WO2016139724A1 - Dispositif d'imagerie - Google Patents

Dispositif d'imagerie Download PDF

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Publication number
WO2016139724A1
WO2016139724A1 PCT/JP2015/056095 JP2015056095W WO2016139724A1 WO 2016139724 A1 WO2016139724 A1 WO 2016139724A1 JP 2015056095 W JP2015056095 W JP 2015056095W WO 2016139724 A1 WO2016139724 A1 WO 2016139724A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive member
substrate
electrode
electron source
imaging device
Prior art date
Application number
PCT/JP2015/056095
Other languages
English (en)
Japanese (ja)
Inventor
智和 酒井
新吾 岩崎
弘喜 金田
Original Assignee
パイオニア株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パイオニア株式会社 filed Critical パイオニア株式会社
Priority to PCT/JP2015/056095 priority Critical patent/WO2016139724A1/fr
Publication of WO2016139724A1 publication Critical patent/WO2016139724A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J31/00—Cathode ray tubes; Electron beam tubes
    • H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
    • H01J31/26—Image pick-up tubes having an input of visible light and electric output
    • H01J31/28—Image pick-up tubes having an input of visible light and electric output with electron ray scanning the image screen

Definitions

  • the present invention relates to an imaging apparatus.
  • Patent Document 1 describes an example of such an imaging apparatus.
  • an electron source is mounted on a glass substrate.
  • a lead electrode is disposed around the electron source.
  • An insulating frame is mounted on the glass substrate via lead electrodes. This frame surrounds the electron source. Furthermore, this frame has a step surface on the inner surface.
  • a metal film is formed on the step surface.
  • the acceleration electrode is supported on the above-described step surface through the metal film.
  • the acceleration electrode is an electrode for applying a voltage for accelerating electrons from the electron source.
  • the acceleration electrode is electrically connected to the lead electrode through an electrode embedded in the frame.
  • an acceleration electrode may be electrically connected to an electrode provided on a substrate on which an electron source is mounted in order to apply a voltage to the acceleration electrode.
  • an acceleration electrode to an electrode provided on a substrate on which an electron source is mounted.
  • the invention described in claim 1 A first substrate; An electron source mounted on the first substrate; A first electrode provided on the first substrate; An insulating frame mounted on the first substrate and surrounding the electron source and the first electrode; A first step surface formed by a step on the inner surface of the frame and facing the opposite side of the first substrate; A conductive member disposed on the first step surface of the frame; A connecting member for electrically connecting the conductive member and the first electrode; An acceleration electrode supported by the first step surface across the conductive member, facing the electron source, and electrically connected to the conductive member; A second substrate facing the electron source via the acceleration electrode and closing the opening of the frame; A conversion film that is stacked on a surface of the second substrate that faces the acceleration electrode, and converts electromagnetic waves or particle beams into electric charges; It is an imaging device provided with.
  • FIG. 1 is a cross-sectional view illustrating a configuration of an imaging apparatus according to Embodiment 1.
  • FIG. It is the figure which expanded the area
  • FIG. It is a figure for demonstrating the manufacturing method of the imaging device shown in FIG.
  • FIG. It is a figure for demonstrating the manufacturing method of the imaging device shown in FIG.
  • FIG. It is a figure for demonstrating the manufacturing method of the imaging device shown in FIG.
  • FIG. 6 is a cross-sectional view illustrating a configuration of an imaging apparatus according to Embodiment 2.
  • FIG. It is a figure for demonstrating the method of manufacturing the imaging device shown in FIG. It is the figure which expanded the principal part of the 1st modification of FIG. It is the figure which expanded the principal part of the 2nd modification of FIG.
  • FIG. 1 is a cross-sectional view illustrating a configuration of the imaging apparatus according to the first embodiment.
  • FIG. 2 is an enlarged view of a region surrounded by a broken line ⁇ in FIG.
  • the imaging apparatus includes a first substrate 100, an electron source 110, a lead electrode 120, a frame body 200, a conductive member 210, a conductive film 222 (connection member), an acceleration electrode 230, a second substrate 300, and a conversion film 310.
  • the imaging device concerning this embodiment detects electromagnetic waves (for example, infrared rays, visible rays, ultraviolet rays, gamma rays, or X rays).
  • the conversion film 310 converts electromagnetic waves into electric charges.
  • the imaging device may detect a particle beam (for example, a neutron beam).
  • the conversion film 310 may convert particle beams into electric charges.
  • the imaging apparatus is described as detecting an electromagnetic wave.
  • the first substrate 100 is an insulating substrate (for example, a glass substrate or a ceramic substrate) or a semiconductor substrate (for example, a silicon substrate).
  • An electron source 110 is mounted on the first surface 102 of the first substrate 100.
  • the electron source 110 is a semiconductor chip.
  • the back surface of the electron source 110 is fixed to the first substrate 100 with an adhesive layer 114 (for example, silver paste).
  • the electron source 110 has a radiation surface 112 on the side opposite to the first substrate 100.
