm as a movable plate 211 by means of surface deposition, surface evaporation, bonding, etc., in this embodiment, the movable pole can also be used.
  • the plate 211 is regarded as a film layer of the diaphragm, that is, a composite diaphragm is formed.
  • a reinforcing portion made of a metal material is fixedly attached to the diaphragm, and the reinforcing portion is used as the movable plate 211.
  • the reinforcing portion is fixedly connected to the diaphragm, the reinforcing portion is a composite film structure, and the reinforcing portion has a metal film layer as a movable plate.
  • the speaker module of the present invention forms a variable capacitor with each of the two fixed plates 31, 32 and the movable plate 211, that is, two variable capacitors are formed, and the two variable capacitors are connected in series by sharing the movable plate 211.
  • the structure of the connection is such that the speaker module can output an electrical signal indicative of the vibration displacement of the vibration system through the connection of the two fixed plates 31, 32.
  • the two fixed plates 31, 32 are provided on the casing main body 11, it is very easy to form the respective connecting portions, and it is very easy to realize the structural design in which the respective connecting portions are exposed, and thus it is not Increase the difficulty of processing and assembly, greatly reducing the complexity of the structure and the difficulty of the process.
  • FIG. 5 is a simplified schematic diagram of a variable capacitor structure formed by the speaker module of FIG. 1. The principle of outputting an electrical signal characterizing the vibration displacement of the vibration system by such a variable capacitor structure will be described below with reference to FIG.
  • the initial capacitance between the fixed plate 31 and the movable plate 211 is C13, and the effective area between the two is S1; the initial capacitance between the fixed plate 32 and the movable plate 211 is C23, both The effective area between the two is S2; the initial capacitance between the fixed plate 31 and the fixed plate 32 is C12; the initial spacing between the fixed plates 31, 32 and the movable plate 211 is equal, and is d; ⁇ is The dielectric constant; and, the displacement of the vibration system is ⁇ d, and the vibration between the fixed plate 31 and the fixed plate 32 is C12' after the vibration system moves by ⁇ d.
  • ⁇ d can be calculated by measuring the electrical signal C12'.
  • Figure 3 is a schematic view showing the structure of an embodiment of the fixed plate of Figures 1 and 2.
  • the fixed electrode plate 31 includes a plate body 301 and a metal body 302 for soldering on the plate body 301.
  • the metal body 302 has, for example, Tin, gold, etc. that are good for welding. At least a portion of the metal body 302 is exposed as a connection portion of the fixed plate 31, for example, the metal body 302 can be completely exposed to increase the surface area available for connection.
  • the plate body 301 is a portion of the fixed electrode plate 31 for forming a variable capacitor with the movable plate 211.
  • the metal body can be applied to the electrode body 301 by, for example, plating.
  • the metal body may completely cover one surface of the plate body 301 or may partially cover one surface of the plate body 301.
  • the two signal input terminals of the capacitance measuring circuit may be wires, pins, etc. soldered on the connection portions of the corresponding fixed plates 31, 32.
  • a spring piece, a spring, or the like may be directly pressed against the connection portion of the corresponding fixed electrode plates 31 and 32 to achieve a contact electrical connection. Therefore, this embodiment has high compatibility with the connection mode and can basically match all forms of signal input terminals.
  • This embodiment can be applied to the material of the electrode plate body 301 which cannot be reliably connected by welding.
  • the electrode body 301 is a steel plate.
  • the fixed plate 32 can be disposed with reference to the fixed plate 31.
  • FIGS. 1 and 2 are schematic structural views of another embodiment of the fixed plate of FIGS. 1 and 2.
  • the fixed electrode plate 31 is also exemplified.
  • the fixed electrode plate 31 includes a plate body 301 and a terminal 303 electrically connected to the plate body 301.
  • the terminal 303 is exposed as a connection portion of the fixed electrode plate 31. It is outside the casing body 11.
  • the terminal 303 extends outwardly, for example, via the rim of the plate body 301.
  • the electrode body 301 is a steel plate.
  • the terminal 303 may include a steel body integrally formed with the plate body 301, and a metal body for welding on the steel body, such as tin, gold, or the like which is advantageous for soldering.
  • the metal body can be applied to the surface of the steel body by, for example, plating. Since the terminal 303 has a small area with respect to the plate body 301, such a structure is advantageous in controlling cost.
  • terminal 303 can also be made entirely of metal suitable for soldering.
  • the two signal input terminals of the capacitance measuring circuit may be wires, pins, etc. soldered on the connection portions of the corresponding fixed plates 31, 32.
  • a spring piece, a spring, or the like may be directly pressed against the connection portion of the corresponding fixed electrode plates 31 and 32 to achieve a contact electrical connection.
  • the fixed plate 32 can be disposed with reference to the fixed plate 31.
  • the fixed plates 31, 32 are integrally formed from a single material and directly expose their surface as a joint.
  • the fixed plates 31, 32 are plates such as steel sheets that cannot be reliably connected by soldering
  • the main application is that the signal input terminals are elastic plates, springs, etc., which are electrically connected by direct pressing. Terminal structure.
  • the above use of the steel sheet as the plate body 301 or as the fixed plates 31, 32 in addition to the function of forming a variable capacitor with the movable plate, is also advantageous for reducing the thickness of the module case 1 to ensure the mode.
  • the thin and light design is realized under the premise of group performance.
  • a sounding device comprising the above capacitance measuring circuit, and a speaker module according to the present invention, two signal input terminals of the capacitance measuring circuit and two of the speaker module
  • the connecting portions are electrically connected one-to-one in any one of the above-described connection structures.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

