WO2016111291A1 - Method for producing bonded structure, and bonded structure - Google Patents

Method for producing bonded structure, and bonded structure Download PDF

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Publication number
WO2016111291A1
WO2016111291A1 PCT/JP2016/050131 JP2016050131W WO2016111291A1 WO 2016111291 A1 WO2016111291 A1 WO 2016111291A1 JP 2016050131 W JP2016050131 W JP 2016050131W WO 2016111291 A1 WO2016111291 A1 WO 2016111291A1
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Prior art keywords
intermediate member
metal
glass
laser
metal member
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PCT/JP2016/050131
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French (fr)
Japanese (ja)
Inventor
和義 西川
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オムロン株式会社
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Publication of WO2016111291A1 publication Critical patent/WO2016111291A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/21Bonding by welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/32Bonding taking account of the properties of the material involved
    • B23K26/324Bonding taking account of the properties of the material involved involving non-metallic parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/57Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04Joining glass to metal by means of an interlayer

Definitions

  • the present invention relates to a method for manufacturing a bonded structure and a bonded structure.
  • Patent Documents 1 and 2 Conventionally, various joining methods for joining two members are known (see, for example, Patent Documents 1 and 2).
  • Patent Document 1 discloses a joining method for joining metallic glass and crystalline metal.
  • the metallic glass and the crystalline metal are joined by forming a molten layer in which the metallic glass is melted by irradiating a laser beam to the interface where the metallic glass and the crystalline metal are brought into contact with each other. .
  • Patent Document 2 discloses a joining method for joining two members, at least one of which is a transparent member.
  • this bonding method an ultrashort light pulse laser beam is irradiated from the transparent member side in a state where two members are laminated.
  • the filament region is generated by the self-focusing effect of the ultrashort optical pulse laser beam, and the two members are joined by positioning the joining surface in the filament region.
  • it is possible to join other types of members such as glass and a transparent member.
  • the present invention has been made to solve the above-described problems, and the object of the present invention is to suppress deterioration in bonding quality even when the surface accuracy of the glass member and the metal member is low. It is to provide a manufacturing method of a bonded structure and a bonded structure.
  • the manufacturing method of the joining structure by this invention is a manufacturing method of the joining structure by which the glass member and the metal member were joined via the metal intermediate member, and the process of forming a 1st recessed part in the surface of a glass member And a step of forming the intermediate member on the surface of the glass member so that the first concave portion is filled with the intermediate member, and a step of joining the metal member to the intermediate member.
  • the step of joining the metal member to the intermediate member includes the step of arranging the metal member adjacent to the intermediate member, and irradiating the intermediate member with laser from the glass member side, thereby And a step of welding the members.
  • the step of forming the second concave portion on the surface of the metal member before joining the metal member to the intermediate member, and the step of joining the metal member to the intermediate member includes the second concave shape.
  • the intermediate member and the metal member are disposed adjacent to each other so that the portion is disposed on the intermediate member side, and the intermediate member is filled into the second concave portion by irradiating the intermediate member with laser from the glass member side. And a solidifying step.
  • the intermediate member may have a linear expansion coefficient between the glass member and the metal member.
  • the bonded structure according to the present invention is manufactured by any one of the above-described bonded structure manufacturing methods.
  • the method for manufacturing a bonded structure and the bonded structure of the present invention it is possible to suppress deterioration in bonding quality even when the surface accuracy of the glass member and the metal member is low.
  • the bonded structure 100 includes a glass member 1, a metal member 2, and an intermediate member 3 disposed between the glass member 1 and the metal member 2.
  • the glass member 1 and the metal member 2 are joined via a metal intermediate member 3.
  • the hatching of the glass member 1 is omitted for easy viewing.
  • a plurality of perforated portions 11 are formed on the surface 1a of the glass member 1, and the perforated portions 11 are filled with the intermediate member 3 and solidified. For this reason, the glass member 1 and the intermediate member 3 are mechanically joined by the anchor effect.
  • the metal member 2 and the metal intermediate member 3 are joined by welding.
  • the whole surface 2a of the metal member 2 may be welded, or the surface 2a may be partially welded.
  • the glass member 1 is a glass capable of transmitting a laser L2 for bonding described later (see FIG. 4), and examples thereof include silicate glass and metal glass such as soda lime glass, quartz glass, and crystal glass. .
  • the perforated portion 11 is a substantially circular non-through hole when seen in a plan view, and a plurality of perforated portions 11 are arranged on the surface 1a of the glass member 1 at a predetermined interval.
  • the perforated part 11 is formed by, for example, a processing laser L1 (see FIG. 2).
  • the processing laser L1 is an extremely short pulse laser such as an IR picosecond laser and a UV picosecond laser. With an ultrashort pulse laser, it is possible to perform processing by inducing nonlinear absorption for a material having a high band gap such as glass.
  • the perforated part 11 is an example of the “first concave part” in the present invention.
  • the perforated portion 11 is formed so that a diameter-expanded portion that expands from the surface 1a side toward the bottom portion side and a diameter-reduced portion that decreases from the diameter-expanded portion toward the bottom side are connected. That is, a protruding portion 11 a that protrudes inward is formed on the inner peripheral surface of the perforated portion 11.
  • the protruding portion 11 a is disposed on the surface 1 a side in the perforated portion 11.
  • the protrusion part 11a is formed over the full length in the circumferential direction, and is formed in cyclic
  • Examples of the metal member 2 include iron metal, stainless steel metal, copper metal, aluminum metal, magnesium metal, and alloys thereof. Moreover, a metal molding may be sufficient and zinc die-casting, aluminum die-casting, powder metallurgy, etc. may be sufficient.
  • the intermediate member 3 is interposed between the glass member 1 and the metal member 2 and is provided for joining the glass member 1 and the metal member 2.
  • Examples of the intermediate member 3 include zinc-based metal, tin-based metal, lead-based metal, bismuth-based metal, indium-based metal, gallium-based metal, and alloys thereof.
  • other than a lead-type metal is preferable.
  • the intermediate member 3 has a melting point lower than that of the glass member 1 and the metal member 2 and has a linear expansion coefficient between the glass member 1 and the metal member 2.
  • the surface 1 a of the glass member 1 is irradiated with a processing laser L ⁇ b> 1, thereby forming a perforated portion 11 on the surface 1 a of the glass member 1.
  • the processing laser L1 is an ultrashort pulse laser, and the perforated portion 11 is formed by ablation. For this reason, it is possible to perform processing that is precise and less affected by heat.
  • the intermediate member 3 is formed on the surface 1 a of the glass member 1 so that the perforated part 11 of the glass member 1 is filled with the intermediate member 3. Specifically, the intermediate member 3 is melted, the melted intermediate member 3 is filled in the perforated portion 11, and after being disposed on the surface 1a, the melted intermediate member 3 is solidified.
  • a soldering process, an ultrasonic process, a plating process, and a vapor deposition process are mentioned. In the ultrasonic process, a heater for melting the intermediate member 3 oscillates with ultrasonic waves.
  • the metal member 2 is joined to the intermediate member 3. Specifically, first, the intermediate member 3 and the metal member 2 are arranged adjacent to each other so that the intermediate member 3 provided on the glass member 1 contacts the surface 2a of the metal member 2 under an inert gas atmosphere. . Then, the intermediate member 3 is melted and solidified by being irradiated with the laser L2 for bonding from the glass member 1 side toward the intermediate member 3, whereby the intermediate member 3 and the metal member 2 are welded.
  • the type of the laser L2 for bonding a fiber laser, a YAG laser, a YVO 4 laser, a semiconductor laser, a carbon dioxide gas laser, and an excimer laser can be selected.
  • the joined structure 100 shown in FIG. 1 is manufactured.
  • the glass member 1 and the intermediate member 3 are joined by the anchor effect, and the metal member 2 and the intermediate member 3 are joined by welding.
  • the intermediate member 3 is provided between the glass member 1 and the metal member 2, the glass member 1 and the intermediate member 3 are joined by the anchor effect, and the metal member 2 and the intermediate member 3 are attached. It is joined by welding.
  • the perforated part 11 is formed in the glass member 1, and the perforated part 11 is filled with the intermediate member 3,
  • the metal intermediate member 3 and the glass member 1 are made mechanical by an anchor effect. Can be joined.
  • the anchor effect can be improved by forming the protruding portion 11 a in the perforated portion 11.
  • the perforated portion 11 by forming the perforated portion 11 with an ultrashort pulse laser, it is possible to perform a precise and less heat-affected process on the glass member 1 which is a material having a high band gap.
