WO2016000393A1 - Amoled显示面板及其制备方法和显示装置 - Google Patents

Amoled显示面板及其制备方法和显示装置 Download PDF

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Publication number
WO2016000393A1
WO2016000393A1 PCT/CN2014/092482 CN2014092482W WO2016000393A1 WO 2016000393 A1 WO2016000393 A1 WO 2016000393A1 CN 2014092482 W CN2014092482 W CN 2014092482W WO 2016000393 A1 WO2016000393 A1 WO 2016000393A1
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Prior art keywords
layer
display panel
array substrate
amoled display
substrate
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PCT/CN2014/092482
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English (en)
French (fr)
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王俊然
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京东方科技集团股份有限公司
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Priority to EP14882155.6A priority Critical patent/EP3166149B1/en
Priority to US14/761,392 priority patent/US9722205B2/en
Publication of WO2016000393A1 publication Critical patent/WO2016000393A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures
    • H10K2102/3023—Direction of light emission
    • H10K2102/3026—Top emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/868—Arrangements for polarized light emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/351—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels comprising more than three subpixels, e.g. red-green-blue-white [RGBW]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8793—Arrangements for polarized light emission

Definitions

  • Embodiments of the present invention relate to an AMOLED display panel, a method of fabricating the same, and a display device.
  • AMOLED Active Matrix/Organic Light Emitting Diode
  • FMM Full Color Metal Mask
  • a R, G, and B color film layer is formed by vapor deposition on a display substrate.
  • FMM technology is prone to color mixing problems and low yield.
  • FMM technology is difficult to achieve high resolution, so it is difficult to cope with high-generation production lines by using FMM technology to achieve full color of AMOLED.
  • WOLED+CF method (WOLED: White Organic Light-Emitting Diode, white organic light-emitting diode, CF: Color-Filter color filter, ie white light + color filter to achieve AMOLED full color), using WOLED+
  • the CF method realizes full colorization of the top emission type AMOLED, has the advantages of high AMOLED aperture ratio and simple backplane process, and is widely used at present.
  • the top emission type AMOLED means that light is emitted from the side of the array substrate toward the side of the color filter substrate.
  • the full colorization of the top emission type AMOLED by the WOLED+CF method is generally performed by disposing a color film layer on a color film substrate, and then performing a cell-assembly on the color film substrate and the array substrate.
  • the color film substrate mostly uses glass as the substrate.
  • a circular polarizer is also attached to the color filter substrate.
  • the thickness of the glass substrate in the color filter substrate usually needs to be set at about 500 ⁇ m, which greatly increases the thickness of the AMOLED panel.
  • color film base A circular polarizer is also attached to the board, and such a structure makes the AMOLED panel more cumbersome, which is disadvantageous for the slimness of the AMOLED panel.
  • Embodiments of the present invention provide an AMOLED display panel, a method of fabricating the same, and a display device.
  • At least one embodiment of the present invention provides an AMOLED display panel including an array substrate and a color filter substrate, and the color filter substrate includes an anti-reflection layer, a water blocking layer, and a color film layer and a black matrix disposed in the same layer.
  • the anti-reflection layer is located on a side of the color film layer and the black matrix away from the array substrate, and the water blocking layer is disposed on the color film layer and the black matrix adjacent to the array substrate One side, or the water blocking layer is disposed between the anti-reflective layer and the color film layer and the black matrix.
  • the water blocking layer may have a thickness ranging from 0.1 to 10 ⁇ m.
  • the water blocking layer may be a single film layer or a plurality of film layers overlapping each other.
  • the single film layer may be made of an inorganic material
  • the plurality of film layers may include a film layer made of an inorganic material and a film layer made of an organic material; the inorganic material may include nitrogen.
  • the inorganic material may include nitrogen.
  • Any one of silicon and silicon oxide, and the organic material may include any one of a poly epoxy resin and a polyacrylic acid.
  • the anti-reflective layer may include a quarter-wave plate, a glue material, and a linear polarizer that are sequentially laminated, the line polarizer being farther from the array substrate than the quarter-wave plate.
  • the 1/4 wave plate may be a COP optical material
  • the glue material may be a polyacrylic material
  • the color film layer may be an RGB three color film layer or an RGBW four color film layer.
  • a bonding adhesive may be disposed between the array substrate and the color filter substrate, and the bonding adhesive material enables the array substrate and the color film substrate to be bonded and bonded together.
  • the array substrate may include a lower substrate and a lower electrode, an electroluminescent layer, an upper electrode, and a thin film encapsulation layer, which are sequentially disposed above the lower substrate.
  • the thin film encapsulation layer may be a single film layer or a plurality of film layers overlapping each other, the material of the thin film encapsulation layer may be the same as the water blocking layer, and the bonding adhesive material may be an epoxy resin material. .
  • the bonding glue may correspond to the four periphery of the array substrate and the color filter substrate.
  • the frame area, or the bonding glue may cover the entire surface of the array substrate and the color film substrate facing each other.
  • the lower substrate may be made of a glass or plastic material, and the plastic material may be polythiamine.
