WO2016101901A1 - 一种led显示模块及其制备方法 - Google Patents

一种led显示模块及其制备方法 Download PDF

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Publication number
WO2016101901A1
WO2016101901A1 PCT/CN2015/098650 CN2015098650W WO2016101901A1 WO 2016101901 A1 WO2016101901 A1 WO 2016101901A1 CN 2015098650 W CN2015098650 W CN 2015098650W WO 2016101901 A1 WO2016101901 A1 WO 2016101901A1
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WO
WIPO (PCT)
Prior art keywords
board
driving pcb
frame
display module
sub
Prior art date
Application number
PCT/CN2015/098650
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English (en)
French (fr)
Inventor
黄福强
Original Assignee
深圳市晶泓达光电工程技术有限公司
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Publication of WO2016101901A1 publication Critical patent/WO2016101901A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements

Definitions

  • the invention relates to the field of LED display, in particular to an LED display module and a preparation method thereof.
  • LED displays Due to its flexible size and adaptability to the environment, LED displays are widely used in the media field.
  • LED display devices commonly used in the market are generally black box-type, light bar screen, screen-cut structure and strip structure.
  • the display module has high permeability, good lighting perspective effect, and at the same time maintains a certain pixel density, while the black box type, the light bar screen, and the grid screen structure structure LED
  • the display device cannot be coordinated with the surrounding environment, such as box-type LEDs installed on the glass curtain wall and the background wall. The display device will completely block the light, lose the effect of light transmission, and the light bar screen and the deleted screen are difficult to meet the glass curtain wall structure of various sizes.
  • this LED screen is the LED
  • the light-emitting unit is mounted on a strip-shaped circuit board and then fixed in an opaque outer casing.
  • a plurality of such light strips form a unit module, and a plurality of unit modules are cascaded into a display screen.
  • the opaque housing occupies a large space, the pixel pitch of such a unit module generally needs to be 40 mm.
  • the above has a certain light transmission effect, but the pixel pitch is too large to be suitable for applications with a small viewing distance.
  • the opaque display module strip structure is very obvious, whether it is installed indoors or outdoors, it will give people a sense of restraint. It is not suitable for high-end applications such as shop windows, shopping malls, glass curtain walls, etc. High pixel density and high permeability LED Display.
  • the object of the present invention is to overcome the deficiencies of the above-mentioned existing similar product structures and to provide an LED.
  • the display module and its preparation method are intended to provide an LED display module having both high pixel density and high permeability.
  • an LED is provided Display module, including a plurality of lamp beads, linearly arranged lamp beads, linearly arranged drive PCB a plate, a frame, a transparent glass plate, a connecting plate and a fixing member, wherein the plurality of lamp beads are fixed on the surface of the lamp bead board, and the lamp bead board is fixed on the driving PCB board, the lamp bead board The board surface is perpendicular to the drive PCB Board surface, the drive PCB The board is fixed on the connecting board, the connecting board includes a first sub-connecting board and a second sub-connecting board disposed at one end of the driving board, the frame is fixed to the glass board, and the driving a PCB board surface is perpendicular to the glass board surface, the fixing member is fixed on the frame, and the frame is included in the driving PCB a first sub-frame at the top of the board and a second sub-frame at the bottom of the driving PCB board, the first sub-frame and the second
  • the plurality of lamp beads are equidistantly arranged on the surface of the lamp bead board.
  • the axial direction of the light emitting plane of the lamp bead is perpendicular to the planar direction of the transparent glass plate.
  • a connecting pin holder is respectively disposed at two ends of the driving PCB board, and the driving PCB The board is fixedly connected to the first sub-connecting board and the second sub-connecting board through the connecting pin holder, and the driving PCB board surface is perpendicular to the first sub-connecting board surface and the second sub-connecting board surface .
  • a method of fabricating an LED display module comprising the steps of:
  • the lamp pin plate pin is soldered to drive the PCB board by means of a tray;
  • the thickness of the lamp bead board and the driving PCB board are both 0.5-1.5 mm, and the lamp bead board and the driving PCB
  • the length of the board is 315-325mm.
  • the connecting plate has a thickness of 1.5 to 2.5 mm, and the connecting plate has a height of 155 to 165 mm.
  • the fixing member and the frame are made of aluminum alloy, and the lamp bead, the driving PCB board and the connecting board are made of glass fiber.
  • the glass sheet is a highly transparent homogeneous substrate made of PMMA polymer material.
  • the invention adopts a transparent glass plate with high transparency as a mounting body
  • the driver PCB By placing the driver PCB laterally on the transparent glass plate, it can greatly reduce the shielding of the light from the driving PCB and improve the LED.
  • the transparency of the module is displayed, and at the same time, the density of the pixels of the LED display module is increased by fixing a plurality of beads to the surface of the linearly arranged lamp bead.
  • FIG. 1 is a perspective view of an LED display module according to an embodiment of the present invention.
  • Figure 2 is an enlarged schematic view of A in Figure 1.
  • FIG. 3 is an exploded perspective view of an LED display module according to an embodiment of the present invention.
  • Figure 4 is an enlarged schematic view of B in Figure 3.
