EP3195705A2 - Procédé de fabrication d'un support de circuit déformé, et support de circuit déformé - Google Patents

Procédé de fabrication d'un support de circuit déformé, et support de circuit déformé

Info

Publication number
EP3195705A2
EP3195705A2 EP15816863.3A EP15816863A EP3195705A2 EP 3195705 A2 EP3195705 A2 EP 3195705A2 EP 15816863 A EP15816863 A EP 15816863A EP 3195705 A2 EP3195705 A2 EP 3195705A2
Authority
EP
European Patent Office
Prior art keywords
film
circuit
circuit carrier
circuit substrate
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15816863.3A
Other languages
German (de)
English (en)
Inventor
Klaus Schmidegg
Stephan Trassl
Mag. DI Andreas TANDA
Christoph RAMSAUER
Philipp WEISSEL
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hueck Folien GmbH
Original Assignee
Hueck Folien GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hueck Folien GmbH filed Critical Hueck Folien GmbH
Publication of EP3195705A2 publication Critical patent/EP3195705A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Definitions

  • the invention relates to a method for producing a formed circuit carrier according to claim 1. Furthermore, the invention relates to a reshaped circuit carrier according to the preamble of patent claim 11.
  • Circuit carriers for receiving, for example, electronic components and / or for implementing other electrical functions, such as sensor functions, are known from the prior art.
  • Genus according circuit carrier are usually designed as a flexible film circuit carrier or as a largely rigid or slightly flexible, rigid-flexible circuit boards.
  • Rigid circuit boards are usually made of epoxy resin and glass fiber fabric, flexible printed circuit boards made of plastic films, such as polyimide films.
  • conductive layers are usually copper layers which are patterned by means of photolithography and by etching processes.
  • flexible film circuit substrates which often consist of polyester film (PET / PEN) or also of polyimide (PI)
  • conductive structures are also partially vapor-deposited or produced by lamination of copper foils.
  • printed silver conductive tracks are also known.
  • a paste or ink with silver particles is applied by screen printing or by other printing processes on a film and forms after drying corresponding conductive structures.
  • certain silver pastes such circuit carriers can also be reshaped within relatively narrow limits, but their manufacture is expensive and relatively unreliable.
  • the known circuit carriers mentioned in the introduction can not usually be further processed in plastic processes, for example molded into a plastic part or coated with plastic, since the carrier materials used for the circuit carriers do not form a connection with materials used in plastics processing, and therefore no adhesive bond can be produced.
  • known circuit carriers are usually not deformable or only within narrow limits, in particular not freely deformable in the sense of deep drawing or in the sense of a 3D forming, ie a transformation from the planar shape into a shape with spherical surface portions.
  • the support materials are often not suitable for such a deformation
  • the conductive structures of known circuit substrate during deformation, in particular 3D deformation easily break and thus lose their conductivity.
  • silver printed conductors printed on foil can be deformed (in narrow limits) using special silver pastes, in some cases they can also be spherically or 3D formed.
  • the possible deep drawing ratio in the free deformation of such printed silver conductive tracks is relatively low with less than 2: 1.
  • the layer thickness of screen printed silver conductors is comparatively high, resulting in patterns of the conductor track structures, for example, later applied decor surfaces.
  • conductive tracks made of pastes have a lower conductivity compared to copper tracks, and silver is comparatively expensive.
  • the process reliability and speed for producing printed silver conductive tracks on film is relatively low and the reject is comparatively high.
  • manufacturing methods for the production of conventional circuit boards are usually limited to smaller areas up to a maximum of 600mm x 600mm, and disproportionately expensive on large areas.
  • the circuit carrier should be inexpensive and even with large surface dimensions with high Prozes security and precision to produce, a high drawdown ratio reach the deformation, and for further plastic processing, such as in particular for coating or back injection, can be used.
  • the method according to the invention is used to produce a shaped circuit substrate, comprising an adhesion promoter film of thermoplastic polymer and a circuit carrier film of organic polymer.
