WO2016009829A1

WO2016009829A1 - Conductive film for touch panel sensor, touch panel sensor, and touch panel

Info

Publication number: WO2016009829A1
Application number: PCT/JP2015/068930
Authority: WO
Inventors: 佐藤　真隆
Original assignee: 富士フイルム株式会社
Priority date: 2014-07-16
Filing date: 2015-07-01
Publication date: 2016-01-21
Also published as: JPWO2016009829A1; CN106462284A; JP6279082B2; CN106462284B; TW201614451A

Abstract

The present invention provides: a conductive film that is for a touch panel sensor and has superior adhesiveness, a lead wire that can be more minute, and high electrical connectivity between the lead wire and a detection electrode; a touch panel sensor; and a touch panel. The conductive film for a touch panel sensor is provided with: a substrate; a detection electrode disposed at least at one surface of the substrate; a patterned coated layer disposed at the periphery of the detection electrode on the surface of the substrate at which the detection electrode is disposed, and having a functional group that interacts with a coating catalyst or a precursor thereof; a lead wire disposed on the patterned coated layer; and a conductive connection section that electrically connects the detection electrode and the lead wire. The lead wire is formed by means of a method having at least a step for imparting the coating catalyst or precursor thereof onto the patterned coated layer, and performing coating processing of the patterned coated layer to which the coating catalyst or precursor thereof has been imparted.

Description

Conductive film for touch panel sensor, touch panel sensor, touch panel

The present invention relates to a conductive film for a touch panel sensor, a touch panel sensor, and a touch panel.

A conductive film having conductive thin wires formed on a substrate includes transparent electrodes for various electronic devices such as solar cells, inorganic EL (Electro Luminescence) elements, and organic EL elements, electromagnetic wave shields for various display devices, touch panels, and transparent surface shapes. Widely used for heating elements.
In particular, in recent years, the rate of mounting touch panels on mobile phones, portable game devices, and the like has increased, and the demand for conductive films for capacitive touch panel sensors that can detect multiple points is rapidly expanding. .
As one aspect of the conductive film for the touch panel sensor, a substrate, a detection electrode used for detecting an input position provided on the surface of the substrate, and a lead wiring for applying a voltage to the detection electrode ( (Peripheral wiring) is provided. Note that the conductive film is preferably manufactured by a low-temperature process in terms of reducing productivity and damage to each member. As shown in Patent Document 1 and the like, the lead-out wiring is made of conductive ink containing silver (silver In many cases, it is formed by ink.

Japanese Patent No. 4780254

On the other hand, the application of touch panels to small information terminal devices has progressed, and in order to secure a wide input area, it is required to narrow the width of the frame portion (narrow frame). Usually, since there is a lead-out wiring in the frame portion of the touch panel, miniaturization of the lead-out wiring (reducing the width of the lead-out wiring) is required to meet the above demand.
However, as described above, silver ink or the like is used in Patent Document 1, and the screen printing technology of such silver ink has limitations in wiring miniaturization and dimensional accuracy.

In addition, with the miniaturization of the lead-out wiring, improvement in the adhesion of the lead-out wiring is also required from the viewpoint of durability.
Furthermore, high electrical connectivity between the detection electrode and the lead-out wiring is also required for the purpose of increasing the touch detection sensitivity.

In view of the above circumstances, the present invention provides a conductive film for a touch panel sensor that has a lead wire that has excellent adhesion and that can be miniaturized, and that has high electrical connectivity between the lead wire and the detection electrode. Let it be an issue.
Moreover, this invention also makes it a subject to provide the touchscreen sensor containing the said conductive film for touchscreen sensors, and a touchscreen.

As a result of diligent investigations on the problems of the prior art, the present inventors placed a plating layer containing a predetermined functional group on a substrate and applied a plating catalyst or a precursor thereof to the plating layer. It has been found that the above-mentioned problems can be solved by forming a lead-out wiring by plating and providing a connection portion for electrically connecting the detection electrode and the lead-out wiring.
That is, the present inventors have found that the above problem can be solved by the following configuration.

(1) a substrate;
A sensing electrode disposed on at least one surface of the substrate;
A patterned layer to be plated having a functional group that is arranged around the detection electrode on the surface of the substrate where the detection electrode is present and interacts with the plating catalyst or a precursor thereof;
A lead-out wiring arranged on the patterned plated layer;
A conductive connection portion for electrically connecting the detection electrode and the lead wiring;
The lead-out wiring is formed by a method having at least a step of applying a plating catalyst or a precursor thereof to the patterned plating layer and performing a plating process on the patterned plating layer to which the plating catalyst or the precursor is applied. A conductive film for a touch panel sensor, which is a connected wiring.
(2) A pattern-like to-be-plated layer gives energy to a to-be-plated layer forming composition containing the compound which has a functional group and polymeric group which interact with a plating catalyst or its precursor, in pattern shape The conductive film for a touch panel sensor according to (1), which is a layer to be formed.
(3) a substrate;
A layer to be plated having a functional group that interacts with a plating catalyst or a precursor thereof disposed on a substrate;
A sensing electrode disposed on the layer to be plated;
On the layer to be plated, the lead wiring arranged around the detection electrode,
A conductive connection portion for electrically connecting the detection electrode and the lead wiring;
The lead-out wiring gives a plating catalyst or a precursor thereof to the layer to be plated, performs a plating process on the layer to be plated to which the plating catalyst or the precursor is applied, forms a metal layer, and patterns the metal layer A conductive film for a touch panel sensor, which is a wiring formed by etching into a shape.
(4) The conductive film for a touch panel sensor according to any one of (1) to (3), wherein the conductive connection portion is a connection portion formed by a printing method using a conductive paste or conductive ink.
(5) The conductive film for a touch panel sensor according to any one of (1) to (4), wherein the detection electrode is an electrode formed by a sputtering method or a vapor deposition method.
(6) The conductive film for a touch panel sensor according to any one of (1) to (5), wherein a primer layer is disposed adjacent to the substrate surface.
(7) The conductive film for a touch panel sensor according to any one of (1) to (6), wherein the lead-out wiring has a line width of 1 to 10 μm.
(8) A touch panel sensor comprising the conductive film for a touch panel sensor according to any one of (1) to (7).
(9) A touch panel comprising the conductive film for a touch panel sensor according to any one of (1) to (7).

ADVANTAGE OF THE INVENTION According to this invention, it can provide the conductive film for touchscreen sensors which has the lead wiring which is excellent in adhesiveness and which can be refined | miniaturized, and has high electrical connectivity with a lead wiring and a detection electrode.
Moreover, according to this invention, the touch panel sensor containing the said conductive film for touch panel sensors, and a touch panel can also be provided.

It is a top view of a 1st embodiment of a conductive film for touch panel sensors of the present invention. FIG. 2 is a cross-sectional view taken along a cutting line AA shown in FIG. FIG. 2 is a cross-sectional view taken along a cutting line BB shown in FIG. It is sectional drawing which shows one Embodiment of the manufacturing method of extraction wiring in order of a process. It is a top view of 2nd Embodiment of the electroconductive film for touchscreen sensors of this invention. FIG. 6 is a cross-sectional view taken along a cutting line CC shown in FIG. It is sectional drawing which shows other embodiment of the manufacturing method of extraction wiring in order of a process. It is a top view of 3rd Embodiment of the electroconductive film for touchscreen sensors of this invention. FIG. 9 is a cross-sectional view taken along a cutting line DD shown in FIG. It is a top view of 4th Embodiment of the electroconductive film for touchscreen sensors of this invention. FIG. 11 is a cross-sectional view taken along a cutting line EE shown in FIG.

Hereinafter, the conductive film for a touch panel sensor, the touch panel sensor, and the touch panel of the present invention will be described in detail.
In the present specification, a numerical range represented by using “to” means a range including numerical values described before and after “to” as a lower limit value and an upper limit value. Further, the drawings in the present invention are schematic diagrams, and the thickness relationships and positional relationships of the layers do not necessarily match the actual ones.

One of the features of the conductive film for a touch panel sensor of the present invention is that a plating catalyst or a precursor thereof is applied to a layer to be plated having a predetermined functional group, and then a plating process is performed to form a lead wiring. In addition, a conductive connection portion that electrically joins the detection electrode and the lead-out wiring is provided.
As one mode of the method for manufacturing the lead wiring, after forming a pattern-like plated layer with a narrow line width by predetermined patterning, the lead-out wiring can be manufactured on the pattern-like plated layer. In other words, by reducing the line width of the layer to be plated that is the base layer of the lead wiring, the line width of the lead wiring to be formed can be made fine. In addition, as another aspect of the manufacturing method of the lead wiring, there is an aspect in which a metal layer is once formed and then etched into a pattern. In this aspect, the wiring of the lead wiring can be controlled by controlling the etching range. The width can be reduced.
Further, since the layer to be plated is disposed between the substrate and the lead wiring, the adhesion of the lead wiring is also excellent.
In addition, when producing extraction wiring using the said to-be-plated layer, the present inventors discovered that joining property with a detection electrode is not necessarily high. Although the detailed reason is unknown, since the lead-out wiring is arranged on the layer to be plated, if the lead-out wiring is formed on the detection electrode via the layer to be plated, the conductivity is insufficient due to the presence of the layer to be plated. Can be considered. In addition, when the detection electrode is formed on the lead-out wiring, it is considered that the height difference between the lead-out wiring and the detection electrode is likely to occur due to the thickness of the plated layer, and the bonding property between the two is likely to be lowered. In addition, since the lead-out wiring is formed by a plating process, impurities that are likely to be generated during the plating process appear on the surface of the lead-out wiring, which may cause a decrease in bondability with the detection electrode. Therefore, the present inventors have found that the above problem can be solved by providing a conductive connection portion that electrically connects the detection electrode and the lead-out wiring.

<< First Embodiment >>
In FIG. 1, the top view of 1st Embodiment of the electroconductive film for touchscreen sensors of this invention is shown. FIG. 2 is a cross-sectional view taken along the cutting line AA. FIG. 3 is a cross-sectional view taken along the cutting line BB.
As shown in FIG. 1, the conductive film 10 for a touch panel sensor according to the present embodiment includes a central area E _I that constitutes an input area that can be input by a user when used as a touch panel sensor, and a central area E. _And an outer region E _O located outside _I. In addition, the central region is, in other words, a region where the detection electrode is disposed, and the outer region _EO is, in other words, a peripheral region (peripheral region) where the lead-out wiring is disposed outside the central region. .
The conductive film 10 for a touch panel sensor includes a substrate 12, a detection electrode 14 disposed on one main surface (on the surface) of the substrate 12, a patterned plated layer 16, a lead-out wiring 18, and conductivity. And a connection unit 24. The detection electrode 14 and the lead wiring 18 are electrically connected via the conductive connection portion 24. As shown in FIG. 3, the lead-out wiring 18 is disposed on the patterned plated layer 16 disposed on the surface of the substrate 12. In other words, the patterned layer 16 is located between the substrate 12 and the lead wiring 18.
Below, the said structure is explained in full detail. First, the patterned plated layer 16, the lead-out wiring 18, and the conductive connection portion 24, which are the features of the present invention, will be described in detail.