  • the stress caused by the difference in linear expansion coefficient between the glass member 1 and the metal member 2 is applied to the intermediate member 3. Can be relaxed.
  • the first embodiment when an ultrasonic process is used when forming the intermediate member 3 on the surface 1a of the glass member 1, a heater for melting the intermediate member 3 oscillates. 11 is easily filled with the intermediate member 3, so that the bonding strength between the glass member 1 and the intermediate member 3 can be improved. Further, when the ultrasonic process is used, the glass member 1 and the intermediate member 3 are covalently bonded due to the cavitation effect, so that the bonding strength between the glass member 1 and the intermediate member 3 can be improved.
  • the bonding structure 200 includes a glass member 1, a metal member 20, and an intermediate member 3 arranged between the glass member 1 and the metal member 20.
  • a plurality of perforated portions 21 are formed on the surface 20a of the metal member 20, and the perforated portions 21 are filled with the intermediate member 3 and solidified. For this reason, the metal member 20 and the intermediate member 3 are mechanically joined by the anchor effect.
  • Examples of the metal member 20 include iron metal, stainless steel metal, copper metal, aluminum metal, magnesium metal, and alloys thereof. Moreover, a metal molding may be sufficient and zinc die-casting, aluminum die-casting, powder metallurgy, etc. may be sufficient.
  • the perforated part 21 is a substantially circular non-through hole when seen in a plan view, and a plurality of the perforated parts 21 are arranged on the surface 20 a of the metal member 20 at a predetermined interval.
  • the perforated portion 21 is formed by, for example, a processing laser L3 (see FIG. 6).
  • a processing laser L3 As the type of the laser L3, a laser capable of pulse oscillation is preferable, and a fiber laser, a YAG laser, a YVO 4 laser, a semiconductor laser, a carbon dioxide gas laser, and an excimer laser can be selected.
  • a YAG laser, a second harmonic of a YAG laser, a YVO 4 laser, and a semiconductor laser are preferable.
  • the perforated part 21 is an example of the “second concave part” in the present invention.
  • the perforated portion 21 is formed so that a diameter-expanded portion that increases in diameter from the surface 20a side toward the bottom portion side and a diameter-reduced portion that decreases in diameter from the expanded diameter portion toward the bottom portion side are connected. That is, a protruding portion 21 a that protrudes inward is formed on the inner peripheral surface of the perforated portion 21.
  • the protruding portion 21 a is disposed on the surface 20 a side in the perforated portion 21.
  • the protrusion part 21a is formed over the full length in the circumferential direction, and is formed in cyclic
  • Such a perforated part 21 is formed by a laser L3 in which one pulse is composed of a plurality of sub-pulses.
  • This laser L3 is suitable for forming the perforated portion 21 because energy can be easily concentrated in the depth direction.
  • fiber laser marker MX-Z2000 or MX-Z2050 manufactured by OMRON can be mentioned.
  • one period of the sub-pulse is 15 ns or less. This is because when one period of the sub-pulse exceeds 15 ns, energy is easily diffused by heat conduction, and it becomes difficult to form the perforated part 21.
  • one cycle of the subpulse is a total time of the irradiation time for one subpulse and the interval from the end of the irradiation of the subpulse to the start of the irradiation of the next subpulse.
  • the number of subpulses in one pulse is preferably 2 or more and 50 or less. This is because when the number of subpulses exceeds 50, the output per unit of subpulses becomes small and it becomes difficult to form the perforated part 21.
  • the other structure of the bonded structure 200 is the same as that of the bonded structure 100 described above.
  • the surface 20 a of the metal member 20 is irradiated with a processing laser L ⁇ b> 3, thereby forming a perforated portion 21 on the surface 20 a of the metal member 20.
  • a processing laser L ⁇ b> 3 In the processing laser L3, one pulse is composed of a plurality of subpulses.
  • the metal member 20 is joined to the intermediate member 3. Specifically, first, the intermediate member 3 and the metal member 20 are arranged adjacent to each other so that the intermediate member 3 provided on the glass member 1 contacts the surface 20a of the metal member 20 under an inert gas atmosphere. . That is, the perforated portion 21 of the metal member 20 is disposed on the intermediate member 3 side. Then, the intermediate member 3 is melted by irradiating the laser L2 for bonding from the glass member 1 side toward the intermediate member 3. For this reason, the melted intermediate member 3 is filled in the perforated portion 21 of the metal member 20 and solidified.
  • the type of the laser L2 for bonding a fiber laser, a YAG laser, a YVO 4 laser, a semiconductor laser, a carbon dioxide gas laser, and an excimer laser can be selected.
  • the joint structure 200 shown in FIG. 5 is manufactured.
  • the glass member 1 and the intermediate member 3 are bonded by the anchor effect, and the metal member 20 and the intermediate member 3 are bonded by the anchor effect.
  • the perforated portion 21 is formed in the metal member 20, and the intermediate member 3 is filled in the perforated portion 21, thereby mechanically connecting the intermediate member 3 and the metal member 20 with an anchor effect.
  • the anchor effect can be improved by forming the protruding portion 21 a in the perforated portion 21.
  • the metal member 20 and the intermediate member 3 may be welded. In this case, the bonding strength between the metal member 20 and the intermediate member 3 can be improved.
  • quartz glass was used as the glass member 301
  • SUS304 was used as the metal member 302a.
  • the glass member 301 and the metal member 302a are formed in a plate shape, have a length of 100 mm, a width of 25 mm, and a thickness of 3 mm.
  • the metal member 302a does not have a perforated portion formed in the joining region.
  • region R1 is a square whose one side is 20 mm, and is arrange
  • the perforated part was formed using a UV picosecond laser having a wavelength of 355 nm.
  • the conditions of this UV picosecond laser are a focal diameter of 20 ⁇ m and an output of less than 1 W.
  • the depth of the perforated part is 5 to 20 ⁇ m.
  • the intermediate member 303 was formed in joining area
  • the intermediate member 303 is zinc-based lead-free solder, and is formed by an ultrasonic process. Specifically, the intermediate member 303 is melted by a heater that oscillates with an ultrasonic wave of about 60 kHz. Then, the melted intermediate member 303 is filled in the perforated portion, and then the melted intermediate member 303 is solidified.
  • the glass member 301 and the metal member 302a were laminated so that the glass member 301 and the metal member 302a sandwiched the intermediate member 303.
  • the intermediate member 303 and the metal member 302a were welded by irradiating a fiber laser toward the intermediate member 303 from the glass member 301 side.
  • the fiber laser irradiation conditions are as follows.
  • the metal member 302b was used as the metal member 302b.
  • the metal member 302b is formed in a plate shape, has a length of 100 mm, a width of 25 mm, and a thickness of 3 mm.
  • the glass member 301 and the intermediate member 303 are the same as those in the first embodiment.
  • the perforated part (illustration omitted) was formed in the joining area
  • region R2 is a square whose one side is 20 mm, and is arrange
  • the perforated part was formed by irradiating a laser in which one pulse is composed of a plurality of subpulses.
  • the glass member 301 and the metal member 302b were laminated so that the glass member 301 and the metal member 302b sandwiched the intermediate member 303.
  • the intermediate member 303 and the metal member 302b were welded by irradiating the fiber laser toward the intermediate member 303 from the glass member 301 side.
  • the perforated part is formed in the joining region R2 of the metal member 302b, the melted intermediate member 303 is filled in the perforated part, and then the intermediate member 303 is solidified.
  • the fiber laser irradiation conditions are the same as those in the first embodiment.
  • the joined structure 300b of Example 2 was produced.
  • the glass member 301 and the intermediate member 303 are joined by the anchor effect
  • the metal member 302b and the intermediate member 303 are joined by the anchor effect and welding.
  • a thermal shock test was performed on the joint structures 300a and 300b.
  • low temperature exposure at ⁇ 40 ° C. for 30 minutes and high temperature exposure at 50 ° C. for 30 minutes were repeated 10 times.
  • the joint portion 300a peeled off, but the joint structure 300b did not peel off the joint portion. That is, in the joined structure 300b in which the metal member 302b and the intermediate member 303 are joined also by the anchor effect, it was possible to improve the durability in a thermal cycle environment.
  • the intermediate member 3 is disposed on the entire surface of the glass member 1 and the metal member 2 .
  • the present invention is not limited to this, and the glass member and the metal member are partially disposed as in the experimental example.
  • An intermediate member may be arranged. The same applies to the second embodiment.
  • the perforated part 21 was formed in the surface 20a of the metal member 20, not only this but the groove-shaped 2nd recessed part was formed in the surface of a metal member. Also good. Moreover, although the example which the protrusion part 21a is formed in the perforated part 21 was shown, not only this but the perforated part may be formed in the cylindrical shape or the mortar shape. Moreover, although the example which forms the perforated part 21 with the laser L3 was shown, not only this but performing a blast process, a sandpaper process, an anodizing process, an electrical discharge process, an etching process, or a press process, A second concave portion may be formed on the surface.
  • the present invention is applicable to a method for manufacturing a bonded structure in which a glass member and a metal member are bonded, and the bonded structure.

