WO2016072312A1 - 波長変換部材、及びそれを用いた発光装置、発光素子、光源装置、表示装置、導光部材、並びに波長変換部材の製造方法 - Google Patents
波長変換部材、及びそれを用いた発光装置、発光素子、光源装置、表示装置、導光部材、並びに波長変換部材の製造方法 Download PDFInfo
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- WO2016072312A1 WO2016072312A1 PCT/JP2015/080173 JP2015080173W WO2016072312A1 WO 2016072312 A1 WO2016072312 A1 WO 2016072312A1 JP 2015080173 W JP2015080173 W JP 2015080173W WO 2016072312 A1 WO2016072312 A1 WO 2016072312A1
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- Prior art keywords
- light
- wavelength conversion
- light emitting
- storage space
- conversion member
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/88—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing selenium, tellurium or unspecified chalcogen elements
- C09K11/881—Chalcogenides
- C09K11/883—Chalcogenides with zinc or cadmium
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
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- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Definitions
- the present invention relates to a wavelength conversion member in which a wavelength conversion member made of a molded body is disposed in a container, a light emitting device using the same, a light emitting element, a light source device, a display device, a light guide member, and a method for manufacturing the wavelength conversion member. .
- Patent Document 1 discloses an invention related to a light emitting device including a light source, a wavelength conversion member, a light guide plate, and the like.
- the wavelength conversion member is provided between the light source and the light guide plate, and after absorbing light emitted from the light source, generates light having a wavelength different from the wavelength of the light from the light source.
- a material in which a wavelength conversion part substance is enclosed in a cylindrical container such as glass is described.
- a fluorescent pigment, a fluorescent dye, or a quantum dot is disclosed.
- a wavelength conversion member formed by filling a resin containing a wavelength conversion substance such as a fluorescent pigment in a cylindrical container such as glass has not been disclosed so far.
- a method of filling a cylindrical container with a resin containing a wavelength converting substance a method of filling the container with a liquid resin mixed with the wavelength converting substance can be considered.
- it is difficult to manage the speed and pressure when filling the liquid resin into the container so that bubbles do not enter there is a problem that the yield tends to decrease.
- the present invention has been made in view of such points, and in particular, a wavelength conversion member that can suppress bubbles from entering the resin containing the wavelength conversion substance and can improve the yield, and a light-emitting device using the same, It aims at providing the manufacturing method of a light emitting element, a light source device, a display apparatus, a light guide member, and a wavelength conversion member.
- the wavelength conversion member of the present invention is characterized by having a container provided with a storage space, and a molded body containing a wavelength conversion substance disposed in the storage space.
- the molded body containing the wavelength converting substance in the storage space, it is possible to suppress the mixing of bubbles and improve the yield as compared with the configuration in which the liquid resin is injected into the storage space. Moreover, quality control can be facilitated by forming a molded body containing a wavelength converting substance.
- the molded body containing the wavelength converting substance is preferably formed by molding a resin composition in which quantum dots are dispersed.
- the container includes a light incident surface, a light emitting surface facing the light incident surface, and a side surface connecting the light incident surface and the light emitting surface, and the inner side of the side surface. It is preferable that the storage space is provided, and a colored layer is formed on the side surface, on an end portion of the light emitting surface, or on the end surface of the light emitting surface.
- the container includes a light incident surface, a light emitting surface opposed to the light incident surface, and a side surface connecting the light incident surface and the light emitting surface, and is located on the inner side of the side surface.
- the storage space may be provided, and a colored layer may be formed on a wall surface in the storage space.
- the container includes a light incident surface, a light emitting surface opposed to the light incident surface, and a side surface connecting the light incident surface and the light emitting surface, and the inner side of the side surface.
- the storage space may be provided, and a colored layer may be provided between the side surface of the container and the storage space.
- the container includes a light incident surface, a light emitting surface facing the light incident surface, and a side surface connecting the light incident surface and the light emitting surface, and the light incident surface and the light It is preferable that the storage space is provided on the inner side of the emission surface, and a distance L1 between the light incident surface and the storage space is larger than a distance L2 between the light emission surface and the storage space.
- the light-emitting device of the present invention is characterized by including a light-emitting element and the wavelength conversion member according to any one of the above-described components disposed on the light-emitting side of the light-emitting element.
- the light-emitting element of the present invention is characterized by including a light-emitting chip and the wavelength conversion member according to any one of the above-described components disposed on the light emitting side of the light-emitting chip.
- the light source device of the present invention is characterized by having the above light emitting device or the above light emitting element and a light guide plate.
- the light guide member of the present invention is characterized in that the wavelength conversion member and the light guide plate are integrated.
- the light source device of the present invention includes the light guide member and a light emitting element, and the light emitting element is attached to the light incident surface of the light guide member.
- a display device comprising: a display unit; and the light-emitting device, the light-emitting element, the light source device, the light guide member, or the light source device disposed on a back side of the display unit.
- the method for producing a wavelength conversion member of the present invention includes a step of forming a molded body containing a wavelength converting substance and a step of inserting the molded body into the storage space of a container provided with a storage space. It is characterized by.
