WO2016059475A2 - Procédé de fabrication d'une pièce multifonctionnelle moulée par injection et pourvue d'une piste conductive et d'un connecteur, et substrat surmoulé - Google Patents

Procédé de fabrication d'une pièce multifonctionnelle moulée par injection et pourvue d'une piste conductive et d'un connecteur, et substrat surmoulé Download PDF

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Publication number
WO2016059475A2
WO2016059475A2 PCT/IB2015/002308 IB2015002308W WO2016059475A2 WO 2016059475 A2 WO2016059475 A2 WO 2016059475A2 IB 2015002308 W IB2015002308 W IB 2015002308W WO 2016059475 A2 WO2016059475 A2 WO 2016059475A2
Authority
WO
WIPO (PCT)
Prior art keywords
circuit carrier
film
circuit substrate
circuit
injection
Prior art date
Application number
PCT/IB2015/002308
Other languages
German (de)
English (en)
Other versions
WO2016059475A3 (fr
Inventor
Gerald Schöfer
Mag. DI Andreas TANDA
Christoph RAMSAUER
Philipp WEISSEL
Original Assignee
Plastic Electronic Gmbh
Schöfer Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plastic Electronic Gmbh, Schöfer Gmbh filed Critical Plastic Electronic Gmbh
Publication of WO2016059475A2 publication Critical patent/WO2016059475A2/fr
Publication of WO2016059475A3 publication Critical patent/WO2016059475A3/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • B29C45/14221—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure by tools, e.g. cutting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure

Definitions

  • the invention relates to a method for producing a multifunctional plastic injection molded part with integrated circuit carrier and integrated connector according to patent claim 1.
  • the invention further relates to a back - injected circuit carrier according to the preamble of patent claim 13.
  • Plastic parts or injection-molded parts with integrated circuit carrier in which the circuit carrier, for example, receive electronic components and / or other electrical functions see see how to take over sensor functions, are known from the prior art.
  • circuit carrier foils with conductor tracks arranged thereon are glued, pressed or sprayed with supporting and / or decorative plastic layers.
  • plastic parts are obtained, which combine electrical and electronic as well as mechanical or supporting and / or decorative functions at the same time.
  • WO 2012/170716 A2 discloses a control panel, for example for a washing machine, for the production of which a circuit carrier is laminated or back-injected together with conductor tracks with different plastic films or layers.
  • a tongue or tab of the circuit substrate is recessed from the laminate, and is finally as an angled terminal lug from the back (hereinafter also referred to as B side, unlike the A- Page, which denotes the front side or visible side or user side of an operating panel, for example) of the control panel.
  • the terminal lug is then contacted in the usual way with a foil connector and connected to the control electronics of the washing machine.
  • an additional trim of the foil circuit carrier and a corresponding after production or injection of the control panel Replacement of the terminal lug necessary, or a perforation, which is broken later, resulting in additional operations, costs and the risk of damage to the circuit board.
  • the film thickness of the circuit substrate must be adapted to the usual thicknesses for such connectors, whereby the film selection for the circuit carrier is already limited.
  • a film connector is not a connector in the strict sense, but only an electrical terminal lug in the form of a film cut, the mechanical stability is rather low.
  • connection lug designed in such a way requires in principle manual work in order to establish the connection of the back-injected circuit carrier with the connector of the higher-level circuit board. A fully automated assembly is not possible with the known versions of generic injection molded parts with circuit carrier.
  • the method according to the invention is used to produce a multifunctional injection molded part with an integrated circuit carrier and with an integrated plug connector.
  • the circuit carrier comprises a circuit carrier foil with at least one tongue section formed integrally with the circuit carrier foil (the tongue section becoming part of the integrated connector by means of the method according to the invention).
  • the circuit carrier foil has at least one electrically conductive conductor track on at least one of its surface sides and at least in a surrounding region surrounding the tongue portion.
  • the at least one conductor track can already be provided in advance with a conductor track pattern.
  • the "tongue portion” is an area region of the circuit carrier foil formed integrally with the circuit carrier foil, which is separated from the remaining circuit carrier foil along a portion of its circumference by means of a cut or with a punched-out portion and integrally formed along another portion of its circumference the remaining circuit substrate film is connected.
