WO2016096946A1 - Substrate holder for vertical galvanic metal deposition - Google Patents

Substrate holder for vertical galvanic metal deposition Download PDF

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Publication number
WO2016096946A1
WO2016096946A1 PCT/EP2015/079932 EP2015079932W WO2016096946A1 WO 2016096946 A1 WO2016096946 A1 WO 2016096946A1 EP 2015079932 W EP2015079932 W EP 2015079932W WO 2016096946 A1 WO2016096946 A1 WO 2016096946A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate holder
substrate
fastening
elements
sealing element
Prior art date
Application number
PCT/EP2015/079932
Other languages
French (fr)
Inventor
Arnulf Fendel
Ralph Rauenbusch
Tobias Bussenius
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Priority to US15/533,712 priority Critical patent/US10407793B2/en
Priority to CN201580068840.4A priority patent/CN107109682B/en
Priority to KR1020177020009A priority patent/KR102010681B1/en
Priority to JP2017533261A priority patent/JP6590933B2/en
Publication of WO2016096946A1 publication Critical patent/WO2016096946A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition

Definitions

  • the present invention relates to a substrate holder for vertical galvanic metal, preferably copper, deposition on a substrate to be treated comprising a first substrate holder part and a second substrate holder part, wherein both substrate holder parts comprise an inner metal comprising part and an outer non-metallic part.
  • the present invention is further directed to the use of such an inventive substrate holder for galvanic metal, in particular copper, deposition on substrates to be treated, in particular semiconductor wafers.
  • the invention relates to a substrate holder for galvanically treating, in particular galvanically coating, a planar substrate, for example wafers in order to produce semiconductor wafers, printed circuit boards or foils or other planar substrates to be treated.
  • said substrate In order to treat the substrate in a galvanic manner, said substrate is placed in an electrolyte bath that is located in a treatment container. Anodes are arranged in the treatment container for the galvanic coating. Metal is deposited on the product in a galvanic manner by virtue of applying a voltage between the anodes and the product.
  • Substrate holders are used for the substrates to be treated in order to render possible an as large as possible range of use of the substrate, said substrate holders hold the substrate in a border area. It is desirable that the substrate can be partially or entirely automatically fastened to and released from the substrate holder.
  • both sides of the substrate are treated galvanically.
  • the two sides can be coated sequentially using different coating processes, it is desirable to coat both sides of the substrate simultaneously for example in order to carry out the method efficiently. Furthermore, it can be necessary to treat only one side of two substrates simultaneously-
  • the demanded metal, in particular copper, deposition on the surface of the respective substrate to be treated should be ensured to be uniform.
  • the present invention accordingly provides a substrate holder for vertical galvanic metal, preferably copper, deposition on a substrate to be treated comprising a first substrate holder part and a second substrate holder part, wherein both substrate holder parts comprise an inner metal comprising part and an outer non-metallic part characterized in that the substrate holder further comprises i) At least one hanging element in each substrate holder part for mechanically connecting the substrate holder to a treatment container, ii) At least one first sealing element in each substrate holder part arranged between the substrate to be treated and the respective substrate holder part, iii) At least one second sealing element for the entire substrate holder arranged between the inner metal comprising part of the substrate holder and the outer non-metallic part of the substrate holder, iv) At least one fastening system for detachably fastening both substrate holder parts to each other for holding the substrate to be treated, v) At least one first contact element in each substrate holder part for forwarding current from an outer source through the hanging element to the at least second contact element
  • the inventive substrate holder is a unique inventive combination of sealing element elements, current contact elements and fastening elements, which ensure that the substrate holder is not passable for treatment liquids.
  • the demanded metal, in particular copper, deposition on the surface of the respective substrate to be treated is uniform.
  • Fig. 1 exhibits a schematic front view of a first substrate holder part in accordance with an embodiment of the present invention.
  • Fig. 2 exhibits a schematic front view of a second substrate holder part in accordance with an embodiment of the present invention.
  • Fig. 3 exhibits a schematic enlarged front view of a part of the second substrate holder part having a closed fastening system in accordance with the same embodiment of the present invention as shown in Figure 2.
  • Fig. 4 exhibits another schematic enlarged front view of the same part of the second substrate holder part having an opened fastening system in accordance with the same embodiment of the present invention as shown in Figure 2.
  • Fig. 5 exhibits another schematic enlarged perspective view of a part of the second substrate holder part in accordance with the same embodiment of the present invention as shown in Figure 2.
  • Fig. 6 exhibits a schematic side view of a specific possible second and/or third sealing element in accordance with an embodiment of the present invention.
  • Fig. 7 exhibits a schematic perspective view on the hanging element of the first and the second substrate holder part in accordance with an embodiment of the present invention.
  • the substrate holder further comprises at least one third sealing element for the entire substrate holder arranged between the inner metal comprising part of the substrate holder and the outer non-metallic part of the substrate holder, wherein said third sealing element is more exterior than the second sealing element.
  • Such an additional third sealing element ensures further that no treatment liquid can pass the outer sealing element in form of the second sealing element to reach the interior area of the substrate holder, wherein the metal parts are.
  • the fastening system comprises at least two, preferably three, first recess elements in the first substrate holder part and at least two, preferably three, first fastening elements in the second substrate holder part, wherein said first fastening elements are in conjunction with the respective first recess elements.
  • This combination of fastening elements and recesses serves the purpose to prevent that both substrate holder parts can even be only slightly shifted against each other during the metal deposition process or during installing the substrate holder in the respective treatment container.
  • the substrate holder further comprises at least two, preferably three, first positioning elements in one substrate holder part for accurate central positioning of the at least one substrate to be treated.
  • Such a high accurate positioning of the substrate to be treated is of high importance for achieving a uniform metal deposition by avoiding edge effects caused by an undesired shift of the substrate, even if the substrate is only slightly shifted.
  • the substrate holder further comprises at least two second positioning elements at the exterior opposite ends of each hanging element for accurate mechanically positioning of the substrate holder in the treatment container.
