WO2016090746A1 - Oled器件 - Google Patents
Oled器件 Download PDFInfo
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- WO2016090746A1 WO2016090746A1 PCT/CN2015/072467 CN2015072467W WO2016090746A1 WO 2016090746 A1 WO2016090746 A1 WO 2016090746A1 CN 2015072467 W CN2015072467 W CN 2015072467W WO 2016090746 A1 WO2016090746 A1 WO 2016090746A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- the present invention relates to the field of display technologies, and in particular, to an OLED device.
- OLED Organic Light Emitting Diode
- LCD liquid crystal display
- the OLED device generally includes a glass substrate, an OLED thin film device disposed on the glass substrate, and a package cover for resisting the external environment and preventing moisture and oxygen from entering the inside of the OLED device, and the package cover usually adopts another glass plate.
- the OLED thin film device generally includes an ITO transparent anode placed on a glass substrate, a hole injection layer (HIL) placed on the transparent anode of the ITO, a hole transport layer (HTL) placed on the hole injection layer, and placed in an empty space.
- the luminescent layer usually employs a host/guest doping system.
- the glass sheet Since the glass sheet has sharp edges, it is susceptible to problems such as improper protection during handling and is fragile when subjected to mechanical loads, and such problems are more apparent when applied to large-sized OLED devices. Moreover, glass sheets (substrates or package covers) are difficult to apply to conventional locations such as screwing, clamping, drilling, etc. to mount the OLED device to a desired location, such as a wall.
- Existing OLED devices are typically provided with a conventional housing that can provide a mechanical package around the exterior of the OLED device, but does not directly contact the OLED device over the entire housing region. Since the mechanical robustness of the OLED device itself is not improved, when a mechanical collision occurs, a mechanical collision also acts on the OLED device inside the casing and eventually damages the OLED device. There is also a housing in which the OLED device is embedded inside the housing to improve the mechanical properties of the OLED device embedded in the housing, but the housing does not directly seal the OLED device, providing a better airtightness for the OLED thin film device. Sexual protection.
- the present invention provides an OLED device, comprising: a substrate, an OLED thin film device disposed on the substrate, an organic packaging film disposed on the substrate and completely covering the OLED thin film device, and disposed on the substrate An inorganic encapsulating film completely covering the organic encapsulating film, a protective cover sealed to the peripheral edge of the substrate and covering the inorganic encapsulating film, and a protective cover disposed away from the substrate A rigid support plate on the side.
- a cooling member is disposed on a side of the rigid support plate away from the substrate.
- the OLED device further includes a driver controller adjacent to the substrate and housed in the protective cover, an electronic driver adjacent to the driver controller and housed in the protective cover, An electrical contact adjacent the electronic driver and housed in the protective cover; the electrical contact portion is exposed to a side of the protective cover.
- the protective cover is provided with a first accommodating portion and second, third and fourth accommodating portions opposite to the opening direction of the first accommodating portion, and the substrate is accommodated in the first In the accommodating portion, the driver controller, the electronic driver, and the electrical contactor are respectively received in the second, third, and fourth accommodating portions.
- a gap is left between the protective cover and the inorganic encapsulating film.
- the upper and lower surfaces of the organic encapsulating film are adhesive, and the material thereof is parylene, polychloro-p-xylene or polydichloro-p-xylene.
- the material of the inorganic encapsulating film is silicon nitride, silicon oxide, aluminum oxide or zirconium oxide.
- the material of the protective covering is plastic, which is prepared by an injection molding process.
- the rigid support plate is a stainless steel plate.
- the material of the cooling member is aluminum or copper.
