WO2016051569A1 - Évaporateur, dispositif de refroidissement et dispositif électronique - Google Patents

Évaporateur, dispositif de refroidissement et dispositif électronique Download PDF

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Publication number
WO2016051569A1
WO2016051569A1 PCT/JP2014/076406 JP2014076406W WO2016051569A1 WO 2016051569 A1 WO2016051569 A1 WO 2016051569A1 JP 2014076406 W JP2014076406 W JP 2014076406W WO 2016051569 A1 WO2016051569 A1 WO 2016051569A1
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WIPO (PCT)
Prior art keywords
liquid
porous body
evaporator
working fluid
mask
Prior art date
Application number
PCT/JP2014/076406
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English (en)
Japanese (ja)
Inventor
内田　浩基
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to PCT/JP2014/076406 priority Critical patent/WO2016051569A1/fr
Priority to TW104126573A priority patent/TWI576556B/zh
Publication of WO2016051569A1 publication Critical patent/WO2016051569A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an evaporator, a cooling device, and an electronic device.
  • a cooling device for cooling a heating element such as an electronic component provided in an electronic device such as a computer
  • high cooling performance is obtained by utilizing latent heat of vaporization when a liquid-phase working fluid evaporates to become a gas-phase working fluid.
  • a cooling device that uses a gas-liquid two-phase flow.
  • an evaporator including a porous body (wick) and a condenser are provided, and an outlet of the evaporator and an inlet of the condenser are connected by a vapor pipe, and the outlet of the condenser and the evaporator
  • LHP loop heat pipe
  • the porous body and the heating surface are provided with irregularities, and the porous body is provided so that the concave portions between the convex portions of the heating surface and the convex portions are embedded,
  • the heat generation amount of the heating element increases and the evaporation amount increases, it becomes difficult to supply the liquid-phase working fluid to the end portion on the heating surface side of the porous body.
  • dryout occurs, the evaporation area decreases, and the cooling performance decreases.
  • a plurality of protrusions are provided on the case serving as the heat transfer part, and a porous body is fitted into each of the plurality of protrusions, and around each protrusion where the porous body is fitted. It is conceivable to create a space in which a liquid-phase working fluid flows. However, if a space in which the liquid-phase working fluid flows is formed around each projection portion in which the porous body is fitted, the area of the wetted surface with which the liquid-phase working fluid of the porous body comes into contact increases. When the area of the liquid contact surface with which the liquid-phase working fluid of the porous body comes into contact increases, heat leak from the porous body to the liquid-phase working fluid increases, and the cooling performance decreases.
  • the evaporator includes a porous body having a plurality of cylindrical convex portions, a vapor chamber and a liquid chamber separated by the porous body, a first portion to which a vapor pipe is connected and defining the vapor chamber, and a liquid pipe Are connected to each other, a second part defining the liquid chamber, and a plurality of protrusions provided in the first part, projecting toward the second part, and fitted into each of the plurality of cylindrical convex parts of the porous body And a plurality of masks covering the respective surfaces of the plurality of cylindrical protrusions so that the area of the liquid contact surface with which the liquid-phase working fluid of the plurality of cylindrical protrusions of the porous body comes into contact is reduced.
  • the cooling device includes an evaporator in which a liquid-phase working fluid evaporates, a condenser in which a gas-phase working fluid condenses, a vapor pipe that connects the evaporator and the condenser and through which the gas-phase working fluid flows, The condenser and the evaporator are connected, and a liquid pipe through which a liquid-phase working fluid flows is provided.
  • the evaporator includes a porous body having a plurality of cylindrical protrusions, a vapor chamber separated by the porous body, and A liquid chamber, a steam pipe is connected, a first part that defines the steam chamber, a liquid pipe is connected, a second part that defines the liquid chamber, and the first part are provided toward the second part.
  • the electronic device includes an electronic component provided on a wiring board and a cooling device that cools the electronic component.
  • the cooling device includes an evaporator that evaporates a liquid-phase working fluid and a vapor-phase working fluid that is condensed.
  • the vessel is composed of a porous body having a plurality of cylindrical protrusions, a vapor chamber and a liquid chamber separated by the porous body, a vapor pipe connected, and a first portion defining the vapor chamber, and the liquid pipe connected.
  • FIG. 4A and 4B are schematic views for explaining the problem of the present invention, and FIG. 4A is a cross-sectional view along the height direction of the protrusion provided in the case. FIG. 4B is a cross-sectional view along the radial direction of the protrusion provided on the case.
  • FIG. 5A and 5B are schematic cross-sectional views for explaining the operation and effect of the mask provided in the evaporator provided in the cooling device according to the present embodiment.
  • 6A and 6B show the results of a cooling experiment in the case where the mask of the first specific example is used in the cooling device of the specific configuration example of the present embodiment
  • FIG. Indicates the result of measuring the evaporator bottom surface temperature
  • FIG. 6B shows the result of measuring the evaporator top surface temperature.
  • FIG. 8A and FIG. 8B show the results of a cooling experiment when the mask of the second specific example is used in the cooling device of the specific configuration example of the present embodiment, and FIG. Indicates the result of measuring the evaporator bottom surface temperature, and FIG. 8B shows the result of measuring the evaporator top surface temperature.
  • FIG. 10A and FIG. 10B show the structure of the modification (mask of the 3rd specific example of a specific structural example) of the mask provided in the evaporator with which the cooling device concerning this embodiment.
  • FIG. 10B show the results of a cooling experiment when the mask of the third specific example is used in the cooling device of the specific configuration example of the present embodiment. Indicates the result of measuring the evaporator bottom surface temperature, and FIG. 10B shows the result of measuring the evaporator top surface temperature. It is a typical perspective view which shows the structure of the modification of the mask provided in the evaporator with which the cooling device concerning this embodiment is provided. It is a typical perspective view which shows the structure of the modification of the mask provided in the evaporator with which the cooling device concerning this embodiment is provided. It is a typical perspective view which shows the structure of the modification of the mask provided in the evaporator with which the cooling device concerning this embodiment is provided.