  • the second contact element in each substrate holder part is formed in one part or in multiple parts, preferably in multiple parts.
  • at least three parts are especially preferred.
  • the second contact element in each substrate holder part comprises a plurality of contact finger elements.
  • the second contact element in each substrate holder part is formed in multiple parts, wherein each part of the second contact element comprises at least one, preferably at least 15, more preferably at least 25, contact finger elements.
  • the second contact element in each substrate holder part has a top conductive coating, preferably composed of a metal or of a metal alloy, wherein the at least one metal is selected from the group consisting of silver, gold, copper, platinum or palladium. Gold and platinum are especially preferred herein.
  • the first contact element in one substrate holder part comprises at both exterior opposite ends directed to the outer current source a second recess element, while the first contact element in the other substrate holder part is a flat edge.
  • the fastening system further comprises at least a plurality of second, third, fourth and fifth fastening elements, and a plurality of third recess elements in the first substrate holder part; while the fastening system further comprises at least a plurality of sixth, seventh, eighth, ninth, tenth, eleventh and twelfth fastening elements, and a plurality of fourth recess elements in the second substrate holder part; wherein the second fastening elements of the first substrate holder part are in conjunction with the fourth recess element of the second substrate holder part; and wherein the sixth fastening elements of the second substrate holder part are in conjunction with the third recess element of the first substrate holder part.
  • the second and sixth fastening elements are permanently fixed elements, which are unmovable in their position, such as screws, bolts, pins or alike; that the seventh, eighth, ninth and twelfth fastening element are metallic chains, wherein the ninth fastening element is a circular metallic chain running around the site of the substrate holder, which is adapted to receive the substrate to be treated, wherein the eighth and seventh fastening elements are two separated metallic chains running both linearly from said ninth fastening element to the upper side of the substrate holder, wherein the seventh and the eighth fastening element are each interconnected to the circular chain by the twelfth fastening element, wherein all these metallic chains in the second substrate holder part comprise a plurality of consecutive oblong holes, which comprise at the one end a circular fourth recess element; and that the first substrate holder part comprises the corresponding metallic fastening elements as counterpart to the respective fastening elements of the second substrate holder part.
  • the second and sixth fastening elements are permanently fixed elements, which are unmovable in their position, such as screws, bolts, pins or alike; that the seventh, eighth, ninth and twelfth fastening element are metallic chains, wherein the ninth fastening element is a rectangular, preferably a quadratic, metallic chain running around the site of the substrate holder, which is adapted to receive the substrate to be treated, wherein the eighth and seventh fastening elements are two separated metallic chains running both linearly from said ninth fastening element to the upper side of the substrate holder, wherein the seventh and the eighth fastening element are each interconnected to the rectangular, preferably a quadratic, metallic chain by the twelfth fastening element, wherein all these metallic chains in the second substrate holder part comprise a plurality of consecutive oblong holes, which comprise at the one end a circular fourth recess element; and that the first substrate holder part comprises the corresponding metallic fastening elements as counterpart to the respective fastening elements of the second substrate holder
  • metal chain refers to a metallic element, which is comprised of flexible metallic subunits, or a metallic element, which is comprised of one single piece.
  • the first sealing element comprises a double sealing element lip, wherein both lips are arranged in such a manner that both lips can contact the surface of the substrate to be treated if inserted.
  • the first sealing element comprises a double sealing element lip, wherein both sealing element lips are arranged in such a manner that both sealing element lips are directed to the substrate to be treated in the center of the substrate holder.
  • the second sealing element and/or the third sealing element comprise each a double sealing element lip, wherein both sealing element lips are arranged between both substrate holder parts in such a manner that both sealing element lips are directed to the outside of the substrate holder.
  • the second sealing element and/or the third sealing element comprise each a modified double sealing element lip, wherein two sealing element lips are arranged between both substrate holder parts in direction to the outside of the substrate holder and wherein simultaneously two sealing element lips are directed to both substrate holder parts.
  • Such a special sealing element is amending the prevention of treatment liquid passage in the substrate holder on the one hand, but on the other hand it also increases the required pressure for closing the substrate holder by pressing both substrate holder parts together after introducing a substrate to be treated inside it.
  • Such an inventive substrate holder of the present invention can be used for galvanic metal, in particular copper, deposition on substrates to be treated, in particular on semiconductor wafers.
  • the present invention thus addresses the problem of providing an amended substrate holder, which can be used for one side and two side metal depositions in an outstanding quality.
  • Figure 1 shows a schematic front view of a first substrate holder part 1 in accordance with an embodiment of the present invention.
  • Said first substrate holder part 1 comprises one hanging element 3 for mechanically connecting the substrate holder to a treatment container and one first sealing element 10 arranged between the site of the first substrate holder part 1 , where a substrate to be treated is adapted to be received, and the first substrate holder part 1 .
  • the first substrate holder part 1 comprises two second positioning elements 4 at the exterior opposite ends of the hanging element 3 for accurate mechanically positioning of the substrate holder in the treatment container.
  • the first substrate holder part 1 comprises a second sealing element 1 1 arranged between the inner metal comprising part of the first substrate holder part 1 and the outer non-metallic part of the first substrate holder part 1 .
  • the first substrate holder part 1 comprises a third sealing element 12 arranged between the inner metal comprising part (non-metallic housing 6) of the first substrate holder part 1 and the outer non-metallic part of the first substrate holder part 1 , wherein said third sealing element 12 is more exterior than the second sealing element 1 1 .
  • first recess elements 7 There are also comprised three first recess elements 7 and three first positioning elements 9 for accurate central positioning of a substrate to be treated in the first substrate holder part 1 .
  • first contact element 13 for forwarding current from an outer source through the hanging element 3 to the second contact element 16.
  • the hanging element 3 is identical to the first contact element 13 because said first contact element 13 is completely made of metal.
  • a defined first contact element being only a specific metal line inside of the hanging element 3.
