TW201617810A - Conductive laminate for touch panel sensor and manufacturing method thereof, touch panel sensor, touch panel - Google Patents

Abstract

The invention provides high electrical connecting conductive laminate for touch panel sensor and manufacturing method thereof, touch panel sensor and touch panel that having detective electrode and lead wire. The conductive laminate for touch panel sensor comprises substrate, resin layer located on the periphery area of the substrate composing functional group is capable of interacting with plating catalyst or precursor thereof, detective electrode that is disposed on the substrate via contacting with the resin layer by an end part and lead wire is disposed on the resin layer, which electrical connecting with an end part of the detective electrode. The lead wire is formed at least by the following procedure: providing the plating catalyst or precursor thereof to the resin layer and then plating the aforesaid resin layer afterwards.

Description

Conductive laminate for touch panel sensor and manufacturing method thereof, touch panel sensor, touch panel

The present invention relates to a conductive laminate for a touch panel sensor, a method of manufacturing the same, and a touch panel sensor and a touch panel.

A conductive film in which a conductive thin wire is formed on a substrate is used in various applications, and in particular, in recent years, with the increase in the mounting rate of a touch panel on a mobile phone, a portable game machine, etc., it is possible to detect multiple points. The demand for conductive films for capacitive touch sensors is rapidly increasing.

In the method of producing a conductive layer that functions as a lead-out wiring included in the conductive film for a touch panel sensor, various methods are proposed. For example, Patent Document 1 (JP-A-2008-207401) discloses In the method, an electroless plating catalyst or a precursor thereof is applied to a graft polymer-forming region having an interactive group, and electroless plating is performed to prepare a conductive layer.

Patent Document 1 describes that the conductive layer can function as "the electrode (detection electrode) connected to the touch panel and the guide wiring (lead wiring) of the driver", but the specific configuration is not described.

The present inventors have found that when a conductive layer is formed in the form of a lead wiring by referring to the method described in Patent Document 1, a conductive defect may occur between the detecting electrodes.

In view of the above circumstances, an object of the present invention is to provide a conductive laminate for a touch panel sensor having high electrical continuity between a detecting electrode and a lead wiring.

Further, another object of the present invention is to provide a method of manufacturing a conductive laminate for a touch panel sensor, a touch panel sensor including the conductive laminate for a touch panel sensor, and a touch panel.

The inventors of the present invention have conducted intensive studies on the problems of the prior art, and as a result, have found that the above problems can be solved by controlling the positional relationship between the resin layer having a functional group that interacts with the plating catalyst or its precursor and the detecting electrode.

That is, the inventors have found that the above problems can be solved by the following configuration.

(1) A conductive laminate for a touch panel sensor, comprising:

Substrate

a resin layer disposed in a peripheral region on the substrate and having a functional group that interacts with the plating catalyst or a precursor thereof;

a detecting electrode disposed on the substrate in such a manner that one end portion is in contact with the resin layer;

Leading wiring disposed on the resin layer and electrically connected to one end portion of the detecting electrode;

The lead-out wiring is a wiring formed by a method having at least the following steps. In this step, a plating catalyst or a precursor thereof is applied to the resin layer, and a resin layer to which the plating catalyst or its precursor is applied is plated. .

(2) The conductive laminate for a touch panel sensor according to (1), wherein

The laminate further includes an insulating layer covering the detecting electrode in such a manner that the one end portion of the detecting electrode electrically connected to the lead wiring is exposed;

The functional group that interacts with the plating catalyst or its precursor is substantially not contained in the insulating layer.

(3) The conductive laminate for a touch panel sensor according to (1) or (2), wherein

a coloring agent is contained in the resin layer, and the resin layer functions as a decorative layer;

One end portion of the detecting electrode extends onto the resin layer.

(4) The conductive laminate for a touch panel sensor according to (1) or (2), wherein

The resin layer is a laminated resin layer including a lower resin layer containing a colorant, and a lower resin layer disposed on the lower resin layer to interact with the plating catalyst or its precursor Functional group

One end portion of the detecting electrode extends to the upper resin layer.

(5) The conductive laminate for a touch panel sensor according to (1) or (2), wherein

The resin layer is a laminated resin layer including a lower resin layer containing a colorant, and a lower resin layer disposed on a portion of the lower resin layer and having a plating catalyst or a precursor thereof Interacting functional group;

One end portion of the detecting electrode extends to the lower resin layer, and one end portion of the lower resin layer is in contact with the upper resin layer.

(6) The conductive laminate for a touch panel sensor according to any one of (1) to (5) wherein the substrate is a glass substrate.

(7) A touch panel sensor comprising the conductive laminate for a touch panel sensor according to any one of (1) to (6).

(8) A touch panel comprising the conductive laminate for a touch panel sensor according to any one of (1) to (6).

(9) A method of manufacturing a conductive laminate for a touch panel sensor, comprising the steps of:

Step A, in this step, forming a resin layer having a functional group that interacts with the plating catalyst or its precursor on a peripheral region on the substrate;

Step B, in this step, forming a detecting electrode on the substrate, one end portion of the detecting electrode extends to the resin layer, and the detecting electrode is in contact with the resin layer;

Step C, in this step, step C-1 and step C-2 are performed in different order, in step C-1, a resist pattern is formed on the resin layer; in step C-2, substantially An insulating layer not containing a functional group that interacts with a plating catalyst or a precursor thereof, the insulating layer covering the detecting electrode in such a manner that one end portion of the detecting electrode that is in contact with the resin layer is exposed;

In the step D, a plating catalyst or a precursor thereof is applied to a region of the resin layer where no resist pattern is not formed, and a resin layer to which a plating catalyst or a precursor thereof is applied is plated to form a resin layer. A lead wire electrically connected to one end portion of the detecting electrode.

(10) A method of manufacturing a conductive laminate for a touch panel sensor, comprising the steps of:

Step E, in this step, forming a lower resin layer containing a colorant on a peripheral region on the substrate;

Step F, in this step, forming a detection electrode extending from one end to the lower resin layer on the substrate;

Step G, in which step G-1 and step G-2 are sequentially performed, and in step G-1, an upper resin layer having a functional group that interacts with the plating catalyst or its precursor is formed, The upper resin layer is disposed on a portion of the lower resin layer, and the upper resin layer is in contact with the detecting electrode; in the step G-2, an insulating layer is formed which does not substantially contain a functional group that interacts with the plating catalyst or its precursor, The insulating layer covers the detecting electrode in such a manner that one end portion of the detecting electrode that is in contact with the upper resin layer is exposed;

Step H, in this step, a lead-out wiring electrically connected to one end portion of the detecting electrode is formed by a method having at least the following steps, and in this step, a plating catalyst or a precursor thereof is applied to the upper resin layer, and is given The upper resin layer of the plating catalyst or its precursor is subjected to a plating treatment.

The effect of the invention is:

1. According to the present invention, it is possible to provide a conductive laminate for a touch panel sensor having high electrical connection linearity between the detecting electrode and the lead wiring.

2. In addition, according to the present invention, a method of manufacturing a conductive laminate for a touch panel sensor, a touch panel sensor including a conductive laminate for a touch panel sensor, and a touch panel can be provided. .

Hereinafter, the conductive laminate for a touch panel sensor of the present invention, a method of manufacturing the same, a touch panel sensor, and a touch panel will be described in detail.

In the present specification, the numerical range represented by "to" means a range including the numerical values described before and after "to" as the lower limit and the upper limit. In addition, the drawings in the present invention are schematic views, and the thickness relationship, positional relationship, and the like of each layer do not necessarily have to be consistent with actual conditions.

One of the features of the conductive laminate for a touch panel sensor of the present invention is that the resin layer containing a specific functional group is placed in contact with the detecting electrode. By adopting such an arrangement, the lead wiring which is formed as a plating metal layer (which is formed by performing a plating treatment on the resin layer to which the plating catalyst or the precursor is applied) is sufficiently in contact with the detecting electrode. Ensure electrical continuity between the two.

Further, as one of the other features of the present invention, an insulating layer covering the detecting electrode may be provided so that one end portion of the detecting electrode is exposed. When the resin layer to which the plating catalyst or its precursor is applied is subjected to a plating treatment by providing the insulating layer, precipitation of the plating material on the detecting electrode can be suppressed, and as a result, conduction between the detecting electrodes can be further suppressed. occur.

<<First embodiment>>

Fig. 1 is a plan view showing a first embodiment of a conductive laminate for a touch panel sensor according to the present invention. Fig. 2 is a cross-sectional view taken along the cutting line A-A. In the present specification, the drawings are schematically shown for easy understanding of the respective layer configurations, and are not intended to accurately show the arrangement of the layers.

The conductive laminate 10 for a touch panel sensor shown in FIG. 1 includes a substrate 12, a resin layer 14 disposed in a peripheral region E _O of the substrate 12, and a center surrounded by a peripheral region E _O on the substrate 12. two or more first detecting electrode 16 and the second detection electrode disposed on a region E _I 18, disposed on the resin layer 14 is connected to the 18 electrical first detection electrode 16 and the second detection electrode of the two or more lead lines 20 And the insulating layer 22 disposed in the central region E _{I so} as to cover the first detecting electrode 16 and the second detecting electrode 18.

The conductive laminate 10 for a touch panel sensor of the present embodiment has a central region E _I constituting an input region (which can be input by a user when used as a touch panel sensor), and A peripheral area E _O located outside the central area E _I . In the central region, as described above, the region in which the detecting electrode is disposed; and in the peripheral region E _O , the outer region (peripheral region) in which the lead wire is disposed outside the central region.

The above configuration will be described in detail below.

[substrate]

The substrate 12 has two main faces, and is a member that functions to support the first detecting electrode 16 and the second detecting electrode 18 in the central region E _I while supporting the resin layer 14 in the peripheral region E _O . Further, in FIG. 1, the peripheral region E _O to the outer periphery of a region extending from near the outer periphery of the substrate 12 toward the center side, is formed into a rectangular frame shape, but is not limited to this shape, a heart shape may be arbitrary, egg Type, round shape, etc.

The type of the substrate 12 is not particularly limited, and examples thereof include an insulating substrate. More specifically, a resin substrate, a ceramic substrate, a glass substrate, or the like can be used, and a glass substrate is preferable.

Examples of the material of the resin substrate include polyethylene terephthalate, polyethylene naphthalate, polyether oxime, polyacrylic resin, urethane resin, polyester, polycarbonate, and poly. Anthracene, polyamine, polyarylate, polyolefin, cellulose resin, polyvinyl chloride, cycloolefin resin, and the like. Among them, polyethylene terephthalate, polyethylene naphthalate or polyolefin is preferred.

The resin substrate is preferably provided with a hard coat layer. The hard coat layer is preferably polyethylene terephthalate, polyethylene naphthalate or polyolefin provided on the surface, and the hard coat layer is more preferably polyethylene terephthalate or polyethylene provided on the surface. Olefins.

The thickness (mm) of the substrate 12 is not particularly limited, and the resin substrate is preferably 0.01 to 2 mm, more preferably 0.02 to 1 mm, and most preferably 0.03 to 0.1 mm from the viewpoint of balance between handleability and thickness reduction. Further, the glass substrate is preferably 0.01 to 2 mm, more preferably 0.3 to 0.8 mm, and most preferably 0.4 to 0.7 mm.

