WO2016078051A1 - Support de led et unité d'émission de lumière led - Google Patents

Support de led et unité d'émission de lumière led Download PDF

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Publication number
WO2016078051A1
WO2016078051A1 PCT/CN2014/091725 CN2014091725W WO2016078051A1 WO 2016078051 A1 WO2016078051 A1 WO 2016078051A1 CN 2014091725 W CN2014091725 W CN 2014091725W WO 2016078051 A1 WO2016078051 A1 WO 2016078051A1
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WO
WIPO (PCT)
Prior art keywords
led
region
radial dimension
transition
bonding
Prior art date
Application number
PCT/CN2014/091725
Other languages
English (en)
Chinese (zh)
Inventor
史利利
Original Assignee
史利利
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 史利利 filed Critical 史利利
Priority to CN201490000324.9U priority Critical patent/CN204678084U/zh
Priority to PCT/CN2014/091725 priority patent/WO2016078051A1/fr
Publication of WO2016078051A1 publication Critical patent/WO2016078051A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages

Definitions

  • the present application relates to the field of light emitting diodes, and in particular, to an LED bracket and an LED lighting unit.
  • the existing LED bracket comprises a pedestal, and a accommodating cavity is arranged on the pedestal, and further comprises a positive electrode piece and a negative electrode piece, the positive electrode piece comprises a positive electrode lead and a positive electrode bonding wire area, and the negative electrode piece comprises a negative electrode lead and a negative electrode bonding wire.
  • the region and the die bonding region for fixing the LED chip are connected to the negative bonding wire region.
  • the solid crystal region is disposed horizontally adjacent to the positive electrode bonding zone.
  • the LED chip When soldering, the LED chip is first placed in the solid crystal region, and then the two poles of the LED chip are respectively led out and soldered to the positive electrode bonding wire region and the negative electrode bonding wire region.
  • the solid crystal region and the negative electrode bonding region are connected together without a boundary, the negative electrode bonding region is too close to the negative electrode, and the customer is soldering the LED soldering pins (including the negative terminal).
  • the generated heat is rapidly transferred to the solder joints in the negative wire bonding area, causing the solder joints to fall off to form a virtual soldering phenomenon, thereby affecting the reliability of the LED.
  • the present application aims to solve at least one of the above technical problems to some extent.
  • the present application provides an LED bracket, comprising: a base provided with a receiving cavity, an electrode piece disposed on the base, and a die bonding metal piece, the electrode piece comprising: a bonding wire region and a pin located in the accommodating cavity, and a transition region transitioning from the wire bonding region to the pin, the die bonding metal piece having a die bond for fixing the LED chip a region in which a direction in which the wire bonding region transitions toward the pin is an axial direction, a radial dimension of the transition region is smaller than a radial dimension of a region on both sides of the transition region, a die bond metal piece and the electrode sheet Independent.
  • the radial extent of the transition zone is less than 1/2 of the radial dimension of the zones on both sides of the transition zone.
  • the radial dimension of the transition zone is 1/3 or 1/4 of the radial dimension of the zones on both sides of the transition zone.
  • the LED bracket comprises: a positive electrode sheet and a negative electrode sheet.
  • the die bonding metal piece is connected to the bonding wire area of the positive electrode sheet or the negative electrode sheet.
  • the die bond metal sheet has heat dissipation legs in communication with the die bonding region.
  • the present application provides an LED lighting unit, including: an LED bracket and an LED chip mounted on the LED bracket, the LED bracket includes: a base provided with a receiving cavity, and is disposed on Said An electrode sheet on the pedestal and a die-bonding metal piece, the electrode piece includes: a wire bond region and a pin connected in the accommodating cavity, and a transition from the wire bonding region to the pin
  • the transition metal region has a die bonding region for fixing the LED chip, wherein a direction in which the wire bonding region transitions to the pin is an axial direction, and a radial dimension of the transition region is smaller than The radial dimension of the regions on both sides of the transition zone, the die bond metal sheet and the electrode sheet are independent of each other.
  • the radial extent of the transition zone is less than 1/2 of the radial dimension of the zones on both sides of the transition zone.
  • the radial dimension of the transition zone is 1/3 or 1/4 of the radial dimension of the zones on both sides of the transition zone.
  • the LED bracket comprises: a positive electrode sheet and a negative electrode sheet.
  • the die bonding metal piece is connected to the bonding wire area of the positive electrode sheet or the negative electrode sheet.
  • the die bond metal sheet has heat dissipation legs in communication with the die bonding region.