  • a second contact element 1 6 for forwarding current from the first contact element 13 to the substrate to be treated.
  • the first contact element 13 in one substrate holder part comprises at both exterior opposite ends directed to the outer current source a second recess element 5, while the first contact element 13 in the other substrate holder part provides a flat edge at both exterior opposite ends directed to the outer current source (better to see in Figure 7).
  • the first contact element 13 is mounted on an outer non-metallic housing 6 by a plurality of a first mounting element 14, while said first contact element 13 is connected to the hanging element 3 by two second mounting elements 15.
  • the second contact element 1 6 is formed in three parts, wherein each part of the second contact element 1 6 comprises in this embodiment 39 contact finger elements.
  • the first substrate holder part 1 comprises a fastening system for detachably fastening said first substrate holder part 1 to a corresponding second substrate holder part 2 for holding the substrate to be treated.
  • a fastening system for detachably fastening said first substrate holder part 1 to a corresponding second substrate holder part 2 for holding the substrate to be treated.
  • the second fastening elements 18 are permanently fixed elements, which are unmovable in their position, such as screws, bolts, and pins or alike.
  • the first substrate holder part 1 comprises the fastening metallic fastening elements as counterpart to the respective fastening elements of the second substrate holder part 2.
  • a third mounting element 17 which is an enhancement element for the second contact elements 1 6 for preventing that the contact fingers will bend or twist by applying pressure on them during providing physical contact between the metallic second contact element 16 and the substrate to be treated in the loading step.
  • Said third mounting element 17 has the same partition as the second contact element, meaning if the second contact element comprises three parts, the third mounting element 17 is also comprised of three parts.
  • a plurality of fourth mounting elements (screws) 25 have been used in the embodiment shown to mount the third mounting element 17 through the second contact element in the first contact element as will be better to see in Figure 5.
  • All mounting elements except the third mounting element 17 in the sense of the present invention can be selected of common mounting elements known to a skilled artisan, such as screws, bolts, and pins or alike.
  • Figure 2 shows a schematic front view of a second substrate holder part 2 in accordance with an embodiment of the present invention. As outlined above, there are only the features of the second substrate holder part 2 to be discussed, which are not included in Figure 1 .
  • Figure 2 discloses a fastening system comprising a plurality of first 8, sixth 20, seventh 22a, eighth 22b, ninth 22c, tenth 23, eleventh 24 and twelfth 26 fastening elements, and a plurality of fourth recess elements 27 in the second substrate holder part 2; wherein the second fastening elements 18 of the first substrate holder part 1 are in conjunction with the fourth recess element 27 of the second substrate holder part 2; and wherein the sixth fastening elements 20 of the second substrate holder part 2 are in conjunction with the third recess element 19 of the first substrate holder part 1 .
  • the sixth fastening elements 20 are permanently fixed elements, which are unmovable in their position, such as screws, bolts, and pins or alike.
  • the seventh 22a, eighth 22b, ninth 22c and twelfth 26 fastening elements are metallic chains, wherein the ninth fastening element 22c is a circular metallic chain running around the site of the substrate holder, which is adapted to receive the substrate to be treated, wherein the eighth 22b and seventh 22a fastening elements are two separated metallic chains running both linearly from said ninth fastening element 22c to the upper side of the second substrate holder part 2, wherein the seventh 22a and the eighth 22b fastening element are each interconnected to the circular chain 22c by the twelfth fastening element 26, wherein all these metallic chains in the second substrate holder part 2 comprise a plurality of consecutive oblong holes, which comprise at the one end a circular fourth recess element 27.
  • the first substrate holder part 1 comprises the respective corresponding metallic fastening elements as counterpart to the respective fastening elements of the second substrate holder part 2.
  • the fastening system comprises three first fastening elements 8 in the second substrate holder part 2, which are designated to become in conjunction with the respective three first recess elements 7 of the first substrate holder part 1 .
  • Figure 3 shows a schematic enlarged front view of a part of the second substrate holder part 2 having a closed fastening system in accordance with the same embodiment of the present invention as shown in Figure 2.
  • Figure 4 shows another schematic enlarged front view of the same part of the second substrate holder part 2 having an opened fastening system in accordance with the same embodiment of the present invention as shown in Figure 2.
  • the tenth 23 and eleventh 24 fastening elements serve the purpose of manually open and close the substrate holder by pushing or pressing the respective fastening element, which is more outside of the non-metallic outer housing 6.
  • Figure 5 shows another schematic enlarged perspective view of a part of the second substrate holder part 2 in accordance with the same embodiment of the present invention as shown in Figure 2.
  • the third mounting element 17 and the second contact elements 1 6 can also be arranged directly adjacent to this edge of the first contact element 13 thereby eliminating the gap 28.
  • FIG. 6 shows a schematic side view of a specific possible second 1 1 and/or third 12 sealing element in accordance with an embodiment of the present invention.
  • Such an alternative second 1 1 or third 12 sealing element comprise a modified double sealing element lip, wherein two sealing element lips can be arranged between both substrate holder parts in direction to the outside of the substrate holder. Simultaneously two sealing element lips are directed to both substrate holder parts 1 ,2.
  • Figure 7 shows a schematic perspective view on the hanging element 3 of the first 1 and the second 2 substrate holder part in accordance with an embodiment of the present invention.
  • the first contact element 13 in one substrate holder part 2 comprises at both exterior opposite ends directed to the outer current source a second recess element 5, while the first contact element 13 in the other substrate holder part 1 is a flat edge.
  • Substrate holder parts 1 and 2 could also be exchanged. Therefore, the reference sign has been kept constant at 5, even if one area is flat and one comprises a recess.
  • the substrate holder further comprises two second positioning elements 4 at the exterior opposite ends of each hanging element 3 for accurate mechanically positioning of the substrate holder in the treatment container.