  • FIG. 16A and FIG. 16B are schematic views showing the configuration of a modification of the mask provided in the evaporator provided in the cooling device according to the present embodiment, and FIG. 16A is a perspective view. FIG. 16B is a cross-sectional view. It is a typical perspective view which shows the structure of the modification of the mask provided in the evaporator with which the cooling device concerning this embodiment is provided.
  • the cooling device is a cooling device that cools a heating element such as an electronic component provided in an electronic device such as a computer (for example, a server or a personal computer).
  • a heating element such as an electronic component provided in an electronic device such as a computer (for example, a server or a personal computer).
  • the electronic device is also referred to as an electronic device.
  • the electronic component is, for example, a CPU or an LSI chip.
  • the electronic apparatus includes a wiring board 52 (for example, a printed wiring board) in which a plurality of electronic components 51 are mounted in a housing 50, and a wiring board 52.
  • the electronic component which is a heat generating body, ie, the heat-emitting component 51X is contained in the some electronic component 51.
  • a CPU (Central Processing Unit) 51X is included as a heat generating component. Since the CPU 51X as the heat generating component cannot be sufficiently cooled only by the air blowing by the blower fan 53, the cooling device 1 (here, a loop heat pipe) is mounted to cool the CPU 51X.
  • the cooling device 1 realizes high cooling performance by using latent heat of evaporation when the liquid-phase (liquid state) working fluid evaporates to become a gas-phase (gas state) working fluid.
  • a cooling device using a liquid two-phase flow That is, the cooling device 1 connects the evaporator 2 in which the liquid-phase working fluid evaporates, the condenser 3 in which the gas-phase working fluid condenses, the evaporator 2 and the condenser 3, and operates in the gas-phase operation.
  • the evaporator 2 is provided with a porous body 6, and the working fluid is circulated by the capillary force of the porous body 6 to transport heat.
  • the evaporator 2 is thermally connected to the CPU 51X as a heat generating component.
  • the evaporator 2 is brought into close contact with the CPU 51X provided on the wiring board 52 via the thermal grease 56 so that the heat from the CPU 51X is transmitted to the evaporator 2.
  • phase working fluid is evaporated (vaporized) by the heat transmitted from the CPU 51X as the heat generating component, and becomes a gas phase working fluid.
  • This gaseous working fluid flows into the condenser 3 through the steam pipe 4 as shown in FIG. Thereby, the heat absorbed by the evaporator 2 is transported to the condenser 3.
  • the gas-phase working fluid flowing into the condenser 3 is condensed (liquefied) by being cooled by the condenser 3 and becomes a liquid-phase working fluid. Thereby, the heat transported to the condenser 3 is radiated.
  • the condenser 3 is provided in the vicinity of the blower fan 53, and the heat radiating fins 57 are provided in the condenser 3. Then, the heat transported to the condenser 3 is radiated through the radiation fins 57 and released to the outside of the housing 50 by the blast from the blower fan 53.
  • heat radiating member such as a heat radiating plate may be provided in place of the heat radiating fins 57.
  • you may make it cool by blowing air directly with respect to a pipe, without providing a heat radiating member.
  • the air cooling type cooling means is used for cooling, but the water cooling type cooling means may be used for cooling. This liquid-phase working fluid flows into the evaporator 2 through the liquid pipe 5.
  • the working fluid recirculates in the circulation path constituted by the evaporator 2, the steam pipe 4, the condenser 3, and the liquid pipe 5.
  • the evaporator 2 is configured as follows.
  • a thin plate evaporator suitable for efficiently cooling a flat plate heating element here, the CPU 51X as a heat generating component
  • the thin plate evaporator is also referred to as a thin plate evaporator or a flat plate evaporator.
  • the evaporator 2 of the present embodiment includes a porous body (wick made of a porous material) 6, a vapor chamber 7 and a liquid chamber 8 separated by the porous body 6, A case 9 and a mask 10 are provided.
  • the porous body 6 is a porous body with low thermal conductivity. Specifically, it is a porous PTFE (polytetrafluoroethylene) resin molded body (resin porous body).
  • the porous body 6 has a plurality of cylindrical convex portions 6A. That is, the porous body 6 includes a flat plate portion 6B and a plurality of cylindrical convex portions 6A provided on the flat plate portion 6B.
  • each of the plurality of cylindrical convex portions 6A is provided so as to protrude toward the liquid chamber 8 side (that is, the upper portion 9B side of the case 9) with respect to the flat plate-like portion 6B.
  • An insertion hole 6C into which a protrusion 9C provided on the lower portion 9A of the case 9 is inserted (that is, on the lower portion 9A side of the case 9 described later).
  • a plurality of grooves 6D extending in the depth direction are provided on the side surface of the insertion hole 6C.
  • the case 9 includes a lower part (first part) 9A that is connected to the steam pipe 4 and defines the steam chamber 7, and an upper part (second part) 9B that is connected to the liquid pipe 5 and defines the liquid chamber 8.
  • the lower portion 9A of the case 9 is provided with a steam pipe connection opening 9D (an outlet of the evaporator 2), and the steam pipe 4 is connected to the steam pipe connection opening 9D.
  • the steam pipe 4 is connected to the steam chamber 7 defined by the lower portion 9A of the case 9 constituting the evaporator 2.
  • the lower portion 9A of the case 9 is composed of a bottom plate 9AX having a recess 9AY, and the steam pipe 4 is connected to a steam pipe connection opening 9D provided in the bottom plate 9AX.
  • a liquid pipe connection opening 9E (an inlet of the evaporator 2) is provided in the upper portion 9B of the case 9, and the liquid pipe 5 is connected to the liquid pipe connection opening 9E.
  • the liquid pipe 5 is connected to the liquid chamber 8 defined by the upper portion 9B of the case 9 constituting the evaporator 2.