[Pattern Layer 16 and Lead Wiring 18]
(Pattern layer 16)
The patterned plated layer 16 is disposed around the detection electrode 14 (outer region E _O ) and has a functional group that interacts with the plating catalyst or its precursor (hereinafter also simply referred to as “interactive group”). It is a patterned layer (layer to be plated). The pattern-like plated layer 16 adsorbs (attaches) a plating catalyst or a precursor thereof used for producing the lead-out wiring according to the function of the interactive group. That is, the patterned plated layer functions as a good receiving layer for the plating catalyst or its precursor.
The patterned plated layer 16 is located between the substrate 12 and the lead wiring 18. That is, the patterned plated layer 16 is disposed at a position where the lead wiring 18 is disposed. As will be described later, the arrangement position of the patterned plated layer 16 is not limited to the mode of FIG. 1, and at least a part of the outer region E _O on the substrate 12 (at least around the detection electrode 14 on the substrate 12). It is preferable to be disposed on a part of the outer region E 2 _O.

The thickness of the patterned plated layer 16 is not particularly limited, but is preferably 0.01 to 10 μm, more preferably 0.2 to 5 μm, and still more preferably 0.25 to 1.0 μm from the viewpoint of productivity.
Further, the line width of the patterned plated layer 16 is not particularly limited, but is preferably 30 μm or less, more preferably 15 μm or less, and more preferably 10 μm or less from the viewpoint of low resistance of the lead-out wiring arranged on the patterned plated layer. Is more preferable, 0.5 μm or more is preferable, and 1.0 μm or more is more preferable.

The type of the interactive group contained in the patterned plated layer 16 will be described in detail later.
Although the material which comprises the pattern-like to-be-plated layer 16 is not restrict | limited in particular, Usually, resin (For example, (meth) acrylic resin (a bridge | crosslinking and non-crosslinking (meth) acrylic resin is included)) is mentioned, Thermosetting Examples thereof include an insulating resin such as a resin or a thermoplastic resin. These materials only need to contain an interactive group. The (meth) acrylic resin is a concept including an acrylic resin and a methacrylic resin.
More specifically, examples of the thermosetting resin include epoxy resins, phenol resins, polyimide resins, polyester resins, bismaleimide resins, polyolefin resins, isocyanate resins, and crosslinked (meth) acrylic resins. Examples of the thermoplastic resin include phenoxy resin, polyether sulfone, polysulfone, polyphenylene sulfone, polyphenylene sulfide, polyphenyl ether, polyether imide, and non-crosslinked (meth) acrylic resin.

The method of forming the patterned plated layer 16 is not particularly limited as long as a patterned layer having a predetermined interactive group is formed, but an embodiment using a composition for forming a plated layer to be described later is preferable. It is done.

(Leader wiring 18)
The lead wiring 18 is a member that plays a role in applying a voltage to the detection electrode 14. The lead-out wiring 18 is disposed in the outer region _EO on the substrate 12, one end thereof is electrically connected to the corresponding detection electrode 14 through the conductive connection portion 24, and the other end is disposed with a flexible printed wiring board or the like. Is located in a place.
In FIG. 1, five lead wires 18 are shown, but the number is not particularly limited, and a plurality of lead wires 18 are usually arranged according to the number of detection electrodes 14.

The thickness of the lead-out wiring 18 is not particularly limited, and an optimum thickness is appropriately selected according to the purpose of use, but is preferably 0.1 μm or more and preferably 0.5 μm or more from the viewpoint of conductive characteristics. 1 to 30 μm is more preferable.
The line width of the lead wiring 18 is not particularly limited, but is preferably 30 μm or less, more preferably 15 μm or less, further preferably 10 μm or less, more preferably 0.5 μm or more, and 1.0 μm or more from the viewpoint of low resistance of the lead wiring Is more preferable.
Further, the type of metal constituting the lead wiring 18 is not particularly limited, and examples thereof include copper, chromium, lead, nickel, gold, silver, tin, and zinc. From the viewpoint of conductivity, copper, gold, silver Are preferable, and copper and silver are more preferable.

(Pattern-like plated layer and lead wiring manufacturing method)
The manufacturing method of the patterned plated layer 16 and the lead wiring 18 is not particularly limited, but the step of forming the patterned plated layer on the substrate is easy in that the formed lead wiring 18 is easily miniaturized (step 1). It is preferable to carry out the step (step 2) of forming the lead wiring on the patterned layer to be plated.
Hereinafter, members and materials used in each process and the procedure thereof will be described in detail.

[Step 1: Patterned plating layer forming step]
In step 1, energy is applied in a pattern to a composition for forming a plating layer containing a compound having a functional group and a polymerizable group that interacts with the plating catalyst or its precursor, and the patterned plating layer is formed into a substrate. It is a process of forming on top. More specifically, first, as shown in FIG. 4 (A), a coating film 20 of the composition for forming a layer to be plated was formed on the substrate 12, and obtained as shown in FIG. 4 (B). By applying energy to the coating film 20 as indicated by the black arrows, the reaction of the polymerizable group is promoted to cure, and then the region to which no energy has been applied is removed to remove the pattern covering. This is a step (FIG. 4C) for obtaining the plating layer 16.
The patterned plated layer 16 formed by the above process adsorbs (attaches) the plating catalyst or its precursor in the process 2 to be described later according to the function of the interactive group. Moreover, a polymeric group is utilized for the coupling | bonding of compounds by the hardening process by energy provision, and can obtain the pattern-like to-be-plated layer 16 excellent in hardness and hardness.
Below, the material used at this process is explained in full detail first, and the procedure of a process is explained in full detail after that. The substrate to be used will be described in detail later.

(Composition for plating layer formation)
The composition for forming a layer to be plated contains a compound having an interactive group and a polymerizable group.
The interactive group is intended to mean a functional group capable of interacting with a plating catalyst or a precursor thereof applied to the patterned plating layer in a process described later. For example, an electrostatic interaction with the plating catalyst or a precursor thereof is performed. A functional group that can be formed, or a nitrogen-containing functional group, a sulfur-containing functional group, an oxygen-containing functional group, and the like that can be coordinated with a plating catalyst or a precursor thereof can be used.
More specifically, as an interactive group, amino group, amide group, imide group, urea group, tertiary amino group, ammonium group, amidino group, triazine ring, triazole ring, benzotriazole group, imidazole group, benzimidazole Group, quinoline group, pyridine group, pyrimidine group, pyrazine group, nazoline group, quinoxaline group, purine group, triazine group, piperidine group, piperazine group, pyrrolidine group, pyrazole group, aniline group, group containing alkylamine structure, isocyanuric structure Nitrogen-containing functional groups such as nitro group, nitroso group, azo group, diazo group, azide group, cyano group, cyanate group (R—O—CN); ether group, hydroxyl group, phenolic hydroxyl group, carboxyl group, Carbonate group, carbonyl group, ester group, group containing N-oxide structure, S Oxygen-containing functional groups such as a group containing an oxide structure and a group containing an N-hydroxy structure; Sulfur-containing functional groups such as sulfone group, sulfite group, group containing sulfoxyimine structure, group containing sulfoxynium salt structure, sulfonic acid group, group containing sulfonic acid ester structure; Phosphate group, phosphoramide group, phosphine group And a phosphorus-containing functional group such as a group containing a phosphate ester structure; a group containing a halogen atom such as chlorine and bromine, and the like. In a functional group capable of taking a salt structure, a salt thereof can also be used.
Among them, since the polarity is high and the adsorption ability to a plating catalyst or a precursor thereof is high, an ionic polar group such as a carboxyl group, a sulfonic acid group, a phosphoric acid group, and a boronic acid group, an ether group, or A cyano group is preferable, and a carboxyl group or a cyano group is more preferable.
Two or more types of interactive groups may be contained in the compound. The number of interactive groups contained in the compound is not particularly limited, and may be one or two or more.

The polymerizable group is a functional group that can form a chemical bond by applying energy, and examples thereof include a radical polymerizable group and a cationic polymerizable group. Among these, a radical polymerizable group is preferable from the viewpoint of more excellent reactivity. Examples of radical polymerizable groups include acrylic acid ester groups (acryloyloxy groups), methacrylic acid ester groups (methacryloyloxy groups), itaconic acid ester groups, crotonic acid ester groups, isocrotonic acid ester groups, maleic acid ester groups, and the like. Examples include unsaturated carboxylic acid ester groups, styryl groups, vinyl groups, acrylamide groups, and methacrylamide groups. Of these, a methacryloyloxy group, an acryloyloxy group, a vinyl group, a styryl group, an acrylamide group, and a methacrylamide group are preferable, and a methacryloyloxy group, an acryloyloxy group, and a styryl group are particularly preferable.
Two or more polymerizable groups may be contained in the compound. The number of polymerizable groups contained in the compound is not particularly limited, and may be one or two or more.

The compound may be a low molecular compound or a high molecular compound. A low molecular weight compound intends a compound having a molecular weight of less than 1000, and a high molecular weight compound intends a compound having a molecular weight of 1000 or more.
The low molecular compound having a polymerizable group corresponds to a so-called monomer. The polymer compound may be a polymer having a predetermined repeating unit.
Moreover, as a compound, only 1 type may be used and 2 or more types may be used together.

When the compound is a polymer, the weight average molecular weight of the polymer is not particularly limited, but is preferably 1000 or more and 700,000 or less, and more preferably 2000 or more and 200,000 or less, from the viewpoint of better handleability such as solubility. In particular, from the viewpoint of polymerization sensitivity, it is preferably 20000 or more.
The method for synthesizing such a polymer having a polymerizable group and an interactive group is not particularly limited, and a known synthesis method (see paragraphs [0097] to [0125] of Patent Publication 2009-280905) is used.

