JP2009248097A - Laser joining structure, laser joining method, and laser beam machining apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser joining structure, a laser joining method, and a laser beam machining apparatus by which stable joining is made possible without excessively damaging the members to be joined. <P>SOLUTION: The joining method includes: irradiating the end part of a light absorbing material held between a first joining member and a second joining member with a laser beam; jetting the fused light absorbing material from the end to the outside of it and solidifying the light absorbing material; and joining the first joining member to the second joining member. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a laser bonding structure, a laser bonding method, and a laser processing apparatus, and more specifically, a laser bonding structure and a laser bonding method laser for irradiating laser beams onto a bonding portion of a plurality of members to bond the members to each other. It relates to a processing apparatus.

  As a method of joining two members, there is a joining method by laser light irradiation. For example, a light emitting panel such as a plasma display panel (PDP), a surface-conduction electron-emitter display (SED), or a field emission display (FED) generally has a structure in which two glasses are joined. As one method for bonding glass, there is laser fusion in which a light-absorbing material is applied to, attached to or formed on a glass bonding surface, and laser light is irradiated to the light-absorbing material (Patent Document 1). The joining method and the device described in Patent Document 1 have a light absorbing material interposed between the joining surfaces of two joining members (glass), and the light absorbing material absorbs the energy of the laser beam and generates heat. That is, the glass is melted and joined.

  However, when the joining member is joined by the apparatus described in Patent Document 1, since the glass that is the joining member is melted, distortion or cracks may occur in the joined portion. When the joining member is distorted, stress is likely to be generated on the joining surface, and there is a possibility that sufficient adhesive strength cannot be obtained and peeling occurs. Further, when the joining member (glass) is melted, there is a concern about damage to the joining member due to the influence of heat.

  On the other hand, there is a method in which a bonding member made of an elastomer is sandwiched between the bonding surfaces of two bonding members, and the bonding member is bonded by melting the bonding sheet (Patent Document 2). In the joining method described in Patent Document 2, the adhesive sheet sandwiched between two joining members is heated and melted by absorbing the energy of laser light, and the heated and melted adhesive sheet is solidified again. It joins by.

However, when the light-absorbing material (adhesive sheet) is sufficiently large with respect to the irradiated portion of the laser light and the bonding member is in close contact, there is no escape route for gas generated by heating and melting the light-absorbing material. Therefore, the gas pressure gives a stress in the direction in which the bonding member is peeled off.
JP 2003-170290 A JP 2008-7584 A

  The present invention has been made based on recognition of such problems, and provides a laser bonding structure, a laser bonding method, and a laser processing apparatus capable of stable bonding without causing excessive damage to members to be bonded.

  According to one aspect of the present invention, the end of the light absorbing material sandwiched between the first joining member and the second joining member is irradiated with laser light, and the melted light absorbing material is used as the end. Then, the first joining member and the second joining member are joined to each other by being ejected to the outside and solidified.

  According to another aspect of the present invention, a laser oscillator that outputs laser light, a laser irradiation optical system that focuses the laser light and irradiates the irradiated body, the irradiated body, Absorption sandwiched between the first joining member and the second joining member based on a control stage for controlling the positional relationship between the laser irradiation optical system and preset position information of the irradiated object. There is provided a laser processing apparatus comprising: a control unit that controls the control stage so that an end portion of the material is irradiated with the laser beam.

  According to another aspect of the present invention, at least one of the first and second bonding members that is transparent to laser light, and between the first bonding member and the second bonding member. First and second light-absorbing materials sandwiched between the first light-absorbing material and the second light-absorbing material, and the first light-absorbing material and the second light-absorbing material. The end portion adjacent to the region sandwiched between the light absorbers is irradiated with the laser beam and melted, the light absorber is ejected from the end portions into the region and solidified, and the first joining members above and below There is provided a joint structure formed by joining the second joint member.

  ADVANTAGE OF THE INVENTION According to this invention, the laser joining structure body, laser joining method, and laser processing apparatus which can perform the stable joining without giving an excessive damage to the member to join are provided.

Embodiments of the present invention will be described below with reference to the drawings. In addition, in each drawing, the same code | symbol is attached | subjected to the same component and detailed description is abbreviate | omitted suitably.
FIG. 1 is a schematic view illustrating a bonding structure and a bonding method according to the first embodiment of the invention. 1A is an exploded schematic view of the bonding structure according to the present embodiment, and FIG. 1B is a schematic view during irradiation of the bonding structure according to the present embodiment with laser light. .

  In the joining method of the present embodiment, first, as shown in FIG. 1A, the joining member 100a (first joining member) having transparency to the laser beam 200 is the same as or different from the joining member 100a. The light absorbing material 102 is sandwiched between the material joining member 100b (second joining member). Subsequently, as illustrated in FIG. 1B, the light absorbing material 102 sandwiched between the bonding member 100 a and the bonding member 100 b is irradiated with the laser light 200 transmitted through the bonding member 100 a. At this time, as will be described in detail later, the laser beam 200 is irradiated in the vicinity of the end of the light absorbing material 102. The light absorbing material 102 is irradiated with the laser beam 200 while being sandwiched between the bonding member 100a and the bonding member 100b, absorbs the energy of the laser beam 200, and is heated and melted. The light-absorbing material melted by heating is ejected from the end toward the outside. Then, the ejected light absorbing material is solidified again, and an anchor effect is generated between the joining members 100a and 100b, thereby joining the joining member 100a and the joining member 100b.

  Here, the transparency to the laser beam means that the laser beam as a heating source is transmitted with almost no reflection or absorption, or the remaining laser beam is not melted even if the laser beam is partially absorbed or reflected. It refers to the property of transmitting laser light and reaching the light absorbing material. The material of the bonding member 100a is not particularly limited as long as it is a material having the above-described transparency with respect to the laser light 200, and examples thereof include glass, resin, and semiconductor.

  On the other hand, the joining member 100b may be the same material as the joining member 100a or a different material, may be a material having the permeability described above, or may be a material other than that. That is, a material that absorbs the laser light 200 may be used. Here, the absorptivity with respect to the laser beam refers to a property that even if a part of the laser beam as a heating source is transmitted or reflected, the remaining laser beam is absorbed and heated. Examples of such an absorptive material include metals, ceramics, and resins.

  The light absorbing material 102 is preferably a metal foil, a metal film, or a metal powder that absorbs and melts the laser beam 200. Specific examples of the light absorbing material 102 include aluminum, an aluminum alloy, copper, and a copper alloy.

  As the laser beam 200, when the joining member 100a is glass or the like, for example, a YAG laser can be used. The laser beam 200 can be a pulse laser. Thereby, the influence of the heat with respect to joining member 100a, 100b can be decreased.

