WO2016059475A2

WO2016059475A2 - Method for producing a multifunctional injection-moulded part comprising a conductor track and a plug connector, as well as an insert-moulded circuit carrier

Info

Publication number: WO2016059475A2
Application number: PCT/IB2015/002308
Authority: WO
Inventors: Gerald Schöfer; Mag. DI Andreas TANDA; Christoph RAMSAUER; Philipp WEISSEL
Original assignee: Plastic Electronic Gmbh; Schöfer Gmbh
Priority date: 2014-09-18
Filing date: 2015-09-18
Publication date: 2016-04-21
Also published as: DE102014013562A1; WO2016059475A3

Abstract

The invention relates to a method for producing a multifunctional injection-moulded part (7) which comprises a circuit carrier (1, 3) and an integrated plug connector (9). The invention also relates to an insert-moulded (6) circuit carrier (1, 3) comprising an integrated plug connector (9). Said circuit carrier (1, 3) comprises a circuit carrier film (1) that has conductor tracks (3) and a tongue section (5). In the claimed method, after the circuit carrier (1, 3) has been formed or, if applicable, 3D formed, said circuit carrier (1, 3) is insert-moulded along with the tongue section (5) as one piece in at least one circuit carrier (1, 3) surrounding region (8) that comprises said tongue section (5), using an injection moulding material (6). This produces single-piece, multifunctional injection-moulded parts (7) without any reworking which comprise an integrated film circuit carrier (1, 3) and a fully functioning plug connector, and can additionally be fully or partially free-formed in a 2D or 3D manner. Additional functionalities such as sensors and/or visual display functions may also be contained.

Description

Method for producing a multifunctional injection molded part with conductor track and plug connector as well as back-injected circuit carrier

The invention relates to a method for producing a multifunctional plastic injection molded part with integrated circuit carrier and integrated connector according to patent claim 1. The invention further relates to a back - injected circuit carrier according to the preamble of patent claim 13.

[02] Plastic parts or injection-molded parts with integrated circuit carrier, in which the circuit carrier, for example, receive electronic components and / or other electrical functions see see how to take over sensor functions, are known from the prior art. For this purpose, for example, circuit carrier foils with conductor tracks arranged thereon are glued, pressed or sprayed with supporting and / or decorative plastic layers. In this way, plastic parts are obtained, which combine electrical and electronic as well as mechanical or supporting and / or decorative functions at the same time. [03] WO 2012/170716 A2 discloses a control panel, for example for a washing machine, for the production of which a circuit carrier is laminated or back-injected together with conductor tracks with different plastic films or layers. For the connection of the circuit carrier to the power supply or to the control electronics of the washing machine a tongue or tab of the circuit substrate is recessed from the laminate, and is finally as an angled terminal lug from the back (hereinafter also referred to as B side, unlike the A- Page, which denotes the front side or visible side or user side of an operating panel, for example) of the control panel. The terminal lug is then contacted in the usual way with a foil connector and connected to the control electronics of the washing machine. For the production of the terminal lug, however, an additional trim of the foil circuit carrier and a corresponding after production or injection of the control panel Replacement of the terminal lug necessary, or a perforation, which is broken later, resulting in additional operations, costs and the risk of damage to the circuit board. Due to the necessary design of the terminal lug as a suitable counterpart of a commercially available foil connector, the film thickness of the circuit substrate must be adapted to the usual thicknesses for such connectors, whereby the film selection for the circuit carrier is already limited. Also, a film connector is not a connector in the strict sense, but only an electrical terminal lug in the form of a film cut, the mechanical stability is rather low.

[05] As a result of the selective coating of the circuit substrate film with adhesion promoter, which is required for subsequent detachability of the connection lug, there is a risk in the injection molding process that the adhesion promoter is displaced or washed out and penetrates into the region of the connection lug. If this is the case, a detachment of the connection lug from the rear side (B side) of the control panel after the injection molding process is no longer possible. Furthermore, due to the required trimming or due to the required perforation of the circuit carrier foil in the region of the connecting lug, there is the risk that during the injection molding process, injection-molded material also passes through the perforated foil to its rear side. This can lead to the circuit substrate film being infiltrated with injection-molding material and thus floating, ie having an undefined end position in the finished component.

[06] In addition, after the injection molding has taken place, a trimming of the circuit carrier foil must always take place in order to be able to release the connection lug from the component. A mechanical damage of the end component and the circuit substrate film can not be excluded. In addition, the shape of the injection-molded component in its production is limited to rather flat, possibly 2D-shaped geometries, since otherwise cutting out and detachment of the terminal lug would only be more difficult or even impossible. [07] Finally, a connection lug designed in such a way requires in principle manual work in order to establish the connection of the back-injected circuit carrier with the connector of the higher-level circuit board. A fully automated assembly is not possible with the known versions of generic injection molded parts with circuit carrier.

[08] With this background, it is an object of the present invention to provide a method for producing a multifunctional plastic part with integrated circuit carrier and integrated, fully-fledged plug connector, as well as a back-injected circuit carrier with plug-in connector. To provide connector, with which the aforementioned disadvantages of the prior art are overcome. In particular, the connector of the circuit substrate to be produced reliably with high reproducibility by means of film technology, are suitable for automatic assembly including production of the electrical connection, and also be particularly robust and resistant to vibration during operation.