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Abstract

This method for producing a bonded structure (100) is a method for producing a bonded structure wherein a glass member (1) and a metal member (2) are bonded with each other with an intermediate member (3), which is made of a metal, being interposed therebetween. This method for producing a bonded structure (100) comprises: a step for forming a first recessed part (11) in the surface of the glass member; a step for forming the intermediate member on the surface of the glass member in such a manner that the first recessed part is filled with the intermediate member; and a step for bonding the metal member to the intermediate member.

Description

接合構造体の製造方法および接合構造体Manufacturing method of bonded structure and bonded structure
 本発明は、接合構造体の製造方法および接合構造体に関する。 The present invention relates to a method for manufacturing a bonded structure and a bonded structure.
 従来、2つの部材を接合する接合方法が種々知られている(たとえば、特許文献1および2参照)。 Conventionally, various joining methods for joining two members are known (see, for example, Patent Documents 1 and 2).
 特許文献1には、金属ガラスと結晶金属とを接合する接合方法が開示されている。この接合方法では、金属ガラスと結晶金属とを接触させた界面にレーザビームを照射することにより、金属ガラスを溶融させた溶融層を形成することによって、金属ガラスと結晶金属とを接合している。 Patent Document 1 discloses a joining method for joining metallic glass and crystalline metal. In this joining method, the metallic glass and the crystalline metal are joined by forming a molten layer in which the metallic glass is melted by irradiating a laser beam to the interface where the metallic glass and the crystalline metal are brought into contact with each other. .
 また、特許文献2には、少なくとも一方が透明の部材である2つの部材を接合する接合方法が開示されている。この接合方法では、2つの部材を積層した状態で、透明な部材の側から超短光パルスレーザビームが照射される。そして、超短光パルスレーザビームの自己収束効果によってフィラメント領域が発生し、そのフィラメント領域に接合面を位置させることにより、2つの部材が接合されている。これにより、透明な部材であるガラスと金属などの他種類の部材とを接合することが可能である。 Further, Patent Document 2 discloses a joining method for joining two members, at least one of which is a transparent member. In this bonding method, an ultrashort light pulse laser beam is irradiated from the transparent member side in a state where two members are laminated. The filament region is generated by the self-focusing effect of the ultrashort optical pulse laser beam, and the two members are joined by positioning the joining surface in the filament region. Thereby, it is possible to join other types of members such as glass and a transparent member.
特開2010-227940号公報JP 2010-227940 A 特開2011-56519号公報JP 2011-56519 A
 しかしながら、特許文献2に記載された接合方法では、2つの部材を接合する際にその2つの部材を接触させる必要があり、高い面精度(平坦度)が要求されるという問題点がある。すなわち、2つの部材の接合面の面精度が低い場合には、接合面に隙間が発生することから、接合面におけるその隙間の部分については接合することが困難であり、接合面の接合品質が悪化する。なお、特許文献1に記載された接合方法では、金属ガラスと結晶金属とを接合することが可能であるが、ケイ酸塩ガラスからなるガラス部材と金属部材とを接合することができない。 However, in the joining method described in Patent Document 2, it is necessary to bring the two members into contact when joining the two members, and there is a problem that high surface accuracy (flatness) is required. That is, when the surface accuracy of the joint surfaces of the two members is low, gaps are generated in the joint surfaces, so it is difficult to join the gap portions of the joint surfaces, and the joint quality of the joint surfaces is low. Getting worse. In the joining method described in Patent Document 1, it is possible to join a metal glass and a crystalline metal, but it is not possible to join a glass member made of silicate glass and a metal member.
 本発明は、上記の課題を解決するためになされたものであり、本発明の目的は、ガラス部材および金属部材の面精度が低い場合であっても、接合品質の悪化を抑制することが可能な接合構造体の製造方法および接合構造体を提供することである。 The present invention has been made to solve the above-described problems, and the object of the present invention is to suppress deterioration in bonding quality even when the surface accuracy of the glass member and the metal member is low. It is to provide a manufacturing method of a bonded structure and a bonded structure.
 本発明による接合構造体の製造方法は、ガラス部材および金属部材が金属製の中間部材を介して接合された接合構造体の製造方法であり、ガラス部材の表面に第1凹状部を形成する工程と、第1凹状部に中間部材が充填されるように、ガラス部材の表面に中間部材を形成する工程と、中間部材に金属部材を接合する工程とを備える。 The manufacturing method of the joining structure by this invention is a manufacturing method of the joining structure by which the glass member and the metal member were joined via the metal intermediate member, and the process of forming a 1st recessed part in the surface of a glass member And a step of forming the intermediate member on the surface of the glass member so that the first concave portion is filled with the intermediate member, and a step of joining the metal member to the intermediate member.
 上記接合構造体の製造方法において、中間部材に金属部材を接合する工程は、中間部材に金属部材を隣接配置する工程と、ガラス部材側から中間部材にレーザを照射することにより、中間部材と金属部材とを溶接する工程とを含んでいてもよい。 In the manufacturing method of the joined structure, the step of joining the metal member to the intermediate member includes the step of arranging the metal member adjacent to the intermediate member, and irradiating the intermediate member with laser from the glass member side, thereby And a step of welding the members.
 上記接合構造体の製造方法において、中間部材に金属部材を接合する前に、金属部材の表面に第2凹状部を形成する工程を備え、中間部材に金属部材を接合する工程は、第2凹状部が中間部材側に配置されるように、中間部材と金属部材とを隣接配置する工程と、ガラス部材側から中間部材にレーザを照射することにより、中間部材を第2凹状部に充填して固化させる工程とを含んでいてもよい。 In the manufacturing method of the joined structure, the step of forming the second concave portion on the surface of the metal member before joining the metal member to the intermediate member, and the step of joining the metal member to the intermediate member includes the second concave shape. The intermediate member and the metal member are disposed adjacent to each other so that the portion is disposed on the intermediate member side, and the intermediate member is filled into the second concave portion by irradiating the intermediate member with laser from the glass member side. And a solidifying step.
 上記接合構造体の製造方法において、中間部材は、線膨張係数がガラス部材および金属部材の間であってもよい。 In the method for manufacturing a joined structure, the intermediate member may have a linear expansion coefficient between the glass member and the metal member.
 本発明による接合構造体は、上記したいずれか1つの接合構造体の製造方法によって製造されている。 The bonded structure according to the present invention is manufactured by any one of the above-described bonded structure manufacturing methods.
 本発明の接合構造体の製造方法および接合構造体によれば、ガラス部材および金属部材の面精度が低い場合であっても、接合品質の悪化を抑制することができる。 According to the method for manufacturing a bonded structure and the bonded structure of the present invention, it is possible to suppress deterioration in bonding quality even when the surface accuracy of the glass member and the metal member is low.
本発明の第1実施形態による接合構造体を模式的に示した断面図である。It is sectional drawing which showed typically the joining structure body by 1st Embodiment of this invention. 接合構造体の製造方法を説明するための図であって、ガラス部材に穿孔部が形成される工程を示した図である。It is a figure for demonstrating the manufacturing method of a joining structure, Comprising: It is the figure which showed the process in which a perforation part is formed in a glass member. 接合構造体の製造方法を説明するための図であって、ガラス部材の表面に中間部材が形成される工程を示した図である。It is a figure for demonstrating the manufacturing method of a joining structure, Comprising: It is the figure which showed the process in which an intermediate member is formed in the surface of a glass member. 接合構造体の製造方法を説明するための図であって、金属部材と中間部材とが接合される工程を示した図である。It is a figure for demonstrating the manufacturing method of a joining structure, Comprising: It is the figure which showed the process in which a metal member and an intermediate member are joined. 本発明の第2実施形態による接合構造体を模式的に示した断面図である。It is sectional drawing which showed typically the joining structure body by 2nd Embodiment of this invention. 接合構造体の製造方法を説明するための図であって、金属部材に穿孔部が形成される工程を示した図である。It is a figure for demonstrating the manufacturing method of a joining structure, Comprising: It is the figure which showed the process in which a perforation part is formed in a metal member. 接合構造体の製造方法を説明するための図であって、金属部材と中間部材とが接合される工程を示した図である。It is a figure for demonstrating the manufacturing method of a joining structure, Comprising: It is the figure which showed the process in which a metal member and an intermediate member are joined. 実施例1および2のガラス部材を示した斜視図である。It is the perspective view which showed the glass member of Example 1 and 2. FIG. 実施例1および2のガラス部材に中間部材が形成された状態を示した斜視図である。It is the perspective view which showed the state in which the intermediate member was formed in the glass member of Example 1 and 2. 実施例1の接合構造体を示した斜視図である。1 is a perspective view showing a joint structure of Example 1. FIG. 実施例2の金属部材を示した斜視図である。5 is a perspective view showing a metal member of Example 2. FIG. 実施例2の接合構造体を示した斜視図である。It is the perspective view which showed the joining structure of Example 2. FIG.