  • a surface bonding of at least regions of the adhesion promoter film to the conductor track-coated circuit carrier film takes place.
  • at least regions of the adhesion promoter film is intended to mean that the adhesion promoter film can also be larger than the circuit carrier film, so that only areas of the adhesion promoter film are coated or bonded to the circuit carrier film, while other areas of the adhesion promoter film are beyond edges of the circuit carrier film protrude.
  • the reverse case cutting of the circuit substrate film larger than adhesive film may occur, and should be encompassed by the invention. An example of this is the formation of a projecting terminal lug on the circuit substrate film.
  • step c) is then carried out an isostatic reshaping of at least partial areas of the circuit substrate, ie the composite or laminate of bonding agent film and conductor-coated circuit carrier film.
  • isostatic transformation means forming into a mold by means of a gaseous pressure medium which occurs abruptly above a glass transition temperature and below the melting temperature of the material to be formed under high gas pressure.
  • the isostatic transformation is preferably carried out at least 40 Kelvin below the melting temperature / flow temperature of the film material of the circuit substrate film to be formed.
  • the Melting temperature, for example, of polycarbonates is about 220 ° C, is therefore reformed preferably at 1 0 ° C.
  • step d the one-piece deformed unit of bonding agent film, circuit carrier foil and conductor track thus formed is removed from the mold cavity.
  • circuit carriers produced according to the invention can, in contrast to conventional circuit carriers, e.g. made of glass fiber reinforced epoxy resin, are used for further processing, in particular for injection molding or for injection molding / projection, for example in the form of film insert molding (FIM), since the material for the adhesive film of the circuit substrate can be selected so that this connects to the each used for injection molding plastic enters. Due to the low and uniform layer thicknesses of the erfmdungs according to purely metallic conductor track less or no visible marks of the structures of the conductor tracks are produced on overlying, in particular decorative surfaces of the plastic part.
  • conventional circuit carriers e.g. made of glass fiber reinforced epoxy resin
  • FIM film insert molding
  • a particularly preferred embodiment of the method according to the invention provides that the circuit carrier is 3D-deformed, deep-drawn or freeform-shaped during forming. In this way, the production of a largely arbitrary or 3D-free molded circuit substrate with interconnects is possible.
  • the method according to the invention achieves, for example, a considerably greater deep drawing ratio of 2: 1 to more than 3: 1, with simultaneously higher process reliability, higher throughput, reduced costs and reduced rejects.
  • the layer thickness of the process step a) on the circuit substrate film generated, purely metallic conductor track in the order of 1000 atomic layers is possible by a metallic layer thickness of the order of 1000 atomic layers, for example in copper so in the range of 200 to 350nm, in particular to deform the circuit substrate film with the metallic conductors in particular spherically (example deep draw) without cracking the conductor tracks or losing their continuous conductivity.
  • the particularly small layer thickness of the printed conductors also leads to a low consumption of conductive material, in particular copper.
  • the two-dimensional bonding of the adhesion promoter foil to the circuit carrier foil in process step b) takes place by means of a wet lamination process in a roll-to-roll process.
  • Role- To-roll processes are advantageous in terms of process safety and speed, especially at high volumes, allow high throughput while high process reliability and low cost.
  • the laminating process can be carried out in the form of a wet lamination, in which first a liquid laminating adhesive is applied to one of the two films, optionally pre-dried and then the film thus coated is bonded to the other film under the action of pressure and / or temperature.
  • the application of the liquid laminating adhesive is carried out preferably by means of roll application method (rotogravure, flexographic printing, screen printing, multi-roll application, etc.) or by means of spraying, dipping or jet coating.
  • the laminating adhesive itself can be solvent-free (LF lamination) or diluted with organic solvents, which are removed by means of a dryer before bonding.
  • LF lamination solvent-free
  • organic solvents which are removed by means of a dryer before bonding.
  • 2-component laminating adhesives which have high crosslinking densities and thus enable corresponding laminating strengths.
  • UV-curing laminating adhesives can be used.
  • hotmelt systems or hotmelt films are preferably used.