- the molded object containing the wavelength conversion substance formed beforehand is inserted in a storage container, mixing of a bubble can be suppressed. Therefore, workability and yield can be improved and quality control can be facilitated.
- it is based on a simple method of inserting a molded article containing a wavelength converting substance into a storage container, it does not require complicated management such as the speed and pressure during filling, unlike the method of injecting a liquid resin.
- a wavelength conversion member can be formed.
- a molded body containing a wavelength converting substance it is possible to suppress bubbles from entering the wavelength converting substance by arranging the liquid converting resin into the accommodating space by arranging it in the accommodating space, and the yield. Can be improved. Moreover, quality control can be facilitated by forming the molded body containing a wavelength converting substance.
- FIG. 10 is an enlarged longitudinal sectional view taken in the height direction along the line BB and viewed from the arrow direction in a state where the wavelength conversion members shown in FIG. 9 are combined.
- FIG. 10 is a longitudinal sectional view of the light-emitting element as viewed from the direction of the arrow, cut in the height direction along the line BB shown in FIG. 9 in a state where the members of the light-emitting element shown in FIG.
- FIG. 1 It is a longitudinal cross-sectional view of the display apparatus using the light emitting element shown in FIG. It is a perspective view which shows the light guide member which concerns on this Embodiment. It is a perspective view which shows the light source device using the light guide member which concerns on this Embodiment.
- FIG. 1 is a perspective view and a sectional view of a wavelength conversion member showing a first embodiment according to the present embodiment.
- FIG. 1A is a perspective view of a wavelength conversion member showing the first embodiment.
- FIG. 1B is a cross-sectional view of the wavelength conversion member shown in FIG. 1A cut along a line AA in the plane direction and viewed from the arrow direction.
- the wavelength conversion member 1 in the first embodiment includes a container 2 and a molded body 3 containing a wavelength conversion substance.
- the container 2 includes a storage space 5 in which a molded body 3 containing a wavelength converting substance can be stored and held.
- the container 2 is preferably a transparent member. “Transparent” refers to what is generally recognized as transparent or has a visible light transmittance of about 50% or more.
- the vertical and horizontal dimensions of the container 2 are about several mm to several tens of mm, and the vertical and horizontal dimensions of the storage space 5 are about several hundred ⁇ m to several mm.
- the container 2 includes a light incident surface 2a, a light emitting surface 2b, and a side surface 2c connecting the light incident surface 2a and the light emitting surface 2b. As shown in FIG. 1, the light incident surface 2a and the light emitting surface 2b are in a positional relationship facing each other.
- the container 2 has a storage space 5 formed inside the light incident surface 2a, the light emitting surface 2b, and the side surface 2c. Note that a part of the storage space 5 may reach the light incident surface 2a, the light emitting surface 2b, or the side surface 2c.
- the outer cross section of the storage space 5 and the outer cross section of the container 2 are both rectangular. It is formed with.
- Such a cut surface is a surface cut in the direction in which the light incident surface 2a, the light emitting surface 2b, and the side surface 2c appear.
- the “rectangular shape” has four vertices having a substantially right angle and includes a square and a rectangle.
- the outer cross section of the storage space 5 and the outer cross section of the container 2 are preferably similar.
- the container 2 shown in FIG. 1 is, for example, a glass tube container, and can be exemplified by a glass capillary.
- a resin or the like may be used as long as the container having excellent transparency can be configured as described above.
- a molded body 3 containing a wavelength conversion substance is disposed in the storage space 5.
- the storage space 5 is open, and a molded body 3 containing a wavelength converting substance can be inserted therefrom.
- the wavelength conversion material according to the present embodiment is characterized by comprising a molded body.
- the molded body 3 containing the wavelength converting substance is previously molded according to the shape of the storage space 5.
- the molded object 3 containing a wavelength conversion substance can be appropriately arrange
- FIG. Therefore, in comparison with the case where the wavelength conversion substance is injected into the storage space 5 and the storage space 5 is filled, it is possible to suppress the problem that bubbles enter the wavelength conversion substance or the wavelength conversion substance is not uniform. That is, the wavelength conversion substance can be arranged uniformly. For example, when bubbles are introduced, the wavelength conversion efficiency tends to decrease due to light diffusion or the like at that portion.
- this Embodiment which can suppress that a bubble enters the inside of a wavelength conversion substance can improve wavelength conversion efficiency effectively. Moreover, in this Embodiment, since it can suppress that a bubble enters into a wavelength conversion substance, a yield can be improved and quality control can be performed easily.
- the molded body 3 containing the wavelength converting substance is inserted into the storage space 5 by means such as press fitting or adhesion.
- the molded body 3 containing the wavelength conversion substance is formed to be completely the same size as the storage space 5 or slightly larger than the storage space 5 and the wavelength conversion substance is applied while applying pressure. Is inserted into the storage space 5 to suppress the generation of a gap between the molded body 3 containing the wavelength converting substance and the container 2 as well as the inside of the molded body 3 containing the wavelength converting substance. it can.