  • FIG. 5 is a front elevational view of an LED display module according to an embodiment of the present invention.
  • Figure 6 is an enlarged schematic view of the portion C in Figure 5.
  • FIG. 7 is a top plan view of an LED display module provided by the present invention.
  • Figure 8 is an enlarged schematic view of D in Figure 7.
  • Figure 9 is a bottom plan view of the LED display module provided by the present invention.
  • Figure 10 is an enlarged schematic view of E in Figure 9.
  • Figure 11 is a left top plan view of the LED display module provided by the present invention.
  • Figure 12 is a right top plan view of the LED display module provided by the present invention.
  • FIG. 13 is a flowchart of a method for preparing an LED display module according to an embodiment of the present invention.
  • the display module comprises a plurality of lamp beads, a linearly arranged lamp bead 2, a linearly arranged driving PCB board 3, a frame 4, a transparent glass plate 5, a connecting plate 6 and a fixing member 7, and the plurality of lamp beads 1 are fixed to the lamp Bead board 2
  • the lamp bead 2 is fixed on the driving PCB board 3
  • the board surface of the lamp board 2 is perpendicular to the board surface of the driving PCB board 3
  • the driving PCB board 3 is fixed on the connecting board 6, and the connecting board 6 is disposed on the driving PCB.
  • the frame 4 is fixed on the glass plate 5
  • the driving PCB board 3 board surface is perpendicular to the glass board 5 board surface
  • the fixing member 7 is fixed to the frame 4 On.
  • a plurality of lamp beads 1 are arranged equidistantly on the surface of the bead plate 2, and a plurality of lamp beads 1 are disposed on the surface of the lamp bead plate 2 to ensure the LEDs.
  • the pixel density of the display module, the lamp bead 1 is preferably 3528, and 3528 lamp beads 1 are patched on the surface of the bead plate 2 by means of an automated patch.
  • the fixing member 7 includes a first sub-fixing member 71 and a second sub-fixing member 72 disposed at one end of one side of the bezel 4, and the first sub-fixing member 71 And the second sub-fixing member 72 is U-shaped, and the first sub-mounting member 71 includes a first bottom plate 711, a first side plate 712, a second side plate 713 and a first horizontal plate 714, a first side plate 712 and a first Two side panels 713 The bottom portions are respectively connected to opposite sides of the first bottom plate 711, and the first horizontal plate 714 is disposed on the top side of the second side plate 713 and extends outward.
  • the first bottom plate 711, the first side plate 712 and the second Side panel 713 A space for accommodating the first sub-connecting plate 61 is formed, and the second sub-mount 72 includes a second bottom plate 721, a third side plate 722, a fourth side plate 723, and a second horizontal plate 724, and the third side plate 722
  • the bottom of the fourth side plate 723 is respectively connected to the opposite sides of the second bottom plate 721.
  • the second horizontal plate 724 is disposed on the top side of the third side plate 722 and extends outward.
  • the driving PCB board 3 is provided with a first fixing block 31 on the board surface, and the driving PCB board 3 is adjacent to the frame 4
  • the second fixing block 32 is provided on one side, and the fastening of the driving PCB board 3 can be further improved by the arrangement of the first fixing block 31 and the second fixing block 32, since the first fixing block 31 and the second fixing block 32 are Made of PMMA polymer material, the first fixing block 31 and the second fixing block 32 have high transparency, so that the first fixing block 31 and the second fixing block 32 can serve as the fixed driving PCB board 3 At the same time, it does not affect the transparency of the LED display module.
  • the bezel 4 includes a first sub-frame 41 on the top of the drive PCB board 3 and is located on the drive PCB board 3
  • the second sub-frame 42 at the bottom, the first sub-frame 41 and the second sub-frame 42 are both L-shaped, and the first sub-frame 41 includes a first surface 411 and a second surface 412, and the first surface 411 is disposed on the driving PCB board 3
  • the second surface 412 is disposed on the surface of the driving PCB board 3
  • the second sub-frame 42 includes a third surface 421 and a fourth surface 422, and the third surface 421 is disposed on the driving PCB board 3.
  • the fourth side 422 is disposed on the surface of the driving PCB board 3.
  • a plurality of spaced-apart transparent holes 43 are disposed on the second surface 412 and the third surface 421, and the transparent holes 43 are disposed.
  • the setting can reduce the weight of the LED display module and increase the transparency of the LED display module.
  • the driving PCB board 3 is provided with a first fixing block 31 on the board surface, and the driving PCB board 3 is adjacent to the frame 4
  • One side is provided with a second fixing block 32 and the second fixing block 32 extends out of the edge of the driving PCB board 3.
  • the driving PCB board 3 can be raised by the arrangement of the first fixing block 31 and the second fixing block 32, and the PCB board 3 can be improved.
  • the first fixing block 31 and the second fixing block 32 are made of PMMA polymer material, the first fixing block 31 and the second fixing block 32 have high transparency, and thus, the first fixing block 31 And the second fixing block 32 can play the fixed driving PCB board 3 without affecting the transmittance of the LED display module.