  • a further particularly preferred embodiment of the method according to the invention provides that before forming in method step c), a decorative layer is laminated to the circuit carrier foil on the exposed surface side of the circuit carrier (ie opposite the side of the adhesion promoter foil).
  • a protective (for example, particularly scratch-resistant), decorative and / or information purposes serving (for example, with hints or scales printed) decorative layer, in particular on the later visible side of the 3D-shaped circuit substrate (hereinafter referred to as user or A- Side referred to, in contrast to the B-side, which denotes the back or side facing away from the user, for example, a control panel) are applied.
  • Another particularly preferred embodiment of the method according to the invention provides that at least partial regions of the circuit substrate after molding in process step c) are back-injected with a polymeric cast material, in particular with a thermoplastic injection-molding material.
  • a polymeric cast material in particular with a thermoplastic injection-molding material.
  • multifunctional injection-molded parts with integrated circuit carrier foil and integrated strip conductors which receive the shape of robust and intrinsically rigid multifunctional components by the back molding, which are largely ready for installation without rework.
  • Also can - depending on the arrangement of the back injection - circuit carrier film and tracks hermetically protected, so in particular resistant to surrounding media.
  • the process thus provides a one-piece, multifunctional, free-formed injection molded part with integrated circuit carrier which is robust, low prone to error and easy to handle and assemble.
  • a further embodiment of the method according to the invention provides that, alternatively to or after the back-injection in a further method step, a protective and / or decorative coating layer is applied to the A-side of the circuit carrier.
  • a protective and / or decorative coating layer is applied to the A-side of the circuit carrier.
  • This can be done in particular in the form of in-mold coating in that after an optional injection molding at least in subregions of the later view or A side of the circuit carrier, an additional cavity in the deep-drawing mold or injection mold opens and (preferably with respect to surface properties optimized ) polymer casting or injection molding material is introduced into the additional cavity and applied to the circuit carrier, whereby this material forms the coating layer after solidification or curing.
  • the reshaped and possibly back-injected circuit carrier alternatively or additionally also to a possibly pre-applied decorative layer, a (further) protective, for example, transparent scratch-resistant and also seamless coating layer on the front or A- Page received.
  • a (further) protective for example, transparent scratch-resistant and also seamless coating layer on the front or A- Page received.
  • the thus produced seamless coating layer protects the circuit board contained (including any decorative layer), as well as any contained sensory, visual or other electronic functions from dirt, moisture and other external influences. If the corresponding layers of the circuit carrier are at least partially transparent, so the circuit carrier in this way as additional functionality For example, the ability to output information obtained by optical components such as LEDs loaded on the circuit substrate and thus integrated into the multifunctional injection molded part. Depending on the front or rear arrangement of such integrated LEDs can be selected as materials for the coating layer and also for the Schuspritz appropriate according to transparent materials.
  • a robust multifunctional circuit carrier with sensory, electrical, mechanical as well as protective and sophisticated decorative functions can be produced in one piece.
  • components produced in this way for example integrated operating consoles with capacitive sensors and optionally visual display functions, can also be significantly thinner and lighter than in control consoles known from the prior art.
  • the molded circuit boards produced by the method according to the invention are particularly well suited for difficult or demanding installation situations, for flat devices, or for innovative touch-sensitive control consoles, for example. in vehicles.
  • the circuit carrier is preceded by method step b) (laminating or bonding of bonding agent film and circuit carrier film), or in advance of process step c) (deformation), on one or both surfaces pages with electronic and / or electrical components.
  • This embodiment represents an alternative to a retrofitting of the deformed circuit carrier and allows the generation and possibly back-injection of a - at least front- or A-side, possibly also on both sides - already partially or completely populated, transformed circuit substrate.
  • a protective embedding of at least parts of the component assembly into the injection-molded material can also take place.
  • a separate blank of adhesion promoter film and / or circuit carrier film is produced prior to bonding or laminating the adhesion promoter film and the circuit carrier film in process step b).
  • the adhesive film can also be cut larger than the circuit substrate film, so that on the finished, transformed circuit substrate a partial or Complete supernatant of the adhesive film over the edge of the circuit substrate film results.