Further, the substrate 12 preferably transmits light appropriately. Specifically, the total light transmittance of the substrate 12 is preferably 85 to 100%.

[resin layer]

The resin layer 14 is a layer of the entire peripheral region E _O disposed on the substrate 12, and is a layer having a functional group (hereinafter simply referred to as "interactive group") which interacts with the plating catalyst or its precursor. The resin layer 14 adsorbs (attaches) the plating catalyst or its precursor used in the production of the lead wiring in accordance with the function of the interactive group. That is, the resin layer 14 functions as a good receiving layer (so-called coated layer) as a plating catalyst or a precursor thereof.

In addition, as described below, the resin layer 14 preferably contains a coloring agent and functions as a so-called decorative layer. In other words, it is preferable that the resin layer 14 functions as a decorative layer while exhibiting a function as a layer to be plated. In addition, the decorative layer is a layer that can cover the lead wiring 20 when the conductive layered body 10 for a touch panel sensor is viewed from the substrate 12 side, and functions as a layer for improving the appearance.

The thickness of the resin layer 14 is not particularly limited, and is preferably 5 to 100 μm, more preferably 10 to 70 μm, still more preferably 20 to 60 μm from the viewpoint of productivity.

The interactive group contained in the resin layer 14 means a functional group capable of interacting with the plating catalyst or its precursor imparted to the resin layer 14, and for example, it is possible to form an electrostatic interaction with the plating catalyst or its precursor. The functional group to be functional or a nitrogen-containing functional group, a sulfur-containing functional group, an oxygen-containing functional group or the like capable of forming a coordination with the plating catalyst or its precursor.

Specific examples of the interactive group include an amino group, an amide group, an imide group, a urea group, a tertiary amino group, an ammonium group, a thiol group, a triazine ring, a triazole ring, and a benzotriazole. Base, imidazolyl, benzimidazolyl, quinolyl, pyridyl, pyrimidinyl, pyrazinyl, quinazolinyl, quinoxalinyl, fluorenyl, triazinyl, piperidinyl, piperazinyl, pyrrole Alkyl, pyrazolyl, anilino, a group containing an alkylamine structure, a group containing an isocyanurate structure, a nitro group, a nitroso group, an azo group, a diazo group, an azide group, a cyano group, a nitrogen-containing functional group such as a cyanate group; an ether group, a hydroxyl group, a phenolic hydroxyl group, a carboxylic acid group, a carbonate group, a carbonyl group, an ester group, a group having an N-oxide structure, a group having an S-oxide structure, An oxygen-containing functional group such as a group having an N-hydroxy structure; a thienyl group, a thiol group, a thiourea group, a thiocyanuric acid group, a benzothiazolyl group, a decyltriazinyl group, a thioether group, a thiol group , anthracenylene, fluorenyl group, sulfite group, group containing a ruthenium structure, a group containing an ytterbium salt structure, a sulfonic acid group, containing a sulfur-containing functional group such as a group of an acid ester structure; a phosphorus-containing functional group such as a phosphate ester group, a phosphoramide group, a phosphino group, or a phosphate group-containing group; a group containing a halogen atom such as chlorine or bromine; Among the functional groups in which a salt structure can be employed, salts thereof can also be used.

Among them, an ionic polar group, an ether group or a cyano group such as a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, and a boric acid group is particularly preferable because of high polarity and high adsorption ability with a plating catalyst or a precursor thereof. Further preferred is a carboxylic acid group (carboxyl group) or a cyano group. In particular, in order to increase the carboxylic acid group, the surface of the resin layer may be subjected to a saponification treatment using an alkaline solution.

The resin layer 14 may contain two or more types of interactive groups.

The type of the resin constituting the resin layer 14 is not particularly limited, and examples thereof include an insulating resin such as a thermosetting resin or a thermoplastic resin (for example, a (meth)acrylic resin (including a crosslinked and a non-crosslinked (meth)acrylic resin). Resin)). It is sufficient that these materials contain an interactive group. In addition, the (meth)acrylic resin is a concept including an acrylic resin and a methacryl resin.

More specifically, examples of the thermosetting resin include an epoxy resin, a phenol resin, a polyimide resin, a polyester resin, a bismaleimide resin, a polyolefin resin, an isocyanate resin, and crosslinking ( Methyl) acrylic resin, enamel resin, and the like. Examples of the thermoplastic resin include phenoxy resin, polyether oxime, polyfluorene, polyphenylene fluorene, polyphenylene sulfide, polyphenyl ether, polyether sulfimine, and non-crosslinked (methyl). Acrylic resin, etc.

The kind of the coloring agent contained in the resin layer 14 is not particularly limited, and a known pigment or dye is used. As the pigment, both an inorganic pigment and an organic pigment can be used. More specifically, as the inorganic pigment, white pigments such as titanium oxide and zinc oxide; body pigments such as calcium carbonate and barium sulfate; black pigments such as carbon black; iron oxide, lead dan, molybdenum red, and cadmium red can be exemplified. Red pigments of the class; yellow pigments such as lead oxide, chrome yellow, yellow iron oxide; blue pigments such as Prussian blue and ultramarine. In addition, examples of the organic pigment include an azo pigment, a phthalocyanine pigment, a quinacridone pigment, a perylene pigment, an isoindolinone pigment, a dioxazine pigment, and a Shilin (スレン) is a pigment, etc.

[Detection electrode]

The first detecting electrode 16 and the second detecting electrode 18 are sensing electrodes that sense a change in electrostatic capacitance in a touch panel sensor including the conductive layered body for a touch panel sensor of the present embodiment, and constitute a sensing portion ( Sensing section). In other words, when the fingertip is brought into contact with the touch panel, the mutual capacitance of each of the detecting electrodes changes, and the position of the fingertip is calculated by the IC circuit based on the amount of change.

The first detection electrode 16 has a function for detecting X-direction position of the input region E _I near the center of the operator's finger, having a function of generating electrostatic capacitance between it and the fingers. The first detecting electrode 16 extends in the first direction (X direction) and is an electrode that is arranged at a predetermined interval in the second direction (Y direction) orthogonal to the first direction.

The second detecting electrode 18 has a function of detecting an input position in the Y direction of the operator's finger close to the central region E _I , and has a function of generating an electrostatic capacitance between the finger and the finger. The second detecting electrode 18 extends in the second direction (Y direction) and is an electrode that is arranged at a predetermined interval in the first direction (X direction).

In FIG. 1, four of the first detecting electrodes 16 and four of the second detecting electrodes 18 are provided, but the number thereof is not particularly limited, and may be two or more.

In FIG. 1, the first detecting electrode 16 and the second detecting electrode 18 are solid films, but may include a specific pattern such as a mesh.

In addition, as shown in FIG. 2, in the portion where the first detecting electrode 16 and the second detecting electrode 18 intersect, the conduction between the first detecting electrode 16 and the second detecting electrode 18 is prevented, and insulation is performed. An inter-electrode insulating layer 24 is disposed between the detecting electrode 16 and the second detecting electrode 18.

Further, as shown in FIG. 2, in the second detecting electrode 18, each of the one end portions 18A extends over the resin layer 14 and is in contact with the resin layer 14. In other words, the one end portion 18A is located on the resin layer 14. In the same manner, in the first detecting electrode 16, the one end portion thereof extends over the resin layer 14 to be in contact with the resin layer 14.

As a result, the one end portion of the first detecting electrode 16 and the one end portion of the second detecting electrode 18 are in contact with the resin layer 14, respectively, and as a result, the contact with the lead wiring 20 formed on the resin layer 14 by the method described later is good. Good electrical conduction between the first detecting electrode 16 and the second detecting electrode 18 and the lead wiring 20 is ensured.

The material constituting the first detecting electrode 16 and the second detecting electrode 18 is not particularly limited, and examples thereof include metal oxides such as indium tin oxide (ITO), tin oxide, zinc oxide, cadmium oxide, gallium oxide, and titanium oxide. Further, a metal such as gold (Au), silver (Ag), copper (Cu), or aluminum (Al) or an alloy may be used.

[lead wiring]

The lead wiring 20 is a member that functions to apply a voltage to the first detecting electrode 16 and the second detecting electrode 18. The lead wiring 20 is disposed in the peripheral region E _{O of the} substrate 12, and one end thereof is electrically connected to the corresponding first detecting electrode 16 and second detecting electrode 18, and the other end is located at a position where the flexible printed circuit board or the like is disposed. In addition, in FIG. 2, the lead wiring is disposed so as to cover one end portion of the detecting electrode (the one end portion 18A of the second detecting electrode 18 in FIG. 2), but the lead wiring may be electrically connected to the detecting electrode, and Limited to this method.

As described below, the lead wiring 20 is a wiring formed by a method having at least the following steps, in which a plating catalyst or a precursor thereof is applied to the resin layer 14, and a plating catalyst or a precursor thereof is imparted thereto. The resin layer 14 is subjected to a plating treatment. That is, the lead wiring 20 is a wiring composed of a plated metal layer (metal layer) formed in the plating process.

In addition, the number of the lead wires 20 is not particularly limited, and generally two or more are arranged in accordance with the number of the first detecting electrodes 16 and the second detecting electrodes 18.

The thickness of the lead-out wiring 20 is not particularly limited, and an optimum thickness can be appropriately selected depending on the purpose of use. From the viewpoint of electrical conductivity, it is preferably 0.1 μm or more, more preferably 0.5 μm or more, and still more preferably 1 to 30 μm.

The line width of the lead-out wiring 20 is not particularly limited, and is preferably 30 μm or less, more preferably 15 μm or less, further preferably 10 μm or less, and preferably 0.5 μm or more, and more preferably 1.0 μm or more from the viewpoint of low resistance of the lead wiring. .

In addition, the type of the metal constituting the lead-out wiring 20 is not particularly limited, and may be different depending on the type of the plating liquid used for the plating treatment to be described later, and examples thereof include copper, chromium, lead, nickel, gold, silver, tin, and zinc. From the viewpoint of conductivity, copper, gold, and silver are preferable, and copper and silver are more preferable.

In addition, although not illustrated in FIG. 1, a flexible printed circuit board or the like may be disposed at a position where the other end of the lead wiring 20 (not the end on the detecting electrode side) is located. The flexible printed circuit board is a board in which two or more wirings and terminals are provided on a substrate, and is connected to the other end of the lead wiring 20 to exhibit a capacitive touch panel sensor and an external device (for example, a display device). The role of the connection.

[Insulation]

The insulating layer 22 covers the first detecting electrode 16 and the second detecting electrode 18 so that one end portion of the first detecting electrode 16 and the second detecting electrode 18 connected to the lead wiring 20 is exposed, and is spread over the central region in FIG. E _I is the entire area of the configuration. In addition, the insulating layer 22 has an arbitrary structure, and is a layer arrange|positioned as needed.

The insulating layer 22 does not substantially contain a functional group that interacts with the plating catalyst or its precursor. Therefore, as described below, in the step of imparting the plating catalyst or the precursor thereof to the above-described production of the lead wiring 20, it is possible to prevent the plating catalyst or its precursor from being imparted (adsorbed) to the first detecting electrode 16 and As a result, the second detecting electrode 18 can suppress the occurrence of conduction between the detecting electrodes after the plating treatment.

The type of the insulating layer 22 is not particularly limited, and a known insulating material can be used. For example, an insulating organic material and an insulating inorganic material are suitably used.

