JP6295330B2 - Conductive laminate for touch panel sensor, and manufacturing method thereof, touch panel sensor, touch panel - Google Patents

Description

  The present invention relates to a conductive laminate for a touch panel sensor, a manufacturing method thereof, a touch panel sensor, and a touch panel.

Conductive films with conductive thin wires formed on a substrate are used in various applications, and in particular, in recent years, with the increase in the mounting rate of touch panels on mobile phones, portable game devices, etc., multipoint detection has been performed. The demand for conductive films for possible capacitive touch panel sensors is rapidly expanding.
Various methods for producing a conductive layer functioning as a lead-out wiring included in a conductive film for a touch panel sensor have been proposed. For example, in Patent Document 1, there is no method for forming a graft polymer having an interactive group. A method for producing a conductive layer by applying an electroplating catalyst or a precursor thereof and performing electroless plating is disclosed.

JP 2008-207401 A

In Patent Document 1, it is described that the conductive layer can function as “leading wiring (leading wiring) connecting the electrode (detection electrode) in the touch panel and the driver”, but a description regarding the specific configuration is described. Absent.
With reference to the method described in Patent Document 1, the present inventors have found that when a conductive layer is produced as a lead-out wiring, a conductive failure may occur with the detection electrode.

In view of the above circumstances, an object of the present invention is to provide a conductive laminate for a touch panel sensor having high electrical connectivity between a detection electrode and a lead-out wiring.
Moreover, this invention also makes it a subject to provide the manufacturing method of the said conductive laminated body for touchscreen sensors, the touchscreen sensor containing the conductive laminated body for touchscreen sensors, and a touchscreen.

The inventors of the present invention conducted extensive studies on the problems of the prior art, and by controlling the positional relationship between the detection layer and the resin layer having a functional group that interacts with the plating catalyst or its precursor, I found that the problem could be solved.
That is, the present inventors have found that the above problem can be solved by the following configuration.

(1) a substrate;
A resin layer having a functional group that interacts with a plating catalyst or a precursor thereof disposed in a peripheral region on the substrate;
A detection electrode disposed on the substrate such that one end thereof is in contact with the resin layer;
A lead wire disposed on the resin layer and electrically connected to one end of the detection electrode;
The lead-out wiring is a wiring formed by a method having at least a step of applying a plating catalyst or a precursor thereof to the resin layer and performing a plating treatment on the resin layer to which the plating catalyst or the precursor is applied, Conductive laminate for touch panel sensor.
(2) It further has an insulating layer covering the detection electrode so that one end portion electrically connected to the lead-out wiring of the detection electrode is exposed,
The conductive laminate for a touch panel sensor according to (1), wherein the insulating layer is substantially free of a functional group that interacts with a plating catalyst or a precursor thereof.
(3) The colorant is contained in the resin layer, the resin layer functions as a decorative layer,
The conductive laminate for a touch panel sensor according to (1) or (2), wherein one end of the detection electrode extends to the top of the resin layer.
(4) A laminated resin layer in which the resin layer includes a lower resin layer containing a colorant and an upper resin layer that is disposed on the lower resin layer and has a functional group that interacts with the plating catalyst or its precursor. And
The conductive laminate for a touch panel sensor according to (1) or (2), wherein one end of the detection electrode extends to the upper resin layer.
(5) A laminate in which the resin layer includes a lower resin layer containing a colorant, and an upper resin layer that is disposed in part on the lower resin layer and has a functional group that interacts with the plating catalyst or its precursor. Mold resin layer,
The conductive laminate for a touch panel sensor according to (1) or (2), wherein one end of the detection electrode extends onto the lower resin layer, and the one end contacts the upper resin layer on the lower resin layer.
(6) The conductive laminate for a touch panel sensor according to any one of (1) to (5), wherein the substrate is a glass substrate.
(7) A touch panel sensor including the conductive laminate for a touch panel sensor according to any one of (1) to (6).
(8) A touch panel including the conductive laminate for a touch panel sensor according to any one of (1) to (6).
(9) Step A of forming a resin layer having a functional group that interacts with the plating catalyst or its precursor in the peripheral region on the substrate;
A step B in which one end portion extends onto the resin layer and a detection electrode in contact with the resin layer is formed on the substrate;
Step C-1 for forming a resist pattern on the resin layer, and a functional group that interacts with the plating catalyst or its precursor covering the detection electrode so that one end of the detection electrode in contact with the resin layer is exposed. A step C of performing the step C-2 of forming an insulating layer substantially not included in any order;
One end of the detection electrode is formed by applying a plating catalyst or a precursor thereof to a region where the resist pattern on the resin layer is not formed, and plating the resin layer to which the plating catalyst or the precursor is applied. And a step D of forming a lead-out wiring electrically connected to the touch panel sensor.
(10) Step E of forming a lower resin layer containing a colorant in the peripheral region on the substrate;
Forming a detection electrode on the substrate with one end extending to the lower resin layer; and
Forming the upper resin layer having a functional group that is disposed on a part of the lower resin layer and that contacts the detection electrode and that has a functional group that interacts with the plating catalyst or its precursor, and the upper resin layer A step of performing step G-2 in any order to form an insulating layer that covers the detection electrode and that does not substantially contain a functional group that interacts with the plating catalyst or its precursor so as to expose one end of the detection electrode. G and
A method including at least a step of applying a plating catalyst or a precursor thereof to the upper resin layer and performing a plating process on the upper resin layer to which the plating catalyst or the precursor is applied is electrically connected to one end of the detection electrode. A method for manufacturing a conductive laminate for a touch panel sensor, comprising the step H of forming a lead-out wiring connected to the touch panel sensor.

ADVANTAGE OF THE INVENTION According to this invention, the electroconductive laminated body for touchscreen sensors with high electrical connectivity with a detection electrode and extraction wiring can be provided.
Moreover, according to this invention, the manufacturing method of the said conductive laminated body for touchscreen sensors, the touchscreen sensor containing the conductive laminated body for touchscreen sensors, and a touchscreen can also be provided.

It is a top view of a 1st embodiment of a conductive layered product for touch panel sensors of the present invention. It is sectional drawing cut | disconnected along the cutting line AA shown in FIG. It is sectional drawing which shows one Embodiment of the manufacturing method of the electroconductive laminated body for touchscreen sensors in process order. It is a top view of 2nd Embodiment of the conductive laminated body for touchscreen sensors of this invention. It is sectional drawing cut | disconnected along the cutting line BB shown in FIG. It is a top view of 3rd Embodiment of the conductive laminated body for touchscreen sensors of this invention. It is sectional drawing cut | disconnected along the cutting line CC shown in FIG.

Below, the electroconductive laminated body for touchscreen sensors of this invention, its manufacturing method, a touchscreen sensor, and a touchscreen are explained in full detail.
In the present specification, a numerical range represented by using “to” means a range including numerical values described before and after “to” as a lower limit value and an upper limit value. Further, the drawings in the present invention are schematic diagrams, and the thickness relationships and positional relationships of the layers do not necessarily match the actual ones.

One feature of the conductive laminate for a touch panel sensor of the present invention is that the resin layer containing a predetermined functional group and the detection electrode are arranged so as to contact each other. With such an arrangement, the lead-out wiring, which is a plating metal layer formed by plating the resin layer to which the plating catalyst or its precursor is applied, and the detection electrode are in sufficient contact with each other. Electrical continuity between the two is ensured.
Another feature of the present invention is that an insulating layer covering the detection electrode is provided so that one end of the detection electrode is exposed. By providing an insulating layer, it is possible to suppress the deposition of plating on the detection electrodes when the plating treatment is performed on the resin layer to which the plating catalyst or its precursor is applied, and as a result, between the detection electrodes. The occurrence of conduction can be further suppressed.

<< First Embodiment >>
In FIG. 1, the top view of 1st Embodiment of the electroconductive laminated body for touchscreen sensors of this invention is shown. FIG. 2 is a cross-sectional view taken along the cutting line AA. In addition, in this specification, drawing is represented typically in order to make an understanding with respect to each layer structure easy, and is not drawing which represented arrangement | positioning of each layer correctly.

1, the touch panel sensor for the electroconductive laminate 10 includes a substrate 12, a resin layer 14 disposed on the peripheral region E _O on the substrate 12, a central region surrounded by the peripheral region E _O on the substrate 12 A plurality of first detection electrodes 16 and second detection electrodes 18 disposed on E _I and a plurality of layers disposed on the resin layer 14 and electrically connected to the first detection electrodes 16 and the second detection electrodes 18. And an insulating layer 22 disposed in the central region E _I so as to cover the first detection electrode 16 and the second detection electrode 18.
The conductive laminate 10 for a touch panel sensor according to the present embodiment is located outside the central area E _I and a central area E _I that constitutes an input area that can be input by a user when used as a touch panel sensor. And a peripheral region E _O. As described above, the central region is a region where the detection electrodes are arranged, and the peripheral region E _O is an outer region (peripheral region) where the lead-out wiring is arranged outside the central region.
Below, the said structure is explained in full detail.

[substrate]
The substrate 12 has two main surfaces and is a member that supports the first detection electrode 16 and the second detection electrode 18 in the central region E _I and supports the resin layer 14 in the peripheral region E _O. . In FIG. 1, the peripheral area E _O is an area close to the outer peripheral edge extending from the outer peripheral edge of the substrate 12 toward the center, and is formed in a rectangular frame shape. It is optional such as a mold, an egg shape, and a round shape.
The kind in particular of board | substrate 12 is not restrict | limited, For example, an insulating substrate is mentioned, More specifically, a resin substrate, a ceramic substrate, a glass substrate etc. can be used, A glass substrate is preferable.
Examples of the resin substrate material include polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, polyacrylic resin, polyurethane resin, polyester, polycarbonate, polysulfone, polyamide, polyarylate, polyolefin, cellulose resin, polyvinyl chloride, Examples thereof include cycloolefin resins. Of these, polyethylene terephthalate, polyethylene naphthalate, or polyolefin is preferable.
The resin substrate is preferably provided with a hard coat layer. Polyethylene terephthalate, polyethylene naphthalate or polyolefin with a hard coat layer provided on the surface is preferred, and polyethylene terephthalate or polyolefin provided with a hard coat layer on the surface is more preferred.
The thickness (mm) of the substrate 12 is not particularly limited, but is preferably 0.01 to 2 mm, more preferably 0.02 to 1 mm, and more preferably 0.03 to 0. Most preferred is 1 mm. Moreover, in a glass substrate, 0.01-2 mm is preferable, 0.3-0.8 mm is more preferable, 0.4-0.7 mm is the most preferable.
Moreover, it is preferable that the board | substrate 12 permeate | transmits light appropriately. Specifically, the total light transmittance of the substrate 12 is preferably 85 to 100%.