  • the electron source 110 can emit electrons from each of a plurality of regions (for example, a plurality of lattice points of m rows and n columns) arranged two-dimensionally on the emission surface 112.
  • Such electrons may be emitted by scanning a surface electron source (for example, an electron source using carbon nanotubes, a Spindt-type electron source, or an electron source using HEED (High-efficiency Electron Emission Device)). it can.
  • a plurality of electron guns may be arranged two-dimensionally.
  • a lead electrode 120 is disposed around the electron source 110.
  • the lead electrode 120 is formed using metal (for example, gold or copper).
  • the lead electrode 120 is a plurality of conductive patterns arranged along the edge of the electron source 110 in plan view. Such a conductive pattern is formed, for example, by patterning a metal film by lithography.
  • the frame body 200 is mounted on the first substrate 100 via the lead electrode 120.
  • the frame body 200 is formed using an insulating member (for example, glass).
  • the frame body 200 has a cylindrical shape (for example, a cylindrical shape).
  • the frame body 200 surrounds the electron source 110.
  • a sealing layer 410 (for example, indium or glass frit) is located between the frame body 200 and the lead electrode 120. Thereby, the space between the frame body 200 and the lead electrode 120 is sealed by the sealing layer 410.
  • a part (first electrode) of the lead electrode 120 is located inside the frame body 200.
  • the first electrode (a part of the lead electrode 120) is electrically connected to the electron source 110 via the bonding wire 116. Further, the first electrode (a part of the lead electrode 120) is electrically connected to the acceleration electrode 230 via the conductive film 222 and the conductive member 210. Furthermore, the other part of the lead electrode 120 is located outside the frame body 200. Thereby, the electron source 110 and the acceleration electrode 230 can be electrically connected to a region outside the frame body 200 via the lead electrode 120.
  • the frame body 200 has a step surface 202 (first step surface) on the inner surface.
  • the step surface 202 is formed by a step on the inner surface of the frame body 200.
  • the step surface 202 faces the side opposite to the first substrate 100 (specifically, the upper side). In any region, the step surface 202 forms the same surface parallel to the surface of the first substrate 100.
  • the step surface 202 may be formed on the entire circumference of the inner surface of the frame body 200, or may be formed only on a partial region of the entire circumference of the inner surface of the frame body 200.
  • the conductive member 210 is disposed on the step surface 202 of the frame body 200.
  • the conductive member 210 is located around the electron source 110 in plan view.
  • the conductive member 210 is formed using a base material whose upper surface and lower surface are parallel. As described above, the step surface 202 forms the same surface in any region. For this reason, when the conductive member 210 is disposed on the step surface 202 in such a direction that the lower surface of the conductive member 210 faces the step surface 202, the upper surface of the conductive member 210 is parallel to the step surface 202 in any region. Form the same surface.
  • the conductive member 210 may be formed on the entire circumference of the inner surface of the frame body 200, or may be formed only on a part of the entire circumference of the inner surface of the frame body 200.
  • the conductive member 210 is electrically connected to the lead electrode 120 through the conductive film 222.
  • the conductive film 222 is formed across the conductive member 210 and the lead electrode 120. More specifically, in the example shown in this drawing, the conductive film 222 is formed by applying a conductive paste from one side of the inner surface of the conductive member 210 and the lead electrode 120 to the other. Thereby, when the conductive film 222 is viewed in a direction perpendicular to the first substrate 100, a part of the conductive film 222 reaches above the step surface 202 of the frame body 200. This part of the conductive film 222 is connected to the conductive member 210. The conductive film 222 reaches the lead electrode 120 from the conductive member 210 along the inner surface of the frame body 200.
  • the conductive paste described above is formed, for example, by dispersing a conductive filler in a resin.
  • the inner surface of the frame 200 has a portion connected to the inner surface of the conductive member 210 that is flush with the inner surface of the conductive member 210. Accordingly, the conductive film 222 can be smoothly transmitted from the inner surface of the conductive member 210 to the inner surface of the frame body 200.
  • the above-described portion of the inner surface of the frame 200 and the inner surface of the conductive member 210 do not have to form the same surface. In this case, a step is formed between the above-described portion of the inner surface of the frame body 200 and the inner surface of the conductive member 210. Even when such a step is formed, the conductive film 222 can be smoothly transmitted from the inner surface of the conductive member 210 to the inner surface of the frame body 200 if the step is small to some extent.
  • Accelerating electrode 230 is mounted on conductive member 210.
  • the acceleration electrode 230 has a grid part 232 and a support part 234.
  • the grid part 232 is formed of a conductive member (for example, Al) having a plurality of openings arranged two-dimensionally.
  • the grid part 232 faces the electron source 110.
  • the electrons from the electron source 110 are accelerated by the voltage of the grid part 232 and then pass through the opening of the grid part 232.
  • the support part 234 is located around the grid part 232 and supports the grid part 232. Further, the support portion 234 is mounted on the conductive member 210. Thereby, the acceleration electrode 230 is supported above the electron source 110.