  • a) first of all, the circuit carrier is reshaped at least in the surrounding area of the tongue section such that at least partial regions of the deformed tongue section form an acute or right angle with the surface of the circuit substrate surrounding the tongue section In other words, protrude from the plane of the circuit substrate surrounding the tongue portion, preferably at a conforming with the subsequent connector outlet angle forming angle of the tongue portion.
  • the circuit carrier including the projecting tongue section is inserted into a casting mold, in particular an injection mold.
  • step c) then carried out a one-piece injection molding (alternatively, pre-projection), for example in the form of Film Insert Molding (FIM) at least of the tongue portion (5) surrounding surrounding area (8) of the circuit substrate (1, 3) including Tongue section (5) with a polymeric casting material, in particular injection-molded material.
  • injection molding for example in the form of Film Insert Molding (FIM) at least of the tongue portion (5) surrounding surrounding area (8) of the circuit substrate (1, 3) including Tongue section (5) with a polymeric casting material, in particular injection-molded material.
  • FIM Film Insert Molding
  • injection molding in the context of the invention, in each case, the alternative of predrawing should also be included, unless stated otherwise.
  • the one-piece unit formed in this way from solidified cast material, in particular injection-molded material, as well as circuit carrier and tongue section, are removed from the mold cavity.
  • the inventive method is compared to the above-described prior art advantageous insofar as this is no subsequent trimming and no subsequent detachment of a circuit board terminal lug, with corresponding costs and with the corresponding risk of damage longer necessary.
  • the type and thickness of the film material of the circuit substrate film in contrast to the state of the art now nikeable, without being limited to film thicknesses for conventional connectors.
  • the inventive method thus provides a multi-functional injection molded part with circuit carrier and connector, which is robust, less prone to error and easy to handle and assembly.
  • a particularly preferred embodiment of the method according to the invention provides that in method step a) (reshaping) beyond the deformation of the tongue section, further at least partial regions of the circuit carrier are also formed.
  • the circuit carrier is preferably 3D-deformed or freeform-shaped.
  • the design of a largely arbitrarily or 3D-free formed, for example, in the surrounding area of the connector 3D-curved, but ultimately a total of rigid and robust component unit from a back-injected circuit board with integrally molded and mechanically and electrically integrally connected to the circuit board connector allows ,
  • the method according to the invention takes place before forming in step a) on the surface of the circuit substrate to be back-coated at least partial areas of the circuit substrate including at least portions of the tongue portion with a primer layer, for example, a lamination of the circuit substrate film with a thermoplastic adhesive foil.
  • the at least one conductor track of the circuit carrier foil can already be provided in advance with the conductor track image, or a corresponding conductor track pattern can be applied by lamination with a conductor track layer and subsequent structuring of the conductor tracks after lamination with the adhesion promoter foil.
  • the adhesion promoter layer can be formed, for example, as a coated lacquer or adhesive layer, or else produced by molecular modification of the corresponding surface side of the circuit carrier foil, for example by plasma discharge or acid treatment of the corresponding circuit carrier surface.
  • the adhesion promoter layer is formed in the form of a film in the form of an adhesion promoter film.
  • the coating of the circuit substrate film with the adhesion promoter layer takes place by lamination of the circuit substrate film and adhesion promoter film to form a film laminate before the forming of the circuit substrate then laminated together with the adhesion promoter film takes place in process step a).
  • the embodiment with adhesion promoter film is advantageous in particular with regard to process reliability and production rate during the coating, since the adhesion promoter film, for example, can already be laminated in a planar manner in a roll-to-roll stage of the production process.
  • the circuit carrier is equipped with electronic and / or electrical components on one or both surface sides in advance of method step a) (reshaping) or in advance of method step b) (insertion in the injection mold) ,
  • a on the Front Var. View side (A side) and / or on the back (B side) already partially or completely Produce multi-functional injection molded parts with integrated connectors that can be embedded with electronic components, which can thus obtain embedded complex electronic functions such as sensors, evaluation electronics and / or optical signaling.
