WO2016122620A1 - Revêtement de tête d'impression - Google Patents

Revêtement de tête d'impression Download PDF

Info

Publication number
WO2016122620A1
WO2016122620A1 PCT/US2015/013855 US2015013855W WO2016122620A1 WO 2016122620 A1 WO2016122620 A1 WO 2016122620A1 US 2015013855 W US2015013855 W US 2015013855W WO 2016122620 A1 WO2016122620 A1 WO 2016122620A1
Authority
WO
WIPO (PCT)
Prior art keywords
printhead
coating
pcb
ald
die
Prior art date
Application number
PCT/US2015/013855
Other languages
English (en)
Inventor
Zhizhang Chen
Chien-Hua Chen
James R. Przybyla
Original Assignee
Hewlett-Packard Development Company, L.P.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett-Packard Development Company, L.P. filed Critical Hewlett-Packard Development Company, L.P.
Priority to PCT/US2015/013855 priority Critical patent/WO2016122620A1/fr
Priority to TW105102208A priority patent/TWI579401B/zh
Publication of WO2016122620A1 publication Critical patent/WO2016122620A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation

Definitions

  • a printhead can include a component in a printer that assembles and holds characters and from which the images of the characters are transferred to a printing medium.
  • Printheads often apply ink to a particular medium, such as paper.
  • a printhead die may be embedded in a printed circuit board (PCB). Ink can flow to the printhead die through a slot in the PCB and into the printhead die.
  • PCB printed circuit board
  • Figure 1 illustrates a diagram of a portion of an example printhead according to the present disclosure.
  • Figure 2 illustrates a flow diagram of an example of a method according to the present disclosure.
  • Figure 3 illustrates a flow chart of an example of a method according to the present disclosure.
  • PCBs or other substrates coupled to printheads may be affected by ink shorts.
  • ink short occurs when metal traces within a substrate are exposed to ink. This ink may be corrosive, causing the metal traces to corrode. For instance, ink leakage paths may be present at or near interfaces associated with the substrate, and the substrate may have
  • ink e.g., thermal ink jet (TIJ) ink
  • TIJ thermal ink jet
  • Some approaches to preventing ink shorting include passivation techniques including shielding an outer layer of the substrate.
  • low glass transition temperatures e.g., less than 175 degrees Celsius
  • substrate materials e.g., PCB materials
  • process options e.g., less than 200 degrees Celsius
  • passivation options because of risk to deformation of the substrate during deposition. Additionally, passivation approaches may focus on device performance and energy efficiency of a printhead, but not protection from ink shorts.
  • examples of the present disclosure include protecting substrates from ink shorts in a print bar fabrication application.
  • print bar robustness can improve printhead performance.
  • a coating also referred to herein as a conformal coating or film
  • ALD atomic layer deposition
  • Figure 1 illustrates a diagram of a portion of an example printhead 100 according to the present disclosure.
  • Printhead 100 can include a die, for instance a silicon die 104, embedded in PCB 102.
  • PCB 102 may comprise a number of different materials.
  • PCB 102 may comprise PEN resin material, plastic material, aluminum material, or copper material, among others. While a PCB is illustrated in the example in Figure 1 , a printhead in accordance with the present disclosure need not include a PCB.
  • a PCB is illustrated in the example in Figure 1 , a printhead in accordance with the present disclosure need not include a PCB.
  • printhead 100 may include a non-PCB substrate.
  • a substrate as used herein, may refer to an entire PCB, or more specifically, an electrically insulating portion of a PCB structure, such as fiberglass bound together with epoxy cement.
  • a substrate as used herein, may also refer to a non-PCB structure within the printhead.
  • Die 104 can be embedded in an epoxy mold compound (EMC) 106.
  • EMC epoxy mold compound
  • Embedding die 104 in an EMC can replace a need for an adhesive to attach a die to other portions of the printhead, for example.
  • Printhead 100 can include a coating (not shown in Figure 1 ) to protect PCB 102 from ink shorts.
  • the coating can be applied to printhead 100 using an ALD process, such that printhead 100 is sealed.
  • ALD involves depositing a selected composition on crystalline or amorphous substrates or layers one molecular layer at a time.