 以下、本発明の実施形態について図面を参照して説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
 (第1実施形態)
 まず、図1を参照して、本発明の第1実施形態による接合構造体100について説明する。
(First embodiment)
First, with reference to FIG. 1, the joining structure 100 by 1st Embodiment of this invention is demonstrated.
 接合構造体100は、図1に示すように、ガラス部材1と、金属部材2と、ガラス部材1および金属部材2の間に配置される中間部材3とを備えている。ガラス部材1および金属部材2は、金属製の中間部材3を介して接合されている。なお、図1では、見やすさを考慮してガラス部材1のハッチングを省略した。 1, the bonded structure 100 includes a glass member 1, a metal member 2, and an intermediate member 3 disposed between the glass member 1 and the metal member 2. The glass member 1 and the metal member 2 are joined via a metal intermediate member 3. In FIG. 1, the hatching of the glass member 1 is omitted for easy viewing.
 具体的には、ガラス部材1の表面1aには、複数の穿孔部11が形成され、その穿孔部11には、中間部材3が充填されて固化されている。このため、ガラス部材1および中間部材3は、アンカー効果によって機械的に接合されている。また、金属部材2と金属製の中間部材3とは溶接によって接合されている。なお、金属部材2の表面2aの全体が溶接されていてもよいし、表面2aが部分的に溶接されていてもよい。 Specifically, a plurality of perforated portions 11 are formed on the surface 1a of the glass member 1, and the perforated portions 11 are filled with the intermediate member 3 and solidified. For this reason, the glass member 1 and the intermediate member 3 are mechanically joined by the anchor effect. The metal member 2 and the metal intermediate member 3 are joined by welding. In addition, the whole surface 2a of the metal member 2 may be welded, or the surface 2a may be partially welded.
 ガラス部材1は、後述する接合用のレーザL2(図4参照)を透過可能なガラスであり、一例としては、ソーダ石灰ガラス、石英ガラスおよびクリスタルガラスなどのケイ酸塩ガラスや金属ガラスが挙げられる。 The glass member 1 is a glass capable of transmitting a laser L2 for bonding described later (see FIG. 4), and examples thereof include silicate glass and metal glass such as soda lime glass, quartz glass, and crystal glass. .
 穿孔部11は、平面的に見てほぼ円形の非貫通孔であり、ガラス部材1の表面1aに所定の間隔を隔てて複数配置されている。この穿孔部11は、たとえば加工用のレーザL1(図2参照)によって形成されている。なお、加工用のレーザL1は、たとえば、IRピコ秒レーザおよびUVピコ秒レーザなどの極短パルスレーザである。極短パルスレーザであれば、ガラスなどのバンドギャップが高い材料に対して非線形吸収を誘導することで加工を行うことが可能である。なお、穿孔部11は、本発明の「第1凹状部」の一例である。 The perforated portion 11 is a substantially circular non-through hole when seen in a plan view, and a plurality of perforated portions 11 are arranged on the surface 1a of the glass member 1 at a predetermined interval. The perforated part 11 is formed by, for example, a processing laser L1 (see FIG. 2). The processing laser L1 is an extremely short pulse laser such as an IR picosecond laser and a UV picosecond laser. With an ultrashort pulse laser, it is possible to perform processing by inducing nonlinear absorption for a material having a high band gap such as glass. The perforated part 11 is an example of the “first concave part” in the present invention.
 また、穿孔部11は、表面1a側から底部側に向けて拡径する拡径部と、その拡径部から底部側に向けて縮径する縮径部とが連なるように形成されている。すなわち、穿孔部11の内周面には、内側に突出する突出部11aが形成されている。突出部11aは、穿孔部11内における表面1a側に配置されている。また、突出部11aは、周方向における全長にわたって形成されており、環状に形成されている。 Further, the perforated portion 11 is formed so that a diameter-expanded portion that expands from the surface 1a side toward the bottom portion side and a diameter-reduced portion that decreases from the diameter-expanded portion toward the bottom side are connected. That is, a protruding portion 11 a that protrudes inward is formed on the inner peripheral surface of the perforated portion 11. The protruding portion 11 a is disposed on the surface 1 a side in the perforated portion 11. Moreover, the protrusion part 11a is formed over the full length in the circumferential direction, and is formed in cyclic | annular form.
 金属部材2の一例としては、鉄系金属、ステンレス系金属、銅系金属、アルミ系金属、マグネシウム系金属、および、それらの合金が挙げられる。また、金属成型体であってもよく、亜鉛ダイカスト、アルミダイカスト、粉末冶金などであってもよい。 Examples of the metal member 2 include iron metal, stainless steel metal, copper metal, aluminum metal, magnesium metal, and alloys thereof. Moreover, a metal molding may be sufficient and zinc die-casting, aluminum die-casting, powder metallurgy, etc. may be sufficient.
 中間部材3は、ガラス部材1および金属部材2の間に介在され、ガラス部材1および金属部材2を接合するために設けられている。中間部材3の一例としては、亜鉛系金属、錫系金属、鉛系金属、ビスマス系金属、インジウム系金属、ガリウム系金属、および、それらの合金が挙げられる。なお、人体等への影響を考慮すると、鉛系金属以外が好ましい。 The intermediate member 3 is interposed between the glass member 1 and the metal member 2 and is provided for joining the glass member 1 and the metal member 2. Examples of the intermediate member 3 include zinc-based metal, tin-based metal, lead-based metal, bismuth-based metal, indium-based metal, gallium-based metal, and alloys thereof. In addition, when the influence on a human body etc. is considered, other than a lead-type metal is preferable.
 また、中間部材3は、融点がガラス部材1および金属部材2よりも低く、線膨張係数がガラス部材1と金属部材2との間である。 The intermediate member 3 has a melting point lower than that of the glass member 1 and the metal member 2 and has a linear expansion coefficient between the glass member 1 and the metal member 2.
 -接合構造体の製造方法-
 次に、図1~図4を参照して、第1実施形態による接合構造体100の製造方法について説明する。
-Manufacturing method of bonded structure-
Next, with reference to FIGS. 1 to 4, a method for manufacturing the joint structure 100 according to the first embodiment will be described.
 まず、図2に示すように、ガラス部材1の表面1aに加工用のレーザL1が照射されることにより、ガラス部材1の表面1aに穿孔部11が形成される。加工用のレーザL1は、極短パルスレーザであり、穿孔部11がアブレーションによって形成される。このため、精密で熱影響の少ない加工を行うことが可能である。 First, as shown in FIG. 2, the surface 1 a of the glass member 1 is irradiated with a processing laser L <b> 1, thereby forming a perforated portion 11 on the surface 1 a of the glass member 1. The processing laser L1 is an ultrashort pulse laser, and the perforated portion 11 is formed by ablation. For this reason, it is possible to perform processing that is precise and less affected by heat.
 次に、図3に示すように、ガラス部材1の穿孔部11に中間部材3が充填されるように、ガラス部材1の表面1aに中間部材3が形成される。具体的には、中間部材3が溶融され、その溶融された中間部材3が穿孔部11に充填されるとともに、表面1aに配置された後に、溶融された中間部材3が固化される。なお、ガラス部材1に対する中間部材3の形成方法の一例としては、はんだ付けプロセス、超音波プロセス、めっきプロセスおよび蒸着プロセスが挙げられる。また、超音波プロセスでは、中間部材3を溶融するためのヒータが超音波で発振するようになっている。 Next, as shown in FIG. 3, the intermediate member 3 is formed on the surface 1 a of the glass member 1 so that the perforated part 11 of the glass member 1 is filled with the intermediate member 3. Specifically, the intermediate member 3 is melted, the melted intermediate member 3 is filled in the perforated portion 11, and after being disposed on the surface 1a, the melted intermediate member 3 is solidified. In addition, as an example of the formation method of the intermediate member 3 with respect to the glass member 1, a soldering process, an ultrasonic process, a plating process, and a vapor deposition process are mentioned. In the ultrasonic process, a heater for melting the intermediate member 3 oscillates with ultrasonic waves.
 その後、図4に示すように、中間部材3に金属部材2が接合される。具体的には、まず、不活性ガス雰囲気下で、ガラス部材1に設けられた中間部材3が金属部材2の表面2aに接触するように、中間部材3と金属部材2とが隣接配置される。そして、ガラス部材1側から中間部材3に向けて接合用のレーザL2が照射されることにより、中間部材3が溶融されて固化されることによって、その中間部材3と金属部材2とが溶接される。なお、接合用のレーザL2の種類としては、ファイバレーザ、YAGレーザ、YVOレーザ、半導体レーザ、炭酸ガスレーザおよびエキシマレーザが選択できる。 Thereafter, as shown in FIG. 4, the metal member 2 is joined to the intermediate member 3. Specifically, first, the intermediate member 3 and the metal member 2 are arranged adjacent to each other so that the intermediate member 3 provided on the glass member 1 contacts the surface 2a of the metal member 2 under an inert gas atmosphere. . Then, the intermediate member 3 is melted and solidified by being irradiated with the laser L2 for bonding from the glass member 1 side toward the intermediate member 3, whereby the intermediate member 3 and the metal member 2 are welded. The As the type of the laser L2 for bonding, a fiber laser, a YAG laser, a YVO 4 laser, a semiconductor laser, a carbon dioxide gas laser, and an excimer laser can be selected.
