WO2016009893A1

WO2016009893A1 - Photosensitive composition, cured-film production method, cured film, liquid crystal display, organic el display, touch panel, and touch panel display

Info

Publication number: WO2016009893A1
Application number: PCT/JP2015/069507
Authority: WO
Inventors: 米澤　裕之; 享平崎田
Original assignee: 富士フイルム株式会社
Priority date: 2014-07-18
Filing date: 2015-07-07
Publication date: 2016-01-21
Also published as: JPWO2016009893A1; TW201604650A; JP6309624B2

Abstract

The purpose of the present invention is to provide: a photosensitive composition which exhibits excellent photolithographic patterning properties, and which, even if heated at low temperatures, is capable of obtaining a cured film exhibiting excellent adhesive properties and hardness; a cured film obtained by curing said photosensitive composition; a production method for said cured film; and a liquid crystal display, an organic EL display, a touch panel, and a touch panel display which are provided with said cured film. This photosensitive composition is characterized by including: component (A), namely a polymerizable monomer which has at least 3 (meth)acryloyl groups and at least one carboxyl group in a molecule thereof; component (B), namely a polymerizable monomer which has at least 3 (meth)acryloyl groups and no carboxyl groups in a molecule thereof; component (C), namely a photopolymerization initiator; component (D), namely a solvent; and component (E), namely a polymerization inhibitor. The photosensitive composition is further characterized in that the total content of component (A) and component (B), and the content of component (A) have values included in certain fixed ranges.

Description

Photosensitive composition, method for producing cured film, cured film, liquid crystal display device, organic EL display device, touch panel and touch panel display device

The present invention relates to a photosensitive composition, a method for producing a cured film, a cured film, and a liquid crystal display device, an organic EL display device, a touch panel and a touch panel display device using the cured film.

Flat panel displays such as liquid crystal display devices and organic EL display devices are widely used. Recently, in the manufacturing process of these displays, it is necessary to lower the heating temperature of various cured films in the manufacturing process from the viewpoint of reducing damage to substrates and circuits and saving energy.
As such a photosensitive composition, for example, Patent Document 1 discloses (A) an alkali-soluble resin, (B) a compound having one or more ethylenically unsaturated groups selected from Formula a and Formula b, (C ) A radiation-sensitive resin composition for forming a protective film for a touch panel, which contains a radiation-sensitive polymerization initiator, and a method for forming the same.

(Where X is selected from a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an acryloyl group or a methacryloyl group, and at least one is an acryloyl group or a methacryloyl group. W is an alkyl group having 1 to 6 carbon atoms. An alkylene group, an alkylene group having 2 to 6 carbon atoms containing one unsaturated bond, a phenylene group, or a cyclohexyl group is shown.)

Patent Document 2 discloses a polymer (A) having an organopolysiloxane unit bonded to the main chain through a nitrogen atom, at least one of a quaternary ammonium base, an acryloyl group or a methacryloyl group, and an acryloyl group in the molecule. An active energy ray-curable coating composition containing polyfunctional (meth) acrylate (B) having a total of 3 or more methacryloyl groups is described.
Furthermore, in order to apply to displays of various designs, it is required that the cured film can be patterned by photolithography.
Patent Document 3 discloses a polyfunctional (meth) acrylate monomer (A) containing various acidic groups or salts thereof, a siloxane compound (B) having two or more hydrolyzable alkoxy groups, and initiation of radical photopolymerization. A negative photosensitive resin composition containing an agent (C), wherein the acid value based on the total weight of the photosensitive resin composition (A) to (C) is 10 to 110 mgKOH / g, and A photosensitive resin composition for a color filter protective film having a (meth) acryloyl group concentration of 6.5 to 10.0 mmol / g based on the total of (A) to (C) of the photosensitive resin composition is described. .

Japanese Patent No. 5201066 JP 2000-080169 A JP 2012-013905 A

However, the photosensitive composition described in Patent Document 1 requires a heating temperature of 200 ° C. or higher, and when heated at a low temperature (for example, 180 ° C. or lower, further 150 ° C. or lower), sufficient hardness cannot be obtained. . The photosensitive composition described in Patent Document 2 has been evaluated for film strength during low-temperature curing, but does not describe patternability by photolithography.
Although the photosensitive composition of patent document 3 is described about patterning property, evaluation regarding film | membrane hardness is not made | formed.
The problem to be solved by the present invention is a photosensitive composition having excellent adhesion and hardness of the resulting cured film even when heated at a low temperature, and having excellent patterning properties by photolithography, and the above photosensitive property It is providing the cured film which hardened the composition, its manufacturing method, and the liquid crystal display device, organic EL display apparatus, touch panel, and touch panel display apparatus which used the said cured film.

The above-described problems of the present invention have been solved by means described in the following <1>, <12>, <14>, and <18> to <21>. It is described below together with <2> to <11>, <13>, and <15> to <17>, which are preferred embodiments.
<1> A polymerizable monomer having three or more (meth) acryloyl groups and one or more carboxy groups in the molecule as component A, and three or more (meth) acryloyl in the molecule as component B A polymerizable monomer having a group and having no carboxy group, Component C as a photopolymerization initiator, Component D as a solvent, and Component K as a polymerization inhibitor, Component A and Component B The total content is 60 to 95% by mass with respect to the total organic solid content of the photosensitive composition, and the content of Component A is 10 to 40% by mass with respect to the total content of Component A and Component B. A photosensitive composition characterized in that,
<2> The photosensitive composition according to <1>, wherein the content of component K is 0.1 to 0.5% by mass with respect to the total organic solid content of the photosensitive composition,
<3> The photosensitive composition according to <1> or <2>, wherein the total content of component A and component B is 65 to 95% by mass with respect to the total organic solid content of the photosensitive composition,
<4> The photosensitive composition according to any one of <1> to <3>, wherein the total content of component A and component B is 70 to 95% by mass with respect to the total organic solid content of the photosensitive composition. Sex composition,
<5> The photosensitive composition according to any one of <1> to <4>, wherein the content of component A is 10 to 30% by mass with respect to the total content of component A and component B,
<6> The photosensitive composition according to any one of <1> to <5>, wherein the content of component A is 10 to 25% by mass relative to the total content of component A and component B;
<7> The photosensitive composition according to any one of <1> to <6>, further containing inorganic particles as component E,
<8> The photosensitive composition according to <7>, wherein the content of component E is 10 to 40% by mass relative to the total solid content of the photosensitive composition,
<9> The photosensitive composition according to any one of <1> to <8>, further containing an alkoxysilane compound as component S,
<10> The content of the polymer component having a molecular weight exceeding 10,000 is 25% by mass or less based on the total solid content of the photosensitive composition, according to any one of <1> to <9> Photosensitive composition,
<11> The content of the polymer component having a molecular weight exceeding 10,000 is 10% by mass or less based on the total solid content of the photosensitive composition, according to any one of <1> to <10> Photosensitive composition,
<12> A method for producing a cured film including at least steps 1 to 5 in this order,
Step 1: Application step of applying the photosensitive composition according to any one of <1> to <11> onto a substrate Step 2: Solvent removal step of removing the solvent from the applied photosensitive composition Step 3 : Exposure step of exposing at least a part of the photosensitive composition from which the solvent has been removed with actinic rays Step 4: development step of developing the exposed photosensitive composition with an aqueous developer Step 5: developed photosensitive composition Heat treatment step <13> for heat-treating the product, The heat treatment temperature in step 5 is 80 ° C. to 150 ° C.
<14> A cured film obtained by curing the photosensitive composition according to any one of <1> to <11>,
<15> The cured film according to <14>, which is an interlayer insulating film or an overcoat film,
<16> The cured film according to <14> or <15>, which is an overcoat film for a touch panel,
<17> The cured film according to any one of <14> to <16>, which is an overcoat film for an on-cell structure touch panel,
<18> A liquid crystal display device having the cured film according to <14> or <15>,
<19> An organic EL display device having the cured film according to <14> or 15>,
<20> A touch panel having the cured film according to any one of <14> to <17>,
<21> A touch panel display device having the cured film according to any one of <14> to <17>.

According to the present invention, even when heated at a low temperature, the resulting cured film has excellent adhesion and hardness, and also has excellent patternability by photolithography, and the above photosensitive composition is cured. It was possible to provide a cured film and a manufacturing method thereof, and a liquid crystal display device, an organic EL display device, a touch panel, and a touch panel display device each having the cured film.

1 shows a conceptual diagram of a configuration of an example of an organic EL display device. A schematic cross-sectional view of a substrate in a bottom emission type organic EL display device is shown, and a planarizing film 4 is provided. 1 is a conceptual diagram of a configuration of an example of a liquid crystal display device. The schematic sectional drawing of the active matrix substrate in a liquid crystal display device is shown, and it has the cured film 17 which is an interlayer insulation film. 1 is a conceptual diagram illustrating a configuration of an example of a liquid crystal display device having a touch panel function. FIG. 5 shows a conceptual diagram of a configuration of another example of a liquid crystal display device having a touch panel function.

Hereinafter, the contents of the present invention will be described in detail. The description of the constituent elements described below may be made based on typical embodiments of the present invention, but the present invention is not limited to such embodiments. In the present specification, “to” is used to mean that the numerical values described before and after it are included as a lower limit value and an upper limit value. The organic EL element in the present invention refers to an organic electroluminescence element.
In the notation of groups (atomic groups) in this specification, the notation that does not indicate substitution and non-substitution includes not only those having no substituent but also those having a substituent. For example, the “alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
In addition, the chemical structural formula in this specification may be expressed as a simplified structural formula in which a hydrogen atom is omitted.
In the present specification, “(meth) acrylate” represents acrylate and methacrylate, “(meth) acryl” represents acryl and methacryl, and “(meth) acryloyl” represents acryloyl and methacryloyl.
In the present invention, “component A: polymerizable monomer having three or more (meth) acryloyl groups and one or more carboxy groups in the molecule” is also simply referred to as “component A” or the like.
In the present invention, “mass%” and “wt%” are synonymous, and “part by mass” and “part by weight” are synonymous.
In the present invention, a combination of preferable embodiments is more preferable.

In the present invention, the weight average molecular weight and number average molecular weight in the polymer component are weight average molecular weights in terms of polystyrene measured by gel permeation chromatography (GPC) using tetrahydrofuran (THF) as a solvent.

(Photosensitive composition)
The photosensitive composition of the present invention (hereinafter also simply referred to as “composition”) is a polymerizable monomer having, as component A, three or more (meth) acryloyl groups and one or more carboxy groups in the molecule. As a monomer, Component B, a polymerizable monomer having three or more (meth) acryloyl groups in the molecule and having no carboxy group, Component C as a photopolymerization initiator, Component D as a solvent, and Component K contains a polymerization inhibitor, the total content of component A and component B is 60 to 95% by mass with respect to the total organic solid content of the photosensitive composition, and the content of component A is The total content of Component A and Component B is 10 to 40% by mass.
The photosensitive composition of the present invention may further contain other components such as an alkoxysilane compound as component S and inorganic particles as component E.
The photosensitive composition of the present invention is preferably capable of patterning by photolithography using an alkaline developer. When the photosensitive composition of the present invention is patterned by photolithography with an alkaline developer, the resulting pattern is a negative pattern in which the photosensitive portion remains as a pattern.

As a result of intensive studies in view of the above-mentioned viewpoints, the present inventors have obtained a photosensitive composition containing component A to component D and having the specific content shown above, when heated at a low temperature. Even in such a case, the present inventors have found that the cured film obtained is excellent in adhesion and hardness and excellent in patterning property by photolithography, and has completed the present invention.
Although the detailed mechanism of the effect is unclear, by containing components A and B at a specific content, a cured film having sufficient hardness can be obtained even when cured at a low temperature, and an appropriate developer. It is presumed that developability is good because of its solubility in water. Furthermore, it is presumed that the adhesiveness is good because the developer A is contained in a specific content to prevent the developer from penetrating into the cured film or the interface between the base plate and the cured film.

Although preferable embodiment of the photosensitive composition of this invention is given to the following, this invention is not limited to these.
<First Embodiment>
Component A: Polymerizable monomer having three or more (meth) acryloyl groups and one or more carboxy groups in the molecule Component B: Three or more (meth) acryloyl groups in the molecule and carboxy Polymerizable monomer having no group Component C: Photopolymerization initiator Component D: Solvent Component K: Polymerization inhibitor

<Second Embodiment>
Component A: Polymerizable monomer having three or more (meth) acryloyl groups and one or more carboxy groups in the molecule Component B: Three or more (meth) acryloyl groups in the molecule and carboxy Polymerizable monomer having no group Component C: Photopolymerization initiator Component D: Solvent Component E: Inorganic particles Component K: Polymerization inhibitor

<Third Embodiment>
Component A: Polymerizable monomer having three or more (meth) acryloyl groups and one or more carboxy groups in the molecule Component B: Three or more (meth) acryloyl groups in the molecule and carboxy Polymerizable monomer having no group Component C: Photopolymerization initiator Component D: Solvent Component N: Blocked isocyanate compound Component S: Alkoxysilane compound

<Fourth Embodiment>
Component A: Polymerizable monomer having three or more (meth) acryloyl groups and one or more carboxy groups in the molecule Component B: Three or more (meth) acryloyl groups in the molecule and carboxy Polymerizable monomer having no group Component C: Photopolymerization initiator Component D: Solvent Component K: Polymerization inhibitor Component S: Alkoxysilane

<Fifth Embodiment>
Component A: Polymerizable monomer having three or more (meth) acryloyl groups and one or more carboxy groups in the molecule Component B: Three or more (meth) acryloyl groups in the molecule and carboxy Polymerizable monomer having no group Component C: Photopolymerization initiator Component D: Solvent Component E: Inorganic particles Component K: Polymerization inhibitor Component S: Alkoxysilane

<Sixth Embodiment>
Component A: Polymerizable monomer having three or more (meth) acryloyl groups and one or more carboxy groups in the molecule Component B: Three or more (meth) acryloyl groups in the molecule and carboxy Polymerizable monomer having no group Component C: Photopolymerization initiator Component D: Solvent Component E: Inorganic particles Component K: Polymerization inhibitor Component N: Block isocyanate Component S: Alkoxysilane

<Seventh Embodiment>
An embodiment in which a surfactant is further added to any of the first to sixth embodiments.

