WO2017161653A1 - 一种扬声器模组壳体及用于扬声器模组壳体的制造方法 - Google Patents

一种扬声器模组壳体及用于扬声器模组壳体的制造方法 Download PDF

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Publication number
WO2017161653A1
WO2017161653A1 PCT/CN2016/082369 CN2016082369W WO2017161653A1 WO 2017161653 A1 WO2017161653 A1 WO 2017161653A1 CN 2016082369 W CN2016082369 W CN 2016082369W WO 2017161653 A1 WO2017161653 A1 WO 2017161653A1
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WO
WIPO (PCT)
Prior art keywords
speaker module
connecting member
annular connecting
module housing
speaker
Prior art date
Application number
PCT/CN2016/082369
Other languages
English (en)
French (fr)
Inventor
汲鹏程
杨鑫峰
Original Assignee
歌尔声学股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 歌尔声学股份有限公司 filed Critical 歌尔声学股份有限公司
Priority to US16/083,617 priority Critical patent/US10582323B2/en
Publication of WO2017161653A1 publication Critical patent/WO2017161653A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H04R3/002—Damping circuit arrangements for transducers, e.g. motional feedback circuits
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the present invention relates to the field of electroacoustic products, and more particularly to a speaker module housing and a method for manufacturing the speaker module housing.
  • the common speakers mainly include moving coil speakers, electromagnetic speakers, capacitive speakers, piezoelectric speakers, etc.
  • the moving coil speakers have the characteristics of relatively simple production, low cost, and good low frequency sounding.
  • the existing moving coil speaker is also called a moving coil speaker module, which generally includes a speaker module housing and a speaker unit, wherein the speaker module housing includes an upper shell and a lower shell, and the upper shell and the lower shell are assembled Together, a cavity for housing the speaker unit is formed.
  • the vibration displacement technology of the diaphragm using the capacitor feedback speaker has been widely used.
  • the capacitive feedback diaphragm vibration displacement technology needs to be in the speaker module.
  • a steel sheet is injection molded on the upper shell of the casing as the upper plate of the capacitor, and another steel sheet is placed on the DOME (ball top) of the speaker unit as the lower plate of the capacitor; when the moving coil speaker operates, the capacitor The capacitance changes, and the vibration displacement of the diaphragm is fed back by the capacitance change of the capacitor, thereby achieving the purpose of improving the acoustic performance of the speaker by monitoring the vibration displacement of the diaphragm of the speaker unit.
  • the speaker unit of the integrated speaker module is not a separate component, the components of the speaker unit are directly assembled in the upper casing of the speaker module housing, so on the upper casing of the speaker module housing. After injection molding the steel sheet, it is no longer possible to assemble the components of the speaker unit in the speaker module housing, that is, the capacitive feedback diaphragm vibration displacement technology that needs to first inject the steel sheet on the upper shell cannot be applied in the integrated speaker module. This directly hinders the improvement of the acoustic performance of the integrated speaker module.
  • a speaker module housing including an upper case and a lower case, further comprising an annular connecting member and a plate member, the annular connecting member including a fixing portion and a connecting portion;
  • the housing is provided with a speaker unit mounting hole, and the fixing portion of the annular connecting member is fixedly connected to the speaker unit mounting hole, and the connecting portion of the annular connecting member is electrically connected to the plate member.
  • the connecting portion is located at an inner ring of the annular connecting member, and the fixing portion is located at an outer ring of the annular connecting member.
  • the edge of the fixing portion is provided with a plurality of grooves and at least one signal collecting leg.
  • the annular connecting member includes a first side, a second side, a third side and a fourth side which are connected end to end, and the first side is disposed corresponding to the third side, and the second side is The fourth side corresponds to the setting, and the side lengths of the first side and the third side are smaller than the side lengths of the second side and the fourth side, and the first side and the third side
  • the size of the groove on the edge is smaller than the size of the groove on the edges of the second side and the four sides.
  • the signal acquisition leg includes one, and the signal acquisition leg extends from an edge of the second side or the fourth side toward a direction away from the lower case.
  • the shape of the plate member matches the shape of the inner ring of the annular connector.