- the molded body 3 containing the wavelength conversion substance When the molded body 3 containing the wavelength conversion substance is bonded and fixed in the storage space 5, the molded body 3 containing the wavelength conversion substance is molded to be smaller than the storage space 5, and the side surface of the molded body 3 containing the wavelength conversion substance.
- the molded body 3 containing the wavelength converting substance is inserted into the storage space 5 with the adhesive layer applied thereto.
- the cross-sectional area of the molded body 3 may be slightly smaller than the cross-sectional area of the housing space 5. Accordingly, the molded body 3 containing the wavelength converting substance and the container 2 are in close contact with each other through the adhesive layer, and the formation of a gap between the molded body 3 containing the wavelength converting substance and the container 2 is suppressed. it can.
- the adhesive layer the same resin as the molded body 3 or a resin having a common basic structure can be used. Alternatively, a transparent adhesive may be used as the adhesive layer.
- the molded body 3 containing the wavelength converting substance contains quantum dots. Fluorescent pigments other than quantum dots, fluorescent dyes, and the like may be used as the molded body 3 including the wavelength conversion substance, but including the quantum dots is excellent in wavelength conversion characteristics.
- the molded body 3 containing the wavelength converting substance is preferably formed by molding a resin composition in which quantum dots are dispersed.
- resins include polypropylene, polyethylene, polystyrene, AS resin, ABS resin, methacrylic resin, polyvinyl chloride, polyacetal, polyamide, polycarbonate, modified polyphenylene ether, polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyethersulfone, and polyphenylene sulfide.
- Polyamideimide, polymethylpentene, liquid crystal polymer, epoxy resin, phenol resin, urea resin, melamine resin, epoxy resin, diallyl phthalate resin, unsaturated polyester resin, polyimide, polyurethane, silicone resin, or some mixture thereof Etc. can be used.
- the refractive index of the wavelength converting material layer 3 is preferably smaller than the refractive index of the container 2.
- the refractive index of the silicone resin composition is 1.52 for SCR1016 manufactured by Shin-Etsu Chemical Co., Ltd. and 1.55 for A2045 manufactured by Daicel Co., Ltd. ) KER-2500 1.41 and Daicel A1080 A 1.41.
- the refractive index of the epoxy resin composition is 1.51 for Cell Venus WO917 manufactured by Daicel Corporation and 1.50 for Cell Venus WO 925 at 23 ° C. for sodium D line.
- the refractive index of the container 2 made of glass is about 1.45 in the case of general glass, and about 1.50 to 1.90 in the case of optical glass with a high refractive index. Therefore, the refractive index of the molded body 3 containing the wavelength converting substance can be made smaller than the refractive index of the container 2 by appropriately selecting the material of the molded body 3 containing the wavelength converting substance and the container 2. For example, A1080 or KER-2500, which is a silicone resin having a refractive index of 1.41, is used as the molded body 3 containing the wavelength converting substance, and the container 2 can be made of glass having a refractive index of 1.45.
- a silicone resin or epoxy resin having a refractive index of 1.41 to 1.55 is used as the molded body 3 containing the wavelength converting substance, and the container 2 is made of glass having a high refractive index of 1.56 or more. Can be configured. Thereby, a part of the light that has entered the molded body 3 containing the wavelength converting substance is totally reflected by the side wall portion of the container 2 facing the storage space 5. This is because the incident angle on the medium side with a small refractive index is larger than the incident angle on the medium side with a large refractive index. Thereby, since the amount of light leaking from the side of the container 2 to the outside can be reduced, the color conversion efficiency and the light emission intensity can be increased.
- the resin composition which comprises the molded object 3 containing the wavelength conversion substance here is not limited to resin for disperse
- the configuration and material of the quantum dots included in the molded body 3 including the wavelength conversion substance are not limited.
- the quantum dots in the present embodiment include a core of semiconductor particles and a shell that covers the periphery of the core. Part.
- CdSe is used for the core, but the material is not particularly limited.
- a core material containing at least Zn and Cd a core material containing Zn, Cd, Se and S, ZnCuInS, CdS, CdSe, ZnS, ZnSe, InP, CdTe, and some composites thereof are used. it can.
- the quantum dot in this Embodiment may be comprised only by the core part of a semiconductor particle, without forming a shell part.
- the quantum dot does not need to have a covering structure with a shell part as long as it has at least a core part.
- the region that becomes the covering structure may be small or the covering portion may be too thin to analyze and confirm the covering structure. Therefore, it can be determined as a quantum dot regardless of the presence or absence of the shell portion by analysis.
- Quantum dots include, for example, two types of quantum dots having an absorption wavelength of 460 nm (blue) and a fluorescence wavelength of about 520 nm (green) and a quantum dot of about 660 nm (red). For this reason, when blue light is incident from the light incident surface 2a, a part of blue is converted into green or red by each quantum dot. Thereby, white light can be obtained from the light emitting surface 2b.
- FIG. 2 is a cross-sectional view of a wavelength conversion member provided with a colored layer.
- colored layers 4 and 4 may be provided on the side surfaces 2c and 2c.