Hereinafter, each component which the photosensitive composition of this invention contains is demonstrated.
Component A: Polymerizable monomer having three or more (meth) acryloyl groups and one or more carboxy groups in the molecule The photosensitive composition of the present invention has three or more in the molecule as component A. It contains a polymerizable monomer having a (meth) acryloyl group and one or more carboxy groups.
Component A may be a low molecular weight compound or an oligomer, but does not contain a polymer.
The molecular weight of component A used in the present invention (in the case of having a molecular weight distribution, the weight average molecular weight) is 100 to 10,000, preferably 200 to 5,000, from the viewpoint of the hardness of the cured film. 300 to 3,000 is more preferable.

Component A has three or more (meth) acryloyl groups in the molecule. The number of (meth) acryloyl groups contained in the molecule (in one molecule) is preferably 3 to 15, more preferably 3 to 10, and still more preferably 3 to 6.
When the number of (meth) acryloyl groups is within the above range, hardness and reactivity are excellent.

Component A is a total of 3 or more of acryloyl (—C (═O) —CH═CH ₂ ) group and methacryloyl group (—C (═O) —C (CH ₃ ) ═CH ₂ ) in one molecule. The acryloyloxy group (—O—C (═O) —CH═CH ₂ ) and the methacryloyloxy group (—O—C (═O) —C (CH ₃ ) ═CH ₂ ) may be used. It is preferably 3 or more in total, more preferably 3 to 15, more preferably 3 to 10, and particularly preferably 3 to 6. Further, it preferably has three or more acryloyl groups, more preferably 3 to 15, more preferably 3 to 10, and particularly preferably 3 to 6. In particular, it preferably has three or more acryloyloxy groups, more preferably 3 to 15, more preferably 3 to 10, and particularly preferably 3 to 6.
Compared with a methacryloyl group, an acryloyl group is preferable in that it is excellent in curability (reactivity). In addition, a (meth) acryloyloxy group is preferable in terms of excellent reactivity and easy synthesis.

Component A has one or more carboxy groups in the molecule (in one molecule). The number of carboxy groups in one molecule is preferably 1 to 4, more preferably 1 to 3, and still more preferably 1 to 2.
It is preferable that the number of carboxy groups that component A has in one molecule is in the above range because the developability and substrate adhesion are excellent.
In addition, the carboxy group which component A has may form a salt. As the cation forming the salt, an organic cationic compound, a transition metal coordination complex cation, or a metal cation is preferable. Examples of the organic cationic compound include a quaternary ammonium cation, a quaternary pyridinium cation, a quaternary quinolinium cation, a phosphonium cation, an iodonium cation, and a sulfonium cation. Examples of the transition metal cation include the compounds described in Japanese Patent No. 279143. Examples of the metal cation include Na ⁺ , K ⁺ , Li ⁺ , Ag ⁺ , Fe ²⁺ , Fe ³⁺ , Cu ⁺ , Cu ²⁺ , Zn ²⁺ , Al ³⁺ , and Ca ²⁺ .

In addition, it is preferable that the component A does not have acid groups other than the said carboxy group. Examples of acid groups other than carboxy groups include sulfonic acid groups and phosphoric acid groups. When it has an acid group other than a carboxy group, the substrate adhesion may be lowered.

Component A is an ester of a polyhydroxy compound and an unsaturated carboxylic acid, and a polymerization in which an unreacted hydroxy group of the polyhydroxy compound is reacted with a carboxylic acid anhydride to give an acid group (carboxy group). Of the polyhydroxy compound is pentaerythritol and / or dipentaerythritol.

Component A can be obtained, for example, by adding an acid anhydride to a compound having three or more (meth) acryloyl groups and a hydroxy group (hereinafter also referred to as “hydroxy polyfunctional (meth) acrylate”).
Examples of the hydroxy polyfunctional (meth) acrylate include an ester of a polyhydroxy compound having four or more hydroxy groups and (meth) acrylic acid.
The polyhydroxy compound having four or more hydroxy groups is preferably an aliphatic polyhydroxy compound, specifically, diglycerol, ditrimethylolethane, ditrimethylolpropane, ditrimethylolbutane, ditrimethylolhexane, pentaerythritol. , Dipentaerythritol, tripentaerythritol and the like. Among these, pentaerythritol and dipentaerythritol are preferable.
Moreover, you may use the alkylene oxide adduct of said polyhydroxy compound illustrated above as a polyhydroxy compound, and ethylene oxide, a propylene oxide, etc. are illustrated as an alkylene oxide.

A method for producing the hydroxy polyfunctional acrylate is not particularly limited as long as a known method is appropriately employed. Specifically, a method of heating and stirring a polyhydroxy compound and (meth) acrylic acid under an acidic catalyst is exemplified. Examples of the acidic catalyst include sulfuric acid, paratoluenesulfonic acid, methanesulfonic acid, and the like. The reaction temperature may be appropriately set according to the compound to be used and the purpose, but is preferably 70 ° C to 140 ° C. Within the above temperature range, the reaction is fast and the reaction proceeds stably, and the generation of impurities and gelation are suppressed.
In the reaction, it is preferable to use an organic solvent having low solubility with water produced by the esterification reaction and promote dehydration while azeotropically distilling water. Preferred organic solvents include aromatic hydrocarbons such as toluene, benzene and xylene, aliphatic hydrocarbons such as hexane and heptane, and ketones such as methyl ethyl ketone and cyclohexanone. The organic solvent can be distilled off under reduced pressure after the reaction.
In addition, a polymerization inhibitor can be added to the reaction solution for the purpose of preventing polymerization of the resulting (meth) acrylic acid ester. Examples of such polymerization inhibitors include hydroquinone, hydroquinone monomethyl ether, 2,6-ditertiary butyl-p-cresol, and phenothiazine.

Component A is obtained by reaction of the hydroxy polyfunctional (meth) acrylate with an acid anhydride.
Acid anhydrides include succinic anhydride, 1-dodecenyl succinic anhydride, maleic anhydride, glutaric anhydride, itaconic anhydride, phthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, tetramethylene maleic anhydride, One in the same molecule such as tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride, tetrachlorophthalic anhydride, tetrabromophthalic anhydride and trimellitic anhydride Compounds having an acid anhydride group, as well as pyromellitic anhydride, phthalic anhydride dimer, diphenyl ether tetracarboxylic dianhydride, diphenyl sulfone tetracarboxylic dianhydride, benzophenone tetracarboxylic dianhydride and 1,2 , 3,4 Tantetracarboxylic dianhydride, diphenyl ether tetracarboxylic anhydride and trimellitic anhydride / ethylene glycol ester (commercially available products include, for example, Shin Nippon Rika Co., Ltd., trade name Ricacid TMEG-100) Examples include compounds having two acid anhydride groups in the same molecule.
Among these, a compound having one acid anhydride group in the same molecule is preferable.

What is necessary is just to follow a conventional method as a manufacturing method of the component A. FIG.
Examples thereof include a method in which a hydroxy polyfunctional (meth) acrylate and an acid anhydride are reacted at 60 to 110 ° C. for 1 to 20 hours in the presence of a catalyst. Examples of the catalyst in this case include N, N-dimethylbenzylamine, triethylamine, tributylamine, triethylenediamine, benzyltrimethylammonium chloride, benzyltriethylammonium bromide, tetramethylammonium bromide, cetyltrimethylammonium bromide, and zinc oxide.

Component A is preferably a compound represented by Formula a-1 or Formula a-2.

In Formula a-1, X ¹ independently represents an acryloyloxy group or a methacryloyloxy group, and W ¹ represents an alkylene group having 1 to 6 carbon atoms, an alkenylene group having 2 to 6 carbon atoms, or a phenylene group.
In formula a-2, each X ² independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an acryloyloxy group or a methacryloyloxy group, and at least three of the five X ² are An acryloyloxy group or a methacryloyloxy group. W ² represents an alkylene group having 1 to 6 carbon atoms, an alkenylene having 2 to 6 carbon atoms, or a phenylene group.

In formula a-1, all three X ¹ are preferably acryloyloxy groups.
In Formula a-1, W ¹ represents an alkylene group having 1 to 6 carbon atoms, an alkenylene group having 2 to 6 carbon atoms, or a phenylene group, and the alkylene group having 1 to 6 carbon atoms is linear, It may be either branched or annular. The alkylene group preferably has 2 to 6 carbon atoms, and examples thereof include an ethylene group, a propylene group, a butylene group, a pentyl group, a hexylene group, and a cyclohexylene group.
In formula a-1, W ¹ is preferably an alkylene group having 1 to 6 carbon atoms, more preferably an alkylene group having 2 to 6 carbon atoms, and an alkylene group having 2 or 3 carbon atoms. More preferred is an ethylene group.

In the formula a-2, 5 of the fold X ^2, at least 3 represents acryloyloxy group or a methacryloyloxy group, is preferably an acryloyloxy group. Of the five X ² groups, 3 to 5 are preferably acryloyloxy groups or methacryloyloxy groups, and 4 to 5 are preferably acryloyloxy groups or methacryloyloxy groups, and five are acryloyloxy groups or methacryloyl groups. It is preferably an oxy group.
X ² other than acryloyloxy group or methacryloyloxy group represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. The alkyl group having 1 to 6 carbon atoms may be a linear, branched or cyclic alkyl group. Among these, X ² other than the (meth) acryloyloxy group is preferably a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, more preferably a hydrogen atom, a methyl group or an ethyl group, and a hydrogen atom More preferably.
In formula a-2, W ² has the same meaning as W ¹ in formula a-1, and the preferred range is also the same.

As the component A, a commercially available product can be used. For example, as a polybasic acid-modified acrylic oligomer manufactured by Toagosei Co., Ltd., Aronix series M-510, M-520, TO- 2349, TO-2359, and the like.

Component A may be used alone or in combination of two or more.
The content of Component A is preferably 6 to 38% by mass, more preferably 5 to 35% by mass, and more preferably 5 to 25% by mass with respect to the total organic solid content of the photosensitive composition. More preferably, the content is 8 to 20% by mass.
In the present invention, the “solid content” in the photosensitive composition means a component excluding volatile components such as an organic solvent. The “organic solid content” means a component obtained by removing a volatile component such as an organic solvent and an inorganic component such as inorganic particles from the photosensitive composition.

Component B: Polymerizable monomer having three or more (meth) acryloyl groups in the molecule and not having a carboxy group The photosensitive composition of the present invention has three or more ( It contains a polymerizable monomer having a (meth) acryloyl group and having no carboxy group. Component B is a polymerizable monomer different from Component A having three or more (meth) acryloyl groups in the molecule (in one molecule). Component B does not have a carboxy group in the molecule, but preferably does not have other acid groups. Examples of other acid groups include sulfonic acid groups and phosphoric acid groups.
Component B may be a low molecular weight compound or an oligomer, but is not a polymer. That is, from the viewpoint of the hardness of the cured film, Component B has a molecular weight (in the case of having a molecular weight distribution, a weight average molecular weight) of 10,000 or less, preferably 5,000 or less, and preferably 3,000 or less. More preferably.

Component B has three or more (meth) acryloyl groups in the molecule. It preferably has 3 to 15 (meth) acryloyl groups, more preferably 3 to 10, and still more preferably 3 to 6. By setting it as said structure, the effect of this invention is exhibited more.

As the polymerizable monomer used in the present invention, those applicable to this kind of composition can be appropriately selected and used, and among them, an ethylenically unsaturated compound is preferably used.
For example, among the components described in paragraph 0011 of JP-A-2006-23696 and the components described in paragraphs 0031 to 0047 of JP-A-2006-64921, three or more (meth) acryloyl groups are included in the molecule. And the description of which is incorporated herein.
Component B is preferably exemplified by (meth) acrylic acid esters of polyhydroxy compounds, specifically, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, Dipentaerythritol hexa (meth) acrylate, tri ((meth) acryloyloxyethyl) isocyanurate, trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate ethylene oxide (EO) modified product, dipentaerythritol hexa ( Examples include meth) acrylate modified EO.
As the component B, commercially available products may be used. Examples of the commercially available products include Aronix (registered trademark) M-309, M-400, M-405, M-450, M -7100, M-8030, M-8060, TO-1382, TO-1450 (manufactured by Toagosei Co., Ltd.), KAYARAD TMPTA, DPHA, DPCA-20, DPCA-30, DPCA- 60, DPCA-120 (manufactured by Nippon Kayaku Co., Ltd.), Biscoat 295, 300, 360, GPT, 3PA, 400 (Osaka Organic Chemical Co., Ltd.).
In addition, even if it is a compound applicable to component B, it is a polymerizable compound which has an ethylenically unsaturated bond, Comprising: What corresponds to the alkoxysilane compound mentioned later is an alkoxysilane compound.

<6 or more urethane (meth) acrylate>
In the present invention, as the component B, hexafunctional or higher urethane (meth) acrylate may be used. As the hexafunctional or higher urethane (meth) acrylate, 6 to 15 functional urethane (meth) acrylate is preferable.

Examples of the urethane (meth) acrylate having 6 or more functional groups that can be used in the present invention include urethane addition polymerizable compounds produced by using an addition reaction of an isocyanate and a hydroxyl group, Japanese Patent Application Laid-Open No. 51-37193, The urethane acrylates described in JP-B-2-32293 and JP-B-2-16765 are exemplified, and these descriptions are incorporated in the present specification.

The molecular weight of the hexafunctional or higher urethane (meth) acrylate is preferably from 500 to 10,000, more preferably from 600 to 6,000, and even more preferably from 650 to 3,000, from the viewpoint of cured film hardness.
By adopting such a configuration, the effect of the present invention is more effectively exhibited.

The number of (meth) acryloxy groups in the hexafunctional or higher-functional urethane (meth) acrylate is preferably 8 or more, more preferably 10 or more, and still more preferably 12 or more. The effect of this invention is more effectively exhibited as it is the said aspect.
The upper limit of the number of the (meth) acryloxy groups is not particularly limited, but is preferably 50 or less, more preferably 30 or less, and still more preferably 20 or less.
The photosensitive composition of the present invention may contain only one type of hexafunctional or more urethane (meth) acrylate, or may contain two or more types.