FIG. 2 is a schematic view illustrating a state where the melted light absorbing material is ejected. 2A is a schematic diagram viewed from the top surface of the joining member, and FIG. 2B is a schematic diagram viewed from the side surface of the joining member.
As shown in FIG. 2A and FIG. 2B, when the end portion of the light absorbing material 102 is irradiated with the laser light 200, the gap between the bonding member 100a and the bonding member 100b outside the light absorbing material is The melted light absorbing material 102a is ejected. At this time, the irradiation side (spot) of the laser beam 200 does not need to include the edge of the ribbon-shaped light absorber 102. The end of the light absorbing material is melted to open an end, and the melted light absorbing material 102a may be ejected from the opened portion in a certain direction toward the outside. Therefore, in the present specification, the end portion of the light absorbing material does not necessarily include the end side of the light absorbing material. However, in order to more reliably eject the melted light absorbing material 102a, it is more preferable that the end of the light absorbing material 102 is included in the irradiation region (spot) of the laser light 200. This ejection distance varies depending on the power of the laser beam 200, the irradiation time, the material of the light absorber 102, the gap between the joining member 100a and the joining member 100b, and the like. And if the light-absorbing material 102a ejected in this way solidifies, an anchor effect will arise between the upper and lower joining members 100a and 100b, and these joining members 100a and 100b will be joined.

According to this embodiment, since the upper and lower joining members 100a and 100b can be joined without melting, it is possible to suppress the occurrence of thermal stress, distortion, cracks, or the like.
Further, the portion where the melted light absorbing material 102a is ejected and the upper and lower joining members 100a and 100b are joined is different from the irradiated portion of the laser beam 200, and therefore the upper and lower joining members 100a and 100b are excessively heated at the joining portion. Can also be suppressed. As a result, there is no possibility that excessive thermal stress is applied to the upper and lower bonding members 100a and 100b in the bonded portion.

  Further, according to the present embodiment, since the light absorbing material 102a melted by the irradiation of the laser light is ejected from the end portion to the outside, a cavity or the like is not generated inside the light absorbing material 102. When the inside of the light absorbing material 102 is melted by irradiating laser light, a cavity may be formed inside the light absorbing material 102. When a cavity is generated in the light absorbing material 102, gas generated by laser light irradiation is confined. The gas confined in the cavity may cause the upper and lower bonding members 100a and 100b to peel off due to the pressure. Furthermore, when it is necessary to maintain the space between the joining members 100a and 100b in a vacuum, if a cavity is formed inside the light absorbing material 102, the gas leaks from the cavity to maintain the vacuum. It can be difficult.

  On the other hand, according to the present embodiment, it is possible to prevent a cavity from being generated inside the light absorbing material 102 by ejecting the light absorbing material 102 a melted from the end of the light absorbing material 102 to the outside. As a result, it is possible to prevent separation of the joint portion due to gas confinement, breakage of vacuum, and the like.

FIG. 3 is a schematic diagram for explaining an example of an experiment conducted by the inventor.
FIG. 4 is a photograph illustrating the results of an experiment conducted by the inventor. 4A is a photograph viewed from the upper surface of the joining member, and FIG. 4B is an enlarged photograph viewed from the upper surface of the joining member.

  As shown in FIG. 3, first, a ribbon-shaped light absorbing material (aluminum) 102 is sandwiched between the joining member (glass) 100 a and the joining member (glass) 100 b. Subsequently, the fixing member (clamp) 302 is used to fix the bonding member 100a and the bonding member 100b with the light-absorbing material 102 sandwiched therebetween to the stage 300a. Furthermore, the stage 300a fixed using the fixing mechanism 302 and the joining members 100a and 100b with the light-absorbing material 102 interposed therebetween are placed on the stage 300b. In this state, the laser beam 200 made of a pulsed laser was applied to the end of the light absorbing material 102 from the upper surface of the bonding member 100a.

  As a result, as shown in FIG. 4A and FIG. 4B, the melted light-absorbing material 102a was ejected from the end irradiated with the laser beam toward the outside. On the other hand, no change was observed in the light absorbing material 102 not irradiated with the laser beam. The ejection distance or ejection range of the melted light absorbing material 102a varies depending on the power of the laser beam 200, the irradiation time, the gap between the joining member 100a and the joining member 100b, and the like. The width of the ribbon-shaped light absorbing material (aluminum) 102 used in this study is about 2 millimeters. Further, the spot diameter of the laser beam 200 is about 0.7 millimeters.

  In this way, the melted light absorbing material 102a is ejected from the end irradiated with the laser beam toward the outside thereof, so that there is no thermal stress or damage at the joint, and the gas inside the light absorbing material 102a is confined. In addition, it is possible to realize a bonded structure that suppresses the above.

Hereinafter, specific examples of the bonded structure and the bonding method according to the present embodiment will be described with reference to the drawings.
FIG. 5 is a schematic view illustrating a specific example of the bonded structure and the bonding method according to this embodiment.
In the joining method of this specific example, as shown in FIG. 5, the laser light 200 is irradiated to one end of the ribbon-shaped light-absorbing material 102 at a predetermined interval. Thereby, the melt | dissolved light absorption material 102a is ejected toward the outer side from one edge part. By appropriately setting the interval between the irradiation positions of the laser light 200, the power of the laser light 200, the irradiation time, and the like, it is possible to connect the ejected light absorbing materials 102a to each other. That is, the joint part of the upper and lower joining members 100a and 100b can be continuously extended.

  Thereby, greater bonding strength can be obtained. Moreover, it becomes possible to maintain a vacuum between the upper and lower connection members 100a and 100b by forming the connection part continuously.

FIG. 6 is a schematic view illustrating another specific example of the bonding structure and the bonding method according to this embodiment.
In the bonded structure of this specific example, surface processing is performed to roughen the bonding surface of at least one of the bonding member 100a and the bonding member 100b on the side from which the melted light absorbing material 102a is ejected. Alternatively, a coating layer that increases the adhesion strength of the light-absorbing material 102 is applied to at least one of the joining surfaces of the joining member 100a and the joining member 100b on the side from which the melted light-absorbing material 102a is ejected. Thereby, the anchor effect between the melt | dissolved light absorption material 102a and the joining members 100a and 100b becomes high, and a bigger joining strength can be obtained. These surface treatments and coating layers may be provided only in the vicinity of the joints of the joining members 100a and 100b, or may be provided throughout.

  According to this specific example, even when stress occurs in the direction in which the bonding members 100a and 100b are peeled off, the bonding member 100a and the bonding member 100b can be more reliably prevented from peeling off. Furthermore, the same effects as those described above with reference to FIG. 5 can be obtained.

