WO2016026267A1 - 载物台和热压设备 - Google Patents

载物台和热压设备 Download PDF

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Publication number
WO2016026267A1
WO2016026267A1 PCT/CN2015/070627 CN2015070627W WO2016026267A1 WO 2016026267 A1 WO2016026267 A1 WO 2016026267A1 CN 2015070627 W CN2015070627 W CN 2015070627W WO 2016026267 A1 WO2016026267 A1 WO 2016026267A1
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WO
WIPO (PCT)
Prior art keywords
base
support
sub
positioning
support sub
Prior art date
Application number
PCT/CN2015/070627
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English (en)
French (fr)
Inventor
陈蕾
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/320,027 priority Critical patent/US10286595B2/en
Publication of WO2016026267A1 publication Critical patent/WO2016026267A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/26—Component parts, details or accessories; Auxiliary operations
    • B29C51/261—Handling means, e.g. transfer means, feeding means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/002—Magnetic work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/062—Press plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/065—Press rams
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/062—Press plates
    • B30B15/064—Press plates with heating or cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Definitions

  • Embodiments of the invention relate to a stage and a hot press apparatus.
  • PCB printed circuit board
  • ACF Anisotropic Conductive Film
  • the processed PCB is usually provided with electronic components on both sides, in order to ensure that the PCB can be smoothly placed on the stage, it is necessary to open a groove on the stage corresponding to the electronic component.
  • the electronic components When the PCB is placed on the stage, the electronic components will be placed in the recesses, allowing the PCB to be placed smoothly on the stage.
  • the number and location of electronic components on different PCBs are not exactly the same, in order to meet the needs of different types of PCBs, it is necessary to process a matching stage for each type of PCB. In the manufacturing process, each time a PCB is replaced, the corresponding stage needs to be replaced, and the stage matched with the PCB is mounted on the hot pressing equipment.
  • At least one embodiment of the present invention provides a stage and a heat press apparatus capable of reducing manufacturing cost, saving production time, and improving production efficiency.
  • At least one embodiment of the present invention provides a stage comprising a base and a support device secured to the base, the support device including a plurality of detachable support sub-devices; the support device configured to be placed to have at least A printed circuit board having a raised structure, and the supporting sub-device is not disposed at a position corresponding to the convex structure on the supporting device.
  • the base is provided with a positioning hole
  • the supporting sub-device is provided with a positioning structure that cooperates with the positioning hole, and the positioning structure is engaged into the positioning hole to make the supporting member
  • the device is fixed on the base; or the positioning device is provided with a positioning hole, and the base is provided with a positioning structure that cooperates with the positioning hole, and the positioning structure is engaged into the positioning hole
  • the support sub-device is fixed to the base.
  • the positioning structure is snapped into the positioning hole.
  • an outer surface of the base is provided with an electromagnetic coil; the electromagnetic coil is configured to reverse the magnetic properties of the base and the magnetic force of the support sub-device when energized, such that the base and The support sub-devices are attracted to each other; and the electromagnetic coil is configured to prevent the base and the support sub-device from being magnetic when the power is off, so that the base and the support sub-device are not attracted to each other .
  • a bezel is also provided on the edge of the base, the bezel being configured to block the support sub-device to prevent the support sub-device from falling off the base.
  • the height of the bezel is less than or equal to the height of the support sub-device.
  • a first vacuum hole is disposed in the base, a second vacuum hole is disposed in the support sub-device, and the first vacuum hole and the second vacuum hole are oppositely disposed; the first The vacuum hole and the second vacuum hole form a vacuum gas path configured to adsorb the printed wiring board while in a vacuum state.
  • the first vacuum aperture and the second vacuum aperture are evenly distributed.
  • the projection of the second vacuum aperture on the base completely coincides with the first vacuum aperture.
  • the projected area of the support device on the base is less than or equal to the area of the support surface of the base.
  • At least one embodiment of the present invention also provides a hot pressing apparatus comprising the above described stage.
  • FIG. 1 is a schematic structural view of a stage according to Embodiment 1 of the present invention.
