WO2016117721A1 - Transducteur à ultrasons comportant une couche absorbant les sons pour améliorer la dissipation de chaleur - Google Patents

Transducteur à ultrasons comportant une couche absorbant les sons pour améliorer la dissipation de chaleur Download PDF

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Publication number
WO2016117721A1
WO2016117721A1 PCT/KR2015/000599 KR2015000599W WO2016117721A1 WO 2016117721 A1 WO2016117721 A1 WO 2016117721A1 KR 2015000599 W KR2015000599 W KR 2015000599W WO 2016117721 A1 WO2016117721 A1 WO 2016117721A1
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WO
WIPO (PCT)
Prior art keywords
sound absorbing
absorbing layer
active element
ultrasonic transducer
ultrasonic
Prior art date
Application number
PCT/KR2015/000599
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English (en)
Korean (ko)
Inventor
이재원
이상곤
Original Assignee
알피니언메디칼시스템 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 알피니언메디칼시스템 주식회사 filed Critical 알피니언메디칼시스템 주식회사
Priority to PCT/KR2015/000599 priority Critical patent/WO2016117721A1/fr
Publication of WO2016117721A1 publication Critical patent/WO2016117721A1/fr

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers

Definitions

  • the present invention relates to an ultrasonic transducer for acquiring image information inside an object under examination using ultrasonic waves.
  • the ultrasound diagnosis apparatus is an apparatus for imaging an internal tissue of a subject by using an ultrasonic signal reflected by shooting an ultrasonic signal on the subject.
  • the ultrasound diagnosis apparatus may transmit the ultrasound signal to a diagnosis part of the subject, and then acquire the image information of the diagnosis part by receiving an ultrasound signal reflected from the boundary of tissues inside the subject having different acoustic impedances. Can be.
  • the ultrasonic diagnostic apparatus includes an ultrasonic transducer for transmitting an ultrasonic signal to the subject and receiving an ultrasonic signal reflected by the subject.
  • Ultrasonic transducers generally include an active element, a matching layer, and a backer layer.
  • an ultrasonic transducer having a sound absorbing layer for improving heat dissipation is proposed.
  • An ultrasonic transducer includes an active element, a matching layer formed on a front surface of the active element and matching acoustic impedance of ultrasonic waves propagated to the front surface of the active element, and formed on a rear surface of the active element to form a rear surface of the active element. And a sound absorbing layer for blocking or attenuating the ultrasonic waves propagated to the sound absorbing layer, wherein the sound absorbing layer includes a thermal conductor having a bracket structure with respect to an elevation direction.
  • the thermal conductor of the sound absorbing layer according to the embodiment lowers the surface temperature of the ultrasonic transducer by generating heat generated in the active element toward the sound absorbing layer.
  • the bracket structure according to an embodiment is integrally inserted into the sound absorbing layer in the form of a cover with a center toward the active element. At this time, in the bracket structure, thermal conductors are formed at both ends of the upper direction.
  • the bracket structure may be inclined so that its ends become narrower in opposite directions of the ultrasonic traveling paths at both ends in the upward direction.
  • the bracket structure may have a space in which the center in the upward direction is empty.
  • Thermal conductor of the sound absorbing layer is any one of copper, aluminum, PGS graphite sheet of graphite film, graphite, carbon nanotube, aluminum nitride, boron nitride, silicon carbide, beryllium oxide thereof In the form of a bond.
  • the sound absorbing layer includes a first member composed of a thermal conductor which is a high impedance material around both ends of the upper direction, and a second member composed of a low impedance material around the center of the upper direction.
  • the first member has a small acoustic pressure difference with the active element, so that the sound pressure transmitted in the direction of the predetermined ultrasonic wave propagation path is small, and the second member has a large acoustic impedance difference with the active element, and the sound pressure delivered in the direction of the predetermined ultrasonic wave path is high.
  • the matching layer according to an embodiment has a multilayer structure.
  • the ultrasonic transducer may be easily manufactured and improve heat dissipation characteristics of the transducer as the thermal conductor having a high thermal conductivity in the shape of a bracket is inserted into the sound absorbing layer.
