WO2016095331A1 - 透明柔性封装衬底及柔性oled封装方法 - Google Patents

透明柔性封装衬底及柔性oled封装方法 Download PDF

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Publication number
WO2016095331A1
WO2016095331A1 PCT/CN2015/072496 CN2015072496W WO2016095331A1 WO 2016095331 A1 WO2016095331 A1 WO 2016095331A1 CN 2015072496 W CN2015072496 W CN 2015072496W WO 2016095331 A1 WO2016095331 A1 WO 2016095331A1
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Prior art keywords
flexible
polymer layer
glass
transparent
flexible glass
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French (fr)
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邹清华
王宜凡
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US14/424,536 priority Critical patent/US20160343993A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/286—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a transparent flexible package substrate and a flexible OLED package method.
  • the flat display device has many advantages such as thin body, power saving, no radiation, and has been widely used.
  • the existing flat display devices mainly include a liquid crystal display (LCD) and an organic light emitting display (OLED).
  • OLED display devices have become the most promising new display devices in recent years due to their advantages of self-luminescence, all solid state, and high contrast.
  • the biggest feature of OLED display devices is that flexible display can be realized.
  • Flexible display devices made of flexible substrates and which are light, flexible and portable are important development directions of OLED display devices.
  • the conventional OLED display device uses a rigid glass substrate with low permeability to oxygen and water vapor, which can better protect the device.
  • the flexible substrate applied to the flexible organic electroluminescent device is mainly a polymer substrate, and the polymer substrate is light, thin, strong and flexible, but the free volume fraction of the polymer substrate itself is small and the average segment is free. The greater the degree, it is easy to be penetrated by water and oxygen, shortening the life of organic light-emitting devices.
  • the metal material can exhibit excellent flexibility when its thickness reaches 100 ⁇ m or less, and is excellent in heat resistance and low in thermal expansion coefficient compared with the polymer, and particularly, there is no problem of water and oxygen permeation, and is very suitable.
  • a substrate material of a flexible organic electroluminescent device as shown in FIG. 1, there is a polymer-metal composite flexible package substrate comprising: a first polymer layer 10 disposed on the first polymer layer 10 The metal foil 20 above is disposed on the second polymer layer 30 above the metal foil 20.
  • the surface size of the metal foil 20 is larger than the surface dimensions of the first polymer layer 10 and the second polymer layer 30, which reduces the influence of the external environment on the package device, prolongs the life of the device, and has a simple manufacturing process. The cost is lower.
  • such flexible substrates prepared using metallic materials are not transparent, limiting their range of applications.
  • Willow Glass is a new type of glass material. Compared with metal materials, the flexible glass material also has good flexibility and water and oxygen barrier ability, and it is a transparent material.
  • the object of the present invention is to provide a flexible OLED packaging method, which is packaged by using the transparent flexible package substrate provided by the present invention, which can achieve good flexibility, excellent water and oxygen barrier properties and transparent characteristics, and can be applied to many applications.
  • a package for an OLED display device is to provide.
  • the present invention firstly provides a transparent flexible package substrate comprising: a flexible glass, an insulating rubber layer disposed on one side of the flexible glass, and a polymer layer disposed on the other side of the flexible glass;
  • the surface of the flexible glass is larger than the surface of the polymer layer
  • the surface of the flexible glass has a surface size equal to or smaller than a surface size of the insulating rubber layer.
  • the flexible glass has a thickness of less than 100 um.
  • the polymer layer has a thickness of 5 to 100 um.
  • the host material of the polymer layer is polyimide, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, or polyether sulfone filled with a desiccant.
  • the host material of the insulating rubber layer is an acrylic resin body or an epoxy resin body in which nanofibers or nanoparticles are filled.
  • the invention also provides a flexible OLED packaging method, comprising the following steps:
  • Step 1 Providing a flexible glass, forming a desiccant-rich polymer layer on one side of the flexible glass;
  • Step 2 forming an insulating rubber layer containing nanofibers or nanoparticles on the other side of the flexible glass to form the transparent flexible packaging substrate;
  • Step 3 coating a plurality of flexible encapsulants on one side of the polymer layer of the transparent flexible package substrate, or directly coating the flexible encapsulant on the polymer layer side of the transparent flexible package substrate;
  • Step 4 align the prepared flexible OLED substrate with the transparent flexible package substrate, wherein the OLED device is disposed corresponding to the polymer layer, and the flexible OLED substrate is adhered to the transparent flexible package substrate by the flexible encapsulant The flexible encapsulant is then UV cured or thermally cured to form a sealed flexible OLED display device.