  • Embodiments of the present invention also provide a display device including any of the above-described AMOLED display panels.
  • the embodiment of the present invention further provides a method for fabricating the above-mentioned AMOLED display panel, which comprises preparing an array substrate and preparing a color filter substrate, and performing the pair of the array substrate and the color filter substrate, wherein the The preparation of the color filter substrate includes the step of forming a water blocking layer.
  • the preparing the color filter substrate and performing the pairing of the array substrate and the color filter substrate may include:
  • Step S1 forming a quarter-wave plate on the glass carrier
  • Step S2 forming a pattern including a color film layer and a black matrix on the glass carrier plate completing step S1 by using a patterning process;
  • Step S3 forming a water blocking layer on the glass carrier plate completing step S2;
  • Step S4 Applying or sticking a bonding adhesive on the glass carrier plate of step S3, and bonding the array substrate to the glass carrier plate of step S3;
  • Step S5 removing the glass carrier
  • Step S6 applying a glue on the online polarizer, and attaching the linear polarizer to the 1/4 wave plate.
  • the preparing the color filter substrate and performing the pairing of the array substrate and the color filter substrate may include:
  • Step S1 forming a quarter-wave plate on the glass carrier
  • Step S2 forming a water blocking layer on the glass carrier plate completing step S1;
  • Step S3 forming a pattern including a color film layer and a black matrix on the glass carrier plate completing step S2 by using a patterning process;
  • Step S4 Applying or sticking a bonding adhesive on the glass carrier plate of step S3, and bonding the array substrate to the glass carrier plate of step S3;
  • Step S5 removing the glass carrier
  • Step S6 applying a glue on the online polarizer, and attaching the linear polarizer to the 1/4 wave plate.
  • the water blocking layer may be formed by a method of physical vapor deposition or chemical vapor deposition.
  • FIG. 1 is a cross-sectional view showing the structure of an AMOLED display panel in Embodiment 1 of the present invention
  • FIG. 2a is a schematic view showing the formation of a quarter-wave plate on a glass carrier plate in the step S1 of the first embodiment
  • 2b is a schematic view showing the formation of a color film layer and a black matrix on the glass carrier plate in the step S2 of the first embodiment
  • 2c is a schematic view showing the formation of a water blocking layer on the glass carrier plate in the step S3 of the embodiment 1;
  • 2d is a schematic view showing the corresponding arrangement of the array substrate and the glass carrier in step S4 of the first embodiment
  • 2e is a schematic view of the glass carrier plate removed in step S5 of the embodiment 1;
  • 2f is a schematic view showing a line-bonding polarizer in step S6 of Embodiment 1;
  • FIG. 3 is a cross-sectional view showing the structure of an AMOLED display panel in Embodiment 2 of the present invention.
  • 4a is a schematic view showing the formation of a quarter-wave plate on a glass carrier in step S1 of Embodiment 2;
  • 4b is a schematic view showing the formation of a water blocking layer on the glass carrier plate in the step S2 of the embodiment 2;
  • 4c is a schematic view showing a color film layer and a black matrix formed on a glass carrier in step S3 of Embodiment 2;
  • 4d is a schematic view showing the corresponding arrangement of the array substrate and the glass carrier in step S4 of the second embodiment
  • Figure 4e is a schematic view showing the removal of the glass carrier in the step S5 of the embodiment 2;
  • Fig. 4f is a schematic view showing the line-bonding polarizer in the step S6 of the second embodiment.
  • This embodiment provides an AMOLED display panel, as shown in FIG. 1, which includes a cell-assembly array substrate 1 and a color filter substrate 2.
  • the color filter substrate 2 includes an anti-reflection layer 21 and a color film layer 22 and a black matrix 23 disposed in the same layer, and the anti-reflection layer 21 is located on a side of the color film layer 22 and the black matrix 23 away from the array substrate 1.
  • the color filter substrate 2 further includes a water blocking layer 24 disposed on a side of the color film layer 22 and the black matrix 23 close to the array substrate 1.
  • the thickness of the water blocking layer 24 may range from 0.1 to 10 [mu]m.
  • the water blocking layer 24 may be a single film layer, and the single film layer may be made of an inorganic material, wherein, for example, the inorganic material may include any one of silicon nitride and silicon oxide, and the inorganic material has good permeability.
  • the light performance has good water blocking performance, so that the water blocking layer 24 can not only protect the AMOLED display panel well, but also does not hinder the normal display of the AMOLED display panel.
  • the water blocking layer 24 may also be a plurality of film layers overlapping each other, and the plurality of film layers may include a film layer made of an inorganic material and a film layer made of an organic material.
  • the organic material may include any one of a polyepoxy resin and a polyacrylic acid. Since the organic material is more flexible than the inorganic material, the film layer made of the organic material and the film layer made of the inorganic material overlap each other to improve the flexibility of the entire water blocking layer 24.
  • the arrangement of the water blocking layer 24 prevents moisture from intruding into the AMOLED display panel, thereby forming a good protection for the AMOLED display panel. At the same time, the arrangement of the water blocking layer 24 eliminates the need to provide a glass substrate in the color filter substrate of the AMOLED display panel.