  • the acoustic impedance of the thermal conductors formed at both ends of the sound absorbing layer is higher than the sound impedance at the center of the sound absorbing layer, the sound pressure transmitted from the center to the acoustic lens in the upper direction is large, and from the peripheral part, the acoustic impedance is transmitted to the acoustic lens. The sound pressure is lowered. Accordingly, the beam shape is improved by apodization while the acoustic characteristics of the conventional transducer are not changed.
  • FIG. 1 is a structural diagram showing the configuration of an ultrasonic transducer having a sound absorbing layer for improving heat dissipation according to an embodiment of the present invention
  • FIG. 2 is a stereoscopic view of a first member of a sound absorbing layer according to an embodiment of the present invention
  • FIG. 3 is a cross-sectional view of a first member of a sound absorbing layer according to various embodiments of the present disclosure
  • FIG. 4 is a block diagram of an ultrasonic diagnostic apparatus according to an embodiment of the present invention.
  • FIG. 5 is a graph showing an effect of improving heat dissipation through a sound absorbing layer according to an embodiment of the present invention
  • FIG. 6 is a graph showing the degree of improvement of the beam shape of the sound absorbing layer and the conventional sound absorbing layer according to an embodiment of the present invention
  • Figure 7 is a graph showing the difference in the beam pattern accordingly.
  • the first material layer when the first material layer is formed on the second material layer, it is a substrate that explicitly excludes it, as well as the case where the first material layer is formed directly on the second material layer. Unless otherwise, it is to be construed that the other third material layer includes all the intervening layers between the first material layer and the second material layer.
  • FIG. 1 is a structural diagram showing the configuration of an ultrasonic transducer having a sound absorbing layer for improving heat dissipation according to an embodiment of the present invention.
  • the ultrasonic transducer 1 includes a backer layer 10, an active component 12, and a matching layer 14, and includes a flexible printed circuit board.
  • GRS ground sheet
  • an acoustic lens 19 may be further included.
  • the ultrasonic transducer 1 may be a single element transducer or an array transducer having a plurality of elements.
  • the type of array transducer may be a linear array, a convex array, a phased array, or the like, and the present invention is applicable to all types of array arrays.
  • the direction in which the elements of the ultrasonic transducer 1 are arranged is called the azimuth direction, and the depth direction in which the ultrasonic signal travels is called the axial direction, and the direction orthogonal to these two directions is This is called the elevation direction.
  • the active element 12 generates an ultrasonic signal, transmits the ultrasonic signal to the object under test, and receives the ultrasonic signal reflected from the object under test.
  • the sound absorbing layer 10 propagates in the direction of the sound absorbing layer 10, which is an unwanted direction of the ultrasonic signal generated from the active element 12 to minimize the return of the reflected wave.
  • the matching layer 14 matches the difference in acoustic impedance between the active element 12 and the object under test so that ultrasonic waves propagate in the direction of the ultrasonic traveling path.
  • a first member 101 made of a thermal conductor having high thermal conductivity and acoustic impedance is included inside the sound absorbing layer 10 in a bracket structure with respect to the upward direction.
  • the bracket structure means a cover structure as shown in FIG. 1. Since the first member 101 of the bracket structure only needs to be inserted into the sound absorbing layer 10, the manufacturing process is simplified.
  • the thermal conductor of the first member 101 functions to disperse heat in the direction of the sound absorbing layer 10.
  • heat generated by the ultrasonic transducer 1 for example, heat generated by the active element 112 and heat generated by multiple reflections, are absorbed.
  • the heat is dissipated in the direction of the sound absorbing layer 10 having a high heat capacity without heat being transferred to the surface of (1), for example, the acoustic lens 19.
  • the surface temperature of the ultrasonic transducer 1, for example, the temperature of the acoustic lens 19, is lowered.
  • the surface temperature of the ultrasonic transducer 1 should be lowered in the transmission signal in a proportional relationship with the magnitude of the ultrasonic signal transmitted from the main body.
  • the surface temperature of the ultrasonic transducer 1 can be lowered by the thermal conductor structure of the sound absorbing layer 10 which dissipates heat while maintaining the level of the transmission signal.
  • the first member 101 composed of a thermal conductor has a bracket structure having a center cover toward the active element 12.
  • the first member 101 of the bracket structure may have thermal conductors formed at both ends of the first member 101.