As the insulating organic material, a known insulating resin can be used. The insulating resin may, for example, be a thermosetting resin or a thermoplastic resin used for forming the resin layer 14 described above.

Further, as the insulating inorganic material, for example, a metal oxide such as cerium oxide or cerium oxide can be used.

The insulating layer 22 may be only one layer or two or more layers. In the case of two or more layers, the materials of the respective layers may be different. In addition, a tape having a weak adhesive such as a cover tape can also be used.

The insulating layer 22 does not substantially contain a functional group (interactive group) that interacts with the plating catalyst or its precursor. Here, the substantially no intermetallic group means that the amount of adsorption of the plating catalyst or the precursor of the insulating layer 22 is 1000 ppm by mass or less, and the amount of adsorption is preferably 500 ppm by mass or less, more preferably 100 ppm by mass. The following is most preferably 10 ppm by mass or less. It can be determined by ICP mass spectrometry.

The thickness of the insulating layer 22 (thickness after drying) is not particularly limited, and it is preferably 1 to 9 μm, more preferably 1 to 8 μm, from the viewpoint of further suppressing plating deposition in the central region E _I during the plating treatment. It is preferably 2 to 8 μm, and particularly preferably 3 to 8 μm.

Further, although not illustrated in FIG. 1, a resist pattern may be disposed on a region of the resin layer 14 where the lead wiring 20 is not disposed. As described below, when the lead wiring 20 is formed, a resist pattern is used as needed.

Further, although not illustrated in FIG. 1, the insulating protective film may be further disposed so as to cover a portion other than the other end of the lead wiring 20.

<Method of Manufacturing Conductive Laminate for Touch Panel Sensor>

The manufacturing method of the first embodiment of the conductive laminate for a touch panel sensor described above is not particularly limited, and an optimum step can be appropriately performed. From the viewpoint of easiness of production, it is preferable to have the following steps.

Step A: a step of forming a resin layer on a peripheral region on the substrate;

Step B: forming a detecting electrode on the substrate, one end portion of the detecting electrode extending onto the resin layer, so that the detecting electrode is in contact with the resin layer;

Step C: The steps of step C-1 and step C-2 are carried out in different order, in step C-1, a resist pattern is formed on the resin layer; in step C-2, in contact with the resin layer Forming an insulating layer in such a manner that one end of the detecting electrode is exposed;

Step D: a step of forming a lead wiring, applying a plating catalyst or a precursor thereof to a region where a resist pattern is not formed on the resin layer, and performing a plating treatment on the resin layer to which the plating catalyst or the precursor thereof is applied, A lead wiring electrically connected to one end portion of the detecting electrode is formed.

The above steps A to D will be described in detail below. In the following description, FIG. 3 is a cross-sectional view showing a method of manufacturing the conductive laminate 10 for a touch panel sensor shown in FIGS. 1 and 2 in order of steps.

[Step A]

Step A is a step of forming a resin layer having a functional group that interacts with the plating catalyst or its precursor on the peripheral region on the substrate. This step is shown by FIG. 3 (A), the peripheral region E _O on the substrate 12 resin layer 14 is disposed.

The method of forming the resin layer is not particularly limited, and a method of forming a composition for forming a resin layer containing a specific compound is preferably used. The resin layer-forming composition to be used is, for example, a resin layer-forming composition containing a functional group and a polymerizable group that interact with a plating catalyst or a precursor thereof. Such a composition is applied onto a substrate to form a coating film, and energy is applied to the coating film located on the peripheral region E _O shown in FIG. 1 to promote the reaction of the polymerizable group, to perform curing, and then to remove the energy. The area of the resin layer can be obtained in the peripheral area.

The manner in which the composition for forming a resin layer is used will be described in detail below. The material of the composition will be described in detail first, and the process of the step will be described in detail later.

(Resin layer forming composition (1))

The resin layer-forming composition contains a compound having an interactive group and a polymerizable group.

The definition of an interactive group is as described above.

The polymerizable group is a functional group capable of forming a chemical bond by energy, and examples thereof include a radical polymerizable group and a cationic polymerizable group. Among them, a radical polymerizable group is preferred from the viewpoint of further excellent reactivity. Examples of the radical polymerizable group include an acrylate group (acryloxy group), a methacrylate group (methacryloxy group), an itaconate group, a butenoate group, and a methacrylic acid. An unsaturated carboxylate group such as an ester group or a maleate group, a styryl group, a vinyl group, an acrylamide group, a methacrylamide group or the like. Among them, a methacryloxy group, a propylene methoxy group, a vinyl group, a styryl group, an acrylamide group, a methacrylamide group, and more preferably a methacryloxy group, a propylene oxy group, a styryl group are preferable. .

In the compound, the polymerizable group may contain two or more kinds. Further, the number of the polymerizable groups contained in the compound is not particularly limited, and may be one or two or more.

The above compound may be a low molecular compound or a high molecular compound. The low molecular compound means a compound having a molecular weight of less than 1,000, and the high molecular compound means a compound having a molecular weight of 1,000 or more.

It should be noted that the low molecular compound having the above polymerizable group corresponds to a so-called monomer. Further, the polymer compound may be a polymer having a specific repeating unit.

Further, as the compound, one type may be used alone or two or more types may be used in combination.

When the compound is a polymer, the weight average molecular weight of the polymer is not particularly limited, and from the viewpoint of more excellent handleability such as solubility, it is preferably 1,000 or more and 700,000 or less, and more preferably 2,000 or more and 200,000 or less. In particular, from the viewpoint of polymerization sensitivity, it is preferably 20,000 or more.

The synthesis method of such a polymer having a polymerizable group and an interactive group is not particularly limited, and a known synthesis method can be used (see paragraphs [0097] to [0125] of Japanese Patent Laid-Open Publication No. 2009-280905).

(Preferred mode 1 of polymer)

The first preferred embodiment of the polymer is a copolymer comprising a repeating unit having a polymerizable group represented by the following formula (a) (hereinafter also suitably a polymerizable group unit) and A repeating unit having an interactive group represented by the following formula (b) (hereinafter also referred to as an interactive group unit as appropriate).

[Chemical 1]

In the above formula (a) and formula (b), R ¹ to R ⁵ each independently represent a hydrogen atom or a substituted or unsubstituted alkyl group (e.g., methyl group, ethyl group, propyl group, butyl group, etc.). In addition, the kind of the substituent is not particularly limited, and examples thereof include a methoxy group, a chlorine atom, a bromine atom, and a fluorine atom.

Note that, as R ^1, preferably a hydrogen atom, a methyl group substituted with a bromine atom or a methyl group. As R ² , a hydrogen atom, a methyl group or a methyl group substituted with a bromine atom is preferred. As R ³ , a hydrogen atom is preferred. As R ⁴ , a hydrogen atom is preferred. R ⁵ is preferably a hydrogen atom, a methyl group or a methyl group substituted by a bromine atom.

In the above formula (a) and formula (b), X, Y and Z each independently represent a single bond or a substituted or unsubstituted divalent organic group. The divalent organic group may, for example, be a substituted or unsubstituted divalent aliphatic hydrocarbon group (preferably having 1 to 8 carbon atoms, for example, an alkylene group such as a methylene group, an ethylene group or a propylene group) or a substituent. or unsubstituted divalent aromatic hydrocarbon group (preferably having 6 to 12 carbon atoms, e.g. phenylene.), - O -, - S -, - SO 2 -, - N (R) - (R: alkyl group) , -CO-, -NH-, -COO-, -CONH-, or a combination thereof (for example, an alkyleneoxy group, an alkyleneoxycarbonyl group, an alkylenecarbonyloxy group, etc.) Wait.

X, Y, and Z are preferably a single bond, an ester group (-COO-), a guanamine group (-CONH-), or an ether group from the viewpoint of easy synthesis of a polymer and excellent adhesion of a lead wire. (-O-) or a substituted or unsubstituted divalent aromatic hydrocarbon group, more preferably a single bond, an ester group (-COO-) or a decylamino group (-CONH-).

In the above formula (a) and formula (b), L ¹ and L ² each independently represent a single bond or a substituted or unsubstituted divalent organic group. The definition of the divalent organic group is the same as the meaning of the divalent organic group described in the above X, Y and Z.

L ¹ is preferably an aliphatic hydrocarbon group or a divalent organic group having a urethane bond or a urea bond (for example, an aliphatic hydrocarbon group) from the viewpoint that the synthesis of the polymer is easy and the adhesion of the lead wiring is more excellent. Among them, the total number of carbon atoms is preferably from 1 to 9. Note that here, L is the total number ^of carbon atoms refers to the total number of carbon substituted or unsubstituted divalent organic group represented by L ¹ contained in the atoms.

In addition, L ² is preferably a single bond, a divalent aliphatic hydrocarbon group, a divalent aromatic hydrocarbon group, or a combination thereof, from the viewpoint that the adhesion of the lead wiring is more excellent. Among them, L ² is preferably a single bond or a total number of carbon atoms of from 1 to 15, and particularly preferably unsubstituted. Note that here, L ² is the total number of carbon atoms refers to the total number of carbon is a substituted or unsubstituted divalent organic group represented by the L ² contained in the atoms.

In the above formula (b), W represents an interactive group. The definition of an interactive group is as described above.

The content of the polymerizable group unit is preferably 5 to 50% by mole, more preferably the total repeating unit in the polymer, from the viewpoints of reactivity (curability, polymerizability) and inhibition of gelation at the time of synthesis. It is 5 to 40% by mole.

Further, the content of the above-mentioned interactive group unit is preferably from 5 to 95 mol%, more preferably from 10 to 10, based on the total of the repeating units in the polymer, from the viewpoint of the adsorptivity to the plating catalyst or its precursor. 95 mol%.

(Preferred mode 2 of polymer)

A second preferred embodiment of the polymer includes a copolymer comprising a repeating unit represented by the following formula (A), formula (B), and formula (C).

[Chemical 2]

The repeating unit represented by the formula (A) is the same as the repeating unit represented by the above formula (a), and the description of each group is also the same.

(B) repeating units represented by R ^5, X, and L ² represented by the above formula (b) and repeating units R ^5, X and L are the same as the formula ^2, each of the groups described is also the same.

Wa in the formula (B) represents a group which interacts with a plating catalyst or a precursor thereof other than the hydrophilic group represented by V described later or a precursor group thereof. Among them, a cyano group and an ether group are preferred.

In the formula (C), R ⁶ each independently represents a hydrogen atom or a substituted or unsubstituted alkyl group.

In the formula (C), U represents a single bond or a substituted or unsubstituted divalent organic group. The definition of the divalent organic group has the same meaning as the above-mentioned divalent organic group represented by X, Y and Z. U is preferably a single bond, an ester group (-COO-), a guanamine group (-CONH-), or an ether group (-O-) from the viewpoint that the synthesis of the polymer is easy and the adhesion of the lead wiring is more excellent. Or a substituted or unsubstituted divalent aromatic hydrocarbon group.

In formula (C), L ³ represents a single bond or a substituted or unsubstituted divalent organic group. The definition of the divalent organic group has the same meaning as the above-mentioned divalent organic group represented by L ¹ and L ² . As L ^3, from a synthetic polymer easy adhesion lead aspects more excellent in consideration of wiring, preferably a single bond or a divalent aliphatic hydrocarbon group, a divalent aromatic hydrocarbon group or a combination thereof.

