WO2016000909A1 - Élément de liaison de cartes de circuits imprimés - Google Patents

Élément de liaison de cartes de circuits imprimés Download PDF

Info

Publication number
WO2016000909A1
WO2016000909A1 PCT/EP2015/062697 EP2015062697W WO2016000909A1 WO 2016000909 A1 WO2016000909 A1 WO 2016000909A1 EP 2015062697 W EP2015062697 W EP 2015062697W WO 2016000909 A1 WO2016000909 A1 WO 2016000909A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
connection element
press
tht
Prior art date
Application number
PCT/EP2015/062697
Other languages
German (de)
English (en)
Inventor
Dietmar Birgel
Bernd Strütt
Franz Glatz
Michael Feucht
Original Assignee
Endress+Hauser Gmbh+Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress+Hauser Gmbh+Co. Kg filed Critical Endress+Hauser Gmbh+Co. Kg
Publication of WO2016000909A1 publication Critical patent/WO2016000909A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10787—Leads having protrusions, e.g. for retention or insert stop
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10871—Leads having an integral insert stop

Definitions

  • the invention relates to a printed circuit board connection elements and a method for producing a printed circuit board assembly.
  • Electronic devices such as measuring devices for process technology, usually contain one or more printed circuit boards, on which electrical components are fastened and printed conductors are applied. Often, the space in the device is limited, so that in addition to rigid circuit boards and space-saving flexible circuit boards are used. Often several printed circuit boards are connected to each other. In particular, in measuring devices which are exposed to high mechanical loads, a firm connection between the circuit boards is of great importance. From printed circuit board manufacturing various methods for assembly and connection of printed circuit boards are known. For example, so-called SMD components (Surface Mounted Device) are mounted on contact surfaces on the front side of the printed circuit board. THT components (through-hole technology), however, have connecting wires which are inserted through an opening in the printed circuit board and on the opposite side or
  • soldering of SMD components is usually done in a reflow process.
  • the circuit board is provided at the points to be equipped with solder paste, which forms a Lotpastendepot. Subsequently, the component is positioned on the corresponding solder depot.
  • the so-equipped printed circuit board is exposed to a heat source, for example, placed on a hot plate or supplied to a soldering oven, wherein the solder paste is melted and thereby a connection of the component is made with the circuit board.
  • the press-fit technology is based on pressing a press-fit pin into a metallised hole (through-hole) of a printed circuit board. As essential is to be considered that the diagonal of the pin cross-section is greater than the diameter of the metallized hole.
  • the resulting during pressing overpressure can either by the deformation in the hole or the
  • the invention is therefore based on the object to enable the simplified connection of at least two circuit boards.
  • Circuit board connection element and a method for producing a printed circuit board assembly solved.
  • the object is achieved by a printed circuit board connecting element for electrical and / or
  • PCB connector at least comprises:
  • a support body having on a first surface solderable SMD pads and / or plug-in THT wire connections, which are solderable in a soldering on a first circuit board and on a second surface at least one press-in, in a press-fit into a metallized hole of a second circuit board can be pressed in;
  • the object is achieved in that the
  • PCB connector once a terminal block with SMD pads and / or plug-in THT wire connections on a first surface of the circuit board connector and once a
  • the PCB connection element during the placement of the first ggfl. also solder the second circuit board on the SMD pads and / or pluggable THT wire connections and can in a following on the placement process press-fitting with the second if necessary. Also first circuit board electrically and / or mechanically connected. Compared to those known from the prior art thus a press-in process can be saved.
  • Carrier underside and the support surface is substantially flush with the carrier base.
  • the ratio of the support surface of the support body to a single SMD pad is at least 2: 1, in particular 4: 1, more preferably 5: 1.
  • An advantageous embodiment provides that the
  • PCB connection element has at least one contour element, via which a positioning of the carrier body takes place on the first circuit board.
  • the at least one contour element is made of a metallic material, so that it can be brazed to the first circuit board in the soldering process.
  • the contour element is a guide pin.
  • An advantageous embodiment provides that at least one spring is provided within the carrier body, which connects an SMD pad and / or a pluggable THT wire connection with the at least one press-in pin electrically.
  • the object is achieved by a method for
  • Printed circuit board and a second circuit board which has at least one
  • Circuit board connection element in particular according to one of the embodiments described above, electrically and / or mechanically connected to each other, the method comprising at least the following steps:
  • Contour element is soldered in the soldering to the first circuit board.
  • Fig. 1 a schematic representation of an inventive
  • Fig. 2 is a schematic representation of a printed circuit board assembly
  • FIG. 3 shows a flow chart of the method according to the invention.
  • Fig. 1 shows a schematic representation of an inventive