Abstract

The present invention is related to a substrate holder for vertical galvanic metal, preferably copper, deposition on a substrate to be treated comprising a first substrate holder part and a second substrate holder part, wherein both substrate holder parts comprise an inner metal comprising part and an outer non-metallic part characterized in that the substrate holder further comprises i) At least one hanging element in each substrate holder part for mechanically connecting the substrate holder to a treatment container, ii) At least one first sealing element in each substrate holder part arranged between the substrate to be treated and the respective substrate holder part, iii) At least one second sealing element for the entire substrate holder arranged between the inner metal comprising part of the substrate holder and the outer non-metallic part of the substrate holder, iv) At least one fastening system for detachably fastening both substrate holder parts to each other for holding the substrate to be treated, v) At least one first contact element in each substrate holder part for forwarding current from an outer source through the hanging element to the at least second contact element, and vi) At least one second contact element in each substrate holder part for forwarding current from the at least first contact element to the substrate to be treated.

Description

SUBSTRATE HOLDER FOR VERTICAL GALVANIC METAL DEPOSITION
Field of the Invention
The present invention relates to a substrate holder for vertical galvanic metal, preferably copper, deposition on a substrate to be treated comprising a first substrate holder part and a second substrate holder part, wherein both substrate holder parts comprise an inner metal comprising part and an outer non-metallic part.
The present invention is further directed to the use of such an inventive substrate holder for galvanic metal, in particular copper, deposition on substrates to be treated, in particular semiconductor wafers.
Background of the Invention
The invention relates to a substrate holder for galvanically treating, in particular galvanically coating, a planar substrate, for example wafers in order to produce semiconductor wafers, printed circuit boards or foils or other planar substrates to be treated.
In order to treat the substrate in a galvanic manner, said substrate is placed in an electrolyte bath that is located in a treatment container. Anodes are arranged in the treatment container for the galvanic coating. Metal is deposited on the product in a galvanic manner by virtue of applying a voltage between the anodes and the product. Substrate holders are used for the substrates to be treated in order to render possible an as large as possible range of use of the substrate, said substrate holders hold the substrate in a border area. It is desirable that the substrate can be partially or entirely automatically fastened to and released from the substrate holder.
Different applications can require that both sides of the substrate are treated galvanically. Although the two sides can be coated sequentially using different coating processes, it is desirable to coat both sides of the substrate simultaneously for example in order to carry out the method efficiently. Furthermore, it can be necessary to treat only one side of two substrates simultaneously-
Objective of the present Invention
There is still a need for substrate holders for galvanically treating a substrate, which substrate holders provide advantages with respect to the above mentioned aims. There is in particular a need for substrate holders for treating a substrate, which substrate holder is arranged for the purpose of coating both sides of the substrate simultaneously.
It was especially an object of the present invention to provide a substrate holder having a unique inventive combination of sealing element elements, current contact elements and fastening elements in order to ensure that the substrate holder is not passable for treatment liquids. At the same time, the demanded metal, in particular copper, deposition on the surface of the respective substrate to be treated should be ensured to be uniform.
Summary of the Invention
These objects and also further objects which are not stated explicitly but are immediately derivable or discernible from the connections discussed herein by way of introduction are achieved by a substrate holder having all features of claim 1 . Appropriate modifications to the inventive substrate holder are protected in dependent claims 2 to 14. Further, claim 15 comprises the use of such a substrate holder for galvanic metal, in particular copper, deposition on substrates to be treated.
The present invention accordingly provides a substrate holder for vertical galvanic metal, preferably copper, deposition on a substrate to be treated comprising a first substrate holder part and a second substrate holder part, wherein both substrate holder parts comprise an inner metal comprising part and an outer non-metallic part characterized in that the substrate holder further comprises i) At least one hanging element in each substrate holder part for mechanically connecting the substrate holder to a treatment container, ii) At least one first sealing element in each substrate holder part arranged between the substrate to be treated and the respective substrate holder part, iii) At least one second sealing element for the entire substrate holder arranged between the inner metal comprising part of the substrate holder and the outer non-metallic part of the substrate holder, iv) At least one fastening system for detachably fastening both substrate holder parts to each other for holding the substrate to be treated, v) At least one first contact element in each substrate holder part for forwarding current from an outer source through the hanging element to the at least second contact element, and vi) At least one second contact element in each substrate holder part for forwarding current from the at least first contact element to the substrate to be treated.
It is thus possible in an unforeseeable manner to provide a substrate holder, which can be used for one side and two side metal depositions in an outstanding quality. Furthermore, the inventive substrate holder is a unique inventive combination of sealing element elements, current contact elements and fastening elements, which ensure that the substrate holder is not passable for treatment liquids. At the same time, the demanded metal, in particular copper, deposition on the surface of the respective substrate to be treated is uniform.
Brief Description of the Figures
Objects, features, and advantages of the present invention will also become apparent upon reading the following description in conjunction with the figures, in which:
Fig. 1 exhibits a schematic front view of a first substrate holder part in accordance with an embodiment of the present invention.
Fig. 2 exhibits a schematic front view of a second substrate holder part in accordance with an embodiment of the present invention.
Fig. 3 exhibits a schematic enlarged front view of a part of the second substrate holder part having a closed fastening system in accordance with the same embodiment of the present invention as shown in Figure 2.
Fig. 4 exhibits another schematic enlarged front view of the same part of the second substrate holder part having an opened fastening system in accordance with the same embodiment of the present invention as shown in Figure 2.
Fig. 5 exhibits another schematic enlarged perspective view of a part of the second substrate holder part in accordance with the same embodiment of the present invention as shown in Figure 2.
Fig. 6 exhibits a schematic side view of a specific possible second and/or third sealing element in accordance with an embodiment of the present invention. Fig. 7 exhibits a schematic perspective view on the hanging element of the first and the second substrate holder part in accordance with an embodiment of the present invention.
Detailed Description of the Invention
In one embodiment, the substrate holder further comprises at least one third sealing element for the entire substrate holder arranged between the inner metal comprising part of the substrate holder and the outer non-metallic part of the substrate holder, wherein said third sealing element is more exterior than the second sealing element.