[09] This object is achieved by a method having the features of patent claim 1, and by a circuit carrier according to claim 15.

[10] Preferred embodiments are the subject of the subclaims.

[11] The method according to the invention is used to produce a multifunctional injection molded part with an integrated circuit carrier and with an integrated plug connector. For this purpose, the circuit carrier comprises a circuit carrier foil with at least one tongue section formed integrally with the circuit carrier foil (the tongue section becoming part of the integrated connector by means of the method according to the invention). The circuit carrier foil has at least one electrically conductive conductor track on at least one of its surface sides and at least in a surrounding region surrounding the tongue portion.

[12] The at least one conductor track can already be provided in advance with a conductor track pattern. For the purposes of the invention, the "tongue portion" is an area region of the circuit carrier foil formed integrally with the circuit carrier foil, which is separated from the remaining circuit carrier foil along a portion of its circumference by means of a cut or with a punched-out portion and integrally formed along another portion of its circumference the remaining circuit substrate film is connected.

In the method according to the invention, in a first method step a) first of all, the circuit carrier is reshaped at least in the surrounding area of the tongue section such that at least partial regions of the deformed tongue section form an acute or right angle with the surface of the circuit substrate surrounding the tongue section In other words, protrude from the plane of the circuit substrate surrounding the tongue portion, preferably at a conforming with the subsequent connector outlet angle forming angle of the tongue portion. Subsequently, in a further method step b), the circuit carrier including the projecting tongue section is inserted into a casting mold, in particular an injection mold.

In a further method step c) then carried out a one-piece injection molding (alternatively, pre-projection), for example in the form of Film Insert Molding (FIM) at least of the tongue portion (5) surrounding surrounding area (8) of the circuit substrate (1, 3) including Tongue section (5) with a polymeric casting material, in particular injection-molded material.

[16] If "injection molding" is mentioned below, in the context of the invention, in each case, the alternative of predrawing should also be included, unless stated otherwise. A known and preferred method in connection with the invention in which the focus is on the injection molding or projection of films, in particular circuit carrier films, is the film insert molding, in which the film to be injected or pre-sprayed (or a film laminate) into a Injection mold is inserted and molded onto one of the film surface sides with molten thermoplastic, wherein if necessary. At the same time a 3D deformation of the film by heat and pressure of the injected thermoplastic can be done.

Finally, in a further method step d), the one-piece unit formed in this way from solidified cast material, in particular injection-molded material, as well as circuit carrier and tongue section, are removed from the mold cavity. The inventive method is compared to the above-described prior art advantageous insofar as this is no subsequent trimming and no subsequent detachment of a circuit board terminal lug, with corresponding costs and with the corresponding risk of damage longer necessary. Furthermore, thanks to the invention, the type and thickness of the film material of the circuit substrate film, in contrast to the state of the art now nikeable, without being limited to film thicknesses for conventional connectors. Instead of only a sensitive terminal lug as in the prior art can be by means of the inventive method a full-fledged, robust and rigid connector with largely freely configurable geometry and high mechanical strength, even with 3D geometries represent. Also, the immediate component environment of the connector thus created may be 2D or 3D free formed. Overall, by means of the inventive method with high process reliability and reproducibility directly a multi-functional injection molded part with integrated circuit substrate and a finished, mechanically robust connector, without the need for further rework produced, the integrated connector thus produced due to its defined shape and location also suitable for fully automatic electrical component testing without manual reworking, as well as for automatic assembly, for example for connection to a higher-level electronic connection module. The inventive method thus provides a multi-functional injection molded part with circuit carrier and connector, which is robust, less prone to error and easy to handle and assembly. With regard to the claims and the description of the method according to the invention should in principle apply that used sequential descriptions such as "subsequently done" or "after step x)" are not to be understood in the sense of "immediately after", but only in terms of relative timing. In other words, for example, the expression "After method step x) is carried out in a further method step y) ..." merely that method step y) follows the method step x) in terms of time. However, this does not preclude, but in part explicitly provides, for example, that further method steps, in particular method steps according to preferred embodiments, can be inserted and carried out between method step x) and method step y). [21] A particularly preferred embodiment of the method according to the invention provides that in method step a) (reshaping) beyond the deformation of the tongue section, further at least partial regions of the circuit carrier are also formed. In this way, not only the connector can be reshaped in the angle provided for mounting, but also other portions of the circuit substrate, or even the entire circuit carrier, can be freely deformed (before the back injection). In this case, the circuit carrier is preferably 3D-deformed or freeform-shaped. In this way, the design of a largely arbitrarily or 3D-free formed, for example, in the surrounding area of the connector 3D-curved, but ultimately a total of rigid and robust component unit from a back-injected circuit board with integrally molded and mechanically and electrically integrally connected to the circuit board connector allows , According to a preferred embodiment of the method according to the invention takes place before forming in step a) on the surface of the circuit substrate to be back-coated at least partial areas of the circuit substrate including at least portions of the tongue portion with a primer layer, for example, a lamination of the circuit substrate film with a thermoplastic adhesive foil. In this way, there is a particularly good adhesion or an intimate, almost cohesive connection between the laminate of circuit carrier film and adhesive layer and the injection molding material in the subsequent back injection. In this case, the at least one conductor track of the circuit carrier foil can already be provided in advance with the conductor track image, or a corresponding conductor track pattern can be applied by lamination with a conductor track layer and subsequent structuring of the conductor tracks after lamination with the adhesion promoter foil.