  • the assembly is carried out at least partially before the injection molding of the circuit carrier, a protective embedding of at least parts of the component assembly into the injection-molded material can thus take place.
  • a further embodiment of the method according to the invention provides that the at least one electrically conductive conductor track is arranged or arranged on the surface side facing the connector connector (that is to say component-related on the B side) of the circuit carrier foil, the circuit carrier being in process step c) is back-injected (or pre-injected in this embodiment) on the side facing away from the connector (A-side).
  • a pre-injection molded circuit board with integrated connector is obtained, in which conductor tracks at least on the back (ie on the connector side or B-side) are present, wherein the projection on the front side (ie on the steckverbinderabgewandten side, typically on the component -Sight side or A-side) of the circuit substrate is arranged.
  • An alternative embodiment of the method according to the invention provides for the at least one electrically conductive strip to be arranged or arranged on the surface of the circuit carrier film facing away from the plug connector (that is to say component-related on the front side or A side), the circuit carrier being in process step c) is back-injected on the connector-facing surface side (ie component-related on the back or B-side).
  • the circuit carrier being in process step c) is back-injected on the connector-facing surface side (ie component-related on the back or B-side).
  • a back-injected circuit substrate is obtained with integrated connector, in which conductor tracks at least A- or front side (ie opposite the connector side) are present, the back injection on the B- or back (ie on the connector side) of the circuit substrate is arranged.
  • the injection molded part can be additionally provided with a protective and or decorative coating film.
  • a rigid, sturdy, one-piece, multi-functional injection molded part having connectors and having electrical, mechanical, protective and decorative functions can be produced in a single injection molding operation.
  • the tongue portion subsequently (before the back injection) from the film laminate preferably adhesion promoter layer, circuit carrier film and decor layer dissolved out and deformed or bent, while the (not cut / stamped and not bonded in the surface region of the tongue portion with the laminate) decorative layer unchanged, the entire visible surface of the subsequent injection molded part continuously covered.
  • a protective and / or decorative coating layer on the side facing away from the connector surface of the injection molded part, which in this Embodiment preferably forms the A-side is applied.
  • This can be done in particular in the form of in-mold coating in that after the injection molding at least in partial areas of the front surface of the injection molded part opens an additional cavity in the injection mold and introduced (possibly different, especially optimized with respect to surface properties) polymeric casting or injection molding material in the additional cavity and so applied to the injection molded part, and after curing forms the coating layer.
  • the injection-molded part can thus, additionally or alternatively, in particular to a decorative layer a (further) protective, for example, transparent scratch-resistant and also seamless coating layer on the front or visible side (A-side) receive.
  • a decorative layer a (further) protective, for example, transparent scratch-resistant and also seamless coating layer on the front or visible side (A-side) receive.
  • a (further) protective for example, transparent scratch-resistant and also seamless coating layer on the front or visible side (A-side) receive.
  • the seamless coating layer thus formed protects the contained circuit substrate (including any decorative layer) as well as the contained sensory or other electronic functions from dirt, moisture and other external influences. Thanks to the method according to the invention, operating consoles with capacitive sensors produced in this way can be significantly thinner and lighter than control consoles known from the prior art. In this way, as well as by the 3D deformability, the method according to the invention and the multifunctional injection-molded parts produced therewith are particularly well suited for difficult installation situations, for flat devices, or for innovative control consoles, e.g. in vehicles.
  • the multifunctional injection-molded part can thus also receive, for example, the ability to output information by fitting optical components, such as LEDs, onto the circuit carrier foil and thus into the device integrated multifunctional injection molded part.
  • a transparent material can also be selected as the material for the posterior injection or pre-projection, which permits correspondingly sophisticated optical signal output, for example by means of integrated LED components.
  • non-electrical functional elements in particular mechanical locking or plug-mounting structures, are formed by the shaping of the back-injection of the circuit carrier tongue section (ie by the shaping of the back injection in the region of the connector).