[Resin layer]
The resin layer 14 is a layer disposed over the entire peripheral region E 2 _O on the substrate 12 and has a functional group that interacts with the plating catalyst or a precursor thereof (hereinafter also simply referred to as “interactive group”). It is. The resin layer 14 adsorbs (attaches) a plating catalyst or a precursor thereof used when producing the lead-out wiring according to the function of the interactive group. That is, the resin layer 14 functions as a good receiving layer (so-called plated layer) of the plating catalyst or its precursor.
As will be described later, the resin layer 14 preferably contains a colorant and functions as a so-called decorative layer. That is, it is preferable that the resin layer 14 functions as a layer to be plated and also functions as a decorative layer. The decorative layer is a layer that can hide the lead-out wiring 20 when the conductive laminate 10 for a touch panel sensor is viewed from the substrate 12 side, and plays a role as a layer for improving design properties. .

  Although the thickness in particular of the resin layer 14 is not restrict | limited, 5-100 micrometers is preferable from a point of productivity, 10-70 micrometers is more preferable, and 20-60 micrometers is further more preferable.

The interactive group contained in the resin layer 14 is intended to be a functional group capable of interacting with the plating catalyst or its precursor imparted to the resin layer 14, for example, an electrostatic interaction with the plating catalyst or its precursor. A functional group that can be formed, or a nitrogen-containing functional group, a sulfur-containing functional group, an oxygen-containing functional group, and the like that can be coordinated with a plating catalyst or a precursor thereof can be used.
More specifically, as an interactive group, amino group, amide group, imide group, urea group, tertiary amino group, ammonium group, amidino group, triazine ring, triazole ring, benzotriazole group, imidazole group, benzimidazole Group, quinoline group, pyridine group, pyrimidine group, pyrazine group, nazoline group, quinoxaline group, purine group, triazine group, piperidine group, piperazine group, pyrrolidine group, pyrazole group, aniline group, group containing alkylamine structure, isocyanuric structure Nitrogen-containing functional groups such as nitro group, nitroso group, azo group, diazo group, azide group, cyano group, cyanate group; ether group, hydroxyl group, phenolic hydroxyl group, carboxylic acid group, carbonate group, carbonyl group, Ester group, group containing N-oxide structure, containing S-oxide structure Group, oxygen-containing functional group such as a group containing an N-hydroxy structure; thiophene group, thiol group, thiourea group, thiocyanuric acid group, benzthiazole group, mercaptotriazine group, thioether group, thioxy group, sulfoxide group, sulfone group, Sulfur-containing functional groups such as phyto groups, groups containing sulfoxyimine structures, groups containing sulfoxynium salt structures, sulfonic acid groups, groups containing sulfonic acid ester structures; phosphate groups, phosphoramide groups, phosphine groups, phosphate esters Phosphorus-containing functional groups such as a group containing a structure; groups containing a halogen atom such as chlorine and bromine, and the like. In a functional group capable of taking a salt structure, a salt thereof can also be used.
Among them, since the polarity is high and the adsorption ability to the plating catalyst or its precursor is high, ionic polar groups such as carboxylic acid groups, sulfonic acid groups, phosphoric acid groups, and boronic acid groups, ether groups, Alternatively, a cyano group is particularly preferable, and a carboxylic acid group (carboxyl group) or a cyano group is more preferable. In particular, in order to increase carboxylic acid groups, the surface of the resin layer may be saponified with an alkaline solution.
Two or more types of interactive groups may be contained in the resin layer 14.

The type of the resin constituting the resin layer 14 is not particularly limited, but includes an insulating resin such as a thermosetting resin or a thermoplastic resin (for example, (meth) acrylic resin (including crosslinked and non-crosslinked (meth) acrylic resins). )). These materials only need to contain an interactive group. The (meth) acrylic resin is a concept including an acrylic resin and a methacrylic resin.
More specifically, examples of the thermosetting resin include epoxy resins, phenol resins, polyimide resins, polyester resins, bismaleimide resins, polyolefin resins, isocyanate resins, cross-linked (meth) acrylic resins, silicon resins, and the like. It is done. Examples of the thermoplastic resin include phenoxy resin, polyether sulfone, polysulfone, polyphenylene sulfone, polyphenylene sulfide, polyphenyl ether, polyether imide, and non-crosslinked (meth) acrylic resin.

  The kind of the colorant contained in the resin layer 14 is not particularly limited, and a known pigment or dye is used. As the pigment, both inorganic pigments and organic pigments can be used. More specifically, as inorganic pigments, white pigments such as titanium oxide and zinc oxide, extender pigments such as calcium carbonate and barium sulfate, black pigments such as carbon black, brown rice, red lead, molybdenum red, and cadmium red Examples thereof include red pigments, yellow pigments such as risurge, yellow lead and yellow iron oxide, and blue pigments such as bitumen and ultramarine blue. Examples of organic pigments include azo pigments, phthalocyanine pigments, quinacridone pigments, perylene pigments, isoindolinone pigments, dioxazine pigments, and selenium pigments.

[Detection electrode]
The first detection electrode 16 and the second detection electrode 18 are sensing electrodes that sense a change in capacitance in a touch panel sensor including the conductive laminate for a touch panel sensor of the present embodiment, and are a sensing unit (sensing unit). Configure. That is, when the fingertip is brought into contact with the touch panel, the mutual capacitance of each detection electrode changes, and the position of the fingertip is calculated by the IC circuit based on the amount of change.
The first detection electrode 16 has a role of detecting an input position in the X direction of an operator's finger approaching the central region E _I and has a function of generating a capacitance between the first detection electrode 16 and the finger. ing. The first detection electrodes 16 are electrodes that extend in a first direction (X direction) and are arranged at a predetermined interval in a second direction (Y direction) orthogonal to the first direction.
The second detection electrode 18 has a role of detecting the input position in the Y direction of the operator's finger approaching the central region E _I and has a function of generating a capacitance between the second detection electrode 18 and the finger. ing. The second detection electrodes 18 are electrodes that extend in the second direction (Y direction) and are arranged at a predetermined interval in the first direction (X direction).
In FIG. 1, four first detection electrodes 16 and four second detection electrodes 18 are provided, but the number is not particularly limited and may be plural.
In FIG. 1, the first detection electrode 16 and the second detection electrode 18 are solid films, but may include a predetermined pattern such as a mesh shape.
As shown in FIG. 2, in the portion where the first detection electrode 16 and the second detection electrode 18 intersect, in order to prevent conduction and insulation between the first detection electrode 16 and the second detection electrode 18, An interelectrode insulating layer 24 is disposed between the first detection electrode 16 and the second detection electrode 18.

As shown in FIG. 2, each of the second detection electrodes 18 has one end 18 </ b> A extending to the above-described resin layer 14 and in contact with the resin layer 14. In other words, the one end 18 </ b> A is located on the resin layer 14. Similarly, the first detection electrode 16 also has one end extending to the resin layer 14 and in contact with the resin layer 14.
Thus, the one end part of the 1st detection electrode 16 and the one end part of the 2nd detection electrode 18 contact with the resin layer 14, respectively, As a result, the extraction wiring 20 formed on the resin layer 14 by the method mentioned later And the first detection electrode 16 and the second detection electrode 18 and the lead-out wiring 20 are ensured to have good electrical continuity.

  The material constituting the first detection electrode 16 and the second detection electrode 18 is not particularly limited. For example, metal oxides such as indium tin oxide (ITO), tin oxide, zinc oxide, cadmium oxide, gallium oxide, and titanium oxide are used. Can be mentioned. Alternatively, a metal or an alloy such as gold (Au), silver (Ag), copper (Cu), or aluminum (Al) may be used.

[Drawer wiring]
The lead wiring 20 is a member that plays a role in applying a voltage to the first detection electrode 16 and the second detection electrode 18. The lead-out wiring 20 is disposed in the peripheral area E _O on the substrate 12, one end thereof is electrically connected to the corresponding first detection electrode 16 and second detection electrode 18, and the other end is disposed with a flexible printed wiring board or the like. Is located in a place. In FIG. 2, the lead-out wiring is arranged so as to cover one end of the detection electrode (one end 18A of the second detection electrode 18 in FIG. 2), but the lead-out wiring and the detection electrode are electrically connected. As long as it is connected, it is not limited to this mode.
As will be described later, the lead-out wiring 20 includes at least a step of applying a plating catalyst or a precursor thereof to the resin layer 14 and performing a plating process on the resin layer 14 to which the plating catalyst or the precursor thereof is applied. The wiring formed by That is, the lead-out wiring 20 is a wiring made of a plated metal layer (metal layer) formed in the plating process.
Note that the number of lead-out wirings 20 is not particularly limited, and usually a plurality of lead-out wirings 20 are arranged according to the number of first detection electrodes 16 and second detection electrodes 18.

The thickness of the lead-out wiring 20 is not particularly limited, and an optimum thickness is appropriately selected according to the purpose of use, but is preferably 0.1 μm or more and more preferably 0.5 μm or more from the viewpoint of conductive characteristics. Preferably, 1-30 micrometers is more preferable.
The line width of the lead-out wiring 20 is not particularly limited, but is preferably 30 μm or less, more preferably 15 μm or less, further preferably 10 μm or less, more preferably 0.5 μm or more, and preferably 1.0 μm or more from the viewpoint of low resistance of the lead-out wiring. Is more preferable.
In addition, the type of metal constituting the lead-out wiring 20 is not particularly limited, and depends on the type of plating solution used in the plating process described later. For example, copper, chromium, lead, nickel, gold, silver, tin, zinc, etc. From the viewpoint of conductivity, copper, gold, and silver are preferable, and copper and silver are more preferable.

  Although not shown in FIG. 1, a flexible printed wiring board or the like may be disposed at a location where the other end (end portion not on the detection electrode side) of the lead wiring 20 is located. The flexible printed wiring board is a board in which a plurality of wirings and terminals are provided on a substrate, and is connected to the other end of each lead-out wiring 20, and a capacitive touch panel sensor and an external device (for example, a display device). Play a role in connecting.