  • the upper portion 9B of the case 9 includes a frame body 9BX and a cover 9BY, and the liquid pipe 5 is connected to a liquid pipe connection opening 9E provided in the frame body 9BX.
  • the steam pipe 4 and the liquid pipe 5 are connected to one side of the case 9, but the present invention is not limited to this, for example, the liquid pipe 5 is connected to one side of the case 9,
  • the steam pipe 4 may be connected to the other side.
  • the lower portion 9A of the case 9 is thermally connected to the CPU 51X as a heat generating component.
  • the vapor chamber 7 defined by the lower portion 9A of the case 9 is provided at a position close to the CPU 51X
  • the liquid chamber 8 defined by the upper portion 9B of the case 9 is provided at a position far from the CPU 51X. Yes.
  • the thermal conductivity of the upper portion 9B of the case 9 is made lower than that of the lower portion 9A.
  • the upper portion 9B of the case 9 is made of stainless steel, and the lower portion 9A of the case 9 is made of copper, so that the thermal conductivity of the upper portion 9B of the case 9 is lower than that of the lower portion 9A. Just do it.
  • This makes it difficult for the heat of the CPU 51X as the heat generating component to be transmitted to the liquid-phase working fluid, and makes it difficult for the temperature of the liquid-phase working fluid to rise.
  • the case 9 has a plurality of protrusions 9C provided on the lower portion 9A, projecting toward the upper portion 9B, and fitted into the plurality of cylindrical protrusions 6A of the porous body 6, respectively. That is, the lower portion 9A of the case 9 is provided with a plurality of protrusions 9C that protrude toward the upper portion 9B, and the plurality of protrusions 9C are formed of a plurality of tubes of the porous body 6. It fits in the insertion hole 6C provided in each of the convex portions 6A.
  • a plurality of protrusions 9C are integrally formed on the surface of the recess 9AY of the bottom plate 9AX constituting the lower portion 9A of the case 9.
  • the plurality of protrusions 9C have a plurality of protrusions 9C so that the center axis of the protrusion 9C coincides with the center axis of the cylindrical protrusion 6A of the porous body 6 (that is, the center axis of the insertion hole 6C). It fits in the insertion hole 6C provided in each cylindrical convex part 6A.
  • the porous body 6 is accommodated in the case 9.
  • a plurality of tubes of the porous body 6 are formed so that a space is formed between the back surface (the lower surface in FIG. 1) of the porous body 6 and the surface (the upper surface in FIG. 1) of the lower portion 9A of the case 9.
  • a plurality of protrusions 9C are fitted into each of the convex portions 6A.
  • a plurality of grooves 6D are formed on the side surfaces of the insertion holes 6C provided in each of the plurality of cylindrical protrusions 6A of the porous body 6, and a space formed between these grooves 6D, that is, The space between the bottom surface of the groove 6D formed in the insertion hole 6C and the side surface of the projection 9C also constitutes a part of the steam chamber 7.
  • a space formed between the surface of the porous body 6 (upper surface in FIG. 1) and the surface of the upper portion 9B of the case 9 (lower surface in FIG. 1) becomes the liquid chamber 8.
  • the liquid chamber 8 also serves as a liquid storage tank for storing a liquid-phase working fluid.
  • the liquid-phase working fluid flowing into and stored in the liquid chamber 8 permeates from the periphery of each of the plurality of cylindrical convex portions 6A of the porous body 6 and oozes out to the vapor chamber 7 side by a capillary phenomenon.
  • the CPU 51X as the heat generating component generates heat
  • the heat is transmitted to the lower portion 9A of the case 9 and further to each of the plurality of protrusions 9C.
  • the liquid-phase working fluid that oozes out to the vapor chamber 7 side is evaporated (vaporized) by the heat transmitted to each of the plurality of protrusions 9C, and becomes a gas-phase working fluid.
  • the porous body 6 with a plurality of cylindrical protrusions 6A, the evaporation area is increased and the cooling performance is improved.
  • the protrusion 9C is provided on the lower portion 9A of the case 9, and the cylindrical protrusion 6A is fitted into the protrusion 9C, so that the permeation distance of the liquid-phase working fluid is made uniform. Accordingly, even when the heat generation amount of the heating element increases and the evaporation amount increases, for example, when the CPU 51X which is a heat generating component becomes large and the heat generation amount increases and the evaporation amount increases, the vapor of the porous body 6 increases.
  • the protruding portion 9C is provided on the lower portion 9A of the case 9, and the cylindrical convex portion 6A is fitted into the protruding portion 9C, and around each protruding portion 9C in which the cylindrical convex portion 6A is fitted.
  • the area of the liquid contact surface 6X with which the liquid-phase working fluid 11 of the porous body 6 contacts as shown in FIGS. 4 (A) and 4 (B). Becomes larger.
  • heat leak from the porous body 6 to the liquid-phase working fluid 11 increases, and the cooling performance decreases.
  • an arrow indicated by a symbol X indicates a heat flow
  • an arrow indicated by a symbol Y indicates a flow of a liquid-phase working fluid.
  • the protruding portion 9C is provided on the lower portion 9A of the case 9 that is thermally connected to the CPU 51X as the heat generating component, and the porous body is provided thereon.
  • the evaporating area is expanded by fitting the 6 cylindrical convex portions 6A.
  • the evaporation surface 6Y that comes into contact with the protruding portion 9C of the cylindrical body 6A of the porous body 6 that contacts the high temperature and the low-temperature liquid-phase working fluid 11 of the cylindrical protrusion 6A of the porous body 6 come into contact. Since the liquid contact surface 6X is integrated with the front and back, if the area of the evaporation surface 6Y of the porous body 6 is increased as described above, the area of the liquid contact surface 6X is further increased.
  • heat transfer from the porous body 6 to the liquid-phase working fluid 11 is according to the following equation.