  • the connecting portion of the annular connecting member is electrically connected to the plate member by a conductive adhesive.
  • the annular connecting piece is an annular steel sheet.
  • the annular connector is configured to be fixedly coupled to the upper casing as an insert by injection molding.
  • Another object of the present invention is to provide a method of manufacturing a housing for a speaker module to achieve a preferred combination of the upper housing and the annular connector.
  • an upper casing for a speaker module housing comprising the steps of:
  • the fixing portion of the annular connecting member is injection-molded as an insert and fixed in the speaker unit mounting hole of the upper shell of the speaker module housing;
  • the plate member is electrically connected to the connecting portion of the annular connecting member described in the step 1) through the conductive adhesive.
  • the inventors of the present invention have found that in the prior art, there is a problem that the vibration feedback displacement technique of the capacitive feedback diaphragm needs to first inject the steel sheet on the upper casing and cannot be applied to the integrated speaker module. Therefore, the technical task to be achieved by the present invention or the technical problem to be solved is not thought of or expected by those skilled in the art, so the present invention is a new technical solution.
  • An advantageous effect of the present invention is that the speaker module housing of the present invention is fixedly connected to the annular connecting member at the speaker unit mounting hole of the upper casing, thereby ensuring that the components of the speaker unit can be self-assembled from the speaker unit assembly hole.
  • the upper shell is assembled and the plate member is connected with the ring connecting member, so that the capacitive feedback diaphragm vibration displacement technology is applied in the integrated speaker module, which is beneficial to the improvement of the acoustic performance of the integrated speaker module.
  • Another advantageous effect of the present invention is that the manufacturing method of the present invention fixes the annular connecting member as an insert into the upper casing of the speaker module housing, which not only effectively improves the connection strength between the annular connecting member and the upper casing, A better bonding force is obtained, and the electrode plate and the annular connecting member are electrically connected by a conductive adhesive, which is convenient for operation and is advantageous for improving production efficiency.
  • FIG. 1 is a schematic structural view of an embodiment of a speaker module housing according to the present invention.
  • Figure 2 is an exploded view of Figure 1;
  • FIG. 3 is a flow chart of an embodiment of a method for manufacturing an upper case of a speaker module housing according to the present invention.
  • Speaker Module Housing-1 Upper Shell-11, Speaker Unit Mounting Hole -111, Lower Shell-12, Ring Shape connector-13, fixing portion -131, connecting portion -132, groove -133, signal collecting leg -134, first side -135, second side -136, third side -137, fourth side -138 , plate -14.
  • the present invention proposes a speaker module housing, as shown in FIG. 1 and FIG. 2, including an upper shell 11 and a lower shell 12, Also included is an annular connecting member 13 and a plate member 14, the annular connecting member 13 comprising a fixing portion 131 and a connecting portion 132, the plate member 14 being a plate of a capacitor, and the plate member 14 being generally a steel plate;
  • the speaker housing 11 is provided with a speaker unit mounting hole 111.
  • the fixing portion 131 of the ring connecting member 13 is fixedly connected to the speaker unit mounting hole 111.
  • the connecting portion 132 of the ring connecting member 13 and the pole are The board 14 is electrically connected.
  • the upper case 11 is the upper case of the housing of the integrated speaker module, and the speaker unit assembly hole 111 of the upper case 11 is used for assembling the components of the speaker unit, that is, the speaker unit.
  • the components can be assembled into the upper casing 11 from the speaker unit mounting hole 111; the fixed connection between the fixing portion 131 of the annular connecting member 13 and the speaker unit mounting hole 111 can be achieved by injection molding or gluing.
  • the electrical connection can be realized by soldering or conductive glue or conductor connection, and the assembly between the upper shell 11 and the lower shell 12 can be realized by a method well known in the art such as gluing or ultrasonic sealing, and the present invention does not Further limited.
  • the annular connecting member 13 does not block the speaker unit mounting hole, and can be fixedly connected before the assembly components of the speaker unit are assembled to the upper casing 11 or the components of the speaker unit are assembled to the upper casing 11
  • the plate member 14 is electrically connected to the ring-shaped connecting member 13.