- the “colored layer” is a layer that is not transparent, and refers to a layer colored in colors including white.
- the colored layer 4 is preferably composed of paint, ink, or tape.
- the color of the colored layer 4 is not limited, it is suitable that it is white. Therefore, the colored layer 4 can be easily formed by simply applying white paint or white ink to the side surface 2c or simply applying a white tape to the side surface 2c.
- the colored layer 4 By providing the colored layer 4 in this manner, light leakage through the side region 7 can be suppressed, color conversion can be performed appropriately and with higher efficiency than in the past, and light of a desired color can be emitted. It can be obtained from the light exit surface 2b. Further, according to the present embodiment, the emission intensity of white light can be made equal to or higher than that of the prior art.
- the colored layer 4 can be formed by vapor-depositing a metal such as Ni, Ag, Al, or Cr.
- the colored layer 4 is formed on the side surface 2c of the container 2, but as shown in FIG. 2B, the colored layer 4 is formed from the side surface 2c of the container 2 to the end 2e of the light emitting surface 2b. Can do. Or as shown to FIG. 2C, the colored layer 4 can also be formed only in the edge part 2e of the light-projection surface 2b.
- the colored layer 4 is preferably formed from the side surface 2c of the container 2 as shown in FIG. 2A or from the side surface 2c of the container 2 to the end 2e of the light emitting surface 2b as shown in FIG. 2B.
- the end 2e of the light exit surface 2b faces the side region 7 between the storage space 5 and the side surface 2c. Therefore, the end 2e does not face the storage space 5 in which the molded body 3 containing the wavelength converting substance is disposed. Therefore, the colored layer 4 provided at the end 2e of the light emitting surface 2b is preferably located on both sides of the storage space 5 in which the molded body 3 containing the wavelength converting substance is disposed and does not face the storage space 5.
- the colored layer 4 may be formed slightly longer on the light emitting surface 2 b and may partially face the storage space 5. For example, the colored layer 4 is included in the allowable range as long as it faces about 1/3 or less of the width of the storage space 5.
- the colored layer 4 is preferably formed on the entire surface of the side surface 2c or the end portion 2e, but may not necessarily be the entire surface, and may be a part of the side surface 2c or the end portion 2e. However, the colored layer 4 preferably covers an area of 50% or more of the side surface 2c or the end 2e. Further, the colored layer 4 may be formed by using all or part of the side region 7 as a colored material instead of being formed on the side region 7. For example, all or part of the side region 7 can be formed by using white glass or white resin.
- the colored layer 4 is formed on the outer surface of the container 2, but the colored layer 4 may be formed on the wall surface 5 a of the storage space 5 as shown in FIG. 3A.
- the wall surface 5 a that forms the colored layer 4 is located at a position facing the side surface 2 c of the container 2.
- the side portion 2 d of the container 2 between the side surface 2 c of the container 2 and the storage space 5 can be a colored layer 4.
- the container 2 is molded in two colors, and at this time, a colored resin is used for a portion to be the side portion 2d of the container 2.
- the container 2 shown in FIG. 3B can be formed by bonding the side part 2d of the container 2 and the other part by bonding or the like.
- the same reference numerals as those in FIGS. 2A and 2B indicate the same parts as those in FIGS. 2A and 2B.
- FIG. 3C is a cross-sectional view of the wavelength conversion member 1 shown in FIG. 1A cut along the line CC and viewed from the arrow direction.
- a stepped portion 80 in which the molded body 3 is recessed from the container 2 is formed at both ends of the wavelength conversion member 1.
- a chip 82 as a colored layer covering the step portion 80 is connected via an adhesive layer 81.
- the chip 82 is formed in a shape substantially opposite to the stepped portion 80, and has a shape in which a portion facing the molded body 3 protrudes.
- the chip 82 is made of, for example, Al, but the material is not particularly limited.
- the adhesive layer 81 preferably has a water resistance barrier property.
- a colored layer may be formed on both ends of the wavelength conversion member 1 without forming the stepped portion 80.
- light leakage from both ends of the wavelength conversion member 1 can be suppressed, and color conversion can be performed appropriately and efficiently compared to the conventional case.
- FIG. 4 is a cross-sectional view of a wavelength conversion member in which a light incident surface side is formed with a thickness as viewed from a storage space (a molded body including a wavelength conversion substance).
- the distance between the light incident surface 2a and the molded body 3 containing the wavelength converting substance is L1, and the distance L2 between the light emitting surface 2b and the wavelength converting layer 3.
- the distances L1 and L2 are linear distances. For example, each of the centers of the light incident surface 2a and the light emitting surface 2b is drawn with a straight line, and the distances L1 and L2 can be measured by a length along the straight line.
- the distance L1 is larger than the distance L2. That is, the container 2 is thicker on the light incident surface 2a side than on the light emitting surface 2b side when viewed from the molded body 3 containing the wavelength converting substance.
- the distance L1 is about 1 mm to 8 mm, and the distance L2 is about 0.2 mm to 1 mm.
