WO2016106335A1 - Traitement de signal pour un canal de communication bidirectionnelle de capteur acoustique - Google Patents

Traitement de signal pour un canal de communication bidirectionnelle de capteur acoustique Download PDF

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Publication number
WO2016106335A1
WO2016106335A1 PCT/US2015/067413 US2015067413W WO2016106335A1 WO 2016106335 A1 WO2016106335 A1 WO 2016106335A1 US 2015067413 W US2015067413 W US 2015067413W WO 2016106335 A1 WO2016106335 A1 WO 2016106335A1
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WO
WIPO (PCT)
Prior art keywords
acoustic sensor
pin
data
send
audio output
Prior art date
Application number
PCT/US2015/067413
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English (en)
Inventor
Baris Cagdaser
Fariborz Assaderaghi
Original Assignee
Invensense, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/975,155 external-priority patent/US9749736B2/en
Application filed by Invensense, Inc. filed Critical Invensense, Inc.
Priority to CN201580069718.9A priority Critical patent/CN107258088B/zh
Publication of WO2016106335A1 publication Critical patent/WO2016106335A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Definitions

  • the subject disclosure generally relates to acoustic sensors, but not limited to, signal processing for an acoustic sensor bi-directional communication channel.
  • MEMS micro-electro-mechanical system
  • Figure 1 illustrates a block diagram of an acoustic sensor comprising a bidirectional communication component configured to send and/or receive data that has been superimposed on an audio output, in accordance with various embodiments;
  • Figure 2 illustrates a block diagram of an acoustic sensor comprising a common mode signal component for sending data that has been superimposed on an audio output, in accordance with various embodiments
  • Figure 3 illustrates waveforms representing differential mode audio output signaling of respective pins and common mode data signaling on the respective pins, in accordance with various embodiments
  • Figure 4 illustrates a block diagram of an acoustic sensor comprising a time division multiplexing component for sending and/or receiving data that has been
  • Figure 5 illustrates a waveform representing data that has been superimposed on an audio output utilizing time division multiplexing, in accordance with various embodiments
  • Figure 6 illustrates a block diagram of an acoustic sensor comprising a signal processing component for sending an audio output using a pin, and based on time division multiplexing, sending and/or receiving data using another pin;
  • Figure 7 illustrates a block diagram of an acoustic sensor comprising a frequency separation component for sending and/or receiving data based on a defined frequency range that is outside/substantially outside an audio band corresponding to an audio output;
  • Figure 8 illustrates waveforms representing a frequency spectrum of data that has been superimposed on an audio output based on a decimation filter employed in a host system, and a transfer function of the decimation filter, respectively, in accordance with various embodiments;
  • Figure 9 illustrates a block diagram of an acoustic sensor comprising a frequency separation component for sending and/or receiving, via a first pin, data based on a defined frequency range that is outside/substantially outside of an audio band corresponding to an audio output of a second pin;
  • Figure 10 illustrates a block diagram of an acoustic sensor comprising a power line communication component for sending/receiving data via a power and/or ground pin, in accordance with various embodiments.
  • Figure 11 illustrates a flow chart of a method associated with an acoustic sensor, in accordance with various embodiments.
  • an acoustic sensor can comprise a MEMS transducer, e.g.,
  • the MEMS transducer can be configured to generate, based on an acoustic pressure, an audio output.
  • the bidirectional communication component can be configured to send and/or receive data that has been superimposed on the audio output using common mode signaling, time division multiplexing, or frequency separation.
  • the MEMS transducer can comprise a signal processing component that can be configured to send the audio output directed to an external device, e.g., a coder-decoder (codec), a digital signal processor (DSP), etc. utilizing differential mode signaling between a first pin of the acoustic sensor and a second pin of the acoustic sensor.
  • the signal processing component can be configured to send the data utilizing common mode signaling according to a sum of respective voltages of the first pin and second pin.
  • the signal processing component can be configured, based on the time division multiplexing, to send the audio output directed to the external device during a first defined period of time, and send or receive the data during a second defined period of time, e.g., during which loss of audio information can be substantially compensated for, minimized, etc.
  • the signal processing component can be configured, based on the time division multiplexing, to send the audio output directed to the external device utilizing a pin of the acoustic sensor. Further, the signal processing component can be configured to send and/or receive the data utilizing the pin. [0022] In yet another embodiment, the signal processing component can be configured, based on the time division multiplexing, to send the audio output directed to the external device utilizing a first pin of the acoustic sensor, and send or receive the data utilizing a second pin of the acoustic sensor.
  • the signal processing component can be configured, based on the frequency separation, to send or receive the data based on a defined frequency range that is outside an audio band corresponding to the audio output, and/or substantially outside the audio band.