  • the heat dissipation characteristics of the ultrasonic transducer 1 can be improved without changing the existing acoustic characteristics.
  • the sound pressure transmitted to the acoustic lens 19 is low at the periphery including both ends, and the sound absorption is performed.
  • the sound pressure transmitted to the acoustic lens 19 is large.
  • the acoustic characteristics maintain and enhance the existing acoustic characteristics, and the beam shape is improved by apodization. An embodiment thereof will be described later with reference to FIGS. 6 and 7.
  • the sound absorbing layer 10 is configured such that the acoustic impedance is well matched with the active element 12.
  • the sound absorption layer 10 may be configured to have sound attenuation characteristics, which are excellent sound absorption characteristics.
  • the sound absorbing layer 10 having excellent sound absorbing properties not only reduces the pulse width of the ultrasonic wave by suppressing free vibration of the active element 12 formed on the front surface, but also occurs in the active element 12 and unnecessarily propagates the ultrasonic wave to the rear surface. Blocking the image effectively prevents image distortion.
  • the thermal conductivity and the thermal conductivity of the first member 101 and the first member 101 made of a thermal conductor having high thermal conductivity and acoustic impedance are high.
  • a second member 102 made of a material with low acoustic impedance is high.
  • the first member 101 made of a thermal conductor has a bracket structure, and is formed around both ends of the sound absorbing layer 10 in the upward direction.
  • the first member 101 may be inserted into the sound absorbing layer 10 in the form of a cover with a center toward the active element 12.
  • the first member 101 according to an exemplary embodiment is inclined such that its end is gradually narrowed in the direction opposite to the ultrasonic traveling path (depth direction).
  • the thermal conductor of the first member 101 disperses heat in the direction of the sound absorbing layer 10.
  • the thermal conductor may be a PGS graphite sheet of graphite, copper, aluminum, or a polymer film, graphite, carbon nanotubes, aluminum nitride, boron nitride, silicon carbide, beryllium oxide, or a combination thereof.
  • the first member 101 formed at both ends of the upper direction by the thermal conductor in the form of a cover which is centered toward the active element 12 has a small acoustic impedance difference from the active element 12, and thus the predetermined ultrasonic propagation.
  • the sound pressure transmitted in the path direction becomes small.
  • the second member 102 formed in the center portion of the upper direction is made of a low impedance material, so that ultrasonic waves do not propagate in the direction of the sound absorbing layer 10.
  • the sound pressure transmitted in the ultrasonic traveling path direction becomes large.
  • the size of the side lobe of the transducer is reduced, so that beam shape due to apodization is improved.
  • the active element 12 generates an ultrasonic signal when energy is applied, such as an electrical signal is applied from the FPCB 16 and the GRS 18 located at both ends.
  • the type of the active element 12 may vary depending on the type of the ultrasonic transducer 1, and is typically composed of a piezoelectric element.
  • the piezoelectric element has a property that a voltage is generated when a mechanical pressure is applied through a piezoelectric effect, and a mechanical deformation occurs when a voltage is applied. There is no particular limitation on the shape or pattern of the piezoelectric elements.
  • the piezoelectric element is made of a piezoelectric ceramic such as lead zirconate titanate (PZT), a single crystal, a composite piezoelectric compound of these materials and a polymer material, or a polymer material represented by polyvinylidene fluoride (PVDF). It may be formed of a piezoelectric body or the like.
  • PZT lead zirconate titanate
  • PVDF polyvinylidene fluoride
  • the matching layer 14 is disposed between the active element 12 and the object under test to mediate the difference in acoustic impedance between the two components. For example, the ultrasonic wave generated by the active element 12 is transmitted to the inspected object or the loss of the reflected signal reflected and returned by the inspected object is reduced.
  • the matching layer 14 may serve as a buffer for reducing problems such as image distortion caused by a sudden change in acoustic impedance between the active element 12 and the object under test.
  • the matching layer 14 may have a structure in which a plurality of layers are stacked.
  • the first matching layer 141 and the second matching layer 142 may be configured, but the number of matching layers is not limited thereto.