  • the width of the cross section of the lamp bead 1 is equivalent to the width of the plate surface of the bead plate 2, due to the width of the cross section of the lamp bead 1 and the bead plate 2
  • the width of the board surface is equivalent, so that the light shielding of the lamp bead 1 can be avoided, and the transparency of the LED display module can be ensured.
  • the axial direction of the light-emitting plane of the lamp bead 1 is perpendicular to the plane direction of the transparent glass plate 5, which can be improved
  • the brightness of the LED display module saves the space occupied by the drive circuit.
  • the driving PCB board 3 is respectively provided with a connecting pin holder 33 at both ends thereof to drive the PCB board 3
  • the first sub-connecting plate 61 and the second sub-connecting plate 62 are fixedly connected by the connecting pin holder 33, and the driving PCB board 3 is perpendicular to the first sub-connecting plate 61 and the second sub-connecting plate 62.
  • the LED display module provided by the invention has a glass plate 5 with high transparency as a mounting body, and the lamp bead 1 is fixed to the lamp bead plate 2
  • the lamp bead 2 is fixed on the driving PCB board 3
  • the board surface of the lamp bead board 2 is perpendicular to the board surface of the driving PCB board 3
  • the driving PCB board 3 is fixed on the connecting board 6 to drive the PCB board 3
  • the board surface is perpendicular to the surface of the glass plate 5, so that by arranging the driving PCB board 3 laterally on the glass board 5, it can greatly reduce the shielding of the light by the driving PCB board 3, and the LED is improved.
  • the transparency of the module is displayed, and the pixel density of the LED display module is increased by fixing a plurality of bead 1 to the surface of the linearly arranged bead plate 2.
  • an embodiment of the present invention provides a method for preparing an LED display module, and a flow chart of the preparation method is provided.
  • the method includes the following steps:
  • the lamp pin plate pin is soldered and driven on the PCB board by a tray fixing;
  • the thickness of the lamp bead board and the driving PCB board are both 0.5-1.5 mm
  • the lamp bead board and the driving PCB The length of the board is 315-325 mm
  • the thickness of the lamp bead board and the driving PCB board are both preferably 1 mm
  • the length of the lamp bead board and the driving PCB board are both preferably 320 mm.
  • the thickness of the connecting plate is 1.5-2.5 mm
  • the height of the connecting plate is 155-165 mm
  • the thickness of the connecting plate is excellent.
  • the height of the web is preferably 160 mm.
  • the fixing member and the frame are made of aluminum alloy.
  • the lamp bead board, the driving PCB Both the plate and the connecting plate are made of glass fiber, and the glass fiber has the advantages of light weight and high strength. Therefore, the lamp bead, the driving PCB board and the connecting plate have the advantages of light weight and high strength.
  • the glass plate is made of a PMMA polymer material with a highly transparent homogeneous substrate, and the glass plate has an aesthetic appearance.
  • the glass plate is the substrate of the LED module, which improves the transparency of the LED display module.
  • the LED display module of this embodiment is as shown in FIG. 1, FIG. 2 and FIG. As shown, it comprises a plurality of lamp beads 1, a linearly arranged lamp bead 2, a linearly arranged driving PCB board 3, a frame 4, a transparent glass plate 5, a connecting plate 6 and a fixing member 7, and a plurality of lamp beads 1 are fixed to Lamp board 2
  • the board surface is electrically connected to the lamp bead board 2
  • the lamp bead board 2 is fixed on the driving PCB board 3 and electrically connected to the driving PCB board 3.
  • the board surface of the lamp bead board 2 is perpendicular to the board surface of the driving PCB board 3, and drives the PCB.
  • the frame 4 includes a first sub-frame 41 located at the top of the driving PCB board 3 and a second sub-frame 42 located at the bottom of the driving PCB board 3.
  • the first sub-frame 41 and the second sub-frame 42 are both L.
  • the first sub-frame 41 includes a first surface 411 and a second surface 412.
  • the first surface 411 is disposed on the top of the driving PCB 3.
  • the second surface 412 is disposed on the driving PCB 3.
  • the second sub-frame 42 includes a third surface 421 and a fourth surface 422.
  • the third surface 421 is disposed at the bottom of the driving PCB board 3, and the fourth surface 422 is disposed on the driving PCB board 3.
  • the preparation method is as follows:
  • the lamp pin plate pin is soldered to drive the PCB board by means of a tray;
  • the driving PCB board is disposed on the front end of the viewer and the driving PCB board is T
  • the LED display module of this embodiment is as shown in FIG. 1, FIG. 2 and FIG.
  • the lamp bead 1 the linearly arranged lamp bead 2
  • the linearly arranged driving PCB board 3 the frame 4
  • the transparent glass plate 5 the connecting plate 6 and the fixing member 7
  • the lamp bead 1 is fixed to the bead plate 2 Board surface and with lamp bead 2 Electrically connected
  • the lamp bead 2 is fixed on the driving PCB board 3 and electrically connected to the driving PCB board 3
  • the board surface of the lamp bead board 2 is perpendicular to the board surface of the driving PCB board 3
  • the driving PCB board 3 is disposed in the frame body 4.