It is in principle irrelevant which type is the adhesive layer and how it is generated or applied. The adhesion promoter layer can be formed, for example, as a coated lacquer or adhesive layer, or else produced by molecular modification of the corresponding surface side of the circuit carrier foil, for example by plasma discharge or acid treatment of the corresponding circuit carrier surface.

[24] According to a particularly preferred embodiment of the process according to the invention, however, the adhesion promoter layer is formed in the form of a film in the form of an adhesion promoter film. In this case, the coating of the circuit substrate film with the adhesion promoter layer takes place by lamination of the circuit substrate film and adhesion promoter film to form a film laminate before the forming of the circuit substrate then laminated together with the adhesion promoter film takes place in process step a). The embodiment with adhesion promoter film is advantageous in particular with regard to process reliability and production rate during the coating, since the adhesion promoter film, for example, can already be laminated in a planar manner in a roll-to-roll stage of the production process.

[25] According to a further embodiment of the method according to the invention, the circuit carrier is equipped with electronic and / or electrical components on one or both surface sides in advance of method step a) (reshaping) or in advance of method step b) (insertion in the injection mold) , In this way, a on the Frontbzw. View side (A side) and / or on the back (B side) already partially or completely Produce multi-functional injection molded parts with integrated connectors that can be embedded with electronic components, which can thus obtain embedded complex electronic functions such as sensors, evaluation electronics and / or optical signaling. Since in this embodiment the assembly is carried out at least partially before the injection molding of the circuit carrier, a protective embedding of at least parts of the component assembly into the injection-molded material can thus take place.

A further embodiment of the method according to the invention provides that the at least one electrically conductive conductor track is arranged or arranged on the surface side facing the connector connector (that is to say component-related on the B side) of the circuit carrier foil, the circuit carrier being in process step c) is back-injected (or pre-injected in this embodiment) on the side facing away from the connector (A-side). In this way, a pre-injection molded circuit board with integrated connector is obtained, in which conductor tracks at least on the back (ie on the connector side or B-side) are present, wherein the projection on the front side (ie on the steckverbinderabgewandten side, typically on the component -Sight side or A-side) of the circuit substrate is arranged.

An alternative embodiment of the method according to the invention provides for the at least one electrically conductive strip to be arranged or arranged on the surface of the circuit carrier film facing away from the plug connector (that is to say component-related on the front side or A side), the circuit carrier being in process step c) is back-injected on the connector-facing surface side (ie component-related on the back or B-side). In this way, a back-injected circuit substrate is obtained with integrated connector, in which conductor tracks at least A- or front side (ie opposite the connector side) are present, the back injection on the B- or back (ie on the connector side) of the circuit substrate is arranged. This alternative embodiment to the above embodiment results in other words an injection molded part with integrated connector, in which the conductor tracks A- or front side (ie on the component side view) are arranged, the back injection, however, the back (on the S teckverbinderseite). [28] With regard to the variant with a projection and at least a backside track, another possible embodiment of the method according to the invention provides that in the case of spraying in process step c) simultaneously with a protective and / or decorative coating film behind and is applied to the injection molded part, wherein the circuit substrate and coating film are arranged on opposite sides of the injection mold, and wherein injection molding material between circuit substrate and coating film is introduced. In this way, for example by means of film insert molding (insertion of the coating film in the injection mold before injection molding), the injection molded part can be additionally provided with a protective and or decorative coating film. Thus, a rigid, sturdy, one-piece, multi-functional injection molded part having connectors and having electrical, mechanical, protective and decorative functions can be produced in a single injection molding operation.

With regard to the alternative variant with back-injection and with at least front-side conductor track, a particularly preferred embodiment of the method according to the invention provides that after the formation of the circuit carrier tongue portion, ie after its cutout or free distances from the circuit carrier, and before method step a) (FIG. Reshaping of the circuit substrate), with respect to the surface side to be back-injected (= here A side = user side) of the circuit substrate is a laminating or gluing the circuit substrate film with a decorative layer, but the area of the tongue portion is not glued to the decorative layer. In this way, the tongue portion subsequently (before the back injection) from the film laminate preferably adhesion promoter layer, circuit carrier film and decor layer dissolved out and deformed or bent, while the (not cut / stamped and not bonded in the surface region of the tongue portion with the laminate) decorative layer unchanged, the entire visible surface of the subsequent injection molded part continuously covered.

According to a further embodiment it is provided that after the back molding in process step c) in a further process step (additionally or alternatively to a coating film or decor layer) a protective and / or decorative coating layer on the side facing away from the connector surface of the injection molded part, which in this Embodiment preferably forms the A-side, is applied. This can be done in particular in the form of in-mold coating in that after the injection molding at least in partial areas of the front surface of the injection molded part opens an additional cavity in the injection mold and introduced (possibly different, especially optimized with respect to surface properties) polymeric casting or injection molding material in the additional cavity and so applied to the injection molded part, and after curing forms the coating layer. The injection-molded part can thus, additionally or alternatively, in particular to a decorative layer a (further) protective, for example, transparent scratch-resistant and also seamless coating layer on the front or visible side (A-side) receive. In this way, for example, visually particularly appealing and at the same time robust, also durable and haptically advantageous, possibly 3D-shaped multi-functional injection molded parts with integrated circuit carrier can be produced, for example as operator consoles with integrated touch sensors, which simultaneously with optically high-quality printed or real decors such as Carbon fabrics, fabrics or wood veneers can be equipped.