[Insulation layer]
The insulating layer 22 is a layer that covers the first detection electrode 16 and the second detection electrode 18 so that one end connected to the lead-out wiring 20 of the first detection electrode 16 and the second detection electrode 18 is exposed. Are arranged over the entire central region E _I. The insulating layer 22 is an arbitrary configuration and is a layer disposed as necessary.
The insulating layer 22 is substantially free of functional groups that interact with the plating catalyst or its precursor. Therefore, as will be described later, in the step of applying the plating catalyst or its precursor, which is performed when the above-described lead-out wiring 20 is manufactured, the plating catalyst or its precursor is the first detection electrode 16 and the second detection electrode 18. As a result, the occurrence of conduction between the detection electrodes is suppressed after the plating process.

The kind in particular of the insulating layer 22 is not restrict | limited, A well-known insulating material can be used, for example, an insulating organic material and an insulating inorganic material are used suitably.
A known insulating resin can be used as the insulating organic material. Examples of the insulating resin include a thermosetting resin or a thermoplastic resin used for forming the resin layer 14 described above.
As the insulating inorganic material, for example, metal oxide such as silicon oxide or niobium oxide can be used.
The insulating layer 22 may be a single layer or two or more layers. In the case of two or more layers, the material of each layer may be different. Moreover, you may use a tape with weak adhesiveness like a masking tape.

  The insulating layer 22 does not substantially contain a functional group (interactive group) that interacts with the plating catalyst or its precursor. Here, the phrase “substantially free of interactive groups” means that the amount of adsorption of the plating catalyst of the insulating layer 22 or its precursor is 1000 ppm by mass or less, and is 500 ppm by mass or less. Preferably, it is 100 mass ppm or less, more preferably 10 mass ppm or less. It can be measured by ICP mass spectrometry.

The thickness (thickness after drying) of the insulating layer 22 is not particularly limited, but is preferably 1 to 9 μm, and more preferably 1 to 8 μm in that plating deposition in the central region E _I can be further suppressed during the plating process. More preferably, it is more preferably 2 to 8 μm, and particularly preferably 3 to 8 μm.

Although not shown in FIG. 1, a resist pattern may be disposed on a region on the resin layer 14 where the lead-out wiring 20 is not disposed. As will be described later, a resist pattern is used as necessary when the lead-out wiring 20 is formed.
In addition, although not shown in FIG. 1, an insulating protective film may be further disposed so as to cover a portion other than the other end of the lead wiring 20.

<Method for manufacturing conductive laminate for touch panel sensor>
The manufacturing method of 1st Embodiment of the electroconductive laminated body for touchscreen sensors mentioned above is not restrict | limited especially, Although an optimal process is implemented suitably, it is preferable to have the following processes from the point that manufacture is easy.
Step A: Step B of forming a resin layer in the peripheral region on the substrate Step B: Step of forming a detection electrode on the substrate with one end extending to the resin layer and contacting the resin layer Step C: On the resin layer Step C-1 for forming a resist pattern and Step C-2 for forming an insulating layer so that one end of the detection electrode in contact with the resin layer is exposed Step D: Resist on the resin layer A plating catalyst or its precursor is applied to the area where the pattern is not formed, and the plating treatment is applied to the resin layer to which the plating catalyst or its precursor is applied, and it is electrically connected to one end of the detection electrode. Step of Forming Leading Wiring Performed Step A to Step D will be described in detail below. In the following description, FIG. 3, which is a cross-sectional view showing a method for manufacturing the conductive laminate 10 for a touch panel sensor shown in FIGS. 1 and 2 in the order of steps, will be used.

[Step A]
Step A is a step of forming a resin layer having a functional group that interacts with the plating catalyst or its precursor in the peripheral region on the substrate. By performing this step, the resin layer 14 is disposed in the peripheral region E _O on the substrate 12 as shown in FIG.
The method for forming the resin layer is not particularly limited, but an embodiment using a resin layer forming composition containing a predetermined compound is preferable. Examples of the resin layer forming composition to be used include a resin layer forming composition containing a compound having a functional group and a polymerizable group that interact with a plating catalyst or a precursor thereof. Such a composition is applied on a substrate to form a coating film, and energy is applied to the coating film located on the peripheral region E _O shown in FIG. 1 to accelerate the reaction of the polymerizable group and cure. Then, the resin layer disposed in the peripheral region can be obtained by removing the region to which no energy is applied.
Below, the aspect using the composition for resin layer formation is explained in full detail. First, the material of the composition will be described in detail, and then the procedure of the process will be described in detail.

(Resin layer forming composition (part 1))
The resin layer forming composition contains a compound having an interactive group and a polymerizable group.
The definition of the interactive group is as described above.
The polymerizable group is a functional group that can form a chemical bond by applying energy, and examples thereof include a radical polymerizable group and a cationic polymerizable group. Among these, a radical polymerizable group is preferable from the viewpoint of more excellent reactivity. Examples of radical polymerizable groups include acrylic acid ester groups (acryloyloxy groups), methacrylic acid ester groups (methacryloyloxy groups), itaconic acid ester groups, crotonic acid ester groups, isocrotonic acid ester groups, maleic acid ester groups, and the like. Examples include unsaturated carboxylic acid ester groups, styryl groups, vinyl groups, acrylamide groups, and methacrylamide groups. Of these, a methacryloyloxy group, an acryloyloxy group, a vinyl group, a styryl group, an acrylamide group, and a methacrylamide group are preferable, and a methacryloyloxy group, an acryloyloxy group, and a styryl group are more preferable.
Two or more polymerizable groups may be contained in the compound. The number of polymerizable groups contained in the compound is not particularly limited, and may be one or two or more.

The compound may be a low molecular compound or a high molecular compound. A low molecular weight compound intends a compound having a molecular weight of less than 1000, and a high molecular weight compound intends a compound having a molecular weight of 1000 or more.
The low molecular compound having a polymerizable group corresponds to a so-called monomer. The polymer compound may be a polymer having a predetermined repeating unit.
Moreover, as a compound, only 1 type may be used and 2 or more types may be used together.

When the compound is a polymer, the weight average molecular weight of the polymer is not particularly limited, but is preferably 1000 or more and 700,000 or less, and more preferably 2000 or more and 200,000 or less, from the viewpoint of better handleability such as solubility. In particular, from the viewpoint of polymerization sensitivity, it is preferably 20000 or more.
The method for synthesizing such a polymer having a polymerizable group and an interactive group is not particularly limited, and a known synthesis method (see paragraphs [0097] to [0125] of Patent Publication 2009-280905) is used.

(Preferred embodiment 1 of polymer)
As a first preferred embodiment of the polymer, a repeating unit having a polymerizable group represented by the following formula (a) (hereinafter also referred to as a polymerizable group unit as appropriate) and an interaction represented by the following formula (b) And a copolymer containing a repeating unit having a functional group (hereinafter also referred to as an interactive group unit as appropriate).

In the above formulas (a) and (b), R ^{1 to} R ⁵ are each independently a hydrogen atom or a substituted or unsubstituted alkyl group (for example, a methyl group, an ethyl group, a propyl group, a butyl group). Etc.). The kind of the substituent is not particularly limited, and examples thereof include a methoxy group, a chlorine atom, a bromine atom, or a fluorine atom.
R ¹ is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a bromine atom. R ² is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a bromine atom. R ³ is preferably a hydrogen atom. R ⁴ is preferably a hydrogen atom. R ⁵ is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a bromine atom.

In the above formulas (a) and (b), X, Y, and Z each independently represent a single bond or a substituted or unsubstituted divalent organic group. Examples of the divalent organic group include a substituted or unsubstituted divalent aliphatic hydrocarbon group (preferably having 1 to 8 carbon atoms, for example, an alkylene group such as a methylene group, an ethylene group, and a propylene group), substituted or unsubstituted. divalent aromatic hydrocarbon group (preferably having 6 to 12 carbon atoms such as a phenylene group.), - O -, - S -, - SO 2 -, - N (R) - (R: alkyl group), —CO—, —NH—, —COO—, —CONH—, or a combination thereof (for example, an alkyleneoxy group, an alkyleneoxycarbonyl group, an alkylenecarbonyloxy group, and the like) can be given.

  As X, Y, and Z, a single bond, an ester group (—COO—), an amide group (—CONH—), an ether group (— O-) or a substituted or unsubstituted divalent aromatic hydrocarbon group is preferable, and a single bond, an ester group (-COO-), or an amide group (-CONH-) is more preferable.

In the above formulas (a) and (b), L ¹ and L ² each independently represent a single bond or a substituted or unsubstituted divalent organic group. As a definition of a divalent organic group, it is synonymous with the divalent organic group described by X, Y, and Z mentioned above.
L ¹ is an aliphatic hydrocarbon group or a divalent organic group having a urethane bond or a urea bond (for example, an aliphatic hydrocarbon) in that the polymer is easily synthesized and the adhesion of the lead wiring is more excellent. Group) is preferable, and among them, those having 1 to 9 carbon atoms are preferable. Incidentally, the total number of carbon atoms of L ^1, means the total number of carbon atoms contained in the divalent organic group or a substituted or unsubstituted represented by L ^1.

L ² may be a single bond, a divalent aliphatic hydrocarbon group, a divalent aromatic hydrocarbon group, or a combination of these in terms of better adhesion of the lead-out wiring. preferable. Among them, L ² is a single bond, or, preferably has a total carbon number of 1 to 15, particularly preferably unsubstituted. Incidentally, the total number of carbon atoms of L ^2, means the total number of carbon atoms contained in the divalent organic group or a substituted or unsubstituted represented by L ^2.

  In the above formula (b), W represents an interactive group. The definition of the interactive group is as described above.

The content of the polymerizable group unit is preferably 5 to 50 mol% with respect to all repeating units in the polymer, from the viewpoint of reactivity (curability, polymerization) and suppression of gelation during synthesis, 5-40 mol% is more preferable.
In addition, the content of the interactive group unit is preferably 5 to 95 mol%, and preferably 10 to 95 mol% with respect to all repeating units in the polymer, from the viewpoint of adsorptivity to the plating catalyst or its precursor. More preferred.

(Preferred embodiment 2 of polymer)
As a 2nd preferable aspect of a polymer, the copolymer containing the repeating unit represented by a following formula (A), a formula (B), and a formula (C) is mentioned.