  • Q is the heat leak heat quantity from the porous body 6 to the liquid-phase working fluid 11
  • h is the heat transfer coefficient
  • A is the contact area (wetted area) of the porous body 6 and the liquid-phase working fluid 11
  • TW is the surface temperature of the porous body 6
  • TL is the temperature of the liquid-phase working fluid 11.
  • wetted area A is by expanding the surface temperature T W of the porous body 6 is increased. This is because the flow rate of the liquid-phase working fluid 11 flowing into the liquid contact surface 6X of the porous body 6 decreases as the liquid contact area A of the porous body 6 increases [FIG. 5A]. reference].
  • the flow velocity of the liquid-phase working fluid 11 flowing into the porous body 6 is approximately several tens of ⁇ m / sec to several hundreds of ⁇ m / sec depending on the type of the working fluid and the heat generation amount. It greatly affects the heat conduction inside.
  • the working fluid inside the loop heat pipe 1 is maintained in a saturated state, and the fluid is operated by a vapor pressure difference caused by a temperature difference between the vapor side and the liquid side separated by the porous body 6 in the evaporator 2. For this reason, when the amount of heat leak heat transferred from the vapor side of the evaporator 2 to the liquid side through the porous body 6 is large, the loop heat pipe 1 causes a significant performance deterioration. For this reason, it is desired to eliminate the cause of the performance degradation of the loop heat pipe 1 and to realize the loop heat pipe 1 having high cooling performance and an electronic device including the same.
  • the area of the liquid contact surface 6 ⁇ / b> X with which the liquid-phase working fluid 11 of the plurality of cylindrical protrusions 6 ⁇ / b> A of the porous body 6 contacts is reduced.
  • a plurality of masks 10 that cover the respective surfaces of the plurality of cylindrical protrusions 6A are provided.
  • the mask 10 so that the liquid contact surface 6X of the cylindrical convex portion 6A of the porous body 6 becomes small, the area where the liquid-phase working fluid 11 and the porous body 6 are in direct contact is reduced.
  • the flow velocity of the liquid-phase working fluid 11 flowing into the porous body 6 can be increased.
  • the mask 10 may have an opening 10A through which the liquid-phase working fluid 11 flows in a portion covering the side surface of the cylindrical convex portion 6A.
  • the surface of the cylindrical convex portion 6A of the porous body 6 is covered with the mask 10, and only the portion where the opening 10A of the mask 10 is located on the side surface of the cylindrical convex portion 6A of the porous body 6 is the wetted surface. 6X, and the area of the liquid contact surface 6X of the cylindrical convex portion 6A of the porous body 6 is reduced.
  • the opening 10A may be a plurality of holes 10B.
  • These holes 10B are preferably provided uniformly over the entire surface of the portion of the mask 10 that covers the side surface of the cylindrical projection 6A. Further, as shown in FIG. 7, it is preferable that these holes 10 ⁇ / b> B are larger on the flat plate-like portion 6 ⁇ / b> B side than the tip side of the cylindrical convex portion 6 ⁇ / b> A of the porous body 6. That is, it is preferable that these holes 10B are larger on the lower portion (first portion) 9A side than on the upper portion (second portion) 9B side of the case 9.
  • the vapor chamber 7 side defined by the lower portion 9A is hotter than the liquid chamber 8 side defined by the upper portion 9B of the case 9, and the amount of evaporation is larger.
  • the distribution of the size of the holes 10B reduces the area (liquid contact area) where the porous body 6 and the liquid-phase working fluid 11 are in direct contact, and flows into the porous body 6.
  • the flow rate of the liquid-phase working fluid 11 can be increased uniformly, and heat leak from the porous body 6 to the liquid-phase working fluid 11 can be reduced uniformly.
  • the shape of the hole 10B is circular here, it is not restricted to this, For example, it can be set as various shapes, such as a triangular shape and a square shape.
  • the opening 10A may be a plurality of slits 10C as shown in FIG. These slits 10C are preferably provided uniformly over the entire surface of the portion of the mask 10 covering the side surface of the cylindrical projection 6A.
  • these slits 10C have a wider width on the flat plate portion 6B side than on the tip side of the cylindrical convex portion 6A of the porous body 6. That is, it is preferable that these slits 10 ⁇ / b> C have a wider width on the lower portion (first portion) 9 ⁇ / b> A side than on the upper portion (second portion) 9 ⁇ / b> B side of the case 9. This is because the vapor chamber 7 side defined by the lower portion 9A is hotter than the liquid chamber 8 side defined by the upper portion 9B of the case 9, and the amount of evaporation is larger.
  • the width of the slit 10C by changing the width of the slit 10C, the area (liquid contact area) in which the porous body 6 and the liquid-phase working fluid 11 are in direct contact is reduced, and the operation of the liquid phase flowing into the porous body 6 is performed.
  • the flow rate of the fluid 11 can be increased uniformly, and heat leak from the porous body 6 to the liquid phase working fluid 11 can be reduced uniformly.
  • the slit 10C extends in the height direction of the cylindrical convex portion 6A, but is not limited thereto, and may extend in the circumferential direction of the cylindrical convex portion 6A, for example. Further, when the slit 10C extending in the height direction of the cylindrical convex portion 6A is used, the slit 10C can be manufactured with a mold in consideration of mass production and cost reduction, as shown in FIG. Is preferably extended to the lower end so as to form a slit extending from the lower end.
  • the mask 10 is provided with the opening 10A so that the area of the liquid contact surface 6X on the side surface of the cylindrical convex portion 6A is 50% or less of the area of the side surface of the cylindrical convex portion 6A. It is preferable to do this.
  • the area (opening area) of the opening 10A of the mask 10 is 50% or less of the area of the portion of the mask 10 that covers the side surface of the cylindrical protrusion 6A. That is, the portion covering the side surface of the cylindrical convex portion 6A of the mask 10 includes the opening 10A (the portion where the porous body 6 and the liquid-phase working fluid 11 are in contact) and the portion other than the opening 10A (the porous body 6).
  • the area of the opening 10A is equal to or smaller than the area of the part other than the opening 10A.
