WO2016106924A1 - 白光led模组 - Google Patents

白光led模组 Download PDF

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Publication number
WO2016106924A1
WO2016106924A1 PCT/CN2015/071709 CN2015071709W WO2016106924A1 WO 2016106924 A1 WO2016106924 A1 WO 2016106924A1 CN 2015071709 W CN2015071709 W CN 2015071709W WO 2016106924 A1 WO2016106924 A1 WO 2016106924A1
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WO
WIPO (PCT)
Prior art keywords
led chip
blue
red
string
green
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/071709
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English (en)
French (fr)
Inventor
陈玲艳
张彦学
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
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Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US14/438,220 priority Critical patent/US9803837B2/en
Publication of WO2016106924A1 publication Critical patent/WO2016106924A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/62—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using mixing chambers, e.g. housings with reflective walls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0008—Reflectors for light sources providing for indirect lighting
    • F21V7/0016—Reflectors for light sources providing for indirect lighting on lighting devices that also provide for direct lighting, e.g. by means of independent light sources, by splitting of the light beam, by switching between both lighting modes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20—Controlling the colour of the light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements characterised by the overall shape of the two-dimensional [2D] array
    • F21Y2105/16—Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements characterised by the overall shape of the two-dimensional [2D] array square or rectangular, e.g. for light panels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/20—Light sources with three-dimensionally disposed light-generating elements on convex supports or substrates, e.g. on the outer surface of spheres
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to the technical field of LED illumination, and in particular to a white LED module.
  • LED is a very competitive new energy-saving light source, which has gradually replaced traditional lighting sources. It has many advantages such as high efficiency, good light quality, high color purity, suitable voltage, low power consumption and long service life.
  • White LEDs generally use a blue chip to package a white LED with a yellow YAG phosphor, but the white light synthesized by this method lacks red light. The cold color is presented, and the YAG phosphor is susceptible to temperature degradation due to temperature, so it is considered to use RGB tricolor chips to combine into white LEDs.
  • the principle of the three primary colors is a technique of mixing RGB three ultra-high-brightness LEDs into white light, which does not need to be converted by phosphors, and is directly matched with white light by three-color crystal grains, in addition to avoiding better loss due to phosphor conversion loss.
  • the main shortcoming currently exists is the difficulty of mixing light. The user can easily observe a variety of different colors of light in front of the light source, and can see a colored shadow behind each of the shelters.
  • the present invention provides a white LED module capable of improving the light mixing effect of red, green and blue LED chips.
  • the present invention provides a white LED module, wherein the white LED module comprises a substrate and a red LED chip string, a blue LED chip string and a green LED chip string fixed on the substrate and arranged in parallel with each other.
  • the number of blue LED chips in the blue LED chip string is equal to the number of green LED chips in the green LED chip string, and the number of red LED chips in the red LED chip string is the number of blue LED chips and green light.
  • the number of LED chips is twice, and the white LED module further includes two pins, wherein a red LED chip string, a blue LED chip string, and two ends of the green LED chip string are respectively connected with a pin, and the white LED
  • the module further includes a reflective wall surrounding the red LED chip string, the blue LED chip string and the periphery of the green LED chip string, wherein the substrate is curved to enable the red LED chip, the blue LED chip and the green LED chip to be emitted At least part of the light is reflected by the reflective wall.
  • the red LED chip string comprises two red LED chips
  • the blue LED chip string comprises a blue LED chip
  • the green LED chip string comprises a green LED chip, wherein two red LED chips are connected in series with each other, and after being connected in series The two red LED chips are further connected in parallel with the blue LED chip and the green LED chip.
  • the substrate is arranged in a circular shape, and is divided into four sector-shaped regions by the center of the substrate, wherein two red LED chips, one blue LED chip and one green LED chip are respectively disposed on a sector region.
  • the two red LED chips are respectively disposed on two sector regions of the four sector regions that are not adjacently disposed.
  • the angle between the two red LED chips, one blue LED chip and one green LED chip and the center line is set to be equal.
  • the substrate gradually protrudes from the edge of the substrate toward the center of the substrate toward the light emitting direction of the white LED module.