The (meth) acryloxy group in the hexafunctional or higher urethane (meth) acrylate may be either an acryloxy group or a methacryloxy group, or may be both, but is preferably an acryloxy group.
The number of urethane bonds in the hexa- or more functional urethane (meth) acrylate is not particularly limited, but is preferably 1 to 30, more preferably 1 to 20, and still more preferably 2 to 10. It is particularly preferably 2 to 5, and most preferably 2 or 3.
The hexafunctional or higher urethane (meth) acrylate is preferably a hexafunctional or higher aliphatic urethane (meth) acrylate.
Moreover, it is preferable that hexafunctional or more urethane (meth) acrylate has an isocyanuric ring structure.
The hexafunctional or higher urethane (meth) acrylate is a compound comprising a core portion having one or more urethane bonds and a terminal portion bonded to the core portion and having one or more (meth) acryloxy groups. Preferably, the core part is more preferably a compound having two or more terminal parts bonded thereto, more preferably a compound having 2 to 5 terminal parts bonded to the core part. A compound in which 2 or 3 of the above terminal moieties are bound to the core part is particularly preferred.

The hexafunctional or more urethane (meth) acrylate is preferably a compound having at least a group represented by the following formula (Ae-1) or (Ae-2), and represented by the following formula (Ae-1). It is more preferable that the compound has at least a group. The hexafunctional or higher urethane (meth) acrylate is a compound having two or more groups selected from the group consisting of a group represented by the following formula (Ae-1) and a group represented by the formula (Ae-2) It is more preferable that
Further, the terminal portion in the hexafunctional or higher functional urethane (meth) acrylate is preferably a group represented by the following formula (Ae-1) or (Ae-2).

In formula (Ae-1) and formula (Ae-2), R each independently represents an acryl group or a methacryl group, and a wavy line portion represents a bonding position with another structure.

The hexafunctional or higher urethane (meth) acrylate is preferably a compound having at least a group represented by the following formula (Ac-1) or (Ac-2), and represented by the following formula (Ac-1): It is more preferable that the compound has at least the group represented.
In addition, the core portion in the hexafunctional or higher urethane (meth) acrylate is preferably a group represented by the following formula (Ac-1) or (Ac-2).

In formula (Ac-1) and formula (Ac-2), L ¹ to L ⁴ each independently represents a divalent hydrocarbon group having 2 to 20 carbon atoms, and the wavy line represents the bonding position with other structure Represents.
L ¹ to L ⁴ are each independently preferably an alkylene group having 2 to 20 carbon atoms, more preferably an alkylene group having 2 to 10 carbon atoms, and an alkylene group having 4 to 8 carbon atoms. Is more preferable. The alkylene group may have a branched or ring structure, but is preferably a linear alkylene group.
Further, the urethane (meth) acrylate having 6 or more functional groups is represented by a group represented by the formula (Ac-1) or the formula (Ac-2), and a formula (Ae-1) or a formula (Ae-2). A compound in which 2 or 3 groups selected from the group consisting of groups are bonded is particularly preferred.

Hereinafter, hexafunctional or higher urethane (meth) acrylates preferably used in the present invention will be exemplified, but it goes without saying that the present invention is not limited to these.

Further, examples of the urethane (meth) acrylate having 6 or more functional groups that can be used in the present invention include urethane addition polymerizable compounds produced by using an addition reaction between an isocyanate and a hydroxyl group, and JP-A-51-37193. Examples of such urethane acrylates are described in Japanese Patent Publications, JP-B-2-32293 and JP-B-2-16765, and these descriptions are incorporated in the present specification.

Commercially available products of 6 or more functional urethane (meth) acrylates are U-6HA, UA-1100H, U-6LPA, U-15HA, U-6H, U-10HA, available from Shin-Nakamura Chemical Co., Ltd. U-10PA, UA-53H, UA-33H (all are registered trademarks) and UA-306H, UA-306T, UA-306I, UA-510H, available from BASF, available from Kyoeisha Chemical Co., Ltd. Examples include Laromer UA-9048, UA-9050, PR9052, EBECRYL 220, 5129, 8301, KRM8200, 8200AE, and 8452 available from Daicel Ornex Co., Ltd.

Component B may be used alone or in combination of two or more.
The content of component B is preferably 30 to 80% by mass, more preferably 30 to 60% by mass, and more preferably 30 to 50% by mass with respect to the total organic solid content of the photosensitive composition. More preferably.

In the present invention, the total content of Component A and Component B is 60 to 95% by mass, preferably 65 to 95% by mass, and preferably 70 to 95% by mass in the total organic solid content of the photosensitive composition. % Is particularly preferred. When the total content of Component A and Component B is within this range, a photosensitive composition having excellent cured film hardness can be obtained.
The content ratio of component A and component B is also important, and the content of component A is 10 to 40% by mass and 10 to 30% by mass with respect to the total content of component A and component B It is preferably 10 to 25% by mass. If content of the component A with respect to the total content of the component A and the component B is the said range, the photosensitive composition which is excellent in patterning property and excellent in the adhesiveness of the cured film obtained will be obtained.

Component C: Photopolymerization initiator The photosensitive composition of the present invention contains a photopolymerization initiator as Component C.
The photopolymerization initiator preferably contains a photoradical polymerization initiator.
The radical photopolymerization initiator that can be used in the present invention is a compound that can initiate and accelerate polymerization of component A, component B, and the like by light.
The “light” is not particularly limited as long as it is an active energy ray capable of imparting energy capable of generating a starting species from the component C by irradiation, and is widely limited to α rays, γ rays, X rays, ultraviolet rays. (UV), visible light, electron beam, and the like. Among these, light containing at least ultraviolet rays is preferable.

Examples of the photopolymerization initiator include oxime ester compounds, organic halogenated compounds, oxydiazole compounds, carbonyl compounds, ketal compounds, benzoin compounds, acridine compounds, organic peroxide compounds, azo compounds, coumarin compounds, azide compounds, metallocenes. Examples include compounds, hexaarylbiimidazole compounds, organic boric acid compounds, disulfonic acid compounds, onium salt compounds, and acylphosphine (oxide) compounds. Among these, oxime ester compounds and hexaarylbiimidazole compounds are preferable from the viewpoint of sensitivity, and oxime ester compounds are more preferable.

Examples of the oxime ester compound include compounds described in JP-A No. 2000-80068, JP-A No. 2001-233842, JP-T No. 2004-534797, JP-A No. 2007-231000, and JP-A No. 2009-134289. Can be used.
The oxime ester compound is preferably a compound represented by the following formula c-1 or formula c-2.

In Formula c-1 or Formula c-2, Ar represents an aromatic group or a heteroaromatic group, R ¹ represents an alkyl group, an aromatic group, or an alkyloxy group, and R ² represents a hydrogen atom or an alkyl group. Further, R ² may be bonded to an Ar group to form a ring.

In Formula c-1 or Formula c-2, Ar represents an aromatic group or a heteroaromatic group, and is preferably a group obtained by removing one hydrogen atom from a benzene ring compound, a naphthalene ring compound, or a carbazole ring compound. , A naphthalenyl group and a carbazoyl group that form a ring with R ² are more preferred. Preferable examples of the hetero atom in the heteroaromatic group include a nitrogen atom, an oxygen atom, and a sulfur atom.
R ¹ represents an alkyl group, an aromatic group or an alkyloxy group, preferably a methyl group, an ethyl group, a benzyl group, a phenyl group, a naphthyl group, a methoxy group or an ethoxy group, and a methyl group, an ethyl group, a phenyl group or a methoxy group Groups are more preferred.
R ² represents a hydrogen atom or an alkyl group, preferably a hydrogen atom or a substituted alkyl group, and more preferably a hydrogen atom, a substituted alkyl group that forms a ring with Ar, or a toluenethioalkyl group.
Ar is preferably a group having 4 to 20 carbon atoms, R ¹ is preferably a group having 1 to 30 carbon atoms, and R ² is a group having 1 to 50 carbon atoms. It is preferable.

The oxime ester compound is more preferably a compound represented by the following formula c-3, formula c-4 or formula c-5.

In formulas c-3 to c-5, R ¹ represents an alkyl group, an aromatic group or an alkoxy group, X represents —CH ₂ —, —C ₂ H ₄ —, —O— or —S—, R ³ independently represents a halogen atom, R ⁴ are each independently an alkyl group, a phenyl group, an alkyl-substituted amino group, an arylthio group, an alkylthio group, an alkoxy group, an aryloxy group or a halogen atom, R ⁵ Represents a hydrogen atom, an alkyl group or an aryl group, R ⁶ represents an alkyl group, n1 and n2 each independently represents an integer of 0 to 6, and n3 represents an integer of 0 to 5.

R ¹ represents an alkyl group, an aromatic group or an alkoxy group, and a group represented by R ¹¹ —X′-alkylene group— (R ¹¹ represents an alkyl group or an aryl group, and X ′ represents a sulfur atom or an oxygen atom. Are preferred). R ¹¹ is preferably an aryl group, more preferably a phenyl group. The alkyl group and aryl group as R ¹¹ may be substituted with a halogen atom (preferably a fluorine atom, a chlorine atom or a bromine atom) or an alkyl group.
X is preferably a sulfur atom.
R ³ and R ⁴ can be bonded at any position on the aromatic ring.
R ⁴ represents an alkyl group, a phenyl group, an alkyl-substituted amino group, an arylthio group, an alkylthio group, an alkoxy group, an aryloxy group or a halogen atom, preferably an alkyl group, a phenyl group, an arylthio group or a halogen atom, an alkyl group, an arylthio group A group or a halogen atom is more preferred, and an alkyl group or a halogen atom is still more preferred. As the alkyl group, an alkyl group having 1 to 5 carbon atoms is preferable, and a methyl group or an ethyl group is more preferable. As a halogen atom, a chlorine atom, a bromine atom, or a fluorine atom is preferable.
The number of carbon atoms in R ⁴ is preferably 0 to 50, more preferably 0 to 20.
R ⁵ represents a hydrogen atom, an alkyl group or an aryl group, and an alkyl group is preferable. As the alkyl group, an alkyl group having 1 to 5 carbon atoms is preferable, and a methyl group or an ethyl group is more preferable. As the aryl group, an aryl group having 6 to 10 carbon atoms is preferable.
R ⁶ represents an alkyl group, preferably an alkyl group having 1 to 5 carbon atoms, more preferably a methyl group or an ethyl group.
n1 and n2 each represent the number of substitutions of R ³ on the aromatic ring in formula c-3 or formula c-4, and n3 represents the number of substitutions of R ⁴ on the aromatic ring in formula 5.
n1 to n3 are each independently preferably an integer of 0 to 2, and more preferably 0 or 1.

Examples of oxime ester compounds preferably used in the present invention are shown below. However, it goes without saying that the oxime ester compounds used in the present invention are not limited to these. Me represents a methyl group and Ph represents a phenyl group. Further, the cis-trans isomerism of the double bond of the oxime in these compounds may be either EZ or a mixture of EZ.

Specific examples of organic halogenated compounds include: Wakabayashi et al., “Bull Chem. Soc. Japan” 42, 2924 (1969), US Pat. No. 3,905,815, Japanese Patent Publication No. 46-4605. JP, 48-34881, JP 55-3070, JP 60-239736, JP 61-169835, JP 61-169837, JP 62-58241, JP-A 62-212401, JP-A 63-70243, JP-A 63-298339, P. Examples include compounds described in Hut “Journal of Heterocyclic Chemistry” 1 (No. 3), (1970), and in particular, oxazole compounds substituted with a trihalomethyl group and s-triazine compounds.

Examples of hexaarylbiimidazole compounds include, for example, JP-B-6-29285, US Pat. Nos. 3,479,185, 4,311,783, and 4,622,286. Examples include various compounds described in the specification.

Examples of the acylphosphine (oxide) compounds include monoacylphosphine oxide compounds and bisacylphosphine oxide compounds. Specific examples include Irgacure 819, Darocur 4265, Darocur TPO, etc. manufactured by Ciba Specialty Chemicals. Can be mentioned.

A photoinitiator can be used 1 type or in combination of 2 or more types.
The total amount of the photopolymerization initiator in the photosensitive composition of the present invention is preferably 0.5 to 30 parts by mass with respect to 100 parts by mass of the total solid content in the composition, and is 1 to 20 parts by mass. More preferred is 1 to 10 parts by mass, still more preferred is 2 to 5 parts by mass.
The content of component C is preferably 0.5 to 30% by mass, more preferably 1 to 20% by mass, and more preferably 1 to 10% by mass with respect to the total organic solid content of the photosensitive composition. More preferably, it is more preferably 1 to 5% by mass.

<Sensitizer>
In addition to the photopolymerization initiator, a sensitizer can also be added to the photosensitive composition of the present invention.
The sensitizer absorbs actinic rays or radiation and enters an excited state. The sensitizer that has been in an excited state is capable of initiating and promoting polymerization by causing an action such as electron transfer, energy transfer, and heat generation due to the interaction with the component C.
Typical sensitizers that can be used in the present invention include those disclosed in Crivello [JV Crivello, Adv. In Polymer Sci., 62, 1 (1984)]. Examples include pyrene, perylene, acridine orange, thioxanthone, 2-chlorothioxanthone, benzoflavine, N-vinylcarbazole, 9,10-dibutoxyanthracene, anthraquinone, coumarin, ketocoumarin, phenanthrene, camphorquinone, and phenothiazine derivatives. The sensitizer is preferably added in a proportion of 50 to 200% by mass with respect to the photopolymerization initiator.

Component D: Solvent The photosensitive composition of the present invention contains a solvent as Component D. The photosensitive composition of the present invention is preferably prepared as a solution in which component A, component B, component C, and component K described below and optional components described below are dissolved in a solvent.
Component D is preferably an organic solvent, and known solvents can be used as the organic solvent used in the photosensitive composition of the present invention, such as ethylene glycol monoalkyl ethers, ethylene glycol dialkyl ethers, ethylene glycol. Monoalkyl ether acetates, propylene glycol monoalkyl ethers, propylene glycol dialkyl ethers, propylene glycol monoalkyl ether acetates, diethylene glycol dialkyl ethers, diethylene glycol monoalkyl ether acetates, dipropylene glycol monoalkyl ethers, butylene glycol di Acetates, dipropylene glycol dialkyl ethers, dipropylene glycol monoalkyl ether acetates, Alcohols, esters, ketones, amides, lactones and the like. As specific examples of these organic solvents, reference can be made to paragraph 0062 of JP-A-2009-098616.