  • the ratio of the opening 10A in the portion covering the side surface of the cylindrical convex portion 6A of the mask 10, that is, the opening ratio of the mask 10 is preferably 50% or less.
  • the area of the liquid contact surface 6X on the side surface of the cylindrical convex portion 6A of the porous body 6 is 50% or less as compared with the case where the mask 10 is not provided.
  • the area where the liquid-phase working fluid 11 (working fluid) and the porous body 6 are in direct contact with each other can be reduced to 1 ⁇ 2 or less, and the liquid-phase working fluid 11 flows into the porous body 6.
  • the flow rate to be increased can be doubled or more.
  • the aperture ratio of the mask 10 it is preferable to lower the aperture ratio of the mask 10 as the area of the liquid contact surface 6X of the cylindrical convex portion 6A increases, and in the case of a specific configuration example described below, for example, the aperture ratio of the mask 10 is increased. It is preferably about 35% or less. Further, the sizes of the plurality of holes 10B and the slits 10C as the opening 10A are set so that the upper portion (second portion) 9B side of the case 9 (the tip side of the cylindrical convex portion 6A; the liquid chamber 8 side; the projection 9C).
  • the mask 10 If the lower part (first part) 9A side (the base side of the cylindrical projection 6A; the steam chamber 7 side; the high temperature side of the projection 9C) is larger than the lower part (first part) 9A, the mask 10
  • the opening ratio of the lower portion (first portion) 9A is higher than that of the upper portion (second portion) 9B of the case 9.
  • the average aperture ratio of the mask 10 may be 50% or less.
  • the opening ratio of the mask 10 is 55% on the upper portion (first portion) 9B side of the case 9, and the opening ratio of the mask 10 is 35% near the center.
  • the lower portion (second portion) of the case 9 The aperture ratio of the mask 10 is 15% on the 9A side, and the aperture ratio of the mask 10 may be distributed so that the average aperture ratio of the mask 10 is 50% or less.
  • the mask 10 is a cylindrical mask having an opening 10A and is covered with the cylindrical convex portion 6A of the porous body 6, but is not limited thereto.
  • the mask 10 includes a first portion 101 that partially covers the side surface of the first cylindrical convex portion 61 ⁇ / b> A included in the four adjacent cylindrical convex portions 6 ⁇ / b> A, and four The second portion 102 partially covering the side surface of the second cylindrical convex portion 62A included in the cylindrical convex portion 6A and the side surface of the third cylindrical convex portion 63A included in the four cylindrical convex portions 6A are partially And a fourth portion 104 partially covering the side surface of the fourth cylindrical convex portion 64A included in the four cylindrical convex portions 6A, and four adjacent masks 10-1 ⁇
  • the side surface of one cylindrical convex portion 61A is covered with four portions 101-1 to 101-4 provided one for each of 10-4, and between these four portions 101-1 to 101-4 Alternatively, a s
  • the mask 10 includes a first portion 101 to a fourth portion 104 and a plate-like portion 105 that supports them, and the first portion 101 to the fourth portion 104 are adjacent to four cylindrical convex portions 6A. It is inserted into the area surrounded by (61A to 64A). With this configuration, the mask 10 can be installed even if the gap between the cylindrical convex portions 6A is narrow.
  • the evaporator 2 provided with the mask 10 configured as described above is as shown in FIG.
  • FIGS. 13 and 14 it is assumed that the portions 101 to 104 of the mask 10 are integrated, and a flow path 10E through which the liquid-phase working fluid 11 flows is provided at the center.
  • the present invention is not limited to this, and it is assumed that the portions 101 to 104 of the mask 10 are separated from each other and independent, and the central region surrounded by these portions 101 to 104 is a liquid-phase working fluid. 11 may be used as a flow path.
  • the slit 10D is preferably provided uniformly over the entire surface of the portion of the mask 10 covering the side surface of the cylindrical convex portion 6A.
  • the slit 10D has a wider width on the lower portion (first portion) 9A side than on the upper portion (second portion) 9B side of the case 9.
  • the mask 10 is provided with slits 10D so that the area of the liquid contact surface 6X on the side surface of the cylindrical convex portion 6A is 50% or less of the area of the side surface of the cylindrical convex portion 6A. preferable.
  • the mask 10 may have a groove 10F through which the liquid-phase working fluid 11 flows in a portion covering the side surface of the cylindrical convex portion 6A. good.
  • a plurality of grooves 10F may be provided.
  • these grooves 10F are preferably provided uniformly over the entire surface of the portion covering the side surface of the cylindrical convex portion 6A of the mask 10. .
  • the mask 10 is provided with grooves 10F so that the area of the liquid contact surface 6X on the side surface of the cylindrical convex portion 6A is 50% or less of the area of the side surface of the cylindrical convex portion 6A. preferable.
  • the mask 10 is provided with a projection 10G on its end face, and the mask 10 is inserted into a region surrounded by the four adjacent cylindrical projections 6A so that the projection 10G is positioned downward.
  • a gap is formed between the material 6 and the flat plate-like portion 6B. This is because the plate-like portion 6B side of the porous body 6 becomes hot and the amount of evaporation increases, so that the liquid-phase working fluid 11 is easily supplied thereto.
  • the mask 10 is inserted into a region surrounded by four adjacent cylindrical convex portions 6A.
  • a cylindrical mask having a groove 10 ⁇ / b> F through which the liquid-phase working fluid 11 flows on the outer peripheral surface may be covered with the cylindrical convex portion 6 ⁇ / b> A.
  • the holes 10B, the slits 10C, 10D, and the grooves 10F are provided uniformly over the entire surface of the portion of the mask 10 that covers the side surface of the cylindrical convex portion 6A, so that the inside of the porous body 6 is in a liquid phase The distance traveled by the working fluid 11 can be shortened, and the pressure loss can be reduced.
  • the mask 10 may be a porous body mask 10H having holes (pores) through which the liquid-phase working fluid 11 flows.