  • PCB connection element 2 for electrical and / or
  • PCB connection element 2 has the following:
  • a support body 4 for example a housing made of plastic, which has solderable SMD connection surfaces 7 and / or pluggable THT wire connections 8 on a first surface 5 and at least one press-fit pin 9 on a second surface 6, but typically several press-fit pins.
  • the first and second surfaces 5, 6 of the carrier body 4 lie in different planes.
  • 4 springs 16 are provided within the carrier body, each having an SMD pad 7 or a pluggable THT wire connection electrically connect with a press-fit pin 9.
  • the invention is also possible without springs 16 and that in this case, the individual SMD Terminal surfaces 7 and the individual pluggable THT wire terminals 8 are electrically connected to each other within the carrier body 4.
  • three THT wire connections 8 are shown by way of example, which, depending on the embodiment of the invention, can also be replaced by SMD connection surfaces 7 or a combination of both.
  • the distances between the individual THT wire terminals 8 and the individual SMD pads 7 are formed according to a grid dimension according to DIN standard 40801.
  • a grid dimension defines the distance between two adjacent grid lines on which the THT wire connections 8 or the SMD connection areas 7 lie.
  • pitches of 2 mm or smaller are common, so that the distances between the THT wire terminals 8 and the SMD pads 7 are 2 mm or smaller.
  • PCB connection element 2 exclusively SMD pads 7 and no THT wire terminals 8, at least 2: 1, in particular 4: 1, more preferably 5: 1.
  • Positioning of the carrier body 4 on the first circuit board 2 is made possible. This feature is considered optional as it provides some advantageous positioning effect. In principle, however, the invention is also possible without this feature.
  • a metallic material for example. Copper or a copper alloy such as brass or bronze, a soldering of the contour element 14 is possible, so that a simplified assembly is given.
  • the contour element 14 may be, for example, a guide pin 14 or a guide rail 14. Typically, the surface is additionally galvanized for better solderability.
  • FIG. 2 shows a schematic representation of a printed circuit board assembly 18.
  • FIG. 2 shows a printed circuit board connection element 1 with only a single THT wire connection 8 and a single press-in pin 9.
  • FIG. 2 shows a printed circuit board connection element 1 with only a single THT wire connection 8 and a single press-in pin 9.
  • THT wire terminals 8 and / or SMD pads 7 and a plurality of press-in pins 9 are present.
  • the printed circuit board assembly 18 in Fig. 2 comprises:
  • a circuit board connection element 1 which according to the
  • FIG. 1 Figure description is formed to FIG. 1.
  • FIG. 3 shows a flowchart of the method according to the invention for producing a printed circuit board arrangement 18 shown in FIG. 2.
  • This process of soldering takes place simultaneously with the actual placement of the first circuit board 2.
  • the SMD connection surfaces of the printed circuit board connection element 1 are also soldered, so that, compared to the methods known from the prior art, the first press-fitting process during the production of the printed circuit board assembly 18 is saved.
  • THT wire connections 8 or a combination of SMD connection areas and THT wire connections In the case that the contour element 14 is made of a metallic material, this is also soldered in the soldering process.
  • the method described above has in the production of a
  • Fig. 3 the inventive method is shown so that in the left branch under the label "LP2", which stands for printed circuit board 2, the SMD placement of the second printed circuit board 3 is indicated in two parts, once loading the back and once that
  • the first printed circuit board 2 (marked “LP1") is populated with SMD components, which in turn is divided into two parts, once the rear side has been assembled and once the components have been assembled
  • the printed circuit board connection element 1 is also soldered with its SMD connection surfaces 7 and / or THT wire connections 8.
  • this soldering is exemplified in the assembly of the front of the first circuit board 2. It is also conceivable that this in the assembly of the
  • Printed circuit board connection element 1 was soldered, the two circuit board 2, 3 are connected together in a last press-fitting by means of the press-fit pin 9.
  • Carrier body in particular housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne un élément de liaison de cartes de circuits imprimés (1) servant à relier électriquement et/ou mécaniquement deux cartes de circuits imprimés (2, 3). L'élément de liaison comprend au moins : - un corps de support (4), qui comporte, sur une première surface (5), des pastilles CMS soudables (7) et/ou des connexions par fil THT enfichables (8) qui sont soudables sur une première carte de circuits imprimés (2) dans un processus de soudage, et, sur une seconde surface (6), au moins une broche à enfoncer (9) qui peut être enfoncée dans un trou métallisé (10) d'une seconde carte de circuits imprimés (3) dans un processus d'enfoncement ; - au moins un corps d'appui (11) fixé au corps de support (4) et possédant une face d'appui (12) destinée à venir en appui sur la première carte de circuits imprimés (2) de façon à soulager mécaniquement les pastilles CMS (7) ou les connexions par fils THT (8) pendant le processus d'enfoncement.
PCT/EP2015/062697 2014-07-01 2015-06-08 Élément de liaison de cartes de circuits imprimés WO2016000909A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014109220.1 2014-07-01
DE102014109220.1A DE102014109220A1 (de) 2014-07-01 2014-07-01 Leiterplattenverbindungselement