  • the reshaped circuit carrier can finally be back-injected or pre-injected, for example, on the conductor track side or provided with a coating layer, in particular in the region of the protruding adhesive promoter film, and thus embedded even more integral and hermetic in the plastic injection.
  • the reverse case cutting of the circuit substrate film larger than adhesive film
  • An example of this is the formation of a projecting terminal lug on the circuit substrate film.
  • the invention further relates to a reshaped circuit carrier, as already described above.
  • the circuit carrier comprises a laminate of a bonding agent foil of thermoplastic polymer and of a circuit carrier foil of organic polymer.
  • the circuit carrier is characterized in that the circuit carrier foil has at least one purely metallic conductor track on at least one of its surfaces, the conductor track having a layer thickness of the order of 1000 atomic layers, and wherein the conductor track together with the laminate carrying the conductor track consists of circuit carrier foil and Adhesive film is at least partially spherically reshaped.
  • the claimed metallic layer thickness in the order of 1000 atomic layers, in copper, for example in the range of 200 to 350nm layer thickness to reshape the metallic conductor (in particular free form or deep draw in the range of 200% to over 300% thermoforming ratio), without the conductor ripping or losing its continuous conductivity.
  • the aforementioned layer thickness of the at least one conductor track according to the findings of the In the case of deep drawing or in the case of the spherical or 3D deformation of the laminate of bonding agent film, circuit substrate film and printed circuit trace due to microscopic metal lattice processes, the applicant automatically produces an expanded metal-like structure of the printed conductor on a molecular size scale.
  • the conductor track endures the significant surface changes that occur, in particular, during a spherical or 3D deformation, without causing macroscopic cracks or interruptions in the conductor track.
  • the particularly small layer thickness also leads to a low consumption of conductive material, in particular of copper, and corresponding cost reduction.
  • the inventive, at least partially spherically deformed circuit carrier thus provides, in particular after a first practical plastic processing of a deformed circuit substrate, such as rear injection, coating, in-mold coating, etc., a robust, one-piece plastic component with integrable electrical or electronic functions, such as in particular information input (sensor) and possibly information output (light / display).
  • a robust, one-piece plastic component with integrable electrical or electronic functions such as in particular information input (sensor) and possibly information output (light / display).
  • the free design of the circuit carrier according to the invention or the method of producing the same result in extensive new fields of application, for example when using a free-form circuit carrier produced in this way in high-quality multifunctional control consoles, with significant advantages in terms of production. and assembly costs, handling, integration as well as user-friendliness and design.
  • FIG. 1 shows a schematic longitudinal sectional view of the layer sequence of a circuit carrier according to the present invention, at the beginning of an embodiment of the method according to the invention
  • FIG. 2 shows an enlarged detail view of the circuit carrier foil according to FIG. 1 during the production of a printed circuit pattern
  • Fig. 4 in a Fig. 1 and 3 corresponding representation of the circuit carrier according to Figures 1 and 3 after the forming or deep drawing ..;
  • FIG. 5 shows in a representation corresponding to FIGS. 1 and 3 to 4 the deep-drawn circuit carrier according to FIG. 4 after the (optional) injection molding or projection;
  • FIG. 6 shows in a representation corresponding to FIGS. 1 and 3 to 5 a deep-drawn and back-injected circuit carrier according to FIG. 5 with an additional A-side coating layer;
  • Fig. 1 shows schematically the layer sequence for an embodiment of a circuit carrier according to the present invention. It can be seen drawing down (black), the primer film 1, which - in addition to a supportive stiffening of the circuit substrate film 3 - for example, in a later back injection as adhesion agent for a chosen for injection molding, in particular thermoplastic injection molding material used.
  • the bonding agent film preferably consists of a thermoplastic, for example ABS, PC, ABS / PC, PP and APET or the like. with a preferred thickness in the range of 150 ⁇ to 500 ⁇ .