  • the porous body mask 10H preferably has a porosity of 50% or less.
  • the porous body mask 10H preferably has a pore diameter (porous diameter; pore diameter) larger than that of the porous body 6 (wick).
  • a pore diameter porous diameter; pore diameter
  • the porous body 6 as a wick is preferably one having a small diameter in order to obtain a capillary force, whereas the porous body mask 10H has low flow resistance and low fluidity.
  • a material having a large hole diameter for improvement.
  • the porous body mask 10H has a porous PTFE resin molded body (resin made of resin) having a larger porous diameter.
  • a porous body may be used.
  • the porous body mask 10H preferably has a hole diameter of 50 ⁇ m or more.
  • the several mask 10 is integrated as shown, for example in FIG. As a result, the number of parts can be reduced and the cost can be kept low.
  • an example in which the mask 10 shown in FIG. 13 is integrated is shown as an example, but the present invention is not limited to this, and the other mask 10 described above may be integrated.
  • the material of the mask 10 is a material having low thermal conductivity.
  • the thermal conductivity is about 0.2 to about 0.3 W / mK. That is, the material of the mask 10 is a material (resin material) having a thermal conductivity of 0.5 W / mK or less.
  • the material of the mask 10 is preferably a material having a lower thermal conductivity than the liquid-phase working fluid 11.
  • the liquid-phase working fluid 11 when the liquid-phase working fluid 11 is water, its thermal conductivity is about 0.6 W / mK. Therefore, the material of the mask 10 is a material having a thermal conductivity lower than 0.6 W / mK. It is preferable to do this.
  • the liquid-phase working fluid 11 when the liquid-phase working fluid 11 is ethanol or acetone, its thermal conductivity is about 0.2 W / mK, so that the material of the mask 10 has a thermal conductivity lower than about 0.2 W / mK. It is preferable to use a material having
  • the cooling device According to the evaporator, the cooling device, and the electronic device according to the present embodiment, heat leak from the porous body 6 to the liquid-phase working fluid 11 can be reduced, and a decrease in cooling performance can be suppressed. There is an advantage that the cooling performance can be obtained. In other words, the cooling performance of the loop heat pipe 1 is greatly improved, the heat generating components provided in the electronic device can be stably cooled, the electronic device can be improved in performance, and the reliability can be improved. is there.
  • the evaporator 2 has an outer size of about 75 mm ⁇ about 75 mm and a height of about 25 mm. Since the lower portion 9A of the case 9 of the evaporator 2 is thermally connected to the heating element 51X, the upper portion 9B of the case 9 is made of stainless steel having a relatively low thermal conductivity. It shall be made. This makes it difficult for heat from the heating element 51X to be transmitted to the liquid-phase working fluid via the lower portion 9A of the case 9.
  • non-porous PTFE polytetrafluoroethylene
  • PTFE polytetrafluoroethylene
  • the porous body 6 is a molded article using a mold.
  • a total of 36 cylindrical convex portions (cylindrical convex portions) 6 ⁇ / b> A are provided on the porous body 6 in a lattice shape with six in the vertical direction and six in the horizontal direction.
  • These cylindrical convex portions 6A have an outer diameter of about 9 mm and an inner diameter of about 7 mm.
  • the central axis of these cylindrical convex portions 6A that is, the central axis of the insertion hole 6C provided on the back surface side of the cylindrical convex portion 6A is respectively a projection 9C provided on the lower portion 9A of the case 9. It matches with the central axis of.
  • each protrusion part 9C provided in the bottom face of 9 A of lower parts of the case 9 is inserted in the insertion hole 6C provided in the back surface side of these cylindrical convex parts 6A, respectively, and the porous body 6 is attached. It is attached to the lower part of the case 9 (see FIGS. 1 and 2).
  • the depth of the insertion hole 6C provided on the back side of the cylindrical convex portion 6A is about 13 mm.
  • the protrusions 9C provided on the bottom surface of the lower portion 9A of the case 9 are inserted into the insertion holes 6C provided on the back surface side of the cylindrical convex portions 6A, respectively, so that the porous body 6 Is attached to the lower portion 9A of the case 9, the bottom surface of the case 9 (that is, the bottom surface of the lower portion 9A of the case 9) and the back surface of the porous body 6 (that is, the flat plate portion 6B of the porous body 6). 2 mm), and a steam chamber 7 is formed (see FIG. 1).
  • the diameter of the insertion hole 6C provided on the back surface side of the cylindrical convex portion 6A is made to be smaller by about 50 ⁇ m to about 200 ⁇ m than the outer diameter size of the protruding portion 9C of the case 9.
  • a groove (groove) 6D having a width of about 1 mm, a depth of about 1 mm, and a pitch of about 2 mm extending in the depth direction (vertical direction) is uniformly provided on the side surface (inner wall) of the insertion hole 6C (see FIGS. 1 and 2).
  • the space formed between the grooves 6D that is, the space between the bottom surface of the groove 6D formed on the side surface of the insertion hole 6C and the side surface of the projection 9C of the case 9 is also one of the steam chambers 7.
  • the side surface of the insertion hole 6 ⁇ / b> C has a fin structure, and the tip of the fin is in close contact with the side surface of the protrusion 9 ⁇ / b> C of the case 9. Then, the liquid-phase working fluid 11 supplied from above the porous body 6 passes through the inside of the cylindrical convex portion 6A of the porous body 6 and is provided on the side surface of the insertion hole 6C.
  • the porous body 6 is accommodated in the case 9, That is, an internal space having a height of about 5 mm is formed between the upper surface of the cylindrical convex portion 6A of the porous body 6 and the lower surface of the upper portion 9B of the case 9, and this internal space and a plurality of porous bodies 6 are formed.
  • a space between the cylindrical convex portions 6A is defined as a liquid chamber 8 also serving as a liquid reservoir tank (see FIG. 1).