In the formula (C), V represents a hydrophilic group or a precursor group thereof. The hydrophilic group is not particularly limited as long as it is a group which exhibits hydrophilicity, and examples thereof include a hydroxyl group and a carboxylic acid group. Further, the precursor group of the hydrophilic group means a group which can form a hydrophilic group by a specific treatment (for example, treatment with an acid or a base), and examples thereof include THP (2-tetrahydrogen). Pyranyl) protected carboxyl group and the like.

As the hydrophilic group, an ionic polar group is preferred from the viewpoint of interaction with the plating catalyst or its precursor. Specific examples of the ionic polar group include a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, and a boronic acid group. Among them, a carboxylic acid group is preferred from the viewpoint of moderate acidity (no decomposition of other functional groups).

The preferred content of each unit in the second preferred embodiment of the above polymer is as follows.

The content of the repeating unit represented by the formula (A) is preferably 5 to 50% by mole based on all the repeating units in the polymer from the viewpoints of reactivity (curability, polymerizability) and inhibition of gelation at the time of synthesis. More preferably, it is 5 to 30 mol%.

The content of the repeating unit represented by the formula (B) is preferably from 5 to 75 mol%, more preferably from 10 to 70, from the viewpoint of the adsorptivity against the plating catalyst or its precursor, with respect to all the repeating units in the polymer. Molar%.

The content of the repeating unit represented by the formula (C) is preferably from 10 to 70% by mole, more preferably from 20 to 30%, based on all of the repeating units in the polymer, from the viewpoint of the developability of the aqueous solution and the wet adhesion resistance. 60 mol%, more preferably 30-50 mol%.

Specific examples of the above-mentioned polymer include the polymers described in paragraphs [0106] to [0112] of JP-A-2009-007540, and paragraphs [0065] to [00] of JP-A-2006-135271. The polymer described in 0070], the polymer described in paragraphs [0030] to [0108] of US2010-080964.

The polymer can be produced by a known method (for example, the method in the literature cited above).

(Preferred mode of monomer)

When the above compound is a so-called monomer, one of the preferable embodiments is a compound represented by the formula (X).

[Chemical 3]

In the formula (X), R ¹¹ to R ¹³ each independently represent a hydrogen atom or a substituted or unsubstituted alkyl group. The unsubstituted alkyl group may, for example, be a methyl group, an ethyl group, a propyl group or a butyl group. Further, examples of the substituted alkyl group include a methyl group, an ethyl group, a propyl group and a butyl group substituted with a methoxy group, a chlorine atom, a bromine atom or a fluorine atom. It should be noted that, as R ^11, is preferably a hydrogen atom or a methyl group. As R ¹² , a hydrogen atom is preferred. As R ¹³ , a hydrogen atom is preferred.

L ¹⁰ represents a single bond or a divalent organic group. The divalent organic group may, for example, be a substituted or unsubstituted aliphatic hydrocarbon group (preferably having 1 to 8 carbon atoms), a substituted or unsubstituted aromatic hydrocarbon group (preferably having 6 to 12 carbon atoms), or -O. -, -S-, -SO ₂ -, -N(R)-(R:alkyl), -CO-, -NH-, -COO-, -CONH-, or a combination of them ( For example, an alkyleneoxy group, an alkyleneoxycarbonyl group, an alkylenecarbonylcarbonyl group, etc.).

The substituted or unsubstituted aliphatic hydrocarbon group is preferably a group obtained by substituting a methylene group, an ethylene group, a propylene group or a butylene group, or a group having a methoxy group, a chlorine atom, a bromine atom or a fluorine atom.

The substituted or unsubstituted aromatic hydrocarbon group is preferably an unsubstituted phenylene group or a phenylene group obtained by substitution with a methoxy group, a chlorine atom, a bromine atom or a fluorine atom.

In the formula (X), as one of preferable embodiments of L ¹⁰ , a -NH-aliphatic hydrocarbon group or a -CO-aliphatic hydrocarbon group- may be mentioned.

The definition of W is the same as the definition of W in the formula (b), and represents an interactive group. The definition of an interactive group is as described above.

In the formula (X), as a preferable aspect of W, an ionic polar group is mentioned, and a carboxylic acid group is more preferable.

When the above compound is a so-called monomer, one of the other preferred embodiments may be a compound represented by the formula (1).

[Chemical 4] (Formula 1)

In the formula (1), R ¹⁰ represents a hydrogen atom, a metal cation or a quaternary ammonium cation. Examples of the metal cation include an alkali metal cation (sodium ion, calcium ion), copper ion, palladium ion, silver ion, and the like. In addition, as a metal cation, a monovalent or divalent metal cation is mainly used, and when a divalent metal cation (for example, palladium ion) is used, n which will be described later represents 2.

Examples of the quaternary ammonium cation include a tetramethylammonium ion and a tetrabutylammonium ion.

Among them, a hydrogen atom is preferred from the viewpoint of adhesion of the plating catalyst or its precursor and metal residue after patterning.

The definition of L ¹⁰ in the formula (1) is the same as the definition of L ¹⁰ in the above formula (X), and represents a single bond or a divalent organic group. The definition of the divalent organic group is as described above.

As defined in the definition of the formula R (1) is ¹¹ ~ R ¹³ of the above-described formula (X) R ¹¹ ~ R ¹³ have the same meaning, represents a hydrogen atom or a substituted or unsubstituted alkyl. It should be noted that preferred embodiments of R ¹¹ to R ¹³ are as described above.

n represents an integer of 1 or 2. Among them, n is preferably 1 from the viewpoint of availability of the compound.

A preferred embodiment of the compound represented by the formula (1) is a compound represented by the formula (2).

[Chemical 5] (Formula 2)

In the formula (2), R ¹⁰ , R ¹¹ and n are the same as defined above.

L ¹¹ represents an ester group (-COO-), a guanamine group (-CONH-) or a phenylene group. However, when L ¹¹ is a guanamine group, solvent resistance (for example, alkali solvent resistance) is improved.

L ¹² represents a single bond or a divalent aliphatic hydrocarbon group (preferably having 1 to 8 carbon atoms, more preferably 3 to 5 carbon atoms) or a divalent aromatic hydrocarbon group. The aliphatic hydrocarbon group may be linear, branched or cyclic. In the case where L ¹² is a single bond, L ¹¹ represents a phenylene group.

The molecular weight of the compound represented by the formula (1) is not particularly limited, and is preferably from 100 to 1,000, more preferably from 100 to 300, from the viewpoints of volatility, solubility in a solvent, film formability, and handleability.

The content of the above compound in the resin layer-forming composition is not particularly limited, and is preferably 2 to 50% by mass, and more preferably 5 to 30% by mass based on the total amount of the composition. When it is in the above range, the handleability of the composition is excellent, and the layer thickness of the resin layer can be easily controlled.

The resin layer-forming composition preferably contains a solvent from the viewpoint of handleability.

The solvent to be used is not particularly limited, and examples thereof include water; alcohol solvents such as methanol, ethanol, propanol, ethylene glycol, 1-methoxy-2-propanol, glycerin, and propylene glycol monomethyl ether; and acetic acid, and the like. Acid; ketone solvent such as acetone, methyl ethyl ketone or cyclohexanone; guanamine solvent such as formamide, dimethylacetamide or N-methylpyrrolidone; nitrile solvent such as acetonitrile or propionitrile; An ester solvent such as methyl ester or ethyl acetate; a carbonate solvent such as dimethyl carbonate or diethyl carbonate; and an ether solvent, a glycol solvent, an amine solvent, a thiol solvent, and a halogen solvent. Wait.

Among them, an alcohol solvent, a guanamine solvent, a ketone solvent, a nitrile solvent, and a carbonate solvent are preferable.

The content of the solvent in the resin layer-forming composition is not particularly limited, and is preferably 50 to 98% by mass, and more preferably 70 to 95% by mass based on the total amount of the composition. When it is in the above range, the handleability of the composition is excellent, and the layer thickness of the resin layer or the like is easily controlled.

A polymerization initiator may be contained in the resin layer-forming composition. By containing a polymerization initiator, the bond between the compounds and the compound and the substrate is further formed, and as a result, the lead wires having more excellent adhesion can be obtained.

The polymerization initiator to be used is not particularly limited, and for example, a thermal polymerization initiator, a photopolymerization initiator, or the like can be used. Examples of the photopolymerization initiator include benzophenones, acetophenones, α-aminoalkylphenones, benzoin, ketones, thioxanthones, benzophenes, and benzyl. A ketal, an oxime ester, an anthrone, a tetramethyl thiuram monosulfide, a bis-decylphosphine oxide, a fluorenylphosphine oxide, an anthracene, an azo compound, and the like.

Further, examples of the thermal polymerization initiator include a diazo compound or a peroxide compound.

When the polymerization initiator is contained in the resin layer-forming composition, the content of the polymerization initiator is preferably 0.01 to 1% by mass, and more preferably 0.1 to 0.5% by mass based on the total amount of the composition. When the content is within the above range, the handleability of the composition is excellent, and the adhesion of the obtained lead wiring is further improved.

A monomer (which does not include the compound represented by the above formula (X) or formula (1)) may be contained in the resin layer-forming composition. By containing a monomer, the crosslinking density and the like in the resin layer can be appropriately controlled.

The monomer to be used is not particularly limited, and examples of the compound having an addition polymerizable property include a compound having an ethylenically unsaturated bond, and examples of the compound having a ring-opening polymerizable property include a compound having an epoxy group. . Among them, a polyfunctional monomer is preferably used from the viewpoint of increasing the crosslinking density in the resin layer and further improving the adhesion of the lead wiring. The polyfunctional monomer means a monomer having two or more polymerizable groups. Specifically, a monomer having 2 to 6 polymerizable groups is preferably used.

The molecular weight of the polyfunctional monomer to be used is preferably from 150 to 1,000, and more preferably from 200 to 700, from the viewpoint of the mobility of the molecule in the crosslinking reaction which affects the reactivity. Further, the interval (distance) between the plurality of polymerizable groups present is preferably from 1 to 15 in terms of the number of atoms, and more preferably from 6 to 10.

Other additives (for example, a sensitizer, a curing agent, a polymerization inhibitor, an antioxidant, an antistatic agent, an ultraviolet absorber, a filler, a granule, a flame retardant, a surfactant, etc.) may be added to the resin layer-forming composition as needed. Lubricants, plasticizers, etc.).

Further, when the colorant is contained in the resin layer, the coloring agent may be further contained in the resin layer-forming composition.

(Resin layer forming composition (Part 2))

The resin layer-forming composition (No. 1) contains a compound having an interactive group and a polymerizable group, but is not limited thereto. For example, a compound having an interactive group and a compound may be used. A composition for forming a resin layer of the two compounds having a polymerizable group.

The compound having an interactive group is a compound having an interactive group but no polymerizable group. The definition of an interactive group is as described above. Such a compound may be a low molecular compound or a polymer compound. A preferred embodiment of the compound having an interactive group is a polymer having a repeating unit represented by the above formula (b).

The compound having a polymerizable group is a so-called monomer, and a polyfunctional monomer having two or more polymerizable groups is preferable from the viewpoint that the hardness of the formed resin layer is more excellent. As the polyfunctional monomer, a known monomer can be used.

(Process of step A)

In the step A, the resin layer-forming composition is first placed on the substrate, and the method of forming the resin layer-forming composition by contacting the resin layer-forming composition on the substrate is exemplified. Methods. As such a method, for example, a method (coating method) of applying the above-described composition for forming a resin layer on a substrate is exemplified.