  • the frame body 4 is fixed on the glass plate 5, the driving PCB board 3 is fixed on the connecting board 6, the driving PCB board 3 board surface is perpendicular to the glass board 5 board surface, the fixing member 7 is fixed on the frame body 4, and the frame 4 is The first sub-frame 41 on the top of the driving PCB board 3 and the second sub-frame 42 on the bottom of the driving PCB board 3 are included, and the first sub-frame 41 and the second sub-frame 42 are both L.
  • the first sub-frame 41 includes a first surface 411 and a second surface 412.
  • the first surface 411 is disposed on the top of the driving PCB 3.
  • the second surface 412 is disposed on the driving PCB 3.
  • the second sub-frame 42 includes a third surface 421 and a fourth surface 422.
  • the third surface 421 is disposed at the bottom of the driving PCB board 3, and the fourth surface 422 is disposed on the driving PCB board 3.
  • the preparation method is as follows:
  • the lamp pin plate pin is soldered to drive the PCB board by means of a tray;
  • the driving PCB board is disposed on the front end of the viewer and the driving PCB board is
  • T-connection method through the combination of left and right module PCBA semi-finished products up to 1024mm width, 256mm Highly infinitely expanded assembly, up to 15625 display pixel density per square, and high transparency up to 67.5%.

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  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract

一种LED显示模块及其制备方法，该LED显示模块中的灯珠(1)固定于线性排列的灯珠板(2)板面上，灯珠板(2)固定于驱动PCB板（3）上，灯珠板（2）板面垂直于驱动PCB板（3）板面，驱动PCB板（3）板面与玻璃板（5）板面相垂直，固定件（7）固定于边框（4）上，通过采用具有高透明度的透明玻璃板（5）作为安装主体，并通过将驱动PCB板（3）横向设置在玻璃板（5）上，能够极大地减少驱动PCB板（3）对光线的遮挡，提高了LED显示模块的透明度，同时，通过将多个灯珠（1）固定于线性排列的灯珠板（2）板面上提高了LED显示模块的像素密度。此种高密度、高通透的LED显示模块，满足了市场对既具有高像素密度又具有高通透性的LED显示模块的需求。

Description

一种LED显示模块及其制备方法 技术领域
本发明涉及LED 显示领域，尤其涉及一种LED 显示模块及其制备方法。
 背景技术
LED 显示屏因其尺寸灵活，环境适应性强的特点使其在媒体领域得到广泛应用，
目前，市场上普遍使用的LED 显示设备，一般都是黑色的箱体式、灯条屏、删格屏方式结构和条状结构。