(Preferred embodiment 1 of polymer)
As a first preferred embodiment of the polymer, a repeating unit having a polymerizable group represented by the following formula (a) (hereinafter also referred to as a polymerizable group unit as appropriate) and an interaction represented by the following formula (b) And a copolymer containing a repeating unit having a functional group (hereinafter also referred to as an interactive group unit as appropriate).

In the above formulas (a) and (b), R ¹ to R ⁵ are each independently a hydrogen atom or a substituted or unsubstituted alkyl group (for example, a methyl group, an ethyl group, a propyl group, a butyl group) Etc.). The kind of the substituent is not particularly limited, and examples thereof include a methoxy group, a chlorine atom, a bromine atom, or a fluorine atom.
R ¹ is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a bromine atom. R ² is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a bromine atom. R ³ is preferably a hydrogen atom. R ⁴ is preferably a hydrogen atom. R ⁵ is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a bromine atom.

In the above formulas (a) and (b), X, Y, and Z each independently represent a single bond or a substituted or unsubstituted divalent organic group. Examples of the divalent organic group include a substituted or unsubstituted divalent aliphatic hydrocarbon group (preferably having 1 to 8 carbon atoms, for example, an alkylene group such as a methylene group, an ethylene group, and a propylene group), a substituted or unsubstituted group. A divalent aromatic hydrocarbon group (preferably having 6 to 12 carbon atoms, such as a phenylene group), —O—, —S—, —SO ₂ —, —N (R) — (R: alkyl group), And —CO—, —NH—, —COO—, —CONH—, or a combination thereof (for example, an alkyleneoxy group, an alkyleneoxycarbonyl group, an alkylenecarbonyloxy group, and the like).

As X, Y, and Z, a single bond, ester group (—COO—), amide group (—CONH—), ether group (— O—) or a substituted or unsubstituted divalent aromatic hydrocarbon group is preferable, and a single bond, an ester group (—COO—), or an amide group (—CONH—) is more preferable.

In the above formulas (a) and (b), L ¹ and L ² each independently represent a single bond or a substituted or unsubstituted divalent organic group. As a definition of a divalent organic group, it is synonymous with the divalent organic group described by X, Y, and Z mentioned above.
L ¹ is an aliphatic hydrocarbon group or a divalent organic group having a urethane bond or a urea bond (for example, an aliphatic hydrocarbon) in that the polymer is easily synthesized and the adhesion of the lead wiring is more excellent. Group), and those having a total carbon number of 1 to 9 are preferred. Incidentally, the total number of carbon atoms of L ^1, means the total number of carbon atoms contained in the divalent organic group or a substituted or unsubstituted represented by L ^1.

L ² may be a single bond, a divalent aliphatic hydrocarbon group, a divalent aromatic hydrocarbon group, or a combination of these in terms of better adhesion of the lead-out wiring. preferable. Among these, L ² preferably has a single bond or a total carbon number of 1 to 15, and is particularly preferably unsubstituted. Incidentally, the total number of carbon atoms of L ^2, means the total number of carbon atoms contained in the divalent organic group or a substituted or unsubstituted represented by L ^2.

In the above formula (b), W represents an interactive group. The definition of the interactive group is as described above.

The content of the polymerizable group unit is preferably 5 to 50 mol% with respect to all repeating units in the polymer from the viewpoint of reactivity (curability, polymerization) and suppression of gelation during synthesis, 5 to 40 mol% is more preferable.
In addition, the content of the interactive group unit is preferably 5 to 95 mol%, preferably 10 to 95 mol%, based on all repeating units in the polymer, from the viewpoint of adsorptivity to the plating catalyst or its precursor. More preferred.

(Preferred embodiment 2 of polymer)
As a 2nd preferable aspect of a polymer, the copolymer containing the repeating unit represented by a following formula (A), a formula (B), and a formula (C) is mentioned.

The repeating unit represented by the formula (A) is the same as the repeating unit represented by the above formula (a), and the description of each group is also the same.
R ^5, X and L ² in the repeating unit represented by formula (B) is the same as R ^5, X and L ² in the repeating unit represented by formula (b), a description of each group Is the same.
Wa in the formula (B) represents a group that interacts with the plating catalyst or its precursor, excluding the hydrophilic group represented by V described later or its precursor group. Of these, a cyano group and an ether group are preferable.

In formula (C), each R ⁶ independently represents a hydrogen atom or a substituted or unsubstituted alkyl group.
In formula (C), U represents a single bond or a substituted or unsubstituted divalent organic group. The definition of a bivalent organic group is synonymous with the divalent organic group represented by X, Y, and Z mentioned above. U is a single bond, an ester group (—COO—), an amide group (—CONH—), an ether group (—O—), or an ether group in that the synthesis of the polymer is easy and the adhesion of the lead wiring is more excellent. A substituted or unsubstituted divalent aromatic hydrocarbon group is preferred.
In Formula (C), L ³ represents a single bond or a substituted or unsubstituted divalent organic group. The definition of a divalent organic group is synonymous with the divalent organic group represented by L ¹ and L ² described above. L ³ is a single bond, a divalent aliphatic hydrocarbon group, a divalent aromatic hydrocarbon group, or a combination thereof in that the polymer is easily synthesized and the adhesion of the lead-out wiring is better. It is preferable that

In the formula (C), V represents a hydrophilic group or a precursor group thereof. The hydrophilic group is not particularly limited as long as it is a hydrophilic group, and examples thereof include a hydroxyl group and a carboxylic acid group. The precursor group of the hydrophilic group means a group that generates a hydrophilic group by a predetermined treatment (for example, treatment with acid or alkali). For example, a carboxyl group protected with THP (2-tetrahydropyranyl group) Group and the like.
The hydrophilic group is preferably an ionic polar group in terms of interaction with the plating catalyst or its precursor. Specific examples of the ionic polar group include a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, and a boronic acid group. Among these, a carboxylic acid group is preferable from the viewpoint of moderate acidity (does not decompose other functional groups).

The preferred content of each unit in the second preferred embodiment of the polymer is as follows.
The content of the repeating unit represented by the formula (A) is 5 to 50 with respect to all the repeating units in the polymer from the viewpoint of reactivity (curability, polymerizability) and suppression of gelation during synthesis. The mol% is preferable, and 5 to 30 mol% is more preferable.
The content of the repeating unit represented by the formula (B) is preferably 5 to 75 mol% with respect to all the repeating units in the polymer, from the viewpoint of adsorptivity to the plating catalyst or its precursor, and 10 to 70 mol. % Is more preferable.
The content of the repeating unit represented by the formula (C) is preferably from 10 to 70 mol%, preferably from 20 to 60 mol%, based on all repeating units in the polymer, from the viewpoints of developability with an aqueous solution and moisture-resistant adhesion. Is more preferable, and 30 to 50 mol% is more preferable.

Specific examples of the polymer include, for example, polymers described in paragraphs [0106] to [0112] of JP-A-2009-007540, and paragraphs [0065] to [0070] of JP-A-2006-135271. Examples thereof include polymers described in paragraphs [0030] to [0108] of US2010-080964.
The polymer can be prepared by known methods (eg, the methods in the literature listed above).

(Preferred embodiment of monomer)
When the said compound is what is called a monomer, the compound represented by Formula (X) is mentioned as one of the suitable aspects.

In the formula (X), R ¹¹ to R ¹³ each independently represents a hydrogen atom or a substituted or unsubstituted alkyl group. Examples of the unsubstituted alkyl group include a methyl group, an ethyl group, a propyl group, and a butyl group. Examples of the substituted alkyl group include a methyl group, an ethyl group, a propyl group, and a butyl group substituted with a methoxy group, a chlorine atom, a bromine atom, or a fluorine atom. R ¹¹ is preferably a hydrogen atom or a methyl group. R ¹² is preferably a hydrogen atom. R ¹³ is preferably a hydrogen atom.

L ¹⁰ represents a single bond or a divalent organic group. Examples of the divalent organic group include a substituted or unsubstituted aliphatic hydrocarbon group (preferably having 1 to 8 carbon atoms), a substituted or unsubstituted aromatic hydrocarbon group (preferably having 6 to 12 carbon atoms), —O —, —S—, —SO ₂ —, —N (R) — (R: alkyl group), —CO—, —NH—, —COO—, —CONH—, or a combination thereof (for example, alkylene Oxy group, alkyleneoxycarbonyl group, alkylenecarbonyloxy group, etc.).
As a substituted or unsubstituted aliphatic hydrocarbon group, a methylene group, an ethylene group, a propylene group, or a butylene group, or these groups are substituted with a methoxy group, a chlorine atom, a bromine atom, a fluorine atom, or the like Those are preferred.
As the substituted or unsubstituted aromatic hydrocarbon group, an unsubstituted phenylene group or a phenylene group substituted with a methoxy group, a chlorine atom, a bromine atom, a fluorine atom or the like is preferable.
In Formula (X), one preferred embodiment of L ¹⁰ includes —NH—aliphatic hydrocarbon group— or —CO—aliphatic hydrocarbon group—.

The definition of W is synonymous with the definition of W in Formula (b), and represents an interactive group. The definition of the interactive group is as described above.
In Formula (X), as a suitable aspect of W, an ionic polar group is mentioned, A carboxylic acid group is more preferable.

When the compound is a so-called monomer, another preferred embodiment is a compound represented by the formula (1).

In formula (1), R ¹⁰ represents a hydrogen atom, a metal cation, or a quaternary ammonium cation. Examples of metal cations include alkali metal cations (sodium ions, calcium ions), copper ions, palladium ions, silver ions, and the like. In addition, as a metal cation, a monovalent or bivalent thing is mainly used, and when bivalent thing (for example, palladium ion) is used, n mentioned later represents 2.
Examples of the quaternary ammonium cation include tetramethylammonium ion and tetrabutylammonium ion.
Especially, it is preferable that it is a hydrogen atom from the point of adhesion of a plating catalyst or its precursor, and the metal residue after patterning.

Defining L ¹⁰ in the formula (1) are the same as defined in L ¹⁰ in the above-mentioned formula (X), a single bond, or a divalent organic group. The definition of the divalent organic group is as described above.

Definition of R ¹¹ ~ R ¹³ in the formula (1) has the same meaning as the definition of R ¹¹ ~ R ¹³ in the above-mentioned formula (X), represents a hydrogen atom or a substituted or unsubstituted alkyl group,. The preferred embodiments of R ¹¹ to R ¹³ are as described above.
n represents an integer of 1 or 2. Especially, it is preferable that n is 1 from a viewpoint of the availability of a compound.

