WO2016074404A1 - Lentille de poudre fluorescente distante et son procédé de fabrication ainsi que son application - Google Patents

Lentille de poudre fluorescente distante et son procédé de fabrication ainsi que son application Download PDF

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Publication number
WO2016074404A1
WO2016074404A1 PCT/CN2015/074686 CN2015074686W WO2016074404A1 WO 2016074404 A1 WO2016074404 A1 WO 2016074404A1 CN 2015074686 W CN2015074686 W CN 2015074686W WO 2016074404 A1 WO2016074404 A1 WO 2016074404A1
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Prior art keywords
phosphor
resin
remote phosphor
remote
solid curved
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PCT/CN2015/074686
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English (en)
Chinese (zh)
Inventor
殷江
陆建新
卢伟
殷俊
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江苏脉锐光电科技有限公司
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Publication of WO2016074404A1 publication Critical patent/WO2016074404A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials

Definitions

  • the present invention relates to the field of illumination technologies, and in particular, to a remote phosphor lens, a manufacturing method thereof and an application thereof
  • COB integrated Chip On Board is to bond a plurality of blue LED light-emitting chips on a metal-based or ceramic substrate, and then electrically connect the blue LED chip to the circuit of the substrate by using a gold wire.
  • the mixture of LED yellow phosphor and silica gel is coated on the blue LED chip and cured.
  • the appropriate voltage or current is applied to the electrical connection line of the COB integrated light source, part of the blue light emitted by the blue LED chip excites the phosphor to emit yellow light, and after mixing with the blue light emitted by the blue LED chip, white light can be obtained.
  • the COB integrated light source also called COB surface light source, is a planar package structure.
  • the COB integrated white light source itself has the characteristics of high power density.
  • the blue chip works, a large amount of heat is generated.
  • the large amount of heat generated by the phosphor being excited by the blue light emitted by the LED chip is also transmitted to the chip, and the heat cannot be in a small space.
  • Distributing in time, the LED blue chip and the phosphor are always at a high working temperature, resulting in a decrease in the luminous efficiency of the chip, and at the same time, the luminous intensity of the phosphor is gradually attenuated, thereby causing a decrease in the luminous efficiency of the light source.
  • the refractive index of silica gel is generally between 1.4 and 1.7, and the refractive index of air is about 1, so part of the yellow light emitted by the phosphor in the silica gel layer and part of the blue light emitted by the LED blue chip are as long as the incident angle is greater than a certain critical angle. , total reflection occurs at the silica gel/air interface, re-entering the silica gel layer, reducing the light extraction efficiency of the light source. These partially reflected light rays are absorbed by the chip or phosphor and released as heat.
  • the illumination angle of the light source is also limited due to its inherent package structure.
  • the present invention provides a remote phosphor lens and a manufacturing method thereof and applications thereof.
  • a remote phosphor lens according to the present invention comprises a hemispherical composite curved surface structure, as shown in FIG.
  • the compound-like hemispherical composite curved surface structure is a composite of a shell 3 having a large radius of curvature and a solid curved surface body 4 having a small radius of curvature; the cross-section of the composite curved surface structure may be a circular shape with a large radius of curvature
  • the circular cross section of the casing 3 and the solid curved body 4 having a small radius of curvature shares a center O.
  • the housing 3 has an outer surface 1 and an inner surface 2; the outer surface 1 of the housing 3 may be a spherical surface, or a paraboloid or any smooth convex surface; the thickness of the housing 3 may be uniform or may be based on the final The application environment is adjusted; the thickness of the casing 3 ranges from 50 micrometers to 3 millimeters; the inner surface 2 of the casing 3 is completely identical to the surface physical shape of the solid curved surface body 4, and may be a spherical surface, or a paraboloid or any smooth surface; The surface of the curved body 4 completely conforms to the inner surface 2 of the casing 3 having a large radius of curvature.
  • the housing 3 having a larger radius of curvature is a remote phosphor structure comprising a mixture of a transparent organic substrate A and phosphor B particles;
  • the transparent organic substrate A is made of PMMA, PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butylbenzene, phenylsulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC.
  • Enhanced PMMA or MS resin, or silica gel specifically, depending on the ambient temperature environment used.
  • the phosphor B is an LED yellow phosphor, or a mixture of an LED green phosphor and an LED red phosphor, or a mixture of an LED yellow phosphor and a small amount of LED red phosphor;
  • the solid curved surface body 4 with a small radius of curvature is a transparent organic material C, which is made of PMMA, PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butylbenzene, phenyl sulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC reinforced PMMA or MS resin, or silica gel; can be selected according to the ambient temperature environment.
  • the material base A of the casing 3 and the material C of the solid curved body 4 may be the same or different.
