WO2016148503A1 - Led illumination device - Google Patents
Led illumination device Download PDFInfo
- Publication number
- WO2016148503A1 WO2016148503A1 PCT/KR2016/002643 KR2016002643W WO2016148503A1 WO 2016148503 A1 WO2016148503 A1 WO 2016148503A1 KR 2016002643 W KR2016002643 W KR 2016002643W WO 2016148503 A1 WO2016148503 A1 WO 2016148503A1
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- WO
- WIPO (PCT)
- Prior art keywords
- lower housing
- led lighting
- seating surface
- power
- led
- Prior art date
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S9/00—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S10/00—Lighting devices or systems producing a varying lighting effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
- F21V21/02—Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
- F21V21/04—Recessed bases
Definitions
- the present invention relates to an LED lighting device, and more particularly to an LED lighting device embedded in the ceiling.
- lighting devices including LED lighting devices basically take the form of emitting light from a surface for diffusion. This is common to bulb type lighting devices, surface lighting devices, and stand type lighting devices, and the beauty of the lighting is not in the light itself, but is determined by the specificity or color of the external design of the lighting device.
- the surface lighting apparatus uses a diffusion plate having a predetermined area as a cover.
- a diffusion plate having a predetermined area as a cover.
- Patent No. 10-0998980 (Registration Date December 1, 2010). 4 which is a representative view of the registered patent, mounts a substrate on which a plurality of LEDs are disposed to emit light upward, and includes at least one or more diffusion layers on the upper side of the substrate, thereby emitting light emitted from the plurality of LEDs. It is a configuration that allows them to be diffused so that they can be illuminated with a constant illuminance across a certain size plane.
- Such a configuration is a general configuration of a conventional lighting device that emits light from the surface described above, the diffusion plate is effective in preventing the occurrence of glare by preventing the light from being concentrated in a part, but the light loss is high light efficiency There was a problem of this deterioration. This reduction in light efficiency causes a decrease in the energy consumption efficiency of the lighting device because more power must be used for the same illumination.
- Patent No. 10-1143344 (Ceiling-embedded downlight luminaire, registered on April 30, 2012) as a prior art for ceiling-embedded lighting, commonly referred to as 'downlights', describes in detail the structure and operation of downlights. It is.
- a printed circuit board 4 having an LED 5 mounted thereon and heat dissipated from the LED 5 may be radiated from the printed circuit board 4.
- Step (2) is formed on the upper inner circumferential surface to be mounted, coupled to the illumination cylinder (7) and the lower end of the illumination cylinder (7) having a plurality of guide grooves formed on the outer circumferential surface, transparent or translucent cover lens (11) inside ),
- a cap 9 is mounted.
- It comprises a heat sink 3 for transferring the heat of the printed circuit board 4 to the heat sink (1).
- the printed circuit board 4 mounted with the LED 5 is described, and a separate heat sink 1 is used to dissipate heat generated from the printed circuit board 4, and the heat sink 1 ) And a heat sink 3 capable of transferring heat between the printed circuit board 4 and the printed circuit board 4.
- the heat sink 1 and the heat sink 3 need to be combined, thereby increasing the time and cost required for manufacturing.
- the technical problem to be solved by the present invention in view of the above problems is to provide an LED lighting device to install the LED only in the circumference of the lighting device to prevent heat concentration phenomenon, and to facilitate the emission of heat.
- Another object of the present invention is to provide an LED lighting device that can accommodate the power supply unit to simplify the wiring work.
- another object of the present invention is to provide an LED lighting device to install a power supply unit and a substrate therein through a light emitting port, and to be combined without a separate fastening means.
- the present invention divides the housing into the upper housing and the lower housing, the lower housing is made of a resin material, the upper housing is a metal material by using a material suitable for each characteristic, LED lighting apparatus that can increase the efficiency and reduce the cost In providing.
- the light emitting port 210 is provided on the bottom, the diameter decreases toward the top, the resin material lower housing having a seating surface 230 in the inner diameter portion 200 And, coupled to the upper portion of the lower housing 200 and the power supply unit 140 is inserted therein, the substrate 300 mounting the LED 310 is coupled to the seating surface 160 around the bottom opening
- the LED lighting apparatus of the present invention has an effect of increasing heat dissipation efficiency by installing only the peripheral portion of the LED in a lighting apparatus having a structure embedded in the ceiling, except for the center portion of the substrate installed horizontally on the ceiling.
- the present invention is integrally molded with the upper housing and the heat dissipation fins, there is no need for a separate assembly process has the effect of reducing the manufacturing cost and improve productivity.
- the present invention has an effect that the upper housing is made of metal, the power supply is built in the upper housing, and the upper edge of the substrate is directly in contact with the bottom of the upper housing to easily dissipate heat of the LED mounted on the substrate. have.
- the present invention inserts the diffusion plate into the lower housing before the tableware when forming the lower housing, so that the diffusion plate can be firmly fixed when the lower housing is cooled, thereby providing a diffusion plate without using a fastening means Fixing has the effect of reducing manufacturing costs and improving productivity.
- FIG. 1 is a block diagram of a conventional LED lighting device.
- FIG. 2 is a block diagram of an LED lighting apparatus according to a preferred embodiment of the present invention.
- FIG. 3 is an exploded perspective view of FIG. 2.
- Figure 4 is a cross-sectional configuration of the combined state of the LED lighting apparatus according to a preferred embodiment of the present invention.
- diffusion plate 241 diffusion pattern
- FIG. 2 is a configuration diagram of the LED lighting apparatus according to a preferred embodiment of the present invention
- Figure 3 is an exploded perspective view of Figure 2
- Figure 4 is a cross-sectional view of FIG.