As a preferred embodiment of the compound represented by the formula (1), a compound represented by the formula (2) may be mentioned.

In formula (2), R ¹⁰ , R ¹¹ and n are the same as defined above.
L ¹¹ represents an ester group (—COO—), an amide group (—CONH—), or a phenylene group. Among these, when L ¹¹ is an amide group, the polymerizability and solvent resistance (for example, alkali solvent resistance) of the obtained layer to be plated are improved.
L ¹² represents a single bond, a divalent aliphatic hydrocarbon group (preferably having 1 to 8 carbon atoms, more preferably 3 to 5 carbon atoms), or a divalent aromatic hydrocarbon group. The aliphatic hydrocarbon group may be linear, branched or cyclic. When L ¹² is a single bond, L ¹¹ represents a phenylene group.

The molecular weight of the compound represented by the formula (1) is not particularly limited, but is preferably from 100 to 1,000, more preferably from 100 to 300, from the viewpoints of volatility, solubility in a solvent, film formability, and handleability. preferable.

The content of the above compound in the composition for forming a plated layer is not particularly limited, but is preferably 2 to 50% by mass, more preferably 5 to 30% by mass with respect to the total amount of the composition. If it is in the said range, the handleability of a composition is excellent and it is easy to control the layer thickness of a pattern-like to-be-plated layer.

The composition for forming a layer to be plated preferably contains a solvent from the viewpoint of handleability.
Solvents that can be used are not particularly limited. For example, water; alcohol solvents such as methanol, ethanol, propanol, ethylene glycol, 1-methoxy-2-propanol, glycerin, propylene glycol monomethyl ether; acids such as acetic acid; acetone, methyl ethyl ketone Ketone solvents such as cyclohexanone; amide solvents such as formamide, dimethylacetamide and N-methylpyrrolidone; nitrile solvents such as acetonitrile and propionitrile; ester solvents such as methyl acetate and ethyl acetate; dimethyl carbonate and diethyl carbonate Other examples include carbonate solvents such as ether solvents, glycol solvents, amine solvents, thiol solvents, and halogen solvents.
Of these, alcohol solvents, amide solvents, ketone solvents, nitrile solvents, and carbonate solvents are preferable.
The content of the solvent in the composition for forming a layer to be plated is not particularly limited, but is preferably 50 to 98% by mass, more preferably 70 to 95% by mass with respect to the total amount of the composition. If it is in the said range, the handleability of a composition is excellent and it is easy to control the layer thickness of a pattern-like to-be-plated layer.

A polymerization initiator may be contained in the composition for forming a layer to be plated. By including the polymerization initiator, bonds between the compounds and between the compound and the substrate are further formed, and as a result, a lead-out wiring having better adhesion can be obtained.
There is no restriction | limiting in particular as a polymerization initiator used, For example, a thermal polymerization initiator, a photoinitiator, etc. can be used. Examples of photopolymerization initiators include benzophenones, acetophenones, α-aminoalkylphenones, benzoins, ketones, thioxanthones, benzyls, benzyl ketals, oxime esters, anthrones, tetramethylthiuram mono Mention may be made of sulfides, bisacylphosphine oxides, acylphosphine oxides, anthraquinones, azo compounds and the like and their derivatives.
Examples of the thermal polymerization initiator include a diazo compound or a peroxide compound.
When a polymerization initiator is contained in the composition for forming a layer to be plated, the content of the polymerization initiator is preferably 0.01 to 1% by mass with respect to the total amount of the composition, and preferably 0.1 to 0.001. More preferably, it is 5 mass%. If it is in the said range, it is excellent in the handleability of a composition and the adhesiveness of the extraction wiring obtained is more excellent.

The composition for forming a layer to be plated may contain a monomer (excluding the compound represented by the above formula (X) or formula (1)). By including the monomer, the crosslink density in the patterned layer to be plated can be appropriately controlled.
The monomer to be used is not particularly limited, and examples thereof include compounds having an ethylenically unsaturated bond as compounds having addition polymerizability, and compounds having an epoxy group as compounds having ring-opening polymerizability. Especially, it is preferable to use a polyfunctional monomer from the point which improves the crosslinking density in a pattern-like to-be-plated layer, and the adhesiveness of a lead-out wiring improves more. A polyfunctional monomer means a monomer having two or more polymerizable groups. Specifically, it is preferable to use a monomer having 2 to 6 polymerizable groups.
The molecular weight of the polyfunctional monomer used is preferably 150 to 1000, more preferably 200 to 700, from the viewpoint of molecular mobility during the crosslinking reaction that affects the reactivity. In addition, the interval (distance) between a plurality of polymerizable groups is preferably 1 to 15 atoms, and more preferably 6 or more and 10 or less.

In the composition for forming a layer to be plated, other additives (for example, sensitizer, curing agent, polymerization inhibitor, antioxidant, antistatic agent, ultraviolet absorber, filler, particle, flame retardant, surfactant) , Lubricants, plasticizers, etc.) may be added as necessary.

In the above description, the composition for forming a plating layer containing a compound having an interactive group and a polymerizable group has been described. However, the present invention is not limited to this embodiment. A composition for forming a layer to be plated containing a compound having a polymerizable group may also be used.
The definitions of the interactive group and the polymerizable group are as described above.
The compound having an interactive group is a compound having an interactive group. The definition of the interactive group is as described above. Such a compound may be a low molecular compound or a high molecular compound. As a suitable aspect of the compound which has an interactive group, the polymer (for example, polyacrylic acid) which has a repeating unit represented by the formula (b) mentioned above is mentioned. The compound having an interactive group does not contain a polymerizable group.
The compound having a polymerizable group is a so-called monomer, and is preferably a polyfunctional monomer having two or more polymerizable groups in that the formed layer to be plated is more excellent in hardness. Specifically, it is preferable to use a monomer having 2 to 6 polymerizable groups as the polyfunctional monomer. The molecular weight of the polyfunctional monomer used is preferably 150 to 1000, more preferably 200 to 700, from the viewpoint of molecular mobility during the crosslinking reaction that affects the reactivity. In addition, the distance (distance) between a plurality of polymerizable groups is preferably 1 to 15 and more preferably 6 to 10 in terms of the number of atoms.

(Procedure of step 1)
In step 1, the composition for forming a layer to be plated is first disposed on the substrate, but the method is not particularly limited. For example, the composition for forming a layer to be plated is brought into contact with the substrate to form a layer to be plated. The method of forming the coating film (to-be-plated layer precursor layer) of the composition for formation is mentioned. Examples of this method include a method (coating method) in which the composition for forming a layer to be plated is applied onto a substrate.
In the coating method, the method for coating the composition for forming a layer to be plated on the substrate is not particularly limited, and a known method (for example, spin coating, die coating, dip coating, etc.) can be used.
From the viewpoint of handleability and production efficiency, an embodiment in which a composition for forming a layer to be plated is applied on a substrate and, if necessary, a drying treatment is performed to remove the remaining solvent to form a coating film.
The conditions for the drying treatment are not particularly limited, but are preferably carried out at room temperature to 220 ° C. (preferably 50 to 120 ° C.) for 1 to 30 minutes (preferably 1 to 10 minutes) from the viewpoint of better productivity. .

The method for applying energy in a pattern to the coating film containing the compound on the substrate is not particularly limited. For example, it is preferable to use a heat treatment or an exposure process (light irradiation process), and the exposure process is preferable because the process is completed in a short time. By imparting energy to the coating film, the polymerizable group in the compound is activated, crosslinking between the compounds occurs, and the curing of the layer proceeds.
For the exposure process, UV (ultraviolet light) lamp, light irradiation with visible light, or the like is used. Examples of the light source include a mercury lamp, a metal halide lamp, a xenon lamp, a chemical lamp, and a carbon arc lamp. Examples of radiation include electron beams, X-rays, ion beams, and far infrared rays. Specific examples of preferred embodiments include scanning exposure with an infrared laser, high-illuminance flash exposure such as a xenon discharge lamp, and infrared lamp exposure.
The exposure time varies depending on the reactivity of the compound and the light source, but is usually between 10 seconds and 5 hours. The exposure energy may be about 10 to 8000 mJ, preferably 50 to 3000 mJ.
In addition, the method in particular which implements the said exposure process in a pattern form is not restrict | limited, A well-known method is employ | adopted, for example, what is necessary is just to irradiate a coating film with exposure light through a mask.

In addition, when heat treatment is used for energy application, an air dryer, an oven, an infrared dryer, a heating drum, or the like can be used.

Next, the portion of the coating film where energy is not applied is removed to form a patterned layer to be plated.
The removal method is not particularly limited, and an optimal method is appropriately selected depending on the compound used. For example, a method using an alkaline solution (preferably pH: 13.0 to 13.8) as a developing solution can be mentioned. In the case of removing an energy non-applied region using an alkaline solution, there are a method of immersing a substrate having a coating film to which energy is applied in a solution, a method of applying a developer on the substrate, and the like. The soaking method is preferred. In the case of the dipping method, the dipping time is preferably about 1 to 30 minutes from the viewpoint of productivity and workability.
In addition, as another method, a method in which a solvent in which the above compound is dissolved is used as a developing solution and immersed in the developing solution.

[Step 2: Lead-out wiring formation step]
Step 2 applies a plating catalyst or a precursor thereof to the patterned plating layer formed in Step 1 above, and performs a plating process on the patterned plating layer provided with the plating catalyst or the precursor thereof. This is a step of forming a lead-out wiring on the patterned layer to be plated. As shown in FIG. 4D, by carrying out this step, the lead-out wiring 18 is arranged on the patterned layer 16 to be plated.
In the following, a step of applying a plating catalyst or a precursor thereof to the patterned layer to be plated (step 2-1), and a step of performing a plating process on the patterned layer of plating to which the plating catalyst or its precursor has been applied This will be described separately in (Step 2-2).

(Step 2-1: Plating catalyst application step)
In this step, first, a plating catalyst or a precursor thereof is applied to the patterned layer to be plated. The interactive group derived from the compound adheres (adsorbs) the applied plating catalyst or its precursor depending on its function. More specifically, a plating catalyst or a precursor thereof is applied in the layer to be plated and on the surface of the layer to be plated.
The plating catalyst or a precursor thereof functions as a catalyst or an electrode for plating treatment. Therefore, the type of plating catalyst or precursor used is appropriately determined depending on the type of plating treatment.
In addition, it is preferable that the plating catalyst used or its precursor is an electroless plating catalyst or its precursor. Hereinafter, mainly the electroless plating catalyst or its precursor will be described in detail.