The repeating unit represented by the formula (A) is the same as the repeating unit represented by the above formula (a), and the description of each group is also the same.
R ^5, X and L ² in the repeating unit represented by formula (B) is the same as R ^5, X and L ² in the repeating unit represented by formula (b), a description of each group Is the same.
Wa in the formula (B) represents a group that interacts with the plating catalyst or its precursor, excluding the hydrophilic group represented by V described later or its precursor group. Of these, a cyano group and an ether group are preferable.

In formula (C), each R ⁶ independently represents a hydrogen atom or a substituted or unsubstituted alkyl group.
In formula (C), U represents a single bond or a substituted or unsubstituted divalent organic group. The definition of a bivalent organic group is synonymous with the divalent organic group represented by X, Y, and Z mentioned above. U is a single bond, an ester group (—COO—), an amide group (—CONH—), an ether group (—O—), or an ether group because the polymer is easily synthesized and the adhesion of the lead wiring is more excellent. A substituted or unsubstituted divalent aromatic hydrocarbon group is preferred.
In Formula (C), L ³ represents a single bond or a substituted or unsubstituted divalent organic group. The definition of a divalent organic group is synonymous with the divalent organic group represented by L ¹ and L ² described above. L ³ is a single bond, a divalent aliphatic hydrocarbon group, a divalent aromatic hydrocarbon group, or a combination thereof in that the polymer is easily synthesized and the adhesion of the lead-out wiring is better. It is preferable that

In the formula (C), V represents a hydrophilic group or a precursor group thereof. The hydrophilic group is not particularly limited as long as it is a hydrophilic group, and examples thereof include a hydroxyl group and a carboxylic acid group. The precursor group of the hydrophilic group means a group that generates a hydrophilic group by a predetermined treatment (for example, treatment with acid or alkali). For example, carboxyl protected with THP (2-tetrahydropyranyl group) Group and the like.
The hydrophilic group is preferably an ionic polar group in terms of interaction with the plating catalyst or its precursor. Specific examples of the ionic polar group include a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, and a boronic acid group. Among these, a carboxylic acid group is preferable from the viewpoint of moderate acidity (does not decompose other functional groups).

The preferred content of each unit in the second preferred embodiment of the polymer is as follows.
The content of the repeating unit represented by the formula (A) is 5 to 50 with respect to all repeating units in the polymer from the viewpoint of reactivity (curability and polymerization) and suppression of gelation during synthesis. Mol% is preferable, and 5 to 30 mol% is more preferable.
The content of the repeating unit represented by the formula (B) is preferably from 5 to 75 mol%, preferably from 10 to 70 mol based on all repeating units in the polymer, from the viewpoint of adsorptivity to the plating catalyst or its precursor. % Is more preferable.
The content of the repeating unit represented by the formula (C) is preferably from 10 to 70 mol%, preferably from 20 to 60 mol%, based on all repeating units in the polymer, from the viewpoint of developability with an aqueous solution and moisture adhesion resistance. Is more preferable, and 30-50 mol% is further more preferable.

Specific examples of the polymer include, for example, the polymers described in paragraphs [0106] to [0112] of JP2009-007540A, and the paragraphs [0065] to [0070] of JP2006-135271A. Examples thereof include polymers described in paragraphs [0030] to [0108] of US2010-080964.
The polymer can be prepared by known methods (eg, the methods in the literature listed above).

(Preferred embodiment of monomer)
When the said compound is what is called a monomer, the compound represented by Formula (X) is mentioned as one of the suitable aspects.

In formula (X), R ^{11 to} R ¹³ each independently represent a hydrogen atom or a substituted or unsubstituted alkyl group. Examples of the unsubstituted alkyl group include a methyl group, an ethyl group, a propyl group, and a butyl group. Examples of the substituted alkyl group include a methyl group, an ethyl group, a propyl group, and a butyl group substituted with a methoxy group, a chlorine atom, a bromine atom, or a fluorine atom. R ¹¹ is preferably a hydrogen atom or a methyl group. R ¹² is preferably a hydrogen atom. R ¹³ is preferably a hydrogen atom.

L ¹⁰ represents a single bond or a divalent organic group. Examples of the divalent organic group include a substituted or unsubstituted aliphatic hydrocarbon group (preferably having 1 to 8 carbon atoms), a substituted or unsubstituted aromatic hydrocarbon group (preferably having 6 to 12 carbon atoms), -O —, —S—, —SO ₂ —, —N (R) — (R: alkyl group), —CO—, —NH—, —COO—, —CONH—, or a combination thereof (for example, alkylene Oxy group, alkyleneoxycarbonyl group, alkylenecarbonyloxy group, etc.).
As a substituted or unsubstituted aliphatic hydrocarbon group, a methylene group, an ethylene group, a propylene group, or a butylene group, or these groups are substituted with a methoxy group, a chlorine atom, a bromine atom, a fluorine atom, or the like Those are preferred.
As the substituted or unsubstituted aromatic hydrocarbon group, an unsubstituted phenylene group or a phenylene group substituted with a methoxy group, a chlorine atom, a bromine atom, a fluorine atom or the like is preferable.
In Formula (X), one preferred embodiment of L ¹⁰ includes —NH-aliphatic hydrocarbon group— or —CO-aliphatic hydrocarbon group—.

The definition of W is synonymous with the definition of W in Formula (b), and represents an interactive group. The definition of the interactive group is as described above.
In Formula (X), as a suitable aspect of W, an ionic polar group is mentioned, A carboxylic acid group is more preferable.

  When the said compound is what is called a monomer, the compound represented by Formula (1) is mentioned as one of the other suitable aspects.

In formula (1), R ¹⁰ represents a hydrogen atom, a metal cation, or a quaternary ammonium cation. Examples of metal cations include alkali metal cations (sodium ions, calcium ions), copper ions, palladium ions, silver ions, and the like. In addition, as a metal cation, a monovalent or bivalent thing is mainly used, and when bivalent thing (for example, palladium ion) is used, n mentioned later represents 2.
Examples of the quaternary ammonium cation include tetramethylammonium ion and tetrabutylammonium ion.
Especially, it is preferable that it is a hydrogen atom from the point of adhesion of a plating catalyst or its precursor, and the metal residue after patterning.

Defining L ¹⁰ in the formula (1) are the same as defined in L ¹⁰ in the above-mentioned formula (X), a single bond, or a divalent organic group. The definition of the divalent organic group is as described above.

Definition of R ¹¹ to R ¹³ in the formula (1) has the same meaning as the definition of R ¹¹ to R ¹³ in the above-mentioned formula (X), represents a hydrogen atom or a substituted or unsubstituted alkyl group,. Incidentally, a preferred embodiment of R ¹¹ to R ¹³ are as described above.
n represents an integer of 1 or 2. Especially, it is preferable that n is 1 from a viewpoint of the availability of a compound.

  As a suitable aspect of the compound represented by Formula (1), the compound represented by Formula (2) is mentioned.

In formula (2), R ¹⁰ , R ¹¹ and n are the same as defined above.
L ¹¹ represents an ester group (—COO—), an amide group (—CONH—), or a phenylene group. Among them, the L ¹¹ is an amide group, solvent resistance (e.g., alkali solvent resistance) is improved.
L ¹² represents a single bond, a divalent aliphatic hydrocarbon group (preferably having 1 to 8 carbon atoms, more preferably 3 to 5 carbon atoms), or a divalent aromatic hydrocarbon group. The aliphatic hydrocarbon group may be linear, branched or cyclic. When L ¹² is a single bond, L ¹¹ represents a phenylene group.

  The molecular weight of the compound represented by the formula (1) is not particularly limited, but is preferably from 100 to 1,000, more preferably from 100 to 300, from the viewpoints of volatility, solubility in a solvent, film formability, and handleability. preferable.

  Although content of the said compound in the composition for resin layer formation is not restrict | limited in particular, 2-50 mass% is preferable with respect to the composition whole quantity, and 5-30 mass% is more preferable. If it is in the said range, it is excellent in the handleability of a composition and it is easy to control the layer thickness of a resin layer.

The resin layer forming composition preferably contains a solvent from the viewpoint of handleability.
Solvents that can be used are not particularly limited. For example, water; alcohol solvents such as methanol, ethanol, propanol, ethylene glycol, 1-methoxy-2-propanol, glycerin, propylene glycol monomethyl ether; acids such as acetic acid; acetone, methyl ethyl ketone Ketone solvents such as cyclohexanone; amide solvents such as formamide, dimethylacetamide and N-methylpyrrolidone; nitrile solvents such as acetonitrile and propionitrile; ester solvents such as methyl acetate and ethyl acetate; dimethyl carbonate and diethyl carbonate Other examples include carbonate solvents such as ether solvents, glycol solvents, amine solvents, thiol solvents, and halogen solvents.
Of these, alcohol solvents, amide solvents, ketone solvents, nitrile solvents, and carbonate solvents are preferable.
The content of the solvent in the resin layer forming composition is not particularly limited, but is preferably 50 to 98% by mass, more preferably 70 to 95% by mass with respect to the total amount of the composition. If it is in the said range, the handleability of a composition is excellent and it is easy to control the layer thickness of a resin layer.

The composition for resin layer formation may contain a polymerization initiator. By including the polymerization initiator, bonds between the compounds and between the compound and the substrate are further formed, and as a result, a lead-out wiring having better adhesion can be obtained.
There is no restriction | limiting in particular as a polymerization initiator used, For example, a thermal polymerization initiator, a photoinitiator, etc. can be used. Examples of photopolymerization initiators include benzophenones, acetophenones, α-aminoalkylphenones, benzoins, ketones, thioxanthones, benzyls, benzyl ketals, oxime esters, anthrones, tetramethylthiuram mono Mention may be made of sulfides, bisacylphosphine oxides, acylphosphine oxides, anthraquinones, azo compounds and the like and their derivatives.
Examples of the thermal polymerization initiator include a diazo compound or a peroxide compound.
When a polymerization initiator is contained in the resin layer forming composition, the content of the polymerization initiator is preferably 0.01 to 1% by mass relative to the total amount of the composition, 0.1 to 0.5 More preferably, it is mass%. If it is in the said range, it is excellent in the handleability of a composition and the adhesiveness of the extraction wiring obtained is more excellent.