  • the thickness of the water blocking layer 24 can be much smaller than the thickness of the glass substrate, so that the overall thickness of the AMOLED display panel can be greatly reduced, making the AMOLED display panel lighter and thinner.
  • the anti-reflection layer 21 may include a quarter-wave plate 211, a glue 212, and a linear polarizer 213 which are sequentially stacked, and the linear polarizer 213 is farther from the array substrate 1 than the quarter-wave plate 211.
  • the AMOLED display panel in this embodiment is a top emission type, and the anti-reflection layer 21 is disposed on the light-emitting side of the AMOLED display panel, that is, the light is emitted from the color film substrate 2 side.
  • the line polarizer 213 passes first, and the light transmitted through the line polarizer 213 becomes linearly polarized light of the same polarization direction. Then, after the linearly polarized light passes through the quarter-wave plate 211, an optical path difference of 1/4 is generated. Then, the linearly polarized light having a 1/4 optical path difference is again transmitted through the quarter-wave plate 211 by reflection, and another 1/4 optical path difference is generated.
  • the linear polarization of the transmission through the linear polarizer 213 The light produced a total of 1/2 optical path difference. Since the polarization direction of the linearly polarized light of the 1/2 optical path difference also changes, it cannot pass through the linear polarizer 213 again, so that the anti-reflection layer 21 functions to reduce the reflection of ambient light, thereby increasing the The contrast of the AMOLED display panel.
  • the quarter-wave plate 211 may employ a cycloolefin polymer (COP) optical material having a lower retardation deviation and capable of improving the optical performance of the quarter-wave plate 211.
  • the rubber material 212 can be made of a polyacrylic material, which can not only affect the quarter-wave plate 211 and the linear polarizer 213, but also affect the light transmission between the quarter-wave plate 211 and the linear polarizer 213. Over.
  • the color film layer 22 may be an RGB three color film layer or an RGBW four color film layer, and the present invention is not limited thereto.
  • a bonding adhesive 3 may be disposed between the array substrate 1 and the color filter substrate 2.
  • the bonding adhesive 3 enables the array substrate 1 and the color filter substrate 2 to be bonded and bonded together.
  • the array substrate 1 may include a lower substrate 11 and a lower electrode 12, an electroluminescent layer 13, an upper electrode 14, and a thin film encapsulation layer 15 which are sequentially disposed above the lower substrate 11.
  • the array substrate includes a pixel array, and each of the sub-pixels includes a driving circuit and an OLED (including the lower electrode 12, the electro-excitation layer 13, and the upper electrode 14).
  • the driving circuit includes a thin film transistor, a capacitor, and the like.
  • the film encapsulation layer 15 may be a single film layer or a plurality of film layers overlapping each other.
  • the material of the film encapsulation layer 15 may be the same as that of the water blocking layer 24, and the bonding glue 3 may be an epoxy resin material.
  • the bonding glue 3 easily damages the OLED device (ie, the electroluminescent layer 13), and the film encapsulation layer 15 is disposed to isolate the bonding glue 3 from the OLED device (ie, the electroluminescent layer 13) on the array substrate 1.
  • the OLED device ie, the electroluminescent layer 13
  • the OLED device ie, the electroluminescent layer 13
  • the bonding glue 3 can cover the entire surface of the array substrate 1 and the color filter substrate 2 (for example, the bonding glue 3 is a double-sided tape). It should be noted that the bonding glue 3 may also correspond to the surrounding frame area of the array substrate 1 and the color filter substrate 2 .
  • the adhesive material 3 can firmly bond the array substrate 1 and the color filter substrate 2 to each other regardless of whether it is located in the surrounding frame area of the AMOLED display panel or on the entire surface of the AMOLED display panel.
  • the lower substrate 11 may be made of a plastic material, for example, the plastic material may be polythiamine.
  • the material has a certain flexibility and flexibility, which makes the entire AMOLED display panel flexible, which makes the AMOLED display panel more flexible.
  • the lower substrate 11 can also be made of glass.
  • the embodiment further provides a method for preparing an AMOLED display panel, which comprises preparing an array substrate and preparing a color filter substrate, and performing an array process on the array substrate and the color filter substrate, wherein the color film is prepared.
  • the substrate includes a step of forming a water blocking layer.
  • the preparation of the array substrate can be carried out by a conventional method in the prior art and will not be described in detail herein.
  • the preparation of the color filter substrate and the alignment of the array substrate and the color filter substrate may include the following steps as shown in FIGS. 2a to 2f.
  • Step S1 A quarter-wave plate 211 is formed on the glass carrier 4.
  • the 1/4 wave plate 211 can be formed by first coating a layer of COP optical material on the glass carrier 4, and then drying the material; or, the already formed 1/4 wave plate can be used. 211 is bonded to the glass carrier 4 by an adhesive.
  • Step S2 A pattern including the color film layer 22 and the black matrix 23 is sequentially formed on the glass carrier 4 on which the step S1 is completed by a patterning process.
  • the black matrix 23 may be formed first, and then the color film layer is formed.