  • the LED bracket comprises: a base provided with a receiving cavity, an electrode piece disposed on the base, and a die bonding metal piece, the electrode piece comprising: communicating a wire bond region and a pin located in the accommodating cavity, and a transition region transitioning from the wire bonding region to the pin, the die bonding metal piece having a solid for fixing the LED chip a crystal region having a direction in which the wire bonding region transitions toward the pin as an axial direction, a radial dimension of the transition region being smaller than a radial dimension of a region on both sides of the transition region, a die bond metal piece and the electrode
  • the pieces are independent of each other.
  • FIG. 1 is a schematic structural diagram of an LED lighting unit according to an embodiment of the present application.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining “first” and “second” can be clearly indicated Or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • the terms “installation”, “connected”, “connected”, “fixed” and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • installation shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • the specific meanings of the above terms in the present application can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature “above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly above and above the second feature, or merely the first feature level being less than the second feature.
  • the embodiment provides an LED lighting unit, which can be used in various fields of display, illumination, signal indication, etc., and can be integrated into an LED display, an LED light bar or an LED signal light.
  • the above LED lighting unit mainly includes an LED bracket 1 and an LED chip 2 mounted on the LED bracket 1.
  • the LED holder 1 includes a susceptor 11 provided with a accommodating cavity 111, an electrode piece 12 disposed on the susceptor 11, and a fixed metal piece 13.
  • the electrode piece is divided into a positive electrode piece and a negative electrode piece, and the electrode piece mainly comprises: The interconnecting wire region 121 and the pin 122 in the accommodating cavity 111 and the transition region 123 extending from the wire bonding region 121 to the pin 122.
  • the die bond metal sheet 13 has a die bonding region 131 for fixing the LED chip 2.
  • the direction in which the bonding wire region 121 transitions to the pin 122 is taken as the axial direction, and the radial dimension of the transition region 123 is smaller than the radial dimension of the region on both sides of the transition region 123, and the die bonding metal sheet 13 and the electrode sheet 12 are independent of each other.
  • the radial dimension from the wire bonding zone to the transition zone may gradually become smaller or abruptly smaller, or the radial dimension from the lead to the transition zone may gradually become smaller or abruptly smaller, or by the wire bonding zone.
  • the radial dimension of the lead-to-transition zone can be gradually reduced or abruptly smaller, or the radial dimension of the transition zone from the wire-bonding zone can be gradually reduced or abruptly smaller, and the transition from pin to pin
  • the radial dimension of the zone can be abruptly smaller or tapered.
  • the radial extent of the transition zone 123 is less than 1/2 of the radial dimension of the zones on either side of the transition zone 123.
  • the radial extent of the transition zone 123 is 1/3 or 1/4 of the radial dimension of the zone on either side of the transition zone 123.
  • the solid crystal metal sheet has a heat dissipation leg that communicates with the solid crystal region.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un support de LED (1) et une unité d'émission de lumière LED. Le support de LED (1) comprend : un substrat (11) pourvu d'une cavité de logement (111), et une plaque d'électrode (12) et une feuille métallique de liaison de puce (13) qui sont disposées sur le substrat (11). La plaque d'électrode (12) comprend une zone de soudage de fil (121) située dans la cavité de logement (111) et une broche (122) communiquant avec la zone de soudage de fil (121), et une zone de transition (123) pour la transition de la zone de soudage de fil (121) à la broche (122). La feuille métallique de liaison de puce (13) est pourvue d'une zone de liaison de puce (131) pour la fixation d'une puce de LED (2). En utilisant la direction de transition de la zone de soudage de fil (121) à la broche (122) en tant que direction axiale, la dimension radiale de la zone de transition (123) est inférieure à la dimension radiale des zones sur deux côtés de la zone de transition (123). La feuille métallique de liaison de puce (13) et la plaque d'électrode (12) sont indépendantes l'une de l'autre. Lorsque la soudure à l'étain de la broche (122) de la plaque d'électrode (12) est réalisée, compte tenu de la faible dimension radiale de la zone de transition (123), la chaleur générée par soudure à l'étain de la broche (122) ne peut pas se diffuser rapidement à la zone de soudage de fil (121), et ainsi un joint de soudure de la zone de soudage de fil (121) ne tombe pas et le phénomène de mauvaise soudure ne se produit pas, assurant ainsi la fiabilité de la LED.
PCT/CN2014/091725 2014-11-20 2014-11-20 Support de led et unité d'émission de lumière led WO2016078051A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201490000324.9U CN204678084U (zh) 2014-11-20 2014-11-20 Led支架及led发光单元
PCT/CN2014/091725 WO2016078051A1 (fr) 2014-11-20 2014-11-20 Support de led et unité d'émission de lumière led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2014/091725 WO2016078051A1 (fr) 2014-11-20 2014-11-20 Support de led et unité d'émission de lumière led