  • the inner surface of the reflective wall is provided with a convex and concave reflective structure.
  • the red LED chip works at a voltage of 1.8-2.6V
  • the blue LED chip and the green LED chip work on Under the voltage of 2.8-3.6V.
  • the present invention provides a white LED module comprising a substrate and a red LED chip string, a blue LED chip string and a green LED chip string fixed on the substrate and arranged in parallel with each other, wherein the white LED module comprises: a substrate;
  • the number of blue LED chips in the blue LED chip string is equal to the number of green LED chips in the green LED chip string, and the number of red LED chips in the red LED chip string is the number of blue LED chips and the green LED The number of chips is doubled.
  • the white LED module further includes two pins, wherein two ends of the red LED chip string, the blue LED chip string and the green LED chip string are respectively connected to one pin.
  • the red LED chip string comprises two red LED chips
  • the blue LED chip string comprises a blue LED chip
  • the green LED chip string comprises a green LED chip, wherein two red LED chips are connected in series with each other, and after being connected in series The two red LED chips are further connected in parallel with the blue LED chip and the green LED chip.
  • the substrate is arranged in a circular shape, and is divided into four sector-shaped regions by the center of the substrate, wherein two red LED chips, one blue LED chip and one green LED chip are respectively disposed on a sector region.
  • the two red LED chips are respectively disposed on two sector regions of the four sector regions that are not adjacently disposed.
  • the angle between the two red LED chips, one blue LED chip and one green LED chip and the center line is set to be equal.
  • the white LED module further comprises a reflective wall surrounding the red LED chip string, the blue LED chip string and the green LED chip string periphery, wherein the substrate is curved to make the red LED chip, the blue LED chip and the green At least part of the light emitted by the light LED chip is reflected by the reflective wall.
  • the substrate gradually protrudes from the edge of the substrate toward the center of the substrate toward the light emitting direction of the white LED module.
  • the inner surface of the reflective wall is provided with a convex and concave reflective structure.
  • the red LED chip works at a voltage of 1.8-2.6V
  • the blue LED chip and the green LED chip work at a voltage of 2.8-3.6V.
  • the present invention provides a white LED module including a substrate and a red LED chip string, a blue LED chip string and a green light fixed on the substrate and arranged in parallel with each other.
  • LED chip string wherein the number of blue LED chips in the blue LED chip string is equal to the number of green LED chips in the green LED chip string, and the number of red LED chips in the red LED chip string is the blue LED chip.
  • the number and the number of green LED chips are twice as large, which can reduce the final connection to the external pins, and can improve the light mixing effect of the red, green and blue LED chips, and the required warm color can appear.
  • FIG. 1 is a schematic structural view of a white LED module according to a first embodiment of the present invention
  • FIG. 2 is a schematic circuit diagram of a first embodiment of a white LED module of the present invention.
  • FIG. 3 is a cross-sectional structural view of a white LED module according to a second embodiment of the present invention.
  • FIG. 4 is a schematic top plan view of a white LED module according to a second embodiment of the present invention.
  • FIG. 5 is a schematic diagram showing the circuit principle of a white LED module according to a second embodiment of the present invention.
  • FIG. 1 is a schematic structural diagram of a white LED module according to a first embodiment of the present invention.
  • 2 is a schematic diagram of the circuit principle of the first embodiment of the white LED module of the present invention.
  • the white LED module includes a substrate 10 and a red LED chip string 11 , a blue LED chip string 12 and a green LED chip string 13 fixed on the substrate 10 and arranged in parallel with each other, wherein the blue LED chip string 12
  • the number of blue LED chips is equal to the number of green LED chips in the green LED chip string 13, and the number of red LED chips in the red LED chip string 11 is the number of blue LED chips and the green LED chip. Two times the number.
  • the white LED module further includes two pins 14, 15 , wherein two ends of the red LED chip string 11 , the blue LED chip string 12 and the green LED chip string 13 are respectively connected to a pin 14 or 15 .
  • FIG. 3 is a schematic cross-sectional view of a white LED module according to a second embodiment of the present invention.