  • the patterning process comprises first coating a glass film or a black matrix film on the glass carrier 4 of step S1, and then exposing, developing and etching the color film or black matrix film to form a film. A pattern including the color film layer 22 or the black matrix 23 is included.
  • Step S3 A water blocking layer 24 is formed on the glass carrier 4 on which the step S2 is completed.
  • the water blocking layer 24 may be formed by physical vapor deposition (ie, vacuum evaporation PVD) or chemical vapor deposition (CVD).
  • Step S4 Apply or attach the bonding adhesive 3 to the glass carrier 4 of the step S3, and bond the array substrate 1 to the glass carrier 4 of the step S3.
  • Step S5 The glass carrier 4 is removed.
  • the glass carrier 4 and the quarter-wave plate 211 are first separated by laser irradiation, and then the glass carrier 4 is removed.
  • Step S6 a glue 212 is applied to the line polarizer 213, and the line polarizer 213 is attached to the quarter-wave plate 211.
  • the AMOLED display panel is prepared.
  • the present embodiment provides an AMOLED display panel. Unlike the first embodiment, as shown in FIG. 3, the water blocking layer 24 is disposed between the anti-reflective layer 21 and the color film layer 22 and the black matrix 23.
  • the present embodiment further provides a method for fabricating an AMOLED display panel, which is different from the method for fabricating the AMOLED display panel in the first embodiment, in which a color filter substrate is prepared, and the array substrate and the color filter substrate are prepared.
  • Performing the pairing box may include the following steps as shown in Figures 4a-4f.
  • Step S1 A quarter-wave plate 211 is formed on the glass carrier 4.
  • Step S2 A water blocking layer 24 is formed on the glass carrier 4 on which the step S1 is completed.
  • Step S3 A pattern including the color film layer 22 and the black matrix 23 is sequentially formed on the glass carrier 4 on which the step S2 is completed by a patterning process.
  • Step S4 Apply or attach the bonding adhesive 3 to the glass carrier 4 of the step S3, and bond the array substrate 1 to the glass carrier 4 of the step S3.
  • Step S5 The glass carrier 4 is removed.
  • Step S6 a glue 212 is applied to the line polarizer 213, and the line polarizer 213 is attached to the quarter-wave plate 211.