- the distance L1 is about 5 mm, and the distance L2 is about 0.5 mm.
- a light emitting element (light source) 10 such as an LED can be attached to the light incident surface 2a of the wavelength conversion member 1 as shown in FIG.
- the light emitting element 10 is in contact with the light incident surface 2 a of the wavelength conversion member 1.
- the molded body 3 containing the wavelength conversion material formed on the wavelength conversion member 1 is arranged so as to be biased toward the light exit surface 2 b rather than the light incident surface 2 a. Therefore, as shown in FIG. 1B, the molded body 3 containing the wavelength converting substance is disposed in the center between the light incident surface 2a and the light emitting surface 2b, and the light emitting element 10 is brought into contact with the light incident surface 2a as in FIG. Compared with the case where it was made, the structure of FIG. 4 can distance the wavelength conversion layer 3 from the light emitting element 10 compared with the structure of FIG. 1B.
- the wavelength conversion member 1 is disposed in contact with the light emitting element 10, so that the wavelength conversion member 1 and the light emitting element 10 can be integrally formed while keeping the wavelength conversion layer 3 away from the light emitting element 10. .
- blackening occurs in the portion of the molded body 3 containing the wavelength converting substance facing the light emitting element 10.
- the blackening is considered to be caused by the influence of light and / or heat from the light emitting element 10 on the quantum dots.
- L1 is made larger than the distance L2 between the molded body 3 containing the wavelength converting substance and the light emitting surface 2b.
- the container 2 is made thinner on the light exit surface 2b side when viewed from the molded body 3 containing the wavelength converting substance. Accordingly, it is possible to suppress the occurrence of blackening while suppressing an increase in the thickness of the entire container 2 (width dimension between the light incident surface 2a and the light emitting surface 2b).
- the cross-sectional shape is preferably such that the outer shape of the container 2 and the storage space 5 is rectangular.
- the side surface 2c of the container 2 and the side wall surface of the storage space 5 can be curved or elliptical.
- FIG. 5 is a cross-sectional view of a wavelength conversion member showing a cross-sectional shape different from that of FIG.
- the outer shape of the container 2 and the storage space 5 is square, but as shown in FIG. 5B, the outer shape of the container 2 and the storage space 5 can be rectangular.
- the effect of providing the colored layer 4 (color conversion can be performed appropriately and efficiently, as shown in FIGS. 4)
- the distance L1 between the light incident surface 2a and the molded body 3 containing the wavelength converting substance can be set as shown in FIG.
- the distance L2 between the light emitting surface 2b and the molded body 3 containing the wavelength converting substance can be appropriately and easily increased.
- the outer shapes of the cross section of the container 2 and the storage space 5 are similar to each other, but as shown in FIG. 5C, the outer shape of the cross section of the container 2 And the outer shape of the cross section of the storage space 5 can be made different.
- the outer shape of the cross section of the container 2 is a rectangular shape
- the outer shape of the cross section of the storage space 5 is a hexagon.
- the external shape of the cross section of the container 2 and the storage space 5 can be made into a trapezoid shape similar to each other. For example, in FIG.
- the shorter side of the trapezoid is the light incident surface 2a, and the longer side is the light emitting surface 2b. Thereby, the light emitted from the light source can be enlarged to a predetermined size.
- the long side of the trapezoid may be the light incident surface 2a and the short side may be the light emitting surface 2b, contrary to FIG. 5D. Thereby, the light emitted from the light source can be condensed to a predetermined size.
- the outer shapes of the cross sections of the container 2 and the storage space 5 are different from those in FIG. 5D, and the side surfaces are formed symmetrically with respect to the center line passing through the centers of the upper base and the lower base of the trapezoid. May be.
- the colored layer 4 does not need to be formed.
- the light incident surface 2a side may be formed thick with respect to the molded body 3 containing the wavelength converting substance.
- the light-incidence surface and the light-projection surface are formed in the plane, either one or both of a light-incidence surface and a light-projection surface are It may be formed with a curved surface.
- the side surface of the container 2 is formed as a flat surface, but the side surface may be formed as a curved surface. The corners between the sides may be R-shaped.
- expressions such as a rectangular shape, a hexagonal shape, and a trapezoidal shape are not limited to geometrically accurate quadrangular shapes, hexagonal shapes, trapezoidal shapes, etc., and lines and angles constituting these have distortions, or Including errors are also included. By these, the direction of the emitted light can be adjusted.
- FIG. 6 is a process diagram of molding a molded body containing the wavelength converting substance according to the present embodiment.
- FIG. 7 is a process diagram for inserting the molded body containing the wavelength converting substance shown in FIG. 6 into the storage space of the container.
- a mold 45 and an injection molding machine 41 are prepared.
- the shape of the molding space 45 a of the mold 45 is substantially the same as the shape of the storage space 5 of the container 2. “Substantially the same” is not limited to the case where they are completely the same, but may be slightly different in size. Specifically, an allowable range is a dimensional difference of about ⁇ 5%.
- the molding space 45a of the mold 45 has an elongated bar shape.