FIG. 7 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to this embodiment. FIG. 7A is a schematic diagram illustrating a specific example of irradiating auxiliary laser light, and FIG. 7B is a schematic diagram illustrating a specific example in which the spot diameter of the laser light is made larger. .
As described above, in the joining method of the present embodiment, the melted light absorbing material 102a is ejected from the end portion of the light absorbing material 102 toward the outside thereof. At this time, the joining member 100a and the joining member 100b at the portion where the melted light absorbing material 102a is ejected are not irradiated with the laser light 200, and therefore, the portion where the light absorbing material 102 exists or the portion irradiated with the laser light 200 is irradiated. Compared with less heat generation.

  On the other hand, in the joining method of this specific example, as shown in FIG. 7A, the auxiliary laser beam 202 for assisting the joining is irradiated to the portion where the light absorbing material 102a is ejected. Alternatively, as illustrated in FIG. 7B, a laser beam 204 having a spot diameter larger than that of the laser beam 200 and the auxiliary laser beam 202 is irradiated with an end portion of the light absorbing material 102 and a portion where the melted light absorbing material 102 a is ejected. And irradiate.

  Thereby, the melted light absorbing material 102 a is heated by the irradiation of the auxiliary laser beam 202 or the laser beam 204 in the ejected portion. The heat is transmitted to the upper and lower joining members 100a and 100b, and heats these joining members 100a and 100b. When the joining members 100a and 100b are appropriately heated, the joining strength (influence of the anchor effect) between the melted light absorbing material 102a and the joining members 100a and 100b is further increased. Therefore, it can prevent more reliably that the joining member 100a and the joining member 100b peel. Furthermore, the same effects as those described above with reference to FIG. 5 can be obtained.

FIG. 8 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to this embodiment.
In this specific example, laser light 200 is irradiated at both ends of the ribbon-shaped light absorbing material 102 at predetermined intervals, and the melted light absorbing material 102a is ejected to the outside to join the upper and lower joining members 100a and 100b. is doing. By forming joints on both sides of the joining member 102, it is possible to obtain a greater joining strength.

  FIG. 9 is a schematic view illustrating still another specific example of the bonding structure and the bonding method according to the present embodiment. FIG. 9A is a schematic perspective view of the joint structure according to this example viewed obliquely from above, and FIG. 9B is a schematic view illustrating the ejection state of the light absorbing material of this example. It is.

  In this specific example, not a ribbon-shaped light-absorbing material, but a circular light-absorbing material 110 is sandwiched between the joining member 100a and the joining member 100b. That is, the light-absorbing material 110 does not have a continuous shape like the ribbon-shaped light-absorbing material 102, and is disposed at a predetermined interval from the adjacent light-absorbing material. Laser light 200 is applied to the circumferential ends of the circular light-absorbing material 110 at predetermined intervals, and the melted light-absorbing material 110a is ejected to the outside to join the upper and lower joining members 100a and 100b. ing.

  Thereby, the melted light absorbing material 110a is ejected substantially radially, and the upper and lower joining members 100a and 100b are joined over a larger area, so that a higher joining strength can be obtained. The shape of the light absorbing material 110 is not limited to a circular shape, and may be a rectangular shape.

  Moreover, if the melt | dissolved light absorption material 110a couple | bonds continuously, as a result, if the adjacent light absorption material 110 couple | bonds continuously, the vacuum property of the space between joining member 100a, 100b is ensured. Is possible. That is, even if the light-absorbing material 110 does not have a continuous shape like the ribbon-shaped light-absorbing material 102, the vacuum of the space between the joining members 100a and 100b can be set by appropriately setting the arrangement of the light-absorbing material 110 and the like. It is possible to ensure the sex.

  FIG. 10 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to this embodiment. FIG. 10A is a schematic diagram illustrating the ejection state of a hollow circular light-absorbing material, and FIG. 10B is a schematic diagram illustrating the ejection state of a hollow rectangular light-absorbing material.

  The light-absorbing material of this example is not in the form of a ribbon, as in the example shown in FIG. The light absorbing material 112 shown in FIG. 10A has a hollow circular shape, and the light absorbing material 114 shown in FIG. 10B has a hollow rectangular shape. In this specific example, the inner ends of the hollow circular light-absorbing material 112 and the hollow rectangular light-absorbing material 114 are respectively irradiated with the laser beam 200 at predetermined intervals, and the melted light-absorbing materials 112a and 114a are respectively inward. The upper and lower joining members 100a and 100b are joined by jetting.

  According to this, as will be described in detail later, even when an electronic element or an optical element is provided in the vicinity of the light absorbers 112 and 114, these elements are contaminated, damaged, or short-circuited. Can be prevented. As described above with reference to FIG. 9, if the melted light absorbers 112 a and the light absorbers 114 a are continuously bonded, as a result, the adjacent light absorbers 112 and 114 are continuously bonded. It is possible to ensure the vacuum property of the space between the joining members 100a and 100b.

FIG. 11 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to the present embodiment.
The ribbon-shaped light absorber 122 shown in FIG. 11 is a composite material of a light absorber 118 that absorbs the energy of laser light and is heated and melted, and an adhesive 120 that has an absorption rate lower than that of the light absorber 118. It has become. The light absorbers 118 are arranged at predetermined intervals at the ends of the light absorber 122. In the specific example shown in FIG. 11, by irradiating the laser light 200 near both ends of the ribbon-shaped light absorbing material 122, the melted light absorber 118a is ejected to the outside, and the upper and lower joining members 100a, 100b thereof. Are joined.

  Thereby, the ejection direction and the ejection amount of the light absorber 118 can be determined more accurately. Further, even when the laser light 200 is irradiated on substantially the entire light absorbing material 122, since the light absorber 118 is disposed only at the end of the light absorber 122, the melted light absorber 118a can be ejected to the outside. .

  The light absorber 118 may be disposed so as to be distributed over substantially the entire light absorber 122. According to this, by irradiating the vicinity of both ends of the ribbon-shaped light absorber 122 with the laser light 200, the melted light absorber 118a is ejected to the outside, and the upper and lower joining members 100a and 100b can be joined.

  Thereby, the ejection direction and the ejection amount can be roughly determined by appropriately setting the arrangement and capacity of the light absorber 118. Further, even if the portion of the adhesive 120 is irradiated with the laser beam 200, the adhesive 120 is not melted and ejected to the outside, so that the irradiation position of the laser beam 200 may not be strictly controlled.

  FIG. 12 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to the present embodiment. FIG. 12A is a schematic cross-sectional view illustrating a cross-section of a specific example in which the light absorber is stacked in the central portion, and FIG. 12B is a specific example in which the light absorber is stacked in the lower portion. FIG. 12C is a cross-sectional schematic view illustrating a cross-section, and FIG. 12C is a schematic cross-sectional view illustrating a cross-section of a specific example in which the light absorber component is dispersed.

