WO2016155324A1 - 一种扬声器模组 - Google Patents

一种扬声器模组 Download PDF

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Publication number
WO2016155324A1
WO2016155324A1 PCT/CN2015/094870 CN2015094870W WO2016155324A1 WO 2016155324 A1 WO2016155324 A1 WO 2016155324A1 CN 2015094870 W CN2015094870 W CN 2015094870W WO 2016155324 A1 WO2016155324 A1 WO 2016155324A1
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WO
WIPO (PCT)
Prior art keywords
induction coil
disposed
casing
speaker module
coil
Prior art date
Application number
PCT/CN2015/094870
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English (en)
French (fr)
Inventor
张志兵
陈钢
Original Assignee
歌尔声学股份有限公司
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Publication date
Application filed by 歌尔声学股份有限公司 filed Critical 歌尔声学股份有限公司
Priority to US15/542,858 priority Critical patent/US10277985B2/en
Publication of WO2016155324A1 publication Critical patent/WO2016155324A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/12—Non-planar diaphragms or cones
    • H04R7/127—Non-planar diaphragms or cones dome-shaped
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H04R9/045—Mounting
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H04R9/046—Construction
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the present invention relates to the field of sounding devices, and more particularly to a speaker module.
  • a speaker is an important acoustic component in an electronic device that is a transducer that converts an electrical signal into an acoustic signal.
  • An existing speaker module includes a housing, and a vibration system and a magnetic circuit system disposed in the housing, wherein the vibration system includes a diaphragm and a voice coil disposed on the diaphragm for driving the diaphragm to sound, the voice coil needs to pass The leads are connected to the system to achieve electrical communication.
  • the connection between the system and the voice coil is mainly through the FPCB board, the lead wire, the shrapnel, etc. These connection methods occupy a large space of the module, and the process is complicated, resulting in low reliability and good yield of the module. .
  • the PCB board of the system is placed inside the module, which also occupies a large space of the module.
  • a speaker module comprising a cavity surrounded by a casing, a speaker unit being disposed in a cavity of the casing, wherein the speaker unit is further provided for electrically connecting the terminal device
  • the first induction coil is further provided with a second induction coil disposed corresponding to the first induction coil for electrically connecting the voice coil of the speaker unit.
  • the first induction coil and the second induction coil are disposed opposite to each other.
  • the second induction coil is disposed in a lumen of the outer casing.
  • a magnetic conductive plate is respectively disposed on an end surface of the first induction coil and the second induction coil facing away from each other.
  • a magnetic conductive column or a magnetic conductive liquid is disposed in the through hole of the first induction coil and the second induction coil.
  • the outer casing includes an upper casing, a middle casing, and a lower casing that are sequentially fastened together.
  • the second induction coil is located on a side of the middle casing adjacent to the lower casing, and the first induction coil is located on the other side of the middle casing.
  • the first induction coil and the second induction coil are fixed on the middle casing by glue or injection molding.
  • the corresponding position of the middle casing is provided with a limiting slot for accommodating the first induction coil and the second induction coil.
  • the limiting groove is surrounded by a protrusion extending from the end surface of the middle casing.
  • the speaker module of the invention turns on the output end of the whole machine and the voice coil through the first induction coil and the second induction coil.
  • the space of the module can be greatly saved, so that a lighter and thinner machine can be developed.
  • problems such as poor performance due to resistance changes in the conventional acoustic and electrical connection methods are avoided.
  • the structure of the first induction coil and the second induction coil allows the first induction coil to be disposed outside the inner cavity, so that the outer casing can be sealed at one time, and the outer lead is not required to be leaded, thereby avoiding the secondary sealing of the lead position. It greatly simplifies the production, transportation and assembly of the speaker module with the terminal device.
  • connection between the terminal device and the voice coil adopts a lead wire or the like, and these connection modes occupy a large space of the module, and the process is complicated, resulting in reliability and yield of the module. Very low. Therefore, the technical task to be achieved by the present invention or the technical problem to be solved is not thought of or expected by those skilled in the art, so the present invention is a new technical solution.
  • FIG. 1 is a cross-sectional view of a speaker module of the present invention.