  • FIG. 2 is a schematic view showing the printed circuit board placed on the supporting device in the first embodiment
  • Figure 3a is a cross-sectional view taken along line A-A of the stage of Figure 1;
  • Figure 3b is a schematic structural view of the supporting sub-assembly of Figure 3a;
  • Figure 3c is a schematic structural view of the base of Figure 1;
  • Figure 4 is a schematic view showing the assembly of the stage of Figure 1;
  • FIG. 5 is a schematic structural diagram of a stage according to Embodiment 2 of the present invention.
  • FIG. 6 is a schematic structural diagram of a stage according to Embodiment 3 of the present invention.
  • FIG. 1 is a schematic structural diagram of a stage according to a first embodiment of the present invention.
  • the stage includes a base 1 and a supporting device 2 fixed to the base 1 .
  • the support device 2 comprises a plurality of detachable support sub-devices 21.
  • the supporting device 2 is configured to place a printed wiring board (not shown in FIG. 1) having at least one convex structure, and the supporting sub-device 21 is not provided at a position on the supporting device 2 corresponding to the convex structure.
  • the raised structure can be an electronic component on a printed circuit board.
  • the support device 2 is disposed on the support surface of the base 1, and the projected area of the support device 2 on the base 1 is equal to the area of the support surface of the base 1. At this time, the support device 2 is The projection on the base 1 completely coincides with the support surface of the base 1. In other embodiments, optionally, the projected area of the support device on the base may also be smaller than the area of the support surface of the base, which is not specifically shown.
  • the shape of the support sub-device 21 may be a block shape.
  • the printed circuit board 3 is a schematic view showing the printed circuit board placed on the supporting device in the first embodiment.
  • the printed circuit board 3 has convex structures 4 on both sides, and the number of the protruding structures 4 may be one or more.
  • the position of the structure 4 can be set according to the design requirements of the printed wiring board 3.
  • the number and position of the raised structures 4 on different types of printed wiring boards 3 may vary. Only the convex structure 4 provided on one side of the supporting device 2 is shown in Fig. 2, and only one convex structure 4 is taken as an example for description.
  • the supporting sub-device 21 When it is required to place the printed wiring board 3 on the supporting device 2, it is first necessary to remove the supporting sub-device 21 corresponding to the protruding structure 4 from the base 1 (or if the supporting sub-device 21 is not yet installed) The support structure 4 is not mounted at the corresponding position of the raised structure 4 to achieve a position corresponding to the raised structure 4 without providing the support sub-assembly 21; then the printed wiring board 3 is placed on the support device 2.
  • the convex structure 4 is located in the blank space 22 of the supporting device 2 where the supporting sub-device 21 is not disposed, and the portion of the printed wiring board 3 where the convex structure 4 is not disposed can be directly attached to the supporting sub-device 21, thereby The printed wiring board 3 can be placed on the stage smoothly.
  • FIG. 3a is a cross-sectional view taken along line A-A of the stage of FIG. 1
  • FIG. 3b is a schematic structural view of the support sub-assembly of FIG. 3a
  • FIG. 3c is a schematic structural view of the base of FIG.
  • the supporting sub-device 21 is provided with a positioning hole 211
  • the base 1 is provided with a positioning structure 11 matched with the positioning hole 211, for example, the positioning structure 11 is joined to (for example, stuck to) the positioning hole.
  • the support member 21 is fixed to the base 1 in 211.
  • the supporting sub-device 21 can be directly pulled up from the base 1, so that the supporting sub-assembly 21 is fixed by the positioning structure 11 and the positioning hole 211.
  • the solution to the base 1 is simple and easy to implement.
  • the positioning structure 11 can be integrally formed with the base 1.
  • one or more positioning holes 211 may be provided on each of the support sub-devices 21. This embodiment is described by taking a positioning hole 211 on each of the supporting sub-devices 21 as an example.
  • the positioning structure 11 can be a positioning post.