Publications (1)

Publication Number Publication Date
WO2016000909A1 true WO2016000909A1 (fr) 2016-01-07

Family

ID=53298383

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/062697 WO2016000909A1 (fr) 2014-07-01 2015-06-08 Élément de liaison de cartes de circuits imprimés

Country Status (2)

Country Link
DE (1) DE102014109220A1 (fr)
WO (1) WO2016000909A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10098267B1 (en) 2017-06-06 2018-10-09 Robert Bosch Llc Housing for a camera and method of manufacture

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020212934A1 (de) 2020-10-14 2022-04-14 Robert Bosch Gesellschaft mit beschränkter Haftung Verbindungselement zum elektrischen Verbinden von zwei Schaltungsträgern

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001047328A1 (fr) * 1999-12-20 2001-06-28 Synqor, Inc. Broches bridees destinees a des convertisseurs continu-continu
US20040253862A1 (en) * 2003-06-12 2004-12-16 Yamaichi Electronics Co., Ltd. Method for providing socket on substrate and socket applied with such method
DE102004041207A1 (de) * 2004-08-25 2006-03-30 Siemens Ag Vorrichtung zur Verbindung von Leiterplatten

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2534861Y2 (ja) * 1993-03-31 1997-05-07 バーグ・テクノロジー・インコーポレーテッド 電気コネクタ結合装置
FR2830375A1 (fr) * 2001-12-27 2003-04-04 Siemens Vdo Automotive Dispositif pour la connexion de deux cartes de circuits imprimes et procede correspondant
US7470129B2 (en) * 2007-05-22 2008-12-30 Tyco Electronics Corporation Two piece single use security module mezzanine connector
DE102008014822A1 (de) * 2008-03-18 2009-09-24 Hella Kgaa Hueck & Co. Leiterplattenanordnung
CN103733434B (zh) * 2011-05-17 2016-06-22 怡得乐工业有限公司 带有防变形顺应挠性针脚的板间连接系统
DE102013111073A1 (de) * 2013-10-07 2015-04-09 Hella Kgaa Hueck & Co. Elektronische Schaltung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001047328A1 (fr) * 1999-12-20 2001-06-28 Synqor, Inc. Broches bridees destinees a des convertisseurs continu-continu
US20040253862A1 (en) * 2003-06-12 2004-12-16 Yamaichi Electronics Co., Ltd. Method for providing socket on substrate and socket applied with such method
DE102004041207A1 (de) * 2004-08-25 2006-03-30 Siemens Ag Vorrichtung zur Verbindung von Leiterplatten

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10098267B1 (en) 2017-06-06 2018-10-09 Robert Bosch Llc Housing for a camera and method of manufacture

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