  • ALD is a thin coating deposition technique based on the sequential use of a gas phase chemical process. ALD reactions may involve precursors that react with the surface of a material one at a time in a sequential, self-limiting, manner. Through the repeated exposure to separate precursors, a thin coating is slowly deposited.
  • the coating may protect the PCB or other substrate from ink shorts by simultaneously having a number of properties.
  • the coating may be chemically robust.
  • a chemically robust coating is inert to a variety of compounds such as ink and moisture, among others.
  • a chemically robust coating can provide a strong chemical resistance to applied inks, as well as to the process chemistry during the fabrication process.
  • the coating's chemical robustness, along with its ability to adhere to a variety of substrates may be a result of a combination of precursor chemistry selection, ALD deposition conditions, and substrate pre-deposition treatments.
  • a water-based hafnium oxide may be used for the coating.
  • the ALD deposition cycle time e.g., pulse/purge time
  • the pre-deposition treatments may include an ultrasonic cleaning, oxygen plasma, and vacuum out-gassing, which can provide adhesion to substrates and produce a pin-hole free conformal coating.
  • the coating can be mechanically flexible (e.g., have at least a threshold flexibility). This flexibility allows for coverage even though silicon, EMC, and a PCB have different coefficients of expansion (e.g., with heating or cooling). For instance, silicon may not expand or shrink a great deal compared to EMC, which may expand or shrink less than PCB materials.
  • a coating in accordance with the present disclosure can seal the printhead, while still allowing for expansion and contraction, for instance, during heating and cooling of the printhead and its components. Without the mechanical flexibility, interfaces between the EMC and PCB may not be sealed, and separation may allow for ink shorts, for example.
  • the coating may be thermally stable.
  • the coating may have an amorphous structure such that it can be applied to a variety of surfaces and/or substrates, including metals (e.g., copper, aluminum, stainless steel, gold, etc.) polymer or plastics, silicon, etc.
  • the coating can maintain its pin-hole-free seal while undergoing thermal cycles and mechanical bending, for instance.
  • the coating may be stable from room temperature (20 degrees Celsius) to 200 degrees Celsius, and may maintain its stability with rises and falls in temperatures. For instance, the coating can be deposited and remain stable in an environment having a temperature below 200 degrees Celsius.
  • the coating can be conformal.
  • a conformal coating is a coating that can effectively cover different shaped- surfaces and textures.
  • a conformal coating may define a morphologically uneven interface with another body and may have a thickness that is
  • a conformal coating may exhibit thickness variations along edges, steps, or other elements of the morphology of the interface, but without substantial thickness variations.
  • the conformal coating can seal a three-dimensional (3D) structure of a printhead, protecting a PCB or other substrate from ink shorts.
  • the conformal coating can give a substantially uniform coating to features and shapes that are often missed (e.g., due to shadowing), for instance, overhangs, angles, edges, etc.
  • “conformal coating” and “coating” are used interchangeably.
  • Method 220 can include the use of an ALD coating to protect printhead components from ink shorts.
  • Printhead 100 as illustrated in Figure 1 , may result from method 220, for instance.
  • a PCB 202 is prepared.
  • PCB may be an FR-4 PCB, such that it is a glass-reinforced epoxy PCB.
  • An FR-4 PCB may be a composite material composed of woven fiberglass cloth with an epoxy resin binder that is flame resistant.
  • examples of the present disclosure are not limited to FR-4 PCBs, and in some examples, a printhead may not include PCB 202, but rather some other material/substrate may be present in its place.
  • a die 204 (e.g., silicon die) can be prepared before coupling to the PCB 202, for instance by performing a deep ink feed hole etch, ink chamber formation (e.g., via an SU8 chamber/wax fill), nozzle plate formation (e.g., via an SU8 top hat), and/or sliver thinning/sawing, among others.
  • a carrier 236 is coupled to die 204 and PCB 202.
  • a thermal release tape can be placed on carrier 236 such that one side of the tape attaches to carrier 236 and the other side attaches to PCB 202 and die 204 to hold them in place.
  • carrier 236, PCB 202, and die 204 can be placed into a compression mold, and an EMC material 206 can be dispensed into the mold such that the PCB 202 and die 204 are embedded in EMC material 206, forming a substrate to be coated.