  • the pedestal 1 may be provided with a positioning hole 211
  • the supporting sub-device 21 is provided with a positioning structure 11 matched with the positioning hole 211, and the positioning structure 11 is engaged into the positioning hole 211 for supporting
  • the sub-device 21 is fixed to the base 1, which is in principle the same as the one shown in Fig. 3a and therefore will not be specifically shown.
  • FIG. 4 is a schematic view showing the assembly of the stage of the first embodiment of FIG. 1.
  • the base 1 is provided with a first vacuum hole 12, and the support sub-device 21 is provided with a second vacuum hole 212.
  • the first vacuum hole 12 and the second vacuum hole 212 are oppositely disposed.
  • First vacuum hole 12 and second vacuum hole 212 A vacuum gas path is formed for adsorbing the printed wiring board while in a vacuum state, thereby fixing the printed wiring board to the supporting device 2.
  • the first vacuum aperture 12 and the second vacuum aperture 212 are evenly distributed. To ensure unobstructed vacuum air passage, in one example, the projection of the second vacuum aperture 212 on the base completely coincides with the first vacuum aperture 21.
  • the stage provided by the first embodiment of the present invention includes a base and a supporting device for placing a printed circuit board.
  • the supporting device includes a plurality of detachable supporting sub-devices, and the position corresponding to the convex structure of the printed circuit board is not set on the supporting device.
  • Support sub-device In this embodiment, the supporting sub-device corresponding to the protruding structure can be removed from the supporting device according to the type of the printed wiring board, so that one stage can be used for placing different types of printed wiring boards, so that the stage can be repeatedly used.
  • the stage can only achieve the purpose of placing different types of printed circuit boards by resetting the supporting sub-devices, thereby avoiding replacing the loading stage every time a printed circuit board is replaced, saving The time to replace the stage saves production time and increases production efficiency.
  • FIG. 5 is a schematic structural diagram of a stage according to Embodiment 2 of the present invention.
  • the difference between the stage provided in this embodiment and the first embodiment is that the outer surface of the base 1 is provided with Electromagnetic coil 5.
  • the electromagnetic coil 5 is configured to reverse the magnetic properties of the susceptor 1 and the magnetic force of the support sub-device 21 when energized, so that the susceptor 1 and the support sub-device 21 are attracted to each other; and the electromagnetic coil 5 is configured to make the pedestal when the power is turned off. Both the support member 21 and the support sub-device 21 are not magnetized so that the susceptor 1 and the support sub-device 21 do not attract each other.
  • the electromagnetic coil 5 is energized such that the magnetic properties of the susceptor 1 and the magnetic properties of the support sub-device 21 are reversed. At this time, the susceptor 1 and the support sub-device 21 are attracted to each other, so that the support sub-device 21 is fixed to the susceptor 1.
  • the electromagnetic coil 5 is de-energized so that neither the susceptor 1 nor the support sub-device 21 is magnetic. At this time, the base 1 and the support sub-device 21 are no longer attracted to each other, so that the support sub-assembly 21 can be detached from the base 1.
  • the materials of the susceptor 1 and the support sub-device 21 may each be a soft magnetic material.
  • the support sub-device is fixed on the base and the support sub-device is detached from the base by the electromagnetic coil, and the solution is simple and easy to implement.
  • FIG. 6 is a schematic structural diagram of a stage according to Embodiment 3 of the present invention, as shown in FIG.
  • the present embodiment also provides a frame 6 on the edge of the base 1, which is used to block the supporting sub-device 21 at the edge to prevent the supporting sub-device 21 from falling off the base 1.
  • the height of the bezel 6 is smaller than the height of the support sub-assembly 21.
  • the height of the support sub-assembly 21 can also be equal to the height of the support sub-assembly 21.
  • the baffle provided in the third embodiment can also be applied to the stage provided in the second embodiment, which is not specifically shown.
  • the bezel provided in the stage provided by the third embodiment of the present invention can effectively prevent the support sub-device 21 from falling off the base when the support sub-assembly 21 is taken up from the base.
  • the embodiment of the invention further provides a hot pressing device, which comprises the stage provided in the first embodiment, the second embodiment or the third embodiment.