  • step S1 to step S6 The specific preparation method in the above step S1 to step S6 is the same as that in the first embodiment, and details are not described herein again.
  • the AMOLED display panel provided in Embodiment 1-2 by providing a water blocking layer in the color filter substrate, moisture can be prevented from intruding into the AMOLED display panel, thereby forming a good protection for the AMOLED display panel.
  • the arrangement of the water blocking layer eliminates the need to provide a glass substrate in the color film substrate. Since the thickness of the water blocking layer is much smaller than the thickness of the glass substrate, the arrangement of the water blocking layer can greatly reduce the overall thickness of the AMOLED display panel. Thereby making the AMOLED display panel lighter and thinner.
  • the embodiment provides a display device including the AMOLED display panel in any of embodiments 1-2.
  • the display device can not only prevent moisture intrusion but also make itself lighter and thinner.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种AMOLED显示面板，包括对盒的阵列基板（1）和彩膜基板（2），彩膜基板（2）包括抗反射层（21）、阻水层（24）以及同层设置的彩膜层（22）和黑矩阵（23），抗反射层（21）位于彩膜层（22）和黑矩阵（23）的远离阵列基板（1）的一侧，该阻水层（24）设置在彩膜层（22）和黑矩阵（23）的靠近阵列基板（1）的一侧，或者阻水层（24）设置在抗反射层（21）与彩膜层（22）和黑矩阵（23）之间。该AMOLED显示面板能够防止水分侵入AMOLED显示面板，且更加轻薄。

Description

AMOLED显示面板及其制备方法和显示装置 技术领域
本发明的实施例涉及一种AMOLED显示面板及其制备方法和显示装置。
背景技术
有源矩阵有机发光二极管面板(Active Matrix/Organic Light Emitting Diode，AMOLED)，相比传统的液晶面板，具有反应速度较快、对比度更高、视角较广等特点，因此倍受人们的青睐。
目前，为了进一步优化AMOLED的全彩化显示效果，通常通过设置彩膜基板来实现，即让AMOLED发出的白光透过彩膜基板，从而实现白光AMOLED的全彩化显示。
目前，通过设置彩膜基板来实现AMOLED全彩化的技术主要有两种。一种是FMM(Fine Metal Mask，精细金属掩膜)技术，即通过蒸镀法在显示基板上蒸镀形成R、G、B彩膜层。但FMM技术容易造成混色问题，良率低。另外，FMM技术难以达到高解析度，所以采用FMM技术实现AMOLED的全彩化很难应对高世代产线。另一种是WOLED+CF法(WOLED：White Organic Light-Emitting Diode,白色有机发光二极管，CF：Color-Filter彩色滤光片，即白光+彩色滤光片实现AMOLED全彩化)，采用WOLED+CF法实现顶发射型AMOLED的全彩化，具有AMOLED开口率高及背板制程较简易等优点，目前被广泛采用。
顶发射型AMOLED是指光线由阵列基板侧向彩膜基板侧射出。通过WOLED+CF法实现顶发射型AMOLED的全彩化通常是将彩膜层设置在彩膜基板上，然后将彩膜基板与阵列基板进行对盒(cell-assembly)。为了保证彩膜基板与阵列基板的对盒精度，并增加AMOLED面板的信赖性，彩膜基板多采用玻璃作为基板。同时，为了减少外界光的反射，增加AMOLED面板的对比度，彩膜基板上还需贴上一层圆偏光片。
为了对AMOLED面板进行防护，彩膜基板中玻璃基板的厚度通常需要设置在500μm左右，这使得AMOLED面板的厚度大大增加。而且，彩膜基 板上还要贴设圆偏光片，这样的结构使得AMOLED面板变得更加笨重，不利于AMOLED面板的轻薄化。
发明内容
本发明的实施例提供一种AMOLED显示面板及其制备方法和显示装置。
本发明的至少一个实施例提供一种AMOLED显示面板，其包括对盒的阵列基板和彩膜基板，所述彩膜基板包括抗反射层、阻水层以及同层设置的彩膜层和黑矩阵，所述抗反射层位于所述彩膜层和所述黑矩阵的远离所述阵列基板的一侧，所述阻水层设置在所述彩膜层和所述黑矩阵的靠近所述阵列基板的一侧，或者所述阻水层设置在所述抗反射层与所述彩膜层和所述黑矩阵之间。