In the case of the coating method, the method of applying the composition for forming a resin layer on the substrate is not particularly limited, and a known method (for example, spin coating, die coating, dip coating, or the like) can be used.

From the viewpoint of handleability and production efficiency, a composition for forming a resin layer is applied onto a substrate, and if necessary, a residual solvent is removed to form a coating film.

In addition, the conditions of the drying treatment are not particularly limited, and from the viewpoint of further excellent productivity, it is preferably carried out at room temperature to 220 ° C (preferably 50 to 120 ° C) for 1 to 30 minutes (preferably 1 to 10 minutes).

The method of applying energy to the coating film (composition layer) on the substrate in a pattern is not particularly limited. For example, heat treatment, exposure treatment (light irradiation treatment), or the like is preferably used, and from the viewpoint of completion of the treatment in a short time, exposure treatment is preferred. By imparting energy to the coating film, the polymerizable group in the compound is activated to cause crosslinking between the compounds, and the layer is cured.

In the exposure processing, light irradiation based on a UV (ultraviolet light) lamp, visible light, or the like is used. Examples of the light source include a mercury lamp, a metal halide lamp, a xenon lamp, a chemical lamp, a carbon arc lamp, and the like. As the radiation, there are electron rays, X rays, ion beams, far infrared rays, and the like. As a specific aspect, high-intensity scintillation exposure such as scanning exposure by infrared laser or xenon discharge lamp, exposure by infrared light, or the like can be suitably mentioned.

The exposure time varies depending on the reactivity of the compound and the light source, and is usually between 10 seconds and 5 hours. The exposure energy may be in the range of 10 to 8000 mJ, and is preferably in the range of 50 to 3000 mJ.

In addition, the method of performing the above-described exposure treatment in a pattern is not particularly limited, and a known method may be employed. For example, the coating film may be irradiated with light for exposure through a mask.

Further, when heat treatment is used as the energy imparting, a blast dryer, an oven, an infrared dryer, a heating drum, or the like can be used.

Next, the portion of the coating film where the energy is not applied is removed to form a resin layer.

The above removal method is not particularly limited, and an optimum method is appropriately selected depending on the compound to be used. For example, a method of using an alkaline solution (preferably pH: 13.0 to 13.8) as a developing solution can be mentioned. In the case where the energy-imparting region is removed by using an alkaline solution, a method of immersing a substrate having a coating film to which energy is applied in a solution, a method of applying a developing solution on the substrate, and the like, and preferably immersing may be mentioned. method. In the case of the method of immersing, it is preferable that the immersion time is about 1 minute to 30 minutes from the viewpoints of productivity, workability, and the like.

Further, as another method, a method in which a solvent which dissolves the above compound is used as a developing solution and is immersed therein may be mentioned.

In the above description, the method of directly forming the resin layer on the substrate has been described, but other methods such as a transfer method may be employed. Further, the transfer method is a method in which a resin layer is formed on a dummy support and the formed resin layer is transferred onto a substrate.

[Step B]

Step B is a step of forming a detecting electrode on the substrate, and one end portion of the detecting electrode extends onto the resin layer such that the detecting electrode is in contact with the resin layer. More specifically, by performing this step, as shown in FIG. 3(B), the first detecting electrode 16 and the second detecting electrode 18 are disposed on the substrate 12. In addition, as shown in FIG. 3(B), one end portion of the detecting electrodes (the first detecting electrode 16 and the second detecting electrode 18) extends over the resin layer 14.

The method for producing the detecting electrode is not particularly limited, and a known method is employed. For example, when an ITO layer is used as the detecting electrode, it is preferably formed by a sputtering method or a vapor deposition method. Further, when forming a detection electrode of a specific shape, a mask is suitably used.

[Step C]

Step C is a step of performing step C-1 and step C-2 in different order, in step C-1, forming a resist pattern on the resin layer; in step C-2, forming an insulating layer, the insulating layer The layer covers the detecting electrode so that one end portion of the detecting electrode that is in contact with the resin layer is exposed. More specifically, by performing this step, as shown in FIG. 3(C), the insulating layer 22 covering the detecting electrodes is disposed. Note that, in FIG. 3(C), although not illustrated, the resist pattern is disposed in a region on the resin layer 14 on which the lead wiring 20 is not formed in FIG.

In step C, step C-1 and step C-2 may be performed in different order. Specifically, step C-2 may be implemented after step C-1 is implemented, or may be implemented after step C-2 is implemented. Step C-1.

Step C-1 is a step of forming a resist pattern on the resin layer. More specifically, this step is a step of forming a resist pattern on a specific region on the resin layer which is not required to be deposited by plating in the plating treatment to be described later.

The method of forming the resist pattern on the resin layer is not particularly limited, and a known method is used. From the viewpoint of more excellent precision of the resist pattern, a method of forming a resist pattern using a photosensitive resist is preferable.

The photosensitive resist which can be used in this step is, for example, a photocurable negative resist or a photo-dissolving positive resist which is dissolved by exposure. As the photosensitive resist, for example, a photosensitive dry film resist (DFR), a liquid resist, or a 3.ED (electrodeposition) resist can be used.

As a method of forming the resist pattern, a film (photosensitive resist film) formed of a photosensitive resist may be disposed on the resin layer, and the photosensitive resist film may be subjected to pattern exposure and further development to form a resist pattern. Resist pattern.

Step C-2 is a step of forming an insulating layer that covers the detecting electrode so that one end portion of the detecting electrode that is in contact with the resin layer is exposed.

The method of forming the insulating layer is not particularly limited, and an optimum method is selected depending on the materials used.

For example, when a photosensitive insulating resin (for example, an epoxy resin) or the like is used, a composition containing a photosensitive insulating resin is applied onto a substrate, and a specific region is exposed and cured, and then the unexposed portion is removed. Method, etc.

Further, when a metal oxide or the like is used, a method in which a specific mask is disposed and a metal oxide layer is deposited at a specific position by sputtering or vapor deposition may be mentioned.

[Step D]

Step D is a step of forming a lead wiring in which a plating catalyst or a precursor thereof is applied to a region on the resin layer where no resist pattern is formed, and a resin layer to which a plating catalyst or a precursor thereof is imparted is applied. The plating treatment is performed to form a lead wiring electrically connected to one end portion of the detecting electrode. More specifically, by performing this step, as shown in FIG. 3(D), the lead wiring 20 electrically connected to the one end portion 18A of the second detecting electrode 18 can be formed. It should be noted that although not illustrated, one end portion of the first detecting electrode is also electrically connected to the lead wiring.

In the following, the step of applying a plating catalyst or a precursor thereof to the resin layer (step D-1), and the step of performing a plating treatment on the resin layer to which the plating catalyst or the precursor is applied (step D-2) are carried out. Description.

(Step D-1: Plating catalyst application step)

In this step, first, a plating catalyst or a precursor thereof is applied to a region of the resin layer where no resist pattern is formed. The interactive group contained in the resin layer adheres (adsorbs) the applied plating catalyst or its precursor according to its function. More specifically, a plating catalyst or a precursor thereof is imparted to the resin layer and on the surface of the resin layer.

The plating catalyst or its precursor functions as a catalyst or electrode for the plating treatment. Therefore, the type of the plating catalyst to be used or its precursor is determined as appropriate depending on the type of the plating treatment.

It is to be noted that the plating catalyst to be used or a precursor thereof is preferably an electroless plating catalyst or a precursor thereof. Hereinafter, the electroless plating catalyst or its precursor and the like will be mainly described in detail.

Regarding the electroless plating catalyst used in the present step, any electroless plating catalyst can be used as long as it can be an active core during electroless plating, and specifically, an autocatalytic reduction reaction can be mentioned. A metal of catalytic ability (known as a metal which can be subjected to electroless plating with a tendency to ionize is lower than Ni). Specifically, Pd, Ag, Cu, Ni, Pt, Au, Co, etc. are mentioned. Among them, Ag, Pd, Pt, and Cu are particularly preferable from the viewpoint of the height of the catalytic ability.

As the electroless plating catalyst, a metal colloid can be used.

The electroless plating catalyst precursor used in this step can be used without particular limitation as long as it can be converted into an electroless plating catalyst by a chemical reaction. Metal ions of the metal exemplified as the above electroless plating catalyst are mainly used. The metal ions as the electroless plating catalyst precursor are converted into a zero-valent metal as an electroless plating catalyst by a reduction reaction. After the metal ions as the electroless plating catalyst precursor are supplied to the resin layer, they can be changed into a zero-valent metal by another reduction reaction to be an electroless plating catalyst before being immersed in the electroless plating bath. Further, the state in which the electroless plating catalyst precursor is maintained may be immersed in the electroless plating bath, or may be changed to a metal (electroless plating catalyst) by the reducing agent in the electroless plating bath.

The metal ion as the electroless plating catalyst precursor is preferably applied to the resin layer using a metal salt. The metal salt to be used is not particularly limited as long as it is dissolved in a suitable solvent to be dissociated into a metal ion and a base (anion), and examples thereof include M(NO ₃ ) _n , MCl _n , and M _2/n (SO). ₄ ), M _3/n (PO ₄ ) (M represents an n-valent metal atom), and the like. As the metal ion, a metal ion obtained by dissociation of the above metal salt can be suitably used. For example, Ag ions, Cu ions, Ni ions, Co ions, Pt ions, and Pd ions can be mentioned. Among them, metal ions which are multidentate ligands are preferable, and Ag ions, Pd ions, and Cu ions are particularly preferable from the viewpoint of the number of kinds of functional groups capable of coordination and catalytic ability.

In this step, a zero-valent metal may be used as the catalyst used for direct plating without electroless plating.

As a method of imparting a plating catalyst or a precursor thereof to the resin layer, for example, a solution (plating catalyst liquid) obtained by dispersing or dissolving a plating catalyst or a precursor thereof in a suitable solvent can be prepared, and the solution can be coated. The substrate on which the resin layer is formed may be immersed in the resin layer or immersed in the solution.

As the above solvent, water or an organic solvent is used as appropriate. As the organic solvent, a solvent which can be impregnated into the resin layer is preferable, and for example, acetone, ethyl acetate, ethyl acetate, ethylene glycol diacetate, cyclohexanone, ethyl acetonide, acetophenone can be used. , 2-(1-cyclohexenyl)cyclohexanone, propylene glycol diacetate, triacetin, diethylene glycol diacetate, dioxane, N-methylpyrrolidone, dimethyl carbonate , dimethyl cellosolve, etc.

The pH of the catalyst-imparting liquid containing the plating catalyst or its precursor and the solvent is not particularly limited, and the pH is preferably 3.0 to 3.0 from the viewpoint of forming a desired amount of the metal layer at a desired position during the plating treatment described later. 7.0 is more preferably 3.2 to 6.8, still more preferably 3.5 to 6.6.

The preparation method of the catalyst-imparting liquid is not particularly limited, and a specific metal salt is dissolved in a suitable solvent, and the pH is adjusted to a specific range using an acid or a base as needed.

The concentration of the plating catalyst or the precursor thereof in the solution is not particularly limited, but is preferably 0.001 to 50% by mass, and more preferably 0.005 to 30% by mass.

Further, the contact time is preferably from about 30 seconds to about 24 hours, more preferably from about 1 minute to about 1 hour.