  • the reason why the matching layer 14 is composed of a plurality of layers is that the difference in acoustic impedance between the active element 12 and the human tissue under test is relatively large, so that the matching layer having the required characteristics is a single layer of material. Because it is difficult to form.
  • the FPCB 16 is formed between the active element 12 and the sound absorbing layer 10.
  • the FPCB 16 is electrically connected to the active element 12 to apply a voltage to the active element 12.
  • a GRS 18 may be formed between the matching layer 14 and the active element 12, and the matching layer 14 may exchange electrical signals with the active element 12 through the GRS 18.
  • An acoustic lens 19 for focusing ultrasonic waves is formed on the front surface of the matching layer 14.
  • the FPCB 16 is located in front of the sound absorbing layer 10 and the GRS 18 is located in the back of the matching layer 14, but the corresponding position is polling of the layers constituting the active element 12. It may vary depending on the direction.
  • the GRS 18 may be formed at the FPCB 16 location, and the FPCB 16 may be formed at the GRS 18 location.
  • FIG. 2 is a stereoscopic view of a first member of a sound absorbing layer according to an embodiment of the present invention.
  • the first member 101 made of a thermal conductor in the sound absorbing layer 10 has a bracket structure.
  • the first member 101 of the bracket structure may be in the form of a cover whose center is toward the active element.
  • the first member 101 may have thermal conductors formed at both ends of the bracket structure with respect to the upper direction, and the center of the bracket structure may have an empty space.
  • the sound pressure transmitted to the acoustic lens is low at the periphery including both ends, and the sound absorbing layer 10 is provided.
  • the sound pressure transmitted to the acoustic lens is large. The acoustic characteristics maintain and enhance existing acoustic characteristics, and the beam shape is improved by apodization.
  • FIG 3 is a cross-sectional view of a first member of a sound absorbing layer according to various embodiments of the present disclosure.
  • a thermal conductor is formed at both ends of the upper direction in a sound absorbing layer in a bracket structure, and may have a center cover toward the active element.
  • the cross section of the first member may be (a) a triangle, (b) a rectangle, or (c) a circle based on an upward direction. Or (d), (e) or (f) may be geometric, but is not limited thereto.
  • the center portion of the bracket structure may be formed as an empty space based on the upward direction.
  • FIG. 4 is a block diagram of the ultrasonic diagnostic apparatus according to an embodiment of the present invention.
  • the ultrasound diagnosis apparatus 40 includes an ultrasound transducer 1, a beamforming unit 2, an image processor 3, and an output unit 4.
  • the ultrasonic transducer 1 may be composed of a plurality of devices 400-1, 400-2,..., 300-n.
  • a thermal conductor having a bracket structure is inserted to disperse heat in the direction of the sound absorbing layer.
  • the bracket structure can be integrally inserted into the sound absorbing layer in the form of the cover cover the center toward the active element, as described above with reference to Figure 2, the thermal conductor is formed at both ends of the upper direction,
  • the center of the direction may have an empty space.
  • the bracket structure may be inclined so that the ends thereof become narrower in opposite directions of the ultrasonic traveling paths at both ends in the upward direction.
  • the beamforming unit 2 drives the ultrasonic transducer 1 to transmit an ultrasonic signal to the inspected object, and processes a reflected signal returned from the inspected object to generate a beam signal.
  • the image processor 3 receives the beam signal from the beamformer 2 and generates an ultrasound image.
  • the output unit 4 displays the ultrasound image generated by the image processor 3 to the outside.
  • FIG. 5 is a graph showing an effect of improving heat dissipation through a sound absorbing layer according to an embodiment of the present invention.
  • Figure 5 shows the temperature change of the acoustic lens per hour in detail, the heat is dispersed in the direction of the sound absorbing layer by the thermal conductor inserted into the sound absorbing layer in the form of a bracket of the present invention to confirm that the temperature of the acoustic lens is lowered as a result Can be.
  • FIG. 6 is a graph showing the degree of improvement of the beam shape of the sound absorbing layer and the conventional sound absorbing layer according to an embodiment of the present invention
  • Figure 7 is a graph showing the difference in the beam pattern accordingly.
  • the thermal conductor of the bracket structure inserted into the sound absorbing layer can maintain and enhance the acoustic characteristics without changing the acoustic characteristics and improve the heat dissipation characteristics of the ultrasonic transducer.