  • a hot pressing device which comprises the stage provided in the first embodiment, the second embodiment or the third embodiment.
  • the stage includes a base and a supporting device for placing the printed circuit board, and the supporting device includes a plurality of detachable supporting sub-devices corresponding to the protruding structure of the printed circuit board.
  • the support sub-device is not disposed at the position; thus, the hot press apparatus provided in the embodiment can make a stage available by removing the support sub-device corresponding to the convex structure from the support device according to the type of the printed wiring board.
  • the placement of different types of printed circuit boards enables the stages to be used repeatedly, thereby saving manufacturing costs; the stage in the hot pressing apparatus provided in this embodiment can be placed in different types only by resetting the supporting sub-devices.
  • the purpose of the printed circuit board is to avoid replacing the stage every time a printed circuit board is replaced, which saves the time for replacing the stage, thereby saving production time and improving the generation efficiency.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

一种载物台和热压设备。该载物台包括基座（1）和固定于基座（1）上的支撑装置（2），支撑装置（2）包括多个可拆卸的支撑子装置（21），支撑装置（2）配置以放置具有至少一个凸起结构（4）的印刷线路板（3），并且支撑装置（2）上与凸起结构（4）对应得位置未设置支撑子装置（21）。该热压设备包括该载物台。该载物台降低了制造成本、节约了生产时间并且提高了生产效率。

Description

载物台和热压设备 技术领域
本发明的实施例涉及载物台和热压设备。
背景技术
在PCB(Printed Circuit Board，印刷线路板)的制造过程中，需要在加工完成的PCB上热压ACF(Anisotropic Conductive Film，各向异性导电胶膜)。在热压ACF时，需要将PCB平稳地放置于载物台上，否则就会影响热压效果。
由于加工完成的PCB通常两面均设置有电子元器件，因此为了确保能够将PCB平稳地放置于载物台上，需要在载物台上与电子元器件相对应的位置上开设凹槽。当将PCB放置于载物台上时，电子元器件将位于凹槽内，从而使得PCB能够平稳地放置于载物台上。由于不同的PCB上电子元器件的数量和位置不完全相同，因此为满足不同种类的PCB的需要，需要为每种PCB加工出配套的载物台。在制造过程中，每更换一种PCB就需要更换相应的载物台，将与该种PCB配套的载物台安装到热压设备上。