  • FIG. 2 is a schematic view of a partial exploded structure of the speaker module of the present invention.
  • Figure 3 is a schematic view showing the structure of a casing in the present invention.
  • a speaker module provided by the present invention includes an inner cavity surrounded by an outer casing, and a speaker unit installed in the inner cavity of the outer casing, wherein the speaker unit includes a magnetic circuit system and vibration. system.
  • the magnetic circuit system includes a basin frame 4, a magnet 5, a washer, and the like located in the inner cavity of the casing, wherein the magnet 5 is located in the basin frame 4, and a magnetic gap is formed between the wall and the side wall of the basin frame 4.
  • the vibration system includes a diaphragm 7 fixed in the inner cavity of the casing, and a voice coil 6 that drives the diaphragm 7 to sound.
  • the voice coil 6 is fixed to the diaphragm 7 and suspended on the side wall of the magnet 5 and the basin frame 4.
  • the diaphragm 7 divides the inner cavity of the outer casing into a front acoustic cavity and a rear acoustic cavity, and a sound hole 9 is arranged at a position of the outer acoustic cavity on the outer casing for sound to flow out, and thereafter the acoustic cavity is a closed structure, only through the orifice Connected with the outside world.
  • a dome 8 or the like may also be provided at the center of the diaphragm 7.
  • the voice coil 6 When the voice coil 6 is energized, the voice coil 6 will vibrate under the action of the magnetic circuit system, and at the same time, the sound The ring 6 drives the diaphragm 7 to vibrate together, and the sound of the diaphragm 7 is realized.
  • the speaker module of the present invention further includes a first induction coil 11 for electrically connecting the terminal device 14, and the housing is further provided with a corresponding one of the first induction coils 11 for electrically connecting the speaker unit to the voice coil 6
  • the second induction coil 12 may be fixed on the outer casing or may be fixed on the terminal device 14.
  • the terminal device 14 may be, for example, a PCB board of a device such as a mobile phone or a tablet computer, and the first induction coil 11 and the terminal device.
  • the control circuit board for controlling the sound emission of the speaker in 14 is electrically connected.
  • the first induction coil 11 may be fixed to the outer wall of the outer casing or may be fixed to the inner wall of the outer casing.
  • the second induction coil 12 is preferably fixed in the inner cavity of the outer casing, that is to say fixed on the inner wall of the outer casing.
  • the first inductive coil 11 and the second inductive coil 12 are correspondingly disposed, that is, the two are at least partially overlapped together.
  • it is preferred for those skilled in the art to completely overlap, that is, the first inductive The coil 11 and the second induction coil 12 are parallel to each other and are disposed to face each other.
  • the first induction coil 11 is electrically connected to the terminal device 14, and the second induction coil 12 is electrically connected to the voice coil 6.
  • the terminal device 14 conducts a current signal of the external audio to the first induction coil 11, so that the first induction coil 11 generates a magnetic field, and the generated magnetic field changes according to the change of the audio signal current; and the second induction
  • the coil 12 senses the varying magnetic field, that is, when the magnetic flux of the closed circuit changes, it generates a correspondingly varying current, which is conducted to the voice coil 6 to drive the voice coil 6 to vibrate, and finally The sound of the speaker unit.
  • the speaker module of the invention turns on the output end of the whole machine and the voice coil through the first induction coil and the second induction coil, and adopting such a structure can greatly save the space of the module and provide space for developing a thinner and lighter machine. Moreover, problems such as poor performance due to resistance changes in the conventional acoustic and electrical connection methods are avoided.
  • the structure of the first induction coil and the second induction coil allows the first induction coil to be disposed outside the inner cavity, so that the outer casing can be sealed at one time, and the outer lead is not required to be leaded, thereby avoiding the secondary sealing of the lead position. It greatly simplifies the production, transportation and assembly of the speaker module with the terminal device.
  • the outer casing includes an upper casing 1, a middle casing 2, and a lower casing 3 which are sequentially fastened together, and the upper casing 1 is fastened to the upper end opening of the middle casing 2, and the lower casing 3 is fastened therein.
  • the lower end of the shell 2 is open, and the inner diameter of the opening of the middle shell 2 is different, so that one can be formed on the middle shell 2
  • the step portions of the first induction coil 11 and the second induction coil 12 are placed.