Specifically, propylene glycol monomethyl ether acetate, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, propylene glycol monomethyl ether, 1,3-butylene glycol diacetate, cyclohexanol acetate, propylene glycol diacetate, and tetrahydrofurfuryl alcohol are preferable.

The boiling point of the organic solvent is preferably 100 ° C. to 300 ° C., more preferably 120 ° C. to 250 ° C. from the viewpoint of applicability.
The solvent which can be used for this invention can be used individually by 1 type or in combination of 2 or more types. It is also preferred to use solvents having different boiling points in combination.
The content of the solvent in the photosensitive composition of the present invention is 100 to 3,000 parts by mass per 100 parts by mass of the total solid content of the photosensitive composition from the viewpoint of adjusting the viscosity to be suitable for coating. The amount is preferably 200 to 2,000 parts by mass, and more preferably 250 to 1,000 parts by mass.
The solid content concentration of the photosensitive composition is preferably 3 to 50% by mass, and more preferably 20 to 40% by mass.

The viscosity of the photosensitive composition is preferably 1 to 200 mPa · s, more preferably 2 to 100 mPa · s, and most preferably 3 to 80 mPa · s. The viscosity is preferably measured at 25 ± 0.2 ° C. using a RE-80L rotational viscometer manufactured by Toki Sangyo Co., Ltd., for example. The rotation speed during measurement is preferably 100 rpm for less than 5 mPa · s, 50 rpm for 5 mPa · s to less than 10 mPa · s, 20 rpm for 10 mPa · s to less than 30 mPa · s, and 10 rpm for 30 mPa · s or more.

Component K: Polymerization inhibitor The photosensitive composition of the present invention contains a polymerization inhibitor as Component K. By containing the component K, the polymerization reaction due to leakage light is suppressed, and the developability is excellent. A polymerization inhibitor means hydrogen donation (or hydrogen donation), energy donation (or energy donation), electron donation (or electron donation), etc. to the polymerization initiation radical component generated from the polymerization initiator by exposure or heat. Is a substance that plays a role in deactivating polymerization initiation radicals and inhibiting polymerization initiation. For example, compounds described in paragraphs 0154 to 0173 of JP2007-334322A can be used.
The content of component K in the photosensitive composition of the present invention is not particularly limited, but is preferably 0.05 to 0.5% by mass with respect to the total solid content of the photosensitive composition. It is more preferably 1 to 0.5% by mass.
The content of component K in the photosensitive composition of the present invention is not particularly limited, but is preferably 0.01 to 0.5% by mass with respect to the total organic solid content of the photosensitive composition. 0.05 to 0.5 mass% is more preferable.
By adjusting the blending amount of the polymerization inhibitor, the patterning property can be improved without impairing the sensitivity.

As the type of the polymerization inhibitor, those that are hard and do not lower the sensitivity are preferably employed. Examples of such polymerization inhibitors include phenothiazine derivatives such as phenothiazine, chlorpromazine, levomepromazine, fluphenazine, and thioridazine, phenoxazine, 3,7-bis (diethylamino) phenoxazine-5-ium perchlorate, 5-amino-9- (Dimethylamino) -10-methylbenzo [a] phenoxazine-7-ium chloride, 7- (pentyloxy) -3H-phenoxazin-3-one, 5,9-diaminobenzo [a] phenoxazine-7- Ium acetate, phenoxazine derivatives such as 7-ethoxy-3H-phenoxazin-3-one, stable radicals such as tri-p-nitrophenylmethyl, diphenylpicrylhydrazyl, carbinoxyl, quinone, benzoquinone, chlorobenzoquinone, 2 , 5-Zee Lorobenzoquinone, 2,6-di-chlorobenzoquinone, 2,3-di-methylbenzoquinone, 2,5-di-methylbenzoquinone, methoxybenzoquinone, methylbenzoquinone, tetrabromobenzoquinone, tetrachlorobenzoquinone, tetramethylbenzoquinone, trichlorobenzoquinone Quinones such as trimethylbenzoquinone, amylquinone, amyloxyhydroquinone, 2,5-di-t-butylhydroquinone, 2,5-diphenyl-p-benzoquinone, α-naphthol, 2-nitro-1-naphthol, β-naphthol Naphthols such as 1-nitro-2-naphthol, 4-methoxyphenol, 4-ethoxyphenol, hydroquinone, phenol, t-butylcatechol, methylhydroquinone, n-butylphenol, hydroquinone monopropyl Pyrether, t-butylcresol, p-cresol, 2,6-di-t-butyl-p-cresol, catechol resorcin, ot-butylphenol, 2,6-di-p-methoxyphenol, 2,6- Di-t-butylphenol, 2,4-di-t-butylphenol, 3,5-di-t-butylphenol, 3,5-di-t-butyl-4-hydroxybenzoic acid, N, N′-bis-3 -(3 ', 5'-di-t-butyl-4-hydroxyphenyl) propionylhexamethylenediamine, 2,2'-methylenebis (6-t-butyl-p-cresol), n-octadecyl-3- (4 -Hydroxy-3 ', 5'-di-tert-butylphenyl) propionate, distearyl (4-hydroxy-3-methyl-5-tert-butyl) benzylmalonate, , 4,6-tri-t-butylphenol, 1,6-hexanediol-bis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate], triethylene glycol-bis- [3- (3-t-butyl-5-methyl-4-hydroxyphenyl) propionate], 2,2-thio-diethylene-bis- [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] 3,9-bis [1,1-dimethyl-2- [β- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionyloxyethyl-2,4,8,10-tetraoxaspiro [5,5] undecane, 2,2′-ethylidene-bis- (2,4-di-tert-butylphenol), 1,1,3-tris- (2-methyl-4-hydroxy-5-tert-butylphenol) Nylbutane, 1,3,5-trimethyl-2,4,6-tris- (3,5-di-t-butyl-4-hydroxybenzyl) benzene, tris (3,5-di-t-butyl-4- Hydroxybenzyl) isocyanate, tris [2- (3 ′, 5′-di-t-butyl-4′-hydroxyhydro-cinnamoyloxyl) ethyl] isocyanate, tris (4-t-butyl-2,6-di) -Methyl-3-hydroxybenzyl) isocyanate, tetrakis [methylene-3- (3 ', 5'-di-t-butyl-4'-hydroxyphenyl) propionate] -phenol such as methane, 2,4-dinitrophenol , Nitrophenols such as o-nitrophenol, m-nitrophenol, p-nitrophenol, gallic acid, methyl gallate, propyl gallate Gallic acids such as isoamyl gallate, pigments such as methylene blue and malachite green, amines such as β-naphthylamine, N-nitrosocyclohexylamine salt, di-p-fluorophenylamine, pyrogallol, monobenzyl ether, benzoquinone, triphenyl Examples include phosphine, cuprous chloride, phenothiazine, chloranil, pyridine, nitrobenzene, dinitrobenzene, p-toluidine, picric acid, and methyl salicylate.

Particularly preferable examples of the polymerization inhibitor include at least one selected from phenothiazine, phenoxazine, hindered amine, and derivatives thereof.
Examples of phenothiazine and derivatives thereof include phenothiazine, bis- (α-methylbenzyl) phenothiazine, 3,7-dioctylphenothiazine, bis- (α-dimethylbenzyl) phenothiazine, fluphenazine and thioridazine, and phenothiazine is preferred.
Phenoxazine and its derivatives include phenoxazine, 3,7-bis (diethylamino) phenoxazine-5-ium perchlorate, 5-amino-9- (dimethylamino) -10-methylbenzo [a] phenoxazine-7- Iium chloride, 7- (pentyloxy) -3H-phenoxazin-3-one, 5,9-diaminobenzo [a] phenoxazine-7-ium acetate, 7-ethoxy-3H-phenoxazine-3-one And phenoxazine is preferred.
Examples of the hindered amine and derivatives thereof include CHIMASSORB 2020 FDL, TINUVIN 144, 765, and 770 (above, manufactured by BASF), and TINUVIN 144 is preferable.

Component E: Inorganic particles The photosensitive composition of the present invention preferably contains inorganic particles as Component E. By containing the inorganic particles, the hardness of the cured film becomes more excellent.
The average particle size of the inorganic particles used in the present invention is preferably 1 to 200 nm, more preferably 5 to 100 nm, and most preferably 5 to 50 nm. The average particle diameter is an arithmetic average obtained by measuring the particle diameter of 200 arbitrary particles with an electron microscope. When the particle shape is not spherical, the maximum outer diameter is taken as the particle diameter of the particle.
Moreover, from the viewpoint of the hardness of the cured film, the porosity of the inorganic particles is preferably less than 10%, more preferably less than 3%, and most preferably no void. The porosity of the particle is an arithmetic average of 200 of the area ratio between the void portion of the cross-sectional image obtained by an electron microscope and the entire particle.
As inorganic particles, Be, Mg, Ca, Sr, Ba, Sc, Y, La, Ce, Gd, Tb, Dy, Yb, Lu, Ti, Zr, Hf, Nb, Mo, W, Zn, B, Al Metal oxide particles containing atoms such as Si, Ge, Sn, Pb, Sb, Bi, and Te are preferable. Silicon oxide, titanium oxide, titanium composite oxide, zinc oxide, zirconium oxide, indium / tin oxide, antimony / Tin oxide is more preferable, silicon oxide, titanium oxide, titanium composite oxide, zirconium oxide is more preferable, silicon oxide or titanium oxide is the stability of particles, availability, hardness of the cured film, transparency, This is particularly preferable from the viewpoint of adjusting the refractive index.

As a silicon oxide, a silica is mentioned preferably and a silica particle is mentioned more preferably.
The silica particles are not particularly limited as long as they are inorganic oxide particles containing silicon dioxide, and particles containing silicon dioxide or a hydrate thereof as a main component (preferably 80% by mass or more) are preferable. The said particle | grains may contain the aluminate as a minor component (for example, less than 5 mass%). Examples of the aluminate that may be contained as a minor component include sodium aluminate and potassium aluminate. The silica particles may contain inorganic salts such as sodium hydroxide, potassium hydroxide, lithium hydroxide and ammonium hydroxide, and organic salts such as tetramethylammonium hydroxide. Colloidal silica is exemplified as an example of such a compound.
There is no restriction | limiting in particular as a dispersion medium of colloidal silica, Any of water, an organic solvent, and these mixtures may be sufficient. These may be used individually by 1 type and can also use 2 or more types together.
In the present invention, the particles can be used as a dispersion prepared by mixing and dispersing in a suitable dispersant and solvent using a mixing device such as a ball mill or a rod mill. In the photosensitive composition of the present invention, it is not essential that the colloidal silica exists in a colloidal state.
When blended, the content of the inorganic particles is preferably 1% by mass or more, more preferably 5% by mass or more, and still more preferably 10% by mass or more based on the total solid content of the photosensitive composition from the viewpoint of hardness. Moreover, 80 mass% or less is preferable, 50 mass% or less is more preferable, 40 mass% or less is further more preferable, and 30 mass% or less is especially preferable.
One type of inorganic particles may be included, or two or more types may be included. When two or more types are included, the total amount is preferably within the above range.

Component S: Alkoxysilane Compound The photosensitive composition of the present invention preferably contains an alkoxysilane compound as Component S. When an alkoxysilane compound is used, the adhesion between the film formed from the photosensitive composition of the present invention and the substrate can be improved.
The alkoxysilane compound is not particularly limited as long as it has at least one group in which an alkoxy group is directly bonded to a silicon atom, but may be a compound having a dialkoxysilyl group and / or a trialkoxysilyl group. Preferably, it is a compound having a trialkoxysilyl group.
The alkoxysilane compound that can be used in the photosensitive composition of the present invention includes a base material, for example, a silicon compound such as silicon, silicon oxide, and silicon nitride, a metal such as gold, copper, molybdenum, titanium, and aluminum, and a cured film. It is preferable that it is a compound which improves the adhesiveness of. Specifically, a known silane coupling agent or the like is also effective. A silane coupling agent having an ethylenically unsaturated bond is preferred.
Examples of the silane coupling agent include γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-glycidoxypropyltrialkoxysilane, γ-glycidoxypropyl dialkoxysilane, and γ-methacryloxypropyl. Trialkoxysilane, γ-methacryloxypropyl dialkoxysilane, γ-chloropropyltrialkoxysilane, γ-mercaptopropyltrialkoxysilane, β- (3,4-epoxycyclohexyl) ethyltrialkoxysilane, vinyltrialkoxysilane It is done. Of these, γ-methacryloxypropyltrialkoxysilane, γ-acryloxypropyltrialkoxysilane, vinyltrialkoxysilane, and γ-glycidoxypropyltriacoxysilane are more preferable. These can be used alone or in combination of two or more.
Examples of commercially available products include KBM-403 and KBM-5103 manufactured by Shin-Etsu Chemical Co., Ltd.

The content of the alkoxysilane compound in the photosensitive composition of the present invention is preferably 0.1 to 30% by mass, more preferably 2 to 20% by mass, and more preferably 2 to 15% by mass with respect to the total solid content of the photosensitive composition. % Is more preferable. Only one type of alkoxysilane compound may be included, or two or more types may be included. When two or more types are included, the total amount is preferably within the above range.

Component N: Blocked isocyanate compound The photosensitive composition of the present invention may contain a blocked isocyanate compound as Component N. The blocked isocyanate compound is not particularly limited as long as it is a compound having a blocked isocyanate group, but is preferably a compound having two or more blocked isocyanate groups in one molecule from the viewpoint of curability. The upper limit of the number of blocked isocyanate groups is not particularly defined, but is preferably 6 or less.
Further, the skeleton of the blocked isocyanate compound is not particularly limited and may be any as long as it has two isocyanate groups in one molecule, and may be aliphatic, alicyclic or aromatic. Polyisocyanate may be used. For example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, isophorone diisocyanate, 1,6-hexamethylene diisocyanate, 1,3-trimethylene diisocyanate, 1,4-tetramethylene diisocyanate, 2,2,4- Trimethylhexamethylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, 1,9-nonamethylene diisocyanate, 1,10-decamethylene diisocyanate, 1,4-cyclohexane diisocyanate, 2,2'-diethyl ether diisocyanate, diphenylmethane 4,4'-diisocyanate, o-xylene diisocyanate, m-xylene diisocyanate, p-xylene diisocyanate, methylene bis (cyclohexyl isocyanate) , Cyclohexane-1,3-dimethylene diisocyanate, cyclohexane-1,4-dimethylene diisocyanate, 1,5-naphthalene diisocyanate, p-phenylene diisocyanate, 3,3′-methylene ditolylene-4,4′-diisocyanate, 4, , 4'-diphenyl ether diisocyanate, tetrachlorophenylene diisocyanate, norbornane diisocyanate, hydrogenated 1,3-xylylene diisocyanate, hydrogenated 1,4-xylylene diisocyanate and the like, and prepolymer type skeleton derived from these compounds These compounds can be suitably used. Among these, tolylene diisocyanate (TDI), diphenylmethane diisocyanate (MDI), hexamethylene diisocyanate (HDI), and isophorone diisocyanate (IPDI) are particularly preferable.