综上所述，上述技术方案存在如下技术问题：
1)由于每种类型的PCB对应于一种载物台，因此当热压ACF完成后，使用过的载物台无法回收利用，只能丢弃，从而造成了制造成本的增加；
2)在制造过程中，每更换一种PCB就需要更换相应的载物台，但是更换载物台需要的时间较长，浪费了生产时间，从而降低了生产效率。
发明内容
本发明的至少一个实施例提供一种载物台和一种热压设备，其能够降低制造成本、节约生产时间并且提高生产效率。
本发明的至少一个实施例提供的载物台包括基座和固定于所述基座上的支撑装置，所述支撑装置包括多个可拆卸的支撑子装置；所述支撑装置配置以放置具有至少一个凸起结构的印刷线路板，并且所述支撑装置上与所述凸起结构对应的位置未设置所述支撑子装置。
在一个示例中，所述基座上设置有定位孔，所述支撑子装置上设置有与所述定位孔配合的定位结构，所述定位结构接合到所述定位孔内以使所述支撑子装置固定于所述基座上；或者，所述支撑子装置上设置有定位孔，所述基座上设置有与所述定位孔配合的定位结构，所述定位结构接合到所述定位孔内以使所述支撑子装置固定于所述基座上。
在一个示例中，所述定位结构卡设于所述定位孔内。
在一个示例中，所述基座的外侧表面设置有电磁线圈；所述电磁线圈配置以在通电时使所述基座的磁性和所述支撑子装置的磁性相反，以使所述基座和所述支撑子装置相互吸引；并且所述电磁线圈配置以在断电时使所述基座和所述支撑子装置均不具备磁性，以使所述基座和所述支撑子装置不相互吸引。
在一个示例中，所述基座的边缘上还设置有边框，所述边框配置以阻挡支撑子装置以防止所述支撑子装置从所述基座上掉落。
在一个示例中，所述边框的高度小于或者等于所述支撑子装置的高度。
在一个示例中，所述基座中设置有第一真空孔，所述支撑子装置中设置有第二真空孔，所述第一真空孔和所述第二真空孔相对设置；所述第一真空孔和所述第二真空孔形成真空气路，所述真空气路配置以在处于真空状态时吸附所述印刷线路板。
在一个示例中，所述第一真空孔和所述第二真空孔均匀分布。
在一个示例中，所述第二真空孔在所述基座上的投影与所述第一真空孔完全重合。
在一个示例中，所述支撑装置在所述基座上的投影的面积小于或者等于所述基座的支撑面的面积。
本发明的至少一个实施例还提供了一种热压设备，包括上述载物台。
附图说明
以下将结合附图对本发明的实施例进行更详细的说明，以使本领域普通技术人员更加清楚地理解本发明，其中：
图1为本发明实施例一提供的一种载物台的结构示意图；
图2为实施例一中印刷线路板放置于支撑装置上的示意图；
图3a为图1中载物台的A-A向剖视图；
图3b为图3a中支撑子装置的结构示意图；
图3c为图1中基座的结构示意图；
图4为图1中的载物台的组装示意图；
图5为本发明实施例二提供的一种载物台的结构示意图；
图6为本发明实施例三提供的一种载物台的结构示意图。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另作定义，此处使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开专利申请说明书以及权利要求书中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”或者“一”等类似词语也不表示数量限制，而是表示存在至少一个。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也相应地改变。
图1为本发明实施例一提供的一种载物台的结构示意图，如图1所示，该载物台包括：基座1和固定于基座1上的支撑装置2。支撑装置2包括多个可拆卸的支撑子装置21。支撑装置2配置以放置具有至少一个凸起结构的印刷线路板(图1未示出)，并且支撑装置2上与该凸起结构对应的位置不设置支撑子装置21。
例如，该凸起结构可以为印刷线路板上的电子元器件。
本实施例中，支撑装置2设置于所述基座1的支撑面上，则支撑装置2在基座1上的投影的面积等于基座1的支撑面的面积，此时，支撑装置2在基座1上的投影与基座1的支撑面完全重合。在其他实施例中，可选地，支撑装置在基座上的投影的面积还可以小于基座的支撑面的面积，此种情况不再具体示出。
本实施例中，支撑子装置21的形状可以为块状。