  • 4 is a schematic top plan view of a white LED module according to a second embodiment of the present invention.
  • FIG. 5 is a schematic diagram showing the circuit principle of a white LED module according to a second embodiment of the present invention.
  • the white LED module includes a substrate 20 and a red LED chip string, a blue LED chip string and a green LED chip string fixed on the substrate 20 and arranged in parallel with each other, and the red LED chip string includes two red
  • the blue LED chip string includes a blue LED chip 23, and the green LED chip string includes a green LED chip 24, wherein the two red LED chips 21 are connected in series with each other, and two red lights are connected in series
  • the LED chips 21, 22 are further connected in parallel with the blue LED chip 23 and the green LED chip 24.
  • the two red LED chips 21 and 22 are connected in series and then connected to the two ends of the blue LED chip 23 and the green LED chip 24 in parallel with the connecting pins 27 and 28, respectively.
  • the substrate 20 is disposed in a circular shape.
  • the top view of the substrate 20 is circular, and is divided into four sectoral regions A, B, C, and D by the center of the substrate 20, wherein two red lights are LED chips 21 and 22, a blue LED chip 23 and a green LED chip 24 are respectively disposed on a sector.
  • the red LED chip 21 is disposed on the sector area B
  • the red LED chip 22 is disposed on the sector area D
  • the blue LED chip 23 is disposed on the sector area C
  • the green LED chip 24 is disposed on the sector area A.
  • the two red LED chips 21, 22 are respectively disposed on the two sector regions B, D which are not adjacently disposed among the four sector regions A, B, C, D.
  • the angle between the two red LED chips 21 and 22, one blue LED chip 23 and one green LED chip 24 and the line connecting the center O is set to be equal.
  • the angle between the adjacent two lines is 90 degrees.
  • the white LED module further comprises a reflective wall 25 surrounding the red LED chip string, the blue LED chip string and the periphery of the green LED chip string, wherein the substrate 20 is curved to make the red LED chips 21, 22 At least part of the light emitted by the blue LED chip 23 and the green LED chip 24 is reflected by the reflective wall.
  • the reflective wall For example, of the light S1 and the light S2, only the light S1 is reflected by the reflective wall 25 and then emitted by the light exit surface, and the light S2 is directly emitted from the light exit surface.
  • the substrate 20 gradually protrudes from the edge of the substrate 20 toward the center of the substrate 20 toward the light-emitting direction of the white LED module.
  • the inner surface of the reflective wall 25 is provided with a convex and concave reflecting structure (not shown), and the inner surface is uneven, rather than a flat reflecting surface.
  • the inner surface of the reflective wall 25 may be disposed as a flat reflective surface by means of planar reflection.
  • the substrate 20 is formed into a curved surface to make the light emission more dispersed, and the inner surface of the reflective wall 25 is made into a concave-convex reflective structure, so that the light mixing is more uniform.
  • the red LED chips 21, 22 operate at a voltage of 1.8-2.6 V
  • the blue LED chip 23 and the green LED chip 24 operate at a voltage of 2.8-3.6 V.