The amount of adsorption of the plating catalyst of the resin layer or the precursor thereof differs depending on the plating bath to be used, the type of catalyst metal, the type of interactive group of the resin layer, the method of use, and the like, and the precipitation property from plating. In view of the above, it is preferably 5 to 1000 mg/m ² , more preferably 10 to 800 mg/m ² , and particularly preferably 20 to 600 mg/m ² .

(Step D-2: Plating Process Step)

Next, the resin layer to which the plating catalyst or its precursor is applied is subjected to a plating treatment. By performing the plating treatment, the lead wiring made of the plated metal layer is formed in the region of the resin layer where the resist pattern is not disposed.

The method of the plating treatment is not particularly limited, and examples thereof include an electroless plating treatment or an electrolytic plating treatment (electroplating treatment). In this step, the electroless plating treatment may be separately performed, or the electrolytic plating treatment may be further performed after the electroless plating treatment is performed.

In addition, in this specification, a silver mirror reaction is contained as one type of said electroless-plating process. Therefore, the adhered metal ions can be reduced by, for example, a silver mirror reaction or the like to form a desired patterned metal layer, and then electrolytic plating treatment can be performed thereafter.

The process of the electroless plating treatment and the electrolytic plating treatment will be described in detail below.

The electroless plating treatment refers to an operation of depositing a metal by a chemical reaction using a solution in which metal ions precipitated in a form desirably plated are dissolved.

The electroless plating in this step is preferably performed, for example, by washing a substrate having a resin layer to which an electroless plating catalyst is applied, removing excess electroless plating catalyst (metal), and then immersing in electroless plating. In the bath, electroless plating is thereby performed. As the electroless plating bath to be used, a known electroless plating bath can be used.

In the case where the substrate provided with the resin layer to which the electroless plating catalyst precursor is applied is immersed in the electroless plating bath in a state where the electroless plating catalyst precursor is adsorbed or infiltrated into the resin layer, it is preferred. The substrate is washed with water to remove excess electroless plating catalyst precursor (metal salt or the like), and then immersed in an electroless plating bath. In this case, the electroless plating catalyst precursor is reduced and the subsequent electroless plating is performed in an electroless plating bath. As the electroless plating bath used herein, a known electroless plating bath may be used in the same manner as described above.

In addition, in the reduction of the electroless plating catalyst precursor, a catalyst activating solution (reducing liquid) may be separately prepared in addition to the above-described method using the electroless plating solution, as before the electroless plating. Other steps to proceed.

Further, the plating bath is not only in contact with the resin layer to which the electroless plating catalyst is applied but also in contact with the detecting electrode, whereby plating is deposited by the detecting electrode. Therefore, deposition of plating is also performed on the detection electrode portion of 2 μm or more from the resin layer, and the lead wiring which ensures electrical conduction with the detection electrode can be formed. The length of plating generated on the detecting electrode from the resin layer is preferably 3 μm or more, more preferably 10 μm or more, and most preferably 1000 μm or more.

As a composition of a general electroless plating bath, in addition to a solvent (for example, water), it mainly includes: 1. metal ions for plating, 2. a reducing agent, and an additive for improving the stability of metal ions (stabilizer). ). In addition to these components, the plating bath may contain a known additive such as a stabilizer of a plating bath.

As the organic solvent used in the electroless plating bath, a solvent soluble in water is necessary. From this point of view, it is preferred to use a ketone such as acetone or an alcohol such as methanol, ethanol or isopropyl alcohol. Copper, tin, lead, nickel, gold, silver, palladium, and rhodium are known as the type of the metal to be used in the electroless plating bath. Among them, copper, silver, and gold are preferable from the viewpoint of conductivity. copper. Further, an optimum reducing agent or additive is selected based on the above metal.

The immersion time in the electroless plating bath is preferably from about 1 minute to about 6 hours, more preferably from about 1 minute to 3 hours, and most preferably from 1 to 10 minutes.

In this step, when the plating catalyst or the precursor thereof to be applied to the resin layer has a function as an electrode, the resin layer to which the catalyst or its precursor is applied may be plated.

It should be noted that, as described above, in this step, electrolytic plating treatment may be performed as needed after the electroless plating treatment. In this manner, the thickness of the formed lead wires can be appropriately adjusted.

As a method of electroplating, a conventionally known method can be used. In addition, copper, chromium, lead, nickel, gold, silver, tin, zinc, etc. are mentioned as a metal used for electroplating, and copper, gold, and silver are preferable from a viewpoint of electroconductive, and copper is more preferable.

After the above step D, the treatment for removing the resist pattern may be performed as needed.

In the above-described embodiment, the embodiment of the step C-2 of forming the insulating layer has been described, but the plating catalyst or its precursor is provided only in a specific portion of the resin layer, and only the resin is provided. The portion of the layer is subjected to a plating treatment, whereby the conductive laminate for the touch panel sensor can be obtained without performing the above step C-2.

The above-described conductive laminate 10 for a touch panel sensor can be suitably applied to a touch panel sensor. The above-described touch panel sensor can be suitably applied to a touch panel (particularly, a capacitive touch panel) in combination with a display device or the like.

<<2th embodiment>>

FIG. 4 is a plan view showing a second embodiment of the conductive laminate for a touch panel sensor of the present invention. Fig. 5 is a cross-sectional view taken along the cutting line B-B.

The conductive laminate 100 for a touch panel sensor shown in FIG. 4 includes a substrate 12 and a laminated resin composed of a lower resin layer 30 and an upper resin layer 32 disposed in a peripheral region E _O of the substrate 12 . The layer 34 and the two or more first detecting electrodes 16 and the second detecting electrodes 18 disposed on the central region E _I surrounded by the peripheral region E _O on the substrate 12 and the first and second stacked electrodes 18 disposed on the laminated resin layer 34 The two or more lead wires 20 electrically connected to the detecting electrode 16 and the second detecting electrode 18 and the insulating layer 22 disposed in the central region E _{I so} as to cover the first detecting electrode 16 and the second detecting electrode 18 are provided.

The conductive laminate 100 for a touch panel sensor shown in FIG. 4 has the same function as the conductive laminate 10 for a touch panel sensor shown in FIG. 1 except for the laminated resin layer 34. The same constituent elements are denoted by the same reference numerals, and the description thereof will be omitted. The laminated resin layer 34 will be mainly described below.

Further, as shown in FIG. 5, the one end portion 18A of the second detecting electrode 18 extends to the upper resin layer 32, and the one end portion 18A is in contact with the upper resin layer 32. In addition, in the first detecting electrode, one end portion thereof also extends to the upper resin layer.

The laminated resin layer 34 is a laminated resin layer including the lower resin layer 30 and the upper resin layer 32, the lower resin layer 30 contains a colorant, and the upper resin layer 32 is disposed on the lower resin layer 30, and is plated. A functional group (interactive group) in which the catalyst or its precursor interacts. In the laminated resin layer 34, the lower resin layer functions as a so-called decorative layer, and the upper resin layer functions as a so-called plated layer. By using such a laminated resin layer 34, the effect of the decorative layer and the layer to be plated can be separated, and the selection range of the materials used for the two layers is expanded.

The type of the coloring agent contained in the lower resin layer 30 is not particularly limited, and examples thereof include the coloring agent contained in the resin layer 14 described above.

In addition, the resin is contained in the lower resin layer 30, and the kind thereof is not particularly limited, and the resin contained in the resin layer 14 can be mentioned.

In addition, an interactive group may be contained in the lower resin layer 30.

The thickness of the lower resin layer 30 is not particularly limited, and is preferably 0.5 to 70 μm, and more preferably 1 to 40 μm from the viewpoint of more excellent functions as a decorative layer and a balance of thickness reduction.

The upper resin layer 32 is a layer disposed on the lower resin layer 30 and contains an interactive group. The definition of an interactive group is as described above.

The resin is contained in the upper resin layer 32, but the type thereof is not particularly limited, and the resin contained in the resin layer 14 can be mentioned.

It is preferable that the upper resin layer 32 does not substantially contain a coloring agent. The content of the coloring agent is not particularly limited to 10% by mass or less based on the total mass of the upper resin layer 32, and the content is preferably 5% by mass or less, and more preferably 0% by mass.

The thickness of the upper resin layer 32 is not particularly limited, and is preferably 0.01 to 10 μm, more preferably 0.2 to 5 μm, still more preferably 0.25, from the viewpoint of further excellent function as a layer to be plated and balance of thickness reduction. ~1.0μm.

The method for manufacturing the conductive laminate 100 for a touch panel sensor is not particularly limited, and the following steps A-1 and A-2 are performed as the conductive laminate 10 for the touch panel sensor. In the method of the step A in the production method, in the step A-1, the lower resin layer is formed on the peripheral region on the substrate; and in the step A-2, the upper resin layer is formed on the lower resin layer.

The method of forming the lower resin layer is not particularly limited, and depending on the type of the resin to be used, a method of using a composition for forming a lower resin layer containing a colorant and a resin may be mentioned. More specifically, a method of applying a composition for forming a lower resin layer on a substrate and then removing a coating film of a composition other than the peripheral region may be mentioned. In the case where a photosensitive resin is used as the resin, the lower resin layer may be formed by coating the composition on the substrate to form a coating film, and then pattern-applying the coating film on the peripheral region on the substrate. The unexposed portion is removed by a development process, thereby forming a desired lower side resin layer.

The method of forming the upper resin layer is not particularly limited, and the process carried out in the step B is employed as appropriate, and the step B is a step of forming the resin layer in the conductive laminate 10 for the touch panel sensor.

<<3rd embodiment>>

Fig. 6 is a plan view showing a third embodiment of the conductive laminate for a touch panel sensor of the present invention. Fig. 7 is a cross-sectional view taken along the cutting line C-C.

The conductive laminate 200 for a touch panel sensor shown in FIG. 6 includes a substrate 12, a lower resin layer 30 of a peripheral region E _O disposed on the substrate 12, and an upper portion of a portion disposed on the lower resin layer 30. The resin layer 132 and the two or more first detecting electrodes 16 and the second detecting electrodes 18 disposed on the central region E _I surrounded by the peripheral region E _O on the substrate 12 are disposed on the upper resin layer 32 and the first The two or more lead wires 20 electrically connected to the detecting electrode 16 and the second detecting electrode 18 and the insulating layer 22 disposed in the central region E _{I so} as to cover the first detecting electrode 16 and the second detecting electrode 18 are provided.

The conductive laminate 200 for a touch panel sensor shown in FIG. 6 has the same configuration as the conductive laminate 100 for a touch panel sensor shown in FIG. 2 except that the upper resin layer 132 is mainly used. Therefore, the same components are denoted by the same reference numerals, and the description thereof will be omitted. The arrangement positions of the respective layers will be mainly described below.

In the conductive laminate 100 for a touch panel sensor shown in FIG. 4, a part of the upper resin layer is located between the lower resin layer and the detecting electrode (the first detecting electrode or the second detecting electrode); In the conductive laminate 200 for a touch panel sensor shown in FIG. 6, the upper resin layer is disposed on the lower resin layer so as to be in contact with the detecting electrode. In other words, as shown in FIG. 7, the one end portion 18A of the second detecting electrode 18 extends to the lower resin layer 30, and the one end portion 18A of the lower resin layer 30 is in contact with the upper resin layer 132 and the lead wiring 20. The same configuration is also applied to the first detecting electrode.