The resin layer forming composition may contain a monomer (excluding the compound represented by the above formula (X) or formula (1)). By including the monomer, the crosslinking density in the resin layer can be appropriately controlled.
The monomer to be used is not particularly limited, and examples thereof include compounds having an ethylenically unsaturated bond as compounds having addition polymerizability, and compounds having an epoxy group as compounds having ring-opening polymerizability. Especially, it is preferable to use a polyfunctional monomer from the point which improves the crosslinking density in a resin layer, and the adhesiveness of a lead-out wiring improves more. A polyfunctional monomer means a monomer having two or more polymerizable groups. Specifically, it is preferable to use a monomer having 2 to 6 polymerizable groups.
From the viewpoint of molecular mobility during the crosslinking reaction that affects the reactivity, the molecular weight of the polyfunctional monomer used is preferably 150 to 1000, more preferably 200 to 700. In addition, the interval (distance) between a plurality of polymerizable groups is preferably from 1 to 15 in terms of the number of atoms, and more preferably from 6 to 10.

In the resin layer forming composition, other additives (for example, sensitizers, curing agents, polymerization inhibitors, antioxidants, antistatic agents, ultraviolet absorbers, fillers, particles, flame retardants, surfactants, You may add a lubricant, a plasticizer, etc.) as needed.
When the resin layer contains a colorant, the resin layer forming composition may further contain a colorant.

(Composition for resin layer formation (part 2))
The resin layer forming composition (part 1) includes a compound having an interactive group and a polymerizable group, but is not limited to this embodiment. For example, the compound having an interactive group, and Further, a resin layer forming composition containing two kinds of compounds having a polymerizable group can be used.
The compound having an interactive group is a compound having an interactive group but no polymerizable group. The definition of the interactive group is as described above. Such a compound may be a low molecular compound or a high molecular compound. A preferred embodiment of the compound having an interactive group includes a polymer having a repeating unit represented by the above-described formula (b).
The compound having a polymerizable group is a so-called monomer, and is preferably a polyfunctional monomer having two or more polymerizable groups from the viewpoint that the hardness of the formed resin layer is more excellent. A known monomer can be used as the polyfunctional monomer.

(Procedure of step A)
In step A, the resin layer forming composition is first disposed on the substrate, but the method is not particularly limited. For example, the resin layer forming composition is brought into contact with the substrate to form the resin layer forming composition. The method of forming the coating film of a thing is mentioned. Examples of this method include a method (coating method) in which the resin layer forming composition is applied onto a substrate.
In the case of the coating method, the method for coating the resin layer forming composition on the substrate is not particularly limited, and known methods (for example, spin coating, die coating, dip coating, etc.) can be used.
From the viewpoint of handleability and production efficiency, an embodiment in which a resin layer forming composition is applied onto a substrate and, if necessary, a drying treatment is performed to remove the remaining solvent to form a coating film.
In addition, although the conditions of a drying process are not restrict | limited in particular, It is preferable to implement for 1 to 30 minutes (preferably 1 to 10 minutes) at room temperature-220 degreeC (preferably 50-120 degreeC) by the point which productivity is more excellent. .

The method for applying energy in a pattern to the coating film (composition layer) on the substrate is not particularly limited. For example, it is preferable to use a heat treatment or an exposure process (light irradiation process), and the exposure process is preferable because the process is completed in a short time. By imparting energy to the coating film, the polymerizable group in the compound is activated, crosslinking between the compounds occurs, and the curing of the layer proceeds.
For the exposure process, UV (ultraviolet light) lamp, light irradiation with visible light, or the like is used. Examples of the light source include a mercury lamp, a metal halide lamp, a xenon lamp, a chemical lamp, and a carbon arc lamp. Examples of radiation include electron beams, X-rays, ion beams, and far infrared rays. Specific examples of preferred embodiments include scanning exposure with an infrared laser, high-illuminance flash exposure such as a xenon discharge lamp, and infrared lamp exposure.
The exposure time varies depending on the reactivity of the compound and the light source, but is usually between 10 seconds and 5 hours. The exposure energy may be about 10 to 8000 mJ, and is preferably in the range of 50 to 3000 mJ.
In addition, the method in particular which implements the said exposure process in a pattern form is not restrict | limited, A well-known method is employ | adopted, for example, what is necessary is just to irradiate a coating film with exposure light through a mask.

  Moreover, when using heat processing for energy provision, an air dryer, oven, an infrared dryer, a heating drum, etc. can be used.

Next, a portion of the coating film where energy is not applied is removed to form a resin layer.
The removal method is not particularly limited, and an optimal method is appropriately selected depending on the compound used. For example, a method in which an alkaline solution (preferably pH: 13.0 to 13.8) is used as a developer can be mentioned. In the case of removing the non-energy-applied region using an alkaline solution, there are a method of immersing a substrate having a coating film to which energy is applied in a solution, a method of applying a developer on the substrate, and the like. The soaking method is preferred. In the case of the dipping method, the dipping time is preferably about 1 to 30 minutes from the viewpoint of productivity and workability.
In addition, as another method, a method in which a solvent in which the above compound is dissolved is used as a developing solution and immersed in the developing solution.

  In addition, although the aspect which forms a resin layer directly on a board | substrate was described above, you may implement other methods, such as a transfer method. The transfer method is a method in which a resin layer is formed on a temporary support and the formed resin layer is transferred onto a substrate.

[Step B]
Process B is a process in which one end portion extends to the resin layer and a detection electrode that contacts the resin layer is formed on the substrate. More specifically, by performing this step, the first detection electrode 16 and the second detection electrode 18 are arranged on the substrate 12 as shown in FIG. As shown in FIG. 3B, one end of the detection electrode (the first detection electrode 16 and the second detection electrode 18) extends to the resin layer.
The production method of the detection electrode is not particularly limited, and a known method is adopted. For example, when an ITO layer is used as the detection electrode, it is preferably formed by sputtering or vapor deposition. Further, when forming a detection electrode having a predetermined shape, a mask is appropriately used.

[Step C]
Step C includes a step C-1 of forming a resist pattern on the resin layer, and a step C-2 of forming an insulating layer covering the detection electrode so that one end of the detection electrode in contact with the resin layer is exposed. This is a process performed in any order. More specifically, by performing this process, as shown in FIG. 3C, an insulating layer 22 covering the detection electrode is disposed. In FIG. 3C, the resist pattern is not shown, but is arranged in a region on the resin layer 14 where the lead-out wiring 20 in FIG. 1 is not formed.
In Step C, Step C-1 and Step C-2 may be performed in any order. Specifically, Step C-2 may be performed after Step C-1 is performed, and Step C-2 may be performed. After carrying out step C1, step C-1 may be carried out.

Step C-1 is a step of forming a resist pattern on the resin layer. More specifically, this step is a step of forming a resist pattern in a predetermined region on the resin layer where it is not desired to deposit plating during the plating process described later.
A method for forming a resist pattern on the resin layer is not particularly limited, and a known method is used. However, a method of forming a resist pattern using a photosensitive resist is preferable because the accuracy of the resist pattern is more excellent.
Examples of the photosensitive resist that can be used in this step include a photocurable negative resist or a photodissolvable positive resist that dissolves upon exposure. Examples of the photosensitive resist include: 1. photosensitive dry film resist (DFR); 2. liquid resist; An ED (electrodeposition) resist can be used.
The resist pattern is formed by placing a film made of a photosensitive resist (photosensitive resist film) on the resin layer, exposing the pattern to the photosensitive resist film, and then developing the resist pattern. The

Step C-2 is a step of forming an insulating layer that covers the detection electrode so that one end of the detection electrode that contacts the resin layer is exposed.
The method for forming the insulating layer is not particularly limited, and an optimum method is selected according to the material used.
For example, when using a photosensitive insulating resin (for example, epoxy resin), a composition containing the photosensitive insulating resin is applied onto a substrate, and a predetermined region is exposed and cured to remove an unexposed portion. The method of removing is mentioned.
Moreover, when using a metal oxide etc., the method of arrange | positioning a predetermined mask and depositing a metal oxide layer in a predetermined position by sputtering or a vapor deposition method etc. are mentioned.

[Step D]
In step D, a plating catalyst or a precursor thereof is applied to a region where the resist pattern on the resin layer is not formed, and a plating treatment is performed on the resin layer to which the plating catalyst or the precursor is applied, and detection is performed. This is a step of forming a lead wiring electrically connected to one end of the electrode. More specifically, by performing this step, the lead-out wiring 20 that is electrically connected to the one end portion 18A of the second detection electrode 18 can be formed as shown in FIG. Although not shown, one end portion of the first detection electrode is also electrically connected to the lead wiring.
Below, the process (process D-1) which provides a plating catalyst or its precursor to a resin layer, and the process (process D-2) which performs a plating process with respect to the resin layer to which the plating catalyst or its precursor was provided. This will be explained separately.

(Process D-1: Plating catalyst application process)
In this step, first, a plating catalyst or a precursor thereof is applied to a region where a resist pattern on the resin layer is not formed. The interactive group contained in the resin layer adheres (adsorbs) the applied plating catalyst or its precursor depending on its function. More specifically, a plating catalyst or a precursor thereof is applied in the resin layer and on the surface of the resin layer.
The plating catalyst or a precursor thereof functions as a catalyst or an electrode for plating treatment. Therefore, the type of plating catalyst or precursor used is appropriately determined depending on the type of plating treatment.
In addition, it is preferable that the plating catalyst used or its precursor is an electroless plating catalyst or its precursor. Hereinafter, mainly the electroless plating catalyst or its precursor will be described in detail.

As the electroless plating catalyst used in this step, any catalyst can be used as long as it becomes an active nucleus at the time of electroless plating. Specifically, a metal (Ni) having catalytic ability for autocatalytic reduction reaction. And those known as metals capable of electroless plating with a lower ionization tendency). Specific examples include Pd, Ag, Cu, Ni, Pt, Au, and Co. Of these, Ag, Pd, Pt, and Cu are particularly preferable because of their high catalytic ability.
A metal colloid may be used as the electroless plating catalyst.
The electroless plating catalyst precursor used in this step can be used without particular limitation as long as it can become an electroless plating catalyst by a chemical reaction. The metal ions of the metals mentioned as the electroless plating catalyst are mainly used. The metal ion that is an electroless plating catalyst precursor becomes a zero-valent metal that is an electroless plating catalyst by a reduction reaction. After the metal ion which is an electroless plating catalyst precursor is imparted to the resin layer, it may be converted into a zero-valent metal by a separate reduction reaction before being immersed in the electroless plating bath. Alternatively, the electroless plating catalyst precursor may be immersed in an electroless plating bath and changed to a metal (electroless plating catalyst) by a reducing agent in the electroless plating bath.