  • the present invention provides a white LED module including a substrate and a red LED chip string, a blue LED chip string and a green LED chip string which are fixed on the substrate and arranged in parallel with each other, wherein the blue LED chip string
  • the number of blue LED chips is equal to the number of green LED chips in the green LED chip string
  • the number of red LED chips in the red LED chip string is twice the number of blue LED chips and the number of green LED chips. This can reduce the final connection to the external pins, and at the same time can improve the light mixing effect of the red, green and blue LED chips, and the required warm color can appear.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

一种白光LED模组，该白光LED模组包括基板（10）以及固定于基板（10）上且彼此并联设置的红光LED芯片串（11）、蓝光LED芯片串（12）以及绿光LED芯片串（13），其中蓝光LED芯片串（12）中的蓝光LED芯片的数量等于绿光LED芯片串（13）中的绿光LED芯片的数量，且红光LED芯片串（11）中的红光LED芯片的数量为蓝光LED芯片的数量和绿光LED芯片的数量的二倍。通过上述方式，能够提高红绿蓝三色LED芯片的混光效果。

Description

白光LED模组
【技术领域】
本发明涉及LED发光技术领域，特别是涉及一种白光LED模组。
【背景技术】
LED是一种极具竞争力的新型节能光源，有逐渐取代传统照明光源的趋势。它具有效率高、光线质量好、颜色纯度高、电压适宜且功耗低且使用寿命长等诸多优点。白光LED一般采用蓝色芯片与黄色YAG荧光粉一起封装合成白光LED的方法，但是此种方法合成的白光中缺少红光而 呈现冷色调，而且YAG荧光粉容易受温度的影响出现光衰现象，因此考虑采用RGB三色芯片来组合成白光LED。这种三基色的原理是将RGB三种超高亮度LED混合成白光的技术，不需要经过荧光粉的转换，由三色晶粒直接配成白光，除了避免因为荧光粉转换损失而得到较佳的发光效率外，更可以由分开控制三色LED的发光强度，取得全彩的变色效果（可变色温），并可由LED芯片波长及强度的选择得到较佳的演色性。但是目前存在的主要缺点就是混光困难。使用者在此光源前方各处可轻易观察到多种不同颜色的光，并且可以在各遮蔽物后方看到彩色的影子。
因此，需要提供一种白光LED模组，以解决上述技术问题。
【发明内容】
有鉴于此，本发明提供一种白光LED模组，能够提高红绿蓝三色LED芯片的混光效果。
为解决上述问题，本发明提供一种白光LED模组，其中，白光LED模组包括基板以及固定于基板上且彼此并联设置的红光LED芯片串、蓝光LED芯片串以及绿光LED芯片串，其中蓝光LED芯片串中的蓝光LED芯片的数量等于绿光LED芯片串中的绿光LED芯片的数量，且红光LED芯片串中的红光LED芯片的数量为蓝光LED芯片的数量和绿光LED芯片的数量的二倍，其中白光LED模组进一步包括两个引脚，其中红光LED芯片串、蓝光LED芯片串以及绿光LED芯片串的两端分别对应连接一引脚，且白光LED模组进一步包括围设于红光LED芯片串、蓝光LED芯片串以及绿光LED芯片串外围的反射壁，其中基板呈曲面设置，以使得红光LED芯片、蓝光LED芯片以及绿光LED芯片出射的至少部分光线被反射壁所反射。