Such an additional third sealing element ensures further that no treatment liquid can pass the outer sealing element in form of the second sealing element to reach the interior area of the substrate holder, wherein the metal parts are.
In one embodiment, the fastening system comprises at least two, preferably three, first recess elements in the first substrate holder part and at least two, preferably three, first fastening elements in the second substrate holder part, wherein said first fastening elements are in conjunction with the respective first recess elements.
This combination of fastening elements and recesses serves the purpose to prevent that both substrate holder parts can even be only slightly shifted against each other during the metal deposition process or during installing the substrate holder in the respective treatment container.
In one embodiment, the substrate holder further comprises at least two, preferably three, first positioning elements in one substrate holder part for accurate central positioning of the at least one substrate to be treated.
Even if these first positioning elements have been shown in both Figures 1 and 2 representing both substrate holder parts, it has to be highlighted that only one substrate holder part can be provided with these positioning elements caused by their construction height. The presence in both Figures 1 and 2 is supposed to only serve illustration purposes because a user can choose in which substrate holder part he wants to include said positioning elements.
Such a high accurate positioning of the substrate to be treated is of high importance for achieving a uniform metal deposition by avoiding edge effects caused by an undesired shift of the substrate, even if the substrate is only slightly shifted.
In one embodiment, the substrate holder further comprises at least two second positioning elements at the exterior opposite ends of each hanging element for accurate mechanically positioning of the substrate holder in the treatment container.
This is supposed to serve the purpose that the substrate holder can be placed in the treatment container without generating undesired tension on the substrate holder by deviations of the vertical alignment of the substrate holder during introducing in the treatment container.
In one embodiment, the second contact element in each substrate holder part is formed in one part or in multiple parts, preferably in multiple parts. Herein, at least three parts are especially preferred.
In one embodiment, the second contact element in each substrate holder part comprises a plurality of contact finger elements.
In a preferred embodiment, the second contact element in each substrate holder part is formed in multiple parts, wherein each part of the second contact element comprises at least one, preferably at least 15, more preferably at least 25, contact finger elements.
In another preferred embodiment, the second contact element in each substrate holder part has a top conductive coating, preferably composed of a metal or of a metal alloy, wherein the at least one metal is selected from the group consisting of silver, gold, copper, platinum or palladium. Gold and platinum are especially preferred herein.
In one embodiment, the first contact element in one substrate holder part comprises at both exterior opposite ends directed to the outer current source a second recess element, while the first contact element in the other substrate holder part is a flat edge.
This is supposed to serve the purpose that the substrate holder can be contacted from an outer source of current without the risk that the contacting is non-uniform or nonconstant caused by undesired tension on the substrate holder, which can be generated by deviations of the vertical alignment of the substrate holder during introducing in the treatment container.
In one embodiment, the fastening system further comprises at least a plurality of second, third, fourth and fifth fastening elements, and a plurality of third recess elements in the first substrate holder part; while the fastening system further comprises at least a plurality of sixth, seventh, eighth, ninth, tenth, eleventh and twelfth fastening elements, and a plurality of fourth recess elements in the second substrate holder part; wherein the second fastening elements of the first substrate holder part are in conjunction with the fourth recess element of the second substrate holder part; and wherein the sixth fastening elements of the second substrate holder part are in conjunction with the third recess element of the first substrate holder part.
In a preferred embodiment, the second and sixth fastening elements are permanently fixed elements, which are unmovable in their position, such as screws, bolts, pins or alike; that the seventh, eighth, ninth and twelfth fastening element are metallic chains, wherein the ninth fastening element is a circular metallic chain running around the site of the substrate holder, which is adapted to receive the substrate to be treated, wherein the eighth and seventh fastening elements are two separated metallic chains running both linearly from said ninth fastening element to the upper side of the substrate holder, wherein the seventh and the eighth fastening element are each interconnected to the circular chain by the twelfth fastening element, wherein all these metallic chains in the second substrate holder part comprise a plurality of consecutive oblong holes, which comprise at the one end a circular fourth recess element; and that the first substrate holder part comprises the corresponding metallic fastening elements as counterpart to the respective fastening elements of the second substrate holder part.
In another preferred embodiment, the second and sixth fastening elements are permanently fixed elements, which are unmovable in their position, such as screws, bolts, pins or alike; that the seventh, eighth, ninth and twelfth fastening element are metallic chains, wherein the ninth fastening element is a rectangular, preferably a quadratic, metallic chain running around the site of the substrate holder, which is adapted to receive the substrate to be treated, wherein the eighth and seventh fastening elements are two separated metallic chains running both linearly from said ninth fastening element to the upper side of the substrate holder, wherein the seventh and the eighth fastening element are each interconnected to the rectangular, preferably a quadratic, metallic chain by the twelfth fastening element, wherein all these metallic chains in the second substrate holder part comprise a plurality of consecutive oblong holes, which comprise at the one end a circular fourth recess element; and that the first substrate holder part comprises the corresponding metallic fastening elements as counterpart to the respective fastening elements of the second substrate holder part.
This offers the advantage that the same fastening system can be used for both kind of substrates to be treated, circular ones and rectangular ones, wherein only the ninth fastening element has to be slightly constructive adapted. All conjunctions between the different fastening elements are and stay from their functional point of view identical. The term "metallic chain" refers to a metallic element, which is comprised of flexible metallic subunits, or a metallic element, which is comprised of one single piece.
In one embodiment, the first sealing element comprises a double sealing element lip, wherein both lips are arranged in such a manner that both lips can contact the surface of the substrate to be treated if inserted.
In another embodiment, the first sealing element comprises a double sealing element lip, wherein both sealing element lips are arranged in such a manner that both sealing element lips are directed to the substrate to be treated in the center of the substrate holder.
In one embodiment, the second sealing element and/or the third sealing element comprise each a double sealing element lip, wherein both sealing element lips are arranged between both substrate holder parts in such a manner that both sealing element lips are directed to the outside of the substrate holder.