  The light absorbing material 124 shown in FIG. 12A is a composite material in which an adhesive 120, a light absorber 118, and an adhesive 120 are laminated in this order. As described above, the light absorber 118 has the property of absorbing the energy of the laser light and heating and melting it. On the other hand, the adhesive 120 has a property that the absorptance with respect to laser light is lower than that of the light absorber 118 as described above.

On the other hand, in the light absorbing material 126 shown in FIG. 12B, the light absorber 118 is disposed in the lower layer portion, and the adhesive 120 is disposed in the upper layer portion.
Further, in the light absorbing material 128 shown in FIG. 12C, the light absorber component 130 is dispersed and blended in the adhesive 120.

  Thus, the light absorbing material does not have to have a high absorptivity with respect to the laser beam as a whole. An adhesive having a low absorption rate for laser light may be included. According to this, a material with better adhesiveness can be used. Further, similarly to the specific example shown in FIG. 11, the ejection direction and the ejection amount of the light absorber 118 can be determined more accurately.

  FIG. 13 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to the present embodiment. 13A is a schematic plan view of the light absorbing material viewed from above, and FIG. 13B is a schematic cross-sectional view of the light absorbing material viewed from the side.

  The light-absorbing material 132 shown in FIG. 13 is a composite material in which the light-absorbing body 118 is disposed on the left end side and the adhesive 120 is disposed on the other portion. When the light absorbing material 132 is viewed from the side, as shown in FIG. 13B, the light absorber 118 is disposed at the center with respect to the vertical direction.

  According to this, even if the irradiation position of the laser beam 200 is not strictly controlled, the light absorber 118 is arranged at the left end side of the light absorber 132, and therefore the ejection direction of the melted light absorber is determined to the left side. Can do. The light absorber 118 is not limited to the left end side, and may be disposed on the right end side.

  FIG. 14 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to the present embodiment. 14A is a schematic plan view of the light absorbing material as viewed from above, and FIG. 14B is a schematic cross-sectional view of the light absorbing material as viewed from the side.

  The light-absorbing material 134 shown in FIG. 14 is a composite material in which the light-absorbing body 118 is arranged on the left side so as not to include the end side, and the adhesive 120 is arranged in the other part. Further, when the light absorbing material 134 is viewed from the side, the light absorber 118 is disposed at the central portion with respect to the vertical direction as in FIG. 13B.

  According to this, the light absorber 118 absorbs the energy of the laser light 200 and heats and melts, and the end of the adhesive 120 on the left side of the light absorber 118 opens. The melted absorber 118 can be ejected toward the left side from the opened portion. As described above, even when the light absorber 118 is arranged on the left side so as not to include the end side, the ejection direction of the melted light absorber can be determined. The light absorber 118 may be arranged from the right side so as not to include the end side.

FIG. 15 is a schematic view illustrating still another specific example of the bonding structure and the bonding method according to this embodiment.
The light-absorbing material 136 shown in FIG. 15 is a composite material of the light-absorbing material 118, the adhesive 120, and the heat insulating material 138 whose thermal conductivity is lower than that of the light-absorbing material 118 and the adhesive 120. In addition, the light absorbers 118 are arranged at predetermined intervals at the ends of the light absorber 136, as in the specific example shown in FIG. The heat insulating material 138 is disposed around the light absorber 118 so as to surround the light absorber 118 disposed at the end.

  When the light absorber 118 is irradiated with the laser light 200, the light absorber 118 absorbs the energy of the laser light 200 and is heated and melted. However, the heat generated here hardly passes through the heat insulating material 138. That is, the heat insulating material 138 can prevent heat from diffusing around the light absorber 118, and can further prevent the melted light absorber 118 a from diffusing in the longitudinal direction or inside of the light absorber 136. Therefore, the melted absorber 118a can be more reliably ejected outward.

  The heat insulating material 138 may be made of a material having a melting point higher than that of the light absorber 118 and the adhesive 120. According to this, even if the light absorber 118 absorbs the energy of the laser beam 200 and is heated and melted, the high melting point material 138 does not melt because the melting point is higher. Therefore, the ejection direction of the melted light absorber 118a can be determined outside the light absorber 136.

Next, a second embodiment of the present invention will be described with reference to the drawings.
FIG. 16 is a schematic view illustrating a bonding structure and a bonding method according to the second embodiment of the invention. 16A is an exploded schematic view of the bonded structure according to the present embodiment, and FIG. 16B is a schematic view during irradiation of the bonded structure according to the present embodiment with laser light. .

  In the joining method of the present embodiment, two ribbon-shaped light absorbing materials 104 (first light absorbing material) and light absorbing material 106 (second light absorbing material) are sandwiched between the joining member 100a and the joining member 100b. Subsequently, at least one of the light absorbing materials 104 and 106 in a state of being sandwiched between the bonding member 100a and the bonding member 100b is irradiated with the laser beam 200. At this time, as will be described in detail later, the irradiation position of the laser beam 200 is at least one end of the light absorbing materials 104 and 106 on the side of the region 108 sandwiched between the light absorbing material 104 and the light absorbing material 106.

  Other bonding methods and bonding structures are the same as the bonding method and bonding structure described above with reference to FIG. Further, the bonding members 100a and 100b, the light absorbers 104 and 106, and the laser beam 200 are the same as the bonding members 100a and 100b, the light absorber 102, and the laser beam 200 described above with reference to FIG.

FIG. 17 is a schematic view illustrating a state where the melted light absorbing material is ejected. FIG. 17A is a schematic diagram viewed from the top surface of the joining member, and FIG. 17B is a schematic diagram viewed from the side surface of the joining member.
As described above, when the end of the light absorbing material is irradiated with laser light, the melted light absorbing material is ejected into the gap between the joining member 100a and the joining member 100b outside the light absorbing material. Therefore, as shown in FIG. 17A and FIG. 17B, the laser beam 200 is irradiated to the end portions of the light absorbing materials 104 and 106 on the side of the region 108 sandwiched between the light absorbing material 104 and the light absorbing material 106. Then, the melted light absorbers 104 a and 106 a are ejected toward a region 108 sandwiched between the light absorber 104 and the light absorber 106. As described above, the irradiation region (spot) of the laser beam 200 includes the end sides of the light absorbing materials 104 and 106 on the side of the region 108 sandwiched between the light absorbing material 104 and the light absorbing material 106. There is no need. In other words, the end of the light absorbing material is melted to open the end, and the melted light absorbing material 104a, 106a is ejected from the opened portion toward the region 108 in a certain direction.

  At this time, the light absorbing material 104 a ejected from the light absorbing material 104 is blocked by the light absorbing material 106 facing the light absorbing material 104. On the other hand, the light absorbing material 106 a ejected from the light absorbing material 106 is also dammed up by the light absorbing material 104 facing the light absorbing material 106.