  • this embodiment means that the back-injection in the region of the circuit board tongue section is already formed in the back injection step as a complete plug element including, for example, plug linear guide and mechanical plug locking structures. It is thus obtained without reworking a multi-functional injection molded part with integrated connector, in which the connector already has the required for a robust, in particular vibration-proof connector mechanical locking structures.
  • the invention further relates to a back-injected circuit carrier with integrated connector as already described above.
  • the circuit carrier comprises a circuit carrier foil with conductor tracks and at least one circuit carrier foil tongue section formed integrally with the circuit carrier foil for electrical connection of the circuit carrier, for example to a separate power supply or to an electronic circuit board.
  • the circuit carrier is characterized in that at least partial regions of the tongue section are integrally back-molded together with at least partial regions of the circuit carrier adjoining the tongue section on the surface side of the circuit carrier facing away from the track, thus forming a plug connector formed integrally with the back-injected circuit carrier.
  • the back-molded circuit carrier according to the invention with connector is advantageous over the initially described prior art insofar as the back-injected circuit carrier no mechanically sensitive, with respect to their angular position not defined circuit carrier terminal lug, but instead has a molded, rigid and stable plug, without For this, however, the integrity of the circuit substrate, the traces and the connector to give up.
  • the type and thickness of the film material for the circuit substrate film in contrast the state of the art freely selectable.
  • the circuit carrier may include a full-fledged connector with largely freely configurable geometry, also in 3D.
  • the immediate as well as the other component environment of the connector may be 2D or 3D free formed.
  • the inventive, back-injected circuit carrier thus represents an injection molded part with integrally integrated, mechanically robust connector and can be produced without need for further reworking in injection molding, the circuit carrier thus produced due to the defined shape and position of the integrated connector in particular for Fully automatic component testing and subsequent automatic assembly is suitable.
  • FIG. 1 is a schematic sectional view of the layer sequence of a circuit carrier according to an embodiment of the present invention
  • FIG. 2 shows a schematic sectional view of the layer structure of the circuit carrier according to FIG. 1 after the individual layers have been connected to one another
  • FIG. 3 shows a schematic sectional view of the circuit carrier according to FIGS. 1 and 2 after forming at least in the region of the tongue section;
  • FIG. 4 is a schematic sectional view of the formed circuit carrier according to FIG. 3 after pre-projection;
  • FIG. 5 again the circuit carrier of FIG. 4, with cutout mark for
  • FIG. 6 is a perspective view of the circuit carrier according to FIGS. 4 and 5;
  • circuit carrier with double-sided conductor track in a representation corresponding to FIG. 2, the layer structure of the circuit carrier according to FIG. 7 after the connection of the individual layers to a laminate as well as after cutting of the tongue section; in a representation corresponding to FIG. 3, the circuit carrier according to FIGS. 7 and 8 after forming, at least in the area of the tongue section; in a representation corresponding to FIG. 4, the reshaped circuit carrier according to FIG. 9 after the pre-projection; in a representation corresponding to Figures 1 and 7, the layer sequence of a circuit substrate according to the invention with integrated decorative layer; in a representation corresponding to FIGS. 2 and 8, the layer structure of the circuit carrier according to FIG.
  • FIGS. 7 after the connection of the individual layers to a laminate as well as after cutting of the tongue section; in a representation corresponding to FIGS. 3 and 9, the circuit carrier according to FIGS. 11 and 12 after forming, at least in the area of the tongue section; in a representation corresponding to FIGS. 4 and 10, the reshaped circuit carrier according to FIG. 13 after the back-injection and with additional coating layer; in a representation corresponding to Figures 1, 7 and 11, the layer sequence of a circuit substrate according to the invention with integrated decorative layer and double-sided conductor; in a representation corresponding to FIGS. 2, 8 and 12, the layer structure of the circuit carrier according to FIG. 7 after connecting the individual layers to a laminate and after cutting the tongue section; in a representation corresponding to FIGS. 3, 9 and 13, the circuit carrier according to FIGS. 15 and 16 after forming at least in the area of the tongue section; and Fig. 18 in a Fig. 4, 10 and 14 corresponding representation of the transformed
  • the layer thicknesses according to the drawing representation are not to scale, neither with respect to the respective overall figure nor with respect to the layer thicknesses of other layers. Some or all of the layer thicknesses, but especially the layer thicknesses of the conductor tracks 3, 3 ', are greatly enlarged in all the figures.