- the present invention also provides an OLED device, comprising: a substrate, an OLED thin film device disposed on the substrate, an organic packaging film disposed on the substrate and completely covering the OLED thin film device, and being completely covered on the substrate An inorganic encapsulating film of the organic encapsulating film, a protective covering sealed around the peripheral edge of the substrate and covering the inorganic encapsulating film, and a rigidity disposed on a side of the protective covering away from the substrate Support plate
- a cooling member is disposed on a side of the rigid support plate away from the substrate;
- driver controller adjacent to the substrate and housed in the protective cover
- electronic driver adjacent to the driver controller and housed in the protective cover
- An electrical contact adjacent to the electronic driver and housed in the protective cover; the electrical connection The contact portion is exposed to a side of the protective cover;
- the present invention provides an OLED device in which an organic packaging film and an inorganic packaging film are covered on an OLED thin film device, and a protective cover which is sealed and connected to the peripheral edge of the substrate is covered over the inorganic packaging film, and A rigid support plate is disposed on a side of the protective cover away from the substrate, thereby effectively protecting the OLED device, so that the mechanical performance of the OLED device is significantly improved, and it is not easy to be damaged by an external force, and at the same time, it can provide better OLED thin film devices.
- the airtight protection ensures the performance of the OLED thin film device and prolongs its service life.
- the protective cover the OLED device is more easily mounted to any desired location by conventional securing means.
- FIG. 1 is a schematic cross-sectional view of an OLED device of the present invention.
- an OLED device includes a substrate 1 , an OLED thin film device 2 disposed on the substrate 1 , and an organic packaging film 3 disposed on the substrate 1 and completely covering the OLED thin film device 2 .
- the OLED device further includes a driver controller 8 adjacent to the substrate 1 and housed in the protective cover 5, adjacent to the driver controller 8 and accommodated in the protection cover An electronic driver 9 in the object 5, an electrical contact 10 adjacent to the electronic driver 9 and housed in the protective cover 5, the electrical contact 10 being partially exposed to the side of the protective cover 5 The part is used to electrically connect to an external power source to drive the OLED device.
- a cooling member 7 is disposed on a side of the rigid support plate 6 away from the substrate 1.
- the protective cover 5 is provided with a first accommodating portion 51 and second, third and fourth accommodating portions 52, 53, 54 opposite to the opening direction of the first accommodating portion 51. .
- the substrate 1 The driver controller 8, the electronic driver 9, and the electrical contactor 10 are respectively received in the second, third, and fourth receiving portions 52, 53, 54.
- the substrate 1 is a transparent substrate through which light emitted by the OLED thin film device 2 is transmitted.
- the substrate 1 is a glass substrate.
- the organic encapsulating film 3 is similar to a double-sided tape, and the upper and lower surfaces thereof are adhesive and can be directly attached to the OLED thin film device 2.
- the material of the organic encapsulating film 3 may be parylene, polychloro-p-xylene, or polydichloro-p-xylene.
- an inorganic encapsulating film 4 completely covering the organic encapsulating film 3 is also provided.
- the inorganic encapsulating film 4 is dense in structure, and the material thereof may be silicon nitride, silicon oxide, aluminum oxide or zirconium oxide.
- the organic encapsulating film 3 can avoid possible damage to the OLED thin film device 2 during the preparation of the inorganic encapsulating film 4.
- the inorganic encapsulating film 4 and the organic encapsulating film 3 cooperate to completely isolate the OLED thin film device 2, thereby providing good airtight protection for the OLED thin film device 2, blocking moisture and oxygen from entering, and ensuring the OLED thin film device 2 Performance to extend its life.
- the protective cover 5 can effectively protect the OLED device, significantly improve the mechanical properties of the OLED device, and make the OLED device less susceptible to damage under external force.
- the protective cover 5 is sealingly connected to the peripheral edge of the substrate 1 and is not in contact with the inorganic encapsulating film 4, that is, a gap is left between the protective cover 5 and the inorganic encapsulating film 4.
- the protective cover 5 completely seals the OLED device, providing better hermetic protection for the OLED thin film device 2.
- the electrical components of the electronic driver 81, the driver controller 82, and the electrical contactor 83 are collectively covered by the protective cover 5.
- the material of the protective cover 5 is plastic and can be prepared by a molding process such as injection molding. It is worth mentioning that the provision of the protective cover 5 also makes it easier to mount the OLED device to any desired location by conventional fixing means.
- the rigid support plate 6 extends through the entire side of the protective cover 5 away from the substrate 1 to increase the strength of the protective cover 5 to better protect the OLED device.