例如，所述阻水层的厚度范围可为0.1-10μm。
例如，所述阻水层可为单一膜层或相互覆叠的多个膜层。
例如，所述单一膜层可采用无机物材料制成，所述多个膜层可包括采用无机物材料制成的膜层和采用有机物材料制成的膜层；所述无机物材料可包括氮化硅和氧化硅中的任意一种，所述有机物材料可包括聚环氧树脂和聚丙烯酸中的任意一种。
例如，所述抗反射层可包括依次覆叠的1/4波片、胶材和线偏光片，所述线偏光片比所述1/4波片更远离所述阵列基板。
例如，所述1/4波片可采用COP光学材料，所述胶材可采用聚丙烯酸材料。
例如，所述彩膜层可为RGB三色彩膜层或RGBW四色彩膜层。
例如，所述阵列基板和所述彩膜基板之间可设置有贴合胶材，所述贴合胶材能使所述阵列基板和所述彩膜基板对应贴合并粘结在一起。
例如，所述阵列基板可包括下基板以及依次设置在所述下基板上方的下电极、电激发光层、上电极和薄膜封装层。
例如，所述薄膜封装层可为单一膜层或相互覆叠的多个膜层，所述薄膜封装层的材料可与所述阻水层相同，所述贴合胶材可采用环氧树脂材料。
例如，所述贴合胶材可对应位于所述阵列基板和所述彩膜基板的四周边 框区域，或者所述贴合胶材可布满所述阵列基板和所述彩膜基板相面对的整个面。
例如，所述下基板可采用玻璃或塑胶材料，所述塑胶材料可为聚亚硫胺。
本发明的实施例还提供一种显示装置，其包括任一上述AMOLED显示面板。
本发明的实施例还提供一种任一上述AMOLED显示面板的制备方法，其包括制备阵列基板和制备彩膜基板，并将所述阵列基板和所述彩膜基板进行对盒，其中，所述制备彩膜基板包括形成阻水层的步骤。
例如，所述制备彩膜基板，并将所述阵列基板和所述彩膜基板进行对盒可包括：
步骤S1：在玻璃载板上形成1/4波片；
步骤S2：采用构图工艺在完成步骤S1的所述玻璃载板上先后形成包括彩膜层和黑矩阵的图形；
步骤S3：在完成步骤S2的所述玻璃载板上形成阻水层；
步骤S4：在完成步骤S3的所述玻璃载板上涂敷或粘贴贴合胶材，并将所述阵列基板与完成步骤S3的所述玻璃载板进行对应贴合；
步骤S5：将所述玻璃载板取下；
步骤S6：在线偏光片上涂敷胶材，并将所述线偏光片贴到所述1/4波片上。
例如，所述制备彩膜基板，并将所述阵列基板和所述彩膜基板进行对盒可包括：
步骤S1：在玻璃载板上形成1/4波片；
步骤S2：在完成步骤S1的所述玻璃载板上形成阻水层；
步骤S3：采用构图工艺在完成步骤S2的所述玻璃载板上先后形成包括彩膜层和黑矩阵的图形；
步骤S4：在完成步骤S3的所述玻璃载板上涂敷或粘贴贴合胶材，并将所述阵列基板与完成步骤S3的所述玻璃载板进行对应贴合；
步骤S5：将所述玻璃载板取下；
步骤S6：在线偏光片上涂敷胶材，并将所述线偏光片贴到所述1/4波片上。
例如，可采用物理气相沉积或化学气相沉积的方法形成所述阻水层。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1为本发明实施例1中AMOLED显示面板的结构剖视图；
图2a为实施例1步骤S1中在玻璃载板上形成1/4波片的示意图；
图2b为实施例1步骤S2中在玻璃载板上形成彩膜层和黑矩阵的示意图；
图2c为实施例1步骤S3中在玻璃载板上形成阻水层的示意图；
图2d为实施例1步骤S4中将阵列基板与玻璃载板对应贴合的示意图；
图2e为实施例1步骤S5中取下玻璃载板的示意图；
图2f为实施例1步骤S6中贴线偏光片的示意图；
图3为本发明实施例2中AMOLED显示面板的结构剖视图；
图4a为实施例2步骤S1中在玻璃载板上形成1/4波片的示意图；
图4b为实施例2步骤S2中在玻璃载板上形成阻水层的示意图；
图4c为实施例2步骤S3中在玻璃载板上形成彩膜层和黑矩阵的示意图；
图4d为实施例2步骤S4中将阵列基板与玻璃载板对应贴合的示意图；
图4e为实施例2步骤S5中取下玻璃载板的示意图；
图4f为实施例2步骤S6中贴线偏光片的示意图。
附图标记：
1.阵列基板；11.下基板；12.下电极；13.电激发光层；14.上电极；15.薄膜封装层；2.彩膜基板；21.抗反射层；211.1/4波片；212.胶材；213.线偏光片；22.彩膜层；23.黑矩阵；24.阻水层；3.贴合胶材；4.玻璃载板。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获 得的所有其他实施例，都属于本发明保护的范围。
实施例1
本实施例提供一种AMOLED显示面板，如图1所示，其包括对盒(cell-assembly)的阵列基板1和彩膜基板2。彩膜基板2包括抗反射层21以及同层设置的彩膜层22和黑矩阵23，抗反射层21位于彩膜层22和黑矩阵23的远离阵列基板1的一侧。彩膜基板2还包括阻水层24，阻水层24设置在彩膜层22和黑矩阵23的靠近阵列基板1的一侧。
例如，阻水层24的厚度范围可为0.1-10μm。阻水层24可为单一膜层，单一膜层可采用无机物材料制成，其中，例如无机物材料可包括氮化硅和氧化硅中的任意一种，该无机物材料既具有良好的透光性能，又具有很好的阻水性能，从而使阻水层24既能对AMOLED显示面板进行很好的保护，又不妨碍AMOLED显示面板的正常显示。
需要说明的是，阻水层24也可以为相互覆叠的多个膜层，多个膜层中可包括采用无机物材料制成的膜层和采用有机物材料制成的膜层。有机物材料可包括聚环氧树脂和聚丙烯酸中的任意一种。由于有机物材料比无机物材料的柔韧性好，所以有机物材料制成的膜层与无机物材料制成的膜层相互覆叠能够提高整个阻水层24的柔韧性。