  • the specific step of the step 1 is: directly attaching a desiccant-rich polymer layer on one side of the flexible glass, or: coating a desiccant-rich polymer precursor solution on the flexible glass side, and then curing Forming a polymer layer;
  • the host material of the polymer layer is polyimide, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, or polyether sulfone, which is filled with Desiccant.
  • the specific step of the step 2 is: directly attaching the nanofiber on the other side of the flexible glass An insulating rubber layer of a dimension or a nanoparticle, or an insulating rubber material containing nanofibers or nanoparticles coated on the other side of the flexible glass, and then cured to form an insulating rubber layer; the insulating rubber layer
  • the host material is an acrylic resin body or an epoxy resin body in which nanofibers or nanoparticles are filled.
  • the thickness of the flexible glass provided in the step 1 is less than 100 um, and the thickness of the polymer layer is 5 to 100 um.
  • the flexible OLED display substrate provided in the step 4 includes: a flexible substrate, and an OLED light emitting element disposed on the flexible substrate.
  • the present invention also provides a transparent flexible package substrate comprising: flexible glass, an insulating rubber layer disposed on one side of the flexible glass, and a polymer disposed on the other side of the flexible glass;
  • the surface of the flexible glass is larger than the surface of the polymer layer
  • the surface dimension of the flexible glass is less than or equal to the surface size of the insulating rubber layer
  • the thickness of the flexible glass is less than 100 um;
  • the polymer layer has a thickness of 5 to 100 um.
  • the present invention provides a transparent flexible package substrate which has excellent flexibility and water and oxygen barrier ability, and is prepared by using a flexible glass material in a transparent flexible package.
  • the substrate has a wide range of applications.
  • the present invention also provides a flexible OLED packaging method, which is packaged by using the transparent flexible packaging substrate provided by the invention, and can be applied to various OLED displays by utilizing its good flexibility, excellent water-blocking oxygen barrier property and transparent property.
  • the device is packaged and has a wide range of applications.
  • FIG. 1 is a schematic structural view of a conventional polymer-metal composite flexible package substrate
  • FIG. 2 is a schematic structural view of a transparent flexible package substrate of the present invention
  • FIG. 3 is a flow chart of a flexible OLED packaging method of the present invention.
  • FIG. 4 is a schematic structural view of a first embodiment of a flexible OLED packaging method according to the present invention.
  • FIG. 5 is a schematic structural view of a second embodiment of a flexible OLED packaging method according to the present invention.
  • the present invention provides a transparent flexible package substrate comprising: a flexible glass 2, an insulating rubber layer 1 disposed on one side of the flexible glass 2, and a polymer layer 3 disposed on the other side of the flexible glass 2. ;
  • the surface of the flexible glass 2 is larger than the surface of the polymer layer 3;
  • the surface size of the flexible glass 2 is equal to or smaller than the surface size of the insulating rubber layer 1.
  • the thickness of the flexible glass 2 is less than 100 um, and preferably, the thickness of the flexible glass 2 is 30 to 60 um.
  • the main material of the polymer layer 3 is a high-strength functional material polymer such as polyimide, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, or polyether sulfone. It is filled with a desiccant. Further, the polymer layer 3 has a thickness of 5 to 100 um.
  • the main body material of the insulating rubber layer 1 is an acrylic resin body or an epoxy resin body in which nanofibers or nanoparticles are filled, which can enhance the strength of the entire transparent flexible packaging substrate.
  • the present invention further provides a flexible OLED packaging method, including the following steps:
  • Step 1 providing a flexible glass 2, forming a desiccant-rich polymer layer 3 on one side of the flexible glass 2;
  • the thickness of the provided flexible glass 2 is less than 100um, preferably 30 to 60um;
  • the specific step of the step 1 is: directly attaching the desiccant-rich polymer layer 3 on the flexible glass 2 side, or: coating the desiccant-rich polymer precursor solution on the flexible glass 2 side, and then Curing to form polymer layer 3;
  • the host material of polymer layer 3 is polyimide, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, or polyether A sulfone filled with a desiccant.
