WO2016155326A1 - 一种扬声器模组 - Google Patents
一种扬声器模组 Download PDFInfo
- Publication number
- WO2016155326A1 WO2016155326A1 PCT/CN2015/094884 CN2015094884W WO2016155326A1 WO 2016155326 A1 WO2016155326 A1 WO 2016155326A1 CN 2015094884 W CN2015094884 W CN 2015094884W WO 2016155326 A1 WO2016155326 A1 WO 2016155326A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- connecting portion
- fpcb board
- flexible connecting
- lead
- speaker module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
- H04R9/025—Magnetic circuit
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
- H04R9/04—Construction, mounting, or centering of coil
- H04R9/046—Construction
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/021—Casings; Cabinets ; Supports therefor; Mountings therein incorporating only one transducer
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/006—Interconnection of transducer parts
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/16—Mounting or tensioning of diaphragms or cones
- H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
- H04R9/04—Construction, mounting, or centering of coil
- H04R9/045—Mounting
Definitions
- the present invention relates to the field of sounding devices, and more particularly to a speaker module.
- a speaker is an important acoustic component in an electronic device that is a transducer that converts an electrical signal into an acoustic signal.
- An existing speaker module includes a housing, and a vibration system and a magnetic circuit system disposed in the housing, wherein the vibration system includes a diaphragm and a voice coil disposed on the diaphragm for driving the diaphragm to sound, wherein the voice coil
- the leads can be soldered to the injection molded pads or soldered directly to the FPCB board.
- connection structure is easy to cause breakage of the lead wire due to long-term vibration of the voice coil due to soldering of the lead wire to the injection molded pad or directly to the FPCB board.
- One existing method is to increase the length of the lead wire, which requires a larger wiring space, and if the lead wire is too long, the lead wire itself tends to exacerbate the occurrence of cracking under the action of resonance.
- a speaker module comprising a cavity formed by a casing, a voice coil mounted in the cavity of the casing, an FPCB board, and a lead wire of the voice coil, and the lead wire and the FPCB a flexible connection between the plates, the free end of the lead is connected to one end of the flexible connection, the other end of the flexible connection is connected to the FPCB board; the flexible connection is suspended on the outer casing by a lead and an FPCB board In the inner cavity.
- the free end of the lead is soldered to the flexible connection.
- the flexible connecting portion is integrally formed with the FPCB board, which is an extension extending from the end of the FPCB board toward the free end of the lead.
- the flexible connecting portion comprises a first portion substantially in the same plane as the FPCB board a planar segment, a second planar segment substantially in the same plane as the free end of the lead, and a connecting segment connecting the first planar segment and the second planar segment.
- the outer casing includes an upper casing, a middle casing and a lower casing which are sequentially fastened together, and the FPCB board is fixed on the middle casing.
- one end of the FPCB board for connecting the flexible connecting portion is provided with a positioning hole, and the middle case is provided with a protruding positioning post at a corresponding position.
- one end of the FPCB board for connecting the flexible connecting portion is fixed to the middle case by means of heat fusion.
- one end of the FPCB board for connecting the flexible connecting portion is fixed to the middle case by a double-sided tape.
- the lead wire and the FPCB board are connected by a flexible connecting portion, and the flexible connecting portion is suspended in the inner cavity of the module.
- the voice coil vibrates
- the lead wire can vibrate together with the flexible connecting portion, that is, the pad connected between the lead wire and the flexible connecting portion can be vibrated along with the lead wire, thereby effectively preventing the lead wire from being connected with the flexible wire.
- the disconnection and breakage of the connection position improves the reliability of the speaker module, and also avoids the problem of large space requirement and resonance of the module caused by the extension of the lead in the conventional scheme.
- the inventors of the present invention have found that in the prior art, there is a problem that the lead wire is detached and broken at the pad position. Therefore, the technical task to be achieved by the present invention or the technical problem to be solved is not thought of or expected by those skilled in the art, so the present invention is a new technical solution.
- FIG. 1 is an exploded view of a speaker module of the present invention.
- FIG. 2 is a schematic view showing the internal structure of the speaker module of the present invention.
- Figure 3 is a cross-sectional view taken along line B-B of Figure 2;
- Fig. 4 is a partially enlarged view showing a position where a lead wire and a flexible connecting portion are connected in another embodiment of the present invention.