[32] The seamless coating layer thus formed protects the contained circuit substrate (including any decorative layer) as well as the contained sensory or other electronic functions from dirt, moisture and other external influences. Thanks to the method according to the invention, operating consoles with capacitive sensors produced in this way can be significantly thinner and lighter than control consoles known from the prior art. In this way, as well as by the 3D deformability, the method according to the invention and the multifunctional injection-molded parts produced therewith are particularly well suited for difficult installation situations, for flat devices, or for innovative control consoles, e.g. in vehicles.

If the corresponding layers of the injection-molded part are made transparent, at least in some areas, the multifunctional injection-molded part can thus also receive, for example, the ability to output information by fitting optical components, such as LEDs, onto the circuit carrier foil and thus into the device integrated multifunctional injection molded part. In this case, a transparent material can also be selected as the material for the posterior injection or pre-projection, which permits correspondingly sophisticated optical signal output, for example by means of integrated LED components. [34] A particularly preferred embodiment of the method according to the invention provides that the final cutting of the circuit carrier foil or, if appropriate, of the foil laminate from the circuit carrier foil and the adhesion promoter foil takes place before the forming in method step a). In this way, virtually the entire production of the circuit substrate in the run-up to the embedding in the multifunctional injection molded part in the flat state "in the sheet" or in the roll-to-roll method. The reshaping (and subsequent back-injection) thus takes place only after completion of all previous, in the flat state of the circuit substrate vorge the process steps of cutting (and laminating). This increases the process reliability and stability as well as the speed in the preparatory processing of the circuit board, in addition, manufacturing costs and component scrap are reduced.

According to a further particularly preferred embodiment of the method according to the invention, non-electrical functional elements, in particular mechanical locking or plug-mounting structures, are formed by the shaping of the back-injection of the circuit carrier tongue section (ie by the shaping of the back injection in the region of the connector). In other words, this embodiment means that the back-injection in the region of the circuit board tongue section is already formed in the back injection step as a complete plug element including, for example, plug linear guide and mechanical plug locking structures. It is thus obtained without reworking a multi-functional injection molded part with integrated connector, in which the connector already has the required for a robust, in particular vibration-proof connector mechanical locking structures. [36] The invention further relates to a back-injected circuit carrier with integrated connector as already described above. The circuit carrier comprises a circuit carrier foil with conductor tracks and at least one circuit carrier foil tongue section formed integrally with the circuit carrier foil for electrical connection of the circuit carrier, for example to a separate power supply or to an electronic circuit board. According to the invention, the circuit carrier is characterized in that at least partial regions of the tongue section are integrally back-molded together with at least partial regions of the circuit carrier adjoining the tongue section on the surface side of the circuit carrier facing away from the track, thus forming a plug connector formed integrally with the back-injected circuit carrier. The back-molded circuit carrier according to the invention with connector is advantageous over the initially described prior art insofar as the back-injected circuit carrier no mechanically sensitive, with respect to their angular position not defined circuit carrier terminal lug, but instead has a molded, rigid and stable plug, without For this, however, the integrity of the circuit substrate, the traces and the connector to give up. Furthermore, in the circuit carrier according to the invention, the type and thickness of the film material for the circuit substrate film in contrast the state of the art freely selectable. Instead of only a sensitive terminal lug as in the prior art, the circuit carrier may include a full-fledged connector with largely freely configurable geometry, also in 3D. Also, the immediate as well as the other component environment of the connector may be 2D or 3D free formed. The inventive, back-injected circuit carrier thus represents an injection molded part with integrally integrated, mechanically robust connector and can be produced without need for further reworking in injection molding, the circuit carrier thus produced due to the defined shape and position of the integrated connector in particular for Fully automatic component testing and subsequent automatic assembly is suitable. [39] In the following, the invention will be explained in more detail with reference to exemplary embodiments of illustrative drawings. It shows

1 is a schematic sectional view of the layer sequence of a circuit carrier according to an embodiment of the present invention;

2 shows a schematic sectional view of the layer structure of the circuit carrier according to FIG. 1 after the individual layers have been connected to one another

Laminate and after cutting;

3 shows a schematic sectional view of the circuit carrier according to FIGS. 1 and 2 after forming at least in the region of the tongue section;

FIG. 4 is a schematic sectional view of the formed circuit carrier according to FIG. 3 after pre-projection; FIG.