  • the organic matrix A of the casing 3 and the material C of the solid curved body 4 have the same or similar refractive index to avoid light. Transmission loss
  • the remote phosphor housing 3 having the larger radius of curvature may further comprise a double layer structure, as shown in FIG. 2, the double layer structure comprises a composite structure of the remote phosphor housing 5 and the remote phosphor housing 6;
  • the outer surface 7 of the body 6 is exactly the same as the physical surface of the inner surface of the casing 5, and the materials used are also the same; the thickness of the casing 6 and the casing 5 may be the same or different; the casing 5 contains the organic substrate A. a mixture with the phosphor D, the housing 6 comprising a mixture of the organic substrate A and the phosphor E;
  • the placement order or the respective thicknesses of the above two-layer and two-layer remote phosphor housings have a certain influence on the light-emitting quality of the LED light-emitting device, so it is necessary to thickness of each of the above-mentioned remote phosphor housings.
  • the arrangement between each other is optimized for design. Taking the remote phosphor lens of FIG. 2 as an example, the phosphor E in the remote phosphor housing 6 is a green phosphor, and the phosphor D in the remote phosphor housing 5 is a red phosphor.
  • the blue light emitted by the blue chip first enters the solid curved body 4 and then passes out from the surface 9 of the solid curved body 4 to enter the remote phosphor housings 5 and 6, respectively.
  • the green phosphor E in the remote phosphor housing 6 is excited by the blue light emitted by the LED blue chip to emit green light.
  • the wavelength of green light is greater than the wavelength of blue light, but less than the wavelength of red light.
  • part of the green light emitted by the green phosphor E in the remote phosphor housing 6 can excite the red phosphor D in the remote phosphor housing 5 to emit red light.
  • a portion of the blue light emitted by the LED blue chip also excites the red phosphor D in the remote phosphor housing 5 after it has penetrated the remote phosphor housing 6, causing it to be excited to emit red light.
  • the blue light emitted by the blue chip except for the remaining light for exciting the phosphor light in the remote phosphor housings 6 and 5, and the green light emitted by the phosphor E in the remote phosphor housing 6,
  • the remaining light for exciting the red phosphor D in the remote phosphor housing 5 will be mixed with the red light emitted by the blue phosphor and the green light in the remote phosphor housing 5, thereby enabling remote fluorescence
  • the outer surface 8 of the powder casing 5 emits white light. In the white light thus synthesized, the content (relative intensity) of green light is smaller than expected, and the content (relative intensity) of red light is larger than expected.
  • the green phosphor content in the remote phosphor housing 6 may be appropriately increased, and the red phosphor content in the remote phosphor housing 5 may be appropriately reduced; or may be appropriately increased.
  • the same purpose can be achieved by the thickness of the remote phosphor housing 6, and appropriately reducing the thickness of the remote phosphor housing 5.
  • the quality of the white light emitted can be finely adjusted by adjusting the thickness of each remote phosphor housing and the amount of phosphor contained therein.
  • the phosphor E in the remote phosphor housing 6 may also be an LED yellow phosphor, or an LED red phosphor, or a mixture of any two of the above phosphors; the phosphor D in the remote phosphor housing 5 may also be LED yellow fluorescent Light powder, or LED green phosphor, or a mixture of any two of the above phosphors; however, the phosphor composition of the remote phosphor housing 6 and the remote phosphor housing 5 is different.
  • the remote phosphor lens according to the present invention may further have a square umbrella-shaped convex shape structure, and the schematic view is shown in FIG.
  • the square umbrella type convex shape structure is a composite of a large remote phosphor shell 10 having a square umbrella type convex shape structure and a small square umbrella type convex shape structure solid curved body 11; a square umbrella type convex shape structure solid
  • the bottom surface of the curved body 11 is a square, and the intersections of the four sides are H, I, J, and K, respectively;
  • the square umbrella-shaped convex-shaped structure solid curved surface body 11 is a semi-cylindrical body having a line connecting the midpoints of two opposite sides JK and HI of a square, and two opposite sides IJ and KH of a square.
  • the point line is the area formed by the overlapping portion of the semi-circular cylinder of the axis; the intersection lines JL, IL, HL and KL between the two semi-cylinders are compared with the point L.
  • the intersections JL, IL, HL, and KL between the two semi-cylinders are smoothed, and the L-point becomes the center point of the four smooth-surface convergence regions.
  • the surface of the solid umbrella body 11 of the square umbrella type convex shape structure is completely identical with the inner surface of the large remote phosphor housing 10 of the square umbrella type convex shape structure, and the large remote phosphor housing 10 of the square umbrella type convex shape structure It has a uniform thickness and a thickness ranging from 50 microns to 3 mm.
  • the remote phosphor lens according to the present invention may further have a deformed semi-cylindrical shape structure, and the schematic view is shown in FIG.