  • the polymer layer 3 has a thickness of 5 to 100 um.
  • Step 2 forming an insulating rubber material layer 1 containing nanofibers or nanoparticles on the other side of the flexible glass 2 to form the transparent flexible packaging substrate;
  • the specific step of the step 2 is: directly coating the insulating rubber layer 1 containing nanofibers or nanoparticles on the other side of the flexible glass 2, or coating the nanofiber or nanometer on the other side of the flexible glass 2
  • the insulating rubber material of the particles is further cured to form the insulating rubber layer 1;
  • the main material of the insulating rubber material layer 1 is an acrylic resin body or an epoxy resin body filled with nanofibers or nanoparticles.
  • nanofibers or nanoparticles can further enhance the strength of the entire transparent flexible packaging substrate.
  • Step 3 as shown in FIG. 4, on the side of the polymer layer 3 side of the transparent flexible package substrate Applying a plurality of flexible encapsulants 7 or, as shown in FIG. 5, directly coating the flexible encapsulant 7 on the polymer layer 3 side of the transparent flexible package substrate;
  • Step 4 align the prepared flexible OLED substrate with the transparent flexible package substrate, wherein the OLED device is disposed corresponding to the polymer layer 3, and the flexible OLED substrate is adhered to the transparent flexible package liner through the flexible encapsulant 7 On the bottom, the flexible encapsulant 7 is then UV cured or thermally cured to form a sealed flexible OLED display device.
  • the flexible OLED display substrate provided in the step 4 includes: a flexible substrate 4 and an OLED light emitting element 5 disposed on the flexible substrate 4, wherein the package substrate is a transparent flexible package substrate, and the OLED element 5 It can be a top or bottom light, which can be selected as needed, without being limited by the package substrate.