其中，红光LED芯片串包括两个红光LED芯片，蓝光LED芯片串包括一个蓝光LED芯片，绿光LED芯片串包括一个绿光LED芯片，其中两个红光LED芯片彼此串联，且串联后的两个红光LED芯片进一步与蓝光LED芯片和绿光LED芯片并联。
其中，基板呈圆形设置，且以基板的圆心划分成四个扇形区域，其中两个红光LED芯片、一个蓝光LED芯片和一个绿光LED芯片分别对应设置于一扇形区域上。
其中，两个红光LED芯片分别设置于四个扇形区域中的不相邻设置的两个扇形区域上。
其中，两个红光LED芯片、一个蓝光LED芯片和一个绿光LED芯片与圆心的连线之间的夹角呈等大设置。
其中，基板从基板的边缘向基板中心逐渐向白光LED模组的出光方向突起。
其中，反射壁的内表面设置有凸凹的反射结构。
其中，红光LED芯片工作于1.8-2.6V的电压下，蓝光LED芯片和绿光LED芯片工作于 2.8-3.6V的电压下。
为解决上述问题，本发明提供一种白光LED模组，该白光LED模组包括基板以及固定于基板上且彼此并联设置的红光LED芯片串、蓝光LED芯片串以及绿光LED芯片串，其中蓝光LED芯片串中的蓝光LED芯片的数量等于绿光LED芯片串中的绿光LED芯片的数量，且红光LED芯片串中的红光LED芯片的数量为蓝光LED芯片的数量和绿光LED芯片的数量的二倍。
其中，白光LED模组进一步包括两个引脚，其中红光LED芯片串、蓝光LED芯片串以及绿光LED芯片串的两端分别对应连接一引脚。
其中，红光LED芯片串包括两个红光LED芯片，蓝光LED芯片串包括一个蓝光LED芯片，绿光LED芯片串包括一个绿光LED芯片，其中两个红光LED芯片彼此串联，且串联后的两个红光LED芯片进一步与蓝光LED芯片和绿光LED芯片并联。
其中，基板呈圆形设置，且以基板的圆心划分成四个扇形区域，其中两个红光LED芯片、一个蓝光LED芯片和一个绿光LED芯片分别对应设置于一扇形区域上。
其中，两个红光LED芯片分别设置于四个扇形区域中的不相邻设置的两个扇形区域上。
其中，两个红光LED芯片、一个蓝光LED芯片和一个绿光LED芯片与圆心的连线之间的夹角呈等大设置。
其中，白光LED模组进一步包括围设于红光LED芯片串、蓝光LED芯片串以及绿光LED芯片串外围的反射壁，其中基板呈曲面设置，以使得红光LED芯片、蓝光LED芯片以及绿光LED芯片出射的至少部分光线被反射壁所反射。
其中，基板从基板的边缘向基板中心逐渐向白光LED模组的出光方向突起。
其中，反射壁的内表面设置有凸凹的反射结构。
其中，红光LED芯片工作于1.8-2.6V的电压下，蓝光LED芯片和绿光LED芯片工作于2.8-3.6V的电压下。
通过上述方案，本发明的有益效果是：区别于现有技术，本发明通过设置白光LED模组包括基板以及固定于基板上且彼此并联设置的红光LED芯片串、蓝光LED芯片串以及绿光LED芯片串，其中蓝光LED芯片串中的蓝光LED芯片的数量等于绿光LED芯片串中的绿光LED芯片的数量，且红光LED芯片串中的红光LED芯片的数量为蓝光LED芯片的数量和绿光LED芯片的数量的二倍，这样可以减少最终连接到外面的引脚，同时可以提高红绿蓝三色LED芯片的混光效果，可以出现所需要的暖色。
【附图说明】
为了更清楚地说明本发明实施方式中的技术方案，下面将对实施方式描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。其中：
图1是本发明第一实施例的白光LED模组的结构示意图；
图2是本发明的白光LED模组的第一实施例的电路原理示意图；
图3是本发明第二实施例的白光LED模组的截面结构示意图；
图4是本发明第二实施例的白光LED模组的俯视结构示意图；
图5是本发明第二实施例的白光LED模组的电路原理示意图。
【具体实施方式】
下面将结合本发明实施方式中的附图，对本发明实施方式中的技术方案进行清楚、完整地描述，显然，所描述的实施方式仅仅是本发明一区域分实施方式，而不是全区域实施方式。基于本发明中的实施方式，本领域普通技术人员在没有做出创造性的劳动前提下所获得的所有其他实施方式，都属于本发明保护的范围。