  • the defined frequency range corresponds to a notch of a decimation filter of an external device coupled to the acoustic sensor, a defined stopband of a band-stop filter of the external device, etc.
  • the signal processing component can be configured, based on the frequency separation, to send the audio output directed to the external device utilizing a pin of the acoustic sensor, and send or receive the data utilizing the pin.
  • the signal processing component can be configured, based on the frequency separation, to send the audio output directed to the external device utilizing a first pin of the acoustic sensor, and send or receive the data utilizing a second pin.
  • the acoustic sensor can comprise a power line
  • a communication component configured to send and/or receive communication data utilizing a power pin and/or a ground pin of the acoustic sensor.
  • a method can comprise generating, by an acoustic sensor, an audio output corresponding to an acoustic pressure applied to a MEMS transducer; and sending and/or receiving, by the acoustic sensor, data that has been superimposed on the audio output based on common mode signaling, time division multiplexing, or frequency separation.
  • the method can comprise sending, by the acoustic sensor, the audio output directed to an external device using differential signaling between a first pin of the system and a second pin of the system, and sending, based on the common mode signaling, the data based on a sum of respective voltages of the first pin and the second pin.
  • the sending and/or receiving the data based on the time division multiplexing can comprise sending the audio output directed to an external device during a first time period, and sending or receiving the data during a second time period.
  • the sending the audio output comprises sending the audio output directed to the external device during the first time period using a pin of the acoustic sensor.
  • the sending or receiving the data during the second time period comprises sending or receiving the data during the second time period using the pin.
  • the sending or receiving the data based on the frequency separation comprises sending or receiving the data based on a defined frequency range that is outside an audio band corresponding to the audio output, or substantially outside the audio band.
  • the sending or receiving the data based on the defined frequency range comprises sending or receiving the data based on a defined stopband of a band-stop filter of an external device coupled to the acoustic sensor, a notch of a decimation filter of the external device, etc.
  • the sending or receiving the data based on the defined frequency range can comprise sending the audio output directed to the external device using a pin of the acoustic sensor, and sending or receiving the data using the pin.
  • the method can further comprise sending and/or receiving, by the acoustic sensor, communication data, e.g., associated with the data, bi-directional communication component 130, etc. using a power pin of the acoustic sensor and/or a ground pin of the acoustic sensor.
  • a system can comprise an acoustic transducer configured to convert an acoustic signal into an audio output; and a bi-directional communication component configured to send and/or receive data that has been superimposed on the audio output based on a common mode transmission, a time division multiplexing transmission, or frequency separation.
  • the system can comprise a signal processing component configured to send, via a pin of the system, the audio output directed to an external device, and based on at least one of the time division multiplexing transmission or the frequency separation, send and/or receive the data via the pin.
  • aspects of apparatus, devices, systems, processes, and process blocks explained herein can constitute machine-executable instructions embodied within a machine, e.g., embodied in a memory device, computer readable medium (or media) associated with the machine. Such instructions, when executed by the machine, can cause the machine to perform the operations described. Additionally, aspects of the apparatus, devices, systems, processes, and process blocks can be embodied within hardware, such as an application specific integrated circuit (ASIC) or the like. Moreover, the order in which some or all of the process blocks appear in each process should not be deemed limiting. Rather, it should be understood by a person of ordinary skill in the art having the benefit of the instant disclosure that some of the process blocks can be executed in a variety of orders not illustrated.
  • ASIC application specific integrated circuit
  • exemplary and/or “demonstrative” is used herein to mean serving as an example, instance, or illustration.
  • the subject matter disclosed herein is not limited by such examples.
  • any aspect or design described herein as “exemplary” and/or “demonstrative” is not necessarily to be construed as preferred or advantageous over other aspects or designs, nor is it meant to preclude equivalent exemplary structures and techniques known to those of ordinary skill in the art having the benefit of the instant disclosure.
  • acoustic sensor 110 comprises MEMS transducer 120, bi-directional communication component 130, signal processing component 140, and input/output (I O) 150.
  • MEMS transducer 120 can be in contact with an acoustic pressure, and variations in the acoustic pressure can cause change(s) in electrical parameter(s) of MEMS transducer 120.
  • MEMS transducer 120 can be formed from, e.g., a diaphragm, a suspended plate, etc.
  • an increase or decrease of the acoustic pressure can bend the diaphragm, or cause a translational displacement of the suspended plate, and MEMS transducer 120 can represent corresponding change(s) in the electrical parameter(s) via an audio output signal.
  • the electrical parameter(s) can comprise a capacitance change representing a bending of the diaphragm or displacement of the suspended plate.