在某些特别的场合，如玻璃幕墙、商店橱窗、舞台背景、商场、酒店、机场等环境需要LED 显示模块通透性高，采光透视效果好，同时又要保持一定的像素密度，而黑色的箱体式、灯条屏、删格屏方式结构的LED 显示设备无法和周围的使用环境协调，比如在玻璃幕墙、背景墙安装了箱体式的LED 显示设备就会完全地阻挡了光线，失去透光的效果，而灯条屏、删格屏难以满足多种尺寸玻璃幕墙结构，如果采用成本大大增加，非常不便利和后期维护，而条状LED 显示屏，这种LED 屏幕是将LED 发光单元安装在一根根条状的电路板上，然后以不透明的外壳固定，若干这样的灯条组成一个单元模块，若干单元模块再级联成显示屏。由于不透明外壳占用较大空间，这种单元模块的像素间距一般要做到40mm 以上才有一定的透光效果，但是像素间距太大则不适用于观看距离较小的应用场合。同时，由于这种不透明显示模块条状结构非常明显，无论安装在室内还是室外，都会给人一种束缚感，并不适用于商店橱窗、商场玻璃幕墙等这样的高档应用场合，市场呼唤既具有高像素密度又具有高通透性的LED 显示屏。
 技术问题
本发明的目的在于克服上述现有类似产品结构的不足，提供一种LED 显示模块及其制备方法，旨在提供一种既具有高像素密度又具有高通透性的LED 显示模块。
 技术解决方案
本发明是这样实现的，一方面，提供了一种LED 显示模块，包括多个灯珠、线性排列的灯珠板、线性排列的驱动PCB 板、边框、透明玻璃板、连接板及固定件，所述多个灯珠固定于所述灯珠板板面上，所述灯珠板固定于所述驱动PCB 板上，所述灯珠板板面垂直于所述驱动PCB 板板面，所述驱动PCB 板固定于所述连接板上，所述连接板包括设置在所述驱动板一侧两端的第一子连接板和第二子连接板，所述边框固定于所述玻璃板上，所述驱动PCB板板面与所述玻璃板板面相垂直，所述固定件固定于所述边框上，所述边框包括位于所述驱动PCB 板顶部的第一子边框和位于所述驱动PCB 板底部的第二子边框，所述第一子边框和第二子边框均为L 型，所述第一子边框包括第一面和第二面，所述第一面设置在所述驱动PCB 板的顶部，所述第二面设置在所述驱动PCB 板板面上，所述第二子边框包括第三面和第四面，所述第三面设置在所述驱动PCB 板的底部，所述第四面设置在所述驱动PCB 板板面上。
进一步地，所述多个灯珠等距离排布在所述灯珠板板面上。
进一步地，所述灯珠发光平面轴向方向与所述透明玻璃板平面方向垂直。
进一步地，所述驱动PCB 板两端分别设有连接针座，所述驱动PCB 板通过所述连接针座与所述第一子连接板和第二子连接板固定连接，所述驱动PCB 板板面垂直于所述第一子连接板板面和第二子连接板板面。
另一方面，提供了一种LED 显示模块制备方法，包括以下步骤：
（1）将多个灯珠自动化贴片在灯珠板板面上；
（2）将采用QFN 工艺封装的驱动IC 自动化贴片在驱动PCB 上；
（3）将8 条灯珠板为一组平摆固定在专用拖盘中，在8 条灯珠板的反面刷锡胶后，将多8 条驱动PCB 板立放在拖盘定位框内，通过拖盘夹具锁扣固定放入自动化回流焊设备过炉；
（4）采用半自动点焊机设备，通过拖盘固定将灯珠板排针焊接驱动PCB 板上；
（5）将焊接好的灯珠板和驱动PCB 板通过夹具左右进行连接焊接实现32 条左或右灯条驱动PCB 板；
（6）采用半自动点焊机设备将32 条左或右灯条驱动PCB 板连接排针固定焊接，左右各设一连接板，完成左右模组PCBA 半成品进行老测试；
（7）将透明玻璃板与边框组装完成一个拖盘架式；
（8）将左右模组PCBA 半成品组装在所述拖盘架式中，以完成双杆结构方式模组；
（9）将固定件固定于所述边框上，得到LED 显示模块。
具体地，所述灯珠板和驱动PCB 板的厚度均为0.5-1.5mm，所述灯珠板和驱动PCB
板的长度均315-325mm。
具体地，所述连接板的厚度为1.5-2.5mm，所述连接板的高度为155-165mm。
具体地，所述固定件和边框均为铝合金材质，所述灯珠板、驱动PCB 板和连接板均为玻璃纤维材质。
具体地，所述玻璃板由PMMA 高分子材料制成的高透明度均质基板。
 有益效果
本发明采用具有高透明度的透明玻璃板作为安装主体，并
通过将驱动PCB 板横向设置在透明玻璃板上，其能够极大地减少驱动PCB 板对光线的遮挡，提高了LED 显示模块的透明度，同时，通过将多个灯珠固定于线性排列的灯珠板板面上，提高了LED 显示模块的像素的密度。
 附图说明
图1 是本发明实施例提供的LED 显示模块立体示意图。
图2 是图1 中A 处放大示意图。
图3 是本发明实施例提供的LED 显示模块分解示意图。
图4 是图3 中B 处放大示意图。
图5 是本发明实施例提供的LED 显示模块的正视图。
图6 是图5 中C 处放大示意图。
图7 是本发明提供的LED 显示模块的俯视图。
图8 是图7 中D 处放大示意图。
图9 是本发明提供的LED 显示模块的仰视图。
图10 是图9 中E 处放大示意图。
图11 是本发明提供的LED 显示模块的左俯视图。
图12 是本发明提供的LED 显示模块的右俯视图。
图13 是本发明实施例提供的LED 显示模块制备方法流程图。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完
整地描述。
如图1~ 图12 所示，本发明实施例提供的一种LED 显示模块，包括多个灯珠1、线性排列的灯珠板2、线性排列的驱动PCB 板3、边框4、透明玻璃板5、连接板6 及固定件7，多个灯珠1 固定于灯珠板2 板面上，灯珠板2 固定于驱动PCB 板3 上，灯珠板2 板面垂直于驱动PCB 板3 板面，驱动PCB 板3 固定于连接板6 上，连接板6 包括设置在驱动PCB 板3 一侧两端的第一子连接板61 和第二子连接板62，边框4 固定于玻璃板5 上，驱动PCB 板3 板面与玻璃板5 板面相垂直，固定件7 固定于边框4 上。