- the LED lighting apparatus according to the preferred embodiment of the present invention
- the light emitting port 210 is provided on the bottom
- the lower housing 200 is gradually reduced in diameter toward the top
- the upper housing 100 is coupled to the upper part of the lower housing 200 and the power supply 140 is inserted therein
- the substrate 300 on which the LED 310 is mounted is coupled to the seating surface 160 around the bottom opening.
- a diffusion plate 240 seated on the seating surface 230 of the lower housing 200.
- the upper housing 100 is formed integrally with a metal material, and the bottom is open, and a space 120 through which the power supply 140 is inserted is provided inside the opened bottom.
- the shape of the upper housing 100 has a circular opening at the bottom, and a seating surface 160 having a predetermined area is provided around the opening, and a plurality of heat dissipation fins 130 protrude from the upper side of the seating surface 160. .
- a plurality of fastening protrusions 150 protrude outward from the seating surface 160 and are fastened by fastening means such as a lower housing 200 and bolts to be described later.
- a hole 101 through which the space portion 120 may communicate with the outside may be formed in a portion of the upper side of the upper housing 100, and the wire 500 is connected from the outside through the hole 101. And may be supplied to the power supply unit 140.
- the power supply unit 140 serves to supply DC power to the substrate 300 by receiving external power, and may be connected to a neighboring LED lighting device through a power connection unit 110.
- AC power supplied to the power supply unit 140 may be supplied through the power connection unit 110, and DC power may be supplied to the power supply unit 140 of the adjacent LED lighting apparatus through the wire 500. have.
- the upper edge of the substrate 300 is seated on the seating surface 160 of the upper housing 100, and is tightly fixed to the seating surface 160 by bolts or adhesives.
- heat generated from the plurality of LEDs 310 mounted on the substrate 300 may be easily conducted and radiated to the heat radiating fins 130 through the substrate 300 and the mounting surface 160.
- the substrate 300 may preferably use a metal PCB.
- the plurality of LEDs 310 mounted on the substrate 300 may be disposed on the lower side of the seating surface 160 instead of being positioned at the center of the substrate 300.
- This may be understood as to increase the effect of heat radiation by conducting heat generated in the LEDs 310 which are substantially heat sources in the direct direction.
- the lower housing 200 is coupled to the lower portion of the upper housing 100 configured as described above.
- the overall shape of the lower housing 200 is a structure in which the inner diameter becomes wider toward the lower portion, and a step is provided in a part of the inner diameter to form a seating surface 230 on which the diffusion plate 240 is seated.
- the lower housing 200 is preferably integrally molded with a resin material.
- the lower end of the lower housing 200 is formed with an anti-glare portion 220 which is convex downward.
- the anti-glare unit 220 serves to reflect the light diffused from the diffusion plate 240 so as not to directly enter the eye of the human body, and may have an appropriate light distribution.
- a plurality of fastening protrusions 250 are provided at an upper circumference of the lower housing 200, and fastening a fastening means such as a bolt in a state facing the fastening protrusion 150 provided in the upper housing 100, thereby providing a firm coupling. It can be done.
- the light emitted from the LED 310 is diffused from the diffuser plate 240 positioned in the middle of the height direction of the lower housing 200 to provide a surface light source, and in particular, the diffuser plate 240.
- the diffusion pattern portion 241 which is an uneven surface, is provided at the central portion of the to facilitate the diffusion of light.
- the light diffused from the diffuser plate 240 is emitted to the outside through the light emitting port 210 of the lower housing 200.
- the diffusion plate 240 is not fixed to the seating surface 230 of the lower housing 200 by a separate fastening means, but is fixed in the fitted state.
- the effect obtained by not using the fastening means is simple because the structure does not need to form a bolt insertion hole to fasten the fastening means, and the cost is high when fastening using the fastening means such as bolts. It can be expected that the effect of increasing the time required for manufacturing and preventing the productivity from decreasing is increased.
- the lower housing 200 is made of a resin material, and then integrally injected. At this time, considering that the lower housing 200 has a relatively higher temperature immediately after the injection and shrinks finely as the temperature decreases with time, the diffusion plate at the light emitting port 210 side of the lower housing 200 immediately after the injection. Push in 240 until it contacts the seating surface 230.
- the pressurization of the diffusion plate 240 is very easy, and when the lower housing 200 cools to room temperature, the diffusion plate is minutely contracted and is finely contracted. 240 can be firmly fixed.
- the present invention can fix the diffusion plate 240 without using a separate fastening means.
- the diffusion plate 240 may be fixed by pressing the lower housing 200 in a completely cured state.
- a part of an outer surface of the lower housing 200 is provided with a fixing part 400 for fixing the lower housing 200 to the ceiling.
- the rotating part 410 constituting the fixing part 400 may also be integrally formed with the lower housing 200, and the elastic locking part 420 may be made of metal and may rotate about the rotating part 410.
- the rotating part 410 may be fitted and fixed.
- it may be configured to further include a ring 430 in order to secure a more robust fixing and stability against disasters such as earthquakes.
- the present invention is to increase the heat dissipation efficiency of the light embedded in the ceiling, can reduce the glare, there is industrial applicability.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
Abstract
The present invention relates to an LED illumination device, which comprises: a lower housing (200) that is made of a resin material, has a light emitting opening (210) arranged at the bottom thereof, has a diameter decreasing toward the upper side, and has a seating surface (230) at a part of the inner diameter; an upper housing (100) that is made of a metal material, is coupled to the upper portion of the lower housing (200), has a power supply unit (140) inserted therein, and has a substrate (300) which has an LED (310) installed thereon and is coupled to a seating surface (160) around a bottom opening part; and a diffusion plate (240) stably placed on the seating surface (230) of the lower housing (200).