阻水层24的设置能够防止水分侵入AMOLED显示面板，从而对AMOLED显示面板形成很好的保护。同时，阻水层24的设置使得AMOLED显示面板的彩膜基板中不需要再设置玻璃基板。阻水层24的厚度可比玻璃基板的厚度小很多，从而能够使AMOLED显示面板的整体厚度大大减薄，使AMOLED显示面板变得更加轻薄。
本实施例中，抗反射层21可包括依次覆叠的1/4波片211、胶材212和线偏光片213，线偏光片213比1/4波片211更远离阵列基板1。
本实施例中的AMOLED显示面板为顶发射型，抗反射层21设置在AMOLED显示面板的出光侧，即光线从彩膜基板2侧出射。当环境光照射到AMOLED显示面板上时，先经过线偏光片213，透过线偏光片213的光线成为同一个偏振方向的线偏振光。接着，该线偏振光经过1/4波片211后，产生了1/4的光程差。然后，产生了1/4光程差的线偏振光通过反射再次经过1/4波片211，又产生了1/4的光程差。至此，透过线偏光片213的线偏振 光总共产生了1/2的光程差。由于该1/2光程差的线偏振光的偏振方向也发生了改变，所以其无法再次透过线偏光片213，从而使抗反射层21起到了减少外界环境光反射的作用，进而增加了AMOLED显示面板的对比度。
例如，1/4波片211可采用环烯烃聚合物(COP)光学材料，该材料具有较低的光程差偏差，能够提高1/4波片211的光学性能。胶材212可采用聚丙烯酸材料，该材料既能使1/4波片211与线偏光片213粘结在一起，又不会影响1/4波片211与线偏光片213之间的光线透过。
例如，本实施例中，彩膜层22可为RGB三色彩膜层或RGBW四色彩膜层，本发明不限于此。
例如，本实施例中，阵列基板1和彩膜基板2之间可设置有贴合胶材3，贴合胶材3能使阵列基板1和彩膜基板2对应贴合并粘结在一起。
例如，阵列基板1可包括下基板11以及依次设置在下基板11上方的下电极12、电激发光层13、上电极14和薄膜封装层15。阵列基板包括像素阵列，每个子像素包括驱动电路和OLED(包括上述下电极12、电激发光层13、上电极14)，驱动电路包括薄膜晶体管、电容器等器件。
例如，薄膜封装层15可为单一膜层或相互覆叠的多个膜层，薄膜封装层15的材料可与阻水层24的材料相同，贴合胶材3可采用环氧树脂材料。贴合胶材3容易对OLED器件(即电激发光层13)造成损害，薄膜封装层15的设置能够将贴合胶材3与阵列基板1上的OLED器件(即电激发光层13)隔离开来，从而能有效地保护OLED器件(即电激发光层13)免受贴合胶材3的损害。
例如，本实施例中，贴合胶材3可布满阵列基板1和彩膜基板2相面对的整个面(如贴合胶材3为双面胶)。需要说明的是，贴合胶材3也可以对应位于阵列基板1和彩膜基板2的四周边框区域。无论是对应位于AMOLED显示面板的四周边框区域，还是对应位于AMOLED显示面板的整个面上，贴合胶材3都能够使阵列基板1和彩膜基板2牢固地粘结在一起。
例如，本实施例中，下基板11可采用塑胶材料，例如塑胶材料可为聚亚硫胺。该材料具有一定的柔韧性和可挠曲性，能使整个AMOLED显示面板可弯曲，从而使AMOLED显示面板的设置更加灵活。当然，下基板11也可以采用玻璃材质。
基于上述AMOLED显示面板的结构，本实施例还提供一种AMOLED显示面板的制备方法，其包括制备阵列基板和制备彩膜基板，并将阵列基板和彩膜基板进行对盒，其中，制备彩膜基板包括形成阻水层的步骤。
阵列基板的制备可以采用现有技术中的常规方法，这里不再详述。制备彩膜基板，并将阵列基板和彩膜基板进行对盒可包括如图2a-图2f所示的如下步骤。
步骤S1：在玻璃载板4上形成1/4波片211。
在该步骤中，形成1/4波片211可以在玻璃载板4上先涂敷一层COP光学材料，然后将该材料烤干即可；或者，也可以将已经形成的1/4波片211通过粘结胶粘结在玻璃载板4上。
步骤S2：采用构图工艺在完成步骤S1的玻璃载板4上先后形成包括彩膜层22和黑矩阵23的图形。
在该步骤中，也可以先形成黑矩阵23，后再形成彩膜层。该构图工艺包括先在完成步骤S1的玻璃载板4上涂敷一层如彩膜层膜或黑矩阵膜，然后对该彩膜层膜或黑矩阵膜进行曝光、显影和刻蚀，最终形成包括彩膜层22或黑矩阵23的图形。
步骤S3：在完成步骤S2的玻璃载板4上形成阻水层24。
在该步骤中，阻水层24可采用物理气相沉积(即真空蒸镀PVD)或化学气相沉积(CVD)的方法形成。
步骤S4：在完成步骤S3的玻璃载板4上涂敷或粘贴贴合胶材3，并将阵列基板1与完成步骤S3的玻璃载板4进行对应贴合。
步骤S5：将玻璃载板4取下。
在该步骤中，先通过激光照射使玻璃载板4与1/4波片211之间脱离，然后将玻璃载板4取下。
步骤S6：在线偏光片213上涂敷胶材212，并将线偏光片213贴到1/4波片211上。
至此，AMOLED显示面板制备完毕。
实施例2
本实施例提供一种AMOLED显示面板，与实施例1不同的是，如图3所示，阻水层24设置在抗反射层21与彩膜层22和黑矩阵23之间。
本实施例中AMOLED显示面板的其他结构与实施例1中相同，此处不再赘述。
基于上述AMOLED显示面板的结构，本实施例还提供一种AMOLED显示面板的制备方法，与实施例1中AMOLED显示面板的制备方法不同的是，制备彩膜基板，并将阵列基板和彩膜基板进行对盒可包括如图4a-图4f所示的如下步骤。
步骤S1：在玻璃载板4上形成1/4波片211。
步骤S2：在完成步骤S1的玻璃载板4上形成阻水层24。
步骤S3：采用构图工艺在完成步骤S2的玻璃载板4上先后形成包括彩膜层22和黑矩阵23的图形。
步骤S4：在完成步骤S3的玻璃载板4上涂敷或粘贴贴合胶材3，并将阵列基板1与完成步骤S3的玻璃载板4进行对应贴合。