  • Fig. 1 shows schematically the layer sequence for one embodiment of a multifunctional injection molding according to the present invention.
  • a circuit substrate film 1 including (black) an adhesion promoter layer 2 formed here as a film, which - in addition to a supportive stiffening of the circuit substrate film 3 - during the later projection for material connection to the Precast selected, preferably thermoplastic injection molding material is used.
  • the primer film 2 is preferably made of thermoplastic, for example, ABS, PC, ABS / PC, PP and APET or the like. with a preferred thickness in the range of 150 ⁇ to 500 ⁇ .
  • the material of the thermoplastic adhesion promoter film 2 is based on the material used later in the further processing, in particular in the injection molding, with which the laminate of the circuit substrate film 1 and the adhesion promoter layer 2 is to be back-injected or pre-injected.
  • the material combination of adhesive film and injection molding material must be compatible with each other to ensure sufficient adhesion between the injection molding material and adhesive film 2.
  • the thickness of the primer film 2 is preferably 200 ⁇ to 500 ⁇ , more preferably 350 ⁇ to 500 ⁇ . With this layer thickness, sufficient inherent rigidity of the geometry of the circuit substrate according to the invention is ensured after the subsequent forming as well as before possible injection molding, with at the same time sufficient formability.
  • a circuit substrate film 1 preferably a polyester film is used, more preferably in the variants PET or PEN, which has a preferred thickness in the range of 12 ⁇ to 50 ⁇ . Particularly suitable is the material PEN due to its physical properties (temperature stability, low shrinkage, low water absorption), which are advantageous for further processing.
  • the material PEN due to its physical properties (temperature stability, low shrinkage, low water absorption), which are advantageous for further processing.
  • On the circuit substrate film 1 are preferably already before laminating or gluing with the bonding agent film 2 printed conductors 3 with the planned conductor track image.
  • the conductor pattern is produced, for example, by means of a lift-off method on the circuit substrate film 1, and as the material for the conductor tracks 3 copper is preferably used with a surface resistance of less than 30 mOhrn / D.
  • connection between circuit substrate film 1 and bonding agent film 2 is preferably effected by means of a laminated adhesive layer (not shown) in the flat state or in a roll-to-roll process, whereby a laminate of circuit substrate film 1 with conductor tracks 3 and adhesion promoter film 2 as shown in FIG. 2.
  • the adhesive layer can be present or applied in particular in the form of adhesive films or adhesive films, by coating or printing or as a liquid-dispensed (disperse) adhesive.
  • the preferred layer thickness of the adhesive layer in wet lamination is preferably in the range of 3-10 ⁇ m, in the case of hot-melt lamination preferably in the range of 5-50 ⁇ m, and in adhesive films and adhesive films preferably in the range of 20-130 ⁇ m.
  • the laminate produced in this way is then separated from the roll format into a provisional geometry, for example by means of a steel strip cut in a crucible punch.
  • a corresponding blank 4 of the later tongue section 5 takes place at the same time, so that finally the ready-cut and cut flat laminate according to Fig. 2 is present.
  • the laminate 1, 2, 3 is then brought into the desired geometry and shape, in particular also 3D geometry (the latter not shown), preferably abruptly into an isostatic high-pressure forming In mold under Gaschristbeetzstoffung above the glass transition temperature and below the melting temperature of the circuit substrate film 1 at a preferred forming temperature of 135 ° C to 180 ° C and at a preferred forming pressure of 20 bar to 155 bar, with a local elongation up to 150% and drawing depths to 55
  • the inventors have found that in this way, due to microscopic metal grid processes in which expanded metal-like structures of the conductor track 4 on a molecular size scale on the circuit substrate film 3, also the interconnects 3 with can be transformed, ei including SD reshaping of circuit carrier foil 1 and conductor tracks 3, without developing (macroscopic) cracks, and without the conductivity of the conductor tracks 3 being appreciably impaired by the 3D shaping.