The metal ion that is the electroless plating catalyst precursor is preferably applied to the resin layer using a metal salt. The metal salt used is not particularly limited as long as it is dissolved in a suitable solvent and dissociated into a metal ion and a base (anion), and M (NO ₃ ) _n , MCl _n , M _{2 / n} (SO ₄ ), M _{3 / n} (PO ₄ ) (M represents an n-valent metal atom), and the like. As a metal ion, the thing which said metal salt dissociated can be used suitably. For example, Ag ion, Cu ion, Ni ion, Co ion, Pt ion, Pd ion can be mentioned. Among them, those capable of multidentate coordination are preferable, and Ag ions, Pd ions, and Cu ions are particularly preferable in terms of the number of types of functional groups capable of coordination and catalytic ability.
In this step, a zero-valent metal can also be used as a catalyst used for direct electroplating without electroless plating.

As a method for applying the plating catalyst or its precursor to the resin layer, for example, a solution (plating catalyst solution) in which the plating catalyst or its precursor is dispersed or dissolved in an appropriate solvent is prepared, and the solution is applied to the resin layer. Or a substrate on which a resin layer is formed may be immersed in the solution.
As said solvent, water and an organic solvent are used suitably. The organic solvent is preferably a solvent that can penetrate into the resin layer. For example, acetone, methyl acetoacetate, ethyl acetoacetate, ethylene glycol diacetate, cyclohexanone, acetylacetone, acetophenone, 2- (1-cyclohexenyl) cyclohexanone, propylene glycol Diacetate, triacetin, diethylene glycol diacetate, dioxane, N-methylpyrrolidone, dimethyl carbonate, dimethyl cellosolve and the like can be used.

The pH of the catalyst-providing liquid containing the plating catalyst or its precursor and the solvent is not particularly limited, but is that a desired amount of a metal layer is easily formed at a desired position during the plating treatment described later. It is preferably 0 to 7.0, more preferably 3.2 to 6.8, and even more preferably 3.5 to 6.6.
The method for preparing the catalyst-imparting solution is not particularly limited, and a predetermined metal salt is dissolved in an appropriate solvent, and the pH is adjusted to a predetermined range using an acid or an alkali as necessary.

The concentration of the plating catalyst or its precursor in the solution is not particularly limited, but is preferably 0.001 to 50% by mass, and more preferably 0.005 to 30% by mass.
Further, the contact time is preferably about 30 seconds to 24 hours, more preferably about 1 minute to 1 hour.

The adsorption amount of the plating catalyst of the resin layer or its precursor varies depending on the type of plating bath used, the type of catalytic metal, the interactive base type of the resin layer, the method of use, etc. -1000 mg / m < ² > is preferable, 10-800 mg / m < ² > is more preferable, and 20-600 mg / m < ² > is particularly preferable.

(Process D-2: Plating process)
Next, a plating process is performed on the resin layer to which the plating catalyst or its precursor is applied. By performing the plating process, a lead-out wiring made of a plated metal layer is formed in a region where the resist pattern on the resin layer is not disposed.
The method for the plating treatment is not particularly limited, and examples thereof include electroless plating treatment or electrolytic plating treatment (electroplating treatment). In this step, the electroless plating process may be performed alone, or after the electroless plating process, the electrolytic plating process may be further performed.
In the present specification, so-called silver mirror reaction is included as a kind of the electroless plating process. Therefore, for example, the deposited metal ions may be reduced by a silver mirror reaction or the like to form a desired resin layer, and then an electrolytic plating process may be performed.
Hereinafter, the procedures of the electroless plating process and the electrolytic plating process will be described in detail.

The electroless plating treatment refers to an operation of depositing a metal by a chemical reaction using a solution in which metal ions to be deposited as a plating are dissolved.
In the electroless plating in this step, for example, a substrate having a resin layer provided with an electroless plating catalyst is washed with water to remove excess electroless plating catalyst (metal), and then immersed in an electroless plating bath. Preferably it is done. As the electroless plating bath used, a known electroless plating bath can be used.
In addition, when a substrate including a resin layer provided with an electroless plating catalyst precursor is immersed in an electroless plating bath with the electroless plating catalyst precursor adsorbed or impregnated on the resin layer, the substrate is washed with water. It is preferable to immerse in an electroless plating bath after removing excess electroless plating catalyst precursor (metal salt or the like). In this case, reduction of the electroless plating catalyst precursor and subsequent electroless plating are performed in the electroless plating bath. As the electroless plating bath used here, a known electroless plating bath can be used as described above.
In addition, the reduction of the electroless plating catalyst precursor may be performed as a separate process before electroless plating by preparing a catalyst activation liquid (reducing liquid) separately from the embodiment using the electroless plating liquid as described above. Is possible.
Further, when the plating bath contacts not only the resin layer provided with the electroless plating catalyst but also the detection electrode, plating is deposited from the detection electrode. For this reason, the plating is also deposited on the detection electrode portion that is 2 μm or more away from the resin layer, and a lead-out wiring that ensures electrical continuity with the detection electrode can be formed. The length from the plating resin layer generated on the detection electrode is preferably 3 μm or more, more preferably 10 μm or more, and most preferably 1000 μm or more.

As a composition of a general electroless plating bath, in addition to a solvent (for example, water), 1. 1. metal ions for plating; 2. reducing agent; Additives (stabilizers) that improve the stability of metal ions are mainly included. In addition to these, the plating bath may contain known additives such as a plating bath stabilizer.
The organic solvent used in the electroless plating bath needs to be a solvent that can be used in water, and from this point, ketones such as acetone and alcohols such as methanol, ethanol, and isopropanol are preferably used. Copper, tin, lead, nickel, gold, silver, palladium, and rhodium are known as the types of metals used in the electroless plating bath. Among these, copper, silver, and gold are preferable from the viewpoint of conductivity. Preferably, copper is more preferable. Moreover, the optimal reducing agent and additive are selected according to the said metal.
The immersion time in the electroless plating bath is preferably about 1 minute to 6 hours, more preferably about 1 minute to 3 hours, and most preferably 1 to 10 minutes.

In this step, when the plating catalyst applied to the resin layer or a precursor thereof has a function as an electrode, electroplating can be performed on the resin layer provided with the catalyst or the precursor thereof. .
In addition, as above-mentioned, in this process, an electroplating process can be performed as needed after the said electroless-plating process. In such an aspect, the thickness of the formed lead wiring can be adjusted as appropriate.
As a method of electroplating, a conventionally known method can be used. In addition, as a metal used for electroplating, copper, chromium, lead, nickel, gold | metal | money, silver, tin, zinc etc. are mentioned, Copper, gold | metal | money, silver is preferable from a conductive viewpoint, and copper is more preferable.

After the step D, a process for removing the resist pattern may be performed as necessary.
In addition, in said aspect, although the aspect which implements process C-2 which forms an insulating layer was described, a plating catalyst or its precursor was provided only to the specific part of the resin layer, and only the part of the resin layer By performing the plating treatment, a conductive laminate for a touch panel sensor can be obtained without carrying out the step C-2.

  The conductive laminate 10 for a touch panel sensor described above can be suitably used for a touch panel sensor. The touch panel sensor as described above can be suitably applied to a touch panel (in particular, a capacitive touch panel) in combination with a display device or the like.

<< Second Embodiment >>
In FIG. 4, the top view of 2nd Embodiment of the electroconductive laminated body for touchscreen sensors of this invention is shown. FIG. 5 is a cross-sectional view taken along the cutting line BB.
A conductive laminate 100 for a touch panel sensor shown in FIG. 4 includes a substrate 12, and a laminated resin layer 34 composed of a lower resin layer 30 and an upper resin layer 32 disposed in a peripheral region E _O on the substrate 12. The plurality of first detection electrodes 16 and the second detection electrodes 18 disposed on the central region E _I surrounded by the peripheral region E _O on the substrate 12 and the multilayer resin layer 34, and the first detection A plurality of lead wires 20 electrically connected to the electrode 16 and the second detection electrode 18, and an insulating layer 22 disposed in the central region E _I so as to cover the first detection electrode 16 and the second detection electrode 18. Is provided.
The conductive laminated body 100 for touch panel sensors shown in FIG. 4 has the same configuration as the conductive laminated body 10 for touch panel sensors shown in FIG. Constituent elements are denoted by the same reference numerals, description thereof is omitted, and the laminated resin layer 34 will be mainly described in detail below.
As shown in FIG. 5, one end 18A of the second detection electrode 18 extends to the upper resin layer 32, and the one end 18A and the upper resin layer 32 are in contact with each other. Note that one end portion of the first detection electrode also extends to the upper resin layer.

The laminated resin layer 34 includes a lower resin layer 30 containing a colorant, and an upper resin disposed on the lower resin layer 30 and having a functional group (interactive group) that interacts with the plating catalyst or its precursor. A multilayer resin layer including the layer 32. In the laminated resin layer 34, the lower resin layer serves as a so-called decorative layer, and the upper resin layer serves as a so-called plated layer. By using such a laminated resin layer 34, the roles of the decorative layer and the layer to be plated can be separated, and the range of selection of materials used in both layers is expanded.
The type of the colorant contained in the lower resin layer 30 is not particularly limited, and examples thereof include the colorant contained in the resin layer 14 described above.
Moreover, although resin is contained in the lower resin layer 30, the kind in particular is not restrict | limited, The resin contained in the resin layer 14 is mentioned.
The lower resin layer 30 may contain an interactive group.
The thickness of the lower resin layer 30 is not particularly limited, but is preferably 0.5 to 70 μm, and more preferably 1 to 40 μm, from the viewpoint that the function as a decorative layer is more excellent and the balance of thinning.

The upper resin layer 32 is a layer disposed on the lower resin layer 30 and includes an interactive group. The definition of the interactive group is as described above.
The upper resin layer 32 includes a resin, but the type thereof is not particularly limited, and examples thereof include a resin included in the resin layer 14.
It is preferable that the upper resin layer 32 is substantially free of colorant. “Substantially not contained” means that the content of the colorant relative to the total mass of the upper resin layer 32 is 10% by mass or less, preferably 5% by mass or less, and preferably 0% by mass. More preferred.
The thickness of the upper resin layer 32 is not particularly limited, but is preferably from 0.01 to 10 μm, more preferably from 0.2 to 5 μm, more preferably from the viewpoint of better function as a layer to be plated and the balance of thinning. More preferably, it is 25-1.0 micrometer.