步骤S5：将玻璃载板4取下。
步骤S6：在线偏光片213上涂敷胶材212，并将线偏光片213贴到1/4波片211上。
上述步骤S1-步骤S6中的具体制备方法与实施例1中相同，在此不再赘述。
实施例1-2中所提供的AMOLED显示面板，通过在彩膜基板中设置阻水层，能够防止水分侵入AMOLED显示面板，从而对AMOLED显示面板形成很好的保护。阻水层的设置使彩膜基板中不需要再设置玻璃基板，由于阻水层的厚度要比玻璃基板的厚度小很多，所以阻水层的设置能使AMOLED显示面板的整体厚度大大减薄，从而使AMOLED显示面板变得更加轻薄。
实施例3
本实施例提供一种显示装置，其包括实施例1-2任一中的AMOLED显示面板。
通过采用实施例1-2任一中的AMOLED显示面板，使该显示装置不仅能够防止水分侵入，还能使其本身变的更加轻薄。
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。
本专利申请要求于2014年7月2日递交的中国专利申请第 201410313199.3号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (17)

  1. 一种AMOLED显示面板，其包括对盒的阵列基板和彩膜基板，
    其中，所述彩膜基板包括抗反射层、阻水层以及同层设置的彩膜层和黑矩阵，所述抗反射层位于所述彩膜层和所述黑矩阵的远离所述阵列基板的一侧，
    所述阻水层设置在所述彩膜层和所述黑矩阵的靠近所述阵列基板的一侧，或者所述阻水层设置在所述抗反射层与所述彩膜层和所述黑矩阵之间。
  2. 根据权利要求1所述的AMOLED显示面板，其中，所述阻水层的厚度范围为0.1-10μm。
  3. 根据权利要求1或2所述的AMOLED显示面板，其中，所述阻水层为单一膜层或相互覆叠的多个膜层。
  4. 根据权利要求3所述的AMOLED显示面板，其中，所述单一膜层采用无机物材料制成，所述多个膜层包括采用无机物材料制成的膜层和采用有机物材料制成的膜层；
    所述无机物材料包括氮化硅和氧化硅中的任意一种，所述有机物材料包括聚环氧树脂和聚丙烯酸中的任意一种。
  5. 根据权利要求1至4任意一项所述的AMOLED显示面板，其中，所述抗反射层包括依次覆叠的1/4波片、胶材和线偏光片，所述线偏光片比所述1/4波片更远离所述阵列基板。
  6. 根据权利要求5所述的AMOLED显示面板，其中，所述1/4波片采用COP光学材料，所述胶材采用聚丙烯酸材料。
  7. 根据权利要求1至6任意一项所述的AMOLED显示面板，其中，所述彩膜层为RGB三色彩膜层或RGBW四色彩膜层。
  8. 根据权利要求1至7任意一项所述的AMOLED显示面板，其中，所述阵列基板和所述彩膜基板之间设置有贴合胶材，所述贴合胶材能使所述阵列基板和所述彩膜基板对应贴合并粘结在一起。
  9. 根据权利要求1至8任意一项所述的AMOLED显示面板，其中，所述阵列基板包括下基板以及依次设置在所述下基板上方的下电极、电激发光层、上电极和薄膜封装层。
  10. 根据权利要求9所述的AMOLED显示面板，其中，所述薄膜封装层为单一膜层或相互覆叠的多个膜层，所述薄膜封装层的材料与所述阻水层相同，所述贴合胶材采用环氧树脂材料。
  11. 根据权利要求8至10任意一项所述的AMOLED显示面板，其中，所述贴合胶材对应位于所述阵列基板和所述彩膜基板的四周边框区域，或者所述贴合胶材布满所述阵列基板和所述彩膜基板相面对的整个面。
  12. 根据权利要求9至11任意一项所述的AMOLED显示面板，其中，所述下基板采用玻璃或塑胶材料，所述塑胶材料为聚亚硫胺。
  13. 一种显示装置，其包括权利要求1至12任意一项所述的AMOLED显示面板。
  14. 一种如权利要求1至12任意一项所述的AMOLED显示面板的制备方法，包括制备阵列基板和制备彩膜基板，并将所述阵列基板和所述彩膜基板进行对盒，其中，所述制备彩膜基板包括形成阻水层的步骤。
  15. 根据权利要求14所述的制备方法，其中，所述制备彩膜基板，并将所述阵列基板和所述彩膜基板进行对盒具体包括：
    步骤S1：在玻璃载板上形成1/4波片；
    步骤S2：采用构图工艺在完成步骤S1的所述玻璃载板上先后形成包括彩膜层和黑矩阵的图形；
    步骤S3：在完成步骤S2的所述玻璃载板上形成阻水层；
    步骤S4：在完成步骤S3的所述玻璃载板上涂敷或粘贴贴合胶材，并将所述阵列基板与完成步骤S3的所述玻璃载板进行对应贴合；
    步骤S5：将所述玻璃载板取下；
    步骤S6：在线偏光片上涂敷胶材，并将所述线偏光片贴到所述1/4波片上。
  16. 根据权利要求14所述的制备方法，其中，所述制备彩膜基板，并将所述阵列基板和所述彩膜基板进行对盒具体包括：
    步骤S1：在玻璃载板上形成1/4波片；
    步骤S2：在完成步骤S1的所述玻璃载板上形成阻水层；
    步骤S3：采用构图工艺在完成步骤S2的所述玻璃载板上先后形成包括彩膜层和黑矩阵的图形；
    步骤S4：在完成步骤S3的所述玻璃载板上涂敷或粘贴贴合胶材，并将所述阵列基板与完成步骤S3的所述玻璃载板进行对应贴合；
    步骤S5：将所述玻璃载板取下；
    步骤S6：在线偏光片上涂敷胶材，并将所述线偏光片贴到所述1/4波片上。
  17. 根据权利要求14至16任意一项所述的制备方法，其中，采用物理气相沉积或化学气相沉积的方法形成所述阻水层。
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