  • the material of the thermoplastic adhesion promoter film 1 is based on the material used later in further processing, for example in injection molding, if the bonding agent film 1 or the circuit substrate 1, 2, 3, 4 is to be back-injected or pre-injected later, for example.
  • the material combination of adhesive film and injection molding material must be compatible with each other to ensure sufficient adhesion between the injection molding material and adhesive film 1.
  • the thickness of the primer film 1 is preferably 150 ⁇ to 500 ⁇ , more preferably 350 ⁇ to 500 ⁇ . With this layer thickness sufficient inherent rigidity of the geometry of the circuit substrate according to the invention after the later forming and before any injection molding is ensured at the same time sufficient formability.
  • the circuit carrier foil 3 follows, on which preferably conductor tracks 4 are already arranged prior to lamination of the circuit carrier foil 3 with the adhesion promoter foil 1, wherein the conductor tracks 4 are designed purely metallic and one have particularly preferred thickness in the range of 1000 atomic layers.
  • the tracks 4 copper is preferably used with a surface resistance of less than 30 mOhm / D.
  • the material used for the circuit substrate film 3 is polyester, more preferably in the variants PET or PEN, in a thickness of 12 ⁇ m to 50 ⁇ m, particularly preferably in a thickness of 23 ⁇ m to 38 ⁇ m.
  • Particularly suitable is the material PEN due to its physical properties (temperature stability, low shrinkage, low water absorption), which are advantageous for further processing.
  • the conductor tracks 4 are preferably applied to the circuit substrate film 3 according to the detail representation in FIG. 2 by first applying a dye or lacquer coating 8 soluble in a solvent, for example water, in those areas 5 of the circuit substrate film 3 in a printing process is to be included later, no traces 4, in other words in the form of an inverse coding or in the form of a negative mask.
  • the application of the coating application 8 in the regions 5 can be effected by any desired method or printing process, for example by intaglio printing, flexographic printing, screen printing, digital printing and the like.
  • the structuring of the conductor tracks 4 can also be effected by etching or by laser.
  • the lacquer 8 used is soluble in a solvent, preferably water, but it is also possible to use a lacquer which is soluble in another solvent, for example in alcohol, esters and the like.
  • the varnish 8 may be in the form of compositions based on natural or artificial macromolecules.
  • the soluble paint 8 can in principle be pigmented with any pigments, or not be pigmented. Particularly suitable as pigments are TiO 2, ZnS, kaolin and the like.
  • the printed circuit substrate film 3 printed in the areas 5 with coating application 8 is then completely over the entire area (ie both in areas 5 with coating application and in areas 7 of the later conductors 4 without coating application) by means of a plasma process (low pressure - or Wegnplasma-, treated by a corona or by means of a flame process.
  • a plasma process low pressure - or Wegnplasma-, treated by a corona or by means of a flame process.
  • High-energy plasma for example Ar or Ar / O 2 plasma
  • circuit carrier film 3 the later regions of printed conductors 4 according to FIG. 1 which are not printed with varnish application 8 from residues of the varnish application.
  • this achieves the necessary sharp delimitation of the contours, which is necessary for the necessary precision of the later printed conductors 4.
  • the exposed surface of the circuit substrate film 3 is ionized or polarized in the regions 7 of the later interconnects 4 by producing terminal polar groups on the surface.
  • the subsequent adhesion of the metallic lead Terbahn layer 6 on the drawing-related upper surface of the circuit substrate film 3 significantly improved.
  • a thin metal or metal oxide layer can be applied to the circuit substrate film 3 as an adhesion promoter substantially simultaneously with the application of the plasma or corona or flame treatment, for example by sputtering or vapor deposition.
  • Particularly suitable are Cr, Al, Ag, Ti, Cu, TiO 2, Si oxides or chromium oxides.
  • This primer layer generally has a thickness of 0, lnm-5nm, preferably 0.2nm-2nm, more preferably 0.2nm to lnm.
  • the wiring layer 6 is made of a metal or a metal alloy, for which Al, Cu, Fe, Ag, Au, Cr, Ni, Zn and the like are suitable. Suitable alloys are, for example, Cu-Al alloys, Cu-Zn alloys and the like.