  • tongue portion 5 is formed or bent so that the tongue portion 5 then protrudes (essentially in a consistent with the later plug outlet angle forming angle) from the plane of the laminate, in the embodiment of FIG. 3 at an angle of about 90 °.
  • the film insert 1, 2, 3 in the form of the trimmed and formed laminate of circuit carrier film 1 with interconnects 3 and adhesive promoter film 2 is inserted into the cavity of an injection molding tool, and on the printed circuit traces 3 facing the adhesive layer 2 side (here on the A side, ie on the view or user side of the later component) with a thermoplastic material 6 or pre-molded.
  • the finished without further reworking injection molded part with integrated circuit substrate 1, 3 and with integrated connector 9 shown in FIG. 4 is obtained.
  • an injection-molded part 7 comparable to FIG. 4 can be produced on the subscription-related bottom (ie on the later user or view page "A") additionally has a protective and / or decorative coating film (not shown).
  • FIG. 4 also shows a protective layer 10 which, for example in the form of protective lacquer, can be applied to the printed conductors 3, alternatively to the entire B-side surface of the circuit substrate 1, 3, in order to see the exposed printed conductors 3 in front of mechanical or media influences such as oxidation.
  • the application of the protective layer 10 can still take place in the flat state of the laminate 1, 2, 3 or the circuit substrate 1, 3.
  • the protective layer is preferably applied in a structured manner (eg printed), the later contacting surfaces being left open in the region of the tongue section 5 or plug connector 9.
  • the protective layer 10 for example, also final, that is applied after forming and injection molding of the laminate 1, 2, 3 as shown in FIG. 4, for example in the form of a protective coating.
  • FIG. 10 for example in the form of protective lacquer
  • FIG. 6 shows the area 8 marked in FIG. 5 in a schematic perspective view.
  • the circuit carrier 1, 3 is shown in FIG. 6 in a peripheral edge region (see FIG
  • the protective layer 10 (cf., Fig. 4, Fig. 5 or Fig. 10) in Fig. 6 is not drawn in view of the recognizability of the interconnects 3 in 2) smaller cut out.
  • Fig. 6 also shows the back injection, or in this embodiment, the projection 6 of the circuit substrate sheet 1, including the tongue portion 5, which is through the projection 6 to a full-fledged, robust connector 9, which is particularly suitable for fully automatic component testing and subsequent also automatic component assembly, for example, with a parent electronic assembly is suitable.
  • FIGS. 7 to 10 essentially correspond to FIGS. 1 to 4 with the difference that the embodiment according to FIGS. 7 to 10 has a circuit carrier foil 1 with a double-sided conductor track 3, 3 '.
  • the double-sided conductor track 3, 3 'of the embodiment according to FIGS. especially for use as capacitive touch sensors can be used.
  • the front-side conductor tracks 3 ' can also be equipped with components which can be arranged on the circuit carrier 1, 3, 3' in advance of the pre-injection with the injection-molding material 6 and thus embedded in the injection-molded material 6 during pre-projection , If an at least partially transparent material is used for the injection-molding material 6 in this variant, an optical signal output can also be effected in this way, in that the front-side assembly comprises, for example, light-emitting diodes. Otherwise, as well as with regard to the sequence of the production steps, The embodiment according to FIGS. 7 to 10 largely corresponds to the embodiment according to FIGS. 1 to 6.
  • the embodiment of FIG. 11 to 14 again has only one side arranged conductor tracks 3 ', which, however, in contrast to the embodiment of FIG. 1 to 6 on the front side, ie on the later view or user side A of the injection molded part 7 shown in FIG 14 are arranged.
  • the laminate according to FIG. 12 already comprises an (optional) additional decorative layer 11, for example a dyed, decoratively and / or informatively printed, or also, for example, textile covering, wood veneer or other decorative or decorative decoration Surface material formed layer.