Examples of the matrix structure of the blocked isocyanate compound in the composition of the present invention include biuret type, isocyanurate type, adduct type, and bifunctional prepolymer type.
Examples of the blocking agent that forms the block structure of the blocked isocyanate compound include oxime compounds, lactam compounds, phenol compounds, alcohol compounds, amine compounds, active methylene compounds, pyrazole compounds, mercaptan compounds, imidazole compounds, and imide compounds. be able to. Among these, a blocking agent selected from oxime compounds, lactam compounds, phenol compounds, alcohol compounds, amine compounds, active methylene compounds, and pyrazole compounds is particularly preferable.

The blocked isocyanate compound that can be used in the composition of the present invention is commercially available. For example, Coronate AP stable M, Coronate 2503, 2515, 2507, 2513, 2555, Millionate MS-50 (above, Nippon Polyurethane Industry Takenate B-830, B-815N, B-820NSU, B-842N, B-84N, B-870N, B-874N, B-882N (above, manufactured by Mitsui Chemicals), Duranate 17B-60P, 17B-60PX, 17B-60P, TPA-B80X, TPA-B80E, MF-B60X, MF-B60B, MF-K60X, MF-K60B, E402-B80B, SBN-70D, SBB-70P, K6000 ( Asahi Kasei Chemicals), Death Mod BL1100, BL1265 MPA / X, BL3575 / 1, BL3272MPA, BL3370MPA, BL3475BA / SN, BL5375MPA, VPLS2078 / 2, BL4265SN, PL340, PL350, Sumijoule BL3175 (above, manufactured by Sumika Bayer Urethane Co., Ltd.) and the like are preferable Can be used.

When the photosensitive composition of the present invention contains a blocked isocyanate compound, it is preferably contained in the range of 0.1 to 20% by mass, and in the range of 0.5 to 10% by mass of the total solid content of the composition. Is more preferable, and the content is more preferably in the range of 1 to 5% by mass.
The photosensitive composition of the present invention may contain only one type of blocked isocyanate compound, or may contain two or more types. When two or more types are included, the total amount is preferably within the above range.

(Other ingredients)
<Compound having epoxy group, compound having oxetanyl group>
The photosensitive composition of the present invention preferably contains at least one selected from the group consisting of a compound having an epoxy group, a compound having an oxetanyl group, a blocked isocyanate compound, and a polyfunctional mercapto compound. It is excellent in the hardness of the obtained cured film as it is the said aspect.

[Compound having an epoxy group]
The photosensitive composition of the present invention may contain a compound having an epoxy group. The compound having an epoxy group may have one epoxy group in the molecule, but two or more are preferable.

Specific examples of compounds having two or more epoxy groups in the molecule include bisphenol A type epoxy resins, bisphenol F type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, aliphatic epoxy resins, and the like. Can do.

These are available as commercial products. For example, as bisphenol A type epoxy resin, JER827, JER828, JER834, JER1001, JER1002, JER1003, JER1055, JER1007, JER1009, JER1010 (above, manufactured by Japan Epoxy Resin Co., Ltd.), EPICLON860, EPICLON1050, EPICLON1051, EPICLON1051, EPICLON1051 And bisphenol F-type epoxy resins such as JER806, JER807, JER4004, JER4005, JER4007, JER4010 (above, Japan Epoxy Resin Co., Ltd.), EPICLON830, EPICLON835 (above, DIC Co., Ltd.), LCE-21, RE-602S (above, Nippon Kayaku Co., Ltd.) As the phenol novolac type epoxy resin, JER152, JER154, JER157S70, JER157S65 (manufactured by Japan Epoxy Resin Co., Ltd.), EPICLON N-740, EPICLON N-740, EPICLON N-770, EPICLON N-775 (or higher) As cresol novolac type epoxy resins, EPICLON N-660, EPICLON N-665, EPICLON N-670, EPICLON N-673, EPICLON N-680, EPICLON N-690, EPICLON N-695 (above, manufactured by DIC Corporation), EOCN-1020 (above, manufactured by Nippon Kayaku Co., Ltd.), etc., and ADEKA RESIN EP-408 as an aliphatic epoxy resin S, EP-4085S, EP-4088S (above, manufactured by ADEKA Corporation), Celoxide 2021P, Celoxide 2081, Celoxide 2083, Celoxide 2085, EHPE3150, EPOLEAD PB 3600, PB 4700 (above, Daicel Chemical Industries, Ltd.) ))). In addition, ADEKA RESIN EP-4000S, EP-4003S, EP-4010S, EP-4010S, EP-4011S (above, manufactured by ADEKA Corporation), NC-2000, NC-3000, NC-7300, XD-1000, EPPN-501, EPPN-502 (above, manufactured by ADEKA Corporation) and the like.
Also, urethane compounds having an ethylene oxide skeleton described in JP-B-58-49860, JP-B-56-17654, JP-B-62-39417, and JP-B-62-39418 can be suitably used. The contents of which are incorporated herein by reference.

When the photosensitive composition of the present invention contains a compound having an epoxy group, it is preferably contained in the range of 0.1 to 20% by mass, and in the range of 0.5 to 10% by mass of the total solid content of the composition. More preferably, it is more preferably contained in the range of 1 to 5% by mass.
The photosensitive composition of the present invention may contain only one type of compound having an epoxy group, or may contain two or more types. When two or more types are included, the total amount is preferably within the above range.

[Compound having oxetanyl group]
The photosensitive composition of the present invention may contain a compound having an oxetanyl group. The compound having an oxetanyl group may have only one oxetanyl group in the molecule, but preferably has two or more.

As specific examples of the compound having an oxetanyl group, Aron oxetane OXT-121, OXT-221, OX-SQ, and PNOX (above, manufactured by Toagosei Co., Ltd.) can be used.
Moreover, it is preferable to use the compound containing an oxetanyl group individually or in mixture with the compound containing an epoxy group.

When the photosensitive composition of the present invention contains a compound having an oxetanyl group, it is preferably contained in the range of 0.1 to 20% by mass, and in the range of 0.5 to 10% by mass of the total solid content of the composition. More preferably, it is more preferably contained in the range of 1 to 5% by mass.
The photosensitive composition of the present invention may contain only one type of compound having an oxetanyl group, or may contain two or more types. When two or more types are included, the total amount is preferably within the above range.

The photosensitive composition of the present invention may contain other compounds (for example, an alkoxymethyl group-containing compound) other than those described above without departing from the spirit of the present invention. Examples of the alkoxymethyl group-containing compound include those described in paragraphs 0192 to 0194 of JP2011-221494A.

<Surfactant>
The photosensitive composition of the present invention may contain a surfactant as another component.
As the surfactant, any of anionic, cationic, nonionic, or amphoteric surfactants can be used, but a preferred surfactant is a nonionic surfactant. As the surfactant, nonionic surfactants are preferable, and fluorine-based surfactants are more preferable.
As the surfactant that can be used in the present invention, for example, commercially available products such as MegaFuck F142D, F172, F173, F176, F177, F183, F479, F482, F554, and F780 are commercially available. F781, F781-F, R30, R08, F-472SF, BL20, R-61, R-90 (manufactured by DIC Corporation), Florard FC-135, FC-170C, FC-430, FC-431, Novec FC-4430 (manufactured by Sumitomo 3M Limited), Asahi Guard AG7105, 7000, 950, 7600, Surflon S-112, S-113, S-131, S -141, S-145, S-382, SC-101, SC-102, SC-103, SC-104, SC-1 05, SC-106 (manufactured by Asahi Glass Co., Ltd.), F-top EF351, 352, 801, 802 (manufactured by Mitsubishi Materials Denka Kasei), and Footgent 250 (manufactured by Neos Co., Ltd.). . In addition to the above, KP (manufactured by Shin-Etsu Chemical Co., Ltd.), Polyflow (manufactured by Kyoeisha Chemical Co., Ltd.), F-Top (manufactured by Mitsubishi Materials Denka Kasei Co., Ltd.), MegaFuck (manufactured by DIC Corporation) , FLORARD (manufactured by Sumitomo 3M Co., Ltd.), Asahi Guard, Surflon (manufactured by Asahi Glass Co., Ltd.), PolyFox (manufactured by OMNOVA), and the like.

In addition, the surfactant includes a structural unit A and a structural unit B represented by the following formula W, and has a polystyrene-reduced weight average molecular weight (Mw) of 1,000 measured by gel permeation chromatography using tetrahydrofuran as a solvent. A copolymer having a molecular weight of 10,000 or less can be cited as a preferred example.

In Formula W, R ^W1 and R ^W3 each independently represent a hydrogen atom or a methyl group, R ^W2 represents a linear alkylene group having 1 to 4 carbon atoms, and R ^W4 represents a hydrogen atom or 1 to 4 carbon atoms. The following alkyl groups are represented, L ^W represents an alkylene group having 3 to 6 carbon atoms, p and q are mass percentages representing a polymerization ratio, and p represents a numerical value of 10% by mass to 80% by mass, q represents a numerical value of 20% by mass to 90% by mass, r represents an integer of 1 to 18 and s represents an integer of 1 to 10.

L ^W is preferably a branched alkylene group represented by the following formula W-2. R ^W5 in Formula W-2 represents an alkyl group having 1 to 4 carbon atoms, and is preferably an alkyl group having 1 to 3 carbon atoms in terms of compatibility and wettability to the coated surface. More preferred is an alkyl group of 3.
The sum (p + q) of p and q in Formula W is preferably p + q = 100, that is, 100% by mass.
The weight average molecular weight (Mw) of the copolymer is more preferably from 1,500 to 5,000.

The content of the surfactant in the photosensitive composition of the present invention is preferably 0.001 to 5.0 parts by mass with respect to 100 parts by mass in the total solid content of the photosensitive composition. More preferred is 01 to 2.0 parts by mass.
Only one type of surfactant may be included, or two or more types of surfactants may be included. When two or more types are included, the total amount is preferably within the above range.

<Antioxidant>
The photosensitive composition of this invention may contain antioxidant other than said component. The antioxidant is a compound other than the component K described above. As an antioxidant, a well-known antioxidant can be contained. By adding an antioxidant, there is an advantage that coloring of the cured film can be prevented, or a decrease in film thickness due to decomposition can be reduced, and heat resistant transparency is excellent.
Examples of such antioxidants include phosphorus antioxidants, amides, hydrazides, hindered phenol antioxidants, ascorbic acids, zinc sulfate, sugars, nitrites, sulfites, thiosulfates, hydroxyls. An amine derivative etc. can be mentioned. Among these, hindered phenolic antioxidants and phosphorus antioxidants are particularly preferable from the viewpoints of coloring of the cured film and reduction in film thickness, and hindered phenolic antioxidants are most preferable. These may be used individually by 1 type and may mix 2 or more types.
Preferred examples of commercially available products include ADK STAB AO-60, ADK STAB AO-80 (above, manufactured by ADEKA Corporation), and Irganox 1098 (above, manufactured by BASF).
The content of the antioxidant is not particularly limited, but is preferably 0.1 to 10% by mass, and preferably 0.2 to 5% by mass with respect to the total solid content of the photosensitive composition. More preferably, it is 0.5 to 4% by mass.

<Binder polymer>
The photosensitive composition of the present invention may contain a binder polymer from the viewpoint of resolution and film property improvement.
There is no restriction | limiting in particular as a binder polymer, Although a well-known thing can be used, It is preferable to use a linear organic polymer. As such a linear organic polymer, a well-known thing can be used arbitrarily. Preferably, a linear organic polymer that is soluble or swellable in water or weak alkaline water is selected to enable water development or weak alkaline water development. The linear organic polymer is selected and used not only as a film forming agent but also according to the use as water, weak alkaline water or an organic solvent developer. For example, when a water-soluble organic polymer is used, water development becomes possible. Examples of such linear organic polymers include radical polymers having a carboxylic acid group in the side chain, such as JP-A-59-44615, JP-B-54-34327, JP-B-58-12777, and JP-B-sho. No. 54-25957, JP-A-54-92723, JP-A-59-53836, JP-A-59-71048, ie, a monomer having a carboxy group alone or Copolymerized resin, acid anhydride monomer alone or copolymerized, acid anhydride unit hydrolyzed, half esterified or half amidated, epoxy resin unsaturated monocarboxylic acid and acid anhydride Examples include modified epoxy acrylate. Examples of the monomer having a carboxy group include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, and 4-carboxystyrene. Examples of the monomer having an acid anhydride include maleic anhydride. It is done.
Similarly, there is an acidic cellulose derivative having a carboxylic acid group in the side chain. In addition, those obtained by adding a cyclic acid anhydride to a polymer having a hydroxyl group are useful.
The content of the binder polymer in the photosensitive composition of the present invention is not particularly limited, but is preferably 0 to 25% by mass, and preferably 0 to 10% by mass with respect to the total solid content of the photosensitive composition. Is more preferable, and 0 to 2% by mass is more preferable.

Further, the content of the polymer component having a weight average molecular weight exceeding 10,000 in the photosensitive composition of the present invention is 0% by mass with respect to the total solid content of the photosensitive composition from the viewpoint of the hardness of the cured film. It is preferably 25% by mass or less, more preferably 0% by mass or more and 10% by mass or less, still more preferably 0% by mass or more and 2% by mass or less, and particularly no polymer component is contained at all. preferable.