  • the deformed semi-cylindrical shape structure is a composite of a large remote phosphor housing 13 having a deformed semi-cylindrical shape structure and a smaller deformed semi-cylindrical shape structure solid curved body 14; a rectangle, the intersection of the four sides is M, N, P and Q;
  • the deformed semi-cylindrical shape structure solid curved body 14 is a semi-cylindrical body with a line connecting the midpoints of two opposite sides MN and PQ of a rectangle and two opposite sides of the rectangle MQ and PN
  • the midpoint line is the area formed by the overlapping portion of the semi-circular cylinder of the axis; the intersection between the two semi-cylinders is QR, MR, PS, and NS.
  • QR, MR, PS the intersection between the two semi-cylinders.
  • the surface of the deformed semi-cylindrical solid curved body 14 is completely coincident with the inner surface of the deformed semi-cylindrical shape of the large remote phosphor housing 13, and the deformed semi-cylindrical shape of the large remote phosphor
  • the housing 13 has a uniform thickness ranging from 50 micrometers to 3 millimeters.
  • blue light refers to light having a center wavelength between 400 nm and 490 nm; the term “green light” particularly relates to light having a center wavelength between 500 nm and 560 nm; the term “yellow light” particularly relates to the center wavelength.
  • the term “red light” specifically refers to light with a center wavelength between approximately 590 nm and 650 nm;
  • the term “yellow phosphor” means light at a wavelength less than its own wavelength Excited to emit a laser-emitting material with a center wavelength between approximately 560 nm and 590 nm;
  • the term “green phosphor” is It is a luminescent material that emits laser light having a center wavelength between about 500 nm and 560 nm when excited by light having a wavelength smaller than its own wavelength;
  • the term “red luminescent phosphor” means that the wavelength is less than itself.
  • a laser-emitting luminescent material having a center wavelength between about 590 nm and 650 nm can be emitted.
  • the present invention further provides a method of manufacturing a remote phosphor lens.
  • the method for manufacturing a remote phosphor lens having a hemispherical compound curved surface structure includes the following steps:
  • Step 1 the particles of the resin C are added to the barrel of the injection molding machine to melt, and the solid curved body 4 is obtained by the injection molding process by means of the mold;
  • Step 2 the powder of the resin A and the powder of the phosphor B are thoroughly mixed, and then added to the barrel of the injection molding machine to melt, and the remote phosphor housing 3 is obtained by the injection molding process by means of the mold;
  • Step 3 The solid curved body 4 is placed in the remote phosphor housing 3, and baked in a vacuum so that the outer surface of the solid curved body 4 is sufficiently adhered to the inner surface of the remote phosphor housing 3; It is characterized in that the organic substance C and the organic substance A are softened and adhered, but the molten state is not formed.
  • Steps 2 and 3 can also be replaced by the following steps, as shown in Figure 5, as follows:
  • S301 mixing resin A powder, phosphor B powder and solvent into a uniform slurry, wherein the mass ratio of the resin A powder to the phosphor B powder is 100:10-20:150, and the phosphor B powder plus the resin A powder mixture
  • the volume ratio of the total volume to the solvent is 10:100-300:100, and the particle size of the resin A powder and the phosphor B powder is between 1 micrometer and 60 micrometer; wherein the solvent is a liquid alcohol, ether, ketone, ester , hydrocarbons.
  • S303 uniformly coating the slurry on the surface of the solid curved body 4, and drying the solid curved body 4 coated with the slurry at a temperature of 40 ° C to 130 ° C and a drying time of 5 minutes to 10 hours;
  • the coating process of the material includes screen printing and electrostatic spraying.
  • the baking temperature T 1 is 100 ° C - 260 ° C, the heating rate is 1-10 ° C / min, and the baking time is 5 minutes - 20 hours.
  • the cooling time is from 20 minutes to 10 hours, and a mixed coating containing the phosphor B and the resin C is obtained on the surface of the solid curved body 4;
  • the baking temperature T 1 is higher than the glass transition temperature of the resin C, but lower than the melting of the resin A
  • the temperature is above 10 ° C, and T 1 is close to but lower than the melting temperature of the resin A; at the baking temperature T 1 , the organic solvent is completely volatilized or decomposed; at the baking temperature T 1 , the resin A powder is softened and combined into a continuous In the vitreous body, a resin A coating containing the phosphor B can be obtained on the surface of the solid curved body 4.
  • Resin A should have better fluidity than resin C, and the glass transition temperature and melting temperature of resin A are lower than the glass transition temperature and melting temperature of resin A by 10 ° C or higher, and resin A at baking temperature T 1 .
  • the powder is softened, even close to melting, and adheres to each other on the surface of the resin C to form a uniform distribution of the continuous glass body; at this time, the phosphor B particles are separated and wrapped by the continuous glass body (resin A) to form on the surface of the solid curved body 4 A uniform Resin B coating containing Phosphor B.