In one embodiment, the second sealing element and/or the third sealing element comprise each a modified double sealing element lip, wherein two sealing element lips are arranged between both substrate holder parts in direction to the outside of the substrate holder and wherein simultaneously two sealing element lips are directed to both substrate holder parts.
Such a special sealing element is amending the prevention of treatment liquid passage in the substrate holder on the one hand, but on the other hand it also increases the required pressure for closing the substrate holder by pressing both substrate holder parts together after introducing a substrate to be treated inside it. The more rigid the sealing element becomes, the safer is the prevention of liquid passage, but also the more force or pressure is required to fasten both parts of the substrate holder to each other. It has been additionally found that such an inventive substrate holder of the present invention can be used for galvanic metal, in particular copper, deposition on substrates to be treated, in particular on semiconductor wafers.
The present invention thus addresses the problem of providing an amended substrate holder, which can be used for one side and two side metal depositions in an outstanding quality.
The following non-limiting examples are provided to illustrate an embodiment of the present invention and to facilitate understanding the invention, but are not intended to limit the scope of the invention, which is defined by the claims appended hereto.
Turning now to the Figures, Figure 1 shows a schematic front view of a first substrate holder part 1 in accordance with an embodiment of the present invention. Said first substrate holder part 1 comprises one hanging element 3 for mechanically connecting the substrate holder to a treatment container and one first sealing element 10 arranged between the site of the first substrate holder part 1 , where a substrate to be treated is adapted to be received, and the first substrate holder part 1 .
Furthermore, the first substrate holder part 1 comprises two second positioning elements 4 at the exterior opposite ends of the hanging element 3 for accurate mechanically positioning of the substrate holder in the treatment container.
Furthermore, the first substrate holder part 1 comprises a second sealing element 1 1 arranged between the inner metal comprising part of the first substrate holder part 1 and the outer non-metallic part of the first substrate holder part 1 .
Further, the first substrate holder part 1 comprises a third sealing element 12 arranged between the inner metal comprising part (non-metallic housing 6) of the first substrate holder part 1 and the outer non-metallic part of the first substrate holder part 1 , wherein said third sealing element 12 is more exterior than the second sealing element 1 1 .
There are also comprised three first recess elements 7 and three first positioning elements 9 for accurate central positioning of a substrate to be treated in the first substrate holder part 1 .
There is also comprised one first contact element 13 for forwarding current from an outer source through the hanging element 3 to the second contact element 16. Herein, in this embodiment, the hanging element 3 is identical to the first contact element 13 because said first contact element 13 is completely made of metal. But, in principle there are also alternatives possible with a defined first contact element being only a specific metal line inside of the hanging element 3. There is also comprised a second contact element 1 6 for forwarding current from the first contact element 13 to the substrate to be treated.
The first contact element 13 in one substrate holder part comprises at both exterior opposite ends directed to the outer current source a second recess element 5, while the first contact element 13 in the other substrate holder part provides a flat edge at both exterior opposite ends directed to the outer current source (better to see in Figure 7).
The first contact element 13 is mounted on an outer non-metallic housing 6 by a plurality of a first mounting element 14, while said first contact element 13 is connected to the hanging element 3 by two second mounting elements 15.
The second contact element 1 6 is formed in three parts, wherein each part of the second contact element 1 6 comprises in this embodiment 39 contact finger elements.
Additionally, the first substrate holder part 1 comprises a fastening system for detachably fastening said first substrate holder part 1 to a corresponding second substrate holder part 2 for holding the substrate to be treated. Herein, there is comprised a plurality of second 18, third 21 a, fourth 21 b and fifth 21 c fastening elements, and a plurality of third recess elements 19 in the first substrate holder part 1 . Herein, the second fastening elements 18 are permanently fixed elements, which are unmovable in their position, such as screws, bolts, and pins or alike. The first substrate holder part 1 comprises the fastening metallic fastening elements as counterpart to the respective fastening elements of the second substrate holder part 2.
There is further shown a third mounting element 17, which is an enhancement element for the second contact elements 1 6 for preventing that the contact fingers will bend or twist by applying pressure on them during providing physical contact between the metallic second contact element 16 and the substrate to be treated in the loading step. Said third mounting element 17 has the same partition as the second contact element, meaning if the second contact element comprises three parts, the third mounting element 17 is also comprised of three parts. A plurality of fourth mounting elements (screws) 25 have been used in the embodiment shown to mount the third mounting element 17 through the second contact element in the first contact element as will be better to see in Figure 5.
All mounting elements except the third mounting element 17 in the sense of the present invention can be selected of common mounting elements known to a skilled artisan, such as screws, bolts, and pins or alike.
The features of the first substrate holder part 1 , which are comprised in identical manner as well in the second substrate holder part 2 have not been again highlighted by the corresponding reference signs and will not be again discussed below for Figures 2 to 5, which are all based on the second substrate holder part 2 to avoid unnecessary repetition. These are the features having the following reference signs: 3-6, 10-17 and 25. Reference sign 9 has been chosen to be discussed for Figure 1 , even if the feature is also included in Figure 2. It is only supposed to underline that this feature according to the appended set of claims can only be composed in one of the two substrate holder parts, not in both. In which one is negligible. Thus, it has been included in both Figures 1 and 2 for illustration purposes.
Figure 2 shows a schematic front view of a second substrate holder part 2 in accordance with an embodiment of the present invention. As outlined above, there are only the features of the second substrate holder part 2 to be discussed, which are not included in Figure 1 .
Figure 2 discloses a fastening system comprising a plurality of first 8, sixth 20, seventh 22a, eighth 22b, ninth 22c, tenth 23, eleventh 24 and twelfth 26 fastening elements, and a plurality of fourth recess elements 27 in the second substrate holder part 2; wherein the second fastening elements 18 of the first substrate holder part 1 are in conjunction with the fourth recess element 27 of the second substrate holder part 2; and wherein the sixth fastening elements 20 of the second substrate holder part 2 are in conjunction with the third recess element 19 of the first substrate holder part 1 .