Fig. 5 again the circuit carrier of FIG. 4, with cutout mark for

Fig. 6;

FIG. 6 is a perspective view of the circuit carrier according to FIGS. 4 and 5; FIG. Fig. 7 in a Fig. 1 corresponding representation of the layer sequence

to the invention circuit carrier with double-sided conductor track; in a representation corresponding to FIG. 2, the layer structure of the circuit carrier according to FIG. 7 after the connection of the individual layers to a laminate as well as after cutting of the tongue section; in a representation corresponding to FIG. 3, the circuit carrier according to FIGS. 7 and 8 after forming, at least in the area of the tongue section; in a representation corresponding to FIG. 4, the reshaped circuit carrier according to FIG. 9 after the pre-projection; in a representation corresponding to Figures 1 and 7, the layer sequence of a circuit substrate according to the invention with integrated decorative layer; in a representation corresponding to FIGS. 2 and 8, the layer structure of the circuit carrier according to FIG. 7 after the connection of the individual layers to a laminate as well as after cutting of the tongue section; in a representation corresponding to FIGS. 3 and 9, the circuit carrier according to FIGS. 11 and 12 after forming, at least in the area of the tongue section; in a representation corresponding to FIGS. 4 and 10, the reshaped circuit carrier according to FIG. 13 after the back-injection and with additional coating layer; in a representation corresponding to Figures 1, 7 and 11, the layer sequence of a circuit substrate according to the invention with integrated decorative layer and double-sided conductor; in a representation corresponding to FIGS. 2, 8 and 12, the layer structure of the circuit carrier according to FIG. 7 after connecting the individual layers to a laminate and after cutting the tongue section; in a representation corresponding to FIGS. 3, 9 and 13, the circuit carrier according to FIGS. 15 and 16 after forming at least in the area of the tongue section; and Fig. 18 in a Fig. 4, 10 and 14 corresponding representation of the transformed

Circuit carrier according to FIG. 17 after back injection.

[40] It should be noted in all the figures and all illustrated embodiments that the layer thicknesses according to the drawing representation are not to scale, neither with respect to the respective overall figure nor with respect to the layer thicknesses of other layers. Some or all of the layer thicknesses, but especially the layer thicknesses of the conductor tracks 3, 3 ', are greatly enlarged in all the figures.

[41] Fig. 1 shows schematically the layer sequence for one embodiment of a multifunctional injection molding according to the present invention. In the drawing, in the middle of the drawing (white), there is a circuit substrate film 1, including (black) an adhesion promoter layer 2 formed here as a film, which - in addition to a supportive stiffening of the circuit substrate film 3 - during the later projection for material connection to the Precast selected, preferably thermoplastic injection molding material is used. For this purpose, the primer film 2 is preferably made of thermoplastic, for example, ABS, PC, ABS / PC, PP and APET or the like. with a preferred thickness in the range of 150 μπι to 500 μηι.

Preferably, the material of the thermoplastic adhesion promoter film 2 is based on the material used later in the further processing, in particular in the injection molding, with which the laminate of the circuit substrate film 1 and the adhesion promoter layer 2 is to be back-injected or pre-injected. In this case, the material combination of adhesive film and injection molding material must be compatible with each other to ensure sufficient adhesion between the injection molding material and adhesive film 2. The thickness of the primer film 2 is preferably 200μπι to 500μηι, more preferably 350μιη to 500μπι. With this layer thickness, sufficient inherent rigidity of the geometry of the circuit substrate according to the invention is ensured after the subsequent forming as well as before possible injection molding, with at the same time sufficient formability.

As a circuit substrate film 1 preferably a polyester film is used, more preferably in the variants PET or PEN, which has a preferred thickness in the range of 12 μπι to 50 μπι. Particularly suitable is the material PEN due to its physical properties (temperature stability, low shrinkage, low water absorption), which are advantageous for further processing. On the circuit substrate film 1 are preferably already before laminating or gluing with the bonding agent film 2 printed conductors 3 with the planned conductor track image. The conductor pattern is produced, for example, by means of a lift-off method on the circuit substrate film 1, and as the material for the conductor tracks 3 copper is preferably used with a surface resistance of less than 30 mOhrn / D.

[44] The connection between circuit substrate film 1 and bonding agent film 2 is preferably effected by means of a laminated adhesive layer (not shown) in the flat state or in a roll-to-roll process, whereby a laminate of circuit substrate film 1 with conductor tracks 3 and adhesion promoter film 2 as shown in FIG. 2. The adhesive layer can be present or applied in particular in the form of adhesive films or adhesive films, by coating or printing or as a liquid-dispensed (disperse) adhesive. The preferred layer thickness of the adhesive layer in wet lamination is preferably in the range of 3-10 μm, in the case of hot-melt lamination preferably in the range of 5-50 μm, and in adhesive films and adhesive films preferably in the range of 20-130 μm.

The laminate produced in this way is then separated from the roll format into a provisional geometry, for example by means of a steel strip cut in a crucible punch. Preferably, a corresponding blank 4 of the later tongue section 5 (see Fig. 3 and Fig. 6) takes place at the same time, so that finally the ready-cut and cut flat laminate according to Fig. 2 is present.