 このようにして、図1に示す接合構造体100が製造される。なお、接合構造体100では、ガラス部材1と中間部材3とがアンカー効果によって接合され、金属部材2と中間部材3とが溶接によって接合されている。 In this way, the joined structure 100 shown in FIG. 1 is manufactured. In the joined structure 100, the glass member 1 and the intermediate member 3 are joined by the anchor effect, and the metal member 2 and the intermediate member 3 are joined by welding.
 -効果-
 第1実施形態では、上記のように、ガラス部材1および金属部材2の間に中間部材3が設けられ、ガラス部材1および中間部材3がアンカー効果で接合され、金属部材2および中間部材3が溶接で接合されている。このように構成することによって、ガラス部材1の表面1aおよび金属部材2の表面2aの面精度が低い場合であっても、中間部材3により表面1aおよび2aのばらつきを吸収することができるので、接合品質の悪化を抑制することができる。すなわち、表面1aおよび2aのばらつきに起因して予期せぬ接合不良が発生するのを抑制することができる。したがって、ガラス部材1および金属部材2が接合された接合構造体100において、その接合部の信頼性の向上を図ることができる。
-effect-
In 1st Embodiment, as above-mentioned, the intermediate member 3 is provided between the glass member 1 and the metal member 2, the glass member 1 and the intermediate member 3 are joined by the anchor effect, and the metal member 2 and the intermediate member 3 are attached. It is joined by welding. By configuring in this way, even if the surface accuracy of the surface 1a of the glass member 1 and the surface 2a of the metal member 2 is low, variations in the surfaces 1a and 2a can be absorbed by the intermediate member 3, Deterioration of bonding quality can be suppressed. That is, it is possible to suppress the occurrence of unexpected bonding failure due to variations in the surfaces 1a and 2a. Therefore, in the bonded structure 100 in which the glass member 1 and the metal member 2 are bonded, the reliability of the bonded portion can be improved.
 また、第1実施形態では、ガラス部材1に穿孔部11を形成し、その穿孔部11に中間部材3を充填することによって、金属製の中間部材3とガラス部材1とをアンカー効果によって機械的に接合することができる。さらに、穿孔部11に突出部11aを形成することによって、アンカー効果の向上を図ることができる。 Moreover, in 1st Embodiment, the perforated part 11 is formed in the glass member 1, and the perforated part 11 is filled with the intermediate member 3, By this, the metal intermediate member 3 and the glass member 1 are made mechanical by an anchor effect. Can be joined. Furthermore, the anchor effect can be improved by forming the protruding portion 11 a in the perforated portion 11.
 また、第1実施形態では、極短パルスレーザにより穿孔部11を形成することによって、バンドギャップが高い材料であるガラス部材1に対して、精密で熱影響の少ない加工を行うことができる。 Further, in the first embodiment, by forming the perforated portion 11 with an ultrashort pulse laser, it is possible to perform a precise and less heat-affected process on the glass member 1 which is a material having a high band gap.
 また、第1実施形態では、中間部材3の線膨張係数がガラス部材1および金属部材2の間であることによって、ガラス部材1および金属部材2の線膨張係数差に起因する応力を中間部材3により緩和することができる。 In the first embodiment, since the linear expansion coefficient of the intermediate member 3 is between the glass member 1 and the metal member 2, the stress caused by the difference in linear expansion coefficient between the glass member 1 and the metal member 2 is applied to the intermediate member 3. Can be relaxed.
 また、第1実施形態において、ガラス部材1の表面1aに中間部材3を形成する際に、超音波プロセスを用いた場合には、中間部材3を溶融するためのヒータが発振するため、穿孔部11に中間部材3が充填されやすくなるので、ガラス部材1と中間部材3との接合強度の向上を図ることができる。また、超音波プロセスを用いた場合には、キャビテーション効果により、ガラス部材1と中間部材3とが共有結合するので、ガラス部材1と中間部材3との接合強度の向上を図ることができる。 Further, in the first embodiment, when an ultrasonic process is used when forming the intermediate member 3 on the surface 1a of the glass member 1, a heater for melting the intermediate member 3 oscillates. 11 is easily filled with the intermediate member 3, so that the bonding strength between the glass member 1 and the intermediate member 3 can be improved. Further, when the ultrasonic process is used, the glass member 1 and the intermediate member 3 are covalently bonded due to the cavitation effect, so that the bonding strength between the glass member 1 and the intermediate member 3 can be improved.
 (第2実施形態)
 次に、図5を参照して、本発明の第2実施形態による接合構造体200について説明する。
(Second Embodiment)
Next, with reference to FIG. 5, the joining structure 200 by 2nd Embodiment of this invention is demonstrated.
 接合構造体200は、図5に示すように、ガラス部材1と、金属部材20と、ガラス部材1および金属部材20の間に配置される中間部材3とを備えている。金属部材20の表面20aには、複数の穿孔部21が形成され、その穿孔部21には、中間部材3が充填されて固化されている。このため、金属部材20および中間部材3は、アンカー効果によって機械的に接合されている。 As shown in FIG. 5, the bonding structure 200 includes a glass member 1, a metal member 20, and an intermediate member 3 arranged between the glass member 1 and the metal member 20. A plurality of perforated portions 21 are formed on the surface 20a of the metal member 20, and the perforated portions 21 are filled with the intermediate member 3 and solidified. For this reason, the metal member 20 and the intermediate member 3 are mechanically joined by the anchor effect.
 金属部材20の一例としては、鉄系金属、ステンレス系金属、銅系金属、アルミ系金属、マグネシウム系金属、および、それらの合金が挙げられる。また、金属成型体であってもよく、亜鉛ダイカスト、アルミダイカスト、粉末冶金などであってもよい。 Examples of the metal member 20 include iron metal, stainless steel metal, copper metal, aluminum metal, magnesium metal, and alloys thereof. Moreover, a metal molding may be sufficient and zinc die-casting, aluminum die-casting, powder metallurgy, etc. may be sufficient.
 穿孔部21は、平面的に見てほぼ円形の非貫通孔であり、金属部材20の表面20aに所定の間隔を隔てて複数配置されている。この穿孔部21は、たとえば加工用のレーザL3(図6参照)によって形成されている。なお、レーザL3の種類としては、パルス発振が可能なものが好ましく、ファイバレーザ、YAGレーザ、YVOレーザ、半導体レーザ、炭酸ガスレーザ、エキシマレーザが選択でき、レーザの波長を考慮すると、ファイバレーザ、YAGレーザ、YAGレーザの第2高調波、YVOレーザ、半導体レーザが好ましい。また、穿孔部21は、本発明の「第2凹状部」の一例である。 The perforated part 21 is a substantially circular non-through hole when seen in a plan view, and a plurality of the perforated parts 21 are arranged on the surface 20 a of the metal member 20 at a predetermined interval. The perforated portion 21 is formed by, for example, a processing laser L3 (see FIG. 6). As the type of the laser L3, a laser capable of pulse oscillation is preferable, and a fiber laser, a YAG laser, a YVO 4 laser, a semiconductor laser, a carbon dioxide gas laser, and an excimer laser can be selected. A YAG laser, a second harmonic of a YAG laser, a YVO 4 laser, and a semiconductor laser are preferable. The perforated part 21 is an example of the “second concave part” in the present invention.
 また、穿孔部21は、表面20a側から底部側に向けて拡径する拡径部と、その拡径部から底部側に向けて縮径する縮径部とが連なるように形成されている。すなわち、穿孔部21の内周面には、内側に突出する突出部21aが形成されている。突出部21aは、穿孔部21内における表面20a側に配置されている。また、突出部21aは、周方向における全長にわたって形成されており、環状に形成されている。 Further, the perforated portion 21 is formed so that a diameter-expanded portion that increases in diameter from the surface 20a side toward the bottom portion side and a diameter-reduced portion that decreases in diameter from the expanded diameter portion toward the bottom portion side are connected. That is, a protruding portion 21 a that protrudes inward is formed on the inner peripheral surface of the perforated portion 21. The protruding portion 21 a is disposed on the surface 20 a side in the perforated portion 21. Moreover, the protrusion part 21a is formed over the full length in the circumferential direction, and is formed in cyclic | annular form.
 このような穿孔部21は、1パルスが複数のサブパルスで構成されるレーザL3によって形成される。このレーザL3では、エネルギを深さ方向に集中させやすいので、穿孔部21を形成するのに好適である。このようなレーザL3の照射装置の一例としては、オムロン製のファイバレーザマーカMX-Z2000またはMX-Z2050を挙げることができる。 Such a perforated part 21 is formed by a laser L3 in which one pulse is composed of a plurality of sub-pulses. This laser L3 is suitable for forming the perforated portion 21 because energy can be easily concentrated in the depth direction. As an example of such an irradiation apparatus of the laser L3, fiber laser marker MX-Z2000 or MX-Z2050 manufactured by OMRON can be mentioned.