- Fig. 5 is a schematic structural view of a flexible connecting portion in another embodiment of the present invention.
- the present invention provides a speaker module including an inner cavity formed by a casing, and a magnetic circuit system 9 and a vibration system installed in the inner cavity of the casing.
- the magnetic circuit system 9 includes a basin frame and a magnet. , Huasi, etc., wherein the magnet is located in the basin frame, and a magnetic gap is formed between the magnet and the side wall of the basin frame.
- the vibration system includes a diaphragm 6 fixed in the inner cavity, and a voice coil 8 that drives the diaphragm 6 to sound, the voice coil 8 is fixed to the diaphragm 6, and is suspended between the magnet and the side wall of the basin frame. In the gap, the center of the diaphragm 6 may also be provided with a dome or the like.
- the voice coil 8 When the voice coil 8 is energized, the voice coil 8 vibrates under the action of the magnetic circuit system 9, and at the same time, the voice coil 8 drives the diaphragm 6 to vibrate together to realize the sound of the diaphrag
- the outer casing includes an upper casing 5, a middle casing 3, and a lower casing 1 which are sequentially fastened together, and the upper casing 5 is fastened to one side of the middle casing 3, and the lower casing 1 is fastened to The other side of the middle casing 3 encloses a cavity for mounting the magnetic circuit system 9 and the vibration system.
- the speaker module of the present invention further includes a lead 10 of the voice coil 8, and an FPCB board 2 located in the speaker module.
- the FPCB board 2 can be mounted on the middle case 3.
- the speaker module of the present invention further includes a flexible connecting portion 11 between the lead 10 and the FPCB board 2 for connecting the lead 10 and the FPCB board 2.
- the free end of the lead 10 is connected to one end of the flexible connecting portion 11 , for example, by soldering; the other end of the flexible connecting portion 11 is connected to the FPCB board 2 .
- the flexible connecting portion 11 is suspended in the inner cavity of the outer casing by the lead 10 and the FPCB board 2.
- the lead 10 and the FPCB board 2 are connected by a flexible connecting portion 11, and the flexible connecting portion 11 is suspended in the inner cavity of the module.
- the lead 10 can vibrate together with the flexible connecting portion 11, that is, the pad connected between the lead 10 and the flexible connecting portion 11 can be vibrated along with the lead 10, so that the lead can be effectively prevented
- the fall-off and breakage of the connection position with the flexible connecting portion 11 improves the reliability of the speaker module, and also avoids the problem of large space requirement and resonance of the module caused by lengthening the lead wire in the conventional solution.
- the flexible connecting portion 11 of the present invention may be integrally formed with the FPCB board 2, which is an extending portion extending from the end of the FPCB board 2 toward the free end of the lead 10.
- the flexible joint 11 can also be made of a thin steel sheet material.
- one end of the FPCB board 2 for connecting the flexible connecting portion 11 is provided with a positioning hole, and the corresponding position of the middle shell 3 is provided with a convex portion.
- the one end of the FPCB board 2 for connecting the flexible connecting portion 11 is fixed to the middle case 3 by means of hot melt or double-sided tape.
- the flexible connecting portion 11 includes a first planar section 110 substantially in the same plane as the FPCB board 2, substantially located at the free end of the lead 10. a second plane segment 112 in the same plane, and Referring to FIG. 5, the connecting section 111 of the first plane segment 110 and the second plane segment 112 is connected.