  • the conductor layer 6 can be applied by known methods, for example by vapor deposition, sputtering, printing (gravure, flexo, screen, digital printing and the like), spraying, electroplating and the like.
  • the thickness of the conductor track layer 6 is preferably 100 nm to 1000 nm, and is particularly preferably of the order of 1000 atomic layers, that is to say in the case of copper in the range from 200 nm to 350 nm.
  • the paint layer 8 is removed by a suitable solvent, which is matched to the composition of the material of the paint layer 8.
  • the material chosen for the lacquer layer 8 is water-soluble.
  • the detachment of the (now covered by the conductor layer 6) lacquer layer 8 can be supported by mechanical action.
  • the circuit substrate film 3 with the conductor tracks 4 arranged thereon is connected, for example, in a wet laminating process by means of the laminating lacquer or adhesive 2 to the bonding agent film 1 such that on the one (in the figures drawing-related lower) side of the primer film 1, and on the other (in the figures drawing top side) the circuit substrate film 3 with the selective Porterbahnbe layering 4 outside.
  • the laminating process is carried out in such a way that a preferred laminating resistance against detachment of 8-10 N / mm is achieved.
  • connection between circuit substrate film 3 and bonding agent film 1 takes place in the sense of a high throughput preferably in the flat state or in the roll-to-roll process.
  • the laminate produced in this way is then separated from the roll format into an at least provisional geometry, for example by means of a steel strip cut in a crucible punching machine, resulting in a laminate blank made of circuit carrier foil 3 with conductor tracks 4 and adhesive promoter foil 1 according to FIG.
  • FIG. 3 shows the layer sequence according to FIG. 1 as a finished layer structure for a deformable circuit carrier before it is deformed. It can be seen in the area of the circuit schufolie 3 full-surface bond between adhesive film 1, Kaschierkleber- layer 2 and circuit substrate film 3, wherein on the circuit substrate film 3, preferably according to the above process description, the tracks 4 are arranged.
  • the circuit board 1-4 which is still planar according to FIG.
  • circuit substrate film 3 is then abruptly shaped or deep-drawn into a mold under high pressure by means of isostatic reforming by fluid, preferably gaseous, pressure medium above the glass transition temperature and below the melting temperature of the circuit substrate film 3 ,
  • fluid preferably gaseous, pressure medium above the glass transition temperature and below the melting temperature of the circuit substrate film 3
  • the preferred parameters, based on a laminate of circuit substrate film 3 and bonding agent film 1 are: forming pressure between 20 and 155 bar, preheating 180 ° C, local elongation up to 150% and drawing depths up to 55 mm, whereby the invention according to free-form circuit substrate 1- 4 results in FIG. 4.
  • FIG. 5 initially contains a reshaped, preferably 3D free-form circuit carrier in the form of a laminate of bonding agent film 1, laminating adhesive 2 and circuit substrate film 3 with printed conductors 4, as already shown in FIG. 4.
  • the formed circuit carrier 1-4 is back-injected with a thermoplastic material 9 in the illustration of FIG. 5. Through the back-injection 9, the deformed circuit substrate 1-4 receives additional rigidity and an additional protective plastic layer 9. In this way, the formed circuit substrate 1-4 becomes an intrinsically stiff, robust component.
  • the back-injected circuit carrier 1-4 can also be given a protective and / or decorative coating layer 10 according to FIG. 6.
  • the back coat 9 is arranged on the B side, and the coat layer 10 is arranged on the A side (front side / visible side or user side) of the later component.
  • the coating layer 10 is applied in the illustrated embodiment after injection molding with the thermoplastic material 9.
  • circuit carrier 1-4 initially remains in the injection mold after the back injection 9, after which an additional cavity in the injection mold is opened by appropriate tool movement, the size of which corresponds to the coating layer 10 to be produced, and then the additional cavity is flooded with the liquid material of the coating layer 10, for example with a reaction polymer such as polyurethane.
  • a reaction polymer such as polyurethane.