请一并参阅图1和图2，图1是本发明第一实施例的白光LED模组的结构示意图。图2是本发明的白光LED模组的第一实施例的电路原理示意图。在本实施例中，白光LED模组包括基板10以及固定于基板10上且彼此并联设置的红光LED芯片串11、蓝光LED芯片串12以及绿光LED芯片串13，其中蓝光LED芯片串12中的蓝光LED芯片的数量等于绿光LED芯片串13中的绿光LED芯片的数量，且红光LED芯片串11中的红光LED芯片的数量为蓝光LED芯片的数量和绿光LED芯片的数量的二倍。
优选地，白光LED模组进一步包括两个引脚14、15，其中红光LED芯片串11、蓝光LED芯片串12以及绿光LED芯片串13的两端分别对应连接一引脚14或者15。
请一并参阅图3、图4和图5，图3是本发明第二实施例的白光LED模组的截面结构示意图。图4是本发明第二实施例的白光LED模组的俯视结构示意图。图5是本发明第二实施例的白光LED模组的电路原理示意图。在本实施例中，白光LED模组包括基板20以及固定于基板20上且彼此并联设置的红光LED芯片串、蓝光LED芯片串以及绿光LED芯片串，红光LED芯片串包括两个红光LED芯片21、22，蓝光LED芯片串包括一个蓝光LED芯片23，绿光LED芯片串包括一个绿光LED芯片24，其中两个红光LED芯片21彼此串联，且串联后的两个红光LED芯片21、22进一步与蓝光LED芯片23和绿光LED芯片24并联。其中两个红光LED芯片21和22串联后再与蓝光LED芯片23以及绿光LED芯片24的并联后的两端分别对应连接引脚27和28。
在本实施例中，基板20呈圆形设置，优选地，基板20的俯视图形为圆形，且以基板20的圆心划分成四个扇形区域A、B、C、D，其中两个红光LED芯片21和22、一个蓝光LED芯片23和一个绿光LED芯片24分别对应设置于一扇形区域上。红光LED芯片21设置在扇形区域B上，红光LED芯片22设置在扇形区域D上，蓝光LED芯片23设置在扇形区域C上，绿光LED芯片24设置在扇形区域A上。
优选地，两个红光LED芯片21、22分别设置于四个扇形区域A、B、C、D中的不相邻设置的两个扇形区域B、D上。
优选地，两个红光LED芯片21和22、一个蓝光LED芯片23和一个绿光LED芯片24与圆心O的连线之间的夹角呈等大设置。相邻两连线之间的夹角均为90度。
优选地，白光LED模组进一步包括围设于红光LED芯片串、蓝光LED芯片串以及绿光LED芯片串外围的反射壁25，其中基板20呈曲面设置，以使得红光LED芯片21、22、蓝光LED芯片23以及绿光LED芯片24出射的至少部分光线被反射壁所反射。例如，光线S1和光线S2中仅光线S1经反射壁25反射后由出光面射出，而光线S2直接由出光面射出。
优选地，基板20从基板20的边缘向基板20中心逐渐向白光LED模组的出光方向突起。
优选地，反射壁25的内表面设置有凸凹的反射结构（图未示），内表面是凹凸不平的，而不是平整的反射面。当然在其他实施例中也可以采用平面反射的方式将反射壁25的内表面设置为平整的反射面。本实施例将基板20做成曲面，使光线出射更为分散，并将反射壁25的内表面做成凹凸的反射结构，使得光线混合更加均匀
优选地，红光LED芯片21、22工作于1.8-2.6V的电压下，蓝光LED芯片23和绿光LED芯片24工作于2.8-3.6V的电压下。
区别于现有技术，本发明通过设置白光LED模组包括基板以及固定于基板上且彼此并联设置的红光LED芯片串、蓝光LED芯片串以及绿光LED芯片串，其中蓝光LED芯片串中的蓝光LED芯片的数量等于绿光LED芯片串中的绿光LED芯片的数量，且红光LED芯片串中的红光LED芯片的数量为蓝光LED芯片的数量和绿光LED芯片的数量的二倍，这样可以减少最终连接到外面的引脚，同时可以提高红绿蓝三色LED芯片的混光效果，可以出现所需要的暖色。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (18)

  1. 一种白光LED模组，其中，所述白光LED模组包括基板以及固定于所述基板上且彼此并联设置的红光LED芯片串、蓝光LED芯片串以及绿光LED芯片串，其中所述蓝光LED芯片串中的蓝光LED芯片的数量等于所述绿光LED芯片串中的绿光LED芯片的数量，且所述红光LED芯片串中的红光LED芯片的数量为所述蓝光LED芯片的数量和所述绿光LED芯片的数量的二倍，其中所述白光LED模组进一步包括两个引脚，其中所述红光LED芯片串、所述蓝光LED芯片串以及所述绿光LED芯片串的两端分别对应连接一所述引脚，且所述白光LED模组进一步包括围设于所述红光LED芯片串、蓝光LED芯片串以及绿光LED芯片串外围的反射壁，其中所述基板呈曲面设置，以使得所述红光LED芯片、所述蓝光LED芯片以及所述绿光LED芯片出射的至少部分光线被所述反射壁所反射。