一种扬声器模组及发声装置，该模组包括模组壳体（1）、及安装在模组壳体（1）中的扬声器单体（2），模组壳体（1）包括壳体主体（11）和固定连接在壳体主体（11）上的两块固定极板（31，32），其中，两块固定极板（31，32）相互绝缘，且两块固定极板（31，32）均具有裸露在壳体主体（11）的外部的连接部；扬声器单体（2）的振动系统（21）形成有可动极板（211），且两块固定极板（31，32）各自与可动极板（211）形成一个可变电容器；扬声器模组被设置为通过两块固定极板（31，32）的连接部输出表征振动系统（21）的振动位移的电信号。

Description

扬声器模组及发声装置 技术领域
本发明涉及声学器件领域，更具体地，本发明涉及一种扬声器模组、及设置有该种扬声器模组的发声装置。
背景技术
扬声器模组包括模组壳体、及安装在模组壳体中的扬声器单体。动圈式结构作为扬声器单体的最主要的结构包括振膜、固定连接在振膜上的音圈、及磁路系统，其中，音圈位于磁路系统形成的磁间隙中，该种结构的扬声器单体通过音圈在接收到音频信号时在磁路系统的作用下带动振膜振动，策动周围空气发声，进而实现电能至声能的转换。
该种扬声器单体在工作于低频条件时，会限制产品最大功率的应用，问题主要在于：大功率下，工作于低频条件下的音圈会产生过大的位移，而过大的位移会导致失真急剧升高，甚至出现明显的音圈与磁路系统的擦碰，这会对扬声器造成不可逆的损伤。
对于上述问题，目前的解决方案是采用智能功放控制单元控制馈给扬声器单体的功率，在振动系统的振动位移超出预定程度时降低功率，这就需要获知振动系统的振动位移。
现有技术中，一种检测振动位移的方案是：使用音圈以及外部电路作为传感器，通过扬声器模型的实时测量以及对输入信号的实时监控，实现对振动系统的振动位移的监控。此种解决方案的前提是假设扬声器有一个理论模型，比如振膜劲度系数Kms，振动系统质量Mms，力电驱动因数Bl，阻尼因数Rms，直流阻抗Re，电感Le等。但是，理论的扬声器模型与实际产品之间仍然具有一定的差异，导致位移监控的准确度有限，这制约了扬声器的低频性能，并影响工作于低频条件下扬声器大功率下性能的优化。
另一种检测振动位移的方案是：在扬声器单体上设置一个固定极板和一个可动极板，且该可动极板位于振膜上，这样，便可通过检测由固定极板和可动极板形成的可变电容器的电容值来监控振动位移。该种方案虽然能够提高振动位移监控的准确度，但是需要增加能够将两个极板与外部电路连接的连接结构，例如，各种形式的引线设置等，不仅增加了扬声器模组的结构复杂性、及加工、组装工艺的难度，还会增加潜在的故障点。
发明内容
本发明实施例的一个目的是提供一种扬声器模组的新的技术方案，以形成用于监控振动位移、且能够方便地与外部电路连接的可变电容结构。
根据本发明的一个方面，提供一种扬声器模组，其包括模组壳体、及安装在所述模组壳体中的扬声器单体，所述模组壳体包括壳体主体和固定连接在所述壳体主体上的两块固定极板，其中，两块固定极板相互绝缘，且两块固定极板均具有裸露在所述壳体主体的外部的连接部；所述扬声器单体的振动系统形成有可动极板，且所述两块固定极板各自与所述可动极板形成一个可变电容器；所述扬声器模组被设置为通过所述两块固定极板的连接部输出表征振动系统的振动位移的电信号。
可选的是，每一所述固定极板包括极板本体、及覆在所述极板本体上的用于焊接的金属体；所述金属体的至少一部分作为对应固定极板的连接部裸露在所述壳体主体的外部。
可选的是，所述两块固定极板由一种材料一体成型，每一所述固定极板的表面直接作为对应的连接部裸露在所述壳体主体的外部。
可选的是，每一所述固定极板包括极板本体、及与所述极板本体电连接的端子，所述端子作为对应固定极板的连接部裸露在所述壳体主体的外部。
可选的是，所述两块固定极板通过作为嵌件注塑于所述壳体主体的至少一部分而与所述壳体主体固定连接在一起。
可选的是，每一所述固定极板与所述壳体主体之间形成防脱开的限位结构。