  • the embodiment according to FIG. 7 initially corresponds to the embodiment according to FIG. 6 with regard to the plastics processing (back injection 9 and coating layer 10).
  • the circuit carrier still contains a decorative layer 11, for example a colored, decorative and / or informatively printed film, or even, for example, a trained as a wood veneer or other decorative or surface material layer.
  • a decorative layer 11 for example a colored, decorative and / or informatively printed film, or even, for example, a trained as a wood veneer or other decorative or surface material layer.
  • real wood veneers, real carbon or fabrics can be used as a decorative layer 11, which is of increasing importance, for example, for the high-end automotive sector.
  • the coating layer 10 may in particular be a reaction-hardened hardcoat, for example a high-gloss PUR flooding. This provides the component with an additional, hermetic surface protection, and makes any decor layer 11 underneath it with even better brilliance stand out.
  • the embodiment according to FIG. 8 essentially corresponds to the preceding exemplary embodiment according to FIG. 7, but with the difference that the embodiment according to FIG. 8 has a circuit carrier foil 3 with double-sided conductor track 4, 4 '.
  • a rear side (B-side) assembly for example, include light-emitting diodes, while surrounding and drawing related located above the light emitting diode layer areas are completely or partially transparent, to forward the light of the rear light emitting diodes forward, while under the drawing below the light emitting diodes located layer areas are made opaque or reflective, in order to direct the largest possible proportion of light of the LEDs forward and to radiate on the user or A side.
  • an optical signal output can also take place.
  • FIG. 9 shows a further embodiment which-initially similar to the embodiments according to FIGS. 5 to 8-has a back-injection or in this case a projection 9.
  • the user or visible side A is-unlike the abovementioned embodiments according to FIGS. 6 to 8-on the drawing-related lower side, ie on the side pre-sprayed with thermoplastic 9.
  • a transparent or crystal-clear polymer is used for the back-injection 9.
  • a protective lacquer layer 12 applied to protect the otherwise exposed traces 4 from mechanical or media influences such as oxidation.
  • a final coating layer 10 is again provided, which is preferably again formed as a hardcoat, and the building partly on the user or visual side A (drawing-related below) gives a correspondingly high-gloss appearance, a high-quality feel as well as a resistant, corrosion- and abrasion-resistant surface.
  • the conductor tracks 4, 4 ' have a thickness which is markedly oversized.
  • the decorative layer 11 and the bonding agent film 1 can have a thickness 100 to 1000 greater than the printed conductors 4, 4 '. Because of this, a mechanical, optical or haptic impairment of the surface layer (for example, the decorative layer 11 according to FIG. 7 or 8) is excluded by the conductor tracks 4.
  • ready-to-use, free-form, hermetically embedable in one-piece plastic components circuit carrier can be generated with tracks, for example, to realize capacitive sensor or other electronic functions including display functions, and both a decorative surface, for example, carbon -, Textile or real wood decor, as well as a hard-wearing, scratch-resistant, protective and / or high-gloss coating layer may have.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un support de circuit déformé se présentant sous la forme d'un stratifié composé d'une feuille de promoteur d'adhérence (1), éventuellement d'une couche d'adhésif (2), d'une feuille de support de circuit (3) et d'une piste conductrice purement métallique (4), cette dernière ayant une épaisseur préférée de l'ordre de 1 000 couches atomiques. L'invention concerne en outre un support de circuit (1-4) déformé. Selon le procédé de l'invention, le support de circuit (1-4) est déformé au moyen d'un fluide sous pression à l'état gazeux, la déformation ayant lieu de manière brutale, sous haute pression de gaz, à une température supérieure à la température de transition vitreuse et inférieure à la température de fusion de la feuille de support de circuit (3) à déformer. L'invention permet, pour la première fois, de réaliser des supports de circuit ayant subit une forte déformation, en particulier des substrats de circuit de forme libre ou sphérique, même munis de pistes conductrices purement métalliques. La rétro-injection (9), l'application de couches décoratives (11) et/ou de couches de revêtement (10), mises en oeuvre de façon facultative, permettent d'obtenir des composants en matière plastique multifonctions de forme libre sans soudure avec intégration d'électronique.