As the electroless plating catalyst used in this step, any catalyst can be used as long as it becomes an active nucleus at the time of electroless plating. Specifically, a metal (Ni) having catalytic ability for autocatalytic reduction reaction. And those known as metals capable of electroless plating with a lower ionization tendency). Specific examples include Pd, Ag, Cu, Ni, Pt, Au, and Co. Of these, Ag, Pd, Pt, and Cu are particularly preferable because of their high catalytic ability.
A metal colloid may be used as the electroless plating catalyst.
The electroless plating catalyst precursor used in this step can be used without particular limitation as long as it can become an electroless plating catalyst by a chemical reaction. The metal ions of the metals mentioned as the electroless plating catalyst are mainly used. The metal ion that is an electroless plating catalyst precursor becomes a zero-valent metal that is an electroless plating catalyst by a reduction reaction. After the metal ion that is the electroless plating catalyst precursor is applied to the patterned layer to be plated, and before being immersed in the electroless plating bath, it may be changed to a zero-valent metal by a reduction reaction separately to be used as an electroless plating catalyst. . Alternatively, the electroless plating catalyst precursor may be immersed in an electroless plating bath and changed to a metal (electroless plating catalyst) by a reducing agent in the electroless plating bath.

It is preferable that the metal ion which is an electroless plating catalyst precursor is provided to the patterned layer 16 by using a metal salt. The metal salt used is not particularly limited as long as it is dissolved in a suitable solvent and dissociated into a metal ion and a base (anion), and M (NO ₃ ) _n , MCl _n , M _{2 / n} (SO ₄ ), M _{3 / n} (PO ₄ ) (M represents an n-valent metal atom), and the like. As a metal ion, the thing which said metal salt dissociated can be used suitably. For example, Ag ion, Cu ion, Ni ion, Co ion, Pt ion, Pd ion can be mentioned. Among them, those capable of multidentate coordination are preferable, and Ag ions, Pd ions, and Cu ions are particularly preferable in terms of the number of types of functional groups capable of coordination and catalytic ability.
In this step, a zero-valent metal can also be used as a catalyst used for direct electroplating without electroless plating.

As a method for applying the plating catalyst or a precursor thereof to the patterned layer 16, for example, a solution (plating catalyst solution) in which the plating catalyst or the precursor thereof is dispersed or dissolved in an appropriate solvent is prepared, and the solution May be applied on the patterned layer to be plated, or a substrate on which the patterned layer to be plated is immersed in the solution.
As said solvent, water and an organic solvent are used suitably. The organic solvent is preferably a solvent that can penetrate the patterned layer to be plated, for example, acetone, methyl acetoacetate, ethyl acetoacetate, ethylene glycol diacetate, cyclohexanone, acetylacetone, acetophenone, 2- (1-cyclohexenyl) cyclohexanone. Propylene glycol diacetate, triacetin, diethylene glycol diacetate, dioxane, N-methylpyrrolidone, dimethyl carbonate, dimethyl cellosolve and the like can be used.

The pH of the catalyst-providing liquid containing the plating catalyst or its precursor and the solvent is not particularly limited. It is preferably 0 to 7.0, more preferably 3.2 to 6.8, and even more preferably 3.5 to 6.6.
The method for preparing the catalyst-imparting solution is not particularly limited, and a predetermined metal salt is dissolved in an appropriate solvent, and the pH is adjusted to a predetermined range using an acid or an alkali as necessary.

The concentration of the plating catalyst or its precursor in the solution is not particularly limited, but is preferably 0.001 to 50% by mass, and more preferably 0.005 to 30% by mass.
The contact time is preferably about 30 seconds to 24 hours, more preferably about 1 minute to 1 hour.

The amount of adsorption of the plating catalyst or precursor of the patterned layer 16 varies depending on the type of plating bath used, the type of catalytic metal, the type of interactive base of the patterned layer 16 to be used, the method of use, etc. from the viewpoint of deposition properties, preferably 5 ~ 1000mg / m ^2, more preferably 10 ~ 800mg / m ^2, particularly preferably 20 ~ 600mg / m ^2.

(Process 2-2: Plating process)
Next, a plating treatment is performed on the patterned layer to which the plating catalyst or its precursor is applied.
The method for the plating treatment is not particularly limited, and examples thereof include electroless plating treatment or electrolytic plating treatment (electroplating treatment). In this step, the electroless plating process may be performed alone, or after the electroless plating process, the electrolytic plating process may be further performed.
In the present specification, so-called silver mirror reaction is included as a kind of the electroless plating process. Therefore, for example, the deposited metal ions may be reduced by a silver mirror reaction or the like to form a desired patterned metal layer, and then an electrolytic plating process may be performed.
Hereinafter, the procedures of the electroless plating process and the electrolytic plating process will be described in detail.

The electroless plating treatment refers to an operation of depositing a metal by a chemical reaction using a solution in which metal ions to be deposited as a plating are dissolved.
In the electroless plating in this step, for example, a substrate provided with a pattern-like plated layer provided with an electroless plating catalyst is washed with water to remove excess electroless plating catalyst (metal), and then the electroless plating bath is used. It is preferable to immerse. As the electroless plating bath used, a known electroless plating bath can be used.
In addition, when a substrate provided with a patterned plating layer provided with an electroless plating catalyst precursor is immersed in an electroless plating bath in a state where the electroless plating catalyst precursor is adsorbed or impregnated in the patterned plating layer Preferably, the substrate is washed with water to remove excess electroless plating catalyst precursor (such as a metal salt) and then immersed in an electroless plating bath. In this case, reduction of the electroless plating catalyst precursor and subsequent electroless plating are performed in the electroless plating bath. As the electroless plating bath used here, a known electroless plating bath can be used as described above.
In addition, the reduction of the electroless plating catalyst precursor may be performed as a separate process before electroless plating by preparing a catalyst activation liquid (reducing liquid) separately from the embodiment using the electroless plating liquid as described above. Is possible.

As a composition of a general electroless plating bath, in addition to a solvent (for example, water), 1. 1. metal ions for plating; 2. reducing agent; Additives (stabilizers) that improve the stability of metal ions are mainly included. In addition to these, the plating bath may contain known additives such as a plating bath stabilizer.
The organic solvent used in the electroless plating bath is preferably a solvent that can be used with water, and from this point, ketones such as acetone and alcohols such as methanol, ethanol, and isopropanol are preferably used. Copper, tin, lead, nickel, gold, silver, palladium, and rhodium are known as the types of metals used in the electroless plating bath. Among these, copper, silver, and gold are preferable from the viewpoint of conductivity. Preferably, copper is more preferable. Moreover, the optimal reducing agent and additive are selected according to the said metal.
The immersion time in the electroless plating bath is preferably about 1 minute to 6 hours, and more preferably about 1 minute to 3 hours.

In this step, when the plating catalyst or its precursor applied to the patterned layer to be plated has a function as an electrode, the electroplating layer to which the catalyst or its precursor is applied Plating can be performed.
In addition, as above-mentioned, in this process, an electroplating process can be performed as needed after the said electroless-plating process. In such an aspect, the thickness of the formed lead wiring can be adjusted as appropriate.
As a method of electroplating, a conventionally known method can be used. In addition, as a metal used for electroplating, copper, chromium, lead, nickel, gold | metal | money, silver, tin, zinc etc. are mentioned, Copper, gold | metal | money, silver is preferable from a conductive viewpoint, and copper is more preferable.

[Conductive connection]
The conductive connection portion 24 is a connection portion that electrically connects the detection electrode 14 and the lead wiring 18. The conductive connection portion 24 is disposed so as to be in contact with the detection electrode 14 and the extraction wiring 18. By disposing the conductive connection portion 24, the conductivity between the detection electrode 14 and the lead-out wiring 18 is further improved.
The material constituting the conductive connection portion 24 is not particularly limited as long as it is a material exhibiting conductivity. For example, a metal such as gold (Au), silver (Ag), copper (Cu), aluminum (Al) ( Alloy) and conductive resins. In addition, as a metal, the form of metal fine particles is mentioned.
The method for forming the conductive connection portion 24 is not particularly limited, but an embodiment using a conductive composition (so-called conductive paste or conductive ink) is preferable. That is, it is preferable that the electroconductive connection part 24 is a connection part formed from the electroconductive composition. Specifically, the conductive composition is applied so as to be in contact with the detection electrode 14 and the lead-out wiring 18 by a printing method such as an inkjet method, a screen printing method, a flexographic printing method, or a gravure printing method, and if necessary, It is formed by performing a curing process.
The difference between the conductive paste and the conductive ink is a difference in viscosity due to the dispersion medium, and the conductive paste generally has a high viscosity because it contains a polymer component as a dispersion medium. A flexographic printing method can be suitably used. In the conductive ink, a low molecular component is generally contained as a dispersion medium, so that the viscosity is low, and an ink jet method or the like can be suitably used.

[substrate]
The substrate 12 has two main surfaces and is a member that supports the detection electrode 14 in the central region E _I and supports the patterned plated layer 16 in the outer region E _O.
The kind in particular of board | substrate 12 is not restrict | limited, For example, an insulating substrate is mentioned, More specifically, a resin substrate, a ceramic substrate, a glass substrate etc. can be used.
Examples of the resin substrate material include polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, polyacrylic resin, polyurethane resin, polyester, polycarbonate, polysulfone, polyamide, polyarylate, polyolefin, cellulose resin, polyvinyl chloride, Examples thereof include cycloolefin resins. Of these, polyethylene terephthalate, polyethylene naphthalate, or polyolefin is preferable.
The thickness (mm) of the substrate 12 is not particularly limited, but is preferably 0.05 to 2 mm, more preferably 0.1 to 1 mm, from the viewpoint of the balance between handleability and thinning.
Moreover, it is preferable that the board | substrate 12 permeate | transmits light appropriately. Specifically, the total light transmittance of the substrate 12 is preferably 85 to 100%.

(Primer layer (adhesion auxiliary layer))
The adhesion between the substrate and the patterned plating layer (or plating layer) may be affected by the surface state and rigidity of the substrate. Therefore, a primer layer for improving the adhesion between the substrate and the pattern-like plated layer (or the plated layer) may be appropriately disposed on the substrate depending on the type of the substrate. In other words, a primer layer may be interposed between the substrate and the pattern-like plated layer (or plated layer).
In order to improve the adhesion of the patterned layer to be plated (or the layer to be plated) with the primer layer, the surface energy is controlled, the chemical bond with the layer to be plated is formed, or the adhesive force by stress relaxation It is possible to take various measures for improving the adhesion, such as using In the case of surface energy control, for example, a low molecular layer or a polymer layer close to the surface energy of the layer to be plated can be used. In the case of forming a chemical bond, a low molecular layer or a high molecular layer having a polymerization active site can be used. In the case where the adhesive force due to stress relaxation is used, a rubber-like resin having a low elastic modulus can be used.