  That is, the melted light-absorbing materials 104a and 106a do not spout outside the region 108 sandwiched between the light-absorbing material 104 and the light-absorbing material 106, and spread to fill the region 108. That is, the range in which the melted light absorbers 104a and 106a are ejected can be limited to a predetermined range. Therefore, for example, even when an electronic element or an optical element is provided in the vicinity of the light absorbers 104 and 106, the ejected light absorbers 104a and 106a come into contact with these elements to be contaminated or damaged, A short circuit can be prevented from occurring. Then, the light absorbing materials 104a and 106a spread in the region 108 are solidified again, and an anchor effect is generated between the bonding member and the light absorbing material, whereby the bonding member 100a and the bonding member 100b are bonded.

Note that the distance between the light absorbing material 104 and the light absorbing material 106, the thickness and width of the light absorbing materials 104 and 106, and the like are preferably set so that the melted light absorbing materials 104a and 106a fill the region 108.
Further, in the joining method shown in FIGS. 16 and 17, two light absorbing materials are arranged. However, the present invention is not limited to this, and three or more light absorbing materials may be arranged. Even in this case, the emitted light absorbing material is blocked by the opposite light absorbing material by irradiating the end portion of the light absorbing material adjacent to the region sandwiched between the respective light absorbing materials with the laser light 200. Thereby, it can prevent that an electronic element, an optical element, etc. are damaged, or a short circuit is produced. Furthermore, since the bonding area is increased by arranging three or more light absorbing materials, a larger bonding strength can be obtained. The same applies to the following specific examples.

Hereinafter, specific examples of the bonding method and the bonded structure according to the present embodiment will be described with reference to the drawings.
FIG. 18 is a schematic view illustrating a specific example of the bonded structure and the bonding method according to this embodiment.
In the joining method of this specific example, as shown in FIG. 18, the laser beams 200 are staggered at the ends of the light absorbing materials 104 and 106 on the side of the region 108 sandwiched between the light absorbing material 104 and the light absorbing material 106. Irradiate. Thereby, the melted light absorbing materials 104a and 106a spread so as to fill the region 108 sandwiched between the light absorbing material 104 and the light absorbing material 106.

  Further, as described above, the light absorbing material 104 a ejected from the light absorbing material 104 is blocked by the light absorbing material 106 facing the light absorbing material 104. Therefore, it is possible to prevent the electronic element or the optical element provided in the vicinity of the joint from being contaminated, damaged, or short-circuited.

  Note that the distance between the irradiation positions of the adjacent laser beams 200 is preferably set so that the melted light absorbers 104 a and 106 a fill the region 108. Further, in the joining method of this specific example, the joining members 100a and 100b are not melted and joined, but the light absorbing material 102 is melted and joined. Therefore, there is little damage by the heat which the laser beam 200 gives to the joining members 100a and 100b.

  The order of irradiating the laser beam 200 is not particularly limited. For example, the light-absorbing material 104 and the light-absorbing material 106 may be alternately irradiated, and the laser light 200 may be irradiated in an order that results in a so-called lightning (zigzag) shape. Alternatively, for example, only the end of the light absorbing material 104 may be irradiated first, and then only the end of the light absorbing material 106 may be irradiated.

FIG. 19 is a schematic view illustrating another specific example of the bonding structure and the bonding method according to this embodiment.
In the bonding method of this specific example, the distance between the light absorbing material 104 and the light absorbing material 106 is made smaller. That is, the area of the region 108 sandwiched between the light absorbing material 104 and the light absorbing material 106 is smaller than the area shown in FIG.

  Therefore, even if the number of places to which the laser beam 200 is irradiated is smaller than the specific example shown in FIG. 18, the melted light absorbers 104a and 106a can sufficiently fill the region 108. Thereby, joining time can be shortened more and efficiency of joining operation can be aimed at. In addition, since the number of locations to which the laser beam 200 is irradiated can be reduced, the power saving of the laser processing apparatus can be achieved. Furthermore, the same effects as those described above with reference to FIG. 18 can be obtained.

FIG. 20 is a schematic view illustrating still another specific example of the bonding structure and the bonding method according to this embodiment.
In the joining method of this specific example, as shown in FIG. 20, the laser beam 200 is irradiated in a row only on the end of the light absorbing material 106 on the side of the region 108 sandwiched between the light absorbing material 104 and the light absorbing material 106. . Accordingly, similarly to the specific example shown in FIG. 18, the melted light absorbing material 106 a spreads so as to fill the region 108 sandwiched between the light absorbing material 104 and the light absorbing material 106.

  The jetted light absorbing material 106a is dammed up by the light absorbing material 104 that faces the light absorbing material 106a. Thereby, a junction part can be restrict | limited to a predetermined range. Further, as in the specific example shown in FIG. 18, the laser beam 200 is not irradiated in a staggered manner, so that the bonding time can be further shortened.

  In the bonding method of this specific example, the laser beam 200 may be irradiated in a line only to the end of the light absorbing material 104 on the side of the region 108 sandwiched between the light absorbing material 104 and the light absorbing material 106. According to this, since the light absorbing material 106a ejected from the light absorbing material 106 is blocked by the light absorbing material 104 facing the light absorbing material 106, the same effect can be obtained.

FIG. 21 is a schematic view illustrating still another specific example of the bonding structure and the bonding method according to this embodiment.
In the bonding method of this specific example, the distance between the light absorbing material 104 and the light absorbing material 106 is made smaller as in the specific example shown in FIG. Accordingly, the area of the region 108 sandwiched between the light absorbing material 104 and the light absorbing material 106 is smaller than the area shown in FIG.

  Therefore, even if the number of locations to which the laser beam 200 is irradiated is smaller than that in the specific example shown in FIG. 20, the melted light absorbers 104a and 106a can sufficiently fill the region 108, and the bonding time can be shortened. .

  Also in this specific example, the laser beam 200 may be irradiated in a line only to the end of the light absorbing material 104 on the side of the region 108 sandwiched between the light absorbing material 104 and the light absorbing material 106. According to this, since the light absorbing material 106a ejected from the light absorbing material 106 is blocked by the light absorbing material 104 facing the light absorbing material 106, the same effect can be obtained.

FIG. 22 is a schematic view illustrating still another specific example of the bonding structure and the bonding method according to this embodiment.
In the joint structure of this specific example, similarly to the specific example shown in FIG. 6, the side from which the melted light absorbing materials 104 a and 106 a are ejected, that is, the region 108 sandwiched between the light absorbing material 104 and the light absorbing material 106 is joined. Surface treatment for roughening the surface is performed on at least one of the joining surfaces of the member 100a and the joining member 100b. Alternatively, a coating layer that facilitates the bonding of the light absorbing material 102 is applied to at least one of the bonding surfaces of the bonding member 100a and the bonding member 100b in the region 108 sandwiched between the light absorbing material 104 and the light absorbing material 106. Thereby, since the influence of the anchor effect between the melted light-absorbing materials 104a and 106a and the joining members 100a and 100b is increased, a larger joining strength can be obtained.