Regarding the arrangement position of the upper resin layer 132, more specifically, as shown in FIG. 6, the upper resin layer 132 is located only between the lower resin layer 30 and the lead wiring 20. In other words, the upper resin layer 132 is arranged in the same pattern as the lead wiring 20, and the lead wiring 20 is located only on the upper resin layer 132. In other words, in the present embodiment, the upper resin layer is arranged in a pattern.

In this embodiment, the arrangement position of the upper resin layer 132 is not limited to the embodiment of FIGS. 6 and 7, as long as the upper resin layer is in contact with one end portion of the detecting electrode on the lower resin layer, for example, the upper resin. The layer may also be disposed on a region other than the region where the detecting electrode on the lower resin layer is located.

The method for producing the conductive laminate 200 for a touch panel sensor is not particularly limited, and it is preferable to have the following steps from the viewpoint of easiness of production.

Step E: a step of forming a lower resin layer containing a colorant in a peripheral region on the substrate;

Step F: forming a detecting electrode on the substrate, the detecting electrode extending from one end to the lower resin layer;

Step G: The steps of Step G-1 and Step G-2 are carried out in different order, and in Step G-1, an upper resin layer having a functional group that interacts with the plating catalyst or its precursor is formed, the upper resin layer Arranged on a portion of the lower resin layer, and the upper resin layer is in contact with the detecting electrode; in step G-2, an insulating layer is formed which does not substantially contain a functional group that interacts with the plating catalyst or its precursor, the insulating layer Covering the detecting electrode in such a manner that one end portion of the detecting electrode that is in contact with the upper resin layer is exposed;

Step H: a step of forming a lead wiring electrically connected to one end portion of the detecting electrode by the following method, the method having at least the step of: applying a plating catalyst or a precursor thereof to the upper resin layer, and imparting a plating catalyst to the plating catalyst The upper resin layer of the precursor or the precursor thereof is subjected to a plating treatment.

The above steps E to H will be described in detail below.

[Step E]

Step E is a step of forming a lower resin layer containing a colorant in a peripheral region on the substrate. This step can be carried out by the same procedure as the above-described step A-1.

[Step F]

Step F is a step of forming a detecting electrode on the substrate, and one end portion of the detecting electrode extends to the lower resin layer. This step can be carried out by the same procedure as step B described above.

[Step G]

Step G is a step of performing steps G-1 and G-2 in a stepwise manner, and in step G-1, forming an upper resin layer having a functional group that interacts with a plating catalyst or a precursor thereof, the upper resin layer Arranged on a portion of the lower resin layer, and the upper resin layer is in contact with the detecting electrode; in step G-2, an insulating layer is formed which does not substantially contain a functional group that interacts with the plating catalyst or its precursor, the insulating layer The detecting electrode is covered so that one end portion of the detecting electrode that is in contact with the upper resin layer is exposed.

In step G, step G-1 and step G-2 may be implemented in different order. Specifically, step G-2 may be implemented after step G-1 is implemented, or may be implemented after step G-2 is implemented. Step G-1.

Step G-1 is a step of forming an upper side resin layer having a functional group that interacts with a plating catalyst or a precursor thereof, the upper side resin layer being disposed on a portion of the lower side resin layer, and the upper side resin layer being in contact with the detecting electrode. The process of this step is preferably carried out in the step A performed in the step of forming the resin layer in the conductive laminate 10 for the touch panel sensor described above, and the upper resin layer is disposed only on a specific region on the lower resin layer. In addition, when the upper resin layer is disposed only in a specific region, the energy-imparting region may be adjusted as appropriate.

Step G-2 is a step of forming an insulating layer that does not substantially contain a functional group that interacts with the plating catalyst or its precursor, and the insulating layer covers the detecting electrode so that one end portion of the detecting electrode that is in contact with the upper resin layer is exposed. The process of this step employs the process carried out in the step C-2 of forming the insulating layer in the conductive laminate 10 for a touch panel sensor as described above.

[Step H]

Step H is a step of forming a lead wiring electrically connected to one end portion of the detecting electrode by the following method, the method having at least the step of: applying a plating catalyst or a precursor thereof to the upper resin layer, and applying a plating catalyst to the plating catalyst The upper resin layer of the precursor or the precursor thereof is subjected to a plating treatment.

As shown in FIG. 6, in the case where the upper resin layer is located only in the region where the lead wiring is disposed, in this step, the desired lead wiring can be formed by performing step D, and the step D forms the touch panel feeling described above. The lead wires in the conductive laminate 10 for the detector are used.

In addition, in step H, if necessary, the metal layer formed on the upper resin layer by the plating treatment may be further etched in a pattern to form lead wires.

As a method at this time, a generally known subtractive method (a method in which a pattern-like mask is provided on a metal layer, an etching process is performed on a region where a mask is not formed, and a mask is removed to form a lead wiring) is used. The addition method (a method in which a pattern mask is provided on a metal layer, a metal layer is formed in a region where no mask is formed, a mask is removed, a mask is removed, and an etching process is performed to form a lead wiring).

In addition, in the step G, the step of forming an insulating layer that does not substantially contain a functional group that interacts with the plating catalyst or its precursor may be omitted, and only the insulating layer is not provided. The upper resin layer of the plating catalyst or its precursor and the one end portion of the detecting electrode are plated.

In addition, in the above-described FIGS. 1 to 7 , the detection electrode, the lead wiring, and the resin layer are disposed only on one surface of the substrate. However, the above-described detection electrodes may be disposed on both surfaces of the substrate. The wiring and the resin layer are taken out. At this time, as the substrate to be used, as described above, a resin substrate (for example, a PET substrate) or the like can be used.

[Examples]

The invention is further illustrated by the following examples, but the invention is not limited thereto.

<Example 1>

Screen printing was performed five times on a glass substrate having a thickness of 0.55 mm using a black resist. Then, the solvent component was removed by a vacuum dryer, and then exposure was performed by a proximity exposure method (ultra-high pressure mercury lamp). Here, as a photomask for exposure, a mask obtained by patterning a soda glass with Cr (chromium) is used. Next, development is carried out using an alkaline developing solution, and heat treatment is performed to form a resin layer at the position of the resin layer 14 shown in FIG.

In addition, as the black resist, the black composition 4 used in Example 4 of JP-A-2014-130417 was used. Further, a carboxylic acid group as an interactive group is contained in the obtained resin layer.

Next, an indium oxide-tin oxide target having a composition of indium oxide and tin oxide of 95:5 by weight and a packing density of 98% was used, and an ITO layer was formed on the obtained glass substrate by a sputtering method, and photolithography was used. The resist is patterned and etched to obtain a patterned ITO layer corresponding to the first detecting electrode 16 and the second detecting electrode 18 shown in FIG. In the meantime, the acrylic photosensitive resin composition is used for pattern exposure between the first detecting electrode 16 and the second detecting electrode 18, and an inter-electrode insulating layer is disposed.

It should be noted that, as shown in FIG. 1, one end portion of the ITO layer extends to the resin layer.

Next, a negative resist containing cyclized isoprene rubber (manufactured by Fuji Film, SC-450) was applied onto the ITO layer of the obtained glass substrate, and exposed in a pattern, and the unexposed portion was removed by development. An insulating layer is obtained at the same position as the insulating layer 22 shown in FIG. It should be noted that the insulating layer does not contain an interactive group. Further, as shown in FIG. 1, the insulating layer is disposed such that each end portion of the ITO layer is exposed.

Next, a negative resist containing cyclized isoprene rubber (SC-450, manufactured by Fuji Film) was applied onto the resin layer, and exposed in a pattern, and the resin in which the lead wiring 20 was not disposed as shown in FIG. 1 was applied. The area on the layer forms a resist pattern.

Next, the surface of the glass substrate in which the resin layer is not formed is covered with a protective tape (manufactured by Nitto Denko Corporation), and the glass substrate having the resin layer is applied to the Pd catalyst only liquid MAT-2 (manufactured by Uemura Industrial Co., Ltd.) at room temperature. The MAT-2A was immersed in a 5-fold diluted solution (catalyst-imparting solution, pH: 3.5) for 5 minutes, and washed twice with pure water. Subsequently, it was immersed in a reducing agent MAB (manufactured by Uemura Industrial Co., Ltd.) at 36 ° C for 5 minutes, and washed twice with pure water. Thereafter, it was immersed in the activation treatment liquid MEL-3 (manufactured by Uemura Kogyo Co., Ltd.) for 5 minutes at room temperature, and was subjected to electroless plating solution Thru-cup PEA (Shangcun Industrial) at room temperature without washing. Immersed for 60 minutes. The tape which was peeled off was washed twice with pure water to obtain a conductive laminate having a patterned copper layer (corresponding to a lead wire) on the resin layer. It is confirmed that the length of the wiring 20 formed on the second detecting electrode end portion 18A shown in FIG. 2 is 1 mm or more from the outermost portion of the second detecting electrode end portion 18A.

<Example 2>

(Synthesis Example: Polymer 1)

1 L of ethyl acetate and 159 g of 2-aminoethanol were placed in a 2 L three-necked flask, and the mixture was cooled in an ice bath. After adjusting to have an internal temperature of 20 ° C or less, 150 g of 2-bromoisobutyl hydrazine bromide was added dropwise thereto. Thereafter, the internal temperature was raised to room temperature (25 ° C) and reacted for 2 hours. After the reaction was terminated, 300 mL of distilled water was added to stop the reaction. Thereafter, the ethyl acetate phase was washed four times with 300 mL of distilled water, and then dried over magnesium sulfate, and then ethyl acetate was distilled off to obtain 80 g of a material A.

Next, 47.4 g of a raw material A, 22 g of pyridine, and 150 mL of ethyl acetate were placed in a 500 mL three-necked flask, and the mixture was cooled in an ice bath. After adjusting to have an internal temperature of 20 ° C or less, 25 g of acrylonitrile chloride was added dropwise thereto. Thereafter, it was raised to room temperature and reacted for 3 hours. After the reaction was terminated, 300 mL of distilled water was added to stop the reaction. Thereafter, the ethyl acetate phase was washed four times with 300 mL of distilled water, and then dried over magnesium sulfate to further distill off ethyl acetate. Thereafter, the following monomer M1 (20 g) was obtained by column chromatography.

[Chemical 6] Monomer M1

8 g of N,N-dimethylacetamide was placed in a 500 mL three-necked flask and heated to 65 ° C under a nitrogen stream. The monomer M: 1:14.3 g, acrylonitrile (manufactured by Tokyo Chemical Industry Co., Ltd.), 3.0 g, acrylic acid (manufactured by Tokyo Chemical Industry Co., Ltd.), 6.5 g, and V-65 (manufactured by Wako Pure Chemical Industries, Ltd.) 0.4 g were added dropwise thereto over a period of 4 hours. 8 g solution of N,N-dimethylacetamide.

After the completion of the dropwise addition, the reaction solution was further stirred for 3 hours. Thereafter, 41 g of N,N-dimethylacetamide was added, and the reaction solution was cooled to room temperature. To the reaction solution, 0.09 g of 4-hydroxy TEMPO (manufactured by Tokyo Chemical Industry Co., Ltd.) and 54.8 g of DBU (diazabicycloundecene) were added, and the reaction was carried out for 12 hours at room temperature. Thereafter, 54 g of a 70% by mass aqueous methanesulfonic acid solution was added to the reaction liquid. After the reaction was terminated, reprecipitation was carried out with water, and the solid matter was taken out to obtain a polymer 1 (12 g).