- the flexible connecting portion 11 further includes a flexible connecting portion pad 113 at the end of the second planar portion 112, through which the flexible connecting portion pad 113 will It is soldered or otherwise secured to the FPCB board 2.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Abstract
Description
Claims (8)
- 一种扬声器模组,其特征在于:包括由外壳构成的内腔,以及安装在外壳内腔中的音圈(8)、FPCB板(2),还包括音圈(8)的引线(10),以及位于引线(10)与FPCB板(2)之间的柔性连接部(11),所述引线(10)的自由端与柔性连接部(11)的一端连接,所述柔性连接部(11)的另一端与FPCB板(2)连接;所述柔性连接部(11)通过引线(10)、FPCB板(2)悬置在外壳的内腔中。
- 根据权利要求1所述的扬声器模组,其特征在于:所述引线(10)的自由端与柔性连接部(11)焊接在一起。
- 根据权利要求1所述的扬声器模组,其特征在于:所述柔性连接部(11)与FPCB板(2)一体成型,其为从FPCB板(2)端头向引线(2)自由端方向延伸的延伸部。
- 根据权利要求1所述的扬声器模组,其特征在于:所述柔性连接部(11)包括基本与FPCB板(2)位于同一平面上的第一平面段(110),基本与引线(2)自由端位于同一平面内的第二平面段(112),以及连接第一平面段(110)、第二平面段(112)的连接段(111)。
- 根据权利要求1所述的扬声器模组,其特征在于:所述外壳包括依次扣合在一起的上壳(5)、中壳(3)、下壳(1),所述FPCB板(2)固定在中壳(3)上。
- 根据权利要求5所述的扬声器模组,其特征在于:所述FPCB板(2)上用于连接柔性连接部(11)的一端设置有定位孔,所述中壳(3)上相应的位置设置有凸起的定位柱(4)。
- 根据权利要求6所述的扬声器模组,其特征在于:所述FPCB板(2)用于连接柔性连接部(11)的一端通过热熔的方式与中壳(3)固定。
- 根据权利要求6所述的扬声器模组,其特征在于:所述FPCB板(2)用于连接柔性连接部(11)的一端通过双面胶与中壳(3)固定。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/524,135 US10149062B2 (en) | 2015-03-31 | 2015-11-18 | Loudspeaker module |
| KR1020177010841A KR101965083B1 (ko) | 2015-03-31 | 2015-11-18 | 스피커 모듈 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510149270.3A CN104822111B (zh) | 2015-03-31 | 2015-03-31 | 一种扬声器模组 |
| CN201510149270.3 | 2015-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2016155326A1 true WO2016155326A1 (zh) | 2016-10-06 |
Family
ID=53732255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2015/094884 Ceased WO2016155326A1 (zh) | 2015-03-31 | 2015-11-18 | 一种扬声器模组 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10149062B2 (zh) |
| KR (1) | KR101965083B1 (zh) |
| CN (1) | CN104822111B (zh) |
| WO (1) | WO2016155326A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11159863B2 (en) * | 2017-12-25 | 2021-10-26 | Goertek Inc. | Loudspeaker module and electronic device |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104822111B (zh) | 2015-03-31 | 2018-10-12 | 歌尔股份有限公司 | 一种扬声器模组 |
| CN206596208U (zh) * | 2017-02-13 | 2017-10-27 | 歌尔股份有限公司 | 发声装置中音圈的连接结构及发声装置 |
| CN207200964U (zh) * | 2017-06-30 | 2018-04-06 | 歌尔科技有限公司 | 扬声器单体以及扬声器模组 |
| CN107547974B (zh) * | 2017-07-04 | 2019-10-22 | 瑞声科技(新加坡)有限公司 | 扬声器箱 |
| CN109451404B (zh) * | 2018-12-18 | 2023-08-04 | 东莞顺合丰电业有限公司 | 扬声器振动组件的组装治具 |
| CN110970674B (zh) * | 2019-11-12 | 2021-05-25 | 深圳欣旺达智能科技有限公司 | 锂电池保护板及锂电池 |
| CN110933574B (zh) * | 2019-11-30 | 2021-06-15 | 捷开通讯(深圳)有限公司 | 一种扬声器 |
| KR102771478B1 (ko) | 2020-07-14 | 2025-02-24 | 삼성전자 주식회사 | 전자 장치 및 전자 장치에 포함된 스피커 구조체 |
| CN213938240U (zh) * | 2020-11-30 | 2021-08-10 | 瑞声科技(新加坡)有限公司 | 一种扬声器箱及移动终端 |
| CN214901294U (zh) * | 2020-12-24 | 2021-11-26 | 歌尔股份有限公司 | 扬声器模组及电子设备 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1630425A (zh) * | 2003-12-02 | 2005-06-22 | 日本先锋公司 | 扬声器装置 |