Description
본 발명은 엘이디 조명장치에 관한 것으로, 더 상세하게는 천장에 매립되는 엘이디 조명장치에 관한 것이다.The present invention relates to an LED lighting device, and more particularly to an LED lighting device embedded in the ceiling.
일반적으로 엘이디 조명장치를 포함하는 조명장치들은 기본적으로 확산을 위한 표면(surface)에서 빛을 발산하는 형태를 취하고 있다. 이는 벌브형 조명장치와 면조명장치, 스텐드형 조명장치 모두 공통되는 것이며, 조명의 아름다움은 빛 자체에 있지 않고 조명장치의 외형 디자인의 특이성이나 색감에 의해 결정된다.Generally, lighting devices including LED lighting devices basically take the form of emitting light from a surface for diffusion. This is common to bulb type lighting devices, surface lighting devices, and stand type lighting devices, and the beauty of the lighting is not in the light itself, but is determined by the specificity or color of the external design of the lighting device.
이처럼 표면 발광형의 조명장치의 예로서 면조명 장치는 일정 면적의 확산판을 커버로 사용하고 있다. 이러한 예로 등록특허 10-0998980호(등록일자 2010년 12월 1일)를 들 수 있다. 상기 등록특허의 대표도면인 도 4에는 상향으로 광을 방출하도록 다수의 엘이디가 배치된 기판을 실장하고, 그 기판의 상부측에 적어도 한 층 이상의 확산층이 포함되도록 하여, 다수의 엘이디에서 방출된 광들을 확산시켜 특정한 크기의 면 전체에서 일정한 조도로 조명할 수 있도록 한 구성이다.As an example of the surface-emitting lighting apparatus, the surface lighting apparatus uses a diffusion plate having a predetermined area as a cover. For example, Patent No. 10-0998980 (Registration Date December 1, 2010). 4, which is a representative view of the registered patent, mounts a substrate on which a plurality of LEDs are disposed to emit light upward, and includes at least one or more diffusion layers on the upper side of the substrate, thereby emitting light emitted from the plurality of LEDs. It is a configuration that allows them to be diffused so that they can be illuminated with a constant illuminance across a certain size plane.
이와 같은 구성은 앞서 설명한 표면에서 빛을 발산하는 종래의 조명장치의 일반적인 구성이며, 확산판은 광이 일부에서 집중적으로 방출되는 것을 방지하여 눈부심의 발생을 방지하는 효과가 있으나, 광 손실이 많아 광효율이 저하되는 문제점이 있었다. 이러한 광효율의 저하는 동일한 조도의 조명을 위하여 보다 많은 전력을 사용해야 하기 때문에 조명장치의 에너지 소비 효율을 저하시키는 원인이 된다.Such a configuration is a general configuration of a conventional lighting device that emits light from the surface described above, the diffusion plate is effective in preventing the occurrence of glare by preventing the light from being concentrated in a part, but the light loss is high light efficiency There was a problem of this deterioration. This reduction in light efficiency causes a decrease in the energy consumption efficiency of the lighting device because more power must be used for the same illumination.
즉, 충분한 조도의 면광원을 제공하기 위해서는 필요 이상으로 많은 수의 엘이디를 사용해야 하기 때문에 엘이디 조명의 저전력소모라는 장점이 퇴색하게 되며, 엘이디에서 방출되는 열을 처리하기가 용이하지 않아 그 열에 의해 엘이디의 수명이 단축될 수 있는 문제점이 있었다.In other words, in order to provide a surface light source with sufficient illuminance, the number of LEDs must be used more than necessary, so the advantage of low power consumption of LED lighting is faded, and it is not easy to process the heat emitted from the LEDs. There was a problem that the life of the can be shortened.
통상 '다운 라이트'로 불리는 천장 매립 조명에 대한 선행기술로서 등록특허 10-1143344호(천장매입형 다운라이트 조명기구, 2012년 4월 30일 등록)에는 다운 라이트의 구조와 작용에 대하여 상세하게 기재되어 있다.Patent No. 10-1143344 (Ceiling-embedded downlight luminaire, registered on April 30, 2012) as a prior art for ceiling-embedded lighting, commonly referred to as 'downlights', describes in detail the structure and operation of downlights. It is.
도 1은 상기 등록특허 10-1143344호의 대표도이다. 1 is a representative view of the registered Patent No. 10-1143344.
도 1을 참조하여 종래 엘이디 조명장치의 구성을 설명하면, 엘이디(5)가 실장된 인쇄회로기판(4)과, 상기 엘이디(5)로부터 방출되는 열을 방열시키며, 상기 인쇄회로기판(4)의 배면에 결합되도록 방열핀 상에 'C' 형상의 나사홈이 복수개 형성된 히트싱크(1)와, 상하 개구된 원통형상으로 상기 인쇄회로기판(4) 및 상기 히트싱크(1)가 결합된 상태로 장착되도록 상측 내주면에 단차(2)가 형성되고, 외주면에 복수개의 가이드홈이 형성되는 조명원통(7) 및 상기 조명원통(7)의 하단에 결합되며, 내부에 투명 또는 반투명의 커버렌즈(11)가 장착되는 캡(9)을 포함한다.Referring to FIG. 1, a configuration of a conventional LED lighting apparatus will be described. A printed circuit board 4 having an LED 5 mounted thereon and heat dissipated from the LED 5 may be radiated from the printed circuit board 4. A heat sink 1 having a plurality of 'C' shaped grooves formed on the heat dissipation fins to be coupled to the rear surface of the heat sink 1, and the printed circuit board 4 and the heat sink 1 are coupled to each other in a cylindrical shape having a vertical opening. Step (2) is formed on the upper inner circumferential surface to be mounted, coupled to the illumination cylinder (7) and the lower end of the illumination cylinder (7) having a plurality of guide grooves formed on the outer circumferential surface, transparent or translucent cover lens (11) inside ), A cap 9 is mounted.