- the rigid support plate 6 is made of a hard material.
- the rigid support plate 6 is a stainless steel plate.
- the material of the cooling member 7 is aluminum or copper which has good heat dissipation, and is used for dissipating heat generated during operation of the OLED device to prevent defects caused by excessive temperature of the OLED device.
- the OLED device of the present invention covers the inorganic package film over the inorganic package film by covering the organic package film and the inorganic package film on the OLED film device, and covers the protective cover around the edge of the substrate.
- a rigid support plate is disposed on a side of the object away from the substrate, thereby effectively protecting the OLED device, so that the mechanical performance of the OLED device is significantly improved. It is not easy to be damaged by external force. At the same time, it can provide better airtight protection for OLED thin film devices, ensure the performance of OLED thin film devices and prolong their service life.
- the protective cover due to the placement of the protective cover, the OLED device is more easily mounted to any desired location by conventional securing means.
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Abstract
一种OLED器件,包括基板(1)、设于所述基板(1)上的OLED薄膜器件(2)、设于所述基板(1)上完全覆盖所述OLED薄膜器件(2)的有机封装薄膜(3)、设于所述基板(1)上完全覆盖所述有机封装薄膜(3)的无机封装薄膜(4)、密封连接于所述基板(1)的四周边缘并罩设于所述无机封装薄膜(4)上方的保护覆盖物(5)、及设于所述保护覆盖物(5)远离所述基板(1)一侧上的刚性支撑板(6)。上述OLED器件具有较好的机械性能,不易在外力作用下损坏,同时能够为OLED器件提供更好的气密性保护。
Description
本发明涉及显示技术领域,尤其涉及一种OLED器件。
有机发光二极管显示器(Organic Light Emitting Diode,OLED)是一种极具发展前景的平板显示技术,它不仅具有十分优异的显示性能,还具有自发光、结构简单、超轻薄、响应速度快、宽视角、低功耗及可实现柔性显示等特性,被誉为“梦幻显示器”,再加上其生产设备投资远小于液晶显示器(Liquid Crystal Display,LCD),得到了各大显示器厂家的青睐,已成为显示技术领域中第三代显示器件的主力军。