图2为实施例一中印刷线路板放置于支撑装置上的示意图，如图2所示，印刷线路板3的两面具有凸起结构4，凸起结构4的数量可以为一个或者多个，凸起结构4的位置可根据印刷线路板3的设计需要进行设置。不同种类的印刷线路板3上凸起结构4的数量和位置均可以不同。图2中仅示出了靠近支撑装置2的一面上设置的凸起结构4，并且仅以一个凸起结构4为例进行描述。当需要将印刷线路板3放置于支撑装置2上时，首先需要将与凸起结构4对应位置的支撑子装置21从基座1上拆卸掉(或者若尚未安装支撑子装置21时可在与凸起结构4对应位置不安装支撑子装置21)以实现与凸起结构4对应的位置不设置支撑子装置21；然后再将印刷线路板3放置于支撑装置2上。此时，凸起结构4位于支撑装置2中未设置支撑子装置21的空白空间22内，而印刷线路板3上未设置凸起结构4的部分可直接与支撑子装置21贴合，从而使得印刷线路板3可平稳地放置于载物台上。
图3a为图1中载物台的A-A向剖视图，图3b为图3a中支撑子装置的结构示意图，图3c为图1中基座的结构示意图。
如图3a至图3c所示，支撑子装置21上设置有定位孔211，基座1上设置有与定位孔211配合的定位结构11，例如定位结构11接合到(例如卡设于)定位孔211内以使支撑子装置21固定于基座1上。当需要将某一个支撑子装置21从基座1上卸下时，可直接将支撑子装置21从基座1上拔起即可，因此采用定位结构11和定位孔211将支撑子装置21固定于基座1的方案简单且易于实现。在一个示例中，定位结构11可以与基座1一体成型。在不同示例中，每个支撑子装置21上可设置有一个或者多个定位孔211。本实施例以每个支撑子装置21上设置一个定位孔211为例进行描述。本实施例中，定位结构11可以为定位柱。
在本实施例的一个变型中，基座1上可设置有定位孔211，而支撑子装置21上设置有与定位孔211配合的定位结构11，定位结构11接合到定位孔211内以使支撑子装置21固定于基座1上，此种情况原理上与图3a中所示的方案相同，因此不再具体示出。
图4为图1中实施例一的载物台的组装示意图，如图1和图4所示，基座1中设置有第一真空孔12，支撑子装置21中设置有第二真空孔212，第一真空孔12和第二真空孔212相对设置。第一真空孔12和第二真空孔212 形成真空气路，该真空气路用于在处于真空状态时吸附印刷线路板，从而使印刷线路板固定于支撑装置2上。在一个示例中，第一真空孔12和第二真空孔212均匀分布。为保证真空气路畅通，在一个示例中，第二真空孔212在基座上的投影与第一真空孔21完全重合。
本发明实施例一提供的载物台包括基座和放置印刷线路板的支撑装置，支撑装置包括多个可拆卸的支撑子装置，支撑装置上与印刷线路板的凸起结构对应的位置未设置支撑子装置。本实施例可根据印刷线路板的类型从支撑装置上拆卸掉与凸起结构对应的支撑子装置以使一种载物台可用于放置不同类型的印刷线路板，使得载物台可反复使用，从而节约了制造成本；本实施例中载物台仅通过重新设置支撑子装置即可达到放置不同类型的印刷线路板的目的，避免了每更换一种印刷线路板就更换一次载物台，节省了更换载物台的时间，从而节约了生产时间，提高了生成效率。
图5为本发明实施例二提供的一种载物台的结构示意图，如图5所示，本实施例提供的载物台与上述实施例一的区别在于：基座1的外侧表面设置有电磁线圈5。电磁线圈5配置以在通电时使基座1的磁性和支撑子装置21的磁性相反，以使基座1和支撑子装置21相互吸引；而且，电磁线圈5配置以在断电时使基座1和支撑子装置21均不具备磁性，以使基座1和支撑子装置21不相互吸引。
例如，当需要将支撑子装置21固定于基座1上，对电磁线圈5通电，使得基座1的磁性和支撑子装置21的磁性相反。此时基座1和支撑子装置21相互吸引，从而使得支撑子装置21固定于基座1上。
例如，当需要将支撑子装置21从基座1上拆卸掉时，对电磁线圈5断电，使基座1和支撑子装置21均不具备磁性。此时基座1和支撑子装置21之间不再相互吸引，从而可将支撑子装置21从基座1上拆卸掉。
本实施例中，为保证电磁线圈5断电后、基座1和支撑子装置21立即消磁，在一个示例中，基座1和支撑子装置21的材料均可以为软磁材料。
对本发明实施例二提供的载物台的其它结构的描述可参见上述实施例一，此处不再重复描述。
本发明实施例二通过电磁线圈实现将支撑子装置固定于基座上以及从基座上拆卸支撑子装置，方案简单且易于实现。