EP15816863.3A 2014-09-18 2015-09-18 Procédé de fabrication d'un support de circuit déformé, et support de circuit déformé Withdrawn EP3195705A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014013564.0A DE102014013564A1 (de) 2014-09-18 2014-09-18 Verfahren zur Herstellung eines umgeformten Schaltungsträgers, sowie umgeformter Schaltungsträger
PCT/IB2015/002186 WO2016042414A2 (fr) 2014-09-18 2015-09-18 Procédé de fabrication d'un support de circuit déformé, et support de circuit déformé

Publications (1)

Publication Number Publication Date
EP3195705A2 true EP3195705A2 (fr) 2017-07-26

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Application Number Title Priority Date Filing Date
EP15816863.3A Withdrawn EP3195705A2 (fr) 2014-09-18 2015-09-18 Procédé de fabrication d'un support de circuit déformé, et support de circuit déformé

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Country Link
EP (1) EP3195705A2 (fr)
DE (1) DE102014013564A1 (fr)
WO (1) WO2016042414A2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017212784A1 (de) * 2017-07-25 2019-01-31 Wiegand Gmbh Zierteil für ein Fahrzeug und Verfahren zur Herstellung eines Zierteils
DE102017125446B4 (de) 2017-10-30 2023-02-23 Bia Kunststoff- Und Galvanotechnik Gmbh & Co. Kg Bedienelement mit galvanisierter Oberfläche und kapazitiver Sensorik und Verfahren zu dessen Herstellung
DE102018131760A1 (de) * 2018-12-11 2020-06-18 Hueck Folien Gmbh Gewölbte Funktionsfolienstruktur und Verfahren zur Herstellung derselben
DE102021103548A1 (de) 2021-02-16 2022-08-18 Bayerische Motoren Werke Aktiengesellschaft Verfahren zur Herstellung eines Bauteils sowie Bauteil
DE102022120646A1 (de) 2022-08-16 2024-02-22 Audi Aktiengesellschaft Verfahren zur Herstellung einer flexiblen gedruckten Schaltung (FPC) mittels Auftragen von Metallleiterbahnen, gedruckte Schaltung und Batteriesystem mit gedruckter Schaltung

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Publication number Priority date Publication date Assignee Title
DE4036592A1 (de) * 1990-11-16 1992-05-21 Bayer Ag Spritzgegossene leiterplatten durch hinterspritzen von flexiblen schaltungen mit thermoplastischen materialien
DE19812880A1 (de) * 1998-03-24 1999-09-30 Bayer Ag Formteil und flexible Folie mit geschützter Leiterbahn und Verfahren zu ihrer Herstellung
US6617671B1 (en) * 1999-06-10 2003-09-09 Micron Technology, Inc. High density stackable and flexible substrate-based semiconductor device modules
DE102005017002A1 (de) * 2005-04-07 2006-10-19 Festo Ag & Co Verfahren zur Herstellung einer räumlichen, wenigstens in einem Teilbereich gekrümmten Leiterplatte sowie nach diesem Verfahren hergestellte Leiterplatte
CN101310570B (zh) * 2005-11-18 2010-11-10 日本电气株式会社 安装基板以及电子设备
US20070257398A1 (en) * 2006-05-04 2007-11-08 Moncrieff Scott E Laminated electronic components for insert molding
CN102484308A (zh) * 2009-04-21 2012-05-30 莫列斯公司 三维天线
CN101873776A (zh) * 2009-04-27 2010-10-27 深圳富泰宏精密工业有限公司 具有天线功能的电子装置壳体及其制造方法
EP2378846A1 (fr) * 2011-01-25 2011-10-19 Bayer Material Science AG Surface de produit décorative dotée d'une fonction de plaque conductrice

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DE102014013564A1 (de) 2016-03-24
WO2016042414A3 (fr) 2016-05-12
WO2016042414A2 (fr) 2016-03-24

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