By means of a forming step only indicated in FIG. 3, the laminate 1, 2, 3 is then brought into the desired geometry and shape, in particular also 3D geometry (the latter not shown), preferably abruptly into an isostatic high-pressure forming In mold under Gasdruckbeaufschlagung above the glass transition temperature and below the melting temperature of the circuit substrate film 1 at a preferred forming temperature of 135 ° C to 180 ° C and at a preferred forming pressure of 20 bar to 155 bar, with a local elongation up to 150% and drawing depths to 55 The inventors have found that in this way, due to microscopic metal grid processes in which expanded metal-like structures of the conductor track 4 on a molecular size scale on the circuit substrate film 3, also the interconnects 3 with can be transformed, ei including SD reshaping of circuit carrier foil 1 and conductor tracks 3, without developing (macroscopic) cracks, and without the conductivity of the conductor tracks 3 being appreciably impaired by the 3D shaping. In any case, when forming the laminate according to FIG. 3 the previously defined by means of section 4 tongue portion 5 is formed or bent so that the tongue portion 5 then protrudes (essentially in a consistent with the later plug outlet angle forming angle) from the plane of the laminate, in the embodiment of FIG. 3 at an angle of about 90 °. [47] Subsequently, the film insert 1, 2, 3 in the form of the trimmed and formed laminate of circuit carrier film 1 with interconnects 3 and adhesive promoter film 2 is inserted into the cavity of an injection molding tool, and on the printed circuit traces 3 facing the adhesive layer 2 side (here on the A side, ie on the view or user side of the later component) with a thermoplastic material 6 or pre-molded. As a result, the finished without further reworking injection molded part with integrated circuit substrate 1, 3 and with integrated connector 9 shown in FIG. 4 is obtained.

As a variant, in the injection mold together with the prepared laminate or insert 1, 2, 3, on the opposite side of the injection mold (ie Zeichnungsbe down at A) nor a coating film (not shown) are inserted, so that depositors 1, 2, 3 and coating film come to rest on opposite sides of the injection mold. By subsequently introducing injection-molding material between insert 1, 2, 3 and coating film (in the sense of film insert molding), an injection-molded part 7 comparable to FIG. 4 can be produced on the subscription-related bottom (ie on the later user or view page "A") additionally has a protective and / or decorative coating film (not shown).

[49] FIG. 4 also shows a protective layer 10 which, for example in the form of protective lacquer, can be applied to the printed conductors 3, alternatively to the entire B-side surface of the circuit substrate 1, 3, in order to see the exposed printed conductors 3 in front of mechanical or media influences such as oxidation. The application of the protective layer 10 can still take place in the flat state of the laminate 1, 2, 3 or the circuit substrate 1, 3. The protective layer is preferably applied in a structured manner (eg printed), the later contacting surfaces being left open in the region of the tongue section 5 or plug connector 9. Alternatively, the protective layer 10, for example, also final, that is applied after forming and injection molding of the laminate 1, 2, 3 as shown in FIG. 4, for example in the form of a protective coating. In FIG. 5, the finished injection molded part 7 with circuit carrier and plug connector according to FIG. 4 is shown again, and the surrounding area 8 of the plug connector 9 is marked by means of a dashed line, the area 8 of the injection molded part 7 shown in FIG complies with FIG. 5. [51] FIG. 6 shows the area 8 marked in FIG. 5 in a schematic perspective view. One recognizes the film circuit carrier 1 with the strip patterns 3 arranged thereon, which are only schematically indicated by strip patterns. For better recognition of the layer sequence of the back injection 6, adhesion promoter film 2 and circuit carrier film 1, the circuit carrier 1, 3 is shown in FIG. 6 in a peripheral edge region (see FIG In addition, the protective layer 10 (cf., Fig. 4, Fig. 5 or Fig. 10) in Fig. 6 is not drawn in view of the recognizability of the interconnects 3 in 2) smaller cut out.

[52] In Fig. 6 also shows the back injection, or in this embodiment, the projection 6 of the circuit substrate sheet 1, including the tongue portion 5, which is through the projection 6 to a full-fledged, robust connector 9, which is particularly suitable for fully automatic component testing and subsequent also automatic component assembly, for example, with a parent electronic assembly is suitable.

[53] FIGS. 7 to 10 essentially correspond to FIGS. 1 to 4 with the difference that the embodiment according to FIGS. 7 to 10 has a circuit carrier foil 1 with a double-sided conductor track 3, 3 '. For example, the double-sided conductor track 3, 3 'of the embodiment according to FIGS. especially for use as capacitive touch sensors can be used. In one possible variant, the front-side conductor tracks 3 'can also be equipped with components which can be arranged on the circuit carrier 1, 3, 3' in advance of the pre-injection with the injection-molding material 6 and thus embedded in the injection-molded material 6 during pre-projection , If an at least partially transparent material is used for the injection-molding material 6 in this variant, an optical signal output can also be effected in this way, in that the front-side assembly comprises, for example, light-emitting diodes. Otherwise, as well as with regard to the sequence of the production steps, The embodiment according to FIGS. 7 to 10 largely corresponds to the embodiment according to FIGS. 1 to 6.

The embodiment of FIG. 11 to 14 again has only one side arranged conductor tracks 3 ', which, however, in contrast to the embodiment of FIG. 1 to 6 on the front side, ie on the later view or user side A of the injection molded part 7 shown in FIG 14 are arranged. In addition, in the embodiment according to FIGS. 11 to 14, the laminate according to FIG. 12 already comprises an (optional) additional decorative layer 11, for example a dyed, decoratively and / or informatively printed, or also, for example, textile covering, wood veneer or other decorative or decorative decoration Surface material formed layer. Since the decor layer 11 present here is intended to cover the subsequent viewing or user side A (drawing-related bottom) of the injection molded part 7 without interruption in the region of the connector 9, the blank of the laminate layers 1, 2 (in the embodiment 1 to 4 in the already laminated state shown in FIG. 2 can be done) in the embodiment of FIGS. 11 to 14 at least before lamination with the decorative layer 11, so that the circuit substrate film 1 and the adhesive film 2 to the formation of the tongue portion. 5 necessary cut 4 can get without the decorative layer 11 is also cut.