The thickness of the primer layer is not particularly limited, but is generally preferably 0.01 to 100 μm, more preferably 0.05 to 20 μm, and further preferably 0.05 to 10 μm.
The material for the primer layer is not particularly limited, and is preferably a resin having good adhesion to the substrate. Specific examples of the resin may be, for example, a thermosetting resin, a thermoplastic resin, or a mixture thereof. For example, as the thermosetting resin, an epoxy resin, a phenol resin, a polyimide resin, a polyester resin, a bismaleimide resin, Examples include polyolefin resins and isocyanate resins. Examples of the thermoplastic resin include phenoxy resin, polyether sulfone, polysulfone, polyphenylene sulfone, polyphenylene sulfide, polyphenyl ether, polyether imide, and ABS resin.
The thermoplastic resin and the thermosetting resin may be used alone or in combination of two or more. In addition, a resin containing a cyano group may be used. Specifically, an ABS resin or “unit having a cyano group in the side chain” described in JP-A 2010-84196 [0039] to [0063] is included. "Polymer" may be used.
Also, rubber components such as NBR rubber (acrylonitrile / butadiene rubber) and SBR rubber (styrene / butadiene rubber) can be used.

One preferred embodiment of the material constituting the primer layer includes a polymer having a conjugated diene compound unit that may be hydrogenated. The conjugated diene compound unit means a repeating unit derived from a conjugated diene compound. The conjugated diene compound is not particularly limited as long as it is a compound having a molecular structure having two carbon-carbon double bonds separated by one single bond.
One preferred embodiment of the repeating unit derived from a conjugated diene compound includes a repeating unit produced by a polymerization reaction of a compound having a butadiene skeleton.
The conjugated diene compound unit may be hydrogenated. When the conjugated diene compound unit includes a hydrogenated conjugated diene compound unit, the adhesion of the patterned metal layer is preferably improved. That is, the double bond in the repeating unit derived from the conjugated diene compound may be hydrogenated.
The above-mentioned interactive group may be contained in the polymer having a conjugated diene compound unit that may be hydrogenated.
Preferred examples of this polymer include acrylonitrile butadiene rubber (NBR), carboxyl group-containing nitrile rubber (XNBR), acrylonitrile-butadiene-isoprene rubber (NBIR), acrylonitrile-butadiene-styrene copolymer (ABS resin), or These hydrogenated products (for example, hydrogenated acrylonitrile butadiene rubber) and the like can be mentioned.

The primer layer contains other additives (for example, sensitizers, antioxidants, antistatic agents, ultraviolet absorbers, fillers, particles, flame retardants, surfactants, lubricants, plasticizers, etc.). Also good.

The method for forming the primer layer is not particularly limited, and a method of laminating a resin to be used on a substrate, a method in which a necessary component is dissolved in a soluble solvent, and a method such as coating and drying on a substrate surface Etc.
The heating temperature and time in the coating method may be selected so that the coating solvent can be sufficiently dried, but from the viewpoint of production suitability, the heating temperature should be 200 ° C. or less and the heating condition within the range of 60 minutes. It is preferable to select heating conditions in the range of heating temperature 40 to 100 ° C. and time 20 minutes or less. As the solvent to be used, an optimal solvent (for example, cyclohexanone or methyl ethyl ketone) is appropriately selected according to the resin to be used.

[Detection electrode]
The detection electrode 14 is a sensing electrode that senses a change in capacitance in a touch panel sensor including the conductive film for a touch panel sensor of the present embodiment, and constitutes a sensing unit (sensing unit). That is, when the fingertip is brought into contact with the touch panel, the mutual capacitance between the detection electrode 14 and the other electrode changes, and the position of the fingertip is calculated by an IC (integrated circuit) circuit based on the change amount.
The detection electrode 14 has a role of detecting an input position in the X direction of an operator's finger approaching the central region E _I and has a function of generating a capacitance between the detection electrode 14 and the finger. . The detection electrodes 14 are electrodes that extend in a first direction (X direction) and are arranged at a predetermined interval in a second direction (Y direction) orthogonal to the first direction. In FIG. 1, five detection electrodes 14 are provided, but the number thereof is not particularly limited, and a plurality of detection electrodes 14 may be provided.
In FIG. 1, the detection electrode 14 is a solid film, but may include a predetermined pattern such as a mesh shape.

The material that constitutes the detection electrode 14 is not particularly limited, and examples thereof include metal oxides such as indium tin oxide (ITO), tin oxide, zinc oxide, cadmium oxide, gallium oxide, and titanium oxide. Alternatively, a metal or an alloy such as gold (Au), silver (Ag), copper (Cu), or aluminum (Al) may be used.
The method for forming the detection electrode 14 is not particularly limited, and a known method can be adopted, but it is preferably formed by, for example, a sputtering method or a vapor deposition method.

Although not shown in FIG. 1, a flexible printed wiring board or the like may be disposed at a location where the other end of the lead-out wiring 18 (an end portion not on the detection electrode 14 side) is located. The flexible printed wiring board is a board in which a plurality of wirings and terminals are provided on a substrate, and is connected to each other end of the lead-out wiring 18, and a capacitive touch panel sensor and an external device (for example, a display device). Play a role in connecting.

[Method for producing conductive film for touch panel sensor]
Although the manufacturing method of the conductive film 10 for touch panel sensors mentioned above is not restrict | limited in particular, Although a well-known method is employ | adopted, the following two methods are mainly mentioned.
(Method 1): After the detection electrode 14 is arranged on the substrate 12 at a predetermined position, the patterned plating layer 16 is arranged on the substrate 12 at a predetermined position, and the lead wiring is formed on the patterned plating layer 16. 18 is disposed, and then the conductive connection portion 24 is disposed (method 2): after the patterned plated layer 16 is disposed on the substrate 12 at a predetermined position, the lead wiring is disposed on the patterned plated layer 16. 18 and then, the method of disposing the detection electrode 14 at a predetermined position on the substrate 12 and then disposing the conductive connection portion 24. In the above method 1 and method 2, the patterned plated layer 16 and As a procedure for manufacturing the lead wiring 18, it is preferable that the procedure described in the above-mentioned “Method for manufacturing a patterned plated layer and a lead wiring” is performed.

The conductive film 10 for a touch panel sensor described above can be suitably used for a touch panel sensor.
For example, two conductive films (film A and film B) for a touch panel sensor are prepared, the detection electrode 14 in the film A and the detection electrode 14 in the film B are opposed, and the detection electrode in the film A 14 and the detection electrode 14 in the film B are orthogonally bonded to each other by attaching an adhesive to the film A and the film B, and, if necessary, connecting other members (for example, a flexible printed circuit board), A capacitive touch panel sensor can be obtained.
In addition, two conductive films (film A and film B) for the touch panel sensor are prepared, and the detection electrode 14 in the film A and the substrate 12 in the film B are opposed to each other, and the detection electrode 14 in the film A is provided. The film A and the film B are bonded with an adhesive so that the detection electrode 14 in the film B and the detection electrode 14 are orthogonal to each other, and another member (for example, a flexible printed wiring board) is connected as necessary. A capacitive touch panel sensor can also be obtained.
The touch panel sensor as described above can be suitably applied to a touch panel (in particular, a capacitive touch panel).

<< Second Embodiment >>
In FIG. 5, the top view of 2nd Embodiment of the conductive film for touchscreen sensors of this invention is shown. FIG. 6 is a cross-sectional view taken along the cutting line CC.
The conductive film 100 for a touch panel sensor shown in FIG. 5 includes a substrate 12, a detection electrode 14, a patterned plated layer 160, and a lead wiring 18 disposed on one main surface (surface) of the substrate 12. And a conductive connection portion 24. In FIG. 5, the patterned plated layer 160 is disposed over the entire outer region E 2 _O. In other words, the patterned plated layer 160 is disposed on the surface of the substrate 12 other than the central region E _I.
Since the conductive film 100 for a touch panel sensor shown in FIG. 5 has the same configuration as that of the conductive film 10 for a touch panel sensor shown in FIG. The same reference numerals are assigned to the same components, and the description thereof is omitted. Hereinafter, the patterned plated layer 160 will be mainly described in detail.

The patterned plated layer 160 has the same configuration as the patterned plated layer 16 described in the first embodiment, and differs only in the arrangement position on the substrate 12.
Examples of the method for forming the patterned plated layer 160 include the same procedure as the method for forming the patterned plated layer 16 described in the first embodiment, and the above-described [Step 1: Patterned plated layer formation]. What is necessary is just to make it the area | region which assign | provides the energy in a process become the whole outer area | region _EO .
In the present embodiment, the manufacturing method of the lead wiring 18 is not particularly limited, but the following process 3 (drawing wiring forming process) is preferably exemplified. Hereinafter, the procedure of step 3 will be described in detail.

[Step 3: Lead-out wiring formation step]
Step 3 applies a plating catalyst or a precursor thereof to the patterned layer to be plated, and performs a plating process on the layer to be plated to which the plating catalyst or the precursor has been applied. This is a step of forming a layer and etching the resulting metal layer into a pattern to form a lead-out wiring. More specifically, first, as shown in FIG. 7A, the substrate 12 on which the patterned plating layer 160 is arranged is prepared, and then, as shown in FIG. A plating catalyst or a precursor thereof is applied to the plating layer 160 and plating is performed to form the metal layer 30 on the patterned layer 160. Next, as shown in FIG. The lead wire 18 is obtained by etching the layer 30 into a pattern.

In this step, a plating catalyst or a precursor thereof is applied to the patterned layer to be plated 160, and a plating treatment is performed on the patterned layer 160 to which the plating catalyst or its precursor has been applied. Since the procedure of forming the metal layer 30 on the layer 160 is the same as the procedure of the steps 2-1 and 2-2 described in the first embodiment, detailed description thereof is omitted.
Hereinafter, the procedure of the process of forming the lead wiring 18 by etching the metal layer 30 in a pattern will be described in detail.