 上記ファイバレーザマーカによる加工条件としては、サブパルスの1周期が15ns以下であることが好ましい。これは、サブパルスの1周期が15nsを超えると、熱伝導によりエネルギが拡散しやすくなり、穿孔部21を形成しにくくなるためである。なお、サブパルスの1周期は、サブパルスの1回分の照射時間と、そのサブパルスの照射が終了されてから次回のサブパルスの照射が開始されるまでの間隔との合計時間である。 As processing conditions by the fiber laser marker, it is preferable that one period of the sub-pulse is 15 ns or less. This is because when one period of the sub-pulse exceeds 15 ns, energy is easily diffused by heat conduction, and it becomes difficult to form the perforated part 21. Note that one cycle of the subpulse is a total time of the irradiation time for one subpulse and the interval from the end of the irradiation of the subpulse to the start of the irradiation of the next subpulse.
 また、1パルスのサブパルス数は、2以上50以下であることが好ましい。これは、サブパルス数が50を超えると、サブパルスの単位あたりの出力が小さくなり、穿孔部21を形成しにくくなるためである。 Also, the number of subpulses in one pulse is preferably 2 or more and 50 or less. This is because when the number of subpulses exceeds 50, the output per unit of subpulses becomes small and it becomes difficult to form the perforated part 21.
 なお、接合構造体200のその他の構成は、上記した接合構造体100と同様である。 The other structure of the bonded structure 200 is the same as that of the bonded structure 100 described above.
 -接合構造体の製造方法-
 次に、図5~図7を参照して、第2実施形態による接合構造体200の製造方法について説明する。なお、ガラス部材1の表面1aに中間部材3を形成するまでの工程は、第1実施形態と同様であるため説明を省略する。
-Manufacturing method of bonded structure-
Next, with reference to FIGS. 5 to 7, a method for manufacturing the joint structure 200 according to the second embodiment will be described. In addition, since the process until forming the intermediate member 3 in the surface 1a of the glass member 1 is the same as that of 1st Embodiment, description is abbreviate | omitted.
 まず、図6に示すように、金属部材20の表面20aに加工用のレーザL3が照射されることにより、金属部材20の表面20aに穿孔部21が形成される。加工用のレーザL3は、1パルスが複数のサブパルスで構成されたものである。 First, as shown in FIG. 6, the surface 20 a of the metal member 20 is irradiated with a processing laser L <b> 3, thereby forming a perforated portion 21 on the surface 20 a of the metal member 20. In the processing laser L3, one pulse is composed of a plurality of subpulses.
 その後、図7に示すように、中間部材3に金属部材20が接合される。具体的には、まず、不活性ガス雰囲気下で、ガラス部材1に設けられた中間部材3が金属部材20の表面20aに接触するように、中間部材3と金属部材20とが隣接配置される。すなわち、金属部材20の穿孔部21が中間部材3側に配置される。そして、ガラス部材1側から中間部材3に向けて接合用のレーザL2が照射されることにより、中間部材3が溶融される。このため、溶融された中間部材3が金属部材20の穿孔部21に充填されて固化される。なお、接合用のレーザL2の種類としては、ファイバレーザ、YAGレーザ、YVOレーザ、半導体レーザ、炭酸ガスレーザおよびエキシマレーザが選択できる。 Thereafter, as shown in FIG. 7, the metal member 20 is joined to the intermediate member 3. Specifically, first, the intermediate member 3 and the metal member 20 are arranged adjacent to each other so that the intermediate member 3 provided on the glass member 1 contacts the surface 20a of the metal member 20 under an inert gas atmosphere. . That is, the perforated portion 21 of the metal member 20 is disposed on the intermediate member 3 side. Then, the intermediate member 3 is melted by irradiating the laser L2 for bonding from the glass member 1 side toward the intermediate member 3. For this reason, the melted intermediate member 3 is filled in the perforated portion 21 of the metal member 20 and solidified. As the type of the laser L2 for bonding, a fiber laser, a YAG laser, a YVO 4 laser, a semiconductor laser, a carbon dioxide gas laser, and an excimer laser can be selected.
 このようにして、図5に示す接合構造体200が製造される。なお、接合構造体200では、ガラス部材1と中間部材3とがアンカー効果によって接合され、金属部材20と中間部材3とがアンカー効果によって接合されている。 In this way, the joint structure 200 shown in FIG. 5 is manufactured. In the bonded structure 200, the glass member 1 and the intermediate member 3 are bonded by the anchor effect, and the metal member 20 and the intermediate member 3 are bonded by the anchor effect.
 -効果-
 第2実施形態では、上記のように、金属部材20に穿孔部21を形成し、その穿孔部21に中間部材3を充填することによって、中間部材3と金属部材20とをアンカー効果で機械的に接合することができる。これにより、中間部材3と金属部材20とが溶着しにくい材料同士の組合せであっても、中間部材3と金属部材20とを接合することができる。さらに、穿孔部21に突出部21aを形成することによって、アンカー効果の向上を図ることができる。なお、金属部材20と中間部材3とが溶着されていてもよく、この場合には、金属部材20と中間部材3との接合強度の向上を図ることができる。
-effect-
In the second embodiment, as described above, the perforated portion 21 is formed in the metal member 20, and the intermediate member 3 is filled in the perforated portion 21, thereby mechanically connecting the intermediate member 3 and the metal member 20 with an anchor effect. Can be joined. Thereby, even if the intermediate member 3 and the metal member 20 are a combination of materials which are difficult to weld, the intermediate member 3 and the metal member 20 can be joined. Furthermore, the anchor effect can be improved by forming the protruding portion 21 a in the perforated portion 21. The metal member 20 and the intermediate member 3 may be welded. In this case, the bonding strength between the metal member 20 and the intermediate member 3 can be improved.
 なお、第2実施形態のその他の効果は、第1実施形態と同様である。 The remaining effects of the second embodiment are similar to those of the first embodiment.
 (実験例)
 次に、図8~図12を参照して、第1実施形態に対応する実施例1による接合構造体300a(図10参照)と、第2実施形態に対応する実施例2による接合構造体300b(図12参照)とを作製し、その接合構造体300aおよび300bに対して行った接合評価について説明する。
(Experimental example)
Next, referring to FIG. 8 to FIG. 12, the joining structure 300a (see FIG. 10) according to Example 1 corresponding to the first embodiment and the joining structure 300b according to Example 2 corresponding to the second embodiment. (Refer to FIG. 12) is manufactured, and the bonding evaluation performed on the bonded structures 300a and 300b will be described.
 まず、実施例1の接合構造体300aの作製方法について説明する。 First, a method for producing the bonded structure 300a of Example 1 will be described.
 接合構造体300aでは、図10に示すように、ガラス部材301として石英ガラスを用い、金属部材302aとしてSUS304を用いた。ガラス部材301および金属部材302aは、板状に形成されており、長さが100mmであり、幅が25mmであり、厚みが3mmである。なお、金属部材302aは、接合領域に穿孔部が形成されていない。 In the joined structure 300a, as shown in FIG. 10, quartz glass was used as the glass member 301, and SUS304 was used as the metal member 302a. The glass member 301 and the metal member 302a are formed in a plate shape, have a length of 100 mm, a width of 25 mm, and a thickness of 3 mm. The metal member 302a does not have a perforated portion formed in the joining region.
 そして、図8に示すように、ガラス部材301の矩形枠状の接合領域R1に穿孔部(図示省略)を形成した。なお、接合領域R1は、一辺が20mmの正方形であり、ガラス部材301の中央に配置されている。 And as shown in FIG. 8, the perforated part (illustration omitted) was formed in the rectangular frame-shaped joining area | region R1 of the glass member 301. As shown in FIG. In addition, joining area | region R1 is a square whose one side is 20 mm, and is arrange | positioned in the center of the glass member 301. FIG.
 なお、穿孔部は、波長が355nmであるUVピコ秒レーザを用いて形成した。また、このUVピコ秒レーザの条件は、焦点径が20μmであり、出力が1W未満である。そして、穿孔部の深さは、5~20μmである。 The perforated part was formed using a UV picosecond laser having a wavelength of 355 nm. The conditions of this UV picosecond laser are a focal diameter of 20 μm and an output of less than 1 W. The depth of the perforated part is 5 to 20 μm.
 そして、図9に示すように、ガラス部材301の穿孔部が形成された接合領域R1に中間部材303を形成した。この中間部材303は、亜鉛系の鉛フリーはんだであり、超音波プロセスによって形成した。具体的には、約60kHzの超音波で発振するヒータにより中間部材303を溶融する。そして、その溶融した中間部材303が穿孔部に充填され、その後、溶融された中間部材303が固化される。 And as shown in FIG. 9, the intermediate member 303 was formed in joining area | region R1 in which the perforated part of the glass member 301 was formed. The intermediate member 303 is zinc-based lead-free solder, and is formed by an ultrasonic process. Specifically, the intermediate member 303 is melted by a heater that oscillates with an ultrasonic wave of about 60 kHz. Then, the melted intermediate member 303 is filled in the perforated portion, and then the melted intermediate member 303 is solidified.
 その後、図10に示すように、ガラス部材301および金属部材302aが中間部材303を挟み込むように、ガラス部材301および金属部材302aを積層した。そして、ガラス部材301側から中間部材303に向けてファイバレーザを照射することにより、中間部材303と金属部材302aとを溶接した。なお、ファイバレーザの照射条件は、以下のとおりである。 Then, as shown in FIG. 10, the glass member 301 and the metal member 302a were laminated so that the glass member 301 and the metal member 302a sandwiched the intermediate member 303. And the intermediate member 303 and the metal member 302a were welded by irradiating a fiber laser toward the intermediate member 303 from the glass member 301 side. The fiber laser irradiation conditions are as follows.
 <レーザ照射条件>
 レーザ:ファイバレーザ(波長1070nm)