  • the other plate monitors the vibration displacement of the diaphragm by the change in capacitance of the capacitor composed of the plate member 14 and the other plate.
  • the speaker module housing of the present invention is fixedly connected to the annular connecting member 13 at the speaker unit mounting hole 111 of the upper casing 11, so that the components of the speaker unit can be self-assembled from the speaker unit mounting hole 111 in the upper casing 11.
  • the assembly and the connection of the plate member 14 and the annular connecting member 13 enable the capacitive feedback diaphragm vibration displacement technology to be applied in the integrated speaker module, which is beneficial to the improvement of the acoustic performance of the integrated speaker module.
  • the connecting portion 132 is located at an inner ring of the annular connecting member 13
  • the fixing portion 131 is located at an outer ring of the annular connecting member 13
  • the connecting portion 132 and the fixing portion 131 respectively
  • the design of the inner and outer rings located in the annular connecting member 13 facilitates more fully and rationally utilizing the annular structure of the annular connecting member 13 to prevent the fixing portion 131 or the connecting portion 132 from interfering with the assembly of the components of the speaker unit in the upper casing 11.
  • the connection between the fixing portion 131 and the connecting portion 132 may be a smooth transition or a corner transition, which is not further limited in the present invention.
  • the edge of the fixing portion 131 is provided with a plurality of grooves 133, and the arrangement of the grooves 133 can increase the fixing portion 131 and the speaker unit mounting hole 111.
  • the concentrated stress dispersion is weakened when combined, and the deformation of the annular connecting member 13 is avoided to affect the connection with the plate member 14; in addition, at least one signal collecting leg 134 may be disposed at the edge of the fixing portion 131, and the signal collecting leg 134 is After the related wires and the like are connected, the relevant capacitance data of the plate member 14 can be output to realize the collection of the capacitance data, and those skilled in the art can easily know how to collect the data output by the signal acquisition leg 134, and the present invention does not falsify here. Said.
  • the annular connecting member 13 is prevented from being deformed, and the annular connecting member 13 includes a first side 135, a second side 136, a third side 137 and a fourth end which are connected end to end.
  • the first side 135 is disposed corresponding to the third side 137
  • the second side 136 is disposed corresponding to the fourth side 138
  • the first side 135 and the third side 137 are disposed.
  • the side length is smaller than the side lengths of the second side 136 and the fourth side 138, and the size of the groove 133 on the edges of the first side 135 and the third side 137 is smaller than the second side 136 and the size of the groove 133 on the edge of the four sides 138.
  • the design of the larger groove 133 on the longer side is advantageous for dispersing and weakening the ring as much as possible under the condition that the structure of the ring connecting member 13 is stable.
  • the concentrated stress when the connecting member 13 is combined with the upper casing 11 better avoids deformation of the annular connecting member 13.
  • the above definitions of "first”, “second”, “third” and “fourth” are only used to distinguish the sides constituting the annular joint member 13.
  • the signal acquisition leg 134 includes one and The signal acquisition leg 134 extends from the edge of the second side 136 or the fourth side 138 in a direction away from the lower case 12.
  • the shape of the plate member 14 matches the shape of the inner ring of the annular connector 13, which design facilitates the improvement between the plate member 14 and the annular connector 13. Connection strength.
  • the connecting portion 132 of the annular connecting member 13 is electrically connected to the plate member 14 by a conductive paste (not shown).
  • the annular connecting member 13 is an annular steel piece, and other electrically conductive ones may be used. Alloy, however, based on cost control considerations, the use of an annular steel sheet as the annular connecting member 13 is a preferred embodiment.
  • the speaker module housing 1 is more conveniently manufactured, and the annular connector 13 is set as an insert. Attached to the upper casing 11 by injection molding, that is, the ring The shaped connecting member 13 is placed as an insert in the mold of the upper casing 11, and the annular connecting member 13 is made to correspond to the portion of the mold for molding the speaker unit fitting hole 111, such that the annular connecting member 13 and the formed upper portion
  • the shell 11 can be fixedly connected as a whole.