<Other ingredients>
In addition to those described above, other components such as a plasticizer, a thermal acid generator, and an acid multiplier can be added to the photosensitive composition of the present invention as necessary. As these components, for example, those described in JP2009-98616A, JP2009-244801A, and other known ones can be used. In addition, various ultraviolet absorbers described in “New Development of Polymer Additives (Nikkan Kogyo Shimbun Co., Ltd.)”, metal deactivators and the like may be added to the photosensitive composition of the present invention.

<Composition of photosensitive composition>
The photosensitive composition of the present invention contains 6 to 38% by mass of component A, 30 to 80% by mass of component B, and 0% of component C with respect to the total organic solid content of the photosensitive composition. 0.5 to 30% by mass, and component K is preferably contained in an amount of 0.05 to 0.5% by mass.

(Curing film, cured product and method for producing the same)
The cured product of the present invention is a cured product obtained by curing the photosensitive composition of the present invention. The cured product is preferably a cured film. Moreover, it is preferable that the cured film of this invention is a cured film obtained by the manufacturing method of the cured film of this invention.
The method for producing a cured film of the present invention is not particularly limited as long as it is a method for producing a cured film by curing the photosensitive composition of the present invention, but may include the following steps 1 to 5 in this order. preferable.
Step 1: Application step of applying the photosensitive composition of the present invention onto a substrate Step 2: Solvent removal step of removing the solvent from the applied photosensitive composition Step 3: At least the photosensitive composition from which the solvent has been removed An exposure step in which a part is exposed with actinic rays Step 4: a development step in which the exposed photosensitive composition is developed with an aqueous developer Step 5: a heat treatment step in which the developed photosensitive composition is heat treated. More preferably, the manufacturing method further includes the following step 4 ′ between step 4 and step 5.
Step 4 ′: a post-exposure step of further irradiating the developed photosensitive composition with light

In the said application | coating process, it is preferable to apply | coat the photosensitive composition of this invention on a board | substrate, and to make a wet film | membrane containing a solvent. Before applying the photosensitive composition to the substrate, the substrate can be cleaned such as alkali cleaning or plasma cleaning. Furthermore, the substrate surface can be treated with hexamethyldisilazane or the like after cleaning the substrate. By performing this treatment, the adhesiveness of the photosensitive composition to the substrate tends to be improved.
Examples of the substrate include inorganic substrates, resins, and resin composite materials.
Examples of the inorganic substrate include glass, quartz, silicon, silicon nitride, and a composite substrate obtained by depositing molybdenum, titanium, aluminum, copper, or the like on such a substrate.
The resins include polybutylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, polybutylene naphthalate, polystyrene, polycarbonate, polysulfone, polyethersulfone, polyarylate, allyl diglycol carbonate, polyamide, polyimide, polyamideimide, polyetherimide, poly Fluorine resins such as benzazole, polyphenylene sulfide, polycycloolefin, norbornene resin, polychlorotrifluoroethylene, liquid crystal polymer, acrylic resin, epoxy resin, silicone resin, ionomer resin, cyanate resin, crosslinked fumaric acid diester, cyclic polyolefin, aromatic From synthetic resins such as aromatic ethers, maleimide-olefin copolymers, cellulose and episulfide resins. Board, and the like.
These substrates are rarely used in the above-described form, and usually a multilayer laminated structure such as a TFT element is formed depending on the form of the final product.
In the case of an on-cell touch panel or the like, the photosensitive composition of the present invention can also be applied on an LCD cell or OLED cell that has been once completed as a panel.

Since the photosensitive composition of the present invention has good adhesion to a metal film or metal oxide formed by sputtering, the substrate preferably contains a metal film formed by sputtering. The metal is preferably titanium, copper, aluminum, indium, tin, manganese, nickel, cobalt, molybdenum, tungsten, chromium, silver, neodymium, and oxides or alloys thereof, molybdenum, titanium, aluminum, copper And alloys thereof are more preferred. In addition, a metal and a metal oxide may be used individually by 1 type, or may use multiple types together.

The coating method on the substrate is not particularly limited. For example, a method such as an inkjet method, a slit coating method, a spray method, a roll coating method, a spin coating method, a casting coating method, a slit and spin method, or a printing method may be used. it can.

In the solvent removal step, it is preferable to remove the solvent from the applied film by vacuum (vacuum) and / or heating to form a dry coating film on the substrate. The heating conditions for the solvent removal step are preferably 70 to 130 ° C. and about 30 to 300 seconds. Moreover, in the said solvent removal process, it is not necessary to remove the solvent in a photosensitive composition completely, and at least one part should just be removed.
In addition, the said application | coating process and the said solvent removal process may be performed in this order, may be performed simultaneously, or may be repeated alternately. For example, the solvent removal step may be performed after the inkjet coating in the coating step is completed, or the solvent is heated while the photosensitive composition is discharged by the inkjet coating method in the coating step. Removal may be performed.

The exposure step generates a polymerization initiating species from a photopolymerization initiator using actinic rays, polymerizes a compound having an ethylenically unsaturated group, and cures at least a part of the photosensitive composition from which the solvent has been removed. It is a process to do.
In the exposure step, it is preferable to irradiate the obtained coating film with an actinic ray having a wavelength of 300 nm to 450 nm in a predetermined pattern.
As an exposure light source that can be used in the above exposure process, a low pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a chemical lamp, an LED light source, an excimer laser generator, and the like can be used. ) And actinic rays having a wavelength of 300 nm to 450 nm, such as g-line (436 nm), can be preferably used. Moreover, irradiation light can also be adjusted through spectral filters, such as a long wavelength cut filter, a short wavelength cut filter, and a band pass filter, as needed. The exposure amount is preferably 1 to 500 mJ / cm ² .
As the exposure apparatus, various types of exposure machines such as a mirror projection aligner, a stepper, a scanner, a proximity, a contact, a microlens array, a lens scanner, and a laser exposure can be used.
The exposure in the exposure step is preferably performed in a state where oxygen is blocked from the viewpoint of curing acceleration. Examples of means for blocking oxygen include exposure in a nitrogen atmosphere and exposure with an oxygen blocking film.
Moreover, the exposure in the said exposure process should just be performed to at least one part of the photosensitive composition from which the solvent was removed, for example, may be whole surface exposure or pattern exposure.
Further, after the exposure step, post-exposure heat treatment (Post Exposure Bake (hereinafter also referred to as “PEB”)) can be performed. The temperature for performing PEB is preferably 30 ° C. or higher and 130 ° C. or lower, more preferably 40 ° C. or higher and 110 ° C. or lower, and particularly preferably 50 ° C. or higher and 100 ° C. or lower.
The heating method is not particularly limited, and a known method can be used. For example, a hot plate, an oven, an infrared heater, etc. are mentioned.
The heating time is preferably about 1 to 30 minutes in the case of a hot plate, and about 20 to 120 minutes in other cases. If it is the said temperature range, it can suppress and damage to a board | substrate and an apparatus, and can heat.

In the development step, the uncured photosensitive composition is developed and removed using an aqueous developer to form a negative image. The developer used in the development step is preferably an alkaline aqueous developer.
The developer used in the development step preferably contains a basic compound. Examples of basic compounds include alkali metal hydroxides such as lithium hydroxide, sodium hydroxide, and potassium hydroxide; alkali metal carbonates such as sodium carbonate, potassium carbonate, and cesium carbonate; sodium bicarbonate, potassium bicarbonate Alkali metal bicarbonates such as: tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, diethyldimethylammonium hydroxide, and other tetraalkylammonium hydroxides: Alkyl) trialkylammonium hydroxides; silicates such as sodium silicate and sodium metasilicate; ethylamine, propylamine, diethylamine, triethylammonium Alkylamines such as diamine; Alcoholamines such as dimethylethanolamine and triethanolamine; 1,8-diazabicyclo- [5.4.0] -7-undecene, 1,5-diazabicyclo- [4.3.0 ] Cycloaliphatic amines such as 5-nonene can be used.
Of these, sodium hydroxide, potassium hydroxide, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, and choline (2-hydroxyethyltrimethylammonium hydroxide) are preferable.
An aqueous solution obtained by adding an appropriate amount of a water-soluble organic solvent such as methanol or ethanol or a surfactant to the alkaline aqueous solution can also be used as a developer.
As a preferred developing solution, a 0.4 to 2.5% by mass aqueous solution of tetramethylammonium hydroxide can be mentioned.
The pH of the developer is preferably 10.0 to 14.0.
The development time is preferably 30 to 500 seconds, and the development method may be any of a liquid piling method (paddle method), a shower method, a dipping method, and the like.
A rinsing step can also be performed after development. In the rinsing step, the developed substrate and the development residue are removed by washing the developed substrate with pure water or the like. A known method can be used as the rinsing method. For example, a shower rinse, a dip rinse, etc. can be mentioned.
For pattern exposure and development, a known method or a known developer can be used. For example, the pattern exposure method and the development method described in JP 2011-186398 A and JP 2013-83937 A can be suitably used.

It is preferable that the manufacturing method of the cured film of this invention includes the process (post-baking) of heat-processing the developed photosensitive composition after the said image development process. By performing the heat treatment after developing the photosensitive composition of the present invention, a cured film having higher strength can be obtained.
As heat processing temperature in the said heat processing process, 180 degrees C or less is preferable, 150 degrees C or less is more preferable, and 130 degrees C or less is still more preferable. As a lower limit, 80 degreeC or more is preferable and 90 degreeC or more is more preferable. The heating method is not particularly limited, and a known method can be used. For example, a hot plate, an oven, an infrared heater, etc. are mentioned.
The heating time is preferably about 1 to 30 minutes in the case of a hot plate, and about 20 to 120 minutes in other cases. If it is the said temperature range, it can harden | cure, suppressing the damage to a board | substrate and an apparatus.
In addition, the heat treatment step can be performed after baking at a relatively low temperature before the heat treatment step (post-bake) (addition of a middle bake step). When performing middle baking, it is preferable to heat at a temperature of 100 ° C. or higher after heating at 90 to 150 ° C. for 1 to 60 minutes. Further, middle baking and post baking can be heated in three or more stages. The shape of the pattern can be adjusted by devising such middle baking and post baking. These heating methods can use well-known heating methods, such as a hotplate, oven, and an infrared heater.

Moreover, it is preferable to include the post-exposure process which irradiates light further to the developed photosensitive composition from a viewpoint of film | membrane hardness improvement after a image development process and before a heat processing process.
In the post-exposure step, it is preferable to expose the entire surface of the developed photosensitive composition. By post-baking after the post-exposure, it is possible to generate an initiation species from the photopolymerization initiator remaining in the exposed portion and to function as a catalyst for accelerating the crosslinking step, and to accelerate the film curing reaction. In the post-exposure step, it is preferable to perform energy exposure of about 50 to 3,000 mJ / cm ² with a mercury lamp or an LED lamp.

(Cured film)
The cured film of the present invention is a cured film obtained by curing the photosensitive composition of the present invention.
The cured film of the present invention can be suitably used as an interlayer insulating film (insulating film) or an overcoat film (protective film), more preferably used as an overcoat film for a touch panel, and as an overcoat film for an on-cell structure touch panel. Further preferably used. The on-cell touch panel is synonymous with an on-cell touch panel display device described later. Moreover, it is preferable that the cured film of this invention is a cured film obtained by the manufacturing method of the cured film of this invention.
The photosensitive composition of the present invention can provide a cured film having sufficient hardness even when cured at a low temperature. For example, a cured film having a pencil hardness of 4H or more at a load of 750 g measured according to JIS K5600: 1999 is obtained. Since the protective film formed by curing the photosensitive composition of the present invention is excellent in cured film properties, it is useful for applications in organic EL display devices and liquid crystal display devices.

Since the photosensitive composition of the present invention is excellent in curability and cured film properties, a cured product or resist pattern obtained by curing the photosensitive composition of the present invention is used as a partition as a structural member of a device for MEMS (Micro Electro Mechanical Systems). Or used as part of a mechanical drive component. Examples of such MEMS devices include parts such as SAW filters, BAW filters, gyro sensors, display micro shutters, image sensors, electronic paper, inkjet heads, biochips, sealants, and the like. More specific examples are exemplified in JP-T-2007-522531, JP-A-2008-250200, JP-A-2009-263544, and the like.

Since the photosensitive composition of the present invention is excellent in flatness and transparency, for example, the bank layer (16) and the planarization film (57) described in FIG. 2 of JP-A-2011-107476, JP-A-2010- The partition wall (12) and the planarization film (102) described in FIG. 4A of 9793 gazette, the bank layer (221) and the third interlayer insulating film (216b) described in FIG. 10 of JP 2010-27591 A ), The second interlayer insulating film (125) and the third interlayer insulating film (126) described in FIG. 4A of JP-A-2009-128577, and the flatness described in FIG. 3 of JP-A-2010-182638. It can also be used to form a chemical film (12), a pixel isolation insulating film (14), and the like. In addition, spacers for keeping the thickness of the liquid crystal layer in the liquid crystal display device constant, color filters for the liquid crystal display device, color filter protective films, facsimiles, electronic copying machines, imaging of on-chip color filters such as solid-state image sensors It can also be suitably used for a microlens of an optical system or an optical fiber connector.

(Organic EL display device)
The organic EL display device of the present invention has the cured film of the present invention.
The organic EL display device of the present invention is not particularly limited except that it has a flattening film and an interlayer insulating film formed using the photosensitive composition of the present invention, and various known organic EL devices having various structures. A display device and a liquid crystal display device can be given.
For example, specific examples of TFT (Thin-Film Transistor) included in the organic EL display device of the present invention include amorphous silicon-TFT, low-temperature polysilicon-TFT, oxide semiconductor TFT, and the like. Since the cured film of the present invention is excellent in electrical characteristics, it can be preferably used in combination with these TFTs.
FIG. 1 is a conceptual diagram of an example of an organic EL display device. A schematic cross-sectional view of a substrate in a bottom emission type organic EL display device is shown, and a planarizing film 4 is provided.
A bottom gate type TFT 1 is formed on a glass substrate 6, and an insulating film 3 made of Si ₃ N ₄ is formed so as to cover the TFT 1. A contact hole (not shown) is formed in the insulating film 3, and then a wiring 2 (height: 1.0 μm) connected to the TFT 1 through the contact hole is formed on the insulating film 3. The wiring 2 is used to connect the TFT 1 with an organic EL element formed between the TFTs 1 or in a later process.
Further, in order to flatten the unevenness due to the formation of the wiring 2, a planarizing film 4 is formed on the insulating film 3 in a state where the unevenness due to the wiring 2 is embedded.
On the planarizing film 4, a bottom emission type organic EL element is formed. That is, the first electrode 5 made of ITO is formed on the planarizing film 4 so as to be connected to the wiring 2 through the contact hole 7. The first electrode 5 corresponds to the anode of the organic EL element.
An insulating film 8 having a shape covering the periphery of the first electrode 5 is formed. By providing the insulating film 8, a short circuit between the first electrode 5 and the second electrode formed in the subsequent process is prevented. can do.
Further, although not shown in FIG. 1, a hole transport layer, an organic light-emitting layer, and an electron transport layer are sequentially deposited through a desired pattern mask, and then a first layer made of Al is formed on the entire surface above the substrate. An active matrix type in which two electrodes are formed, sealed by bonding using a sealing glass plate and an ultraviolet curable epoxy resin, and TFTs 1 for driving the organic EL elements are connected. An organic EL display device is obtained.