- the resin composition 44 in which the quantum dots 46 are dispersed is injected from the injection molding machine 41 to the mold 45.
- the resin composition 44 is a molten resin.
- the resin composition 44 in which the quantum dots 46 are dispersed is injected into a mold and then cooled to become a solid, thereby forming a molded body.
- the burrs and the like on the surface of the molded body 40 taken out from the mold 45 are ground to obtain the molded body 40 having a desired size and shape.
- the wavelength conversion member 1 According to the method for manufacturing the wavelength conversion member 1 according to the present embodiment, it is possible to freely produce molded bodies 40 of various shapes using a resin composition in which quantum dots and the like are dispersed.
- the molded body 40 according to the present embodiment is formed by methods such as extrusion molding, hollow molding, thermoforming, compression molding, calendar molding, inflation method, casting method, and the like. May be used.
- the produced molded body 40 is inserted into the storage space 5 of the container 2 in the wavelength conversion member 1 (in FIG. 7, the insertion is indicated by an arrow).
- the container 2 include a glass capillary as described above.
- the cross section of the molded body 40 shown in FIG. 7 (the cross section parallel to the surface of reference numeral 42) is the same as or slightly larger than the size of the cross section of the storage space 5, the molded body 40 is stored while applying pressure. Insert into space 5 (press fit). Since the container 2 has high strength in the insertion direction of the molded body 40, the container 2 is not easily damaged such as cracking of the container 2 during press-fitting.
- the molded body 40 and the container 2 can be brought into close contact and fixed.
- the cross section of the molded body 40 shown in FIG. 7 is slightly smaller than the size of the cross section of the storage space 5
- the molded body 40 is stored in the storage space 5 with the adhesive layer applied to the side surface of the molded body 40. Insert into.
- the molded body 40 and the container 2 can be fixed in close contact via an adhesive layer.
- the wavelength conversion member 1 When the wavelength converting substance is injected into the storage space 5, there is a problem that bubbles are likely to enter.
- the wavelength conversion material is formed of a molded body, it is possible to prevent bubbles from entering the wavelength conversion material.
- the molded body 3 containing the wavelength converting substance can be brought into close contact with the container 2, and therefore, a gap can be prevented from entering between the molded body 3 containing the wavelength converting substance and the container 2.
- the high-quality wavelength conversion member 1 can be manufactured with a high yield.
- workability is improved and quality control can be facilitated.
- FIG. 8 is a plan view of a light emitting device and a light source device using the wavelength conversion member shown in FIG.
- the wavelength conversion member 1 shown in FIG. 1 can be interposed between a light emitting element 10 such as an LED and a light guide plate 12, as shown in FIG.
- the wavelength conversion member 1 is disposed on the light emitting side of the light emitting element 10.
- the light emitting side is a side from which light is emitted from the light emitting element 10.
- the light emitting element 10 has a configuration in which an LED chip is mounted on a printed wiring board, the light emitting element 10 is on the opposite side of the printed wiring board with respect to the LED chip.
- a combination of the wavelength conversion member 1 and the light emitting element 10 is a light emitting device, and a light source plate 12 is added to the light emitting device to constitute a light source device.
- the light guide member can be configured by combining the wavelength conversion member 1 and the light guide plate 12.
- the light emitting device shown in FIG. 8 can be used as a white surface light source of a liquid crystal display, for example.
- the light emitted from the light emitting element 10 enters from the light incident surface 2 a of the wavelength conversion member 1, is wavelength-converted by the molded body 3 (see FIG. 1) containing the wavelength conversion substance, and the wavelength The converted desired light is emitted from the light emitting surface 2b to the light guide plate 12.
- the desired color of emitted light is white light.
- the rate at which the light source light from the light emitting element 10 passes through the side region of the wavelength conversion member 1 without being wavelength-converted can be reduced, which is more effective.
- light of a desired color can be obtained from the light exit surface 2b.
- the occurrence of blackening can be suppressed by making the light incident surface 2a side thicker when viewed from the molded body 3 containing the wavelength converting substance.
- the wavelength conversion member 1 and the light emitting element 10 are separated from each other.
- the distance between the molded body 3 containing the wavelength conversion substance and the light emitting element 10 can be increased, and the occurrence of blackening can be effectively suppressed.
- FIG. 9 is an exploded perspective view of a light emitting device including a wavelength conversion member according to the second embodiment.
- FIG. 10 is an enlarged longitudinal sectional view taken along the line BB in the height direction and viewed from the arrow direction in a state where the wavelength conversion members shown in FIG. 9 are combined.
- FIG. 11 is a longitudinal cross-sectional view of the light-emitting element as seen from the direction of the arrow, cut in the height direction along the line BB shown in FIG. 9 in a state where the members of the light-emitting element shown in FIG. 9 are combined.
- the wavelength conversion member 21 includes a container 25 formed of a plurality of pieces of a container main body 23 and a lid body 24.
- the wavelength conversion member 1 is disposed on the light emitting side of the LED chip (light emitting chip) 22.