  • the decor layer 11 present here is intended to cover the subsequent viewing or user side A (drawing-related bottom) of the injection molded part 7 without interruption in the region of the connector 9, the blank of the laminate layers 1, 2 (in the embodiment 1 to 4 in the already laminated state shown in FIG. 2 can be done) in the embodiment of FIGS. 11 to 14 at least before lamination with the decorative layer 11, so that the circuit substrate film 1 and the adhesive film 2 to the formation of the tongue portion. 5 necessary cut 4 can get without the decorative layer 11 is also cut.
  • the decorative layer In order to be able to detach and reshape the tongue section 5 after the lamination according to FIG. 12 of the layers 1, 2 and 11 or to bend it as shown in FIG. 13, the decorative layer also becomes laminating or gluing the layers 1, 2 and 11 11 recessed in the surface area 12 of the tongue portion 5 of the bond.
  • This is symbolized in FIG. 12 by the solid line in the surface region 12 of the tongue section between the decorative layer 11 and the circuit carrier film 1 overlying it (with conductor 3 '); in other words, in the region of the solid line at 12 according to FIG. 12 there is no application of adhesive or no connection between the decorative layer 11 and the circuit carrier foil 1 conductor 3 '.
  • the embodiment according to FIGS. 11 to 14 additionally has, in addition to the decorative layer 11, an (optional) upstream, in particular protective and / or decorative, coating layer 13, for example a high-gloss hardcoat.
  • the coating layer 13 is applied in the illustrated embodiment only after the back molding with thermoplastic material 6 '. This is done, for example, by in-mold coating in that the injection molded part 7 initially remains in the injection molding tool after the injection molding, after which an additional cavity in the injection molding tool is opened by appropriate tool movement whose size corresponds to the coating layer 13 to be created, and then the additional cavity with the liquid material the coating layer 13, for example, with clear-setting polyurethane, geflu- tet. After curing of the coating layer 13 thus produced in the additional cavity of the injection molding tool, the finished injection molded part 7 can then be removed from the mold.
  • the coating layer 13 according to FIG. 14 can also be applied directly to the user-side (drawing-related underlying) surface on the A-side of the back-injected circuit carrier foil 1 in a further variant (not shown in the figures) of an injection-molded part according to the invention in that a decorative layer 11 is arranged between circuit carrier film 1 and coating layer 13.
  • the decorative layer 11 should be omitted from the beginning.
  • the exemplary embodiment according to FIGS. 15 to 18 essentially corresponds to the exemplary embodiment according to FIGS. 11 to 14, but again initially with the difference that the embodiment according to FIGS. 15 to 18 (as in the exemplary embodiment according to FIGS 10) again has a circuit substrate film 1 with double-sided conductor 3, 3 '.
  • the double-sided conductor track 3, 3 'of the embodiment according to FIGS. 15 to 18 again allows, for example, a loading of the back conductor tracks 3 with components, while the front conductor paths 3' can be used again for sensor purposes, in particular for use as capacitive touch sensors. If in the embodiment of FIG.
  • the back side (B-side) conductor tracks 3 is provided, this can be done in particular before the back injection with the injection molding material 6 ', so that the components are embedded in the subsequent injection molding in the injection molding material 6.
  • the adhesion promoter layer 2 is correspondingly excluded in the later areas of the components when they are created.
  • the additional coating layer 13 according to FIG. 14 is omitted.
  • the decorative layer 11 here itself forms the user or visible surface on the side A (drawing-related bottom) of the component.
  • the conductor tracks 3, 3 ' have a greatly oversized drawn thickness.
  • the decorative layer 11 and the bonding agent film 2 can have a thickness 100 to 1000 greater than the printed conductors 3, 3 '. Due to this, a mechanical, optical or haptic impairment of the surface layer (for example the decorative layer 11 according to FIG. 18) is excluded by the conductor tracks 3 '.