可选的是，所述壳体主体具有与所述两块固定极板一一对应的开口，且每一所述开口的内壁形成有台阶部；每一所述固定极板嵌于对应的开口中，并支撑在所述台阶部上。
可选的是，所述可动极板为固定连接在所述振动系统的振膜的中央平面部上的补强部，或者为固定连接在所述振动系统振膜的中央平面部上的补强部的一个膜层。
可选的是，所述振膜的对应所述补强部的部分被去料形成去料口，所述补强部的边缘搭接固定在所述振膜的、位于去料口周边的内边沿上。
根据本发明的第二方面，提供了一种发声装置，其包括电容测量电路及根据本发明第一方面所述的扬声器模组，所述电容测量电路的两个信号输入端子与所述扬声器模组的两个连接部一一对应电连接。
本发明的一个技术效果在于，本发明通过在模组壳体上设置两个固定极板与振动系统形成的可动极板形成串联结构，这样，便可直接通过两个固定极板的裸露在外的连接部引出表征振动位移的电信号，而无需在扬声器模组的内部设置任何连接结构，这将大大降低扬声器模组为形成可变电容器结构、并引出电容器结构产生的电信号而导致的结构复杂性，进而有效降低了工艺难度。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其
它特征及其优点将会变得清楚。
附图说明
构成说明书的一部分的附图描述了本发明的实施例，并且连同说明书一起用于解释本发明的原理。
图1为根据本发明扬声器模组的一种实施例的剖视示意图；
图2为图1中扬声器模组的仰视示意图；
图3为图1中固定极板的一种实施例的结构示意图；
图4为图1中固定极板的另一种实施例的结构示意图；
图5为图1中扬声器模组形成的可变电容器结构的简化示意图。
附图标记说明：
1-模组壳体；                11-壳体主体；
2-扬声器单体；              21-振动系统；
211-可动极板；              22-磁路系统；
31、32-固定极板；           301-极板本体；
302-金属体；                303-端子。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术和设备可能不作详细讨论，但在适当情况下，所述技术和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
图1和图2为根据本发明扬声器模组的一种实施方式的结构示意图。
根据图1和图2所示，该扬声器模组包括模组壳体1、及安装在模组壳体1中的扬声器单体2。
振动系统21进一步包括振膜和音圈，还可以包括与振膜的中央平面部固定连接的补强部(DOME)，其中，音圈可以固定连接在振膜上，也可以固定连接在补强部上，且位于磁路系统22形成的磁间隙中。
在振动系统21设置有补强部的实施例中，可对振膜的对应补强部的部分进行去料形成去料口，而使补强部的边缘搭接固定在振膜的、位于去 料口周边的内边沿上，以减轻振动系统21的负担。
在图1所示的实施例中，该磁路系统22为双磁路结构，即磁路系统包括导磁轭、固定连接在导磁轭上的中心磁铁、在导磁轭上环绕中心磁铁布置的边磁铁、固定连接在中心磁铁上的中心导磁板、及固定连接在边磁铁上的边导磁板，并在中心导磁板与边导磁板之间形成上述磁间隙。其中，边磁铁可以为一块环形磁铁，也可以由多块单独的磁铁构成。
在另外的实施例中，该磁路系统22也可以采用单磁路结构，例如，内磁路结构和外磁路结构，其中，内磁路结构即磁路系统22包括碗状的导磁轭、固定连接在导磁轭上的中心磁铁、及固定连接在中心磁铁上的中心导磁板，其中，中心导磁板与导磁轭的侧壁之间形成上述磁间隙。
该模组壳体1包括壳体主体11和固定连接在壳体主体11上的两块固定极板31、32，其中，两块固定极板31、32相互绝缘，且两块固定极板31、32均具有裸露在壳体主体11的外部的连接部，以方便进行两块固定极板31、32与外部电路之间的连接。
为了便于安装扬声器单体2，该壳体主体11可以包括组装在一起的至少两个部分，在图1和图2所示的实施例中，壳体主体11包括模组上壳和模组下壳，且两块固定极板31、32具体固定连接在模组上壳上。其中，模组上壳被定义为是面向振膜一侧的壳体，模组下壳被定义为是面向磁路系统一侧的壳体。