  • the FPCB board of the voice coil 6 can also be fixed by the positioning post 15 for connecting the lead wires of the voice coil 6, refer to FIG.
  • the first induction coil 11 and the second induction coil 12 may be respectively disposed on two sides of the middle casing 2, for example, the second induction coil 12 is located on a side of the middle casing 2 adjacent to the lower casing 3, and the first induction The coil 11 is located on the other side of the middle case 2.
  • the first induction coil 11 and the second induction coil 12 may be fixed to the middle casing 2 by gluing or injection molding or other mechanical connection.
  • a position limiting groove 16 for accommodating the first induction coil 11 and the second induction coil 12 is disposed at a corresponding position of the middle casing 2, wherein the limiting groove 16 is extended from the end surface of the middle casing 16.
  • the bulge is enclosed.
  • the outer shape of the first induction coil 11 and the second induction coil 12 can be selected according to actual needs, such as a circular shape, a rectangular shape, an elliptical shape or other irregular shapes.
  • the first induction coil 11 and the second induction coil 12 are respectively provided with magnetic conductive plates 10 and 13 on the end faces facing away from each other.
  • the magnetic conductive plate 10 is disposed at the upper end of the first induction coil 11, and the magnetic conductive plate 13 is disposed at the lower end of the second induction coil 12.
  • a magnetic conductive column, a magnetic conductive liquid, or the like may be disposed in the through holes of the first induction coil 11 and the second induction coil 12.

Abstract

本发明公开了一种扬声器模组，包括由外壳围成的内腔，在所述外壳的内腔中设置有扬声器单体，其中，还包括用于电连接终端装置的第一感应线圈，所述外壳上还设置有与第一感应线圈对应设置、用于电连接扬声器单体中音圈的第二感应线圈。本发明的扬声器模组，通过第一感应线圈、第二感应线圈导通整机输出端、音圈，采用这样的结构可以大大节省模组的空间，可以开发更轻薄的整机。而且还避免传统声电连接方式中因阻值变化所造成的性能不良等问题。采用上述结构，允许第一感应线圈设置在内腔之外，使得外壳可以一次性密封，不再需要由外至内进行引线，从而避免了引线位置的二次密封，极大地简化了扬声器模组的生产、运输及与终端装置的组装。