  • the upper surface of the conductive member 210 forms the same surface parallel to the step surface 202 (in other words, the surface of the first substrate 100). Therefore, when the conductive member 210 is mounted on the acceleration electrode 230, the acceleration electrode 230 can be supported in parallel to the surface of the first substrate 100 (that is, the electron source 110). Further, the conductive member 210 is electrically connected to the lead electrode 120 through the conductive film 222. For this reason, the acceleration electrode 230 can be electrically connected to the lead electrode 120 via the conductive member 210 and the conductive film 222.
  • the conductive member 210 is made of a material having a certain degree of rigidity (for example, stainless steel). Thereby, even if the acceleration electrode 230 is mounted on the conductive member 210, the conductive member 210 can be prevented from being deformed.
  • An insulating member 240 (for example, glass) is mounted on the support portion 234 of the acceleration electrode 230.
  • the insulating member 240 is provided to prevent the sealing layer 420 (described later) from coming into contact with the support portion 234.
  • the upper surface of the insulating member 240 forms the same surface as the upper surface of the frame body 200.
  • the opening surrounded by the frame body 200 is closed by the second substrate 300.
  • the region surrounded by the frame body 200 is blocked from the external region.
  • This region is in a vacuum state.
  • a sealing layer 420 (for example, indium or glass frit) is provided on the upper surface of the frame body 200 and the upper surface of the insulating member 240.
  • the edge of the second substrate 300 is pressed against the sealing layer 420.
  • a part of the sealing layer 420 protrudes outside the frame body 200 and the second substrate 300.
  • This partial side surface of the sealing layer 420 is sealed with a sealing member 430.
  • the sealing member 430 surrounds the frame body 200 and the second substrate 300 in plan view, and has, for example, a ring shape.
  • the second substrate 300 is formed of a material that can transmit electromagnetic waves detected by the imaging apparatus.
  • the second substrate 300 can be a glass substrate, for example.
  • the second substrate 300 can be a silicon substrate, for example.
  • a transparent electrode 302 is formed on the surface of the second substrate 300 facing the electron source 110.
  • the transparent electrode 302 is formed using, for example, ITO (indium tin oxide).
  • the lead electrode 304 is provided on the second substrate 300.
  • the lead electrode 304 passes through the second substrate 300 and one end is connected to the transparent electrode 302.
  • the lead electrode 304 is used to apply an external voltage to the transparent electrode 302. Further, the lead electrode 304 is used to detect a current flowing through the transparent electrode 302.
  • the transparent electrode 302 is covered with a conversion film 310.
  • the conversion film 310 is formed using a material (for example, amorphous selenium) that can convert electromagnetic waves (for example, visible light or X-rays) into electric charges. Note that the conversion film 310 may be laminated on the transparent electrode 302.
  • FIG. 3A is a plan view showing a first example of the configuration of the conductive member 210 shown in FIG.
  • the conductive member 210 is formed using a base material having an opening.
  • This base material is, for example, stainless steel coated with a metal having high conductivity (for example, Cu).
  • the conductive member 210 is continuously formed over the entire circumference of the edge of the opening.
  • the conductive member 210 has a ring shape.
  • the electron source 110 is positioned inside the above-described opening.
  • the conductive member 210 is detachable from the frame body 200 (FIG. 1).
  • FIG. 3B is a plan view showing a second example of the configuration of the conductive member 210 shown in FIG.
  • the conductive member 210 has an opening in the same manner as the example shown in FIG.
  • the conductive member 210 has two end portions 212.
  • the conductive member 210 is continuously formed from one end 212 to the other end 212 along the edge of the opening.
  • FIG. 4 to 7 are diagrams for explaining a method of manufacturing the imaging device shown in FIG.
  • the electron source 110 and the lead electrode 120 are formed on the first substrate 100.
  • the electron source 110 and the lead electrode 120 are connected using the bonding wire 116.
  • the sealing layer 410 is formed on the lead electrode 120.
  • the frame body 200 is mounted on the first substrate 100 via the sealing layer 410 and the lead electrode 120.
  • the step surface 202 is formed on the frame body 200 before the frame body 200 is mounted on the frame body 200.
  • the step surface 202 is formed by processing the frame body 200, for example.
  • the conductive member 210 is mounted on the step surface 202 of the frame body 200.
  • the conductive member 210 may be fixed to the step surface 202 via an adhesive.
  • the conductive member 210 may be fitted into the inner surface of the frame body 200.
  • a conductive paste is applied from the side surface of the conductive member 210 to the lead electrode 120. Thereby, the conductive film 222 is formed. Note that solder may be used for the conductive film 222.
  • the acceleration electrode 230 is mounted on the conductive member 210 as shown in FIG. Thereby, the acceleration electrode 230 is supported above the electron source 110. In this case, the acceleration electrode 230 is in contact with the conductive member 210. Further, the conductive member 210 is electrically connected to the lead electrode 120 through the conductive film 222. Accordingly, the acceleration electrode 230 can be electrically connected to the lead electrode 120 via the conductive member 210 and the conductive film 222.