- the light emitting side is a direction opposite to the printed wiring board 29 of the light emitting element 20 with respect to the LED chip (light emitting chip) 22, that is, a direction in which light is emitted from the light emitting element 20.
- a bottomed storage space 26 is formed at the center of the container body 23.
- a molded body 27 including a wavelength conversion substance made of a molded body is disposed in the storage space 26.
- the lid body 24 is joined to the container body 23 via an adhesive layer (not shown). Further, a colored layer is formed on the side surface 25 c of the container 25.
- the lower surface of the container 25 of the wavelength conversion member 21 shown in FIGS. 9, 10, and 11 is a light incident surface 25a.
- the upper surface facing the light incident surface 25a is the light emitting surface 25b.
- a storage space 26 is formed at a position inside the side surface 25c provided in the container 25 of the wavelength conversion member 21 shown in FIG. 9, FIG. 10, and FIG.
- a molded body 27 made of a molded body and containing a wavelength conversion substance is disposed by fixing means such as press-fitting or adhesion. That is, the molded body 27 containing the wavelength conversion substance is formed by molding the molded body 27 containing the wavelength converting substance slightly larger than the storage space 26 and press-fitting the molded body 27 containing the wavelength conversion substance into the storage space 26.
- the container 25 can be brought into close contact. Further, the molded body 27 containing the wavelength converting substance may be molded slightly smaller than the storage space 26.
- the molded body 27 containing the wavelength conversion substance is inserted into the storage space 26 by inserting the molded body 27 containing the wavelength conversion substance into the storage space 26.
- the container 25 can be brought into close contact with the adhesive layer.
- the same resin as the molded body 27 or a resin having a common basic structure can be used.
- a transparent adhesive may be used as the adhesive layer.
- the LED chip 22 is connected to a printed wiring board 29, and the periphery of the LED chip 22 is surrounded by a frame 30 as shown in FIGS.
- the inside of the frame 30 is sealed with a resin layer 31.
- the wavelength conversion member 21 is joined to the upper surface of the frame body 30 via an adhesive layer (not shown) to form a light emitting element 20 such as an LED.
- the colored layer described in FIG. 2 and the like may be provided in the wavelength conversion member 21 shown in FIGS. 9, 10, and 11, the colored layer described in FIG. 2 and the like may be provided. As described in FIG. 4, the wavelength conversion member 21 is viewed from the molded body 27 containing the wavelength conversion material.
- the light incident surface 25a side may be formed thicker than the light emitting surface 25b side.
- FIG. 12 is a longitudinal sectional view of a display device using the light emitting element shown in FIG.
- the display device 50 includes a plurality of light emitting elements 20 (LEDs) and a display unit 54 such as a liquid crystal display facing the light emitting elements 20.
- Each light emitting element 20 is disposed on the back side of the display unit 54.
- the plurality of light emitting elements 20 are supported by the support body 52.
- the light emitting elements 20 are arranged at a predetermined interval.
- Each light emitting element 20 and the support 52 constitute a backlight 55 for the display unit 54.
- the support 52 is not particularly limited in shape or material such as a sheet shape, a plate shape, or a case shape.
- a light diffusion plate 53 or the like is interposed between the backlight 55 and the display unit 54.
- the light emitting device and the light source device (including the light emitting element, the capillary wavelength conversion member 1, the light guide plate 12, and the like) shown in FIG. 8 are arranged on the back side of the display unit 54 shown in FIG.
- the display device 50 may be configured.
- FIG. 13 is a perspective view showing a light guide member according to the present embodiment.
- a storage space 5 is formed between both end portions on the light incident surface side of the light guide plate 12, and the molded body 3 containing a wavelength converting substance is inserted into the storage space 5.
- the structure of the molded body 3 containing the wavelength converting substance may be the same as that shown in FIG.
- the wavelength conversion member 1 and the light guide plate 12 are integrated, a combination process of the wavelength conversion member 1 and the light guide plate 12 is not necessary, and a positional shift or the like accompanying the combination process. The problem does not occur.
- a light diffusing plate 53 or the like may be included between the light guide plate 12 and the wavelength conversion member 1.
- the light emitting element is disposed to face the light incident surface 12a of the light guide plate 12 (wavelength conversion member 1).
- FIG. 14 is a perspective view showing a light source device using the light guide member according to the present embodiment.
- the light emitting element 10 is attached to the light incident surface 60 a of the light guide member 60.
- the light emitting element 10 has a configuration in which a plurality of LED chips are juxtaposed in a horizontal direction in a frame body and embedded in a resin. In addition, it can also be set as the structure by which the several light emitting element 10 was attached to the light-incidence surface 60a of the light guide member 60.
- the distance d between the molded body 3 containing the wavelength converting substance and the light incident surface 60a is extended as compared with FIG. 13, so that the light emitting element 10 can be directly attached to the light incident surface 60a.
- the distance d is preferably about 1 mm to 8 mm, similar to the distance L1 shown in FIG.
- the colored layer 4 is provided as in FIG. 13. However, the colored layer 4 may not be formed in the configurations of FIGS. 13 and 14.