Description

一种扬声器模组 技术领域
本发明涉及发声装置领域，更具体地，本发明涉及一种扬声器模组。
背景技术
扬声器是电子设备中的重要声学部件，其为一种把电信号转变为声信号的换能器件。现有的扬声器模组，包括外壳，以及设置在外壳内的振动系统、磁路系统，其中振动系统包括振膜以及设置在振膜上用于驱动振膜发声的音圈，该音圈需要通过引线与系统连接，实现电路的连通。现有技术中，系统与音圈之间的连接主要是通过FPCB板、引线、弹片等方式，这些连接方式占用模组空间大，而且工艺复杂，导致模组的可靠性和良品率都很低。而且为了减少音圈至系统的距离，通过会将系统的PCB板设置在模组内部，这也大大占用了模组的空间。
发明内容
本发明的一个目的是提供一种扬声器模组的新技术方案。
根据本发明的第一方面，提供了一种扬声器模组，包括由外壳围成的内腔，在所述外壳的内腔中设置有扬声器单体，其中，还包括用于电连接终端装置的第一感应线圈，所述外壳上还设置有与第一感应线圈对应设置、用于电连接扬声器单体中音圈的第二感应线圈。
优选地，所述第一感应线圈与第二感应线圈正对设置。
优选地，所述第二感应线圈设置在外壳的内腔中。
优选地，所述第一感应线圈、第二感应线圈相互背离的端面的上分别设置有导磁板。
优选地，所述第一感应线圈、第二感应线圈的通孔内设置有导磁柱或导磁液。
优选地，所述外壳包括依次扣合在一起的上壳、中壳、下壳。
优选地，所述第二感应线圈位于中壳上邻近下壳的一侧，所述第一感应线圈位于中壳的另一侧。
优选地，所述第一感应线圈、第二感应线圈通过涂胶或者注塑的方式固定在中壳上。
优选地，所述中壳相应的位置设置有用于容纳第一感应线圈、第二感应线圈的限位槽。
优选地，所述限位槽由中壳端面上伸出的凸起围成。
本发明的扬声器模组，通过第一感应线圈、第二感应线圈导通整机输出端、音圈，采用这样的结构可以大大节省模组的空间，以便可以开发更轻薄的整机。而且还避免传统声电连接方式中因阻值变化所造成的性能不良等问题。采用第一感应线圈、第二感应线圈的结构，允许第一感应线圈设置在内腔之外，使得外壳可以一次性密封，不需要由外至内进行引线，从而避免了引线位置的二次密封，极大地简化了扬声器模组的生产、运输及与终端装置的组装。
本发明的发明人发现，在现有技术中，终端装置与音圈之间的连接采用引线等方式，这些连接方式占用模组空间大，而且工艺复杂，导致模组的可靠性和良品率都很低。因此，本发明所要实现的技术任务或者所要解决的技术问题是本领域技术人员从未想到的或者没有预期到的，故本发明是一种新的技术方案。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例，并且连同其说明一起用于解释本发明的原理。
图1是本发明扬声器模组的剖面图。
图2是本发明扬声器模组的部分爆炸结构的示意图。
图3是本发明中壳的结构示意图。
其中，标号所代表的部件如下：
1-上壳；2-中壳；3-下壳；4-盆架；5-磁铁；6-音圈；7-振膜；8-球顶；9-声孔；10-导磁板；11-第一感应线圈；12-第二感应线圈；13-导磁板；14-终端装置；15-定位柱；16-限位槽。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
参考图1、图2，本发明提供的一种扬声器模组，包括由外壳围成的内腔，以及安装在外壳内腔中的扬声器单体，其中，该扬声器单体包括磁路系统和振动系统。磁路系统包括位于外壳内腔中的盆架4、磁铁5、华司等部件，其中磁铁5位于盆架4中，且其与盆架4的侧壁之间形成有磁间隙。振动系统包括固定在外壳内腔中的振膜7，以及驱动振膜7发声的音圈6，所述音圈6固定在振膜7上，并且悬置在磁铁5与盆架4侧壁之间的磁间隙中；振膜7将外壳的内腔分为前声腔和后声腔，外壳上位于前声腔的位置设置有声孔9，以便声音的流出，其后声腔为封闭结构，仅通过阻尼孔与外界连通。在所述振膜7的中心位置还可设有球顶8等。
当音圈6通电后，音圈6会在磁路系统的作用下振动，与此同时，音 圈6驱动振膜7一同振动，实现了振膜7的发声。
本发明的扬声器模组，还包括用于电连接终端装置14的第一感应线圈11，所述外壳上还设置有与第一感应线圈11对应设置、用于电连接扬声器单体中音圈6的第二感应线圈12。具体地，其中第一感应线圈11可以固定在外壳上，也可以固定在终端装置14上，该终端装置14例如可以是手机、平板电脑等设备的PCB板等，第一感应线圈11与终端装置14中用于控制扬声器发声的控制电路板电连接。第一感应线圈11可以固定在外壳的外壁，也可以固定在外壳的内壁上。第二感应线圈12优选固定在外壳的内腔中，也就是说，固定在外壳的内壁上。其中，第一感应线圈11和第二感应线圈12对应设置，也就是说，二者至少部分重叠在一起，当然，对于本领域的技术人员来说，优选完全重叠，也就是说，第一感应线圈11与第二感应线圈12相互平行，正对设置在一起。