  • the present invention provides a transparent flexible package substrate having excellent flexibility and water and oxygen barrier capability, and is prepared by using a flexible glass material, and is a transparent flexible package substrate, and has a wide application range.
  • the invention also provides a flexible OLED packaging method, which is packaged by using the transparent flexible packaging substrate provided by the invention, and can be applied to various OLED displays by utilizing its good flexibility, excellent water blocking and oxygen barrier properties and transparent characteristics. The package of the device.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Packages (AREA)

Abstract

一种透明柔性封装衬底及柔性OLED封装方法，包括：柔性玻璃(2)、设于柔性玻璃(2)的一侧的绝缘胶材层(1)、设于柔性玻璃(2)另一侧的聚合物层(3)；所述柔性玻璃(2)的表面尺寸大于聚合物层(3)的表面尺寸；所述柔性玻璃(2)的表面尺寸小于等于绝缘胶材层(1)的表面尺寸。该透明柔性封装衬底具有优异的柔韧性与阻水阻氧能力，且其采用柔性玻璃材料制备，为透明的柔性封装衬底，应用范围广阔，可以应用于多种OLED显示器件的封装。

Description

透明柔性封装衬底及柔性OLED封装方法 技术领域
本发明涉及显示技术领域，尤其涉及一种透明柔性封装衬底及柔性OLED封装方法。
背景技术
平面显示器件具有机身薄、省电、无辐射等众多优点，得到了广泛的应用。现有的平面显示器件主要包括液晶显示器件(Liquid Crystal Display，LCD)及有机电致发光显示器件(Organic Light Emitting Display，OLED)。
OLED显示器件以其自发光、全固态、高对比度等优点，成为近年来最具潜力的新型显示器件。而OLED显示器件最大的特点在于可以实现柔性显示，采用柔性衬底制成重量轻、可弯曲、便于携带的柔性显示器件是OLED显示器件的重要发展方向。
传统的OLED显示器件采用的硬质玻璃衬底对氧气和水汽具有低渗透性，能够较好的保护器件。应用于柔性有机电致发光器件的柔性衬底目前主要为聚合物衬底，聚合物衬底轻薄、坚固且柔韧性极佳，但由于聚合物衬底本身自由体积分数较小且链段平均自由度较大，决定了其容易被水和氧气渗透，缩短有机发光器件寿命。
金属材料在其厚度达到100μm以下时，能够表现出优异的可挠性，并且与聚合物相比，耐热性能优异且热膨胀系数很低，特别是不存在水和氧气渗透的问题，非常适于用作柔性有机电致发光器件的衬底材料，如图1所示，现有一种聚合物-金属复合柔性封装衬底，其包括：第一聚合物层10，设置于第一聚合物层10之上的金属箔片20，设置于金属箔片20之上的第二聚合物层30。其中，所述金属箔片20的表面尺寸大于所述第一聚合物层10和第二聚合物层30的表面尺寸，降低了外界环境对封装器件的影响，延长了器件寿命，且制造工艺简单、成本较低。然而这种采用金属材料制备的柔性衬底不是透明的，限制了其应用范围。柔性玻璃(Willow Glass)是一种新型的玻璃材料，相对于金属材料，所述柔性玻璃材料同样具备良好的柔韧性与阻水阻氧能力，且其为透明材料。
发明内容
本发明的目的在于提供一种透明柔性封装衬底，用于柔性OLED的封 装，具备良好的柔韧性和优异的阻水阻氧性能，采用透明材料制备，扩大其应用范围。
本发明的目的还在于提供一种柔性OLED封装方法，采用本发明提供的透明柔性封装衬底进行封装，可以实现良好的柔韧性、优异的阻水阻氧性能和透明的特性，能够应用于多种OLED显示器件的封装。
为实现上述目的，本发明首先提供一种透明柔性封装衬底，包括：柔性玻璃、设于柔性玻璃的一侧的绝缘胶材层、设于柔性玻璃另一侧的聚合物层；
所述柔性玻璃的表面尺寸大于聚合物层的表面尺寸；
所述柔性玻璃的表面尺寸小于等于绝缘胶材层的表面尺寸。
所述柔性玻璃的厚度小于100um。
所述聚合物层厚度为5至100um。
所述聚合物层的主体材料为聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、或聚醚砜，其中填充有干燥剂。
所述绝缘胶材层的主体材料为丙烯酸类树脂体或环氧类树脂体，其中填充有纳米纤维或者纳米颗粒。
本发明还提供一种柔性OLED封装方法，包括如下步骤：