  • the present invention also provides a method of manufacturing an upper case for a speaker module housing to achieve a better combination between the upper case 11 and the annular connecting member 13, and FIG. 3 shows an implementation of the manufacturing method.
  • the method specifically includes the following steps:
  • the fixing portion 131 of the annular connecting member 13 is injection-molded as an insert in the speaker unit mounting hole 111 of the upper casing 11 of the speaker module housing 1, that is, the annular connecting member 13 is placed as an insert on the thermoforming vibration.
  • the annular connecting member 13 corresponds to the portion of the mold for molding the speaker unit mounting hole 111, such that the annular connecting member 13 and the formed upper shell 11 can be fixedly connected as a whole;
  • the plate member 14 is electrically connected to the connecting portion 132 of the annular connecting member 13 described in the step 1) by a conductive adhesive.
  • the annular connecting member 13 is injection-molded as an insert in the upper casing 11 of the speaker module housing 1, which not only effectively improves the connection strength between the annular connecting member 13 and the upper casing 11, but also obtains a better
  • the bonding force, and the electrode plate 14 and the annular connecting member 13 are electrically connected by the conductive adhesive, which is convenient to operate and is advantageous for improving production efficiency.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

本发明公开了一种扬声器模组壳体及用于扬声器模组壳体的制造方法，其中前者包括上壳和下壳，还包括环形连接件和极板件，所述环形连接件包括固定部和连接部；所述上壳上设有扬声器单体装配孔，所述环形连接件的固定部与所述扬声器单体装配孔固定连接，所述环形连接件的连接部与所述极板件电性连接。本发明的扬声器模组壳体通过在上壳的扬声器单体装配孔处固定连接环形连接件，保证了扬声器单体的各组成部件可自扬声器单体装配孔在上壳内组装，并将极板件与环形连接件连接在一起，从而将电容反馈振膜振动位移技术应用在一体化扬声器模组中，有利于一体化扬声器模组的声学性能的提高.

Description

一种扬声器模组壳体及用于扬声器模组壳体的制造方法 技术领域