  • the substrate can include the printhead, portions of the printhead, and/or components of the printhead, among others.
  • the substrate can be released from carrier 236 and the thermal release tape can be released from the substrate, with PCB 202, EMC material 206 and die 204 remaining.
  • the substrate can undergo a number of other mechanical processes, such as ink feed hole protection, slotting (e.g. sawing), and/or sub-panel adjustment at 230, and/or wire bonding and film encapsulation at 232.
  • a copper wire can be seen at 244, and a film encapsulation can be seen at 246.
  • the substrate may include a slot 242 that allows ink to get to the die 204 for the printing process, which may be referred to as an ink access slot.
  • Slot 242 in some examples, may be formed in the EMC, the PCB, and/or a different substrate.
  • the substrate can be placed into an ALD chamber for deposition of a coating 248 onto the printhead.
  • the coating is a hafnium oxide coating.
  • the coating can seal cracks, pin holes,
  • hafnium oxide HfO 2
  • Zirconium dioxide ZrO 2
  • Hafnium silicon oxides Hf x Si y O z
  • Zirconium silicon oxides Hf x Si y O z
  • the coating can protect the PCB from ink shorts by sealing interfaces between the silicon dies, EMC, and PCB. These interfaces may provide ink leakage paths, and the PCB broad substrate materials have porous structures.
  • the coating can prevent ink from diffusing though interfaces, porous structures, and PCB broad edge surfaces and migrating to locations that result in electrical shorts.
  • the coating can overmold the substrate such that entire surfaces are sealed. For instance, entire strips of silicon dies can be overmolded for protection.
  • the coating can be used in particular temperature environments in accordance with the present disclosure.
  • PCB materials may include (low) glass temperature requirements of less than 200 degrees Celsius (in some examples less than 175 degrees Celsius).
  • a coating in accordance with the present disclosure can seal and protect a PCB at these temperature requirements.
  • the coating can be chemically robust (for inks), pin-hole free (to block ink diffusion), cover porous surfaces and edges, adhere to a variety of surfaces and/or materials, be thermally stable, and be mechanically flexible.
  • the coating can seal the substrate, and this seal can prevent metal traces of the PCB from being exposed to ink, which can cause ink shorting and/or corrosion of the PCB due to the ink's abrasiveness.
  • the seal can coat holes, cracks, gaps, etc. that may allow passage of ink or other undesirable materials to the PCB.
  • an ALD coating can be deposited onto a PCB (e.g., directly onto a PCB) before the die attach process.
  • the contact pad area may be sealed off by high temperature tape during the ALD coating process.
  • the coating can be deposited on different printhead types.
  • the coating can be deposited on and protect a thermal inkjet printhead, a piezoelectric inkjet printhead, or an electrostatically driven inkjet printhead, among others.
  • a coating in accordance with the present disclosure can allow for packaging of several pieces of silicon (e.g., silicon dies) along with slot 242, while providing a protective seal against ink shorts.
  • Figure 3 illustrates a flow chart of an example of a method 360 according to the present disclosure.
  • Method 360 can include depositing a coating onto at least a portion of a printhead to protect printhead components from ink shorts.
  • method 360 can include forming a printhead substrate via compression molding and using an EMC.
  • the printhead substrate can be formed within a mold chest by dispensing EMC material onto die embedded in a PCB.
  • a mechanical process can be performed on the printhead substrate.
  • the mechanical process can include, for example, at least one of a carrier release process, ink feed hole protection, slotting, sub-panel adjustment, wire bonding, and fil encapsulation, among others.
  • method 360 can include depositing a coating on the printhead substrate via ALD.
  • the coating can be pin-hole-free and can be conformal, such that it substantially uniformly covers all surfaces of the printhead substrate.
  • the ALD deposition can take place in an environment having a temperature at or below 200 degrees Celsius, in some instances.
  • method 360 can include embedding a silicon die in the EMC and forming an ink access slot within the EMC such that the coating covers the slot.
  • the slot may be present to allow ink to access the silicon die embedded in the EMC.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