Although the manufacturing method in particular of the said conductive laminated body 100 for touchscreen sensors is not restrict | limited, a lower resin layer is formed in the peripheral region on a board | substrate as the process A in the manufacturing method of the conductive laminated body 10 for touchscreen sensors mentioned above. The method of performing process A-1 and process A-2 which forms an upper resin layer on a lower resin layer is mentioned.
The method for forming the lower resin layer is not particularly limited, and may vary depending on the type of resin used, but includes a method of using a lower resin layer forming composition containing a colorant and a resin. More specifically, a method of applying the lower resin layer forming composition on the substrate and removing the coating film of the composition other than on the peripheral region can be mentioned. In addition, when a photosensitive resin is used as the resin, after applying the composition on the substrate to form a coating film, pattern exposure is performed on the coating film located on the peripheral region on the substrate. The desired lower resin layer can be formed by removing the unexposed portion by development processing.

  The method in particular of forming an upper resin layer is not restrict | limited, The procedure implemented at the process B which forms the resin layer in the conductive laminated body 10 for touchscreen sensors mentioned above is employ | adopted suitably.

<< Third Embodiment >>
In FIG. 6, the top view of 3rd Embodiment of the electroconductive laminated body for touchscreen sensors of this invention is shown. FIG. 7 is a cross-sectional view taken along the cutting line CC.
A conductive laminate 200 for a touch panel sensor shown in FIG. 6 is disposed on the substrate 12, the lower resin layer 30 disposed in the peripheral region E _O on the substrate 12, and a part on the lower resin layer 30. The upper resin layer 132, the plurality of first detection electrodes 16 and the second detection electrodes 18 disposed on the central region E _I surrounded by the peripheral region E _O on the substrate 12, and the upper resin layer 32. The plurality of lead wires 20 electrically connected to the first detection electrode 16 and the second detection electrode 18 and the central region E _I so as to cover the first detection electrode 16 and the second detection electrode 18 And an insulating layer 22.
The conductive laminate 200 for a touch panel sensor shown in FIG. 6 mainly has the same configuration as the conductive laminate 100 for a touch panel sensor shown in FIG. 2 except for the upper resin layer 132. The same components are denoted by the same reference numerals, description thereof is omitted, and the arrangement positions of the respective layers will be mainly described in detail below.

In the conductive laminate 100 for a touch panel sensor shown in FIG. 4, a part of the upper resin layer is located between the lower resin layer and the detection electrode (first detection electrode or second detection electrode). However, in the conductive laminate 200 for a touch panel sensor shown in FIG. 6, the upper resin layer is disposed on the lower resin layer so as to be in contact with the detection electrode. That is, as shown in FIG. 7, one end 18 </ b> A of the second detection electrode 18 extends to the lower resin layer 30, and the one end 18 </ b> A extends from the upper resin layer 132 and the lead on the lower resin layer 30. Contact the wiring 20. The first detection electrode has a similar configuration.
More specifically, the upper resin layer 132 is positioned only between the lower resin layer 30 and the lead-out wiring 20 as shown in FIG. That is, the upper resin layer 132 is arranged in the same pattern as the lead-out wiring 20, and the lead-out wiring 20 is located only on the upper resin layer 132. In other words, in this aspect, the upper resin layer is arranged in a pattern.
In this aspect, the arrangement position of the upper resin layer 132 is not limited to the aspect of FIGS. 6 and 7, as long as the upper resin layer can contact one end of the detection electrode on the lower resin layer. The upper resin layer may be disposed on a region other than the region where the detection electrode is located on the lower resin layer.

Although the manufacturing method in particular of the said conductive laminated body 200 for touchscreen sensors is not restrict | limited, It is preferable to have the following processes from the point that manufacture is easy.
Step E: Step of forming a lower resin layer containing a colorant in the peripheral region on the substrate Step F: Step of forming a detection electrode having one end extending on the lower resin layer on the substrate Step G: Lower resin A step G-1 of forming an upper resin layer having a functional group that interacts with a plating catalyst or a precursor thereof disposed in part of the layer and in contact with the detection electrode; and a detection electrode in contact with the upper resin layer Step H of performing Step G-2 in any order to form an insulating layer that covers the detection electrode and that does not substantially contain a functional group that interacts with the plating catalyst or its precursor so as to expose one end. A method including at least a step of applying a plating catalyst or a precursor thereof to the upper resin layer and performing a plating process on the upper resin layer to which the plating catalyst or the precursor is applied is electrically connected to one end of the detection electrode. Connected to Step of forming the lead wires will be described below in detail above step E~ step H.

[Step E]
Step E is a step of forming a lower resin layer containing a colorant in the peripheral region on the substrate. This step can be performed by the same procedure as in step A-1.

[Step F]
Step F is a step of forming on the substrate a detection electrode whose one end extends to the lower resin layer. This step can be performed by the same procedure as in step B described above.

[Step G]
Step G is a step G-1 of forming an upper resin layer that is disposed on a part of the lower resin layer and has a functional group that interacts with the plating catalyst or its precursor, and that contacts the detection electrode, and the upper resin. Step G-2 is performed in any order to form an insulating layer that covers the detection electrode and that does not substantially contain a functional group that interacts with the plating catalyst or its precursor so that one end of the detection electrode in contact with the layer is exposed. It is a process to be carried out.
In Step G, Step G-1 and Step G-2 may be performed in any order. Specifically, Step G-2 may be performed after Step G-1 is performed, and Step G-2 may be performed. After carrying out step G1, step G-1 may be carried out.

Step G-1 is a step of forming an upper resin layer having a functional group that is disposed on a part of the lower resin layer and is in contact with the detection electrode and that interacts with the plating catalyst or its precursor. As the procedure of this step, the procedure performed in the step A of forming the resin layer in the conductive laminate for touch panel sensor 10 described above is appropriately adopted, and the upper resin layer is formed only on a predetermined region on the lower resin layer. Be placed. In addition, what is necessary is just to adjust the area | region which gives energy suitably, when arrange | positioning an upper side resin layer only on a predetermined area | region.
In step G-2, an insulating layer that covers the detection electrode and does not substantially contain a functional group that interacts with the plating catalyst or its precursor so as to expose one end of the detection electrode that contacts the upper resin layer is exposed. It is a process of forming. As the procedure of this step, the procedure performed in step C-2 of forming the insulating layer in the conductive laminate 10 for a touch panel sensor described above is appropriately adopted.

[Step H]
Step H includes applying a plating catalyst or a precursor thereof to the upper resin layer, and performing a plating process on the upper resin layer to which the plating catalyst or the precursor is applied. This is a step of forming a lead wiring electrically connected to the portion.
As shown in FIG. 6, when the upper resin layer is located only in the region where the lead-out wiring is disposed, in this step, the process D for forming the lead-out wiring in the touch panel sensor conductive laminate 10 described above is performed. Thus, a desired lead wiring can be formed.

In Step H, if necessary, the metal layer formed on the upper resin layer by plating may be further etched into a pattern to form a lead wiring.
At that time, as a method, a generally known subtractive method (a patterned mask is provided on a metal layer, a non-mask formation region is etched, the mask is removed, and an extraction wiring is formed. Method), semi-additive method (providing a patterned mask on the metal layer, plating so that the metal layer is formed in the non-formation area of the mask, removing the mask, etching, Forming method) is used.
In addition, instead of the step of forming an insulating layer substantially free of functional groups that interact with the plating catalyst or its precursor in Step G, the plating catalyst or its precursor was applied without forming the insulating layer. Plating can be performed only on one end of the upper resin layer and the detection electrode.

  In addition, in FIGS. 1 to 7 described above, the detection electrode, the lead wiring, and the resin layer are disposed only on one surface of the substrate. However, the detection electrode and the lead wiring described above are provided on both surfaces of the substrate. And the resin layer may be arrange | positioned. In this case, as the substrate used, as described above, a resin substrate (for example, a PET substrate) can be used.

  EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to these.

<Example 1>
On a glass substrate having a thickness of 0.55 mm, screen printing was performed 5 times using a black resist, and coating was performed. Next, after removing the solvent content with a vacuum dryer, exposure was performed by a proximity exposure system (ultra-high pressure mercury lamp). Here, as the photomask for exposure, a soda glass patterned with Cr (chromium) was used. Next, it developed with the alkaline developing solution, heat-processed, and formed the resin layer in the position of the resin layer 14 shown in FIG.
As the black resist, the black composition 4 used in Example 4 of Japanese Patent Application Laid-Open No. 2014-130417 was used. In the obtained resin layer, a carboxylic acid group was contained as an interactive group.

Next, an ITO layer is formed on the obtained glass substrate by a sputtering method using an indium oxide-tin oxide target having a composition of indium oxide and tin oxide at a weight ratio of 95: 5 and a filling density of 98%. Then, resist patterning and etching were performed to obtain a patterned ITO layer corresponding to the first detection electrode 16 and the second detection electrode 18 shown in FIG. However, between the 1st detection electrode 16 and the 2nd detection electrode 18, pattern exposure was performed using the acrylic photosensitive resin composition, and the insulating layer between electrodes was arrange | positioned.
In addition, as shown in FIG. 1, the one end part of the ITO layer extended on the resin layer.

  Next, on the ITO layer of the obtained glass substrate, a negative resist containing cyclized isoprene rubber (manufactured by Fuji Film, SC-450) is applied, exposed in a pattern, and unexposed portions are developed and removed. An insulating layer was obtained at the same position as the insulating layer 22 shown in FIG. The insulating layer did not contain an interactive group. Moreover, as shown in FIG. 1, the insulating layer was arrange | positioned so that each one end part of ITO layer might be exposed.

  Next, a negative resist containing cyclized isoprene rubber (manufactured by Fuji Film, SC-450) is applied on the resin layer, exposed in a pattern, and on the resin layer where the lead-out wiring 20 shown in FIG. A resist pattern was formed in this area.