  • Signal processing component 140 can generate, based on the audio output signal generated by MEMS transducer 120, an electrical output signal, audio data, audio out, etc. representing the acoustic pressure. Further, signal processing component 140 can send the audio data to various components of acoustic sensor 110, e.g., amplifier(s), a non- volatile memory, a digital interface (DIF), etc. (not shown) (see e.g. related text of parent U.S. Patent Application No. 14/074,587 incorporated by reference herein), and exchange the audio data with a device that is external to acoustic sensor 110, e.g., a host, a DSP, processor, etc. (not shown) utilizing electrical interface pins (e.g., 250, 260, 420, 610) (see below) of I/O 150.
  • a device that is external to acoustic sensor 110 e.g., a host, a DSP, processor, etc.
  • Bi-directional communication component 130 can comprise the DIF, which can be used to send/receive data, communication data, etc. to/from registers, non- volatile memory, etc. (not shown) of acoustic sensor 110, e.g., for testing, configuring, trimming, obtaining information from, etc. various components of acoustic sensor 110.
  • signal processing component 140 can send/receive the communication data (e.g. DATA, DATA OUT, etc.) between acoustic sensor 110 and an external device (not shown) using common electrical interface pins(s) of I/O 150.
  • signal processing component 140 can superimpose, e.g., using logic, switches, multiplexers, demultiplexers, etc. (not shown) the communication data on the audio data using common mode signaling, time division multiplexing, or frequency separation.
  • signal processing component 140 can send, based on an audio output received from MEMS transducer 120, the audio output as a differential output signal, e.g., "+ AUDIO OUT" and "-AUDIO OUT", using electrical interface pins 250 and 260.
  • common mode signal component 210 can send the communication data, e.g., "DATA OUT", to an external device (not shown) utilizing common mode signaling comprising a sum of respective voltages of electrical interface pins 250 and 260.
  • the audio output e.g., "AUDIO OUT”
  • the communication data e.g., "DATA OUT”
  • the communication data comprises the sum of the "+AUDIO OUT” and "- AUDIO OUT” waveforms.
  • signal processing component can receive the communication data, e.g., "DATA”, "DATA IN”, etc. from the external device utilizing the common mode signaling.
  • electrical interface pins 250 and 260 can comprise bi-directional input/output pins
  • acoustic sensor can comprise receiver(s), amplifier(s), comparator(s), analog-to-digital converter(s), etc. (not shown) to decode, convert, etc. the common mode data into a standard logic level signal that can be input to bidirectional communication component 130.
  • power line communication component 220 can be configured to receive, via power pin 240, e.g., a power pin or a ground pin of power supply interface (PWR) 230, communication data from the external device.
  • power line communication component 220 can include a data and clock conditioning circuit (not shown) (see e.g. related text of parent U.S. Patent Application No. 14/074,587 incorporated by reference herein), that can translate communication data encoded onto power pin 240 into a standard logic level signal that can be input to bi-directional communication component 130.
  • the data and clock conditioning circuit can utilize a high frequency carrier and amplitude shift key signaling scheme superimposed on power. (See e.g. Figure 3 and related text of parent U.S. Patent Application No. 14/074,587 incorporated by reference herein).
  • the data and clock conditioning circuit can utilize a pass-band signaling scheme superimposed on power. (See e.g. Figure 4 and related text of parent U.S. Patent Application No. 14/074,587 incorporated by reference herein).
  • the data and clock conditioning circuit can utilize a baseband signaling scheme superimposed on power. (See e.g. Figure 5 and related text of parent U.S. Patent Application No. 14/074,587 incorporated by reference herein).
  • FIG. 4 illustrates a block diagram (400) of an acoustic sensor comprising a time division multiplexing component (410) for sending and/or receiving data that has been superimposed on an audio output, in accordance with various embodiments.
  • time division multiplexing component 410 can be configured to send the audio output, e.g., "AUDIO OUTPUT", directed to an external device (not shown) during a first defined period of time.
  • time division multiplexing component 410 can be configured to send or receive the communication data, e.g., "DATA”, "DATA IN”, “DATA OUT”, etc.
  • bi-directional electrical interface pin 420 e.g., reducing or substantially reducing interference between the communication data and the audio output data, e.g., due to supply, ground, etc. layout imperfections, package limitations, etc.
  • time division multiplexing component 410 can be configured to send the audio output directed to the external device utilizing a pin, e.g., electrical interface pin 410, and send or receive the communication data utilizing the same pin.
  • a pin e.g., electrical interface pin 410
  • time division multiplexing component 410 can be configured to send the audio output directed to the external device utilizing a first pin, e.g., electrical interface pin 610, and send or receive the data utilizing a different, or second, pin, e.g., bi-directional electrical interface pin 620.
  • FIG. 7 a block diagram (700) of an acoustic sensor comprising a frequency separation component (710) for sending and/or receiving data based on a defined frequency range that is outside, or substantially outside, an audio band, e.g., 20Hz to 20kHz, corresponding to an audio output is illustrated, in accordance with various embodiments.