  Therefore, even when a stress in a direction in which the bonding members 100a and 100b are peeled off, the bonding member 100a and the bonding member 100b can be more reliably prevented from peeling. Furthermore, the same effects as those described above with reference to FIG. 18 can be obtained.

FIG. 23 is a schematic view illustrating still another specific example of the bonding structure and the bonding method according to this embodiment.
In the bonding method of this specific example, the laser beam 200 is irradiated not on the staggered pattern but on the opposed positions as shown in FIG. When the laser beam 200 is irradiated in this way, the melted light absorbing materials 104a and 106a are ejected in opposite directions, and are substantially fused in a region 108 sandwiched between the light absorbing material 104 and the light absorbing material 106. Therefore, even if the distance between the light absorbing material 104 and the light absorbing material 106 is increased, that is, the area of the region 108 is increased, the melted light absorbing materials 104 a and 106 a spread so as to fill the region 108. Thereby, since a joining area becomes large, larger joining strength can be obtained.

  In the bonding method of this specific example, the laser beam 200 can be simultaneously irradiated to the opposite irradiation positions. In other words, by using a multifocal lens or the like as a focal lens (not shown), it is possible to simultaneously irradiate two opposite irradiation positions with the laser beam 200. Thereby, joining time can be shortened more and efficiency of joining operation can be aimed at.

FIG. 24 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to this embodiment.
In this specific example, as shown in FIG. 24, the laser beam 205 having a spot diameter larger than that of the laser beam 200 can be simultaneously irradiated to the end portions of the light-absorbing materials 104 and 106 facing each other. As a result, the melted light absorbers 104a and 106a are ejected in opposite directions and are substantially fused in the region 108. Therefore, the same effect as that described above with reference to FIG. 23 can be obtained. Further, since the laser beam 205 is also irradiated to the region 108 where the light absorbing materials 104a and 106a are substantially fused, the joining members 100a and 100b in this region are appropriately heated. Thereby, the influence of the anchor effect of the melt | dissolved light absorption material 104a, 106a and joining member 100a, 100b becomes large, and larger joining strength can be obtained.

FIG. 25 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to this embodiment. FIG. 25A is a schematic diagram illustrating a specific example of irradiation with auxiliary laser light, and FIG. 25B is a schematic diagram illustrating a specific example in which the spot diameter of the laser light is made larger. .
As described above, in the bonding method of the present embodiment, the melted light absorbing materials 104 a and 106 a spread so as to fill the region 108 sandwiched between the light absorbing material 104 and the light absorbing material 106. At this time, since the region 108 sandwiched between the light absorbing material 104 and the light absorbing material 106 is not irradiated with the laser beam 200, the temperature is low.

  On the other hand, in the bonding method of this specific example, as shown in FIG. 25A, the auxiliary laser light 206 for assisting the bonding is irradiated to the region 108. Alternatively, as illustrated in FIG. 25B, the laser beam 208 having a spot diameter larger than that of the laser beam 200 and the auxiliary laser beam 206 is irradiated on the region 108 side sandwiched between the absorber 104 and the absorber 106. Irradiate the end portions of the light absorbing materials 104 and 106 and the region 108.

  As a result, the melted light absorbers 104a and 106a are heated at the ejected portion, and the joining member 100a and the joining member 100b are also heated by the heat. As a result, the bonding strength (influence of the anchor effect) between the melted light absorbing materials 104a and 106a and the bonding members 100a and 100b becomes larger. Therefore, it can prevent more reliably that the joining member 100a and the joining member 100b peel. Furthermore, the same effects as those described above with reference to FIG. 18 can be obtained.

Next, a laser processing apparatus according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 26 is a schematic view illustrating the laser processing apparatus according to the embodiment of the invention.
The laser processing apparatus shown in FIG. 26 has an image recognition optical system having a laser irradiation optical system 230 that condenses laser light and irradiates a predetermined position, and an optical element such as a lens and a camera for acquiring an image of the irradiated object. System 220, laser oscillator 260 that oscillates laser light, optical fiber (transmission unit) 240 that transmits the laser light oscillated from laser oscillator 260 to laser irradiation optical system 230, laser irradiation optical system 230, and image recognition optics A triaxial control stage 250 that can adjust the position of the system 220 in the triaxial direction, and a fixing mechanism 310 that fixes the joining members 100a and 100b are provided.

  The laser beam 200 oscillated by the laser oscillator 260 is condensed and irradiated on the bonding surface between the bonding member 100a and the bonding member 100b through an optical fiber 240 and a lens (not shown) provided in the laser irradiation optical system 230. . At this time, an image of the irradiation position of the laser beam 200 can be acquired by a camera built in the image recognition optical system 220. The position of the laser spot of the laser beam 200 and the imaging position of the irradiated object are controlled by the three-axis control stage 250 that supports the laser irradiation optical system 230 and the image recognition optical system 220.

  Note that the irradiation position of the laser beam 200 can be controlled by adjusting a stage (not shown) on which the joining members 100a and 100b are mounted in three axial directions. Further, if necessary, the laser light output from the laser oscillator 260 can be transmitted by an optical fiber or an optical system branched into a plurality of parts, and a plurality of joints can be performed simultaneously.

FIG. 27 is a block diagram illustrating the configuration of the laser processing apparatus according to the embodiment of the invention.
The laser processing apparatus shown in FIG. 27 is applied to the laser oscillator 260 by a laser oscillator 260 having an excitation lamp 260a, a switching power supply 270 that applies a driving power of an arbitrary magnitude to the laser oscillator 260, and the switching power supply 270. And a control microcomputer 280 for controlling drive power. The control microcomputer 280 is connected to the control computer 290 via the communication path 285. The control computer 290 can control the switching power supply 270 so as to change the setting of the pulse shape, pulse width, and the like of the laser light 200 according to an instruction from the user. In addition, image data captured by a camera provided in the image recognition optical system 220 is output to the control computer 290 and subjected to image analysis. Based on the result, the control computer 290 controls the three-axis control stage 250 so that the irradiation position of the laser beam 200 is a predetermined position. Instead of controlling the triaxial control stage 250, the stage on which the irradiated bodies (joining members 100a and 100b) are placed may be adjusted in the triaxial direction.
Here, the control microcomputer (control unit) is configured by the control microcomputer 280 and the control computer 290.

  That is, in the laser processing apparatus shown in FIG. 27, the pulse shape of the laser light emitted from the laser oscillator 260 is controlled according to the waveform of the driving power applied by the switching power supply 270. Under the control of the control microcomputer 280 and the control computer 290, the waveform of the driving power applied to the laser oscillator 260 by the switching power supply 270 is changed, so that the laser oscillator 260 has a predetermined peak output and energy density. Laser light (pulse laser) 200 is emitted.