在本发明的一个具体实施例中，此两块固定极板31、32可通过作为嵌件注塑于壳体主体11的至少一部分而与壳体主体11固定连接在一起。在图1和图2所示的实施例中，此两块固定极板31、32即为通过作为嵌件注塑于模组上壳而与壳体主体11固定连接在一起，即在注塑模组上壳时，将两块固定极板31、32作为嵌件放置于注塑模具的型腔的相应位置，并进行定位，这样，在将注塑原料注入注塑模具中，便可在固定极板31、32上进行模组上壳的注塑成型，进而使得二者可靠地结合在一起。该种结合结构的优点在于：结合力强、无需通过额外手段进行二者之间的固定、能够轻易地在二者之间形成有效的防脱开的限位结构、便于加工、成本低等。
该限位结构例如是在固定极板31、32与壳体主体11之间具有至少一 对防脱开的作用面，形成对应的限位结构，该作用面例如是台阶面、斜面等。
在本发明的另一个具体实施例中，此两块固定极板31、32也可以粘接固定在壳体主体11上。例如，两块固定极板31、32可以粘接固定在壳体主体11的对应开口中，也可以在壳体主体11的内侧粘接固定在壳体主体的位于对应开口周边的部分上，还可以在壳体主体11的外侧粘接固定在壳体主体的位于对应开口周边的部分上。
在两块固定极板31、32在壳体主体11的外侧粘接固定在壳体主体11的位于对应开口周边的部分上的实施例中，每一固定极板31、32可以包括中间部位、及经由中间部位弯折延伸出的盆沿。每一固定极板31、32的中间部位嵌于对应开口中，或者经由对应开口伸入壳体主体11的内部，且每一固定极板31、32的盆沿搭接固定在壳体主体11上，以尽可能地缩小固定极板31、32与可动极板211之间的初始间隙，增大电信号。
为了便于进行固定极板31、32在壳体主体11上的定位，在本发明的一个具体实施例中，该壳体主体11可以具有与两块固定极板31、32一一对应的开口，且每一开口的内壁形成有台阶部；每一固定极板31、32嵌于对应的开口中，并支撑在台阶部上。在此基础上，结合粘接固定的实施例，两块固定极板31、32可以直接粘接固定在对应的台阶部上。
在壳体主体11为塑料等绝缘材质的实施例中，通过将两块固定极板31、32间隔设置在壳体主体11上，便可通过壳体主体11实现二者之间的绝缘。
在两块固定极板31、32通过绝缘胶粘接固定在壳体主体11上的实施例中，也可通过绝缘胶和/或壳体主体实现二者之间的绝缘。
上述振动系统21形成有可动极板211，其中，可动极板211的形成结构可以但不局限于是：
1、振膜为金属材质，将振膜作为可动极板211。
2、振膜为绝缘材质，通过表面沉积、表面蒸镀、粘接等手段在振膜上结合一层金属膜层作为可动极板211，在该实施例中，也可以将该可动极板211看作是振膜的一个膜层，即形成复合振膜。
3.振膜上固定连接有金属材质的补强部，并将补强部作为可动极板211。
4.振膜上固定连接有补强部，补强部为复合膜结构，且补强部具有一层金属膜层作为可动极板。
本发明扬声器模组通过两块固定极板31、32各自与可动极板211形成一个可变电容器，即形成两个可变电容器，且两个可变电容器通过共用可动极板211形成串联连接的结构，这样，扬声器模组通过两块固定极板31、32的连接部便可输出表征振动系统的振动位移的电信号。在此，由于两块固定极板31、32设置在壳体主体11上，因此，非常容易形成各自的连接部、并且非常容易实现使得各自的连接部裸露在外的结构设计，而且也不会因此增加加工、组装难度，大大降低了结构复杂性及工艺难度。
图5是图1中扬声器模组形成的可变电容器结构的简化示意图。以下将根据图5说明通过该种可变电容器结构输出表征振动系统的振动位移的电信号的原理。
设：固定极板31与可动极板211之间的初始电容为C13，二者之间的有效面积为S1；固定极板32与可动极板211之间的初始电容为C23，二者之间的有效面积为S2；固定极板31与固定极板32之间的初始电容为C12；固定极板31、32与可动极板211之间的初始间距相等，且为d；ε为介电常数；以及，振动系统的位移为Δd，振动系统运动Δd后，固定极板31与固定极板32之间的电容为C12′。