 発振モード:連続発振
 出力:150W
 焦点径:0.15mm
 走査速度:2000mm/min
 このようにして、実施例1の接合構造体300aを作製した。なお、接合構造体300aでは、ガラス部材301と中間部材303とがアンカー効果によって接合され、金属部材302aと中間部材303とが溶接によって接合されている。
<Laser irradiation conditions>
Laser: Fiber laser (wavelength 1070nm)
Oscillation mode: Continuous oscillation Output: 150W
Focal diameter: 0.15mm
Scanning speed: 2000mm / min
In this way, the bonded structure 300a of Example 1 was produced. In the joined structure 300a, the glass member 301 and the intermediate member 303 are joined by the anchor effect, and the metal member 302a and the intermediate member 303 are joined by welding.
 次に、実施例2の接合構造体300bの作製方法について説明する。 Next, a method for manufacturing the joint structure 300b of Example 2 will be described.
 接合構造体300bでは、図12に示すように、金属部材302bとしてSUS304を用いた。金属部材302bは、板状に形成されており、長さが100mmであり、幅が25mmであり、厚みが3mmである。なお、ガラス部材301および中間部材303については実施例1と同様である。 In the joining structure 300b, as shown in FIG. 12, SUS304 was used as the metal member 302b. The metal member 302b is formed in a plate shape, has a length of 100 mm, a width of 25 mm, and a thickness of 3 mm. The glass member 301 and the intermediate member 303 are the same as those in the first embodiment.
 そして、図11に示すように、金属部材302bの矩形枠状の接合領域R2に穿孔部(図示省略)を形成した。なお、接合領域R2は、一辺が20mmの正方形であり、金属部材302bの中央に配置されている。すなわち、接合領域R2は、ガラス部材301および金属部材302bが積層されたときに接合領域R1と対応する位置に配置される。なお、穿孔部は、1パルスが複数のサブパルスで構成されるレーザを照射することによって形成した。 And as shown in FIG. 11, the perforated part (illustration omitted) was formed in the joining area | region R2 of the rectangular frame shape of the metal member 302b. In addition, joining area | region R2 is a square whose one side is 20 mm, and is arrange | positioned in the center of the metal member 302b. That is, the joining region R2 is disposed at a position corresponding to the joining region R1 when the glass member 301 and the metal member 302b are laminated. The perforated part was formed by irradiating a laser in which one pulse is composed of a plurality of subpulses.
 その後、図12に示すように、ガラス部材301および金属部材302bが中間部材303を挟み込むように、ガラス部材301および金属部材302bを積層した。そして、ガラス部材301側から中間部材303に向けてファイバレーザを照射することにより、中間部材303と金属部材302bとを溶接した。ここで、金属部材302bの接合領域R2には穿孔部が形成されていることから、溶融した中間部材303が穿孔部に充填され、その後中間部材303が固化される。なお、ファイバレーザの照射条件は、実施例1と同様である。 Then, as shown in FIG. 12, the glass member 301 and the metal member 302b were laminated so that the glass member 301 and the metal member 302b sandwiched the intermediate member 303. And the intermediate member 303 and the metal member 302b were welded by irradiating the fiber laser toward the intermediate member 303 from the glass member 301 side. Here, since the perforated part is formed in the joining region R2 of the metal member 302b, the melted intermediate member 303 is filled in the perforated part, and then the intermediate member 303 is solidified. The fiber laser irradiation conditions are the same as those in the first embodiment.
 このようにして、実施例2の接合構造体300bを作製した。なお、接合構造体300bでは、ガラス部材301と中間部材303とがアンカー効果によって接合され、金属部材302bと中間部材303とがアンカー効果および溶接によって接合されている。 In this way, the joined structure 300b of Example 2 was produced. In the joined structure 300b, the glass member 301 and the intermediate member 303 are joined by the anchor effect, and the metal member 302b and the intermediate member 303 are joined by the anchor effect and welding.
 なお、比較のために、中間部材を設けることなくガラス部材と金属部材との接合を試みたが、接合しなかった。 For comparison, an attempt was made to join a glass member and a metal member without providing an intermediate member, but it was not joined.
 そして、接合構造体300aおよび300bについて、高さ1mからのゴムシートへの落下試験を行った。その結果、接合構造体300aおよび300bでは、落下試験後であっても接合部に剥離が生じておらず、接合状態を維持することができた。 And about the joining structure 300a and 300b, the drop test to the rubber sheet from height 1m was done. As a result, in the bonded structures 300a and 300b, even after the drop test, no peeling occurred at the bonded portion, and the bonded state could be maintained.
 また、接合構造体300aおよび300bについて、熱衝撃試験を行った。この熱衝撃試験は、-40℃で30分間の低温さらしと、50℃で30分間の高温さらしとを10回繰り返し行った。その結果、接合構造体300aについては接合部の剥離が生じたが、接合構造体300bについては接合部の剥離が生じていなかった。つまり、金属部材302bと中間部材303とがアンカー効果によっても接合されている接合構造体300bでは、熱サイクル環境下における耐久性の向上を図ることができた。 Further, a thermal shock test was performed on the joint structures 300a and 300b. In this thermal shock test, low temperature exposure at −40 ° C. for 30 minutes and high temperature exposure at 50 ° C. for 30 minutes were repeated 10 times. As a result, the joint portion 300a peeled off, but the joint structure 300b did not peel off the joint portion. That is, in the joined structure 300b in which the metal member 302b and the intermediate member 303 are joined also by the anchor effect, it was possible to improve the durability in a thermal cycle environment.
 (他の実施形態)
 なお、今回開示した実施形態は、すべての点で例示であって、限定的な解釈の根拠となるものではない。したがって、本発明の技術的範囲は、上記した実施形態のみによって解釈されるものではなく、特許請求の範囲の記載に基づいて画定される。また、本発明の技術的範囲には、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれる。
(Other embodiments)
In addition, embodiment disclosed this time is an illustration in all the points, Comprising: It does not become a basis of limited interpretation. Therefore, the technical scope of the present invention is not interpreted only by the above-described embodiments, but is defined based on the description of the scope of claims. Further, the technical scope of the present invention includes all modifications within the meaning and scope equivalent to the scope of the claims.
 たとえば、第1実施形態では、ガラス部材1および金属部材2の全面に中間部材3が配置される例を示したが、これに限らず、実験例のように、ガラス部材および金属部材の一部分に中間部材が配置されていてもよい。なお、第2実施形態についても同様である。 For example, in the first embodiment, the example in which the intermediate member 3 is disposed on the entire surface of the glass member 1 and the metal member 2 has been shown. However, the present invention is not limited to this, and the glass member and the metal member are partially disposed as in the experimental example. An intermediate member may be arranged. The same applies to the second embodiment.
 また、第1実施形態では、ガラス部材1の表面1aに穿孔部11が形成される例を示したが、これに限らず、ガラス部材の表面に溝状の第1凹状部が形成されていてもよい。また、穿孔部11に突出部11aが形成される例を示したが、これに限らず、穿孔部が円筒状またはすり鉢状に形成されていてもよい。なお、第2実施形態についても同様である。 Moreover, in 1st Embodiment, although the example in which the perforated part 11 was formed in the surface 1a of the glass member 1 was shown, not only this but the groove-shaped 1st recessed part is formed in the surface of a glass member. Also good. Moreover, although the example in which the protrusion part 11a was formed in the perforated part 11 was shown, not only this but the perforated part may be formed in the cylindrical shape or the mortar shape. The same applies to the second embodiment.
 また、第2実施形態では、金属部材20の表面20aに穿孔部21が形成される例を示したが、これに限らず、金属部材の表面に溝状の第2凹状部が形成されていてもよい。また、穿孔部21に突出部21aが形成される例を示したが、これに限らず、穿孔部が円筒状またはすり鉢状に形成されていてもよい。また、レーザL3によって穿孔部21を形成する例を示したが、これに限らず、ブラスト処理、サンドペーパ処理、陽極酸化処理、放電加工処理、エッチング処理またはプレス加工処理を施すことにより、金属部材の表面に第2凹状部を形成するようにしてもよい。 Moreover, in 2nd Embodiment, although the perforated part 21 was formed in the surface 20a of the metal member 20, not only this but the groove-shaped 2nd recessed part was formed in the surface of a metal member. Also good. Moreover, although the example which the protrusion part 21a is formed in the perforated part 21 was shown, not only this but the perforated part may be formed in the cylindrical shape or the mortar shape. Moreover, although the example which forms the perforated part 21 with the laser L3 was shown, not only this but performing a blast process, a sandpaper process, an anodizing process, an electrical discharge process, an etching process, or a press process, A second concave portion may be formed on the surface.
 本発明は、ガラス部材および金属部材が接合された接合構造体の製造方法および接合構造体に利用可能である。 The present invention is applicable to a method for manufacturing a bonded structure in which a glass member and a metal member are bonded, and the bonded structure.
 1       ガラス部材
 1a      表面
 2、20    金属部材
 20a     表面
 3       中間部材
 11      穿孔部(第1凹状部)
 21      穿孔部(第2凹状部)
 100、200 接合構造体
 