优选地，多个灯珠1 等距离排布在灯珠板2 板面上，在灯珠板2 板面上设置多个灯珠1 可以确保LED 显示模块的像素密度，灯珠1 优选为3528 个，并且3528 个灯珠1 通过自动化贴片的方式贴片在灯珠板2 板面上。
优选地，固定件7 包括设置在边框4 一侧两端的第一子固定件71 和第二子固定件72，第一子固定件71 和第二子固定件72 均为类U 形，第一子固定件71 包括第一底板711、第一侧板712、第二侧板713 和第一横板714，第一侧板712 及第二侧板713 的底部分别连接在第一底板711 的相对两侧，第一横板714 设置在第二侧板713 的顶部一侧且向外侧延伸，所述第一底板711、第一侧板712 及第二侧板713 形成一用于容纳第一子连接板61 的空间，第二子固定件72 包括第二底板721、第三侧板722、第四侧板723 和第二横板724，第三侧板722 及第四侧板723 的底部分别连接在第二底板721 的相对两侧，第二横板724 设置在第三侧板722 的顶部一侧且向外侧延伸，第二底板721、第三侧板722 及第四侧板723 形
成一用于容纳第二子连接板62 的空间。
优选地，驱动PCB 板3 板面上设有第一固定块31，驱动PCB 板3 靠近边框4 的一侧设有第二固定块32，通过第一固定块31 和第二固定块32 的设置，可以进一步提高驱动PCB板3 的牢固性，由于第一固定块31 和第二固定块32 均为PMMA 高分子材料制成，第一固定块31 和第二固定块32 具有高透明度，这样，第一固定块31 和第二固定块32 就可以起到固定驱动PCB 板3 的同时，还不影响LED 显示模块的透光度。
优选地，边框4 包括位于驱动PCB 板3 的顶部的第一子边框41 和位于驱动PCB 板3 底部的第二子边框42，第一子边框41 和第二子边框42 均为L 型，第一子边框41 包括第一面411 和第二面412，第一面411 设置在驱动PCB 板3 的顶部，所述第二面412 设置在驱动PCB 板3 板面上，第二子边框42 包括第三面421 和第四面422，第三面421 设置在驱动PCB 板3 的底部，第四面422 设置在驱动PCB 板3 板面上。
优选地，第二面412 和第三面421 上分别设置多个间隔排布的透光孔43，透光孔43 的设置即可以减轻LED 显示模块的重量，又可以提高LED 显示模块的通透度。
优选地，驱动PCB 板3 板面上设有第一固定块31，驱动PCB 板3 靠近边框4 的一侧设有第二固定块32 且第二固定块32 延伸出驱动PCB 板3 边沿，驱动PCB 板3 通过第一固定块31 和第二固定块32 的设置，可以提高PCB 板3 的牢固性，另外，由于第一固定块31 和第二固定块32 均为PMMA 高分子材料制成，第一固定块31 和第二固定块32 具有高透明度，这样，第一固定块31 和第二固定块32 就可以起到固定驱动PCB 板3 的同时，还不影响LED显示模块的透光度。
优选地，灯珠1 截面的宽度与灯珠板2 板面的宽度相当，由于灯珠1 截面的宽度与灯珠板2 板面的宽度相当，这样，可以避免灯珠1 对光线的遮挡，保证LED 显示模块的通透度。
优选地，灯珠1 发光平面轴向方向与透明玻璃板5 平面方向垂直，这样可以提高
LED 显示模块的发光亮度，有效节省驱动电路的占用空间。
优选地，驱动PCB 板3 两端分别设有连接针座33，驱动PCB 板3 通过连接针座33与第一子连接板61 和第二子连接板62 固定连接，驱动PCB 板3 板面垂直于第一子连接板61 板面和第二子连接板62 板面。
本发明所提供的LED 显示模块，由于采用具有高透明度的玻璃板5 作为安装主体，灯珠1 固定于灯珠板2 板面上，灯珠板2 固定于驱动PCB 板3 上，灯珠板2 板面垂直于驱动PCB 板3 板面，驱动PCB 板3 固定于连接板6 上，驱动PCB 板3 板面与玻璃板5 板面相垂直，这样，通过将驱动PCB 板3 横向设置在玻璃板5 上，其能够极大地减少驱动PCB 板3 对光线的遮挡，提高了LED 显示模块的透明度，同时，通过将多个灯珠1 固定于线性排列的灯珠板2 板面上提高了LED 显示模块的像素密度。
相应地，本发明实施例提供一种LED 显示模块制备方法，该制备方法的流程示意
图如图13 所示，该方法包括如下步骤：
S01、将多个灯珠自动化贴片在灯珠板板面上；
S02、将采用QFN（Quad Flat No-leadPackage，方形扁平无引脚封装技术）工艺封装的驱动IC 自动化贴片在驱动PCB 上；
S03、将8 条灯珠板为一组平摆固定在专用拖盘中，在8 条灯珠板的反面刷锡胶后，将多8 条驱动PCB 板立放在拖盘定位框内，通过拖盘夹具锁扣固定放入自动化回流焊设备过炉；
S04、采用半自动点焊机设备，通过拖盘固定将灯珠板排针焊接驱动PCB 板上；
S05、将焊接好的灯珠板和驱动PCB 板通过夹具左右进行连接焊接实现32 条左或右灯条驱动PCB 板；