本发明涉及电声产品技术领域，更具体地，涉及一种扬声器模组壳体，及用于该扬声器模组壳体的制造方法。
背景技术
扬声器作为一种用于手机、电视、计算机等电子产品的发声器件，被广泛应用于人们的日常生产和生活中。目前常见的扬声器主要有动圈式扬声器、电磁式扬声器、电容式扬声器、压电式扬声器等，其中的动圈式扬声器因具有制作相对简单、成本低廉、有较好的低频发声优势等特点。
现有的动圈式扬声器又称为动圈式扬声器模组，其通常包括扬声器模组壳体和扬声器单体，其中扬声器模组壳体包括上壳和下壳，上壳和下壳装配在一起形成了用于收容扬声器单体的腔体。
随着人们对动圈式扬声器的声学性能要求的提高，使用电容反馈扬声器单体的振膜的振动位移技术得到了更加广泛的应用，具体地，电容反馈振膜振动位移技术需要在扬声器模组壳体的上壳上注塑一钢片作为电容器的上极板，在扬声器单体的DOME(球顶部)上设置另一钢片作为电容器的下极板；当动圈式扬声器工作时，电容器的电容发生变化，通过电容器的电容变化来反馈振膜的振动位移，从而实现通过对扬声器单体的振膜的振动位移的监控来提高扬声器声学性能的目的。
由于一体化扬声器模组的扬声器单体不是一个独立的部件，而是扬声器单体的各组成零部件直接组装在扬声器模组壳体的上壳中，因此在扬声器模组壳体的上壳上注塑钢片后无法再在扬声器模组壳体中组装扬声器单体的各组成部件，即需要先在上壳上注塑钢片的电容反馈振膜振动位移技术无法应用在一体化扬声器模组中，这直接阻碍了一体化扬声器模组声学性能的提升。
发明内容
本发明的一个目的是提供一种扬声器模组壳体，以将电容反馈振膜振动位移技术应用至一体化扬声器模组中。
根据本发明的第一方面，提供了一种扬声器模组壳体，包括上壳和下壳，还包括环形连接件和极板件，所述环形连接件包括固定部和连接部；所述上壳上设有扬声器单体装配孔，所述环形连接件的固定部与所述扬声器单体装配孔固定连接，所述环形连接件的连接部与所述极板件电性连接。
优选地，所述连接部位于所述环形连接件的内环，所述固定部位于所述环形连接件的外环。
更优选地，所述固定部的边缘设有多个凹槽和至少一个信号采集支脚。
进一步地，所述环形连接件包括彼此首尾相连的第一边、第二边、第三边和第四边，所述第一边与所述第三边对应设置，所述第二边与所述第四边对应设置，且所述第一边和所述第三边的边长小于所述第二边和所述第四边的边长，所述第一边和所述第三边的边缘上的所述凹槽的尺寸小于所述第二边和所述四边的边缘上的所述凹槽的尺寸。
更进一步地，所述信号采集支脚包括一个，且所述信号采集支脚自所述第二边或所述第四边的边缘朝向远离所述下壳的方向延伸。
优选地，所述极板件的形状与所述环形连接件的内环的形状相匹配。
优选地，所述环形连接件的连接部通过导电胶与所述极板件电性连接。
优选地，所述环形连接件为环形钢片。
优选地，所述环形连接件被设为作为嵌件与所述上壳通过注塑成型固定连接在一起。
本发明的另一个目的是提供一种用于扬声器模组壳体的制造方法，以实现上壳与环形连接件之间的较佳结合。
根据本发明的第二方面，本发明提供了一种用于扬声器模组壳体的上壳的制造方法，其包括如下步骤：
1)将环形连接件的固定部作为嵌件注塑成型固定在扬声器模组壳体的上壳的扬声器单体装配孔中；
2)将极板件通过导电胶与步骤1)中所述的环形连接件的连接部电性连接。
本发明的发明人发现，在现有技术中，存在因电容反馈振膜振动位移技术需要先在上壳上注塑钢片而无法应用在一体化扬声器模组中的问题。因此，本发明所要实现的技术任务或者所要解决的技术问题是本领域技术人员从未想到的或者没有预期到的，故本发明是一种新的技术方案。
本发明的一个有益效果在于，本发明的扬声器模组壳体通过在上壳的扬声器单体装配孔处固定连接环形连接件，保证了扬声器单体的各组成部件可自扬声器单体装配孔在上壳内组装，并将极板件与环形连接件连接在一起，从而将电容反馈振膜振动位移技术应用在一体化扬声器模组中，有利于一体化扬声器模组的声学性能的提高。
本发明的另一个有益效果在于，本发明的制造方法将环形连接件作为嵌件注塑成型固定在扬声器模组壳体的上壳中，不但有效提高环形连接件与上壳之间的连接强度，获得较佳的结合力，而且极板件与环形连接件通过导电胶电性连接操作方便，有利于提高生产效率。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例，并且连同其说明一起用于解释本发明的原理。
图1为本发明扬声器模组壳体实施例的结构示意图；
图2为图1的爆炸图；
图3为本发明用于扬声器模组壳体的上壳的制造方法实施例的流程图。