OLED器件通常包括一玻璃基板、设于玻璃基板上的OLED薄膜器件、以及用于抵御外界环境氛围、防止水汽、氧气进入OLED器件内部的封装盖板,该封装盖板通常采用另一块玻璃板。OLED薄膜器件通常包括:置于玻璃基板上的ITO透明阳极、置于ITO透明阳极上的空穴注入层(HIL)、置于空穴注入层上的空穴传输层(HTL)、置于空穴传输层上的发光层(EML)、置于发光层上的电子传输层(ETL)、置于电子传输层上的电子注入层(EIL)以及置于电子注入层上的阴极。为了提高效率,发光层通常采用主/客体掺杂系统。
由于玻璃板具有锋利的边缘,其在处理期间易出现保护不当等问题,并且在承受机械载荷时易碎,此类问题在应用于大尺寸OLED器件时更为明显。而且,玻璃板(基板或封装盖板)难以应用如螺纹连接、夹接、钻孔等传统固定方法将OLED器件安装到期望的位置,例如墙壁上。
现有的OLED器件一般设有普通外壳,该普通外壳可以提供围绕OLED器件外部的机械封装,但不会在整个外壳区域上与OLED器件直接接触。由于OLED器件自身的机械鲁棒性没有提高,因而当发生机械碰撞时,机械碰撞也作用于外壳内部的OLED器件上,并且最终损坏OLED器件。还有一种外壳是将OLED器件嵌入外壳内部,以提高嵌入外壳中的OLED器件的机械性能,但是这种外壳并没有使OLED器件直接处于密封状态下,无法为OLED薄膜器件提供更好的气密性保护。
因此,有必要提供一种新型的OLED器件,以实现在显著提高OLED器件机械性能的同时,能够为OLED薄膜器件提供更好的气密性保护。
发明内容
本发明的目的在于提供一种OLED器件,其具有较好的机械性能,不易在外力作用下损坏,同时能够为OLED薄膜器件提供更好的气密性保护。
为实现上述目的,本发明提供一种OLED器件,包括基板、设于所述基板上的OLED薄膜器件、设于所述基板上完全覆盖所述OLED薄膜器件的有机封装薄膜、设于所述基板上完全覆盖所述有机封装薄膜的无机封装薄膜、密封连接于所述基板的四周边缘并罩设于所述无机封装薄膜上方的保护覆盖物、及设于所述保护覆盖物远离所述基板一侧上的刚性支撑板。
所述刚性支撑板远离所述基板的一侧上设有一冷却件。
所述OLED器件,还包括与所述基板相邻且容置于所述保护覆盖物中的驱动器控制器、与所述驱动器控制器相邻且容置于所述保护覆盖物中的电子驱动器、与所述电子驱动器相邻且容置于所述保护覆盖物中的电接触器;所述电接触器部分暴露于所述保护覆盖物的侧部。
所述保护覆盖物上设有第一容置部、及与所述第一容置部的开口方向相反的第二、第三与第四容置部,所述基板容置于所述第一容置部中,所述驱动器控制器、电子驱动器、及电接触器分别容置于所述第二、第三与第四容置部中。
所述保护覆盖物与所述无机封装薄膜之间留有间隙。
所述有机封装薄膜的上、下表面均具有胶粘性,其材料为聚对二甲苯、聚氯代对二甲苯、或聚二氯代对二甲苯。
所述无机封装薄膜的材料为氮化硅、氧化硅、氧化铝或氧化锆。
所述保护覆盖物的材料为塑料,通过注塑工艺制备。
所述刚性支撑板为不锈钢板。
所述冷却件的材料为铝或铜。
本发明还提供一种OLED器件,包括基板、设于所述基板上的OLED薄膜器件、设于所述基板上完全覆盖所述OLED薄膜器件的有机封装薄膜、设于所述基板上完全覆盖所述有机封装薄膜的无机封装薄膜、密封连接于所述基板的四周边缘并罩设于所述无机封装薄膜上方的保护覆盖物、及设于所述保护覆盖物远离所述基板一侧上的刚性支撑板;
其中,所述刚性支撑板远离所述基板的一侧上设有一冷却件;
其中,还包括与所述基板相邻且容置于所述保护覆盖物中的驱动器控制器、与所述驱动器控制器相邻且容置于所述保护覆盖物中的电子驱动器、与所述电子驱动器相邻且容置于所述保护覆盖物中的电接触器;所述电接
触器部分暴露于所述保护覆盖物的侧部;
其中,所述保护覆盖物与所述无机封装薄膜之间留有间隙。
本发明的有益效果:本发明提供的一种OLED器件,通过在OLED薄膜器件上覆盖有机封装薄膜与无机封装薄膜,在无机封装薄膜上方罩设一密封连接于基板四周边缘的保护覆盖物,并在该保护覆盖物远离基板的一侧上设置刚性支撑板,对OLED器件进行了有效保护,使得OLED器件的机械性能显著提高,不易在外力作用下损坏,同时,能够为OLED薄膜器件提供更好的气密性保护,保证OLED薄膜器件的性能,延长其使用寿命。此外,由于保护覆盖物的设置,使得OLED器件更容易通过传统的固定方式安装到任何期望的位置。