  The laser processing apparatus according to the present embodiment can execute the laser bonding method described above with reference to FIGS. That is, the control computer 290 analyzes the image acquired by the camera built in the image recognition optical system 220 and determines the positions of the light-absorbing materials 102, 104, and 106. Then, based on the predetermined joining parameters, the triaxial control stage 250, the control microcomputer 280, and the laser light 200 are irradiated at predetermined intervals to the ends of the light absorbing materials 102, 104, 106, To control.

  For example, when programmed to perform laser bonding by the method described above with reference to FIG. 17, the control computer 290 uses the light absorbing material 104 based on an image acquired by a camera incorporated in the image recognition optical system 220. , 106 are detected, and the three-axis control stage 250 and the control microcomputer 280 are controlled so that the laser beam 200 is irradiated to predetermined positions at the end portions thereof. In this way, by repeating the movement of the irradiated object and the irradiation of the laser beam 200, the laser junction structure described above with reference to FIG. 17 can be automatically formed.

  Further, the portion where the light absorbing material 102a is ejected is appropriately irradiated with the auxiliary laser light 202, the laser light 200 and the laser light 204 having a spot diameter larger than the auxiliary laser light 202 are appropriately irradiated, the light absorbing material 104 and the light absorbing material. The auxiliary laser beam 202 can be appropriately irradiated onto the region 108 sandwiched between the laser beam 106 and the laser beam 208 having a larger spot diameter than the laser beam 200 and the auxiliary laser beam 206 can be appropriately irradiated.

  In the laser processing apparatus according to the present embodiment, based on the preset position information of the light absorbing material, the control computer 290 has three axes so that the end of the light absorbing material is irradiated with the laser beam 200. The control stage 250 and the control microcomputer 280 may be controlled. According to this, since the image recognition optical system 220 is not required, the laser processing apparatus can be simplified.

  FIG. 28 is a schematic diagram for explaining a fixing mechanism 310 provided in the laser processing apparatus of the present embodiment. FIG. 28A is a schematic perspective view of the fixing mechanism 310 viewed obliquely from above, and FIG. 28B is a schematic top view of the fixing position of the fixing mechanism 310 viewed from above.

  The fixing mechanism 310 includes a mounting table 312 on which the joining members 100a and 100b are placed, and a fixing portion 314 that fixes the joining members 100a and 100b. The fixed portion 314 is pivotally supported by the shaft 318 with respect to the mounting table 312. Further, as shown in FIG. 28A, an opening 316 through which the laser 200 passes is provided on the upper surface of the fixing portion 314 in a state where the joining members 100a and 100b are fixed. Accordingly, the laser beam 200 can be irradiated onto the bonding surface from above the fixing portion 314 while the bonding members 100a and 100b are fixed. FIG. 28A shows one side of the fixing mechanism 310, but this fixing mechanism 310 can have the same fixing portion 314 on the other side.

  At this time, the fixing unit 314 can limit the irradiation range of the laser light 200 by appropriately setting the size of the opening 316 or the arrangement of the light absorbers 104 and 106. That is, as shown in FIG. 28B, the fixing portion 314 shields a part of the laser beam 200 and limits the irradiation range of the laser beam 200 that has passed through the opening 316 to the end portions of the light absorbers 104 and 106. can do. Here, when the fixing mechanism 310 is viewed from above, the size of the opening 316 or the light absorbing material 104, so that the vicinity of the ends of the light absorbing materials 104 and 106 to be irradiated with the laser light 200 can be seen from the opening 316. It is necessary to set the arrangement of 106.

  Thereby, since the laser beam 200 can be more accurately irradiated to the end portions of the light absorbers 104 and 106, the irradiation position of the laser beam 200 can be limited by a simpler image processing system or position adjustment system. Further, the spot diameter, focus position, output control, etc. of the laser beam 200 can be set more simply.

FIG. 29 is a schematic view illustrating a modification of laser light emitted from above the fixing mechanism. Note that FIG. 29 is a schematic top view of the fixing position of the fixing mechanism 310 as viewed from above, as in FIG.
In the present modification, similarly to the specific example described above with reference to FIG. 24, the light absorbing material 104 and the light absorbing material 106 can be irradiated almost simultaneously with the laser 209 having a spot diameter larger than that of the laser light 200. Also in this case, as described above with reference to FIG. 28B, the fixing portion 314 shields a part of the laser light 209, so that the irradiation range of the laser light 209 is limited to the end portions of the light absorbers 104 and 106. Can do.

  Thereby, the same effect as the effect mentioned above regarding FIG.28 (b) can be acquired. Further, since the opposite end portions of the light absorbing material 104 and the light absorbing material 106 are ejected, as described above with reference to FIG. 24, the interval between the light absorbing material 104 and the light absorbing material 106 is widened, that is, the light absorbing material 104 and the light absorbing material 106. The region 108 sandwiched between the materials 106 can be widened. Therefore, the bonding area is increased and the bonding strength can be further increased.

  As described above, according to the embodiment of the present invention, it is possible to irradiate the laser beam 200 to a predetermined position at the end of the light absorbing material 102. Thereby, the joining members 100a and 100b can be joined without applying excessive thermal stress to the joining member 100a and the joining member 100b and without forming a cavity inside the light absorbing material 102. In addition, according to the embodiment of the present invention, the laser beam 200 can be irradiated to at least one end of the light absorbers 104 and 106 on the side of the region 108 sandwiched between the light absorber 104 and the light absorber 106. it can. Thereby, ejection of the light absorbing material can be suppressed, and the joining members 100a and 100b can be joined while defining the joining region.

The embodiment of the present invention has been described above. However, the present invention is not limited to these descriptions. As long as the features of the present invention are provided, those skilled in the art appropriately modified the design of the above-described embodiments are also included in the scope of the present invention. For example, the shape, dimensions, material, arrangement, and the like of each element included in the laser processing apparatus, the bonding structure, and the like are not limited to those illustrated, and can be changed as appropriate.
Further, the shape and size of the ribbon-shaped light-absorbing material, the spot diameter of the laser beam, and the like are not limited to those illustrated, and can be appropriately changed.
Furthermore, the specific examples described above or the elements included in them can be combined as long as technically possible, and combinations thereof are also included in the scope of the present invention as long as they include the features of the present invention.