  • Resin A should have a thermal expansion coefficient similar to or the same as that of resin C, so as not to be deformed from the baking temperature T 1 to room temperature, the solid curved body 4 is deformed due to the difference in thermal expansion coefficients of the two resins; there is little difference in thermal expansion coefficient
  • the two resins can fix the shape of the solid curved body 4 by means of a mold; preferably, the resin A and the resin C are different derivatives of the same resin, and the resin C coating and the solid curved body 4 are completely integrated. structure.
  • the drying process in the above step S303 can be carried out in the air or in a vacuum.
  • the baking process can be carried out in the air or in a vacuum, and the baking method is direct baking by infrared rays or heating and baking by electric heating wire;
  • Steps S301 to S305 are repeated a plurality of times until the remote phosphor case 3 satisfies the thickness requirement.
  • the preparation process is similar.
  • a method of manufacturing a remote phosphor lens having a square umbrella-shaped convex shape structure and a deformed semi-cylindrical shape structure is similar to the above method, and only the mold used is different.
  • the method for manufacturing a remote phosphor lens having a hemispherical composite curved surface structure includes the following steps:
  • Step 1 Mix the thermosetting resin or silica gel, remove the bubbles, inject into the mold, and cure at 50 ° C ⁇ 200 ° C for 20 minutes to 2 hours, and then cool to room temperature, to obtain a solid curved body 4;
  • Step 2 thoroughly mix the thermosetting resin or silica gel with the powder of the phosphor B, remove the bubbles, inject into the mold, cure at 50 ° C ⁇ 200 ° C for 20 minutes to 2 hours, and then cool to room temperature to obtain the remote phosphor shell. 3;
  • Step 3 coating the inner surface of the remote phosphor housing 3 with a transparent organic glue, then placing the solid curved body 4 into the remote phosphor housing 3, and baking in a vacuum to make the outer surface of the solid curved body 4
  • the inner surface of the remote phosphor housing 3 is sufficiently fitted; the organic glue has the same or similar refractive index as the solid curved body 4 and the remote phosphor housing 3, so as to avoid loss of light transmission.
  • the preparation process is similar.
  • a method of manufacturing a remote phosphor lens having a square umbrella-shaped convex shape structure and a deformed semi-cylindrical shape structure is similar to the above method, and only the mold used is different.
  • silicon dioxide SiO 2
  • zirconium dioxide ZrO 2
  • aluminum oxide Al 2 O 3
  • SiO 2 silicon dioxide
  • the volume ratio of the phosphor to the oxide particles is from 100:1 to 100:150.
  • the inorganic oxide particles may be composed of two or more types as needed.
  • the invention also provides a white light emitting device using a remote phosphor lens, comprising a remote phosphor lens with a circular COB integrated blue light source and a hemispherical composite curved surface structure.
  • the structure of the COB integrated blue light source is as shown in FIG. 6 , and includes a substrate 16 .
  • the LED chip area (circular) on the substrate 16 is pasted with a plurality of (group) blue LED chips 20 , and the plurality of blue LED chips pass through the gold wire 21 .
  • Circuit connections on substrate 16 and 17 and 22 are electrical connection terminals for the COB integrated blue light source.
  • the LED chip area is covered with a transparent silica gel layer 19, and the thickness of the transparent silica gel layer is just enough to cover the chip and the gold wire, and the remote phosphor lens is placed on the transparent silica gel layer, and the outer side of the lens is just close to the dam 18, The silica gel is applied to the joint between the lens and the dam.
  • the COB blue light source + remote phosphor lens combination is placed in a constant temperature oven for baking and curing, the baking temperature is 50 ° C to 200 ° C, and the baking time is 10 minutes to 2.5 hours. After the oven is cooled to room temperature, the cured COB blue light source + remote phosphor lens combination is taken out to obtain the white light emitting device of the present invention, as shown in FIG.
  • the phosphor and the blue chip are a "remote phosphor" arrangement, which is different from the conventional direct coating of a mixture of phosphor and silica gel or epoxy on the surface of the blue chip, the blue chip and the phosphor There is no direct contact and there is a certain physical space.
  • the blue chip 20 emits blue light and first enters the solid curved body 4, and part of the blue light is irradiated to the remote Phosphor particles B in the phosphor shell excite the yellow light that emits a longer wavelength. In this way, part of the blue light emitted by the LED chip is mixed with the yellow light excited by the phosphor to obtain white light.
  • FIG. 8 A cross-sectional view of a COB integrated white light source with a silicone lens packaged using conventional technology is shown in Fig. 8.
  • the cross section of the silicone lens is half circular, 23 is a substrate, 24 is a blue chip, and 25 is a coated silica gel. Regions, 26 and 27 are dams, and 28 are phosphor particles coated by silica gel regions;
  • the phosphor particles 28 are excited by the blue light emitted by the blue chip to emit yellow light 32, and are incident on the lens and air interface at an incident angle ⁇ 1 .