下面结合附图,通过对本发明的具体实施方式详细描述,将使本发明的技术方案及其它有益效果显而易见。
附图中,
图1为本发明OLED器件的剖面示意图。
为更进一步阐述本发明所采取的技术手段及其效果,以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图1,本发明提供一种OLED器件,包括基板1、设于所述基板1上的OLED薄膜器件2、设于所述基板1上完全覆盖所述OLED薄膜器件2的有机封装薄膜3、设于所述基板1上完全覆盖所述有机封装薄膜3的无机封装薄膜4、密封连接于所述基板1的四周边缘并罩设于所述无机封装薄膜4上方的保护覆盖物5、及设于所述保护覆盖物5远离所述基板1一侧上的刚性支撑板6。
进一步的,所述OLED器件还包括与所述基板1相邻且容置于所述保护覆盖物5中的驱动器控制器8、与所述驱动器控制器8相邻且容置于所述保护覆盖物5中的电子驱动器9、与所述电子驱动器9相邻且容置于所述保护覆盖物5中的电接触器10,所述电接触器10部分暴露于所述保护覆盖物5的侧部,用于电性连接至外部电源,从而对OLED器件进行驱动。
所述刚性支撑板6远离所述基板1的一侧上设有一冷却件7。
具体地,所述保护覆盖物5上设有第一容置部51、及与所述第一容置部51的开口方向相反的第二、第三与第四容置部52、53、54。所述基板1
容置于所述第一容置部51中,所述驱动器控制器8、电子驱动器9、及电接触器10分别容置于所述第二、第三与第四容置部52、53、54中。
所述基板1为透明基板,供所述OLED薄膜器件2发出的光透过,优选地,所述基板1为玻璃基板。
所述有机封装薄膜3类似于双面胶,其的上、下表面均具有胶粘性,可直接贴附于所述OLED薄膜器件2上。所述有机封装薄膜3的材料可为聚对二甲苯、聚氯代对二甲苯、或聚二氯代对二甲苯。
由于所述有机封装薄膜3的结构不够致密,其阻隔水汽与氧气的性能并不理想,所以还设置有一层完全覆盖有机封装薄膜3的无机封装薄膜4。所述无机封装薄膜4的结构致密,其材料可为氮化硅、氧化硅、氧化铝或氧化锆。所述有机封装薄膜3能够避免无机封装薄膜4的制备过程中对OLED薄膜器件2可能造成的损坏。
所述无机封装薄膜4与有机封装薄膜3共同作用,使得OLED薄膜器件2完全被密封隔离开来,为OLED薄膜器件2提供良好的气密性保护,阻隔水汽与氧气进入,保证OLED薄膜器件2的性能,延长其使用寿命。
所述保护覆盖物5能够对OLED器件进行有效保护,显著提高了OLED器件的机械性能,使OLED器件不易在外力作用下损坏。所述保护覆盖物5与基板1的四周边缘密封连接,且不与所述无机封装薄膜4接触,即所述保护覆盖物5与所述无机封装薄膜4之间留有间隙。所述保护覆盖物5将OLED器件完全密封,为所述OLED薄膜器件2提供了更好的气密性保护。所述电子驱动器81、驱动器控制器82、及电接触器83的电学组件一起被所述保护覆盖物5覆盖。
所述保护覆盖物5的材料为塑料,可通过注塑等成型工艺制备。值得一提的是,设置所述保护覆盖物5,还能使得OLED器件更容易通过传统的固定方式安装到任何期望的位置。
所述刚性支撑板6贯穿整个保护覆盖物5远离所述基板1的一侧,能够增加保护覆盖物5的强度,以更好的保护OLED器件。所述刚性支撑板6由硬质材料制成,优选的,所述刚性支撑板6为不锈钢板。
所述冷却件7的材料为散热性较好的铝或铜,用于将OLED器件运行期间所产生的热量散发出去,防止OLED器件因温度过高引发的不良。
综上所述,本发明的OLED器件,通过在OLED薄膜器件上覆盖有机封装薄膜与无机封装薄膜,在无机封装薄膜上方罩设一密封连接于基板四周边缘的保护覆盖物,并在该保护覆盖物远离基板的一侧上设置刚性支撑板,对OLED器件进行了有效保护,使得OLED器件的机械性能显著提高,
不易在外力作用下损坏,同时,能够为OLED薄膜器件提供更好的气密性保护,保证OLED薄膜器件的性能,延长其使用寿命。此外,由于保护覆盖物的设置,使得OLED器件更容易通过传统的固定方式安装到任何期望的位置。
以上所述,对于本领域的普通技术人员来说,可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形,而所有这些改变和变形都应属于本发明权利要求的保护范围。