인쇄회로기판(4)의 열을 히트싱크(1)로 전달하는 방열판(3)을 포함하여 구성된다.It comprises a heat sink 3 for transferring the heat of the printed circuit board 4 to the heat sink (1).
상기 엘이디(5)를 실장한 인쇄회로기판(4)에 대하여 기재되어 있으며, 인쇄회로기판(4)에서 발생하는 열을 방열시키기 위해 별도의 히트싱크(1)를 사용하며, 그 히트싱크(1)와 인쇄회로기판(4)의 사이에서 열을 전달할 수 있는 방열판(3)을 사용하게 된다.The printed circuit board 4 mounted with the LED 5 is described, and a separate heat sink 1 is used to dissipate heat generated from the printed circuit board 4, and the heat sink 1 ) And a heat sink 3 capable of transferring heat between the printed circuit board 4 and the printed circuit board 4.
이는 인쇄회로기판(4)에 실장되는 엘이디(5)가 균등하게 이격되어 분포되어 있는 것이며, 따라서 열의 배출이 어려워 복잡한 구성의 방열구조가 요구되는 문제점이 있었다.This is because the LEDs 5 mounted on the printed circuit board 4 are equally spaced and distributed. Therefore, the heat is difficult to be discharged, and a heat dissipation structure having a complicated configuration is required.
또한 히트싱크(1)와 조명원통(7), 방열판(3)이 각각 분리되어 제조된 후, 이를 결합해야 하기 때문에 제작에 요구되는 시간과 비용이 증가하게 된다.In addition, since the heat sink 1, the illumination cylinder 7, and the heat sink 3 are separately manufactured, the heat sink 1 and the heat sink 3 need to be combined, thereby increasing the time and cost required for manufacturing.
그리고 종래의 도면 등에서는 상기 엘이디(5)에 직류의 정전원을 공급하는 전원공급장치에 대한 언급이 없으며, 이러한 경우 전원공급장치는 종래 기술의 조명원통(7)의 외부에 설치되는 것으로 이해될 수 있다.And there is no reference to a power supply for supplying a static power source of direct current to the LED (5) in the conventional drawings, in this case, it will be understood that the power supply is installed outside the lighting cylinder 7 of the prior art. Can be.
따라서 이처럼 전원공급장치를 별도의 위치에 설치해야 하는 경우, 그 전원공급장치의 전선을 상기 인쇄회로기판(4)에 연결하여야 하기 때문에 별도의 배선 작업이 요구되는 불편함이 있었다.Therefore, when it is necessary to install the power supply in a separate position as described above, there is an inconvenience in that a separate wiring work is required because the wire of the power supply should be connected to the printed circuit board 4.
상기와 같은 문제점을 감안한 본 발명이 해결하고자 하는 기술적 과제는, 엘이디를 조명장치의 둘레에만 설치하여 열의 집중 현상을 방지하고, 열의 방출이 용이하도록 하는 엘이디 조명장치를 제공함에 있다.The technical problem to be solved by the present invention in view of the above problems is to provide an LED lighting device to install the LED only in the circumference of the lighting device to prevent heat concentration phenomenon, and to facilitate the emission of heat.
그리고 본 발명의 다른 과제는, 전원공급부도 함께 수용하여 배선 작업을 간소화할 수 있는 엘이디 조명장치를 제공함에 있다.In addition, another object of the present invention is to provide an LED lighting device that can accommodate the power supply unit to simplify the wiring work.
또한 본 발명의 다른 과제는 광방출구를 통해 내부에 전원공급부와 기판을 설치하며, 별도의 체결 수단 없이도 결합이 이루어지도록 하는 엘이디 조명장치를 제공함에 있다.In addition, another object of the present invention is to provide an LED lighting device to install a power supply unit and a substrate therein through a light emitting port, and to be combined without a separate fastening means.
아울러 본 발명은 하우징을 상부하우징과 하부하우징으로 분할하고, 하부하우징은 수지재, 상부하우징은 금속재로 하여 각각의 특성에 맞는 재질을 사용함으로써, 효율을 높이고, 비용을 절감할 수 있는 엘이디 조명장치를 제공함에 있다.In addition, the present invention divides the housing into the upper housing and the lower housing, the lower housing is made of a resin material, the upper housing is a metal material by using a material suitable for each characteristic, LED lighting apparatus that can increase the efficiency and reduce the cost In providing.
또한 확산판을 체결수단으로 체결하지 않고도 견고하게 고정할 수 있는 엘이디 조명장치를 제공함에 있다.In addition, to provide an LED lighting device that can be firmly fixed without fastening the diffusion plate by a fastening means.