  • the yellow light ray 33 will exit from the T point with a slightly larger refraction angle ⁇ 2 ; the phosphor particles 29 are excited by the blue light emitted by the blue chip to emit yellow light 30 At the incident angle ⁇ 3 , it is incident on the U point at the interface between the lens and the air, and the yellow ray 31 will exit from the U point with a slightly larger refraction angle ⁇ 4 .
  • FIG. 9 shows a cross-sectional view of a COB integrated white light source of a planar structure packaged by a conventional technique, wherein 23 is a substrate and 24 is a blue chip. 25 is the coated silica gel region, 26 and 27 are the dams, 28 is the phosphor particles coated by the silica gel region, and the broken line 34 is the interface between the silica gel and the air; the phosphor particles 29 corresponding to FIG. 8 are subjected to The yellow light 30 emitted by the blue light emitted by the blue chip, the yellow light 35 in FIG.
  • FIG. 10 A cross-sectional view of a white light source of a COB blue light integrated light source plus a remote phosphor lens in the present invention is shown in FIG. 10, wherein the lens has a hemispherical composite curved surface structure, and the interface between the shell and the solid curved surface body is semicircular.
  • the center of the circle is O
  • 23 is the substrate
  • 24 is the blue chip
  • 25 is the coated silica gel region
  • 26 and 27 are the dam
  • 37 is the scattering agent particles
  • the organic material of the shell and the solid curved body is silica gel, and coated with The silica gel in the chip-covered region has the same refractive index.
  • the white light source adopting the COB blue light integrated light source and the remote phosphor lens combination has completely different illumination characteristics from the COB integrated white light source with the lens packaged by the conventional technology.
  • Phosphor particles are partially blue by the blue chip
  • the yellow light (such as 39, 41, and 45) emitted by the light and the remaining blue light (such as 42) emitted by the blue chip will be diffusely scattered on the lens surface after being refracted by the scattering agent (such as 43).
  • the white light obtained after mixing will produce various emission directions, and the illumination angle is greatly increased, so that the emitted light is more evenly distributed in space, and glare is avoided.
  • the blue chip and the phosphor are not in direct contact, there is a certain spatial distance, and the phosphor is excited by the blue light emitted by the LED blue chip to emit a longer wavelength light (such as yellow light, red light, etc.).
  • a longer wavelength light such as yellow light, red light, etc.
  • the COB blue integrated light source and the remote phosphor lens are combined to form a convex curved surface at the interface between the white light source and the air, so that the LED is compared with the COB integrated white light source of the planar structure packaged by the conventional technology.
  • the blue light emitted by the blue chip and the longer wavelength light emitted by the phosphor are greatly reflected at the interface with the air and are reabsorbed into the light-emitting device, thereby greatly reducing the luminous efficiency of the light source. At the same time reduce the heat generated by the light source.
  • the white light-emitting device can greatly improve the light-emitting efficiency of the light source, the heat generation of the light source can be greatly reduced, and the operating temperature of the chip can be greatly reduced, and the luminous efficiency of the LED blue light chip can be greatly improved.
  • the phosphor is far away from the chip, and the heat generation amount of the light source is greatly reduced, so that the operating temperature of the phosphor is greatly reduced, so that the light decay is greatly reduced, and the life of the light emitting device can be greatly extended.
  • the remote phosphor is a prefabricated component, which does not generate additional stress, and the process is relatively simple, which helps to improve the yield of the product.
  • a white light emitting device using a remote phosphor lens according to the present invention is not limited to a remote phosphor lens including a circular COB integrated blue light source and a hemispherical composite curved surface structure, and may also include a The light-emitting area is a square COB integrated blue light source and a square umbrella-shaped convex-shaped remote phosphor lens, or a remote phosphor lens having a rectangular COB integrated blue light source and a deformed semi-cylindrical shape structure.
  • a white light emitting device using a COB integrated blue light source and a remote phosphor lens combination has the advantage that a phosphor is placed between the blue chip and a "remote phosphor" setting, in combination with a conventional phosphor and silica gel or epoxy.
  • the blue chip does not directly contact the phosphor, and has a certain physical space; in the white light emitting device in which the remote phosphor lens and the COB blue integrated light source are combined, the phosphor and the blue chip are One kind
  • the "remote phosphor" setting the phosphor is excited by the blue light emitted by the LED blue chip, and the longer wavelength light (such as yellow light, red light, etc.) re-enters the chip and the chance of absorption is greatly reduced, which can effectively improve the light source illumination.
  • the phosphor particles in the remote phosphor shell are randomly distributed in space, and the light is diffusely reflected between the particles, and finally the light on the surface of the remote phosphor shell can be emitted in any direction, the angle of illumination
  • the increase is large, so that the outgoing light is more evenly distributed in space, avoiding the glare phenomenon
  • the interface between the light-emitting device and the air is a convex curved surface, so compared with the conventional technology packaged planar structure COB integrated white light source, the LED blue light chip
  • the emitted light emitted by the blue light and the phosphor is stimulated by the total wavelength of the light at the interface with the air to be re-entered into the light-emitting device, the light extraction efficiency is greatly increased, the light-emitting angle is greatly increased, and the phosphor works.