Any method can be used to form the lead-out wiring 18, and specifically, a generally known subtractive method (a patterned mask is provided on the metal layer, and a non-mask forming region is etched). After the treatment, the mask is removed and a lead wiring is formed), a semi-additive method (a patterned mask is provided on the metal layer, and a plating process is performed so as to form a metal layer in a non-mask formation region) , A method of removing the mask and performing etching to form a lead-out wiring).
Specifically, the subtractive method is to provide a resist layer on the formed metal layer, form the same pattern as the lead wiring formed by pattern exposure and development, and use the resist pattern as a mask to form the metal layer with an etching solution. This is a method of removing and forming a lead wiring. Any material can be used as the resist, and negative, positive, liquid, and film-like ones can be used. Moreover, as an etching method, any method used at the time of manufacturing a printed wiring board can be used, and wet etching, dry etching, and the like can be used, and may be arbitrarily selected. In terms of operation, wet etching is preferable from the viewpoint of simplicity of the apparatus. As an etching solution, for example, an aqueous solution of cupric chloride, ferric chloride, or the like can be used.
Specifically, the semi-additive method is to provide a resist layer on the formed metal layer, form the same pattern as the non-metal layer pattern portion by pattern exposure and development, and perform electrolytic plating using the resist pattern as a mask, This is a method of forming a lead-out wiring by performing quick etching after removing the resist pattern and removing the metal layer in a pattern. The resist, the etching solution, etc. can use the same material as the subtractive method. Moreover, the above-described method can be used as a method of electrolytic plating treatment.

In addition, when performing the etching process of the metal layer, the metal particles formed by reducing metal ions contained in the pattern plating layer located immediately below the metal layer to be removed are combined as necessary. It may be removed.
In addition, the removal method in particular of the said metal particle is not restrict | limited, The removal of a metal particle can also be implemented with the removal of a metal layer by adjusting the kind of etching liquid used, and etching time.

<< Third Embodiment >>
In FIG. 8, the top view of 3rd Embodiment of the conductive film for touchscreen sensors of this invention is shown. FIG. 9 is a cross-sectional view taken along the cutting line DD.
A conductive film 200 for a touch panel sensor shown in FIG. 8 includes a substrate 12, a plated layer 22 disposed on the substrate 12, a detection electrode 14 disposed on the plated layer 22, lead wires 18, And a conductive connection portion 24. In FIG. 8, the layer to be plated 22 is disposed over the entire surface of the substrate 12, and the detection electrode 14 and the lead wiring 18 are disposed on the layer to be plated 22.
The conductive film 200 for a touch panel sensor shown in FIG. 8 is for the touch panel sensor shown in FIG. 1 except that the plated layer 22 is used instead of the patterned plated layer 16 and the arrangement of each member is changed. Since it has the same configuration as that of the conductive film 10, the same reference numeral is given to the same component, the description thereof is omitted, and the plated layer 22 will be mainly described in detail below.

The to-be-plated layer 22 and the pattern-like to-be-plated layer 16 demonstrated in 1st Embodiment differ in the area | region arrange | positioned on the board | substrate 12, and have the same structure. Specifically, the to-be-plated layer 22 has an interactive group.
The formation method of the to-be-plated layer 22 is not specifically limited, The procedure similar to 1st Embodiment mentioned above is mentioned, The area | region which provides the energy in the [process 1: patterned to-be-plated layer forming process] mentioned above is a board | substrate. What is necessary is just to become 12 whole areas.
Further, the method for manufacturing the lead wiring 18 is not particularly limited, but the step 3 (drawing wiring forming step) described in the second embodiment is preferable.

<< Fourth Embodiment >>
In the first to third embodiments, the mode in which the detection electrode, the patterned layer to be plated (or the layer to be plated), the lead-out wiring, and the conductive connection portion are arranged on one surface of the substrate has been described. The detection electrode, the patterned plated layer (or plated layer), the lead-out wiring, and the conductive connection portion may be disposed on both surfaces of the substrate.
FIG. 10: shows the top view of 4th Embodiment of the conductive film for touchscreen sensors of this invention. FIG. 11 is a cross-sectional view taken along the cutting line DD.
As shown in FIG. 10, the conductive film 300 for a touch panel sensor includes a substrate 12, a detection electrode 14 disposed on both surfaces of the substrate 12, a patterned plated layer 16, lead wires 18, and conductivity. And a connection unit 24. As shown in FIG. 10, the detection electrode 14 disposed on the front surface of the substrate 12 and the detection electrode 14 disposed on the back surface of the substrate 12 are disposed so as to be orthogonal to each other.

Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to these.

(Synthesis example: Polymer 1)
1 L of ethyl acetate and 159 g of 2-aminoethanol were placed in a 2 L three-necked flask and cooled in an ice bath. Thereto, 150 g of 2-bromoisobutyric acid bromide was added dropwise while adjusting the internal temperature to 20 ° C. or less. Thereafter, the internal temperature was raised to room temperature (25 ° C.) and reacted for 2 hours. After completion of the reaction, 300 mL of distilled water was added to stop the reaction. Thereafter, the ethyl acetate phase was washed four times with 300 mL of distilled water, dried over magnesium sulfate, and 80 g of raw material A was obtained by distilling off ethyl acetate.
Next, 47.4 g of raw material A, 22 g of pyridine, and 150 mL of ethyl acetate were placed in a 500 mL three-necked flask and cooled in an ice bath. Thereto, 25 g of acrylic acid chloride was added dropwise while adjusting the internal temperature to 20 ° C. or lower. Then, it was raised to room temperature and reacted for 3 hours. After completion of the reaction, 300 mL of distilled water was added to stop the reaction. Thereafter, the ethyl acetate phase was washed four times with 300 mL of distilled water and then dried over magnesium sulfate, and further ethyl acetate was distilled off. Thereafter, the following monomer M1 (20 g) was obtained by column chromatography.

A 500 mL three-necked flask was charged with 8 g of N, N-dimethylacetamide and heated to 65 ° C. under a nitrogen stream. Thereto, monomer M1: 14.3 g, acrylonitrile (manufactured by Tokyo Chemical Industry Co., Ltd.) 3.0 g, acrylic acid (manufactured by Tokyo Chemical Industry) 6.5 g, V-65 (manufactured by Wako Pure Chemical Industries) 0.4 g of N, A solution of 8 g of N-dimethylacetamide was added dropwise over 4 hours.
After completion of the dropwise addition, the reaction solution was further stirred for 3 hours. Thereafter, 41 g of N, N-dimethylacetamide was added, and the reaction solution was cooled to room temperature. To the reaction solution, 0.09 g of 4-hydroxy TEMPO (manufactured by Tokyo Chemical Industry) and 54.8 g of DBU (diazabicycloundecene) were added and reacted at room temperature for 12 hours. Thereafter, 54 g of a 70 mass% methanesulfonic acid aqueous solution was added to the reaction solution. After completion of the reaction, reprecipitation was carried out with water, the solid matter was taken out, and 12 g of polymer 1 was obtained.

The obtained polymer 1 was identified using an IR (infrared) measuring machine (manufactured by Horiba, Ltd.). The measurement was performed by dissolving the polymer in acetone and using KBr crystals. As a result of IR measurement, a peak was observed in the vicinity of 2240 cm ⁻¹ , and it was found that acrylonitrile, which is a nitrile unit, was introduced into the polymer. Moreover, it was found from the acid value measurement that acrylic acid was introduced as a carboxylic acid unit. Further, it was dissolved in heavy DMSO (dimethyl sulfoxide) and measured by Bruker 300 MHz NMR (Nuclear Magnetic Resonance) (AV-300). 4. A peak corresponding to the nitrile group-containing unit is broadly observed at 2.5-0.7 ppm (5H min), and a peak corresponding to the polymerizable group-containing unit is 7.8-8.1 ppm (1H min). 8-5.6 ppm (1H min), 5.4-5.2 ppm (1H min), 4.2-3.9 ppm (2H min), 3.3-3.5 ppm (2H min), 2.5- A broad peak is observed at 0.7 ppm (6H min), and a peak corresponding to a carboxylic acid-containing unit is broadly observed at 2.5-0.7 ppm (3H min). A polymerizable group-containing unit: a nitrile group-containing unit: It was found that the carboxylic acid group unit = 30: 30: 40 (mol%).

<Preparation of composition for forming layer to be plated>
In a 200 ml beaker containing a magnetic stirrer, water (18.95 parts by mass), propylene glycol monomethyl ether (75.8 parts by mass), polymer 1 (5 parts by mass), and IRGACUREOXE02 (manufactured by BASF) (0. 0 parts). 25 parts by mass) was added to prepare a composition for forming a layer to be plated.

<Example 1>
A glass substrate (manufactured by Corning) was heated and dried at 150 ° C. for 1 hour, and then a primer layer forming composition (Nipol 1561 (manufactured by ZEON Corporation) in water dispersion (total solid content concentration: 40.5 parts by mass) ) Was spin-coated at 1500 rpm for 1 minute and dried at 120 ° C. for 30 minutes to form a primer layer. Subsequently, the composition for forming a layer to be plated was spin-coated on the primer layer and dried at 80 ° C. for 5 minutes. After that, the substrate was irradiated with UV in the atmosphere (energy amount: 2J, 10 mW, wavelength: 256 nm) through a negative mask having a pattern of 3 μm / 3 μm line / space, and 1% sodium hydrogen carbonate was used. And developed to form a patterned plated layer (thickness: 0.25 μm).
After masking the surface of the glass substrate on which the patterned coating layer is not formed with a curing tape (manufactured by Nitto Denko), the glass substrate having the patterned coating layer is coated with Pd catalyst applying liquid MAT-2 (manufactured by Uemura Kogyo). Of MAT-2A alone (catalyst imparting solution, pH: 3.5) was immersed for 5 minutes at room temperature, and washed twice with pure water. Next, it was immersed in a reducing agent MAB (manufactured by Uemura Kogyo) at 36 ° C. for 5 minutes and washed twice with pure water. Thereafter, it was immersed in an activation treatment solution MEL-3 (manufactured by Uemura Kogyo) at room temperature for 5 minutes, and immersed in electroless plating solution Sulcup PEA (manufactured by Uemura Kogyo) for 60 minutes at room temperature without washing. The masked tape was peeled off and washed twice with pure water to obtain a glass substrate provided with a patterned copper layer (corresponding to a lead-out wiring) on the patterned plated layer.