상기와 같은 과제를 해결하기 위한 본 발명 엘이디 조명장치는, 저면에 광방출구(210)가 마련되어 있으며, 상부로 갈수록 직경이 감소하며, 내경일부에 안착면(230)을 가지는 수지재 하부하우징(200)과, 상기 하부하우징(200)의 상부에 결합되며 내부에 전원공급부(140)가 삽입되고, 엘이디(310)를 실장한 기판(300)이 저면 개방부의 둘레의 안착면(160)에 결합되는 금속재 상부하우징(100)과, 상기 하부하우징(200)의 안착면(230)에 안착되는 확산판(240)을 포함한다.LED lighting apparatus of the present invention for solving the above problems, the light emitting port 210 is provided on the bottom, the diameter decreases toward the top, the resin material lower housing having a seating surface 230 in the inner diameter portion 200 And, coupled to the upper portion of the lower housing 200 and the power supply unit 140 is inserted therein, the substrate 300 mounting the LED 310 is coupled to the seating surface 160 around the bottom opening The metal upper housing 100 and a diffusion plate 240 mounted on the mounting surface 230 of the lower housing 200.
본 발명 엘이디 조명장치는, 천장에 매립 설치되는 구조의 조명장치에서 엘이디를 천장에 수평하게 설치되는 기판의 중앙부를 제외하고, 주변부에만 설치함으로써, 열 방출 효율을 높일 수 있는 효과가 있다.The LED lighting apparatus of the present invention has an effect of increasing heat dissipation efficiency by installing only the peripheral portion of the LED in a lighting apparatus having a structure embedded in the ceiling, except for the center portion of the substrate installed horizontally on the ceiling.
또한 본 발명은 상부하우징과 방열핀을 일체로 성형하여, 별도의 조립공정이 요구되지 않아 제조비용을 절감하고 생산성을 향상시킬 수 있는 효과가 있다.In addition, the present invention is integrally molded with the upper housing and the heat dissipation fins, there is no need for a separate assembly process has the effect of reducing the manufacturing cost and improve productivity.
그리고 본 발명은 상부하우징을 금속재로 하고, 상부하우징 내에 전원부 를 내장하고, 상부하우징의 저면에 직접 기판의 상부 가장자리가 접하도록 설치되어 기판에 실장된 엘이디의 열을 용이하게 방출할 수 있는 효과가 있다.In addition, the present invention has an effect that the upper housing is made of metal, the power supply is built in the upper housing, and the upper edge of the substrate is directly in contact with the bottom of the upper housing to easily dissipate heat of the LED mounted on the substrate. have.
아울러 본 발명은 하부하우징을 성형할 때 성형열이 식기 이전에 확산판을 하부하우징 내에 삽입하고, 하부하우징이 식었을 때 확산판이 견고하게 고정될 수 있도록 함으로써, 체결수단을 사용하지 않고도 확산판을 고정하여 제조비용을 절감함과 아울러 생산성을 향상시킬 수 있는 효과가 있다.In addition, the present invention inserts the diffusion plate into the lower housing before the tableware when forming the lower housing, so that the diffusion plate can be firmly fixed when the lower housing is cooled, thereby providing a diffusion plate without using a fastening means Fixing has the effect of reducing manufacturing costs and improving productivity.
도 1은 종래 엘이디 조명장치의 구성도이다.1 is a block diagram of a conventional LED lighting device.
도 2는 본 발명의 바람직한 실시예에 따른 엘이디 조명장치의 구성도이다.2 is a block diagram of an LED lighting apparatus according to a preferred embodiment of the present invention.
도 3은 도 2의 분해 사시도이다.3 is an exploded perspective view of FIG. 2.
도 4는 본 발명의 바람직한 실시예에 따른 엘이디 조명장치의 결합상태 단면 구성도이다.Figure 4 is a cross-sectional configuration of the combined state of the LED lighting apparatus according to a preferred embodiment of the present invention.
- 부호의 설명 -Description of the sign
100:상부하우징 101:홀100: upper housing 101: hall
110:전원연결부 120:공간부110: power connection portion 120: space
130:방열핀 140:전원공급부130: heat radiation fin 140: power supply
150:체결돌기부 160:안착면150: fastening protrusion 160: seating surface
200:하부하우징 210:광방출구200: lower housing 210: light exit
220:눈부심 방지부 230:안착면220: anti-glare 230: seating surface
240:확산판 241:확산패턴240: diffusion plate 241: diffusion pattern
250:체결돌기부 300:기판250: fastening projection 300: substrate
310:엘이디 400:고정부310: LED 400: high government
410:회동부 420:탄성걸림부410: rotating part 420: elastic locking part
430:고리부 500:전선430: hook 500: wire
이하, 본 발명 엘이디 조명장치에 대하여 첨부한 도면을 참조하여 상세하게 설명한다.Hereinafter, the LED lighting apparatus of the present invention will be described in detail with reference to the accompanying drawings.
도 2는 본 발명의 바람직한 실시예에 따른 엘이디 조명장치의 구성도이고, 도 3은 도 2의 분해 사시도이고, 도 4는 도 2의 단면도이다.2 is a configuration diagram of the LED lighting apparatus according to a preferred embodiment of the present invention, Figure 3 is an exploded perspective view of Figure 2, Figure 4 is a cross-sectional view of FIG.