  • the temperature is greatly reduced, the phosphor light decay is greatly reduced, and the luminous efficiency of the light source is greatly improved.
  • the service life of the illuminating device is greatly extended.
  • Figure 1 Schematic diagram of a hemispherical remote phosphor lens.
  • Figure 2 Schematic diagram of a remote phosphor lens constructed with a hemispherical double shell.
  • Figure 3 Schematic diagram of a remote fluorescent lens of a square umbrella-shaped convex shape structure.
  • Figure 4 Schematic diagram of a deformed semi-cylindrical shape structure remote phosphor lens.
  • Figure 5 Process flow diagram for preparing a resin-based remote phosphor housing on a solid curved surface.
  • FIG. 1 Schematic diagram of the COB blue integrated light source.
  • FIG. 7 Schematic diagram of a white light emitting device combined with a COB blue integrated light source and a remote phosphor lens.
  • Figure 8 Cross-sectional view of a COB integrated white light source with a silicone lens packaged using conventional techniques.
  • Figure 9 Cross-sectional view of a COB integrated white light source with a planar structure packaged using conventional techniques.
  • Figure 10 Cross-sectional view of a white light source with a COB blue integrated light source plus a remote phosphor lens.
  • Embodiment 1 will be specifically described with reference to FIG. 1.
  • Figure 1 is a schematic view showing the structure of a hemispherical remote phosphor lens, wherein 3 is a remote having a large radius of curvature
  • the phosphor hemispherical shell 4 is a solid hemisphere having a small radius of curvature
  • O is a spherical core common to the remote phosphor hemispherical shell 3 and the solid hemisphere 4.
  • the housing 3 has an outer surface 1 and an inner surface 2; the outer surface 1 of the housing 3 may also be a spherical surface, or a paraboloid or any smooth convex surface; the thickness of the housing 3 may be uniform or may be The final application environment is adjusted; the thickness of the casing 3 ranges from 50 micrometers to 3 millimeters; the inner surface 2 of the casing 3 is completely identical to the physical shape of the surface of the solid curved surface body 4, and may be a spherical surface, or a paraboloid or any smooth surface; The surface of the solid curved body 4 completely conforms to the inner surface 2 of the casing 3 having a large radius of curvature.
  • the housing 3 having a larger radius of curvature is a remote phosphor structure comprising a mixture of a transparent organic substrate A and phosphor B particles;
  • the transparent organic substrate A is made of PMMA, PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butylbenzene, phenylsulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC.
  • the phosphor B is an LED yellow phosphor, or a mixture of an LED green phosphor and an LED red phosphor, or a mixture of an LED yellow phosphor and a small amount of LED red phosphor;
  • the solid curved surface body 4 with a small radius of curvature is a transparent organic material C, which is made of PMMA, PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butylbenzene, phenyl sulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC reinforced PMMA or MS resin.
  • a transparent organic material C which is made of PMMA, PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butylbenzene, phenyl sulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC reinforced PMMA or MS resin.
  • the material base A of the casing 3 and the material C of the solid curved body 4 may be the same or different.
  • the organic matrix A of the casing 3 and the material C of the solid curved body 4 have the same or similar refractive index to avoid light. Transmission loss
  • Step 1 the particles of the resin C are added to the barrel of the injection molding machine to melt, and the solid curved body 4 is obtained by the injection molding process by means of the mold;
  • Step 2 the powder of the resin A and the powder of the phosphor B are thoroughly mixed, and then added to the barrel of the injection molding machine to melt, and the remote phosphor housing 3 is obtained by the injection molding process by means of the mold;
  • Step 3 The solid curved body 4 is placed in the remote phosphor housing 3, and baked in a vacuum so that the outer surface of the solid curved body 4 is sufficiently adhered to the inner surface of the remote phosphor housing 3; It is characterized in that the organic substance C and the organic substance A are softened and adhered, but the molten state is not formed.
  • Steps 2 and 3 can also be replaced by the following steps, as shown in Figure 5:
  • S301 mixing resin A powder, phosphor B powder and solvent into a uniform slurry, wherein the mass ratio of the resin A powder to the phosphor B powder is 100:10-20:150, and the phosphor B powder plus the resin A powder mixture
  • the volume ratio of the total volume to the solvent is 10:100-300:100, and the particle size of the resin A powder and the phosphor B powder is between 1 micrometer and 60 micrometer; wherein the solvent is a liquid alcohol, ether, ketone, ester , hydrocarbons.
  • S303 uniformly coating the slurry on the surface of the solid curved body 4, and drying the solid curved body 4 coated with the slurry at a temperature of 40 ° C to 130 ° C and a drying time of 5 minutes to 10 hours;
  • the coating process of the material includes screen printing and electrostatic spraying.