图中标示如下：
扬声器模组壳体-1，上壳-11，扬声器单体装配孔-111，下壳-12，环 形连接件-13，固定部-131，连接部-132，凹槽-133，信号采集支脚-134，第一边-135，第二边-136，第三边-137，第四边-138，极板件-14。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
本发明为了解决电容反馈振膜振动位移技术无法应用在一体化扬声器模组的问题，提出了一种扬声器模组壳体，如图1和图2所示，包括上壳11和下壳12，还包括环形连接件13和极板件14，所述环形连接件13包括固定部131和连接部132，上述极板件14可作为电容器的极板，极板件14通常可为钢片；所述上壳11上设有扬声器单体装配孔111，所述环形连接件13的固定部131与所述扬声器单体装配孔111固定连接，所述环形连接件13的连接部132与所述极板件14电性连接。本领域技术人员应当清楚，上述上壳11为一体化扬声器模组的壳体的上壳，上壳11的扬声器单体装配孔111用于装配扬声器单体的各组成部件用，即扬声器单体的各组成部件可自扬声器单体装配孔111中装配至上壳11内；上述环形连接件13的的固定部131与扬声器单体装配孔111之间的固定连接可采用注塑或胶粘等方式实现，上述环形连接件13的连接部132与极板件14之间的 电性连接可采用焊接或导电胶或导体连接等方式实现，上述上壳11和下壳12之间的装配可采用本领域熟知的方式例如胶粘或超声密封等方式实现，本发明对此不作进一步限定。
这样，环形连接件13并不会封堵扬声器单体装配孔，其可在扬声器单体的各组装部件组装至上壳11前或扬声器单体的各组成部件组装至上壳11后再固定连接在上壳11的扬声器单体装配孔111处，再将极板件14电性连接至环形连接件13，当然，本领域技术人员可容易想到，在DOME上再设置一与极板件14相对应的另一极板，以通过由极板件14和另一极板组成的电容器的电容变化来监控振膜的振动位移。
本发明的扬声器模组壳体通过在上壳11的扬声器单体装配孔111处固定连接环形连接件13，保证了扬声器单体的各组成部件可自扬声器单体装配孔111在上壳11内组装，并将极板件14与环形连接件13连接在一起，从而将电容反馈振膜振动位移技术应用在一体化扬声器模组中，有利于一体化扬声器模组的声学性能的提高。
如图2的具体实施例所示，所述连接部132位于所述环形连接件13的内环，所述固定部131位于所述环形连接件13的外环，连接部132和固定部131分别位于环形连接件13的内外环的设计有利于更加充分合理的利用环形连接件13的环形结构，以避免固定部131或连接部132干涉到扬声器单体的各组成部件在上壳11内的组装。固定部131和连接部132之间的连接处可为平滑过渡或折角过渡，本发明对此不作进一步地限定。
为了提高固定部131与上壳11之间连接的可靠性，所述固定部131的边缘设有多个凹槽133，凹槽133的设置可增大固定部131与扬声器单体装配孔111之间的结合力，而且由于环形连接件13通常厚度薄，尺寸小，其与上壳11结合时极易因应力集中问题而变形，凹槽133的设置还有利于将环形连接件13与上壳11结合时集中的应力分散减弱，避免环形连接件13变形而影响到与极板件14之间的连接；此外，固定部131的边缘还可设置至少一个信号采集支脚134，信号采集支脚134与相关导线等连接后可将极板件14的相关电容数据输出，实现电容数据的采集，本领域技术人员可容易知道如何采集信号采集支脚134输出的数据，本发明在此不作赘 述。
进一步地，为了提高环形连接件13的结构的稳定性，防止环形连接件13变形，所述环形连接件13包括彼此首尾相连的第一边135、第二边136、第三边137和第四边138，所述第一边135与所述第三边137对应设置，所述第二边136与所述第四边138对应设置，且所述第一边135和所述第三边137的边长小于所述第二边136和所述第四边138的边长，所述第一边135和所述第三边137的边缘上的所述凹槽133的尺寸小于所述第二边136和所述四边138的边缘上的所述凹槽133的尺寸，这种较长边上设置更大凹槽133的设计有利于在环形连接件13的结构稳定的前提下，尽量分散减弱环形连接件13与上壳11结合时集中的应力，更好地避免环形连接件13变形。上述“第一”、“第二”、“第三”和“第四”的限定仅用于区分组成环形连接件13的各边。