It is a schematic diagram which illustrates the joining structure and joining method concerning a 1st embodiment of the present invention. It is a schematic diagram which illustrates the state which the molten light-absorbing material ejected. It is a schematic diagram for demonstrating the method of prior examination which this inventor performed. It is a photograph figure which illustrates the result of prior examination which this inventor performed. It is a schematic diagram which illustrates the specific example of the joining structure body and joining method concerning 1st Embodiment. It is a schematic diagram which illustrates the other specific example of the joining structure body and joining method concerning 1st Embodiment. FIG. 6 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to the first embodiment. FIG. 6 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to the first embodiment. FIG. 6 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to the first embodiment. FIG. 6 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to the first embodiment. FIG. 6 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to the first embodiment. FIG. 6 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to the first embodiment. FIG. 6 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to the first embodiment. FIG. 6 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to the first embodiment. FIG. 6 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to the first embodiment. It is a schematic diagram which illustrates the joining structure body and joining method concerning the 2nd Embodiment of this invention. It is a schematic diagram which illustrates the state which the molten light-absorbing material ejected. It is a schematic diagram which illustrates the specific example of the joining structure body and joining method concerning 2nd Embodiment. It is a schematic diagram which illustrates the other specific example of the joining structure body and joining method concerning 2nd Embodiment. FIG. 10 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to the second embodiment. FIG. 10 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to the second embodiment. FIG. 10 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to the second embodiment. FIG. 10 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to the second embodiment. FIG. 10 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to the second embodiment. FIG. 10 is a schematic view illustrating still another specific example of the bonded structure and the bonding method according to the second embodiment. It is a schematic diagram which illustrates the laser processing apparatus concerning embodiment of this invention. It is a block diagram which illustrates the composition of the laser processing device concerning an embodiment of the invention. It is a schematic diagram for demonstrating the fixing mechanism with which the laser processing apparatus concerning embodiment of this invention is provided. It is a schematic diagram which illustrates the modification of the laser beam irradiated from the upper direction of a fixing mechanism.

Explanation of symbols

  100a, 100b Joining member, 102, 102a, 104, 104a, 106, 106a Absorber, 108 region, 110, 110a, 112, 112a, 114, 114a Absorber, 118, 118a Absorber, 120 Adhesive, 122, 124 126, 128, 132, 134, 136 Absorber, 130 Absorber component, 138 Insulating material (high melting point material), 200 laser beam, 202 Auxiliary laser beam, 204, 205 Laser beam, 206 Auxiliary laser beam, 208, 209 Laser light, 220 image recognition optical system, 230 laser irradiation optical system, 240 optical fiber, 250 3-axis control stage, 260 laser oscillator, 260a excitation lamp, 270 switching power supply, 280 microcomputer for control, 285 communication path, 290 control controller Computer, 300a, 300b stage, 302 fixing mechanism, 310 fixing mechanism, 312 mounting table, 314 fixing unit, 316 opening, 318 axis

Claims (18)

  Laser light is irradiated to the end of the light absorbing material sandwiched between the first bonding member and the second bonding member, and the melted light absorbing material is ejected from the end to the outside to be solidified. A joining method comprising joining the first joining member and the second joining member. The light absorbing material includes a first light absorbing material and a second light absorbing material,
At least one of the first light-absorbing material and the second light-absorbing material, and the end adjacent to the region sandwiched between the first light-absorbing material and the second light-absorbing material The bonding method according to claim 1, wherein laser light is irradiated.   The bonding method according to claim 1, wherein the laser light is irradiated so that an edge of the light absorbing material is included in an irradiation region of the laser light.   The joining method according to any one of claims 1 to 3, wherein the laser light is further irradiated to the portion where the melted light-absorbing material is ejected after the ejection.   The surface treatment for roughening the surface is performed on at least one of the joining surfaces of the first joining member and the second joining member, where the melted light absorbing material is ejected. The joining method according to any one of 1 to 3.   Forming a coating layer on the joining surface of at least one of the first joining member and the second joining member to increase the adhesion strength of the light absorbing material. The joining method according to any one of claims 1 to 3. A laser oscillator that outputs laser light;
A laser irradiation optical system that condenses the laser light and irradiates the irradiated object;
A control stage for controlling the positional relationship between the irradiated object and the laser irradiation optical system;
The control stage is configured to irradiate the end portion of the absorber sandwiched between the first joining member and the second joining member based on the preset position information of the irradiated body so as to irradiate the laser beam. A control unit for controlling
A laser processing apparatus comprising: An image recognition optical system for acquiring an image of the irradiation unit;
The control stage controls the positional relationship between the irradiated object, the laser irradiation optical system, and the image recognition optical system,
8. The laser according to claim 7, wherein the control unit controls the control stage so as to irradiate the end portion with the laser beam based on the image acquired by the image recognition optical system. Processing equipment. The light absorbing material includes a first light absorbing material and a second light absorbing material,
The control unit is at least one end of the first light-absorbing material and the second light-absorbing material, and is adjacent to a region sandwiched between the first light-absorbing material and the second light-absorbing material The laser processing apparatus according to claim 7, wherein the control stage is controlled to irradiate the laser beam to the end portion. A fixing mechanism for fixing the irradiated object;
The fixing mechanism is
A mounting table for mounting the irradiated object;
A fixing portion provided with an opening through which the laser beam passes;
Have
The said fixing | fixed part shields a part of said laser beam, and irradiates only the laser beam which passed through the said opening part without the said shielding, The any one of Claims 7-9 characterized by the above-mentioned. The laser processing apparatus as described in one.   The laser processing according to any one of claims 7 to 10, wherein the control unit controls the control stage so that an end side of the light absorbing material is included in an irradiation region of the laser light. apparatus.   The said control part is controlled to irradiate the said laser beam after the said jetting also about the part which the said melt | dissolved light absorbing material jetted, The any one of Claims 7-11 characterized by the above-mentioned. Laser processing equipment. At least one of the first and second joining members having transparency to laser light;
First and second light absorbers sandwiched between the first joining member and the second joining member;
With
The laser at an end of at least one of the first light absorbing material and the second light absorbing material and adjacent to a region sandwiched between the first light absorbing material and the second light absorbing material. The light-absorbing material that has been irradiated with light and melted is ejected and solidified from the end portion to the region, and the upper and lower first joining members and the second joining member are joined. Bonding structure.   14. The light-absorbing material comprises a composite material of a light-absorbing material that absorbs the laser light and is heated and melted, and an adhesive that has a lower absorptance with respect to the laser light than the light-absorbing material. The joint structure according to the description. A heat insulating material whose thermal conductivity is lower than that of the light absorber and the adhesive, or a high melting point material whose melting point is higher than that of the light absorber and the adhesive;
The bonded structure according to claim 14, wherein the heat insulating material or the high melting point material is arranged around the light absorber.   The bonded structure according to claim 14 or 15, wherein the light absorber is disposed at the end.   At least one of the first joining member and the second joining member is formed by subjecting a joining surface of a portion from which the melted light-absorbing material is ejected to surface roughening. Item 18. The bonded structure according to any one of Items 13 to 16.   At least one of the first bonding member and the second bonding member is formed by forming a coating layer on the bonding surface of the portion from which the melted light absorbing material is ejected to increase the adhesion strength of the light absorbing material. The bonded structure according to any one of claims 13 to 16, wherein