도 2 내지 도 4를 각각 참조하면 본 발명의 바람직한 실시예에 따른 엘이디 조명장치는, 저면에 광방출구(210)가 마련되어 있으며, 상부로 갈수록 직경이 단계적으로 감소하는 하부하우징(200)과, 상기 하부하우징(200)의 상부에 결합되며 내부에 전원공급부(140)가 삽입되고, 엘이디(310)를 실장한 기판(300)이 저면 개방부의 둘레의 안착면(160)에 결합되는 상부하우징(100)과, 상기 하부하우징(200)의 안착면(230)에 안착되는 확산판(240)을 포함하여 구성된다.2 to 4 respectively, the LED lighting apparatus according to the preferred embodiment of the present invention, the light emitting port 210 is provided on the bottom, the lower housing 200 is gradually reduced in diameter toward the top, and The upper housing 100 is coupled to the upper part of the lower housing 200 and the power supply 140 is inserted therein, and the substrate 300 on which the LED 310 is mounted is coupled to the seating surface 160 around the bottom opening. ), And a diffusion plate 240 seated on the seating surface 230 of the lower housing 200.
이하, 상기와 같이 구성되는 본 발명의 바람직한 실시예에 따른 엘이디 조명장치의 구성과 작용을 보다 상세히 설명한다.Hereinafter, the configuration and operation of the LED lighting apparatus according to a preferred embodiment of the present invention configured as described above in more detail.
먼저, 상부하우징(100)은 금속재로 일체 성형된 것이며, 저면은 개방되어 있으며, 그 개방된 저면의 안쪽으로는 상기 전원공급부(140)가 삽입될 수 있는 공간부(120)가 마련되어 있다.First, the upper housing 100 is formed integrally with a metal material, and the bottom is open, and a space 120 through which the power supply 140 is inserted is provided inside the opened bottom.
상부하우징(100)의 형상은 저면의 개방부가 원형이며, 그 개방부의 둘레에는 소정면적의 안착면(160)이 마련되어 있으며, 안착면(160)의 상부측에는 방열핀(130)들이 다수로 돌출되어 있다.The shape of the upper housing 100 has a circular opening at the bottom, and a seating surface 160 having a predetermined area is provided around the opening, and a plurality of heat dissipation fins 130 protrude from the upper side of the seating surface 160. .
또한 상기 안착면(160)의 외측으로는 복수의 체결돌기부(150)가 돌출되어 이후 설명될 하부하우징(200)과 볼트 등의 체결수단에 의해 체결된다.In addition, a plurality of fastening protrusions 150 protrude outward from the seating surface 160 and are fastened by fastening means such as a lower housing 200 and bolts to be described later.
상기 상부하우징(100)의 상부측의 측면 일부에는 공간부(120)가 외부와 연통될 수 있는 홀(101)이 형성될 수 있으며, 그 홀(101)을 통해 전선(500)이 외부로부터 연결되어 전원공급부(140)에 공급될 수 있다.A hole 101 through which the space portion 120 may communicate with the outside may be formed in a portion of the upper side of the upper housing 100, and the wire 500 is connected from the outside through the hole 101. And may be supplied to the power supply unit 140.
상기 전원공급부(140)는 외부의 전원을 공급받아 직류전원을 상기 기판(300)에 공급하는 역할을 하게 되며, 이웃한 엘이디 조명장치에는 전원연결부(110)를 통해 연결할 수 있다. The power supply unit 140 serves to supply DC power to the substrate 300 by receiving external power, and may be connected to a neighboring LED lighting device through a power connection unit 110.
이와는 반대로 전원공급부(140)에 공급되는 교류전원이 상기 전원연결부(110)를 통해 공급될 수 있으며, 상기 전선(500)을 통해 이웃한 엘이디 조명장치의 전원공급부(140)에 직류전원을 공급할 수 있다.On the contrary, AC power supplied to the power supply unit 140 may be supplied through the power connection unit 110, and DC power may be supplied to the power supply unit 140 of the adjacent LED lighting apparatus through the wire 500. have.
상기 상부하우징(100)의 안착면(160)에는 상기 기판(300)의 상부 가장자리가 접하도록 안착되며, 볼트나 접착제에 의하여 안착면(160)에 밀착 고정된다. The upper edge of the substrate 300 is seated on the seating surface 160 of the upper housing 100, and is tightly fixed to the seating surface 160 by bolts or adhesives.
따라서 상기 기판(300)에 실장된 다수의 엘이디(310)들에서 발생되는 열은 기판(300)과 안착면(160)을 통해 방열핀(130)으로 쉽게 전도되어 방열될 수 있다.Therefore, heat generated from the plurality of LEDs 310 mounted on the substrate 300 may be easily conducted and radiated to the heat radiating fins 130 through the substrate 300 and the mounting surface 160.
이와 같은 방열의 효율을 높이기 위하여 상기 기판(300)은 메탈 PCB를 사용하는 것이 바람직다.In order to increase the efficiency of heat dissipation, the substrate 300 may preferably use a metal PCB.
또한 상기 기판(300)에 실장되는 다수의 엘이디(310)들은 기판(300)의 중앙에 위치하지 않고, 상기 안착면(160)의 하부측에 배치될 수 있도록 한다.In addition, the plurality of LEDs 310 mounted on the substrate 300 may be disposed on the lower side of the seating surface 160 instead of being positioned at the center of the substrate 300.
이는 실질적으로 열원인 엘이디(310)들에서 발생된 열을 직상 방향으로 전도시켜 방열의 효과를 높이기 위한 것으로 이해될 수 있다.This may be understood as to increase the effect of heat radiation by conducting heat generated in the LEDs 310 which are substantially heat sources in the direct direction.
이와 같이 구성되는 상부하우징(100)의 하부에는 하부하우징(200)이 결합된다.The lower housing 200 is coupled to the lower portion of the upper housing 100 configured as described above.