  • the baking temperature T 1 is 100 ° C - 260 ° C, the heating rate is 1-10 ° C / min, and the baking time is 5 minutes - 20 hours.
  • the cooling time is from 20 minutes to 10 hours, and a mixed coating containing the phosphor B and the resin C is obtained on the surface of the solid curved body 4;
  • the baking temperature T 1 is higher than the glass transition temperature of the resin C, but lower than the melting of the resin A
  • the temperature is above 10 ° C, and T 1 is close to but lower than the melting temperature of the resin A; at the baking temperature T 1 , the organic solvent is completely volatilized or decomposed; at the baking temperature T 1 , the resin A powder is softened and combined into a continuous
  • the vitreous body can obtain a resin A coating containing phosphor B on the surface of the solid curved body 4.
  • Resin A should have better fluidity than resin C, and the glass transition temperature and melting temperature of resin A are lower than the glass transition temperature and melting temperature of resin A by 10 ° C or higher, and resin A at baking temperature T 1 .
  • the powder is softened, even close to melting, and adheres to each other on the surface of the resin C to form a uniform distribution of the continuous glass body; at this time, the phosphor B particles are separated and wrapped by the continuous glass body (resin A) to form on the surface of the solid curved body 4 A uniform Resin B coating containing Phosphor B.
  • Resin A should have a thermal expansion coefficient similar to or the same as that of resin C, so as not to be deformed from the baking temperature T 1 to room temperature, the solid curved body 4 is deformed due to the difference in thermal expansion coefficients of the two resins; there is little difference in thermal expansion coefficient
  • the two resins can fix the shape of the solid curved body 4 by means of a mold; preferably, the resin A and the resin C are different derivatives of the same resin, and the resin C coating and the solid curved body 4 are completely integrated. structure.
  • the drying process in the above step S303 can be carried out in the air or in a vacuum.
  • the baking process can be carried out in the air or in a vacuum, and the baking method is direct baking by infrared rays or heating and baking by electric heating wire;
  • Steps S301 to S305 are repeated a plurality of times until the remote phosphor case 3 satisfies the thickness requirement.
  • an appropriate amount of silica may be added to the mixed powder of the phosphor B powder and the resin A powder ( Inorganic oxide particles such as SiO 2 ), zirconium dioxide (ZrO 2 ), and aluminum oxide (Al 2 O 3 ) act as a light-mixing effect.
  • the volume ratio of the phosphor B powder to the oxide particles is from 100:1 to 100:150.
  • the particle size of the added oxide particles can be selected according to specific practical requirements.
  • the inorganic oxide particles may be composed of two or more types as needed.
  • the blue chip 20 emits blue light and first enters the solid curved body 4, and some of the blue light is irradiated to the remote phosphor. On the phosphor particles B in the casing, it emits yellow light having a longer wavelength. In this way, part of the blue light emitted by the LED chip is mixed with the yellow light excited by the phosphor to obtain white light.
  • Inorganic oxide particles such as (SiO 2 ), zirconium dioxide (ZrO 2 ), and aluminum oxide (Al 2 O 3 ) added to the blue light emitted from the LED blue chip 20
  • the portion of the blue light and the phosphor B particles absorbed by the phosphor B particles in the body 3 are more complexly reflected and refracted by the longer wavelength light emitted by the excitation, so that the two portions of the light are more thoroughly mixed. Therefore, a better quality white light is obtained.
  • Embodiment 3 will be specifically described with reference to FIG. 3.
  • FIG. 3 is a schematic structural view of a remote phosphor lens having a square umbrella-shaped convex shape structure, wherein the bottom surface of the solid curved surface body 11 of the square umbrella-shaped convex shape structure is a square, and the intersections of the four sides are H, I, J, and K, respectively.
  • Umbrella-shaped convex shape structure The solid curved surface body 11 is composed of a semi-cylindrical body with a line connecting the midpoint of the line segment JK and the line segment HI, and an overlapping portion of the semi-circular cylinder with the line connecting line IJ and the midpoint of the line segment HK as the axis.
  • the surface of the solid curved surface body 11 is completely identical with the inner surface of the large remote phosphor housing 10 of the square umbrella-shaped convex shape structure, and the large remote phosphor of the square umbrella-shaped convex shape structure
  • the housing 10 has a uniform thickness and a thickness in the range of 1 mm. ;
  • Step 1 Inject the silica gel into the mold and cure it at 60-150 ° C for 30 minutes to 2 hours. After cooling, the solid curved body 11 can be obtained;
  • Step 2 thoroughly mix the silica gel and the powder of the phosphor B, and then inject it into the mold after vacuuming, and then solidify at 60 to 150 ° C for 30 minutes to 2 hours, and then obtain a large remote fluorescence of the convex shape of the square umbrella shape after cooling.