Dans un mode de réalisation donné à titre d'exemple, une tête d'impression peut comprendre une carte de circuit imprimé, une puce couplée à la carte de circuit imprimé et enrobée dans un mélange à mouler à base de résines époxydes, et un revêtement par dépôt de couche atomique recouvrant la carte de circuit imprimé et la puce.
PCT/US2015/013855 2015-01-30 2015-01-30 Revêtement de tête d'impression WO2016122620A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/US2015/013855 WO2016122620A1 (fr) 2015-01-30 2015-01-30 Revêtement de tête d'impression
TW105102208A TWI579401B (zh) 2015-01-30 2016-01-25 列印頭塗層

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2015/013855 WO2016122620A1 (fr) 2015-01-30 2015-01-30 Revêtement de tête d'impression

Publications (1)

Publication Number Publication Date
WO2016122620A1 true WO2016122620A1 (fr) 2016-08-04

Family

ID=56544036

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2015/013855 WO2016122620A1 (fr) 2015-01-30 2015-01-30 Revêtement de tête d'impression

Country Status (2)

Country Link
TW (1) TWI579401B (fr)
WO (1) WO2016122620A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019072905A (ja) * 2017-10-16 2019-05-16 エスアイアイ・プリンテック株式会社 液体噴射ヘッドおよび液体噴射記録装置
WO2020162927A1 (fr) * 2019-02-06 2020-08-13 Hewlett-Packard Development Company, L.P. Revêtement de mouillabilité de voie d'alimentation en fluide
WO2021188098A1 (fr) * 2020-03-17 2021-09-23 Hewlett-Packard Development Company, L.P. Revêtement fluide de tête d'éjection de fluide

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030193545A1 (en) * 2002-04-12 2003-10-16 Boucher William R. Electronic devices having an inorganic film
US20090079793A1 (en) * 2007-09-25 2009-03-26 Silverbrook Research Pty Ltd Integrated circuit support for low profile wire bond
US20110018938A1 (en) * 2008-04-29 2011-01-27 Rio Rivas Printing device
US20130063525A1 (en) * 2011-09-09 2013-03-14 Kurt D. Sieber Printhead for inkjet printing device
WO2014153305A1 (fr) * 2013-03-20 2014-09-25 Hewlett-Packard Development Company, L.P. Rubans de filière moulés ayant des surfaces avant et arrière exposées

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030193545A1 (en) * 2002-04-12 2003-10-16 Boucher William R. Electronic devices having an inorganic film
US20090079793A1 (en) * 2007-09-25 2009-03-26 Silverbrook Research Pty Ltd Integrated circuit support for low profile wire bond
US20110018938A1 (en) * 2008-04-29 2011-01-27 Rio Rivas Printing device
US20130063525A1 (en) * 2011-09-09 2013-03-14 Kurt D. Sieber Printhead for inkjet printing device
WO2014153305A1 (fr) * 2013-03-20 2014-09-25 Hewlett-Packard Development Company, L.P. Rubans de filière moulés ayant des surfaces avant et arrière exposées

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019072905A (ja) * 2017-10-16 2019-05-16 エスアイアイ・プリンテック株式会社 液体噴射ヘッドおよび液体噴射記録装置
WO2020162927A1 (fr) * 2019-02-06 2020-08-13 Hewlett-Packard Development Company, L.P. Revêtement de mouillabilité de voie d'alimentation en fluide
US11390076B2 (en) 2019-02-06 2022-07-19 Hewlett-Packard Development Company, L.P. Fluid feed path wettability coating
EP3713769B1 (fr) * 2019-02-06 2022-10-12 Hewlett-Packard Development Company, L.P. Revêtement de mouillabilité de voie d'alimentation en fluide
WO2021188098A1 (fr) * 2020-03-17 2021-09-23 Hewlett-Packard Development Company, L.P. Revêtement fluide de tête d'éjection de fluide

Also Published As

Publication number Publication date
TWI579401B (zh) 2017-04-21
TW201634731A (zh) 2016-10-01

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