步骤1、提供一柔性玻璃、在所述柔性玻璃的一侧形成富含干燥剂的聚合物层；
步骤2、在所述柔性玻璃的另一侧形成含有纳米纤维或者纳米颗粒的绝缘胶材层，形成所述透明柔性封装衬底；
步骤3、在所述透明柔性封装衬底的聚合物层一侧边缘涂布多条柔性封装胶材，或者直接在透明柔性封装衬底的聚合物层一侧整面涂布柔性封装胶材；
步骤4、将制备好的柔性OLED基板与该透明柔性封装衬底对组，其中，OLED器件对应于聚合物层设置，通过柔性封装胶材将柔性OLED基板粘附于该透明柔性封装衬底上，然后对柔性封装胶材进行UV固化或者热固化，形成密封的柔性OLED显示装置。
所述步骤1的具体步骤为：在柔性玻璃一侧直接粘贴富含干燥剂的聚合物层，或者是：在柔性玻璃一侧涂布富含干燥剂的聚合物前驱体溶液，再进行固化以形成聚合物层；所述聚合物层的主体材料为聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、或聚醚砜，其中填充有干燥剂。
所述步骤2的具体步骤为：在柔性玻璃的另一侧直接粘贴含有纳米纤 维或者纳米颗粒的绝缘胶材层，或者是：在柔性玻璃的另一侧涂布含有纳米纤维或者纳米颗粒的绝缘胶材，再进行固化以形成绝缘胶材层；所述绝缘胶材层的主体材料为丙烯酸类树脂体或环氧类树脂体，其中填充有纳米纤维或者纳米颗粒。
所述步骤1中提供的柔性玻璃的厚度小于100um，所述聚合物层的厚度为5至100um。
所述步骤4中提供的柔性OLED显示基板包括：柔性基板、及设于所述柔性基板上的OLED发光元件。
本发明还提供一种透明柔性封装衬底，包括：柔性玻璃、设于柔性玻璃的一侧的绝缘胶材层、设于柔性玻璃另一侧的聚合物；
所述柔性玻璃的表面尺寸大于聚合物层的表面尺寸；
所述柔性玻璃的表面尺寸小于等于绝缘胶材层的表面尺寸；
其中，所述柔性玻璃的厚度小于100um；
其中，所述聚合物层为厚度为5至100um。
本发明的有益效果：本发明提供了一种透明柔性封装衬底，所述透明柔性封装衬底具有优异的柔韧性与阻水阻氧能力，且其采用柔性玻璃材料制备，为透明的柔性封装衬底，应用范围广阔。本发挥还提供一种柔性OLED封装方法，采用本发明提供的透明柔性封装衬底进行封装，利用其良好的柔韧性、优异的阻水阻氧性能和透明的特性，可应用于多种OLED显示器件的封装，应用范围广阔。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为现有的聚合物-金属复合柔性封装衬底的结构示意图；
图2为本发明的透明柔性封装衬底的结构示意图；
图3为本发明的柔性OLED封装方法的流程图；
图4为本发明的柔性OLED封装方法的第一实施例的结构示意图；
图5为本发明的柔性OLED封装方法的第二实施例的结构示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图2，本发明提供一种透明柔性封装衬底，包括：柔性玻璃2、设于柔性玻璃2的一侧的绝缘胶材层1、设于柔性玻璃2另一侧的聚合物层3；
所述柔性玻璃2的表面尺寸大于聚合物层3的表面尺寸；
所述柔性玻璃2的表面尺寸小于等于绝缘胶材层1的表面尺寸。
具体的，所述柔性玻璃2的厚度小于100um，优选的，柔性玻璃2的厚度为30至60um。
所述聚合物层3的主体材料为聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、或聚醚砜等高强度的功能材料聚合物，其中填充有干燥剂。进一步的，所述聚合物层3的厚度为5至100um。
所述绝缘胶材层1的主体材料为丙烯酸类树脂体或环氧类树脂体，其中填充有纳米纤维或者纳米颗粒，可以增强整个透明柔性封装衬底的强度。
请参阅图3-5，本发明还提供一种柔性OLED封装方法，包括如下步骤：
步骤1、提供一柔性玻璃2、在所述柔性玻璃2的一侧形成富含干燥剂的聚合物层3；
具体的，提供的柔性玻璃2的厚度小于100um，优选为30至60um；
所述步骤1的具体步骤为：在柔性玻璃2一侧直接粘贴富含干燥剂的聚合物层3，或者是：在柔性玻璃2一侧涂布富含干燥剂的聚合物前驱体溶液，再进行固化以形成聚合物层3；所述聚合物层3的主体材料为聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、或聚醚砜，其中填充有干燥剂。该聚合物层3的厚度为5至100um。
步骤2、在所述柔性玻璃2的另一侧形成含有含有纳米纤维或者纳米颗粒的绝缘胶材层1，形成所述透明柔性封装衬底；
所述步骤2的具体步骤为：在柔性玻璃2的另一侧直接粘贴含有纳米纤维或者纳米颗粒的绝缘胶材层1，或者是：在柔性玻璃2的另一侧涂布含有纳米纤维或者纳米颗粒的绝缘胶材，再进行固化以形成绝缘胶材层1；所述绝缘胶材层1的主体材料为丙烯酸类树脂体或环氧类树脂体，其中填充有纳米纤维或者纳米颗粒。
在绝缘胶材层1中加入纳米纤维或者纳米颗粒可以进一步增强整个透明柔性封装衬底的强度。