由此得出：
Figure PCTCN2017073195-appb-000001
由于C13与C23为串联结构，
因此，
Figure PCTCN2017073195-appb-000002
同理，
Figure PCTCN2017073195-appb-000003
进而，
Figure PCTCN2017073195-appb-000004
在已知d和C12的情况下，可以通过测量电信号C12′便可计算得到Δd。
图3是图1和图2中固定极板的一种实施例的结构示意图。
根据图3所示，以固定极板31为例，该固定极板31包括极板本体301、及覆在该极板本体301上的用于焊接的金属体302，该金属体302例如是有利于焊接的锡、金等。该金属体302的至少一部分作为固定极板31的连接部裸露在外，例如，可使得金属体302完全裸露在外，以增加可供连接的表面积。该极板本体301即为固定极板31的用于与可动极板211形成可变电容器的部分。
该金属体例如可以通过电镀等手段覆于极板本体301上。
该金属体可以完全覆盖极板本体301的一个表面，也可以是局部覆盖极板本体301的一个表面。
对于该实施例，在进行扬声器模组与外部的电容测量电路之间的连接时，电容测量电路的两个信号输入端子可以是导线、针脚等焊接在对应固定极板31、32的连接部上，也可以是弹片、弹簧等直接抵压在对应固定极板31、32的连接部上实现接触性电连接。因此，该实施例对于连接方式具有较高的兼容性，基本能够与所有形式的信号输入端子相匹配。
该种实施例能够适用于极板本体301为无法通过焊接进行可靠连接的材质，例如极板本体301为钢片。
固定极板32可以参照固定极板31设置。
图4是图1和图2中固定极板的另一种实施例的结构示意图。
根据图4所示，同样以固定极板31为例，该固定极板31包括极板本体301、及与极板本体301电连接的端子303，该端子303作为固定极板31的连接部裸露在壳体主体11的外部。
该端子303例如经由极板本体301的边沿向外延伸。
该种实施例同样能够适用于极板本体301为无法通过焊接进行可靠连接的材质，例如极板本体301为钢片。这样，该端子303可以包括与极板本体301一体成型的钢制本体、及覆在该钢制本体上的用于焊接的金属体，该金属体例如是有利于焊接的锡、金等。
该金属体例如可以通过电镀等手段覆于钢制本体的表面。由于端子303相对极板本体301具有较小的面积，因此，该种结构有利于控制成本。
另外，该端子303也可以整体采用有利于焊接的金属制成。
对于该实施例，在进行扬声器模组与外部的电容测量电路之间的连接时，电容测量电路的两个信号输入端子可以是导线、针脚等焊接在对应固定极板31、32的连接部上，也可以是弹片、弹簧等直接抵压在对应固定极板31、32的连接部上实现接触性电连接。
固定极板32可以参照固定极板31设置。
在另外的实施例中，固定极板31、32由一种材料一体成型，且直接将其表面作为连接部裸露在外。在该实施例中，如果固定极板31、32为钢片等无法通过焊接进行可靠连接的极板，则其主要适用于信号输入端子是弹片、弹簧等通过直接抵压进行接触性电连接的端子结构。
以上利用钢片作为极板本体301或者作为固定极板31、32除起到与可动极板形成可变电容器的作用外，还有利于减小模组壳体1的厚度，以在保证模组性能的前提下实现轻薄化设计。
根据本发明的另一方面，还提供了一种发声装置，该发声装置包括上述电容测量电路、及根据本发明的扬声器模组，该电容测量电路的两个信号输入端子与扬声器模组的两个连接部以上述任一种连接结构一一对应电连接。
虽然已经通过示例对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上示例仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (10)