Publications (1)

Publication Number Publication Date
WO2016078051A1 true WO2016078051A1 (fr) 2016-05-26

Family

ID=54177775

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/091725 WO2016078051A1 (fr) 2014-11-20 2014-11-20 Support de led et unité d'émission de lumière led

Country Status (2)

Country Link
CN (1) CN204678084U (fr)
WO (1) WO2016078051A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112770440A (zh) * 2020-12-31 2021-05-07 江苏生辉光电科技有限公司 一种新型led驱动电源
CN114497319A (zh) * 2022-01-07 2022-05-13 芜湖聚飞光电科技有限公司 Led发光组件、led支架及其制作方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060103012A1 (en) * 2004-11-15 2006-05-18 Unity Opto Technology Co., Ltd. Solid-state semiconductor light emitting device
CN201732814U (zh) * 2010-07-20 2011-02-02 深圳市聚飞光电股份有限公司 一种提高可靠性的led支架和led
CN201845810U (zh) * 2010-11-03 2011-05-25 深圳市聚飞光电股份有限公司 Led支架及led
CN202167539U (zh) * 2011-07-28 2012-03-14 深圳市聚飞光电股份有限公司 一种led支架及led
CN203071133U (zh) * 2013-02-05 2013-07-17 深圳市新月光电有限公司 大功率led灯的四边焊线结构
CN203165943U (zh) * 2013-04-16 2013-08-28 慈溪宝诚知识产权服务有限公司 一种led支架

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060103012A1 (en) * 2004-11-15 2006-05-18 Unity Opto Technology Co., Ltd. Solid-state semiconductor light emitting device
CN201732814U (zh) * 2010-07-20 2011-02-02 深圳市聚飞光电股份有限公司 一种提高可靠性的led支架和led
CN201845810U (zh) * 2010-11-03 2011-05-25 深圳市聚飞光电股份有限公司 Led支架及led
CN202167539U (zh) * 2011-07-28 2012-03-14 深圳市聚飞光电股份有限公司 一种led支架及led
CN203071133U (zh) * 2013-02-05 2013-07-17 深圳市新月光电有限公司 大功率led灯的四边焊线结构
CN203165943U (zh) * 2013-04-16 2013-08-28 慈溪宝诚知识产权服务有限公司 一种led支架

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112770440A (zh) * 2020-12-31 2021-05-07 江苏生辉光电科技有限公司 一种新型led驱动电源
CN112770440B (zh) * 2020-12-31 2023-12-01 江苏生辉光电科技有限公司 一种新型led驱动电源
CN114497319A (zh) * 2022-01-07 2022-05-13 芜湖聚飞光电科技有限公司 Led发光组件、led支架及其制作方法

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Publication number Publication date
CN204678084U (zh) 2015-09-30

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