In order to be able to detach and reshape the tongue section 5 after the lamination according to FIG. 12 of the layers 1, 2 and 11 or to bend it as shown in FIG. 13, the decorative layer also becomes laminating or gluing the layers 1, 2 and 11 11 recessed in the surface area 12 of the tongue portion 5 of the bond. This is symbolized in FIG. 12 by the solid line in the surface region 12 of the tongue section between the decorative layer 11 and the circuit carrier film 1 overlying it (with conductor 3 '); in other words, in the region of the solid line at 12 according to FIG. 12 there is no application of adhesive or no connection between the decorative layer 11 and the circuit carrier foil 1 conductor 3 '.

This makes it possible that the tongue portion 5 shown in FIG. 13 from the laminate 1, 2, 11 can be dissolved out and deformed or bent, while the decorative layer 11 simultaneously covers the surface portion 12 of the tongue portion 5 without interruption.

[58] After the detachment of the tongue section 5 according to FIG. 13, the embodiment according to FIGS. 11 to 14 takes place (in contrast to the projection in the embodiments 1 to 10), a rear-side injection molding with thermoplastic material 6 ', as shown in Fig. 14. In this way it is also possible that the conductor 3 'in the region of the bent tongue portion 5 again comes to rest on the free, not covered with thermoplastic material 6' side of the connector 9, and accordingly by a connector 9 with the corresponding socket ( not shown) can be contacted.

The embodiment according to FIGS. 11 to 14 additionally has, in addition to the decorative layer 11, an (optional) upstream, in particular protective and / or decorative, coating layer 13, for example a high-gloss hardcoat. The coating layer 13 is applied in the illustrated embodiment only after the back molding with thermoplastic material 6 '. This is done, for example, by in-mold coating in that the injection molded part 7 initially remains in the injection molding tool after the injection molding, after which an additional cavity in the injection molding tool is opened by appropriate tool movement whose size corresponds to the coating layer 13 to be created, and then the additional cavity with the liquid material the coating layer 13, for example, with clear-setting polyurethane, geflu- tet. After curing of the coating layer 13 thus produced in the additional cavity of the injection molding tool, the finished injection molded part 7 can then be removed from the mold.

The coating layer 13 according to FIG. 14 can also be applied directly to the user-side (drawing-related underlying) surface on the A-side of the back-injected circuit carrier foil 1 in a further variant (not shown in the figures) of an injection-molded part according to the invention in that a decorative layer 11 is arranged between circuit carrier film 1 and coating layer 13. For this purpose (for example in the embodiment according to FIGS. 11 to 14), the decorative layer 11 should be omitted from the beginning.

[61] The exemplary embodiment according to FIGS. 15 to 18 essentially corresponds to the exemplary embodiment according to FIGS. 11 to 14, but again initially with the difference that the embodiment according to FIGS. 15 to 18 (as in the exemplary embodiment according to FIGS 10) again has a circuit substrate film 1 with double-sided conductor 3, 3 '. The double-sided conductor track 3, 3 'of the embodiment according to FIGS. 15 to 18 again allows, for example, a loading of the back conductor tracks 3 with components, while the front conductor paths 3' can be used again for sensor purposes, in particular for use as capacitive touch sensors. If in the embodiment of FIG. 15 to 18 a placement of the back side (B-side) conductor tracks 3 is provided, this can be done in particular before the back injection with the injection molding material 6 ', so that the components are embedded in the subsequent injection molding in the injection molding material 6. In this case, the adhesion promoter layer 2 is correspondingly excluded in the later areas of the components when they are created.

[62] In addition, in the embodiment according to FIGS. 15 to 18, in contrast to the embodiment according to FIGS. 11 to 14, the additional coating layer 13 according to FIG. 14 is omitted. Instead, according to FIG. 18, the decorative layer 11 here itself forms the user or visible surface on the side A (drawing-related bottom) of the component. [63] At this point it should be noted again that in the figures, in particular the conductor tracks 3, 3 'have a greatly oversized drawn thickness. On the real component, for example, the decorative layer 11 and the bonding agent film 2 can have a thickness 100 to 1000 greater than the printed conductors 3, 3 '. Due to this, a mechanical, optical or haptic impairment of the surface layer (for example the decorative layer 11 according to FIG. 18) is excluded by the conductor tracks 3 '.

As a result, it can be seen that, thanks to the invention, one-piece, ready-to-install, multifunctional injection-molded parts with integrated plug connectors and with integrated conductor tracks can be produced, for example, for realizing a capacitive sensor which can also be 3D-free formed and / or ready-to-use components. and which may have both a decorative visual surface, for example carbon, textile or wood decor, as well as a hard-wearing, scratch-resistant, protective and / or high-gloss coating layer.