  1. 一种扬声器模组，其特征在于，包括模组壳体(1)、及安装在所述模组壳体(1)中的扬声器单体(2)，所述模组壳体(1)包括壳体主体(11)和固定连接在所述壳体主体(11)上的两块固定极板(31、32)，其中，两块固定极板(31、32)相互绝缘，且两块固定极板(31、32)均具有裸露在所述壳体主体(11)的外部的连接部；所述扬声器单体(2)的振动系统(21)形成有可动极板(211)，且所述两块固定极板(31、32)各自与所述可动极板(211)形成一个可变电容器；所述扬声器模组被设置为通过所述两块固定极板(31、32)的连接部输出表征所述振动系统的振动位移的电信号。
  2. 根据权利要求1所述的扬声器模组，其特征在于，每一所述固定极板(31、32)包括极板本体(301)、及覆在所述极板本体(301)上的用于焊接的金属体(302)；所述金属体(302)的至少一部分作为对应固定极板(31、32)的连接部裸露在所述壳体主体(11)的外部。
  3. 根据权利要求1或2所述的扬声器模组，其特征在于，所述两块固定极板(31、32)由一种材料一体成型，每一所述固定极板(31、32)的表面直接作为对应的连接部裸露在所述壳体主体(11)的外部。
  4. 根据权利要求1至3中任一项所述的扬声器模组，其特征在于，每一所述固定极板(31、32)包括极板本体(301)、及与所述极板本体(301)电连接的端子(303)，所述端子(303)作为对应固定极板(31、32)的连接部裸露在所述壳体主体(11)的外部。
  5. 根据权利要求1至4中任一项所述的扬声器模组，其特征在于，所述两块固定极板(31、32)通过作为嵌件注塑于所述壳体主体(11)的至少一部分而与所述壳体主体(11)固定连接在一起。
  6. 根据权利要求5所述的扬声器模组，其特征在于，每一所述固定极板(31、32)与所述壳体主体(11)之间形成防脱开的限位结构。
  7. 根据权利要求1至6中任一项所述的扬声器模组，其特征在于，所述壳体主体(11)具有与所述两块固定极板(31、32)一一对应的开口，且每一所述开口的内壁形成有台阶部；每一所述固定极板(31、32)嵌于对应的开口中，并支撑在所述台阶部上。
  8. 根据权利要求1至7中任一项所述的扬声器模组，其特征在于，所述可动极板(211)为固定连接在所述振动系统的振膜的中央平面部上的补强部，或者为固定连接在所述振动系统振膜的中央平面部上的补强部的一个膜层。
  9. 根据权利要求8所述的扬声器模组，其特征在于，所述振膜的对应所述补强部的部分被去料形成去料口，所述补强部的边缘搭接固定在所述振膜的、位于去料口周边的内边沿上。
  10. 一种发声装置，其特征在于，包括电容测量电路及权利要求1至9中任一项所述的扬声器模组，所述电容测量电路的两个信号输入端子与所述扬声器模组的两个连接部一一对应电连接。
PCT/CN2017/073195 2016-09-09 2017-02-10 扬声器模组及发声装置 WO2018045718A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020197007921A KR102168754B1 (ko) 2016-09-09 2017-02-10 스피커 모듈 및 발성장치
US16/331,524 US10638233B2 (en) 2016-09-09 2017-02-10 Speaker module and sound production device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201621047836.8U CN206136275U (zh) 2016-09-09 2016-09-09 扬声器模组及发声装置
CN201621047836.8 2016-09-09