하부하우징(200)의 전체적인 형상은 하부로 갈수록 내경이 넓어지는 구조이며, 그 내경의 일부에는 단차가 마련되어 확산판(240)이 안착되는 안착면(230)을 형성하게 된다.The overall shape of the lower housing 200 is a structure in which the inner diameter becomes wider toward the lower portion, and a step is provided in a part of the inner diameter to form a seating surface 230 on which the diffusion plate 240 is seated.
상기 하부하우징(200)은 수지재로 일체 성형되는 것이 바람직하다.The lower housing 200 is preferably integrally molded with a resin material.
상기 하부하우징(200)의 하부 끝단은 하향으로 볼록한 눈부심 방지부(220)가 형성된다. 상기 눈부심 방지부(220)는 상기 확산판(240)에서 확산된 광이 인체의 눈에 직접 입사되지 않도록 반사시키는 역할을 하며, 적절한 배광을 가지도록 할 수 있다.The lower end of the lower housing 200 is formed with an anti-glare portion 220 which is convex downward. The anti-glare unit 220 serves to reflect the light diffused from the diffusion plate 240 so as not to directly enter the eye of the human body, and may have an appropriate light distribution.
상기 하부하우징(200)의 상부측 둘레에는 다수의 체결돌기부(250)가 마련되어 있으며, 상부하우징(100)에서 제공되는 체결돌기부(150)와 마주한 상태에서 볼트 등 체결수단을 체결하여, 견고한 결합이 이루어질 수 있게 된다.A plurality of fastening protrusions 250 are provided at an upper circumference of the lower housing 200, and fastening a fastening means such as a bolt in a state facing the fastening protrusion 150 provided in the upper housing 100, thereby providing a firm coupling. It can be done.
이와 같은 구조에서 상기 엘이디(310)에서 방출된 광은 상기 하부하우징(200)의 높이 방향 중간 정도에 위치하는 확산판(240)에서 확산되어 면광원을 제공하게 되며, 특히 상기 확산판(240)의 중앙부에는 요철면인 확산패턴부(241)을 두어 광의 확산이 보다 용이하게 되도록 한다.In such a structure, the light emitted from the LED 310 is diffused from the diffuser plate 240 positioned in the middle of the height direction of the lower housing 200 to provide a surface light source, and in particular, the diffuser plate 240. The diffusion pattern portion 241, which is an uneven surface, is provided at the central portion of the to facilitate the diffusion of light.
이처럼 확산판(240)에서 확산된 광은 하부하우징(200)의 광방출구(210)를 통해 외부로 방출된다.As such, the light diffused from the diffuser plate 240 is emitted to the outside through the light emitting port 210 of the lower housing 200.
상기 확산판(240)은 하부하우징(200)의 안착면(230)에 별도의 체결수단에 의해 고정되지 않고, 끼워진 상태에서 고정된다.The diffusion plate 240 is not fixed to the seating surface 230 of the lower housing 200 by a separate fastening means, but is fixed in the fitted state.
이와 같이 체결수단을 사용하지 않음으로써 얻을 수 있는 효과는 체결수단을 체결하기 위하여 볼트 삽입구 등의 구조를 형성하지 않아도 되기 때문에 구조가 단순하게 되며, 볼트 등의 체결수단을 사용하여 체결할 때 비용이 상승하고, 제조에 소요되는 시간의 증가에 의해 생산성이 저하되는 것을 방지할 수 있는 효과를 기대할 수 있다.Thus, the effect obtained by not using the fastening means is simple because the structure does not need to form a bolt insertion hole to fasten the fastening means, and the cost is high when fastening using the fastening means such as bolts. It can be expected that the effect of increasing the time required for manufacturing and preventing the productivity from decreasing is increased.
이를 위하여 본 발명에서는 하부하우징(200)을 수지재로 하여, 일체 사출을 한다. 이때 사출 직후에는 하부하우징(200)이 상대적으로 더 높은 온도이며 시간이 갈수록 온도가 낮아지면서 미세하게 수축이 되는 것을 고려하여, 사출 직후 하부하우징(200)의 광방출구(210)측에서 상기 확산판(240)을 압입하여 상기 안착면(230)에 접할 때까지 밀어 넣는다. To this end, in the present invention, the lower housing 200 is made of a resin material, and then integrally injected. At this time, considering that the lower housing 200 has a relatively higher temperature immediately after the injection and shrinks finely as the temperature decreases with time, the diffusion plate at the light emitting port 210 side of the lower housing 200 immediately after the injection. Push in 240 until it contacts the seating surface 230.
앞서 언급한 바와 같이 사출 후 하부하우징(200)이 상대적으로 높은 온도일 때에는 상기 확산판(240)의 압입이 매우 용이하며, 하부하우징(200)이 상온으로 식게 되면, 미세하게 수축되면서 상기 확산판(240)을 견고하게 고정할 수 있게 된다.As mentioned above, when the lower housing 200 is relatively high after injection, the pressurization of the diffusion plate 240 is very easy, and when the lower housing 200 cools to room temperature, the diffusion plate is minutely contracted and is finely contracted. 240 can be firmly fixed.
따라서 본 발명은 별도의 체결수단을 사용하지 않고도 상기 확산판(240)을 고정할 수 있다.Therefore, the present invention can fix the diffusion plate 240 without using a separate fastening means.
이와는 다르게 상기 확산판(240)을 하부하우징(200)이 완전히 경화된 상태에서 압입하여 고정할 수도 있다.Alternatively, the diffusion plate 240 may be fixed by pressing the lower housing 200 in a completely cured state.