  • frequency separation component 710 can be configured to send or receive the data, e.g., pulse-density modulation (PDM) audio data, based on a defined frequency range that is outside an audio band corresponding to the audio output, or substantially outside the audio band.
  • the defined frequency range can correspond to a notch of a decimation filter of an external device (not shown) coupled to the acoustic sensor, a defined stopband of a band-stop filter of the external device, etc.
  • frequency separation component 710 can receive, from the external device via the communication data, e.g., in the form of a clock signal, frequency information representing the notch, the defined stopband, etc. Further, frequency separation component 710 can send or receive the data based on the frequency information.
  • signal processing component 140 can be configured to send the audio output directed to the external device utilizing bi-directional electrical interface pin 420, and send or receive the communication data - according to the defined frequency range - utilizing the same pin.
  • signal processing component 140 can be configured to send the audio output directed to the external device utilizing a first pin, e.g., electrical interface pin 610, and send or receive the communication data - according to the defined frequency range - utilizing a second pin, e.g., bi-directional electrical interface pin 620.
  • FIG. 10 illustrates a block diagram (1000) of an acoustic sensor comprising a power line communication component (220) for sending and/or receiving data via a power pin (240), in accordance with various embodiments.
  • power line communication component 220 can include a data and clock conditioning circuit to translate communication data encoded onto power pin 240 into a standard logic level signal that can be input to bi-directional communication component 130.
  • power line communication component 220 can transmit communication data, data, etc., e.g., received from bi-directional communication component 130, in the form of a load current through power pin 240 - the data output converted into current pulses.
  • a data input and/or data clock can be received, via power pin 240, as superimposed voltage signals.
  • MEMS transducer 120 and other components of acoustic sensor 110 can be fully integrated in a single die, implemented on separate dies in which MEMS transducer 120 and the other components are interconnected via additional pins and bond wires, etc.
  • acoustic sensor 110 can be coupled to a host system (not shown), e.g., a codec, a DSP, a processor, etc. via I/O 150.
  • the host system can be a tester used during production and characterization of acoustic sensor 110, an external device that acquires/sends an acoustic sensor output, communication data, etc.
  • Figure 11 illustrates a methodology in accordance with the disclosed subject matter.
  • the methodology is depicted and described as a series of acts. It is to be understood and appreciated that various embodiments disclosed herein are not limited by the acts illustrated and/or by the order of acts. For example, acts can occur in various orders and/or concurrently, and with other acts not presented or described herein. Furthermore, not all illustrated acts may be required to implement the methodologies in accordance with the disclosed subject matter. In addition, those skilled in the art will understand and appreciate that the methodologies could alternatively be represented as a series of interrelated states via a state diagram or events.
  • process 1100 performed by an acoustic sensor
  • the acoustic sensor can generate an audio output corresponding to an acoustic pressure applied to a MEMS transducer.
  • the acoustic sensor can send and/or receive data that has been superimposed on the audio output based on common mode signaling, time division multiplexing, or frequency separation.
  • processor can refer to substantially any computing processing unit or device comprising, but not limited to comprising, single-core processors; single-processors with software multithread execution capability; multi-core processors; multi-core processors with software multithread execution capability; multi-core processors with hardware multithread technology; parallel platforms; and parallel platforms with distributed shared memory.
  • a processor can refer to an integrated circuit, a codec, an application specific integrated circuit (ASIC), a digital signal processor (DSP), a field programmable gate array (FPGA), a programmable logic controller (PLC), a complex programmable logic device (CPLD), a discrete gate or transistor logic, discrete hardware components, or any combination thereof.
  • ASIC application specific integrated circuit
  • DSP digital signal processor
  • FPGA field programmable gate array
  • PLC programmable logic controller
  • CPLD complex programmable logic device
  • a processor can exploit nano-scale architectures such as, but not limited to, molecular and quantum-dot based transistors, switches and gates, e.g., in order to optimize space usage or enhance performance of mobile devices.
  • a processor can also be implemented as a combination of computing processing units, devices, etc.
  • memory can include volatile memory and/or nonvolatile memory.
  • volatile memory can include random access memory (RAM), which can act as external cache memory.
  • RAM random access memory
  • RAM can include synchronous RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), Synchlink DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct Rambus dynamic RAM (DRDRAM), and/or Rambus dynamic RAM (RDRAM).
  • non-volatile memory can include read only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable ROM (EEPROM), or flash memory.
  • ROM read only memory
  • PROM programmable ROM
  • EPROM electrically programmable ROM
  • EEPROM electrically erasable ROM
  • flash memory any other suitable types of memory.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Circuit For Audible Band Transducer (AREA)