  Next, after masking the surface of the glass substrate on which the resin layer is not formed with a curing tape (manufactured by Nitto Denko), the glass substrate having the resin layer is made of MAT-Pd catalyst application liquid MAT-2 (manufactured by Uemura Kogyo). It was immersed for 5 minutes at room temperature in a solution obtained by diluting 2A only 5 times (catalyst imparting solution, pH: 3.5), and washed twice with pure water. Next, it was immersed in a reducing agent MAB (manufactured by Uemura Kogyo) at 36 ° C. for 5 minutes and washed twice with pure water. Then, it was immersed in activation treatment liquid MEL-3 (manufactured by Uemura Kogyo) at room temperature for 5 minutes, and immersed in electroless plating solution Sulcup PEA (manufactured by Uemura Kogyo) for 60 minutes at room temperature without washing. The masked tape was peeled off and washed twice with pure water to obtain a conductive laminate having a patterned copper layer (corresponding to a lead-out wiring) on the resin layer. It was confirmed that the length of the wiring 20 formed on the second detection electrode end 18A shown in FIG. 2 was 1 mm or more from the outermost part of the second detection electrode end 18A.

<Example 2>
(Synthesis example: Polymer 1)
1 L of ethyl acetate and 159 g of 2-aminoethanol were placed in a 2 L three-necked flask and cooled in an ice bath. Thereto, 150 g of 2-bromoisobutyric acid bromide was added dropwise while adjusting the internal temperature to 20 ° C. or lower. Thereafter, the internal temperature was raised to room temperature (25 ° C.) and reacted for 2 hours. After completion of the reaction, 300 mL of distilled water was added to stop the reaction. Thereafter, the ethyl acetate phase was washed four times with 300 mL of distilled water, dried over magnesium sulfate, and 80 g of raw material A was obtained by distilling off ethyl acetate.
Next, 47.4 g of raw material A, 22 g of pyridine, and 150 mL of ethyl acetate were placed in a 500 mL three-necked flask and cooled in an ice bath. Thereto, 25 g of acrylic acid chloride was added dropwise while adjusting the internal temperature to 20 ° C. or lower. Then, it was raised to room temperature and reacted for 3 hours. After completion of the reaction, 300 mL of distilled water was added to stop the reaction. Thereafter, the ethyl acetate phase was washed four times with 300 mL of distilled water and then dried over magnesium sulfate, and further ethyl acetate was distilled off. Thereafter, the following monomer M1 (20 g) was obtained by column chromatography.

A 500 mL three-necked flask was charged with 8 g of N, N-dimethylacetamide and heated to 65 ° C. under a nitrogen stream. There, monomer M1: 14.3 g, acrylonitrile (manufactured by Tokyo Chemical Industry Co., Ltd.) 3.0 g, acrylic acid (manufactured by Tokyo Chemical Industry) 6.5 g, V-65 (manufactured by Wako Pure Chemical Industries) 0.4 g of N, An 8 g solution of N-dimethylacetamide was added dropwise over 4 hours.
After completion of the dropwise addition, the reaction solution was further stirred for 3 hours. Thereafter, 41 g of N, N-dimethylacetamide was added, and the reaction solution was cooled to room temperature. To the above reaction solution, 0.09 g of 4-hydroxy TEMPO (manufactured by Tokyo Chemical Industry) and 54.8 g of DBU (diazabicycloundecene) were added and reacted at room temperature for 12 hours. Thereafter, 54 g of a 70 mass% methanesulfonic acid aqueous solution was added to the reaction solution. After completion of the reaction, reprecipitation was carried out with water, the solid matter was taken out, and 12 g of polymer 1 was obtained.

The obtained polymer 1 was identified using an IR measuring machine (manufactured by Horiba, Ltd.). The measurement was performed by dissolving the polymer in acetone and using KBr crystals. As a result of IR measurement, a peak was observed in the vicinity of 2240 cm ⁻¹ , and it was found that acrylonitrile, which is a nitrile unit, was introduced into the polymer. Moreover, it was found from the acid value measurement that acrylic acid was introduced as a carboxylic acid unit. Moreover, it melt | dissolved in heavy DMSO (dimethyl sulfoxide) and measured by NMR (nuclear magnetic resonance) (AV-300) of Bruker 300MHz. 4. A peak corresponding to the nitrile group-containing unit is broadly observed at 2.5 to 0.7 ppm (5 H min), and a peak corresponding to the polymerizable group containing unit is 7.8 to 8.1 ppm (1 H min). 8-5.6 ppm (for 1H), 5.4-5.2 ppm (for 1H), 4.2-3.9 ppm (for 2H), 3.3-3.5 ppm (for 2H), 2.5- A broad peak was observed at 0.7 ppm (6H min), and a peak corresponding to a carboxylic acid-containing unit was observed broadly at 2.5-0.7 ppm (3H min), a polymerizable group-containing unit: a nitrile group-containing unit: It was found that the carboxylic acid group unit = 30: 30: 40 (mol%).

(Preparation of upper resin layer forming composition)
In a 200 ml beaker containing a magnetic stirrer, water (18.95 parts by mass), propylene glycol monomethyl ether (75.8 parts by mass), polymer 1 (5 parts by mass), and IRGACUREOXE02 (manufactured by BASF) (0. 0 parts). 25 parts by mass) was added to prepare a composition for forming the upper resin layer.

  A conductive laminate was produced according to the same procedure as in Example 1 except that the resin layer production procedure was changed to the following method (laminated resin layer production method).

(Manufacturing method of laminated resin layer)
Using the decorative layer forming photosensitive film L1 manufactured in Example 1 of JP2013-218313A, according to the same procedure as the above document, at the same position as the lower resin layer 30 shown in FIG. A decorative layer was placed on the substrate. In addition, the coloring agent was contained in the decoration layer.
Next, the upper resin layer forming composition was spin-coated on a substrate provided with a decorative layer and dried at 80 ° C. for 5 minutes. Thereafter, the entire surface of the coating film was irradiated with UV in the form of a pattern in the atmosphere (energy amount: 2J, 10 mW, wavelength: 256 nm), and the upper resin layer (thickness: 0) was positioned at the same position as the upper resin layer 32 shown in FIG. .25 μm) was formed.

<Example 3>
A substrate having a decorative layer was produced according to the same procedure as in Example 2.
Next, an ITO layer was disposed on the substrate according to the same procedure as the method performed in Example 1. In addition, the one end part of the ITO layer was extended on the decoration layer.
Next, the upper resin layer forming composition was spin-coated on a substrate provided with a decorative layer and dried at 80 ° C. for 5 minutes. Thereafter, the entire surface of the coating film was irradiated with UV in the form of a pattern in the atmosphere (energy amount: 2J, 10 mW, wavelength: 256 nm), and the upper resin layer (thickness: 0) was positioned at the same position as the upper resin layer 132 shown in FIG. .25 μm) was formed.
Thereafter, using the obtained substrate, an insulating layer is provided according to the same procedure as in Example 1, and further plated, and a patterned copper layer is formed at the position of the lead wiring 20 shown in FIG. A conductive laminate was obtained.

When the following (connection resistance measurement) was carried out using the conductive laminates obtained in Examples 1 to 3, the evaluation was “A” in any conductive laminate, and the ITO layer (detection) It was confirmed that the electrical connectivity between the electrode) and the patterned copper layer (lead wiring) was high.
(Connection resistance measurement)
As an evaluation method, the resistance value between the patterned copper layer and the patterned ITO layer was measured (manufactured by Hioki Electric Co., Ltd., milliohm high tester 3540) and evaluated according to the following criteria.
“A”: When the resistance value is 10 mΩ or less “B”: When the resistance value exceeds 10 mΩ “C”: When the resistance value cannot be measured and is substantially disconnected

In Example 1, an insulating layer formed from a cyclized isoprene rubber-containing negative resist (manufactured by Fuji Film, SC-450) was used, but an SiO ₂ layer (33 nm) and an NbO ₅ layer (14 nm) were used. It was confirmed that the same effect was obtained when the laminated layer was used instead.

  When the touchscreen provided with the touchscreen sensor containing each electroconductive laminated body obtained in the said Examples 1-3 was manufactured, all the touchscreens operate | moved favorably.

  In Examples 1 to 3, the insulating layer was provided and the plating process was performed. However, without providing the insulating layer, the plating process was performed only on the portion where the lead-out wiring was to be deposited, and the desired patterned copper layer was formed. It could also be formed. More specifically, only the portion of the resin layer on which the lead wiring is to be deposited was immersed in the solution used in the plating treatment to deposit the plating.

10, 100, 200 Conductive laminate for touch panel sensor 12 Substrate 14 Resin layer 16 First detection electrode 18 Second detection electrode 20 Lead-out wiring 22 Insulating layer 24 Interelectrode insulating layer 30 Lower resin layer 32, 132 Upper resin layer 34 Multilayer resin layer

Claims (3)

  Forming a resin layer having a functional group that interacts with a plating catalyst or a precursor thereof in a peripheral region on the substrate; and
  A step B in which one end portion extends onto the resin layer and a detection electrode that contacts the resin layer is formed on the substrate;
  Step C-1 for forming a resist pattern on the resin layer, and interaction with a plating catalyst or a precursor thereof covering the detection electrode so that one end of the detection electrode in contact with the resin layer is exposed A step C of performing the step C-2 of forming an insulating layer substantially free of functional groups to be performed in any order;
  A plating catalyst or a precursor thereof is applied to a region on the resin layer where the resist pattern is not formed, and a plating treatment is performed on the resin layer to which the plating catalyst or the precursor is applied, and the detection is performed. And a step D of forming a lead-out wiring electrically connected to the one end of the electrode. A method for manufacturing a conductive laminate for a touch panel sensor.   Forming a lower resin layer containing a colorant in a peripheral region on the substrate; and
  Forming a detection electrode on the substrate, one end of which extends to the lower resin layer; and
  A step G-1 of forming an upper resin layer that is disposed on a part of the lower resin layer and has a functional group that interacts with a plating catalyst or a precursor thereof, in contact with the detection electrode; and the upper resin layer Forming an insulating layer that covers the detection electrode and that does not substantially contain a functional group that interacts with the plating catalyst or its precursor so as to expose one end of the detection electrode in contact with the electrode. Step G performed in random order;
  The end of the detection electrode is formed by a method including at least a step of applying a plating catalyst or a precursor thereof to the upper resin layer and performing a plating process on the upper resin layer to which the plating catalyst or the precursor is applied. A process for producing a conductive laminate for a touch panel sensor, comprising: a step H of forming a lead-out wiring electrically connected to the portion. The manufacturing method of the conductive laminated body for touchscreen sensors of Claim 1 or 2 with which the material which comprises the said detection electrode contains a metal oxide, a metal, or an alloy.