  • the insulating member 240 is formed on the support portion 234 of the acceleration electrode 230.
  • the sealing layer 420 is formed on the upper surface of the frame body 200 and the upper surface of the insulating member 240.
  • the second substrate 300 is prepared.
  • the transparent electrode 302 and the conversion film 310 are formed on the surface of the second substrate 300, and the lead electrode 304 is formed on the second substrate 300.
  • the second substrate 300 is mounted on the frame body 200 via the sealing layer 420 so that the conversion film 310 and the transparent electrode 302 face the first substrate 100.
  • a part of the sealing layer 420 protrudes from between the frame body 200 and the second substrate 300 toward the outside.
  • This partial side surface of the sealing layer 420 is sealed with a sealing member 430. In this way, the imaging device shown in FIG. 1 is manufactured.
  • a voltage is applied to the conversion film 310 from the outside via the lead electrode 304 and the transparent electrode 302. As a result, an electric field is generated in the conversion film 310 in the direction from the second substrate 300 toward the electron source 110.
  • electromagnetic waves are irradiated from the opposite side of the conversion film 310 through the second substrate 300.
  • the radiation passes through the second substrate 300 and the transparent electrode 302 and then enters the conversion film 310.
  • the radiation forms electron-hole pairs in the conversion film 310.
  • holes contained in the electron-hole pair move to the electron source 110 side by an electric field inside the conversion film 310.
  • generated in this case respond
  • the holes accumulated on the surface of the conversion film 310 are two-dimensionally scanned by electrons emitted from the electron source 110.
  • a current flows from the conversion film 310 to the transparent electrode 302. This current is read by the lead electrode 304.
  • the hole pattern generated on the surface of the conversion film 310 can be read by reading from the electron source 110 which part of the electron source 110 has emitted electrons.
  • a voltage is applied to the acceleration electrode 230 from the outside via the lead electrode 120, the conductive film 222, and the conductive member 210.
  • This voltage is a voltage for accelerating the electrons emitted from the electron source 110.
  • the electrons emitted from the emission surface 112 of the electron source 110 are accelerated by the voltage described above, and then pass through the opening of the grid portion 232 of the acceleration electrode 230.
  • the conductive member 210 is disposed on the step surface 202 of the frame body 200.
  • An acceleration electrode 230 is mounted on the conductive member 210. Thereby, the acceleration electrode 230 is supported above the electron source 110.
  • the conductive member 210 is electrically connected to the lead electrode 120 through the conductive film 222. Accordingly, an external voltage can be applied to the acceleration electrode 230 via the lead electrode 120, the conductive film 222, and the conductive member 210.
  • FIG. 8 is a cross-sectional view illustrating a configuration of the imaging apparatus according to the second embodiment, and corresponds to FIG. 1 of the first embodiment.
  • the imaging apparatus according to the present embodiment has the same configuration as that of the imaging apparatus according to the first embodiment except for the following points.
  • the imaging device includes a bonding wire 224 (connection member).
  • the bonding wire 224 has one end connected to the conductive member 210 and the other end connected to the lead electrode 120. Thereby, the conductive member 210 and the lead electrode 120 can be electrically connected via the bonding wire 224.
  • FIG. 9 is a diagram for explaining a method of manufacturing the imaging device shown in FIG. First, similarly to Embodiment 1, the steps shown in FIGS. 4 and 5 are performed.
  • the conductive member 210 and the lead electrode 120 are connected using a bonding wire 224.
  • FIG. 10 is an enlarged view of the main part of the first modification of FIG.
  • the conductive member 210 has a convex portion 214.
  • the protrusion 214 protrudes on the side opposite to the frame body 200.
  • the convex portion 214 is located on the first substrate 100 side when the upper surface (first surface: the surface on which the support portion 234 (acceleration electrode 230) is mounted) of the conductive member 210 is used as a reference.
  • first surface the surface on which the support portion 234 (acceleration electrode 230) is mounted
  • the bonding wire 224 can enter the gap.
  • one end of the bonding wire 224 is connected to the surface of the convex portion 214 facing the opposite side to the first substrate 100.
  • FIG. 11 is an enlarged view of the main part of the second modification of FIG.
  • the conductive member 210 has a step surface 216 (second step surface).
  • the step surface 216 is formed by a step on the outer surface of the conductive member 210.
  • the step surface 216 faces the step surface 202 side of the frame body 200.
  • the conductive member 210 is parallel to the step surface 202. Can be supported.
  • the stepped surface 202 may be formed on the frame body 200 by removing a part of the inner surface of the frame body 200 from above the frame body 200.
  • a part of the frame body 200 may remain between the step surface 202 and the above-described inner surface.
  • the above-described part of the frame body 200 can enter the gap generated by the step surface 216.
  • the conductive member 210 can be supported in parallel to the step surface 202.