Claims (13)
- 一种OLED器件,包括基板、设于所述基板上的OLED薄膜器件、设于所述基板上完全覆盖所述OLED薄膜器件的有机封装薄膜、设于所述基板上完全覆盖所述有机封装薄膜的无机封装薄膜、密封连接于所述基板的四周边缘并罩设于所述无机封装薄膜上方的保护覆盖物、及设于所述保护覆盖物远离所述基板一侧上的刚性支撑板。
- 如权利要求1所述的OLED器件,其中,所述刚性支撑板远离所述基板的一侧上设有一冷却件。
- 如权利要求1所述的OLED器件,其中,还包括与所述基板相邻且容置于所述保护覆盖物中的驱动器控制器、与所述驱动器控制器相邻且容置于所述保护覆盖物中的电子驱动器、与所述电子驱动器相邻且容置于所述保护覆盖物中的电接触器;所述电接触器部分暴露于所述保护覆盖物的侧部。
- 如权利要求3所述的OLED器件,其中,所述保护覆盖物上设有第一容置部、及与所述第一容置部的开口方向相反的第二、第三与第四容置部,所述基板容置于所述第一容置部中,所述驱动器控制器、电子驱动器、及电接触器分别容置于所述第二、第三与第四容置部中。
- 如权利要求1所述的OLED器件,其中,所述保护覆盖物与所述无机封装薄膜之间留有间隙。
- 如权利要求1所述的OLED器件,其中,所述有机封装薄膜的上、下表面均具有胶粘性,其材料为聚对二甲苯、聚氯代对二甲苯、或聚二氯代对二甲苯。
- 如权利要求1所述的OLED器件,其中,所述无机封装薄膜的材料为氮化硅、氧化硅、氧化铝或氧化锆。
- 如权利要求1所述的OLED器件,其中,所述保护覆盖物的材料为塑料,通过注塑工艺制备。
- 如权利要求1所述的OLED器件,其中,所述刚性支撑板为不锈钢板。
- 如权利要求2所述的OLED器件,其中,所述冷却件的材料为铝或铜。
- 一种OLED器件,包括基板、设于所述基板上的OLED薄膜器件、设于所述基板上完全覆盖所述OLED薄膜器件的有机封装薄膜、设于所述 基板上完全覆盖所述有机封装薄膜的无机封装薄膜、密封连接于所述基板的四周边缘并罩设于所述无机封装薄膜上方的保护覆盖物、及设于所述保护覆盖物远离所述基板一侧上的刚性支撑板;其中,所述刚性支撑板远离所述基板的一侧上设有一冷却件;其中,还包括与所述基板相邻且容置于所述保护覆盖物中的驱动器控制器、与所述驱动器控制器相邻且容置于所述保护覆盖物中的电子驱动器、与所述电子驱动器相邻且容置于所述保护覆盖物中的电接触器;所述电接触器部分暴露于所述保护覆盖物的侧部;其中,所述保护覆盖物与所述无机封装薄膜之间留有间隙。
- 如权利要求11所述的OLED器件,其中,所述保护覆盖物上设有第一容置部、及与所述第一容置部的开口方向相反的第二、第三与第四容置部,所述基板容置于所述第一容置部中,所述驱动器控制器、电子驱动器、及电接触器分别容置于所述第二、第三与第四容置部中。
- 如权利要求11所述的OLED器件,其中,所述有机封装薄膜的上、下表面均具有胶粘性,其材料为聚对二甲苯、聚氯代对二甲苯、或聚二氯代对二甲苯;其中,所述无机封装薄膜的材料为氮化硅、氧化硅、氧化铝或氧化锆;其中,所述保护覆盖物的材料为塑料,通过注塑工艺制备;其中,所述刚性支撑板为不锈钢板;其中,所述冷却件的材料为铝或铜。
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| CN102610762A (zh) * | 2011-01-21 | 2012-07-25 | 彩虹显示器件股份有限公司 | 一种有机发光器件的薄膜封装方法 |
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| JP2000040586A (ja) * | 1998-07-21 | 2000-02-08 | Tdk Corp | 有機el素子モジュール |
| WO2006046679A1 (ja) * | 2004-10-29 | 2006-05-04 | Pioneer Corporation | 有機エレクトロルミネセンス表示装置及びその製造方法 |
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