Thanks to the method according to the invention and thanks to the multifunctional injection molded part according to the invention, it is possible to develop extensive new fields of application, for example for integrated multifunctional operator consoles, with decisive advantages in terms of manufacturing and assembly costs, handling, integration and robustness, user-friendliness and design. reference numeral

1 circuit carrier foil

2 adhesive film

3, 3 'conductor track

4 cut, punched

5 tongue section

6, 6 'preloading, posterior

7 injection molded part

8 connector area

9 Integrated connector

10 protective layer, protective lacquer

11 decorative layer

12 area area

13 coating layer

A visible side, visible surface, user side

B backside

Claims

claims

1. A method for producing a multifunctional injection molded part (7) with circuit carrier (1, 3) and integrated connector (9), the circuit carrier (1, 3) comprising a circuit carrier foil (1) with at least one integrally formed with the circuit carrier foil (1) circuit carrier foils Tongue section (5), wherein the circuit carrier foil (1) has at least one electrically conductive conductor track (3) on at least one surrounding region (8) surrounding the tongue section (5) on at least one of its surfaces, with the following method steps

a. Uniforms of the circuit substrate (1, 3) at least in the surrounding area (8) of the tongue portion (5) such that at least portions of the deformed tongue portion (5) with the surrounding surface of the circuit substrate (1, 3) include an acute or right angle;

b. Inserting the circuit carrier (1, 3) including tongue portion (5) in a mold, in particular injection mold;

c. Integral injection-molding of at least the surrounding region (8) of the circuit carrier (1, 3) including the tongue section (5), including the tongue section (5) with a polymeric casting material (6), in particular injection-molding material;

d. Removal of the one-piece unit of solidified cast material (6), circuit carrier (1, 3) and tongue portion (5).

2. A manufacturing method according to claim 1, characterized in that in the process step a) reshaping of further at least partial areas of the circuit substrate (1, 3) takes place.

3. A manufacturing method according to claim 2, characterized in that the forming of at least partial areas of the circuit carrier (1, 3) is a 3D or freeform forming.

4. Manufacturing method according to one of claims 1 to 3, characterized in that before forming in step a) on the surface to be backfilled of the circuit substrate (1, 3) coating at least portions of the circuit substrate film (1) including at least portions of the circuit substrate film (1) in the tongue section (5) with a bonding agent layer (2).

5. A manufacturing method according to claim 4, characterized in that the primer layer is film-shaped as a primer film (2), wherein the coating of the circuit substrate film (1) with the primer layer (2) by lamination of circuit substrate film (1) and adhesive film (2) to a Foil laminate takes place.

6. Manufacturing method according to one of claims 1 to 5, characterized in that the circuit carrier (1, 3) in the run-up to process step a) or b) on one or both surface sides is equipped with electronic and / or electrical components.

7. Manufacturing method according to one of claims 1 to 6, characterized in that the at least one electrically conductive conductor track (3) on the connector facing surface side of the circuit substrate film (1) is arranged, wherein the circuit carrier (1, 3) in step c) on the back side facing away from the connector (A side) is back-injected at least in some areas.

8. Manufacturing method according to one of claims 1 to 6, characterized in that the at least one electrically conductive conductor track (3) on the connector facing away from the surface side of the circuit substrate film (1) is arranged, wherein the circuit carrier (1, 3) in step c) on the plug-facing surface side (B side) is back-injected at least in some areas.

9. A manufacturing method according to claim 7, characterized in that during the injection molding process in step c) at the same time a protective and / or decorative coating film is back-injected with circuit carrier (1, 3) and coating film are arranged on opposite sides of the injection mold and wherein injection molding material (6 ) between circuit carrier (1, 3) and coating film is introduced.

10. A manufacturing method according to any one of claims 1 to 9, characterized in that after the formation of the circuit carrier tongue portion (5) and before forming in step a) with respect to the hinterspritzenden surface side of the circuit substrate (1, 3) laminating the circuit substrate film ( 1), including the surface region (12) of the tongue section (5), with a decorative layer (11), the surface region (12) of the tongue section (5) not being adhesively bonded to the decorative layer (11).

11. Manufacturing method according to one of claims 1 to 10, characterized in that after the back molding in step c) in a further process step, a protective and / or decorative coating layer (13) on the steckverbinderabgewandten surface side (A-side) of the injection molded part (7) is applied by at least in partial areas of the front surface of the injection molded part (7) opens an additional cavity in the injection mold and a polymer casting or injection molding material (13) is introduced into the Zusatzkavität.

12. Production method according to one of claims 1 to 11, characterized in that prior to forming in process step a) a cutting of the circuit substrate film (1) or of the film laminate (1, 3) takes place.

13. Production method according to one of claims 1 to 12, characterized in that non-electrical functional elements are formed by the shaping of the back-molding (6) of the circuit board tongue section (5), in particular mechanical locking or mounting structures.

14. Hinterspritzter circuit substrate (1, 3) with integrated connector (9), comprising a circuit substrate film (1) with at least one conductor track (3) and at least one integrally formed with the circuit substrate film (1) circuit carrier foil tongue portion (5) with conductor track (3 ) for electrical connection of the back-injected circuit carrier (1, 3), wherein the tongue portion (5) with the tongue portion (5) surrounding surface of the circuit carrier (1, 3) includes an acute or right angle, characterized in that at least one of the tongue portion (5) comprehensive surrounding area (8) of the circuit substrate (1, 3) including the tongue portion (5) on the trackside surface facing away from the circuit carrier (1, 3) and tongue portion (5) integrally behind injection molded (6).