The identification of the obtained polymer 1 was carried out using an IR measuring machine (manufactured by Horiba, Ltd.). In the measurement, the polymer was dissolved in acetone and carried out using KBr crystals. From the results of the IR measurement, a peak was observed in the vicinity of 2240 cm ^-1 , and it was found that acrylonitrile was introduced into the polymer as a nitrile unit. Further, it was found from the measurement of the acid value that acrylic acid was introduced as a carboxylic acid unit. Further, the polymer was dissolved in deuterated DMSO (dimethyl hydrazine) and measured by 300 MHz NMR (Nuclear Magnetic Resonance) (AV-300) manufactured by Bruker. It can be seen that a broad peak corresponding to the nitrile-containing unit was observed at 2.5-0.7 ppm (5H), at 7.8-8.1 ppm (1H), 5.8-5.6 ppm (1H), 5.4-5.2 ppm (1H), 4.2-3.9. Phenol (2H), 3.3-3.5 ppm (2H), 2.5-0.7 ppm (6H), a broad peak corresponding to a polymerizable group unit was observed, and a corresponding carboxylic acid-containing unit was observed at 2.5-0.7 ppm (3H). Wide peak, polymerizable group unit: nitrile group-containing unit: carboxylic acid group unit = 30:30:40 (mol%).

[Chemistry 7] Polymer 1

(Preparation of composition for forming upper resin layer)

Water (18.95 parts by mass), propylene glycol monomethyl ether (75.8 parts by mass), polymer 1 (5 parts by mass), and IRGACURE OXE 02 (manufactured by BASF Corporation) (0.25 parts by mass) were placed in a 200 ml beaker placed with magnetic stirring. The liquid was prepared to obtain a composition for forming an upper resin layer.

A conductive laminate was produced in the same manner as in Example 1 except that the production process of the resin layer was changed to the following method (manufacturing method of the laminated resin layer).

(Method of Manufacturing Layered Resin Layer)

In the same manner as the above-mentioned document, the decorative layer is the same as the lower resin layer 30 shown in FIG. 4, using the photosensitive film L1 for decorative layer formation manufactured in Example 1 of JP-A-2013-218313. The position is placed on the substrate. It should be noted that a coloring agent is contained in the decorative layer.

Next, the composition for forming the upper resin layer was spin-coated on the substrate having the decorative layer, and dried at 80 ° C for 5 minutes. Thereafter, the entire surface of the coating film was subjected to UV irradiation (energy: 2 J, 10 mW, wavelength: 256 nm) in the atmosphere, and an upper resin layer was formed at the same position as the upper resin layer 32 shown in FIG. 4 (thickness: 0.25 μm).

<Example 3>

A substrate having a decorative layer was produced in the same manner as in Example 2.

Next, an ITO layer was placed on the substrate in the same manner as the method carried out in Example 1. It should be noted that one end portion of the ITO layer extends to the decorative layer.

Next, the composition for forming the upper resin layer was spin-coated on the substrate having the decorative layer, and dried at 80 ° C for 5 minutes. Thereafter, the entire surface of the coating film was subjected to UV irradiation (energy: 2 J, 10 mW, wavelength: 256 nm) in the atmosphere, and an upper resin layer was formed at the same position as the upper resin layer 132 shown in FIG. 6 (thickness: 0.25 μm).

Then, using the obtained substrate, an insulating layer was provided in the same manner as in Example 1, and further, a plating treatment was performed, and a patterned copper layer was formed at the position of the lead wiring 20 shown in FIG. 6 to obtain a conductive laminate. .

The conductive laminate obtained in the above Examples 1 to 3 was subjected to the following (connection resistance measurement), and as a result, it was evaluated as "A" in any of the conductive laminates, and it was confirmed that the ITO layer (detection electrode) and The patterned copper layer (lead wiring) has a high electrical connection linearity.

(connection resistance measurement)

As a method of evaluation, the electric resistance value between the patterned copper layer and the patterned ITO layer was measured (manufactured by Hiramoto Electric Co., Ltd., Milliohm HiTester 3540), and evaluated according to the following criteria.

"A": When the resistance value is 10mΩ or less

"B": the resistance value is greater than 10mΩ

"C": The resistance value cannot be measured, and the disconnection is substantially caused.

In addition, in Example 1, an insulating layer formed of a negative resist containing a cyclized isoprene rubber (SC-450, manufactured by Fuji Film) was used, but it was used instead of the insulating layer. In the case of a laminated layer of SiO ₂ layer (33 nm) and NbO ₅ layer (14 nm), it was confirmed that the same effect was obtained.

A touch panel including the touch panel sensor including the respective conductive laminates obtained in the above Examples 1 to 3 was produced, and as a result, each of the touch panels worked well.

In the above-described first to third embodiments, the insulating layer is provided for the plating treatment. However, the plating layer may be formed only in the portion where the extraction wiring is desired to be formed without providing the insulating layer, thereby forming a desired pattern. Copper layer. More specifically, only the portion of the resin layer which is desired to precipitate the lead wiring is immersed in the solution used in the above plating treatment to precipitate the plating material.

The above is only a part of the embodiments of the present invention, and is not intended to limit the present invention. It is intended to be included in the scope of the present invention.

In summary, the embodiments of the present invention can achieve the expected use efficiency, and the specific technical means disclosed therein have not been seen in similar products, nor have they been disclosed before the application, and have completely complied with the patent law. The regulations and requirements, the application for invention patents in accordance with the law, and the application for review, and the grant of patents, are truly sensible.

10,100,200‧‧‧Electrically conductive laminate for touch panel sensors

12‧‧‧Substrate

14‧‧‧ resin layer

16‧‧‧1st detecting electrode

18‧‧‧2nd detection electrode

20‧‧‧Leading wiring

22‧‧‧Insulation

24‧‧‧Inter-electrode insulation

30‧‧‧Lower resin layer

32,132‧‧‧Upper resin layer

34‧‧‧Layered resin layer

18A‧‧‧End

1 is a plan view showing a first embodiment of a conductive laminate for a touch panel sensor according to the present invention.

Fig. 2 is a cross-sectional view taken along the cutting line A-A shown in Fig. 1.

3 is a cross-sectional view showing one embodiment of a method of manufacturing a conductive laminate for a touch panel sensor in order of steps.

4 is a plan view showing a second embodiment of the conductive laminate for a touch panel sensor of the present invention.

Fig. 5 is a cross-sectional view taken along the cutting line B-B shown in Fig. 4 .

Fig. 6 is a plan view showing a third embodiment of a conductive laminate for a touch panel sensor according to the present invention.

Fig. 7 is a cross-sectional view taken along the cutting line C-C shown in Fig. 6.

12‧‧‧Substrate

14‧‧‧ resin layer

16‧‧‧1st detecting electrode

18‧‧‧2nd detection electrode

18A‧‧‧End

20‧‧‧Leading wiring

22‧‧‧Insulation

24‧‧‧Inter-electrode insulation

Claims (10)

A conductive laminate for a touch panel sensor, comprising: a substrate; a resin layer disposed on a peripheral region of the substrate, having a functional group that interacts with a plating catalyst or a precursor thereof; and a detecting electrode One end portion is disposed on the substrate so as to be in contact with the resin layer, and a lead wire is disposed on the resin layer and electrically connected to the one end portion of the detecting electrode; and the lead wire is a method having at least the following steps In the wiring to be formed, in this step, a plating catalyst or a precursor thereof is applied to the resin layer, and a resin layer to which the plating catalyst or its precursor is applied is subjected to a plating treatment. The conductive laminate for a touch panel sensor according to claim 1, wherein the laminate further has an insulating layer, the insulating layer being electrically connected to the one end of the detecting electrode electrically connected to the lead wiring The exposed portion covers the detecting electrode; the insulating layer does not substantially contain a functional group that interacts with the plating catalyst or its precursor. The conductive laminate for a touch panel sensor according to the first aspect of the invention, wherein the resin layer contains a coloring agent, the resin layer functions as a decorative layer, and the one end portion of the detecting electrode It extends to the above resin layer. The conductive laminate for a touch panel sensor according to the first or second aspect, wherein the resin layer is a laminated resin layer including a lower resin layer and an upper resin layer, and the lower resin The layer contains a coloring agent, the upper resin layer is disposed on the lower resin layer, and the upper resin layer has a functional group that interacts with the plating catalyst or the precursor thereof; and the one end portion of the detecting electrode extends to the upper resin On the floor. The conductive laminate for a touch panel sensor according to the first or second aspect, wherein the resin layer is a laminated resin layer including a lower resin layer and an upper resin layer, and the lower resin The layer contains a coloring agent, the upper resin layer is disposed on a portion of the lower resin layer, and the upper resin layer has a functional group that interacts with the plating catalyst or a precursor thereof; and the one end portion of the detecting electrode extends to the above On the lower resin layer, the one end portion is in contact with the upper resin layer on the lower resin layer. The conductive laminate for a touch panel sensor according to claim 1 or 2, wherein the substrate is a glass substrate. A touch panel sensor, comprising the conductive laminate for a touch panel sensor according to any one of claims 1 to 6. A touch panel comprising the conductive laminate for a touch panel sensor according to any one of claims 1 to 6. A method for manufacturing a conductive laminate for a touch panel sensor, comprising the steps of: Step A, in which a functional group having a interaction with a plating catalyst or a precursor thereof is formed in a peripheral region on a substrate a resin layer; in this step, a detecting electrode is formed on the substrate, one end portion of the detecting electrode extends to the resin layer, and the detecting electrode is in contact with the resin layer; Step C, in this step, Step C-1 and step C-2 are performed in different order, in step C-1, a resist pattern is formed on the above resin layer; in step C-2, formation is substantially free of plating catalyst or An insulating layer of a functional group in which the precursor interacts, the insulating layer covering the detecting electrode in such a manner that one end portion of the detecting electrode in contact with the resin layer is exposed; and a step D, in the step, on the resin layer The region where the resist pattern is not formed is provided with a plating catalyst or a precursor thereof, and the resin layer to which the plating catalyst or its precursor is applied is plated. Forming the lead line connected to the one end portion of the detection electrode electrically. A method for manufacturing a conductive laminate for a touch panel sensor, comprising the steps of: Step E, in which a lower resin layer containing a colorant is formed on a peripheral region on a substrate; Step F, In this step, a detecting electrode having one end extending to the lower resin layer is formed on the substrate; Step G, in this step, step G-1 and step G-2 are performed in different order, in step G- 1 , forming an upper resin layer having a functional group that interacts with a plating catalyst or a precursor thereof, the upper resin layer being disposed on a portion of the lower resin layer, and the upper resin layer being in contact with the detecting electrode; In G-2, an insulating layer that does not substantially contain a functional group that interacts with a plating catalyst or a precursor thereof is formed, and the insulating layer covers the detecting electrode so that one end portion of the detecting electrode that is in contact with the upper resin layer is exposed. And step H, in which the lead wiring electrically connected to the one end portion of the detecting electrode is formed by the following method, the method Having at least the following steps: on the upper side of the resin layer imparting a plating catalyst or a precursor thereof, a plating treatment is given to the above-described plated layer on the side of the resin catalyst or a precursor thereof.