 
 
DESCRIPTION OF SYMBOLS 1 Glass member 1a Surface 2, 20 Metal member 20a Surface 3 Intermediate member 11 Perforated part (1st recessed part)
21 Perforated part (second concave part)
100, 200 bonded structure

Claims (5)

  1.  ガラス部材および金属部材が金属製の中間部材を介して接合された接合構造体の製造方法であって、
     前記ガラス部材の表面に第1凹状部を形成する工程と、
     前記第1凹状部に前記中間部材が充填されるように、前記ガラス部材の表面に前記中間部材を形成する工程と、
     前記中間部材に前記金属部材を接合する工程とを備えることを特徴とする接合構造体の製造方法。
    A method for producing a joined structure in which a glass member and a metal member are joined via a metal intermediate member,
    Forming a first concave portion on the surface of the glass member;
    Forming the intermediate member on the surface of the glass member so that the intermediate member is filled in the first concave portion;
    And a step of joining the metal member to the intermediate member.
  2.  請求項1に記載の接合構造体の製造方法において、
     前記中間部材に前記金属部材を接合する工程は、
     前記中間部材に前記金属部材を隣接配置する工程と、
     前記ガラス部材側から前記中間部材にレーザを照射することにより、前記中間部材と前記金属部材とを溶接する工程とを含むことを特徴とする接合構造体の製造方法。
    In the manufacturing method of the joined structure according to claim 1,
    The step of joining the metal member to the intermediate member includes
    Placing the metal member adjacent to the intermediate member;
    A method of manufacturing a joined structure comprising: welding the intermediate member and the metal member by irradiating the intermediate member with laser from the glass member side.
  3.  請求項1に記載の接合構造体の製造方法において、
     前記中間部材に前記金属部材を接合する前に、前記金属部材の表面に第2凹状部を形成する工程を備え、
     前記中間部材に前記金属部材を接合する工程は、
     前記第2凹状部が前記中間部材側に配置されるように、前記中間部材と前記金属部材とを隣接配置する工程と、
     前記ガラス部材側から前記中間部材にレーザを照射することにより、前記中間部材を前記第2凹状部に充填して固化させる工程とを含むことを特徴とする接合構造体の製造方法。
    In the manufacturing method of the joined structure according to claim 1,
    Before joining the metal member to the intermediate member, comprising a step of forming a second concave portion on the surface of the metal member;
    The step of joining the metal member to the intermediate member includes
    Arranging the intermediate member and the metal member adjacently such that the second concave portion is disposed on the intermediate member side;
    And a step of irradiating the intermediate member with a laser from the glass member side to fill the second concave portion with the intermediate member and solidify the intermediate member.
  4.  請求項1~3のいずれか1つに記載の接合構造体の製造方法において、
     前記中間部材は、線膨張係数が前記ガラス部材および前記金属部材の間であることを特徴とする接合構造体の製造方法。
    In the method for manufacturing a bonded structure according to any one of claims 1 to 3,
    The intermediate member has a linear expansion coefficient between the glass member and the metal member.
  5.  請求項1~4のいずれか1つに記載の接合構造体の製造方法によって製造されたことを特徴とする接合構造体。
     
     
    A bonded structure manufactured by the method for manufacturing a bonded structure according to any one of claims 1 to 4.

PCT/JP2016/050131 2015-01-09 2016-01-05 Method for producing bonded structure, and bonded structure WO2016111291A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106517828A (en) * 2016-11-02 2017-03-22 北京工业大学 Laser welding method for connecting molybdenum-group glass/kovar alloy by adding Mo-Mn-Ni metal interlayer
US20210053155A1 (en) * 2019-08-23 2021-02-25 Shenzhenshi Yuzhan Precision Technology Co., Ltd. Connecting article and method for manufacturing the same, and laser device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108803783A (en) * 2018-05-29 2018-11-13 珠海市魅族科技有限公司 Terminal device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63203268A (en) * 1987-02-18 1988-08-23 Hitachi Ltd Joining method for glass or ceramic and metal
JP2002112394A (en) * 2000-10-03 2002-04-12 Matsushita Electric Ind Co Ltd Junction of substances with different coefficients of thermal expansion and ultrasonic wave transmitter- receiver using it and its manufacturing method
JP2004262698A (en) * 2003-02-28 2004-09-24 Hitachi Ltd Anodic bonding method and electronic device
JP2007105777A (en) * 2005-10-14 2007-04-26 Toyota Motor Corp Recess forming method and recess forming device, and metallic product manufacturing method
JP2009248097A (en) * 2008-04-01 2009-10-29 Shibaura Mechatronics Corp Laser joining structure, laser joining method, and laser beam machining apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63203268A (en) * 1987-02-18 1988-08-23 Hitachi Ltd Joining method for glass or ceramic and metal
JP2002112394A (en) * 2000-10-03 2002-04-12 Matsushita Electric Ind Co Ltd Junction of substances with different coefficients of thermal expansion and ultrasonic wave transmitter- receiver using it and its manufacturing method
JP2004262698A (en) * 2003-02-28 2004-09-24 Hitachi Ltd Anodic bonding method and electronic device
JP2007105777A (en) * 2005-10-14 2007-04-26 Toyota Motor Corp Recess forming method and recess forming device, and metallic product manufacturing method
JP2009248097A (en) * 2008-04-01 2009-10-29 Shibaura Mechatronics Corp Laser joining structure, laser joining method, and laser beam machining apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106517828A (en) * 2016-11-02 2017-03-22 北京工业大学 Laser welding method for connecting molybdenum-group glass/kovar alloy by adding Mo-Mn-Ni metal interlayer
US20210053155A1 (en) * 2019-08-23 2021-02-25 Shenzhenshi Yuzhan Precision Technology Co., Ltd. Connecting article and method for manufacturing the same, and laser device

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