S06、采用半自动点焊机设备将32 条左或右灯条驱动PCB 板连接排针固定焊接，左右各设一连接板，完成左右模组PCBA 半成品进行老测试；
S07、将透明玻璃板与边框组装完成一个拖盘架式；
S08、将左右模组PCBA 半成品组装在所述拖盘架式中，以完成双杆结构方式模组；
S09、将固定件固定于所述边框上，得到LED 显示模块。
具体地，灯珠板和驱动PCB 板的厚度均为0.5-1.5mm，灯珠板和驱动PCB 板的长度均315-325mm，灯珠板和驱动PCB 板的厚度均优选为1mm，灯珠板和驱动PCB 板的长度均优选为320mm。
具体地，连接板的厚度为1.5-2.5mm，连接板的高度为155-165mm，连接板厚度优
选2 mm，连接板的高度优选为160mm。
优选地，固定件和边框均为铝合金材质。
优选地，灯珠板、驱动PCB 板和连接板均为玻璃纤维材质，玻璃纤维具有重量轻、强度高等优点，因此，灯珠板、驱动PCB 板和连接板具有重量轻、强度高等优点。
优选地，玻璃板由PMMA 高分子材料制成的高透明度均质基板，玻璃板具有美观、
高透明度及易于机械加工的特点，以玻璃板为LED 模块的基板，提高了LED 显示模块的透明度。
下面结合具体实施例对本发明作详细的描述：
实施例1
该实施例的LED 显示模块，如图1、图2 和图3 所示，包括多个灯珠1、线性排列的灯珠板2、线性排列的驱动PCB 板3、框体4、透明玻璃板5、连接板6 及固定件7，多个灯珠1 固定于灯珠板2 板面上且与灯珠板2 电连接，灯珠板2 固定于驱动PCB 板3 上且与驱动PCB 板3 电连接，灯珠板2 板面垂直于驱动PCB 板3 的板面，驱动PCB 板3 设置在框体4 中，框体4固定于玻璃板5 上，驱动PCB 板3 固定于连接板6 上，驱动PCB 板3 板面与玻璃板5 板面相垂直，固定件7 固定于框体4 上，边框4 包括位于驱动PCB 板3 的顶部的第一子边框41 和位于驱动PCB 板3 底部的第二子边框42，第一子边框41 和第二子边框42 均为L 型，第一子边框41 包括第一面411 和第二面412，第一面411 设置在驱动PCB 板3 的顶部，所述第二面412 设置在驱动PCB 板3 板面上，第二子边框42 包括第三面421 和第四面422，第三面421设置在驱动PCB 板3 的底部，第四面422 设置在驱动PCB 板3 板面上。
其制备方法如下：
（1）将3528 个灯珠自动化贴片在灯珠板板面上，其中，灯珠板厚度为1.0mm，灯珠板的长度为320mm ；
（2）将采用QFN 工艺封装的驱动IC 自动化贴片在驱动PCB 上，其中，驱动板厚度为1.0mm，驱动板的长度为320 mm ；
（3）将8 条灯珠板为一组平摆固定在专用拖盘中，在8 条灯珠板的反面刷锡胶后，将多8 条驱动PCB 板立放在拖盘定位框内，通过拖盘夹具锁扣固定放入自动化回流焊设备过炉；
（4）采用半自动点焊机设备，通过拖盘固定将灯珠板排针焊接驱动PCB 板上；
（5）将焊接好的灯珠板和驱动PCB 板通过夹具左右进行连接焊接实现640mm 长度的左或右灯条驱动PCB 板；
（6）采用半自动点焊机设备将32 条左或右灯条驱动PCB 板连接排针固定焊接，左右各设一连接板，完成左右模组PCBA 半成品进行老测试，其中，连接板的厚度为2mm，连接板的高度为160mm ；
（7）将玻璃板与边框组装完成一个拖盘架式；
（8）将左右模组PCBA 半成品组装在所述拖盘架式中，以完成双杆结构方式模组；
（9）将固定件固定于所述边框上，得到LED 显示模块。
[0048] 本发明实施例中，驱动PCB 板面向观众的正端上设置的灯珠板板与驱动PCB 板为T 型连接方式工艺，通过左右模组PCBA 半成品组合可达1280mm 宽度，160mm 高度无限扩展拼装，按每平方计算高达40000 个显示像素点密度, 高密度下透明度高达48% 效果。
实施例2
该实施例的LED 显示模块，如图1、图2 和图3 所示，包括灯珠1、线性排列的灯珠板2、线性排列的驱动PCB 板3、框体4、透明玻璃板5、连接板6 及固定件7，灯珠1 固定于灯珠板2 板面上且与灯珠板2 电连接，灯珠板2 固定于驱动PCB 板3 上且与驱动PCB 板3 电连接，灯珠板2 板面垂直于驱动PCB 板3 的板面，驱动PCB 板3 设置在框体4 中，框体4 固定于玻璃板5 上，驱动PCB 板3 固定于连接板6 上，驱动PCB 板3 板面与玻璃板5 板面相垂直，固定件7 固定于框体4 上，边框4 包括位于驱动PCB 板3 的顶部的第一子边框41 和位于驱动PCB 板3 底部的第二子边框42，第一子边框41 和第二子边框42 均为L 型，第一子边框41包括第一面411 和第二面412，第一面411 设置在驱动PCB 板3 的顶部，所述第二面412 设置在驱动PCB 板3 板面上，第二子边框42 包括第三面421 和第四面422，第三面421 设置在驱动PCB 板3 的底部，第四面422 设置在驱动PCB 板3 板面上。
其制备方法如下：
（1）将3528 个灯珠自动化贴片在灯珠板板面上，其中，灯珠板厚度为1.0mm，灯珠板的长度为256mm ；
（2）将采用QFN 工艺封装的驱动IC 自动化贴片在驱动PCB 上，其中，驱动板厚度为1.0mm，驱动板的长度为256 mm ；