Next, sputtering using an indium oxide-tin oxide target having a composition of indium oxide and tin oxide at a weight ratio of 95: 5 and a packing density of 98% is applied to a region where the patterned copper layer on the glass substrate is not disposed. An ITO layer was formed by the method, and resist patterning and etching were performed by a photolithography method to obtain a patterned ITO layer (corresponding to a detection electrode).
Furthermore, conductive ink containing silver nanoparticles (NPS-JL manufactured by Harima Chemicals Co., Ltd.) is dropped between the patterned copper layer and the ITO layer by an inkjet method, and heat-curing treatment is performed. A conductive connecting portion made of silver, which electrically connects the layer and the ITO layer, was formed to obtain a conductive film.

<Example 2>
A glass substrate (manufactured by Corning) was heated and dried at 150 ° C. for 1 hour, and then a primer layer forming composition (Nipol 1561 (manufactured by ZEON Corporation) in water dispersion (total solid content concentration: 40.5 parts by mass) ) Was spin-coated at 1500 rpm for 1 minute and dried at 120 ° C. for 30 minutes to form a primer layer. Subsequently, the composition for forming a layer to be plated was spin-coated on the primer layer and dried at 80 ° C. for 5 minutes. Thereafter, UV irradiation (energy amount: 2 J, 10 mW, wavelength: 256 nm) was performed on the entire surface of the coating film in the air to form a layer to be plated (thickness: 0.25 μm).
After masking the surface of the glass substrate on which the layer to be plated is formed with a curing tape (manufactured by Nitto Denko), the glass substrate having the layer to be plated is made of MAT-2A made of Pd catalyst application liquid MAT-2 (manufactured by Uemura Kogyo). No. 5 was diluted 5 times at room temperature and washed twice with pure water. Next, it was immersed in a reducing agent MAB (manufactured by Uemura Kogyo) at 36 ° C. for 5 minutes and washed twice with pure water. Thereafter, it was immersed in an activation treatment solution MEL-3 (manufactured by Uemura Kogyo) at room temperature for 5 minutes, and immersed in electroless plating solution Sulcup PEA (manufactured by Uemura Kogyo) for 60 minutes at room temperature without washing. The masked tape was peeled off and washed twice with pure water to obtain a glass substrate having a copper layer on the layer to be plated.
A dry resist film (manufactured by Hitachi Chemical; RY3315, film thickness: 15 μm) was laminated on the obtained copper layer with a vacuum laminator (manufactured by Meiki Seisakusho: MVLP-600) at 70 ° C. and 0.2 MPa. Next, a glass mask capable of forming a comb-type wiring (compliant with JPCA-BU01-2007) as defined in JPCA-ET01 is closely attached to the substrate on which the dry resist film is laminated, and the resist is exposed to light of 70 mJ with an exposure machine having a central wavelength of 405 nm. Irradiated with energy. Development was performed by spraying a 1% Na ₂ CO ₃ aqueous solution onto the exposed substrate at a spray pressure of 0.2 MPa. Thereafter, the substrate was washed with water and dried to form a resist pattern having a line / space of 8 μm / 8 μm.
Etching was performed by immersing the substrate on which the resist pattern was formed in an FeCl ₃ / HCl aqueous solution (etching solution) at a temperature of 40 ° C. to remove the copper layer present in the region where the resist pattern was not formed. Thereafter, the resist pattern is swollen and peeled off by spraying a 3% NaOH aqueous solution onto the substrate at a spray pressure of 0.2 MPa, neutralized with a 10% sulfuric acid aqueous solution, and washed with water to form a patterned copper layer (drawer). A glass substrate provided with a wiring) was obtained.
Using the obtained glass substrate, according to the same procedure as in Example 1, a patterned ITO layer and a conductive connection part were formed to obtain a conductive film.

<Comparative Example 1>
Except that a patterned silver layer (corresponding to a lead-out wiring) was produced by an inkjet method (DMP2831 made by FUJIFILM Dimatix) using conductive ink (NPS-JL made by Harima Chemicals Co., Ltd.) instead of the patterned copper layer According to the same procedure as in Example 1, a conductive film was obtained.
However, in the ink jet method using conductive ink, only a patterned silver layer having a line / space of 100 μm / 100 μm was obtained due to a problem in the performance of the apparatus.

<Miniaturization evaluation>
The line / space sizes of the patterned copper layers of Examples 1 and 2 and the patterned silver layer of Comparative Example 1 were evaluated according to the following criteria.
“A”: When a line / space width of 5 μm or less can be formed “B”: A line / space width of both 5 μm and 10 μm or less can be formed “C”: Line / space When only patterns with a width exceeding 10 μm can be formed

<Adhesion evaluation>
(Tape peeling test)
As an evaluation method, a tape peeling test was performed after the patterned copper layer of Examples 1 and 2 and the patterned silver layer of Comparative Example 1 were formed, and the patterned copper layer or the patterned silver layer was not peeled off. The residual rate remaining above was evaluated according to the following criteria.
The tape peeling test was performed according to JIS K5600-5-6.
“A”: 90 to 100% remaining “B”: More than 10% peeled

<Connectivity evaluation>
(Connection resistance measurement)
As an evaluation method, a resistance value between the patterned copper layer (or patterned silver layer) and the patterned ITO layer was measured (manufactured by Hioki Electric Co., Ltd., milliohm high tester 3540), and evaluated according to the following criteria.
“A”: When the resistance value is 10 mΩ or less “B”: When the resistance value exceeds 10 mΩ “C”: When the resistance value cannot be measured and is substantially disconnected

The evaluation results are summarized in Table 1.
In Table 1, “X” in the “Treatment Method” column means a method of forming a patterned copper layer on the patterned layer to be plated, and “Y” indicates that the patterned copper layer is etched by etching the copper layer. Intended for the method of forming.

As shown in Examples 1 and 2, the patterned copper layer (corresponding to the lead-out wiring) in the conductive film for a touch panel sensor of the present invention can be miniaturized and has excellent adhesion. Moreover, the electrical connectivity between the patterned copper layer and the ITO layer (corresponding to the detection electrode) was also high.
On the other hand, in Comparative Example 1 using conductive ink, the patterned silver layer (corresponding to the lead-out wiring) could not be refined in the first place, and the adhesiveness of the formed patterned silver layer was inferior.

<Example 3>
A glass substrate (manufactured by Corning) was heated and dried at 150 ° C. for 1 hour, and then a primer layer forming composition (Nipol 1561 (manufactured by ZEON Corporation) in water dispersion (total solid content concentration: 40.5 parts by mass) ) Was spin-coated at 1500 rpm for 1 minute and dried at 120 ° C. for 30 minutes to form a primer layer. Subsequently, the composition for forming a layer to be plated was spin-coated on the primer layer at 1500 rpm for 1 minute and dried at 80 ° C. for 5 minutes. Thereafter, the substrate is irradiated with UV light (energy amount: 2J, 10 mW, wavelength: 256 nm) in the air through a predetermined negative mask, and developed with 1% sodium hydrogen carbonate, thereby developing the substrate shown in FIG. A patterned plated layer was formed at the same position as the patterned plated layer 16.
A patterned copper layer was produced on the patterned plated layer according to the same procedure as in Example 1 using the obtained glass substrate having the patterned plated layer. The obtained patterned copper layer is disposed at the same position as the lead-out wiring 18 in FIG.
Next, an ITO layer was produced by sputtering or photolithography so that the ITO layer was disposed at the position of the detection electrode 14 in FIG.
Further, a conductive ink containing silver nanoparticles (NPS-JL manufactured by Harima Kasei Co., Ltd.) is used in the inkjet method between the patterned copper layer and the ITO layer so that the conductive connection portion 24 of FIG. 1 is formed. Then, a heat curing treatment was performed to form a conductive connection portion made of silver.
In addition, the obtained conductive film for a touch panel showed desired effects (miniaturization, low resistance, high adhesion) as in Example 1.

Moreover, the conductive film for touchscreens was obtained according to the procedure similar to the above except having formed the pattern-like to-be-plated layer in the same position as the pattern-like to-be-plated layer 160 of FIG.
Furthermore, the conductive film for touch panels of the aspect shown in FIG. 10 was obtained by implementing the said procedure on both surfaces of a glass substrate.

10, 100, 200, 300 Conductive film for touch panel sensor 12 Substrate 14 Detection electrode 16,160 Patterned layer to be plated 18 Lead-out wiring 20 Coating layer 22 Plated layer 24 Conductive connection 30 Metal layer

Claims

A substrate,
A detection electrode disposed on at least one surface of the substrate;
On the surface of the substrate on the side where the detection electrode is located, a pattern-like plated layer disposed around the detection electrode and having a functional group that interacts with a plating catalyst or a precursor thereof;
A lead-out line disposed on the patterned layer to be plated;
A conductive connection portion for electrically connecting the detection electrode and the lead-out wiring;
The lead-out wiring includes at least a step of applying a plating catalyst or a precursor thereof to the patterned plating layer and performing a plating process on the patterned plating layer provided with the plating catalyst or the precursor thereof. A conductive film for a touch panel sensor, which is a wiring formed by the method.
The patterned layer to be plated is formed by applying energy in a pattern to a composition for forming a layer to be plated containing a compound having a functional group and a polymerizable group that interacts with a plating catalyst or a precursor thereof. The conductive film for a touch panel sensor according to claim 1, wherein the conductive film is a layer.
A substrate,
A layer to be plated having a functional group that interacts with the plating catalyst or a precursor thereof disposed on the substrate;
A detection electrode disposed on the plated layer;
On the plated layer, a lead-out wiring arranged around the detection electrode,
A conductive connection portion for electrically connecting the detection electrode and the lead-out wiring;
The lead-out wiring imparts a plating catalyst or a precursor thereof to the layer to be plated, performs a plating process on the layer to be plated with the plating catalyst or the precursor, and forms a metal layer, A conductive film for a touch panel sensor, which is a wiring formed by etching a metal layer in a pattern.
The conductive film for a touch panel sensor according to any one of claims 1 to 3, wherein the conductive connection portion is a connection portion formed by a printing method using a conductive paste or conductive ink.
The conductive film for a touch panel sensor according to any one of claims 1 to 4, wherein the detection electrode is an electrode formed by a sputtering method or a vapor deposition method.
The conductive film for a touch panel sensor according to any one of claims 1 to 5, wherein a primer layer is disposed adjacent to the substrate surface.
The conductive film for a touch panel sensor according to any one of claims 1 to 6, wherein a line width of the lead wiring is 1 to 10 µm.
A touch panel sensor comprising the conductive film for a touch panel sensor according to any one of claims 1 to 7.
A touch panel comprising the conductive film for a touch panel sensor according to any one of claims 1 to 7.