步骤3、如图4所示，在所述透明柔性封装衬底的聚合物层3一侧边缘 涂布多条柔性封装胶材7，或者，如图5所示，直接在透明柔性封装衬底的聚合物层3一侧整面涂布柔性封装胶材7；
步骤4、将制备好的柔性OLED基板与该透明柔性封装衬底对组，其中，OLED器件对应于聚合物层3设置，通过柔性封装胶材7将柔性OLED基板粘附于该透明柔性封装衬底上，然后对柔性封装胶材7进行UV固化或者热固化，形成密封的柔性OLED显示装置。
所述步骤4中提供的柔性OLED显示基板包括：柔性基板4、及设于所述柔性基板4上的OLED发光元件5，因该封装衬底为透明柔性封装衬底，所述的OLED元件5可以为顶发光或者底发光，可根据需要进行选择，不受封装衬底的限制。
综上所述，本发明提供的一种透明柔性封装衬底，具有优异的柔韧性与阻水阻氧能力，且其采用柔性玻璃材料制备，为透明的柔性封装衬底，应用范围广阔。本发明还提供一种柔性OLED封装方法，采用本发明提供的透明柔性封装衬底进行封装，利用其良好的柔韧性、优异的阻水阻氧性能和透明的特性，可应用于多种OLED显示器件的封装。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (13)

  1. 一种透明柔性封装衬底，包括：柔性玻璃、设于柔性玻璃的一侧的绝缘胶材层、设于柔性玻璃另一侧的聚合物；
    所述柔性玻璃的表面尺寸大于聚合物层的表面尺寸；
    所述柔性玻璃的表面尺寸小于等于绝缘胶材层的表面尺寸。
  2. 如权利要求1所述的透明柔性封装衬底，其中，所述柔性玻璃的厚度小于100um。
  3. 如权利要求1所述的透明柔性封装衬底，其中，所述聚合物层为厚度为5至100um。
  4. 如权利要求3所述的透明柔性封装衬底，其中，所述聚合物层的主体材料为聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、或聚醚砜，其中填充有干燥剂。
  5. 如权利要求1所述的透明柔性封装衬底，其中，所述绝缘胶材层的主体材料为丙烯酸类树脂体或环氧类树脂体，其中填充有纳米纤维或者纳米颗粒。
  6. 一种柔性OLED封装方法，包括如下步骤：
    步骤1、提供一柔性玻璃、在所述柔性玻璃的一侧形成富含干燥剂的聚合物层；
    步骤2、在所述柔性玻璃的另一侧形成含有纳米纤维或者纳米颗粒的绝缘胶材层，形成所述透明柔性封装衬底；
    步骤3、在所述透明柔性封装衬底的聚合物层一侧边缘涂布多条柔性封装胶材，或者直接在透明柔性封装衬底的聚合物层一侧整面涂布柔性封装胶材；
    步骤4、将制备好的柔性OLED基板与该透明柔性封装衬底对组，其中，OLED器件对应于聚合物层设置，通过柔性封装胶材将柔性OLED基板粘附于该透明柔性封装衬底上，然后对柔性封装胶材进行UV固化或者热固化，形成密封的柔性OLED显示装置。
  7. 如权利要求6所述的柔性OLED封装方法，其中，所述步骤1的具体步骤为：在柔性玻璃一侧直接粘贴富含干燥剂的聚合物层，或者是：在柔性玻璃一侧涂布富含干燥剂的聚合物前驱体溶液，再进行固化以形成聚合物层；所述聚合物层的主体材料为聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、或聚醚砜，其中填充有干燥剂。
  8. 如权利要求6所述的柔性OLED封装方法，其中，所述步骤2的具体步骤为：在柔性玻璃的另一侧直接粘贴含有纳米纤维或者纳米颗粒的绝缘胶材层，或者是：在柔性玻璃的另一侧涂布含有纳米纤维或者纳米颗粒的绝缘胶材，再进行固化以形成绝缘胶材层；所述绝缘胶材层的主体材料为丙烯酸类树脂体或环氧类树脂体，其中填充有纳米纤维或者纳米颗粒。
  9. 如权利要求6所述的柔性OLED封装方法，其中，所述步骤1中提供的柔性玻璃的厚度小于100um，所述聚合物层的厚度为5至100um。
  10. 如权利要求6所述的柔性OLED封装方法，其中，所述步骤4中提供的柔性OLED显示基板包括：柔性基板、及设于所述柔性基板上的OLED发光元件。
  11. 一种透明柔性封装衬底，包括：柔性玻璃、设于柔性玻璃的一侧的绝缘胶材层、设于柔性玻璃另一侧的聚合物；
    所述柔性玻璃的表面尺寸大于聚合物层的表面尺寸；
    所述柔性玻璃的表面尺寸小于等于绝缘胶材层的表面尺寸；
    其中，所述柔性玻璃的厚度小于100um；
    其中，所述聚合物层为厚度为5至100um。
  12. 如权利要求11所述的透明柔性封装衬底，其中，所述聚合物层的主体材料为聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、或聚醚砜，其中填充有干燥剂。
  13. 如权利要求11所述的透明柔性封装衬底，其中，所述绝缘胶材层的主体材料为丙烯酸类树脂体或环氧类树脂体，其中填充有纳米纤维或者纳米颗粒。
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