（3）将8 条灯珠板为一组平摆固定在专用拖盘中，在8 条灯珠板的反面刷锡胶后，将多8 条驱动PCB 板立放在拖盘定位框内，通过拖盘夹具锁扣固定放入自动化回流焊设备过炉；
（4）采用半自动点焊机设备，通过拖盘固定将灯珠板排针焊接驱动PCB 板上；
（5）将焊接好的灯珠板和驱动PCB 板通过夹具左右进行连接焊接实现512mm 长度的左或右灯条驱动PCB 板；
（6）采用半自动点焊机设备将32 条左或右灯条驱动PCB 板连接排针固定焊接，左右各设一连接板，完成左右模组PCBA 半成品进行老测试，其中，连接板的厚度为2mm，连接板的高度为160mm ；
（7）将玻璃板与边框组装完成一个拖盘架式；
（8）将左右模组PCBA 半成品组装在所述拖盘架式中，以完成双杆结构方式模组；
（9）将固定件固定于所述边框上，得到LED 显示模块。
本发明实施例中，驱动PCB 板面向观众的正端上设置的灯珠板板与驱动PCB 板为
T 型连接方式工艺，通过左右模组PCBA 半成品组合可达1024mm 宽度，256mm 高度无限扩展拼装，按每平方计算高达15625 个显示像素点密度, 高密度下透明度高达67.5% 效果。
以上实施是本发明的优选实施方式，并非限定本发明产品的结构和样式，应当指
出，对于本技术领域的技术人员来说，在不脱离本发明结构原理的前提下，还可以做出若干等同效果的变化和修饰，这些等同变化和修饰皆属于本发明的保护范围。

Claims (1)

  1. 1.一种LED 显示模块，其特征在于，包括多个灯珠、线性排列的灯珠板、线性排列的驱动PCB 板、边框、透明玻璃板、连接板及固定件，所述多个灯珠固定于所述灯珠板板面上，所述灯珠板固定于所述驱动PCB 板上，所述灯珠板板面垂直于所述驱动PCB 板板面，所述驱动PCB 板固定于所述连接板上，所述连接板包括设置在所述驱动板一侧两端的第一子连接板和第二子连接板，所述边框固定于所述玻璃板上，所述驱动PCB 板板面与所述玻璃板板面相垂直，所述固定件固定于所述边框上，所述边框包括位于所述驱动PCB 板顶部的第一子边框和位于所述驱动PCB 板底部的第二子边框，所述第一子边框和第二子边框均为L 型，所述第一子边框包括第一面和第二面，所述第一面设置在所述驱动PCB 板的顶部，所述第二面设置在所述驱动PCB 板板面上，所述第二子边框包括第三面和第四面，所述第三面设置在所述驱动PCB 板的底部，所述第四面设置在所述驱动PCB 板板面上。
    2.根据权利要求1 所述的LED 显示模块，其特征在于，所述多个灯珠等距离排布在所述灯珠板板面上。
    3.根据权利要求2 所述的LED 显示模块，其特征在于，所述灯珠发光平面轴向方向与所述玻璃板平面方向垂直。
    4.根据权利要求1 所述的LED 显示模块，其特征在于，所述第二面和第三面上分别设有多个间隔排布的透光孔。
    5.根据权利要求1 所述的LED 显示模块，其特征在于，所述驱动PCB 板两端分别设有连接针座，所述驱动PCB 板通过所述连接针座与所述第一子连接板和第二子连接板固定连接，所述驱动PCB 板板面垂直于所述第一子连接板板面和第二子连接板板面。
    6.如权利要求1-5 任一项所述的LED 显示模块制备方法，其特征在于，包括如下步骤：
    （1）将多个灯珠自动化贴片在灯珠板板面上；
    （2）将采用QFN 工艺封装的驱动IC 自动化贴片在驱动PCB 上；
    （3）将8 条灯珠板为一组平摆固定在专用拖盘中，在8 条灯珠板的反面刷锡胶后，将多8 条驱动PCB 板立放在拖盘定位框内，通过拖盘夹具锁扣固定放入自动化回流焊设备过炉；
    （4）采用半自动点焊机设备，通过拖盘固定将灯珠板排针焊接驱动PCB 板上；
    （5）将焊接好的灯珠板和驱动PCB 板通过夹具左右进行连接焊接实现32 条左或右灯条驱动PCB 板；
    （6）采用半自动点焊机设备将32 条左或右灯条驱动PCB 板连接排针固定焊接，左右各设一连接板，完成左右模组PCBA 半成品进行老测试；
    （7）将透明玻璃板与边框组装完成一个拖盘架式；
    （8）将左右模组PCBA 半成品组装在所述拖盘架式中，以完成双杆结构方式模组；
    （9）将固定件固定于所述边框上，得到LED 显示模块。
    7.如权利要求6 所述的LED 显示模块制备方法，其特征在于，所述灯珠板和驱动PCB 板的厚度均为0.5-1.5mm，所述灯珠板和驱动PCB 板的长度均315-325mm。
    8.如权利要求6 所述的LED 显示模块制备方法，其特征在于，所述连接板的厚度为1.5-2.5mm，所述连接板的高度为155-165mm。
    9.根据权利要求6 所述的LED 显示模块制备方法，其特征在于，所述固定件和边框均为铝合金材质，所述灯珠板、驱动PCB 板和连接板均为玻璃纤维材质。
    10.根据权利要求6 所述的LED 显示模块制备方法，其特征在于，所述玻璃板由PMMA 高分子材料制成的高透明度均质基板。
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