Abstract

La présente invention concerne un traitement de signal pour un canal de communication bidirectionnelle de capteur acoustique. Le capteur acoustique peut comprendre un transducteur de système microélectromécanique (MEMS) configuré pour générer, sur la base d'une pression acoustique, une sortie audio ; et un composant de communication bidirectionnelle configuré pour envoyer et/ou recevoir des données qui ont été superposées sur la sortie audio à l'aide d'une signalisation en mode commun, d'un multiplexage par répartition dans le temps, ou d'une séparation de fréquences. Selon un exemple, un composant de traitement de signal est configuré pour envoyer la sortie audio dirigée vers un dispositif externe par utilisation d'une signalisation en mode différentiel entre des broches respectives du capteur acoustique ; et envoyer les données par utilisation de la signalisation en mode commun comprenant une somme de tensions des broches respectives. Selon d'autres exemples, le composant de traitement de signal est configuré pour envoyer et/ou recevoir les données, et envoyer la sortie audio, durant différentes périodes de temps ; ou envoyer les données sur la base d'une plage de fréquences à l'extérieur d'une bande audio.
PCT/US2015/067413 2014-12-22 2015-12-22 Traitement de signal pour un canal de communication bidirectionnelle de capteur acoustique WO2016106335A1 (fr)

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Application Number Priority Date Filing Date Title
CN201580069718.9A CN107258088B (zh) 2014-12-22 2015-12-22 用于声传感器双向通信信道的信号处理

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US201462095108P 2014-12-22 2014-12-22
US62/095,108 2014-12-22
US14/975,155 US9749736B2 (en) 2013-11-07 2015-12-18 Signal processing for an acoustic sensor bi-directional communication channel
US14/975,155 2015-12-18

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CN111200775B (zh) * 2018-11-19 2021-03-05 广州汽车集团股份有限公司 音频接口电路、电路组、汽车和音频接入方法

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CN107258088A (zh) 2017-10-17

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