| EP2472905A1 (en) * | 2011-01-04 | 2012-07-04 | Knowles Electronics Asia PTE. Ltd. | Electroacoustic transducer |
| CN104254044A (zh) * | 2013-06-26 | 2014-12-31 | 亚德诺半导体股份有限公司 | 动圈式微型扬声器模块 |
| CN104822111A (zh) * | 2015-03-31 | 2015-08-05 | 歌尔声学股份有限公司 | 一种扬声器模组 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE3247941A1 (de) * | 1982-12-24 | 1984-06-28 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Lautsprecher |
| JP4444728B2 (ja) * | 2004-05-11 | 2010-03-31 | スター精密株式会社 | 電気音響変換器 |
| JP5191280B2 (ja) * | 2008-05-27 | 2013-05-08 | 株式会社ジャパンディスプレイウェスト | 電子デバイス及び電子機器 |
| KR20110029264A (ko) * | 2009-09-15 | 2011-03-23 | 주식회사 비에스이 | 보이스코일 및 이를 이용한 smt 마이크로 스피커 |
| WO2012023709A2 (ko) * | 2010-08-18 | 2012-02-23 | 주식회사 이엠텍 | 음향 변환 장치 |
| KR101297658B1 (ko) * | 2012-03-08 | 2013-08-21 | 주식회사 엑셀웨이 | 평판 스피커용 fpcb 일체형 리드 플레이트 |
| EP2866468A4 (en) * | 2012-06-26 | 2016-02-24 | Clarion Co Ltd | ACOUSTIC COIL SPEAKER |
| KR101983792B1 (ko) * | 2012-07-30 | 2019-05-29 | 삼성전자주식회사 | 휴대용 단말기의 스피커 모듈 |
| CN202799135U (zh) * | 2012-08-29 | 2013-03-13 | 歌尔声学股份有限公司 | 扬声器装置 |
| KR101395050B1 (ko) * | 2012-10-25 | 2014-05-19 | 주식회사 이엠텍 | 통풍 구조를 지닌 음향 변환 장치 |
| CN202949552U (zh) * | 2012-11-15 | 2013-05-22 | 瑞声光电科技(常州)有限公司 | 发声装置 |
| CN203086728U (zh) * | 2013-01-18 | 2013-07-24 | 歌尔声学股份有限公司 | 声学模组 |
| CN203618121U (zh) * | 2013-12-11 | 2014-05-28 | 歌尔声学股份有限公司 | 扬声器模组 |
| CN203708478U (zh) * | 2014-01-26 | 2014-07-09 | 歌尔声学股份有限公司 | 采用fpcb连接驱动源的扬声器 |
| CN203722813U (zh) * | 2014-02-12 | 2014-07-16 | 歌尔声学股份有限公司 | 扬声器模组 |
| CN204425606U (zh) * | 2015-01-29 | 2015-06-24 | 瑞声光电科技(常州)有限公司 | 扬声器及移动通信终端 |
| CN204442658U (zh) * | 2015-03-31 | 2015-07-01 | 歌尔声学股份有限公司 | 一种扬声器模组 |
-
2015
- 2015-03-31 CN CN201510149270.3A patent/CN104822111B/zh active Active
- 2015-11-18 US US15/524,135 patent/US10149062B2/en active Active
- 2015-11-18 KR KR1020177010841A patent/KR101965083B1/ko active Active
- 2015-11-18 WO PCT/CN2015/094884 patent/WO2016155326A1/zh not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1630425A (zh) * | 2003-12-02 | 2005-06-22 | 日本先锋公司 | 扬声器装置 |
| EP2472905A1 (en) * | 2011-01-04 | 2012-07-04 | Knowles Electronics Asia PTE. Ltd. | Electroacoustic transducer |
| CN104254044A (zh) * | 2013-06-26 | 2014-12-31 | 亚德诺半导体股份有限公司 | 动圈式微型扬声器模块 |
| CN104822111A (zh) * | 2015-03-31 | 2015-08-05 | 歌尔声学股份有限公司 | 一种扬声器模组 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11159863B2 (en) * | 2017-12-25 | 2021-10-26 | Goertek Inc. | Loudspeaker module and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104822111B (zh) | 2018-10-12 |
| US20180176690A1 (en) | 2018-06-21 |
| CN104822111A (zh) | 2015-08-05 |
| KR20170058426A (ko) | 2017-05-26 |
| KR101965083B1 (ko) | 2019-04-02 |
| US10149062B2 (en) | 2018-12-04 |
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