本发明的扬声器模组，第一感应线圈11与终端装置14电连接，而第二感应线圈12与音圈6电连接。工作的时候，终端装置14将外部音频的电流信号导通至第一感应线圈11上，使得第一感应线圈11产生磁场，其产生的磁场随着音频信号电流的变化而变化；而第二感应线圈12感应到该变化的磁场，也就是说，通过闭合电路的磁通量发生变化时，其会产生相应变化的电流，该变化的电流导通至音圈6上，驱动音圈6振动，最终实现扬声器单体的发声。
本发明的扬声器模组，通过第一感应线圈、第二感应线圈导通整机输出端、音圈，采用这样的结构可以大大节省模组的空间，为开发更轻薄的整机提供空间。而且还避免传统声电连接方式中因阻值变化所造成的性能不良等问题。采用第一感应线圈、第二感应线圈的结构，允许第一感应线圈设置在内腔之外，使得外壳可以一次性密封，不需要由外至内进行引线，从而避免了引线位置的二次密封，极大地简化了扬声器模组的生产、运输及与终端装置的组装。
在本发明一个具体的实施方式中，外壳包括依次扣合在一起的上壳1、中壳2、下壳3，上壳1扣合在中壳2的上端开口，下壳3扣合在中壳2的下端开口，且中壳2两端开口的内径不一，使得在中壳2上形成一可以用 于放置第一感应线圈11、第二感应线圈12的台阶部。其中，在中壳2上还可以通过定位柱15固定音圈6的FPCB板，用于连接音圈6的引线，参考图3。
其中，第一感应线圈11、第二感应线圈12可以分别设置在中壳2的两侧，例如所述第二感应线圈12位于中壳2上邻近下壳3的一侧，所述第一感应线圈11位于中壳2的另一侧。第一感应线圈11、第二感应线圈12可以通过涂胶或者注塑或其它机械连接方式固定在中壳2上。例如，参考图3，在所述中壳2相应的位置设置有用于容纳第一感应线圈11、第二感应线圈12的限位槽16，其中该限位槽16由中壳16端面上伸出的凸起围成。第一感应线圈11、第二感应线圈12的外形可以根据实际需要进行选择，例如圆形、长方形、椭圆形或其它不规则形状。
为了提高第一感应线圈11、第二感应线圈12之间的磁通量利用率，所述第一感应线圈11、第二感应线圈12相互背离的端面上分别设置有导磁板10、13。例如，第一感应线圈11、第二感应线圈12上下正对设置的时候，导磁板10设置在第一感应线圈11的上端，导磁板13设置在第二感应线圈12的下端。通过导磁板10、13，不但可以提高磁通量的利用率，而且还可以避免两个感应线圈对其它器件的影响。为了进一步提高磁通量的利用率，在所述第一感应线圈11、第二感应线圈12的通孔内还可以设置导磁柱或导磁液等。
虽然已经通过例子对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (10)

  1. 一种扬声器模组，其特征在于：包括由外壳围成的内腔，在所述外壳的内腔中设置有扬声器单体，其中，还包括用于电连接终端装置(14)的第一感应线圈(11)，所述外壳上还设置有与第一感应线圈(11)对应设置、用于电连接扬声器单体中音圈(6)的第二感应线圈(12)。
  2. 根据权利要求1所述的扬声器模组，其特征在于：所述第一感应线圈(11)与第二感应线圈(12)正对设置。
  3. 根据权利要求1所述的扬声器模组，其特征在于：所述第二感应线圈(12)设置在外壳的内腔中。
  4. 根据权利要求1所述的扬声器模组，其特征在于：所述第一感应线圈(11)、第二感应线圈(12)相互背离的端面的上分别设置有导磁板(10、13)。
  5. 根据权利要求1所述的扬声器模组，其特征在于：所述第一感应线圈(11)、第二感应线圈(12)的通孔内设置有导磁柱或导磁液。
  6. 根据权利要求1所述的扬声器模组，其特征在于：所述外壳包括依次扣合在一起的上壳(1)、中壳(2)、下壳(3)。
  7. 根据权利要求6所述的扬声器模组，其特征在于：所述第二感应线圈(12)位于中壳(2)上邻近下壳(3)的一侧，所述第一感应线圈(11)位于中壳(2)的另一侧。
  8. 根据权利要求7所述的扬声器模组，其特征在于：所述第一感应线圈(11)、第二感应线圈(12)通过涂胶或者注塑的方式固定在中壳(2)上。
  9. 根据权利要求7所述的扬声器模组，其特征在于：所述中壳(2)相应的位置设置有用于容纳第一感应线圈(11)、第二感应线圈(12)的限位槽(16)。
  10. 根据权利要求9所述的扬声器模组，其特征在于：所述限位槽(16)由中壳(2)端面上伸出的凸起围成。
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