Herein, the sixth fastening elements 20 are permanently fixed elements, which are unmovable in their position, such as screws, bolts, and pins or alike. The seventh 22a, eighth 22b, ninth 22c and twelfth 26 fastening elements are metallic chains, wherein the ninth fastening element 22c is a circular metallic chain running around the site of the substrate holder, which is adapted to receive the substrate to be treated, wherein the eighth 22b and seventh 22a fastening elements are two separated metallic chains running both linearly from said ninth fastening element 22c to the upper side of the second substrate holder part 2, wherein the seventh 22a and the eighth 22b fastening element are each interconnected to the circular chain 22c by the twelfth fastening element 26, wherein all these metallic chains in the second substrate holder part 2 comprise a plurality of consecutive oblong holes, which comprise at the one end a circular fourth recess element 27. The first substrate holder part 1 comprises the respective corresponding metallic fastening elements as counterpart to the respective fastening elements of the second substrate holder part 2. The fastening system comprises three first fastening elements 8 in the second substrate holder part 2, which are designated to become in conjunction with the respective three first recess elements 7 of the first substrate holder part 1 .
Figure 3 shows a schematic enlarged front view of a part of the second substrate holder part 2 having a closed fastening system in accordance with the same embodiment of the present invention as shown in Figure 2.
Figure 4 shows another schematic enlarged front view of the same part of the second substrate holder part 2 having an opened fastening system in accordance with the same embodiment of the present invention as shown in Figure 2.
These two Figures have been included to allow a more detailed view on the fastening mechanism of the substrate holder itself and especially of the substrate holder part 2. As can be easily derived by said Figures 3 and 4, the locking mechanism for such a substrate holder functions by a shift of the position of the sixth fastening element 20, which is itself not movable, in relation to the seventh fastening element 22a par example. The only parts of the fastening system of the substrate holder, which are moving or can be moved at all, are the seventh 22a, eighth 22b, ninth 22c and twelfth 26 fastening elements.
The tenth 23 and eleventh 24 fastening elements serve the purpose of manually open and close the substrate holder by pushing or pressing the respective fastening element, which is more outside of the non-metallic outer housing 6.
Figure 5 shows another schematic enlarged perspective view of a part of the second substrate holder part 2 in accordance with the same embodiment of the present invention as shown in Figure 2.
Herein, it is remarkable that there is a small gap 28 between the third mounting element 17 and the second contact elements 1 6 in form of contact fingers on the one side and the first contact element 13, which possesses there a circular running edge. In a preferred embodiment of the present invention, the third mounting element 17 and the second contact elements 1 6 can also be arranged directly adjacent to this edge of the first contact element 13 thereby eliminating the gap 28.
This would offer the advantage that the accurate positioning of the substrates to be treated inside of this substrate holder becomes even more effective due to the fixed unchangeable alignment then between the aforementioned elements 13, 1 6 and 17. An undesired shift, bent, twist or deformation of the contact fingers as second contact element could be thereby avoided, even if relatively high pressure or forces are required for fastening both parts 1 and 2 of the substrate holder to each other during introducing a substrate to be treated.
Figure 6 shows a schematic side view of a specific possible second 1 1 and/or third 12 sealing element in accordance with an embodiment of the present invention. Such an alternative second 1 1 or third 12 sealing element comprise a modified double sealing element lip, wherein two sealing element lips can be arranged between both substrate holder parts in direction to the outside of the substrate holder. Simultaneously two sealing element lips are directed to both substrate holder parts 1 ,2.
Figure 7 shows a schematic perspective view on the hanging element 3 of the first 1 and the second 2 substrate holder part in accordance with an embodiment of the present invention.
Herein, the first contact element 13 in one substrate holder part 2 comprises at both exterior opposite ends directed to the outer current source a second recess element 5, while the first contact element 13 in the other substrate holder part 1 is a flat edge. Substrate holder parts 1 and 2 could also be exchanged. Therefore, the reference sign has been kept constant at 5, even if one area is flat and one comprises a recess.
Furthermore, there is again good to see that the substrate holder further comprises two second positioning elements 4 at the exterior opposite ends of each hanging element 3 for accurate mechanically positioning of the substrate holder in the treatment container.
It will be understood that the embodiments described herein are merely exemplary and that a person skilled in the art may make many variations and modifications without departing from the scope of the invention. All such variations and modifications, including those discussed above, are intended to be included within the scope of the invention as defined by the appended claims.
Reference signs
First substrate holder part
Second substrate holder part
Hanging element
Second positioning element
Second recess element
Non-metallic housing
First recess element
First fastening element
First positioning element
First sealing element
Second sealing element
Third sealing element
First contact element
First mounting element
Second mounting element
Second contact element
Third mounting element
Second fastening element
Third recess element
Sixth fastening element a,b,c Third, fourth and fifth fastening element a,b,c Seventh, eighth and ninth fastening element Tenth fastening element Eleventh fastening element Fourth mounting element Twelfth fastening element Fourth recess element Gap sealing element lip, which is directed to the outside of the substrate holder sealing element lip, which is directed to a substrate holder part

Claims

C L A I M S
1 . Substrate holder for vertical galvanic metal, preferably copper, deposition on a substrate to be treated comprising a first substrate holder part and a second substrate holder part, wherein both substrate holder parts comprise an inner metal comprising part and an outer non-metallic part characterized in that the substrate holder further comprises i) At least one hanging element in each substrate holder part for mechanically connecting the substrate holder to a treatment container, ii) At least one first sealing element in each substrate holder part arranged between the substrate to be treated and the respective substrate holder part, iii) At least one second sealing element for the entire substrate holder arranged between the inner metal comprising part of the substrate holder and the outer non-metallic part of the substrate holder, iv) At least one fastening system for detachably fastening both substrate holder parts to each other for holding the substrate to be treated, v) At least one first contact element in each substrate holder part for forwarding current from an outer source through the hanging element to the at least second contact element, and vi) At least one second contact element in each substrate holder part for forwarding current from the at least first contact element to the substrate to be treated.