  • the vapor chamber 7 of the evaporator 2 thus manufactured (that is, the lower portion 9A of the case 9 defining the vapor chamber 7 of the evaporator 2) and the inlet of the condenser 3 are connected by the vapor pipe 4 (see FIG. 3).
  • the liquid chamber 8 of the evaporator 2 (that is, the upper portion 9B of the case 9 that defines the liquid chamber 8 of the evaporator 2) and the outlet of the condenser 3 are connected by a liquid pipe 5 (see FIG. 3).
  • the steam pipe 4 is a copper pipe having an outer diameter of about 6 mm and an inner diameter of about 5 mm, and its length is about 300 mm.
  • the liquid pipe 5 is a copper pipe having an outer diameter of about 4 mm and an inner diameter of about 3 mm, and its length is about 200 mm.
  • the condenser 3 has a width of about 150 mm, a height of about 50 mm, and a length of about 45 mm.
  • aluminum plate fins (radiating fins 57) are caulked and attached to a condenser tube provided in the condenser 3 (see FIG. 3).
  • a copper groove tube having an outer diameter of about 6.35 mm is used, and the aluminum plate fins 57 have a thickness of about 0.2 mm and a pitch of about 1.5 mm.
  • the working fluid is ethanol
  • the inside of the loop heat pipe 1 is evacuated by a vacuum pump to be in a vacuum state, and then a predetermined amount of saturated ethanol degassed by vacuum is sealed and hermetically sealed.
  • a protrusion 9C pin structure
  • the evaporation area is increased by fitting the cylindrical convex portion 6A of the porous body 6 into this, the area of the liquid contact surface 6X integrated with the evaporation surface 6Y is also increased.
  • the heat exchange area between the porous body 6 and the liquid-phase working fluid 11 is large, and the liquid-phase working fluid 11 flowing into the porous body 6 has a large flow velocity.
  • the heat leak to the working fluid 11 is very large. Due to this influence, the temperature (liquid temperature) of the liquid working fluid 11 above the porous body 6 rises, the temperature of the liquid working fluid 11 supplied to the porous body 6 increases, and the liquid phase The temperature of the gas-phase working fluid in which the working fluid 11 is evaporated and vaporized also increases. For this reason, the temperature of the case 9 provided with the protruding portion 9C is also high, and the CPU 51X as the heat generating component cannot be sufficiently cooled.
  • the opening ratio is about 35% in each cylindrical protrusion 6 ⁇ / b> C of the porous body 6 described above.
  • a mask 10 wick mask; heat insulating mask
  • holes 10B having a diameter of about 1 mm were uniformly provided on the side surface was installed [see FIGS. 1, 2, and 5B].
  • the mask 10 uses a PTFE resin (non-porous body) having a low thermal conductivity (about 0.23 W / mK here) and excellent heat resistance as its material, and its thickness is about 0.8 mm. To do.
  • the area where the porous body 6 and the liquid working fluid 11 are in direct contact is reduced to about 35%, and the operation of the liquid phase flowing into the porous body 6 is performed.
  • the flow rate of the fluid 11 can be increased about three times.
  • FIG. 6A shows the result of performing these cooling experiments and measuring the heater temperature, that is, the evaporator bottom surface temperature (case bottom surface temperature).
  • a solid line A indicates the bottom surface temperature of the evaporator 2 in contact with the heater when the heater is cooled using the loop heat pipe 1 including the evaporator 2 provided with the mask 10 as described above. Is shown.
  • a solid line B indicates the bottom surface temperature of the evaporator in contact with the heater when the heater is cooled using a loop heat pipe including an evaporator without a mask.
  • a solid line A indicates the upper surface temperature of the evaporator 2 when the heater is cooled using the loop heat pipe 1 including the evaporator 2 provided with the mask 10 as described above. Yes.
  • a solid line B indicates the upper surface temperature of the evaporator when the heater is cooled using a loop heat pipe including an evaporator without a mask.
  • the loop type heat pipe 1 including the evaporator 2 provided with the mask 10 as described above when the loop type heat pipe 1 including the evaporator 2 provided with the mask 10 as described above is used, an evaporator having no mask is provided for all the calorific values.
  • the upper surface temperature of the evaporator is lower by about 5 to about 8 ° C., which means that the temperature of the liquid-phase working fluid 11 is reduced.
  • the temperature of the liquid-phase working fluid 11 can be reduced, and the liquid-phase working fluid can be reduced from the porous body 6. It was confirmed that the heat leak to 11 could be reduced. In addition, it was confirmed that the heater temperature can be reduced, a decrease in cooling performance can be suppressed, and a stable cooling performance can be obtained.
  • the average opening ratio of each cylindrical protrusion 6 ⁇ / b> A of the porous body 6 is about 35%.
  • a mask 10 provided with holes 10B having a diameter of about 0.5 mm to about 1.5 mm on the side surface, that is, a mask 10 (wick mask; heat insulating mask) having a distribution in the aperture ratio is installed (see FIG. 7).
  • the mask 10 uses a PTFE resin (non-porous body) having a low thermal conductivity (about 0.23 W / mK here) and excellent heat resistance as its material, and its thickness is about 0.8 mm. To do.
  • the opening ratio of the mask 10 is 55% (opening diameter: about 1.5 mm) near the base of the protrusion 9C of the case 9, and the opening ratio of the mask 10 is 35% (opening diameter: 1.0 mm) near the center. ), And the aperture ratio of the mask 10 is 15% (the aperture diameter is about 0.5 mm) on the tip side of the projection 9C of the case 9, and the average aperture ratio of the mask 10 is about 35%.
  • the aperture ratio of the mask 10 was distributed in the height direction of the portion 9C.
  • the area where the porous body 6 and the liquid-phase working fluid 1 are in direct contact is reduced to about 35% as a whole, and the liquid phase flowing into the porous body 6 is reduced.