  • Step 3 Applying a transparent glue to the inner surface of the large remote phosphor housing 10 of the square umbrella-shaped convex shape structure, and placing the solid curved surface body 11 into the remote phosphor housing 10, and curing at 60 to 150 ° C for 30 minutes. ⁇ 2 hours, after cooling A remote phosphor lens having a square umbrella-shaped convex shape structure can be obtained.
  • the organic glue has the same or similar refractive index as the solid curved body and the remote phosphor housing to avoid loss of light transmission.
  • Embodiment 4 will be specifically described with reference to FIGS. 6 and 7.
  • FIG. 7 is a schematic structural view of a white light emitting device combined with a COB blue light source and a remote phosphor lens
  • FIG. 6 is a schematic structural view of the COB blue integrated light source (22W) of FIG. 7, including a substrate 16, and an LED chip region on the substrate 16 is pasted.
  • a plurality of (group) blue LED chips 20, a plurality of blue LED chips being connected to circuits on the substrate 16 via gold wires 21, and 17 and 22 being electrical connection terminals of the light source.
  • the LED chip area is covered with a transparent silica gel 19, and the thickness of the transparent silica gel layer is just enough to cover the chip and the gold wire, and the remote phosphor lens is placed on the transparent silica gel layer, and the outer side of the lens is just close to the dam 18, The connection between the lens and the dam is coated with silica gel.
  • the organic matter of the solid curved body 4 and the remote phosphor case 3 in the remote phosphor lens is silica gel, and the phosphor B contains an LED green phosphor (luminescence center wavelength 554 nm) and a red phosphor (wavelength 643 nm).
  • the COB blue light source and the remote phosphor lens combination were placed in a constant temperature oven for baking and curing, the baking temperature was 100 ° C, and the baking time was 2 hours. After the oven is cooled to room temperature, the solidified COB blue light source and the remote phosphor lens are combined and taken out to obtain the white light emitting device of the present invention.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne une lentille de poudre fluorescente distante, comprenant une structure incurvée composite, laquelle structure incurvée composite est un corps composite qui a un logement (3) approximativement hémisphérique doté d'un plus grand rayon de courbure et un corps (4) incurvé solide approximativement hémisphérique doté d'un plus petit rayon de courbure, la coupe transversale du corps composite étant un demi-cercle approximatif, et la coupe transversale approximativement semi-circulaire du logement (3) ayant le plus grand rayon de courbure et celle du corps (4) à surface incurvée solide doté du plus petit rayon de courbure ayant un centre circulaire commun, ou est un corps composite constitué d'un grand logement (3) de poudre fluorescente distante ayant une surface inférieure carrée et ayant une structure carrée en forme de surface convexe de type parapluie et d'un petit corps (4) incurvé solide ayant une structure carrée en forme de surface convexe de type parapluie, ou est un corps composite constitué d'un grand logement (3) de poudre fluorescente distante ayant une surface inférieure rectangulaire et ayant une structure en forme de demi-cylindre déformée et d'un petit corps (4) à surface incurvée solide ayant une structure en forme de demi-cylindre déformée.
PCT/CN2015/074686 2014-11-14 2015-03-20 Lentille de poudre fluorescente distante et son procédé de fabrication ainsi que son application WO2016074404A1 (fr)

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CN201410649313.X 2014-11-14
CN201410649313.XA CN104485411A (zh) 2014-11-14 2014-11-14 一种远程荧光粉透镜和制造方法及其应用

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CN105156992B (zh) * 2015-08-28 2018-12-28 南京盈波光电科技有限公司 一种陶瓷灯罩专用白光光源及制造方法

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Publication number Priority date Publication date Assignee Title
CN102227012A (zh) * 2011-06-28 2011-10-26 复旦大学 一种色温均匀的高显色性能白光led
CN103078048A (zh) * 2013-01-08 2013-05-01 南通脉锐光电科技有限公司 白光发光装置
CN103681991A (zh) * 2013-12-20 2014-03-26 纳晶科技股份有限公司 用于led封装的硅胶透镜及其制造方法

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US20110031516A1 (en) * 2009-08-07 2011-02-10 Koninklijke Philips Electronics N.V. Led with silicone layer and laminated remote phosphor layer
CN103094461B (zh) * 2013-01-08 2016-03-30 江苏脉锐光电科技有限公司 光学波长转换组件、其制备方法及白光发光装置
CN203085634U (zh) * 2012-11-03 2013-07-24 林万炯 一种led封装结构及使用该led封装结构的灯具

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Publication number Priority date Publication date Assignee Title
CN102227012A (zh) * 2011-06-28 2011-10-26 复旦大学 一种色温均匀的高显色性能白光led
CN103078048A (zh) * 2013-01-08 2013-05-01 南通脉锐光电科技有限公司 白光发光装置
CN103681991A (zh) * 2013-12-20 2014-03-26 纳晶科技股份有限公司 用于led封装的硅胶透镜及其制造方法

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