图6为本发明实施例三提供的一种载物台的结构示意图，如图6所示， 在上述实施例一的基础上，本实施例还在基座1的边缘上设置边框6，边框6用于阻挡位于边缘的支撑子装置21以防止支撑子装置21从基座1上掉落。
本实施例中，边框6的高度小于支撑子装置21的高度。在本实施例的一个变型中，支撑子装置21的高度还可以等于支撑子装置21的高度。
对本发明实施例三提供的载物台的其它结构的描述可参见上述实施例一，此处不再重复描述。
在一个示例中，本实施例三提供的挡板还可以应用于实施例二提供的载物台中，此种情况不再具体示出。
本发明实施例三所提供的载物台中设置的边框可以有效防止从基座上取放支撑子装置21时支撑子装置21从基座上掉落。
本公开所描述的各个实施例的载物台并非彼此互斥，其特征也可以相互组合以得到新的实施例。
本发明实施例还提供了一种热压设备，该热压设备包括上述实施例一、实施例二或者实施例三所提供的载物台。具体描述可参见上述实施例一、实施例二或者实施例三中的相应描述，此处不再赘述。
本实施例提供的热压设备中，载物台包括基座和放置印刷线路板的支撑装置，支撑装置包括多个可拆卸的支撑子装置，支撑装置上与印刷线路板的凸起结构对应的位置未设置支撑子装置；由此，本实施例所提供的热压设备可通过根据印刷线路板的类型从支撑装置上拆卸掉与凸起结构对应的支撑子装置以使一种载物台可用于放置不同类型的印刷线路板而使得载物台可反复使用，从而节约了制造成本；本实施例提供的热压设备中的载物台仅通过重新设置支撑子装置即可达到放置不同类型的印刷线路板的目的，避免了每更换一种印刷线路板就更换一次载物台，节省了更换载物台的时间，从而节约了生产时间，提高了生成效率。
本申请要求于2014年8月20日提交的名称为“载物台和热压设备”的中国专利申请No.201420471893.3的优先权，该申请全文以引用方式合并于本文。

Claims (11)

  1. 一种载物台，包括：基座和固定于所述基座上的支撑装置，
    其中，所述支撑装置包括多个可拆卸的支撑子装置；
    所述支撑装置配置以放置具有至少一个凸起结构的印刷线路板，并且所述支撑装置上与所述凸起结构对应的位置未设置所述支撑子装置。
  2. 根据权利要求1所述的载物台，其中，所述基座上设置有定位孔，所述支撑子装置上设置有与所述定位孔配合的定位结构，所述定位结构接合到所述定位孔内以使所述支撑子装置固定于所述基座上；或者
    所述支撑子装置上设置有定位孔，所述基座上设置有与所述定位孔配合的定位结构，所述定位结构接合到所述定位孔内以使所述支撑子装置固定于所述基座上。
  3. 根据权利要求2所述的载物台，其中，所述定位结构卡设于所述定位孔内。
  4. 根据权利要求1至3中任一项所述的载物台，其中，所述基座外侧表面设置有电磁线圈；
    所述电磁线圈配置以在通电时使所述基座的磁性和所述支撑子装置的磁性相反，以使所述基座和所述支撑子装置相互吸引；并且
    所述电磁线圈配置以在断电时使所述基座和所述支撑子装置均不具备磁性，以使所述基座和所述支撑子装置不相互吸引。
  5. 根据权利要求1至4中任一项所述的载物台，其中，所述基座的边缘上还设置有边框，所述边框配置以阻挡支撑子装置以防止所述支撑子装置从所述基座上掉落。
  6. 根据权利要求5所述的载物台，其中，所述边框的高度小于或者等于所述支撑子装置的高度。
  7. 根据权利要求1至6中任一项所述的载物台，其中，所述基座中设置有第一真空孔，所述支撑子装置中设置有第二真空孔，所述第一真空孔和所述第二真空孔相对设置；并且
    所述第一真空孔和所述第二真空孔形成真空气路，所述真空气路配置以在处于真空状态时吸附所述印刷线路板。
  8. 根据权利要求7所述的载物台，其中，所述第一真空孔和所述第二 真空孔均匀分布。
  9. 根据权利要求7所述的载物台，其中，所述第二真空孔在所述基座上的投影与所述第一真空孔完全重合。
  10. 根据权利要求1至9中任一项所述的载物台，其中，所述支撑装置在所述基座上的投影的面积小于或者等于所述基座的支撑面的面积。
  11. 一种热压设备，包括：权利要求1至10中任一项所述的载物台。
PCT/CN2015/070627 2014-08-20 2015-01-13 载物台和热压设备 WO2016026267A1 (zh)

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