  2. 根据权利要求1所述的白光LED模组，其中，所述红光LED芯片串包括两个红光LED芯片，所述蓝光LED芯片串包括一个蓝光LED芯片，所述绿光LED芯片串包括一个绿光LED芯片，其中所述两个红光LED芯片彼此串联，且串联后的所述两个红光LED芯片进一步与所述蓝光LED芯片和所述绿光LED芯片并联。
  3. 根据权利要求2所述的白光LED模组，其中，所述基板呈圆形设置，且以所述基板的圆心划分成四个扇形区域，其中所述两个红光LED芯片、所述一个蓝光LED芯片和所述一个绿光LED芯片分别对应设置于一所述扇形区域上。
  4. 根据权利要求3所述的白光LED模组，其中，所述两个红光LED芯片分别设置于所述四个扇形区域中的不相邻设置的两个扇形区域上。
  5. 根据权利要求3所述的白光LED模组，其中，所述两个红光LED芯片、所述一个蓝光LED芯片和所述一个绿光LED芯片与所述圆心的连线之间的夹角呈等大设置。
  6. 根据权利要求1所述的白光LED模组，其中，所述基板从所述基板的边缘向所述基板中心逐渐向所述白光LED模组的出光方向突起。
  7. 根据权利要求1所述的白光LED模组，其中，所述反射壁的内表面设置有凸凹的反射结构。
  8. 根据权利要求1所述的白光LED模组，其中，所述红光LED芯片工作于1.8-2.6V的电压下，所述蓝光LED芯片和所述绿光LED芯片工作于 2.8-3.6V的电压下。
  9. 一种白光LED模组，其中，所述白光LED模组包括基板以及固定于所述基板上且彼此并联设置的红光LED芯片串、蓝光LED芯片串以及绿光LED芯片串，其中所述蓝光LED芯片串中的蓝光LED芯片的数量等于所述绿光LED芯片串中的绿光LED芯片的数量，且所述红光LED芯片串中的红光LED芯片的数量为所述蓝光LED芯片的数量和所述绿光LED芯片的数量的二倍。
  10. 根据权利要求9所述的白光LED模组，其中，所述白光LED模组进一步包括两个引脚，其中所述红光LED芯片串、所述蓝光LED芯片串以及所述绿光LED芯片串的两端分别对应连接一所述引脚。
  11. 根据权利要求9所述的白光LED模组，其中，所述红光LED芯片串包括两个红光LED芯片，所述蓝光LED芯片串包括一个蓝光LED芯片，所述绿光LED芯片串包括一个绿光LED芯片，其中所述两个红光LED芯片彼此串联，且串联后的所述两个红光LED芯片进一步与所述蓝光LED芯片和所述绿光LED芯片并联。
  12. 根据权利要求11所述的白光LED模组，其中，所述基板呈圆形设置，且以所述基板的圆心划分成四个扇形区域，其中所述两个红光LED芯片、所述一个蓝光LED芯片和所述一个绿光LED芯片分别对应设置于一所述扇形区域上。
  13. 根据权利要求12所述的白光LED模组，其中，所述两个红光LED芯片分别设置于所述四个扇形区域中的不相邻设置的两个扇形区域上。
  14. 根据权利要求12所述的白光LED模组，其中，所述两个红光LED芯片、所述一个蓝光LED芯片和所述一个绿光LED芯片与所述圆心的连线之间的夹角呈等大设置。
  15. 根据权利要求9所述的白光LED模组，其中，所述白光LED模组进一步包括围设于所述红光LED芯片串、蓝光LED芯片串以及绿光LED芯片串外围的反射壁，其中所述基板呈曲面设置，以使得所述红光LED芯片、所述蓝光LED芯片以及所述绿光LED芯片出射的至少部分光线被所述反射壁所反射。
  16. 根据权利要求15所述的白光LED模组，其中，所述基板从所述基板的边缘向所述基板中心逐渐向所述白光LED模组的出光方向突起。
  17. 根据权利要求15所述的白光LED模组，其中，所述反射壁的内表面设置有凸凹的反射结构。
  18. 根据权利要求9所述的白光LED模组，其中，所述红光LED芯片工作于1.8-2.6V的电压下，所述蓝光LED芯片和所述绿光LED芯片工作于 2.8-3.6V的电压下。
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