- a light guide member 60 and a light emitting element (not shown) shown in FIG. 13 and a light source device 70 shown in FIG. 14 are arranged on the back side of the display unit 54 shown in FIG.
- the display device 50 may be configured.
- the wavelength conversion member and the light emitting element of the present embodiment can be applied to other types of light source devices, illumination devices, light diffusion devices, light reflection devices, and the like. it can.
- an LED, a backlight device, a display device, or the like can be realized by using a wavelength conversion member in which a molded product of a wavelength conversion material is press-fitted in a container.
- a wavelength conversion member of the present invention since the molded product containing the wavelength conversion material can be appropriately disposed on the wavelength conversion member, the LED, backlight device, display device, etc. using the wavelength conversion member of the present invention are of high quality. Can be maintained.
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Abstract
Description
Claims (13)
- 収納空間が設けられた容器と、
前記収納空間内に配置された波長変換物質を含む成形体と、を有することを特徴とする波長変換部材。 - 前記波長変換物質を含む成形体は、量子ドットが分散された樹脂組成物が成形されてなることを特徴とする請求項1に記載の波長変換部材。
- 前記容器は、光入射面、前記光入射面に対向する光出射面、及び、前記光入射面と前記光出射面との間を繋ぐ側面を備え、前記側面よりも内側に前記収納空間が設けられており、
前記側面上、前記光出射面の端部上、又は、前記側面上から前記光出射面の端部上にかけて着色層が形成されていることを特徴とする請求項1又は請求項2に記載の波長変換部材。 - 前記容器は、光入射面、前記光入射面に対向する光出射面、及び、前記光入射面と前記光出射面との間を繋ぐ側面を備え、前記側面よりも内側に前記収納空間が設けられており、
前記収納空間内の壁面に着色層が形成されていることを特徴とする請求項1又は請求項2に記載の波長変換部材。 - 前記容器は、光入射面、前記光入射面に対向する光出射面、及び、前記光入射面と前記光出射面との間を繋ぐ側面を備え、前記側面よりも内側に前記収納空間が設けられており、
前記容器の前記側面と前記収納空間までの間に着色層が設けられていることを特徴とする請求項1又は請求項2に記載の波長変換部材。 - 前記容器は、光入射面、前記光入射面に対向する光出射面、及び、前記光入射面と前記光出射面との間を繋ぐ側面を備え、前記光入射面及び光出射面よりも内側に前記収納空間が設けられており、
前記光入射面と前記収納空間との間の距離L1は、前記光出射面と前記収納空間との距離L2よりも大きいことを特徴とする請求項1から請求項5のいずれかに記載の波長変換部材。 - 発光素子と、前記発光素子の発光側に配置される請求項1から請求項6のいずれかに記載の波長変換部材と、を有して構成されることを特徴とする発光装置。
- 発光チップと、前記発光チップの光出射側に配置される請求項1から請求項6のいずれかに記載の波長変換部材と、を有して構成されることを特徴とする発光素子。
- 請求項7に記載の発光装置、あるいは、請求項8に記載の発光素子と、導光板と、を有することを特徴とする光源装置。
- 請求項1又は請求項2に記載の波長変換部材と、導光板とが一体となっていることを特徴とする導光部材。
- 請求項10に記載の導光部材と、発光素子と、を有し、前記発光素子は、前記導光部材の前記光入射面に取り付けられていることを特徴とする光源装置。
- 表示部と、前記表示部の裏面側に配置された請求項7に記載の発光装置、請求項8に記載の発光素子、請求項9に記載の光源装置、請求項10に記載の導光部材、あるいは、請求項11に記載の光源装置と、を有することを特徴とする表示装置。
- 波長変換物質を含む成形体を形成する工程と、
前記成型体を収納空間が設けられた容器の前記収納空間内に挿入する工程と、を含むことを特徴とする波長変換部材の製造方法。
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EP15857683.5A EP3217444A4 (en) | 2014-11-04 | 2015-10-27 | Wavelength conversion member, light-emitting device in which same is used, light-emitting element, light-source device, display device, light guide member, and method for manufacturing wavelength conversion member |
US15/522,398 US10598843B2 (en) | 2014-11-04 | 2015-10-27 | Method of producing wavelength converting member |
CN201580059774.4A CN107258023B (zh) | 2014-11-04 | 2015-10-27 | 波长转换部件及其制造方法、发光装置、光源装置 |
JP2016557715A JP6883159B2 (ja) | 2014-11-04 | 2015-10-27 | 波長変換部材の製造方法 |
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US20170315287A1 (en) | 2017-11-02 |
JPWO2016072312A1 (ja) | 2017-10-12 |
EP3217444A1 (en) | 2017-09-13 |
US10598843B2 (en) | 2020-03-24 |
TW201630220A (zh) | 2016-08-16 |
EP3217444A4 (en) | 2018-08-22 |
JP6883159B2 (ja) | 2021-06-09 |
CN107258023A (zh) | 2017-10-17 |
TWI693729B (zh) | 2020-05-11 |
CN107258023B (zh) | 2020-04-17 |
CN110828639A (zh) | 2020-02-21 |
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