由于过多信号采集支脚134会影响到环形连接件13与扬声器单体装配孔111之间的连接以及影响到环形连接件13结构的稳定性，因此，所述信号采集支脚134包括一个，且所述信号采集支脚134自所述第二边136或所述第四边138的边缘朝向远离所述下壳12的方向延伸。
在本发明的一个优选实施例中，所述极板件14的形状与所述环形连接件13的内环的形状相匹配，这种设计有利于提高极板件14和环形连接件13之间的连接强度。
为了更方便地将环形连接件13与极板件14连接在一起，所述环形连接件13的连接部132通过导电胶(图中未示出)与所述极板件14电性连接。
为了使环形连接件13能够以尽可能薄的厚度获得合适的刚性，或者是能够在相同的厚度下获得更大的刚性，所述环形连接件13为环形钢片，也可以采用其它可导电的合金，但是，基于成本控制的考虑，采用环形钢片作为环形连接件13为较佳的实施例。
为了在保证环形连接件13与上壳11的扬声器单体装配孔111两者结合的可靠性前提下，更加方便地制造扬声器模组壳体1，所述环形连接件13被设为作为嵌件与所述上壳11通过注塑成型固定连接在一起，即将环 形连接件13作为嵌件放置于上壳11的模具中，且使环形连接件13与模具的用于成型扬声器单体装配孔111的部分相对应，这样，环形连接件13与成型后的上壳11便可固定连接为一个整体。
本发明还提供了一种用于扬声器模组壳体的上壳的制造方法，以实现上壳11与环形连接件13之间的较佳结合，图3示出了该制造方法的一种实施方式，其具体包括以下步骤：
1)将环形连接件13的固定部131作为嵌件注塑成型固定在扬声器模组壳体1的上壳11的扬声器单体装配孔111中，即将环形连接件13作为嵌件放置于热成型振膜21的模具中，且使环形连接件13与模具的用于成型扬声器单体装配孔111的部分相对应，这样，环形连接件13与成型后的上壳11便可固定连接为一个整体；
2)将极板件14通过导电胶与步骤1)中所述的环形连接件13的连接部132电性连接。
本发明的制造方法将环形连接件13作为嵌件注塑成型固定在扬声器模组壳体1的上壳11中，不但有效提高环形连接件13与上壳11之间的连接强度，获得较佳的结合力，而且极板件14与环形连接件13通过导电胶电性连接操作方便，有利于提高生产效率。
虽然已经通过例子对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (10)

  1. 一种扬声器模组壳体，包括上壳和下壳，其特征在于，还包括环形连接件和极板件，所述环形连接件包括固定部和连接部；所述上壳上设有扬声器单体装配孔，所述环形连接件的固定部与所述扬声器单体装配孔固定连接，所述环形连接件的连接部与所述极板件电性连接。
  2. 根据权利要求1所述的扬声器模组壳体，其特征在于，所述连接部位于所述环形连接件的内环，所述固定部位于所述环形连接件的外环。
  3. 根据权利要求2所述的扬声器模组壳体，其特征在于，所述固定部的边缘设有多个凹槽和至少一个信号采集支脚。
  4. 根据权利要求3所述的扬声器模组壳体，其特征在于，所述环形连接件包括彼此首尾相连的第一边、第二边、第三边和第四边，所述第一边与所述第三边对应设置，所述第二边与所述第四边对应设置，且所述第一边和所述第三边的边长小于所述第二边和所述第四边的边长，所述第一边和所述第三边的边缘上的所述凹槽的尺寸小于所述第二边和所述四边的边缘上的所述凹槽的尺寸。
  5. 根据权利要求4所述的扬声器模组壳体，其特征在于，所述信号采集支脚包括一个，且所述信号采集支脚自所述第二边或所述第四边的边缘朝向远离所述下壳的方向延伸。
  6. 根据权利要求1所述的扬声器模组壳体，其特征在于，所述极板件的形状与所述环形连接件的内环的形状相匹配。
  7. 根据权利要求1所述的扬声器模组壳体，其特征在于，所述环形连接件的连接部通过导电胶与所述极板件电性连接。
  8. 根据权利要求1所述的扬声器模组壳体，其特征在于，所述环形连接件为环形钢片。
  9. 根据权利要求1至8任一项中所述的扬声器模组壳体，其特征在于，所述环形连接件被设为作为嵌件与所述上壳通过注塑成型固定连接在一起。
  10. 一种用于扬声器模组壳体的上壳的制造方法，其特征在于，包括 如下步骤：
    1)将环形连接件的固定部作为嵌件注塑成型固定在扬声器模组壳体的上壳的扬声器单体装配孔中；
    2)将极板件通过导电胶与步骤1)中所述的环形连接件的连接部电性连接。
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