(Liquid crystal display device)
The liquid crystal display device of the present invention has the cured film of the present invention.
The liquid crystal display device of the present invention is not particularly limited except that it has an overcoat film (protective film) formed using the photosensitive composition of the present invention, a planarizing film and an interlayer insulating film, and has various structures. The well-known liquid crystal display device which takes can be mentioned.
For example, specific examples of TFT (Thin-Film Transistor) included in the liquid crystal display device of the present invention include amorphous silicon-TFT, low-temperature polysilicon-TFT, oxide semiconductor TFT (for example, indium gallium zinc oxide, so-called IGZO) and the like. Since the cured film of the present invention is excellent in electrical characteristics, it can be preferably used in combination with these TFTs.
Liquid crystal driving methods that can be taken by the liquid crystal display device of the present invention include a TN (Twisted Nematic) method, a VA (Virtual Alignment) method, an IPS (In-Place-Switching) method, an FFS (Fringe Field Switching) method, and an OCB (OCB) method. (Optically Compensated Bend) method.
In the panel configuration, the cured film of the present invention can also be used in a COA (Color Filter on Array) type liquid crystal display device. For example, the organic insulating film (115) disclosed in JP-A-2005-284291 and JP-A-2005 -346054 can be used as the organic insulating film (212). Specific examples of the alignment method of the liquid crystal alignment film that the liquid crystal display device of the present invention can take include a rubbing alignment method and a photo alignment method. Further, the polymer orientation may be supported by a PSA (Polymer Sustained Alignment) technique described in JP-A Nos. 2003-149647 and 2011-257734.
Moreover, the photosensitive composition of this invention and the cured film of this invention are not limited to the said use, It can be used for various uses. For example, in addition to a planarization film and an interlayer insulating film, it is suitable for a protective film, a spacer for keeping the thickness of a liquid crystal layer in a liquid crystal display device constant, a microlens provided on a color filter in a solid-state imaging device, Can be used.

FIG. 2 is a conceptual cross-sectional view showing an example of the active matrix type liquid crystal display device 10. The color liquid crystal display device 10 is a liquid crystal panel having a backlight unit 12 on the back surface, and the liquid crystal panel includes all pixels disposed between two

glass substrates

14 and 15 having a polarizing film attached thereto. The elements of the TFT 16 corresponding to are arranged. Each element formed on the glass substrate is wired with an ITO transparent electrode 19 that forms a pixel electrode through a contact hole 18 formed in the cured film 17. On the ITO transparent electrode 19, an RGB color filter 22 in which a liquid crystal 20 layer and a black matrix are arranged is provided.
The light source of the backlight is not particularly limited, and a known light source can be used. For example, white LED, multicolor LED such as blue, red, and green, fluorescent lamp (cold cathode tube), organic EL, and the like can be mentioned.
Further, the liquid crystal display device may be a 3D (stereoscopic) type or a touch panel type (touch panel display device). Further, it can be made flexible, and used as the second interlayer insulating film (48) described in JP2011-145686A and the interlayer insulating film (520) described in JP2009-258758A. Can do.

(Touch panel and touch panel display device)
The touch panel of the present invention is a touch panel in which all or part of the insulating layer and / or protective layer is made of a cured product of the photosensitive composition of the present invention. Moreover, it is preferable that the touch panel of this invention has a transparent substrate, an electrode, an insulating layer, and / or a protective layer at least.
The touch panel display device of the present invention is preferably a touch panel display device having the touch panel of the present invention. As the touch panel of the present invention, any of known methods such as a resistive film method, a capacitance method, an ultrasonic method, and an electromagnetic induction method may be used. Among these, the electrostatic capacity method is preferable.
Examples of the capacitive touch panel include those disclosed in JP 2010-28115 A and those disclosed in International Publication No. 2012/057165.
As a touch panel display device, a so-called in-cell type (for example, FIG. 5, FIG. 6, FIG. 7 and FIG. 8 in Japanese Patent Publication No. 2012-517051), a so-called on-cell type (for example, FIG. 14, International Publication No. 2012/141148, FIG. 2 (b)), OGS type, TOL type, and other configurations (for example, FIG. 6 of JP2013-164871A).
FIG. 3 is a conceptual diagram illustrating an example of a touch panel display device.
For example, the cured film of the present invention is preferably applied to the protective film between the layers in FIG. 3, and is also preferably applied to an interlayer insulating film that separates the detection electrodes of the touch panel. In addition, as a detection electrode of a touch panel, it is preferable that they are silver, copper, aluminum, titanium, molybdenum, and these alloys.
In FIG. 3, reference numeral 110 denotes a pixel substrate, 140 denotes a liquid crystal layer, 120 denotes a counter substrate, and 130 denotes a sensor unit. The pixel substrate 110 includes a polarizing plate 111, a transparent substrate 112, a common electrode 113, an insulating layer 114, a pixel electrode 115, and an alignment film 116 in order from the lower side of FIG. The counter substrate 120 includes an alignment film 121, a color filter 122, and a transparent substrate 123 in order from the lower side of FIG. The sensor unit 130 includes a retardation film 124, an adhesive layer 126, and a polarizing plate 127. In FIG. 3, reference numeral 125 denotes a sensor detection electrode. The cured film of the present invention includes an insulating layer (114) (also referred to as an interlayer insulating film) in the pixel substrate portion, various protective films (not shown), various protective films (not shown) in the pixel substrate portion, and a counter substrate portion. Can be used for various protective films (not shown), various protective films (not shown) for the sensor portion, and the like.

Furthermore, a statically driven liquid crystal display device can display a pattern with high designability by applying the present invention. As an example, the present invention can be applied as an insulating film of a polymer network type liquid crystal as described in JP-A-2001-125086.

FIG. 4 is a conceptual diagram of the configuration of another example of the touch panel display device.
A lower display panel 200 corresponding to a thin film transistor display panel provided with a thin film transistor (TFT) 440, and a color filter display panel provided with a plurality of color filters 330 on the surface facing the lower display panel 200 and facing the lower display panel 200. And the liquid crystal layer 400 formed between the lower display panel 200 and the upper display panel 300. The liquid crystal layer 400 includes liquid crystal molecules (not shown).

The lower display panel 200 is disposed on the first insulating substrate 210, the thin film transistor (TFT) disposed on the first insulating substrate 210, the insulating film 280 formed on the upper surface of the thin film transistor (TFT), and the insulating film 280. A pixel electrode 290 is included. The thin film transistor (TFT) may include a gate electrode 220, a gate insulating film 240 covering the gate electrode 220, a semiconductor layer 250, ohmic contact layers 260 and 262, a source electrode 270, and a drain electrode 272. A contact hole 282 is formed in the insulating film 280 so that the drain electrode 272 of the thin film transistor (TFT) is exposed.

The upper display panel 300 is disposed on one surface of the second insulating substrate 310, on the light shielding members 320 arranged in a matrix, the alignment film 350 disposed on the second insulating substrate 310, and the alignment film 350. A color filter 330 to be disposed, and a common electrode 370 disposed on the color filter 330 and corresponding to the pixel electrode 290 of the lower display panel 200 to apply a voltage to the liquid crystal layer 400 are included.

4, a sensing electrode 410, an insulating film 420, a driving electrode 430, and a protective film 280 are disposed on the other surface of the second insulating substrate 310. In the touch panel display device shown in FIG. As described above, in the manufacture of the liquid crystal display device shown in FIG. 4, when the upper display panel 300 is formed, the sensing electrode 410, the insulating film 420, the drive electrode 430, and the like, which are constituent elements of the touch screen, are formed together. be able to. In particular, a cured film obtained by curing the photosensitive composition of the present invention can be suitably used for the insulating film 280 and the insulating film 420.

Hereinafter, the present invention will be described more specifically with reference to examples. The materials, amounts used, ratios, processing details, processing procedures, and the like shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. Unless otherwise specified, “part” and “%” are based on mass.

(Component A)
A-1: Compound having a structure represented by the following formula A-1 A-2: Compound having a structure represented by the following formula A-2 A-3: Compound having a structure represented by the following formula A-3 A ′ -1: Aronix M-5300 (manufactured by Toagosei Co., Ltd.), monofunctional

(Component B)
B-1: Dipentaerythritol hexaacrylate (DPHA, Nippon Kayaku Co., Ltd.), hexafunctional B-2: Pentaerythritol tetraacrylate (A-TMMT, Shin-Nakamura Chemical Co., Ltd.), tetrafunctional B- 3: Trimethylene propane triacrylate (M309, manufactured by Toagosei Co., Ltd.), trifunctional B-4: NK Oligo U-15HA (manufactured by Shin-Nakamura Chemical Co., Ltd.), 15 functional B-5: UA-306H (Kyoeisha Chemical Co., Ltd.), 6 functional B'-1: 1,9-nonanediol diacrylate (A-NOD-N, Shin-Nakamura Kogyo Co., Ltd.), bifunctional

(Component C)
C-1: Compound C-1 below, oxime ester compound C-2: IRGACURE OXE-01 (manufactured by BASF), oxime ester compound, structure shown below C-3: IRGACURE OXE-02 (manufactured by BASF), oxime ester compound , The following structure

(Component D)
D-1: Propylene glycol monomethyl ether acetate (manufactured by Daicel Corporation)
D-2: Methyl ethyl diglycol (manufactured by Daicel Corporation)
D-3: 1,3-butylene glycol diacetate D-4: Tetrahydrofurfuryl alcohol (component K)
K-1: Phenothiazine (manufactured by Tokyo Chemical Industry Co., Ltd.)
K-2: Phenoxazine (manufactured by Tokyo Chemical Industry Co., Ltd.)
(Component E)
E-1: PMA-ST (manufactured by Nissan Chemical Industries, Ltd.), silica particles, average particle size of 10 to 15 nm
E-2: MIBK-ST-L (manufactured by Nissan Chemical Industries, Ltd.), silica particles, average particle size of 40 to 50 nm

(Component N)
N-1: Takenate B870N (Mitsui Chemicals) (base isocyanate: isophorone diisocyanate, blocking agent: methyl ethyl ketone oxime)
N-2: Desmodur BL3575 / 1 MPA / SN (manufactured by Sumika Bayer Co., Ltd.) (base isocyanate: hexamethylene diisocyanate, blocking agent: methyl ethyl ketone oxime)
N-3: Desmodur BL4265SN (manufactured by Sumika Bayer Co., Ltd.) (base isocyanate: isophorone diisocyanate, blocking agent: methyl ethyl ketone oxime)
N-4: Duranate SBN-70D (manufactured by Mitsui Chemicals, Inc.) (base isocyanate: 1,6-hexamethylene diisocyanate, blocking agent: pyrazole derivative)

(Component S)
SC-1: KBM-403 (3-glycidoxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd.)
SC-2: KBM-5103 (3-acryloxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd.)

(Surfactant)
W-1: MegaFuck F554 (manufactured by DIC Corporation), fluorosurfactant)
(Sensitizer)
I-1: DBA (dibutoxyanthracene having the following structure) (manufactured by Kawasaki Kasei Kogyo Co., Ltd.)
(Binder polymer)
P-1: Jonkrill 581 (hydroxy-modified acrylic polymer, manufactured by BASF)
P-2: Compound P-2 synthesized by the following synthesis method

(In the formula, Bu represents a butyl group.)

(Synthesis of Compound 1 (C-1))
<Synthesis of Compound A>
Ethylcarbazole (100.0 g, 0.512 mol) was dissolved in 260 ml of chlorobenzene, and after cooling to 0 ° C., aluminum chloride (70.3 g, 0.527 mol) was added. Subsequently, o-toluoyl chloride (81.5 g, 0.527 mol) was added dropwise over 40 minutes, and the mixture was heated to room temperature (25 ° C., the same applies hereinafter) and stirred for 3 hours. Next, after cooling to 0 ° C., aluminum chloride (75.1 g, 0.563 mol) was added. 4-Chlorobutyryl chloride (79.4 g, 0.563 mol) was added dropwise over 40 minutes, and the mixture was warmed to room temperature and stirred for 3 hours. A mixed solution of 156 ml of 35 mass% hydrochloric acid aqueous solution and 392 ml of distilled water was cooled to 0 ° C., and the reaction solution was added dropwise. The precipitated solid was filtered with suction, washed with distilled water and methanol, and recrystallized from acetonitrile to obtain Compound A having the following structure (yield 164.4 g, yield 77%).

<Synthesis of Compound B>
Compound A (20.0 g, 47.9 mmol) obtained above was dissolved in 64 ml of tetrahydrofuran (THF), and 4-chlorobenzenethiol (7.27 g, 50.2 mmol) and sodium iodide (0.7 g, 4. 79 mmol). Subsequently, sodium hydroxide (2.0 g, 50.2 mmol) was added to the reaction solution, and the mixture was refluxed for 2 hours. Next, after cooling to 0 ° C., SM-28 (11.1 g, 57.4 mmol, sodium methoxide 28% methanol solution, manufactured by Wako Pure Chemical Industries, Ltd.) was added dropwise over 20 minutes, and the temperature was raised to room temperature. And stirred for 2 hours. Next, after cooling to 0 ° C., isopentyl nitrite (6.73 g, 57.4 mmol) was added dropwise over 20 minutes, and the mixture was warmed to room temperature and stirred for 3 hours. The reaction solution was diluted with 120 ml of acetone and added dropwise to a 0.1N hydrochloric acid aqueous solution cooled to 0 ° C. The precipitated solid was filtered with suction and washed with distilled water. Subsequently, recrystallization was performed with acetonitrile to obtain a compound B having the following structure (yield: 17.0 g, yield: 64%).