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Biomedical Technology (AREA)
  • Molecular Biology (AREA)
  • Biophysics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Acoustics & Sound (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Signal Processing (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

L'invention concerne un transducteur à ultrasons comportant une couche absorbant les sons pour améliorer la dissipation de chaleur. Le transducteur à ultrasons, selon un mode de réalisation de la présente invention, comprend : un élément actif; une couche d'adaptation formée sur la surface avant de l'élément actif pour adapter l'impédance acoustique d'une onde ultrasonique propagée à la surface avant de l'élément actif; et une couche absorbant les sons formée sur la surface arrière de l'élément actif pour bloquer ou amortir une onde ultrasonique propagée à la surface arrière de l'élément actif, la couche absorbant les sons comprenant un conducteur thermique présentant une structure de support par rapport à une direction d'élévation.
PCT/KR2015/000599 2015-01-20 2015-01-20 Transducteur à ultrasons comportant une couche absorbant les sons pour améliorer la dissipation de chaleur WO2016117721A1 (fr)

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Application Number Priority Date Filing Date Title
PCT/KR2015/000599 WO2016117721A1 (fr) 2015-01-20 2015-01-20 Transducteur à ultrasons comportant une couche absorbant les sons pour améliorer la dissipation de chaleur

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Application Number Priority Date Filing Date Title
PCT/KR2015/000599 WO2016117721A1 (fr) 2015-01-20 2015-01-20 Transducteur à ultrasons comportant une couche absorbant les sons pour améliorer la dissipation de chaleur

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150270474A1 (en) * 2014-03-20 2015-09-24 Fujifilm Corporation Ultrasound probe
WO2020131306A1 (fr) * 2018-12-19 2020-06-25 Fujifilm Sonosite, Inc. Couche conductrice thermique de réduction de température de face de transducteur
CN112638264A (zh) * 2018-06-12 2021-04-09 深圳市理邦精密仪器股份有限公司 超声波换能器、超声波探头以及超声波检测装置

Citations (5)

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Publication number Priority date Publication date Assignee Title
US20080009742A1 (en) * 2006-07-10 2008-01-10 Nihon Dempa Kogyo Co., Ltd. Ultrasonic probe
US20120004554A1 (en) * 2010-06-30 2012-01-05 Toshiba Medical Systems Corporation Ultrasound probe and ultrasound imaging apparatus
KR101195671B1 (ko) * 2012-04-23 2012-10-30 (주)프로소닉 의료용 초음파 트랜스듀서의 집속을 위한 적층형 구조
US20140375171A1 (en) * 2013-06-21 2014-12-25 General Electric Company Ultrasound transducer and method for manufacturing an ultrasound transducer
US20150011889A1 (en) * 2013-07-08 2015-01-08 Samsung Medison Co., Ltd. Ultrasonic probe and manufacturing method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080009742A1 (en) * 2006-07-10 2008-01-10 Nihon Dempa Kogyo Co., Ltd. Ultrasonic probe
US20120004554A1 (en) * 2010-06-30 2012-01-05 Toshiba Medical Systems Corporation Ultrasound probe and ultrasound imaging apparatus
KR101195671B1 (ko) * 2012-04-23 2012-10-30 (주)프로소닉 의료용 초음파 트랜스듀서의 집속을 위한 적층형 구조
US20140375171A1 (en) * 2013-06-21 2014-12-25 General Electric Company Ultrasound transducer and method for manufacturing an ultrasound transducer
US20150011889A1 (en) * 2013-07-08 2015-01-08 Samsung Medison Co., Ltd. Ultrasonic probe and manufacturing method thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150270474A1 (en) * 2014-03-20 2015-09-24 Fujifilm Corporation Ultrasound probe
US9799818B2 (en) * 2014-03-20 2017-10-24 Fujifilm Corporation Ultrasound probe with heat collecting portion
CN112638264A (zh) * 2018-06-12 2021-04-09 深圳市理邦精密仪器股份有限公司 超声波换能器、超声波探头以及超声波检测装置
CN112638264B (zh) * 2018-06-12 2024-05-17 深圳市理邦精密仪器股份有限公司 超声波换能器、超声波探头以及超声波检测装置
WO2020131306A1 (fr) * 2018-12-19 2020-06-25 Fujifilm Sonosite, Inc. Couche conductrice thermique de réduction de température de face de transducteur
US11583259B2 (en) 2018-12-19 2023-02-21 Fujifilm Sonosite, Inc. Thermal conductive layer for transducer face temperature reduction

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