Landscapes

  • Image-Pickup Tubes, Image-Amplification Tubes, And Storage Tubes (AREA)

Abstract

L'invention concerne un dispositif d'imagerie dans lequel il est possible de connecter électriquement une électrode d'accélération avec facilité à une électrode disposée sur un substrat sur lequel une source d'électrons est montée. Un premier substrat (100) est pourvu d'une électrode conductrice (120). Un cadre (200) est monté sur le premier substrat (100). Un élément conducteur (210) est disposé sur une surface progressive (202) du cadre (200). Une électrode d'accélération (230) est montée sur l'élément conducteur (210). L'électrode d'accélération (230) est connectée électriquement à l'élément conducteur (210). L'élément conducteur (210) est connecté électriquement à l'électrode conductrice (120) à travers un film conducteur (222).
PCT/JP2015/056095 2015-03-02 2015-03-02 Dispositif d'imagerie WO2016139724A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/056095 WO2016139724A1 (fr) 2015-03-02 2015-03-02 Dispositif d'imagerie

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/056095 WO2016139724A1 (fr) 2015-03-02 2015-03-02 Dispositif d'imagerie

Publications (1)

Publication Number Publication Date
WO2016139724A1 true WO2016139724A1 (fr) 2016-09-09

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ID=56848819

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PCT/JP2015/056095 WO2016139724A1 (fr) 2015-03-02 2015-03-02 Dispositif d'imagerie

Country Status (1)

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WO (1) WO2016139724A1 (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000048743A (ja) * 1998-05-26 2000-02-18 Futaba Corp 平面形撮像装置及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000048743A (ja) * 1998-05-26 2000-02-18 Futaba Corp 平面形撮像装置及びその製造方法

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