  • one-piece, ready-to-install, multifunctional injection-molded parts with integrated plug connectors and with integrated conductor tracks can be produced, for example, for realizing a capacitive sensor which can also be 3D-free formed and / or ready-to-use components. and which may have both a decorative visual surface, for example carbon, textile or wood decor, as well as a hard-wearing, scratch-resistant, protective and / or high-gloss coating layer.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

L'invention concerne un procédé de fabrication d'une pièce (7) multifonctionnelle moulée par injection comprenant un substrat (1, 3) et un connecteur (9) intégré. L'invention concerne un substrat (1, 3) surmoulé (6) pourvu d'un connecteur (9) intégré. Le substrat (1, 3) comprend un film formant substrat (1) pourvu de pistes conductives (3) et d'une section formant languette (5). Selon le procédé de l'invention, le substrat (1, 3), y compris la section formant languette (5), est, après la mise en forme préalable, éventuellement la mise en forme 3D du substrat (1, 3), surmoulé d'un seul tenant avec un matériau à mouler par injection (6) au moins dans une zone environnementale (8) du substrat (1, 3), zone comportant la section languette. Cela permet d'obtenir des pièces (7) multifonctionnelles réalisées d'un seul tenant par moulage par injection, ne nécessitant aucun finissage, pourvues d'un substrat (1, 3) en film intégré et d'un connecteur de grande valeur, lesdites pièces étant aptes en totalité ou partiellement à une mise en forme libre en 2D ou 3D, ainsi que d'autres fonctionnalités, par exemple, de détection et/ou des fonctions d'affichage visuel.
PCT/IB2015/002308 2014-09-18 2015-09-18 Procédé de fabrication d'une pièce multifonctionnelle moulée par injection et pourvue d'une piste conductive et d'un connecteur, et substrat surmoulé WO2016059475A2 (fr)

Applications Claiming Priority (2)

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DE102014013562.4A DE102014013562A1 (de) 2014-09-18 2014-09-18 Verfahren zur Herstellung eines multifunktionalen Spritzgussteils mit Leiterbahn und Steckverbinder sowie hinterspritzter Schaltungsträger
DE102014013562.4 2014-09-18

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WO2016059475A2 true WO2016059475A2 (fr) 2016-04-21
WO2016059475A3 WO2016059475A3 (fr) 2016-06-23

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DE102019126232A1 (de) * 2019-09-30 2021-04-01 Lisa Dräxlmaier GmbH Herstellen eines stromführenden fahrzeugbauteils
US11325283B2 (en) 2020-03-17 2022-05-10 GM Global Technology Operations LLC Injected LED light assembly

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WO2012170716A2 (fr) 2011-06-10 2012-12-13 Scott Moncrieff Panneau de commande moulé par injection avec film plastique décoré moulé qui comprend un connecteur interne

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DE19546551C1 (de) * 1995-12-13 1997-01-16 Daimler Benz Ag Beschichtetes Dekorteil
KR101104026B1 (ko) * 2010-05-27 2012-01-06 강민수 Ｌｅｄ 전원용 압전회로부를 포함하는 전자식 카드
DE102011005933A1 (de) * 2011-03-23 2012-09-27 Robert Bosch Gmbh Verfahren zum Herstellen eines von einer Moldmasse umgebenen Schaltungsträgers
DE102011050585B4 (de) * 2011-05-24 2014-05-08 Kunststoff Helmbrechts Ag Verfahren zur Herstellung eines Kunststoffformkörpers als Anzeige- und/oder Funktionselement und Kunststoffformkörper
DE102011117985B8 (de) * 2011-11-09 2016-12-01 Leonhard Kurz Stiftung & Co. Kg Kunststoffteil sowie Verfahren zur Herstellung eines Kunststoffteils
DE102012203474B4 (de) * 2012-03-06 2014-06-26 Ddm Hopt + Schuler Gmbh & Co. Kg Kartenleser mit einem eine Leiterbahnstruktur aufweisenden Kunststoffspritzteil
JP5525574B2 (ja) * 2012-08-07 2014-06-18 ホシデン株式会社 部品モジュール及び部品モジュールの製造方法
DE202013102008U1 (de) * 2013-05-08 2014-05-12 Steffen Söhner Gmbh Vorrichtung zur Herstellung eines Bauteils mit Leiterbahnen, die ganz oder teilweise in Kunststoff eingebettet sind

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WO2012170716A2 (fr) 2011-06-10 2012-12-13 Scott Moncrieff Panneau de commande moulé par injection avec film plastique décoré moulé qui comprend un connecteur interne

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