<Synthesis of Compound C-1>
Compound B (18.0 g, 32.4 mmol) was dissolved in 90 ml N-methylpyrrolidone (NMP) and triethylamine (Et ₃ N, 3.94 g, 38.9 mmol) was added. Next, after cooling to 0 ° C., acetyl chloride (AcCl, 3.05 g, 38.9 mmol) was added dropwise over 20 minutes, and then the mixture was warmed to room temperature and stirred for 2 hours. The reaction solution was added dropwise to 150 ml of distilled water cooled to 0 ° C., and the precipitated solid was subjected to suction filtration, washed with 200 ml of isopropyl alcohol cooled to 0 ° C., dried, and then compound C-1 (yield 19.5 g, yield). 99%).

Moreover, the structure of the obtained compound 1 was identified by NMR.
¹ H-NMR (400 MHz, CDCl ₃ ): δ = 8.86 (s, 1H), 8.60 (s, 1H), 8.31 (d, 1H, J = 8.0 Hz), 8.81 ( d, 1H, J = 8.0 Hz), 7.51-7.24 (m, 10H), 7.36 (q, 2H, 7.4 Hz), 3.24-3.13 (m, 4H), 2.36 (s, 3H), 2.21 (s, 3H), 1.50 (t, 3H, 7.4 Hz).

(Synthesis of Compound P-2)
A flask equipped with a condenser and a stirrer was charged with 5 parts by mass of 2,2′-azobis (2,4-dimethylvaleronitrile) and 200 parts by mass of diethylene glycol methyl ethyl ether. Subsequently, 40 parts by mass of glycidyl methacrylate, 18 parts by mass of styrene, 20 parts by mass of methacrylic acid, and 22 parts by mass of N-cyclohexylmaleimide were charged, and the mixture was purged with nitrogen. The solution temperature was raised to 70 ° C., and this temperature was maintained for 5 hours to obtain a polymer solution containing the copolymer (P-2). The solid content concentration of the obtained polymer solution was 33.1% by mass. The number average molecular weight of the obtained polymer was 7,000, and the molecular weight distribution (Mw / Mn) was 2.

(Examples 1 to 52 and Comparative Examples 1 to 18)
As shown in Tables 1 to 5 below, each component was mixed and stirred to form a solution and / or dispersion of an organic solvent, and filtered through a polytetrafluoroethylene filter having a pore size of 0.3 μm. A composition was obtained. The numerical value under the component name in the following table represents the content of each component, and the unit of the component is part by mass. Moreover, the mass part of solid content conversion is shown except a solvent.

(Comparative Example 19)
<Synthesis of Copolymer 1>
A flask equipped with a condenser and a stirrer was charged with 5 parts by mass of 2,2′-azobis (2,4-dimethylvaleronitrile) and 200 parts by mass of diethylene glycol methyl ethyl ether. Subsequently, 40 parts by mass of glycidyl methacrylate, 18 parts by mass of styrene, 20 parts by mass of methacrylic acid, and 22 parts by mass of N-cyclohexylmaleimide were charged, and the mixture was purged with nitrogen. The solution temperature was raised to 70 ° C., and this temperature was maintained for 5 hours to obtain a polymer solution containing the copolymer 1. The solid content concentration of the obtained polymer solution was 33.1% by mass. The number average molecular weight of the obtained polymer was 7,000. The molecular weight distribution (Mw / Mn) was 2.

<Adjustment of photosensitive composition>
A solution containing copolymer 1 obtained in Synthesis Example 1 above (an amount containing 100 parts by mass of copolymer 1 in terms of solid content) and mono- [3- (3-acryloyloxy-2,2-bis succinate] -Acryloyloxymethyl-propoxy) -2,2-bis-acryloyloxymethyl-propyl] ester 200 parts by weight and 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one (Irgacure 907, manufactured by BASF), 10 parts by mass, novolac type epoxy resin (Epicoat 152, manufactured by Japan Epoxy Resin Co., Ltd.), 30 parts by mass, γ-glycidoxypropyltrimethoxysilane, 30 parts by mass, FTX-218, Inc. After adding 0.2 parts by mass of Neos) and further adding diethylene glycol methyl ethyl ether so that the solid content concentration becomes 22% by weight To obtain a photosensitive composition was filtered through a Millipore filter having a pore size 0.5 [mu] m.

(Comparative Example 20)
A photosensitive composition was obtained in the same manner as in Comparative Example 19 except that K-1 was added so that the concentration in the total organic solid content was 0.2% by mass in the preparation of the photosensitive composition.

(Production and evaluation of cured film)
<Evaluation of patterning properties>
A glass substrate (EAGLE XG, 0.7 mm thickness (manufactured by Corning)) was exposed to hexamethyldisilazane (HMDS) vapor for 30 seconds, and each photosensitive composition was spin-coated and then heated at 90 ° C./120 seconds. Pre-baked on the plate to volatilize the solvent to form a photosensitive composition layer having a thickness of 3.0 μm.
Next, the obtained photosensitive composition layer was exposed through a mask capable of forming an isolated pattern having a size of 100 μm × 300 μm using MPA 5500CF (high pressure mercury lamp) manufactured by Canon Inc. The exposed photosensitive composition layer was developed with an alkali developer (2.38% tetramethylammonium hydroxide aqueous solution) at 23 ° C./60 seconds, and then rinsed with ultrapure water for 20 seconds. The sensitivity was the optimum i-line exposure (Eopt) when resolving a 50 μm hole by these operations.
The hole diameter at the time of producing a permanent film having a hole pattern with the most appropriate exposure amount to be resolved for each mask diameter was evaluated. In the subsequent evaluation, the actual hole pattern diameter was defined by the size of the bottom (bottom) of the resist. The smaller the difference between the hole diameter and the mask diameter (that is, the higher the mask linearity), the easier the panel design becomes, and this is preferable. Evaluation criteria are as follows, and

evaluation levels

5, 4 and 3 are practical ranges. The evaluation results are shown in Tables 6-8. The mask diameter was defined based on the size of the bottom (bottom surface), and the exposure amount was the most appropriate exposure amount to be resolved for each mask diameter. In Tables 6 to 8, “(A + B) / total organic solid content” means “the ratio of the total content of component A and component B to the total organic solid content of the photosensitive composition” as “(A) / “(A + B)” represents “a ratio of the content of component A to the total content of component A and component B”, and the unit is mass%.
5: Ratio of mask diameter to actual hole pattern diameter is within ± 10% 4: Ratio of mask diameter to actual hole pattern diameter exceeds ± 10% and within ± 20% 3: Mask diameter to actual hole Pattern diameter ratio exceeds ± 20% and within ± 30% 2: Mask diameter and actual hole pattern ratio exceeds ± 30% and within ± 40% 1: Mask diameter and actual hole Pattern diameter ratio exceeds ± 40%

<Evaluation of adhesion>
Each composition prepared above was spin-coated on a copper-deposited substrate and pre-baked at 100 ° C. for 120 seconds to obtain a coating film having a thickness of 2.0 μm. Next, irradiation with light of 500 mJ / cm ² (i-line conversion) was performed with a high-pressure mercury lamp, and further a baking was performed in an oven at 120 ° C. for 60 minutes to form a cured film. About the obtained cured film, the crosscut test of 100 squares was done by the method based on JISK5600, and adhesiveness was evaluated.
Each composition prepared above was spin-coated on a substrate on which ITO was vapor-deposited, and a cured film produced under the same conditions as above was also subjected to a cross cut of 100 squares by a method in accordance with JIS K5600. Tests were conducted to evaluate adhesion. In the following evaluation, the

evaluation levels

5, 4, and 3 are in the practical range. The evaluation results are shown in Tables 6-8.
5: No peeling at all.
4: Slightly peels off, but peels off less than 2%.
3: The peeling rate is 2% or more and less than 5%.
2: The peeling ratio is 5% or more and less than 15%.
1: The peeling rate is 15% or more.

<Evaluation of pencil hardness>
Each photosensitive composition prepared above was spin-coated on a glass substrate and pre-baked at 90 ° C. for 120 seconds to obtain a coating film having a thickness of 2.0 μm. Next, irradiation with light of 500 mJ / cm ² (i-line conversion) was performed with a high-pressure mercury lamp, and further, baking was performed in an oven at 120 ° C. for 60 minutes to prepare a cured film.
The obtained cured film was subjected to a pencil hardness test by a method (load 750 g) in accordance with JIS K5600 to evaluate the film hardness. 4H or more is a practical range.

As is apparent from Tables 6 to 8 above, the photosensitive composition of the present invention obtained a cured film having excellent patterning properties and excellent adhesion and hardness even when cured at a low temperature.

(Production of touch panel display device)
In the touch panel display device shown in FIG. 4, each of the display devices was produced using the photosensitive composition obtained in each example of the present invention as a touch detection electrode protective film (insulating film, 420). Specifically, the protective film (420) was slit-coated with the photosensitive composition obtained in each example of the present invention, pre-baked at 90 ° C. for 120 seconds, and MPA 5500CF (manufactured by Canon Inc.) Using a high-pressure mercury lamp, exposure was performed through a predetermined mask. The exposed photosensitive composition layer was developed with an alkali developer (2.38% tetramethylammonium hydroxide aqueous solution) at 23 ° C./60 seconds, and then rinsed with ultrapure water for 20 seconds. By these operations, a 50 μm hole was formed. Further, a cured film was formed by baking in an oven at 120 ° C. for 60 minutes. The other part of the display device was manufactured according to the manufacturing method described in FIG. 19 in JP 2013-168125 A. The produced display device was excellent in display performance and touch detection performance.

1: TFT (thin film transistor), 2: wiring, 3: insulating film, 4: flattening film, 5: first electrode, 6: glass substrate, 7: contact hole, 8: insulating film, 10: liquid crystal display device, 12 : Backlight unit, 14, 15: Glass substrate, 16: TFT, 17: Cured film, 18: Contact hole, 19: ITO transparent electrode, 20: Liquid crystal, 22: Color filter, 110: Pixel substrate, 111: Polarizing plate 112: transparent substrate, 113: common electrode, 114: insulating layer, 115: pixel electrode, 116: alignment film, 120: counter substrate, 121: alignment film, 122: color filter, 123: transparent substrate, 124: phase difference Film: 125: detection electrode for sensor, 126: adhesive layer, 127: polarizing plate, 130: sensor part, 140: liquid crystal layer, 200: lower display board, 210: first insulating substrate 220: gate electrode, 240: gate insulating film, 250: semiconductor layer, 260, 262: ohmic contact layer, 270: source electrode, 272: drain electrode, 280: insulating film, 282: contact hole, 290: image electrode, 300 : Upper display board, 310: second insulating substrate, 320: light shielding member, 330: color filter, 350: alignment film, 370: common electrode, 400: liquid crystal layer, 410: sensing electrode, 420: insulating film, 430: driving Electrode, 440: TFT

Claims

As component A, a polymerizable monomer having three or more (meth) acryloyl groups and one or more carboxy groups in the molecule,
As component B, a polymerizable monomer having three or more (meth) acryloyl groups in the molecule and no carboxy group,
As component C, a photopolymerization initiator,
As component D, a solvent, and
Component K contains a polymerization inhibitor,
The total content of component A and component B is 60 to 95% by mass with respect to the total organic solid content of the photosensitive composition,
A photosensitive composition, wherein the content of component A is 10 to 40% by mass relative to the total content of component A and component B.
The photosensitive composition according to claim 1, wherein the content of component K is 0.1 to 0.5 mass% with respect to the total organic solid content of the photosensitive composition.
The photosensitive composition according to claim 1 or 2, wherein the total content of component A and component B is 65 to 95% by mass relative to the total organic solid content of the photosensitive composition.
The photosensitive composition according to any one of claims 1 to 3, wherein the total content of Component A and Component B is 70 to 95 mass% with respect to the total organic solid content of the photosensitive composition.
The photosensitive composition according to any one of claims 1 to 4, wherein the content of Component A is 10 to 30% by mass relative to the total content of Component A and Component B.
The photosensitive composition according to any one of claims 1 to 5, wherein the content of Component A is 10 to 25% by mass based on the total content of Component A and Component B.
The photosensitive composition according to any one of claims 1 to 6, further comprising inorganic particles as component E.
The photosensitive composition according to claim 7, wherein the content of component E is 10 to 40% by mass relative to the total solid content of the photosensitive composition.
The photosensitive composition according to any one of claims 1 to 8, further comprising an alkoxysilane compound as component S.
The photosensitive composition according to any one of claims 1 to 9, wherein the content of the polymer component having a molecular weight exceeding 10,000 is 25% by mass or less based on the total solid content of the photosensitive composition.
The photosensitive composition according to any one of claims 1 to 10, wherein the content of the polymer component having a molecular weight exceeding 10,000 is 10% by mass or less based on the total solid content of the photosensitive composition.
A method for producing a cured film comprising at least Step 1 to Step 5 in this order.
Step 1: Application step of applying the photosensitive composition according to any one of claims 1 to 11 on a substrate Step 2: Solvent removal step of removing the solvent from the applied photosensitive composition Step 3: Solvent An exposure step of exposing at least a part of the photosensitive composition from which the light has been removed with actinic rays Step 4: a development step of developing the exposed photosensitive composition with an aqueous developer Step 5: a developed photosensitive composition Heat treatment process for heat treatment
The method for producing a cured film according to claim 12, wherein the heat treatment temperature in Step 5 is 80 ° C to 150 ° C.
A cured film obtained by curing the photosensitive composition according to any one of claims 1 to 11.
The cured film according to claim 14, which is an interlayer insulating film or an overcoat film.
The cured film according to claim 14 or 15, which is an overcoat film for a touch panel.
The cured film according to any one of claims 14 to 16, which is an overcoat film for an on-cell touch panel.
A liquid crystal display device having the cured film according to claim 14 or 15.
An organic EL display device having the cured film according to claim 14 or 15.
A touch panel having the cured film according to any one of claims 14 to 17.
A touch panel display device having the cured film according to any one of claims 14 to 17.