  • the flow rate of the working fluid 11 can be increased uniformly about three times. In this way, the flow velocity of the liquid-phase working fluid 11 flowing into the liquid contact surface 6X of the cylindrical convex portion 6A of the porous body 6 can be made substantially uniform in the height direction, and from the surface of the porous body 6 It is possible to uniformly reduce heat leak to the liquid-phase working fluid 11 in the height direction.
  • FIG. 8A shows the results of performing these cooling experiments and measuring the heater temperature, that is, the evaporator bottom surface temperature (case bottom surface temperature).
  • a solid line A indicates the bottom surface temperature of the evaporator in contact with the heater when the heater is cooled using the loop heat pipe 1 including the evaporator 2 provided with the mask 10 as described above.
  • a solid line B indicates the bottom surface temperature of the evaporator in contact with the heater when the heater is cooled using a loop heat pipe including an evaporator without a mask.
  • a solid line A indicates the upper surface temperature of the evaporator when the heater is cooled using the loop heat pipe 1 including the evaporator 2 provided with the mask 10 as described above.
  • a solid line B indicates the upper surface temperature of the evaporator when the heater is cooled using a loop heat pipe including an evaporator without a mask.
  • the temperature of the liquid-phase working fluid 11 can be reduced, and the liquid-phase working fluid can be reduced from the porous body 6. It was confirmed that the heat leak to 11 could be reduced. In addition, it was confirmed that the heater temperature can be reduced, a decrease in cooling performance can be suppressed, and a stable cooling performance can be obtained.
  • each cylindrical protrusion 6 ⁇ / b> A of the porous body 6 has a porosity of about 10 as a mask 10.
  • a 35% porous body mask 10H (wick mask; heat insulating mask) was installed (see FIG. 9).
  • the porous body mask 10H uses PTFE resin (porous body) having a low thermal conductivity (about 0.23 W / mK here) and excellent heat resistance as its material, and its thickness is about 0.00. 8 mm.
  • the porous body mask 10H is about 100 ⁇ m.
  • FIG. 10A shows the result of performing these cooling experiments and measuring the heater temperature, that is, the evaporator bottom surface temperature (case bottom surface temperature).
  • the solid line A indicates the bottom surface temperature of the evaporator 2 in contact with the heater when the heater is cooled using the loop heat pipe 1 including the evaporator 2 provided with the mask 10H as described above. Is shown.
  • a solid line B indicates the bottom surface temperature of the evaporator in contact with the heater when the heater is cooled using a loop heat pipe including an evaporator without a mask.
  • a solid line A indicates the upper surface temperature of the evaporator 2 when the heater is cooled using the loop heat pipe 1 including the evaporator 2 provided with the mask 10H as described above. Yes. Further, in FIG. 10B, a solid line B indicates the upper surface temperature of the evaporator when the heater is cooled using a loop heat pipe including an evaporator without a mask.
  • the temperature of the liquid-phase working fluid 11 can be reduced, and the liquid-phase working fluid from the porous body 6 can be reduced. It was confirmed that the heat leak to 11 could be reduced. In addition, it was confirmed that the heater temperature can be reduced, a decrease in cooling performance can be suppressed, and a stable cooling performance can be obtained.
  • Cooling device (loop heat pipe) DESCRIPTION OF SYMBOLS 2 Evaporator 3 Condenser 4 Steam pipe 5 Liquid pipe 6 Porous body 6A Cylindrical convex part 6B Flat plate part 6C Insertion hole 6D Groove 6X Liquid contact surface 6Y Evaporating surface 61A 1st cylindrical convex part 62A 2nd cylindrical convex part Part 63A Third cylindrical convex part 64A Fourth cylindrical convex part 7 Vapor chamber 8 Liquid chamber 9 Case 9A Lower part 9AX Bottom plate 9AY Recessed part 9B Upper part 9BX Frame body 9BY Cover 9C Protrusion part 9D Steam pipe connection opening 9E Liquid pipe connection opening 10 Mask 10A Opening 10B Hole 10C Slit 10D Slit 10E Flow path 10F Groove 10G Projection 10H Porous mask 101 First part 102 Second part 103 Third part 104 Fourth part 105 Plate-like part 10 -1 to 10-4 Four adjacent masks 101-1 to 101-4 Four parts, one

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un évaporateur (2) qui est pourvu : d'un corps poreux (6) ayant une pluralité de sections en saillie cylindriques (6A) ; d'une chambre à vapeur (7) et une chambre de liquide (8), qui sont séparées l'une de l'autre au moyen du corps poreux ; d'un boîtier (9) qui a une première partie (9A) à laquelle est connecté un tube de vapeur (4), ladite première partie définissant la chambre à vapeur, une seconde partie (9B) à laquelle est connecté un tube de liquide (5), ladite seconde partie définissant la chambre de liquide, et une pluralité de sections en saillie (9C), qui sont disposées sur la première partie, et qui font saillie du côté de la seconde partie, lesdites sections en saillie étant insérées dans les sections en saillie cylindriques du corps poreux ; et d'une pluralité de masques (10) qui recouvrent les surfaces des sections en saillie cylindriques de telle sorte que la zone des surfaces de contact de liquide des sections en saillie cylindriques du corps poreux est petite, lesdites surfaces de contact de liquide étant en contact avec un fluide de travail en phase liquide (11).
PCT/JP2014/076406 2014-10-02 2014-10-02 Évaporateur, dispositif de refroidissement et dispositif électronique WO2016051569A1 (fr)

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TW104126573A TWI576556B (zh) 2014-10-02 2015-08-14 蒸發器、冷卻裝置及電子裝置

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JP2019116990A (ja) * 2017-12-27 2019-07-18 国立大学法人名古屋大学 熱交換器、電子機器、および熱交換器の製造方法

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JP2003185370A (ja) * 2001-12-18 2003-07-03 Mitsubishi Electric Corp 毛細管力駆動型二相流体ループ、その蒸発器及び熱輸送方法
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JP2019116990A (ja) * 2017-12-27 2019-07-18 国立大学法人名古屋大学 熱交換器、電子機器、および熱交換器の製造方法
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