Publications (1)

Publication Number Publication Date
WO2018045718A1 true WO2018045718A1 (zh) 2018-03-15

Family

ID=58570619

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/073195 WO2018045718A1 (zh) 2016-09-09 2017-02-10 扬声器模组及发声装置

Country Status (4)

Country Link
US (1) US10638233B2 (zh)
KR (1) KR102168754B1 (zh)
CN (1) CN206136275U (zh)
WO (1) WO2018045718A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN212785822U (zh) * 2020-07-06 2021-03-23 瑞声科技(新加坡)有限公司 一种发声器件
CN112351356B (zh) * 2020-08-27 2024-07-16 瑞声新能源发展(常州)有限公司科教城分公司 扬声器箱

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204887445U (zh) * 2015-07-09 2015-12-16 张扬 微型发声器
CN205029868U (zh) * 2015-10-29 2016-02-10 歌尔声学股份有限公司 扬声器单体
US20160094917A1 (en) * 2014-09-30 2016-03-31 Apple Inc. Capacitive position sensing for transducers
CN105681983A (zh) * 2016-01-12 2016-06-15 瑞声光电科技(常州)有限公司 扬声器
CN206136274U (zh) * 2016-09-09 2017-04-26 歌尔股份有限公司 扬声器单体、扬声器模组及发声装置
CN206136277U (zh) * 2016-09-09 2017-04-26 歌尔股份有限公司 扬声器单体、扬声器模组及发声装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002135888A (ja) * 2000-10-23 2002-05-10 Pioneer Electronic Corp スピーカ用振動板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160094917A1 (en) * 2014-09-30 2016-03-31 Apple Inc. Capacitive position sensing for transducers
CN204887445U (zh) * 2015-07-09 2015-12-16 张扬 微型发声器
CN205029868U (zh) * 2015-10-29 2016-02-10 歌尔声学股份有限公司 扬声器单体
CN105681983A (zh) * 2016-01-12 2016-06-15 瑞声光电科技(常州)有限公司 扬声器
CN206136274U (zh) * 2016-09-09 2017-04-26 歌尔股份有限公司 扬声器单体、扬声器模组及发声装置
CN206136277U (zh) * 2016-09-09 2017-04-26 歌尔股份有限公司 扬声器单体、扬声器模组及发声装置

Also Published As

Publication number Publication date
US20190208328A1 (en) 2019-07-04
CN206136275U (zh) 2017-04-26
US10638233B2 (en) 2020-04-28
KR102168754B1 (ko) 2020-10-22
KR20190040277A (ko) 2019-04-17

Similar Documents

Publication Publication Date Title
WO2017161667A1 (zh) 动圈式扬声器系统
KR102128689B1 (ko) 가동 코일 스피커
KR102260112B1 (ko) 가동 코일 스피커
US20150016659A1 (en) Miniature electroacoustic transducer and assembling method thereof
WO2018040397A1 (zh) 一种动圈式扬声器
WO2016078561A1 (zh) 一种扬声器结构
KR102002742B1 (ko) 다이어프램 및 다이어프램 제조 방법
US9955251B1 (en) Sounder module
JP3180969U (ja) エレクトレット・コンデンサー式マイク
US9820067B2 (en) Micro speaker with capacitors formed by conductive segmented cover and segmented diaphram
WO2016179995A1 (zh) 振动扬声器
US9820069B2 (en) Micro speaker with capacitors formed by conductive segmented cover and diaphragm
WO2018045718A1 (zh) 扬声器模组及发声装置
US9866982B2 (en) Micro speaker with capacitors formed by conductive diaphragm and segmented pole plate
US9820068B2 (en) Micro speaker with capacitors formed by conductive cover and segmented diaphragm
WO2017161653A1 (zh) 一种扬声器模组壳体及用于扬声器模组壳体的制造方法
CN206136277U (zh) 扬声器单体、扬声器模组及发声装置
WO2018045717A1 (zh) 扬声器单体、扬声器模组及发声装置
EP2490462A1 (en) Condenser microphone assembly with floating configuration
CN106028234B (zh) 一种振膜及扬声器单体
WO2019015069A1 (zh) 一种扬声器
US9820066B2 (en) Micro speaker with capacitors formed by conductive cover and diaphragm
US9826326B2 (en) Micro speaker with capacitors formed by conductive diaphragm and pole plate
CN111131971B (zh) 一种发声装置以及电子终端
CN209017303U (zh) 一种窄带强指向性高声压报警扬声器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17847894

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20197007921

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 17847894

Country of ref document: EP

Kind code of ref document: A1