2. Substrate holder according to claim 1 characterized in that the substrate holder further comprises at least one third sealing element for the entire substrate holder arranged between the inner metal comprising part of the substrate holder and the outer non-metallic part of the substrate holder, wherein said third sealing element is more exterior than the second sealing element.
3. Substrate holder according to claims 1 or 2 characterized in that the fastening system comprises at least two, preferably three, first recess elements in the first substrate holder part and at least two, preferably three, first fastening elements in the second substrate holder part, wherein said first fastening elements are in conjunction with the respective first recess elements.
4. Substrate holder according to one of the preceding claims characterized in that the substrate holder further comprises at least two, preferably three, first positioning elements in one substrate holder part for accurate central positioning of the at least one substrate to be treated.
5. Substrate holder according to one of the preceding claims characterized in that the substrate holder further comprises at least two second positioning elements at the exterior opposite ends of each hanging element for accurate mechanically positioning of the substrate holder in the treatment container.
6. Substrate holder according to one of the preceding claims characterized in that the second contact element in each substrate holder part is formed in multiple parts, preferably in at least three parts.
7. Substrate holder according to one of the preceding claims characterized in that the second contact element in each substrate holder part comprises a plurality of contact finger elements.
8. Substrate holder according to claims 6 and 7 characterized in that the second contact element in each substrate holder part is formed in multiple parts, wherein each part of the second contact element comprises at least one, preferably at least 15, more preferably at least 25, contact finger elements.
9. Substrate holder according to one of the preceding claims characterized in that the first contact element in one substrate holder part comprises at both exterior opposite ends directed to the outer current source a second recess element, while the first contact element in the other substrate holder part is a flat edge.
10. Substrate holder according to one of the preceding claims characterized in that the fastening system further comprises at least a plurality of second, third, fourth and fifth fastening elements, and a plurality of third recess elements in the first substrate holder part; while the fastening system further comprises at least a plurality of sixth, seventh, eighth, ninth, tenth, eleventh and twelfth fastening elements, and a plurality of fourth recess elements in the second substrate holder part; wherein the second fastening elements of the first substrate holder part are in conjunction with the fourth recess element of the second substrate holder part; and wherein the sixth fastening elements of the second substrate holder part are in conjunction with the third recess element of the first substrate holder part.
1 1 . Substrate holder according to claim 10 characterized in that the second and sixth fastening elements are permanently fixed elements, which are unmovable in their position, such as screws, bolts, pins or alike; that the seventh, eighth, ninth and twelfth fastening element are metallic chains, wherein the ninth fastening element is a circular metallic chain running around the site of the substrate holder, which is adapted to receive the substrate to be treated, wherein the eighth and seventh fastening elements are two separated metallic chains running both linearly from said ninth fastening element to the upper side of the substrate holder, wherein the seventh and the eighth fastening element are each interconnected to the circular chain by the twelfth fastening element, wherein all these metallic chains in the second substrate holder part comprises a plurality of consecutive oblong holes, which comprise at the one end a circular fourth recess element; and that the first substrate holder part comprises the corresponding metallic fastening elements as counterpart to the respective fastening elements of the second substrate holder part.
12. Substrate holder according to one of the preceding claims characterized in that the first sealing element comprise a double sealing element lip, wherein both lips are arranged in such a manner that both lips can contact the surface of the substrate to be treated if inserted.
13. Substrate holder according to one of the preceding claims characterized in that the second sealing element and/or the third sealing element comprise each a double sealing element lip, wherein both sealing element lips are arranged between both substrate holder parts in such a manner that both sealing element lips are directed to the outside of the substrate holder.
14. Substrate holder according to one of the preceding claims characterized in that the second sealing element and/or the third sealing element comprise each a modified double sealing element lip, wherein two sealing element lips are arranged between both substrate holder parts in direction to the outside of the substrate holder and wherein simultaneously two sealing element lips are directed to both substrate holder parts.
15. Use of a substrate holder according to one of claims 1 to 14 for galvanic metal, in particular copper, deposition on substrates to be treated, in particular semiconductor wafers.
PCT/EP2015/079932 2014-12-19 2015-12-16 Substrate holder for vertical galvanic metal deposition WO2016096946A1 (en)

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US15/533,712 US10407793B2 (en) 2014-12-19 2015-12-16 Substrate holder for vertical galvanic metal deposition
CN201580068840.4A CN107109682B (en) 2014-12-19 2015-12-16 Substrate holder for vertical deposition plating metal
KR1020177020009A KR102010681B1 (en) 2014-12-19 2015-12-16 Substrate holder for vertical galvanic metal deposition
JP2017533261A JP6590933B2 (en) 2014-12-19 2015-12-16 Substrate holder for vertical galvanic metal deposition

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3309279A1 (en) 2016-10-14 2018-04-18 ATOTECH Deutschland GmbH Wafer-like substrate processing method, apparatus and use thereof
WO2018068983A1 (en) 2016-10-14 2018-04-19 Atotech Deutschland Gmbh Wafer-like substrate processing method, apparatus and use thereof
US10832929B2 (en) 2016-10-14 2020-11-10 Atotech Deutschland Gmbh Wafer-like substrate processing method and apparatus
EP3376530A1 (en) 2017-03-16 2018-09-19 ATOTECH Deutschland GmbH Automated substrate holder loading device
WO2018166757A1 (en) 2017-03-16 2018-09-20 Atotech Deutschland Gmbh Automated substrate holder loading device

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US10407793B2 (en) 2019-09-10
EP3034657A1 (en) 2016-06-22
KR20170096029A (en) 2017-08-23
TWI679726B (en) 2019-12-11
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CN107109682B (en) 2019-05-28
JP2018503745A (en) 2018-02-08

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