상기 하부하우징(200)의 외면의 일부에는 천장에 하부하우징(200)을 고정하기 위한 고정부(400)가 설치된다. 이때 고정부(400)를 구성하는 회동부(410)도 하부하우징(200)과 일체로 성형할 수 있으며, 금속재이며 상기 회동부(410)를 중심으로 회동할 수 있는 탄성걸림부(420)는 그 회동부(410)에 끼워져 고정될 수 있다.A part of an outer surface of the lower housing 200 is provided with a fixing part 400 for fixing the lower housing 200 to the ceiling. In this case, the rotating part 410 constituting the fixing part 400 may also be integrally formed with the lower housing 200, and the elastic locking part 420 may be made of metal and may rotate about the rotating part 410. The rotating part 410 may be fitted and fixed.
또한 보다 더 견고한 고정과 지진등 재난에 대한 안정성의 확보를 위하여 고리부(430)를 더 포함하여 구성할 수 있다.In addition, it may be configured to further include a ring 430 in order to secure a more robust fixing and stability against disasters such as earthquakes.
본 발명은 상기 실시예에 한정되지 않고 본 발명의 기술적 요지를 벗어나지 아니하는 범위 내에서 다양하게 수정, 변형되어 실시될 수 있음은 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 있어서 자명한 것이다.It will be apparent to those skilled in the art that the present invention is not limited to the above embodiments and may be variously modified and modified without departing from the technical spirit of the present invention. will be.
본 발명은 천장에 매립되는 조명의 열방출 효율을 높이며, 눈부심을 감소시킬 수 있는 것으로, 산업상 이용 가능성이 있다.The present invention is to increase the heat dissipation efficiency of the light embedded in the ceiling, can reduce the glare, there is industrial applicability.
Claims (6)
- 저면에 광방출구(210)가 마련되어 있으며, 상부로 갈수록 직경이 감소하며, 내경일부에 안착면(230)을 가지는 수지재 하부하우징(200);The light emitting port 210 is provided on the bottom, and the diameter decreases toward the upper portion, the resin material lower housing 200 having a seating surface 230 in the inner diameter portion;상기 하부하우징(200)의 상부에 결합되며 내부에 전원공급부(140)가 삽입되고, 엘이디(310)를 실장한 기판(300)이 저면 개방부의 둘레의 안착면(160)에 결합되는 금속재 상부하우징(100); 및A metal upper housing coupled to an upper portion of the lower housing 200 and having a power supply 140 inserted therein and a substrate 300 mounted with an LED 310 coupled to a seating surface 160 around a bottom opening. 100; And상기 하부하우징(200)의 안착면(230)에 안착되는 확산판(240)을 포함하는 엘이디 조명장치.LED lighting device comprising a diffusion plate 240 seated on the seating surface 230 of the lower housing (200).
- 제1항에 있어서,The method of claim 1,상기 기판(300)에 실장된 상기 엘이디(310)는 상기 안착면(160)의 직하방향에 위치하는 것을 특징으로 하는 엘이디 조명장치.The LED 310 mounted on the substrate 300 is an LED lighting apparatus, characterized in that located in the direction directly below the seating surface (160).
- 제1항에 있어서,The method of claim 1,상기 상부하우징(100)의 안착면(160) 상부에는 다수의 방열핀(130)이 일체로 마련된 것을 특징으로 하는 엘이디 조명장치.LED lighting apparatus, characterized in that a plurality of heat dissipation fins 130 are provided integrally on the seating surface 160 of the upper housing 100.
- 제1항에 있어서, The method of claim 1,상기 확산판(240)은,The diffusion plate 240,상기 하부하우징(200)의 성형 직후에, 상기 하부하우징(200)의 내측으로 삽입되어 상기 안착면(230)에 접한 상태에서, 상기 하부하우징(200)의 온도가 낮아짐에 따라 견고하게 고정된 것을 특징으로 하는 엘이디 조명장치.Immediately after molding of the lower housing 200, the lower housing 200 is inserted into the lower housing 200 and is in contact with the seating surface 230, so that the lower housing 200 is firmly fixed as the temperature of the lower housing 200 is lowered. LED lighting device characterized in that.
- 제4항에 있어서,The method of claim 4, wherein상기 확산판(240)은,The diffusion plate 240,중앙 일부에 확산패턴(241)이 요철 구조로 형성된 것을 특징으로 하는 엘이디 조명장치.LED lighting device, characterized in that the diffusion pattern 241 is formed in an uneven structure in the center portion.
- 제1항에 있어서,The method of claim 1,상기 전원공급부(140)는,The power supply unit 140,외부의 교류전원을 전선(500)을 통해 공급받아 상기 기판(300)에 직류전원을 공급함과 아울러 전원연결부(110)를 통해 직류전원을 이웃한 다른 엘이디 조명장치에 공급하거나,The external AC power is supplied through the wire 500 to supply the DC power to the substrate 300 as well as to supply the DC power to the other LED lighting device through the power connection unit 110, or외부의 교류전원을 전원연결부(110)를 통해 공급받아 상기 기판(300)에 직류전원을 공급함과 아울러 전선(500)을 통해 직류전원을 이웃한 다른 엘이디 조명장치에 공급하는 것을 특징으로 하는 엘이디 조명장치.LED lighting, characterized in that the external AC power is supplied through the power connection unit 110 to supply the DC power to the substrate 300 as well as to supply the DC power to the other LED lighting device through the wire 500. Device.
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JP7097704B2 (en) | 2018-01-23 | 2022-07-08 | 日東電工株式会社 | Adhesive tape |
KR102241426B1 (en) * | 2020-06-30 | 2021-04-16 | 주식회사 바이더엠 | Led flood light with multi lighting area |
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